Charger

Abstract

The invention provides a charger which comprises a printed circuit board assembly and a heat dissipation shell structure. The heat dissipation shell structure comprises a main body, a fin structure and a fan, the main body is provided with a containing part, a first side wall and a second side wall. The first side wall is provided with an inner surface and an outer surface opposite to the inner surface. An inner surface of the first sidewall faces the printed circuit board assembly. The second side wall is perpendicular to the first side wall. The fin structure is arranged on the outer surface of the first side wall of the main body. The fan is arranged on the second side wall and used for extracting heat absorbed by the fin structure outwards.

Description

Technical Field

[0001] This invention relates to a charger, and more particularly to a waterproof charger. Background Technology

[0002] In waterproof chargers, due to waterproofing requirements, the fan cannot directly blow air onto the internal heat-generating components for heat dissipation. Therefore, the internal heat must first be conducted to the metal casing, and then the fan blows air away the heat from the casing to achieve the purpose of heat dissipation.

[0003] However, in current chargers on the market, such as the existing heat dissipation housing structure 9000 shown in Figure 7, the fan 9200 is mostly mounted above the housing 9400 where the heat-generating components are placed and located in the center of the top cover 9100. The fan 9200 blows air directly onto the fin structure 9300 on the housing, causing air to flow from the air inlet 9001 to the air outlet 9002 in the direction indicated by arrow 9003.

[0004] However, due to inconsistent airflow (e.g., air blowing out radially from the center) and the limitation of product size that causes the fan to be close to the casing, the back pressure increases (the air blown into the fin structure 9300 from the air inlet 9001 will first hit the casing and then turn to the direction of the air outlet 9002), thus failing to effectively increase the airflow and limiting the heat dissipation effect.

[0005] Therefore, it is very meaningful to improve the heat dissipation shell structure in waterproof chargers. Summary of the Invention

[0006] According to some embodiments of the present invention, a charger is provided, including a printed circuit board assembly and a heat dissipation housing structure. The heat dissipation housing structure includes a main body, a fin structure, and a fan. The main body has a receiving portion, a first sidewall, and a second sidewall. The first sidewall has an inner surface and an outer surface opposite to the inner surface. The inner surface of the first sidewall faces the printed circuit board assembly. The second sidewall is perpendicular to the first sidewall. The fin structure is disposed on the outer surface of the first sidewall of the main body. The fan is disposed on the second sidewall and draws the heat absorbed by the fin structure outward.

[0007] In some embodiments, the fin structure has multiple fins, and the fins are arranged parallel to each other in a first direction.

[0008] In some embodiments, the fan has a rotation axis that is parallel to a second direction perpendicular to the first direction. The fin structure and the fan form an airflow duct. Air flows along the second direction within the airflow duct.

[0009] In some embodiments, when viewed along the second direction, the fan at least partially overlaps with the fin structure.

[0010] In some embodiments, when viewed along the second direction, the fan at least partially overlaps with the printed circuit board assembly.

[0011] In some embodiments, the body further includes a clearance portion located in a second direction between the receiving portion and the second sidewall. The fin structure does not extend into the clearance portion.

[0012] In some embodiments, the length of the clearance portion is greater than 15 mm in the second direction.

[0013] In some embodiments, the charger further includes a top cover and a bottom cover. The top cover is connected to the body. A fin structure is disposed between the top cover and the body. The bottom cover is opposite to the top cover and connected to the body. A printed circuit board assembly is disposed between the bottom cover and the body.

[0014] In some embodiments, the charger further includes a Formed in Place Gasket (FIPG) disposed between the bottom cover and the body to seal the bottom cover and the body.

[0015] In some embodiments, the charger further includes a thermally conductive adhesive that fills the housing and contacts the printed circuit board assembly. Attached Figure Description

[0016] Figure 1 A front perspective view of the charger according to some embodiments of the present invention;

[0017] Figure 2 A rear perspective view of the charger is provided according to some embodiments of the present invention, wherein the top cover of the charger is indicated by dashed lines;

[0018] Figure 3 An exploded view of the charger according to some embodiments of the present invention;

[0019] Figure 4A A top view of the combination of the body and fin structure in a heat dissipation housing structure according to some embodiments of the present invention;

[0020] Figure 4B A bottom view of the main body according to some embodiments of the present invention;

[0021] Figure 4C A side view of the combination of the body and fin structure according to some embodiments of the present invention;

[0022] Figure 5 According to some embodiments of the present invention, a cross-sectional view of the charger is taken along line segment AA in Figure 1;

[0023] Figure 6A bottom perspective view of a charger according to some embodiments of the present invention, wherein the bottom cover and the circuit board of the printed circuit board assembly are omitted;

[0024] Figure 7 This is a cross-sectional schematic diagram of an existing heat sink casing structure; where the reference numerals are:

[0025] 1000: Charger

[0026] 1001: Air Inlet

[0027] 1002: Air vent

[0028] 1100: Printed Circuit Board Assembly

[0029] 1101: Circuit Board

[0030] 1102: Electronic Components

[0031] 1200: Heat dissipation housing structure

[0032] 1210: Main Body

[0033] 1211: First sidewall

[0034] 1212: Second sidewall

[0035] 1213: Clear Space Section

[0036] 1215: Storage Department

[0037] 1217: Opening

[0038] 1219: Power Connection Section

[0039] 1220: Fin structure

[0040] 1225: Fins

[0041] 1226: Bending fins

[0042] 1230: Fan

[0043] 1235: Rotation axis

[0044] 1300: Air duct

[0045] 1305: Arrow

[0046] 1400: Top Cover

[0047] 1500: Bottom Cover

[0048] 1600: Field-molded gasket

[0049] 1700: Thermal conductive adhesive

[0050] 9000: Commonly known heat sink housing structure

[0051] 9001: Air Inlet

[0052] 9002: Air vent

[0053] 9003: Arrow

[0054] 9100: Top Cover

[0055] 9200: Fan

[0056] 9300: Fin structure

[0057] 9400: Storage Department

[0058] D 1: First direction

[0059] D 2: Second direction

[0060] L: Length Detailed Implementation

[0061] The following description provides many different embodiments or examples, and describes specific examples of various components and arrangements to implement different features of the invention. For example, if this specification describes a first feature formed "on" or "above" a second feature, it means that it may include embodiments in which the first feature and the second feature are in direct contact, or embodiments in which an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact.

[0062] Relative spatial terms, such as "below" and "above," may be used in the embodiments to facilitate the description of the relationship between elements or features in the drawings and other elements or features. In addition to the orientations shown in the drawings, these spatial terms are intended to encompass different orientations of the device in use or operation. The device may be turned to different orientations (rotated 90 degrees or other orientations), and the spatial terms used herein can be interpreted in the same way.

[0063] The charger 1000 disclosed in this specification can be a waterproof battery charger. Depending on the user's needs, the charger 1000 can be a vehicle charger for applications such as electric motorcycles. Alternatively, the charger 1000 can also be a handheld, portable charger. In the charger 1000, the printed circuit board assembly with charging functionality is sealed to achieve waterproof and dustproof effects, and a heat dissipation housing structure improves the efficiency of removing heat generated by the printed circuit board assembly. The construction of the charger 1000 will be described in detail below.

[0064] First, please refer to... Figures 1 to 3 . Figure 1A front perspective view of a charger 1000 according to some embodiments of the present invention. Figure 2 According to some embodiments of the present invention, a rear perspective view of a charger 1000 is provided, wherein the top cover 1400 of the charger is indicated by dashed lines. Figure 3 An exploded view of a charger 1000 according to some embodiments of the present invention.

[0065] like Figures 1 to 3 As shown, the charger 1000 mainly includes a printed circuit board assembly 1100, a heat dissipation housing structure 1200, a top cover 1400, and a bottom cover 1500.

[0066] like Figure 3 As shown, the printed circuit board assembly 1100 and the heat sink structure 1200 are disposed between the upper cover 1400 and the bottom cover 1500. The upper cover 1400 is connected to one side of the heat sink structure 1200 (e.g., the side closer to the +Z direction). The bottom cover 1500 is opposite to the upper cover 1400 and connected to the other side of the heat sink structure 1200 (e.g., the side closer to the -Z direction).

[0067] As described above, the printed circuit board assembly 1100 has a charging function and includes a circuit board 1101 and a plurality of electronic components 1102. In an embodiment of the invention, the printed circuit board assembly 1100 is housed in a heat dissipation housing structure 1200 (e.g., in a housing portion 1215 described below). In some embodiments, the circuit board 1101 is arranged parallel to the bottom cover 1500, and the circuit board 1101 is closer to the bottom cover 1500 than the electronic components 1102.

[0068] Next refer to Figure 2 and Figures 4A to 4C To illustrate the construction of the heat dissipation housing structure 1200. Figure 4A A top view of the combination of the body 1210 and the fin structure 1220 in the heat dissipation housing structure 1200 according to some embodiments of the present invention. Figure 4B A bottom view of the main body 1210 according to some embodiments of the present invention. Figure 4C A side view of the combination of the body 1210 and the fin structure 1220 according to some embodiments of the present invention.

[0069] The heat dissipation housing structure 1200 includes a main body 1210, a fin structure 1220, and a fan 1230.

[0070] In some embodiments, the body 1210 may be made of a metallic material to facilitate heat conduction. The body 1210 has a housing 1215 for housing the printed circuit board assembly 1100. Figure 4BAs shown, the internal structure of the storage section 1215 can be determined according to the arrangement, size, and shape of the electronic components 1102 of the printed circuit board assembly 1100. In other words, the internal structure of the storage section 1215 is not limited by the drawings of this invention and can be determined according to the actual configuration of the printed circuit board assembly 1100. Furthermore, the bottom cover 1500 ( Figure 3 The printed circuit board assembly 1100 is disposed between the bottom cover 1500 and the main body 1210, and the top cover 1400, which is opposite to the bottom cover 1500, is connected to the other side of the main body 1210.

[0071] The main body 1210 has a first sidewall 1211, such as Figure 4A As shown. The first sidewall 1211 has an inner surface and an outer surface opposite to the inner surface. In this specification, the surface of the first sidewall 1211 facing the printed circuit board assembly 1100 is referred to as the inner surface, and the surface of the first sidewall 1211 facing away from the printed circuit board assembly 1100 (i.e., the surface of the body 1210 facing the upper cover 1400) is referred to as the outer surface. A fin structure 1220 is disposed on the outer surface of the first sidewall 1211 of the body 1210. Therefore, the fin structure 1220 is disposed between the upper cover 1400 and the body 1210, as shown. Figure 2 As shown.

[0072] like Figure 4A As shown, the fin structure 1220 has multiple fins 1225. These fins 1225 are arranged parallel to each other in a first direction D1. Specifically, each fin can extend from the outer surface of the first sidewall 1211 towards... Figure 4A The fins protrude in the Z direction and extend longitudinally along the Y direction. The fins are arranged parallel to each other in the X direction (i.e., the first direction D1). It should be understood that the height of the fin structure 1220 protruding from the first sidewall 1211, the length extending in the Y direction, and the number of fins 1225 are all determined by the shape and size of the back of the receiving portion 1215, and are not limited to the embodiments presented in this invention.

[0073] In this embodiment, the heat generated by the printed circuit board assembly 1100 is conducted to the fin structure 1220 via the body 1210. Therefore, the main purpose of the heat dissipation housing structure 1200 is to dissipate the heat absorbed by the fin structure 1220.

[0074] In this specification, one of the sidewalls of the main body 1210 that is perpendicular to the first sidewall 1211 is referred to as the second sidewall 1212. Figure 4A In the diagram, the second sidewall 1212 is located on the right side. At the second sidewall 1212, the main body 1210 has an opening 1217 for accommodating the fan 1230, as shown below. Figure 2 As shown.

[0075] like Figure 2 As shown, a fan 1230 is disposed on the second sidewall 1212, and the fan 1230 has a rotation axis 1235. The rotation axis 1235 is parallel to a second direction D2 (Y direction) that is perpendicular to the first direction D1 (X direction). The fan 1230 can draw the heat absorbed by the fin structure 1220 out of the charger 1000.

[0076] like Figure 4A As shown, in some embodiments, the fin structure 1220 may further include some bent fins 1226 (in... Figure 4A (The area circled in dashed lines). The bent fins 1226 are positioned in conjunction with the fan 1230 to guide air to the fan 1230. As mentioned above, the configuration of the housing 1215 depends on the configuration of the printed circuit board assembly 1100, and the configuration of the fin structure 1220 depends on the shape and size of the back of the housing 1215. Therefore, depending on the different printed circuit board assemblies 1100, it can be determined whether to provide the bent fins 1226, or the position, number, and shape of the bent fins 1226. In the embodiment shown in Figure 4A, the fin structure 1220 has four bent fins 1226 to smoothly guide air from a greater distance to the fan 1230, thereby achieving higher heat dissipation efficiency.

[0077] Next, please refer to Figure 4A , Figure 4C and Figure 5 . Figure 5 According to some embodiments of the present invention, along Figure 1 Line segment AA in the diagram represents a cross-sectional view of charger 1000.

[0078] In an embodiment of the invention, the fin structure 1220 and the fan 1230 form an air duct 1300. Figure 5 In the diagram, arrow 1305 indicates the air flowing in duct 1300. For example... Figure 5 As shown, in the air duct 1300, air flows along the second direction D2.

[0079] In detail, in the charger 1000 according to the present invention, since the fan 1230 draws out the heat absorbed by the fin structure 1220 by means of air extraction, the air inlet 1001 of the charger 1000 is located on the side away from the fan 1230, while the air outlet 1002 is located on the side of the fan 1230. By placing the fan 1230 on the side of the fin structure 1220 (instead of placing the fan 9200 in the middle as in the conventional heat dissipation housing structure 9000), the airflow can be effectively increased, and each fin 1225 can receive airflow evenly, thereby improving heat dissipation efficiency. Furthermore, compared to the design of blowing air from the fan to the housing, the exhaust design of the present invention prevents air from being blocked by the internal structure of the main body 1210, further increasing the airflow.

[0080] In addition, such as Figure 4A and Figure 5 As shown, in some embodiments, the main body 1210 further includes a clearance portion 1213. The clearance portion 1213 is located in the second direction D2 between the receiving portion 1215 and the second sidewall 1212. The clearance portion 1213 is a specially reserved space in the main body 1210, and the fin structure 1220 does not extend into the clearance portion 1213.

[0081] like Figure 5 As shown, by providing a clearance portion 1213, the fan 1230 and the fin structure 1220 are kept at a certain distance. This design can improve the problem of increased back pressure caused by the fan being too close to the fins in conventional heat sink structures. By reducing the back pressure, the fan 1230 according to the embodiment of the present invention can achieve a larger airflow, further improving heat dissipation efficiency. In some embodiments, in the second direction D2, the length L of the clearance portion 1213 is... Figure 4A (More than 15 mm) to ensure the effect of reducing back pressure.

[0082] In some embodiments, to achieve miniaturization, the configuration of the fin structure 1220 and the printed circuit board assembly 1100 may correspond to the size of the fan 1230. For example, as shown in Figure 4C, viewed along the second direction D2, the fan 1230 at least partially overlaps with the fin structure 1220, and the fan 1230 also at least partially overlaps with the housing 1215 (and the printed circuit board assembly 1100 housed therein). In this way, the dimensions in the Z direction can be effectively limited.

[0083] Next refer to Figure 3 and Figure 6 This will explain the assembly process of the charger 1000. Figure 6 According to some embodiments of the present invention, a bottom perspective view of a charger 1000 is provided, wherein the bottom cover 1500 and the circuit board 1101 of the printed circuit board assembly 1100 are omitted.

[0084] When assembling the charger 1000, the fin structure 1220 can be fixed together with the main body 1210 first. In some embodiments, the fin structure 1220 can be integrally formed with the main body 1210.

[0085] Next, as Figure 6 As shown, the printed circuit board assembly 1100 can be first installed (for clarity, in...). Figure 6 The circuit board 1101 (omitted) is placed into the storage section 1215 of the main body 1210. After placement, thermally conductive adhesive 1700 (…) is applied. Figure 3 The thermally conductive adhesive 1700 is filled into the receiving portion 1215, allowing it to contact the printed circuit board assembly 1100. The thermally conductive adhesive 1700 is used to rapidly conduct heat generated by the electronic component 1102 to the main body 1210 and protects the electronic component 1102 from damage caused by impacts, vibrations, etc. In some embodiments, the thermally conductive adhesive 1700 can be cured after heating to stably bond with the electronic component 1102, improving stability.

[0086] Next, field-formed gaskets (FIPGs) 1600 are formed on the edge of the main body 1210 to bond the main body 1210 to the bottom cover 1500. The field-formed gaskets 1600 are disposed between the bottom cover 1500 and the main body 1210 to seal the bottom cover 1500 and the main body 1210. After the bottom cover 1500 and the main body 1210 are sealed together, the storage section 1215 achieves a waterproof and dustproof effect, protecting the internal printed circuit board assembly 1100.

[0087] Finally, assemble and fix the fan 1230 and the top cover 1400 onto the main body 1210 to complete the assembly of the charger 1000.

[0088] In addition, such as Figure 2 and Figure 6 As shown, the main body 1210 may further include a plurality of power connection portions 1219. In some embodiments, the main body 1210 includes two power connection portions 1219, respectively for connecting a power output line and a power input line (not shown). Furthermore, the power lines are electrically connected to the printed circuit board assembly 1100 sealed inside the main body 1210 via the power connection portions 1219. In embodiments of the present invention, the power connection portions 1219 are located on side surfaces perpendicular to both the first sidewall 1211 and the second sidewall 1212, but the position of the power connection portions 1219 is not limited to this and can be positioned appropriately as needed.

[0089] In summary, the present invention provides a waterproof and dustproof charger 1000. In the heat dissipation housing structure 1200 that seals the printed circuit board assembly 1100, the fin structure 1220 and the side-mounted fan 1230 increase airflow, significantly improving heat dissipation efficiency. Furthermore, by filling the storage portion 1215 containing the printed circuit board assembly 1100 with thermally conductive adhesive 1700, the heat generated by the printed circuit board assembly 1100 can be removed more effectively. In addition, by using field-molded gaskets 1600 to seal the printed circuit board assembly 1100 within the heat dissipation housing structure 1200, the waterproof and dustproof properties of the printed circuit board assembly 1100 are ensured, improving the overall stability of the device.

[0090] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that anyone skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Anyone skilled in the art can understand from the disclosure of the present invention that current or future developed processes, machines, manufacturing, material composition, apparatus, methods, and steps can be used according to the present invention as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of various claim claims and embodiments.

Claims

1. A charger characterized by: Comprising: a printed circuit board assembly; and a heat dissipation housing structure comprising: a main body having: a receiving portion receiving the printed circuit board assembly; a first side wall having an inner surface and an outer surface opposite to the inner surface, wherein the inner surface of the first side wall faces the printed circuit board assembly; and a second side wall perpendicular to the first side wall; a fin structure disposed on the outer surface of the first side wall of the main body; and a fan disposed on the second side wall to draw out heat absorbed by the fin structure. wherein the fin structure has a plurality of fins arranged parallel to each other in a first direction.

2. The charger of claim 1, wherein:

3. The charger of claim 2, wherein: the fan has a rotation axis parallel to a second direction perpendicular to the first direction; the fin structure and the fan form an air duct; in the air duct, air flows along the second direction. wherein, 4. The charger of claim 3, wherein: the fan and the fin structure at least partially overlap when viewed along the second direction. wherein, 5. The charger of claim 3, wherein: the fan and the printed circuit board assembly at least partially overlap when viewed along the second direction. wherein the main body further has a clearance portion between the receiving portion and the second side wall in the second direction, wherein the fin structure does not extend into the clearance portion.

6. The charger of claim 3, wherein: wherein a length of the clearance portion in the second direction is greater than 15 mm.

7. The charger of claim 6, wherein: further comprising:

8. The charger of claim 1, wherein: an upper cover connected to the main body, wherein the fin structure is disposed between the upper cover and the main body; and a bottom cover opposite to the upper cover and connected to the main body, wherein the printed circuit board assembly is disposed between the bottom cover and the main body. further comprising: a field installable gasket (FIPG) disposed between the bottom cover and the main body to seal the bottom cover and the main body.

9. The charger of claim 8, wherein: further comprising: a thermal conductive paste filled in the receiving portion and contacting the printed circuit board assembly.

10. The charger of claim 1, wherein: ​ ​

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