Radio frequency remote electronic equipment and circuit board matching method

Abstract

The invention provides a radio frequency remote electronic device and a circuit board matching method, and relates to the technical field of terminals. The invention provides a radio frequency remote electronic device. A first circuit board is provided with an SOC, an identification unit and a storage unit, and the storage unit stores a static parameter of a second circuit board and a first calibration parameter of the first circuit board; an RFIC and an identification circuit are installed on the second circuit board. The first mainboard is in communication connection with the second mainboard. The SOC downloads a second calibration parameter of the second circuit board from the server through the obtained RFIC identifier of the second circuit board; the identification unit obtains the model identifier of the second circuit board by obtaining the output data of the identification circuit. And under the condition that the static parameter is matched with the model identifier, the SOC performs function test on the radio frequency remote electronic equipment based on the first calibration parameter, the second calibration parameter and the static parameter. Therefore, the first circuit board and the second circuit board do not need to be matched one by one, and the production cost of a production line is reduced.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a radio frequency remote electronic device and a circuit board matching method. Background Technology

[0002] Typically, the system-on-chip (SOC) and radio frequency integrated circuit (RFIC) in electronic devices are mounted on the same circuit board (such as the motherboard) to reduce communication losses. In addition, RF units, power supplies, and other components are also mounted on this circuit board. The large number of components on this board results in a relatively thick final electronic device, impacting users' desire for a slim and lightweight experience.

[0003] To address this, the RFIC, power supply, and other components installed on the motherboard can be moved to other circuit boards (such as sub-boards) to reduce the overall thickness of the motherboard, thereby reducing the thickness of the electronic devices.

[0004] In this system, the SOC triggers the operation of devices using parameters stored in the memory cells on the motherboard. However, because some devices are moved to the sub-board for installation, a one-to-one correspondence between the motherboard and sub-board is required to ensure that the SOC on the motherboard can correctly trigger the devices on the sub-board using the stored parameters after the motherboard and sub-board are combined. This increases production and maintenance costs on the production line. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides a method for matching radio frequency remote electronic devices and circuit boards. The technical solution provided by this application allows the first circuit board to download required parameters from a server based on the identifier of the second circuit board. Thus, during assembly, the first and second circuit boards no longer need to be matched one-to-one, reducing production line manufacturing and maintenance costs.

[0006] To achieve the above-mentioned technical objectives, this application provides the following technical solution:

[0007] In a first aspect, a radio frequency remote control (RFR) electronic device is provided, comprising a first circuit board and a second circuit board. The first circuit board has a system-on-a-chip (SOC), an identification unit, and a storage unit mounted on it. The storage unit stores first static parameters for driving the second circuit board and first calibration parameters for the first circuit board. The second circuit board has a radio frequency integrated circuit (RFIC) and an identification circuit mounted on it. The first and second circuit boards are communicatively connected. The SOC is used to obtain the RFIC identifier of the second circuit board via the communication connection and, based on the RFIC identifier, download the second calibration parameters of the second circuit board from a server. The identification unit is used to obtain the output data of the identification circuit via the communication connection and, based on the output data, obtain the model identifier of the second circuit board. If the first static parameters match the model identifier, the SOC is also used to perform functional testing on the RFR electronic device based on the first calibration parameters, the second calibration parameters, and the first static parameters.

[0008] In this way, the second calibration parameters of the second circuit board are uploaded to the server instead of being saved in the storage unit of the first circuit board, thus breaking the strong binding relationship between the first circuit board and the matched second circuit board. Subsequently, after the first circuit board establishes a communication connection with the second circuit board, it only needs to download the second calibration parameters corresponding to the currently connected second circuit board from the server to ensure the normal operation of the devices on both circuit boards. Thus, in the assembly process of the first and second circuit boards, they can be randomly assembled, effectively reducing production line production and maintenance costs.

[0009] According to the first aspect, a first radio frequency unit is mounted on a first circuit board, and a second radio frequency unit is mounted on a second circuit board.

[0010] In this way, by mounting the RFIC and some radio frequency units on the second circuit board, the overall thickness of the first circuit board can be reduced, and the wiring insertion loss can be reduced to improve the transmission and reception performance of the electronic device.

[0011] According to the first aspect, or any implementation of the first aspect above, the first radio frequency unit includes a satellite receiving unit and / or a short-range transceiver unit, and the second radio frequency unit includes a satellite transceiver unit and / or a cellular transceiver unit.

[0012] Thus, by separating the RFIC from the SOC and moving the RFIC and RF unit B to a position closer to the cellular antenna on the second circuit board, not only can the thickness of the first circuit board be reduced, but also the wiring insertion loss and the complexity of the antenna layout on the first circuit board can be reduced.

[0013] According to the first aspect, or any implementation of the first aspect above, the first radio frequency unit is connected to at least one short-range antenna, and the second radio frequency unit is connected to at least one mobile cellular antenna.

[0014] According to the first aspect, or any implementation of the first aspect above, the first radio frequency unit is connected to the satellite diversity receiving antenna, and the second radio frequency unit is connected to the satellite transmitting antenna and the main receiving antenna.

[0015] Thus, by mounting the satellite receiving unit on the first circuit board and the satellite transceiver unit on the second circuit board, the radio frequency front-end of the satellite system can be extended.

[0016] According to the first aspect, or any implementation thereof, a first test socket and a second test socket are mounted on a first circuit board. The first test socket is connected to a first antenna and a satellite receiving unit on the first circuit board, and the second test socket is connected to the satellite receiving unit and an RFIC on the second circuit board. When the first test socket is turned on, the SOC is used to obtain a first gain jointly generated by the satellite receiving unit and the RFIC. When both the first and second test sockets are turned on, the SOC is used to obtain a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is the difference between the first and second gains.

[0017] It should be understood that the first and second test sockets are used to obtain more accurate circuit board calibration parameters during the circuit board manufacturing process.

[0018] In this way, the calibration parameters of the RFIC and the RF front-end module are decoupled through the first test socket and the second test socket, improving the accuracy of obtaining the first calibration parameters and the second calibration parameters, so as to ensure the accuracy of the function implementation after the flexible assembly of the first circuit board and the second circuit board.

[0019] According to the first aspect, or any implementation of the first aspect above, the identification circuit includes multiple resistors; the output data is voltage data or current data, and the storage unit stores the gear corresponding to different output data, and the gear has a mapping relationship with the model identifier of the second circuit board.

[0020] Thus, by configuring an identification circuit in the second circuit board, the model of the currently assembled second circuit board can be determined after the first and second circuit boards are flexibly assembled, thereby enabling the loading of appropriate static parameters to meet the requirements of flexible assembly between circuit boards.

[0021] According to the first aspect, or any implementation of the first aspect above, if the first static parameter matches the model identifier, the SOC is further used to load the first static parameter and the second calibration parameter. Alternatively, if the first static parameter matches the model identifier and the SOC has already loaded the first static parameter, the SOC is further used to load the second calibration parameter.

[0022] According to the first aspect, or any implementation of the first aspect above, the first static parameter includes multiple sets of static parameters. The SOC is also used to retrieve a target static parameter matching the model identifier from the first static parameter and load the target static parameter.

[0023] According to the first aspect, or any implementation of the first aspect above, the first static parameter includes multiple sets of static parameters. The SOC is also used to determine that all multiple sets of static parameters do not match the model identifier, triggering an error report from the remote radio frequency device.

[0024] In this way, the first circuit board can adaptively load the corresponding static parameters according to the model of the connected second circuit board, thus realizing flexible circuit board assembly.

[0025] According to the first aspect, or any implementation of the first aspect above, the model identifier is used to indicate the model of the second circuit board. Multiple second circuit boards with the same model have the same model identifier and correspond to the same target static parameters.

[0026] Secondly, a circuit board matching method is provided, applied to a radio frequency remote control (RFR) electronic device. The RFR electronic device includes a first circuit board and a second circuit board, which are communicatively connected. The first circuit board has a system-on-a-chip (SOC), an identification unit, and a storage unit installed on it. The storage unit stores first static parameters for driving the second circuit board and first calibration parameters for the first circuit board. The second circuit board has a radio frequency integrated circuit (RFIC) and an identification circuit installed on it. The method includes: the SOC acquiring the RFIC identifier of the second circuit board via the communication connection, and downloading second calibration parameters of the second circuit board from a server based on the RFIC identifier. The identification unit acquiring output data from the identification circuit via the communication connection, and acquiring the model identifier of the second circuit board based on the output data. When the first static parameters match the model identifier, the SOC performs functional testing on the RFR electronic device based on the first calibration parameters, the second calibration parameters, and the first static parameters.

[0027] According to the second aspect, a first radio frequency unit is mounted on a first circuit board, and a second radio frequency unit is mounted on a second circuit board.

[0028] According to the second aspect, or any implementation of the second aspect above, the first radio frequency unit includes a satellite receiving unit and / or a short-range transceiver unit, and the second radio frequency unit includes a satellite transceiver unit and / or a cellular transceiver unit.

[0029] According to the second aspect, or any implementation of the second aspect above, the first radio frequency unit is connected to at least one short-range antenna, and the second radio frequency unit is connected to at least one mobile cellular antenna.

[0030] According to the second aspect, or any implementation of the second aspect above, the first radio frequency unit is connected to the satellite diversity receiving antenna, and the second radio frequency unit is connected to the satellite transmitting antenna and the main receiving antenna.

[0031] According to the second aspect, or any implementation thereof, the first circuit board is equipped with a first test socket and a second test socket. The first test socket is connected to a first antenna and a satellite receiving unit on the first circuit board, and the second test socket is connected to the satellite receiving unit and an RFIC on the second circuit board. The method further includes: when the first test socket is turned on, the SOC acquires a first gain jointly generated by the satellite receiving unit and the RFIC. When both the first and second test sockets are turned on, the SOC acquires a second gain generated by the satellite receiving unit, and the third gain generated by the RFIC is the difference between the first and second gains.

[0032] According to the second aspect, or any implementation of the second aspect above, the identification circuit includes multiple resistors; the output data is voltage data or current data, and the storage unit stores the gear corresponding to different output data, and the gear has a mapping relationship with the model identifier of the second circuit board.

[0033] According to the second aspect, or any implementation thereof, when the first static parameter matches the model identifier, the SOC performs functional testing on the radio frequency remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter, including: when the first static parameter matches the model identifier, the SOC loads the first static parameter and the second calibration parameter. Alternatively, when the first static parameter matches the model identifier and the SOC has already loaded the first static parameter, the SOC loads the second calibration parameter.

[0034] According to the second aspect, or any implementation of the second aspect above, the first static parameter includes multiple sets of static parameters; when the first static parameter matches the model identifier, the SOC performs functional testing on the radio frequency remote electronic device based on the first calibration parameter, the second calibration parameter and the first static parameter, including: the SOC obtains the target static parameter that matches the model identifier from the first static parameter and loads the target static parameter.

[0035] According to the second aspect, or any implementation of the second aspect above, the first static parameter includes multiple sets of static parameters; the method also includes: the SOC determines that all multiple sets of static parameters do not match the model identifier, triggering the radio frequency remote electronic device to report an error.

[0036] Thirdly, a computer-readable storage medium is provided. The computer-readable storage medium stores a computer program (also referred to as instructions or code) that, when executed by an electronic device, causes the electronic device to perform the method of the second aspect or any embodiment of the second aspect.

[0037] Fourthly, a computer program product is provided that, when run on an electronic device, causes the electronic device to perform the method of the second aspect or any one of the embodiments of the second aspect.

[0038] The technical effects of the aforementioned aspects can be referenced from each other, and will not be elaborated further here. Attached Figure Description

[0039] Figure 1 Schematic diagram of the circuit board structure provided in the embodiments of this application Figure 1 ;

[0040] Figure 2 A schematic diagram of the communication system used in the circuit board matching method provided in the embodiments of this application;

[0041] Figure 3 Flowchart of the circuit board matching method provided in the embodiments of this application Figure 1 ;

[0042] Figure 4 Schematic diagram of the circuit board structure provided in the embodiments of this application Figure 2 ;

[0043] Figure 5 Schematic diagram of the circuit board structure provided in the embodiments of this application Figure 3 ;

[0044] Figure 6 Schematic diagram of the circuit board structure provided in the embodiments of this application Figure 4 ;

[0045] Figure 7 Schematic diagram of the circuit board structure provided in the embodiments of this application Figure 5 ;

[0046] Figure 8 Schematic diagram of the circuit board structure provided in the embodiments of this application Figure 6 ;

[0047] Figure 9 Flowchart of the circuit board matching method provided in the embodiments of this application Figure 2 ;

[0048] Figure 10 Flowchart of the circuit board matching method provided in the embodiments of this application Figure 3 ;

[0049] Figure 11This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0050] The technical solutions of the embodiments of this application are described below with reference to the accompanying drawings. In the description of the embodiments of this application, the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one or more (including two).

[0051] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. The term "connection" includes direct connections and indirect connections, unless otherwise stated. "First" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0052] In the embodiments of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0053] In some embodiments, an electronic device may include two circuit boards, such as a first circuit board and a second circuit board. The circuit board with the System-on-a-Chip (SOC) mounted on it is described as the motherboard, and the other circuit board is described as the sub-board. The motherboard can control the devices mounted on the motherboard and the sub-board via the SOC. This application embodiment uses the first circuit board as the motherboard and the second circuit board as the sub-board as an example to describe the circuit board matching method provided in this application embodiment. It should be understood that the second circuit board can also be the motherboard, and the first circuit board can also be the sub-board; the relevant implementation methods can be referred to the various embodiments provided in this application embodiment, which will not be repeated here.

[0054] Optionally, the first or second circuit board is a printed circuit board (PCB), which may include an insulating base plate, connecting wires and pads for assembling and soldering electronic components, and has the dual function of conductive lines and insulating base plate.

[0055] Optionally, the first circuit board and the second circuit board are connected via a connector. Optionally, the connector can be, for example, a flexible flat cable.

[0056] In some embodiments, some components on the first circuit board are moved to the second circuit board for mounting, reducing the number of components mounted on the first circuit board and thus reducing the overall thickness of the first circuit board. In this way, both the first and second circuit boards have a smaller thickness, thereby reducing the thickness of the electronic device and meeting users' desire for a slim and lightweight experience.

[0057] As the communication performance of electronic devices improves, and given the limited area of ​​the first circuit board, more and more antennas are being placed on the second circuit board. Moving the radio frequency integrated circuit (RFIC) and RF units originally located on the first circuit board to the second circuit board not only reduces the overall thickness of the first circuit board but also allows the RFIC and RF units to be closer to the antennas, thereby reducing wiring insertion losses and improving the transmission and reception performance of the electronic devices.

[0058] Alternatively, an RFIC refers to a chip that integrates multiple radio frequency functions on a single chip. RFICs typically include functional modules such as RF amplifiers, mixers, oscillators, and filters. The design purpose of RFICs is to reduce space and power consumption, improve performance, and lower overall cost through integration. These chips are widely used in mobile communications, satellite communications, and other radio frequency applications.

[0059] Optionally, the radio frequency unit may include, for example, a front-end module (FEM) for filtering and amplifying radio frequency signals to ensure signal quality and strength. Optionally, the FEM may include, for example, a power amplifier (PA), a filter, a switch, a low-noise amplifier (LNA), a tuner, a duplexer, etc.

[0060] Alternatively, insertion loss refers to the loss of energy or gain when certain devices or branch circuits (such as filters, impedance matching devices, etc.) are added to a circuit.

[0061] For example, such as Figure 1 As shown in Figure (a), the first circuit board houses multiple components including a System-on-a-Chip (SoC), an RFIC, an RF unit, an antenna (such as a short-range antenna or a mobile cellular antenna), a storage unit, a power management unit, and a battery. The second circuit board houses antennas (such as mobile cellular antennas), a power management unit, and a battery. Among these, for example... Figure 1 As shown in (b), Figure 1 As shown in (a), the RFIC on the original first circuit board is moved to the second circuit board, and some RF units on the original first circuit board are also moved to the second circuit board, such as RF units B such as PA or LNA, while only some RF circuits A are retained on the first circuit board. In addition, the entire mobile cellular antenna is moved to the second circuit board. In this way, by separating the RFIC from the SOC and moving the RFIC and RF units B to a position closer to the mobile cellular antenna on the second circuit board, not only can the thickness of the first circuit board be reduced, but also the wiring insertion loss and the complexity of the antenna layout on the first circuit board can be reduced.

[0062] In some embodiments, different devices on a circuit board can be driven to operate by corresponding parameters. Generally, to reduce the difficulty of obtaining the parameters of each device during the production of circuit boards on a production line, a set of static parameters is preset, which can drive the operation of the corresponding device. However, different circuit boards may have certain differences during the production process, so the static parameters may not be able to completely and accurately control different circuit boards. Therefore, during the production of circuit boards on a production line, it is necessary to calibrate the static parameters of the circuit board and obtain the corresponding calibration parameters. These calibration parameters are used to ensure that the devices on the circuit board operate normally based on the calibrated static parameters, thereby ensuring the normal use of various functions of the electronic device. Optionally, the parameters of the circuit board may include, for example, static parameters and calibration parameters. The parameters of the circuit board may also be described as operating parameters, static parameters may also be described as reference parameters, and calibration parameters may also be described as correction parameters, compensation parameters, etc. The embodiments of this application do not limit this.

[0063] For example, the calibration parameters of the first circuit board can be the calibration parameters corresponding to the devices (or described as hardware) installed on the first circuit board, such as the calibration parameters of RF unit A. The calibration parameters of the second circuit board can be the calibration parameters corresponding to the devices installed on the second circuit board, such as the calibration parameters of the RFIC, the calibration parameters of RF unit B, etc.

[0064] In some embodiments, after obtaining the calibration parameters of the first circuit board and the second circuit board, both the calibration parameters of the first circuit board and the calibration parameters of the second circuit board are uploaded to the first circuit board, and the calibration parameters of the first circuit board and the calibration parameters of the second circuit board are saved through the storage unit in the first circuit board.

[0065] Subsequently, during the assembly of the first and second circuit boards, they must be matched one-to-one. Only then can the first circuit board correctly drive the devices on the second circuit board using the stored calibration parameters. If the first and second circuit boards are not properly matched, the first circuit board cannot correctly drive the devices on the second circuit board, resulting in the inability to perform the functions of the electronic device.

[0066] The first and second circuit boards are assembled in a strictly one-to-one matching manner, which increases the production and maintenance costs of the production line.

[0067] To address this issue, this application provides a circuit board matching method. A first circuit board can identify the identifier of a second circuit board by detecting an identification circuit within the second circuit board, and download the required parameters from a server based on this identifier. This eliminates the need for one-to-one matching between the first and second circuit boards during assembly, allowing for the acquisition of correct parameters and reducing production line manufacturing and maintenance costs.

[0068] Figure 2 This is a schematic diagram of a communication system in which the circuit board matching method provided in the embodiments of this application is applied. Figure 2 As shown, the communication system includes an electronic device 100 and a server 200.

[0069] Optionally, the electronic device 100 includes at least two circuit boards, such as a first circuit board and a second circuit board. Optionally, the electronic device 100 can be, for example, a mobile phone, tablet computer, augmented reality (AR) / virtual reality (VR) device, personal computer (PC), ultra-mobile personal computer (UMPC), netbook, personal digital assistant (PDA), wearable device, artificial intelligence (AI) device, or other terminal device. This application does not limit the specific type of the electronic device 100.

[0070] Optionally, server 200 can be a device or server with computing capabilities, such as a cloud server or a network server. Server 200 can be a single server, a server cluster consisting of multiple servers, or a cloud computing service center.

[0071] In some embodiments, the circuit board matching method provided in this application can be applied to the process of assembling a first circuit board and a second circuit board on a production line.

[0072] In some embodiments, during the production of circuit boards on a production line, each circuit board can be configured with a corresponding identifier to distinguish different circuit boards. For example, a first circuit board is configured with a first identifier to indicate that it is the first circuit board, and a second circuit board is configured with a second identifier to indicate that it is the second circuit board.

[0073] Optionally, an RFIC is mounted on the second circuit board, and the RFIC is configured with an identification (ID) that can be used to distinguish different RFICs. Therefore, after the RFIC is mounted on the second circuit board, different second circuit boards can be distinguished by the RFIC ID. For example, the second identifier of the second circuit board is the RFIC ID of the second circuit board.

[0074] In some embodiments, during the production of circuit boards on a production line, calibration parameters of the circuit boards can be obtained, which are used to ensure the normal operation of the devices on the circuit boards.

[0075] Optionally, the first circuit board and the second circuit board are manufactured separately, and the first calibration parameters of the first circuit board and the second calibration parameters of the second circuit board can be obtained respectively.

[0076] Optionally, after obtaining the first calibration parameters, the first circuit board can save the first calibration parameters through a storage unit installed on the first circuit board.

[0077] Optionally, after obtaining the second calibration parameters, the second circuit board can upload the second calibration parameters and its own second identifier to the server. Correspondingly, the server can save the second calibration parameters and the second identifier, as well as the correspondence between them.

[0078] In this way, the second calibration parameters of the second circuit board are uploaded to the cloud server instead of being saved to the storage unit of the first circuit board, thus breaking the strong binding relationship between the first circuit board and the matched second circuit board. Subsequently, after the first circuit board is assembled with the second circuit board, it only needs to download the second calibration parameters corresponding to the currently assembled second circuit board from the cloud server to ensure the normal operation of the devices on both circuit boards. Thus, during the assembly process, the first and second circuit boards can be randomly assembled, effectively reducing production line production and maintenance costs.

[0079] The following is passed Figure 3 The flowchart shown details the process of obtaining the second calibration parameter and uploading it to the server. Figure 3 As shown, the process includes the following steps.

[0080] S301, Power-on initialization.

[0081] In some embodiments, during the manufacturing process of the second circuit board, the second circuit board is assembled with a tool first circuit board to obtain the second calibration parameters of the second circuit board. Optionally, the tool first circuit board is a tool board for testing the second circuit board. The tool first circuit board can be loaded with static parameters applicable to various models of the second circuit board. After the static parameters are loaded, the devices on the second circuit board can be driven to operate, thereby obtaining the second calibration parameters of the second circuit board.

[0082] Optionally, to acquire the subsequent second calibration parameters, the tool's first circuit board and second circuit board need to be assembled and powered on for initialization. Optionally, during power-on initialization, the tool's first circuit board can load test software used to test the second circuit board.

[0083] S302. Determine whether the first circuit board of the tool matches the second circuit board. If the first circuit board of the tool matches the second circuit board, proceed to step S303; if the first circuit board of the tool does not match the second circuit board, end the current process.

[0084] In some embodiments, as shown above, static parameters can be configured in the circuit board, and calibration parameters can be obtained by correcting these static parameters. For example, Figure 1 As shown in (b), a first circuit board of the tool is equipped with a System-on-a-Chip (SOC) and a memory unit, while a second circuit board is equipped with an RFIC, thus enabling the RFIC to be located remotely relative to the SOC. Optionally, the memory unit of the first circuit board stores static parameters used to drive the devices on the second circuit board. Optionally, the first circuit board of the tool executes the various steps in this process via the SOC.

[0085] Optionally, the first tool circuit board can be used to test multiple models (or described as types, categories, etc.) of the second circuit board. Correspondingly, the first tool circuit board can also be configured with multiple sets of static parameters corresponding to each model. However, the first tool circuit board generally cannot support all models of the second circuit board. Therefore, if the first tool circuit board determines that it cannot support the model of the currently connected second circuit board, it can be determined that the first tool circuit board and the second circuit board are incompatible, and the production line personnel can be prompted to replace the second circuit board.

[0086] Optionally, the first circuit board of the tool can obtain the matching result through the model identifier of the second circuit board. Optionally, the production line can produce multiple different models of second circuit boards, each with a different model identifier, while different circuit boards of the same model have the same model identifier. The first circuit board of the tool can distinguish the model of the second circuit board and determine whether it is supported based on this model identifier. Optionally, the first circuit board obtains the model identifier of the second circuit board through an identification circuit on the second circuit board. Details regarding the identification circuit can be found in the relevant content below and will not be repeated here.

[0087] Optionally, different sets of static parameters corresponding to different models of the second circuit board can be distinguished by a virtual radio frequency product ID (RF product ID).

[0088] For example, the first circuit board of the tool supports four models of second circuit boards: model identifier 11, model identifier 12, model identifier 13, and model identifier 14. Furthermore, the first circuit board of the tool has pre-set static parameters corresponding to these four models of second circuit boards in its storage unit, such as virtual RF product IDs of 0x3A2C0000, 0x3A2C0400, 0x3A2C0800, and 0x3A2C0C00, respectively. It should be understood that different sets of static parameters for different models of second circuit boards can also be distinguished directly by the model identifier. For example, the first circuit board of the tool has pre-set static parameter A (indicated by model identifier 11), static parameter B (indicated by model identifier 12), static parameter C (indicated by model identifier 13), and static parameter D (indicated by model identifier 14) in its storage unit.

[0089] If the first circuit board of the tool reads the model identifier of the second circuit board as 11, it can be determined that the first circuit board of the tool is compatible with the currently connected second circuit board, and subsequent test steps can be performed. Alternatively, if the first circuit board of the tool reads the model identifier of the second circuit board as 21, it can be determined that the first circuit board of the tool is incompatible with the currently connected second circuit board, and the test process can be terminated.

[0090] S303. Are the static parameters currently loaded on the first circuit board of the tool appropriate? If the static parameters currently loaded on the first circuit board of the tool are appropriate, proceed to step S305; if the static parameters currently loaded on the first circuit board of the tool are inappropriate, proceed to step S304.

[0091] S304, Replace the first circuit board with appropriate static parameters.

[0092] S305. Test the second circuit board and obtain the second calibration parameters of the second circuit board.

[0093] In some embodiments, the tool's first circuit board determines that it matches the currently connected second circuit board. Then, the tool's first circuit board can load static parameters that match the model identifier of the current second circuit board to drive the second circuit board to operate. During operation, various functions of the second circuit board are tested to calibrate the currently loaded static parameters and obtain second calibration parameters.

[0094] For example, as in the example scenario of step S302 above, the tool's first circuit board reads the model identifier of the second circuit board as 11, determining that the tool's first circuit board matches the currently connected second circuit board. Then, the tool's first circuit board can obtain the virtual RF product ID corresponding to model identifier 11 as 0x3A2C0000, and then load the static parameters corresponding to the virtual RF product ID 0x3A2C0000, and perform a testing process to calibrate the static parameters in order to obtain the second calibration parameters.

[0095] In another embodiment, before connecting the tool's first circuit board to the current second circuit board, it may be connected to other second circuit boards of different models to obtain the second calibration parameters of those other second circuit boards, and in this process, load static parameters that match those other second circuit boards. Then, after connecting the tool's first circuit board to the new second circuit board and confirming its compatibility, it can determine whether the currently loaded static parameters are applicable to the new second circuit board. If applicable, subsequent testing procedures can be performed. If not applicable, suitable static parameters can be reloaded.

[0096] For example, the first circuit board of the tool loads the static parameters corresponding to the virtual RF product ID 0x3A2C0400 based on the second circuit board with model identifier 12, and completes the static parameter calibration of the second circuit board with model identifier 12. Subsequently, the first circuit board of the tool connects to a new second circuit board, and obtains that the model identifier of the new second circuit board is 11. Then, the first circuit board can determine that the first circuit board is compatible with the currently connected second circuit board, but the currently loaded static parameters are not applicable to the new second circuit board. Therefore, the first circuit board can reload the static parameters corresponding to the virtual RF product ID 0x3A2C0000 according to model identifier 11 to obtain the second calibration parameters of the second circuit board with model identifier 11.

[0097] In this way, the first circuit board of the tool can adaptively load the corresponding static parameters according to the model of the connected second circuit board, realize the flexible execution of the second calibration parameter acquisition process of the second circuit board, and obtain more accurate second calibration parameters.

[0098] S306, The second circuit board uploads the second calibration parameters to the server.

[0099] In some embodiments, after obtaining the second calibration parameters, the second circuit board can send the second calibration parameters to the server. As mentioned above, different second circuit boards are distinguished by the identifier of the RFIC installed on them. Therefore, the RFIC ID and the second calibration parameters can be uploaded to the server together to establish a mapping relationship between the RFIC ID and the second calibration parameters. Here, the RFIC ID is the second identifier.

[0100] Optionally, the first circuit board of the tool can read the RFIC ID of the second circuit board. Then, the first circuit board of the tool can also upload the RFIC ID and the second calibration parameters to the server.

[0101] In some embodiments, the tool's first circuit board may acquire the RFIC ID of the second circuit board during the acquisition of the second calibration parameters, in which case the second calibration parameters include the RFIC ID, and then upload the second calibration parameters to the server. Alternatively, the tool's first circuit board may acquire the RFIC ID of the second circuit board separately, and then upload both the second calibration parameters and the RFIC ID to the server.

[0102] In some examples, the tool board can obtain the RFIC ID of the second board via AT commands. Optionally, the SOC of the first tool board is configured with an AT service module, which can send AT commands to the RFIC of the second board to obtain the RFIC ID. For example, the AT command is “AT^RFICDIEID?”.

[0103] In some examples, the RFIC on the second circuit board is configured with electronic fuse (eFuse) information. This eFuse information is of a preset bit length (e.g., 64 bits) and can be used to identify the RFIC. Therefore, this eFuse information can serve as the RFIC ID of the second circuit board. eFuse is a programmable fuse technology commonly used in integrated circuit (IC) design, primarily for storing information and protecting the chip. By embedding specific conductive paths during chip manufacturing, an eFuse can be "fused" or "programmed" by a current pulse, thereby changing its resistance state. The programmed eFuse permanently records this state change. Optionally, the eFuse information is written once and cannot be changed afterward; it can only be read.

[0104] For example, in response to a received AT command, the RFIC in the second circuit board can obtain eFuse information (such as the RFIC ID) to feed back the RFIC ID to the RFIC in the first circuit board. Optionally, the feedback statement format of the AT command is, for example, ^RFICDIEID:diesn_in_rfic,CrcFlag,CrcResult. Here, diens_in_rfic represents the RFIC ID. CrcFlag indicates whether the RFIC has a cyclic redundancy check (CRC) parameter, which is a checksum for detecting data transmission or storage errors, and can be used to check data integrity. CrcResult represents the CRC check result. If CrcFlag is empty (e.g., 0), it indicates that CRC checking is not required, and CrcResult can return OK; if CrcFlag is 1, it indicates that CRC checking is required, and CrcResult can feed back the CRC check result, such as 0 indicating CRC check failure and 1 indicating CRC check success. For example, in response to an AT command, the RFIC sends "^RFICDIEID:BA4B2AD346246800,1,1" to the SOC on the second circuit board. Here, the RFIC ID is BA4B2AD346246800, the CRC check is successful, and the RFIC ID data is complete.

[0105] Optionally, the electronic device may include multiple RFICs, with at least one RFIC mounted on the second circuit board. In this case, the feedback statement of the aforementioned AT command may also include a field indicating which RFIC it is. For example, assuming the second circuit board includes two RFICs, the AT command feedback statement could include two statements: ^RFICDIEID:rfic num,rfic index0,diesn_in_rfic0,CrcFlag,CrcResult; and ^RFICDIEID:rfic num,rficindex1,diesn_in_rfic1,CrcFlag,CrcResult. Here, rfic num indicates the number of RFICs currently present, and rficindex indicates the RFIC number.

[0106] Optionally, each RFIC has a different RFIC ID. In the case that the second circuit board includes multiple RFICs, the tool first circuit board can arbitrarily select one of them or select the RFIC ID with index 0 (or a preset index) as the RFIC ID of the current second circuit board.

[0107] Thus, in the subsequent assembly process of the first and second circuit boards, the first circuit board can read the RFIC ID of the second circuit board to obtain the second calibration parameter that uniquely matches the second circuit board from the server, thereby decoupling the unique matching relationship between the first and second circuit boards in the assembly process of the first and second circuit boards, and thus achieving flexible matching of the first and second circuit boards.

[0108] It should be understood that second circuit boards of the same model have the same pre-configured static parameters. Therefore, these static parameters are not unique. Thus, pre-setting the static parameters in the first circuit board will not affect the flexibility of assembly between the first and second circuit boards. Furthermore, only uploading or downloading the second calibration parameters can reduce data transmission volume and improve data transmission efficiency.

[0109] The following section details how the first circuit board identifies the identity of the currently assembled second circuit board in order to obtain the correct second calibration parameters from the cloud server.

[0110] In some embodiments, the second circuit board is equipped with an identification circuit. Optionally, this identification circuit is used to identify the model of the second circuit board. For example, the model of the second circuit board is identified by the output data level of the identification circuit. In some examples, during the production of the second circuit board, production line personnel can know the model of the current second circuit board. Then, the production line personnel can identify the model of the current second circuit board by adjusting the output data of the identification circuit on the current second circuit board. The specific structure and adjustment of the identification circuit are detailed below and will not be repeated here.

[0111] Optionally, the correspondence between the output data of the identification circuit, the gear position, and the model identifier can be pre-configured.

[0112] Optionally, after the first circuit board and the second circuit board are assembled, the first circuit board can obtain the detection data from the identification circuit. Then, through this detection data, the first circuit board can obtain the model identifier of the currently connected second circuit board.

[0113] Optionally, different test data correspond to different model identifiers. Alternatively, test data within different preset ranges correspond to different model identifiers. Optionally, the first circuit board stores the correspondence between test data and model identifiers.

[0114] For example, such as Figure 4 As shown, the second circuit board is equipped with an identification circuit. After the first circuit board is assembled with the second circuit board, it can obtain the detection data of the identification circuit through the connection relationship between the first circuit board and the identification circuit, thereby obtaining the model identification of the second circuit board.

[0115] Optionally, after obtaining the model identifier, the first circuit board can load the corresponding static parameters.

[0116] Optionally, after the first and second circuit boards are assembled, the first circuit board can read the RFIC ID, i.e., the second identifier, of the currently connected second circuit board. Then, the first circuit board can send a calibration parameter retrieval request to the server, carrying the second identifier in the request. Correspondingly, the server can receive the calibration parameter retrieval request sent by the first circuit board and, based on the second identifier carried therein, retrieve the second calibration parameter corresponding to the second identifier from a stored pool of calibration parameters. The server can then issue the second calibration parameter to the first circuit board. Optionally, after obtaining the second calibration parameter, the first circuit board can save it in a storage unit, which also stores the first calibration parameter corresponding to the first circuit board. Optionally, after the first and second circuit boards are assembled, the first circuit board can send the aforementioned AT command to the second circuit board to obtain the RFIC ID.

[0117] Therefore, during subsequent testing or use, after the first circuit board receives the control command sent by the control unit, it can trigger the corresponding devices on the first or second circuit board to execute the control command through the first or second calibration parameters stored in the storage unit and the loaded static parameters, so as to realize the corresponding function of the electronic device. For example, it can trigger the RFIC and radio frequency unit B to execute the corresponding transceiver function.

[0118] That is, during the identification process of the second circuit board, the first circuit board can obtain the identification of the second circuit board through the identification circuit and RFIC on the second circuit board, such as the model number and the second identification.

[0119] Optionally, the control unit can also be used to control the power-on and power-off of the first or second circuit board, generate and write the first and second calibration parameters, and upload the second calibration parameters to the cloud server.

[0120] Thus, through a simple identification circuit and RFIC ID, the first circuit board can identify the second circuit board and download the second calibration parameters adapted to the second circuit board from the server, effectively simplifying the assembly process of the first and second circuit boards.

[0121] It should be understood that Figure 4 The components on the first and second circuit boards shown are merely illustrative; the first and second circuit boards may also include more or fewer components. As described above, through... Figure 4The circuit board structure shown mounts the RFIC and some RF units on a second circuit board, reducing the overall thickness of the first circuit board and minimizing wiring insertion loss, thus improving the transmission and reception performance of the electronic device. Therefore, it can be understood that more or fewer RF units can be placed on the second circuit board, without being limited to the division into RF unit A and RF unit B. Furthermore, mounting the RFIC on the second circuit board allows for a more distant placement of the RFIC relative to the SOC.

[0122] For example, based on the above Figure 4 The structures of the first and second circuit boards shown are, through Figure 5 This section introduces the additional devices that can be installed on the first and second circuit boards.

[0123] The components mounted on the first circuit board will be introduced below.

[0124] like Figure 5 As shown, the devices mounted on the first circuit board may include, for example: a SOC, a baseband processing unit, a storage unit, a power supply unit 1 corresponding to the power management unit and the battery, a satellite receiving unit corresponding to the radio frequency unit A, a short-range chip module, and a wireless fidelity (Wi-Fi) / Bluetooth (BT) / Global Positioning System (GPS) transceiver module, an antenna, a clock unit, an identification unit, a first circuit board ID unit, a universal serial bus (USB) unit, etc.

[0125] The System-on-Chip (SOC) is used to implement the processing functions of the electronic device, such as triggering devices on the first and second circuit boards to execute corresponding commands based on the first and second calibration parameters. The SOC may include a baseband processing unit, and the wireless communication function of the electronic device can be implemented through antennas, baseband processors, etc.

[0126] The storage unit is used to store the first calibration parameters, static parameters corresponding to different supported second circuit board models, etc. Optionally, after the first circuit board obtains the second calibration parameters from the cloud server, the storage unit can also be used to store the second calibration parameters. Optionally, the storage unit can also be used to store the correspondence between the first and second calibration parameters, the correspondence between the first circuit board ID unit, the second circuit board ID unit, and the baseband processing unit ID, etc. Optionally, the storage unit may include, for example, double data rate (DDR) or universal flash storage (UFS).

[0127] Power supply unit 1 is used to supply power to other devices. For example, power supply unit 1 can supply power to devices such as SOC, clock unit, short-pitch chip module, and memory unit.

[0128] The satellite receiving unit may be, for example, a satellite receiving radio frequency unit. Optionally, the satellite receiving unit may include devices such as an LNA, a switch, and a filter.

[0129] Short-range chip modules are used to convert radio frequency signals into analog and digital signals. Optionally, short-range chip modules may include, for example, short-range RFICs and baseband components.

[0130] A WiFi / BT / GPS transceiver module is a radio frequency front-end module for WiFi, BT, and GPS. Optionally, the WiFi / BT / GPS transceiver module may include, for example, a filter, a power amplifier (PA), an low-noise amplifier (LNA), and an RF switch.

[0131] An antenna is used to enable the transmission and reception functions of the first circuit board. Optionally, multiple antennas are mounted on the first circuit board. For example, a satellite receiving unit is connected to a satellite diversity receiving antenna; a WiFi / BT / GPS transceiver module is connected to a WiFi / BT / GPS transceiver antenna.

[0132] Optionally, one or more test sockets may be included between the transceiver unit and the antenna, or between the transceiver unit and other devices, to simulate various test environments and obtain calibration parameters. For example, a satellite diversity reception test socket A may be included between the satellite receiving unit and the antenna; a satellite diversity reception test socket B may be included between the satellite receiving unit and the RFIC on the second circuit board; and a WiFi transceiver test socket 1 and a WiFi / BT transceiver test socket 2 may be included between the WiFi / BT / GPS transceiver module and the antenna.

[0133] The clock unit is used to provide a reference clock for the system.

[0134] The identification unit is used to identify information from the first circuit board ID unit and the second circuit board ID unit (located on the second circuit board), and send this information to the SOC so that the SOC can determine the identity of the first and second circuit boards. For example, the identification unit can identify a first identifier of the first circuit board ID unit, which points to the first circuit board. Or, for example, the identification unit can identify the model identifier of the second circuit board ID unit.

[0135] The first circuit board ID unit is used to identify the hardware ID information of the first circuit board.

[0136] The USB unit is used to enable communication between the control unit and the first circuit board, and to perform functions such as calibration and power-on / off control.

[0137] The components mounted on the second circuit board are described below.

[0138] like Figure 5 As shown, the devices mounted on the second circuit board may include, for example, an RFIC, a satellite transceiver unit corresponding to RF unit B, a cellular transceiver unit 1, a cellular transceiver unit 2, a cellular transceiver unit 3, a cellular transceiver unit 4, an antenna, a second circuit board ID unit, and a power supply unit 2 corresponding to a power management unit and a battery, etc.

[0139] An RFIC (Radio Frequency Identifier) ​​is used for signal processing in satellite receiving units, cellular transceiver units, etc. Optionally, during downlink communication signal transmission, the RFIC can convert radio frequency signals into analog signals and then into digital signals. During uplink communication signal processing, the RFIC can convert digital signals into analog signals and then back into radio frequency signals.

[0140] A satellite transceiver unit is used to receive and transmit satellite signals. Optionally, the satellite transceiver unit may include, for example, a switch, a power amplifier (PA), an low-noise amplifier (LNA), a filter, etc.

[0141] Cellular transceiver unit 1, such as a cellular first receiving radio frequency unit and a first transmitting radio frequency unit, may include devices such as PA, LNA, radio frequency switch, filter, and coupler.

[0142] Cellular receiver unit 2, for example, a second cellular receiver radio frequency unit, may include devices such as an LNA, radio frequency switch, and filter.

[0143] Cellular transceiver unit 3, such as a cellular third receiving radio frequency unit and a second transmitting radio frequency unit, may include devices such as PA, LNA, radio frequency switch, filter, and coupler.

[0144] Cellular receiver unit 4, for example, a fourth cellular receiver radio frequency unit, may include devices such as an LNA, radio frequency switch, and filter.

[0145] The antenna is used to realize the transmission and reception functions of the second circuit board. Optionally, multiple antennas are mounted on the second circuit board. For example, the satellite transceiver unit is connected to a satellite transmitting antenna and a main receiving antenna; cellular transceiver unit 1 is connected to cellular receiving and transmitting antenna 1; cellular transceiver unit 2 is connected to cellular receiving antenna 1; cellular transceiver unit 3 is connected to cellular receiving and transmitting antenna 2; and cellular transceiver unit 4 is connected to cellular receiving antenna 2.

[0146] Optionally, one or more test sockets may be included between the transceiver unit and the antenna, or between the transceiver unit and other devices. For example, a satellite transceiver unit may include a satellite transmitting antenna and a main receiving antenna test socket between itself and the satellite transmitting antenna and the main receiving antenna. Another example is a cellular transceiver unit 1, which includes a cellular receiving and transmitting test socket 1 between itself and the cellular receiving and transmitting antenna 1, enabling testing of transmission (TX) and reception (RX) in the low-band (LB), mid-high-band (MHB), ultra-high-band (UHB), and future communication network bands. Yet another example is a cellular transceiver unit 2, which includes a cellular receiving test socket 1 between itself and the cellular receiving antenna 1, enabling testing of cellular LB, MHB, or UHB, and RX1 in future communication network bands. And yet another example is a cellular transceiver unit 3, which includes a cellular receiving and transmitting test socket 2 between itself and the cellular receiving and transmitting antenna 2, enabling testing of cellular LB, MHB, or UHB, and TX1 and RX2 in future communication network bands. For example, the cellular transceiver unit 4 and the cellular receiving antenna 2 include a cellular receiving test base 2, which can realize the testing of cellular LB, MHB or UHB, and RX3 of future communication network frequency bands.

[0147] The second circuit board ID unit is used to identify the hardware type of the second circuit board. Optionally, the second circuit board ID unit is, for example, as shown below. Figure 4 The identification circuit shown.

[0148] Power supply unit 2 is used to supply power to the various devices mounted on the second circuit board.

[0149] Based on the above description of the components on the first and second circuit boards, it can be seen that the mounting methods of these components enable a remote connection between the satellite system RF front-end and the cellular system RF front-end in the electronic device. For example, by mounting the satellite receiver unit on the first circuit board and the satellite transceiver unit on the second circuit board, the satellite system RF front-end can be remotely connected. Similarly, by mounting the SOC, baseband processing unit (MODEM), and clock unit on the first circuit board, and mounting the RFIC, cellular transceiver unit 1, cellular transceiver unit 2, cellular transceiver unit 3, and cellular transceiver unit 4 on the second circuit board, the cellular system RF front-end can be remotely connected relative to the SOC / MODEM.

[0150] In some embodiments, based on the above... Figure 5The first and second circuit boards are described below. The first calibration parameters of the first circuit board may include, for example, the calibration parameters of devices such as clock units and satellite receiving units. The second calibration parameters may include, for example, the calibration parameters of devices such as RFIC, cellular transceiver unit 1, cellular transceiver unit 2, cellular transceiver unit 3, and cellular transceiver unit 4.

[0151] Optionally, after obtaining the first calibration parameter, the first circuit board directly saves the first calibration parameter in the storage unit.

[0152] Optionally, after obtaining the second calibration parameters, the control unit can control the second circuit board to upload the second calibration parameters to the server. Optionally, during the uploading process, a cyclic redundancy check (CRC) parameter can also be generated. This CRC is a checksum used to detect errors in data transmission or storage, and can be used, for example, to check data integrity. Subsequently, after the control unit controls the first circuit board to download the second calibration parameters from the server, it can check the integrity of the downloaded second calibration parameters using the CRC, thereby ensuring that the correct second calibration parameters are obtained.

[0153] In some embodiments, different RFICs have different chip IDs. Therefore, different second calibration parameters can correspond to the chip IDs of the RFICs mounted on the current second circuit board. That is, different RFIC IDs (second identifiers) correspond to different second calibration parameters.

[0154] In some examples, after the first and second circuit boards are assembled, the second calibration parameters for the second circuit board can be downloaded from the server. Furthermore, the first circuit board can also read the chip ID of the RFIC mounted on the second circuit board. The first circuit board can store the second calibration parameters and the RFIC chip ID in a storage unit. Subsequently, during the use of the electronic device, the first circuit board determines whether the second circuit board needs to be replaced by comparing the read chip ID of the RFIC on the second circuit board with the stored chip ID of the RFIC in the storage unit, thereby determining whether the second calibration parameters need to be re-downloaded.

[0155] For example, in a maintenance scenario, the maintenance testing application can trigger the SOC of the first circuit board to read the chip ID of the RFIC on the second circuit board, thereby triggering a comparison of the RFIC chip ID and determining whether to re-download the second calibration parameters. This allows for more flexible replacement and maintenance of the second circuit board in maintenance scenarios.

[0156] For example, in response to the power-on of the electronic device, the SOC of the first circuit board reads the chip ID of the RFIC on the second circuit board, thereby triggering a comparison of the RFIC chip ID and determining whether to re-download the second calibration parameters. In this way, potential problems with the second circuit board can be detected promptly during the use of the electronic device.

[0157] The preceding text introduced the various components on the first and second circuit boards, as well as their functions. The following text details the identification circuit on the second circuit board and the process of obtaining the corresponding static parameters of the second circuit board based on this circuit.

[0158] It should be understood that, for the sake of simplicity, the following text will still use the same format as above. Figure 4 The circuit board structure shown illustrates the implementation methods of each embodiment. The implementation methods described in the embodiments below can also be applied to... Figure 5 The circuit board structure shown, or the first and second circuit boards including more or fewer components.

[0159] In some embodiments, the identification circuit includes a resistor, or multiple resistors connected in parallel and / or in series. Optionally, after the first circuit board and the second circuit board are assembled and powered on, the first circuit board can obtain the detection data of the identification circuit through the SOC, thereby obtaining the model identifier of the second circuit board based on the detection data.

[0160] In some examples, the detection data may be, for example, the voltage data of the identification circuit, or it may be the current data of the identification circuit. Optionally, the detection data may also be a digital signal output after performing an analog-to-digital converter (ADC) on the actual detection data. The ADC converts the analog signal into a digital signal for processing in a digital device. For example, the detection data may be the voltage analog-to-digital converter signal (V) corresponding to the voltage data. ADC ).

[0161] The following text uses the detection data as V ADC Taking this as an example, the process of obtaining the model identification of the second circuit board will be described in detail.

[0162] In some embodiments, the maximum achievable V is obtained based on the number of resistors included in the identification circuit, the resistance value of each resistor, the connection method, etc. ADC After that, for the range from 0 to the maximum V... ADC The range is divided into multiple intervals of a preset number, each interval corresponding to a gear, which can be used as the model identifier for the second circuit board. For example, during the production of the second circuit board, based on the actual V of the identification circuit in the second circuit board... ADCMatch the corresponding gear and use that gear as the model identifier for the second circuit board.

[0163] Optionally, the identification circuit of the second circuit board may also include a resistor with an adjustable resistance value. Then, after obtaining the model number of the second circuit board, the appropriate range can be obtained by adjusting the resistance value. For example, second circuit boards of the same model or type can correspond to the same range. Optionally, different ranges corresponding to different models can be pre-configured. This way, after obtaining the actual model number, the range of the current second circuit board can be set by adjusting the resistance value in the identification circuit of the second circuit board, and this range matches the actually obtained model number. It should be understood that similar models, for example, include multiple second circuit boards in the same series, and the definitions of different models can be adjusted according to actual production conditions.

[0164] In some examples, the storage units of the first circuit board contain information about each range and its corresponding gear. This allows the SOC on the first circuit board to detect the V during subsequent testing after the first and second circuit boards are assembled. ADC Match the corresponding gear to obtain the model identifier of the currently connected second circuit board.

[0165] In some examples, the production process of the first circuit board, the production process of the second circuit board, and the assembly process of the first and second circuit boards can be three separate processes or any combination of processes; this application embodiment does not impose any limitations on this. Optionally, in the production process of the first circuit board, production line personnel configure different V... ADC The correspondence between the circuit board and the gear position is used to subsequently determine the model identifier of the second circuit board. Optionally, during the production process of the second circuit board, production line personnel determine the gear position of the second circuit board based on its model number, and adjust the resistance value of the resistor in the identification circuit to make the V output of the identification circuit... ADC This is matched to the gear position. The second circuit board uses this gear position as an identifier for its own model. Optionally, during the assembly process of the first and second circuit boards, the first circuit board receives the V signal output by the identification circuit in the second circuit board. ADC Then, according to different preset V values ADC The system identifies the current gear position (model identifier) ​​of the second circuit board by establishing a correspondence with the gear positions. The first circuit board then uses this model identifier to determine if it matches the currently connected second circuit board. If they match, the first circuit board loads the static parameters corresponding to the model identifier. Subsequently, after downloading the second calibration parameters, functional tests of both the first and second circuit boards can be performed based on the loaded static and calibration parameters.

[0166] The following section provides a detailed explanation of the model identification process for the second circuit board, using two scenarios: identifying circuits containing two resistors in parallel or three resistors in parallel.

[0167] For example, such as Figure 6 As shown, the identification circuit includes two resistors, both of which are adjustable in value, used to change V. ADC The detection data. For example, change the voltage data Vx and Vy corresponding to the two resistors respectively. Optionally, divide the voltage data from 0 to the maximum possible voltage into 10 levels from 0 to 9. Then, by changing the resistance values ​​of resistor 1 and resistor 2, a total of 100 levels from 00 to 99 can be obtained.

[0168] Optionally, different gears corresponding to different models of the second circuit board can be pre-configured.

[0169] Optionally, during the production of the second circuit board, the required gear level can be determined based on the model number of the obtained second circuit board. Then, the V output of the identification circuit can be adjusted by changing the resistance value of at least one of resistors R1 and R2. ADC Meets the gear requirements. Then, based on the preset V... ADC The correspondence between the voltage level and the gear position is determined by adjusting the resistance value of at least one of resistors R1 and R2, so that the actual V output of the identification circuit is obtained. ADC Matching the settings of the second circuit board. It should be understood that in some scenarios, it is not necessary to adjust the resistance values ​​of resistors R1 and R2 to achieve a suitable V output from the identification circuit. ADC Therefore, production line personnel do not need to adjust the resistance values ​​of resistors R1 and R2.

[0170] Among them, such as Figure 6 As shown, this example illustrates the configuration process of the model identifier on the second circuit board, using RF unit B, which includes a PA, as an example. As mentioned above, RF unit B can also include other components. Therefore, currently... Figure 6 The image shows a scenario where an RF transmitter unit is moved further away, thus achieving the extension or separation of the transmission path.

[0171] Optionally, in the assembly process, after the first circuit board and the second circuit board are assembled and powered on, the SOC of the first circuit board can be detected by the identification unit through the V output of the identification circuit of the second circuit board. ADC Therefore, the first circuit board can be based on this V. ADCThe first circuit board obtains the model identifier of the currently assembled second circuit board and loads the corresponding static parameters based on this model identifier. Furthermore, the first circuit board can read the second identifier (such as the RFIC ID) of the second circuit board and obtain the second calibration parameters of the second circuit board from the server based on this second identifier. Afterwards, the first circuit board can perform testing and use of both the first and second circuit boards according to its own first calibration parameters and the obtained static and second calibration parameters.

[0172] Optionally, the SOC of the first circuit board triggers the detection unit to detect the V output of the identification circuit of the second circuit board. ADC In two V ADC If all voltage values ​​are less than the preset minimum voltage value (e.g., 100 millivolts), the first circuit board can determine that the second circuit board is not currently connected, or that the second circuit board does not have an identification circuit, meaning the second circuit board does not have an adaptive matching function with the first circuit board. Therefore, the first circuit board can proceed with subsequent testing as if the second circuit board were not present. For example, the baseband processing unit (modem) in the SOC can achieve self-starting without the RF backplate (i.e., the second circuit board), thus ensuring that in the test scenario, there are no issues such as abnormal standby current caused by modem malfunction, or the first circuit board failing to start.

[0173] For example, such as Figure 7 As shown, the identification circuit includes three resistors, which are adjustable in value, used to change V. ADC The detection data. For example, change the voltage data Vx, Vy, and Vz corresponding to the three resistors respectively. Optionally, divide the voltage data from 0 to the maximum possible voltage into 10 levels from 0 to 9. Then, by changing the resistance values ​​of resistor 1, resistor 2, and resistor 3, 1000 levels from 000 to 999 can be obtained.

[0174] Optionally, different gears corresponding to different models of the second circuit board can be pre-configured.

[0175] Optionally, during the production of the second circuit board, the required gear level can be determined based on the model number of the obtained second circuit board. Then, the V output of the identification circuit can be achieved by adjusting the resistance value of at least one of resistors 1, 2, and 3. ADC Meets the gear requirements. Then, based on the preset V... ADC The correspondence between the gear and the speed setting is determined by adjusting the resistance value of at least one of resistors 1, 2, and 3, so that the actual V output by the identification circuit can be determined. ADC Matching the settings of the second circuit board. It should be understood that in some scenarios, it is not necessary to adjust the resistance values ​​of resistors 1, 2, and 3 to achieve a suitable V output from the identification circuit. ADCTherefore, production line personnel do not need to adjust the resistance values ​​of resistors 1, 2, and 3.

[0176] Among them, such as Figure 7 As shown, this example uses RF unit B, which includes an LNA, to illustrate the configuration process of the model identifier on the second circuit board. As mentioned above, RF unit B can also include other components. Therefore, currently... Figure 7 The diagram illustrates a scenario where the receiving unit is moved further away, thus extending or separating the receiving path.

[0177] Optionally, in the assembly process, after the first circuit board and the second circuit board are assembled and powered on, the SOC of the first circuit board can be detected by the identification unit through the V output of the identification circuit of the second circuit board. ADC Therefore, the first circuit board can be based on this V. ADC The first circuit board obtains the model identifier of the currently assembled second circuit board and loads the corresponding static parameters based on this model identifier. Furthermore, the first circuit board can read the second identifier (such as the RFIC ID) of the second circuit board and obtain the second calibration parameters of the second circuit board from the server based on this second identifier. Afterwards, the first circuit board can perform testing and use of both the first and second circuit boards according to its own first calibration parameters and the obtained static and second calibration parameters.

[0178] Optionally, the SOC of the first circuit board triggers the detection unit to detect the V output of the identification circuit of the second circuit board. ADC In three V ADC If all voltage values ​​are less than the preset minimum voltage value (e.g., 100 millivolts), the first circuit board can determine that the second circuit board is not currently connected, or that the second circuit board does not have an identification circuit, meaning the second circuit board does not have an adaptive matching function with the first circuit board. Therefore, the first circuit board can proceed with subsequent testing as if the second circuit board were not present. For example, the baseband processing unit (modem) in the SOC can achieve self-starting without the RF backplate (second circuit board), thus ensuring that in the test scenario, there are no issues such as standby current caused by modem malfunctions or the first circuit board failing to start.

[0179] The above describes the configuration process of the identification circuit on the second circuit board during the production process. The following section describes in detail the process of obtaining static parameters of the first circuit board during the assembly process.

[0180] In some embodiments, after the first and second circuit boards are assembled, it is necessary to ensure that all relevant trigger / response (TR) paths (or channels, etc.) on the first and second circuit boards can correctly coordinate and function. Therefore, the first circuit board needs to be pre-configured with TR path routing parameters, which can also be described as static parameters, to ensure correct coordination and operation between the first and second circuit boards. Optionally, TR path routing parameters may include, for example, RF specifications, RF power, RF path information, power supply configuration, etc. Routing parameters typically refer to parameter settings used for configuring and adjusting functions in a system or device, and can affect the device's performance, compatibility, and functional implementation.

[0181] In some examples, the modem in the SOC on the first circuit board can support a variety of static parameters. Therefore, the number of static parameters that the modem supports is limited, and the number of static parameters that the first circuit board can match is also limited. It should be understood that as electronic technology develops, the types of static parameters supported by the modem will increase, or the limitation will no longer apply; the following is merely an illustrative example.

[0182] In some examples, different static parameters can support the normal operation of different second circuit boards. The different models of the second circuit boards indicate different configurations, such as the models of the devices mounted on them.

[0183] Optionally, different model identifiers can be used to indicate different models of the second circuit board, and different virtual RF product IDs can be used to point to different static parameters stored in the first circuit board. The SOC in the first circuit board can drive the devices on the second circuit board to operate through these static parameters. Thus, there is a correspondence between the model identifier and the virtual RF product ID. For example, after the first circuit board is connected to the second circuit board, it can obtain the model identifier of the second circuit board, then determine the virtual RF product ID corresponding to that model identifier, and then obtain the static parameters indicated by the virtual RF product ID, so as to drive the devices on the currently connected second circuit board to operate through these static parameters.

[0184] It should be understood that the first circuit board distinguishes different models of the second circuit board by the output data of the identification circuit installed on the second circuit board. To reduce the design complexity of the identification circuit, the more complex virtual RF product ID is generally not used to distinguish different second circuit boards directly. Instead, a simpler model identifier is created to distinguish different second circuit boards. Therefore, without considering the design complexity of the identification circuit, different second circuit boards can also be distinguished directly by the virtual RF product ID. After the first circuit board is assembled with the second circuit board, it can determine the virtual RF product ID by obtaining the output data of the identification circuit, thereby directly obtaining the static parameters indicated by the virtual RF product ID. Optionally, different static parameters can also be distinguished directly by the model identifier. For example, the first circuit board stores the static parameters directly indicated by different model identifiers. Then, after the first circuit board is connected to the second circuit board, it can obtain the model identifier of the second circuit board, and then determine the static parameters indicated by the model identifier to drive the devices on the currently connected second circuit board to operate. That is, the static parameters can be obtained without going through the conversion step of model identifier and virtual RF product ID.

[0185] Optionally, different virtual RF product IDs can correspond to different groups of static parameters, with each group of static parameters including at least one static parameter. Optionally, the storage unit of the first circuit board stores the static parameters corresponding to different virtual RF product IDs. For example, as shown in Table 1 below, the first identifier of the first circuit board ID unit indicates the first circuit board, and the model identifier of the second circuit board ID unit indicates the model of the second circuit board. Different model identifiers correspond to virtual RF product IDs. Therefore, after the first circuit board identifies the model identifier of the second circuit board through the identification circuit, it can obtain the virtual RF product ID corresponding to that model identifier. The static parameter indicated by this virtual RF product ID is the static parameter currently supported by the second circuit board. Furthermore, the first circuit board can download the second calibration parameters of the second circuit board from the server by reading the RFIC ID of the second circuit board. Then, the first circuit board can load the second calibration parameters and the static parameters indicated by the virtual RF product ID, thereby achieving flexible parameter calibration and testing.

[0186] Alternatively, after the first circuit board identifies the model identifier of the second circuit board through the identification circuit, it fails to obtain the virtual RF product ID corresponding to that model identifier. In this case, the first circuit board can determine that it does not support the currently assembled second circuit board, triggering an error report. This achieves error-proofing (or poka-yoke), preventing the assembly of unusable first and second circuit boards. Error-proofing refers to taking measures in the system design to prevent problems caused by user or production line personnel due to errors or negligence. Error-proofing can be ensured through design and process control to ensure that errors do not occur or can be detected and corrected in a timely manner, thereby improving the reliability and accuracy of the system.

[0187] Optionally, the storage cells in the first circuit board store a virtual RF product ID and corresponding static parameters.

[0188] For example, the first identifier indicated by the first circuit board ID unit of the first circuit board is 18234, and the model identifier indicated by the second circuit board ID unit of the second circuit board identified by the first circuit board is 24. As shown in Table 1 below, the first circuit board can obtain the virtual RF product ID corresponding to model identifier 24 as 0x3A3C0C00. Then, the first circuit board can load the static parameters corresponding to 0x3A3C0C00 and download the second calibration parameters corresponding to the RFIC ID of the second circuit board from the server. Afterwards, the first circuit board can use these static parameters and the second calibration parameters to test and calibrate the functions of both the first and second circuit boards.

[0189] For example, the first identifier indicated by the first circuit board ID unit of the first circuit board is 18233, and the model identifier indicated by the second circuit board ID unit of the second circuit board identified by the first circuit board is 24. As shown in Table 1 below, the first circuit board cannot obtain the virtual RF product ID corresponding to the current model identifier. Therefore, the first circuit board can report an error.

[0190] Table 1

[0191]

[0192] In this way, by flexibly downloading the second calibration parameters and loading local static parameters, the first and second circuit boards can be flexibly matched, improving the production line efficiency.

[0193] In some embodiments, during the production of the first and second circuit boards, the first circuit board can obtain first calibration parameters by connecting to a second tool circuit board, and the second circuit board can obtain second calibration parameters by connecting to the first tool circuit board. Optionally, the first tool circuit board is a tool board used for testing the second circuit board, and the second tool circuit board is a tool board used for testing the first circuit board. During the acquisition of calibration parameters (such as the first or second calibration parameters), the devices on the tool circuit board (such as the first or second tool circuit board) can also generate corresponding signal losses, and the signal losses generated by devices on different tool circuit boards are different. Therefore, if the signal loss of the tool circuit board is also considered as the signal loss of the devices on the connected circuit boards, it will obviously affect the accuracy of the calibration parameters. Therefore, by decoupling the signal losses of the devices on the two connected circuit boards, more accurate calibration parameters can be obtained.

[0194] In some examples, gain is used to indicate the signal loss of a device. Gain is a commonly used concept in electronics and communications; it represents the ratio between the input signal and the output signal. Gain measures a system's or component's ability to amplify signals. Gain can be voltage gain, power gain, etc., depending on the application.

[0195] In some examples, RF gain is detected by adding an RF test socket to the circuit board.

[0196] See above for some examples. Figure 5 The relevant content describes how adding RF test sockets between RF devices and other devices can simulate various test environments. By opening or closing the switches on the RF test sockets, the corresponding paths can be connected or disconnected, thereby obtaining the gain of the corresponding RF device.

[0197] For example, such as Figure 8 As shown, a satellite receiving unit is configured on the first circuit board, and a satellite diversity reception RF test socket A is included between the satellite receiving unit and the antenna; a satellite diversity reception RF test socket B is included between the satellite receiving unit and the RFIC on the second circuit board. Optionally, when only RF test socket A is turned on (or described as RF test socket B being turned off), the SOC on the first circuit board can obtain the overall board gain Gain_A of the satellite receiving unit and the RFIC; when both RF test sockets A and B are turned on, the SOC on the first circuit board can obtain the gain Gain_B of the satellite receiving unit. Therefore, the SOC on the first circuit board can determine the gain Gain_B of the satellite receiving unit, and the gain of the RFIC is Gain_A - Gain_B.

[0198] In this way, the calibration parameters of RFIC and FEM are decoupled through RF test socket A and RF test socket B, improving the accuracy of obtaining the first calibration parameter and the second calibration parameter, so as to ensure the accuracy of the function implementation after the flexible assembly of the first circuit board and the second circuit board.

[0199] The preceding text introduced the structure of the first and second circuit boards, as well as the process for obtaining the static parameters and the second calibration parameters. The following text details the flexible matching process of the first and second circuit boards during the assembly process. For example... Figure 9 As shown, the process may include the following steps.

[0200] S901, Power-on initialization.

[0201] In some embodiments, during the assembly process, after the first circuit board and the second circuit board are assembled, the first circuit board and the second circuit board can be powered on and enter the initialization process.

[0202] Optionally, during the initialization process, the first circuit board may load test software to trigger subsequent test processes.

[0203] S902. The first circuit board determines whether the second circuit board is in place. If the first circuit board determines that the second circuit board is in place, proceed to step S904; if the first circuit board determines that the second circuit board is not in place, proceed to step S903.

[0204] S903: The first circuit board enters the single motherboard boot mode, tests the first circuit board, and stores the test results.

[0205] In some embodiments, the first circuit board and the second circuit board may be improperly assembled, or the first circuit board may not be assembled with the second circuit board. That is, the second circuit board is not in place. In this case, the first circuit board may trigger different test procedures depending on whether the second circuit board is in place.

[0206] Optionally, the first circuit board can determine whether the second circuit board is in place using testing software. If the second circuit board is in place, the first circuit board can trigger a dual-board boot mode, testing both the first and second circuit boards through the following steps. If the second circuit board is not in place, the first circuit board can trigger a single-board boot mode, performing separate functional tests on the first circuit board and acquiring and storing the corresponding test results.

[0207] It should be understood that the first circuit board can execute each step of the current process via the SOC. Optionally, the first circuit board can receive and execute control commands sent by the control unit via the SOC to implement each step of the current process. This will not be elaborated further below.

[0208] S904. Determine if the first circuit board matches the second circuit board. If the first circuit board matches the second circuit board, proceed to step S905; if the first circuit board does not match the second circuit board, end the test.

[0209] In some embodiments, when the first circuit board determines that the second circuit board is in place, it can read the output data of the identification circuit on the second circuit board to obtain corresponding detection data. Then, the first circuit board can match the corresponding gear based on the detection data to obtain the model identifier of the second circuit board. Afterwards, the first circuit board can determine whether the static parameters currently loaded on the first circuit board correspond to the model identifier. For example, the first circuit board can determine whether it supports the operation of the devices on the currently connected second circuit board to determine whether the first and second circuit boards are compatible.

[0210] If the first circuit board and the second circuit board are incompatible, the first circuit board cannot support the operation of the devices on the currently connected second circuit board, and therefore subsequent testing of the second circuit board is impossible. In this case, the first circuit board can terminate the testing process. Optionally, the first circuit board can notify the production line personnel that the two currently connected circuit boards are incompatible.

[0211] If the first circuit board and the second circuit board are matched, then the first circuit board can support the operation of the devices on the currently connected second circuit board, and the first circuit board can execute the subsequent test process.

[0212] S905. Are the static parameters currently loaded on the first circuit board appropriate? If the static parameters currently loaded on the first circuit board are appropriate, proceed to step S906; if the static parameters currently loaded on the first circuit board are inappropriate, end the test.

[0213] In some embodiments, static parameters may have been loaded onto the first circuit board during the manufacturing process. After connecting to the second circuit board, the first circuit board can determine whether the currently loaded static parameters are suitable for the model of the second circuit board. For example, during the process of determining whether the first and second circuit boards are compatible, the first circuit board has already obtained the model identifier of the second circuit board. The first circuit board can then determine whether the currently loaded static parameters are appropriate by checking whether this model identifier matches the virtual RF product ID of the currently loaded static parameters. If the currently loaded static parameters are appropriate, the first circuit board can continue executing the test process. If the currently loaded static parameters are inappropriate, the first circuit board can terminate the test process.

[0214] Optionally, during the manufacturing process of the first circuit board, the first circuit board is connected to a tooling second circuit board to obtain the first calibration parameters of the first circuit board. During this process, the first circuit board is loaded with corresponding static parameters. Therefore, subsequently, upon reaching the assembly process, the first circuit board has already been loaded with these static parameters.

[0215] In other embodiments, the first circuit board supports multiple models of the second circuit board. Therefore, if the first circuit board determines that the currently loaded static parameters are inappropriate, and if the first circuit board matches the second circuit board, then the first circuit board can reload appropriate static parameters to execute subsequent testing procedures.

[0216] In other embodiments, after the first circuit board completes testing during the manufacturing process, the static parameters may no longer be loaded (e.g., unloaded). Then, during the subsequent assembly process, the first circuit board may be reloaded with static parameters applicable to the currently matched second circuit board to perform subsequent testing procedures.

[0217] S906, The first circuit board downloads the second calibration parameters of the second circuit board from the server.

[0218] In some embodiments, after the first circuit board is connected to the second circuit board, it can read the identifier of the RFIC on the second circuit board, such as the RFIC ID. The RFIC ID is a unique identifier for the second circuit board. For example, the RFIC ID could be a second identifier. Then, the first circuit board can send this second identifier to the server to download the second calibration parameters corresponding to the second identifier from the server.

[0219] For example, the SOC in the first circuit board sends an AT command "AT^RFICDIEID?" to the second circuit board. In response to this AT command, the second circuit board replies to the SOC in the first circuit board with "^RFICDIEID:1,0,BA4B2AD346246800,1,1". Then, the SOC in the first circuit board can obtain the RFIC ID of the second circuit board as BA4B2AD346246800, and thereby download the second calibration parameters from the server based on this RFIC ID.

[0220] Optionally, the first circuit board can also load the second calibration parameters after downloading them.

[0221] Optionally, the second calibration parameter is the calibration parameter uploaded after testing during the production of the second circuit board.

[0222] It should be understood that the embodiments of this application do not limit the execution order of steps S904, S905, and S906. That is, the first circuit board may load the static parameters first and then download the second calibration parameters; the first circuit board may also download the second calibration parameters first and then load the static parameters; or, the first circuit board may load the static parameters and download the second calibration parameters simultaneously.

[0223] S907, the first circuit board performs tests on the first circuit board and the second circuit board.

[0224] In some embodiments, the first circuit board is loaded with static parameters and second calibration parameters, and functional tests can be performed on the first circuit board and the second circuit board based on the static parameters and the second calibration parameters.

[0225] Thus, by uploading the second calibration parameters to the server, the first and second circuit boards are decoupled, enabling a more flexible assembly process for the first and second circuit boards.

[0226] Figure 10 This is a schematic flowchart illustrating a circuit board matching method provided in an embodiment of this application. It should be noted that this method does not rely on... Figure 10 The specific order described below is a limitation. It should be understood that in other embodiments, the order of some steps in the method can be interchanged according to actual needs, or some steps can be omitted or deleted. The method includes the following steps:

[0227] S1001 and SOC obtain the RFIC identifier of the second circuit board through a communication connection, and download the second calibration parameters of the second circuit board from the server based on the RFIC identifier.

[0228] The circuit board matching method provided in this application embodiment is applied to a radio frequency remote electronic device. Optionally, the radio frequency remote electronic device includes a first circuit board and a second circuit board. The first circuit board is equipped with a System-on-a-Chip (SOC), an identification unit, and a storage unit. The storage unit stores first static parameters for driving the second circuit board, as well as first calibration parameters for the first circuit board. The second circuit board is equipped with an RFIC and an identification circuit. Optionally, the first and second circuit boards are communicatively connected.

[0229] For example, such as Figure 4 As shown, a first circuit board houses a System-on-a-Chip (SOC), an identification unit, and a storage unit, while a second circuit board houses an RFIC and an identification circuit. Optionally, the RFIC is mounted on the second circuit board to achieve radio frequency remote control of the RFIC relative to the SOC. Optionally, the RFIC's identifier serves as a unique identifier for the second circuit board, allowing the first circuit board to obtain the second calibration parameters of the second circuit board from a server based on this unique identifier.

[0230] For example, the SOC on the first circuit board sends an AT command to the RFCI on the second circuit board to obtain the RFIC ID fed back by the RFIC on the second circuit board. This RFIC ID is a unique identifier for the second circuit board, such as a second identifier. Then, the SOC on the first circuit board can request to download the second calibration parameters corresponding to the second identifier from the server based on this second identifier. Specifically, the SOC can send the second identifier to the server through the RF unit on the first circuit board, and then receive the second calibration parameters sent by the server through the same RF unit. Optionally, before assembling the first and second circuit boards, the second circuit board can be connected to the tool first circuit board. The tool first circuit board can obtain the second calibration parameters and the second identifier of the second circuit board by testing it, and upload the second calibration parameters and the second identifier to the server, so that any subsequent first circuit board that establishes a communication connection with the second circuit board can download the second calibration parameters based on the second identifier.

[0231] In this way, the second calibration parameters of the second circuit board are uploaded to the server instead of being saved in the storage unit of the first circuit board, thus breaking the strong binding relationship between the first circuit board and the matched second circuit board. Subsequently, after the first circuit board is assembled with the second circuit board, it only needs to download the second calibration parameters corresponding to the currently assembled second circuit board from the server to ensure the normal operation of the devices on both circuit boards. Thus, during the assembly process, the first and second circuit boards can be randomly assembled, effectively reducing production line production and maintenance costs.

[0232] In some embodiments, a first radio frequency unit is mounted on a first circuit board, and a second radio frequency unit is mounted on a second circuit board.

[0233] For example, such as Figure 4 As shown, radio frequency unit A is mounted on the first circuit board, and radio frequency unit B is mounted on the second circuit board.

[0234] In this way, by mounting the RFIC and some radio frequency units on the second circuit board, the overall thickness of the first circuit board can be reduced, and the wiring insertion loss can be reduced to improve the transmission and reception performance of the electronic device.

[0235] In some embodiments, the first radio frequency unit includes a satellite receiving unit and / or a short-range transceiver unit, and the second radio frequency unit includes a satellite transceiver unit and / or a cellular transceiver unit.

[0236] For example, such as Figure 5 As shown, the first circuit board is equipped with a satellite receiving unit and a short-range chip module connected to the WiFi / BT / GPS transceiver module (enabling short-range transmission and reception). The second circuit board is equipped with a satellite transceiver unit and a cellular transceiver unit.

[0237] Thus, by separating the RFIC from the SOC and moving the RFIC and RF unit B to a position closer to the cellular antenna on the second circuit board, not only can the thickness of the first circuit board be reduced, but also the wiring insertion loss and the complexity of the antenna layout on the first circuit board can be reduced.

[0238] In some examples, the first radio frequency unit is connected to at least one short-range antenna, and the second radio frequency unit is connected to at least one mobile cellular antenna.

[0239] In some examples, the first radio frequency unit is connected to the satellite diversity receiving antenna, and the second radio frequency unit is connected to both the satellite transmitting antenna and the main receiving antenna.

[0240] Thus, by mounting the satellite receiving unit on the first circuit board and the satellite transceiver unit on the second circuit board, the radio frequency front-end of the satellite system can be extended.

[0241] S1002 The identification unit obtains the output data of the identification circuit through a communication connection, and obtains the model identifier of the second circuit board based on the output data.

[0242] In some embodiments, the identification circuit includes multiple resistors, and the output data is voltage data or current data. The storage unit stores the gear positions corresponding to different output data, and the gear positions are mapped to the model identifier of the second circuit board.

[0243] In some examples, the model identifier is used to indicate the model of the second circuit board. Multiple second circuit boards with the same model have the same model identifier and correspond to the same target static parameters.

[0244] For example, such as Figure 6 As shown, the identification circuit includes two resistors, both of which are adjustable in value, used to change V. ADC The detection data. It should be understood that the output data of the recognition circuit corresponds to the detection data of the recognition unit. For example, change the voltage data Vx and voltage data Vy corresponding to the two resistors respectively. Optionally, divide the voltage data from 0 to the maximum possible voltage into 10 levels from 0 to 9. Then, by changing the resistance values ​​of resistor 1 and resistor 2, 100 levels from 00 to 99 can be obtained.

[0245] Optionally, different settings corresponding to different models of the second circuit board can be pre-configured. During the debugging process of the second circuit board, by adjusting the resistance value in the identification circuit according to the model of the second circuit board, output data indicating the current model can be obtained. Once the resistance value indicating the current model is obtained, the debugging of the identification circuit can be considered complete. Subsequently, after the first and second circuit boards are assembled, the model of the currently assembled second circuit board is also determined by reading the output data of the identification circuit through the identification unit.

[0246] Thus, by configuring an identification circuit in the second circuit board, the model of the currently assembled second circuit board can be determined after the first and second circuit boards are flexibly assembled, thereby enabling the loading of appropriate static parameters to meet the requirements of flexible assembly between circuit boards.

[0247] S1003. When the first static parameter matches the model designation, the SOC performs functional tests on the radio frequency remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter.

[0248] In some embodiments, if the first static parameter matches the model identifier, the SOC loads the first static parameter and the second calibration parameter. Alternatively, if the first static parameter matches the model identifier and the SOC has already loaded the first static parameter, the SOC loads the second calibration parameter.

[0249] In some examples, the first static parameter includes multiple sets of static parameters. The SOC retrieves the target static parameter that matches the model identifier from the first static parameter and loads the target static parameter.

[0250] In other examples, the first static parameter includes multiple sets of static parameters. The SOC determines that all sets of static parameters do not match the model identifier, triggering an error in the remote RF electronic device.

[0251] For example, the first circuit board includes at least a set of static parameters for driving the devices on the second circuit board. For instance, the first circuit board may have already loaded static parameters during manufacturing. After connecting to the second circuit board, the first circuit board can determine whether the currently loaded static parameters are suitable for the model of the second circuit board. For example, the first circuit board can determine whether the currently loaded static parameters are appropriate by checking if the obtained model identifier matches the virtual RF product ID of the currently loaded static parameters. If the currently loaded static parameters are appropriate, the first circuit board can continue executing the test process. If the currently loaded static parameters are inappropriate, the target static parameters that match the model identifier of the current second circuit board can be reloaded from the stored first static parameters to execute subsequent test processes. If all static parameters stored in the storage unit of the first circuit board do not match the model identifier, it can be determined that the first circuit board and the second circuit board are incompatible. The first circuit board can save the information and prompt the user to replace the second circuit board.

[0252] In this way, the first circuit board can adaptively load the corresponding static parameters according to the model of the connected second circuit board, thus realizing flexible circuit board assembly.

[0253] In some embodiments, a first test socket and a second test socket are mounted on a first circuit board. The first test socket connects a first antenna and a satellite receiving unit on the first circuit board, and the second test socket connects the satellite receiving unit and an RFIC on the second circuit board. When the first test socket is turned on, the SOC acquires a first gain jointly generated by the satellite receiving unit and the RFIC. When both the first and second test sockets are turned on, the SOC acquires a second gain generated by the satellite receiving unit. The third gain generated by the RFIC is the difference between the first and second gains.

[0254] For example, such as Figure 8 As shown, a satellite receiving unit is configured on the first circuit board, and a satellite diversity reception RF test socket A is included between the satellite receiving unit and the antenna; a satellite diversity reception RF test socket B is included between the satellite receiving unit and the RFIC on the second circuit board. Optionally, when only RF test socket A is turned on (or described as RF test socket B being turned off), the SOC on the first circuit board can obtain the overall board gain Gain_A of the satellite receiving unit and the RFIC; when both RF test sockets A and B are turned on, the SOC on the first circuit board can obtain the gain Gain_B of the satellite receiving unit. Therefore, the SOC on the first circuit board can determine the gain Gain_B of the satellite receiving unit, and the gain of the RFIC is Gain_A - Gain_B.

[0255] It should be understood that the first and second test sockets are used to obtain more accurate circuit board calibration parameters during the circuit board manufacturing process.

[0256] In this way, the calibration parameters of the RFIC and the RF front-end module are decoupled through the first test socket and the second test socket, improving the accuracy of obtaining the first calibration parameters and the second calibration parameters, so as to ensure the accuracy of the function implementation after the flexible assembly of the first circuit board and the second circuit board.

[0257] The following section uses Electronic Device 100, a foldable screen phone, as an example to introduce the hardware structure of electronic devices.

[0258] For example, Figure 11 A schematic diagram of an electronic device 100 is shown.

[0259] Electronic device 100 may include processor 110, external memory interface 120, internal memory 121, universal serial bus (USB) interface 130, charging management module 140, power management module 141, battery 142, antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, audio module 170, sensor module 180, button 190, motor 191, indicator 192, camera 193, display screen 194, and subscriber identification module (SIM) card interface 195, etc.

[0260] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0261] Processor 110 may include one or more processing units, such as application processors (APs), modem processors, graphics processing units (GPUs), image signal processors (ISPs), controllers, video codecs, digital signal processors (DSPs), baseband processors, and / or neural network processing units (NPUs). These different processing units may be independent devices or integrated into one or more processors.

[0262] The controller can generate operation control signals based on the instruction opcode and timing signals to complete the control of instruction fetching and execution.

[0263] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0264] The wireless communication function of electronic device 100 can be realized through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor and baseband processor, etc.

[0265] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover one or more communication frequency bands. Different antennas can also be multiplexed to improve antenna utilization. For example, antenna 1 can be multiplexed as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with tuning switches.

[0266] The mobile communication module 150 can provide solutions for wireless communication, including 2G / 3G / 4G / 5G, applied to the electronic device 100. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves via antenna 1, and perform filtering, amplification, and other processing on the received electromagnetic waves before transmitting them to a modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via antenna 1. In some embodiments, at least some functional modules of the mobile communication module 150 may be housed in the processor 110. In some embodiments, at least some functional modules of the mobile communication module 150 and at least some modules of the processor 110 may be housed in the same device.

[0267] The modem processor may include a modulator and a demodulator. The modulator modulates the low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs a sound signal through an audio device or displays an image or video through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0268] The wireless communication module 160 can provide solutions for wireless communication applications on the electronic device 100, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via antenna 2, performs frequency modulation and filtering of the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, perform frequency modulation and amplification, and convert them into electromagnetic waves for radiation via antenna 2.

[0269] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, enabling electronic device 100 to communicate with networks and other devices via wireless communication technology. The wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies, etc. The GNSS may include the Global Positioning System (GPS), the Global Navigation Satellite System (GLONASS), the BeiDou Navigation Satellite System (BDS), the Quasi-Zenith Satellite System (QZSS), and / or satellite-based augmentation systems (SBAS).

[0270] Internal memory 121 can be used to store computer executable program code, which includes instructions. Internal memory 121 may include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function (such as sound playback, image playback, etc.), etc. The data storage area may store data created during the use of electronic device 100 (such as audio data, phonebook, etc.). Furthermore, internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc. Processor 110 executes various functional applications and data processing of electronic device 100 by running instructions stored in internal memory 121 and / or instructions stored in memory located in the processor.

[0271] In some solutions, multiple embodiments of this application can be combined, and the combined solution can be implemented. Optionally, some operations in the processes of each method embodiment may be combined, and / or the order of some operations may be changed. Furthermore, the execution order between the steps of each process is merely exemplary and does not constitute a limitation on the execution order between steps; other execution orders are also possible. It is not intended to indicate that the execution order is the only possible order in which these operations can be performed. Those skilled in the art will conceive of various ways to reorder the operations described herein. In addition, it should be noted that the process details involved in one embodiment of this document are similarly applicable to other embodiments, or different embodiments may be combined.

[0272] Furthermore, some steps in the method embodiments can be equivalently replaced with other possible steps. Alternatively, some steps in the method embodiments may be optional and can be deleted in certain use cases. Or, other possible steps may be added to the method embodiments.

[0273] Furthermore, the various method embodiments can be implemented individually or in combination.

[0274] This application also provides a chip system, including: a processor coupled to a memory, the memory being used to store programs or instructions, wherein when the program or instructions are executed by the processor, the chip system implements the methods in any of the above method embodiments.

[0275] Optionally, the chip system may contain one or more processors. These processors can be implemented in hardware or software. When implemented in hardware, the processor can be a logic circuit, an integrated circuit, etc. When implemented in software, the processor can be a general-purpose processor, implemented by reading software code stored in memory.

[0276] Optionally, the chip system may contain one or more memories. The memory may be integrated with the processor or disposed separately from it; this application embodiment does not limit this. For example, the memory may be a non-transient processor, such as a read-only memory (ROM), which may be integrated with the processor on the same chip or disposed separately on different chips. This application embodiment does not specifically limit the type of memory or the arrangement of the memory and processor.

[0277] For example, the chip system may be a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on chip (SoC), a central processor unit (CPU), a network processor (NP), a digital signal processor (DSP), a micro controller unit (MCU), a programmable logic device (PLD), or other integrated chips.

[0278] It should be understood that each step in the above method embodiments can be completed by integrated logic circuits in the processor hardware or by instructions in software form. The method steps disclosed in the embodiments of this application can be directly manifested as being executed by a hardware processor, or being executed by a combination of hardware and software modules in the processor.

[0279] This application also provides a computer-readable storage medium storing a computer program. When the computer program is run on a computer, it causes the computer to perform the aforementioned related steps to implement the circuit board matching method in the above embodiments.

[0280] This application also provides a computer program product that, when run on a computer, causes the computer to perform the aforementioned related steps to implement the circuit board matching method in the above embodiments.

[0281] In addition, this application also provides an apparatus. This apparatus may specifically be a component or module, and may include one or more processors and a memory connected together. The memory stores a computer program. When the computer program is executed by one or more processors, the apparatus performs the circuit board matching method described in the above-described method embodiments.

[0282] The apparatus, computer-readable storage medium, computer program product, or chip provided in the embodiments of this application are all used to execute the corresponding methods provided above. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects of the corresponding methods provided above, and will not be repeated here.

[0283] The steps of the methods or algorithms described in conjunction with the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in random access memory (RAM), flash memory, read-only memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disks, portable hard disks, CD-ROMs, or any other form of storage medium well known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can reside in an application-specific integrated circuit (ASIC).

[0284] Through the above description of the embodiments, those skilled in the art will clearly understand that, for the sake of convenience and brevity, the division of the above functional modules is only used as an example. In practical applications, the above functions can be assigned to different functional modules as needed; that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0285] In the several embodiments provided in this application, it should be understood that the disclosed methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of modules or units is only a logical functional division, and there may be other division methods in actual implementation; for example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of modules or units may be electrical, mechanical or other forms.

[0286] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0287] Computer-readable storage media include, but are not limited to, any of the following: USB flash drive, portable hard drive, read-only memory (ROM), random access memory (RAM), magnetic disk or optical disk, and other media capable of storing program code.

[0288] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radio frequency remote electronics device, comprising: The radio remote electronic device comprises a first circuit board and a second circuit board; wherein the first circuit board is provided with a system chip (SOC), an identification unit and a storage unit, the storage unit stores a first static parameter for driving the second circuit board and a first calibration parameter of the first circuit board; and the second circuit board is provided with a radio frequency integrated circuit (RFIC) and an identification circuit; The first main board and the second main board are in communication connection; The SOC is configured to acquire the RFIC identification of the second circuit board through the communication connection, and download a second calibration parameter of the second circuit board from a server based on the RFIC identification; The identification unit is configured to acquire output data of the identification circuit through the communication connection, and acquire a model identification of the second circuit board based on the output data; In a case where the first static parameter matches the model identification, the SOC is further configured to perform a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter and the first static parameter.

2. The radio frequency remote electronic device of claim 1, wherein, The first circuit board is provided with a first radio frequency unit, and the second circuit board is provided with a second radio frequency unit.

3. The radio frequency remote electronic device of claim 2, wherein, The first radio frequency unit comprises a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit comprises a satellite transceiving unit and / or a cellular transceiving unit.

4. The radio frequency remote electronic of claim 2 or 3, wherein, The first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

5. The radio frequency remoting electronic device of any of claims 2-4, wherein, The first radio frequency unit is connected with a satellite diversity receiving antenna, and the second radio frequency unit is connected with a satellite transmitting antenna and a main set receiving antenna.

6. The radio frequency remoting electronic device of any of claims 3-5, wherein, The first circuit board is provided with a first test seat and a second test seat, the first test seat is connected with a first antenna and a satellite receiving unit on the first circuit board, and the second test seat is connected with the satellite receiving unit and an RFIC on the second circuit board; In a case where the first test seat is turned on, the SOC is configured to acquire a first gain generated by the satellite receiving unit and the RFIC together; In a case where both the first test seat and the second test seat are turned on, the SOC is configured to acquire a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is a difference between the first gain and the second gain.

7. The radio frequency remoting electronic device of any of claims 1-6, wherein, The identification circuit comprises a plurality of resistors; the output data is voltage data or current data, the storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identification of the second circuit board.

8. The radio remote electronic device according to any one of claims 1-7, wherein, In a case where the first static parameter matches the model identification, the SOC is further configured to load the first static parameter and the second calibration parameter; Or, in a case where the first static parameter matches the model identification and the SOC has already loaded the first static parameter, the SOC is further configured to load the second calibration parameter.

9. The radio frequency remoting electronic device of any of claims 1-8, wherein, The first static parameter comprises a plurality of groups of static parameters; The SOC is further configured to acquire a target static parameter matching the model identifier from the first static parameter, and load the target static parameter.

10. The radio frequency remoting electronic device of any of claims 1-9, wherein, The first static parameter comprises a plurality of groups of static parameters. The SOC is further configured to determine that the plurality of groups of static parameters do not match the model identifier, and trigger the radio remote electronic device to report an error.

11. The radio frequency remoting electronic device of any of claims 1-10, wherein, The model identifier is used to indicate the model of the second circuit board, the model identifiers of a plurality of second circuit boards of the same model are the same, and correspond to the same target static parameter.

12. A circuit board matching method characterized by, The method is applied to a radio remote electronic device, the radio remote electronic device comprising a first circuit board and a second circuit board, the first circuit board and the second circuit board being communicatively connected; wherein the first circuit board is provided with a system chip SOC, an identification unit, and a storage unit, the storage unit storing first static parameters used to drive the second circuit board and first calibration parameters of the first circuit board; the second circuit board is provided with a radio frequency integrated circuit RFIC and an identification circuit; the method comprises: The SOC acquires an RFIC identifier of the second circuit board through the communication connection, and downloads second calibration parameters of the second circuit board from a server based on the RFIC identifier; The identification unit acquires output data of the identification circuit through the communication connection, and acquires a model identifier of the second circuit board based on the output data; In a case where the first static parameters match the model identifier, the SOC performs a function test on the radio remote electronic device based on the first calibration parameters, the second calibration parameters, and the first static parameters.

13. The method of claim 12, wherein, The first circuit board is provided with a first radio frequency unit, and the second circuit board is provided with a second radio frequency unit.

14. The method of claim 13, wherein, The first radio frequency unit comprises a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit comprises a satellite transceiving unit and / or a cellular transceiving unit.

15. The method according to claim 13 or 14, characterized in that, The first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

16. The method according to any one of claims 13-15, characterized in that, The first radio frequency unit is connected with a satellite diversity receiving antenna, and the second radio frequency unit is connected with a satellite transmitting antenna and a main set receiving antenna.

17. The method according to any one of claims 14-16, characterized by, The first circuit board is provided with a first test seat and a second test seat, the first test seat is connected with a first antenna and a satellite receiving unit on the first circuit board, and the second test seat is connected with the satellite receiving unit and the RFIC on the second circuit board; the method further comprises: In a case where the first test seat is connected, the SOC acquires a first gain generated by the satellite receiving unit and the RFIC together; In a case where the first test seat and the second test seat are both connected, the SOC acquires a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is a difference between the first gain and the second gain.

18. The method according to any one of claims 12-17, characterized by, The identification circuit comprises a plurality of resistors; the output data is voltage data or current data, the storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identifier of the second circuit board.

19. The method according to any one of claims 12-18, characterized in that, The SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter in a case where the first static parameter matches the model identifier. The SOC loads the first static parameter and the second calibration parameter in a case where the first static parameter matches the model identifier. Alternatively, the SOC loads the second calibration parameter in a case where the first static parameter matches the model identifier and the SOC has already loaded the first static parameter.

20. The method of any of claims 12-19, wherein, The first static parameter includes a plurality of groups of static parameters; and the SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter in a case where the first static parameter matches the model identifier. The SOC acquires a target static parameter matching the model identifier from the first static parameter and loads the target static parameter.

21. The method of any of claims 12-20, wherein, The first static parameter includes a plurality of groups of static parameters; and the method further includes: The SOC determines that the plurality of groups of static parameters do not match the model identifier and triggers the radio remote electronic device to report an error.

22. The method of any one of claims 12-21, wherein, The model identifier is used to indicate a model of the second circuit board, the model identifiers of a plurality of second circuit boards of the same model are the same, and correspond to the same target static parameter.

23. A computer-readable storage medium, characterized in that, The computer readable storage medium includes a computer program, which, when running on an electronic device, causes the electronic device to perform the method of any one of claims 12-22.

24. A computer program product, characterised in that, The computer program product, when running on a computer, causes the computer to perform the method of any one of claims 12-22.

Images