Turnover mechanism based on wafer electroplating machine

Abstract

The invention relates to the technical field of wafer electroplating, in particular to a turnover mechanism based on a wafer electroplating machine, which comprises a movable seat slidably mounted on a support, the bottom of the movable seat is symmetrically and fixedly connected with a connecting seat and a mounting seat, and a turnover assembly is arranged between the bottom of the connecting seat and the bottom of the mounting seat. A positioning assembly is arranged in the overturning assembly, and through the cooperative action of the overturning assembly and the positioning assembly, when the driving shaft rotates forwards, the overturning seat is driven to overturn clockwise, so that the double surfaces of the wafer are alternately downward, the influence of gravity on metal ion deposition is broken, and the plating defect that the upper part is thin and the lower part is thick is avoided; when the driving shaft rotates reversely, the positioning seat is driven to rotate anticlockwise, so that all areas on the surface of the wafer are uniformly positioned in an electrolyte main flow area, and the consistency of a circumferential coating is guaranteed; and the two groups of clamping parts are alternately clamped, so that an electroplating blind area of traditional single clamping is eliminated, the whole periphery of the edge of the wafer can be in full contact with electrolyte, dead-angle-free electroplating is realized, and the uniformity of a plating layer is further improved.

Description

Technical Field

[0001] This invention relates to the field of wafer electroplating technology, specifically to a flipping mechanism based on a wafer electroplating machine. Background Technology

[0002] In the semiconductor manufacturing field, wafer electroplating is a core step in realizing key processes such as metal wiring and electrode fabrication. The uniformity of the plating layer directly determines the electrical performance and yield of the wafer. Existing wafer electroplating machines' flipping mechanisms have the following technical shortcomings in practical applications: Poor coating uniformity: Traditional flipping mechanisms completely immerse the wafer in the electroplating bath. For example, in the wafer electroplating machine with automatic gas guiding of ion filter membrane shown in invention patent publication number CN117626395B, metal ions in the electrolyte tend to accumulate at the bottom of the wafer due to gravity, resulting in a coating defect of "thin at the top and thick at the bottom". At the same time, the wafer edge is prone to local thin coating due to poor electrolyte flow. Insufficient clamping reliability: Existing clamping structures mostly use rigid clamping, which can easily cause chipping and stress damage at the wafer edges. In addition, a single clamping method can lead to a plating blind zone in the contact area between the wafer and the clamping component, resulting in missing plating. Some mechanisms lack effective axial limiting design, and the wafer is prone to shifting or falling off during flipping or rotation. Summary of the Invention

[0003] The purpose of this invention is to provide a flipping mechanism based on a wafer electroplating machine to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a flipping mechanism based on a wafer electroplating machine, comprising a movable seat slidably mounted on a support, a connecting seat and a mounting seat symmetrically fixedly connected to the bottom of the movable seat, a flipping component disposed between the bottoms of the connecting seat and the mounting seat, and a positioning component disposed inside the flipping component; The flipping assembly includes a flipping seat rotatably connected between a connecting seat and a mounting seat via an installation component. The bottom of the connecting seat and the mounting seat are respectively rotatably connected to a drive shaft. The drive shaft is rotatably connected to the flipping seat via a one-way bearing. A support ring is fixedly connected inside the flipping seat. The positioning assembly includes a positioning seat rotatably connected inside the flipping seat. The drive shaft passes through the outer side of one end of the support ring and is rotatably connected to a drive gear via a one-way bearing. A ring crown gear meshing with the bottom inner wall of the positioning seat is fixedly connected. Two sets of clamping components are evenly arranged inside the positioning seat.

[0005] Preferably, a motor is fixedly mounted on the top of the movable seat, and a driving component is provided inside the mounting seat. The driving component includes a transmission shaft rotatably connected inside the mounting seat, a worm gear fixedly connected to the bottom of the transmission shaft, a worm wheel fixedly connected to one end of the drive shaft that extends into the mounting seat, the worm wheel and the worm gear meshing with each other, and the top of the transmission shaft extending through the movable seat and fixedly connected to the motor output shaft.

[0006] Preferably, the mounting component includes two mounting sleeves and two mounting shafts. The two mounting sleeves are respectively fixedly connected to the bottom of the connecting seat and the mounting seat, and the two mounting shafts are symmetrically fixedly connected to the outside of the flip seat. The mounting shafts are rotatably connected to the inside of the mounting sleeves.

[0007] Preferably, two anti-reverse components are symmetrically arranged between the mounting sleeve and the mounting shaft. Each anti-reverse component includes a positioning ring fixedly connected to the outside of the mounting shaft. A fixing sleeve is fixedly connected inside the mounting sleeve. A locking block is slidably connected inside the fixing sleeve. A spring is fixedly connected between the end of the locking block away from the positioning ring and the inner wall of the fixing sleeve. A wedge-shaped groove adapted to the spring is opened on the outside of the positioning ring.

[0008] Preferably, the upper and lower ends of the support ring are fixedly connected to limit rings, the outer side of the positioning seat is provided with an installation groove, the support ring is slidably installed in the installation groove through the two limit rings, and the upper and lower ends of the drive gear pass through the two limit rings respectively.

[0009] Preferably, the clamping component includes a clamping seat slidably connected inside the guide seat, a movable block slidably connected inside the clamping seat, a clamping block fixedly connected to the end of the movable block away from the flipping seat, limit blocks fixedly connected to the upper and lower ends of the clamping block, and rollers rotatably mounted on the upper and lower ends of the clamping seat.

[0010] Preferably, the support ring has two guide seats fixedly connected inside, and guide grooves are provided on opposite sides of the two guide seats. The clamping seat is slidably installed between the two guide seats through the sliding cooperation of the rollers and the guide grooves.

[0011] Preferably, two sliders are fixedly connected to the outer side of the movable block, and a spring is fixedly connected between the side of the slider away from the clamping block and the inner wall of the clamping seat.

[0012] Preferably, the upper and lower surfaces of the clamping seat are provided with four sliding grooves, and multiple guide blocks are fixedly connected to the inner wall of the guide seat, with the guide blocks slidably connected to the sliding grooves.

[0013] Preferably, a second anti-reverse component is provided between the guide seat and the positioning seat. The second anti-reverse component includes a limiting rod slidably connected to the top of the positioning seat, an anti-reverse block fixedly connected to the bottom of the limiting rod, a spring three fixedly connected between the top of the anti-reverse block and the inner wall of the positioning seat, a hexagonal nut threadedly installed on the top of the limiting rod, and two wedge blocks fixedly connected to the upper surface of the guide seat.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the present invention has a reasonable structural design and strong functionality, and has the following advantages: 1. Through the coordinated action of the flipping component and the positioning component, when the drive shaft rotates forward, it drives the flipping seat to rotate clockwise, so that the two sides of the wafer face downward alternately, breaking the influence of gravity on metal ion deposition and avoiding the coating defect of thin top and thick bottom; when the drive shaft rotates in reverse, it drives the positioning seat to rotate counterclockwise, so that all areas of the wafer surface are evenly in the mainstream electrolyte area, ensuring the circumferential coating consistency; the alternating clamping design of the two sets of clamping components eliminates the electroplating blind spots of traditional single clamping, so that the entire circumference of the wafer edge can fully contact the electrolyte, achieving electroplating without dead corners and further improving the coating uniformity; 2. The clamping component adopts a spring-driven elastic clamping structure. Through the elastic buffering of the movable block and the clamping block, it can adapt to wafers of different sizes while avoiding wafer damage caused by rigid clamping. The limiting blocks at the upper and lower ends of the clamping block form a composite positioning of radial clamping and axial limiting, which effectively prevents wafer movement and falling off, and improves installation convenience and positioning accuracy. The clamping seat reduces motion friction through the rolling cooperation of the roller and the guide groove of the guide seat, ensuring the smoothness of the displacement and rotation of the clamping component and avoiding the decrease in guiding accuracy caused by sliding wear. 3. The reverse locking engagement of one-way bearing 1 and one-way bearing 2 enables precise power distribution to the drive shaft, ensuring that forward rotation only drives the flipping mechanism and reverse rotation only drives the rotation, thus avoiding interference. Anti-reverse component 1 limits the flipping seat to rotate only clockwise and automatically positions itself after a 180-degree flip, while anti-reverse component 2 limits the positioning seat to rotate only counterclockwise. This double anti-reverse mechanism ensures the uniqueness of the movement direction and prevents reverse axial movement. The meshing transmission of the worm gear and worm has a self-locking function, which can lock the drive shaft position and prevent accidental rotation caused by external loads. The symmetrical support of the connecting seat and mounting seat, and the guiding and limiting of the support ring and the limiting ring, further ensure the overall force balance and coaxiality of the mechanism. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the support of the present invention; Figure 3 This is a cross-sectional structural diagram of the mounting base of the present invention; Figure 4 This is a schematic diagram of the structure of the flipping component and the positioning component of the present invention; Figure 5 This is a schematic cross-sectional view of the support ring of the present invention; Figure 6 This is a schematic diagram of the flip-up seat and positioning seat structure of the present invention; Figure 7 This is a schematic diagram of the support ring structure of the present invention; Figure 8 This is a schematic diagram of the meshing structure of the drive gear and the ring crown gear of the present invention; Figure 9 This is a schematic diagram of the clamping base structure of the present invention; Figure 10 This is a schematic diagram of the internal structure of the clamping base of the present invention; Figure 11 This is a schematic diagram of the anti-reverse component of the present invention; Figure 12 This is a schematic diagram of the drive component structure of the present invention.

[0016] In the diagram: 1. Support; 2. Movable seat; 3. Motor; 41. Connecting seat; 42. Mounting seat; 5. Tilting assembly; 51. Tilting seat; 52. Drive component; 521. Transmission shaft; 522. Worm gear; 523. Worm; 53. Mounting component; 531. Mounting sleeve; 532. Mounting shaft; 54. Anti-reverse component one; 541. Fixed sleeve; 542. Positioning ring; 543. Clamping block; 544. Spring one; 55. Support ring; 56. Drive shaft; 571. Drive gear; 572. Ring crown gear 58. One-way bearing 1; 59. One-way bearing 2; 50. Limiting ring; 6. Positioning assembly; 61. Positioning seat; 62. Clamping component; 621. Clamping seat; 622. Movable block; 623. Clamping block; 624. Limiting block; 625. Roller; 626. Slider; 627. Spring 2; 628. Guide block; 629. Slide groove; 63. Guide seat; 64. Anti-reverse component 2; 641. Limiting rod; 642. Anti-reverse block; 643. Spring 3; 644. Wedge block; 645. Hexagonal nut. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figures 1 to 12The present invention provides a technical solution: a flipping mechanism based on a wafer electroplating machine, including a support 1 installed on the side of the electroplating tank and a movable seat 2 slidably installed on the support 1. The bottom of the movable seat 2 is symmetrically fixedly connected to a connecting seat 41 and a mounting seat 42. A flipping component 5 is provided between the bottoms of the connecting seat 41 and the mounting seat 42. A positioning component 6 is provided inside the flipping component 5. The connecting base 41 and the mounting base 42 can support both ends of the flipping component 5, ensuring that the wafer can be moved to the appropriate electroplating position and that the wafer flipping is always in the electroplating bath. The positioning component 6 can clamp and position the wafer. The flipping component 5 drives the wafer to flip synchronously through the positioning component 6, so that both sides of the wafer can be in uniform contact with the electrolyte in the electroplating bath, avoiding the occurrence of uneven plating layer with thin upper and thick lower layers due to gravity causing more metal ions in the electrolyte to be deposited on the lower part of the wafer. Please refer to Figure* for details. The flipping assembly 5 includes a flipping seat 51 rotatably connected between the connecting seat 41 and the mounting seat 42 via a mounting component 53. The mounting component 53 includes two mounting sleeves 531 and two mounting shafts 532. The two mounting sleeves 531 are fixedly connected to the bottom of the connecting seat 41 and the mounting seat 42 respectively. The two mounting shafts 532 are symmetrically fixedly connected to the outside of the flipping seat 51. The mounting shafts 532 are rotatably connected to the inside of the mounting sleeves 531. The bottom of the connecting seat 41 and the mounting seat 42 are rotatably connected to drive shafts 56 respectively. The drive shafts 56 are rotatably connected to the flipping seat 51 via one-way bearings 59. The drive shafts 56 are also rotatably connected to the mounting shafts 532 via one-way bearings 59, so that when the drive shafts 56 rotate clockwise, they can drive the flipping seat 51 to rotate clockwise via the two one-way bearings 59. When the drive shafts 56 rotate counterclockwise, they cannot drive the flipping seat 51 via the one-way bearings 59. A support ring 55 is fixedly connected inside the flipping seat 51. The positioning assembly 6 includes a positioning seat 61 rotatably connected inside the flipping seat 51. Limiting rings 50 are fixedly connected to the upper and lower ends of the support ring 55. An annular mounting groove is provided on the outer side of the positioning seat 61. The support ring 55 is slidably mounted in the annular mounting groove via two limiting rings 50. The positioning seat 61 is slidably mounted on the outer side of the support ring 55 via the annular mounting groove, and the two limiting rings 50 on the support ring 55 limit the positioning seat 61. Specifically, annular grooves are symmetrically provided on the upper and lower inner sidewalls of the annular mounting groove, and the two limiting rings 50 are rotatably connected to adjacent annular grooves, allowing the positioning seat 61 to be more stably rotatably connected to the flipping seat 51 and ensuring stability during rotation. One end of the drive shaft 56, which passes through the support ring 55, is rotatably connected to a drive shaft via a one-way bearing 58. The upper and lower ends of the drive gear 571 are respectively connected to two limiting rings 50. The bottom inner wall of the positioning seat 61 is fixedly connected to the drive gear 571 and meshes with it. The ring crown gear 572 is fixedly installed in one of the ring grooves. The drive gear 571 meshes with the ring crown gear 572 on the bottom inner wall of the positioning seat 61 through the limiting ring 50 at the bottom. When the drive shaft 56 reverses, it can drive the drive gear 571 to rotate through the one-way bearing 58. The drive gear 571 drives the positioning seat 61 to rotate synchronously through meshing with the ring crown gear 572. When the drive shaft 56 rotates forward, it cannot drive the drive gear 571 through the one-way bearing 58. Two sets of clamping components 62 are evenly arranged inside the positioning seat 61. The two sets of clamping components 62 can alternately realize the positioning and clamping of the wafer.

[0019] In practical use, the core of this flipping mechanism achieves uniform double-sided electroplating of the wafer in the electroplating bath through displacement positioning of the movable seat 2, angle adjustment of the flipping component 5, clamping of the positioning component 6, and rotational coordination. Its detailed working principle is as follows: like Figure 2 and Figure 3 As shown, the initial positioning and wafer pre-clamping stage; First, the movable seat 2 slides linearly along the support 1, causing the connecting seat 41 and mounting seat 42 fixed at its bottom to move synchronously, thereby pulling the flipping assembly 5 and positioning assembly 6 below to move as a whole to the preset electroplating area in the electroplating tank. Since the connecting seat 41 and mounting seat 42 are symmetrically distributed, and the mounting sleeve 531 and mounting shaft 532 rotate together, the mounting component 53 provides support at both ends for the flipping seat 51, ensuring that the flipping assembly 5 is subjected to balanced force, and ensuring that the wafer remains in the electrolyte environment during the subsequent flipping process, avoiding detachment from the electroplating area and resulting in interruption or uneven plating. Subsequently, one of the two sets of clamping components 62 inside the positioning base 61 first achieves coaxial positioning and radial clamping of the wafer: the clamping component 62 is precisely fitted with the edge of the wafer, restricting the radial displacement and circumferential movement of the wafer, ensuring that the center of the wafer coincides with the axis of the positioning base 61 and the flipping base 51, providing basic positioning accuracy for subsequent flipping and rotation actions, and avoiding coating thickness deviation due to wafer eccentricity; like Figure 5 , Figure 6 As shown, the drive shaft 56 rotates 180 degrees clockwise; the flipping seat 51 flips clockwise, so that the two sides of the wafer alternately face downwards. When the drive shaft 56 outputs forward rotation power, the one-way bearing 59 between it and the flipping seat 51 is locked. The one-way bearing 59 only transmits power when the drive shaft 56 rotates forward. The power is directly transmitted to the flipping seat 51 through the one-way bearing 59. Since the flipping seat 51 is rotatably connected to the connecting seat 41 and the mounting sleeve 531 of the mounting seat 42 through the mounting shaft 532, the flipping seat 51 rotates clockwise with the mounting shaft 532 as the axis, driving the positioning seat 61 and the clamped wafer to rotate synchronously. During this process, the one-way bearing 58 between the drive shaft 56 and the drive gear 571 is in a free state. The one-way bearing 58 only transmits power when the drive shaft 56 reverses. The drive gear 571 has no power input. The positioning seat 61 and the wafer remain in a clamped and fixed state. The angle adjustment is only completed with the flipping seat 51. The core function of the flipping action is to change the relative posture of the wafer and the electrolyte: by continuously flipping clockwise, the upper and lower surfaces of the wafer alternately face downwards, breaking the effect of gravity on the deposition of metal ions in the electrolyte, avoiding excessive accumulation of metal ions in the lower area of ​​the wafer due to gravity, fundamentally suppressing the uneven coating defect of "thin on top and thick on bottom", and ensuring that the contact area and contact pressure between the two sides of the wafer and the electrolyte are consistent.

[0020] like Figures 5 to 8 As shown, the drive shaft 56 then reverses: the positioning seat 61 drives the wafer to rotate circumferentially, achieving uniform contact between the wafer circumferentially and the electrolyte. When the drive shaft 56 switches to reverse power output, the one-way bearing 59 switches to a free state, the tilting seat 51 loses power support, maintains the current tilting angle, and avoids interference between the tilting action and the rotation action; at the same time, the one-way bearing 58 between the drive shaft 56 and the drive gear 571 switches to a locked state, and the reverse power is transmitted to the drive gear 571 through the one-way bearing 58. The drive gear 571 passes through the limiting ring 50 at the bottom of the support ring 55 and meshes with the annular crown gear 572 on the inner wall of the bottom of the positioning seat 61, thereby driving the positioning seat 61 to rotate around the axis of the support ring 55. At this time, the support ring 55 slides with the annular mounting groove of the positioning seat 61 through the limiting rings 50 at the upper and lower ends: the limiting rings 50 provide rotation guidance for the positioning seat 61, restricting its axial movement, and ensure that the axis of the positioning seat 61 always coincides with the flipping seat 51 during the rotation process, ensuring rotational coaxiality; when the positioning seat 61 rotates, the clamping component 62 currently holding the wafer synchronously drives the wafer to rotate circumferentially, so that the wafer edge and surface areas are alternately in the mainstream area of ​​electrolyte flow, avoiding insufficient metal ion supply in local areas due to poor electrolyte flow, and achieving uniformity of the circumferential coating thickness of the wafer; Meanwhile, another set of clamping components 62 inside the positioning base 61 prepares for subsequent alternating clamping, preventing the wafer from becoming loose during the clamping switching process; like Figure 4 , Figure 5 and Figure 7 As shown, the clamping component 62 alternates between operation and cyclic electroplating; When one set of clamping components 62 drives the wafer to complete the preset circumferential rotation angle, the clamping components 62 release the clamp, and another set of clamping components 62 closes the clamp, realizing seamless alternating clamping of the wafer. During this process, the coaxial positioning state of the wafer is always maintained, with no radial displacement or circumferential movement, ensuring the continuity of electroplating. Subsequently, the drive shaft 56 can be switched to forward rotation again, driving the flipping seat 51 to continue to rotate clockwise to the next preset angle. At the same time, when the drive shaft 56 reverses, the positioning seat 61 continues to drive the wafer to rotate circumferentially, forming a cyclic operation mode of "flipping angle adjustment, circumferential rotation, and alternating clamping". In summary, the reverse locking engagement of one-way bearing 58 and one-way bearing 59 enables the power to be split so that the rotating seat 51 is driven to rotate only when the drive shaft 56 rotates forward and the positioning seat 61 is driven to rotate only when the drive shaft 56 rotates in reverse, thus avoiding interference between the two sets of actions. The support at both ends of the connecting seat 41 and the mounting seat 42, and the guiding and limiting of the support ring 55 and the limiting ring 50, ensure the stability of the rotating and rotating actions. The alternating clamping of the two sets of clamping components 62 ensures that the wafer does not loosen during the entire electroplating process, ultimately achieving uniform deposition of the coating on both sides and the circumference of the wafer, meeting the requirements of high-precision electroplating processes.

[0021] like Figure 3 and Figure 4As shown, a motor 3 is fixedly mounted on the top of the movable seat 2. A drive component 52 is provided inside the mounting base 42 so that the motor 3 can drive the drive shaft 56 to rotate stably in both forward and reverse directions through the drive component 52, thereby realizing power transmission. The drive component 52 includes a transmission shaft 521 rotatably connected inside the mounting base 42. A worm gear 523 is fixedly connected to the bottom of the transmission shaft 521. A worm wheel 522 is fixedly connected to one end of the drive shaft 56 that passes through the mounting base 42. The worm wheel 522 and the worm gear 523 mesh with each other. The meshing between the worm wheel 522 and the worm gear 523 has a self-locking function, which improves the stability of the rotation of the drive shaft 56. The top of the transmission shaft 521 passes through the movable seat 2 and is fixedly connected to the output shaft of the motor 3. The output shaft of the motor 3 can drive the worm gear 523 to rotate through the transmission shaft 521. The worm gear 523 drives the drive shaft 56 to rotate through the meshing with the worm wheel 522, thereby providing the power for flipping and rotating clamping.

[0022] In actual use, motor 3 serves as the power source, and its output shaft transmits torque through a rigid connection with transmission shaft 521. The transmission shaft 521 drives worm 523 to rotate synchronously. Utilizing the meshing transmission characteristics of worm 523 and worm wheel 522, the power is reversed and converted into the low-speed, high-torque output required by drive shaft 56, realizing the stable forward and reverse rotation of drive shaft 56 and providing power support for flipping and clamping rotation actions. At the same time, the meshing self-locking function of worm wheel 522 and worm 523 can lock the position of drive shaft 56, preventing accidental rotation caused by external loads and ensuring transmission stability.

[0023] like Figure 5 and Figure 11As shown, two anti-reverse components 54 are symmetrically arranged between the mounting sleeve 531 and the mounting shaft 532. The anti-reverse components 54 limit the rotation direction of the flip seat 51, ensuring that the flip seat 51 can only rotate clockwise. Furthermore, when rotated 180 degrees, the anti-reverse components 54 provide initial restraint on the flip seat 51, providing support after the flip seat 51 is flipped, ensuring that the wafer held by the positioning component 6 remains horizontal. The anti-reverse components 54 include a positioning ring 542 fixedly connected to the outside of the mounting shaft 532. A fixing sleeve 541 is fixedly connected inside the mounting sleeve 531. A locking block 543 is slidably connected inside the fixing sleeve 541. A spring 544 is fixedly connected between the end of the locking block 543 away from the positioning ring 542 and the inner wall of the fixing sleeve 541. The spring 544 applies elastic force to the locking block 543. The outer side of the positioning ring 542 is annular. The array has wedge-shaped grooves that match the locking blocks 543. The number of wedge-shaped grooves is the same as the number of locking blocks 543. When the drive shaft 56 rotates clockwise, it drives the flipping seat 51 to rotate clockwise through the one-way bearing 59. The flipping seat 51 drives the positioning ring 542 fixedly connected to its outer side to rotate through the mounting shaft 532. The positioning ring 542 cooperates with the inclined surface of the bottom of the locking block 543 through the inclined surface of the wedge-shaped groove, pushing the locking block 543 to retract and move into the fixed sleeve 541. At the same time, the locking block 543 compresses the spring 544 to elastically contract. When the flipping seat 51 rotates 180 degrees, the locking block 543 resets under the elastic action of the spring 544 and engages with another wedge-shaped groove on the positioning ring 542, realizing the initial fixation of the rotation of the flipping seat 51 and ensuring that the flipping seat 51 is in a horizontal state. When the drive shaft 56 rotates in reverse, it cannot drive the flipping seat 51 to rotate through the one-way bearing 59.

[0024] In actual use, the fixing sleeve 541 of the anti-reverse component 54 is fixed inside the mounting sleeve 531 to provide axial sliding guidance for the locking block 543. The spring 544 is pre-pressed between the locking block 543 and the inner wall of the fixing sleeve 541 to provide reset power for the locking block 543. The positioning ring 542 is rigidly connected to the mounting shaft 532 and rotates synchronously with the flipping seat 51. Its outer wedge groove is designed to match the inclined surface at the end of the locking block 543. When the drive shaft 56 rotates forward, it drives the flipping seat 51 to rotate clockwise through the one-way bearing 59. The positioning ring 542 rotates synchronously with the mounting shaft 532. The wedge groove slope surface and the bottom slope surface of the locking block 543 are pressed together. The locking block 543 overcomes the elastic force of the spring 544 and slides into the fixed sleeve 541, releasing the rotation limit on the flipping seat 51 and ensuring that the flipping seat 51 can smoothly complete the clockwise flipping action. When the flip base 51 rotates clockwise to 180 degrees, the locking block 543, under the elastic restoring force of the spring 544, quickly engages into the wedge-shaped groove at the corresponding position of the positioning ring 542, forming a mechanical locking, thus achieving initial fixation and support for the flip base 51, forcing the flip base 51 to remain in a horizontal state, thereby ensuring that the wafer held by the positioning component 6 is in a horizontal position, avoiding deviation in the contact angle between the wafer and the electrolyte due to the deflection of the flip base 51, and ensuring the uniformity of the coating. When the drive shaft 56 reverses, the one-way bearing 59 cannot transmit power to the tilting seat 51. At the same time, the locking structure of the locking block 543 of the anti-reverse component 54 and the wedge groove of the positioning ring 542 can prevent the tilting seat 51 from swinging back counterclockwise, thus providing double protection for the stability of the tilting seat 51.

[0025] like Figure 5 , Figure 9 and Figure 10 As shown, the clamping component 62 includes a clamping seat 621 slidably connected inside the guide seat 63. The clamping seat 621 passes through the positioning seat 61 and extends to its inner side. A movable block 622 is slidably connected inside the clamping seat 621. One end of the movable block 622 away from the flip seat 51 passes through the clamping seat 621 and is fixedly connected to a clamping block 623, which can clamp the side of the wafer. Limiting blocks 624 are fixedly connected to the upper and lower ends of the clamping block 623, which can clamp the upper and lower ends of the wafer edge, play a limiting role, and can realize wafer installation positioning during wafer installation, ensuring the convenience and accuracy of installation. Rollers 625 are rotatably installed at the upper and lower ends of the clamping seat 621. The support ring 55 has two guide seats 63 fixedly connected internally. Guide grooves are formed on opposite sides of the two guide seats 63. The clamping seat 621 is slidably installed between the two guide seats 63 via the sliding engagement of rollers 625 and the guide grooves. The guide grooves are annularly distributed wave grooves, with a recessed groove near the center of the wafer and a raised groove away from the center. The guide grooves allow for adjustment of the positions of the two sets of clamping components 62. When one set moves towards the wafer for clamping, the rollers 625 on that clamping component 62 are in the guide groove position. In the recessed groove of the guide slot, another set of rollers 625, which are far away from the wafer, are released from the clamping. At this time, the rollers 625 on the clamping component 62 are in the raised groove of the guide slot, thereby completing the alternating clamping and ensuring that the edge part can also be uniformly electroplated. The clamping seat 621 slides with the guide slot on the guide seat 63 through the rollers 625, so that when the positioning seat 61 drives the clamping seat 621 to rotate synchronously, the clamping seat 621 drives the rollers 625 to roll in the guide slot, so as to reduce the friction between the fit and improve the stability of the rollers 625 pushing the clamping seat 621 to move. Two sliders 626 are fixedly connected to the outer side of the movable block 622. A spring 627 is fixedly connected between the side of the slider 626 away from the clamping block 623 and the inner wall of the clamping seat 621. The spring 627 pushes the movable block 622 out of the clamping seat 621 under the elastic force of the slider 626 to provide clamping buffer space. When the distance from the center of the two sets of clamping components 62 is equal, the spring 627 is stretched to its maximum length. When installing or removing the wafer, the clamping block 623 is pushed to move closer to the clamping seat 621, which can insert the wafer between the two sets of clamping components 62. The clamping block 623 in the clamping component 62 achieves initial clamping of the wafer through the elastic force of the spring 627, ensuring that the wafer can always be positioned and clamped between the clamping components 62. The upper and lower surfaces of the clamping seat 621 are provided with four sliding grooves 629. Multiple guide blocks 628 are fixedly connected to the inner wall of the guide seat 63. The guide blocks 628 are slidably connected to the sliding grooves 629. The clamping seat 621 is slidably installed on the outside of the guide blocks 628 through the sliding grooves 629, so that the clamping seat 621 can ensure the stability of movement under the guidance of the guide blocks 628.

[0026] In actual use, the two guide seats 63 fixed inside the support ring 55 provide the core guiding reference for the clamping component 62. The guide grooves opened on opposite sides of the guide seats 63 form a rolling fit with the rollers 625 at the upper and lower ends of the clamping seat 621: when the positioning seat 61 drives the clamping component 62 to rotate circumferentially, the rollers 625 roll along the inner wall of the guide groove, which transforms the traditional sliding friction into rolling friction, greatly reducing the fitting resistance between the clamping seat 621 and the guide seat 63, while avoiding the decrease in guiding accuracy caused by sliding wear, and ensuring the smoothness and stability of the displacement and rotation process of the clamping seat 621. In addition, the clamping seat 621 slides with the guide block 628 fixed on the inner wall through the sliding groove 629 on its upper and lower surfaces. The guide block 628 extends linearly along the sliding groove 629, which restricts the circumferential movement and radial sway of the clamping seat 621. This allows the clamping seat 621 to only make linear displacements towards and away from the wafer along the guide groove of the guide seat 63. This structurally ensures the movement accuracy of the clamping component 62 and avoids wafer clamping eccentricity caused by the offset of the clamping seat 621. During the wafer mounting stage, both sets of clamping components 62 are initially in the released state. The operator places the wafer in the central area between the two sets of clamping components 62. At this time, the pre-tightening elastic force of the second spring 627 is transmitted to the movable block 622 through the slider 626, which pushes the movable block 622 to drive the clamping block 623 to extend from the clamping seat 621. The clamping block 623 fits against the side of the wafer, realizing the elastic pre-clamping of the wafer. The elastic deformation of the second spring 627 can be adapted to the clamping gap of wafers of different sizes, while providing a buffer space to avoid edge chipping or stress damage to the wafer caused by rigid clamping. The limiting blocks 624 fixed at the upper and lower ends of the clamping block 623 are synchronously attached to the upper and lower surfaces of the wafer edge to form a composite positioning of radial clamping and axial limiting: the limiting blocks 624 restrict the axial up and down displacement of the wafer to prevent the wafer from leaving the clamping area during flipping and rotation, and at the same time provide the upper and lower references for the wafer during the installation stage, guide the wafer to quickly snap into the clamping position, improve the ease of installation and positioning accuracy, and ensure that the center of the wafer coincides with the axis of the positioning seat 61; During the electroplating process, the guide groove of the guide seat 63 drives the two sets of clamping components 62 to move in opposite directions: when one set of clamping components 62 approaches the wafer along the guide groove and achieves tight clamping by increasing the clamping force through the clamping block 623, the other set of clamping components 62 moves away from the wafer along the guide groove and releases the clamping of the wafer; after the current clamping group drives the wafer to complete the preset rotation angle, the displacement state of the two sets of clamping components 62 reverses, the original loosening group approaches and clamps the wafer, and the original clamping group moves away and releases; The core function of alternating clamping is to release the clamping blind spots at the wafer edge: traditional single clamping methods can easily lead to the clamping block 623 not being able to contact the electrolyte in the contact area with the wafer, resulting in missing coating; while alternating clamping ensures that each area of ​​the wafer edge is clamped for only a short time, and is exposed to the electrolyte for the rest of the time. Combined with the circumferential rotation of the positioning seat 61, it ensures that the entire circumference of the wafer edge is in uniform contact with the electrolyte, achieving coating coverage without dead corners, and further improving the uniformity of the overall wafer coating.

[0027] like Figure 6 and Figure 7As shown, a second anti-reverse component 64 is provided between the guide seat 63 and the positioning seat 61. The second anti-reverse component 64 limits the counter-clockwise rotation of the positioning seat 61, ensuring that the positioning seat 61 can only rotate counter-clockwise under the drive of the drive shaft 56. The second anti-reverse component 64 includes a limiting rod 641 slidably connected to the top of the positioning seat 61. A anti-reverse block 642 is fixedly connected to the bottom of the limiting rod 641. The anti-reverse block 642 has an inclined surface on one side of its clockwise rotation trajectory, the orientation of which matches the counter-clockwise rotation direction of the limiting rod 641. A third spring 643 is fixedly connected between the top of the anti-reverse block 642 and the inner wall of the positioning seat 61. A hexagonal nut 645 is threaded onto the top of the limiting rod 641. Two wedge blocks 644 are fixedly connected to the upper surface of the guide seat 63. The drive shaft 56 reverses and drives the drive gear 571 to rotate counterclockwise through the one-way bearing 58. The drive gear 571 drives the positioning seat 61 to rotate counterclockwise through the meshing of the ring crown gear 572. The positioning seat 61 pushes the anti-reverse block 642 to rotate synchronously through the limit rod 641 and the sliding connection with the anti-reverse block 642. When the anti-reverse block 642 contacts the wedge block 644, the anti-reverse block 642 will be pushed upward by the inclined surface of the wedge block 644 and squeeze the spring 643 to contract. When the anti-reverse block 642 disengages from the wedge block 644, the anti-reverse block 642 will reset under the elastic force of the spring 643.

[0028] In actual use, in the second anti-reverse component 64, the limiting rod 641 slides with the top of the positioning seat 61, and the anti-reverse block 642 at its bottom rotates synchronously with the positioning seat 61; the third spring 643 is pre-pressed between the top of the anti-reverse block 642 and the inner wall of the positioning seat 61 to provide a downward restoring elastic force for the anti-reverse block 642; the hexagonal nut 645 is threadedly installed on the top of the limiting rod 641 for the installation and fixation of the limiting rod 641; the two wedge-shaped blocks 644 fixed on the upper surface of the guide seat 63 provide a mating reference for the anti-reverse block 642. When the drive shaft 56 reverses, power is transmitted to the positioning seat 61 via the meshing of the one-way bearing 58, drive gear 571, and ring crown gear 572, causing the positioning seat 61 to rotate counterclockwise. At this time, the anti-reverse block 642 rotates counterclockwise synchronously with the limit rod 641, and its inclined surface on the clockwise trajectory side is pressed against the inclined surface of the wedge block 644. The anti-reverse block 642 moves upward against the elastic force of the spring 643, causing the limit rod 641 to slide along the positioning seat 61, and the spring 643 contracts. When the anti-reverse block 642 disengages from the wedge block 644, under the action of the elastic restoring force of the spring 643, the anti-reverse block 642 returns to its original position downward, ensuring that it continues to adapt to the wedge block 644 and realizes the smooth transmission of the counterclockwise rotation of the positioning seat 61. If the positioning seat 61 attempts to rotate clockwise due to external force, the side of the anti-reverse block 642 without the inclined surface will be rigidly engaged with the wedge block 644. At this time, the wedge block 644 cannot push the anti-reverse block 642 to move upward, the spring 643 remains in the reset state, and the anti-reverse block 642 is limited by the wedge block 644, thereby preventing the positioning seat 61 from moving clockwise, realizing one-way anti-reverse, ensuring the consistency of the wafer circumferential rotation, and providing directional accuracy support for the uniformity of the coating.

[0029] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flipping mechanism based on a wafer electroplating machine, comprising a movable seat (2) slidably mounted on a support (1), characterized in that: The bottom of the movable seat (2) is symmetrically fixedly connected to a connecting seat (41) and a mounting seat (42). A flipping component (5) is provided between the bottoms of the connecting seat (41) and the mounting seat (42). A positioning component (6) is provided inside the flipping component (5). The flipping assembly (5) includes a flipping seat (51) rotatably connected between the connecting seat (41) and the mounting seat (42) via a mounting component (53). The bottom of the connecting seat (41) and the mounting seat (42) are respectively rotatably connected to a drive shaft (56). The drive shaft (56) is rotatably connected to the flipping seat (51) via a one-way bearing (59). A support ring (55) is fixedly connected inside the flipping seat (51). The positioning assembly (6) includes a positioning seat (61) rotatably connected inside the flipping seat (51). The drive shaft (56) passes through the outer side of one end inside the support ring (55) and is rotatably connected to a drive gear (571) via a one-way bearing (58). A ring crown gear (572) meshing with the bottom inner wall of the positioning seat (61) is fixedly connected. Two sets of clamping components (62) are evenly arranged inside the positioning seat (61).

2. The flipping mechanism based on a wafer electroplating machine according to claim 1, characterized in that: A motor (3) is fixedly installed on the top of the movable seat (2). A drive component (52) is provided inside the mounting seat (42). The drive component (52) includes a transmission shaft (521) rotatably connected inside the mounting seat (42). A worm (523) is fixedly connected to the bottom of the transmission shaft (521). A worm wheel (522) is fixedly connected to one end of the drive shaft (56) that passes through the mounting seat (42). The worm wheel (522) and the worm (523) mesh with each other. The top of the transmission shaft (521) passes through the movable seat (2) and is fixedly connected to the output shaft of the motor (3).

3. The flipping mechanism based on a wafer electroplating machine according to claim 1, characterized in that: The mounting component (53) includes two mounting sleeves (531) and two mounting shafts (532). The two mounting sleeves (531) are fixedly connected to the bottom of the connecting seat (41) and the mounting seat (42) respectively. The two mounting shafts (532) are symmetrically fixedly connected to the outside of the flip seat (51). The mounting shafts (532) are rotatably connected to the inside of the mounting sleeves (531).

4. The flipping mechanism based on a wafer electroplating machine according to claim 3, characterized in that: Two anti-reverse components (54) are symmetrically arranged between the mounting sleeve (531) and the mounting shaft (532). The anti-reverse component (54) includes a positioning ring (542) fixedly connected to the outside of the mounting shaft (532). A fixing sleeve (541) is fixedly connected inside the mounting sleeve (531). A locking block (543) is slidably connected inside the fixing sleeve (541). A spring (544) is fixedly connected between the end of the locking block (543) away from the positioning ring (542) and the inner wall of the fixing sleeve (541). A wedge-shaped groove that matches the locking block (543) is opened on the outside of the positioning ring (542).

5. The flipping mechanism based on a wafer electroplating machine according to claim 1, characterized in that: The upper and lower ends of the support ring (55) are respectively fixedly connected to the limiting rings (50). The outer side of the positioning seat (61) is provided with an annular mounting groove. The support ring (55) is slidably installed in the annular mounting groove through the two limiting rings (50). The upper and lower ends of the drive gear (571) pass through the two limiting rings (50).

6. The flipping mechanism based on a wafer electroplating machine according to claim 1, characterized in that: The clamping component (62) includes a clamping seat (621) slidably connected inside the guide seat (63). A movable block (622) is slidably connected inside the clamping seat (621). A clamping block (623) is fixedly connected to one end of the movable block (622) away from the flip seat (51). Limiting blocks (624) are fixedly connected to the upper and lower ends of the clamping block (623). Rollers (625) are rotatably installed at the upper and lower ends of the clamping seat (621).

7. The flipping mechanism based on a wafer electroplating machine according to claim 6, characterized in that: The support ring (55) has two guide seats (63) fixedly connected inside. The two guide seats (63) have guide grooves on opposite sides. The clamping seat (621) is slidably installed between the two guide seats (63) through the sliding cooperation of the roller (625) and the guide groove.

8. The flipping mechanism based on a wafer electroplating machine according to claim 6, characterized in that: Two sliders (626) are fixedly connected to the outside of the movable block (622). A spring (627) is fixedly connected between the side of the slider (626) away from the clamping block (623) and the inner wall of the clamping seat (621).

9. A flipping mechanism based on a wafer electroplating machine according to claim 6, characterized in that: The clamping seat (621) has four sliding grooves (629) on its upper and lower surfaces. Multiple guide blocks (628) are fixedly connected to the inner wall of the guide seat (63). The guide blocks (628) are slidably connected to the sliding grooves (629).

10. A flipping mechanism based on a wafer electroplating machine according to claim 7, characterized in that: A second anti-reverse component (64) is provided between the guide seat (63) and the positioning seat (61). The second anti-reverse component (64) includes a limiting rod (641) slidably connected to the top of the positioning seat (61). A anti-reverse block (642) is fixedly connected to the bottom of the limiting rod (641). A spring (643) is fixedly connected between the top of the anti-reverse block (642) and the inner wall of the positioning seat (61). A hexagonal nut (645) is threaded onto the top of the limiting rod (641). Two wedge blocks (644) are fixedly connected to the upper surface of the guide seat (63).

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