Method for processing on-line grid line groove by PI (Polyimide) film

Abstract

The invention provides a method for carrying out on-line grid line groove processing on a PI film, which enables the processing of the PI film by laser to be fast and efficient, improves the processing efficiency of cutting a grid line by the PI film, and improves the yield. The screen frame laminated with the PI film is positioned and placed on a screen frame placing mechanism of laser processing equipment, reference points are respectively marked at four corners of the screen frame in advance, then coordinates of a tungsten filament on screen cloth are obtained through scanning of a lens on the laser processing equipment, and the coordinates of the tungsten filament on the whole screen cloth are obtained relative to the marked reference point at the upper right corner; then, a grid line drawing of the PI film to be processed is guided into laser processing equipment, the width of a grid line is guided in while the grid line drawing is guided into a linear position, and the laser processing equipment converts the position of the grid line and the width of the grid line into a laser cutting pattern corresponding to the tungsten filament coordinates on the screen cloth; and each laser cutting pattern is converted into a linear path with a width or a closed cutting path, so that a reliable PI film cutting laser path pattern is obtained.

Description

Technical Field

[0001] This invention relates to the technical field of solar screen printing, specifically a method for online grid groove processing of PI film. Background Technology

[0002] Existing screen printing techniques for solar energy require the following steps: after the screen is stretched onto a frame, a PI film needs to be pressed onto the screen. The frame is then placed on a laser processing device, where the laser is used to process the fine and main grid lines on the PI film. Current technologies require manually matching and setting the positions of the fine and main grid lines as well as the laser cutting parameters. After the first laser cut, the operator needs to identify whether the position of the laser-cut grid lines interferes with the underlying parallel tungsten wires. If interference is found, the process needs to be readjusted. Throughout the entire process, the laser cutting position parameters and power must be manually matched one by one, resulting in low efficiency in cutting the PI film on the screen.

[0003] Therefore, there is an urgent need to develop a method for online grid groove processing of PI film, so as to improve the processing efficiency of PI film grid cutting. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a method for online processing of grid grooves in PI films, which enables rapid and efficient laser processing of PI films, improves the processing efficiency of cutting grid lines in PI films, and increases production output.

[0005] A method for online grating groove processing of PI film is characterized by: positioning a PI film-coated mesh frame on a mesh frame placement mechanism of a laser processing equipment; pre-marking reference points at the four corners of the mesh frame; obtaining the coordinates of the tungsten wires on the mesh fabric by scanning with a lens on the laser processing equipment, and obtaining the coordinates of the tungsten wires on the entire mesh fabric relative to the upper right corner reference point; importing the grating pattern of the PI film to be processed into the laser processing equipment, simultaneously importing the linear position and width of the grating pattern; converting the position and width of the grating pattern into laser cutting patterns corresponding to the coordinates of the tungsten wires on the mesh fabric; converting each laser cutting pattern into a linear path with width or a closed cutting path to obtain a reliable PI film cutting laser path diagram; comparing the coordinates of the PI film cutting laser path diagram with the coordinates of the tungsten wires, and automatically adjusting the laser path position relative to the mesh frame in advance, so that the fine grating lines are all set in the middle area parallel to the tungsten wires; and then driving the laser control module to drive the laser cutting mechanism to complete the cutting of the PI film along the cutting path, generating the corresponding fine grating lines and main grating lines.

[0006] Its further features are: The laser processing equipment has a built-in conversion module that converts the grid line drawing of the PI film into a laser path diagram for PI film cutting. The conversion module receives the grid line drawing of the PI film and the width value set on the grid line on the drawing. The line width information of the corresponding main grid line and fine grid line on the grid line drawing of the PI film is also received. The conversion module converts the position and line width of the grid line into a laser cutting pattern corresponding to the coordinates of the tungsten wire on the mesh. Each laser cutting pattern is converted into a linear path with width or a closed cutting path, thereby obtaining a reliable laser path diagram for PI film cutting. In the PI film grid pattern, the fine grid lines are transformed into linear paths with width, while the main grid lines on the PI film grid pattern are directly transformed into closed rectangular shapes because of their relatively large width. The laser processing equipment has a built-in laser parameter database module, which integrates the corresponding laser power, compensation value, and moving speed for PI films of different thicknesses. The thickness of the PI film is input into the laser processing equipment. The laser processing equipment matches the film thickness with the corresponding laser parameters. Combined with the PI film cutting laser path diagram, the laser control and drive module drives the laser head of the laser cutting mechanism to cut the PI film along the cutting path and according to the set laser parameters, generating the corresponding fine grid lines and main grid lines. When the laser control drive module drives the laser head of the laser cutting mechanism to move, it moves in a cyclical pattern from back to front and left to right. The laser processing equipment has a small lens above the fixed mesh frame, and a light source is arranged above the small lens. The small lens makes the area of ​​the light spot small, so that the lens can completely capture the cutting path and the final cutting pattern during laser cutting. If the laser cutting path or cutting pattern is wrong, an alarm can be triggered and the operation can be stopped. After processing begins, the laser processing equipment will automatically scan to fill in the offset and rotation amounts into the product parameters, and perform slight expansion and contraction to ensure that the fine grid lines where the scan lines are located are aligned with the middle position of the warp tungsten wires.

[0007] With this invention, the grid line drawing of the PI film to be processed is imported into the laser processing equipment. Simultaneously with importing the linear position of the grid line drawing, the width of the grid line is also imported. The laser processing equipment converts the position and width of the grid line into laser cutting patterns corresponding to the coordinates of the tungsten wires on the mesh. Each laser cutting pattern is converted into a linear path with width or a closed cutting path, thereby obtaining a reliable laser path diagram for PI film cutting. By comparing the coordinates of the PI film cutting laser path diagram with the coordinates of the tungsten wires, the laser path position relative to the mesh frame is automatically adjusted, ensuring that the fine grid lines are all positioned in the middle area parallel to the tungsten wires. When processing the PI film in the online grid line groove, only the grid line drawing along with the line width of each grid line on the drawing needs to be imported into the laser processing equipment. This makes the laser processing of the PI film fast and efficient, improving the processing efficiency of PI film grid line cutting and increasing production output. Attached Figure Description

[0008] Figure 1 This is a grid line drawing of the PI film corresponding to a specific embodiment of the present invention; Figure 2 This is a laser path diagram for PI film cutting obtained by the conversion module after using the method of the present invention; Figure 3 This is a schematic diagram illustrating how the grid lines are transformed into closed cutting paths according to the present invention. Detailed Implementation

[0009] A method for online grating groove processing of PI film: A grating frame with PI film is positioned on the grating frame placement mechanism of a laser processing equipment. Reference points are pre-marked at the four corners of the grating frame. Then, the coordinates of the tungsten wires on the grating are obtained by scanning with a lens on the laser processing equipment, and the coordinates of the tungsten wires on the entire grating are obtained relative to the marked reference point at the upper right corner. The grating pattern of the PI film to be processed is then imported into the laser processing equipment. The grating pattern imports the linear position and the width of the grating simultaneously. The laser processing equipment converts the position and width of the grating into laser cutting patterns corresponding to the coordinates of the tungsten wires on the grating. Each laser cutting pattern is converted into a linear path with width or a closed cutting path (see...). Figure 3 This process obtains a reliable laser path map for PI film cutting. The coordinates of the PI film cutting laser path map are compared with the coordinates of the tungsten wire, and the laser path position relative to the grid frame is automatically adjusted in advance so that the fine grid lines are all set in the middle area of ​​the parallel tungsten wire. Then, the laser control drive module drives the laser cutting mechanism to complete the cutting of the PI film along the cutting path, generating the corresponding fine grid lines and main grid lines.

[0010] In practice, the laser processing equipment has a built-in conversion module that converts the grid line drawing of the PI film into a laser path diagram for PI film cutting. The conversion module receives the grid line drawing of the PI film and the width value set on the grid line on the drawing. The line width information of the main grid line and the fine grid line on the grid line drawing of the PI film is also received. The conversion module converts the position and line width of the grid line into a laser cutting pattern corresponding to the coordinates of the tungsten wire on the mesh, and converts each laser cutting pattern into a closed cutting path, thereby obtaining a reliable laser path diagram for PI film cutting. The laser processing equipment has a built-in laser parameter database module, which integrates the corresponding laser power, compensation value, and moving speed for PI films of different thicknesses. The thickness of the PI film is input into the laser processing equipment. The laser processing equipment matches the film thickness with the corresponding laser parameters. Combined with the PI film cutting laser path diagram, the laser control and drive module drives the laser head of the laser cutting mechanism to cut the PI film along the cutting path and according to the set laser parameters, generating the corresponding fine grid lines and main grid lines. When the laser control drive module drives the laser head of the laser cutting mechanism to move, it moves in a cyclical pattern from back to front and left to right. The laser processing equipment has a small lens above the fixed mesh frame, and a light source is arranged above the small lens. The small lens makes the area of ​​the light spot small, so that during laser cutting, the small lens can completely capture the cutting path and the final cutting pattern. If the laser cutting path or cutting pattern is incorrect, an alarm will be triggered and the operation will be stopped.

[0011] In specific embodiments, such as Figure 1 The grid line drawing of the PI film shown above requires the following steps in the existing technology for generating the laser path diagram for PI film cutting: S1, query the scheduling table for this part number; S2, thicken and fill the line widths of each layer of the drawing file according to the customer's process requirements in the schedule; S3, use the line segments left in the scan dwg or dxf layer of the drawing file to perform trial cuts. When the trial cut reaches the center of the two steel wires, record the angle of rotation and the offset of the drawing. S4. After inputting the recorded graphic rotation angle and offset into the software product parameters, processing begins.

[0012] The entire process takes about 20 minutes. In actual PI film laser processing, the entire drawing import is done manually, and the large lens spot blocks the light during the processing, resulting in a processing yield of only 85%.

[0013] The specific embodiments correspond to Figure 1The grid pattern of the PI film is processed by the method of this invention. The conversion module receives the grid pattern of the PI film and the width values ​​set on the grid lines on the pattern. The linewidth information of the corresponding main grid lines and fine grid lines on the grid pattern of the PI film is also received. The conversion module converts the position and linewidth of the grid lines into laser cutting patterns corresponding to the coordinates of the tungsten wires on the mesh. Each laser cutting pattern is converted into a closed cutting path, thereby obtaining a reliable laser path diagram for PI film cutting (see...). Figure 2 ), Figure 2 The four points located on the outer perimeter of the drawing are the corresponding coordinates of the reference points marked at the four corners of the frame. The laser path diagram for PI film cutting obtained by the above method takes only 15 seconds. Furthermore, since the small lens can completely capture the cutting path and the final cutting pattern during the processing, the processing yield reaches 99% or higher.

[0014] Because the grid pattern of the PI film to be processed is imported into the laser processing equipment, the grid pattern is imported along with the width of the grid lines at the same time. The laser processing equipment converts the position and width of the grid lines into laser cutting patterns corresponding to the coordinates of the tungsten wires on the mesh. Each laser cutting pattern is converted into a closed cutting path, thereby obtaining a reliable laser path map for PI film cutting. By comparing the coordinates of the PI film cutting laser path map with the coordinates of the tungsten wires, the laser path is automatically adjusted relative to the mesh frame, so that the fine grid lines are all set in the middle area of ​​the parallel tungsten wires. When processing the PI film in the online grid groove, it is only necessary to import the grid pattern along with the line width of each grid line on the pattern into the laser processing equipment. This makes the laser processing of PI film fast and efficient, improves the processing efficiency of PI film grid cutting, and increases production output.

[0015] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0016] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A method for online grid groove processing of a PI film, characterized in that: A PI film-coated mesh frame is positioned on the mesh frame placement mechanism of a laser processing equipment. Reference points are pre-marked at the four corners of the mesh frame. Then, the coordinates of the tungsten wires on the mesh are obtained by scanning with the lens of the laser processing equipment, and the coordinates of the tungsten wires on the entire mesh are obtained relative to the reference point marked in the upper right corner. The grid line drawing of the PI film to be processed is then imported into the laser processing equipment. The grid line drawing is imported along with the linear position and the width of the grid line. The laser processing equipment converts the position and width of the grid line into laser cutting patterns corresponding to the coordinates of the tungsten wires on the mesh. Each laser cutting pattern is converted into a linear path with width or a closed cutting path, thereby obtaining a reliable laser path map for PI film cutting. The coordinates of the PI film cutting laser path map are compared with the coordinates of the tungsten wires, and the laser path position relative to the mesh frame is automatically adjusted in advance so that the fine grid lines are all set in the middle area of ​​the parallel tungsten wires. Then, the laser control drive module drives the laser cutting mechanism to complete the cutting of the PI film along the cutting path, generating the corresponding fine grid lines and main grid lines.

2. The method for online grid groove processing of a PI film according to claim 1, characterized in that: The laser processing equipment has a built-in conversion module that converts the grid line drawing of the PI film into a laser path diagram for PI film cutting. The conversion module receives the grid line drawing of the PI film and the width value set on the grid line on the drawing. The line width information of the corresponding main grid line and fine grid line on the grid line drawing of the PI film is also received. The conversion module converts the position and line width of the grid line into a laser cutting pattern corresponding to the coordinates of the tungsten wire on the mesh. Each laser cutting pattern is converted into a linear path with width or a closed cutting path, thereby obtaining a reliable laser path diagram for PI film cutting.

3. The method for online grid groove processing of a PI film according to claim 1, characterized in that: The fine grid lines on the grid line drawing of the PI film are transformed into linear paths with width, while the main grid lines on the grid line drawing of the PI film, due to their relatively large width, are directly transformed into closed rectangular shapes.

4. The method for online grid groove processing of a PI film according to claim 2, characterized in that: The laser processing equipment has a built-in laser parameter database module, which integrates the corresponding laser power, compensation value, and moving speed for PI films of different thicknesses.

5. The method for online grid groove processing of a PI film according to claim 4, characterized in that: The thickness of the PI film is input into the laser processing equipment. The laser processing equipment matches the film thickness with the corresponding laser parameters. Combined with the PI film cutting laser path diagram, the laser control and drive module drives the laser head of the laser cutting mechanism to cut the PI film along the cutting path and according to the set laser parameters, generating the corresponding fine grid lines and main grid lines.

6. The method for online grid groove processing of a PI film according to claim 1, characterized in that: When the laser control drive module drives the laser head of the laser cutting mechanism to move, it moves in a cyclical pattern from back to front and left to right.

7. The method for online grid groove processing of a PI film according to claim 1, characterized in that: The laser processing equipment has a small lens above the fixed mesh frame, and a light source is arranged above the small lens. The small lens makes the area of ​​the light spot small, so that the lens can completely capture the cutting path and the final cutting pattern during laser cutting. If the laser cutting path or cutting pattern is incorrect, an alarm will be triggered and the operation will be stopped.

8. The method for online grid groove processing of a PI film according to claim 1, characterized in that: After processing begins, the laser processing equipment will automatically scan to fill in the offset and rotation amounts into the product parameters, and perform slight expansion and contraction to ensure that the fine grid lines where the scan lines are located are aligned with the middle position of the warp tungsten wires.

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