Polishing equipment for pressure sensor sintering base

Abstract

The invention relates to the technical field of polishing equipment, in particular to polishing equipment for a pressure sensor sintering base, which comprises a polishing box, a movable top frame is rotatably arranged at the top of the polishing box through a hinge, and a workpiece positioning frame is slidably arranged at the lower part in the polishing box; a machining driving frame is fixedly arranged at the bottom of the movable top frame, and a polishing assembly is arranged at the bottom of the machining driving frame. A positioning assembly is arranged on the top of the workpiece positioning frame. Through the structural design of multi-dimensional driving and lifting adjustment, multi-procedure integration of rough polishing, fine polishing and hole inner wall polishing is achieved, whole-procedure machining can be completed without replacing equipment or grinding tools, and machining continuity and efficiency are greatly improved; the fine polishing mechanism adopts a magneto-rheological filling medium to be matched with an electromagnetic regulation and control structure, the hardness of a grinding medium can be dynamically adjusted according to the machining requirements of workpieces made of different materials, precise adaptation of polishing pressure is achieved, and the flatness and consistency of the fine polishing surface are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of polishing equipment technology, specifically to a polishing device for a pressure sensor sintering base. Background Technology

[0002] As the core load-bearing component of the pressure sensor, the sintered base of the pressure sensor is mostly made of brittle and hard materials such as ceramics and single crystal silicon. The surface flatness, the smoothness of the inner wall of the hole and the surface cleanliness after processing directly determine the detection accuracy and service life of the sensor. Therefore, the polishing equipment is subject to stringent requirements of high precision, high adaptability, low damage and process integration.

[0003] Existing polishing equipment for processing sintered substrates often employs rigid clamping mechanisms for workpiece positioning, resulting in poor adaptability. It can only meet the positioning requirements of substrates of a single specification and shape, failing to accommodate sintered substrates of different sizes and irregular structures. Furthermore, rigid contact easily leads to indentations and scratches on the brittle substrate surface. The polishing function is also relatively limited, typically only offering rough or fine polishing of flat surfaces. Polishing the inner walls of holes in the sintered substrate requires additional specialized tooling or equipment, leading to fragmented processes, low processing efficiency, and secondary damage during workpiece transfer between different processing stages. In addition, the hardness of the grinding media in existing fine polishing mechanisms is often fixed, failing to dynamically adjust the polishing pressure according to the physical characteristics of different sintered substrate materials. This results in unstable polishing quality, prone to over-polishing or under-polishing, making it difficult to meet the processing requirements of high-precision pressure sensor sintered substrates. Summary of the Invention

[0004] The purpose of this invention is to provide a polishing device for sintering bases of pressure sensors. Through multi-dimensional driving and adjustable structural design, it realizes the integration of multiple processes such as rough polishing, fine polishing, and polishing of the inner wall of holes. The entire process can be completed without changing equipment or grinding tools, which greatly improves the continuity and efficiency of processing. The fine polishing mechanism adopts a magnetorheological filling medium combined with an electromagnetic control structure, which can dynamically adjust the hardness of the grinding medium according to the processing requirements of different workpiece materials, achieve precise matching of polishing pressure, and ensure the flatness and consistency of the fine polished surface.

[0005] To achieve the above effects, the technical solution adopted by the present invention is as follows: a polishing device for a pressure sensor sintering base, comprising a polishing box, a movable top frame rotatably mounted on the top of the polishing box via a hinge, and a workpiece positioning frame slidably mounted inside the lower part of the polishing box; a processing drive frame fixedly mounted at the bottom of the movable top frame, and a polishing component mounted at the bottom of the processing drive frame; a positioning component mounted on the top of the workpiece positioning frame; a dust collection frame fixedly mounted inside the lower part of the polishing box, with a dust collection port on the inner wall of the dust collection frame; a dust collection box fixedly mounted on the left side of the polishing box, the dust collection box being connected to the inside of the dust collection frame via a dust pump; and loading / unloading linear slides fixedly mounted on both sides of the inside of the polishing box, with the opposite sides of the two loading / unloading linear slides slidably connected to the two sides of the workpiece positioning frame respectively.

[0006] Preferably, the positioning component includes a central suction frame and a connecting strip. The central suction frame is fixedly installed at the top center of the workpiece positioning frame, and a vacuum pump is installed at the bottom of the central suction frame. Positioning linear slides are fixedly installed around the top of the workpiece positioning frame. Movable frames are slidably installed on the top of the four positioning linear slides. Three positioning servo electric cylinders are fixedly installed inside the four movable frames, and connecting strips are fixedly installed at the drive ends of the three positioning servo electric cylinders.

[0007] Preferably, a silicone pad is provided on the top of the central adsorption rack; a rubber pad is fixedly provided on one side of the connecting strip, and the connecting strip is made of thermoplastic polyurethane.

[0008] Preferably, the polishing assembly includes a mounting frame and a rotary table. An X-axis linear slide is fixedly mounted at the bottom center of the processing drive frame. A sliding frame is slidably mounted at the bottom of the X-axis linear slide. A Y-axis linear slide is fixedly mounted at the bottom of the sliding frame. A Z-axis servo cylinder is slidably mounted at the bottom of the Y-axis linear slide. A mounting frame is fixedly mounted at the bottom end of the drive shaft of the Z-axis servo cylinder.

[0009] Preferably, a polishing servo motor is fixedly installed inside the mounting frame, and a rotating platform is rotatably installed at the bottom of the mounting frame. One end of the output shaft of the polishing servo motor is fixedly connected to the top of the rotating platform. A coarse polishing block is fixedly installed at the bottom of the rotating platform, and an elastic buffer pad is provided between the coarse polishing block and the rotating platform. The elastic buffer pad and the coarse polishing block are bonded together with thermally conductive adhesive. An air pump is fixedly installed around the inside of the mounting frame, and an air outlet connected to the air pump outlet is provided around the bottom of the mounting frame.

[0010] Preferably, the rotary table has a mounting groove at the bottom center, and two adjusting electric cylinders are fixedly installed at the top inside the mounting groove. A connecting plate is fixedly installed at the bottom end of the drive shaft of the two adjusting electric cylinders. A polishing servo electric cylinder is fixedly installed at the top center of the connecting plate, and a base frame is rotatably installed at the bottom of the connecting plate. The top of the base frame is fixedly connected to one end of the output shaft of the polishing servo electric cylinder.

[0011] Preferably, a ring is fixedly disposed at the bottom of the base frame, and an annular groove is provided at the bottom of the ring, with a filling medium disposed inside the annular groove; an electromagnetic coil is fixedly disposed inside the base frame, and the electromagnetic coil is in contact with the inner wall of the ring; an air blowing ring is also disposed inside the base frame, and a miniature air pump communicating with the air blowing ring is disposed inside the base frame, with the air outlet of the air blowing ring facing the polishing needle side.

[0012] Preferably, the filling medium is a uniform mixture of silicone resin matrix, carbonyl iron powder, and cerium oxide abrasive particles; the electromagnetic coil uses φ0.08mm enameled copper wire with 120 turns, and the outer layer of the electromagnetic coil is wrapped with a polyimide insulating film.

[0013] Preferably, two adjusting electric cylinders are fixedly installed in the middle of the base frame, and a connecting plate is fixedly installed at the bottom of the drive shaft of the two adjusting electric cylinders; a polishing servo electric cylinder is fixedly installed in the middle of the top of the connecting plate, and a rotating block is rotatably installed at the bottom of the connecting plate; one end of the output shaft of the polishing servo electric cylinder is fixedly connected to the top of the rotating block; several miniature linear slides are fixedly installed at the bottom of the rotating block, a fixed block is slidably installed at the bottom of the miniature linear slide, a miniature servo electric cylinder is fixedly installed at the bottom of the fixed block, and a polishing needle is fixedly installed at the bottom of the output shaft of the miniature servo electric cylinder.

[0014] Preferably, the plurality of miniature linear slides are distributed at equal angles about the central axis of the connecting plate two; the plurality of polishing needles are all tapered and tapered, with the bottom of the polishing needles having an arc-shaped tip, and the plurality of polishing needles are distributed radially outward with the center of the rotating block as the center, and the included angle between adjacent polishing needles is 60°.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. In this invention, a composite positioning method combining adsorption and elastic clamping is adopted in the positioning and loading / unloading stages. This achieves rapid and accurate positioning of the workpiece while avoiding damage to the brittle base caused by rigid clamping due to the contact structure of the elastic material. At the same time, it can be adapted to workpieces of different shapes and specifications, greatly improving the versatility of the equipment. The design of the automated loading / unloading structure realizes automated control of workpieces entering and leaving the processing area, reducing manual intervention. This not only improves processing efficiency but also reduces positioning errors caused by manual operation, laying the foundation for high-precision polishing.

[0016] 2. In the polishing process of this invention, a multi-dimensional drive and adjustable structure design integrates multiple processes, including rough polishing, fine polishing, and polishing of the inner walls of holes. All processes can be completed without changing equipment or grinding tools, significantly improving processing continuity and efficiency. The fine polishing mechanism uses a magnetorheological filling medium combined with an electromagnetic control structure, which can dynamically adjust the hardness of the grinding medium according to the processing requirements of different workpiece materials, achieving precise matching of polishing pressure and ensuring the flatness and consistency of the finely polished surface. A dedicated mechanism designed for polishing the inner walls of holes uses radially distributed conical polishing needles combined with multi-dimensional rotation drive to achieve all-round, dead-angle-free polishing of the inner walls of holes, solving the problem of blind spots in hole polishing in existing equipment. Furthermore, the equipment integrates a composite dust removal structure of multi-directional air blowing and overall dust collection, which can quickly remove dust generated during polishing, avoiding the impact of dust adhesion or residue on polishing quality, while ensuring the cleanliness of the processing environment, further improving processing stability and workpiece qualification rate. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a polishing device structure for a pressure sensor sintering base according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the polishing box according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the positioning component structure according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the movable top frame and processing drive frame structure according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the mounting frame and rotary table structure according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the rotary table and base frame structure according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the base frame and rotating block structure according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the rotating block and polishing needle structure in an embodiment of the present invention.

[0019] In the diagram, 1. Polishing box; 2. Movable top frame; 3. Workpiece positioning frame; 4. Dust collection frame; 5. Dust collection box; 6. Machining drive frame; 7. Polishing assembly; 8. Loading and unloading linear slide; 9. Positioning assembly; 10. Central suction frame; 11. Positioning linear slide; 12. Movable frame; 13. Positioning servo cylinder; 14. Connecting strip; 15. Rubber pad; 16. X-axis linear slide; 17. Y-axis linear slide; 18. Sliding frame; 19. Z-axis servo cylinder; 20. Mounting frame; 21. Rotary table; 2. Polishing servo motor one; 23. Air pump; 24. Air inlet; 25. Mounting slot; 26. Rough polishing block; 27. Adjusting electric cylinder one; 28. Connecting plate one; 29. ​​Polishing servo electric cylinder two; 30. Base frame; 31. Ring; 32. Filling medium; 33. Electromagnetic coil; 34. Air blowing ring; 35. Adjusting electric cylinder two; 36. Connecting plate two; 37. Polishing servo electric cylinder three; 38. Rotating block; 39. Miniature linear slide; 40. Fixing block; 41. Miniature servo electric cylinder; 42. Polishing needle. Detailed Implementation

[0020] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments. Example 1

[0021] Please see Figures 1 to 8 As shown in the figure, this embodiment discloses a polishing device for a pressure sensor sintering base, including a polishing box 1. A movable top frame 2 is rotatably mounted on the top of the polishing box 1 via a hinge. A workpiece positioning frame 3 is also slidably mounted on the lower part of the interior of the polishing box 1. A processing drive frame 6 is fixedly mounted on the bottom of the movable top frame 2. A polishing component 7 is mounted on the bottom of the processing drive frame 6. A positioning component 9 is mounted on the top of the workpiece positioning frame 3. The positioning component 9 is used to position and clamp the pressure sensor sintering base to ensure the stability of the positioning, thereby improving the polishing accuracy of the pressure sensor sintering base.

[0022] As a further explanation in this application, a dust collection frame 4 is fixedly installed at the bottom inside the polishing box 1. The inner wall of the dust collection frame 4 is provided with a dust suction port. A dust collection box 5 is also fixedly installed on the left side of the polishing box 1. The interior of the dust collection box 5 is connected to the interior of the dust collection frame 4 through a dust pump. The dust pump inside the dust collection box 5 works in conjunction with the dust collection frame 4 to extract the polishing dust inside the polishing box 1, thereby ensuring the surface cleanliness of the workpiece after polishing inside the polishing box 1.

[0023] Specifically, such as Figure 3As shown, the positioning component 9 includes a central adsorption frame 10 and a connecting strip 14. The central adsorption frame 10 is fixedly installed in the middle of the top of the workpiece positioning frame 3. The central adsorption frame 10 works in conjunction with a vacuum pump installed at the bottom. A silicone pad is also installed on the top of the central adsorption frame 10 to protect the positioning contact surface of the pressure sensor sintering base and avoid scratching the bottom of the pressure sensor sintering base. Positioning linear slides 11 are fixedly installed around the top of the workpiece positioning frame 3. Movable frames 12 are slidably installed on the top of each of the four positioning linear slides 11. Three positioning servo electric cylinders 13 are fixedly installed inside each of the four movable frames 12. Connecting bars 14 are fixedly installed at the drive ends of the three positioning servo electric cylinders 13, and rubber pads 15 are fixedly installed on one side of the connecting bars 14. The connecting bars 14 are made of thermoplastic polyurethane, which allows them to deform elastically. The connecting bars 14 are moved in conjunction with the drive ends of the three positioning servo electric cylinders 13, allowing them to conform to the sintering base of pressure sensors of different shapes and specifications. In conjunction with the central adsorption frame 10, the connecting bars 14 are adsorbed and positioned at the center of the bottom of the sintering base of the pressure sensor, thereby improving the positioning stability of the sintering base of the pressure sensor.

[0024] As a preferred implementation of the scheme in this embodiment, in order to realize the automatic loading and unloading control of the workpiece positioning frame 3 inside the polishing box 1, loading and unloading linear slides 8 are fixedly installed on both sides inside the polishing box 1. The opposite sides of the two loading and unloading linear slides 8 are slidably connected to the two sides of the workpiece positioning frame 3 respectively. By connecting the two loading and unloading linear slides 8 to the rear of the two sides of the workpiece positioning frame 3, the automatic sliding control of the workpiece positioning frame 3 inside the polishing box 1 is realized, so that the workpiece positioning frame 3 can automatically slide out from the inside of the polishing box 1, thereby facilitating the positioning and placement of the pressure sensor sintering base on the top of the workpiece positioning frame 3.

[0025] It should be noted that by using the polishing box 1 as the main body of the equipment, the movable top frame 2 on its top is set by hinge rotation, which facilitates the opening and closing of the equipment; the loading and unloading linear slides 8 on both sides inside the polishing box 1 are slidably connected to the workpiece positioning frame 3, which can realize the automatic sliding out and sliding in of the workpiece positioning frame 3, which not only facilitates the positioning and placement of the pressure sensor sintering base on the top of the workpiece positioning frame 3, but also improves the convenience of loading and unloading the equipment; the dust collection frame 4 at the bottom of the polishing box 1, together with the dust collection box 5 on the left and the internal dust collection pump, can timely extract the dust generated during the polishing process, effectively ensuring the surface cleanliness of the sintering base after polishing; the polishing component 7 carried by the processing drive frame 6 at the bottom of the movable top frame 2 can cooperate with the positioned sintering base The sintered base is stably polished. The central adsorption frame 10 in the positioning component 9 uses the adsorption effect of a vacuum pump and is equipped with a silicone pad on top. This achieves adsorption positioning of the bottom center of the sintered base while avoiding scratches on its bottom contact surface. The positioning linear slides 11 around the top of the workpiece positioning frame 3 can drive the movable frame 12 to move. The three positioning servo electric cylinders 13 in the movable frame 12 drive the thermoplastic polyurethane connecting strip 14. Combined with the rubber pad 15 on one side of the connecting strip 14, the elastic deformation characteristics of the connecting strip 14 are used to fit the sintered base of different shapes and specifications. Through multi-position positioning clamping, the stability of the sintered base positioning is further improved with the central adsorption frame 10, thereby helping to ensure the polishing accuracy. Example 2

[0026] Specifically, such as Figure 4 As shown in the figure, this embodiment specifically discloses the detailed structure of the polishing component 7 in the above embodiment. The polishing component 7 includes a mounting frame 20 and a rotary table 21. An X-axis linear slide 16 is fixedly arranged in the middle of the bottom of the processing drive frame 6. A sliding frame 18 is slidably arranged at the bottom of the X-axis linear slide 16. A Y-axis linear slide 17 is fixedly arranged at the bottom of the sliding frame 18. A Z-axis servo cylinder 19 is slidably arranged at the bottom of the Y-axis linear slide 17. A mounting frame 20 is fixedly arranged at the bottom end of the drive shaft of the Z-axis servo cylinder 19.

[0027] Furthermore, such as Figure 5As shown, a polishing servo motor 22 is fixedly installed inside the mounting bracket 20. A rotating table 21 is rotatably installed at the bottom of the mounting bracket 20. One end of the output shaft of the polishing servo motor 22 is fixedly connected to the top of the rotating table 21. A coarse polishing block 26 is fixedly installed at the bottom of the rotating table 21. An elastic buffer pad is provided between the top of the coarse polishing block 26 and the bottom of the rotating table 21. The elastic buffer pad and the coarse polishing block 26 are bonded together with thermally conductive adhesive. Air pumps 23 are fixedly installed around the inside of the mounting bracket 20, and air blowing ports 24 connected to the air outlets of the air pumps 23 are provided around the bottom of the mounting bracket 20. Air is blown around the rotating table 21 by the air pumps 23 and the air blowing ports 24 to blow away the polishing dust generated on the surface of the pressure sensor sintering base, thereby further improving the polishing accuracy of the pressure sensor sintering base.

[0028] It should be noted that during the rough polishing of the pressure sensor sintered base, the drive end of the Z-axis servo cylinder 19 controls the mounting frame 20 to move downwards until the rough polishing block 26 at the bottom of the base frame 30 contacts the polished surface of the pressure sensor sintered base. The output shaft of the polishing servo motor 22 controls the rotary table 21 to rotate, and the rough polishing block 26 is used to perform rough polishing on the surface of the pressure sensor sintered base. In conjunction with the X-axis linear slide 16 and the Y-axis linear slide 17, the rotary table 21 is controlled to move on the polished surface of the pressure sensor sintered base, so as to achieve comprehensive polishing of the polished surface of the pressure sensor sintered base.

[0029] As a further explanation in this application, such as Figure 6As shown, a mounting groove 25 is provided in the middle of the bottom of the rotary table 21. Two adjusting electric cylinders 27 are fixedly installed at the top inside the mounting groove 25. A connecting plate 28 is fixedly installed at the bottom end of the drive shaft of the two adjusting electric cylinders 27. A polishing servo electric cylinder 29 is fixedly installed in the middle of the top of the connecting plate 28. A base frame 30 is rotatably installed at the bottom of the connecting plate 28. The top of the base frame 30 is fixedly connected to one end of the output shaft of the polishing servo electric cylinder 29. A ring 31 is fixedly installed at the bottom of the base frame 30, and a ring is provided at the bottom of the ring 31. The annular groove contains a filling medium 32, which is a uniform mixture of silicone resin matrix, carbonyl iron powder, and cerium oxide abrasive particles. The carbonyl iron powder is a magnetic response medium, and the cerium oxide is a fine polishing medium. The mixed medium is poured into the annular groove of the substrate and cured at a constant temperature of 60 degrees Celsius for 2 hours. After curing, the surface of the functional layer is flush with the upper surface of the substrate, and the overall thickness is maintained at 2 mm. The working surface of the functional layer is pre-polished, with an initial roughness Ra≤0.1nm to ensure adhesion to the substrate surface. An electromagnetic coil 33 is fixedly installed inside the base frame 30, and the electromagnetic coil 33 is located and attached to the inner wall of the ring 31. The electromagnetic coil 33 uses φ0.08mm enameled copper wire with 120 turns, and the outer layer of the electromagnetic coil 33 is wrapped with a polyimide insulating film. The hardness of the magnetorheological medium is controlled by the electromagnetic coil 33: when current is input, carbonyl iron powder is oriented under the action of magnetic field, which increases the overall hardness of the filling medium 32; when the current decreases, the hardness decreases, thereby adapting to the fine polishing pressure requirements of different material bases.

[0030] It should be noted that when the functional layer formed by the filling medium 32 is used to polish the surface of the pressure sensor sintered base, the driving end of the adjusting electric cylinder 27 is used to control the connecting plate 28 to move downward. The connecting plate 28 drives the base frame 30 to slide downward from the inside of the mounting groove 25, so that the bottom surface of the functional layer formed by the filling medium 32 is lower than the polished surface of the coarse polishing block 26. Then, the mounting frame 20 is controlled to move downward by the Z-axis servo electric cylinder 19 until the functional layer formed by the filling medium 32 contacts the polished surface of the pressure sensor sintered base. The current of the electromagnetic coil 33 is controlled according to the fine polishing pressure requirements of the pressure sensor sintered base of different materials to increase the hardness of the filling medium 32. The output shaft of the polishing servo electric cylinder 29 controls the base frame 30 to rotate, and the polished surface of the pressure sensor sintered base is finely polished by the filling medium 32.

[0031] As a preferred embodiment of this invention, such as Figure 7 and Figure 8As shown, two adjusting electric cylinders 35 are fixedly installed in the middle of the base frame 30. A connecting plate 36 is fixedly installed at the bottom of the drive shaft of the two adjusting electric cylinders 35. A polishing servo electric cylinder 37 is fixedly installed in the middle of the top of the connecting plate 36. A rotating block 38 is rotatably installed at the bottom of the connecting plate 36. One end of the output shaft of the polishing servo electric cylinder 37 is fixedly connected to the top of the rotating block 38.

[0032] Furthermore, several miniature linear slides 39 are fixedly mounted on the bottom of the rotating block 38. Each miniature linear slide 39 has a fixed block 40 slidably mounted on its bottom. Each fixed block 40 has a miniature servo cylinder 41 fixedly mounted on its bottom. Polishing needles 42 are fixedly mounted on the bottom of the output shafts of each miniature servo cylinder 41. An air blowing ring 34 is also installed inside the base frame 30, and a miniature air pump communicating with the air blowing ring 34 is installed inside the base frame 30. The air blower from the air blowing ring 34... The opening faces the polishing needle 42 on one side; several miniature linear slides 39 are arranged at equal angles about the central axis of the connecting plate 36; several polishing needles 42 all adopt a tapered gradient structure, the bottom of the polishing needle 42 is an arc-shaped tip, and the main body of the polishing needle 42 is tapered, ensuring that the contact area between the polishing needle 42 and the hole wall dynamically adapts with the feed depth; several polishing needles 42 are centered on the center of the rotating block 38, the included angle between adjacent polishing needles 42 is 60°, and several polishing needles 42 are arranged in a radial pattern that diffuses outward.

[0033] It should be noted that when polishing the holes of the pressure sensor sintered base, the drive end of the electric cylinder 35 is adjusted to control the connecting plate 36 to move downward until the bottom end of the rotating block 38 is level with the bottom end of the functional layer formed by the filling medium 32. The spacing of several polishing needles 42 is adjusted according to the hole specifications of the pressure sensor sintered base. The bottom ends of several polishing needles 42 are used to contact the inner wall of the hole of the pressure sensor sintered base, and the several polishing needles 42 are used to pre-position the inner wall of the hole of the pressure sensor sintered base. The output shaft of the polishing servo electric cylinder 37 is used to control the rotating block 38 to rotate, which drives the several polishing needles 42 to polish the inner wall of the hole of the pressure sensor sintered base. At the same time, the output shaft of the micro servo electric cylinder 41 controls the polishing needles 42 to rotate, ensuring the polishing quality of the surface of the several polishing needles 42 on the inner wall of the hole of the pressure sensor sintered base.

[0034] It should be noted that the X-axis linear slide 16, sliding frame 18, Y-axis linear slide 17, and Z-axis servo cylinder 19 at the bottom of the machining drive frame 6 work together to drive the mounting frame 20 to move in multiple dimensions, facilitating coverage of the entire polished surface of the pressure sensor sintering base. The polishing servo motor 22 inside the mounting frame 20 drives the rotary table 21 to rotate. The coarse polishing block 26 at the bottom of the rotary table 21, along with the elastic buffer pad and thermal conductive adhesive between it and the rotary table 21, can complete the coarse polishing process, buffer against hard contact damage to the base, and simultaneously achieve heat dissipation. The air pump 23 and air nozzle 24 inside the mounting frame 20 can blow away the dust generated during polishing, further ensuring the accuracy of coarse polishing. The adjusting cylinder 27 in the mounting slot 25 of the rotary table 21 can control the connecting plate 28 to drive the base frame 30 to rise and fall, facilitating the switching between coarse and fine polishing processes. The polishing servo cylinder 29 on the connecting plate 28 can drive the base frame 30 to rotate. The base frame 30, in conjunction with the filling medium 32 in the bottom ring 31 and the electromagnetic coil 33 on the inner wall, can adjust the hardness of the medium by current to adapt to the fine polishing pressure requirements of different base materials. The molding and pre-grinding of the filling medium also ensures its adhesion to the base surface. The adjusting electric cylinder 35 in the base frame 30 can control the connecting plate 36 to drive the rotating block 38 to rise and fall. The micro linear slide 39 and the fixed block 40 at the bottom of the rotating block 38 can adjust the spacing of several polishing needles 42 to adapt to base holes of different specifications. The tapered gradient structure and radial distribution of the polishing needles 42 can dynamically fit the hole wall with the feed depth. In conjunction with the polishing servo electric cylinder 37 driving the rotating block 38 to rotate and the micro servo electric cylinder 41 driving the polishing needles 42 to rotate, the polishing quality of the inner wall of the hole can be guaranteed. At the same time, the air blowing ring 34 and the micro air pump in the base frame 30 can clean the dust generated during hole polishing, further improving the polishing effect. Example 3

[0035] Specifically, this embodiment discloses a polishing method for a polishing device used for a pressure sensor sintering base, including the following steps: Step 1: Control the loading and unloading linear slides 8 on both sides inside the polishing box 1 to drive the workpiece positioning frame 3 to slide out automatically from inside the polishing box 1; place the pressure sensor sintering base to be polished above the center adsorption frame 10 on the top of the workpiece positioning frame 3, and then control the loading and unloading linear slides 8 to drive the workpiece positioning frame 3 back into the polishing box 1, and close the movable top frame 2.

[0036] Step 2: Start the vacuum pump at the bottom of the central adsorption frame 10. Use the silicone pad at the top of the central adsorption frame 10 to adsorb the bottom center of the sintering base to complete the initial positioning. Control the positioning linear slides 11 around the top of the workpiece positioning frame 3 to move the movable frame 12 to the corresponding position. Then start the positioning servo electric cylinder 13 in the movable frame 12 to drive the thermoplastic polyurethane connecting strip 14 to move towards the sintering base side, so that the rubber pad 15 on one side of the connecting strip 14 fits against the side of the sintering base, and completes the stable positioning of the sintering base with the help of the central adsorption frame 10.

[0037] Step 3: Control the linkage of the X-axis linear slide 16, sliding frame 18, and Y-axis linear slide 17 at the bottom of the machining drive frame 6, and adjust the position of the Z-axis servo cylinder 19; start the Z-axis servo cylinder 19 to drive the mounting frame 20 to move downwards until the coarse polishing block 26 at the bottom of the rotary table 21 contacts the polishing surface of the sintered base; start the polishing servo motor 22 inside the mounting frame 20 to drive the rotary table 21 to rotate, and use the coarse polishing block 26 to coarsely polish the surface of the sintered base, while coordinating with the X-axis linear slide 16 and Y-axis linear slide 17 to control the rotary table 21 to cover the entire polishing surface; during the process, start the air pump 23 inside the mounting frame 20 to blow air around the rotary table 21 through the air outlet 24, and at the same time start the dust collection pump in the dust collection box 5 to extract polishing dust with the dust collection frame 4.

[0038] Step 4: Activate the adjusting electric cylinder 27 in the mounting slot 25 of the rotary table 21, drive the connecting plate 28 to slide the base frame 30 downward from the mounting slot 25, so that the bottom end of the functional layer of the filling medium 32 in the bottom ring 31 of the base frame 30 is lower than the polishing surface of the coarse polishing block 26; control the Z-axis servo electric cylinder 19 to move the mounting frame 20 downward until the functional layer of the filling medium 32 contacts the polishing surface of the sintered base; adjust the current of the electromagnetic coil 33 inside the base frame 30 according to the material of the sintered base to regulate the hardness of the filling medium 32; activate the polishing servo electric cylinder 29 to rotate the base frame 30, and use the filling medium 32 to complete the fine polishing of the sintered base surface.

[0039] Step 5: Activate the second adjusting electric cylinder 35 inside the base frame 30 to drive the second connecting plate 36 to move downwards, so that the bottom end of the rotating block 38 is level with the bottom end of the functional layer of the filling medium 32; control the micro linear slide 39 at the bottom of the rotating block 38 to drive the fixed block 40 to move, adjust the spacing of several polishing needles 42, so that the arc-shaped tip of the polishing needle 42 contacts the inner wall of the hole to complete the pre-positioning; activate the third polishing servo electric cylinder 37 to drive the rotating block 38 to rotate, and at the same time activate the micro servo electric cylinder 41 to drive the polishing needle 42 to rotate, polishing the inner wall of the hole; during the process, activate the micro air pump inside the base frame 30 to blow air to the polishing needle 42 side through the air blowing ring 34 to clean the polishing dust in the hole.

[0040] Step 6: After all polishing processes are completed, control the Z-axis servo cylinder 19 to drive the polishing assembly 7 to reset and open the movable top frame 2; start the loading and unloading linear slide 8 to drive the workpiece positioning frame 3 to slide out of the polishing box 1, turn off the vacuum pump of the central adsorption frame 10, retract the connecting strip 14, and remove the polished pressure sensor sintered base.

[0041] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0042] This invention is not limited to the optional embodiments described above, and anyone can derive other various forms of products based on the inspiration of this invention. The specific embodiments described above should not be construed as limiting the scope of protection of this invention; the scope of protection of this invention should be determined by the claims, and the specification can be used to interpret the claims.

Claims

1. A polishing device for a sintering base of a pressure sensor, characterized in that, The polishing box (1) includes a polishing box (1), a movable top frame (2) is mounted on the top of the polishing box (1) via a hinge, and a workpiece positioning frame (3) is slidably mounted inside the polishing box (1) at the bottom; a processing drive frame (6) is fixedly mounted at the bottom of the movable top frame (2), and a polishing component (7) is mounted at the bottom of the processing drive frame (6); a positioning component (9) is mounted on the top of the workpiece positioning frame (3); a dust collection frame (4) is fixedly mounted inside the polishing box (1) at the bottom, and a dust collection port is provided on the inner wall of the dust collection frame (4); a dust collection box (5) is fixedly mounted on the left side of the polishing box (1), and the dust collection box (5) is connected to the inside of the dust collection frame (4) via a dust pump; two loading and unloading linear slides (8) are fixedly mounted on both sides inside the polishing box (1), and the opposite sides of the two loading and unloading linear slides (8) are slidably connected to the two sides of the workpiece positioning frame (3).

2. The polishing equipment for a pressure sensor sintering base according to claim 1, characterized in that, The positioning component (9) includes a central suction frame (10) and a connecting strip (14). The central suction frame (10) is fixedly installed at the top center of the workpiece positioning frame (3), and a vacuum pump is installed at the bottom of the central suction frame (10). Positioning linear slides (11) are fixedly installed around the top of the workpiece positioning frame (3). Movable frames (12) are slidably installed on the top of the four positioning linear slides (11). Three positioning servo electric cylinders (13) are fixedly installed inside the four movable frames (12). The driving end of the three positioning servo electric cylinders (13) is fixedly installed with a connecting strip (14).

3. The polishing equipment for a pressure sensor sintering base according to claim 2, characterized in that, A silicone pad is provided on the top of the central adsorption rack (10); a rubber pad (15) is fixedly provided on one side of the connecting strip (14), and the material of the connecting strip (14) is thermoplastic polyurethane.

4. The polishing equipment for a pressure sensor sintering base according to claim 1, characterized in that, The polishing assembly (7) includes a mounting bracket (20) and a rotary table (21). An X-axis linear slide (16) is fixedly installed at the bottom center of the processing drive frame (6). A sliding frame (18) is slidably installed at the bottom of the X-axis linear slide (16). A Y-axis linear slide (17) is fixedly installed at the bottom of the sliding frame (18). A Z-axis servo cylinder (19) is slidably installed at the bottom of the Y-axis linear slide (17). A mounting bracket (20) is fixedly installed at the bottom end of the drive shaft of the Z-axis servo cylinder (19).

5. The polishing equipment for a pressure sensor sintering base according to claim 4, characterized in that, The mounting frame (20) is fixedly equipped with a polishing servo motor (22), and a rotating table (21) is rotatably mounted on the bottom of the mounting frame (20). One end of the output shaft of the polishing servo motor (22) is fixedly connected to the top of the rotating table (21). A coarse polishing block (26) is fixedly mounted on the bottom of the rotating table (21). An elastic buffer pad is provided between the coarse polishing block (26) and the rotating table (21). The elastic buffer pad and the coarse polishing block (26) are bonded together with thermally conductive adhesive. An air pump (23) is fixedly mounted on all four sides inside the mounting frame (20). An air blowing port (24) connected to the air outlet of the air pump (23) is provided on all four sides of the bottom of the mounting frame (20).

6. The polishing equipment for a pressure sensor sintering base according to claim 5, characterized in that, The rotary table (21) has a mounting groove (25) at the bottom center. Two adjusting electric cylinders (27) are fixedly installed at the top inside the mounting groove (25). A connecting plate (28) is fixedly installed at the bottom end of the drive shaft of the two adjusting electric cylinders (27). A polishing servo electric cylinder (29) is fixedly installed at the top center of the connecting plate (28). A base frame (30) is rotatably installed at the bottom of the connecting plate (28). The top of the base frame (30) is fixedly connected to one end of the output shaft of the polishing servo electric cylinder (29).

7. The polishing equipment for a pressure sensor sintering base according to claim 6, characterized in that, The base frame (30) is fixedly provided with a ring (31) at the bottom, and the bottom of the ring (31) is provided with an annular groove, and the annular groove is provided with a filling medium (32); an electromagnetic coil (33) is fixedly provided inside the base frame (30), and the electromagnetic coil (33) is in contact with the inner wall of the ring (31); an air blowing ring (34) is also provided inside the base frame (30), and a miniature air pump connected to the air blowing ring (34) is provided inside the base frame (30), and the air outlet of the air blowing ring (34) faces the polishing needle (42).

8. The polishing equipment for a pressure sensor sintering base according to claim 7, characterized in that, The filling medium (32) is uniformly mixed from silicone resin matrix, carbonyl iron powder and cerium oxide grinding particles; the electromagnetic coil (33) uses φ0.08mm enameled copper wire with 120 turns, and the outer layer of the electromagnetic coil (33) is wrapped with polyimide insulating film.

9. A polishing apparatus for a pressure sensor sintering base according to claim 6, characterized in that, Two adjusting electric cylinders (35) are fixedly installed in the middle of the base frame (30). A connecting plate (36) is fixedly installed at the bottom of the drive shaft of the two adjusting electric cylinders (35). A polishing servo electric cylinder (37) is fixedly installed at the top middle of the connecting plate (36). A rotating block (38) is rotatably installed at the bottom of the connecting plate (36). One end of the output shaft of the polishing servo electric cylinder (37) is fixedly connected to the top of the rotating block (38). Several miniature linear slides (39) are fixedly installed at the bottom of the rotating block (38). A fixed block (40) is slidably installed at the bottom of the miniature linear slides (39). A miniature servo electric cylinder (41) is fixedly installed at the bottom of the fixed block (40). A polishing needle (42) is fixedly installed at the bottom of the output shaft of the miniature servo electric cylinder (41).

10. A polishing apparatus for a pressure sensor sintering base according to claim 9, characterized in that, Several of the miniature linear slides (39) are distributed at equal angles about the central axis of the connecting plate (36); several of the polishing needles (42) are all tapered and gradually changing structures, with the bottom of the polishing needle (42) being an arc-shaped tip, and the several polishing needles (42) are distributed radially outward with the center of the rotating block (38) as the center, and the included angle between adjacent polishing needles (42) is 60°.

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