Cleaning sewage treatment structure and semiconductor cleaning equipment

Abstract

The invention discloses a cleaning sewage treatment structure and semiconductor cleaning equipment, and relates to the technical field of semiconductor cleaning, the cleaning sewage treatment structure comprises a supporting base, the supporting base is internally provided with two first sliding grooves, two drainage grooves and a plurality of filtering holes; the semiconductor cleaning equipment comprises the cleaning sewage treatment structure, and a plurality of pipe frames are fixedly arranged in the cleaning box. The sewage treatment device has the advantages that the sewage density (concentration) is sensed in real time through the buoyancy structure, the stirring angle and rotating speed of the deflector rod are automatically adjusted, the higher the sewage concentration is, the higher the stirring rotating speed of the deflector rod is, the larger the stirring angle is, and the stronger the bubble breaking capacity is, so that the problems of incomplete removal when the concentration is high and energy waste when the concentration is low caused by fixed parameter stirring are solved; and stubborn bubbles attached to the surface of a semiconductor can be fully broken, bubble clusters suspended in sewage can be scattered, it is ensured that cleaning liquid makes full contact with the surface of a wafer and pollutants, and the cleaning efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning technology, and in particular to a wastewater treatment structure and semiconductor cleaning equipment. Background Technology

[0002] In semiconductor manufacturing, wafer cleaning is a crucial step. The wastewater from cleaning often contains pollutants such as particulate matter, organic matter, and metal ions. Direct discharge or recycling of this wastewater not only pollutes the environment but may also affect the cleaning effect or even damage the wafers. Traditional wastewater treatment methods mostly rely on static filtration or centrifugation, which makes it difficult to adjust the treatment intensity in real time according to changes in the concentration and density of pollutants in the wastewater. This results in unstable filtration efficiency, easy clogging of filter elements, and high energy consumption.

[0003] Therefore, we propose a wastewater treatment structure and semiconductor cleaning equipment to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to solve the problems mentioned in the background art, and to propose a wastewater treatment structure and semiconductor cleaning equipment.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A wastewater treatment structure includes a support base, which has two sliding grooves, two drainage grooves and multiple filter holes. Each filter hole is fixedly equipped with a filter element. Two sewage pipes are fixedly connected to both sides of the support base, and each sewage pipe is connected to a corresponding drainage groove. A cleaning tank is fixedly installed on the support base. A sliding groove is provided inside the support base. A buoyancy structure is provided in the sliding groove. Multiple sliding holes are provided inside the support base. Each sliding hole is provided with a bubble breaking structure. Multiple drainage holes are provided inside the support base and are connected to the sliding groove. The buoyancy structure triggers multiple sets of bubble breaking structures according to the density of the sewage. The bubble breaking structures adapt to the operating state according to the change of sewage density.

[0006] In the above-mentioned wastewater treatment structure, the buoyancy structure includes a floating ring slidably disposed in a trough. Two partitions are fixedly disposed on the lower surface of the floating ring, and the partitions seal and block multiple drainage holes under normal conditions.

[0007] In the above-mentioned wastewater treatment structure, multiple vertical rods are fixedly installed on the upper surface of the floating ring, and multiple sliding grooves are opened in the support base. Each sliding groove is connected to a sliding groove and multiple sliding holes, and each vertical rod slides in the sliding groove. Each vertical rod is provided with a guide component.

[0008] In the above-mentioned wastewater treatment structure, the guiding component includes a spiral guide groove formed on a vertical rod, and the spiral guide groove is spiral in shape, with the spiral density gradually increasing from top to bottom.

[0009] In the above-mentioned wastewater treatment structure, each of the sliding holes is provided with toothed plates on its upper and lower inner walls.

[0010] In the above-mentioned wastewater treatment structure, the bubble breaking structure includes a guide rod slidably disposed in a spiral guide groove. A toothed ring and two limiting rings are fixedly disposed on the guide rod, and the toothed ring is located between the two limiting rings and meshes with the corresponding two toothed plates.

[0011] In the above-mentioned wastewater treatment structure, the diameter of the limiting ring is greater than the vertical distance between the two toothed plates in each sliding hole.

[0012] In the above-mentioned wastewater treatment structure, a fixed seat is fixedly installed at the middle position of the guide rod, a baffle is fixedly installed at one end of the guide rod, a displacement groove is opened on the guide rod, a sliding member is slidably installed in the displacement groove, a spring is fixedly installed at both ends of the sliding member, a lever is fixedly installed at one end of each of the two springs, and both levers are rotatably installed on the fixed seat.

[0013] A semiconductor cleaning device includes the cleaning wastewater treatment structure described above. Multiple pipe racks are fixedly installed inside the cleaning tank, and a spray pipe is fixedly installed between every two pipe racks.

[0014] Compared with existing technologies, the advantages of this invention are as follows: by sensing the density (concentration) of sewage in real time through a buoyancy structure, the stirring angle and speed of the lever are automatically adjusted. The higher the sewage concentration, the faster the stirring speed and the larger the stirring angle, and the stronger the bubble breaking ability. This avoids the problems of incomplete removal when the concentration is high and energy waste when the concentration is low caused by stirring with fixed parameters. It can not only fully break the stubborn bubbles attached to the semiconductor surface, but also disperse the bubble clusters suspended in the sewage, ensuring that the cleaning solution is in full contact with the wafer surface and contaminants, greatly improving cleaning efficiency and reducing the residual rate of contaminants on the wafer surface. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a semiconductor cleaning device proposed in this invention; Figure 2 for Figure 1 A magnified structural diagram of part a; Figure 3 This is a side view of the present invention; Figure 4 for Figure 3 Cross-sectional view of the structure along the AA direction; Figure 5 This is a schematic diagram of the drainage hole structure; Figure 6 for Figure 5 A magnified structural diagram of part b in the middle; Figure 7 for Figure 3 A cross-sectional view of the structure along the BB direction.

[0016] In the diagram: 1. Cleaning tank; 2. Support base; 3. Drain pipe; 4. Spray pipe; 5. Pipe rack; 6. Sliding hole; 7. Toothed plate; 8. Baffle; 9. Lever; 10. Floating ring; 11. Partition plate; 12. Vertical rod; 13. Slide groove one; 14. Drainage groove; 15. Slide groove two; 16. Spiral guide groove; 17. Toothed ring; 18. Limiting ring; 19. Sliding component; 20. Displacement groove; 21. Guide rod; 22. Spring; 23. Fixing base; 24. Filter element; 25. Filter hole; 26. Drain hole. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Reference Figure 1 , Figure 7 A semiconductor cleaning device includes a support base 2, which serves as the basic load-bearing structure of the device. The support base 2 is made of high-strength corrosion-resistant alloy material, which not only ensures the overall structural stability of the device, but also resists the chemical corrosion of cleaning liquid and sewage, extending the service life of the device. The support base 2 has two sliding grooves 13, two drainage grooves 14 and multiple filter holes 25. The sliding grooves 13 provide a stable vertical sliding space for the buoyancy structure. Its inner wall is precision polished to ensure that the floating ring 10 slides smoothly without jamming, ensuring a sensitive response to changes in sewage concentration.

[0019] Each filter hole 25 is fixedly equipped with a filter element 24, which is made of high-precision ceramic porous filter material with a pore size precisely designed to be 0.1-1μm. This pore size parameter strictly matches the particle size characteristics of the main pollutants in semiconductor cleaning wastewater. It can achieve efficient physical interception of common particles larger than 1μm (such as wafer grinding debris and dust particles) and metal oxide particles (such as copper oxide and silicon oxide, with particle sizes mostly between 0.5-5μm) in wastewater. At the same time, the 0.1-1μm pore size design can ensure the wastewater throughput. The filter element 24 and the filter hole 25 are connected by a detachable sealed connection, which is convenient for subsequent maintenance and replacement. Two sewage pipes 3 are fixedly connected to both sides of the support base 2, and each sewage pipe 3 is connected to the corresponding drainage tank 14. The sewage pipe 3 is set at a height lower than the bottom of the drainage tank 14, realizing the gravity flow of sewage without the need for additional power devices, reducing energy consumption. At the same time, the dual sewage pipe design can realize the diversion of discharge, avoiding the drainage problem caused by blockage of a single pipe.

[0020] Two drainage channels 14 are symmetrically distributed inside the support base 2, and the bottom of the channels is designed to be inclined. Gravity is used to accelerate the discharge of filtered sewage and avoid sewage accumulation. Multiple filter holes 25 are evenly distributed in a matrix. On the one hand, this expands the sewage filtration contact area and improves filtration efficiency. On the other hand, it makes the sewage pressure evenly distributed on the surface of the filter element 24 and avoids excessive local pressure that could damage the filter element 24.

[0021] A semiconductor cleaning device includes a wastewater treatment structure. A cleaning tank 1 is fixedly mounted on a support base 2. The cleaning tank 1 provides a closed working space for wafer cleaning, preventing wastewater splashing and contaminant diffusion during the cleaning process and ensuring a clean working environment. Its inner wall is made of a smooth, corrosion-resistant material to reduce contaminant adhesion. Multiple tube racks 5 are fixedly mounted inside the cleaning tank 1. The tube racks 5 are made of lightweight, high-strength, and rigid materials. Their structural design balances support stability and water flow permeability, ensuring that the spray range of the spray pipes 4 is not obstructed and that the cleaning solution evenly covers the wafer surface. A spray pipe 4 is fixedly mounted between every two tube racks 5. The spray pipe 4 has fine-diameter spray holes evenly distributed on it, which can atomize the cleaning solution into fine droplets, improving the contact efficiency between the cleaning solution and the wafer surface, while reducing the initial amount of bubbles generated. The tube racks 5 use a snap-on design to fix the spray pipes 4, which facilitates the disassembly, cleaning, and maintenance of the spray pipes 4.

[0022] Reference Figures 1-6The support base 2 has a groove 13, and a buoyancy structure is provided at the groove 13. The buoyancy structure includes a floating ring 10 that is slidably set in the groove 13. The floating ring 10 is made of lightweight and corrosion-resistant material, such as polypropylene (PP), polyethylene (PE), or glass fiber reinforced plastic (FRP), to ensure that even a small change in sewage concentration (i.e., a change in density) can drive the floating ring 10 to produce a significant vertical displacement, thus achieving sensitive detection of sewage concentration. Two partitions 11 are fixedly set on the lower surface of the floating ring 10. Under normal conditions, the partitions 11 seal and block multiple drain holes 26. The partitions 11 are made of elastic sealing material, and their edges are tightly fitted to the inner wall of the drain holes 26, ensuring that untreated sewage does not directly enter the filter holes 25. Only when the floating ring 10 floats up with the increase of sewage concentration (sewage concentration > 50 mg / L) will the partitions 11 move up synchronously, opening the drain holes 26, allowing the sewage to enter the bubble breaking and filtration stage, ensuring the orderly nature of the treatment process.

[0023] Multiple vertical rods 12 are fixedly mounted on the upper surface of the floating ring 10. The vertical rods 12 and the floating ring 10 are manufactured using an integral molding process, resulting in high structural strength. This allows for precise transmission of the vertical displacement of the floating ring 10 to the guide assembly, avoiding force loss during transmission. Multiple sliding grooves 15 are provided inside the support base 2, and each sliding groove 15 is connected to a sliding groove 13 and multiple sliding holes 6. The inner wall of the sliding groove 15 is coated with a lubricating layer to reduce friction during the sliding of the vertical rods 12, ensuring smooth and synchronous movement of the vertical rods 12 with the floating ring 10. Simultaneously, the sliding groove 15 limits the movement of the vertical rods 12, preventing misalignment caused by the vertical rods 12. Dynamic failure; each vertical rod 12 slides within the second groove 15, and each vertical rod 12 is equipped with a guide component, which includes a spiral guide groove 16 formed on the vertical rod 12. The spiral guide groove 16 is spiral in shape, and the spiral density of the spiral guide groove 16 gradually increases from top to bottom. This design is the core of realizing the speed adjustment of the lever 9: when the vertical rod 12 floats up with the float ring 10 (the sewage concentration increases), the contact point between the spiral guide groove 16 and the guide rod 21 moves along the area with greater spiral density, the rotation stroke of the guide rod 21 increases, and thus the speed is increased, realizing the dynamic adaptation of "the higher the sewage concentration, the faster the speed of the lever 9".

[0024] Multiple sliding holes 6 are provided inside the support base 2. The internal space dimensions of the sliding holes 6 are precisely designed according to the movement trajectory of the bubble breaking structure to ensure that the guide rod 21 slides and rotates smoothly in it without jamming or interference. Each sliding hole 6 has a toothed plate 7 on its upper and lower inner walls. The tooth shape of the toothed plate 7 meshes with the toothed ring 17, and the tooth pitch of the toothed plate 7 is uniform, ensuring the smooth transmission when the toothed ring 17 rotates, providing stable rotational power for the guide rod 21, and thus ensuring the uniformity of the rotation speed of the lever 9.

[0025] Each sliding hole 6 is equipped with a bubble breaking structure. The support base 2 has multiple drainage holes 26 that are connected to the trough 13. The buoyancy structure triggers multiple bubble breaking structures according to the sewage density (concentration). The bubble breaking structure adapts to the operating state (i.e., the stirring angle and speed of the lever 9) according to the change in sewage density. The bubble-breaking structure includes a guide rod 21 slidably disposed within the spiral guide groove 16. The end of the guide rod 21 is spherically designed to reduce frictional resistance with the inner wall of the spiral guide groove 16, ensuring that the vertical displacement of the vertical rod 12 can be efficiently converted into the rotational motion of the guide rod 21. A toothed ring 17 and two limiting rings 18 are fixedly disposed on the guide rod 21, with the toothed ring 17 located between the two limiting rings 18. The toothed ring 17 meshes with the corresponding two toothed plates 7. The number of teeth of the toothed ring 17 and the tooth pitch of the toothed plates 7 are designed to ensure that the rotational speed of the guide rod 21 is precisely matched with the displacement of the vertical rod 12, thereby achieving controllable adjustment of the rotational speed. The diameter of the limiting ring 18 is larger than the vertical distance between the two toothed plates 7 in each sliding hole 6. The limiting ring 18 plays an axial limiting role, ensuring that the toothed ring 17 always remains meshed with the toothed plates 7, avoiding transmission failure caused by axial displacement of the guide rod 21.

[0026] A fixed base 23 is fixedly installed at the middle position of the guide rod 21. The fixed base 23 provides a stable support point for the rotation of the lever 9. Its structural design ensures that the lever 9 can flexibly adjust the stirring angle. A baffle 8 is fixedly installed at one end of the guide rod 21. The baffle 8 can prevent the guide rod 21 from sliding out of the sliding hole 6, and play a limiting protection role. A displacement groove 20 is opened on the guide rod 21. A sliding member 19 is slidably installed in the displacement groove 20. The length of the displacement groove 20 is designed according to the movement stroke of the sliding member 19, providing sufficient space for the adjustment of the stirring angle of the lever 9. Springs 22 are fixedly installed at both ends of the sliding member 19. The springs 22 are made of a material with a moderate elastic coefficient (such as piano wire, elastic coefficient 2.0-2.3N / mm). Its elastic force can be adaptively adjusted according to the rotation speed of the guide rod 21: when the rotation speed of the guide rod 21 is slow (the sewage concentration is low, the sewage concentration is high), the spring force can be adjusted according to the rotation speed of the guide rod 21. When the concentration is ≤50mg / L, the elastic force of the spring 22 drives the sliding member 19 to be in the middle position in the displacement groove 20, and the stirring angle of the lever 9 is small to avoid over-stirring. When the guide rod 21 rotates faster (high sewage concentration, sewage concentration >50mg / L), the centrifugal force increases, the sliding member 19 slides outward in the displacement groove 20, stretches the spring 22, and then pushes the lever 9 to increase the stirring angle, realizing the dynamic adaptation of "the higher the sewage concentration, the larger the stirring angle of the lever 9". One end of each of the two springs 22 is fixedly provided with a lever 9, and both levers 9 are rotatably set on the fixed base 23. The lever 9 is made of flexible wear-resistant material, and its end is designed to be arc-shaped to avoid scratching damage to the wafer surface. At the same time, the arc-shaped structure can enhance the bubble breaking effect during stirring, ensuring that the bubbles attached to the wafer surface and suspended in the sewage can be broken.

[0027] The support base 2 has multiple drainage holes 26 that are connected to the slide 13. The diameter of the drainage holes 26 is precisely designed to be 8-12mm. This size is based on the maximum sewage treatment flow rate to ensure that the sewage can quickly enter the bubble breaking area. At the same time, the distribution of the drainage holes 26 corresponds to the stirring range of the lever 9, so that the sewage can be stirred by the lever 9 as soon as it enters, breaking the bubbles in time and preventing the bubbles from accumulating in the sewage.

[0028] To further clarify, the aforementioned fixed connection should be interpreted broadly unless otherwise explicitly specified and limited. For example, it may be welding, gluing, or integral molding, or other conventional methods well known to those skilled in the art.

[0029] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A cleaning system for a sewage treatment structure comprising a support base (2), characterised in that, Two sliding grooves one (13), two drainage grooves (14) and multiple filter holes (25) are arranged in the support base (2), a filter core (24) is fixedly arranged in each filter hole (25), two sewage pipes (3) are fixedly and communicatively arranged on the two sides of the support base (2), and each sewage pipe (3) is communicated with the corresponding drainage groove (14); A cleaning box (1) is fixedly arranged on the support base (2), a sliding groove one (13) is arranged in the support base (2), a buoyancy structure is arranged at the sliding groove one (13), multiple sliding holes (6) are arranged in the support base (2), a bubble breaking structure is arranged in each sliding hole (6), multiple drainage holes (26) which are communicated with the sliding groove one (13) are arranged in the support base (2), the buoyancy structure triggers multiple bubble breaking structures according to the density of sewage, and the bubble breaking structure adapts the operation state according to the change of the density of sewage.

2. A cleaning system for a sewage treatment structure as claimed in claim 1, wherein, The buoyancy structure comprises a floating ring (10) which is slidingly arranged in the sliding groove one (13), and two partition plates (11) are fixedly arranged on the lower surface of the floating ring (10), and the partition plates (11) seal and shield the multiple drainage holes (26) in the normal state.

3. A cleaning system for a sewage treatment structure as claimed in claim 2, wherein, Multiple vertical rods (12) are fixedly arranged on the upper surface of the floating ring (10), multiple sliding grooves two (15) are arranged in the support base (2), each sliding groove two (15) is communicated with the sliding groove one (13) and the multiple sliding holes (6), each vertical rod (12) is slidingly arranged in the sliding groove two (15), and a guide assembly is arranged on each vertical rod (12).

4. A cleaning system for a sewage treatment structure as claimed in claim 3, wherein, The guide assembly comprises a spiral guide groove (16) arranged on the vertical rod (12), and the spiral guide groove (16) is in a spiral shape as a whole, and the spiral density of the spiral guide groove (16) gradually increases from top to bottom.

5. A cleaning system for a sewage treatment structure as claimed in claim 4, wherein, The upper inner wall and the lower inner wall of each sliding hole (6) are provided with a toothed plate (7).

6. A cleaning system for a sewage treatment structure as claimed in claim 4, wherein, The bubble breaking structure comprises a guide rod (21) which is slidingly arranged in the spiral guide groove (16), a toothed ring (17) and two limiting rings (18) are fixedly arranged on the guide rod (21), the toothed ring (17) is located between the two limiting rings (18), and the toothed ring (17) is engaged with the corresponding two toothed plates (7).

7. A cleaning system for a sewage treatment structure as claimed in claim 6, wherein, The diameter of the limiting ring (18) is greater than the vertical distance between the two toothed plates (7) in each sliding hole (6).

8. A cleaning system for a sewage treatment structure as claimed in claim 7, wherein, A fixed seat (23) is fixedly arranged at the middle position of the guide rod (21), a baffle (8) is fixedly arranged at one end of the guide rod (21), a displacement groove (20) is arranged on the guide rod (21), a sliding piece (19) is slidingly arranged in the displacement groove (20), springs (22) are fixedly arranged at both ends of the sliding piece (19), and a lever (9) is fixedly arranged at one end of each spring (22), and the two levers (9) are rotationally arranged on the fixed seat (23).

9. A semiconductor cleaning apparatus comprising a cleaning sewage treatment structure according to claim 1, characterized by Multiple pipe racks (5) are fixedly arranged in the cleaning box (1), and a spraying pipe (4) is fixedly arranged between every two pipe racks (5).

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