Circuit monitoring system adopting substrate technology

Abstract

The invention discloses a circuit monitoring system adopting a substrate technology. Devices are sealed and connected through a bare DIE sealing process, a sealing chip adopts a traditional plastic packaging and bonding packaging process, each device is a lead bonding type bare core, the devices are bonded with a substrate through insulating glue, and internal resistors and capacitors are connected with the substrate through a surface mounting technology (SMT); all devices in the system are communicated through substrate wiring, and external pins of the circuit monitoring system are led out by pins of the sealing chip; and the BGA pins of the sealing chip are directly connected with the external pins and the configurable pins through BGA layout to form a standardized packaging module. The circuit monitoring system sealing chip can be conveniently applied to small-sized occasions such as unmanned aerial vehicles and humanoid robots; the tested circuit system and the circuit monitoring system are connected through a substrate technology, and the whole control system is installed as a module, so that the installation process is greatly simplified, and the yield is remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a circuit monitoring system employing substrate technology. Background Technology

[0002] The circuit monitoring system monitors the operating parameters of the circuit under test, such as voltage, current, and temperature, to ensure that the circuit operates within the normally set parameter range. When abnormal operating parameters occur, the circuit monitoring system can send an alarm signal to the main control unit, reminding the main control unit to take measures to prevent the abnormality from spreading further and to prevent irreversible damage to the entire control system.

[0003] The circuit monitoring system mainly consists of sensors, data acquisition modules, data processing modules, and alarm modules. Sensors are generally sampling resistors, thermistors, etc.; the data acquisition module is generally composed of ADCs, which are responsible for converting the analog signals collected by the sensors into digital signals; the data processing module is generally built by MCUs, which are used to process the digital signals sent by the data acquisition module and determine whether the operating parameters such as voltage and current are normal; the alarm module consists of sound, light, and electrical devices, which are used to indicate abnormal parameters, or it can be directly connected to the main control unit, which will handle the abnormality.

[0004] The framework of the circuit monitoring system is as follows Figure 1 As shown, the analog quantities such as voltage, current, and temperature of the system under test are amplified by operational amplifier signals and then input to the ADC of the acquisition module. It should be noted that the acquisition module can use the ADC module inside the MCU, or the number of sampling channels can be expanded by adding a dedicated ADC chip.

[0005] like Figure 1 The components shown can be mounted on a printed circuit board (PCB) to form modules with specific functions, and connected to the circuit system under test via connectors and cables. When the circuit system under test is a traditional module or a printed circuit board assembly (PCBA), the circuit monitoring module can play a good role in monitoring and alarming.

[0006] However, as applications such as robots, drones, and micro-devices place increasingly higher demands on the integration and miniaturization of circuit systems, many control systems adopt substrate-based encapsulation technologies and wafer-level packaging processes to reduce system size. These PCBA-based circuit monitoring systems are beginning to reveal more and more shortcomings, particularly in the following two aspects:

[0007] (1) Some systems under test use bare DIE packaging technology, while the circuit monitoring system module uses PCBA technology, which makes it too large compared to the system under test, thus undermining the application scenario's requirements for miniaturization and integration of the control system.

[0008] (2) The current, temperature and other parameters of the system under test are generally differential signals. When the system under test is a module or PCBA, it needs to be connected to the data acquisition module of the circuit monitoring system through shielded twisted pair cable. As the overall control system becomes smaller and smaller, the connection of cables will bring great challenges to the assembly and production process. At the same time, a large number of cables will also bring cost pressure.

[0009] Therefore, traditional PCBA-based circuit monitoring modules cannot meet the needs of miniaturized and integrated applications. Due to requirements in terms of process, assembly, cost, and other aspects, there is an urgent need to design a new type of circuit monitoring system to meet these needs. Summary of the Invention

[0010] The purpose of this invention is to provide a circuit monitoring system using substrate technology to solve the problems in the prior art.

[0011] To solve the above-mentioned technical problems, the present invention provides a circuit monitoring system using substrate technology, comprising the following components: a sensor, a data acquisition module, a data processing module, and an alarm module;

[0012] The devices are encapsulated and connected using a bare die encapsulation process. The encapsulated chips use traditional plastic encapsulation and bonding packaging processes. Each device is a wire bonded bare core. Insulating adhesive is used to bond the devices to the substrate. The internal resistors and capacitors are connected to the substrate using surface mount technology (SMT).

[0013] The connections between the various devices in the system are made through the substrate wiring, and the external pins of the circuit monitoring system are brought out through the pins of the encapsulated chip.

[0014] The BGA pins of the packaged chip are directly connected to each external pin and configurable pin through the BGA layout to form a standardized package module.

[0015] In one embodiment, the circuit monitoring system is used as a standard BGA device. When designing the overall control system encapsulation substrate, the encapsulated circuit monitoring system is connected to the system under test through differential lines on the substrate.

[0016] The circuit monitoring system using substrate technology provided by this invention has the following advantages:

[0017] (1) The overall size of the circuit monitoring system is greatly reduced. The size of the packaged chip of the circuit monitoring system of the present invention is 14mm×14mm, which is only comparable to the size of a single MCU plastic package, making it easy to use in drones, humanoid robots and other occasions with special requirements for miniaturization.

[0018] (2) It significantly reduces the cost of the overall control system, especially the cost of connectors and cables; taking the present invention for 8-channel current sampling and 8-channel temperature measurement as an example, the circuit monitoring system based on substrate technology can save 16 sets of differential shielded twisted pair cables and 32 industrial connectors.

[0019] (3) The circuit system under test and the circuit monitoring system are connected together through substrate technology, so that the entire control system can be installed as a module, which greatly simplifies the installation process and significantly improves the yield. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the circuit monitoring system.

[0021] Figure 2 This is a schematic diagram of the connection structure between the circuit monitoring system and the system under test.

[0022] Figure 3 This is a schematic diagram of the chip bonding and BGA144.

[0023] Figure 4 This is a schematic diagram of a circuit monitoring system applied to packaged chips. Detailed Implementation

[0024] The circuit monitoring system using substrate technology proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.

[0025] This invention redesigns the circuit monitoring system using the following technical means:

[0026] (1) Figure 1 The system shown is miniaturized based on substrate technology: a bare die encapsulation process is used to... Figure 1 The components are encapsulated and connected, with the encapsulated chips using a traditional plastic encapsulation and bonding packaging scheme. Each component is a WB (wire bonded) bare core, bonded to the substrate with insulating adhesive. Internal resistors and capacitors are connected to the substrate using surface mount technology (SMT). Through a highly integrated design, efficient digital-to-analog signal processing, multi-channel digital-to-analog, and analog-to-digital conversion functions are achieved within a limited space. The connections between the various components within the system are made through substrate wiring, and the external pins of the circuit monitoring system are led out from the pins of the encapsulated chips.

[0027] (2) Modularize and standardize the packaged chip: Select commonly used BGA packages (BGA144, BGA176, etc. can be used depending on the number of signals to be tested), and bring out all external pins and configurable pins directly to the BGA pins of the packaged chip through BGA layout to form a standardized package module. Users can freely configure signal connections according to actual needs and flexibly adapt to the application and functional requirements of different scenarios.

[0028] The circuit monitoring system can be used as a standard BGA device: When designing the overall control system packaged substrate, the packaged circuit monitoring system can be used as a standard BGA component. The traditional shielded twisted pair connection can be simplified to differential distribution lines on the substrate and a large number of connectors can be eliminated. This method can greatly simplify the module installation process.

[0029] A fully functional control system mainly consists of two parts: a circuit monitoring system and a system under test (SUT). Traditional PCBA-based circuit monitoring systems connect to the SUT via connectors and shielded twisted-pair cables. Figure 2 As shown.

[0030] To meet the miniaturization and integration requirements of application scenarios, the system under test (SUT) has achieved size reduction through technologies such as wafer-level encapsulation. This invention employs substrate technology to simultaneously reduce the size of the circuit monitoring system to match practical applications. A bare die encapsulation process is used to encapsulate and connect components such as the MCU, ADC, operational amplifier, LDO, reference source, and capacitors. The encapsulated chip uses a traditional plastic encapsulation + bonding packaging scheme, with each component being a WB-type bare die, bonded to the substrate with insulating adhesive. Internal resistors and capacitors are connected to the substrate using surface mount technology (SMT). To facilitate the use of the circuit monitoring system as a standard component in various scenarios, this invention performs BGA layout on the encapsulated chip and uses a plastic BGA144 package to form a standardized packaged product, such as... Figure 3 As shown.

[0031] After packaging, the circuit monitoring system designed in this invention can be used as a 14mm×14mm BGA144 molded component, which can be widely used in various miniaturized PCBAs and encapsulated designs. For example, when the system under test (SUTP) is encapsulated using a bare die, the circuit monitoring system (in this case, a BGA molded package) can be incorporated into the overall substrate design. The connection between the SUTP and the circuit monitoring system is made on the substrate using differential traces, eliminating the need for numerous connectors and cables. After the design is completed, Figure 2 The traditional control system shown, consisting of two PCBAs, can be simplified to... Figure 4 The substrate-based encapsulated chip shown (it should be noted that the circuit monitoring system at this time is also a substrate-based encapsulated chip) greatly reduces the system size and installation difficulty.

[0032] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A circuit monitoring system employing substrate technology, characterized in that, It includes the following components: sensor, data acquisition module, data processing module, and alarm module; The devices are encapsulated and connected using a bare die encapsulation process. The encapsulated chips use traditional plastic encapsulation and bonding packaging processes. Each device is a wire bonded bare core. Insulating adhesive is used to bond the devices to the substrate. The internal resistors and capacitors are connected to the substrate using surface mount technology (SMT). The connections between the various devices in the system are made through the substrate wiring, and the external pins of the circuit monitoring system are brought out through the pins of the encapsulated chip. The BGA pins of the packaged chip are directly connected to each external pin and configurable pin through the BGA layout to form a standardized package module.

2. The circuit monitoring system using substrate technology as described in claim 1, characterized in that, The circuit monitoring system is used as a standard BGA device. When designing the overall control system encapsulation substrate, the encapsulated circuit monitoring system is connected to the system under test through differential lines on the substrate.

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