Heat exchange part, machining method of heat exchange part, heat exchange module and electronic equipment
By designing the body and transition sections of the heat exchanger, and combining integrated forming process and material selection, the problem of space arrangement of liquid cooling plates in electronic devices was solved, realizing the miniaturization and integration of the equipment, and improving space utilization and processing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2026-03-31
AI Technical Summary
Existing liquid cooling plates are insufficient to meet the complex spatial requirements of electronic devices, thus limiting the miniaturization and integration of electronic devices.
Design a heat exchange component, including a body and a transition section, and form an avoidance space through an integrated forming process to adapt to the complex internal structure of electronic equipment. Use polymer materials or elastic metal materials to enable the transition section to bend to adapt to deformation requirements, and optimize the processing by combining forming process parameters.
It improves the space utilization of electronic devices, promotes the miniaturization and integration of equipment, reduces processing difficulty, and ensures structural reliability and heat exchange effect.
Smart Images
Figure CN121761674A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat transfer technology, and more specifically, to a heat exchanger, a method for processing the heat exchanger, a heat exchange module, and an electronic device. Background Technology
[0002] As electronic devices become increasingly integrated, heat dissipation has become a key factor limiting their performance improvement. Liquid cooling plates, as a highly efficient heat dissipation component, are widely used in various high-power-density electronic devices.
[0003] Currently, flow channels are typically created within liquid cooling plates to transfer heat using the flow of the working fluid, thereby cooling the corresponding areas of electronic devices. However, most liquid cooling plates are simple metal plates, which are difficult to meet the complex spatial arrangement requirements inside electronic devices and do not take advantage of the miniaturization development of electronic devices. Summary of the Invention
[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a novel heat exchanger, a method for processing the heat exchanger, a heat exchange module, and an electronic device.
[0005] According to one aspect of the present invention, a heat exchanger is provided.
[0006] The heat exchanger includes:
[0007] The heat exchanger includes a body and a transition section. The body includes a first part and a second part. The first end of the transition section is bent and connected to the first part, and the second end of the transition section is bent and connected to the second part. Along the extension direction of the heat exchanger, the first part, the second part, and the transition section can form a clearance space.
[0008] Optionally, the first end of the transition portion has a first angle with the first part, and the second end of the transition portion has a second angle with the second part, and the first angle and the second angle have different orientations.
[0009] Optionally, the first included angle and the second included angle are the same.
[0010] Optionally, the heat exchanger is formed into the transition section through an integral forming process.
[0011] Optionally, the transition section includes at least one bent segment.
[0012] Optionally, the number of the bending segments is multiple, and the multiple bending segments are bent along a first direction;
[0013] Alternatively, there may be multiple bending segments, some of which bend along a first direction and others along a second direction, the second direction intersecting the first direction.
[0014] Optionally, the bent segment is an arc-shaped bent segment.
[0015] Optionally, the plurality of the arc-shaped bends form a corrugated structure.
[0016] Optionally, the transition section includes at least one connecting segment, and the first part, the second part, and the connecting segment constitute a stepped structure.
[0017] Optionally, the first end of the connecting segment has a first rounded corner between it and the first portion, and / or the second end of the connecting segment has a second rounded corner between it and the second portion.
[0018] According to another aspect of the present invention, a method for processing a heat exchanger as described above is provided, comprising:
[0019] Obtain heat exchanger components;
[0020] The heat exchanger is formed into a body and a transition section through an integral forming process. The body includes a first part and a second part. The first end of the transition section is bent and connected to the first part, and the second end of the transition section is bent and connected to the second part. Along the extension direction of the heat exchanger, the first part, the second part and the transition section can form a clearance space.
[0021] Optionally, the heat exchanger is in the shape of a flat plate, and the process of forming the heat exchanger body and transition portion by an integral shaping process includes: forming an avoidance space through the shaping process.
[0022] Optionally, the parameters of the shaping process include shaping temperature and shaping pressure, wherein the shaping temperature ranges from 80℃ to 150℃ and the shaping pressure ranges from 0.05mPa to 0.4mPa.
[0023] Optionally, the shaping temperature is 120°C and the shaping pressure is 0.2 mPa.
[0024] According to another aspect of the present invention, a heat exchange module is provided, comprising a micropump and the heat exchange element described above.
[0025] Optionally, the heat exchanger has a first working fluid inlet, a first working fluid outlet and a flow channel, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.
[0026] According to another aspect of the present invention, an electronic device is provided, comprising the heat exchanger described above or the heat exchange module described above.
[0027] One technical advantage of the embodiments disclosed herein is that:
[0028] The heat exchanger includes a body and a transition section. The body includes a first part and a second part. The first end of the transition section is bent and connected to the first part, and the second end of the transition section is bent and connected to the second part. Along the extension direction of the heat exchanger, the first part, the second part, and the transition section can form a clearance space. This clearance space can avoid other electronic components such as ICs (Integrated Circuits), capacitors, and resistors inside the electronic device, so as to make full use of the internal space of the electronic device. This improves the space utilization rate of the electronic device using the heat exchanger and facilitates the miniaturization and integration of the electronic device.
[0029] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description
[0030] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.
[0031] Figure 1 This is a top view of a heat exchanger according to an embodiment of the present disclosure;
[0032] Figure 2 This is a side view of a heat exchanger according to an embodiment of the present disclosure;
[0033] Figure 3 This is a side view of another heat exchanger according to an embodiment of the present disclosure;
[0034] Figure 4 This is a side view of another heat exchanger according to an embodiment of the present disclosure;
[0035] Figure 5 This is a side view of another heat exchanger according to an embodiment of the present disclosure;
[0036] Figure 6 This is a schematic diagram of a heat exchange module according to an embodiment of the present disclosure.
[0037] Explanation of reference numerals in the attached figures:
[0038] 100. Heat exchanger; 200. Micro pump;
[0039] 1. First part; 2. Second part; 3. Transition section. Detailed Implementation
[0040] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the invention.
[0041] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.
[0042] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0043] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0044] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0045] This invention provides a heat exchanger 100, which can be applied to heat exchange in small electronic devices such as tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.
[0046] like Figures 1 to 5 As shown, the heat exchanger 100 provided in this embodiment of the invention includes:
[0047] The heat exchanger includes a main body and a transition section 3. The main body includes a first part 1 and a second part 2. The first end of the transition section 3 is bent and connected to the first part 1, and the second end of the transition section 3 is bent and connected to the second part 2. Along the extension direction of the heat exchanger, the first part 1, the second part 2 and the transition section 3 can form a clearance space.
[0048] like Figure 1As shown, along the extension direction of the heat exchanger 100, the heat exchanger 100 can be divided into three parts: a first part 1, a second part 2, and a transition part 3. Based on the actual design, the heat exchanger 100 can be a strip structure, a sheet structure, or other irregular shapes. The first part 1 has a first sub-flow channel, the second part 2 has a second sub-flow channel, and the transition part 3 has a third sub-flow channel. One side of the third sub-flow channel flows with the first sub-flow channel, and the other side of the third sub-flow channel flows with the second sub-flow channel, together forming a flow channel within the heat exchanger 100 to facilitate the flow of the working fluid within the heat exchanger 100 and achieve the heat exchange effect.
[0049] The third sub-channel can be configured such that one side is opposite to the first sub-channel and the other side is opposite to the second sub-channel, so as to facilitate smooth connection of the three channels and simplify the processing of the internal channels of the heat exchanger 100, thereby reducing the production difficulty of the heat exchanger 100.
[0050] The first, second, and third sub-channels can be set at the same height to facilitate the connection of the three channels, thereby facilitating the smooth flow of the working fluid within the heat exchanger 100, reducing the resistance to the flow of the working fluid, and ensuring the heat exchange effect of the heat exchanger 100.
[0051] like Figures 2 to 5 As shown, the first part 1 and the first end of the transition part 3 are bent and connected, and the second part 2 and the second end of the transition part 3 are bent and connected. That is, the two ends of the transition part 3 have angles with the first part 1 and the second part 2, respectively, so that the first part 1, the second part 2 and the transition part 3 are at different heights, so that a clearance space can be formed between the first part 1, the second part 2 and the transition part 3. This clearance space can avoid other electronic components such as ICs (Integrated Circuits), capacitors, and resistors in the electronic device, so as to make full use of the internal space of the electronic device, thereby improving the space utilization rate of the electronic device using the heat exchanger 100, and facilitating the miniaturization and integration of electronic devices.
[0052] like Figure 2 and Figure 3 As shown, the first part 1, the second part 2, and the corrugated transition section 3 together form a clearance space; as Figure 4 and Figure 5 As shown, the first part 1, the second part 2, and the stepped transition part 3 together form a clearance space. The length and structure of the transition part 3 can be specifically designed to adjust the size of the clearance space accordingly, so as to meet the different arrangement requirements of electronic devices using the heat exchanger 100.
[0053] In one embodiment, the transition portion 3 can be configured as a flexible structure, meaning that the transition portion 3 can be bent, stretched, or deformed. For example, the transition portion 3 can be made of polymer materials such as PET (polyethylene terephthalate) or PBT (polybutylene terephthalate), or it can be made of elastic metal, so that it can deform under external force, thereby enabling relative movement between the first part 1 and the second part 2 of the heat exchanger 100, thus meeting the deformation requirements of the electronic device.
[0054] In another embodiment, the transition section 3 can also be set as a rigid structure, so that the clearance space formed by the first part 1, the second part 2 and the transition section 3 is more stable, and the structural reliability of the heat exchanger 100 can also be improved.
[0055] Optionally, the first end of the transition portion 3 has a first angle with the first part 1, and the second end of the transition portion 3 has a second angle with the second part 2, and the first angle and the second angle have different orientations.
[0056] In this way, a clearance space can be formed between the first part 1, the second part 2 and the transition part 3. This clearance space can avoid other electronic components such as ICs (integrated circuits), capacitors, and resistors in the electronic device, so as to make full use of the internal space of the electronic device, thereby improving the space utilization rate of the electronic device using the heat exchanger 100 and facilitating the miniaturization and integration of the electronic device.
[0057] Optionally, the first included angle and the second included angle are the same.
[0058] In this embodiment, the two included angles are set to be the same. On the one hand, this facilitates the connection between the transition part 3 and the first part 1 and the second part 2, reducing assembly difficulty; on the other hand, it also improves the structural symmetry of the heat exchanger 100 and facilitates the utilization of the internal space of the electronic device.
[0059] Optionally, the heat exchanger 100 is formed into the transition portion 3 through an integral forming process.
[0060] In this embodiment, after the heat exchanger 100 is procured or processed, it is integrally formed by a forming mold to obtain the transition part 3. This ensures the connection strength and reliability between the transition part 3 and the first part 1 and the second part 2, thereby ensuring the structural reliability of the heat exchanger 100.
[0061] Furthermore, since the heat exchanger 100 has internal flow channels, compared to first forming the transition part 3 and then assembling the heat exchanger 100, forming the transition part 3 integrally with the heat exchanger 100 eliminates the need to position the flow channels and avoids heat exchange abnormalities caused by flow channel misalignment. This reduces processing difficulty, improves processing efficiency, and ensures the heat exchange effect of the heat exchanger 100.
[0062] Optionally, the transition portion 3 includes a polymer material layer. This allows for both bending and connecting of the transition portion 3 and lightweight design of the heat exchanger 100, thereby facilitating the portability and use of electronic devices equipped with the heat exchanger 100.
[0063] Optionally, the transition portion 3 includes a polymer material layer and a metal layer.
[0064] Specifically, the transition portion 3 can be formed by stacking polymer material layers and metal layers, or by combining polymer material layers and metal layers. Both methods facilitate the bending connection between the transition portion 3 and the first portion 1 and the second portion 2.
[0065] Furthermore, since the transition section 3 has a third sub-channel, by setting the transition section 3 to include a polymer material layer and a metal layer, the metal layer can also be used to enhance the strength of the transition section 3 itself, so as to form a reliable support for the flow channel on it, avoid abnormalities such as flow channel position displacement or collapse, and thus improve the structural stability of the heat exchanger 100.
[0066] Optionally, the transition section 3 includes at least one bent segment.
[0067] In this embodiment, the transition section 3 may include one, two or more bending segments. The bending segments may be arc-shaped, rectangular, or irregular in shape, etc., so that different clearance spaces can be formed between the first part 1, the second part 2 and the transition section 3, so as to facilitate clearance between different structures in the electronic device.
[0068] Optionally, the number of the bending segments is multiple, and the multiple bending segments are bent along a first direction;
[0069] Alternatively, there may be multiple bending segments, some of which bend along a first direction and others along a second direction, the second direction intersecting the first direction.
[0070] In this embodiment, as Figure 3 and Figure 5 As shown, multiple bending segments can be bent in one direction to form a corrugated or stepped structure, which facilitates the avoidance of different structures within the electronic device, facilitates the forming of the transition section 3, and reduces the processing difficulty of the heat exchange component 100.
[0071] In another embodiment, some of the bending segments may be designed to bend in one direction, while other bending segments may bend in a direction intersecting that direction. For example, the transition portion 3 may be U-shaped or other shapes to accommodate the complex obstacle avoidance requirements inside the electronic device.
[0072] Optionally, the bent segment is an arc-shaped bent segment.
[0073] Optionally, the plurality of the arc-shaped bending segments constitute a corrugated structure. In an electronic device having this heat exchanger 100, the corrugated structure can be positioned opposite to a connecting structure such as a hinge, so that the transition portion 3 can adapt to the deformation requirements of the electronic device.
[0074] Optionally, the transition section 3 includes at least one connecting segment, and the first part 1, the second part 2 and the connecting segment constitute a stepped structure, which can simplify the forming process of the transition section 3 and reduce the processing difficulty of the heat exchanger 100.
[0075] like Figure 4 As shown, the transition section 3 includes a vertically extending connecting segment that forms a clearance space with the first part 1 and the second part 2. Figure 5 As shown, the transition section 3 includes multiple connecting segments, some of which extend vertically and others extend horizontally. These connecting segments form a clearance space with the first section 1 and the second section 2. In this way, different structures within the electronic device can be cleared.
[0076] Optionally, the first end of the connecting segment has a first rounded corner between it and the first part 1, and / or the second end of the connecting segment has a second rounded corner between it and the second part 2.
[0077] In this embodiment, by setting a first rounded corner and a second rounded corner, the connecting segment is smoothly connected to the first part 1 and the second part 2, respectively. This also prevents the heat exchanger 100 from scratching the surrounding structure, thereby extending the service life of the electronic device with the heat exchanger 100. The radius of the first rounded corner can be 0.5mm, and the radius of the second rounded corner can also be 0.5mm, which simplifies the design of the two rounded corners.
[0078] Optionally, the first part 1 includes at least one of a polymer material layer and a metal layer, and / or the second part 2 includes at least one of a polymer material layer and a metal layer.
[0079] Specifically, depending on actual design requirements, the first part 1 can include a polymer material layer and / or a metal layer. For example, the first part 1 can include a metal layer, which can improve the strength and thermal conductivity of the first part 1, thereby improving the heat exchange efficiency of the heat exchanger 100, reducing the operating temperature of the electronic device with the heat exchanger 100, and also facilitating the reduction of the thickness of the first part 1; the first part 1 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger 100, thereby facilitating the portability and use of the electronic device with the heat exchanger 100; the first part 1 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger 100.
[0080] Similarly, the second part 2 can include a polymer material layer and / or a metal layer. For example, the second part 2 can include a metal layer, which can improve the strength and thermal conductivity of the second part 2, thereby improving the heat exchange efficiency of the heat exchanger 100, reducing the operating temperature of the electronic device with the heat exchanger 100, and also facilitating the reduction of the thickness of the second part 2; the second part 2 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger 100, thereby facilitating the portability and use of the electronic device with the heat exchanger 100; the second part 2 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger 100.
[0081] Optionally, the first part 1 includes at least one of a polymer material layer and a metal layer, and / or the second part 2 includes at least one of a polymer material layer and a metal layer.
[0082] Specifically, depending on actual design requirements, the first part 1 can include a polymer material layer and / or a metal layer. For example, the first part 1 can include a metal layer, which can improve the strength and thermal conductivity of the first part 1, thereby improving the heat exchange efficiency of the heat exchanger 100, reducing the operating temperature of the electronic device with the heat exchanger 100, and also facilitating the reduction of the thickness of the first part 1; the first part 1 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger 100, thereby facilitating the portability and use of the electronic device with the heat exchanger 100; the first part 1 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger 100.
[0083] Optionally, the first part 1 includes a metal layer, the second part 2 includes a metal layer, and the transition part 3 includes a polymer material layer.
[0084] Specifically, by including a polymer material layer in the transition portion 3, the transition portion 3 becomes deformable, allowing it to deform under external force and thus change the angle between the first part 1 and the second part 2. Furthermore, by including a metal layer in both the first part 1 and the second part 2, the strength of both parts can be increased while simultaneously reducing the thickness of both parts, thereby reducing the overall weight of the heat exchanger 100 and facilitating its thinner and lighter design.
[0085] This invention also provides a method for processing a heat exchanger 100, comprising:
[0086] Obtain heat exchanger 100;
[0087] Obtaining the heat exchanger 100 includes: purchasing or processing a flat plate-shaped heat exchanger 100.
[0088] The heat exchanger 100 is formed into a body and a transition portion 3 through an integral forming process. The body includes a first part 1 and a second part 2. The first end of the transition portion 3 is bent and connected to the first part 1, and the second end of the transition portion 3 is bent and connected to the second part 2. Along the extension direction of the heat exchanger 100, the first part 1, the second part 2 and the transition portion 3 can form a clearance space.
[0089] This clearance space can avoid other electronic components such as ICs (Integrated Circuits), capacitors, and resistors inside the electronic device, so as to make full use of the internal space of the electronic device, thereby improving the space utilization rate of the electronic device using the heat exchanger 100, and facilitating the miniaturization and integration of the electronic device.
[0090] Optionally, the heat exchanger 100 is in the shape of a flat plate, and the process of forming the heat exchanger 100 into a body and a transition portion 3 by means of forming an avoidance space through the forming process.
[0091] In this embodiment, after the heat exchanger 100 is procured or processed, it is integrally formed by a forming mold to obtain the transition part 3. This ensures the connection strength and reliability between the transition part 3 and the first part 1 and the second part 2, thereby ensuring the structural reliability of the heat exchanger 100.
[0092] In the process of integrally molding the heat exchanger 100 using a forming mold, the heat exchanger 100 can be placed into the forming mold as a whole, so that the positioning parts on both sides of the forming mold can fix the heat exchanger 100, and the forming part in the middle of the forming mold can be pressed together to form the transition part 3.
[0093] Before integrally forming the heat exchanger 100 using a forming mold, the area of the pre-forming region corresponding to the transition part 3 can be kept greater than twice the area of the transition part 3, so as to obtain the desired transition part 3.
[0094] Furthermore, since the heat exchanger 100 has internal flow channels, compared to forming the transition part 3 first and then assembling the heat exchanger 100, forming the transition part 3 integrally with the heat exchanger 100 eliminates the need to position the flow channels and avoids heat exchange abnormalities caused by flow channel misalignment. This reduces processing difficulty, improves processing efficiency, and ensures the heat exchange effect of the heat exchanger 100.
[0095] Optionally, the forming process parameters include forming temperature and forming pressure. The forming temperature ranges from 80℃ to 150℃, and the forming pressure ranges from 0.05mPa to 0.4mPa. This can prevent springback or deformation of the transition section 3, thereby forming a more reliable transition section 3 and improving the structural reliability of the heat exchanger 100.
[0096] Optionally, the shaping temperature is 120°C and the shaping pressure is 0.2 MPa, which can reduce the risk of springback or deformation of the transition part 3 and also avoid abnormalities such as glue overflow during the pressing process.
[0097] This invention also provides a heat exchange module, such as... Figure 6 As shown, it includes a micropump 200 and the heat exchanger 100. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micropump 200 and form a complete heat exchange cycle.
[0098] Among them, the micropump 200 includes, but is not limited to, piezoelectric pumps and electromagnetic pumps. The thickness of the micropump 200 can be between 0.3mm and 3mm to facilitate the development of thinner and lighter heat exchange modules.
[0099] Optionally, the heat exchanger 100 has a first working fluid inlet, a first working fluid outlet, and a flow channel, and the micropump 200 has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet. In this way, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet, and return to the micropump 200 from the flow channel through the first working fluid outlet and the second working fluid inlet, thereby realizing the circulation of the working fluid.
[0100] This invention also provides an electronic device, including the heat exchanger 100 or the heat exchange module. This electronic device can be a small electronic device, such as a tablet computer, laptop computer, smart glasses, smartwatch, or smart headband.
[0101] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.
[0102] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims
1. A heat exchanging member, characterized by, include: The body part and the transition part (3) are provided. The body part includes a first part (1) and a second part (2). The first end of the transition part (3) is bent and connected to the first part (1), and the second end of the transition part (3) is bent and connected to the second part (2). Along the extension direction of the heat exchanger, the first part (1), the second part (2) and the transition part (3) can form a clearance space.
2. The heat exchange member according to claim 1, characterized by The first end of the transition section (3) has a first angle with the first part (1), and the second end of the transition section (3) has a second angle with the second part (2), and the first angle and the second angle have different orientations.
3. The heat exchange member according to claim 2, characterized by The first included angle and the second included angle are the same.
4. The heat exchange member according to claim 1, characterized by The heat exchanger (100) is formed into the transition section (3) through an integral forming process.
5. The heat exchange member according to claim 1, wherein The transition section (3) includes at least one bent section.
6. The heat exchange member according to claim 5, characterized by The number of the bending segments is multiple, and the multiple bending segments are bent along the first direction; Alternatively, there may be multiple bending segments, some of which bend along a first direction and others along a second direction, the second direction intersecting the first direction.
7. The heat exchange member according to claim 5, wherein The bent section is an arc-shaped bent section.
8. The heat exchange member according to claim 7, characterized by The multiple arc-shaped bends form a corrugated structure.
9. The heat exchange member of claim 1, wherein The transition section (3) includes at least one connecting segment, and the first part (1), the second part (2) and the connecting segment constitute a stepped structure.
10. The heat exchange member according to claim 9, characterized by The first end of the connecting segment has a first rounded corner between it and the first part (1), and / or the second end of the connecting segment has a second rounded corner between it and the second part (2).
11. A method of processing a heat exchanger according to any one of claims 1 to 10, characterized in that include: Obtain heat exchanger components; The heat exchanger is formed into a body and a transition section through an integral forming process. The body includes a first part and a second part. The first end of the transition section is bent and connected to the first part, and the second end of the transition section is bent and connected to the second part. Along the extension direction of the heat exchanger, the first part, the second part and the transition section can form a clearance space.
12. The heat exchanging member processing method according to claim 11, wherein The heat exchanger is flat, and the process of forming the heat exchanger into a body and a transition section through an integral shaping process includes: forming an avoidance space through the shaping process.
13. The heat exchanging member processing method according to claim 12, wherein The parameters of the shaping process include shaping temperature and shaping pressure. The shaping temperature ranges from 80℃ to 150℃, and the shaping pressure ranges from 0.05mPa to 0.4mPa.
14. The heat exchanging member processing method according to claim 13, wherein The shaping temperature is 120℃ and the shaping pressure is 0.2mPa.
15. A heat exchange module, characterized by It includes a micropump (200) and a heat exchanger (100) as described in any one of claims 1 to 10.
16. The heat exchange module of claim 15, wherein: The heat exchanger (100) has a first working fluid inlet, a first working fluid outlet and a flow channel, and the micro pump (200) has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.
17. An electronic device, comprising: It includes the heat exchanger (100) as described in any one of claims 1 to 10 or the heat exchange module as described in any one of claims 15 to 16.