Pressure-sensitive adhesive composition, electric visbreaking foam tape and preparation method of electric visbreaking foam tape

Abstract

The invention relates to a pressure-sensitive adhesive composition, an electric visbreaking foam tape and a preparation method of the pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition is prepared from the following raw materials in parts by weight: 100 parts of photocuring slurry, 5-20 parts of ionic liquid, 0.2-5 parts of a photoinitiator, 0.5-7 parts of hollow microspheres, 1-4 parts of thickening filler, 0-25 parts of tackifying resin and 0-5 parts of an auxiliary agent, the light-cured slurry is prepared from 30 to 70 parts of polyurethane acrylate oligomer, 15 to 65 parts of hydrophobic monomer and 5 to 20 parts of hydrophilic monomer; the glass transition temperature of the copolymer of the light-cured slurry is less than or equal to-10 DEG C; the polyurethane acrylate oligomer is a polyurethane acrylate oligomer containing a polyethyoxyl structure, and the polyethyoxyl structure is a polyurethane acrylate oligomer containing a polyethyoxyl structure; the ionic liquid is a disubstituted imidazole compound containing an alkenyl group and an alkyl group.

Description

Technical Field

[0001] This invention relates to the field of adhesive technology, and in particular to a pressure-sensitive adhesive composition, an electro-tack reducing foam tape, and a method for preparing the same. Background Technology

[0002] Consumer electronics products such as mobile phones, laptops, and smartwatches are portable and wearable devices that typically contain high-value but fragile components like batteries, screens, and cameras. These components are sensitive to temperature, stress, and solvents, making methods like heating to de-bond or pulling them apart unsuitable for disassembly and recycling during product assembly, rework, fault repair, or at the end of the product's lifecycle. In recent years, the trends towards thinner, lighter, more portable, and waterproof consumer electronics, along with the promotion of curved and foldable screens, have improved the user experience. However, these trends have also led to drawbacks such as the inability of electronic products to withstand impacts and drops, and high repair costs, which in turn hinders the market promotion of new electronic products.

[0003] To achieve reliable adhesion, waterproofing, dustproofing, and impact resistance, while also ensuring easy disassembly during repairs, various new adhesive technologies are constantly emerging. In battery bonding, previous typical removable adhesive solutions included stretch-adhesive tapes, ethanol-based stretch-adhesive tapes, and strong-weak double-sided tapes. These solutions ensured quick and good fixation after assembly and repair, but disassembly often required slow and careful operation by professional repair personnel. Even so, using stretch-adhesive tapes, ethanol-based stretch-adhesive tapes, and strong-weak double-sided tapes still carries the risk of tape breakage, leakage of ethanol and its moisture content into other sensitive components, resulting in residual adhesive and contamination of parts, or excessive force during disassembly leading to battery deformation, separator puncture, and potential fire hazards. When installing mobile phone screens and back covers, high-strength and impact-resistant tapes such as PE foam, polyurethane foam, and acrylic foam are commonly used. However, disassembly generally requires heating to soften the tape before slow removal, taking care not to damage phone components, which is very time-consuming and labor-intensive.

[0004] WO2023054478A1, CN111819257B, and CN118043426A respectively disclose formulations of solvent-containing electro-tack adhesives. The preparation process generates a large amount of VOCs. While the resulting tapes possess high peel strength, the lack of a foamed structure in the tapes prevents them from providing good impact absorption, thus failing to effectively protect electronic products. CN120519100A, CN119286411A, and CN119639392B disclose methods for preparing acrylic foam tapes. Although the foam tapes provided by these technical solutions possess certain impact absorption, stress mitigation, and high peel strength, disassembling the two components bonded with them is extremely difficult.

[0005] In summary, existing technical solutions cannot simultaneously meet the requirements of reliable adhesion, waterproofing and dustproofing, impact resistance, and easy disassembly. Therefore, developing a solution that combines the advantages of both foam tape and electro-adhesive tape has become an urgent problem to be solved. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a pressure-sensitive adhesive composition, an electro-adhesive foam tape, and a method for preparing the same. The electro-adhesive foam tape containing the pressure-sensitive adhesive composition provided by this invention possesses both the excellent peel strength and impact absorption of acrylic foam tape, and the advantages of electro-adhesive tape, such as significantly reduced peel strength under low voltage and no adhesive residue after peeling. Furthermore, the entire preparation process does not use organic solvents, which aligns better with the concept of sustainable development.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] In a first aspect, the present invention provides a pressure-sensitive adhesive composition, wherein the raw materials for preparing the pressure-sensitive adhesive composition comprise, by weight, the following:

[0009] 100 parts of UV-curable slurry, 5-20 parts of ionic liquid, 0.2-5 parts of photoinitiator, 0.5-7 parts of hollow microspheres, 1-4 parts of thickening filler, 0-25 parts of tackifying resin, and 0-5 parts of additives;

[0010] The photocurable slurry comprises 35-70 parts of polyurethane acrylate oligomer, 15-65 parts of hydrophobic monomer, and 5-20 parts of hydrophilic monomer.

[0011] The glass transition temperature of the copolymer of the photocurable slurry is ≤-10℃;

[0012] The polyurethane acrylate oligomer is a polyurethane acrylate oligomer containing a polyethoxy group structure;

[0013] The ionic liquid is a disubstituted imidazole compound containing an alkenyl group and an alkyl group.

[0014] Among them, 5-20 portions can be 5 portions, 10 portions, 15 portions, or 20 portions, etc.; 0.2-5 portions can be 0.2 portions, 0.5 portions, 1 portion, 2 portions, 3 portions, 4 portions, or 5 portions, etc.; 0.5-7 portions can be 0.5 portions, 0.8 portions, 1 portion, 2 portions, 3 portions, 4 portions, 5 portions, 6 portions, or 7 portions, etc.; 1-4 portions can be 1 portion, 1.5 portions, 2 portions, 3 portions, or 4 portions, etc.; 0-25 portions can be 0 portions, 5 portions, 10 portions, 15 portions, 20 portions, or 25 portions, etc.; 0-5 portions can be 0 portions, 0.5 portions, 1 portion, 2 portions, 3 portions, 4 portions, or 5 portions, etc.

[0015] The glass transition temperature is ≤-10℃, for example, it can be -50℃, -40℃, -30℃, -20℃ or -10℃, etc.

[0016] This invention, through the rational selection of the types and proportions of each raw material component in the pressure-sensitive adhesive composition, enables the produced electro-tack reducing foam tape to possess the excellent properties of both electro-tack reducing tape and acrylic foam tape. Through the combined design of polyurethane acrylate oligomers and two types of monomers, the resulting photocurable slurry copolymer exhibits low Tg and good pressure-sensitive adhesive properties. The tackifying resin further enhances the adhesive performance, achieving high peel strength for the acrylic foam tape at both room temperature (23℃) and high temperature (80℃). By adding polyethoxylated polyurethane acrylate oligomers and ionic liquids to the pressure-sensitive adhesive composition, ions exhibit good migration ability under low voltage, achieving rapid tack reduction under low voltage. The synergistic effect of adding polyurethane acrylate oligomers and highly elastic hollow microspheres (low-impact glass microspheres or polymer microspheres) to the pressure-sensitive adhesive composition imparts… The pressure-sensitive adhesive composition exhibits excellent point impact absorption; the use of high-temperature resistant hollow microspheres (glass microspheres, high initial foaming temperature, or pre-foamed polymer microspheres) imparts reliable high-temperature peel strength to the electro-tack-reducing foam tape; the addition of thickening fillers to the pressure-sensitive adhesive composition facilitates the preparation of a pressure-sensitive adhesive composition with appropriate thixotropic properties, enabling the hollow microspheres to be stably dispersed and less prone to floating and delamination; the addition of an appropriate amount of photoinitiator to the pressure-sensitive adhesive composition helps reduce monomer residue and enhance high-temperature peel strength; the addition of additives and other components to the pressure-sensitive adhesive composition provides reinforcement, coloring, and dispersion assistance in the preparation process of the pressure-sensitive adhesive composition and substrate-free acrylic foam tape.

[0017] The electro-adhesive foam tape provided by this invention has a substrate-free structure and is suitable for various application scenarios. It can achieve bonding and debonding between various materials: (1) It can be used between conductive and non-conductive materials, such as between metal and plastic. First, a conductive coating or plating is applied to the plastic surface. One side of the electro-adhesive foam tape is bonded to the conductive coating or plating, and the other side is bonded to the metal surface. When a voltage is applied between the conductive coating or plating and the metal (the negative electrode is connected to the metal), a portion of the ionic liquid migrates to the metal surface, destroying the bonding interface of the electro-adhesive foam tape, thereby achieving a significant reduction in peel force, such as Figure 3 As shown. (2) It can be used between conductive and non-conductive materials, such as between metal and plastic. First, a conductive substrate (such as aluminum-plastic composite film) is bonded to the plastic surface. One side of the electro-adhesive foam tape is bonded to the conductive substrate, and the other side is bonded to the metal surface. When a voltage is applied between the conductive substrate and the metal (the negative electrode is connected to the metal), part of the ionic liquid migrates to the metal surface, destroying the bonding interface of the electro-adhesive foam tape, thereby achieving a significant reduction in peel force, such as Figure 4As shown. (3) It can be used between two conductive materials, such as between metals. The two sides of the electro-adhesive foam tape are used directly to bond the surfaces of the two metals together (but they are not conductive to each other). When a voltage is applied between the two metals, a portion of the ionic liquid migrates to the metal surface connected to the negative electrode, destroying the bonding interface between the electro-adhesive foam tape and the metal surface connected to the negative electrode, thus achieving a significant reduction in peel force. Figure 5 As shown.

[0018] Preferably, the functionality of the polyurethane acrylate oligomer containing the polyethoxy structure is 2.

[0019] Preferably, the polyurethane acrylate oligomer containing the polyethoxy structure has the structure shown in formula (I):

[0020]

[0021] Equation (Ⅰ);

[0022] Wherein, R1 is a H atom or a -CH3 group; m is an integer, and m>9, for example, m can be 10, 15, 20, 25, 30, 40 or 50, etc.

[0023] R2 is any one of -CH2CH2O-, -CH2CHO(CH3)-, or -CH2CH2CH2CH2O-;

[0024] X is a structural unit containing two urethane groups;

[0025] Y represents an aliphatic polyester group or a group other than -(CH2CH2O). m Any of the polyalkoxy groups other than -

[0026] Preferably, X is -OOCNH-C6H4-NHCOO- or -OOCNH-C 10 H 16 -NHCOO- or -OOCNH-C6H 12 Any one of -NHCOO-.

[0027] Preferably, the Y is -(OCH(CH3)-COO). n -、-(CH2CH2CH2O) n -or-(CH2CH2CH2CH2O) n - any one of the following; where n is an integer and n>1, for example n can be 2, 4, 6, 8, 10, 15 or 20, etc.

[0028] Preferably, the glass transition temperature of the polyurethane acrylate oligomer containing the polyethoxy structure is ≤0℃. For example, it can be 0℃, -10℃, -20℃, -30℃, -40℃, -50℃, -60℃, -70℃, -80℃, etc.

[0029] The preferred polyurethane acrylate oligomer of formula (Ⅰ) containing a polyethoxy group has two (meth)acryloyloxy groups and a functionality of 2. When a polyurethane acrylate oligomer without a polyethoxy group, or with a Tg > 0°C, or a functionality ≥ 3 is selected, the resulting electro-adhesive foam tape has too high a degree of crosslinking after curing, poor initial tack, and cannot fully wet the surface of the bonded materials, thus failing to achieve high peel strength before energization. When a polyurethane acrylate oligomer without a polyethoxy group or with a Tg > 0°C is selected, the resulting electro-adhesive foam tape has poor flexibility, resulting in poor point impact absorption.

[0030] The present invention preferably has a polyurethane acrylate oligomer having the structure of formula (Ⅰ), where m is an integer and m>9, that is, containing more than 9 -CH2CH2O- groups. When the selected polyurethane acrylate oligomer containing a polyethoxy structure has ≤9 -CH2CH2O- groups, the ion migration ability of the resulting pressure-sensitive adhesive composition is too weak, and it cannot achieve efficient migration of some ions in the ionic liquid under the condition of energization, and cannot achieve rapid reduction of peel force after energization.

[0031] Preferably, the hydrophobic monomer comprises any one or a combination of at least two of the following: ethyl acrylate, butyl acrylate, n-octyl acrylate, isooctyl acrylate, lauryl acrylate, n-decyl acrylate, isohexadecanyl acrylate, 2-phenoxyethyl methacrylate, methyl methacrylate, butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, isobornyl methacrylate, 3,3,5-trimethylcyclohexyl methacrylate, or p-tert-butylcyclohexyl methacrylate.

[0032] Preferably, the hydrophilic monomer comprises any one or a combination of at least two of the following: acrylic acid, methacrylic acid, β-carboxyethyl acrylate, (meth)acrylamide, N,N-dimethylacrylamide, N,N-diethylacrylamide, N-vinylcaprolactam, N-vinylpyrrolidone, acryloylmorpholine, hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, or 4-hydroxybutyl acrylate.

[0033] Preferably, the ionic liquid comprises any one or a combination of at least two of the disubstituted imidazole compounds containing an alkenyl group and an alkyl group having the structure shown in formula (II);

[0034]

[0035] Equation (II);

[0036] Wherein, R1 is a C2-C5 alkenyl group, such as vinyl, propenyl, butenyl, or pentenyl; R2 is a C1-C6 alkyl group, such as methyl, ethyl, propyl, butyl, pentyl, or hexyl; X is a C1-C6 alkyl group. - ,Br - I - PF 6- BF 4- CF3SO 3- N(CF3SO2) 2- NO 3- or CH3C6H4SO3 - .

[0037] Preferably, the C2-C5 alkenyl group is vinyl or propylene.

[0038] The present invention preferably uses a disubstituted imidazole compound having a structure of formula (II) containing an alkenyl group and an alkyl group. When R1 is an alkenyl group containing more than 6 carbon atoms or R2 is an alkyl group containing more than 7 carbon atoms, the increase in the number of carbon atoms leads to an increase in the steric hindrance of the ions, a decrease in the migration ability of the ionic liquid, and a decrease in the tack reduction efficiency of the electro-tack reducing foam tape under energized conditions, and a significant decrease in the peel force.

[0039] Preferably, the initiator comprises a free radical photoinitiator.

[0040] Preferably, the free radical photoinitiator includes any one or a combination of at least two of the following: 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-methyl-2-(4-morpholino)-1-[4-(methylthio)phenyl]-1-propanone, 2,2-dimethoxy-2-phenylacetophenone, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, or benzophenone.

[0041] Preferably, the hollow microspheres include hollow glass microspheres and / or hollow polymer microspheres.

[0042] Preferably, the D50 diameter of the hollow glass microspheres is 10-80 μm, for example, it can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm or 80 μm, etc.

[0043] Preferably, the true density of the hollow glass microspheres is 0.1-0.250 g / cm³. 3 For example, it could be 0.1 g / cm³.3 0.12 g / cm 3 0.14 g / cm 3 0.15 g / cm 3 0.16 g / cm 3 0.18 g / cm 3 0.2 g / cm 3 0.22 g / cm 3 0.24 g / cm 3 Or 0.25 g / cm 3 wait.

[0044] Preferably, the impact strength of the hollow glass microspheres is <1000 psi, for example, it can be 500 psi, 600 psi, 700 psi, 800 psi or 900 psi.

[0045] Preferably, the hollow polymer microspheres include expandable polymer microspheres or pre-expanded polymer microspheres with an initial foaming temperature ≥100℃ (e.g., 100℃, 120℃, 140℃, 150℃, 160℃, 180℃ or 200℃, etc.).

[0046] Preferably, the D50 diameter of the hollow polymer microspheres is 10-80 μm, for example, it can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm or 80 μm.

[0047] Preferably, the thickening filler comprises any one or a combination of at least two of the following: fumed silica, organobentonite, nano-calcium carbonate, talc, solvent-free pigments, or solid pigments.

[0048] Preferably, the tackifying resin includes any one or a combination of at least two of terpene phenol resin, rosin ester resin, or rosin phenol resin.

[0049] Preferably, the softening point of the terpene phenol resin is 90-150℃, for example, it can be 90℃, 100℃, 110℃, 120℃, 130℃, 140℃ or 150℃, etc., and the hydroxyl value is 30-130 mgKOH / g, for example, it can be 30 mgKOH / g, 40 mgKOH / g, 50 mgKOH / g, 60 mgKOH / g, 70 mgKOH / g, 80 mgKOH / g, 90 mgKOH / g, 100 mgKOH / g, 110 mgKOH / g, 120 mgKOH / g or 130 mgKOH / g, etc.

[0050] Preferably, the softening point of the rosin ester resin is 90-150℃, for example, it can be 90℃, 100℃, 110℃, 120℃, 130℃, 140℃ or 150℃, etc., and the acid value is 10-50 mgKOH / g, for example, it can be 10 mgKOH / g, 20 mgKOH / g, 30 mgKOH / g, 40 mgKOH / g or 50 mgKOH / g, etc.

[0051] Preferably, the softening point of the rosinol resin is 90-150℃, for example, it can be 90℃, 100℃, 110℃, 120℃, 130℃, 140℃ or 150℃, etc., and the acid value is 10-50 mgKOH / g, for example, it can be 10 mgKOH / g, 20 mgKOH / g, 30 mgKOH / g, 40 mgKOH / g or 50 mgKOH / g, etc.

[0052] Preferably, the additives include any one or a combination of at least two of the following: chain transfer agents, silane coupling agents, metal corrosion inhibitors, leveling agents, defoamers, antistatic agents, antihydrolysis agents, and antioxidants.

[0053] Preferably, the crosslinking agent comprises a polyfunctional acrylate monomer with a functionality of 2-4.

[0054] Preferably, the crosslinking agent comprises any one or a combination of at least two of 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol diacrylate, ethylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, or pentaerythritol tetraacrylate.

[0055] Preferably, the thixotropic index (TI) of the pressure-sensitive adhesive composition is 2.5-5, for example, it can be 2.5, 3, 3.5, 4, 4.5 or 5, etc.

[0056] The pressure-sensitive adhesive composition provided by this invention has a high viscosity at low shear rates, which is beneficial to the stable distribution of hollow microspheres in the pressure-sensitive adhesive composition. At the same time, the high thixotropic index makes the pressure-sensitive adhesive composition have a low viscosity at high shear rates, which is beneficial to the full mixing and uniform dispersion of materials at high shear rates during the preparation of the pressure-sensitive adhesive composition, and also beneficial to the uniform coating and leveling of the pressure-sensitive adhesive composition.

[0057] In a second aspect, the present invention provides a method for preparing the pressure-sensitive adhesive composition as described in the first aspect, the method comprising the following steps:

[0058] (1) Preparation of photocurable slurry: The polyurethane acrylate oligomer, hydrophobic monomer and hydrophilic monomer are mixed to obtain the photocurable slurry;

[0059] (2) Preparation of pressure-sensitive adhesive composition: The pressure-sensitive adhesive composition is obtained by mixing photocurable slurry, ionic liquid, initiator, hollow microspheres, thickening filler, tackifying resin and additives.

[0060] Preferably, both steps (1) and (2) are performed in an environment where ultraviolet light is blocked.

[0061] Preferably, the mixing in steps (1) and (2) is carried out under stirring.

[0062] Preferably, the stirring speed in step (1) is 200-400 rpm, for example, 200 rpm, 250 rpm, 300 rpm, 350 rpm or 400 rpm.

[0063] Preferably, the mixing time in step (1) is 1.5-2.5 h, for example, it can be 1.5 h, 1.6 h, 1.8 h, 2 h, 2.2 h, 2.4 h or 2.5 h.

[0064] Preferably, the stirring speed in step (2) is 600-1200 rpm, for example, 600 rpm, 800 rpm, 1000 rpm or 1200 rpm.

[0065] Preferably, the mixing time in step (2) is 1.5-2.5 h, for example, it can be 1.5 h, 1.6 h, 1.8 h, 2 h, 2.2 h, 2.4 h or 2.5 h.

[0066] Thirdly, the present invention provides an electro-tack reducing foam tape, the electro-tack reducing foam tape comprising an electro-tack reducing foam layer cured from the pressure-sensitive adhesive composition described in the first aspect.

[0067] The electro-adhesive foam tape also includes release films disposed on both sides of the electro-adhesive foam adhesive layer.

[0068] Preferably, the curing method is UV curing.

[0069] Preferably, the UVA energy of the UV curing light source is 500-5000 mJ / cm². 2 For example, it could be 500 mJ / cm 2 1000 mJ / cm 2 2000 mJ / cm 2 3000 mJ / cm 2 4000 mJ / cm 2 Or 5000 mJ / cm 2 wait.

[0070] Preferably, the thickness of the electro-adhesive layer in the electro-adhesive foam tape is 50-2000 μm, for example, it can be 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 800 μm, 1000 μm, 2000 μm, etc.

[0071] Preferably, the electro-adhesive foam tape is prepared by the following method, the preparation method comprising:

[0072] The pressure-sensitive adhesive composition is applied between two release films using a two-roller coater and then cured. The UV curing energy is 500-5000 mJ / cm². 2 After curing, it becomes an electro-tack reducing foam tape, such as... Figure 1 As shown. The thickness of the electro-adhesive foam tape is 50-2000 μm.

[0073] The electro-adhesive foam tape provided by this invention, when bonding different material surfaces, requires different application methods to achieve both strong adhesion and reduced tack when electrified. For conductive materials, such as metals, the electro-adhesive foam tape can be directly adhered to the material being bonded, such as... Figure 5 As shown. For non-conductive materials (such as plastics), it is necessary to first adhere auxiliary conductive materials or add a conductive coating or plating to the surface of the material to be bonded, or first bond it with a conductive substrate and pressure-sensitive adhesive to form a multi-layer structure with a conductive surface, and then use electro-adhesive foam tape to bond the non-conductive material, such as... Figure 3 and Figure 4 As shown.

[0074] Compared with the prior art, the present invention has at least the following beneficial effects:

[0075] (1) By rationally selecting the types and proportions of each raw material component and monomer in the pressure-sensitive adhesive composition, the pressure-sensitive adhesive composition prepared by the present invention has excellent electro-tack reduction properties. The electro-tack reduction foam tape provided by the present invention has both the excellent peel force and impact absorption of acrylic foam tape, as well as the advantages of electro-tack reduction foam tape such as significantly reduced peel force under low voltage and no residue after peeling.

[0076] (2) The electro-tack reducing foam tape containing the pressure-sensitive adhesive composition provided by the present invention can achieve rapid tack reduction in just 60 seconds under a low voltage of 9 V, and there is no residue or contamination on the attached object. The adhesive performance is quickly restored after power failure, effectively realizing the repair or recycling of the bonded parts.

[0077] (3) The present invention uses a solvent-free pressure-sensitive adhesive composition formulation. The production process only requires UV light irradiation and does not require heating. Compared with the traditional solvent-based pressure-sensitive adhesive preparation process, the energy consumption is lower, and the production process does not use volatile organic solvents, which has the advantage of low VOC emissions. Attached Figure Description

[0078] Figure 1 This is a schematic diagram of the structure of the electro-adhesive foam tape provided by the present invention;

[0079] Figure 2 A schematic diagram of a structure in which a release film B is bonded to one side and an aluminum-plastic composite film is bonded to the other side using the electro-adhesive foam tape provided by the present invention.

[0080] Figure 3 A schematic diagram showing the application of DC voltage to reduce adhesion of plastic and SUS304 stainless steel plates with conductive coatings or platings on their bonding surfaces using the electro-adhesive tape provided by this invention.

[0081] Figure 4 A schematic diagram illustrating the application of DC voltage to reduce adhesion when bonding plastic and SUS304 stainless steel plates with aluminum-plastic composite film attached to the adhesive surface using the electro-adhesive tape provided by this invention.

[0082] Figure 5 A schematic diagram illustrating the application of a DC voltage to reduce adhesion when bonding metal layer A and metal layer B with electro-adhesive foam tape provided by this invention.

[0083] 1-Release film A; 2-Electro-adhesive foam layer; 3-Release film B; 4-Aluminum-plastic composite film; 5-SUS304 stainless steel plate; 6-Ordinary pressure-sensitive adhesive; 7-Metal layer A; 8-Plastic layer; 9-Metal layer B; 10-Conductive coating or plating. Detailed Implementation

[0084] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments. However, the following examples are merely simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention is determined by the claims.

[0085] In the following specific embodiments of the present invention, the specific information of the materials used in the examples and comparative examples is as follows:

[0086] The polyurethane acrylate oligomer, GU3300Z, was purchased from Guojing Chemical. Its glass transition temperature (Tg, hereinafter referred to as Tg) is -37℃, and its functionality is 2.

[0087] Polyurethane acrylate oligomer, CN9021NS, purchased from Sartoma (Guangzhou) Chemical Co., Ltd., with a Tg of -54℃ and a functionality of 2;

[0088] Polyurethane acrylate oligomer, CN8899NS, purchased from Sartoma (Guangzhou) Chemical Co., Ltd., with a Tg of -67℃ and a functionality of 2;

[0089] Polyurethane acrylate oligomer, CN989NS, purchased from Sartoma (Guangzhou) Chemical Co., Ltd., with a Tg of 72℃ and a functionality of 3;

[0090] Hydrophobic monomer, n-butyl acrylate, purchased from Shanghai Huayi Chemical Co., Ltd., Tg: -54℃;

[0091] Hydrophobic monomer, isooctyl acrylate, purchased from Changxing Chemical, Tg -68℃;

[0092] Hydrophobic monomer, 2-phenoxyethyl acrylate, purchased from Changxing Chemical, Tg 39℃;

[0093] Hydrophobic monomer, isobornyl acrylate, purchased from Changxing Chemical, Tg 88℃;

[0094] Hydrophilic monomer, acrylic acid, purchased from Shanghai Huayi Chemical, Tg 106℃;

[0095] The hydrophilic monomer, acrylomorpholine, was purchased from Shanghai Aladdin Biochemical Technology Co., Ltd., with a Tg of 145℃.

[0096] The ionic liquid, 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, was purchased from Shanghai Aladdin Biochemical Technology Co., Ltd.

[0097] Ionic liquid, 1-vinyl-3-butylimidazolium tetrafluoroborate, was purchased from Shanghai Aladdin Biochemical Technology Co., Ltd.

[0098] Initiator, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, was purchased from Shanghai Aladdin Biochemical Technology Co., Ltd.

[0099] Initiator, 1-hydroxycyclohexylphenyl ketone, was purchased from Shanghai Aladdin Biochemical Technology Co., Ltd.

[0100] Hollow microspheres, product model S22, D50 diameter 35μm, true density 220 kg / m³ 3 Hollow glass microspheres with an impact strength of 400 psi were purchased from 3M China Ltd.

[0101] Hollow microspheres, product model F-30DE, D50, 30-60 μm diameter foamed hollow polymer microspheres, purchased from Matsumoto Oils & Fats Co., Ltd., Japan;

[0102] Hollow microspheres, product model S35, D50 diameter 40μm, true density 350 kg / m³ 3 Hollow glass microspheres with an impact strength of 3000 psi were purchased from 3M China Ltd.

[0103] Hollow microspheres, product model F-36, D50 diameter 10-16μm, initial foaming temperature 75-85℃, hollow polymer microspheres, purchased from Matsumoto Oils & Fats Co., Ltd., Japan.

[0104] Thickening filler, hydrophobic fumed silica HB-630, purchased from Huifu Nanomaterials Co., Ltd.

[0105] Tackifying resin, rosin ester resin WH1105, purchased from Weistar Chemicals;

[0106] Tackifying resin, rosin phenol resin WM 5120, purchased from Weistar Chemicals;

[0107] The additive, 1,6-hexanediol diacrylate crosslinking agent, was purchased from Shanghai Aladdin Biochemical Technology Co., Ltd.

[0108] Additive, color paste 9007-UV, purchased from Codina Micro New Materials Co., Ltd.;

[0109] Additive, chain transfer agent n-dodecyl mercaptan, purchased from Chevron Phillips Chemical Company;

[0110] Additive, silane coupling agent KBM-403, purchased from Shin-Etsu Chemicals, Japan;

[0111] Release film A, RF02N, 50 μm thick, purchased from SKC High-Tech Materials (Suzhou) Co., Ltd.

[0112] Release film B, RF12N, 50 μm thick, purchased from SKC High-Tech Materials (Suzhou) Co., Ltd.

[0113] Aluminum-plastic composite film, 25 μm thick;

[0114] Steel plate, SUS304 mirror stainless steel plate.

[0115] Examples 1-13

[0116] Examples 1-13 provide a pressure-sensitive adhesive composition and its preparation method, respectively. The raw material components for preparing the pressure-sensitive adhesive composition are shown in Tables 1 and 2 (the amounts of the raw material components in Tables 1 and 2 are all by weight), where "--" indicates that the component was not added. The preparation method is as follows:

[0117] (1) Preparation of photocurable slurry: Polyurethane acrylate oligomer, hydrophobic monomer and hydrophilic monomer are mixed in an environment that isolates ultraviolet light and stirred at 300 rpm for 2 h to obtain the photocurable slurry;

[0118] (2) Preparation of pressure-sensitive adhesive composition: Under an environment in which ultraviolet light is blocked, the photocurable slurry, ionic liquid, initiator, hollow microspheres, thickening filler, tackifying resin and additives are mixed and stirred at 1000 rpm for 2 h to obtain the pressure-sensitive adhesive composition.

[0119] Table 1

[0120]

[0121] Table 2

[0122]

[0123] Comparative Example 1

[0124] This comparative example provides a pressure-sensitive adhesive composition and its preparation method. The difference from Example 1 is that the polyurethane acrylate oligomer GU3300Z is replaced in equal amounts with a polyurethane acrylate oligomer CN989NS with a Tg of 72°C and a functionality of 3.

[0125] Comparative Example 2

[0126] This comparative example provides a pressure-sensitive adhesive composition and its preparation method. The difference from Example 2 is that the polyurethane acrylate oligomer GU3300Z is replaced in equal amounts with a polyurethane acrylate oligomer CN8899NS that does not contain an EO (polyethoxy) structure, has a Tg of -67°C, and a functionality of 2.

[0127] Comparative Example 3

[0128] This comparative example provides a pressure-sensitive adhesive composition and its preparation method, which differs from Example 3 in that: the D50 has a diameter of 35 μm and a true density of 220 kg / m³. 3 Hollow glass microspheres S22 with an impact strength of 400 psi were replaced in equal amounts with D50 microspheres with a diameter of 40 μm and a true density of 350 kg / m³. 3 S35 hollow glass microspheres with an impact strength of 3000 psi.

[0129] Comparative Example 4

[0130] This comparative example provides a pressure-sensitive adhesive composition and its preparation method, which differs from Example 4 in that: the D50 has a diameter of 35 μm and a true density of 220 kg / m³. 3 Hollow glass microspheres S22 with an impact strength of 400 psi were replaced with hollow polymer microspheres F-36 with a diameter of 10-16 μm and an initial foaming temperature of 75-85℃, at an addition amount of 0.6 parts by weight.

[0131] Comparative Example 5

[0132] This comparative example provides a pressure-sensitive adhesive composition and its preparation method. The difference between this and Example 5 is that the amount of hollow microspheres S22 added in the raw materials of the pressure-sensitive adhesive composition provided in this comparative example is 9 parts by weight.

[0133] Comparative Example 6

[0134] This comparative example provides a pressure-sensitive adhesive composition and its preparation method. The difference between this and Example 6 is that the pressure-sensitive adhesive composition provided in this comparative example does not contain hollow glass microspheres S22 in its preparation raw materials.

[0135] Comparative Example 7

[0136] This comparative example provides a pressure-sensitive adhesive composition and its preparation method. The difference between this and Example 7 is that the pressure-sensitive adhesive composition provided in this comparative example does not contain 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide in its raw materials.

[0137] Comparative Example 8

[0138] This comparative example provides a pressure-sensitive adhesive composition and its preparation method. The difference between this and Example 8 is that the pressure-sensitive adhesive composition provided in this comparative example does not contain the thickening filler HB-630 in its raw materials.

[0139] Application Example 1-10 and Comparative Application Example 1-8

[0140] Application Examples 1-10 and Comparative Application Examples 1-8 each provide an electro-tack reducing foam tape, the electro-tack reducing foam tape comprising an electro-tack reducing foam layer cured from the pressure-sensitive adhesive composition and a release film covering both sides thereof.

[0141] The electro-adhesive foam tape is prepared by the following method:

[0142] The pressure-sensitive adhesive composition is coated between release film A and release film B and then cured using UV curing energy of 500-5000 mJ / cm². 2 After curing, an electro-tack reducing foam tape with a thickness of 200 μm is obtained, such as... Figure 1 As shown.

[0143] The curing parameters of the electro-tack reducing foam tapes provided in Application Examples 1-10 and Comparative Application Examples 1-8 are shown in Table 3:

[0144] Table 3

[0145]

[0146] Test methods

[0147] 1. Glass transition temperature (°C): The glass transition temperature is calculated using the following formula:

[0148]

[0149] T g : Glass transition temperature of the copolymer;

[0150] w i : The mass fraction (w) of the i-th monomer or polyurethane acrylate oligomer in the copolymer. i The sum is 1).

[0151] T g,i : The glass transition temperature of the homopolymer of the i-th monomer or polyurethane acrylate oligomer;

[0152] 2. Thixotropic index (TI) test: Using a Bollerfeld viscometer, the pressure-sensitive adhesive composition was kept at a constant temperature of 25°C in a water bath for 2 hours. Then, a 63# rotor was selected, and the viscosity V1 was measured at 5 rpm and the viscosity V2 was measured at 50 rpm. The thixotropic index (TI) is calculated as V1 / V2.

[0153] 3. Peel strength test:

[0154] All peel strength related tests refer to the standard GB / T 2795-2014. First, prepare a single-sided electro-tack reducing foam tape: remove the release film from one side of the electro-tack reducing foam tape, adhere it to the aluminum foil layer of the aluminum-plastic composite film that has been cleaned sequentially with ethyl acetate and ethanol, and press it back and forth three times with a 2 kg rubber roller to obtain the single-sided electro-tack reducing foam tape. Figure 2 As shown.

[0155] (1) Room temperature peel force test: After removing the release film from the single-sided electro-adhesive foam tape, it is attached to a 304 steel plate that has been cleaned with ethyl acetate and ethanol in sequence. It is pressed with a 2 kg rubber roller for 3 rounds. After being placed at 23℃ for 20 min, the 180° peel force is tested and recorded as F1.

[0156] (2) High temperature peel force test: After removing the release film from the single-sided electro-adhesive foam tape, it is attached to a 304 steel plate that has been cleaned with ethyl acetate and ethanol in sequence. It is pressed back and forth 3 times with a 2 kg rubber roller. After being kept at a constant temperature of 80℃ in a high and low temperature tensile tester for 30 min, the 180° peel force is tested and recorded as F2.

[0157] (3) Peel strength test after power-on: Remove the release film of the single-sided electro-adhesive foam tape, attach it to the steel plate, press it back and forth 3 times with a 2kg rubber roller, and place it at 23℃ for 20 min. Then connect the positive terminal of the DC power supply to the aluminum foil layer of the aluminum-plastic composite film and the negative terminal to the steel plate, apply a voltage of 9 V for 60 s, and then test the peel strength at 180° and record it as F3;

[0158] 4. Point Impact Absorption Test: Prepare a 3cm × 3cm tape sample and place it on the platform of the bottom stress sensing device. Use a 4.3g ball to drop freely from a height of 100mm, and read the maximum stress before and after placing the tape sample. Impact absorption = (maximum stress value before placing the tape sample - maximum stress value after placing the tape sample) / maximum stress value before placing the tape sample × 100%.

[0159] Test Results

[0160] The performance of the pressure-sensitive adhesive compositions provided in Examples 1-10 and Comparative Examples 1-8, and the tapes provided in Application Examples 1-10 and Comparative Application Examples 1-8 were tested. The performance test results are shown in Table 4 below:

[0161] Table 4

[0162]

[0163] The test results show that:

[0164] (1) As can be seen from Application Examples 1 to 10, the present invention, through the reasonable combination of the types and amounts of each raw material component in the pressure-sensitive adhesive composition, enables the electro-tack reducing foam tape to simultaneously possess the excellent properties of both electro-tack reducing tape and foam tape. Specifically, the room temperature peel strength of the electro-tack reducing foam tape can reach 2334-3730 g / 25mm, the high temperature peel strength at 80℃ can be maintained at 1240-2467 g / 25mm, and the peel strength after energization is as low as 13.3-116.6 g / 25mm, with no residue, an elongation at break of 416-627%, and a point impact absorption rate of 43.1-52.3%.

[0165] (2) As can be seen from Application Examples 8, 9 and 10, compared with choosing to use hollow glass microspheres, choosing hollow polymer microspheres can further optimize the point impact absorption effect.

[0166] (3) As can be seen from Application Example 1 and Comparative Application Example 1, by selecting a polyurethane acrylate oligomer containing a polyethoxy structure with a functionality of 2 and a glass transition temperature ≤0℃, the present invention can achieve excellent room temperature and high temperature peel strength before energization. However, when the preferred polyurethane acrylate oligomer is not used, the prepared foam tape does not have initial adhesion and cannot achieve the technical effect of excellent peel strength at different temperatures before energization.

[0167] (4) Through Application Example 2 and Application Example 7, and comparative Application Example 2 and Comparative Application Example 7, it can be seen that the present invention has a synergistic effect by rationally selecting the types and amounts of each raw material component of the pressure-sensitive adhesive composition, especially the polyurethane acrylate oligomer and ionic liquid, which synergistically improves the technical effect of significantly reducing the peel force of the electro-tack-reducing foam tape on the bonded material after energization and leaving no adhesive residue; the foam tape prepared by the pressure-sensitive adhesive composition without the preferred polyurethane acrylate oligomer and ionic liquid does not have electro-tack-reducing properties.

[0168] (5) Through Application Examples 1 and 2, and comparative Application Examples 1 and 2, it can be seen that by selecting a polyurethane acrylate oligomer containing a polyethoxy structure with a functionality of 2 and a glass transition temperature ≤0℃, the cured foam tape has better elasticity and can achieve better point impact absorption rate when combined with the preferred hollow microspheres. When a non-preferred polyurethane acrylate oligomer is selected, the cured foam tape has poor elasticity, resulting in a lower point impact absorption rate;

[0169] (6) As can be seen from Application Examples 3 and 4, and Comparative Application Examples 3 and 4, the present invention restricts the specifications of hollow microspheres. It avoids the situation where hollow glass microspheres with too high true density and strength have weak deformation ability, and the tape cannot effectively absorb impact energy, resulting in a low point impact absorption rate. It also avoids the situation where hollow polymer microspheres with low initial foaming temperature expand at high temperature, causing the adhesive layer to lose adhesion with the bonded material, resulting in a significantly low high-temperature peel force.

[0170] (7) As can be seen from Application Examples 5 and 6, and Comparative Application Examples 5 and 6, the present invention limits the amount of hollow microspheres used. This avoids the problem that when the amount of hollow microspheres is too small, the tape cannot effectively absorb the impact energy, resulting in a low point impact absorption rate; it also avoids the problem that when the amount of hollow microspheres is too large, the adhesive layer cannot effectively bond with the adhered material, resulting in low peel strength at both room temperature and high temperature.

[0171] (8) As can be seen from Application Example 8 and Comparative Application Example 8, the present invention limits the amount of thickening filler. When thickening filler is not used, the hollow microspheres in the pressure-sensitive adhesive composition cannot be stably dispersed and are prone to floating to the surface of the adhesive layer during the coating process, affecting the bonding interface and resulting in low peel strength at both room temperature and high temperature.

[0172] (9) As can be seen from Application Examples 1-10 and Comparative Application Examples 1-8, the present invention, through the reasonable combination of the types and amounts of each raw material component of the pressure-sensitive adhesive composition, enables the electro-tack reducing foam tape to have the characteristic of significantly reducing peel force after the conventional electro-tack reducing tape is energized, while having the excellent tensile elongation at break and point impact absorption rate of the conventional acrylic foam tape, and exhibiting high peel force at both room temperature and high temperature.

[0173] The applicant declares that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A pressure-sensitive adhesive composition, characterized in that, The raw materials for preparing the pressure-sensitive adhesive composition include, by weight: 100 parts of photocurable slurry, 5-20 parts of ionic liquid, 0.2-5 parts of photoinitiator, 0.5-7 parts of hollow microspheres, 1-4 parts of thickening filler, 0-25 parts of tackifying resin, and 0-5 parts of additives. The photocurable slurry comprises 35-70 parts of polyurethane acrylate oligomer, 15-65 parts of hydrophobic monomer, and 5-20 parts of hydrophilic monomer. The glass transition temperature of the copolymer of the photocurable slurry is ≤-10℃; The polyurethane acrylate oligomer is a polyurethane acrylate oligomer containing a polyethoxy group structure; The ionic liquid is a disubstituted imidazole compound containing an alkenyl group and an alkyl group.

2. The pressure-sensitive adhesive composition according to claim 1, characterized in that, The functionality of the polyurethane acrylate oligomer containing the polyethoxy structure is 2; Preferably, the polyurethane acrylate oligomer containing the polyethoxy structure has the structure shown in formula (I): Equation (Ⅰ); Where R1 is a H atom or a -CH3 group; m is an integer, and m>9; R2 is any one of -CH2CH2O-, -CH2CHO(CH3)-, or -CH2CH2CH2CH2O-; X is a structural unit containing two urethane groups; Y represents an aliphatic polyester group or a group other than -(CH2CH2O). m Any of the polyalkoxy groups other than - Preferably, X is -OOCNH-C6H4-NHCOO- or -OOCNH-C 10 H 16 -NHCOO- or -OOCNH-C6H 12 Any one of -NHCOO-; Preferably, the Y is -(OCH(CH3)-COO). n -、-(CH2CH2CH2O) n -or-(CH2CH2CH2CH2O) n - any one of the following, where n is an integer and n>1; Preferably, the glass transition temperature of the polyurethane acrylate oligomer containing the polyethoxy structure is ≤0°C.

3. The pressure-sensitive adhesive composition according to claim 1 or 2, characterized in that, The hydrophobic monomers include any one or a combination of at least two of the following: ethyl acrylate, butyl acrylate, n-octyl acrylate, isooctyl acrylate, lauryl acrylate, n-decyl acrylate, isodecyl acrylate, isohexadecanyl acrylate, 2-phenoxyethyl methacrylate, methyl acrylate, butyl methacrylate, isobutyl methacrylate, tert-butyl acrylate, isobornyl acrylate, 3,3,5-trimethylcyclohexyl methacrylate, or p-tert-butylcyclohexyl methacrylate. Preferably, the hydrophilic monomer comprises any one or a combination of at least two of the following: acrylic acid, methacrylic acid, β-carboxyethyl acrylate, (meth)acrylamide, N,N-dimethylacrylamide, N,N-diethylacrylamide, N-vinylcaprolactam, N-vinylpyrrolidone, acryloylmorpholine, hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, or 4-hydroxybutyl (meth)acrylate.

4. The pressure-sensitive adhesive composition according to any one of claims 1-3, characterized in that, The ionic liquid includes any one or a combination of at least two of the disubstituted imidazole compounds comprising an alkenyl group and an alkyl group having the structure shown in Formula (II); Equation (II); Wherein, R1 is a C2-C5 alkenyl group; R2 is a C1-C6 alkyl group; X is a C1-C6 alkyl group. - ,Br - I - PF 6- BF 4- CF3SO 3- N(CF3SO2) 2- NO 3- or CH3C6H4SO 3- ; Preferably, the C2-C5 alkenyl group is vinyl or propylene.

5. The pressure-sensitive adhesive composition according to any one of claims 1-4, characterized in that, The initiator includes a free radical photoinitiator; Preferably, the free radical photoinitiator includes any one or a combination of at least two of the following: 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-methyl-2-(4-morpholino)-1-[4-(methylthio)phenyl]-1-propanone, 2,2-dimethoxy-2-phenylacetophenone, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, or benzophenone.

6. The pressure-sensitive adhesive composition according to any one of claims 1-5, characterized in that, The hollow microspheres include hollow glass microspheres and / or hollow polymer microspheres; Preferably, the D50 diameter of the hollow glass microspheres is 10-80 μm; Preferably, the true density of the hollow glass microspheres is 0.1-0.25 g / cm³. 3 ; Preferably, the impact strength of the hollow glass microspheres is <1000 psi; Preferably, the hollow polymer microspheres include expandable polymer microspheres or pre-expanded polymer microspheres with an initial foaming temperature ≥100℃; Preferably, the D50 diameter of the hollow polymer microspheres is 10-80 μm; Preferably, the thickening filler comprises any one or a combination of at least two of the following: fumed silica, organobentonite, nano-calcium carbonate, talc, solvent-free pigment or solid pigment. Preferably, the tackifying resin includes any one or a combination of at least two of terpene phenol resin, rosin ester resin, or rosin phenol resin; Preferably, the terpene phenol resin has a softening point of 90-150℃ and a hydroxyl value of 30-150 mgKOH / g; Preferably, the rosin ester resin has a softening point of 90-150℃ and an acid value of 10-50 mgKOH / g; Preferably, the rosinol resin has a softening point of 90-150℃ and an acid value of 10-50 mgKOH / g; Preferably, the additives include any one or a combination of at least two of the following: crosslinking agents, chain transfer agents, color pastes, silane coupling agents, metal corrosion inhibitors, leveling agents, defoamers, antistatic agents, antihydrolysis agents, and antioxidants; Preferably, the crosslinking agent comprises a polyfunctional propylene carboxyl-containing monomer with a functionality of 2-4; Preferably, the crosslinking agent comprises any one or a combination of at least two of 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol diacrylate, ethylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, or pentaerythritol tetraacrylate.

7. The pressure-sensitive adhesive composition according to any one of claims 1-6, characterized in that, The thixotropic index of the pressure-sensitive adhesive composition is 2.5-5.

8. A method for preparing a pressure-sensitive adhesive composition according to any one of claims 1-7, characterized in that, The preparation method includes the following steps: (1) Preparation of photocurable slurry: The polyurethane acrylate oligomer, hydrophobic monomer and hydrophilic monomer are mixed to obtain the photocurable slurry; (2) Preparation of pressure-sensitive adhesive composition: The pressure-sensitive adhesive composition is obtained by mixing photocurable slurry, ionic liquid, initiator, hollow microspheres, thickening filler, tackifying resin and additives.

9. The method for preparing the pressure-sensitive adhesive composition according to claim 8, characterized in that, Both steps (1) and (2) are performed in an environment where ultraviolet light is blocked; Preferably, the mixing in steps (1) and (2) is carried out under stirring; Preferably, the stirring speed in step (1) is 200-400 rpm; Preferably, the mixing time in step (1) is 1.5-2.5 h; Preferably, the stirring speed in step (2) is 600-1200 rpm. Preferably, the mixing time in step (2) is 1.5-2.5 h.

10. An electro-adhesive foam tape, characterized in that, The electro-tack reducing foam tape includes an electro-tack reducing foam layer cured from the pressure-sensitive adhesive composition as described in any one of claims 1-7.

11. The electro-adhesive foam tape according to claim 10, characterized in that, The curing method is UV curing; Preferably, the UVA energy of the UV curing light source is 500-5000 mJ / cm². 2 ; Preferably, the thickness of the electro-adhesive foam layer in the electro-adhesive foam tape is 50-2000 μm.

Images