Lighting device and lamp

Abstract

The lighting device disclosed in an embodiment of the present invention comprises: a support plate having a concave receiving portion at an upper portion; the circuit board is arranged on the accommodating part of the supporting plate; a plurality of pads arranged on one side of the circuit board; a light source portion provided on the support plate and having a light emitting element and a plurality of bond pads; a plurality of connection members respectively connecting the plurality of pads to the plurality of bond pads; and a molded portion covering the plurality of connecting members, the plurality of pads, and the plurality of bonding pads, in which an outer contour line of the molded portion has first to fourth side portions, the first side portion of the molded portion extending in a first direction along a region between an upper surface of the light emitting element and an upper surface of the plurality of bonding pads on the light source portion, and the second side portion of the molded portion extending in a second direction along a region between an upper surface of the light emitting element and an upper surface of the plurality of bonding pads on the light source portion. A second side portion of the molded portion extends in a first direction along an outer side of the plurality of pads on the circuit board, and third and fourth side portions of the molded portion extend in a second direction perpendicular to the first direction from both ends of the first and second side portions, and may include a convex curve and a concave curve.

Description

Technical Field

[0001] Embodiments of the present invention relate to lighting devices and lamps. Background Technology

[0002] Lighting applications include automotive lights and backlighting for displays and signs. Compared to conventional light sources such as fluorescent and incandescent lamps, light-emitting elements such as light-emitting diodes (LEDs) offer advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. These LEDs are used in various display devices, such as indoor or outdoor lighting fixtures. Recently, LED-based lamps have been proposed as vehicle light sources. Compared to incandescent lamps, LEDs have the advantage of low power consumption. However, due to the small emission angle of the light emitted from LEDs, the luminous area of ​​the LED lamp needs to be increased when using LEDs as automotive lights. Summary of the Invention

[0003] Technical issues

[0004] Embodiments of the present invention provide a lighting module and a lighting device, the lighting device having a member for fixing at least a portion of a connecting member electrically connecting a light source portion to a circuit board. Embodiments of the present invention provide a lighting module and a lighting device, the lighting device having a member for fixing a portion or all of a plurality of connecting members electrically connecting a light source portion to a circuit board. Embodiments of the present invention provide a lighting module and a lighting device, the lighting device having a member for fixing a portion of one or more wires to at least one area on the upper surface of a circuit board or the upper surface of a support plate. Embodiments of the present invention provide a lighting device and a lamp or automotive lamp having the lighting device.

[0005] Technical solution

[0006] The lighting device according to an embodiment of the present invention includes: a support plate having a concave receiving portion on its upper part; a circuit board disposed on the receiving portion of the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light-emitting element and a plurality of bonding pads; a plurality of connecting members connecting the plurality of pads to the plurality of bonding pads respectively; and a molding portion covering the plurality of connecting members, the plurality of pads and the plurality of bonding pads, wherein the outer contour of the molding portion has a first side to a fourth side, the first side of the molding portion extending in a first direction along the region between the upper surface of the light-emitting element and the upper surface of the plurality of bonding pads on the light source portion, the second side of the molding portion extending in a first direction along the outer side of the plurality of pads on the circuit board, and the third and fourth sides of the molding portion extending from both ends of the first and second sides in a second direction orthogonal to the first direction, and may include convex curves and concave curves.

[0007] According to an embodiment of the present invention, the plurality of pads include a first pad and a second pad adjacent to the light source portion, the plurality of bonding pads include a first bonding pad and a second bonding pad adjacent to the circuit board, the plurality of connecting members include a first connecting member connecting the first pad and the first bonding pad, and a second connecting member connecting the second pad and the second bonding pad, and the uppermost end of the molding portion may be configured to be higher than the highest point of the first connecting member and the second connecting member with reference to the upper surface of the circuit board.

[0008] According to an embodiment of the present invention, the uppermost end of the molded portion may be located in the region between the circuit board and the light source portion. The highest points of the first connecting member and the second connecting member may be located in the region between the circuit board and the light source portion. The present invention includes an adhesive member disposed between the light source portion and the support plate, and the third and fourth sides of the molded portion may protrude further outward than the adhesive members disposed on both sides of the light source portion in the first direction.

[0009] According to an embodiment of the present invention, the first side of the molded portion may have a linear or concave shape along a plurality of bonding pads on the light source portion. One side region of the third side and one side region of the fourth side may have raised curved surface regions on both sides of the light source portion. The distance between the first side of the molded portion and the light-emitting element may gradually increase from both sides of the light source portion in the first direction toward the region between the plurality of bonding pads.

[0010] According to an embodiment of the present invention, each of the first connecting member and the second connecting member includes a first end joined to the first bonding pad and the second bonding pad, a second end joined to the first pad and the second pad, and an intermediate line portion connecting the first end and the second end, wherein the distance between the second end of the first connecting member and the second connecting member may be greater than the distance between the first end of the first connecting member and the first end of the second connecting member. Each of the plurality of connecting members may be a strip line whose width is greater than twice its thickness.

[0011] A lamp according to an embodiment of the present invention includes: an illumination device that emits white light; and a light guiding module or reflector on the illumination device, wherein the illumination device may include the illumination device disclosed above.

[0012] Beneficial effects

[0013] Embodiments of the present invention can improve the electrical reliability caused by the connecting members by supporting and fixing part or all of the connecting members between the light source and the circuit board, thereby preventing deformation and cracking of the connecting members. Embodiments of the present invention mold part or all of the connecting members that connect the light source and the circuit board to the molding part, thereby preventing movement of the connecting members and blocking electrical contact between the connecting members, and suppressing possible openings or cracks in the joint between the connecting members and the pads. Embodiments of the present invention can improve the reliability of the lighting module and the lighting device including the lighting module. Attached Figure Description

[0014] Figure 1a This is a perspective view of the lighting device according to the present invention.

[0015] Figure 1b yes Figure 1a A sectional side view of the lighting device.

[0016] Figure 2 It is shown Figure 1a Enlarged view of the light source, circuit board and connecting components.

[0017] Figure 3 (A) and Figure 3 (B) shows Figure 2 Examples of tensile testing and crack formation in connecting components.

[0018] Figure 4a This is a perspective view of a lighting device according to a first embodiment of the present invention.

[0019] Figure 4b yes Figure 4a Example of a plan view of a lighting fixture.

[0020] Figure 4c It is shown Figure 4a A perspective view of the connecting components and fixing frame of the lighting device.

[0021] Figure 5 yes Figure 4a Example of a cross-sectional side view of a lighting device.

[0022] Figure 6a This is a first modification of the lighting device according to the first embodiment of the present invention.

[0023] Figure 6b It is shown Figure 6a A diagram of the light source and the fixed frame.

[0024] Figure 7 This is a second modification of the lighting device according to the first embodiment of the present invention.

[0025] Figure 8 It is shown Figure 7 A diagram showing an example of a fixed frame for a lighting device.

[0026] Figure 9 This is a cross-sectional side view of a lighting device according to a second embodiment of the present invention.

[0027] Figure 10 yes Figure 9 A sectional side view of the lighting device.

[0028] Figure 11 It is shown Figure 10 A floor plan of an example lighting fixture.

[0029] Figure 12 It shows Figure 11 An example of the shape of the molded part in a lighting device.

[0030] Figure 13 It is shown Figure 10 A floor plan of another example of a lighting fixture.

[0031] Figure 14 It shows Figure 13 An example of the shape of the molded part in a lighting device.

[0032] Figure 15 and Figure 16 This is a diagram illustrating the manufacturing process of the molding portion in a lighting device according to a second embodiment of the present invention.

[0033] Figure 17 It is shown Figure 15 A diagram of another shape of the outer wall.

[0034] Figure 18 An example of a light guiding module combined with a lighting device according to a first embodiment of the present invention is shown.

[0035] Figure 19 yes Figure 18 Example of a cross-sectional side view of a lighting device.

[0036] Figure 20 This is a cross-sectional view of an illumination device with a reflector according to an embodiment of the present invention. Detailed Implementation

[0037] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. The inventive concept is not limited to a subset of the described embodiments, but can be implemented in various different forms, and one or more of its components may be selectively combined and substituted among embodiments if they are within the scope of the inventive concept. Furthermore, unless explicitly defined and described, the terminology used in the embodiments of the invention (including technical and scientific terms) is to be interpreted as having a meaning commonly understood by one of ordinary skill in the art, and commonly used terms (e.g., terms defined in dictionaries) may be interpreted in the context of the relevant art.

[0038] The terminology used in the embodiments of this invention is for describing embodiments and is not intended to limit the invention. In this specification, the singular form may include the plural form unless specifically described in the wording, and when described as “at least one (or more than one) of A and / or B and C,” it may include at least one of all combinations of A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe components of embodiments of this invention. These terms are intended only to distinguish components from other components and are not determined by their nature, sequence, or order. Furthermore, when a component is described as “connected,” “joined,” or “linked” to another component, this refers not only to the direct connection, joining, or linking of the component to another component, but also to the "connection," "joining," or "linking" of another component between the component and other components. Additionally, when each component is described as being formed or disposed “upward (above) or downward (below),” upward (downward) or downward (bottom) includes not only the case where two components are in direct contact with each other, but also the case where one or more components are formed or disposed between two components. Furthermore, when expressed as "up (above)" or "down (below)," it can include not only the upward direction based on a component but also the downward direction based on a component.

[0039] <Lighting device>

[0040] Figure 1a This is a perspective view of the lighting device according to the present invention. Figure 1b yes Figure 1a A sectional side view of the lighting device, and Figure 2It is shown Figure 1a Enlarged view of the light source, circuit board and connecting components.

[0041] Reference Figure 1a , Figure 1b and Figure 2 The lighting device 1000 may include a support plate 101, a circuit board 110 disposed on the support plate 101, a light source portion 130 disposed on the support plate 101 adjacent to the circuit board 110, and connecting members 141 and 142 electrically connecting the light source portion 130 and the circuit board 110. The lighting device 1000 can be applied to various lighting devices requiring illumination, such as automotive lights, household lighting devices, and industrial lighting devices. For example, when applied to automotive lights, the lighting device can be used for headlights, side mirror lights, side marker lights, fog lights, taillights, brake lights, daytime running lights, vehicle interior lighting, door trim lights, rear combination lights, reversing lights, etc. The lighting device can also be used in indoor and outdoor advertising devices, display devices, and various electric vehicle applications. The lighting device 1000 can be used, for example, as a headlight.

[0042] Within the lighting device 1000, the light source unit 130 and the circuit board 110 may be spaced apart in one direction (e.g., in the second direction Y of the first direction X and the second direction Y). The first direction X and the second direction Y are mutually orthogonal, and the direction orthogonal to the first direction X and the second direction Y is a third direction Z, which may be a vertical direction.

[0043] The support plate 101 supports the circuit board 110 and the light source unit 130, and can conduct heat generated from the circuit board 110 and the light source unit 130. The support plate 101 can be a heat sink. The support plate 101 can be formed of metal, or it can be formed of a laminated structure of thermally conductive material and metal layers. The support plate 101 can be formed as a single layer or multiple layers. The thermally conductive material can include ceramic materials, AlN, or aluminum materials with an anodized surface layer. The metal can include at least one of Al, Ni, Mo, Cu, Cu alloy, Cu-W, Ag, or Au, and can be formed as a single layer or a multilayer of two or more metals. The support plate 101 may further include heat sinks on its bottom.

[0044] The support plate 101 includes an upper portion 102 and a side portion 103, and the upper surface area of ​​the upper portion 102 can be set to be larger than the area of ​​the circuit board 110, for example, two times or more, such as ten times or more. The side portion 103 can be bent downward from the edge of the upper portion 102, and one or more can be provided along the outer side of the upper portion 102. Here, the downward direction is the direction facing the opposite side to the direction in which the circuit board 110 is provided on the upper surface of the support plate 101. Empty spaces can be provided on the inner side of the side portion 103 and the lower side of the upper portion 102, or, for example, a heat sink structure can be combined. In the region of the upper portion 102, a plurality of connecting holes 105 and 106 provided on both sides of the light source portion 130 in the second direction Y can be provided in the first direction X. External structures, for example, light guiding module 500 (see Figure 18 It can be connected to the support plate 101 through the connecting holes 105 and 106.

[0045] A light source 130 is disposed on one side of the upper portion 102 of the support plate 101, and a circuit board 110 is disposed on the other side of the upper portion 102. The light source 130 may be disposed on one side of the circuit board 110. The light source 130 may be disposed on the support plate 101 and adhered to the support plate 101 using an adhesive member 138. The adhesive member 138 comprises a thermally conductive adhesive and may be made of an electrically insulating material such as silicone resin or epoxy resin. The lower surface of the light source 130 may adhere to the upper surface of the support plate 101 or to a region lower than the upper surface of the support plate 101. The adhesive member 138 may adhere the light source 130 to the upper surface 102. The adhesive member 138 may be located on the lower surface of the light source 130, protruding outward from the side surface of the light source 130, and adhered to the lower part of the side surface of the light source 130. The adhesive member 138 may conduct heat generated from the light source 130 to the support plate 101.

[0046] The circuit board 110 may comprise resin or metal materials. The circuit board 110 may be formed from any of the following: ceramic-based PCB, metal-core PCB (MCPCB), flexible PCB (FPCB), and resin-based PCB. Figure 5 As shown, the circuit board 110 may include a metal layer 110A on the bottom, a circuit layer (not shown) with pads 111 and 112 on the top, a protective layer 110B made of insulating material for protecting the circuit layer, and an insulating layer 110C between the metal layer 110A and the pads 111 and 112. The circuit board 110 may be configured as an MCPCB with a metal layer on the bottom and may transfer heat to the support plate 101.

[0047] Here, the circuit board 110 can be fastened to the upper portion 102 by a fastening device 119, and the fastening device 119 may include one or more bolts for fastening and attaching the circuit board 110 to the upper portion 102. As another example, the fastening device 119 may include a fastening structure and / or a hooking structure. An adhesive film 118 can bond the circuit board 110 to the upper portion 102 and may be a heat-conducting material. When the circuit board 110 is fastened by the fastening device 119, the adhesive film 118 may be removable to facilitate the separation of the circuit board 110. The circuit board 110 can be fastened to the upper surface of the support plate 101 using at least one or both of the fastening device 119 and the adhesive film 118.

[0048] The pads 111 and 112 of the circuit board 110 may include a first pad 111 and a second pad 112 spaced apart from each other. The first pad 111 and the second pad 112 can be connected to a connector 115 disposed on the upper part of the circuit board 110 via a circuit layer of the circuit board 110. The connector 115 can receive drive signals and power from the outside. The pads 111 and 112 may be disposed on one side of the circuit board 110, and the connector 115 may be coupled to the other side of the circuit board 110. A fastening device 119 may be disposed in the area between the pads 111 and 112 and the connector 115. The first pad 111 and the second pad 112 are disposed adjacent to one side of the circuit board 110 and may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au and optional alloys thereof. Each of the first pad 111 and the second pad 112 includes a single layer or multiple layers, and in the case of multiple layers, may contain the same or different metals.

[0049] The circuit board 110 has a protective layer 110B on the metal layer 110A, and the protective layer 110B can protect the pads 111 and 112 and the circuit layer, and can open the bonding area or upper surface area of ​​the pads 111 and 112. The protective layer 110B can be an insulating material, such as solder resist material, that partially exposes the pads 111 and 112.

[0050] The light source unit 130 can be bonded to the upper part 102 of the support plate 101 using an adhesive member 138. The adhesive member 138 conducts heat generated from the light source unit 130 to the support plate 101. The adhesive member 138 may include a thermally conductive adhesive member, such as a TIM (thermal interface material), which contains metal powder or inorganic powder within a resin material. A side surface of the light source unit 130 may face a portion of the side surface of the circuit board 110. The light source unit 130 and the circuit board 110 may be electrically connected. The light source unit 130 and the circuit board 110 may be connected by at least one connecting member 141 and 142. The light source unit 130 may include an OLED or an LED. When powered by the circuit board 110, the light source unit 130 operates and emits light of at least one or more of blue, green, red, and white. For example, the light source unit 130 may emit white light.

[0051] The bonding pads 134 and 135 of the light source section 130 are provided on one side adjacent to the circuit board 110. The bonding pads 111 and 112 of the circuit board 110 are provided on the other side adjacent to the light source section 130. The bonding pads 134 and 135 of the light source section 130 can be provided close to the circuit board 110 within the area of ​​the light source section 130. Due to the thickness of the circuit board 110, the upper surface of the circuit board 110 can be provided higher than the upper surface of the light source section 130. In addition, the upper surfaces of the bonding pads 111 and 112 of the circuit board 110 can be provided higher than the upper surface positions of the bonding pads 134 and 135 of the light source section 130. As another example, as shown in FIG22a, the lower surface of the circuit board 110 can be provided in the housing section 108, which is lower than the upper surface of the support plate 101 on which the light source section 130 is provided.

[0052] The pads of the circuit board 110 may include first pads 111 and second pads 112 spaced apart from each other, and the bonding pads of the light source section 130 may include first bonding pads 134 and second bonding pads 135 spaced apart from each other. Connecting members 141 and 142 may include first connecting members 141 and second connecting members 142 spaced apart from each other. The first pads 111 and 112, the bonding pads 134 and 135 may be connected to each other via the first connecting member 141, and the second pads 112 and 135 may be connected to each other via the second connecting member 142. Pads 111 and 112, bonding pads 134 and 135, and connecting members 141 and 142 are each described as two, but may be changed to one, three, or four depending on the connection method. Furthermore, pads 111 and 112, bonding pads 134 and 135, and connecting members 141 and 142 are described as having the same number, but at least one may be a different number. For example, the lower end of the light source section 130 can be electrically connected to the support plate 101 through a through-hole structure, and in this case, the number of bonding pads 134 and 135, pads 111 and 112, and connecting members 141 and 142 can be one.

[0053] The first bonding pad 134 can be used as a cathode terminal, and the second bonding pad 135 can be used as an anode terminal. The first bonding pad 134 and the second bonding pad 135 can be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof. The first bonding pad 134 and the second bonding pad 135 can comprise a single layer or multiple layers, and in the case of multiple layers, they can contain the same or different metals.

[0054] The first connecting member 141 and the second connecting member 142 may include conductive wires, and may include at least one of the metals selected from Au, Cu, Al, Ag, or alternative alloys thereof. The first connecting member 141 and the second connecting member 142 are wires whose width is greater than their thickness, such as strip wires, and the width W of each may be 0.4 mm or greater, for example, in the range of 0.4 mm to 0.9 mm, and the thickness may be 0.15 mm or less, for example, in the range of 0.07 mm to 0.15 mm. The width W of each of the first connecting member 141 and the second connecting member 142 may be greater than twice the thickness of the connecting members 141 and 142, for example, greater than twice and less than 15 times. When the width W is less than the above range, the connecting members 141 and 142 may bend downwards, and the bonding force may decrease, the available current may decrease, and the resistance to external forces may weaken. Additionally, if the width W of the connecting members 141 and 142 is greater than the above range, there is a problem of increased size or material waste of the bonding pads 134 and 135 or pads 111 and 112.

[0055] The first connecting member 141 and the second connecting member 142 include a first end portion 41, a second end portion 43, and a center line portion 42. The first end portion 41 is respectively bonded to a first bonding pad 134 and a second bonding pad 135, and the second end portion 43 is respectively bonded to a first pad 111 and a second pad 112. The center line portion 42 connects the first end portion 41 and the second end portion 43, and may have a curved shape. The center line portion 42 may have, for example, a raised curved shape.

[0056] The center line portion 42 of the first connecting member 141 connects the first end 41, which engages with the first bonding pad 134, and the second end 43, which engages with the first bonding pad 111. The center line portion 42 of the second connecting member 142 connects the first end 41, which engages with the second bonding pad 135, and the second end 43, which engages with the second bonding pad 112. The center line portion 42 can extend from the other side of the light source portion 130 to one side of the circuit board 110. The center line portion 42 can have a length longer than the distance between the circuit board 110 and the light source portion 130.

[0057] The upper surface heights of the first end 41 and the second end 43 of the connecting members 141 and 142 can be different from each other. For example, the upper surface height of the first end 41 of the connecting members 141 and 142 can be set to be lower than the upper surface height of the second end 43, and the height of the highest point of the intermediate line portion 42 can be set to be higher than the upper surface position of the first end 41. The height of the highest point of the intermediate line portion 42 can be set to be higher than the upper surface position of the second end 43.

[0058] The first connecting member 141 and the second connecting member 142 may be parallel or non-parallel to each other. When the first connecting member 141 and the second connecting member 142 are parallel to each other, the distance between the first ends 41 and the distance between the second ends 43 of the first connecting member 141 and the second connecting member 142 may be the same. The distance between the center line portions 42 of the first connecting member 141 and the second connecting member 142 may be the same as the spacing between the first ends 41 and the distance between the second ends 43.

[0059] When the first connecting member 141 and the second connecting member 142 are not parallel to each other, the distance between the first ends 41 of the first connecting member 141 and the second connecting member 142 can be different from the distance between the second ends 43. For example, as Figure 10 As shown, the distance E1 between the first ends 41 of the first connecting member 141 and the second connecting member 142 can be less than the distance E2 between the second ends 43. In this case, imaginary straight lines extending along the first connecting member 141 and the second connecting member 142 can intersect each other.

[0060] like Figure 2 and Figure 3 As shown, relative to the upper surface of the support plate 101, the first connecting member 141 and the second connecting member 142 each have a height difference between a first end 41 and a second end 43. When the first end 41 and the second end 43 are respectively bonded to pads 111 and 112 and to pads 134 and 135, poor bonding or poor opening may occur at each end 41 and 43 due to the height difference between the first end 41 and the second end 43 of the first connecting member 141 and the second connecting member 142. Bonding can be performed by an ultrasonic welding process, which generates heat of 200 degrees or higher.

[0061] In addition, such as Figure 3 As shown in (A), when a line tensile test is performed after the joining of connecting members 141 and 142, opening defects such as heel cracks may occur at the connection between the first end 41 and the intermediate line portion 42 of connecting members 141 and 142, and / or at the connection or bend between the second end 43 and the intermediate line portion 42. Alternatively, joining cracks may occur at the boundary between the first end 41 or the second end 43 and the pads 111 and 112 or the bonding pads 134 and 135. To prevent these opening defects in connecting members 141 and 142, the design takes into account the straight-line distance between the first end 41 and the second end 43, the angle of inclination extending from the first end 41 to the intermediate line portion 42, and the angle of inclination extending from the second end 43 to the intermediate line portion 42. However, when there are large temperature changes or external impacts, cracks may occur at the boundary between the intermediate line portion 42 and the first end 41 and the second end 43 due to flow in the intermediate line portion 42 of connecting members 141 and 142. In other words, it can be seen that the joint where the line is bent is most susceptible to the effects of external forces and the environment during welding.

[0062] Embodiments of the present invention may provide a component having a molded portion made of resin material in at least one of the regions A1 of the first end 41, A2 of the intermediate line portion 42, or A3 of the third end 43 of the connecting members 141 and 142. The component with the molded portion molds at least one, two, or all of the regions A1 of the first end 41, A2 of the intermediate line portion 42, or A3 of the second end 43 of the connecting members 141 and 142, and may fix the position of at least a portion of the connecting members 141 and 142 to protect them from external impact, or prevent metal oxidation by inhibiting moisture penetration into the regions A1 of the first end 41 and A3 of the second end 42. The molded portion may mold at least one or more of the first end 41, intermediate line portion 42, and second end 43 of the first connecting member 141. The molded portion may mold at least one or more of the first end 41, intermediate line portion 42, and second end 43 of the second connecting member 142. The component including the molded portion may be made of a material with a low modulus of elasticity, which may reduce the stress transmitted to the line and increase the joint strength of the joint portion. When using a full test to evaluate lead bond strength (identification strength), the baseline match strength is approximately 135 gf per bond region, and when molded with a component including the molding portion, the baseline bond strength is greater than twice that value. The molding portion and the component including the molding portion will be described in detail in the embodiments described below.

[0063] Figures 4a to 4c and Figure 5 This is an example of a lighting device according to the first embodiment of the present invention.

[0064] like Figures 4a to 4c and Figure 5 As shown, the lighting device 1000 includes a fixing member 120, which has a support plate 101, a circuit board 110, a light source portion 130 on the support plate 101, connecting members 141 and 142 connecting the circuit board 110 and the light source portion 130, and a molded portion 122 covering a portion of the connecting members 141 and 142. The light source portion 130 includes a support member 133 and a light-emitting element 131 disposed on the support member 133, and the light-emitting element 131 may include one or more light-emitting elements. The light source portion 130 may include a resin member 132, and the resin member 132 may be disposed around the periphery of the light-emitting element 131.

[0065] The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may be configured as a ceramic layer or a metal layer. The support member 133 can conduct heat generated from the light-emitting element 131 through the support plate 101. The support member 133 can be bonded to the support plate 101 using an adhesive member 138. The adhesive member 138 may contact the lower surface and lower side surfaces of the support member 133. Because the adhesive member 138 contacts the lower surface and lower side surfaces of the support member 133, the heat generated through the support member 133 can be conducted to the support plate 101.

[0066] The support member 133 can support the light-emitting element 131 and includes a conductive pattern electrically connected to the light-emitting element 131. The light source section 130 may have the light-emitting element 131 on one side and bonding pads 134 and 135 on the other side. The light-emitting element 131 may be disposed on one side of the support member 131 and the bonding pads 134 and 135 may be disposed on the other side of the support member 131. The upper surface height of the bonding pads 134 and 135 may be set to be higher than the upper surface height of the resin member 132, or may be set at the same height as the upper surface height of the resin member 132. A protective element (not shown) for protecting the light-emitting element 131 may be disposed on the support member 133, and the protective element may be implemented as a thyristor, Zener diode, or TVS (transient voltage suppressor), and protects the light-emitting element 131 from ESD (electrostatic discharge).

[0067] The light-emitting element 131 may include at least one of blue, green, or red LED chips. The light-emitting element 131 may be configured as a vertical, horizontal, or flip-chip. The light-emitting element 131 may include an encapsulation having an LED chip and a transparent resin molding portion disposed on the LED chip. The resin component 132 may be formed of a single layer or multiple layers of a material comprising silicone resin or epoxy resin. The resin component 132 may further include a convex lens (not shown) on its upper portion. The light-emitting element 131 may include at least one light-emitting chip 30 disposed on a support component 133 and a wavelength conversion layer 31 disposed on the at least one light-emitting chip 30. There may be one or more light-emitting chips 30, and they may include multiple semiconductor layers made of compound semiconductors of Group II and VI elements and / or Group III and V elements, and at least one or all of the multiple semiconductor layers may include, for example, compound semiconductors of the AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, and InGaAs series. A wavelength conversion layer 31 is disposed on the light-emitting chip 30 and may cover the entire upper surface of the light-emitting chip 30. The wavelength conversion layer 31 converts a portion of the light emitted from the light-emitting chip 30. The wavelength conversion layer 31 may contact the upper surface of the light-emitting chip 30 and a portion of the resin component 132. The wavelength conversion layer 31 may contain at least one, two, or more of yellow phosphors, green phosphors, blue phosphors, and red phosphors. The light-emitting element 131 may emit white light. The light-emitting element 131 may emit light with the highest luminous intensity in a direction perpendicular to the upper surface of the light-emitting element 131. As another example, the light-emitting element 131 may include LED chips with different wavelengths, in which case the wavelength conversion layer may be omitted. LED chips with different wavelengths may include red LED chips, green LED chips, and blue LED chips.

[0068] The light-emitting element 131 may be disposed on one upper side of the support member 133, and bonding pads 134 and 135 may be disposed on the other upper side of the support member 133. The bonding pads 134 and 135 may include a first bonding pad 134 connected to the cathode of the light-emitting element 131 and a second bonding pad 135 connected to the anode of the light-emitting element 131. The support member 133 has an electrode pattern on which the first bonding pad 134 and the second bonding pad 135 are disposed, and the electrode pattern can electrically connect the light-emitting element 131 to the first bonding pad 134 and the second bonding pad 135. The first bonding pad 134 and the second bonding pad 135 may be exposed on the upper surface of the other side of the support member 133. The distance between the light source portion 130 and the circuit board 110 may be 3 mm or greater, for example, in the range of 3 mm to 10 mm or in the range of 3 mm to 8 mm. If the distance is less than the above range, the buffer space due to the difference in thermal expansion between the light source 130 and the circuit board 110 will be reduced, which may decrease the electrical reliability of the first connecting member 141 and the second connecting member 142 when the light source 130 moves. If the distance between the light source 130 and the circuit board 110 is greater than the above range, the length or material of the first connecting member 141 and the second connecting member 142 will increase.

[0069] The fixing member 120 may be disposed on either or both of the circuit board 110 and the support plate 101. The fixing member 120 includes a molding portion 122, and the molding portion 122 may mold at least one region or different regions of each of the connecting members 141 and 142. The fixing member 120 may include a fixing frame 121 for fixing the molding portion 122. The fixing frame 121 may be disposed on the lower part of the fixing member 120, and the molding portion 122 may be disposed on the upper part of the fixing member 120. The fixing frame 121 may be disposed on at least one or both of the circuit board 110 and the support plate 101. The fixing frame 121 may be adhered to or joined to the circuit board 110 and / or the support plate 101. The fixing frame 121 may fix the position of the molding portion 122 below the molding portion 122. The fixing frame 121 may contact at least a portion of the molding portion 122 and may be coupled to at least one of the inner or outer sides of the molding portion 122, or may be coupled to different areas of the molding portion 122. As another example, the fixing member 120 may be formed by the molding portion 122 without a fixing frame.

[0070] The molding portion 122 can contact at least one or both of the first connecting member 141 and the second connecting member 142, and can fix the position of at least a portion of each of the first connecting member 141 and the second connecting member 142. The molding portion 122 can fix the center line portion 42 of at least one of the first connecting member 141 and the second connecting member 142 onto the circuit board 110. The molding portion 122 surrounds and supports the periphery of the center line portion 42 of the first connecting member 141 and the second connecting member 142, thereby fixing the position of the center line portion 42.

[0071] The fixing frame 121 can be disposed on the area that overlaps with the circuit board 110 in the vertical direction. The molding part 122 molds and supports the area of ​​the center line portion 42 of the first connecting member 141 and the second connecting member 142 that overlaps with the circuit board 110 in the vertical direction. The molding part 122 molds and supports the area of ​​the center line portion 42 of the first connecting member 141 and the second connecting member 142 that overlaps with the area between one side of the circuit board 110 and the pads 111 and 112 in the vertical direction.

[0072] The fixing frame 121 can be attached or joined to the circuit board 110. The fixing frame 121 can be attached to sub-pads 113 disposed within the circuit board 110 using a joining member (not shown). The fixing frame 121 may include a bottom 21 attached to the sub-pad 113, and support portions 22 and 23 bent from one or both ends of the bottom 21. The support portions 22 and 23 can be bent Z-directionally from one or both ends of the bottom 21 on the circuit board 110. The bend between the bottom 21 and the support portions 22 and 23 may include a curved surface. The bottom 21 may be disposed between the pads 111 and 112 and one side of the circuit board 110. Figure 4b As shown, the distance G1 between the support portions 22 and 23 on both sides of the fixed frame 121 can be greater than the maximum length of the region having pads 111 and 112 in the first direction X. The distance G1 between the support portions 22 and 23 in the first direction X can be greater than the maximum length D2 of the region having connecting members 141 and 142.

[0073] Sub-pads 113 can be formed of the same material as pads 111 and 112. The fixing frame 121 can be formed of a metallic material, such as at least one of Cu, Ti, Al, Pd, Co, Ni, Ag, and Au, or an alloy of two or more of the aforementioned metals. The fixing frame 121 can be formed as a single layer or multiple layers of metal. The number of fixing frames 121 can be the same as the number of molding portions 122. As another example, the number of molding portions 122 can be greater than the number of fixing frames 121, and in this case, the molding portions 122 can be formed in different regions of the fixing frame 121. As another example, the fixing frame 121 can be made of a non-metallic material.

[0074] A molding portion 122 is disposed on a fixing frame 121, and the fixing frame 121 can be disposed within the region of the molding portion 122. That is, the fixing frame 121 can be attached to the upper surface of the circuit board 110 and embedded in the lower part of the molding portion 122. The molding portion 122 can be disposed on the surface of the bottom 21 of the fixing frame 121 and in the region between the support portions 22 and 23. The molding portion 122 can be disposed on the upper and outer sides of the support portions 22 and 23. The molding portion 122 can be disposed around the periphery of the support portions 22 and 23. Therefore, the molding portion 122 can cover the entire upper surface of the fixing frame 121. Furthermore, the molding portion 122 can contact at least one or both of the surface of the fixing frame 121 and the upper surface of the circuit board 110. The molding portion 122 can be disposed in the region between the first end 41 and the second end 43 of the first connecting member 141. The molding portion 122 can be disposed in the region between the first end 41 and the second end 43 of the second connecting member 142. The molding portion 122 can cover the area of ​​the first connecting member 141 with its highest point, and the height of the uppermost end of the molding portion 122 can be set higher than the highest point of the first connecting member 141. The molding portion 122 covers the highest point of the second connecting member 142, and the uppermost end of the molding portion 122 can be set higher than the highest point of the second connecting member 142. That is, the molding portion 122 can cover the highest point of the middle line portion 42 of the first connecting member 141 and the second connecting member 142, and can cover the area of ​​the middle line portion 42 on the circuit board 110 that overlaps with the circuit board 110 in the vertical direction.

[0075] The molding portion 122 may comprise a resin material, such as silicone or epoxy resin, acrylate, polyurethane, polyolefin, UV resin, or insulating material, or selective mixtures thereof. The molding portion 122 may be applied to the fixing frame 121 and then cured using a method selected from high-temperature curing, room-temperature curing, or UV curing. The molding portion 122 may be an adhesive or insulating component adhered to the connecting members 141 and 142. The molding portion 122 may contain a diffusing agent or reflective material. The molding portion 122 has a plurality of side surfaces and a top surface, and the corner portions between the plurality of side surfaces may include curved or angled surfaces, such as curved surfaces, and the corner portions between each side surface and the top surface may have curved or angled surfaces, such as curved surfaces.

[0076] The support portions 22 and 23 of the fixing frame 121 can be configured as a first support portion 22 and a second support portion 23 disposed on both sides of the bottom 21 in the first direction X, or configured as a first support portion 22 or a second support portion 23 disposed at one end or the other end of the bottom 21 in the first direction X. The upper surfaces of the support portions 22 and 23 can be curved or angled surfaces at corner portions in the second direction Y. The support portions 22 and 23 can protrude toward the outer region of the centerline portion 42 of each of the first connecting member 141 and the second connecting member 142. The fixing frame 121 may further include a support portion (not shown) protruding into the region between the first connecting member 141 and the second connecting member 142. The support portions 22 and 23 can be one or more in number, protruding from the fixing frame 121 toward the upper surface of the molding portion 122, and can be disposed in a region that does not overlap with the centerline portion 42 of the first connecting member 141 and the second connecting member 142 in a direction perpendicular to the upper surface of the support plate 101.

[0077] The fixing member 120, the first connecting member 141, and the second connecting member 142 may overlap in a direction perpendicular to the upper surface of the support plate 101 (i.e., the Z direction). A portion of the fixing member 120, the first connecting member 141, and the second connecting member 142 may overlap in a direction perpendicular to the upper surface of the support plate 101. A portion of the first connecting member 141 and the second connecting member 142, the fixing member 120, and the circuit board 110 may overlap in a direction perpendicular to the upper surface of the support plate 101. The molded portion 122 of the fixing member 120 and a portion of the first connecting member 141 and the second connecting member 142 may overlap in a direction perpendicular to the upper surface of the support plate 101.

[0078] The fixing member 120 can space the position of the midline portion 42 of the first connecting member 141 and the second connecting member 142 from the upper surface of the circuit board 110. The molding portion 122 can space the position of the midline portion 42 of the first connecting member 141 and the second connecting member 142 from the upper surface of the fixing frame 121. The region with the highest point of the midline portion 42 can be located between the upper surface of the circuit board 110 and the upper surface of the molding portion 122. The region with the highest point of the midline portion 42 can be located between the lower surface of the molding portion 122 and the upper surface of the molding portion 122. The region with the highest point of the midline portion 42 can be located between the fixing frame 121 and the upper surface of the molding portion 122.

[0079] The upper end height H1 of the molding portion 122, based on the upper surface of the circuit board 110, can be higher than the height of the highest points of the connecting members 141 and 142. The positions of the highest points of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, can be positioned between the upper end of the molding portion 122 and the fixing frame 121. The height of the highest points of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, can be higher than the bottom 21 of the fixing frame 121 and lower than the upper height of the support portions 22 and 23. As another example, the positions of the highest points of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, can be higher than the upper ends of the support portions 22 and 23 of the fixing frame 121.

[0080] At least one or both of the support portions 22 and 23 of the fixing frame 121 may internally include holes 22A and 23A. The molding portion 122 may engage with the holes 22A and 23A of the support portions 22 and 23. Because the molding portion 122 engages with the holes 22A and 23A of the support portions 22 and 23, it can prevent the molding portion 122 from detaching from or separating from the fixing frame 121. The holes 22A and 23A may be circular or polygonal in shape, and one or more holes 22A and 23A may be provided within each support portion 22 and 23. As another example, the fixing frame 121 may include at least one of a recess, a capturing protrusion, or a capturing projection for securing the molding portion 122.

[0081] like Figure 4b As shown, the length D0 of the fixing member 120 is the length in the first direction X, which is orthogonal to the extending directions of the connecting members 141 and 142, and is the maximum length of the molding portion 122 in the first direction X. The length D0 of the fixing member 120 in the first direction X can be greater than the maximum length of the area where the first pad 111 and the second pad 112 are provided in the first direction X. The length D0 of the fixing member 120 can be greater than the minimum spacing distance D3 between the first connecting member 141 and the second connecting member 142 in the first direction X, and greater than the maximum length D2 of the area where the first connecting member 141 and the second connecting member 142 are provided.

[0082] The length D1 of the fixing frame 121 in the first direction X can be greater than the maximum length of the region having the first bonding pad 134 and the second bonding pad 135 in the first direction X. The length D1 of the fixing frame 121 in the first direction X can be greater than the length D5 of the light source section 130.

[0083] The length D0 of the fixing member 120 in the first direction X varies according to the extending direction of the connecting members 141 and 142, and may, for example, be a length capable of covering the intermediate region of the two connecting members 141 and 142 spaced apart in the first direction X, or may have a length that is 1.5 times or greater than the length (maximum spacing distance) of the region where the two connecting members 141 and 142 are disposed. The length D1 of the fixing frame 121 in the first direction X may be greater than the maximum length of the region in the first direction X having the first pad 111 and the second pad 112.

[0084] The two side surfaces of the fixing member 120 in the first direction X may be further outward in the first direction X than the outer side of each bonding pad 134 and 135 in the first direction X, and may be further outward in the first direction X than the outer side of each pad 111 and 112. The fixing member 120 can prevent vertical and horizontal movement of the first connecting member 141 and the second connecting member 142 relative to the upper surface of the circuit board 110, thereby preventing short circuits caused by contact between the connecting members 141 and 142 and the upper part 102 of the support plate 101.

[0085] The bottom width C2 of the fixing frame 121 in the second direction Y can be equal to or less than the width of the upper surface of the molding portion 122, and can be less than the bottom width C0 of the fixing member 120. Since the bottom width C0 of the fixing member 120 is set to be greater than the bottom width C2 of the fixing frame 121, the molding portion 122 can seal the fixing frame 121 and increase the bonding area between the molding portion 122 and the circuit board 110.

[0086] The bottom width C0 of the fixing member 120 in the second direction Y is the bottom width of the molding portion 122, and can be less than the distance C1 between the pads 111 and 112 of the circuit board 110 and one side surface of the circuit board 110. Therefore, the fixing member 120 can be disposed on the upper surface of the circuit board 110 between the pads 111 and 112 and one side surface of the circuit board 110. The fixing member 120 can be disposed between the light source portion 130 and the pads 111 and 112. The distance D4 between the light source portion 130 and the pads 111 and 112 of the circuit board 110 can be greater than 1 times the bottom width C0 of the fixing member 120, for example, greater than 1 times and less than 3 times. Here, the width P2 of the first bonding pad 134 and the second bonding pad 135 in the second direction Y can be 0.7 mm or greater, for example, in the range of 0.7 mm to 1 mm, and the length P1 in the first direction X can be 1 mm or greater, for example, in the range of 1 mm to 1.4 mm. The width P4 of the first pad 111 and the second pad 112 in the second direction Y can be set within the range of 80% to 120% of the width P2 of the first bonding pad 134 and the second bonding pad 135, respectively. The length P3 of the first pad 111 and the second pad 112 in the first direction X can be set within the range of 80% to 120% of the length P1 of the first bonding pad 134 and the second bonding pad 135, respectively.

[0087] In the first direction X, the two ends of the fixing frame 121 may further protrude from the outside of each of the first connecting member 141 and the second connecting member 142 toward the outside of each of the first bonding pad 134 and the second bonding pad 135 by predetermined distances K1 and K2. For example, distances K1 and K2 may be 0.2 mm or greater, for example, in the range of 0.2 mm to 0.8 mm. Distances K1 and K2 may be distances that prevent the middle line portion 42 of the connecting members 141 and 142 from contacting the support portions 22 and 23 of the fixing frame 121 when the middle line portion 42 of the connecting members 141 and 142 moves to both sides in the first direction X. The fixing member 120 fixes and supports the connecting members 141 and 142 on the circuit board 110, thereby preventing movement of the connecting members 141 and 142 and preventing short circuits between the connecting members 141 and 142 and the support plate 101. Since each of the support members 22 and 23 of the fixed frame 121 is integrated into the interior of the molding portion 122, expansion or contraction of the molding portion 122 in the first direction X can be suppressed. Furthermore, by using the molding portion 122 to protect the area between the ends of the connecting members 141 and 142 with external force, deformation of the connecting members 141 and 142 can be reduced, external exposure can be minimized, and short-circuit problems in the intermediate line portion 42 can be prevented.

[0088] Figure 6a and Figure 6bA first modification of a lighting device according to a first embodiment of the present invention is shown.

[0089] Reference Figure 6a and Figure 6b The lighting device includes a recess 105 therein for accommodating a light source portion 130, and the recess 105 can be recessed from one side of the circuit board 110 to the other side. The length R2 of the recess 105 in the first direction X can be greater than the length D5 of the light source portion 130 in the first direction (see...). Figure 4b And, for example, the length R2 can be greater than one time the length D5 and less than twice the length D5. The length R1 of the recess 105 in the second direction Y can be greater than the length D6 of the light source portion 130 in the second direction Y (see...). Figure 4b Furthermore, for example, the length R1 can be greater than 0.5 times the length D6 and less than 2 times the length D6. That is, the light source portion 130 can be partially or entirely accommodated within the recess 105 in the first direction X. Therefore, a portion of the light source portion 130 can be disposed on the inner side of one side of the circuit board 110.

[0090] First pad 111 and second pad 112 can be disposed on both sides of the recess 105 of the circuit board 110 in a first direction X. That is, the first pad 111 and second pad 112 can be spaced apart in the first direction X by a distance greater than the length R2 of the recess 105. The top view shape of the recess 105 can have a shape corresponding to the top view shape of the light source portion 130, and can be, for example, a square shape or a square shape with curved corners. In addition, the top view shape of the recess 105 can be a shape in which at least a portion of the side surface of the recess 105 has a curved surface. When the light source portion 130 is accommodated in the recess 105, an adhesive member 138 for adhering the light source portion 130 to the upper portion 102 can be placed inside the recess 105. The adhesive member 138 can be spaced apart from the inner surface of the recess 105, or can be in contact with the inner surface of the recess 105. The light source portion 130 can be accommodated and stably disposed inside the recess 105.

[0091] The fixing members 120A and 120B may include a first fixing member 120A and a second fixing member 120B spaced apart in the first direction X and disposed on both sides of the light source portion 130. The first fixing member 120A and the second fixing member 120B may correspond to each other on both sides of the recess 105 in the first direction X. For example, the first fixing member 120A and the second fixing member 120B may be disposed facing each other on both sides of the recess 105 in the first direction X.

[0092] The first bonding pad 134 of the light source unit 130 and the first bonding pad 111 of the circuit board 110 are connected by a first connecting member 141, and the second bonding pad 135 of the light source unit 130 and the second bonding pad 112 of the circuit board 110 are connected by a second connecting member 142. The first connecting member 141 and the second connecting member 142 can extend in the first direction X.

[0093] Each of the first fixing member 120A and the second fixing member 120B includes fixing frames 121A and 121B and molding portions 122A and 122B. The first fixing member 120A may be disposed in the region between the recess 105 and the first pad 111. The second fixing member 120B may be disposed in the region between the recess 105 and the second pad 112. The spacing between the first molding portion 122A and the second molding portion 122B may be spaced apart by a length R2 in the first direction X of the recess 105. As another example, each of the first fixing member 120A and the second fixing member 120B may be configured as molding portions 122A and 122B without fixing frames 121A and 121B.

[0094] The first molding portion 122A of the first fixing member 120A fixes a portion of the first connecting member 141 to the circuit board 110, and the second molding portion 122A of the second fixing member 120B fixes a portion of the second connecting member 142 to the circuit board 110. The first molding portion 122A may be disposed on the upper surface of the circuit board 110 in a region that overlaps vertically with the center line portion 42 of the first connecting member 141. The second molding portion 122B may be disposed on the upper surface of the circuit board 110 in a region that overlaps vertically with the center line portion 42 of the second connecting member 142. A portion of the first connecting member 141 and the second connecting member 142 are molded into the molding portions 122A and 122B of the first fixing member 120A and the second fixing member 120B, and the position of the center line portion 42 of the first connecting member 141 and the second connecting member 142 may be fixed by the molding portions 122A and 122B. Each of the fixing frames 121A and 121B can be adhesively attached to the circuit board 110 or attached to the sub-pad 113 (see [link]). Figure 5 ).

[0095] With reference to the upper surface of circuit board 110, the highest point of the first connecting member 141 may be lower than the highest point of the first fixing member 120A or the highest point of the first molding portion 122A. With reference to the upper surface of circuit board 110, the position of the highest point of the second connecting member 142 may be lower than the position of the highest point of the second fixing member 120B or the highest point of the second molding portion 122B. The length D10 of each of the first fixing member 120A and the second fixing member 120B in the first direction X may be greater than the length C10 in the second direction Y. The length D10 of each of the first fixing member 120A and the second fixing member 120B in the second direction Y may be greater than the length P3 of each of the first pad 111 and the second pad 112 in the second direction Y, and the length C10 of each of the first fixing member 120A and the second fixing member 120B in the first direction X may be greater than the length P4 of each of the first pad 111 and the second pad 112 in the first direction X. Here, the lengths P3 and P4 of the first pad 111 and the second pad 112 in the first direction X and the second direction Y can vary according to the direction in which the connecting members 141 and 142 extend.

[0096] The first fixing member 120A and the second fixing member 120B may include a bottom 21 as disclosed in FIG. 6(b) and support portions 22 and 23 that are bent on one or both sides of the bottom 21 in the second direction Y. Molded portions 122A and 122B may cover the bottom 21 and the support portions 22 and 23. The height of the highest point of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, may be higher than the bottom 21 of the fixing frame 121A and lower than the upper height of the support portions 22 and 23. As another example, the height of the highest point of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, may be higher than the upper height of the support portions 22 and 23 of the fixing frame 121A and lower than the height of the highest point of the first molding portion 122A and the second molding portion 122B. The length D10 of each of the molding portions 122A and 122B or the fixing members 120A and 120B in the second direction Y can be less than the length R1 of the recess 105 in the second direction Y. The distance between the first fixing member 120A and the second fixing member 120B in the first direction X can be greater than or equal to the length R2 of the recess 105 in the first direction X, and can reduce interference with the light emitted from the light source portion 130.

[0097] Molded portions 122A and 122B can be formed within the holes 22A and 23A of the support portions 22 and 23. That is, molded portions 122A and 122B can extend inside the holes 22A and 23A of the support portions 22 and 23, as well as on the inner and outer sides of the support portions 22 and 23, and can be adhered to and fixed to the fixing frames 121A and 121B. To determine the angle of light emitted from the light-emitting element 131, the inner surfaces of the molded portions 122A and 122B can be inclined relative to the upper surface of the circuit board 110, or the area between the first fixing member 120A and the second fixing member 120B and the molded portions 122A and 122B can not overlap with the upper region of the light-emitting element 131 in the first direction X. The area between the first fixing member 120A and the second fixing member 120B and the molded portions 122A and 122B can not overlap with the upper region of the light-emitting element 131 in the second direction Y.

[0098] The length D10 of each of the first fixing member 120A and the second fixing member 120B in the second direction Y varies according to the extending direction of the first connecting member 141 and the second connecting member 142, and may be, for example, a length capable of covering a portion of one of the connecting members 141 and 142, or may be the same as the width W of one of the connecting members 141 and 142 (see...). Figure 4b The first fixing member 120A and the second fixing member 120B respectively secure and support a portion of the first connecting member 141 and the second connecting member 142 (e.g., a portion of the center line portion 42) to the circuit board 110. This prevents movement of the first connecting member 141 and the second connecting member 142 and prevents short circuits between the first connecting member 141 and the second connecting member 142 and the support plate 101.

[0099] Figure 7 and Figure 8 A second modification of the lighting device according to the first embodiment of the present invention is shown.

[0100] Reference Figure 7 and Figure 8 The circuit board 110 may include a concave recess 106 on one side. The recess 106 may have a circular, elliptical, or semi-circular shape when viewed from above. A portion or lower part of the fixing member 120C may be located in the recess 106. Since the fixing member 120C is located within the recess 106, the distance between the light source 130 and the circuit board 110 can be reduced.

[0101] The fixing member 120C includes a fixing frame 121C and a molding portion 122C. The fixing frame 121C can be bonded to the upper surface of the support plate 101 with adhesive or with a connecting member (not shown). The fixing frame 121C can be integrally formed with the support plate 101. The fixing frame 121C can be made of metal and can be bonded to the support plate 101. The fixing frame 121C can include a columnar lower frame 25 and a plate-shaped upper frame 26. The columnar shape can be a circular or polygonal column, and the plate shape can have a circular or polygonal top view. The upper frame 26 can have a diameter D13 or width larger than the diameter or width of the lower frame 25, and can have a length D2 greater than the region where the connecting members 141 and 142 are provided in the first direction X (see...). Figure 4b The diameter D13 or width is larger. The fixing member 120C can be formed by the molding part 122C without the fixing frame 121C. That is, the diameter D13 is greater than the length of the area that overlaps in the vertical direction with the middle line portion 42 of the first connecting member 141 and the second connecting member 142 with reference to the upper surface of the circuit board 110, or has a length longer than the length between the two ends of the middle line portion 42 of the first connecting member 141 and the second connecting member 142 in the first direction X.

[0102] The molding portion 122C is disposed on the periphery of the lower frame 25 of the fixing member 120C and on the surface and periphery of the upper frame 26, and is captured by the capturing structure between the lower frame 25 and the upper frame 26, so that detachment or separation can be prevented by the structure or shape of the fixing frame 121C. The lower part of the molding portion 122C may be cylindrical or polygonal, and the upper surface may have a convex curved surface or a flat surface. The upper end of the molding portion 122C may be set to be higher than the upper end height H2 of the fixing frame 121C and higher than the upper surface height of the circuit board 110, based on the upper surface of the support plate 101. The upper end of the molding portion 122C may have a height higher than the highest point of the first connecting member 141 and the second connecting member 142, based on the upper surface of the support plate 101.

[0103] A portion of the molding portion 122C may extend to the upper surface of the circuit board 110. A portion of the molding portion 122C may extend over at least one of the first end 41 and the second end 43 of the first connecting member 141. A portion of the molding portion 122C may extend over at least one of the first end 41 and the second end 43 of the second connecting member 142. A portion of the molding portion 122C may extend over at least one of the first bonding pad 134 and the second bonding pad 135. A portion of the molding portion 122C may extend over at least one of the first pad 111 and the second pad 112. The area extended by the molding portion 122C may include at least one or two or more of the aforementioned components (e.g., the first end 41, the second end 43, bonding pads 134 and 135, or pads 111 and 112).

[0104] Each of the first connecting member 141 and the second connecting member 142 connects between the bonding pads 134 and 135 of the light source portion 130 and the pads 111 and 112 of the circuit board 110, and extends on the fixing frame 121C. A molding portion 122C is formed within the recess 106 and on the surface of the fixing frame 121C, and surrounds a portion of the first connecting member 141 and the second connecting member 142, for example, a portion of the centerline portion 42. Based on the upper surface of the support plate 101, the molding portion 122C may overlap the recess 106 in the vertical direction, protruding upwards beyond the highest point of the connecting members 141 and 142, and supporting and fixing a portion of the connecting members 141 and 142, namely the centerline portion 42.

[0105] A portion of the molding portion 122C may contact the inner surface of the recess 106 of the circuit board 110 and / or the upper surface of the circuit board 110. A portion of the molding portion 122C may contact the other side of the light source portion 130 and the upper surface of the support plate 101. A portion of the molding portion 122C may contact the surface of the adhesive member 138.

[0106] The fixing member 120C fixes and supports the connecting members 141 and 142 in the area between the circuit board 110 and the light source part 110, thereby preventing the connecting members 141 and 142 from moving and preventing short circuits between the connecting members 141 and 142 and the support plate 101.

[0107] Figures 9 to 11 This is a diagram of a lighting device according to a second embodiment of the present invention.

[0108] Reference Figures 9 to 11The lighting device may include a support plate 101, a circuit board 110, a light source 130, connecting members 141 and 142, and a molding portion 170. The configuration of the support plate 101, circuit board 110, light source 130, and connecting members 141 and 142 may include the configuration and description of the first embodiment disclosed above. The molding portion 170 comprises a resin material and may comprise a transparent resin material, a translucent resin material, or a reflective resin material. The material of the molding portion 170 may comprise resin materials such as silicone or epoxy resin, acrylates, polyurethane, polyolefins, UV resins, or insulating materials, or may be selective mixtures thereof.

[0109] The support plate 101 has a concave receiving portion 108 on its upper part 102, into which the lower part of the circuit board 110 can be inserted. The stepped bottom 102A of the upper part 102 of the support plate 101 is the bottom of the receiving portion 108 and can be set to be lower than the upper surface of the upper part 102. The lower surface of the circuit board 110 inside the receiving portion 108 can be adhered to the bottom of the receiving portion 108 using an adhesive film 118. Since the circuit board 110 is located inside the receiving portion 108, the height of the upper surface of the circuit board 110 can be set to be lower than the upper surface of the support plate 101 on which the light source portion 130 is provided. That is, the upper surface of the circuit board 110 can be set on a horizontal line extending from the upper surface of the light source portion 130 relative to the upper surface of the support plate 101 on which the light source portion 130 is provided, or it can be set to be lower than the horizontal line extending from the upper surface of the light source portion 130. In this way, because the upper surface of the circuit board 110 is set lower, the position of the highest point of the connecting members 141 and 142 can be lower than... Figure 2 The position of the highest point of the connecting components 141 and 142.

[0110] The molding portion 170 can be disposed on the other side of the light source portion 130 and on one side of the circuit board 110. The molding portion 170 can be disposed on the other side of the light source portion 130, one side of the circuit board 110, and in the area between the light source portion 130 and the circuit board 110. The other side of the light source portion 130 is the area of ​​the light source portion 130 adjacent to the circuit board 110, and is an area that does not overlap with the light-emitting element 131 in the vertical direction Z. The other side of the light source portion 130 is an area that overlaps with the bonding pads 134 and 135 of the light source portion 130 in the vertical direction. The area on one side of the circuit board 110 can be an area adjacent to the light source portion 130, and can overlap with the pads 111 and 112 in the vertical direction.

[0111] The molding portion 170 can cover the entire surface of the connecting members 141 and 142. For example, the molding portion 170 can cover the first end 41, the middle line portion 42, and the second end 43 of the connecting members 141 and 142. The molding portion 170 can have a convex curved surface in the area between the light source portion 130 and the circuit board 110. The highest point Zy1 of the molding portion 170 can be set higher than the highest point of each of the connecting members 141 and 142. For example, the distance G11 between the highest point Zy1 of the molding portion 170 and the highest point of the connecting members 141 and 142 can be spaced apart by 0.1 mm or more, for example, in the range of 0.1 mm to 0.3 mm. Therefore, the molding portion 170 protects the surfaces of the connecting members 141 and 142 and prevents oxidation of the connecting members 141 and 142. The height H12 of the highest point Zy1 of the molding section 170 relative to the upper surface of the circuit board 110 can be 1.2 mm or greater, for example, in the range of 1.2 mm to 2 mm or 1.2 mm to 1.5 mm.

[0112] The molding portion 170 can extend from one side of the light source portion 130 to one side of the circuit board 110. The top view shape of the molding portion 170 can include a polygonal shape, such as a square, circle, or ellipse, or a shape with straight and curved contours. The molding portion 170 has an outer wall 170A, and the outer wall 170A can be formed in a ring shape along the surfaces of the light source portion 130, the adhesive member 138, the upper surface of the support plate 101, and the upper surface of the circuit board 110. Figure 10 As shown, a portion 170B of the molding portion 170 can extend into the receiving portion 108 in which the circuit board 110 is received. The portion 170B of the molding portion 170 can adhere one side of the circuit board 110 to the receiving portion 108.

[0113] The outer surface of the outer wall 170A can be configured as the outer contour line of the molding portion 170. The shape of the outer wall 170A can include a polygonal shape, a circular shape, an elliptical shape, a shape with convex and concave curves, or a shape with curves and straight lines. The outer wall 170A can contact the upper surface of the resin member 132 of the light source portion 130 and the upper surface of the protective layer 110B of the circuit board 110. The outer wall 170A can be formed of the same material as the molding portion 170. The outer wall 170A is provided around the area of ​​the molding portion 170 and can have a dam shape. The outer surface of the outer wall 170A can be a vertical surface, a surface with an inclination, or a curved surface. The outer wall 170A can prevent liquid resin from overflowing during the manufacturing process of the molding portion 170. Therefore, the problem of the molding portion 170 penetrating the surface of the light-emitting element 131 through the outer wall 170A on the upper surface of the light source portion 130 can be prevented. In addition, since the outer contour of the molding section 170 is formed by the outer wall 170A, the amount of resin liquid dispensed to the molding section 170 can be reduced.

[0114] On the light source section 130, the outer surface of the outer wall 170A can be spaced apart from the light-emitting element 131. On the upper surface of the light source section 130, the outer wall 170A can be disposed between the light-emitting element 131 and the bonding pads 134 and 135, and can be disposed closer to the bonding pads 134 and 135 than the light-emitting element 131.

[0115] The upper end of the outer wall 170A on the light source section 130 can be equal to or lower than the highest point of the connecting members 141 and 142, and the height H13 of the upper end of the outer wall 170A on the light source section 130, based on the upper surface of the circuit board 110, can be 0.9 mm or greater, for example, in the range of 0.9 mm to 1.30 mm. The height H11 of the highest point of the connecting members 141 and 142, based on the upper surface of the circuit board 110, can be 1 mm or greater, for example, in the range of 1 mm to 1.2 mm. The distance G12 between the horizontal line passing through the upper end of the outer wall 170A on the light source section 130 and the horizontal line passing through the highest point of the connecting members 141 and 142 can be equal to or less than the distance G11. By storing the circuit board 110 in the storage portion 108 of the support plate 101, the upper surface of the circuit board 110 can be lower than the upper surface of the light source section 130, and the highest point of the connecting members 141 and 142 can also be lowered. Therefore, the highest point Zy1 of the molding section 170 can be reduced, so as not to affect the distribution of the beam angle Q1 of the light-emitting element 131.

[0116] like Figure 11 As shown, the molding portion 170 can be provided on the bonding pads 134 and 135 of the light source portion 130 and the pads 111 and 112 of the circuit board 110. The molding portion 170 seals the surfaces of the bonding pads 134 and 135 and the pads 111 and 112, and can suppress the reduction of the bonding force between the first end 41 and the second end 43 of the connecting members 141 and 142 and the bonding pads 134 and 135 or the pads 111 and 112.

[0117] The minimum distance E1 between the first connecting member 141 and the first end portion 41 of the second connecting member 142 may be less than or equal to the minimum clearance E2 between the first connecting member 141 and the second end portion 43 of the second connecting member 142. For example, the minimum distances E1 and E2 may satisfy the condition: E1 ≤ E2, and preferably, E1 < E2. This can increase the areas of the first pad 111 and the second pad 112 on the circuit board 110, and can also increase the distance between the first pad 111 and the second pad 112 to be greater than the distance between the first bonding pad 134 and the second bonding pad 135. Therefore, within the minimum spacing E1 and E2, E2 may be greater than 1 times the distance E1 and less than 2 times the distance E1. If the minimum distance E2 is greater than the above range, the materials of the connecting members 141 and 142 may be wasted, and each end portion 41 and 43 may be inclined due to the interval between the connecting members 141 and 142, and thus, the bonding and fixing of the device for bonding each end portion 41 and 43 may become difficult. The minimum clearance E1 between the first end portions 41 of the first connecting member 141 and the second connecting member 142 may be greater than the widths W of the connecting members 141 and 142, for example, may be 1 mm or greater or within the range of 1 mm to 6 mm.

[0118] The included angle between two imaginary straight lines extending in the longitudinal direction of the first connecting member 141 and the second connecting member 142 may be 1 degree or greater, for example, 1 degree to 90 degrees or 10 degrees to 60 degrees. If the included angle is less than the above range, the bonding area of the molding portion on the circuit board 110 may be reduced. This enables the second end portions 43 of the connecting members 141 and 142 to be supported by the molding portion having a larger area on the circuit board 110.

[0119] Referring to Figure 11 and Figure 12 , the outer contour line of the molding portion 170 is the outer contour line of the outer wall 170A, and may include a first side portion to a fourth side portion S1, S2, S3, and S4. The first side portion S1 extends along the first direction X on the light source portion 130, the second side portion S2 extends along the first direction X on the circuit board 110, and the third side portion S3 and the fourth side portion S4 may extend along the second direction Y from both ends of the first side portion S1 and the second side portion S2. The first side portion S1 and the second side portion S2 are the lines on both sides of the molding portion 170 in the first direction X, and the third side portion S3 and the fourth side portion S4 are the lines on both sides of the molding portion 170 in the second direction Y. The area between the first side portion S1 and the third side portion S3 or the area on one side of the third side portion S3 may have a convex curved surface area. The area between the first side portion S1 and the fourth side portion S4 or one side area of the fourth side portion S4 may have a convex curved surface area.

[0120] The first side portion S1 can extend in a straight line along the first direction X on the light source portion 130, and the second side portion S2 can extend in a straight line along the first direction X on the circuit board 110. Since the first side portion S1 is spaced apart from the light-emitting element 131 in a straight line along the first direction X on the light source portion 130, it can prevent a part of the molding portion 170 from penetrating into the surface of the light-emitting element 131, and it can prevent problems affecting the distribution of the beam angle.

[0121] The maximum length of the third side portion S3 and the fourth side portion S4 of the molding portion 170 in the first direction X can be greater than the distance X1 in the first direction X between the two sides of the region having the first bonding pad 134 and the second bonding pad 135, and can be greater than the distance X2 in the first direction X between the two sides of the region having the first pad 111 and the second pad 112. The maximum length of the third side portion S3 and the fourth side portion S4 of the molding portion 170 on both sides of the light source portion 130 in the first direction X can be greater than the length D5 of the light source portion 130 in the first direction X. The linear distance D0 between the outer ends of the first end portion 41 and the second end portion 43 of each connecting member 141 and 142 can be less than the distance in the second direction Y between the first side portion S1 and the second side portion S2 of the molding portion 170.

[0122] The third side portion S3 of the molding portion 170 may include a portion having a convex curved surface on its outer side and a portion having a concave curved surface. Specifically, the third side portion S3 may include a 3-1 portion S31 extending from one end of the first side portion S1 to the adhesive member 138, a 3-2 portion S32 extending outward from the 3-1 portion S31 with a convex curved surface, a 3-3 portion S33 extending from the 3-2 portion S32 with a concave curved surface, a 3-4 portion S34 connecting the 3-3 portion S33 and the 3-5 portion S35 and disposed on the receiving portion 108, and a protruding 3-5 portion S35 extending from the 3-4 portion S34 to one end of the second side portion S2. Here, a convex curved surface is provided in the boundary region between the 3-1 portion S31 and the 3-2 portion S32. The third-third part S33 of the molding part 170 is recessed into the area between the circuit board 110 and the light source part 130, and the third-fourth part S34 can be recessed towards the inside or the bottom of the storage part 108 due to the stepped area of ​​the storage part 108.

[0123] The fourth side portion S4 of the molding portion 170 may include a portion having a convex curved surface on the outer side and a portion having a concave curved surface. Specifically, the fourth side portion S4 may include a 4-1 portion S41 extending from the other end of the first side portion S1 to the adhesive member 138, a 4-2 portion S42 extending outward from the 4-1 portion S41 with a convex curved surface, a 4-3 portion S43 extending from the 4-2 portion S42 with a concave curved surface, a 4-4 portion S44 connecting the 4-3 portion S43 and the 4-5 portion S45 and disposed on the receiving portion 108, and a protruding 4-5 portion S45 extending from the 4-4 portion S44 to the other end of the second side portion S2. Here, a convex curved surface is provided in the boundary region between the 4-1 portion S41 and the 4-2 portion S42. The fourth-third part S43 of the molding part 170 is recessed into the area between the circuit board 110 and the light source part 130, and the fourth-fourth part S44 can be recessed inward or toward the bottom of the storage part 108 due to the stepped area of ​​the storage part 108.

[0124] The third-side portion S32 (3-2) and the fourth-side portion S42 (4-2) of the molded portion 170 can protrude outward in a raised shape from a straight line passing through the first side portion S1. The distance between the third-side portion S32 (3-2) and the fourth-side portion S42 (4-2) of the molded portion 170 can be greater than the length D5 of the light source portion 130 in the first direction X. The third-side portion S32 (3-2) and the fourth-side portion S42 (4-2) of the molded portion 170 can cover the adhesive member 138 adhered to the outside of the light source portion 130, thereby preventing movement of the light source portion 130. The distance X3 between the outer surface of the third-side portion S32 (3-2) and the light source portion 130 can be at least 0.3 mm or greater, for example, in the range of 0.3 mm to 0.5 mm. The distance X4 between the outer surface of the fourth side S4 of the molding part 170, the fourth-second part S42, and the light source part 130 can be at least 0.3 mm or greater, for example, in the range of 0.3 mm to 0.5 mm.

[0125] The distance between the first side S1 of the molding portion 170 on the light source portion 130 and the light-emitting element 131 can be 0 or greater and 0.2 mm or less. The first side S1 of the molding portion 170 can cover the first bonding pad 134 and the second bonding pad 135, and can be independent of the wavelength conversion layer 31 (see...). Figure 10 The second side S2 of the molding portion 170 can be 0 or greater and 0.2 mm or less between it and the first pad 111 and the second pad 112 on the circuit board 110. The second side S2 of the molding portion 170 can cover the first pad 111 and the second pad 112.

[0126] The maximum length of the third side S3 and the fourth side S4 of the molding portion 170 in the second direction Y can be greater than the distance Y1 between the two sides of the region having the first bonding pad 134 and the second bonding pad 135, and the first pad 111 and the second pad 112, such that the molding portion 170 can seal the first bonding pad 134 and the second bonding pad 135, and the first pad 111 and the second pad 112. The minimum length of the molding portion 170 extending along the first side S1 of the molding portion 170 on the light source portion 130 in the first direction X can be greater than the length D5 of the light source portion 130 in the first direction X. The minimum length of the molding portion 170 extending along the second side S2 of the molding portion 170 on the circuit board 140 in the first direction X can be greater than the distance X2 between the two sides of the region having the first pad 111 and the second pad 112.

[0127] As another example, such as Figure 13 and Figure 14 As shown, the first side portion S1 of the molding portion 170 may have a concave shape on the light source portion 130 toward the region between the first bonding pad 134 and the second bonding pad 135. That is, as the first side portion S1 moves toward the first bonding pad 134 and the second bonding pad 135, the distance from the light-emitting element 131 may gradually increase. The first side portion S1 may be a concave curve, or it may extend in an inclined shape toward the third-1 portion S31 and the fourth-1 portion S41 based on the region between the first bonding pad 134 and the second bonding pad 135. Therefore, since the molding portion 170 covering the first bonding pad 134 and the second bonding pad 135 is provided along the first side portion S1, the problem of the molding portion 170 extending to the surface of the light-emitting element 131 can be prevented.

[0128] Figure 15 and Figure 16 This is a schematic diagram illustrating the processes used to manufacture the molding part. (Example) Figure 15 As shown, the outer wall 170A has a first side portion S1 and a second side portion S2 extending in the first direction X along the outer sides of the first bonding pad 134 and the second bonding pad 135 of the light source portion 130 and the outer sides of the first pad 111 and the second pad 112 in the second direction Y. It may also have a third side portion S3 and a fourth side portion S4 extending in the second direction Y from both ends of the first side portion S1 and the second side portion S2. The top view shape of the outer wall 170A can be a polygon, and as other examples, it can be an ellipse or a circle, a polygon with curved corners, or a shape with straight lines and curves. Furthermore, the shape of the outer wall 170A can be... Figures 11 to 14 The outer contour shape of the molded part 170.

[0129] On the light source section 130, the outer surface of the outer wall 170A or the outer surface of the first side S1 can be spaced apart from the outer ends of the first bonding pad 134 and the second bonding pad 135 by distances WA3 and WA4, which are in the range of 0 mm to 0.2 mm. On the circuit board 110, the outer surface of the outer wall 170A or the outer surface of the second side S2 can be spaced apart from the outer ends of the first pad 111 and the second pad 112 by distances WB3 and WB4, which are in the range of 0 mm to 0.2 mm. On the light source section 130, the outer surfaces of the two sides of the outer wall 170A or the third side S3 and the fourth side S4 can be spaced apart from the outer ends of the first bonding pad 134 and the second bonding pad 135 by distances WA1 and WA2, which are in the range of 0 mm to 0.2 mm. On the circuit board 110, the outer surfaces of the two sides or the third side S3 and the fourth side S4 of the outer wall 170A can be spaced apart from the outer ends of the first pad 111 and the second pad 112 by distances WB1 and WB2, which are in the range of 0 mm to 0.2 mm. Since the distance X2 between the two sides of the area having the first pad 111 and the second pad 112 in the first direction X is set to be greater than the length D5 of the light source portion 130 in the first direction X, the spacing between the third side S3 and the fourth side S4 on the circuit board 110 can be set to be greater than the distance X2 between the two sides of the area having the first pad 111 and the second pad 112 in the first direction X.

[0130] like Figure 15 and Figure 16 As shown, when the outer wall 170A cures, molding liquid (i.e., liquid resin) is dispensed onto the inner side of the outer wall 170A and cured. The molding portion 170 fills the inner region of the outer wall 170A, and the liquid resin does not flow out to the outer side of the outer wall 170A. Furthermore, since the outer wall 170A forms the outer contour of the molding portion 170, the amount of resin dispensed to the molding portion 170 can be reduced. Additionally, the corner portions of the outer wall 170A can be bent, thereby reducing the amount of resin dispensed during the formation of the molding portion 170. Specifically, the corner portions between the first side S1 and the third side S3 and the fourth side S4 of the outer wall 170A, and the corner portions between the second side S2 and the third side S3 and the fourth side S4, can be bent. The molding portion 170 can be made of the same material as the outer wall 170A, in which case the boundary surface between the molding portion 170 and the outer wall 170A can be removed.

[0131] like Figure 17As shown, the first side portion S1 of the outer wall 170A can be deformed. The first side portion S1 may include a first-1 portion S11 having a concave curve shape on the light source portion 130, a first-2 portion S12 extending from one end of the first-1 portion S11 with a convex curve to one end of the third side portion S3, and a first-3 portion S13 extending from the other end of the first-1 portion S11 with a convex curve to one end of the fourth side portion S4. The closer the first-1 portion S11 is to the region between the first bonding pad 134 and the second bonding pad 135 at both ends of the first-1 portion S11, the further away it is from the light-emitting element 131. Since the distance between the first-1 portion S11 and the upper surface of the light-emitting element 131 increases from both sides of the light source portion 130 toward the center, interference with the beam angular distribution of the light-emitting element 131 can be suppressed, and the amount of resin liquid can be reduced. Furthermore, parts 1-2 (S12) and 1-3 (S13) have convex curved shapes extending from both sides of the light source 130 toward both sides of the light source 130, thereby reducing the loss of light emitted toward both sides of the light source 130. When resin liquid is dispensed and hardened inside the outer wall 170A to form a molding part, parts 1-1 (S11), 1-2 (S12), and 1-3 (S13) can be set as the lower end lines of the convex curved surfaces in the molding part.

[0132] In the lighting device according to an embodiment of the present invention, such as Figure 18 and Figure 19 As shown, light emitted from the light source unit 130 can be extracted by the light guiding module 500 made of a transparent material. The lighting device disclosed above can be limited to a light source module.

[0133] like Figure 18 and Figure 19 As shown, the light guiding module 500 includes a transparent plate 510 and a light guiding portion 520. The transparent plate 510 may be made of a transparent plastic material, and the light guiding portion 520 protrudes from the transparent plate 510 and is also made of a transparent plastic material. The transparent plastic material may contain PC or PMMA. The transparent plate 510 and the light guiding portion 520 may be made of the same material. The transparent plate 510 and the light guiding portion 520 may be integrally formed from the transparent material.

[0134] The transparent plate 510 aligns the positions of the light source section 130 and the light guide section 520 and can be attached to the support plate 101. Furthermore, the transparent plate 510 can cover the upper periphery of the light source section 130, allowing light emitted from the light source section 130 to effectively strike the light guide section 520. The lower or upper surface of the transparent plate 510 can be configured to be parallel to the upper surface of the support plate 101. The transparent plate 510 can be spaced a predetermined distance from the upper surface of the support plate 101 and can be located at a height higher than the uppermost end of the fixing member 120 in FIG. 1, for example, 2.5 mm or greater, in the range of 2.5 mm to 7 mm.

[0135] The light guide portion 520 is configured in a columnar shape, and may include, for example, a circular columnar or polygonal columnar shape. Depending on the directional distribution of the light source portion 130, the light guide portion 520 may have a shape with a narrow lower region and a wide upper region. The beam angle of the light source portion 130 may be 70 degrees or greater, for example, in the range of 70 to 150 degrees. The light guide portion 520 may overlap with the light source portion 130 in the vertical direction. The light guide portion 520 emits point light from the light source portion 130 as surface light. The light guide portion 520 may have a lower surface area and / or upper surface area larger than the upper surface area of ​​the light source portion 130. The light guide portion 520 may have a length D5 greater than one side of the light source portion 130 (see [reference]). Figure 10 The diameter or width of the light guide portion 520 should be at least 1.5 times the length of one side of the light source portion 130, preferably at least 5 mm, for example, in the range of 5 mm to 10 mm. If the diameter or width of the light guide portion 520 is smaller than the above range, the amount of incident light may be reduced, and if the diameter or width of the light guide portion 520 is larger than the above range, the luminous intensity or luminous intensity distribution may be reduced.

[0136] The transparent plate 510 includes a first support protrusion 531 and a second support protrusion 535 at its bottom. The first support protrusion 531 can be disposed on both sides of the lower outer portion of the transparent plate 510, and the second support protrusion 535 can be disposed on both sides of the lower inner portion. Here, the inner side can be the direction of the circuit board 110 disposed at the center of the support plate 101. The transparent plate 510 can be connected to the support plate 101 through the first support protrusion 531 and the second support protrusion 535 by a fastening device. A joint portion 535A for connecting to the first support protrusion 531 and the second support protrusion 535 can be provided on the upper surface of the transparent plate 510, or a washer or nut can be connected thereto.

[0137] The light guiding module 500 can extract light, such as white light, emitted by the light source section 130 of the lighting device 1000. Furthermore, the light guiding section 520 is positioned in the direction of highest luminous intensity emission from the light source section 130, and due to light incidence, the light can be emitted to the outside without any light loss. This light guiding module can be applied to the lighting devices disclosed in the first and second embodiments.

[0138] Reference Figure 20 A vehicle headlight 90 having a lighting device according to an embodiment includes a light source module 93 and a housing 92. The light source module 93 is disposed within the housing 92 to radiate light, and the radiated light can be reflected in the emission direction by the inner surface 92A of the housing 92. The housing 92 has a chamber 95 therein, and the chamber 95 is an area open in the emission direction or on one side, and the light source module 93 can be incorporated therein. The light source module 93 can include the lighting device disclosed above. When viewed from the emission direction or the opening direction, the shape of the chamber 95 can be hemispherical, semi-elliptical, circular, or elliptical.

[0139] The housing 92 may comprise a metallic or non-metallic material, and the non-metallic material may comprise a plastic material. The housing 92 may be a reflector for a headlight. The inner surface 92A of the housing 92 or the inner surface 92A of the chamber 95 may be coated with a highly reflective material, or may include a reflective layer made of an anti-reflective (AR) material. For example, the highly reflective material may comprise at least one metal, such as Al, Ag, or Au, and the anti-reflective material may comprise at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, or ZrO2. The reflective layer of the inner surface 92A may be a single layer or multiple layers. Because the chamber 95 is provided with reflective material around its periphery, it can be used as a reflector cup.

[0140] The headlight 90 may include an inner lens and / or an outer lens that projects light emitted through the housing 92. The light distribution pattern of the light emitted from the light source module 93 may be adjusted according to the shape of the inner lens or the number of light source sections. The light source module 93 selectively radiates light with high beam and low beam distribution patterns, and the high beam or low beam distribution pattern may be automatically turned on and off according to driving mode or driving conditions. The inner surface 92A of the housing 92 may include a partially dome-shaped or partially elliptical parabolic surface. The inner surface 92A may have multiple facets. The facets may be freeform, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a freeform portion, a flat portion, and / or a curved portion (e.g., any combination thereof). In some embodiments, the facets (or at least the inward-facing surfaces on the facets) may be defined at least approximately or otherwise by algebraic equations. For example, the shape of the facets or inward-facing surfaces may be represented by one or more fifth-order algebraic equations (although other equations of any order are also possible). In at least one exemplary embodiment, the surface (or, for example, a coating) of the facet has a high reflectivity (e.g., greater than 80%). Non-limiting examples of the facet and / or the coating on the facet include aluminum and silver, but other reflective materials may be used. The inner surface 92A of the housing 92 is spaced laterally from the light source module 93, and light emitted from the light source module 93 can be reflected by the inner surface 92A and focused on the emitting side of the housing 92, illuminating it as high beam or low beam.

[0141] The exterior of housing 92 may include various features and accessories for mounting or connecting headlight 90 to the vehicle interior, and may have electrical interfaces, such as sockets, for connecting power and / or signals. The housing 92 and chamber 95 described above are merely examples and can be modified into various shapes. According to an embodiment, housing 92 can be used as a reflector for the left / right headlight 90.

[0142] Another example of a lamp is the application of a reflector to a lighting device, such as... Figure 21 As shown. The lighting device can be the lighting device disclosed in the embodiment or another example. Figure 21 As shown, the support plate 101 may include a concave receiving portion 108 in its upper part. Therefore, the stepped bottom 102A of the upper portion 102 of the support plate 101 can be configured to be lower than the upper surface of the upper portion 102. The receiving portion 108 can be configured to allow the circuit board 110 to be inserted therein. The depth of the receiving portion 108 can be 0.5 times or more than the thickness of the circuit board 110, for example, 0.5 to 1.5 times. If the depth of the receiving portion 108 is greater than the above range, the rigidity in the stepped region of the upper portion 102 may be reduced, and if the depth of the receiving portion 108 is less than the above range, the effect of reducing the height of the line's highest point may be reduced.

[0143] The lower end of reflector 95A can be disposed on the upper part 102 of support plate 101. The lower end of reflector 95A can be disposed in a region adjacent to the light source portion 130 disposed on support plate 101. The lower end of reflector 95A can be configured to surround at least three sides and the upper surface of light source portion 130. The region between the upper end of reflector 95A and the upper surface of support plate 101 can be a region in which light is emitted. The interior of reflector 95A, i.e., the region between reflector 95A and the upper part of support plate 101, can be an open region for light mixing.

[0144] The vertical distance between the upper end of reflector 95A and the upper surface of support plate 101 can be greater than the distance between the upper surface of light source portion 130 and the point where an imaginary line perpendicular to the upper surface of light source portion 130 intersects with reflector 95A. Therefore, reflector 95A can radiate light emitted from light source portion 130 in a lateral direction. Here, the lateral direction is the direction away from the line perpendicular to light source portion 130, and is the direction in which light reflected by reflector 95A and light emitted from light source portion 130 are emitted. As another example, the lower end of reflector 95A can be disposed on circuit board 110. As yet another example, the lower end of reflector 95A can be disposed on circuit board 110 and the upper part 102 of support plate 101. Depending on the position of reflector 95A, the direction of emitted light can vary, and for example, the direction of emitted light between support plate 101 and reflector 95A can be at least one of the directions orthogonal to an imaginary line perpendicular to light source portion 130.

[0145] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, content related to such combinations and modifications should be interpreted as being included within the scope of the present invention. Additionally, although embodiments have been primarily described above, these are merely examples and do not limit the present invention, and those skilled in the art will understand that various modifications and applications not shown above are possible without departing from the essential characteristics of these embodiments. For example, each component specifically shown in the embodiments can be implemented by modification. Differences related to these modifications and applications should be interpreted as being included within the scope of the present invention as defined in the appended claims.

Claims

1. A lighting device, comprising: A support plate having a concave storage portion at its upper part; A circuit board, the circuit board being disposed on the receiving portion of the support plate; Multiple pads are disposed on one side of the circuit board; A light source unit is disposed on the support plate and includes a light-emitting element and a plurality of bonding pads; Multiple connecting members, wherein the multiple connecting members respectively connect the multiple pads to the multiple bonding pads; as well as A molding section, the molding section covering the plurality of connecting members, the plurality of pads, and the plurality of bonding pads, The outer contour of the molded part has a first side, a second side, a third side, and a fourth side. Wherein, the first side portion of the molding portion extends in a first direction along the region between the upper surface of the light-emitting element and the upper surface of the plurality of bonding pads on the light source portion. Wherein, the second side portion of the molded portion extends on the circuit board along the outer side of the plurality of pads in a first direction, and The third and fourth sides of the molding portion extend from both ends of the first and second sides in a second direction perpendicular to the first direction, and have convex and concave curves.

2. The lighting device according to claim 1, wherein, The plurality of pads includes a first pad and a second pad adjacent to the light source portion. The plurality of bonding pads includes a first bonding pad and a second bonding pad adjacent to the circuit board. The plurality of connecting members include a first connecting member connecting the first pad and the first bonding pad, and a second connecting member connecting the second pad and the second bonding pad. The uppermost end of the molding part is configured to be higher than the highest point of the first connecting member and the second connecting member, with the upper surface of the circuit board as a reference.

3. The lighting device according to claim 2, wherein, The highest point of the molding part is located in the area between the circuit board and the light source part.

4. The lighting device according to claim 3, wherein, The highest points of the first connecting member and the second connecting member are located in the area between the circuit board and the light source.

5. The lighting device according to any one of claims 1 to 4, further comprising: An adhesive component is disposed between the light source portion and the support plate. The third and fourth sides of the molding portion protrude further outward than the adhesive members disposed on both sides of the light source portion in the first direction.

6. The lighting device according to claim 5, wherein, The first side of the molding portion has a straight or concave shape along the plurality of bonding pads on the light source portion.

7. The lighting device according to claim 7, wherein, The distance between the first side of the molding portion and the light-emitting element gradually increases from both sides of the light source portion in the first direction toward the area between the plurality of bonding pads.

8. The lighting device according to claim 7, wherein, One side region of the third side and one side region of the fourth side have raised curved surface regions on both sides of the light source.

9. The lighting device according to any one of claims 2 to 4, wherein, Each of the first connecting member and the second connecting member includes a first end joined to the first bonding pad and the second bonding pad, a second end joined to the first pad and the second pad, and a midline portion connecting the first end and the second end. Wherein, the distance between the second end of the first connecting member and the second end of the second connecting member is greater than the distance between the first end of the first connecting member and the first end of the second connecting member.

10. The lighting device according to any one of claims 1 to 4, wherein, Each of the plurality of connecting members is a strip with a width greater than twice its thickness.

11. A lamp, comprising: Lighting device that emits white light, A light guiding module or reflector, wherein the light guiding module or reflector is disposed on the lighting device. The lighting device is the lighting device according to any one of claims 1 to 4.

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