Remote radio electronic device and circuit board matching method

Abstract

The present application relates to the technical field of terminals, and provides a remote radio electronic device and a circuit board matching method. The present application provides a remote radio electronic device. An SoC, an identification unit, and a storage unit are mounted on a first circuit board. The storage unit stores a static parameter of a second circuit board and a first calibration parameter of the first circuit board. An RFIC and an identification circuit are mounted on the second circuit board. A first mainboard is communicatively connected to a second mainboard. The SoC downloads a second calibration parameter of the second circuit board from a server on the basis of an acquired RFIC identifier of the second circuit board. The identification unit acquires a model identifier of the second circuit board on the basis of acquired output data of the identification circuit. When the static parameter matches the model identifier, the SoC performs a function test on the remote radio electronic device on the basis of the first calibration parameter, the second calibration parameter, and the static parameter. In this way, there is no need to match the first circuit board and the second circuit board one by one, thereby reducing production costs of the production line.

Description

Radio frequency remote electronic device and circuit board matching method

[0001] The present application claims priority to the Chinese patent application No. 202411381034.X, filed on September 29, 2024, and entitled "Radio frequency remote electronic device and circuit board matching method", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of terminal, and in particular to a radio frequency remote electronic device and a circuit board matching method. BACKGROUND

[0003] Generally, a system on chip (SOC) and a radio frequency integrated circuit (RFIC) in an electronic device are installed on the same circuit board (such as a mainboard) to reduce communication loss. In addition, a radio frequency unit, a power supply and other devices are also installed on the circuit board. The installation of more devices on the circuit board results in a larger thickness of the final electronic device, which affects the user's pursuit of a light and thin experience of the electronic device.

[0004] To this end, the RFIC, the power supply and other devices installed on the mainboard can be moved to other circuit boards (such as a subboard) for installation, reducing the overall thickness of the mainboard and thus the thickness of the electronic device.

[0005] The SOC triggers the operation of the devices through parameters stored in a storage unit on the mainboard. However, since some devices are moved to the subboard for installation, the mainboard and the subboard need to be one-to-one corresponding, so that the SOC in the mainboard can correctly trigger the operation of the devices in the subboard after the mainboard and the subboard are combined, increasing the production line production and maintenance costs. SUMMARY

[0006] To solve the above technical problems, the present application provides a radio frequency remote electronic device and a circuit board matching method. The first circuit board can download the required parameters from the server based on the identification of the second circuit board. In this way, the first circuit board and the second circuit board do not have to be one-to-one matched during assembly, reducing the production line production and maintenance costs.

[0007] To achieve the above technical purposes, the present application provides the following technical solutions:

[0008] In a first aspect, a radio remote electronic device is provided, which includes a first circuit board and a second circuit board; wherein the first circuit board is provided with a system chip (SOC), an identification unit, and a storage unit, the storage unit storing a first static parameter for driving the second circuit board and a first calibration parameter of the first circuit board; and the second circuit board is provided with a radio frequency integrated circuit (RFIC) and an identification circuit. The first circuit board and the second circuit board are communicatively connected. The SOC is configured to acquire an RFIC identifier of the second circuit board through the communication connection, and download a second calibration parameter of the second circuit board from a server based on the RFIC identifier. The identification unit is configured to acquire output data of the identification circuit through the communication connection, and acquire a model identifier of the second circuit board based on the output data. In a case where the first static parameter matches the model identifier, the SOC is further configured to perform a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter.

[0009] In this way, the second calibration parameter of the second circuit board is uploaded to the server without being saved in the storage unit of the first circuit board, thereby breaking the strong binding relationship between the first circuit board and the matched second circuit board. Subsequently, after the first circuit board establishes a communication connection with the second circuit board, the first circuit board only needs to download the second calibration parameter corresponding to the second circuit board currently connected from the server, and normal operation of the devices on the first circuit board and the second circuit board can also be achieved. In this way, in the assembly process of the first circuit board and the second circuit board, the first circuit board and the second circuit board can be randomly assembled, thereby effectively reducing the production and maintenance costs of the production line.

[0010] According to the first aspect, the first circuit board is provided with a first radio frequency unit, and the second circuit board is provided with a second radio frequency unit.

[0011] In this way, the RFIC and part of the radio frequency unit are installed on the second circuit board, thereby reducing the overall thickness of the first circuit board and reducing the insertion loss of the wiring to improve the transmission and reception performance of the electronic device.

[0012] According to the first aspect, or any one of the implementation manners of the first aspect, the first radio frequency unit includes a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit includes a satellite transceiving unit and / or a cellular transceiving unit.

[0013] In this way, by separating the RFIC from the SOC and moving the RFIC and the radio frequency unit B to a position closer to the second circuit board where the cellular antenna is moved, the thickness of the first circuit board can be reduced, and the insertion loss of the wiring and the complexity of the antenna layout on the first circuit board can also be reduced.

[0014] According to the first aspect, or any one of the implementation manners of the first aspect, the first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

[0015] According to the first aspect, or any one of the implementations of the first aspect, the first radio frequency unit is connected with a satellite diversity receive antenna, and the second radio frequency unit is connected with a satellite transmit antenna and a main diversity receive antenna.

[0016] In this way, the satellite receiving unit is mounted on the first circuit board, and the satellite transceiving unit is mounted on the second circuit board, so that the satellite system radio frequency front end is pulled away.

[0017] According to the first aspect, or any one of the implementations of the first aspect, the first circuit board is provided with a first test seat and a second test seat, the first test seat is connected with the first antenna on the first circuit board and the satellite receiving unit, and the second test seat is connected with the satellite receiving unit and the RFIC on the second circuit board. When the first test seat is turned on, the SOC is used to obtain a first gain generated by the satellite receiving unit and the RFIC together. When the first test seat and the second test seat are both turned on, the SOC is used to obtain a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is a difference between the first gain and the second gain.

[0018] It should be understood that the first test seat and the second test seat are used to obtain more accurate circuit board calibration parameters during the production process of the circuit board.

[0019] In this way, the first test seat and the second test seat are used to decouple the calibration parameters of the RFIC and the radio frequency front end module, improve the accuracy of obtaining the first calibration parameter and the second calibration parameter, and ensure the accuracy of subsequent flexible assembly of the first circuit board and the second circuit board.

[0020] According to the first aspect, or any one of the implementations of the first aspect, the identification circuit includes a plurality of resistors; the output data is voltage data or current data, and the storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identifier of the second circuit board.

[0021] In this way, by configuring the identification circuit in the second circuit board, it can be determined that the model of the currently assembled second circuit board after the subsequent flexible assembly of the first circuit board and the second circuit board, so as to load appropriate static parameters, and meet the demand of flexible assembly between the circuit boards.

[0022] According to the first aspect, or any one of the implementations of the first aspect, in a case where the first static parameter matches the model identifier, the SOC is further used to load the first static parameter and the second calibration parameter. Or, in a case where the first static parameter matches the model identifier and the SOC has loaded the first static parameter, the SOC is further used to load the second calibration parameter.

[0023] According to the first aspect, or any one of the implementations of the first aspect, the first static parameter comprises a plurality of groups of static parameters. The SOC is further configured to obtain a target static parameter matching the model identifier from the first static parameter, and load the target static parameter.

[0024] According to the first aspect, or any one of the implementations of the first aspect, the first static parameter comprises a plurality of groups of static parameters. The SOC is further configured to determine that none of the plurality of groups of static parameters matches the model identifier, and trigger the radio remote electronic device to report an error.

[0025] In this way, the first circuit board can adaptively load corresponding static parameters according to the model of the connected second circuit board, thereby achieving flexible circuit board assembly.

[0026] According to the first aspect, or any one of the implementations of the first aspect, the model identifier is used to indicate the model of the second circuit board, the model identifiers of a plurality of second circuit boards of the same model are the same, and correspond to the same target static parameter.

[0027] The second aspect provides a circuit board matching method. The method is applied to a radio remote electronic device, and the radio remote electronic device comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are in communication connection. The first circuit board is installed with a system chip (SOC), an identification unit, and a storage unit, and the storage unit stores first static parameters for driving the second circuit board and first calibration parameters of the first circuit board. The second circuit board is installed with a radio frequency integrated circuit (RFIC) and an identification circuit. The method comprises the following steps: the SOC obtains an RFIC identifier of the second circuit board through the communication connection, and downloads second calibration parameters of the second circuit board from a server based on the RFIC identifier. The identification unit obtains output data of the identification circuit through the communication connection, and obtains a model identifier of the second circuit board based on the output data. In the case that the first static parameters match the model identifier, the SOC performs a function test on the radio remote electronic device based on the first calibration parameters, the second calibration parameters, and the first static parameters.

[0028] According to the second aspect, the first circuit board is installed with a first radio frequency unit, and the second circuit board is installed with a second radio frequency unit.

[0029] According to the second aspect, or any one of the implementations of the second aspect, the first radio frequency unit comprises a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit comprises a satellite transceiving unit and / or a cellular transceiving unit.

[0030] According to the second aspect, or any one of the implementations of the second aspect, the first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

[0031] According to a second aspect, or any possible implementation mode of the second aspect, the first radio frequency unit is connected with a satellite diversity receiving antenna, and the second radio frequency unit is connected with a satellite transmitting antenna and a main diversity receiving antenna.

[0032] According to the second aspect, or any possible implementation mode of the second aspect, the first test seat and the second test seat are mounted on the first circuit board, the first test seat is connected with the first antenna and the satellite receiving unit on the first circuit board, and the second test seat is connected with the satellite receiving unit and the RFIC on the second circuit board; the method further comprises: in the case that the first test seat is turned on, the SOC acquires a first gain generated by the satellite receiving unit and the RFIC together; and in the case that the first test seat and the second test seat are both turned on, the SOC acquires a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is a difference between the first gain and the second gain.

[0033] According to the second aspect, or any possible implementation mode of the second aspect, the identification circuit comprises a plurality of resistors; the output data is voltage data or current data, and the storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identifier of the second circuit board.

[0034] According to the second aspect, or any possible implementation mode of the second aspect, in the case that the first static parameter matches the model identifier, the SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter and the first static parameter, comprising: in the case that the first static parameter matches the model identifier, the SOC loads the first static parameter and the second calibration parameter; or in the case that the first static parameter matches the model identifier and the SOC has loaded the first static parameter, the SOC loads the second calibration parameter.

[0035] According to the second aspect, or any possible implementation mode of the second aspect, the first static parameter comprises a plurality of groups of static parameters; in the case that the first static parameter matches the model identifier, the SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter and the first static parameter, comprising: the SOC acquires a target static parameter matching the model identifier from the first static parameter, and loads the target static parameter.

[0036] According to the second aspect, or any possible implementation mode of the second aspect, the first static parameter comprises a plurality of groups of static parameters; the method further comprises: the SOC determines that the plurality of groups of static parameters all do not match the model identifier, and triggers the radio remote electronic device to report an error.

[0037] In a third aspect, a computer readable storage medium is provided. The computer readable storage medium stores a computer program (which can also be referred to as instructions or code) that, when executed by an electronic device, causes the electronic device to perform the method of the second aspect or any one of the implementations of the second aspect.

[0038] In a fourth aspect, a computer program product is provided. When the computer program product is run on an electronic device, the electronic device is caused to perform the method of the second aspect or any one of the implementations of the second aspect.

[0039] The technical effects of the foregoing aspects can be referred to each other, and will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0040] FIG. 1 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

[0041] FIG. 2 is a schematic diagram of a communication system to which a circuit board matching method according to an embodiment of the present application is applied;

[0042] FIG. 3 is a schematic diagram of a circuit board matching method according to an embodiment of the present application;

[0043] FIG. 4 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

[0044] FIG. 5 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

[0045] FIG. 6 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

[0046] FIG. 7 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

[0047] FIG. 8 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

[0048] FIG. 9 is a schematic diagram of a circuit board matching method according to an embodiment of the present application;

[0049] FIG. 10 is a schematic diagram of a circuit board matching method according to an embodiment of the present application;

[0050] FIG. 11 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. In the description of the embodiments of the present application, the terms used in the following embodiments are only for the purpose of describing the specific embodiments and are not intended to be limiting on the present application. As used in the specification and the appended claims of the present application, the singular forms “a,” “an,” and “the” are intended to include the plural forms, e.g., “one or more,” unless the context clearly indicates otherwise. It will also be understood that “at least one” and “one or more” refer to one or two or more (including two) in the following embodiments of the present application.

[0052] In the present specification, the phrase “one embodiment” or “some embodiments” etc. means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, the phrases “in one embodiment,” “in some embodiments,” “in other some embodiments,” “in yet some embodiments,” etc. appearing in various places in the specification are not necessarily all referring to the same embodiment, but mean “one or more but not all embodiments” unless otherwise specifically stated. The terms “comprising,” “including,” “having” and their conjugates mean “including but not limited to,” unless otherwise specifically stated. The term “connected” includes both direct and indirect connections unless otherwise specifically stated. “First,” “second,” etc. are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0053] In the embodiments of the present application, the words “exemplary” or “for example” are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as “exemplary” or “for example” in the embodiments of the present application is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words “exemplary” or “for example” is intended to present concepts in a concrete manner.

[0054] In some embodiments, two circuit boards can be included in an electronic device, such as a first circuit board and a second circuit board. Among them, the circuit board on which the SOC is installed is described as a main board, and the other circuit board is described as a secondary board. The main board can control the devices installed on the main board and the secondary board through the SOC. In the embodiments of the present application, the first circuit board is taken as the main board and the second circuit board is taken as the secondary board as an example, and the circuit board matching method provided by the embodiments of the present application is introduced. It should be understood that the second circuit board can also be the main board, and the first circuit board can also be the secondary board. The related implementation manners can refer to the various embodiments provided by the embodiments of the present application, and will not be described here.

[0055] Optionally, the first circuit board or the second circuit board is a printed circuit board (PCB) that can include an insulating substrate, connecting wires, and solder pads for mounting electronic components, and has the dual functions of conducting electricity and insulating the substrate.

[0056] Optionally, the first circuit board and the second circuit board are connected by a connector. Optionally, the connector can be a flexible flat cable, for example.

[0057] In some embodiments, moving some of the components on the first circuit board to the second circuit board for mounting reduces the number of components mounted on the first circuit board, thereby reducing the overall thickness of the first circuit board. In this way, both the first circuit board and the second circuit board have a smaller thickness, thereby reducing the thickness of the electronic device and meeting the user's pursuit of a light and thin experience of the electronic device.

[0058] In some embodiments, as the communication performance of the electronic device improves, more and more antennas are configured on the second circuit board due to the limited area of the first circuit board. Then, moving the radio frequency integrated circuit (RFIC) and the radio frequency unit originally configured on the first circuit board to the second circuit board not only reduces the overall thickness of the first circuit board, but also makes the RFIC and the radio frequency unit closer to the antennas, thereby reducing the insertion loss of the wiring and improving the transmission and reception performance of the electronic device.

[0059] Optionally, the RFIC refers to a chip that integrates multiple radio frequency functions on a single chip. The RFIC usually includes functional modules such as radio frequency amplifiers, mixers, oscillators, and filters. The design purpose of the RFIC is to reduce space and power consumption through integration, improve performance, and reduce overall cost. These chips are widely used in mobile communication, satellite communication, and other radio frequency applications.

[0060] Optionally, the radio frequency unit includes, for example, a radio frequency front-end module (FEM) for filtering and amplifying radio frequency signals to ensure the quality and strength of the signals. Optionally, the FEM includes, for example, a power amplifier (PA), a filter, a switch, a low noise amplifier (LNA), a tuner, a du / multiplexer, etc.

[0061] Optionally, the insertion loss refers to the loss of energy or gain when certain components or branch circuits (such as filters, impedance matchers, etc.) are added to a circuit.

[0062] Exemplarily, as shown in (a) of FIG. 1, a plurality of devices such as a SOC, an RFIC, a radio frequency unit, an antenna (such as a short-range antenna, a mobile cellular antenna), a storage unit, a power management unit, a battery, and the like are mounted on the first circuit board. An antenna (such as a mobile cellular antenna), a power management unit, a battery, and the like are mounted on the second circuit board. As shown in (b) of FIG. 1, the RFIC on the original first circuit board shown in (a) of FIG. 1 is moved to the second circuit board, and part of the radio frequency unit on the original first circuit board is moved to the second circuit board, such as moving the radio frequency unit B such as a PA or an LNA to the second circuit board, while only part of the radio frequency circuit A is reserved on the first circuit board. In addition, the mobile cellular antenna is all moved to the second circuit board. In this way, by separating the RFIC from the SOC, moving the RFIC and the radio frequency unit B to a position closer to the mobile cellular antenna on the second circuit board, not only can the thickness of the first circuit board be reduced, but also the insertion loss of the wiring and the complexity of the antenna layout on the first circuit board can be reduced.

[0063] In some embodiments, different devices on the circuit board can be driven to operate by corresponding parameters. Generally, in order to reduce the difficulty of obtaining parameters of each device in the process of producing the circuit board on the production line, a set of static parameters is pre-set, which can drive the corresponding device to operate. However, there may be certain differences in the production process of different circuit boards, and the static parameters may not be able to completely achieve accurate control of different circuit boards. Therefore, in the process of producing the circuit board on the production line, the static parameters of the circuit board need to be calibrated to obtain corresponding calibration parameters, which are used to realize the normal operation of the devices on the circuit board based on the calibrated static parameters, so as to ensure the normal use of each function of the electronic equipment. Optionally, the parameters of the circuit board, for example, include static parameters and calibration parameters. The parameters of the circuit board can also be described as operating parameters, and the static parameters can also be described as reference parameters, and the calibration parameters can also be described as correction parameters, compensation parameters, and the like, which are not limited in the embodiments of the present application.

[0064] For example, the calibration parameters of the first circuit board can be the calibration parameters corresponding to the devices (or described as hardware) mounted on the first circuit board, for example, including the calibration parameters of the radio frequency unit A and the like. The calibration parameters of the second circuit board can be the calibration parameters corresponding to the devices mounted on the second circuit board, for example, including the calibration parameters of the RFIC, the calibration parameters of the radio frequency unit B, and the like.

[0065] In some embodiments, after obtaining the calibration parameters of the first circuit board and the calibration parameters of the second circuit board, the calibration parameters of the first circuit board and the calibration parameters of the second circuit board are uploaded to the first circuit board, and the calibration parameters of the first circuit board and the calibration parameters of the second circuit board are saved by the storage unit in the first circuit board.

[0066] Subsequently, in the process of assembling the first circuit board and the second circuit board, the first circuit board and the second circuit board need to be matched one by one. Then, the first circuit board can correctly drive the devices on the second circuit board to operate through the stored calibration parameters. If the first circuit board and the second circuit board cannot be correctly matched, the first circuit board cannot correctly drive the devices on the second circuit board to operate, resulting in the failure to realize the function of the electronic device.

[0067] In this way, the first circuit board and the second circuit board are strictly assembled in a one-to-one matching manner, which increases the production and maintenance costs of the production line.

[0068] To this end, the present application provides a circuit board matching method. The first circuit board can identify the identifier of the second circuit board through the identification circuit in the second circuit board, and download the required parameters from the server based on the identifier. In this way, in the process of assembly, the first circuit board and the second circuit board do not need to be matched one by one, and the correct parameters can also be obtained, thereby reducing the production and maintenance costs of the production line.

[0069] FIG. 2 is a schematic diagram of a communication system to which the circuit board matching method provided by the embodiments of the present application is applied. As shown in FIG. 2, the communication system includes an electronic device 100 and a server 200.

[0070] Optionally, the electronic device 100 includes at least two circuit boards, such as a first circuit board and a second circuit board. Optionally, the electronic device 100 can be a terminal device such as a mobile phone, a tablet computer, an augmented reality (AR) / virtual reality (VR) device, a personal computer (PC), an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a wearable device, an artificial intelligence (AI) device, etc. The specific type of the electronic device 100 is not limited in the present application.

[0071] Optionally, the server 200 can be a cloud server or a network server, or a device or server with computing function. The server 200 can be a server, a server cluster composed of multiple servers, or a cloud computing service center.

[0072] In some embodiments, the circuit board matching method provided by the embodiments of the present application can be applied in the process of assembling the first circuit board and the second circuit board on the production line.

[0073] In some embodiments, during the production of the circuit board in the production line, a corresponding identification can be configured for each circuit board to distinguish different circuit boards. For example, the first circuit board is configured with a first identification indicating the first circuit board, and the second circuit board is configured with a second identification indicating the second circuit board.

[0074] Optionally, the RFIC is mounted on the second circuit board, and the RFIC is configured with an identification (ID) that can be used to distinguish different RFICs. Then, the second circuit board can be distinguished by the RFIC ID after the RFIC is mounted. For example, the second identification of the second circuit board is the RFIC ID of the second circuit board.

[0075] In some embodiments, during the production of the circuit board in the production line, the calibration parameter of the circuit board can be obtained, which is used to realize the normal operation of the device on the circuit board.

[0076] Optionally, the first circuit board and the second circuit board are produced separately, and the first calibration parameter of the first circuit board and the second calibration parameter of the second circuit board can be obtained respectively.

[0077] Optionally, after obtaining the first calibration parameter, the first circuit board can save the first calibration parameter through the storage unit mounted on the first circuit board.

[0078] Optionally, after obtaining the second calibration parameter, the second circuit board can upload the second calibration parameter and the second identification of itself to the server. Correspondingly, the server can save the second calibration parameter and the second identification, and the corresponding relationship between the second calibration parameter and the second identification.

[0079] In this way, the second calibration parameter of the second circuit board is uploaded to the cloud server without being saved in the storage unit of the first circuit board, thereby breaking the strong binding relationship between the first circuit board and the matching second circuit board. Subsequently, after the first circuit board is assembled with the second circuit board, the first circuit board only needs to download the second calibration parameter corresponding to the currently assembled second circuit board from the cloud server, and the normal operation of the devices on the first circuit board and the second circuit board can also be realized. In this way, during the assembly process, the first circuit board and the second circuit board can be randomly assembled, effectively reducing the production and maintenance costs of the production line.

[0080] The acquisition process of the second calibration parameter and the process of uploading the second calibration parameter to the server are described in detail as follows by the flow shown in FIG. 3. As shown in FIG. 3, the flow includes the following steps.

[0081] S301, power-on initialization.

[0082] In some embodiments, the second circuit board is assembled with the tool first circuit board in a production procedure of the second circuit board to obtain the second calibration parameter of the second circuit board. Optionally, the tool first circuit board is a tool board for testing the second circuit board, and the tool first circuit board can load static parameters suitable for multiple models of the second circuit board, and after the static parameters are loaded, the devices on the second circuit board can be driven to operate to obtain the second calibration parameter of the second circuit board.

[0083] Optionally, to implement the subsequent step of obtaining the second calibration parameter, the tool first circuit board needs to be assembled with the second circuit board and be powered on for initialization. Optionally, in the process of powering on for initialization, the tool first circuit board can load test software for testing the second circuit board.

[0084] S302, the tool first circuit board determines whether the tool first circuit board matches the second circuit board. If the tool first circuit board matches the second circuit board, step S303 is performed; if the tool first circuit board does not match the second circuit board, the current process is ended.

[0085] In some embodiments, as shown above, static parameters can be configured in the circuit board, and the calibration parameter can be obtained by correcting the static parameters. As shown in (b) of FIG. 1, the tool first circuit board is installed with a SOC and a storage unit, and the second circuit board is installed with an RFIC to achieve a long-distance pull of the RFIC relative to the SOC. Optionally, the storage unit of the tool first circuit board stores static parameters for driving the devices on the second circuit board to operate. Optionally, the tool first circuit board performs each step in the process through the SOC.

[0086] Optionally, the tool first circuit board can be used to test multiple models (or described as types, categories, etc.) of the second circuit board. Accordingly, the tool first circuit board can also be configured with multiple sets of static parameters corresponding to the multiple models respectively. However, the tool first circuit board generally cannot support all models of the second circuit board, and therefore, in the case that the tool first circuit board determines that it cannot support the model of the currently connected second circuit board, it can be determined that the tool first circuit board does not match the second circuit board, and the production line personnel is prompted to replace the second circuit board.

[0087] Optionally, the tool first circuit board can obtain the matching result through the model identifier of the second circuit board. Optionally, the production line can produce multiple second circuit boards of different models, and different models of the second circuit board are configured with different model identifiers, and different circuit boards of the same model are configured with the same model identifier, and the tool first circuit board can distinguish the model of the second circuit board and determine whether it is supported according to the model identifier. Optionally, the first circuit board obtains the model identifier of the second circuit board through the identification circuit on the second circuit board. The content of the identification circuit can be referred to in the relevant content below, and will not be described here.

[0088] Optionally, different sets of static parameters corresponding to different models of the second circuit board can be distinguished by virtual radio frequency product identification (RF product ID).

[0089] For example, the tool first circuit board supports four models of the second circuit board, i.e., model identification 11, model identification 12, model identification 13, and model identification 14. The tool first circuit board pre-stores in the storage unit static parameters corresponding to the four models of the second circuit board, i.e., virtual RF product ID is 0x3A2C0000, 0x3A2C0400, 0x3A2C0800, and 0x3A2C0C00, respectively. It should be understood that the different sets of static parameters corresponding to different models of the second circuit board can also be distinguished directly by model identification. For example, the tool first circuit board pre-stores in the storage unit static parameter A indicated by model identification 11, static parameter B indicated by model identification 12, static parameter C indicated by model identification 13, and static parameter D indicated by model identification 14.

[0090] Then, if the tool first circuit board reads the model identification of the second circuit board as 11, it can be determined that the tool first circuit board matches the currently connected second circuit board, and the subsequent test steps can be continued. Alternatively, if the tool first circuit board reads the model identification of the second circuit board as 21, it can be determined that the tool first circuit board does not match the currently connected second circuit board, and the test procedure can be ended.

[0091] S303, whether the static parameters currently loaded by the tool first circuit board are appropriate. If the static parameters currently loaded by the tool first circuit board are appropriate, step S305 is performed; if the static parameters currently loaded by the tool first circuit board are not appropriate, step S304 is performed.

[0092] S304, the tool first circuit board replaces appropriate static parameters.

[0093] S305, the second circuit board is tested to obtain second calibration parameters of the second circuit board.

[0094] In some embodiments, the tool first circuit board determines whether it matches the currently connected second circuit board. Then, the tool first circuit board can load static parameters matching the model identification of the current second circuit board to drive the second circuit board to operate, and test each function of the second circuit board during operation to calibrate the currently loaded static parameters and obtain second calibration parameters.

[0095] Exemplarily, as the step S302 exemplified scenario described above, the tool first circuit board reads the model identifier of the second circuit board as 11, and determines that the tool first circuit board matches the currently connected second circuit board. Then, the tool first circuit board can obtain the virtual RF product ID corresponding to the model identifier 11 as 0x3A2C0000, and further loads the static parameters corresponding to the virtual RF product ID 0x3A2C0000, and performs the test process, realizes the calibration of the static parameters, to obtain the second calibration parameters of the second circuit board.

[0096] In another embodiment, before being connected with the current second circuit board, the tool first circuit board can be connected with other model of second circuit board, to obtain the second calibration parameters of the other second circuit board, and in this process, the static parameters matched with the other second circuit board are loaded. Then, after being connected with the new second circuit board and determining that the tool first circuit board matches the new second circuit board, the tool first circuit board can determine whether the currently loaded static parameters are applicable to the new second circuit board. If applicable, the subsequent test process can be performed. If not applicable, the appropriate static parameters can be reloaded.

[0097] Exemplarily, the tool first circuit board loads the static parameters corresponding to the virtual RF product ID 0x3A2C0400 based on the model identifier 12 of the second circuit board, and completes the static parameter calibration of the second circuit board of the current model identifier 12. Subsequently, the tool first circuit board is connected with a new second circuit board, and obtains the model identifier of the new second circuit board as 11. Then, the tool first circuit board can determine that the tool first circuit board matches the currently connected second circuit board, but the currently loaded static parameters are not applicable to the new second circuit board. Then, the tool first circuit board can reload the static parameters corresponding to the virtual RF product ID 0x3A2C0000 according to the model identifier 11, to obtain the second calibration parameters of the second circuit board of the model identifier 11.

[0098] In this way, the tool first circuit board can adaptively load the corresponding static parameters according to the model of the connected second circuit board, realize the flexible execution of the obtaining process of the second calibration parameters of the second circuit board, and obtain more accurate second calibration parameters.

[0099] S306、the second circuit board uploads the second calibration parameters to the server.

[0100] In some embodiments, after obtaining the second calibration parameter, the second circuit board can send the second calibration parameter to the server. Wherein, different second circuit boards are distinguished by the identification of the RFIC installed on the second circuit board, as described above. Then, the RFIC ID can be uploaded to the server together with the second calibration parameter to establish a mapping relationship between the RFIC ID and the second calibration parameter. Wherein, the RFIC ID is the second identification.

[0101] Optionally, the tool first circuit board can read the RFIC ID of the second circuit board. Then, the tool first circuit board can also upload the RFIC ID and the second calibration parameter to the server.

[0102] In some embodiments, the tool first circuit board can obtain the RFIC ID of the second circuit board in the process of obtaining the second calibration parameter, and then the second calibration parameter includes the RFIC ID, and then the second calibration parameter is uploaded to the server. Alternatively, the tool first circuit board can also separately obtain the RFIC ID of the second circuit board, and then upload the second calibration parameter and the RFIC ID to the server.

[0103] In some examples, the tool circuit board can obtain the RFIC ID of the second circuit board through an AT command. Optionally, the SOC of the tool first circuit board is configured with an AT service module, through which an AT command for obtaining the RFIC ID can be sent to the RFIC of the second circuit board. For example, the AT command is "AT^RFICDIEID?".

[0104] In some examples, the RFIC of the second circuit board is configured with eFuse information, which is information of a preset bit length (such as 64 bits) and can be used to identify the RFIC. Then, the eFuse information can be used as the RFIC ID of the second circuit board. Wherein, eFuse is a programmable fuse technology commonly used in integrated circuit (IC) design, mainly used for storing information and protecting chips. eFuse, embedded in the chip manufacturing process through a specific conductive path, can be "blown" or "programmed" by a current pulse, thereby changing its resistance state. The programmed eFuse permanently records this state change. Optionally, the eFuse information is written once and cannot be changed after writing, only read.

[0105] Exemplarily, in response to the received AT command, the RFIC in the second circuit board can obtain the eFuse information (such as the RFIC ID) to feed back the RFIC ID to the RFIC of the first circuit board. Optionally, the feedback statement format of the AT command is, for example, ^RFICDIEID:diesn_in_rfic,CrcFlag,CrcResult. Wherein, diesn_in_rfic represents the RFIC ID. CrcFlag represents whether there is an integrity check parameter (cyclic redundancy check, CRC) of the RFIC. The CRC is a check code for detecting data transmission or storage error, which can be used to detect the integrity of the data. CrcResult represents the CRC check result. Wherein, CrcFlag is empty (such as 0), indicating that no CRC check is needed, and CrcResult can return OK; CrcFlag is 1, indicating that CRC check is needed, and CrcResult can feed back the CRC check result, such as 0 indicating that the CRC check fails, and 1 indicating that the CRC check succeeds. For example, the RFIC feeds back ^RFICDIEID:BA4B2AD346246800,1,1 to the SOC of the second circuit board in response to the AT command, wherein the RFIC ID is BA4B2AD346246800, and the CRC check is successful, and the RFIC ID data is complete.

[0106] Optionally, the electronic device can include multiple RFICs, wherein at least one RFIC is installed on the second circuit board. Then, the feedback statement of the above-mentioned AT command can further include a field for indicating which RFIC the RFIC is. For example, taking the case that the second circuit board includes 2 RFICs as an example, the feedback statement of the AT command includes 2, which can be ^RFICDIEID:rficnum,rfic index0,diesn_in_rfic0,CrcFlag,CrcResult and ^RFICDIEID:rfic num,rfic index1,diesn_in_rfic1,CrcFlag,CrcResult respectively. Wherein, rfic num indicates how many rfic there are currently, and rfic index represents the first RFIC.

[0107] Optionally, the RFIC ID of each RFIC is different, and in the case that the second circuit board includes multiple RFICs, the tool first circuit board can arbitrarily select one of them or select the RFIC ID of the index 0 (or the preset index) as the RFIC ID of the current second circuit board.

[0108] Therefore, in the subsequent assembly process of the actual first circuit board and the second circuit board, the first circuit board can obtain the second calibration parameter uniquely matched with the second circuit board from the server by reading the RFIC ID of the second circuit board, thereby decoupling the unique matching relationship between the first circuit board and the second circuit board in the assembly process of the first circuit board and the second circuit board, and achieving flexible matching of the first circuit board and the second circuit board.

[0109] It should be understood that the second circuit board of the same model is preconfigured with the same static parameter. Therefore, the static parameter does not have uniqueness. Therefore, pre-setting the static parameter into the first circuit board will not affect the flexibility of assembly between the first circuit board and the second circuit board. Moreover, only uploading or downloading the second calibration parameter can also reduce the data transmission amount and improve the data transmission efficiency.

[0110] The process of how the first circuit board identifies the identity of the currently assembled second circuit board to obtain the correct second calibration parameter from the cloud server is described in detail below.

[0111] In some embodiments, the second circuit board is configured with an identification circuit. Optionally, the identification circuit is used to identify the model of the second circuit board. For example, the model of the second circuit board is identified by the gear of the output data of the identification circuit of the second circuit board. In some examples, during the production of the second circuit board, the production line personnel can know the model of the current second circuit board. Therefore, the production line personnel can identify the model of the current second circuit board by adjusting the output data of the identification circuit on the current second circuit board. The specific structure of the identification circuit, adjustment, and the like are described in detail below, and are not repeated here.

[0112] Optionally, the correspondence between the identification circuit output data, the gear, and the model identification is preconfigured.

[0113] Optionally, after the first circuit board and the second circuit board are assembled, the first circuit board can obtain the detection data of the identification circuit. Therefore, the first circuit board can obtain the model identification of the currently connected second circuit board through the detection data.

[0114] Optionally, different detection data corresponds to different model identifications. Alternatively, the detection data located in different preset intervals corresponds to different model identifications. Optionally, the first circuit board stores the correspondence between the detection data and the model identification.

[0115] Exemplarily, as shown in FIG. 4, the second circuit board is configured with an identification circuit, and the first circuit board can obtain the detection data of the identification circuit through the connection relationship between the first circuit board and the identification circuit after the first circuit board is assembled with the second circuit board, thereby obtaining the model identification of the second circuit board.

[0116] Optionally, the first circuit board can load the corresponding static parameters after obtaining the model identifier.

[0117] Optionally, after the first circuit board and the second circuit board are assembled, the first circuit board can read the RFICID of the currently connected second circuit board, i.e., the second identifier. Then, the first circuit board can send a calibration parameter acquisition request to the server, and carry the second identifier in the calibration parameter acquisition request. Correspondingly, the server can obtain the calibration parameter acquisition request sent by the first circuit board, and according to the second identifier carried therein, obtain the second calibration parameter corresponding to the second identifier from the saved multiple calibration parameters. Then, the server can issue the second calibration parameter to the first circuit board. Optionally, after obtaining the second calibration parameter, the first circuit board can save the second calibration parameter through the storage unit, wherein the storage unit also saves the first calibration parameter corresponding to the first circuit board. Optionally, after the first circuit board and the second circuit board are assembled, the first circuit board can send the above AT command to the second circuit board to obtain the RFICID.

[0118] Then, in the subsequent test or use process, after the first circuit board receives the control instruction sent by the control unit, the first calibration parameter or the second calibration parameter saved in the storage unit and the loaded static parameters can be used to trigger the corresponding devices on the first circuit board or the second circuit board to execute the control instruction, so as to realize the corresponding functions of the electronic device. For example, the RFIC and the radio frequency unit B are triggered to execute the corresponding transceiving function.

[0119] That is, in the identity recognition process of the second circuit board, the first circuit board can obtain the identity identifier of the second circuit board, such as the model identifier and the second identifier, through the recognition circuit and the RFIC on the second circuit board.

[0120] Optionally, the control unit can also be used to control the power-on and power-off of the first circuit board or the second circuit board, the generation and writing of the first calibration parameter and the second calibration parameter, the uploading of the second calibration parameter to the cloud server, and the like.

[0121] In this way, through the simple recognition circuit and RFIC ID, the first circuit board can identify the identity of the second circuit board, and download the second calibration parameter adapted to the second circuit board from the server, effectively simplifying the assembly process of the first circuit board and the second circuit board.

[0122] It should be understood that the devices on the first circuit board and the second circuit board shown in FIG. 4 are only exemplary illustrations, and more or fewer devices can also be included on the first circuit board and the second circuit board. Among them, as described above, by the circuit board structure as shown in FIG. 4, the RFIC and part of the radio frequency unit are installed on the second circuit board, which realizes reducing the overall thickness of the first circuit board and reducing the insertion loss of the wiring to improve the transmission and reception performance of the electronic device. It can be understood that more or fewer radio frequency units can be arranged on the second circuit board, and it is not limited to the division mode of the radio frequency unit A and the radio frequency unit B. Among them, by installing the RFIC on the second circuit board, the RFIC is pulled away from the SOC.

[0123] Exemplarily, based on the structure of the first circuit board and the second circuit board shown in FIG. 4 described above, more devices that can be installed on the first circuit board and the second circuit board are introduced by FIG. 5.

[0124] Next, the devices installed on the first circuit board are introduced.

[0125] As shown in FIG. 5, the devices installed on the first circuit board can include, for example: a SOC, a baseband processing unit, a storage unit, a power supply unit 1 corresponding to a power management unit and a battery, a satellite receiving unit corresponding to a radio frequency unit A, a short-distance chip module, and a wireless fidelity (Wi-Fi) / bluetooth (BT) / global positioning system (GPS) transceiver module, an antenna, a clock unit, an identification unit, a first circuit board ID unit, a universal serial bus (USB) unit, and the like.

[0126] Among them, the SOC is used to realize the processing function of the electronic device, such as triggering the devices on the first circuit board and the second circuit board to execute corresponding commands through the first calibration parameter and the second calibration parameter. The SOC can include a baseband processing unit, and the wireless communication function of the electronic device can be realized through an antenna, a baseband processor, and the like.

[0127] A storage unit is configured to store the first calibration parameter, static parameters corresponding to different models of the second circuit board supported, and the like. Optionally, after the first circuit board obtains the second calibration parameter from the cloud server, the storage unit is further configured to store the second calibration parameter. Optionally, the storage unit is further configured to store the correspondence between the first calibration parameter and the second calibration parameter, the correspondence between the first circuit board ID unit, the second circuit board ID unit, and the baseband processing unit ID, and the like. Optionally, the storage unit may, for example, include a double data rate (DDR), a universal flash storage (UFS), and the like.

[0128] A power supply unit 1 is configured to supply power to other devices. For example, the power supply unit 1 can supply power to devices such as the SOC, the clock unit, the short-range chip module, and the storage unit.

[0129] A satellite receiving unit may, for example, be a satellite receiving radio frequency unit. Optionally, the satellite receiving unit may, for example, include devices such as an LNA, a switch, and a filter.

[0130] A short-range chip module is configured to implement functions such as conversion of a radio frequency signal into an analog signal and a digital signal. Optionally, the short-range chip module may, for example, include a short-range RFIC and a baseband.

[0131] A WiFi / BT / GPS transceiver module is a radio frequency front-end module for WiFi, BT, and GPS. Optionally, the WiFi / BT / GPS transceiver module may, for example, include devices such as a filter, a PA, an LNA, and a radio frequency switch.

[0132] An antenna is configured to implement the transceiving function of the first circuit board. Optionally, the first circuit board is provided with a plurality of antennas. For example, the satellite receiving unit is connected with a satellite diversity receiving antenna; and the WiFi / BT / GPS transceiver module is connected with a WiFi / BT / GPS transceiving antenna.

[0133] Optionally, one or more test seats may be further included between the transceiving unit and the antenna or other devices, to simulate various test environments and implement obtaining of calibration parameters. For example, a satellite diversity receiving test seat A is included between the satellite receiving unit and the antenna; a satellite diversity receiving test seat B is included between the satellite receiving unit and an RFIC on the second circuit board; and WiFi transceiving test seat 1 and WiFi / BT transceiving test seat 2 may be included between the WiFi / BT / GPS transceiver module and the antenna.

[0134] A clock unit is configured to provide a reference clock for the system.

[0135] An identification unit is configured to identify information of the first circuit board ID unit and the second circuit board ID unit (on the second circuit board), and send the information to the SOC, so as to facilitate the SOC to determine the identities of the first circuit board and the second circuit board. For example, the identification unit can identify a first identifier of the first circuit board ID unit, and the first identifier points to the first circuit board. For another example, the identification unit can identify a model identifier of the second circuit board ID unit.

[0136] The first circuit board ID unit is configured to identify hardware ID information of the first circuit board.

[0137] The USB unit is configured to realize communication between the control unit and the first circuit board, realize calibration, realize control of power-on and power-off, and the like.

[0138] The devices installed on the second circuit board are described as follows.

[0139] As shown in FIG. 5, the devices installed on the second circuit board may, for example, include an RFIC, a satellite transceiving unit corresponding to the satellite transceiving unit B, a cellular transceiving unit 1, a cellular transceiving unit 2, a cellular transceiving unit 3, a cellular transceiving unit 4, an antenna, a second circuit board ID unit, and a power supply unit 2 corresponding to the power management unit and the battery, and the like.

[0140] The RFIC is configured to process signals of the satellite transceiving unit, the cellular transceiving unit, and the like. Optionally, in the process of downlink communication signal transmission, the RFIC can convert a radio frequency signal into an analog signal and a digital signal. In the process of uplink communication signal processing, the RFIC can convert a digital signal into an analog signal and then into a radio frequency signal.

[0141] The satellite transceiving unit is configured to receive and transmit satellite signals. Optionally, the satellite transceiving unit may, for example, include a switch, a PA, an LNA, a filter, and the like.

[0142] The cellular transceiving unit 1, for example, a first cellular receiving radio frequency unit and a first cellular transmitting radio frequency unit, may, for example, include a PA, an LNA, a radio frequency switch, a filter, a coupler, and the like.

[0143] The cellular transceiving unit 2, for example, a second cellular receiving radio frequency unit, may, for example, include an LNA, a radio frequency switch, a filter, and the like.

[0144] The cellular transceiving unit 3, for example, a third cellular receiving radio frequency unit and a second cellular transmitting radio frequency unit, may, for example, include a PA, an LNA, a radio frequency switch, a filter, a coupler, and the like.

[0145] The cellular transceiving unit 4, for example, a fourth cellular receiving radio frequency unit, may, for example, include an LNA, a radio frequency switch, a filter, and the like.

[0146] Antennas for implementing the transceiving function of the second circuit board. Optionally, multiple antennas are installed on the second circuit board. For example, the satellite transceiving unit is connected with a satellite transmitting antenna and a main set receiving antenna; the cellular transceiving unit 1 is connected with a cellular receiving and transmitting antenna 1; the cellular transceiving unit 2 is connected with a cellular receiving antenna 1; the cellular transceiving unit 3 is connected with a cellular receiving and transmitting antenna 2; and the cellular transceiving unit 4 is connected with a cellular receiving antenna 2.

[0147] Optionally, one or more test seats can be further included between the transceiving unit and the antenna or other devices. For example, the satellite transceiving unit and the satellite transmitting antenna and the main set receiving antenna include a satellite transmitting antenna and a main set receiving test seat. For another example, the cellular transceiving unit 1 and the cellular receiving and transmitting antenna 1 include a cellular receiving and transmitting test seat 1, which can implement the test of transmit (TX) 0 and receive (RX) 0 of the low band (LB), mid & high band (MHB), ultra high band (UHB), and future communication network frequency bands of the cellular. For another example, the cellular transceiving unit 2 and the cellular receiving antenna 1 include a cellular receiving test seat 1, which can implement the test of RX 1 of the LB, MHB, or UHB, and future communication network frequency bands of the cellular. For another example, the cellular transceiving unit 3 and the cellular receiving and transmitting antenna 2 include a cellular receiving and transmitting test seat 2, which can implement the test of TX 1 and RX 2 of the LB, MHB, or UHB, and future communication network frequency bands of the cellular. For another example, the cellular transceiving unit 4 and the cellular receiving antenna 2 include a cellular receiving test seat 2, which can implement the test of RX 3 of the LB, MHB, or UHB, and future communication network frequency bands of the cellular.

[0148] A second circuit board ID unit for identifying the hardware type of the second circuit board. Optionally, the second circuit board ID unit is, for example, an identification circuit as shown in FIG. 4.

[0149] A power supply unit 2 for supplying power to each device installed on the second circuit board.

[0150] Based on the above introduction of each device on the first circuit board and the second circuit board, it can be seen that, based on the mounting mode of each device, the pull-out scheme of the satellite system radio frequency front end and the cellular system radio frequency front end on the electronic device is realized. For example, by mounting the satellite receiving unit on the first circuit board and mounting the satellite transceiver unit on the second circuit board, the pull-out of the satellite system radio frequency front end is realized. For another example, by mounting the SOC and the baseband processing unit (MODEM) and the clock unit on the first circuit board and mounting the RFIC, the cellular transceiver unit 1, the cellular transceiver unit 2, the cellular transceiver unit 3, and the cellular transceiver unit 4 on the second circuit board, the pull-out of the cellular system radio frequency front end relative to the SOC / MODEM is realized.

[0151] In some embodiments, based on the above introduction of the first circuit board and the second circuit board in FIG. 5, the first calibration parameter of the first circuit board may, for example, include the calibration parameter of the clock unit, the satellite receiving unit, and the like, and the second calibration parameter may, for example, include the calibration parameter of the RFIC, the cellular transceiver unit 1, the cellular transceiver unit 2, the cellular transceiver unit 3, and the cellular transceiver unit 4.

[0152] Optionally, after the first calibration parameter is acquired, the first circuit board directly saves the first calibration parameter in the storage unit.

[0153] Optionally, after the second calibration parameter is acquired, the control unit of the second circuit board can control the second circuit board to upload the second calibration parameter to the server. Optionally, in the process of uploading the second calibration parameter, a cyclic redundancy check (CRC) can also be generated, which is a check code for detecting data transmission or storage errors, for example, can be used to detect the integrity of the data. Subsequently, after the control unit of the first circuit board controls the first circuit board to download the second calibration parameter from the server, the integrity of the downloaded second calibration parameter can be detected through the CRC, so as to ensure that the correct second calibration parameter is acquired.

[0154] In some embodiments, different RFICs have different chip IDs. Then, different second calibration parameters can have a corresponding relationship with the chip ID of the RFIC mounted on the current second circuit board. That is, different RFIC IDs (second identifiers) correspond to different second calibration parameters.

[0155] In some examples, after the first circuit board and the second circuit board are assembled, the second calibration parameter of the second circuit board can be downloaded from the server. In addition, the first circuit board can also read the chip ID of the RFIC installed on the second circuit board. The first circuit board can store the second calibration parameter and the chip ID of the RFIC in the storage unit. Then, in the subsequent use of the electronic device, the first circuit board determines whether the second circuit board is replaced by comparing whether the chip ID of the RFIC read from the second circuit board is the same as the chip ID of the RFIC stored in the storage unit, so as to determine whether the second calibration parameter needs to be re-downloaded.

[0156] Exemplarily, in the maintenance scenario, the maintenance detection application can trigger the SOC of the first circuit board to read the chip ID of the RFIC on the second circuit board, so as to trigger the comparison of the chip ID of the RFIC and whether the second calibration parameter needs to be re-downloaded. Then, in the maintenance scenario, more flexible replacement and maintenance of the second circuit board can be realized.

[0157] Exemplarily, in response to the start-up of the electronic device, the SOC of the first circuit board reads the chip ID of the RFIC on the second circuit board, so as to trigger the comparison of the chip ID of the RFIC and whether the second calibration parameter needs to be re-downloaded. In this way, in the use of the electronic device, the possible problems of the second circuit board can also be found in time.

[0158] The above describes the various devices on the first circuit board and the second circuit board, and the functions of the devices. The following describes the identification circuit on the second circuit board and the process of obtaining the static parameters corresponding to the second circuit board based on the identification circuit.

[0159] It should be understood that, in order to simplify the description, the following describes the implementation of various embodiments based on the circuit board structure shown in FIG. 4. The implementation of various embodiments described below can also be applied to the circuit board structure shown in FIG. 5, or the first circuit board and the second circuit board including more or fewer devices.

[0160] In some embodiments, the identification circuit includes one resistor, or a plurality of resistors in parallel and / or in series. Optionally, after the first circuit board and the second circuit board are assembled and powered on, the first circuit board can obtain the detection data of the identification circuit through the SOC, so as to obtain the model identifier of the second circuit board according to the detection data.

[0161] In some examples, the detection data is, for example, voltage data of the identification circuit, or can also be current data of the identification circuit, etc. Optionally, the detection data can also be a digital signal output after analog-to-digital conversion (ADC) of the actual detection data. The ADC can convert an analog signal into a digital signal for processing in a digital device. For example, the detection data can be a voltage analog-to-digital conversion signal (V ADC ) corresponding to the voltage data.

[0162] Hereinafter, the type identification acquisition process of the second circuit board is described in detail taking the detection data as V ADC .

[0163] In some embodiments, according to the number of resistors included in the identification circuit, the resistance values of the resistors, the connection mode, etc., the maximum V ADC that can be achieved is acquired. Then, the range from 0 to the maximum V ADC is evenly divided to acquire a preset number of intervals, and each interval corresponds to a gear, which can be used as the type identification of the second circuit board. For example, in the process of producing the second circuit board, according to the actual V ADC of the identification circuit in the second circuit board, the corresponding gear is matched, and the gear is used as the type identification of the second circuit board.

[0164] Optionally, the identification circuit of the second circuit board can also include a resistor with an adjustable resistance value. Then, after the type of the second circuit board is acquired, the appropriate gear is acquired by adjusting the resistance value of the resistor. For example, the same type or type of second circuit board can correspond to the same gear. Optionally, different gears corresponding to different types are pre-configured. In this way, after the actual type is acquired subsequently, the gear of the current second circuit board can be set by adjusting the resistance value of the resistor in the identification circuit of the second circuit board, and the gear matches the actual acquired type. It should be understood that similar types, for example, include multiple second circuit boards of the same series, and the definition of different types can be adjusted according to the actual production situation.

[0165] In some examples, the storage unit of the first circuit board stores information of each interval and the corresponding gear. In this way, during the actual detection process after the first circuit board and the second circuit board are assembled, the SOC on the first circuit board can match the detected V ADC to the corresponding gear, so as to acquire the type identification of the currently connected second circuit board.

[0166] In some examples, the production process of the first circuit board, the production process of the second circuit board, and the assembly process of the first circuit board and the second circuit board can be three separate processes or any combination of processes, and embodiments of the present application do not limit this. Optionally, in the production process of the first circuit board, the production line personnel configures different V ADC corresponding to the gear for subsequent determination of the model identification of the second circuit board. Optionally, in the production process of the second circuit board, the production line personnel determines the gear of the second circuit board according to the model of the second circuit board, and adjusts the resistance value of the resistance in the identification circuit to make the V ADC output by the identification circuit match the gear. The second circuit board takes the gear as an identification for identifying its own model. Optionally, in the assembly process of the first circuit board and the second circuit board, the first circuit board obtains the V ADC output by the identification circuit in the second circuit board, and then obtains the gear corresponding to the V ADC according to the preset correspondence between different V and gears, to obtain the gear of the current second circuit board, i.e., the model identification. After that, the first circuit board can determine whether the currently connected second circuit board matches according to the model identification. In the case of matching, the first circuit board can load the static parameters corresponding to the model identification. In this way, after downloading the second calibration parameters, the function test of the first circuit board and the second circuit board can be performed based on the already loaded static parameters and the second calibration parameters.

[0167] The model identification process of the second circuit board will be described in detail below by taking two scenarios in which the identification circuit includes two resistors in parallel or three resistors in parallel as examples.

[0168] For example, as shown in FIG. 6, the identification circuit includes two resistors, which are resistors with adjustable resistance values, for changing the detection data of V ADC . For example, changing the voltage data Vx and the voltage data Vy corresponding to the two resistors. Optionally, the possible maximum voltage data is evenly divided into 0-9, a total of 10 gears. Then, by changing the resistance values of resistor 1 and resistor 2, a total of 100 gears, 00-99, can be obtained.

[0169] Optionally, the gears corresponding to different models of the second circuit board are preconfigured.

[0170] Optionally, in the process of producing the second circuit board, the required gear can be determined according to the obtained model of the second circuit board. Then, by adjusting the resistance value of at least one of the resistors R1 and R2, the V ADC output by the identification circuit can meet the gear requirement. After that, based on the preset V ADCcorresponding relationship between the gear and the resistance value of at least one of the resistors R1 and R2, so that the actual V ADC corresponding to the gear of the second circuit board. It should be understood that in some scenarios, the resistors R1 and R2 do not need to be adjusted to output a suitable V ADC from the identification circuit. Then, the resistors R1 and R2 do not need to be adjusted by the production line personnel.

[0171] As shown in FIG. 6, the current radio frequency unit B includes a PA and the like, and is used as an example to illustrate the configuration process of the model identifier of the second circuit board. As described above, the radio frequency unit B can also include other devices. Then, the current FIG. 6 shows a radio frequency transmitting unit zoom-out scenario, which realizes zoom-out or separation of the transmitting path.

[0172] Optionally, in the assembly process, after the first circuit board and the second circuit board are assembled and powered on, the SOC of the first circuit board can detect the V ADC output by the identification circuit of the second circuit board through the identification unit. Then, the first circuit board can obtain the model identifier of the currently assembled second circuit board according to the V ADC , so as to load the corresponding static parameters based on the model identifier. In addition, the first circuit board can also read the second identifier (such as RFIC ID) of the second circuit board, and obtain the second calibration parameters of the second circuit board from the server based on the second identifier. Then, the first circuit board can perform testing, use, and the like of the first circuit board and the second circuit board according to the first calibration parameters of the first circuit board and the obtained static parameters and second calibration parameters.

[0173] Optionally, the SOC of the first circuit board triggers detection of the V ADC output by the identification circuit of the second circuit board through the identification unit. In the case that both of the two V ADC are less than a preset minimum voltage value (such as 100 millivolts), the first circuit board can determine that the current second circuit board is not connected, or the second circuit board does not configure the identification circuit, that is, the second circuit board does not have the adaptive matching function with the first circuit board. Then, the first circuit board can perform the subsequent test process according to the case without the second circuit board. For example, the baseband processing unit (modem) in the SOC can realize self-starting without the radio frequency board (i.e., the second circuit board), so as to ensure that there is no problem such as standby current abnormality caused by abnormal modem in the test scenario, or the first circuit board does not start, and the like.

[0174] As an example, as shown in FIG. 7, the identification circuit includes three resistors, which are resistors with adjustable resistance values, used to change the V ADCFor example, the three resistors correspond to voltage data Vx, voltage data Vy and voltage data Vz respectively. Optionally, the 0 to the maximum possible voltage data is evenly divided into 10 levels, i.e. 0-9. Then, by changing the resistance values of the resistor 1, the resistor 2 and the resistor 3, 1000 levels, i.e. 000-999, can be obtained.

[0175] Optionally, different models of the second circuit board are pre-configured with corresponding levels.

[0176] Optionally, during the production of the second circuit board, the required level can be determined according to the obtained model of the second circuit board. Then, by adjusting the resistance value of at least one of the resistor 1, the resistor 2 and the resistor 3, the V ADC satisfying the level requirement can be output by the identification circuit. Then, based on the preset correspondence between the V ADC and the level, by adjusting the resistance value of at least one of the resistor 1, the resistor 2 and the resistor 3, the actual V ADC output by the identification circuit matches the level of the second circuit board. It should be understood that in some scenarios, the resistance values of the resistor 1, the resistor 2 and the resistor 3 do not need to be adjusted, and the identification circuit can also output the appropriate V ADC . Then, the production line personnel can also not need to adjust the resistance values of the resistor 1, the resistor 2 and the resistor 3.

[0177] As shown in FIG. 7, the current radio frequency unit B includes an LNA and the like, and is used as an example to illustrate the model identification configuration process of the second circuit board. As described above, the radio frequency unit B can also include other devices. Then, the current FIG. 7 shows a receiving unit zoom-out scenario, which realizes zoom-out or separation of the receiving path.

[0178] Optionally, after the first circuit board and the second circuit board are assembled and powered on in the assembly process, the SOC of the first circuit board can detect the V ADC output by the identification circuit of the second circuit board through the identification unit. Then, the first circuit board can obtain the model identification of the currently assembled second circuit board according to the V ADC , so as to load the corresponding static parameters based on the model identification. In addition, the first circuit board can also read the second identification (such as RFIC ID) of the second circuit board, and obtain the second calibration parameters of the second circuit board from the server based on the second identification. Then, the first circuit board can perform testing, use and the like of the first circuit board and the second circuit board according to the first calibration parameters of itself and the obtained static parameters and second calibration parameters.

[0179] Optionally, the SOC of the first circuit board triggers the detection of the V ADC output by the identification circuit of the second circuit board through the identification unit, and the three-way V ADCIn the case that the first voltage and the second voltage are both less than a preset minimum voltage value (e.g., 100 millivolts), the first circuit board can determine that the second circuit board is not currently connected, or that the second circuit board does not have a recognition circuit configured, i.e., the second circuit board does not have the self-adaptive matching function with the first circuit board. Then, the first circuit board can perform a subsequent test process according to the case without the second circuit board. For example, a baseband processing unit (modem) in the SOC can realize self-starting without a radio frequency board (second circuit board), so as to ensure that there is no standby current caused by modem abnormalities in the test scenario, and the first circuit board does not start and the like.

[0180] The above describes the configuration process of the recognition circuit on the second circuit board in the production process of the second circuit board. The following describes in detail the process of the first circuit board obtaining the static parameters in the assembly process.

[0181] In some embodiments, after the first circuit board and the second circuit board are assembled, it is necessary to ensure that all related trigger / response (TR) paths (or described as channels, etc.) on the first circuit board and the second circuit board can correctly cooperate and work. Then, the first circuit board needs to be pre-configured with TR path matching parameters, which can also be described as static parameters, to realize the correct cooperation and work of the first circuit board and the second circuit board. Optionally, the TR path matching parameters, for example, include radio frequency specifications, radio frequency power, radio frequency path information, power supply configuration, and the like. Among them, the matching parameter generally refers to a parameter setting used for configuration and adjustment of functions in a system or device, and the matching parameter can affect the performance, compatibility and function implementation of the device.

[0182] In some examples, the modem in the SOC on the first circuit board can support a plurality of static parameters. Then, limited by the types of static parameters supported by the modem, the number of static parameters matched by the first circuit board is limited. It should be understood that with the development of electronic technology, the types of static parameters supported by the modem will also increase, or will no longer be limited, and the following is only an exemplary description.

[0183] In some examples, different static parameters can support different normal operations of the second circuit board. Among them, different models of the second circuit board refer to different configuration contents such as the model of the device installed on the second circuit board.

[0184] Optionally, different models of the second circuit board are indicated by different model identifiers, different static parameters stored in the first circuit board are pointed by different virtual RF product IDs, and the SOC in the first circuit board can drive the devices on the second circuit board to operate by the static parameters. Then, the model identifiers have a corresponding relationship with the virtual RF product IDs. For example, after the first circuit board is connected with the second circuit board, the first circuit board can acquire the model identifier of the second circuit board, then determine the virtual RF product ID corresponding to the model identifier, and further acquire the static parameters indicated by the virtual RF product ID, so as to drive the devices on the currently connected second circuit board to operate by the static parameters.

[0185] It should be understood that the first circuit board distinguishes different models of the second circuit board by the output data of the identification circuit installed on the second circuit board. In order to reduce the design difficulty of the identification circuit, different second circuit boards are generally not directly distinguished by relatively complex virtual RF product IDs, but are distinguished by creating relatively simple model identifiers. Then, without considering the design difficulty of the identification circuit, different second circuit boards can also be directly distinguished by virtual RF product IDs. Then, after the first circuit board is assembled with the second circuit board, the first circuit board can acquire the output data of the identification circuit, determine the virtual RF product ID, and thus directly acquire the static parameters indicated by the virtual RF product ID. Optionally, different static parameters can also be directly distinguished by model identifiers. For example, the first circuit board stores static parameters directly indicated by different model identifiers. Then, after the first circuit board is connected with the second circuit board, the first circuit board can acquire the model identifier of the second circuit board, then determine the static parameters indicated by the model identifier, and drive the devices on the currently connected second circuit board to operate by the static parameters. That is, without the conversion step of the model identifier and the virtual RF product ID, the static parameters can also be acquired.

[0186] Optionally, different virtual RF product IDs correspond to different sets of static parameters, and each set of static parameters includes at least one static parameter. Optionally, the storage unit of the first circuit board stores the static parameters corresponding to different virtual RF product IDs. For example, as shown in Table 1 below, the first identification of the first circuit board ID unit indicates the first circuit board, and the model identification of the second circuit board ID unit indicates the model of the second circuit board. Different model identifications correspond to different virtual RF product IDs. Then, after the first circuit board identifies the model identification of the second circuit board through the identification circuit, the first circuit board can obtain the virtual RF product ID corresponding to the model identification, and the static parameters indicated by the virtual RF product ID are the static parameters supported by the current second circuit board. In addition, the first circuit board can download the second calibration parameters of the second circuit board from the server by reading the RFIC ID of the second circuit board. Then, the first circuit board can load the second calibration parameters and the static parameters indicated by the virtual RF product ID, thereby realizing flexible parameter calibration and testing.

[0187] Alternatively, after the first circuit board identifies the model identification of the second circuit board through the identification circuit, the first circuit board fails to obtain the virtual RF product ID corresponding to the model identification. Then, the first circuit board can determine that it does not support the currently assembled second circuit board, and triggers an error to realize error-proofing or poka-yoke, thereby avoiding assembling the first circuit board and the second circuit board that cannot be used. Error-proofing refers to taking measures in system design to prevent users or production line personnel from causing problems due to errors or negligence. Error-proofing can be ensured by design and process control to prevent errors from occurring or being discovered and corrected in time, thereby improving the reliability and accuracy of the system.

[0188] Optionally, the storage unit in the first circuit board stores the virtual RF product ID and the corresponding static parameters.

[0189] For example, the first identification of the first circuit board ID unit of the first circuit board is 18234, and the model identification of the second circuit board ID unit of the second circuit board identified by the first circuit board is 24. As shown in Table 1 below, the first circuit board can obtain the virtual RF product ID corresponding to the model identification 24 as 0x3A3C0C00. Then, the first circuit board can load the static parameters corresponding to 0x3A3C0C00, and download the second calibration parameters corresponding to the RFIC ID of the second circuit board from the server. After that, the first circuit board can test and calibrate the functions of the first circuit board and the second circuit board through the static parameters and the second calibration parameters.

[0190] For example, the first circuit board ID unit of the first circuit board indicates a first identification of 18233, and the second circuit board ID unit of the second circuit board identified by the first circuit board indicates a model identification of 24. As shown in Table 1 below, the first circuit board cannot obtain the virtual RF product ID corresponding to the current model identification. Then, the first circuit board can report an error.

[0191] Table 1

[0192] In this way, flexible second calibration parameter downloading and local static parameter loading are used to realize flexible matching of the first circuit board and the second circuit board and improve production line generation efficiency.

[0193] In some embodiments, during production of the first circuit board and the second circuit board, the first circuit board can obtain the first calibration parameter of the first circuit board by connecting the tool second circuit board, and the second circuit board can obtain the second calibration parameter of the second circuit board by connecting the tool first circuit board. Optionally, the tool first circuit board is a tool board used for testing the second circuit board, and the tool second circuit board is a tool board used for testing the first circuit board. During the calibration parameter (such as the first calibration parameter or the second calibration parameter) acquisition process, the devices on the tool circuit board (such as the first tool circuit board or the second tool circuit board) can also generate corresponding signal loss, and the devices on different tool circuit boards generate different signal loss. Then, if the signal loss of the tool circuit board is also regarded as the signal loss of the devices on the connected circuit board, the accuracy of the calibration parameter will be obviously affected. Therefore, the calibration parameter can be more accurately obtained by decoupling the signal loss of the devices on the two connected circuit boards.

[0194] In some examples, the signal loss of a device is indicated by a gain. The gain is a concept commonly used in the field of electronics and communications, which represents the ratio between the input signal and the output signal. The gain measures the amplification capability of a system or component on a signal. The gain can be voltage gain, power gain, etc., which is different according to the application.

[0195] In some examples, the RF gain is detected by adding an RF test seat on the circuit board.

[0196] In some examples, referring to the related content of FIG. 5 above, the RF test seat is added between the RF device and other devices to simulate multiple test environments. Then, the connection or disconnection of the corresponding path can be realized by the engagement or disengagement of the switch of the RF test seat, so as to realize the acquisition of the gain of the corresponding RF device.

[0197] Exemplarily, as shown in FIG. 8, the satellite receiving unit is configured on the first circuit board, and the satellite diversity receiving RF test seat A is included between the satellite receiving unit and the antenna; the satellite diversity receiving RF test seat B is included between the satellite receiving unit and the RFIC on the second circuit board. Optionally, in the case that only the RF test seat A is turned on (or described as the RF test seat B is turned off), the SOC on the first circuit board can obtain the board gain Gain_A of the satellite receiving unit and the RFIC; in the case that the RF test seat A and the RF test seat B are both turned on, the SOC on the first circuit board can obtain the gain Gain_B of the satellite receiving unit. Then, the SOC on the first circuit board can determine the gain Gain_B of the satellite receiving unit, and the gain of the RFIC is Gain_A-Gain_B.

[0198] In this way, the decoupling of the calibration parameters of the RFIC and the FEM is realized through the RF test seat A and the RF test seat B, the accuracy of obtaining the first calibration parameter and the second calibration parameter is improved, so as to ensure the accuracy of the subsequent function implementation after the flexible assembly of the first circuit board and the second circuit board.

[0199] The structure of the first circuit board and the second circuit board, and the obtaining process of the static parameter and the second calibration parameter are introduced above, and the flexible matching process of the first circuit board and the second circuit board in the assembly process is introduced in detail below. As shown in FIG. 9, the process can include the following steps.

[0200] S901, power-on initialization.

[0201] In some embodiments, after the assembly of the first circuit board and the second circuit board in the assembly process, the first circuit board and the second circuit board can be triggered to power on and enter the initialization process.

[0202] Optionally, in the initialization process, the first circuit board can load test software to trigger the subsequent test process.

[0203] S902, the first circuit board judges whether the second circuit board is in place. In the case that the first circuit board judges that the second circuit board is in place, step S904 is executed; in the case that the first circuit board judges that the second circuit board is not in place, step S903 is executed.

[0204] S903, the first circuit board enters the single mainboard start mode, tests the first circuit board, and stores the test result.

[0205] In some embodiments, the first circuit board and the second circuit board can be abnormally assembled, or the first circuit board can also not assemble the second circuit board. That is, the second circuit board is not in place. Then, the first circuit board can trigger different test processes according to whether the second circuit board is in place.

[0206] Optionally, the first circuit board can determine whether the second circuit board is in place through the test software. If the second circuit board is in place, the first circuit board can trigger the dual-board start mode to test the first circuit board and the second circuit board through the following steps. If the second circuit board is not in place, the first circuit board can trigger the single-mainboard start mode to perform a separate function test on the first circuit board and obtain and store the corresponding test results.

[0207] It should be understood that the first circuit board can perform each step in the current process through the SOC. Optionally, the first circuit board receives and executes the control commands sent by the control unit through the SOC to implement each step in the current process. Details are not described herein again.

[0208] S904, the first circuit board determines whether the first circuit board and the second circuit board are matched. In the case that the first circuit board and the second circuit board are matched, step S905 is performed; in the case that the first circuit board and the second circuit board are not matched, the test is ended.

[0209] In some embodiments, in the case that the first circuit board determines that the second circuit board is in place, the first circuit board can read the output data of the identification circuit on the second circuit board to obtain the corresponding detection data. Then, the first circuit board can match the corresponding gear according to the detection data to obtain the model identifier of the second circuit board. Then, the first circuit board can determine whether the static parameters currently loaded in the first circuit board correspond to the model identifier. For example, the first circuit board determines whether the first circuit board currently supports the operation of the device on the currently connected second circuit board to determine whether the first circuit board and the second circuit board are matched.

[0210] If the first circuit board and the second circuit board are not matched, the first circuit board cannot support the operation of the device on the currently connected second circuit board, and thus cannot perform the subsequent test on the second circuit board. Then, the first circuit board can end the test process. Optionally, the first circuit board can prompt the production line personnel that the currently connected two circuit boards are not matched.

[0211] If the first circuit board and the second circuit board are matched, the first circuit board can support the operation of the device on the currently connected second circuit board, and thus can perform the subsequent test process.

[0212] S905, whether the static parameters currently loaded in the first circuit board are appropriate. In the case that the static parameters currently loaded in the first circuit board are appropriate, step S906 is performed; in the case that the static parameters currently loaded in the first circuit board are not appropriate, the test is ended.

[0213] In some embodiments, the first circuit board can have loaded the static parameters during the production process. Then, after the first circuit board is connected with the second circuit board, the first circuit board can determine whether the currently loaded static parameters are suitable for the model of the second circuit board. For example, during the process of determining whether the first circuit board and the second circuit board match, the first circuit board has obtained the model identification of the second circuit board. Then, the first circuit board can determine whether the currently loaded static parameters are suitable by determining whether the model identification matches the virtual RF product ID of the currently loaded static parameters. If the currently loaded static parameters are suitable, the first circuit board can continue to perform the test process. If the currently loaded static parameters are not suitable, the first circuit board can end the test process.

[0214] Optionally, during the production process of the first circuit board, the first circuit board is connected with a tool second circuit board to obtain the first calibration parameters of the first circuit board. During this process, the first circuit board loads the corresponding static parameters. Then, subsequently, after reaching the assembly process, the first circuit board has already loaded the static parameters.

[0215] In some embodiments, the first circuit board supports multiple models of the second circuit board. Then, in the case that the first circuit board determines that the currently loaded static parameters are not suitable, if the first circuit board matches the second circuit board, the first circuit board can also load suitable static parameters to perform the subsequent test process.

[0216] In some embodiments, the first circuit board can not load (e.g., unload) the static parameters after completing the test during the production process. Then, subsequently, during the assembly process, the first circuit board can load the static parameters suitable for the currently matched second circuit board to perform the subsequent test process.

[0217] S906, the first circuit board downloads the second calibration parameters of the second circuit board from the server.

[0218] In some embodiments, after the first circuit board is connected with the second circuit board, the first circuit board can read the identification of the RFIC on the second circuit board, such as the RFIC ID. The RFIC ID is a unique identification of the second circuit board. For example, the RFIC ID is the second identification. Then, the first circuit board can send the second identification to the server to download the second calibration parameters corresponding to the second identification from the server.

[0219] Exemplarily, the SOC in the first circuit board sends an AT command "AT^RFICDIEID?" to the second circuit board. In response to the AT command, the second circuit board feeds back "^RFICDIEID: 1, 0, BA4B2AD346246800, 1, 1" to the SOC of the first circuit board. Then, the SOC of the first circuit board can obtain the RFIC ID of the second circuit board as BA4B2AD346246800, and download the second calibration parameter from the server based on the RFIC ID.

[0220] Optionally, the first circuit board can also load the second calibration parameter after downloading the second calibration parameter.

[0221] Optionally, the second calibration parameter is a tested calibration parameter uploaded in the process of producing the second circuit board.

[0222] It should be understood that the embodiments of the present application do not limit the execution order between the step S904, the step S905 and the step S906. That is, the first circuit board can load the static parameter first, and then download the second calibration parameter; the first circuit board can also download the second calibration parameter first, and then load the static parameter; or the first circuit board can load the static parameter and download the second calibration parameter at the same time.

[0223] S907, the first circuit board performs a test on the first circuit board and the second circuit board.

[0224] In some embodiments, the first circuit board can perform a function test on the first circuit board and the second circuit board based on the static parameter and the second calibration parameter after loading the static parameter and the second calibration parameter.

[0225] In this way, by uploading the second calibration parameter to the server, the decoupling of the first circuit board and the second circuit board is realized, and a more flexible assembly process of the first circuit board and the second circuit board is realized.

[0226] FIG. 10 is a flow diagram of a circuit board matching method provided by an embodiment of the present application. It should be noted that the method is not limited to the specific order described in FIG. 10 and the following, and it should be understood that in other embodiments, the order of some steps of the method can be exchanged according to actual needs, or some steps of the method can be omitted or deleted. The method includes the following steps:

[0227] S1001, the SOC obtains the RFIC identifier of the second circuit board through the communication connection, and downloads the second calibration parameter of the second circuit board from the server based on the RFIC identifier.

[0228] The circuit board matching method provided in the embodiments of the present application is applied to a radio remote electronic device. Optionally, the radio remote electronic device comprises a first circuit board and a second circuit board. The first circuit board is provided with a SOC, an identification unit and a storage unit, and the storage unit stores a first static parameter for driving the second circuit board and a first calibration parameter of the first circuit board. The second circuit board is provided with an RFIC and an identification circuit. Optionally, the first circuit board and the second circuit board are in communication connection.

[0229] Exemplarily, as shown in FIG. 4, the first circuit board is provided with a SOC, an identification unit and a storage unit, and the second circuit board is provided with an RFIC and an identification circuit. Optionally, the RFIC is installed on the second circuit board to realize radio remote of the RFIC relative to the SOC. Optionally, the identification of the RFIC is a unique identification of the second circuit board, and the first circuit board can acquire a second calibration parameter of the second circuit board from a server based on the unique identification.

[0230] For example, the SOC on the first circuit board acquires an RFIC ID fed back by the RFIC on the second circuit board by sending an AT command to the RFIC, and the RFIC ID is a unique identification of the second circuit board, such as a second identification. Then, the SOC on the first circuit board can request the server to download the second calibration parameter corresponding to the second identification based on the second identification. The SOC can send the second identification to the server through a radio unit on the first circuit board and receive the second calibration parameter issued by the server through the radio unit. Optionally, before the first circuit board and the second circuit board are assembled, the second circuit board can be connected to a tool first circuit board, and the tool first circuit board can acquire the second calibration parameter and the second identification of the second circuit board by testing the second circuit board, and upload the second calibration parameter and the second identification to the server, so that any first circuit board that establishes a communication connection with the second circuit board in the future can download the second calibration parameter based on the second identification.

[0231] In this way, the second calibration parameter of the second circuit board is uploaded to the server without being saved in the storage unit of the first circuit board, thereby breaking the strong binding relationship between the first circuit board and the matched second circuit board. Subsequently, the first circuit board only needs to download the second calibration parameter corresponding to the second circuit board assembled currently from the server after the first circuit board is assembled with the second circuit board, and normal operation of the devices on the first circuit board and the second circuit board can also be realized. In this way, the first circuit board and the second circuit board can be randomly assembled in the assembly link, thereby effectively reducing the production and maintenance costs of the production line.

[0232] In some embodiments, the first circuit board is provided with a first radio unit, and the second circuit board is provided with a second radio unit.

[0233] Exemplarily, as shown in FIG. 4, the first circuit board is provided with the radio frequency unit A, and the second circuit board is provided with the radio frequency unit B.

[0234] In this way, the RFIC and part of the radio frequency unit are mounted on the second circuit board, so as to reduce the overall thickness of the first circuit board and reduce the insertion loss of the wire, thereby improving the transmitting and receiving performance of the electronic device.

[0235] In some embodiments, the first radio frequency unit comprises a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit comprises a satellite transceiving unit and / or a cellular transceiving unit.

[0236] Exemplarily, as shown in FIG. 5, the first circuit board is provided with a satellite receiving unit and a short-range chip module (capable of realizing short-range transceiving function) connected with a WiFi / BT / GPS transceiving module. The second circuit board is provided with a satellite transceiving unit and a cellular transceiving unit.

[0237] In this way, by separating the RFIC from the SOC and moving the RFIC and the radio frequency unit B to a position closer to the second circuit board where the cellular antenna is moved, the thickness of the first circuit board can be reduced, and the insertion loss of the wire and the complexity of the antenna layout on the first circuit board can also be reduced.

[0238] In some examples, the first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

[0239] In some examples, the first radio frequency unit is connected with a satellite diversity receiving antenna, and the second radio frequency unit is connected with a satellite transmitting antenna and a main diversity receiving antenna.

[0240] In this way, by mounting the satellite receiving unit on the first circuit board and mounting the satellite transceiving unit on the second circuit board, the satellite system radio frequency front end is pulled away.

[0241] S1002, the identification unit obtains the output data of the identification circuit through the communication connection, and obtains the model identifier of the second circuit board based on the output data.

[0242] In some embodiments, the identification circuit comprises a plurality of resistors, and correspondingly, the output data is voltage data or current data. The storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identifier of the second circuit board.

[0243] In some examples, the model identifier is used to indicate the model of the second circuit board, the model identifiers of a plurality of second circuit boards of the same model are the same, and correspond to the same target static parameter.

[0244] Exemplarily, as shown in FIG. 6, the identification circuit comprises two resistors, and the two resistors are adjustable resistors, which are used to change the voltage V ADCThe output data of the identification circuit corresponds to the detection data of the identification unit. For example, the voltage data Vx and the voltage data Vy corresponding to the two resistors are changed. Optionally, the 0-9 total of 10 grades are evenly divided from 0 to the maximum possible voltage data. Then, by changing the resistance values of the resistors 1 and 2, 00-99 total of 100 grades can be obtained.

[0245] Optionally, the grades corresponding to different models of the second circuit board are pre-configured. Then, during the debugging of the second circuit board, according to the model of the second circuit board, by adjusting the resistance values of the resistors in the identification circuit, the output data indicating the current model can be obtained. Then, after obtaining the resistance value that can indicate the current model, it can be determined that the debugging of the identification circuit is completed. Subsequently, after the first circuit board and the second circuit board are assembled, the output data of the identification circuit is read by the identification unit, and the model of the currently assembled second circuit board is also determined.

[0246] In this way, by configuring the identification circuit in the second circuit board, after the subsequent flexible assembly of the first circuit board and the second circuit board, the model of the currently assembled second circuit board can be determined, so as to load the appropriate static parameters, and meet the needs of flexible assembly between circuit boards.

[0247] S1003, in the case that the first static parameter matches the model identifier, the SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter.

[0248] In some embodiments, in the case that the first static parameter matches the model identifier, the SOC loads the first static parameter and the second calibration parameter. Alternatively, in the case that the first static parameter matches the model identifier and the SOC has already loaded the first static parameter, the SOC loads the second calibration parameter.

[0249] In some examples, the first static parameter includes a plurality of groups of static parameters. The SOC obtains a target static parameter matching the model identifier from the first static parameter, and loads the target static parameter.

[0250] In other examples, the first static parameter includes a plurality of groups of static parameters. The SOC determines that none of the plurality of groups of static parameters matches the model identifier, and triggers the radio remote electronic device to report an error.

[0251] For example, the first circuit board can have loaded the static parameters during the production process. Then, after the first circuit board is connected with the second circuit board, it can be determined whether the currently loaded static parameters are suitable for the model of the second circuit board. For example, the first circuit board can determine whether the currently loaded static parameters are suitable by determining whether the obtained model identifier matches the virtual RF product ID of the currently loaded static parameters. If the currently loaded static parameters are suitable, the first circuit board can continue to perform the test process. If the currently loaded static parameters are not suitable, the target static parameters stored in the first static parameters that match the model identifier of the current second circuit board can also be reloaded to perform the subsequent test process. If all the static parameters stored in the storage unit of the first circuit board do not match the model identifier, it can be determined that the first circuit board does not match the second circuit board, and the first circuit board can save and prompt the user to replace the second circuit board.

[0252] In this way, the first circuit board can adaptively load the corresponding static parameters according to the model of the connected second circuit board, realizing flexible circuit board assembly.

[0253] In some embodiments, the first circuit board is provided with a first test seat and a second test seat, the first test seat is connected with the first antenna and the satellite receiving unit on the first circuit board, and the second test seat is connected with the satellite receiving unit and the RFIC on the second circuit board. When the first test seat is turned on, the SOC obtains a first gain generated by the satellite receiving unit and the RFIC together. When both the first test seat and the second test seat are turned on, the SOC obtains a second gain generated by the satellite receiving unit. The third gain generated by the RFIC is the difference between the first gain and the second gain.

[0254] For example, as shown in FIG. 8, the first circuit board is provided with a satellite receiving unit, and includes a satellite diversity receiving RF test seat A between the satellite receiving unit and the antenna, and a satellite diversity receiving RF test seat B between the satellite receiving unit and the RFIC on the second circuit board. Optionally, when only the RF test seat A is turned on (or described as the RF test seat B is turned off), the SOC on the first circuit board can obtain the whole-board gain Gain_A of the satellite receiving unit and the RFIC. When both the RF test seat A and the RF test seat B are turned on, the SOC on the first circuit board can obtain the gain Gain_B of the satellite receiving unit. Then, the SOC on the first circuit board can determine the gain Gain_B of the satellite receiving unit and the gain of the RFIC as Gain_A-Gain_B.

[0255] It should be understood that the first test seat and the second test seat are used to obtain more accurate circuit board calibration parameters during the production process of the circuit board.

[0256] In this way, the first test seat and the second test seat realize decoupling of the RFIC and the calibration parameters of the radio frequency front-end module, improve the accuracy of obtaining the first calibration parameter and the second calibration parameter, and ensure the accuracy of subsequent flexible assembly of the first circuit board and the second circuit board.

[0257] Next, taking the electronic device 100 as a folding screen mobile phone as an example, the hardware structure of the electronic device is introduced.

[0258] For example, FIG. 11 shows a structural schematic diagram of the electronic device 100.

[0259] The electronic device 100 can include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a sensor module 180, a key 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc.

[0260] It can be understood that the structure shown in the embodiments of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 can include more or fewer components than shown, or combine certain components, or split certain components, or different component arrangements. The components shown can be implemented in hardware, software, or a combination of software and hardware.

[0261] The processor 110 can include one or more processing units, for example: the processor 110 can include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units can be independent devices, or can be integrated into one or more processors.

[0262] The controller can generate operation control signals according to the instruction operation code and the timing signal, and complete the control of fetching and executing instructions.

[0263] The processor 110 can also be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory can store instructions or data that have just been used or recycled by the processor 110. If the processor 110 needs to use the instructions or data again, it can be directly called from the memory. This avoids repeated access and reduces the waiting time of the processor 110, thereby improving the efficiency of the system.

[0264] The wireless communication function of the electronic device 100 can be realized by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor, and the baseband processor, etc.

[0265] The antenna 1 and the antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in the electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization rate of the antennas. For example, the antenna 1 can be multiplexed as a diversity antenna of a wireless local area network. In some other embodiments, the antennas can be used in combination with tuning switches.

[0266] The mobile communication module 150 can provide a solution including 2G / 3G / 4G / 5G wireless communication applied to the electronic device 100. The mobile communication module 150 can include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, and perform filtering, amplification, etc. on the received electromagnetic waves, and transmit them to the modem processor for demodulation. The mobile communication module 150 can also amplify the signals modulated by the modem processor, and convert them into electromagnetic waves radiated by the antenna 1. In some embodiments, at least part of the functional modules of the mobile communication module 150 can be arranged in the processor 110. In some embodiments, at least part of the functional modules of the mobile communication module 150 and at least part of the modules of the processor 110 can be arranged in the same device.

[0267] The modem processor can include a modulator and a demodulator. The modulator is configured to modulate a low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is configured to demodulate a received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. The low-frequency baseband signal processed by the baseband processor is transmitted to the application processor. The application processor outputs an audio signal through an audio device, or displays an image or video through the display screen 194. In some embodiments, the modem processor can be a separate device. In other embodiments, the modem processor can be independent of the processor 110, and can be disposed in the same device as the mobile communication module 150 or other functional modules.

[0268] The wireless communication module 160 can provide wireless communication solutions including wireless local area networks (WLAN) (e.g., wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR) technology, and the like, which are applied to the electronic device 100. The wireless communication module 160 can be one or more devices that integrate at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, performs frequency modulation and filtering processing on the electromagnetic wave signal, and transmits the processed signal to the processor 110. The wireless communication module 160 can also receive a signal to be transmitted from the processor 110, perform frequency modulation and amplification, and radiate the signal as an electromagnetic wave via the antenna 2.

[0269] In some embodiments, the antenna 1 and the mobile communication module 150 of the electronic device 100 are coupled, and the antenna 2 and the wireless communication module 160 are coupled, so that the electronic device 100 can communicate with a network and other devices through wireless communication technology. The wireless communication technology can include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology, etc. The GNSS can include a global positioning system (GPS), a global navigation satellite system (GLONASS), a beidou navigation satellite system (BDS), a quasi-zenith satellite system (QZSS), and / or a satellite based augmentation systems (SBAS).

[0270] The internal memory 121 can be used to store computer executable program codes including instructions. The internal memory 121 can include a program storage area and a data storage area. The program storage area can store an operating system, at least one application required for a function (such as a sound play function, an image play function, etc.), etc. The data storage area can store data created during the use of the electronic device 100 (such as audio data, a phonebook, etc.), etc. In addition, the internal memory 121 can include a high-speed random access memory, and can further include a non-volatile memory such as at least one of a magnetic disk storage device, a flash memory device, a universal flash storage (UFS), etc. The processor 110 performs various function applications and data processing of the electronic device 100 by executing instructions stored in the internal memory 121 and / or instructions stored in a memory disposed in the processor.

[0271] In some embodiments, multiple embodiments of the present application can be combined, and the combined embodiments can be implemented. Optionally, some operations in the flow of each method embodiment are optionally combined, and / or the order of some operations is optionally changed. Also, the execution order between steps of each flow is only exemplary, and does not constitute a limitation on the execution order between the steps, and other execution orders between the steps can also be used. The described execution order is not intended to indicate that these operations can only be executed in this order. A person of ordinary skill in the art will think of various ways to reorder the operations described herein. In addition, it should be pointed out that the process details involved in some embodiments herein are also applicable in a similar manner to other embodiments, or different embodiments can be combined for use.

[0272] In addition, some steps in the method embodiments can be equivalently replaced by other possible steps. Alternatively, some steps in the method embodiments can be optional, and can be deleted in some use scenarios. Alternatively, other possible steps can be added to the method embodiments.

[0273] Also, each method embodiment can be implemented individually, or in combination.

[0274] The embodiments of the present application also provide a chip system, comprising: a processor, the processor being coupled with a memory, the memory being used to store programs or instructions, when the programs or instructions are executed by the processor, the chip system implements the method in any one of the above method embodiments.

[0275] Optionally, the processor in the chip system can be one or more. The processor can be implemented by hardware or software. When implemented by hardware, the processor can be a logic circuit, an integrated circuit, etc. When implemented by software, the processor can be a general-purpose processor, which is implemented by reading software codes stored in the memory.

[0276] Optionally, the memory in the chip system can also be one or more. The memory can be integrated with the processor, or can be separately arranged from the processor, and the embodiments of the present application are not limited. Exemplarily, the memory can be a non-transient processor, for example, a read-only memory (ROM), which can be integrated on the same chip as the processor, or can be separately arranged on different chips, and the embodiments of the present application do not make specific limitations on the type of the memory and the arrangement manner of the memory and the processor.

[0277] Exemplarily, the chip system can be a field programmable gate array (FPGA), can be an application specific integrated circuit (ASIC), can also be a system on chip (SoC), can also be a central processor unit (CPU), can also be a network processor (NP), can also be a digital signal processor (DSP), can also be a micro controller unit (MCU), can also be a programmable logic device (PLD) or other integrated chip.

[0278] It should be understood that each step in the above method embodiments can be completed by integrated logic circuits of hardware in the processor or instructions in the form of software. The method steps disclosed in combination with the embodiments of the present application can be directly embodied as hardware processor execution, or executed by a combination of hardware and software modules in the processor.

[0279] The embodiments of the present application also provide a computer readable storage medium, which stores a computer program. When the computer program is executed on a computer, the computer is caused to execute the above related steps to realize the circuit board matching method in the above embodiments.

[0280] The embodiments of the present application also provide a computer program product. When the computer program product is executed on a computer, the computer is caused to execute the above related steps to realize the circuit board matching method in the above embodiments.

[0281] In addition, the embodiments of the present application also provide a device. The device can be specifically a component or a module, and the device can include one or more processors and memories connected thereto. The memory is used to store a computer program. When the computer program is executed by the one or more processors, the device executes the circuit board matching method in the above method embodiments.

[0282] Among them, the device, computer readable storage medium, computer program product or chip provided by the embodiments of the present application are used to execute the corresponding method provided above. Therefore, the beneficial effects that can be achieved are referred to the beneficial effects in the corresponding method provided above, which will not be repeated here.

[0283] The steps of methods or algorithms described in connection with the embodiments disclosed herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module can reside in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, a removable media, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium can be integral to the processor. The processor and the storage medium can reside in an ASIC.

[0284] Those skilled in the art can clearly understand the method according to the description of the above embodiments. For the convenience and brevity, only the above division of functional modules is taken as an example. In actual application, the above functions can be completed by different functional modules according to the needs; that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

[0285] In several embodiments provided in the present application, it should be understood that the disclosed method can be implemented in other ways. The above-described device embodiments are only schematic. For example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner; for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, module or unit, which can be electrical, mechanical or other forms.

[0286] In addition, each functional unit in each embodiment of the present application can be integrated into one processing unit, or each unit can exist physically, or two or more units can be integrated into one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0287] The computer readable storage medium includes, but is not limited to, any one of the following: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media capable of storing program codes.

[0288] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed by the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A radio frequency remote electronics device, comprising: The radio remote electronic device comprises a first circuit board and a second circuit board; wherein the first circuit board is provided with a system chip (SOC), an identification unit and a storage unit, the storage unit stores a first static parameter for driving the second circuit board and a first calibration parameter of the first circuit board; and the second circuit board is provided with a radio frequency integrated circuit (RFIC) and an identification circuit; The first main board and the second main board are in communication connection; The SOC is configured to acquire the RFIC identification of the second circuit board through the communication connection, and download a second calibration parameter of the second circuit board from a server based on the RFIC identification; The identification unit is configured to acquire output data of the identification circuit through the communication connection, and acquire a model identification of the second circuit board based on the output data; In a case where the first static parameter matches the model identification, the SOC is further configured to perform a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter and the first static parameter.

2. The radio frequency remote electronic device of claim 1, wherein, The first circuit board is provided with a first radio frequency unit, and the second circuit board is provided with a second radio frequency unit.

3. The radio frequency remote electronic device of claim 2, wherein, The first radio frequency unit comprises a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit comprises a satellite transceiving unit and / or a cellular transceiving unit.

4. The radio frequency remote electronic of claim 2 or 3, wherein, The first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

5. The radio frequency remoting electronic device of any of claims 2-4, wherein, The first radio frequency unit is connected with a satellite diversity receiving antenna, and the second radio frequency unit is connected with a satellite transmitting antenna and a main set receiving antenna.

6. The radio frequency remoting electronic device of any of claims 3-5, wherein, The first circuit board is provided with a first test seat and a second test seat, the first test seat is connected with a first antenna and a satellite receiving unit on the first circuit board, and the second test seat is connected with the satellite receiving unit and an RFIC on the second circuit board; In a case where the first test seat is turned on, the SOC is configured to acquire a first gain generated by the satellite receiving unit and the RFIC together; In a case where both the first test seat and the second test seat are turned on, the SOC is configured to acquire a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is a difference between the first gain and the second gain.

7. The radio frequency remoting electronic device of any of claims 1-6, wherein, The identification circuit comprises a plurality of resistors; the output data is voltage data or current data, the storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identification of the second circuit board.

8. The radio remote electronic device according to any one of claims 1-7, wherein, In a case where the first static parameter matches the model identification, the SOC is further configured to load the first static parameter and the second calibration parameter; Or, in a case where the first static parameter matches the model identification and the SOC has already loaded the first static parameter, the SOC is further configured to load the second calibration parameter.

9. The radio frequency remoting electronic device of any of claims 1-8, wherein, The first static parameter comprises a plurality of groups of static parameters; The SOC is further configured to acquire a target static parameter matching the model identifier from the first static parameter, and load the target static parameter.

10. The radio frequency remoting electronic device of any of claims 1-9, wherein, The first static parameter comprises a plurality of groups of static parameters. The SOC is further configured to determine that the plurality of groups of static parameters do not match the model identifier, and trigger the radio remote electronic device to report an error.

11. The radio frequency remoting electronic device of any of claims 1-10, wherein, The model identifier is used to indicate the model of the second circuit board, the model identifiers of a plurality of second circuit boards of the same model are the same, and correspond to the same target static parameter.

12. A circuit board matching method characterized by, The method is applied to a radio remote electronic device, the radio remote electronic device comprising a first circuit board and a second circuit board, the first circuit board and the second circuit board being communicatively connected; wherein the first circuit board is provided with a system chip SOC, an identification unit, and a storage unit, the storage unit storing first static parameters used to drive the second circuit board and first calibration parameters of the first circuit board; the second circuit board is provided with a radio frequency integrated circuit RFIC and an identification circuit; the method comprises: The SOC acquires an RFIC identifier of the second circuit board through the communication connection, and downloads second calibration parameters of the second circuit board from a server based on the RFIC identifier; The identification unit acquires output data of the identification circuit through the communication connection, and acquires a model identifier of the second circuit board based on the output data; In a case where the first static parameters match the model identifier, the SOC performs a function test on the radio remote electronic device based on the first calibration parameters, the second calibration parameters, and the first static parameters.

13. The method of claim 12, wherein, The first circuit board is provided with a first radio frequency unit, and the second circuit board is provided with a second radio frequency unit.

14. The method of claim 13, wherein, The first radio frequency unit comprises a satellite receiving unit and / or a short-range transceiving unit, and the second radio frequency unit comprises a satellite transceiving unit and / or a cellular transceiving unit.

15. The method according to claim 13 or 14, characterized in that, The first radio frequency unit is connected with at least one short-range antenna, and the second radio frequency unit is connected with at least one mobile cellular antenna.

16. The method according to any one of claims 13-15, characterized in that, The first radio frequency unit is connected with a satellite diversity receiving antenna, and the second radio frequency unit is connected with a satellite transmitting antenna and a main set receiving antenna.

17. The method according to any one of claims 14-16, characterized by, The first circuit board is provided with a first test seat and a second test seat, the first test seat is connected with a first antenna and a satellite receiving unit on the first circuit board, and the second test seat is connected with the satellite receiving unit and the RFIC on the second circuit board; the method further comprises: In a case where the first test seat is connected, the SOC acquires a first gain generated by the satellite receiving unit and the RFIC together; In a case where the first test seat and the second test seat are both connected, the SOC acquires a second gain generated by the satellite receiving unit, and a third gain generated by the RFIC is a difference between the first gain and the second gain.

18. The method according to any one of claims 12-17, characterized by, The identification circuit comprises a plurality of resistors; the output data is voltage data or current data, the storage unit stores gears corresponding to different output data, and the gears have a mapping relationship with the model identifier of the second circuit board.

19. The method according to any one of claims 12-18, characterized in that, The SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter in a case where the first static parameter matches the model identifier. The SOC loads the first static parameter and the second calibration parameter in a case where the first static parameter matches the model identifier. Alternatively, the SOC loads the second calibration parameter in a case where the first static parameter matches the model identifier and the SOC has already loaded the first static parameter.

20. The method of any of claims 12-19, wherein, The first static parameter includes a plurality of groups of static parameters; and the SOC performs a function test on the radio remote electronic device based on the first calibration parameter, the second calibration parameter, and the first static parameter in a case where the first static parameter matches the model identifier. The SOC acquires a target static parameter matching the model identifier from the first static parameter and loads the target static parameter.

21. The method of any of claims 12-20, wherein, The first static parameter includes a plurality of groups of static parameters; and the method further includes: The SOC determines that the plurality of groups of static parameters do not match the model identifier and triggers the radio remote electronic device to report an error.

22. The method of any one of claims 12-21, wherein, The model identifier is used to indicate a model of the second circuit board, the model identifiers of a plurality of second circuit boards of the same model are the same, and correspond to the same target static parameter.

23. A computer-readable storage medium, characterized in that, The computer readable storage medium includes a computer program, which, when running on an electronic device, causes the electronic device to perform the method of any one of claims 12-22.

24. A computer program product, characterised in that, The computer program product, when running on a computer, causes the computer to perform the method of any one of claims 12-22.

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