Temperature pressure sensor

By using sintered glass sealing and thermal insulation sleeve design, the sealing reliability and thermal hysteresis problems of temperature and pressure sensors under high pressure and vibration environments are solved, achieving rapid thermal response and stable temperature detection.

CN121761968APending Publication Date: 2026-03-31NANJING FINEMEMS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-24
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Existing temperature and pressure sensors suffer from sealing and reliability issues at the connection between the thermistor and the circuit board, especially prone to failure under high pressure and vibration environments, and exhibit severe thermal hysteresis.

Method used

By using sintered glass to seal the gap between the terminal and the terminal through hole, combined with the heat insulation sleeve design, the temperature sensitive element is directly placed inside the interface tube. The sealing area is optimized by the structure of the annular cavity and the island section, avoiding the use of sealant and improving sealing reliability and thermal response speed.

Benefits of technology

It significantly improves the long-term sealing reliability of the sensor under high pressure and high and low temperature cycling environments, reduces the hysteresis of temperature detection, enhances vibration resistance, and optimizes the sealing process.

✦ Generated by Eureka AI based on patent content.

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Abstract

A temperature pressure sensor comprises: a housing comprising a metal pressure interface, the pressure interface comprising a transversely extending plate and an interface pipe which is formed by integrally extending the plate towards one side of a longitudinal near end and is used for introducing a medium to be measured; the interior of the interface pipe is communicated to the surface of one side of the longitudinal far end of the plate through a pressure hole and a plurality of terminal via holes; an electronic module assembly fixed inside the housing; the pressure sensitive element is fixed at the longitudinal far end of the pressure hole in an airtight manner and is electrically connected to the electronic module assembly; the temperature sensitive component comprises a temperature sensitive element at least partially arranged in the interface tube and a plurality of terminals, one end of each terminal is connected to the temperature sensitive element, and the other end of each terminal penetrates through the terminal via hole towards one side of the longitudinal far end and then is electrically connected to the electronic module component; air tightness is formed between the terminal and the terminal via hole through sintered glass; the terminal is good in sealing effect and long in sealing life.
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Description

Technical Field

[0001] This invention belongs to the field of sensor technology, specifically a temperature and pressure sensor. Background Technology

[0002] In some temperature and pressure sensors, it is sometimes necessary to obtain the temperature of the measured medium additionally through a thermistor. To reduce errors and thermal hysteresis caused by temperature gradients, the thermistor usually needs to be placed as close as possible to the pressure inlet port. Furthermore, an electrical connection is required between the thermistor and the circuit board inside the temperature and pressure sensor, making the sealing of the thermistor crucial.

[0003] In existing technologies, the following methods are commonly used: 1. Wrap the thermistor in a metal temperature sleeve and place it as close as possible to the pressure port, filling the metal temperature sleeve with thermally conductive material to reduce the influence of temperature gradients. This method increases cost and sensor size, and also raises issues regarding the reliable filling and aging of the thermally conductive material. 2. Expose the thermistor directly to the inside of the pressure channel, and then seal it around the terminals of the thermistor with sealant. This method also faces the problem of sealant aging, and as the medium pressure increases, the sealing performance and lifespan of the sealant decrease sharply or even fail completely; in addition, the head of the thermistor needs to be reliably fixed to avoid vibration.

[0004] The information disclosed in the background section of this invention is only intended to enhance the understanding of the general background of this invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature and pressure sensor to solve at least one of the above-mentioned technical problems.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A temperature and pressure sensor, comprising: The housing includes a metal pressure interface, the pressure interface comprising a laterally extending plate and an interface tube integrally formed from the plate toward a longitudinal proximal end for introducing a medium to be measured; the interior of the interface tube is connected to the longitudinal distal end surface of the plate through a pressure hole and a plurality of terminal through holes. Electronic module assembly fixed inside the housing; A pressure-sensitive element is hermetically fixed to the longitudinal distal end of the pressure orifice and electrically connected to the electronic module assembly; The temperature-sensitive component includes a temperature-sensitive element at least partially disposed within the interface tube and a plurality of terminals connected at one end to the temperature-sensitive element. The other end of the terminals passes through the terminal via on the longitudinally distal side and is electrically connected to the electronic module assembly. A sintered glass layer forms an airtight seal between the terminals and the terminal via.

[0007] Preferably, a cavity is formed on one longitudinally distal side surface of the plate, and the longitudinally distal end of the terminal through hole is disposed at the bottom of the cavity.

[0008] Preferably, the cavity extends in a transverse plane to form an annular shape, and the longitudinal distal end of the plate forms an island portion surrounded by the cavity, with the longitudinal distal end of the pressure hole extending through to the longitudinal side surface of the island portion.

[0009] Preferably, the longitudinal proximal end of the sintered glass is relatively enlarged to form an enlarged portion.

[0010] Preferably, the inner wall of the interface tube has a longitudinally extending receiving portion for at least partially accommodating the temperature-sensitive element, the temperature-sensitive element abutting against the inner wall of the receiving portion.

[0011] Preferably, the temperature-sensitive element is externally fitted with a heat-insulating sleeve that exposes at least a portion of the surface of the temperature-sensitive element to the inner cavity of the interface tube, and the inner wall of the interface tube is formed with a receiving portion for at least partially accommodating the longitudinal extension of the heat-insulating sleeve.

[0012] Preferably, the heat insulation sleeve is made of an elastic material.

[0013] Preferably, the outer wall of the heat insulation sleeve abuts against the inner wall of the interface pipe.

[0014] Preferably, the pressure-sensitive element is a metal pressure-sensitive head.

[0015] Preferably, the metal pressure-sensitive head has a laterally extending metal elastic membrane and a ring of supporting flanges formed by the metal elastic membrane protruding towards the longitudinal proximal side and sealed to the longitudinal distal end of the pressure hole.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention avoids the use of sealant by sealing the gap between the terminal and the terminal via with sintered glass. Sintered glass can form a chemically stable and thermally expansion-matched hermetically tight connection at the terminal via, which has the advantages of high pressure resistance, wide temperature range, anti-aging, and vibration resistance, significantly improving the long-term sealing reliability of the sensor under harsh environments such as high pressure and high and low temperature cycles; 2. This invention achieves rapid thermal response by directly placing the temperature-sensitive element inside the receiving part of the interface tube, allowing it to directly contact the medium being measured flowing through the interface tube. The structure of the receiving part provides mechanical support for the temperature-sensitive element, effectively resisting vibration. The design of the heat insulation sleeve, while ensuring thermal contact, can also reduce heat transfer between the temperature-sensitive element and the wall of the interface tube, thereby reducing the impact of the interface tube wall on the temperature-sensitive element, improving the hysteresis of temperature detection, and the heat insulation sleeve can also play a role in vibration reduction and protection of the temperature-sensitive element. 3. The present invention, through the design of the annular cavity and the island section, spatially separates and optimizes the installation area of ​​the pressure-sensitive element and the terminal sealing area, which facilitates their respective sealing process operations. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the temperature and pressure sensor structure in this embodiment; Figure 2 for Figure 1 Enlarged view of a portion of point A in the middle; Figure 3 This is a schematic diagram of the temperature and pressure sensor structure of another preferred embodiment in this example; In the diagram: 1. Housing; 11. Pressure interface; 111. Plate; 111a. Pressure hole; 111b. Terminal through hole; 111c. Cavity; 1110. Sintered glass; 1110a. Enlargement; 1111. Island section; 112. Interface tube; 112a. Receiving section; 12. Cylinder shell; 13. End button; 131. Pin; 2. Pressure sensitive element; 3. Temperature sensitive component; 30. Temperature sensitive element; 31. Terminal; 32. Heat insulation sleeve; 4. Electronic module assembly. Detailed Implementation

[0018] The technical solution of this application will now be clearly and completely described with reference to the accompanying drawings. The following embodiments are exemplary and are only used to explain this application, and should not be construed as limiting this application. In the following description, the same reference numerals are used to denote the same or equivalent elements, and repeated descriptions are omitted.

[0019] In the description of this application, it should be understood that the terms "upper," "lower," "inner," "outer," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the prepositions "first," "second," and "third," etc., are only used for the purpose of distinguishing the modified objects, and should not be construed as indicating or implying relative importance.

[0020] Furthermore, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] It should also be further understood that the term "and / or" as used in this application specification and the corresponding claims refers to any combination of one or more of the listed items and all possible combinations.

[0022] like Figure 1 and Figure 2 As shown, this embodiment provides a temperature and pressure sensor. The temperature and pressure sensor includes a housing 1, an electronic module assembly 4 fixed inside the housing 1, a pressure-sensitive element 2 for sensing the pressure of the medium to be measured, and a temperature-sensitive element 3 for sensing the temperature of the medium to be measured.

[0023] The housing 1 serves as the mechanical support and sealing body for the sensor, and includes a metal pressure port 11. The pressure port 11 is preferably integrally formed from a machinable and corrosion-resistant metal material such as stainless steel or aluminum alloy through machining, casting, or forging. The pressure port 11 includes a plate 111 extending generally laterally (i.e., perpendicular to the longitudinal axis), and extending from the central region of the plate 111 towards the longitudinal proximal end (i.e.,... Figure 1 The interface tube 112 is integrally formed by extending one side of the lower end of the tube. The interface tube 112 is usually cylindrical.

[0024] In this embodiment, the housing 1 may further include a cylindrical shell 12 and an end button 13. The pressure port 11 is fixedly connected to the bottom end of the cylindrical shell 12, and the connection method may be welding. The end button 13 is located at the top end of the cylindrical shell 12. The top end of the cylindrical shell 12 can be rolled inward to press the bottom end of the end button 13 against the pressure port 11. A pin 131 may be provided on the end button 13 to realize the electrical connection between the electronic module assembly 4 and external devices.

[0025] The board 111 has a pressure hole 111a and several terminal through holes 111b (the number of which is the same as the number of terminals 31). The pressure hole 111a and the terminal through holes 111b extend downward (i.e., towards the longitudinal proximal end) from the longitudinally distal end (the longitudinally distal end corresponds to the upper end in the figure, and the longitudinally proximal end corresponds to the lower end in the figure) of the surface of the board 111, and finally communicate with the inner cavity of the interface tube 112. Specifically, the pressure hole 111a is used to transfer the medium to be measured in the interface tube 112 to the pressure-sensitive element 2. The terminal through holes 111b are used to allow the terminals 31 of the temperature-sensitive component 3 to pass through, so as to realize the electrical connection between the temperature-sensitive component 3 and the electronic module component 4.

[0026] A recess 111c is preferably formed on the longitudinally distal side surface of plate 111. This recess 111c is recessed inwards (towards the longitudinal proximal end) from the surface of plate 111. The longitudinally distal opening of terminal via 111b (i.e., the opening located on the longitudinally distal side of plate 111) is located at the bottom of this recess 111c. This design spatially separates the sealing operation area of ​​terminal via 111b from other areas of plate 111.

[0027] More preferably, the cavity 111c extends in a ring shape in the transverse plane. This naturally creates a relatively convex region surrounded by the annular cavity 111c on the longitudinally distal side surface of the plate 111; this region can be referred to as the island portion 1111. The longitudinally distal end of the pressure hole 111a extends to the upper surface of this island portion 1111 (i.e., the longitudinally distal side surface). By making the cavity 111c annular, subsequent glass sintering and sealing are facilitated.

[0028] The pressure-sensitive element 2 is hermetically fixed to the distal longitudinal end of the pressure port 111a. Its function is to convert the pressure of the measured medium into an electrical signal (such as a change in resistance, capacitance, or voltage). The pressure-sensitive element 2 is electrically connected to the electronic module assembly 4 via wires or direct soldering. The electronic module assembly 4 typically includes a circuit board 111, which integrates processing circuitry to process the electrical signals generated by the pressure-sensitive element 2 and the temperature-sensitive element 3, and output standard pressure and temperature values.

[0029] As a preferred embodiment, the pressure-sensitive element 2 can be a pressure-sensitive head having an elastic metal diaphragm and a strain resistor disposed on the surface of the elastic metal diaphragm.

[0030] The temperature-sensitive component 3 includes a temperature-sensitive element 30 and several terminals 31 connected thereto. The temperature-sensitive element 30 is at least partially disposed within the inner cavity of the interface tube 112 to directly contact and sense the temperature of the medium flowing through it. The temperature-sensitive element 30 can be a thermistor, platinum resistance thermometer, thermocouple, or other suitable type of temperature sensing element.

[0031] One end of terminal 31 (longitudinal proximal side) is connected to the lead of temperature-sensitive element 30 in a mechanically and electrically reliable manner (such as soldering or crimping), or is itself an extension electrode of temperature-sensitive element 30. The other end of terminal 31 (longitudinal distal side) extends in the longitudinal distal direction, passing through the inner cavity of interface tube 112 and terminal through hole 111b in sequence, and finally reaching the longitudinal distal side of board 111, where it is electrically connected to the circuit board 111 of electronic module assembly 4 by means of soldering or connectors.

[0032] To improve the sealing reliability and mechanical locking effect of the sintered glass 1110, the longitudinal proximal side of the sintered glass 1110 can be designed to be relatively enlarged to form an enlarged portion 1110a. The enlarged portion 1110a increases the contact area between the glass and the plate 111 and the mechanical interlock, effectively preventing the glass from being pushed out of the hole under high pressure or vibration, and further improving the pressure resistance and reliability of the sealing structure.

[0033] In this embodiment, a longitudinally extending receiving portion 112a can be directly formed on the inner wall of the interface tube 112. This receiving portion 112a can be a groove extending to the lower end face of the interface tube 112, and the groove is disposed on the wall of the hole in the interface tube 112. Alternatively, in other embodiments, the receiving portion 112a can also be a through hole extending to the lower end face of the interface tube 112, and the through hole is disposed inside the inner wall of the interface tube 112, independent of the inner cavity of the interface tube 112. The temperature-sensitive element 30 abuts against the inner wall of the receiving portion 112a. The receiving portion 112a can provide support for the temperature-sensitive element 30, reducing terminal fatigue caused by vibration.

[0034] As another preferred embodiment of this solution, such as Figure 3As shown, a heat insulation sleeve 32 can be fitted over the temperature sensing element 30. The heat insulation sleeve 32 can be fixed to the pressure port 11, or alternatively, it can be fixedly wrapped around the outside of the temperature sensing element 30. The heat insulation sleeve 32 is made of a material with relatively low thermal conductivity, such as a polymer (e.g., an organic foam material). Its design allows at least a portion of the temperature sensing surface of the temperature sensing element 30 (e.g., a part of the head or side) to be exposed in the inner cavity of the interface tube 112, directly contacting the medium. Similarly, a receiving portion 112a for at least partially accommodating the longitudinally extending heat insulation sleeve 32 can still be formed on the inner wall of the interface tube 112. The receiving portion 112a provides support for the temperature sensing element 30, reducing fatigue of the terminal 31 caused by vibration. The heat insulation sleeve 32 can separate the temperature sensing element 30 from the interface tube 112, reducing heat exchange between them, thereby reducing the impact of the interface tube 112 on the temperature sensing element 30. Generally, since the mass of the pressure interface 11 is much greater than that of the temperature sensing element 30, the heat it can absorb or release is much greater than that of the temperature sensing element 30, thus forming a thermal inertia similar to that of the ocean. Therefore, the temperature pressure sensor, through this configuration, can reduce the temperature signal hysteresis caused by the thermal inertia of the pressure interface 11. The heat insulation sleeve 32 can be perforated (e.g., mesh), thereby improving heat exchange with the measured medium while reducing the thermal inertia of the pressure interface 11. More preferably, the heat insulation sleeve 32 can be made of an elastic material, thus providing mechanical protection for the temperature sensing element 30. In this case, the outer wall of the heat insulation sleeve 32 can also abut against the inner wall of the interface tube 112 to simultaneously improve the vibration resistance of the temperature sensing element 30. In this embodiment, the pressure sensing element can also be a semiconductor pressure sensing element, such as a MEMS pressure chip.

[0035] It should be noted that although the present invention has been disclosed above with specific embodiments, the above embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A temperature pressure sensor, characterized by, The utility model relates to a pressure sensor, comprising: a housing (1) comprising a metal pressure interface (11), the pressure interface (11) comprising a transversely extending plate (111) and an interface tube (112) integrally extending from the plate (111) towards a longitudinally proximal side for introducing a medium to be measured, an interior of the interface tube (112) being in communication with a surface of the plate (111) on a longitudinally distal side through a pressure hole (111a) and a plurality of terminal through holes (111b); an electronic module assembly (4) fixed inside the housing (1); a pressure sensitive element (2) fixed airtightly on a longitudinally distal side of the pressure hole (111a) and electrically connected to the electronic module assembly (4); and a temperature sensitive assembly (3) comprising a temperature sensitive element (30) disposed at least partially inside the interface tube (112) and a plurality of terminals (31) connected to the temperature sensitive element (30) on one end, the terminals (31) being electrically connected to the electronic module assembly (4) on the other end after passing through the terminal through holes (111b) towards a longitudinally distal side, an airtightness between the terminals (31) and the terminal through holes (111b) being formed by sintered glass (1110).

2. The temperature pressure sensor of claim 1, wherein, The surface of the plate (111) on a longitudinally distal side forms a concave cavity (111c), and the terminal through holes (111b) are disposed on a bottom of the concave cavity (111c) on a longitudinally distal side.

3. The temperature pressure sensor of claim 2, wherein, The concave cavity (111c) extends in a transverse plane to form a ring shape, and the surface of the plate (111) on a longitudinally distal side oppositely forms an island portion (1111) surrounded by the concave cavity (111c), and the pressure hole (111a) penetrates through to a surface of the island portion (1111) on a longitudinal side.

4. The temperature pressure sensor of claim 1, wherein, The longitudinally proximal side of the sintered glass (1110) is relatively enlarged to form an enlarged portion.

5. The temperature pressure sensor of claim 1, wherein, An inner wall of the interface tube forms a longitudinally extending accommodation portion for at least partially accommodating the temperature sensitive element, and the temperature sensitive element abuts against an inner wall of the accommodation portion.

6. The temperature pressure sensor of claim 1, wherein, An insulating sleeve (32) is provided outside the temperature sensitive element, at least a portion of a surface of the temperature sensitive element being exposed to an inner cavity of the interface tube, and an inner wall of the interface tube forms a longitudinally extending accommodation portion for at least partially accommodating the insulating sleeve (32).

7. The temperature pressure sensor of claim 6, wherein, The insulating sleeve (32) is made of an elastic material.

8. The temperature pressure sensor of claim 6, wherein, An outer wall of the insulating sleeve (32) abuts against an inner wall of the interface tube.

9. The temperature pressure sensor of claim 1, wherein, The pressure sensitive element (2) is a metal pressure sensitive head.

10. The temperature pressure sensor of claim 6, wherein, The metal pressure sensitive head has a transversely extending metal elastic film and a ring of support flanges integrally extending from the metal elastic film towards a longitudinally proximal side and sealingly welded to a longitudinally distal side of the pressure hole (111a).