PCB (Printed Circuit Board) substrate laser edge burning equipment with anti-warping structure

Abstract

The invention discloses PCB (printed circuit board) substrate laser edge-burning equipment with an anti-warping structure, and particularly relates to the field of PCB substrate laser edge-burning, the PCB substrate laser edge-burning equipment comprises a laser edge-burning frame, the bottom of the laser edge-burning frame is provided with a plurality of groups of edge-burning platens which are mutually connected, the outer wall of the laser edge-burning frame corresponding to the edge-burning platens is vertically provided with an air cylinder in an inserting manner, the extending end of the air cylinder is provided with a stool-shaped plate, and the stool-shaped plate is provided with an anti-warping structure. A rectangular frame is vertically inserted in the middle of the stool-shaped plate, a hollow column is vertically inserted in the middle of the rectangular frame, a piston plate is slidably arranged on the upper portion of the inner wall of the hollow column, a movable column is arranged at the bottom of the piston plate, and the bottom of the movable column movably extends to the lower portion of the hollow column and is connected with a four-claw frame plate; high-precision edge burning is firmly guaranteed through real-time pressing and cooling cleaning, meanwhile, the device has the remarkable advantage in machining flexibility, the device can easily meet diversified machining requirements through rotation of the edge burning supporting plate and reciprocating movement of the laser edge burning machine, and the machining efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of laser edge burning technology for PCB substrates, and more specifically, to laser edge burning equipment for PCB substrates with anti-warping structure. Background Technology

[0002] As the support and electrical connection carrier for electronic components, the quality of PCB printed circuit boards directly affects the performance and reliability of electronic products. Laser edge burning is one of the key processes in PCB substrate production. Its main purpose is to precisely process the edges of the PCB substrate, remove excess material and burrs, and form neat and smooth edges to meet the requirements of subsequent assembly and use. Precise edge burning can ensure that the PCB substrate has good fit when electronic components are installed, avoiding problems such as short circuits and poor contact caused by uneven edges, thereby improving the stability and service life of the entire electronic product. During edge burning, the high energy of the laser causes localized heating of the substrate. Since the substrate is composed of a variety of materials with different coefficients of thermal expansion, uneven expansion of each part generates internal stress, which in turn causes the substrate to warp. This not only leads to displacement of the burning position and reduced accuracy, affecting the quality of the substrate, but may also damage the equipment and increase costs. Meanwhile, if the molten material generated by burning is not cleaned up in time, it will form hard burrs after cooling and solidification, affecting the appearance of the substrate and subsequent assembly, scratching components or reducing installation accuracy. Traditional mechanical scraping is easy to damage the substrate, and manual cleaning is inefficient and the effect is unstable. Therefore, it is essential to develop laser edge-burning equipment for PCB substrates with anti-warping structures to solve the above problems and ensure the quality of edge burning. Summary of the Invention

[0003] To overcome the above-mentioned defects of the prior art, the present invention provides a laser edge-burning device for PCB substrates with an anti-warping structure.

[0004] To achieve the above objectives, the present invention provides the following technical solution: A laser edge-burning device for PCB substrates with an anti-warping structure includes a laser edge-burning frame. The bottom of the laser edge-burning frame is provided with multiple interconnected edge-burning platforms. Cylinders are vertically inserted into the outer wall of the laser edge-burning frame corresponding to the edge-burning platforms. A stool-shaped plate is provided at the extended end of the cylinder. A rectangular frame is vertically inserted into the middle of the stool-shaped plate. A hollow column is vertically inserted into the middle of the rectangular frame. A piston plate is slidably provided on the upper part of the inner wall of the hollow column. A movable column is provided at the bottom of the piston plate. The bottom of the movable column extends movably to the bottom of the hollow column and is connected to a four-claw frame plate. The bottom of the four-claw frame is connected to a rectangular frame that presses the edge of the PCB substrate, and the edge-burning platform is provided with an edge-burning support plate on the top wall directly below the rectangular frame. The movable column is fitted with a thrust spring on the outer wall inside the hollow column. Four connecting pipes are evenly inserted into the circumferential side wall at the top of the hollow column. A control valve is installed on the top wall of the connecting pipe. Each of the four sets of gripping rods of the four-claw frame plate has a conveying channel communicating with the connecting pipe. A rectangular annular groove communicating with the conveying channel is opened at the bottom of the rectangular frame. A straight groove communicating with the rectangular annular groove is opened on the side wall of the rectangular frame.

[0005] Furthermore, the straight groove gradually decreases in size from the side closest to the rectangular ring groove to the side furthest from the rectangular ring groove, and the output end of the straight groove is positioned facing the side of the PCB substrate.

[0006] Furthermore, an inflation tube for inflating the hollow column is connected to the top wall of the hollow column, and a rubber pad is provided on the bottom wall of the rectangular frame.

[0007] Furthermore, a motor for driving the burning edge support plate is provided above the burning edge support plate, and an annular plate is provided at the bottom of the burning edge support plate, with rollers that contact the burning edge table at the bottom of the annular plate.

[0008] Furthermore, the laser edge-burning frame is symmetrically provided with edge-burning fixtures for burning the edges of the PCB substrate on both sides. The edge-burning fixtures include a pair of threaded rods rotatably mounted on the laser edge-burning frame, and each of the opposite ends of the pair of threaded rods is provided with a reciprocating motor connected to the laser edge-burning frame.

[0009] Furthermore, the outer wall of the threaded rod is threaded with a guide block that slides in cooperation with the top wall of the laser edge-burning frame, and the bottom of the guide block is equipped with a laser edge-burning machine.

[0010] The method for preventing warping of the PCB substrate using the laser edge-burning equipment is as follows: Pressing the substrate edge to prevent warping: Place the PCB substrate on the edge-burning support plate, extend the cylinder downwards, and move the stool-shaped plate to the top of the substrate, but without contacting the substrate; inflate the hollow column with air, push the piston plate to move the rectangular frame down to press the substrate edge, and use a laser edge-burning machine to burn the edges of the substrate. Cooling the edge of the substrate by blowing away molten material: Open the control valve of the connecting pipe, and the gas is blown out through the straight groove to blow away the molten material and cool the burning edge area. Then the thrust spring resets the rectangular frame. The motor drives the burning edge support plate to rotate, moving the other two sides of the substrate to the bottom of the laser burning edge machine. Close the control valve, and then press the edge with air to complete the burning edge.

[0011] The technical effects and advantages of this invention are as follows: 1. In the process of edge burning, the invention uses air to push the rectangular frame to press the edge of the PCB substrate in real time by filling the hollow column with air. This can effectively suppress the warping phenomenon caused by thermal expansion of the substrate and ensure the accuracy of the edge burning position. At the same time, the gas is blown out from the straight groove to clean the molten material on the edge of the substrate after edge burning and cool the edge burning area in time, reducing the impact of heat conduction on other parts of the substrate and ensuring the quality of edge burning in all aspects.

[0012] 2. In this invention, the motor drives the edge-burning support plate to rotate, which can easily move different sides of the substrate to the bottom of the laser edge-burning machine to achieve multi-sided edge burning. In addition, the reciprocating motor in the edge-burning fixture drives the threaded rod to rotate, so that the laser edge-burning machine can move back and forth. The edge-burning position can be flexibly adjusted according to the PCB substrates of different specifications and requirements, which greatly improves the applicability and processing efficiency of the equipment. Attached Figure Description

[0013] Figure 1 This is a perspective view of the overall structure of the present invention.

[0014] Figure 2 This is a perspective view of the rectangular frame and the edge support plate in this invention.

[0015] Figure 3 This is a perspective view of the external structure of the four-claw support plate in this invention.

[0016] Figure 4 This is a cross-sectional view of the internal structure of the four-claw frame plate in this invention.

[0017] Figure 5 This is a cross-sectional view of the overall structure of the present invention.

[0018] Figure 6 This is a three-dimensional view of the external structure of the laser-burning frame in this invention.

[0019] The attached diagram is labeled as follows: 1. Burning edge platform; 2. Laser burning edge frame; 3. Cylinder; 4. Annular plate; 5. Burning edge support plate; 6. Roller; 7. Motor; 8. Rectangular frame; 9. Stool-shaped plate; 10. Four-claw frame plate; 11. Hollow column; 12. Air inflator; 13. Movable column; 14. Rectangular frame; 15. Thrust spring; 16. Conveyor channel; 17. Rectangular annular groove; 18. Straight groove; 19. Connecting pipe; 20. Piston plate; 21. Threaded rod; 22. Track block; 23. Laser burning edge machine. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-6 As shown, the following solutions can be used to address the problem that if the molten material generated by burning edges is not cleaned up in time, it will form hard burrs after cooling and solidification, and the high energy of light will cause local heating of the substrate, leading to substrate warping. In this embodiment, a laser edge-burning device for PCB substrates with an anti-warping structure includes a laser edge-burning frame 2. The bottom of the laser edge-burning frame 2 is provided with multiple interconnected edge-burning platforms 1. Cylinders 3 are vertically inserted on the outer wall of the laser edge-burning frame 2 corresponding to the edge-burning platforms 1. A stool-shaped plate 9 is provided at the extended end of the cylinder 3. A rectangular frame 14 is vertically inserted in the middle of the stool-shaped plate 9. A hollow column 11 is vertically inserted in the middle of the rectangular frame 14. A piston plate 20 is slidably provided on the upper inner wall of the hollow column 11. A movable column 13 is provided at the bottom of the piston plate 20. The bottom of the movable column 13 extends movably to the bottom of the hollow column 11 and is connected to a four-claw frame plate 10. A rectangular frame 8 for pressing the edge of the PCB substrate is connected to the bottom of the four-claw frame plate 10. An edge-burning support plate 5 is provided on the top wall of the edge-burning platform 1 located directly below the rectangular frame 8. A thrust spring 15 is fitted on the outer wall of the movable column 13 inside the hollow column 11. Four connecting pipes 19 are evenly inserted on the circumferential side wall at the top of the hollow column 11. A control valve is installed on the top wall of the connecting pipe 19. Each of the four sets of grippers on the four claw plate 10 has a conveying channel 16 that communicates with the connecting pipe 19. A rectangular ring groove 17 that communicates with the conveying channel 16 is opened at the bottom of the rectangular frame 8. A straight groove 18 that communicates with the rectangular ring groove 17 is opened on the side wall of the rectangular frame 8. The straight groove 18 gradually decreases in size from the side closest to the rectangular ring groove 17 to the side furthest from the rectangular ring groove 17, and the output end of the straight groove 18 is positioned facing the side of the PCB substrate. An inflation tube 12 for inflating the hollow column 11 is connected to the top wall, and a rubber pad is provided on the bottom wall of the rectangular frame 8 to avoid damage to the substrate surface. A motor 7 is provided above the edge support plate 5 to drive the edge support plate 5, and an annular plate 4 is provided at the bottom of the edge support plate 5. A roller 6 is provided at the bottom of the annular plate 4 to contact the edge support plate 1. When the motor 7 drives the edge support plate 5 to rotate, the roller 6 rolls with the edge support plate 1 to support and limit the rotation of the edge support plate 5. Based on the above, we can conclude that: The PCB substrate is placed on the edge-burning support plate 5. The extended end of the control cylinder 3 extends downward, and the rectangular frame 8 is moved to the top of the substrate through the stool-shaped plate 9, but without contacting the substrate. Then, gas, such as oxygen or nitrogen, is injected into the hollow column 11 through the gas filling pipe 12, which pushes the piston plate 20 downward. The rectangular frame 8 is moved downward through the moving column 13 and pressed against the edge of the substrate. Then, the laser edge-burning machine 23 burns the edges of the substrate on both sides. After the edge-burning is completed, the control valve on the connecting pipe 19 is opened. The gas above the hollow column 11 enters the rectangular annular groove 17 through the connecting pipe 19 and the conveyor 16, and then blows out through the straight groove 18 to blow away the molten material on the edge of the substrate after edge-burning. At the same time, the edge-burning area can be cooled to reduce heat conduction. The thrust spring 15 pushes the piston plate 20 upward, so that the rectangular frame 8 is reset and moved above the substrate. Then, the motor 7 drives the edge-burning support plate 5 to rotate slowly, moving the other two sides of the substrate to below the laser edge-burning machine 23. The control valve is closed, and gas is then injected into the hollow column 11 through the connecting pipe 19. The rectangular frame 8 presses the edge of the substrate to complete the laser edge-burning of the substrate. During processing, the edge of the substrate is pressed in real time to suppress warping caused by thermal expansion of the substrate. The control valve is opened, and gas is blown out through the straight groove 18 to blow away the molten material on the edge of the substrate after edge-burning. Following the above steps, the edge-burning of the PCB substrate is completed. The following supplementary explanations are provided for the above content: 1. An adsorption plate with multiple evenly distributed suction holes is set above the edge burning support plate 5 as a negative pressure fixture. The adsorption plate is connected to a vacuum pump. When the PCB substrate is placed on the adsorption plate, the vacuum pump is started, and a negative pressure is formed inside the adsorption plate. The substrate is tightly adsorbed on the adsorption plate. During the laser edge burning process, even if the substrate is subjected to laser heat, the substrate can maintain a stable position due to the continuous adsorption of the negative pressure, avoiding warping or movement, thereby ensuring the quality of edge burning. Second: Gas is injected into the hollow column 11 through the gas filling pipe 12. The gas pushes the piston plate 20 downward, which in turn drives the movable column 13 downward, causing the rectangular frame 8 to move downward and press against the edge of the substrate. During this process, the amount and pressure of the injected gas can be flexibly controlled according to the actual heating condition of the substrate. For example, when the substrate expands significantly due to heat, the amount of injected gas or the gas pressure is increased, so that the piston plate 20 is subjected to a greater downward force, which in turn causes the rectangular frame 8 to apply a greater pressing force to the edge of the substrate. Conversely, when the substrate expands less due to heat, the amount of injected gas or the gas pressure is reduced, which reduces the pressing force of the rectangular frame 8 on the edge of the substrate. This is controlled by the external control system of the edge burning fixture. Example 2: Please refer to Figure 1 , Figure 6 As shown, supplementary explanations will be provided based on the content of Example 1; The laser edge burning frame 2 is symmetrically provided with edge burning fixtures for burning the edges of PCB substrates on both sides. The edge burning fixtures include a pair of threaded rods 21 rotatably mounted on the laser edge burning frame 2. The ends of the pair of threaded rods 21 that are opposite to each other are provided with reciprocating motors connected to the laser edge burning frame 2. The outer wall of the threaded rods 21 is threaded with a fixed rail block 22 that slides with the top wall of the laser edge burning frame 2. The bottom of the fixed rail block 22 is provided with a laser edge burning machine 23. This belongs to the prior art of functional instruments for burning the edges of PCB substrates. As can be seen from the above: the reciprocating motor drives the threaded rod 21 to rotate, the fixed rail block 22 is limited by the laser edge burning frame 2, and drives the laser edge burning machine 23 to move back and forth on the outer wall of the laser edge burning frame 2 to burn the edge of the PCB substrate. As can be seen from Embodiments 1 and 2 of this invention: During the edge-burning process, air is injected into the hollow column 11 to push the rectangular frame 8 to press the edge of the PCB substrate in real time. The pressing force is adjusted in real time according to the heating condition of the substrate, effectively suppressing the warping phenomenon caused by thermal expansion of the substrate and ensuring the accuracy of the edge-burning position. At the same time, gas is blown out from the straight groove 18 to clean up the molten material on the edge of the substrate after burning and to cool the burning area, reducing the impact of heat conduction on other parts of the substrate. This comprehensively ensures the quality of edge burning, improves the production efficiency and product quality of PCB substrates, and meets the demand of the electronics manufacturing industry for high-quality PCB substrates. Real-time pressing and cooling cleaning provide a solid guarantee for high-precision edge burning. At the same time, the equipment has significant advantages in processing flexibility. The rotation of the edge burning support plate 5 and the reciprocating movement of the laser edge burning machine 23 enable it to easily cope with diverse processing needs and greatly improve processing efficiency.

[0022] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A laser edge-burning device for PCB substrates with an anti-warping structure, comprising a laser edge-burning frame (2), wherein the bottom of the laser edge-burning frame (2) is provided with multiple interconnected edge-burning platforms (1), and cylinders (3) are vertically inserted into the outer wall of the laser edge-burning frame (2) corresponding to the edge-burning platforms (1), characterized in that, The cylinder (3) has a stool-shaped plate (9) at its extended end. A rectangular frame (14) is vertically inserted in the middle of the stool-shaped plate (9). A hollow column (11) is vertically inserted in the middle of the rectangular frame (14). A piston plate (20) is slidably provided above the inner wall of the hollow column (11). A movable column (13) is provided at the bottom of the piston plate (20). The bottom of the movable column (13) extends movably to the bottom of the hollow column (11) and is connected to a four-claw frame plate (10). The bottom of the four-claw support plate (10) is connected to a rectangular frame (8) that presses the edge of the PCB substrate, and the edge-burning platform (1) is provided with an edge-burning support plate (5) on the top wall directly below the rectangular frame (8). The movable column (13) is fitted with a thrust spring (15) on the outer wall inside the hollow column (11). Four connecting pipes (19) are evenly inserted on the circumferential side wall at the top of the hollow column (11). A control valve is provided on the top wall of the connecting pipe (19). The four sets of grippers on the four claw plate (10) are provided with a conveying channel (16) that communicates with the connecting pipe (19). The bottom of the rectangular frame (8) is provided with a rectangular ring groove (17) that communicates with the conveying channel (16). The side wall of the rectangular frame (8) is provided with a straight groove (18) that communicates with the rectangular ring groove (17).

2. The laser edge-burning equipment for PCB substrates with anti-warping structure according to claim 1, characterized in that: The straight groove (18) gradually decreases in size from the side closest to the rectangular ring groove (17) to the side furthest from the rectangular ring groove (17), and the output end of the straight groove (18) is set toward the side of the PCB substrate.

3. The laser edge-burning equipment for PCB substrates with anti-warping structure according to claim 1, characterized in that: An inflation tube (12) for inflating the hollow column (11) is connected to the top wall of the column, and a rubber pad is provided on the bottom wall of the rectangular frame (8).

4. The laser edge-burning equipment for PCB substrates with anti-warping structure according to claim 1, characterized in that: The upper part of the burn edge support plate (5) is provided with a motor (7) for driving the burn edge support plate (5), and the bottom of the burn edge support plate (5) is provided with an annular plate (4), and the bottom of the annular plate (4) is provided with a roller (6) that contacts the burn edge table (1).

5. The laser edge-burning equipment for PCB substrates with anti-warping structure according to claim 1, characterized in that: The laser edge burning frame (2) is symmetrically provided with edge burning fixtures for burning the edge of the PCB substrate on both sides. The edge burning fixtures include a pair of threaded rods (21) rotatably set on the laser edge burning frame (2). The ends of the pair of threaded rods (21) that are opposite to each other are provided with a reciprocating motor (7) connected to the laser edge burning frame (2).

6. The laser edge-burning equipment for PCB substrates with anti-warping structure according to claim 5, characterized in that: The outer wall of the threaded rod (21) is threaded with a guide block (22) that slides with the top wall of the laser edge-burning frame (2), and the bottom of the guide block (22) is provided with a laser edge-burning machine (23).

7. The laser edge-burning equipment for PCB substrates with anti-warping structure according to any one of claims 1-6, characterized in that: The method for preventing warping of the PCB substrate by the laser edge-burning equipment is as follows: Press the edge of the substrate to prevent warping: Place the PCB substrate on the edge-burning support plate (5), extend the cylinder (3) downward, and the stool-shaped plate (9) moves the rectangular frame (8) directly above the substrate, but does not contact the substrate; inflate the hollow column (11) and push the piston plate (20) to move the rectangular frame (8) down to press the edge of the substrate, and use the laser edge-burning machine (23) to burn the edges of the substrate on both sides; Cooling the edge of the substrate by blowing away the molten material: Open the control valve of the connecting pipe (19), and the gas is blown out through the straight groove (18) to blow away the molten material and cool the burning edge area. Then the thrust spring (15) resets the rectangular frame (8). The motor (7) drives the burning edge support plate (5) to rotate, and moves the other two sides of the substrate to below the laser burning edge machine (23). Close the control valve, and then press the edge with air to complete the burning edge.

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