Circuit board conveying method, circuit board conveying line and circuit board processing system

Abstract

The invention provides a circuit board conveying method, a circuit board conveying line and a circuit board processing system.The circuit board conveying method comprises the steps that a finished product assembly is conveyed to a conveying mechanism, and the finished product assembly comprises a circuit board assembly; the finished product assembly is conveyed to a board dividing mechanism through the conveying mechanism; the circuit board in the finished product assembly is separated from the bottom plate through the board separating mechanism; the bottom plate is conveyed to a plate stacking mechanism through the conveying mechanism; the circuit board is stacked on the bottom plate through the plate stacking mechanism to form a to-be-processed assembly; and the to-be-machined assembly is output. According to the method, an automatic circulation closed loop is constructed, manual intervention is reduced in the whole process, coherent operation of all links is achieved, and conveying continuity and efficiency are remarkably improved.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and in particular relates to a circuit board conveying method and circuit board conveying line. Background Technology

[0002] In the printed circuit board (PCB) forming process, forming machines are typically equipped with multiple processing platforms, such as stacking platforms specifically for stacking materials and separating platforms responsible for separating finished products from waste materials, to complete the entire process from pretreatment to processing and sorting of the board materials. However, the operation of these platforms is still mainly manual. This manual operation mode requires manual transfer and repetitive operations between multiple processing platforms, resulting in a cumbersome process. This not only significantly extends the processing cycle of a single batch of products but also makes it difficult to match the high-speed processing capabilities of the forming machine. The efficiency and stability of manual operation can no longer meet the needs of large-scale transportation. Summary of the Invention

[0003] The purpose of this application is to provide a circuit board conveying method and circuit board conveying line, which aims to solve the technical problems of low processing efficiency and poor product quality stability caused by the need for manual transfer of the base plate in the current circuit board processing process.

[0004] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: In a first aspect, a circuit board conveying method is provided for processing a circuit board assembly, the circuit board assembly including stacked circuit boards and a base plate, applied to a circuit board conveying line, the circuit board conveying line including a stacking mechanism, a separating mechanism, and a transport mechanism, the circuit board conveying method comprising: The finished components, including the processed circuit board and the base plate, are transported to the transport vehicle. The finished components are transported to the separating mechanism via the transport mechanism; The circuit board in the finished assembly is separated from the base plate by the separation mechanism; The base plate is transported to the stacking mechanism via the transport mechanism; The circuit boards to be processed are stacked on the base plate by the stacking mechanism to form the assembly to be processed; Output the component to be processed.

[0005] One possible scenario is that the transport mechanism includes a transport frame, which has a receiving position, a separating position, a stacking position and an output position arranged sequentially along a first direction, and the transport mechanism is provided with a first conveying component connected to the transport frame at the receiving position, the separating position, the stacking position and the output position. The process of transporting the finished component to the separating mechanism via the transport mechanism specifically includes: The finished product assembly is transported from the receiving position to the separating position via the first conveying component; The transport mechanism conveys the base plate to the stacking mechanism, specifically including: The base plate is transported from the splitting position to the stacking position via the first conveying component.

[0006] One possible scenario is that the plate-separating mechanism includes a plate-separating baffle, which is movably connected to the transport frame and located in the transport direction of the first transport assembly. The step of conveying the finished product component from the receiving position to the separating position via the first conveying component further includes: The finished product assembly is conveyed along the first direction by the first conveying component until it abuts against the partition plate baffle, thereby confining the finished product assembly to the partition plate position.

[0007] One possible scenario is that the board separation mechanism includes a board separation robot arm, which is disposed on one side of the board separation position. The board separation mechanism also includes a finished product rack and a scrap rack, and the processed circuit board includes a finished product section and a scrap section. The step of separating the circuit board from the base plate in the finished assembly through the board separation mechanism includes: The finished product section is placed on the finished product rack by the separating robot, and the waste section is placed on the waste rack.

[0008] One possible scenario is that the board separation mechanism further includes a pull plate component connected to the transport frame, which can dock with the base plate and restrict the base plate from moving along the thickness direction of the circuit board. After the finished product component is conveyed along the first direction by the first conveying component, the process further includes: The base plate is connected to the pull plate member by the first conveying component.

[0009] One possible scenario is that a limiting rod and a limiting cap are provided on the bottom of the base plate, and the pull plate component has a pull plate groove that runs through the first direction. The groove opening width is smaller than the groove bottom width. The step of connecting the base plate to the pull plate member via the first conveying component specifically includes: The limiting cap under the base plate is slid into the pull plate groove by the first conveying component.

[0010] One possible scenario is that the separating mechanism also includes a top-feeding assembly; Before separating the circuit board from the base plate in the finished assembly via the board separation mechanism, the method further includes: The top material assembly is moved along the thickness direction of the circuit board and lifts the circuit board so that the circuit board is detached from the base plate.

[0011] One possible scenario is that the transport mechanism further includes a second conveying component and a receiving baffle, both connected to the transport frame. The second conveying component is disposed at the receiving position and offset from the first conveying component. The second conveying component can move along the thickness direction of the circuit board and is used to transport the finished component towards the receiving position along a second direction. The receiving baffle is connected to the transport frame and is located on one side of the receiving position along the second direction, which is perpendicular to the first direction. The process of transporting the finished components to the transportation mechanism includes: The finished product component is received by the second conveying component and conveyed toward the second direction until the finished product component abuts against the receiving baffle so that the finished product component reaches the receiving position; The second conveying component is moved downward relative to the first conveying component so that the first conveying component supports the finished product component, and the second conveying component is separated from the finished product component.

[0012] One possible scenario is that the stacking mechanism includes a stacking baffle that is movably connected to the transport frame and located in a first direction of the first conveying assembly. The process of conveying the base plate to the stacking mechanism via the transport mechanism includes: The partition plate baffle is moved downward to avoid the movement path of the base plate in the first direction; The base plate is conveyed along the first direction by the first conveying component until it abuts against the stacking baffle, so that the base plate reaches the stacking position.

[0013] One possible scenario is that the stacking mechanism further includes a stacking robot, a cardboard frame, and a circuit board frame, all of which are located on one side of the stacking position. The process of stacking the circuit boards on the base plate using the stacking mechanism to form the assembly to be processed includes: The stacking robot stacks the cardboard from the cardboard rack and the circuit boards from the circuit board rack onto the base plate located at the stacking position to form the component to be processed.

[0014] One possible scenario is that the base plate is provided with a first positioning structure, the stacking mechanism further includes a stacking positioning plate, and the stacking positioning plate is provided with a second positioning structure; after the base plate abuts against the stacking baffle, it further includes: Move the stacked plate positioning plate upwards until the first positioning structure and the second positioning structure are inserted and engaged.

[0015] One possible scenario is that the transport mechanism further includes a third conveying component and an output baffle, both connected to the transport frame. The output baffle is connected to the transport frame and located in a first direction of the first conveying component. The output baffle can limit the component to be processed to the output position, and the third conveying component is disposed at the output position. The output of the component to be processed includes: The component to be processed is conveyed by the first conveying component to abut against the output baffle, thereby confining the component to be processed to the output position; The third conveying component is moved upward relative to the first conveying component, such that the third conveying component supports the component to be processed, and the first conveying component is separated from the component to be processed; The component to be processed is conveyed along a third direction by the third conveying component until the component to be processed is removed from the third conveying component, the third direction being perpendicular to the first direction.

[0016] In a second aspect, a circuit board conveying line is provided, employing the circuit board conveying method described in any of the above possible cases, the circuit board conveying line further comprising a transfer mechanism capable of docking with the transport mechanism to receive and / or transport the circuit board assembly.

[0017] The technical advantages of this application embodiment compared to the prior art are as follows: This circuit board conveying method constructs a fully automated closed-loop system of "receiving-transfer-separation-baseboard conveying-stacking-output-circulation". Relying on the first conveying component, it achieves precise and seamless transfer of finished components, baseboards, and components to be processed between various workstations. This not only completely replaces the repetitive operations of traditional manual transfer, stacking, and separation, but also significantly shortens the processing cycle of a single batch of products and improves the adaptability of large-scale conveying. In addition, in this conveying method, the baseboard participates in the component conveying throughout the process and moves directly with the circuit board components to the circuit board processing equipment. By reusing the baseboard, material consumption and operational steps are reduced. At the same time, the precise positioning design of each process avoids the secondary alignment requirement in the circuit board processing equipment after component transfer in traditional processing. This eliminates the cumbersome alignment steps and complex alignment structures in traditional processing, avoiding the efficiency loss caused by the alignment process and reducing high manufacturing costs, high maintenance difficulty, and failure risks. While ensuring processing accuracy and conveying continuity, it achieves simultaneous optimization of conveying efficiency, cost control, and product quality, significantly improving the overall competitiveness of circuit board forming and processing. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the component to be processed provided in the embodiments of this application; Figure 2 This is a three-dimensional structural diagram of the finished component provided in the embodiments of this application; Figure 3 This is a partial three-dimensional structural diagram of the circuit board conveyor line provided in the embodiment of this application during the processing state; Figure 4 This is a flowchart of the circuit board conveying method provided in the embodiments of this application; Figure 5 This is a partial three-dimensional structural diagram of the circuit board conveyor line provided in an embodiment of this application, wherein the transfer mechanism is not shown; Figure 6 yes Figure 5 A partial enlarged view of the circuit board conveyor line; Figure 7 This is a three-dimensional structural diagram of the base plate provided in the embodiment of this application from one perspective; Figure 8 This is a partial three-dimensional structural diagram of the board separation position in the circuit board conveyor line provided in the embodiment of this application; Figure 9 This is a three-dimensional structural diagram of the base plate provided in an embodiment of this application from another perspective; Figure 10 This is a three-dimensional structural diagram of the circuit board provided in the embodiment of this application.

[0019] Figure 11 This is a three-dimensional structural diagram of the cardboard provided in the embodiments of this application; Figure 12 yes Figure 5 A partial enlarged view of another part of the circuit board conveyor line; Figure 13 This is a partial three-dimensional structural diagram of the stacked board position in the circuit board conveyor line provided in the embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 90a. Component to be processed; 90b. Finished component; 91. Base plate; 911. First positioning structure; 9111. Positioning post; 912. Limiting structure; 9121. Limiting rod; 9122. Limiting cap; 913. Positioning pin; 914. Clearance hole; 92. Circuit board; 920. First limiting hole; 92a. Finished product section; 92b. Waste section; 93. Cardboard; 931. Second limiting hole; 10. Separating mechanism; 11. Separating baffle; 111. 12. Lifting drive component; 12. Separating robot; 121. Separating suction cup; 122. Deformable frame; 13. Finished product rack; 131. Finished product partition; 14. Scrap rack; 141. Scrap material limit component; 130. Finished product placement area; 140. Scrap material placement area; 15. Pulling plate component; 150. Pulling plate groove; 16. Top material assembly; 161. Top material pin; 162. Top material plate; 1620. Perforation; 163. Top material drive component; 20. Stacking mechanism; 21. Stacking 211. Board baffle; 22. Third lifting drive; 22. Stacking robot; 221. Stacking suction cup; 23. Cardboard rack; 24. Circuit board rack; 230. Cardboard placement area; 240. Circuit board placement area; 25. Stacking positioning plate; 251. Second positioning structure; 2511. Positioning hole; 26. Positioning drive; 30. Transport mechanism; 31. Transport frame; 301. Receiving position; 302. Board splitting and stacking position; 3021. Board splitting position; 3022. Stacking Plate position; 303, Output position; 32, First conveying assembly; 321, Conveying roller; 3211, Conveying shaft; 3212, Conveying roller; 33, Second conveying assembly; 331, Receiving drive shaft; 332, Receiving conveyor belt; 34, Receiving baffle; 35, Third conveying assembly; 351, Output drive shaft; 352, Output conveyor belt; 36, Output baffle; 37, Guide plate; 40, Transfer mechanism; 41, First transfer car; 42, Second transfer car. Detailed Implementation The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified. In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0022] In the printed circuit board (PCB) forming process, forming machines are typically equipped with multiple processing platforms, such as a stacking platform specifically for stacking materials and a separating platform responsible for separating finished products from waste materials, to complete the entire process of PCB manufacturing from pretreatment to processing and sorting. However, the operation of these platforms is still mainly manual, with low automation, which seriously restricts conveying efficiency and processing accuracy.

[0023] Specifically, on the stacking platform, operators first manually place cardboard as a base, then precisely stack the circuit boards on top to form the components to be processed. After stacking, the components are manually removed from the stacking platform and transferred to the circuit board processing equipment for milling and other shaping processes. After processing, the cardboard carrying the finished circuit boards is manually transferred to the separating platform, where operators manually separate the boards. After separating, new cardboard is manually placed on the stacking platform for a new round of manual stacking, and this cycle continues.

[0024] This manual operation mode requires manual transfer and repetitive operations between multiple processing platforms, which is cumbersome. It not only significantly extends the processing cycle of a single batch of products, but also makes it difficult to match the high-speed processing capabilities of the molding machine. The efficiency and stability of manual operation can no longer meet the needs of large-scale transportation.

[0025] In addition, during the circuit board processing stage, the circuit board and cardboard assembly to be processed need to be transported together onto the table of the circuit board processing equipment. Since the relative position of the circuit board and the table directly determines the accuracy of the cutting path, a special alignment operation must be performed after transport. To achieve this, the equipment typically needs to be equipped with complex alignment structures, such as positioning pins, guide rails, and vision recognition components. The component positions are adjusted through mechanical limits or image comparison to ensure that the circuit board reference datum matches the preset processing reference datum of the table.

[0026] However, the alignment process requires a significant amount of extra time, reducing overall processing efficiency. Furthermore, the specially designed alignment structure not only increases the manufacturing cost and maintenance difficulty of the equipment but may also lead to frequent malfunctions due to its complexity, affecting the continuity of the conveying process.

[0027] To address the aforementioned problems, this application provides a circuit board conveyor line for transporting circuit board assemblies, which include stacked circuit boards 92 and a base plate 91. This circuit board conveyor line automates the transportation, separation, and stacking processes of the circuit board assemblies, thereby improving processing efficiency.

[0028] Please see Figure 1 and Figure 2 In the depaneling process, the finished component 90b, processed by the circuit board processing equipment, needs to be depaneled. The finished component 90b includes the processed circuit board 92 and the base plate 91. The processing of the circuit board 92 by the circuit board processing equipment includes, but is not limited to, milling, laser cutting, drilling, edge grinding, and chamfering. Taking the milling process as an example, after processing by the circuit board processing equipment, the circuit board 92 is divided into a finished product section 92a and a waste section 92b. The finished product section 92a is the target product of the milling process, referring to the main body of the circuit board 92 that meets the size, structure, and precision requirements of the design drawings. Its shape is directly related to the final application scenario of the circuit board 92; it may be a single independent circuit board 92 or multiple connected boards. The waste section 92b consists of excess material removed during the milling process, mainly including edge scraps of the circuit board 92, discarded portions of the internal hollow areas, and defective edges and corners caused by processing errors. In this context, separating the circuit board 92 in the finished component 90b refers to classifying and placing the finished product section 92a and the waste section 92b of the circuit board 92.

[0029] In the stacking process, the circuit boards 92 to be processed are stacked on the base plate 91 to form the assembly 90a to be processed. A cardboard 93 can be placed between the base plate 91 and the circuit board 92. The base plate 91 provides rigid support for the cardboard 93 and the circuit board 92, preventing warping or shaking during processing due to the thinness of the circuit board 92 or stress, thus ensuring the accuracy of the processing path. The cardboard 93 supports the circuit board 92 during separation, stacking, and transportation, preventing direct contact between the circuit board 92 and the base plate 91 and reducing mechanical damage.

[0030] In the embodiments of this application, please refer to Figure 3 The circuit board conveyor line includes a board separating mechanism 10, a board stacking mechanism 20, and a transport mechanism 30.

[0031] The transport mechanism 30 includes a transport frame 31, which has a receiving position 301, a slitting and stacking position 302, and an output position 303 arranged sequentially along a first direction. The transport mechanism 30 has a first conveying component 32 connected to the transport frame 31 at each of the receiving position 301, the slitting and stacking position 302, and the output position 303. The base plate 91 can be transported sequentially to the receiving position 301, the slitting and stacking position 302, and the output position 303 via the first conveying component 32, meaning the first conveying component 32 can realize the entire process of transporting the base plate 91. The receiving position 301 is used to receive the finished component 90b, and the output position 303 is used to output the component 90a to be processed. The slitting mechanism 10 is disposed on one side of the slitting and stacking position 302 and is used to slitting the finished component 90b on the slitting and stacking position 302. A stacking mechanism 20 is disposed on one side of the plate-splitting and stacking position 302 and is used to stack the base plate 91 on the plate-splitting and stacking position 302 to form the component 90a to be processed. The plate-splitting and stacking position 302 includes a plate-splitting position 3021 and a stacking position 3022, which are arranged sequentially along the conveying direction of the first conveying component 32. The plate-splitting mechanism 10 can perform plate-splitting operations on the finished component 90b located at the plate-splitting position 3021, and the stacking mechanism 20 can perform plate-stacking operations on the base plate 91 located at the stacking position 3022. In other embodiments, the plate-splitting and stacking position 302 can be a fixed position, that is, both the plate-splitting operation and the stacking operation are performed at the same position on the transport frame 31.

[0032] Please combine Figure 4 This application provides a circuit board conveying method, which is applied to the aforementioned circuit board conveying line. The circuit board conveying method includes: S1. Transport the finished component 90b to the transport mechanism 30.

[0033] In this step, the transport mechanism 30 receives the finished component 90b that has been processed and accurately transports it to the preset receiving position 301 of the transport mechanism 30, in preparation for the subsequent board separation process.

[0034] S2. The finished component 90b is transported to the separation mechanism 10 via the transport mechanism 30.

[0035] In this step, the finished component 90b is transported from the receiving position 301 to the sorting position 3021 via the first conveying component 32. This achieves a smooth transport of the finished component 90b from the receiving position 301 to the sorting position 3021, completing the precise transfer of the component between different process stations without manual intervention, ensuring process continuity, and replacing traditional manual transfer operations. Furthermore, the sorting mechanism 10 can also limit the position of the base plate 91 on the sorting position 3021, ensuring that the finished component 90b is in a precise positioning state for subsequent precise sorting by the sorting mechanism 10.

[0036] S3. The circuit board 92 in the finished component 90b is separated from the base plate 91 by the board separation mechanism 10.

[0037] In this step, the board separation mechanism 10 first sorts the circuit boards 92 in the finished product assembly 90b at the board separation position 3021, placing the valuable finished product part 92a and the waste part 92b, and then completely separating the circuit board 92 from the base plate 91, avoiding the errors and inefficiencies of manual sorting.

[0038] S4. The base plate 91 is transported to the stacking mechanism 20 via the transport mechanism 30.

[0039] In this step, after the board separation is completed, the base plate 91, stripped of the load of the circuit board 92, is located on the board separation position 3021. The first conveying component 32 can transport the base plate 91 from the board separation position 3021 to the stacking position 3022. The stacking mechanism 20 can limit the base plate 91 on the stacking position 3022 to ensure that the base plate 91 is in a precise positioning state, providing a stable reference for the subsequent stacking of unprocessed circuit boards 92, and realizing the efficient recycling of the base plate 91.

[0040] S5. The circuit board 92 is stacked on the base plate 91 by the stacking mechanism 20 to form the component to be processed 90a.

[0041] In this step, the stacking mechanism 20 precisely stacks the unprocessed circuit board 92 onto the positioned base plate 91 at the stacking position 3022, and completes the positioning of the circuit board assembly to form a standardized assembly 90a to be processed, replacing the traditional manual stacking operation and ensuring stacking accuracy and efficiency.

[0042] S6, Output component 90a to be processed. In this step, the first conveying component 32 transfers the component 90a to be processed formed by the stacking position 3022 to the output position 303, and then outputs and conveys it to the circuit board processing equipment for forming processing.

[0043] The finished component 90b formed after processing is returned to the receiving position 301 of the transport mechanism 30, and steps S1-S6 are repeated to establish a continuously operating closed-loop transport process. Since the component to be processed 90a has been formed in step S5 by the stacking mechanism 20 to form a component to be processed 90a with a relatively stable position between the circuit board 92 and the base plate 91, the circuit board processing equipment can directly process the circuit board 92 according to the preset program without additional adjustment of the position of the circuit board 92 or the component to be processed 90a.

[0044] The circuit board conveyor line in this embodiment constructs a collaborative operation system of a slitting mechanism 10, a stacking mechanism 20, and an integrated transport mechanism 30. This integrates key processes in the circuit board 92 processing flow, such as receiving finished component 90b, slitting and sorting, recycling of the base plate 91, stacking of circuit boards 92 to be processed, and output of finished products, into continuous workstations on the same transport frame 31, namely the receiving station 301, the slitting and stacking station 302, and the output station 303. This achieves fully automated closed-loop operation from the slitting process to the stacking process, and completes the assembly of the base plate 91 and circuit board components through the first transport component 32. Precise transfer between workstations not only completely replaces repetitive operations such as traditional manual transfer, stacking, separation, and sorting of circuit board components, significantly shortening the processing cycle of a single batch of products and improving the adaptability of large-scale transportation, but also simplifies the work process through the 91-cycle reuse mechanism of the base plate. At the same time, it eliminates the need for secondary alignment caused by component transfer in traditional processing, avoiding the high manufacturing costs, maintenance difficulties, and failure risks brought about by complex alignment structures. While ensuring processing accuracy and transportation continuity, it significantly improves the overall efficiency of circuit board 92 forming processing and the stability of equipment operation.

[0045] This circuit board conveying method constructs a fully automated closed-loop system of "receiving-transferring-splitting-baseboard 91 conveying-stacking-output-circulation". Relying on the first conveying component 32, it realizes the precise and seamless transfer of finished component 90b, baseboard 91 and component 90a to be processed between various workstations. It not only completely replaces the repetitive operations such as transfer, stacking and splitting that are traditionally dominated by manual labor, but also greatly shortens the processing cycle of a single batch of products and improves the adaptability of large-scale conveying. In addition, in this conveying method, the base plate 91 participates in the entire component conveying process and moves directly with the circuit board assembly to the circuit board processing equipment. By reusing the base plate 91, material consumption and operation links are reduced. At the same time, the precise positioning design of each process avoids the secondary alignment requirement in the circuit board processing equipment after component transfer in traditional processing. This eliminates the cumbersome alignment steps and complex alignment structures in traditional processing, avoiding the efficiency loss caused by the alignment process, and reducing high manufacturing costs, high maintenance difficulty and failure risk. On the basis of ensuring processing accuracy and conveying continuity, it achieves simultaneous optimization of conveying efficiency, cost control and product quality, significantly improving the overall competitiveness of circuit board 92 forming processing.

[0046] Please see Figure 5 and Figure 6 It is understood that the slitting mechanism 10 includes a slitting baffle 11. The slitting baffle 11 is movably connected to the transport frame 31 and is located in the transport direction of the first transport assembly 32. The slitting baffle 11 can limit the finished product assembly 90b to the slitting position 3021. Specifically, the slitting baffle 11 is located in the first direction of the slitting position 3021. The slitting baffle 11 can move up and down relative to the transport frame 31. When the slitting baffle 11 moves upward, it can be located on the movement path of the finished product assembly 90b, that is, the slitting baffle 11 and the finished product assembly 90b are on the same plane in the first direction, so as to restrict the finished product assembly 90b from continuing to move in the first direction when it reaches the slitting position 3021. When the slitting baffle 11 moves downward, it can move to below the bottom plate 91 to avoid the movement path of the bottom plate 91, so that the bottom plate 91 can continue to move in the first direction under the transport of the first transport assembly 32.

[0047] Accordingly, step S2 specifically includes: S21. The finished product component 90b is conveyed along the first direction by the first conveying component 32 until the finished product component 90b abuts against the partition baffle 11, so as to limit the finished product component 90b to the partition position 3021.

[0048] In this step, the first conveying assembly 32 can convey the finished product assembly 90b along the first direction until the finished product assembly 90b abuts against the separating baffle 11. When the finished product assembly 90b abuts against the separating baffle 11, the finished product assembly 90b reaches the separating position 3021.

[0049] The finished component 90b is stably conveyed along the first direction by the first conveying component 32. With the limiting effect of the separating baffle 11, the finished component 90b can accurately abut against the separating baffle 11 and be stably positioned at the separating position 3021. This design not only ensures the smoothness of the conveying process of the finished component 90b, but also achieves standardized positioning of the base plate 91 at the separating position 3021 through the mechanical limiting of the separating baffle 11. This ensures that the circuit board assembly can be separated in a fixed position every time, which greatly improves the accuracy and repeatability of the separating action, reduces sorting errors caused by position deviation, and simplifies the positioning control logic of the separating process, making the separating mechanism 10 more suitable for the high-efficiency operation requirements of automated conveyor lines.

[0050] Please see Figure 5 and Figure 6It is understood that the depaneling mechanism 10 also includes a depaneling robot 12, which is located on one side of the depaneling position 3021. The depaneling robot 12 can be used to depanel the circuit board 92. That is to say, when the finished component 90b is confined to the depaneling position 3021 by the depaneling baffle 11, the depaneling robot 12 can perform depaneling operations on the finished component 90b located at the depaneling position 3021. The depaneling robot 12 can efficiently complete the depaneling action of the circuit board 92, ensuring the smooth flow of materials during the depaneling process.

[0051] Please see Figure 5 and Figure 6 It is understood that the slitting mechanism 10 also includes a finished product rack 13 and a scrap rack 14, both disposed on one side of the slitting position 3021. The finished product rack 13 has a finished product placement area 130, and the scrap rack 14 has a scrap placement area 140. The slitting robot 12 is used to place the scrap part 92b in the scrap rack 14 and to place the finished product part 92a in the finished product rack 13.

[0052] Accordingly, step S3 specifically includes: S31. The finished product part 92a is placed on the finished product rack 13 by the board separating robot 12, and the waste part 92b is placed on the waste rack 14.

[0053] The dedicated placement areas for the finished product rack 13 and the waste rack 14 in the PCB separation mechanism 10, combined with the targeted sorting and placement function of the PCB separation robot 12, realize the automated classification and placement of the finished product section 92a and the waste section 92b of the circuit board 92. This completely replaces manual sorting and classification operations, avoids damage to finished products or mixing of waste materials caused by human error, improves the efficiency and standardization of PCB separation and sorting, lays the foundation for smooth connection of subsequent processes, and further improves the automated conveying closed loop.

[0054] Optionally, the depaneling robot 12 includes multiple depaneling suction cups 121. These suction cups 121 can adsorb finished parts 92a within the circuit board 92 and transport the adsorbed finished parts 92a to the finished part placement area 130, after which the depaneling suction cups 121 can separate from the finished parts 92a. The depaneling suction cups 121 can also adsorb cardboard 93 and / or waste parts 92b of the circuit board 92 and transport the adsorbed cardboard 93 and / or waste parts 92b of the circuit board 92 to the waste placement area 140, after which the depaneling suction cups 121 can separate from the cardboard 93 and / or waste parts 92b of the circuit board 92. The arrangement of the depaneling suction cups 121 can reduce mechanical damage to the circuit board 92 when handling it.

[0055] Optionally, the depaneling robot 12 also includes a deformable frame 122, and depaneling suction cups 121 can be connected to the deformable frame 122. The deformable frame 122 can change its shape to change the relative position of multiple depaneling suction cups 121, thereby enabling the depaneling suction cups 121 to adsorb different parts of the finished component 90b.

[0056] For example, the deformable frame 122 has a first form and a second form. When the deformable frame 122 is in the first form, the board separation suction cup 121 can correspondingly adsorb the finished product section 92a in the circuit board 92. Among the multiple finished products in the finished product section 92a, each finished product can be adsorbed by one board separation suction cup 121 or by multiple board separation suction cups 121. The board separation robot 12 can adsorb the left and right finished products at one time by the board separation suction cup 121, or it can only adsorb some of the finished products. As long as the board separation robot 12 can ultimately transport all the finished products to the finished product placement area 130 through several adsorption and movement actions. When the deformable frame 122 is in the second state, the partition suction cup 121 can correspond to the adsorption waste section 92b of the circuit board 92. The waste section 92b can be a single integral structure. In this case, the partition robot 12 can remove the waste section 92b in one go through the partition suction cup 121. The waste section 92b can also be a dispersed multi-piece structure. In this case, the partition robot 12 can remove all the waste sections 92b in one go through the partition suction cup 121, or it can remove the waste sections 92b in multiple times. There is no restriction here, as long as the partition robot 12 can eventually transport all the waste sections 92b to the waste placement area 140 through several adsorption and movement actions.

[0057] In other embodiments, the board-separating robot 12 may include multiple board-separating grippers, which hold the circuit board 92 and the cardboard 93. This is not a limitation.

[0058] It should be noted that in the embodiment where a cardboard 93 is provided between the base plate 91 and the circuit board 92, since the waste portion 92b is placed on the cardboard 93, the separating robot 12 can remove the cardboard 93 and the waste portion 92b together by using the separating suction cup 121 to adsorb the portion of the cardboard 93 exposed outside the waste portion 92b. Thus, when the cardboard 93 is removed, the waste portion 92b is also removed along with it. At this time, the deformable frame 122 can still maintain its first form, i.e., the separating suction cup 121 corresponds to the original finished portion 92a. Since the finished portion 92a has already been removed, it becomes the part exposed outside the waste portion 92b. The separating suction cup 121 can then adsorb along the original path, thereby achieving the adsorption of the cardboard 93. Of course, based on the unchanged adsorption position, the separating robot 12 may also not have a deformable frame 122, but instead place the separating suction cup 121 on a non-deformable fixed frame; this is not a limitation.

[0059] In this step, the finished product section 92a is protected from interference by waste materials and cardboard 93 during the sorting process through step-by-step operation, reducing the risk of finished products being contaminated or damaged, and improving the cleanliness and integrity of the recycled finished products. At the same time, the cardboard 93 is processed synchronously with the waste material section 92b, which simplifies the sorting process, reduces the ineffective movements of the robotic arm, improves the efficiency of board separation, and adapts to the continuous operation requirements of automated conveyor lines, further enhancing the stability and economy of the board separation process.

[0060] In other embodiments, the waste section 92b and the cardboard 93 can also be removed separately by the separating robot 12. Specifically, the separating robot 12 first removes the waste section 92b by switching the deformable frame 122 to the second form, and then removes the cardboard 93 while maintaining the second form. The removed waste section 92b and cardboard 93 can be stacked together in the waste placement area 140, or they can be stacked separately for subsequent reuse of the cardboard 93. When removing the cardboard 93, the deformable frame 122 can also switch to the first form, or switch to a third form other than the first and second forms; there are no restrictions here, as long as the cardboard 93 can be adsorbed.

[0061] Optionally, the finished product rack 13 is provided with multiple finished product partitions 131, and a finished product placement area 130 is formed on the upper surface of the finished product rack 13. The finished product placement area 130 includes multiple sub-placement areas in the horizontal direction, and each sub-placement area can place a stack of finished parts 92a of the stacked circuit boards 92. The finished product partitions 131 are installed on the upper surface of the finished product rack 13 and are vertically arranged. The finished product partitions 131 are located between two adjacent sub-placement areas to separate two adjacent stacks of finished parts 92a and prevent the edges of the two adjacent stacks of finished parts 92a from rubbing against each other. The scrap rack 14 is provided with a scrap limiting member 141. A scrap placement area 140 is formed on the upper surface of the scrap rack 14, and the scrap limiting member 141 is disposed at the edge of the scrap placement area 140 to limit the boundary position of the scrap placement area 140 to prevent scrap parts 92b from falling.

[0062] Please see Figure 6 It is understood that the first conveying assembly 32 includes multiple conveying rollers 321, which are spaced apart along a first direction. Each conveying roller 321 includes a conveying shaft 3211 and multiple conveying rollers 3212 connected to the conveying shaft 3211. The conveying shaft 3211 is connected to the transport frame 31 and extends along a second direction. The multiple conveying rollers 3212 are spaced apart along the second direction, which is perpendicular to the first direction. The first conveying assembly 32 supports the base plate 91 through the conveying rollers 3212. Rotation of the conveying shaft 3211 can drive the conveying rollers 3212 to rotate, and rotation of the plate-separating conveying rollers 3212 can drive the base plate 91 to move along the first direction.

[0063] Optionally, the separating baffle 11 can move up and down under the drive of the first lifting drive 111. When the finished component 90b approaches the separating baffle 11, the separating baffle 11 can move upward under the drive of the first lifting drive 111 so that the finished component 90b can abut against the separating baffle 11. Specifically, the finished component 90b reaches the separating position 3021 by abutting against the separating baffle 11 on the platform. Before the separating operation, or after the separating operation, when there are remaining platform boards, the separating baffle 11 can move downward under the drive of the first lifting drive 111 so that the separating baffle 11 separates from the finished component 90b, thereby avoiding increasing the resistance of the first separating conveyor component in taking away the circuit board 92 during the separating process, and allowing the first separating conveyor component to continue conveying the remaining platform boards in the first direction, preventing the separating baffle 11 from obstructing the bottom plate 91 from continuing to move toward the stacking mechanism 20.

[0064] As one alternative implementation, the first conveying assembly 32 can move up and down via the second lifting drive. When the first conveying assembly 32 begins conveying the finished product assembly 90b, it can move downward via the second lifting drive so that the finished product assembly 90b can abut against the separating baffle 11 protruding upward from the first conveying assembly 32. Before the separating operation, or after the separating operation, when there are remaining plates, the first conveying assembly 32 can move upward under the drive of the second lifting drive to separate the separating baffle 11 from the finished product assembly 90b, thereby allowing the first conveying assembly 32 to continue conveying the remaining bottom plate 91 along the first direction, preventing the separating baffle 11 from obstructing the bottom plate 91 from continuing to move towards the stacking mechanism 20. When the first conveying assembly 32 moves up and down, the separating baffle 11 can also move up and down simultaneously to cooperate with the limiting and unlimiting operations of the finished product assembly 90b, or it can be fixed in position, with the limiting and unlimiting operations of the finished product assembly 90b achieved solely through the up and down movement of the first conveying assembly 32.

[0065] In other embodiments, after the board separation operation is completed, the base plate 91 may be conveyed in a direction different from the first direction, such as a 90° sideways direction, to bypass the board separation baffle 11. In this case, the downward movement of the board separation baffle 11 can prevent the circuit board 92 from being affected by the friction caused by the board separation baffle 11 when it moves upward, and / or prevent the base plate 91 from being affected by the friction caused by the board separation baffle 11 when it moves toward the stacking mechanism 20. Alternatively, after the board separation operation is completed, the board separation baffle 11 may not move up and down relative to the first conveying component 32; this is not a limitation.

[0066] Please see Figure 7 It is understandable that the lower surface of the base plate 91 is provided with a limiting structure 912. Specifically, this limiting structure 912 is located on the lower surface of the base plate 91. Please refer to... Figure 6 and Figure 8 The separation mechanism 10 also includes a pull plate component 15, which is connected to the transport frame 31. The pull plate component 15 can dock with the base plate 91 and restrict the base plate 91 from moving along the thickness direction of the circuit board 92, i.e., restrict the base plate 91 from moving upward. When the finished component 90b moves to the separation position 3021 along the first direction, the pull plate component 15 can dock with the limiting structure 912, at which point the finished component 90b reaches the separation position 3021. The docking methods between the pull plate component 15 and the limiting structure 912 include, but are not limited to, hooking, snapping, and magnetic attraction.

[0067] Accordingly, after the finished product component 90b is conveyed along the first direction by the first conveying component 32, the process further includes: S211. The base plate 91 is connected to the pull plate member 15 by the conveying of the first conveying component 32.

[0068] The limiting structure 912 on the lower surface of the base plate 91 precisely engages with the pull plate component 15 when the finished component 90b moves to the separating position 3021. The pull plate component 15 also prevents the limiting structure 912 from separating upwards. This design locks the position of the finished component 90b from both vertical and horizontal directions. Combined with the conveying of the first conveying component 32 and the limiting of the separating baffle 11, multi-dimensional stable positioning of the finished component 90b at the separating position 3021 is achieved. This ensures the accuracy of the limiting engagement during conveying and avoids displacement or shaking of the finished component 90b due to force during the operation of the separating robot 12. This significantly improves the stability and consistency of the separating position 3021, provides a reliable benchmark for the precise operation of the separating robot 12, further reduces the separating error rate, and improves the automation accuracy and efficiency of the separating process.

[0069] Optionally, the limiting structure 912 includes a limiting rod 9121 and a limiting cap 9122. The limiting rod 9121 protrudes from the lower surface of the base plate 91, and the limiting cap 9122 is located at the end of the limiting rod 9121 away from the base plate 91, i.e., the lower end of the limiting rod 9121. The limiting cap 9122 protrudes circumferentially from the circumferential side of the limiting rod 9121. The pull plate member 15 has a pull plate groove 150 with the groove opening facing upward and extending through the pull plate member 15 in a first direction. That is, the pull plate groove 150 forms openings on both ends of the pull plate member 15 in the first direction. The limiting cap 9122 can slide into the pull plate groove 150 from the opening on the end face of the pull plate member 15 in the first direction and slide in connection with the pull plate groove 150. The width of the opening of the pull plate groove 150 is less than the width of the bottom of the groove 150, thus preventing the limiting cap 9122 from dislodging from the opening of the pull plate groove 150. The width direction of the opening and the width direction of the bottom of the pull plate groove 150 are the same, both being normal to the extension direction of the pull plate groove 150, and this width direction is perpendicular to the vertical direction. The width of the limiting cap 9122 in the width direction of the pull plate groove 150 is greater than the width of the opening of the pull plate groove 150. In this way, the sidewall of the pull plate groove 150 can prevent the limiting cap 9122 from moving upwards and dislodging from the pull plate groove 150.

[0070] Accordingly, step S211 specifically includes: The limiting cap 9122 under the base plate 91 is slid into the pull plate groove 150 by the first conveying component 32.

[0071] In this step, the limiting rod 9121 and the limiting cap 9122 of the limiting structure 912 cooperate with the pull plate groove 150 of the pull plate component 15. The limiting cap 9122 slides into the pull plate groove 150 from the end face opening of the pull plate component 15 along the first direction and forms a sliding connection, realizing smooth docking between the two. The width of the groove opening of the pull plate groove 150 is smaller than the width of the groove bottom, and the width of the limiting cap 9122 in the width direction of the pull plate groove 150 is greater than the width of the groove opening. It can effectively limit the upward disengagement of the limiting cap 9122 with the help of the groove side wall, which not only ensures reliable locking in the vertical direction, but also uses the pull plate groove 150 to guide the movement of the finished component 90b, avoiding jamming during the docking process. This design allows the finished component 90b to naturally complete the limiting docking during transportation, improving the smoothness of process connection, while enhancing the stability of the separation position 3021, providing a more reliable guarantee for the precise operation of the separation robot 12, and further improving the automation efficiency and accuracy of the separation process.

[0072] Optionally, the pull plate groove 150 includes a first groove segment and a second groove segment from top to bottom. The width of the second groove segment is greater than that of the first groove segment. The limiting cap 9122 is adapted to the second groove segment, and the limiting rod 9121 is adapted to the first groove segment. In this way, the pull plate groove 150 can also accurately guide the finished component 90b and prevent the finished component 90b from deviating when moving towards the alignment position.

[0073] Optionally, the limiting structure 912 can be a screw, which is inexpensive and easy to assemble.

[0074] In other embodiments, both the limiting structure 912 and the pull plate member 15 may be L-shaped structures. When the finished product assembly 90b moves to the partition position 3021, the limiting structure 912 and the pull plate member 15 are hooked together at the ends of the L-shaped structures. Alternatively, the limiting structure 912 may include a pull plate groove 150, and the pull plate member 15 may include a limiting rod 9121 and a limiting cap 9122; no limitation is imposed here.

[0075] As an alternative implementation, the pull plate member 15 can restrict the finished component 90b from continuing to move along the first direction after docking with the limiting structure 912. In this case, the separating mechanism 10 may not have a separating baffle 11, but the limiting structure 912 can be limited along the first direction and upward by the pull plate member 15. For example, the pull plate groove 150 is configured with only one extension end through and the other extension end closed. In this way, when the limiting cap 9122 enters the pull plate groove 150, it can abut against the closed end of the pull plate groove 150, thereby restricting the finished component 90b from continuing to move along the first direction.

[0076] It should be noted that when the base plate 91 needs to be conveyed toward the stacking mechanism 20, the base plate 91 can be moved by the first conveying assembly 32 in either the first direction or away from the first direction until it separates from the limiting structure 912 and the pulling member 15, and then the base plate 91 can be conveyed in other directions. Specifically, when the first conveying assembly 32 needs to move the base plate 91 along the first direction, the separating baffle 11 can be moved downwards relative to the first conveying assembly 32 to avoid obstructing the separation of the limiting structure 912 and the pulling member 15.

[0077] Please see Figure 6 and Figure 8 It is understood that the board separation mechanism 10 also includes a top material assembly 16, which is movably connected to the transport frame 31. The top material assembly 16 can move along the thickness direction of the circuit board 92, that is, the top material assembly 16 can move up and down.

[0078] Before step S3, the following is also included: S30. Move the top material assembly 16 along the thickness direction of the circuit board 92 and lift the circuit board 92 so that the circuit board 92 is detached from the base plate 91.

[0079] In this step, when the finished component 90b moves to the board separation position 3021, the top material component 16 is located below the bottom plate 91. The top material component 16 can lift the bottom plate 91 upward by moving upward. Since the bottom plate 91 has already achieved vertical limitation through the docking of the limiting structure 912 and the pull plate component 15, the position of the bottom plate 91 remains unchanged when the top material component 16 continues to move upward. It will only lift the circuit board 92 upward and cause the circuit board 92 to detach from the bottom plate 91.

[0080] Specifically, combined Figure 9 and Figure 10 The base plate 91 is provided with a positioning post 9111, and the circuit board 92 is provided with a first limiting hole 920, which is then combined with Figure 1 In the finished component 90b, the circuit board 92 is fitted onto the positioning post 9111 through the first limiting hole 920 to achieve relative positioning between the circuit board 92 and the base plate 91. The base plate 91 has a clearance hole 914, and the ejector component 16 includes an ejector pin 161, which can move up and down. During its upward movement, the ejector pin 161 passes through the clearance hole 914 of the base plate 91 located at the separation position 3021 and abuts against the lower surface of the circuit board 92. As the ejector pin 161 continues to move upward, it can lift the circuit board 92 and disengage it from the positioning post 9111, thereby separating the circuit board 92 from the base plate 91.

[0081] To ensure the tightness and precision of the positioning fit between the circuit board 92 and the base plate 91, the positioning pin 9111 is generally tightly fitted to the circuit board 92. Alternatively, during the transportation of the component 90a to be processed or the finished component 90b, or during the processing of the circuit board 92, at least one of the circuit boards 92 may move relative to the base plate 91, increasing the friction between the ejector pin 161 and the wall of the clearance hole 914, making board separation difficult. Therefore, the ejector pin 161 allows the circuit board 92 to disengage from the positioning pin 9111 before board separation, thereby reducing the suction force of the board separation suction cup 121, thus avoiding damage to the circuit board 92 due to excessive suction force, improving board separation efficiency, and reducing board separation difficulty. In embodiments where a cardboard 93 is provided between the circuit board 92 and the base plate 91, the ejector pin 161 can also lift the cardboard 93 together with the circuit board 92, so that the cardboard 93 and the circuit board 92 disengage from the positioning pin 9111 together.

[0082] In this step, passing the top pin 161 through the clearance hole 914 can either allow the top pin 161 to move upwards, or allow the first conveying component 32 to drive the base plate 91 downwards. During the process of the top pin 161 lifting the circuit board 92, the limiting structure 912 and the pulling plate component 15 remain in a mating state to prevent the base plate 91 from moving upwards along with the circuit board 92, thus avoiding displacement of the base plate 91. This step effectively solves the problem of increased separation resistance caused by excessively tight fit between the positioning post 9111 and the circuit board 92, or by relative movement during transportation or processing. It not only reduces the suction force required by the suction cup of the separation robot 12, avoiding damage to the circuit board 92 caused by excessive suction, but also reduces the risk of jamming during separation, significantly improving separation efficiency and operational safety. Simultaneously, it ensures the stability of the material state before separation, providing reliable conditions for subsequent accurate sorting.

[0083] It should be noted that in embodiments where a cardboard 93 is provided between the circuit board 92 and the base plate 91, combined with Figure 11 The cardboard 93 has multiple second limiting holes 931. The cardboard 93 is fitted onto the positioning post 9111 through these second limiting holes 931 to achieve positioning of the cardboard 93 on the base plate 91. Then, the circuit board 92 is fitted onto the positioning plate through the second limiting holes 931. When the top pin 161 passes through the clearance hole 914 on the base plate 91 and continues to move upward, it can lift the cardboard 93 and the circuit board 92 together until the positioning post 9111 disengages from the first limiting hole 920 and the second limiting hole 931. At this time, the cardboard 93 and the circuit board 92 are separated from the base plate 91 to facilitate the separation operation of the separation mechanism 10. The position of the first limiting hole 920 can be located in the finished product section 92a or the waste section 92b, which is not limited here.

[0084] Optionally, the top material assembly 16 also includes a top material plate 162, with multiple top material pins 161, all vertically positioned above the top material plate 162. The top material plate 162 can move up and down, allowing the multiple top material pins 161 to pass through corresponding clearance holes 914 to lift the cardboard 93. The top material plate 162 may have through holes 1620 for avoiding the separation conveyor rollers 3212.

[0085] Optionally, the top material assembly 16 also includes a top material drive 163, which is connected to the top material plate 162 and is used to drive the top material plate 162 to move up and down.

[0086] In an alternative implementation, the first conveying assembly 32 and the pull plate 15 can move up and down together, while the position of the ejector pin 161 remains unchanged. When it is necessary to lift the cardboard 93, the first conveying assembly 32 and the pull plate 15 can move downward together, so that the ejector pin 161 passes through the clearance hole 914 and lifts the circuit board 92. The base plate 91 continues to move downward under the pull of the pull plate 15, thereby allowing the circuit board 92 to be disengaged from the positioning post 9111 of the base plate 91. In other embodiments, the ejector pin 161 can also move upward while the first conveying assembly 32 and the pull plate 15 move downward together to eject the circuit board 92 from the positioning post 9111 of the base plate 91. This is not a limitation.

[0087] It should be noted that, in order to prevent the base plate 91 from moving upward with the circuit board 92 during the ejection process of the ejector pin 161, the limiting structure 912 and the pull plate 15 may not be set. Instead, the stability of the position of the base plate 91 can be achieved by using the heavier base plate 91. No restrictions are imposed here.

[0088] Please see Figure 6 It is understood that the transport mechanism 30 also includes a second conveying assembly 33 and a receiving baffle 34, both connected to the transport frame 31. The second conveying assembly 33 is disposed at the receiving position 301 and is offset from the first conveying assembly 32 in the thickness direction of the circuit board 92. The second conveying assembly 33 can move along the thickness direction of the circuit board 92 to achieve vertical movement relative to the first conveying assembly 32, and is used to transport the finished product assembly 90b towards the receiving position 301 in a second direction. The second direction may be different from the first direction, for example, perpendicular to the first direction. The receiving baffle 34 is connected to the transport frame and is located on one side of the receiving position 301 along the second direction. The receiving baffle 34 is used to confine the finished product assembly 90b to the receiving position 301.

[0089] Accordingly, step S1 specifically includes: S11. The finished product component 90b is received by the second conveying component 33 and conveyed towards the second direction until the finished product component 90b abuts against the receiving baffle 34, so that the finished product component 90b reaches the receiving position 301.

[0090] In this step, the finished component 90b is first placed on the second conveying component 33. At this time, the second conveying component 33 receives the finished component 90b and then conveys the finished component 90b toward the second direction. At this time, the receiving baffle 34 moves upward and is located in the second direction of the finished component 90b. During the movement of the finished component 90b along the second direction, it can abut against the receiving baffle 34. The receiving baffle 34 can limit the finished component 90b to the receiving position 301.

[0091] S12. The second conveying component 33 is moved downward relative to the first conveying component 32 so that the first conveying component 32 supports the finished product component 90b, and the second conveying component 33 is separated from the finished product component 90b.

[0092] When the finished component 90b arrives at the receiving position 301, the first conveying component 32 can be positioned below and spaced apart from the finished component 90b. When the second conveying component 33 is moved downwards relative to the first conveying component 32, the finished component 90b also moves downwards. Since the first conveying component 32 and the second conveying component 33 are offset in the thickness direction of the circuit board 92, the second conveying component 33 can pass through the first conveying component 32 and continue moving downwards. During this process, the finished component 90b on the second conveying component 33 can rest on the first conveying component 32. The second conveying component 33 continues to move downwards and separates from the finished component 90b. In this way, the finished component 90b can be transferred to the first conveying component 32 for subsequent conveying of the base plate 91 in the first direction via the first conveying component 32.

[0093] The second conveying component 33 cooperates with the receiving baffle 34 to receive the finished component 90b along the second direction and transport it to the receiving baffle 34, accurately positioning it at the receiving position 301. Then, the second conveying component 33 moves downward to switch the finished component 90b to the support of the first conveying component 32, achieving a smooth transition of the finished component 90b from receiving to the receiving position 301. This design ensures the orderly connection of the finished component 90b from the second conveying component 33 to the first conveying component 32, guaranteeing the continuity and positioning accuracy of the finished component 90b's transport, reducing positional deviations during transfer, improving the efficiency of the pre-separation preparation process, and further enhancing the automation and space utilization of the conveyor line.

[0094] As an alternative implementation, the vertical position of the second conveying component 33 can remain unchanged, while the first conveying component 32 can move vertically. That is, after the finished product component 90b arrives at the receiving position 301, the first conveying component 32 moves upward to replace the second conveying component 33 in supporting the finished product component 90b, thereby separating the second conveying component 33 from the base plate 91, so that the first conveying component 32 can then convey the finished product component 90b from the receiving position 301 to the separating position 3021.

[0095] Optionally, the second conveying assembly 33 includes a receiving drive shaft 331 and a receiving conveyor belt 332. The receiving drive shaft 331 is connected to the transport frame 31, and the receiving conveyor belt 332 overlaps the receiving drive shaft 331. The receiving baffle 34 is located in the conveying direction of the receiving conveyor belt 332, that is, in the second direction of the respective conveyor belts. The finished product assembly 90b can be placed on the receiving conveyor belt 332, and the receiving conveyor belt 332 can drive the finished product assembly 90b to move towards the receiving baffle 34 along the second direction.

[0096] exist Figure 6 In the embodiment shown, two receiving conveyor belts 332 are provided, which are spaced apart along the first direction and respectively support two regions in the first direction of the finished product component 90b to improve the stability of the support for the finished product component 90b.

[0097] Please see Figure 5 and Figure 12 It is understood that the stacking mechanism 20 includes a stacking baffle 21, which is movably connected to the transport frame 31 and is located in the transport direction of the first conveying assembly 32. In the illustrated embodiment, the stacking baffle 21 is capable of moving up and down relative to the transport frame 31, and is located in the first direction of the stacking position 3022. In other embodiments, the stacking baffle 21 may also move relative to the transport frame 31 in other directions that form an angle with the first direction; this is not limited here.

[0098] Accordingly, step S4 specifically includes: S41. Move the partition baffle 11 downward to avoid the movement path of the base plate 91 in the first direction.

[0099] In this step, the partition baffle 11 is moved downwards to below the base plate 91, thereby avoiding obstructing the movement of the base plate 91 along the first direction.

[0100] S42. The base plate 91 is conveyed along the first direction by the first conveying component 32 until the base plate 91 abuts against the stacking baffle 21, so that the base plate 91 reaches the stacking position 3022.

[0101] In this step, the stacking baffle 21 can be moved upward to the conveying path of the base plate 91, that is, the stacking baffle 21 and the base plate 91 are located on the same plane. During the movement of the base plate 91 along the first direction, it can abut against the stacking baffle 21. At this time, the stacking baffle 21 is limited to the stacking position 3022 to facilitate the stacking mechanism 20 to perform stacking operation on the base plate 91 at the stacking position 3022.

[0102] In this way, the above steps not only achieve smooth and unobstructed transfer of the base plate 91 from the splitting position 3021 to the stacking position 3022, but also ensure the precise positioning of the base plate 91 at the stacking position 3022 through the limiting effect of the stacking baffle 21. This provides a stable and reliable benchmark for the subsequent stacking mechanism 20 to smoothly stack and position the unprocessed circuit boards 92, effectively improving the stacking accuracy. At the same time, the entire process is completed automatically without manual intervention to adjust the position of the base plate 91. This avoids the errors and inefficiencies of manual operation, ensures the continuity of the base plate 91 recycling process, further improves the fully automated closed loop, and helps to simultaneously improve the conveying efficiency and product quality.

[0103] Optional, combined Figure 13 The stacking baffle 21 can move up and down under the drive of the third lifting drive 211. When the base plate 91 approaches the stacking baffle 21, the stacking baffle 21 can move upward under the drive of the third lifting drive 211 so that the base plate 91 can abut against the stacking baffle 21. Specifically, the base plate 91 reaches the stacking position 3022 by abutting against the stacking baffle 21. When the stacking operation is completed and the component to be processed 90a is formed, the stacking baffle 21 can move downward under the drive of the third lifting drive 211 so that the stacking baffle 21 separates from the base plate 91 or the component to be processed 90a, thereby avoiding the friction caused by the stacking baffle 21 when the circuit board 92 or the cardboard 93 moves downward, and allowing the component to be processed 90a to continue moving in the first direction.

[0104] Of course, the stacking baffle 21 can also be fixed in position, and the limiting and unlimiting operations of the base plate 91 can only be achieved by the up and down movement of the first conveying component 32. As an alternative embodiment, the first conveying component 32 can be moved up and down by the fourth lifting drive. When the first conveying component 32 starts to convey the base plate 91 located on the separating position 3021 along the first direction, it can be moved downward by the fourth lifting drive so that the horizontal height of the stacking baffle 21, which remains unchanged, exceeds that of the base plate 91 and is located on the conveying path of the base plate 91 in the first direction. In this way, when the base plate 91 is conveyed to the stacking position 3022, it can abut against the stacking baffle 21. After the stacking operation is completed and the component to be processed 90a is formed, the first conveying component 32 can be moved upward by the drive of the fourth lifting drive so that the base plate 91 moves upward and exceeds the stacking baffle 21, so that the component to be processed 90a can continue to move along the first direction.

[0105] Please see Figure 5 and Figure 12It is understood that the stacking mechanism 20 also includes a stacking robot 22. The stacking robot 22 is located on one side of the stacking position 3022. The stacking robot 22 is used to first stack the cardboard 93 in the cardboard placement area 230 onto the base plate 91, and then stack the unprocessed circuit board 92 in the circuit board placement area 240 onto the cardboard 93 to form the component to be processed 90a.

[0106] Optionally, the stacking mechanism 20 also includes a cardboard frame 23 and a circuit board frame 24. The cardboard frame 23 is provided with multiple cardboard 93 limiting members. A cardboard placement area 230 is formed on the upper surface of the cardboard frame 23. Cardboard 93 can be stacked in the cardboard placement area 230. The cardboard 93 limiting members are located at the edges of the cardboard placement area 230 to limit the boundary position of the cardboard placement area 230, thereby aligning the edges of the cardboard 93 vertically and preventing the cardboard 93 from falling. The circuit board frame 24 is provided with circuit board 92 limiting members. A circuit board placement area 240 is formed on the upper surface of the circuit board frame 24. Circuit boards 92 can be stacked in the circuit board placement area 240. The circuit board 92 limiting members are located at the edges of the circuit board placement area 240 to limit the boundary position of the circuit board placement area 240, thereby aligning the edges of the circuit boards 92 vertically and preventing the circuit boards 92 from falling.

[0107] Accordingly, step S5 specifically includes: S51. The cardboard 93 on the cardboard rack 23 and the circuit board 92 on the circuit board rack 24 are stacked on the base plate 91 located at the stacking position 3022 by the stacking robot 22 to form the component to be processed 90a.

[0108] This step integrates the modular design of the stacking mechanism 20, stacking robot 22, cardboard rack 23, and circuit board rack 24. Combined with the orderly grasping and stacking of materials on the cardboard rack 23 and circuit board rack 24 by the stacking robot 22, it achieves automated layered stacking of cardboard 93, circuit board 92, and base plate 91, as well as the integrated forming of the component 90a to be processed. This not only completely replaces the tedious traditional manual stacking operation, avoiding problems such as stacking misalignment and material damage caused by manual operation, and ensuring the stacking accuracy and consistency of the component 90a to be processed, but also improves the continuity of material retrieval and stacking through the dedicated storage design of the material rack and the efficient operation of the robot. Combined with the fully automated closed-loop process, it further shortens the conveying cycle and reduces reliance on manual labor.

[0109] It should be noted that in the embodiment where a cardboard 93 is provided between the circuit board 92 and the base plate 91, the stacking robot 22 can first put the cardboard 93 onto the positioning post 9111 of the base plate 91 through the second limiting hole 931, and then stack the cardboard 93 on the base plate 91. Then, the cardboard 93 is released, and the circuit board 92 is put onto the positioning post 9111 of the base plate 91 through the first limiting hole 920, and then stack the circuit board 92 on the cardboard 93, so that the base plate 91, the cardboard 93 and the circuit board 92 together form the component to be processed 90a. In this embodiment, the cardboard 93 picked up by the stacking robot 22 can be brand new cardboard 93, which can be stacked in the cardboard placement area 230. The brand new circuit board 92 can be stacked in the circuit board placement area 240. The stacking robot 22 can first remove the cardboard 93 from the cardboard placement area 230, then stack the cardboard 93 on the base plate 91, and complete the engagement with the positioning post 9111 on the base plate 91. Then, it releases the cardboard 93, removes the circuit board 92 from the circuit board placement area 240, and then stacks the circuit board 92 on the cardboard 93, completing the engagement with the positioning post 9111 on the base plate 91. In other embodiments, the cardboard 93 stacked on the base plate 91 can also be the cardboard 93 removed in the board separation process; there is no limitation here.

[0110] Optionally, the stacking robot 22 includes multiple stacking suction cups 221. The stacking robot 22 can use the stacking suction cups 221 to pick up the cardboard 93 and the circuit board 92, thereby realizing the transport of the cardboard 93 and the circuit board 92. The stacking suction cups 221 can reduce mechanical damage to the circuit board 92 when picking it up.

[0111] In other embodiments, the stacking robot 22 may include multiple stacking grippers, which hold the circuit board 92 and the cardboard 93. This is not a limitation.

[0112] Please see Figure 9 and Figure 13 It is understood that the base plate 91 is provided with a first positioning structure 911, and the stacking mechanism 20 also includes a stacking positioning plate 25. The stacking positioning plate 25 is provided with a second positioning structure 251. The second positioning structure 251 can be inserted and cooperated with the first positioning structure 911 along the thickness direction of the circuit board 92, that is, the first positioning structure 911 and the second positioning structure 251 can be inserted and cooperated along the second direction.

[0113] Accordingly, after the step of the base plate 91 abutting against the stacked baffle 21, the following steps are also included: S43. Move the stacked plate positioning plate 25 upward until the first positioning structure 911 and the second positioning structure 251 are inserted and engaged.

[0114] In this way, the stacking mechanism 20 initially limits the bottom plate 91 through the stacking baffle 21, and further limits the bottom plate 91 through the interlocking cooperation of the first positioning structure 911 and the second positioning structure 251. This achieves precise positioning and stable limiting of the bottom plate 91 at the stacking position 3022, effectively resisting external force interference generated when the stacking robot 22 stacks the cardboard 93 and circuit board 92, and completely avoiding stacking misalignment problems caused by displacement or offset of the bottom plate 91. This provides a highly stable benchmark for the layered stacking of the components 90a to be processed, significantly improving stacking accuracy and component consistency. At the same time, this positioning method relies on a simple interlocking action, eliminating the need for manual positioning assistance. This reduces equipment complexity and maintenance costs, and does not affect the smooth transfer of the bottom plate 91 between workstations, further ensuring the continuity of the fully automated conveying process.

[0115] Optionally, the second positioning structure 251 includes a positioning hole 2511 formed on the stacking positioning plate 25, and the first positioning structure 911 includes a positioning pin 913 protruding from the lower surface of the base plate 91. The stacking positioning plate 25 can move up and down, and the positioning pin 913 can be fitted and inserted into the positioning hole 2511. When the base plate 91 abuts against the stacking baffle 21, the stacking positioning plate 25 is located below the base plate 91, and the positioning pin 913 can be opposite to the positioning hole 2511 in the vertical direction. The stacking positioning plate 25 can be moved upward to allow the positioning pin 913 to be inserted into the positioning hole 2511, so that the base plate 91 is limited to the current stacking position 3022, preventing the base plate 91 from shifting horizontally during the stacking operation. In other embodiments, the positioning pin 913 can also be provided on the stacking positioning plate 25, and the positioning hole 2511 can be formed on the base plate 91. There is no limitation here.

[0116] Optionally, the stacking positioning plate 25 can move up and down through a positioning drive 26, which is connected to the transport frame 31 and its output end is connected to the stacking positioning plate 25.

[0117] As an alternative implementation, the first conveying component 32 can move up and down, while the stacking positioning plate 25 can remain stationary. After the bottom plate 91 abuts against the stacking baffle 21, the first conveying component 32 can move down until the positioning pin 913 on the bottom plate 91 is inserted into the positioning hole 2511, thereby limiting the bottom plate 91 to the current stacking position 3022.

[0118] Please see Figure 12It is understood that the stacking mechanism 20 also includes a third conveying component 35 and an output baffle 36, both connected to the transport frame 31. The output baffle 36 is connected to the transport frame 31 and located on one side of the first conveying component 32 along the first direction. The output baffle 36 can confine the component to be processed 90a to the output position 303. The third conveying component 35 is disposed at the output position 303 and is offset from the first conveying component 32. The two can be offset along the moving direction of the third conveying component 35. The moving direction of the third conveying component 35 can be the thickness direction of the circuit board 92, i.e., the up and down direction, or other directions, which are not limited here. The third conveying component 35 is used to convey the component to be processed 90a at the output position 303 toward a third direction. In the illustrated embodiment, the third direction is perpendicular to the first direction and opposite to the second direction, so as to facilitate the conveying of the finished component 90b and the receiving of the component to be processed 90a on the same side of the transport frame 31, saving the layout space of the circuit board conveying line. In other embodiments, the third direction can also be the same as the second direction, which is not limited here.

[0119] Accordingly, step S6 specifically includes: S61. The component to be processed 90a is conveyed to the output baffle 36 by the first conveying component 32 so as to limit the component to be processed 90a to the output position 303. In this step, when the component to be processed 90a reaches the output position 303, the third conveying component 35 can be located below the component to be processed 90a and spaced apart from the base plate 91. The output baffle 36 is located on the moving path of the component to be processed 90a in the first direction. The component to be processed 90a can abut against the output baffle 36 under the conveying of the first conveying component 32, at which time the component to be processed 90a is confined to the output position 303.

[0120] S62. Move the third conveying component 35 upward relative to the first conveying component 32 so that the third conveying component 35 supports the component to be processed 90a, and the first conveying component 32 is separated from the component to be processed 90a.

[0121] In this step, when it is necessary to output the component 90a to be processed, the third conveying component 35 can move upward from below the component 90a to be processed. Since the third conveying component 35 and the first conveying component 32 are misaligned in the thickness direction of the circuit board 92, the third conveying component 35 can pass through the first conveying component 32 and continue to move upward, thereby replacing the first conveying component 32 to support the component 90a to be processed. As the third conveying component 35 continues to move upward, the component 90a to be processed moves upward with the third conveying component 35 to above the first conveying component 32, thereby achieving separation from the first conveying component 32.

[0122] S63. The component to be processed 90a is conveyed along a third direction by the third conveying component 35 until the component to be processed 90a is removed from the third conveying component 35.

[0123] In this step, the third conveying assembly 35 is activated so that the component 90a to be processed is conveyed out of the transport mechanism 30 via the third conveying assembly 35 in a third direction.

[0124] The output baffle 36 reliably confines the component 90a to be processed at the output position 303, ensuring the reference stability of subsequent conveying switching. The staggered setting and lifting action of the third conveying component 35 and the first conveying component 32 in the thickness direction of the circuit board 92 can smoothly support the component 90a to be processed and separate it from the first conveying component 32, avoiding friction damage or positional displacement of the component during conveying switching. The entire output process is completed automatically without manual intervention to adjust the direction or assist in transfer, which not only improves the smoothness of process connection and conveying efficiency, but also ensures the structural integrity and positional accuracy of the component 90a to be processed, further improving the closed loop of full-process automation.

[0125] As an alternative implementation, the vertical position of the third conveying component 35 may remain unchanged, while the first conveying component 32 may move downward so that the component to be processed 90a moves downward and rests on the third conveying component 35. Then the first conveying component 32 continues to move downward to separate the first conveying component 32 from the base plate 91. At this time, the third conveying component 35 supports the component to be processed 90a.

[0126] Optionally, the third conveying assembly 35 includes an output drive shaft 351 and an output conveyor belt 352. The output drive shaft 351 is connected to the transport frame 31, and the output conveyor belt 352 overlaps the output drive shaft 351. The conveying direction of the output conveyor belt 352 is the third direction. The output conveyor belt 352 can support the component 90a to be processed and drive the component 90a to be processed to move towards the transfer mechanism 40 along the third direction. In the illustrated embodiment, two output conveyor belts 352 are provided, and the two output conveyor belts 352 are spaced apart along the first direction and respectively support two parts of the base plate 91 in the first direction to improve the stability of the support for the component 90a to be processed.

[0127] Please see Figure 5 It is understood that the transport mechanism 30 also includes a guide plate 37, which is connected to the edge of the transport frame 31 and is used to guide the bottom plate 91 during the transport process, thereby improving the accuracy of the bottom plate 91 moving from the receiving position 301 to the stacking position 3022. The guide plate 37 can be connected to the receiving baffle 34 and the output baffle 36 and is integrally formed to facilitate processing and installation.

[0128] Please see Figure 5It is understood that the circuit board conveyor line also includes a transfer mechanism 40, which can move to dock with the receiving position 301 to provide finished component 90b to the receiving position 301. The transfer mechanism 40 can also move to dock with the output position 303 to receive component 90a to be processed. Accordingly, the finished product component 90b is received via the second conveying component 33, including: S111, Connect the transfer mechanism 40 carrying the finished component 90b to the receiving position 301.

[0129] This step is the pre-connection process for the finished component 90b to enter the circuit board conveyor line. The core is to control the transfer mechanism 40 to move to the vicinity of the receiving position 301 and make the material output end of the transfer mechanism 40 and the receiving position 301 of the transport mechanism 30 precisely aligned. This ensures that the finished component 90b is transported smoothly and without deviation after the two are connected, laying a spatial benchmark for the stable transfer of the finished component 90b.

[0130] S112. The finished component 90b is output to the transport mechanism 30 via the transfer mechanism 40.

[0131] After the transfer mechanism 40 and the receiving position 301 are precisely docked, the finished product component 90b carried on the transfer mechanism 40 is smoothly and completely transferred to the receiving position 301 of the transport mechanism 30, relying on the transport function of the transfer mechanism 40. This realizes the automated transfer of the finished product component 90b from the transfer mechanism 40 to the transport mechanism 30 without the need for manual handling or adjustment.

[0132] Accordingly, step S63 specifically includes: S631. Connect the transfer mechanism 40 to the output position 303.

[0133] This step is a crucial connection process for the output of the component 90a to be processed to the circuit board processing equipment. The core is to control the transfer mechanism 40 to move to the vicinity of the output position 303, so that the material receiving end of the transfer mechanism 40 and the output position 303 of the transport mechanism 30 are precisely aligned. This ensures that after the two are connected, a smooth conveying channel is formed along the third direction, and the connection gap, height difference, etc. meet the requirements for the stable transfer of the component 90a to be processed, laying a spatial benchmark for the subsequent directional transfer of components.

[0134] S632, The component to be processed 90a is conveyed along a third direction by the third conveying component 35 until the component to be processed 90a moves onto the transfer mechanism 40.

[0135] After the transfer mechanism 40 and the output position 303 are precisely docked, the supporting and positioned component 90a is smoothly transported along the third direction by relying on the power output function of the third conveying component 35 until the component is completely transferred to the bearing surface of the transfer mechanism 40, realizing the automated transfer of the component 90a from the transport mechanism 30 to the transfer mechanism 40, without the need for manual assistance in pushing or adjusting the position.

[0136] The transfer mechanism 40 can accurately transport the finished product component 90b to the receiving position 301, achieving a seamless connection between the finished product component 90b and the board separation process. It can also efficiently receive the component 90a to be processed from the output position 303 and transfer it to the circuit board processing equipment, completing the directional transfer of the component 90a to the processing step. The entire transfer process requires no manual intervention, completely replacing the traditional manual material transfer mode. This not only significantly reduces labor costs and the risk of damage during material transfer, ensuring the structural integrity and positional accuracy of the components, but also significantly improves the efficiency of inter-process connections and the continuity of transport, further perfecting the fully automated system.

[0137] In other embodiments, the transfer mechanism 40 may simply move to dock with the receiving position 301 to provide the finished component 90b to the receiving position 301, without docking with the output position 303, or it may simply move to dock with the output position 303 to receive the component 90a to be processed, without docking with the receiving position 301. No limitation is made here.

[0138] Optionally, the transfer mechanism 40 may include a first transfer vehicle 41 and a second transfer vehicle 42. The first transfer vehicle 41 may dock with the receiving position 301 to transport the finished component 90b processed on the circuit board processing equipment to the transport mechanism 30. The second transfer vehicle 42 may dock with the output position 303 to transport the component 90a to be processed from the transport mechanism 30 to the circuit board processing equipment. In this way, the first transfer vehicle 41 and the second transfer vehicle 42 can work simultaneously to transport the finished component 90b and the component 90a to be processed at the same time, thereby improving processing efficiency. The first transfer vehicle 41 may stack multiple layers of finished components 90b to achieve simultaneous transport of multiple finished components 90b, and the second transfer vehicle 42 may stack multiple layers of components 90a to achieve simultaneous transport of multiple components 90a to be processed, thereby improving processing efficiency.

[0139] This application embodiment also provides a circuit board processing system, which includes circuit board processing equipment and the aforementioned circuit board conveyor line. The circuit board processing equipment includes a machine tool and a worktable assembly. The worktable assembly includes a drive mechanism and a worktable plate, the worktable plate being the aforementioned base plate 91. The worktable plate is detachably connected to the drive mechanism, which is used to receive and output circuit board assemblies 92. Specifically, the drive mechanism can receive a component 90a to be processed containing circuit board assemblies, the component 90a containing the base plate 91 serving as the worktable plate. This transportation method allows multiple circuit boards to be pre-fixed on the base plate 91, eliminating the need for positioning operations when the circuit boards are transported to the circuit board processing equipment, reducing positioning errors and improving efficiency. The machine tool can be used to process the circuit boards 92 in the transported component 90a to be processed, forming a finished component 90b. The drive mechanism can also output the finished component 90b containing the processed circuit board assemblies, thereby completing the circuit board assembly processing flow.

[0140] In this embodiment, the circuit board delivery method includes: First, the finished component 90b processed by the circuit board processing equipment is transported to the first transfer car 41. The first transfer car 41 is then docked with the receiving position 301 on the transport mechanism 30. The finished component 90b is then transported along the second direction by the second conveying component 33 until it abuts against the receiving baffle 34, at which point the finished component 90b has reached the receiving position 301. Then, the second conveying component 33 is lowered so that the finished component 90b rests on the first conveying component 32 and is separated from the second conveying component 33. Then, the first conveying component 32 transports the finished component 90b along the first direction, while the separating baffle 11 is raised so that the finished component 90b abuts against the separating baffle 11 during transport, thereby reaching the separating position 3021. At this time, the limiting cap 9122 under the bottom plate 91 is slidably connected in the pull plate groove 150. Then, the top pin 161 is driven to rise, so that the top pin 161 passes through the clearance hole 914 on the base plate 91 and lifts the cardboard 93 and circuit board 92 until the cardboard 93 and circuit board 92 are both removed from the positioning post 9111 on the base plate 91. Then, the separating robot 12 first picks up the finished part 92a in the circuit board 92 and transports it to the finished product placement area 130 of the finished product rack 13. Then, the separating robot 12 picks up the cardboard 93, so that the cardboard 93 and the remaining waste part 92b on the cardboard 93 are simultaneously transported to the waste placement area 140 of the waste rack 14. Then, the top pin 161 is driven down to separate from the bottom plate 91, and the separating baffle 11 is lowered to avoid the movement path of the bottom plate 91 in the first direction. Then, the bottom plate 91 continues to be conveyed in the first direction by the first conveying assembly 32, while the stacking baffle 21 is raised. The bottom plate 91 can abut against the stacking baffle 21 under the conveying of the first conveying assembly 32. At this time, the bottom plate 91 reaches the stacking position 3022. Then, the stacking positioning plate 25 is raised until the positioning pin 913 under the bottom plate 91 is inserted into the positioning hole 2511 of the stacking positioning plate 25. Then, the stacking robot 22 picks up the cardboard 93 in the cardboard placement area 230 on the cardboard rack 23, and fits the cardboard 93 onto the positioning post 9111 of the base plate 91 through the second limiting hole 931, and stacks it on top of the base plate 91. Then, the stacking robot 22 picks up the unprocessed circuit board 92 in the circuit board placement area 240 on the circuit board rack 24, and fits the circuit board 92 onto the positioning post 9111 of the base plate 91 through the first limiting hole 920, and stacks it on top of the cardboard 93, forming the component to be processed 90a. Then, the stacking positioning plate 25 descends so that the positioning pin 913 disengages from the positioning hole 2511, and at the same time, the stacking baffle 21 descends to avoid the movement path of the component in the first direction. Then, the first conveying component 32 continues to convey the component to be processed 90a in the first direction until the component to be processed 90a abuts against the output baffle 36, at which point the component to be processed 90a is in the output position 303.Then, the third conveying component 35 rises until it supports the base plate 91, and the first conveying component 32 separates from the base plate 91. Simultaneously, the second transfer cart 42 docks with the output position 303. The component 90a to be processed is then conveyed in a third direction via the third conveying component 35 until it reaches the second transfer cart 42. The second transfer cart 42 then transports the component 90a to the circuit board processing equipment, allowing the equipment to process the circuit board 92 to form the finished component 90b. The above steps are then repeated.

[0141] In other embodiments, during the board separation process, the board separation robot 12 may only sort the finished product section 92a and the waste section 92b of the circuit board 92 without removing the cardboard 93. That is, the board separation mechanism 10 can transport the base plate 91 together with the cardboard 93 to the stacking mechanism 20. Correspondingly, during the stacking process, the stacking robot 22 will only stack the unprocessed boards on the cardboard 93 without stacking new cardboard 93. In addition, the base plate 91 may only refer to the cardboard 93 without actually setting up a base plate 91; this is not a limitation.

[0142] In other embodiments, the drive mechanism may receive the circuit board assembly without outputting to the circuit board assembly, or output the circuit board assembly without receiving it; there are no limitations on this.

[0143] The above descriptions are merely several specific embodiments of this application, and only specifically describe the technical principles of this application. These descriptions are only for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this interpretation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application, as well as other specific embodiments of this application that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of this application.

Claims

1. A circuit board conveying method for conveying circuit board assemblies, the circuit board assembly comprising stacked circuit boards and a base plate, applied to a circuit board conveying line, the circuit board conveying line comprising a stacking mechanism, a separating mechanism, and a transport mechanism, characterized in that... The circuit board delivery method includes: The finished components, including the processed circuit board and the base plate, are transported to the transport vehicle. The finished components are transported to the separating mechanism via the transport mechanism; The circuit board in the finished assembly is separated from the base plate by the separation mechanism; The base plate is transported to the stacking mechanism via the transport mechanism; The circuit boards to be processed are stacked on the base plate by the stacking mechanism to form the assembly to be processed; Output the component to be processed.

2. The circuit board conveying method as described in claim 1, characterized in that, The transport mechanism includes a transport frame, which has a receiving position, a separating position, a stacking position and an output position arranged sequentially along a first direction. The transport mechanism is provided with a first conveying component connected to the transport frame at the receiving position, the separating position, the stacking position and the output position. The process of transporting the finished component to the separating mechanism via the transport mechanism specifically includes: The finished product assembly is transported from the receiving position to the separating position via the first conveying component; The transport mechanism conveys the base plate to the stacking mechanism, specifically including: The base plate is transported from the splitting position to the stacking position via the first conveying component.

3. The circuit board conveying method as described in claim 2, characterized in that, The plate-separating mechanism includes a plate-separating baffle, which is movably connected to the transport frame and located in the transport direction of the first transport assembly; The step of conveying the finished product component from the receiving position to the separating position via the first conveying component further includes: The finished product assembly is conveyed along the first direction by the first conveying component until it abuts against the partition plate baffle, thereby confining the finished product assembly to the partition plate position.

4. The circuit board conveying method as described in claim 3, characterized in that, The board separation mechanism includes a board separation robot arm, which is disposed on one side of the board separation position. The board separation mechanism also includes a finished product rack and a scrap rack. The processed circuit board includes a finished product section and a scrap section. The step of separating the circuit board from the base plate in the finished assembly through the board separation mechanism includes: The finished product section is placed on the finished product rack by the separating robot, and the waste section is placed on the waste rack.

5. The circuit board conveying method as described in claim 3, characterized in that, The board separation mechanism also includes a pull plate component, which is connected to the transport frame. The pull plate component can dock with the base plate and restrict the base plate from moving along the thickness direction of the circuit board. After the finished product component is conveyed along the first direction by the first conveying component, the process further includes: The base plate is connected to the pull plate member by the first conveying component.

6. The circuit board conveying method as described in claim 5, characterized in that, A limiting rod and a limiting cap are provided on the bottom of the base plate. The pull plate component has a pull plate groove that runs through the first direction. The groove opening width is smaller than the groove bottom width. The step of connecting the base plate to the pull plate member via the first conveying component specifically includes: The limiting cap is slid into the pull plate groove by the first conveying component.

7. The circuit board conveying method as described in claim 5, characterized in that, The plate-separating mechanism also includes a top-feeding assembly; Before separating the circuit board from the base plate in the finished assembly via the board separation mechanism, the method further includes: The top material assembly is moved along the thickness direction of the circuit board and lifts the circuit board so that the circuit board is detached from the base plate.

8. The circuit board conveying method as described in claim 2, characterized in that, The transport mechanism further includes a second conveying component and a receiving baffle, both connected to the transport frame. The second conveying component is disposed at the receiving position and is offset from the first conveying component. The second conveying component can move along the thickness direction of the circuit board and is used to transport the finished component towards the receiving position along a second direction. The receiving baffle is connected to the transport frame and is located on one side of the receiving position along the second direction, which is perpendicular to the first direction. The process of transporting the finished components to the transportation mechanism includes: The finished product component is received by the second conveying component and conveyed toward the second direction until the finished product component abuts against the receiving baffle so that the finished product component reaches the receiving position; The second conveying component is moved downward relative to the first conveying component so that the first conveying component supports the finished product component, and the second conveying component is separated from the finished product component.

9. The circuit board conveying method as described in claim 3, characterized in that, The stacking mechanism includes a stacking baffle, which is movably connected to the transport frame and located in a first direction of the first conveying assembly; The process of conveying the base plate to the stacking mechanism via the transport mechanism includes: The partition plate baffle is moved downward to avoid the movement path of the base plate in the first direction; The base plate is conveyed along the first direction by the first conveying component until it abuts against the stacking baffle, so that the base plate reaches the stacking position.

10. The circuit board conveying method as described in claim 9, characterized in that, The stacking mechanism also includes a stacking robot, a cardboard frame, and a circuit board frame, all of which are located on one side of the stacking position. The process of stacking the circuit boards on the base plate using the stacking mechanism to form the assembly to be processed includes: The stacking robot stacks the cardboard from the cardboard rack and the circuit boards from the circuit board rack onto the base plate located at the stacking position to form the component to be processed.

11. The circuit board conveying method as described in claim 10, characterized in that, The base plate is provided with a first positioning structure, and the stacking mechanism further includes a stacking positioning plate, on which a second positioning structure is provided; after the base plate abuts against the stacking baffle, the mechanism further includes: The stacked plate positioning plate is moved upward until the first positioning structure and the second positioning structure are inserted and engaged to limit the bottom plate to the stacked plate position.

12. The circuit board conveying method as described in claim 2, characterized in that, The transport mechanism further includes a third conveying component and an output baffle, both connected to the transport frame. The output baffle is connected to the transport frame and located in a first direction of the first conveying component. The output baffle can limit the component to be processed to the output position. The third conveying component is disposed at the output position. The output of the component to be processed includes: The component to be processed is conveyed by the first conveying component to abut against the output baffle, thereby confining the component to be processed to the output position; The third conveying component is moved upward relative to the first conveying component, such that the third conveying component supports the component to be processed, and the first conveying component is separated from the component to be processed; The component to be processed is conveyed along a third direction by the third conveying component until the component to be processed is removed from the third conveying component, the third direction being perpendicular to the first direction.

13. A circuit board conveying line, employing the circuit board conveying method as described in any one of claims 1-12, characterized in that, The circuit board conveyor line also includes a transfer mechanism that can dock with the transport mechanism to receive and / or transport the circuit board assembly.

14. A circuit board processing system, characterized in that, The invention includes circuit board processing equipment and a circuit board conveyor line as described in claim 13. The circuit board processing equipment includes a machine tool and a worktable assembly. The worktable assembly includes a drive mechanism and a worktable plate. The worktable plate is the base plate. The worktable plate is detachably connected to the drive mechanism. The drive mechanism is used to receive and / or output the circuit board assembly.

Images