Mainboard assembly, air conditioner and control method thereof

Abstract

The invention provides a mainboard assembly, an air conditioner and a control method thereof.The mainboard assembly comprises a mainboard and a cooling device, the cooling device comprises a box body, the box body can be used for storing condensate water generated by the air conditioner, the mainboard assembly is characterized in that a groove is formed in the surface of the box body, and a wall plate of the groove comprises a heat conduction part; the main board comprises a first board surface and a second board surface provided with components, and the first board surface is attached to the heat conduction part in a heat conduction mode, so that condensate water generated by working of the air conditioner can be fully utilized to cool the main board.

Description

Technical Field

[0001] This invention belongs to the field of air conditioner technology, specifically relating to a motherboard assembly, an air conditioner, and a control method thereof. Background Technology

[0002] In air conditioners, the outdoor unit's mainboard is a core control component. If the high heat generated during operation cannot be effectively dissipated, it will directly lead to decreased system performance and reliability, and may even trigger overheat protection shutdown or permanent component damage. Currently, the cooling technology for air conditioner outdoor unit mainboards mainly relies on air cooling, which uses a fan to force airflow over the mainboard to achieve heat exchange. However, cooling the mainboard through airflow makes its efficiency severely limited by ambient temperature. When the ambient temperature rises (such as in hot summer weather when the ambient temperature exceeds 40°C), the cooling efficiency drops sharply, thermal resistance increases, and it becomes difficult to control the mainboard temperature within a safe threshold.

[0003] The low-temperature water generated during indoor refrigeration typically has a temperature of 10-15℃. In existing technology, this condensate is collected inside the cabinet and then diverted to a heat exchanger thermally coupled to the mainboard to cool it. However, this solution suffers from significant cooling loss due to the condensate, resulting in low utilization.

[0004] How to make full use of the condensate generated by the air conditioner to cool the motherboard is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] Therefore, the present invention provides a motherboard assembly, an air conditioner, and a control method that can simplify the device for cooling the motherboard using the condensate generated by the air conditioner.

[0006] On one hand, the present invention provides an air conditioner mainboard assembly, including a mainboard and a cooling device. The cooling device includes a housing, which can be used to store condensate produced by the air conditioner. The housing is characterized in that the surface of the housing is provided with a groove, and the wall panel of the groove includes a heat-conducting part. The mainboard includes a first plate surface and a second plate surface provided with components. The first plate surface is thermally bonded to the heat-conducting part.

[0007] In some embodiments, the groove is provided on the bottom plate of the housing.

[0008] In some embodiments, the heat-conducting part is provided with fins on the wall surface facing the inner cavity of the housing.

[0009] In some embodiments, the wall panels of the groove are all heat-conducting.

[0010] In some embodiments, the cooling device further includes a heat dissipation component and a drive component disposed outside the housing; the drive component operates to enable water to circulate between the housing and the heat dissipation component.

[0011] In some embodiments, the housing includes a circulation inlet and a circulation outlet, the circulation inlet and the circulation outlet are located on the same side of the housing, both the circulation inlet and the circulation outlet are connected to the housing, a preset area is provided inside the housing, the preset area and the circulation outlet are respectively located on both sides of the groove, the operation of the drive component enables water in the preset area to flow to the circulation outlet, and water flowing into the housing from the heat dissipation component can flow to the preset area.

[0012] In some embodiments, a baffle plate is provided inside the tank, which enables water flowing in from the circulation inlet to flow to a preset area.

[0013] The present invention also provides an air conditioner, including a main board assembly, wherein the main board is the main board of the outdoor unit of the air conditioner, the outdoor unit is provided with a partition, a fan is provided on one side of the partition, and ventilation holes are provided on the partition. When the fan is working, air can pass through the ventilation holes. When a heat dissipation component is provided, the heat dissipation component is located in the air flow path.

[0014] In some embodiments, the heat dissipation component includes a coil, at least a portion of which is disposed within the ventilation hole, wherein the extension direction of the coil disposed within the ventilation hole is consistent with the extension direction of the surface of the partition plate.

[0015] In some embodiments, the heat dissipation component includes a heat dissipation pipe disposed around the ventilation hole.

[0016] The present invention also provides a control method for controlling an air conditioner, the control method comprising: acquiring the water level H and water temperature T inside the unit, and controlling the unit to drain water when H≥H1 and / or when T>T2, wherein H1 is a first preset water level and T2 is a second preset temperature.

[0017] In some embodiments, the control method further includes: during the drainage process of the tank, when H=H2 and T≤T1, stopping drainage; when HT1, maintaining drainage of the tank and starting to fill the tank with water, the water filling flow rate is not greater than the drainage flow rate, H2 is a second preset water level, H2T1.<h1>

[0018] In some embodiments, after maintaining drainage in the tank and starting to fill the tank with water, drainage is stopped when H = H2 and T ≤ T1; drainage is stopped and water is started when H < H2 and T ≤ T1, and the water filling flow rate is not greater than the drainage flow rate.

[0019] In some embodiments, the air conditioner includes a drive component that is turned on when H ≥ H3, turned off when H < H3, and H3 < H2.

[0020] Compared with existing technologies, the cooling device of this application does not require a dedicated heat exchanger. Instead, the mainboard is directly placed in the groove of the condensate collection box and thermally bonded to the box. Firstly, the box, through its groove structure, forms a wraparound heat dissipation system for the mainboard. This allows the heat dissipation part in contact with the mainboard to absorb heat and also exchanges heat with the mainboard through radiation, fully utilizing the cooling capacity of the condensate and improving the cooling efficiency of the mainboard. Secondly, directly using the box to cool the mainboard reduces the number of components, simplifies the structure, and facilitates installation inside the outdoor unit of an air conditioner. Thirdly, with the mainboard within the groove of the box, the box forms a protective shell for the mainboard, eliminating the need for an electrical box to house it and further simplifying the structure. Attached Figure Description

[0021] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of an air conditioner outdoor unit with a housing according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the motherboard being installed in the recess of the casing according to an embodiment of the present invention; Figure 3 This is an embodiment of the present invention. Figure 2 A bottom view; Figure 4 This is an embodiment of the present invention. Figure 2 The left view; Figure 5 This is an embodiment of the present invention. Figure 2 Top view; Figure 6 This is an embodiment of the present invention. Figure 4 A sectional view; Figure 7 This is an embodiment of the present invention. Figure 2 A schematic diagram after the cooling water has been removed; Figure 8 This is a schematic diagram of part of the outer casing of the outdoor unit according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the partition plate of the outdoor unit according to an embodiment of the present invention; Figure 10 This is an embodiment of the present invention. Figure 2 The diagram shows the situation with a base. Figure 11 This is a control flowchart of the air conditioner during operation according to an embodiment of the present invention.

[0023] The attached figures are labeled as follows: 1. Cooling device; 2. Main board; 3. Housing; 301. Water inlet; 302. Water outlet; 303. Water injection port; 304. Circulation inlet; 305. Circulation outlet; 3021. Water outlet valve; 3031. Water injection valve; 306. Heat conduction part; 307. Groove; 308. Guide plate; 309. Preset area; 4. Fins; 5. Heat dissipation component; 6. Drive component; 7. Middle partition; 701. Ventilation hole; 702. Support plate; 801. Water level sensor A; 802. Water level sensor B; 803. Water level sensor C; 9. Temperature sensor. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0026] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0027] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0028] In air conditioners, the outdoor unit's mainboard is a core control component. Under complex operating conditions such as high temperature, high humidity, and dust, the mainboard suffers from low heat dissipation efficiency and insufficient reliability. Existing air-cooling technologies are highly dependent on ambient temperature and are easily affected by dust accumulation and blockage, increasing the risk of mainboard temperature runaway. In high-temperature and high-humidity environments, this can easily lead to mainboard temperature runaway, triggering overheat protection shutdown or permanent component damage. Currently, the heat dissipation technology for air conditioner outdoor unit mainboards mainly relies on air cooling, that is, using a fan to force airflow through the mainboard to achieve heat exchange. However, this method has significant drawbacks: 1. Heat dissipation efficiency is severely limited by ambient temperature: Air cooling relies on the temperature difference between the heatsink and the environment. When the ambient temperature rises (such as in hot summer weather when the ambient temperature exceeds 40°C), the heat dissipation efficiency drops sharply, the thermal resistance increases, and it becomes difficult to control the motherboard temperature within a safe threshold. 2. Poor environmental adaptability: In high humidity, dusty, or poorly ventilated conditions, air-cooled heatsinks are prone to dust accumulation and blockage, further reducing heat dissipation capacity and requiring frequent maintenance. 3. Energy efficiency and cost bottlenecks: To improve heat dissipation, it is necessary to increase fan power or increase the size of the heatsink, but this will increase energy consumption and equipment costs, and cannot fundamentally solve the heat dissipation bottleneck in high-temperature environments.

[0029] While some liquid cooling solutions have been attempted in existing technologies (such as using closed-loop coolant circulation systems), their complex structures and high costs, coupled with the need for regular coolant replacement, make them unsuitable for the compact structure and low-cost requirements of household air conditioners. Furthermore, the condensate produced by the air conditioner itself (low-temperature water generated during indoor unit cooling, typically 10-15°C) is not effectively utilized, resulting in resource waste.

[0030] To resolve some of the aforementioned technical issues, in conjunction with [see also...] Figure 1-11 As shown, the present invention provides an air conditioner mainboard assembly, including a mainboard 2 and a cooling device 1. The cooling device 1 includes a housing 3, which can be used to store condensate produced by the air conditioner. The surface of the housing is provided with a groove 307, and the wall panel of the groove 307 includes a heat-conducting part 306. The mainboard 2 includes a first plate surface and a second plate surface provided with components. The first plate surface is thermally bonded to the heat-conducting part 306.

[0031] The first board is relatively flat, while the second board contains various components. Main board 2 is the main board for the outdoor unit of the air conditioner.

[0032] This application incorporates a housing 3 that collects the generated condensate. Simultaneously, the mainboard 2 of the outdoor unit is thermally conductively attached to the thermally conductive part 306 of the housing 3. This eliminates the need for an additional heat exchanger, directly utilizing the housing 3 for condensate collection to dissipate heat from the mainboard 2. This reduces the number of components and the structural complexity of the cooling device 1, facilitating its internal installation within the air conditioner's outdoor unit. Using water cooling to lower the mainboard 2 ensures its temperature is more stably controlled within a reasonable range. By utilizing the condensate generated during air conditioner operation, cooling energy is recovered, conserving resources and embodying green environmental protection principles. Furthermore, by eliminating the use of air for cooling the mainboard 2, dust accumulation inside the electrical box is prevented, thus avoiding reduced heat dissipation efficiency and potential short circuits caused by dust.

[0033] The tank 3 is equipped with a water outlet 302 and a drain pipe to facilitate the discharge of unsuitable water from the tank 3 (such as water that is too hot or contains too many impurities, which can be discharged through the drain pipe). The timing and speed of drainage of the tank 3 are controlled by the water outlet valve 3021.

[0034] The cooling device of this application does not require a dedicated heat exchanger. Instead, the mainboard is directly placed within the groove 307 of the condensate collection housing 3 and thermally bonded to the housing 3. This achieves several advantages: First, the housing 3 directly cools the mainboard 2, reducing the number of components, simplifying the structure, and facilitating installation within the outdoor unit of an air conditioner. Second, the housing 3 forms a protective shell around the mainboard, protecting it. Third, the groove 307 structure of the housing 3 creates a wraparound heat dissipation system for the mainboard 2, allowing the heat dissipation part in contact with the mainboard 2 to absorb heat and also exchange heat through radiation, effectively reducing the mainboard temperature. Figure 2 and Figure 6 As shown, the groove 307 is disposed on the bottom plate of the housing 3.

[0035] In this application, the base plate of the enclosure 3 is defined with reference to the spatial orientation of the enclosure 3 when the enclosure 3 is installed inside the outdoor unit of the air conditioner and the outdoor unit of the air conditioner is in normal working condition.

[0036] The housing 3 is equipped with a water inlet 301 and a water outlet 302. The water inlet 301 is equipped with a water inlet pipe, through which condensate can enter the housing 3. The water outlet 302 is equipped with a drain pipe, and a drain valve 3021 is installed on the drain pipe. The opening degree of the drain valve 3021 is adjustable.

[0037] By setting a groove 307 on the bottom plate of the enclosure 3, and forming a heat-conducting part 306 on the wall plate of the groove 307, the main board 2 is set in the groove 307. In this way, there is no need for an electrical box. The main board 2 can not only exchange heat with the condensate in the enclosure 3 for cooling, but the enclosure 3 also plays a role in protecting the main board 2, improving the safety of the main board 2, further simplifying the structure of the cooling device 1 and the main board 2, and making it easier to install in the outdoor unit.

[0038] The opening of the groove 307 faces downwards, which is not conducive to the entry of dust and solid particles.

[0039] Furthermore, the wall panel of the groove 307 includes a side panel that extends vertically. A thermally conductive silicone grease pad is placed between the first surface of the main board 2 and the side panel, thereby improving the fit between the main board 2 and the housing 3 and also improving the heat exchange efficiency.

[0040] Furthermore, the groove 307 is rectangular (cube-shaped) in general. The sidewall of the groove 307 is basically the same size as the motherboard 2. The sidewall of the groove 307 is flat. The thermal pad with silicone grease between the sidewall and the motherboard 2 is about 1.5mm thick, which improves the thermal conductivity and increases the thermal area (making the fit tighter).

[0041] The housing 3 is provided with a water inlet 301 and a water outlet 302. The water inlet 301 is provided with a water inlet pipe, through which the condensate can enter the housing 3. The water outlet 302 is provided with a drain pipe, and a drain valve 3021 is provided on the drain pipe. The opening degree of the drain valve 3021 is adjustable. Preferred, such as Figure 1 and Figure 6 As shown, the heat-conducting part 306 has fins 4 on the inner wall of the housing 3.

[0042] Fins 4 are provided on the inner wall of the housing 3. Water in different areas is rapidly heated through the fins 4. On the one hand, this improves the temperature uniformity of the water in the housing 3, which is conducive to making full use of the cold energy contained in the water. On the other hand, the heat generated by the main board 2 is quickly transferred to the fins 4, thereby increasing the heat exchange area and improving the efficiency of water cooling the main board 2. The main board 2 exchanges heat with the water in the housing 3 through the heat-conducting part 306 and the fins 4.

[0043] The fins 4 are made of aluminum, and the spacing between adjacent fins 4 is about 5mm. The fins 4 face the heat conduction part 306 inside the housing 3. That is, the fins 4 and the main board 2 are respectively set on both sides of the heat conduction part 306. The fins 4 are arranged in an array. The opposite ends of the fins 4 are the bottom end and the top end, respectively. The bottom end is connected to the inner wall surface of the housing 3, and the closest distance between the top end and the inner wall surface of the housing 3 (not the inner wall surface connected to the bottom end) is about 20mm. When water flows in the housing 3 under the action of the drive component 6, it flows through the fins 4 to achieve heat exchange.

[0044] Preferred, such as Figure 1 , Figure 2 and Figure 5 As shown, the box 3 is also provided with a water inlet 303, which is used to connect with an external water source, such as a tap water source.

[0045] By setting up water inlet 303, external water sources can be injected to improve the cooling efficiency of the motherboard 2.

[0046] The external water source here does not include condensate. The external water source can be municipal water or ordinary household tap water. A filter component can be installed at the water inlet 303 to filter the introduced water.

[0047] Preferably, all the wall panels of the groove 307 are heat-conducting, meaning that all the wall panels constituting the groove 307 are heat-conducting. The motherboard located in the groove 307 can exchange heat with the water in the housing 3 not only through the heat dissipation part 306, but also through radiation. In this way, the housing 3 forms a ring-shaped heat dissipation system for the motherboard 2, which greatly improves the heat dissipation effect on the motherboard (specifically, heat dissipation can be achieved in all directions except downward; more specifically, the first plate surface of the motherboard 2 is in contact with the heat dissipation part of the groove 307 for heat conduction, while other directions form heat exchange through radiation). Moreover, the ring-shaped heat dissipation system provides more uniform heat dissipation for the motherboard, especially for components located on the second plate surface, which can directly dissipate heat through radiation, making it more conducive to keeping the motherboard within a stable operating temperature range.

[0048] Preferred, as shown in the figure Figure 1 , Figure 2 , Figure 4 and Figure 7 As shown, the cooling device 1 includes a heat dissipation component 5 and a drive component 6 disposed outside the housing 3. The drive component 6 is capable of circulating water between the housing 3 and the heat dissipation component 5.

[0049] Furthermore, the housing 3 includes a circulation inlet 304 and a circulation outlet 305. The heat dissipation inlet of the heat dissipation component 5 is connected to the circulation outlet 305, and the heat dissipation outlet of the heat dissipation component 5 is connected to the circulation inlet 304. The driving component 6 can drive the water in the housing 3 to enter the heat dissipation component 5 and then re-enter the housing 3.

[0050] By incorporating heat dissipation component 5 and drive component 6, water inside the enclosure 3 flows out from circulation outlet 305 and into heat dissipation component 5 under the action of drive component 6. The water exchanges heat with the outside air in heat dissipation component 5, further reducing its temperature. The cooled water then re-enters the enclosure 3 through circulation inlet 304. This effectively prevents the water temperature inside the enclosure 3 from becoming too high and significantly improves the cooling efficiency for the motherboard 2.

[0051] Furthermore, the drive component 6 includes a water pump, which is controlled to intelligently drive water circulation.

[0052] Preferred, such as Figure 1 , Figure 2 , Figure 4 and Figure 7 As shown, the housing 3 includes a circulation inlet 304 and a circulation outlet 305. The circulation inlet 304 and the circulation outlet 305 are located on the same side of the housing 3 and are connected to the housing 3. A preset area 309 is provided inside the housing 3. The preset area 309 and the circulation outlet 305 are respectively located on both sides of the groove 307. The operation of the driving component 6 enables the water in the preset area 309 to flow to the circulation outlet 305, and the water flowing into the housing 3 from the heat dissipation component 5 can flow to the preset area 309.

[0053] Furthermore, a guide plate 308 is provided inside the housing 3, which directs the water flowing in from the circulation inlet 304 to the preset area 309. The preset area 309 and the circulation inlet 304 are located on opposite sides of the groove 307, ensuring that the straight line connecting a point in the preset area 309 and the circulation outlet 305 passes through the groove 307. The circulation inlet 304 and the circulation outlet 305 are located on the same side of the housing 3, with the circulation outlet 305 located below the circulation inlet 304. This facilitates the installation of the heat dissipation component 5 and the drive component 6, reducing the space requirements. A guide plate 308 is provided inside the housing 3. The guide plate 308 directs the water flowing in from the circulation inlet 304 to the preset area 309. The preset area 309 and the circulation outlet 305 are respectively located on both sides of the groove 307. By positioning the preset area 309 and the circulation inlet 304 on both sides of the groove 307, the water entering the housing 3 from the circulation inlet 304 flows to the preset area 309 under the action of the guide plate 308. The flow path of the water from the preset area 309 to the circulation outlet 305 maximizes the flow through the area inside the housing 3 corresponding to the groove 307, which is beneficial to the water flow in the area near the heat-conducting part 306, thereby improving the heat exchange efficiency. That is, while facilitating the installation of the heat dissipation component 5 and the drive component 6, it also facilitates the better flow of water inside the housing 3 through the internal area of ​​the housing 3 corresponding to the groove 307 when driven by the drive component 6, thereby improving the heat dissipation efficiency of the heat-conducting part 306 and thus improving the heat dissipation efficiency of the main board 2.

[0054] The present invention provides an air conditioner, such as Figure 4 , Figure 5 , Figure 8 and Figure 9 As shown, the main board 2 is the main board 2 of the outdoor unit of the air conditioner. The outdoor unit is provided with a middle partition 7. A fan is provided on one side of the middle partition 7. A ventilation hole 701 is provided on the middle partition 7. When the fan is working, air can pass through the ventilation hole 701. When a heat dissipation component 5 is provided, the heat dissipation component 5 is located on the air flow path.

[0055] Specifically, one side of the partition 7 is the first chamber, which houses the fan, and the other side is the second chamber, which houses the compressor. The housing 3 is mounted on the partition 7.

[0056] The main function of the fan is to accelerate the airflow through the outdoor heat exchanger (i.e., condenser). At the same time, when the fan is working, it also allows air to pass through the ventilation hole 701 from the second chamber into the first chamber. In this way, the air in the second chamber can cool the compressor. Since the heat dissipation component 5 is located in the airflow path, it also accelerates the heat exchange between the heat dissipation component 5 and the air, improves the cooling efficiency of the heat dissipation component 5 on the water flowing through it, and thus helps to reduce the water temperature in the casing 3, and finally effectively cools the motherboard 2.

[0057] Preferably, the heat dissipation component 5 includes a coil, at least a portion of which is disposed within the ventilation hole 701, and the extension direction of the coil disposed within the ventilation hole 701 is consistent with the extension direction of the surface of the partition plate 7.

[0058] At least part of the coil is installed inside the ventilation hole 701. The coil inside the ventilation hole 701 can not only exchange heat better with the air flowing through the ventilation hole 701, but also act as a grid to prevent insects from moving through the ventilation hole 701.

[0059] Furthermore, a gap is formed between two adjacent sections of the coil, with the gap width ranging from 1mm to 2mm. The gap between the coil and the periphery of the through hole is also between 1mm and 2mm in width.

[0060] Preferably, the heat dissipation component 5 includes a heat dissipation pipe, which is arranged around the ventilation hole 701.

[0061] By arranging the heat dissipation pipes around the ventilation holes 701, the airflow through the ventilation holes 701 accelerates the heat exchange between the heat dissipation pipes and the air. Furthermore, the heat dissipation pipes are positioned within the second cavity, forming a spring-like shape with flared ends facing away from the first cavity. This design guides the airflow through the ventilation holes 701, increasing the airflow rate and effectively improving the cooling efficiency of the compressor and the heat dissipation pipes themselves.

[0062] Both the water inlet valve 3031 and the water outlet valve 3021 are solenoid valves.

[0063] exist Figure 1 and Figure 2 From this perspective, the water pump and heat dissipation component 5 are installed on the left side of the housing 3. The water pump is installed in the lower left part of the cabinet 3. Its location ensures that the cooling water (water from the refrigerator) cools the mainboard 2 before entering the heat dissipation component 5 to exchange heat with the air and cool down, before returning to the cabinet 3. This cycle improves cooling efficiency. The water pump is connected to the cabinet 3 via a silicone hose. The cooling water heat dissipation component 5 includes coils or heat pipes with a diameter of Φ6mm (outer diameter) copper tubing. Ventilation holes 701 are used to achieve enhanced air cooling, thus improving the heat exchange efficiency between the cooling water and the air in the heat dissipation component 5, increasing cooling water utilization, and preventing frequent drainage due to overheating. Utilizing the existing airflow resources (the existing partition 7 has ventilation holes 701), no additional fans or heat dissipation devices are needed, saving space and energy, and solving the problem of frequent cooling water drainage under high-power operation.

[0064] Temperature sensor 9 is installed 8mm above the water outlet 302 on the lower left side of the housing 3 (e.g. Figure 1 and Figure 2 As shown in the image, the probe is inserted into the center of the water flow to ensure accurate temperature measurement. This signal is fed back to the main control system, which dynamically adjusts the water pump speed and the solenoid valve's on / off state to achieve intelligent temperature control and prevent overheating.

[0065] Water inlet 303 and water outlet 301 are located on the upper right side of the housing 3. Water inlet 301 is connected to the indoor unit's water tray via a PVC conduit and flows into the housing 3 by gravity. Water inlet 303 is connected to external tap water and has a pre-filter of PP cotton to prevent impurities from entering the system. Water inlet 303 is equipped with an independent normally closed solenoid valve (water inlet valve 3031), which is controlled by the controller to open and close according to the water level signal.

[0066] The circulation outlet 305 is located at the lower left of the housing 3, adjacent to the water pump inlet 301, facilitating the formation of a smooth circulation channel. The outlet 302 is equipped with an outlet valve 3021, which is used to close the outlet channel when the system is shut down or under maintenance to prevent cooling water leakage and ensure equipment safety. At the same time, it drains water when the water temperature inside the housing 3 is too high. The outlet valve 3021 is connected to a drain pipe to discharge the high-temperature cooling water to the outside.

[0067] The present invention also provides a control method for an air conditioner, wherein the water level H and water temperature T inside the housing 3 are obtained, and when H≥H1, and / or when T>T2, the housing 3 is controlled to drain water, where H1 is a first preset water level and T2 is a second preset temperature.

[0068] The water level H and water temperature T inside the tank 3 are obtained. When H≥H1, the water level is too high, and the tank 3 drains water. And / or, when T>T2, the water temperature is too high, and the tank 3 drains water to make room for further cooling water. H1 is the first preset water level, and T2 is the second preset temperature.

[0069] Preferably, the control method further includes: during the drainage process of the box body 3, when H = H2 and T ≤ T1, stop draining; when H < H2 and T ≤ T1, stop draining and start injecting water into the box body 3 until H = H2 and then stop injecting water; when H ≤ H2 and T > T1, keep draining the box body 3 and start injecting water into the box body 3, and the injection flow rate is not greater than the drainage flow rate. H2 is the second preset water level, H2 < H1, T1 is the first preset temperature, and T2 > T1.

[0070] After controlling the drainage of the box body 3, when H = H2 and T ≤ T1, the water level is appropriate and the water temperature is also appropriate, so stop draining; when H < H2 and T ≤ T1, the water level is inappropriate and low, and the water temperature is appropriate, so stop draining and start injecting water into the box body 3 until H = H2 and then stop injecting water; when H ≤ H2 and T > T1, keep draining the box body 3 to leave enough space for injecting water, start injecting water into the box body 3 to reduce the water temperature, and the injection flow rate is not greater than the drainage flow rate to avoid overflow. H2 is the second preset water level, H2 < H1, and T2 > T1.

[0071] Preferably, after keeping the box body 3 draining and starting to inject water into the box body 3, when H = H2 and T ≤ T1, stop draining; when H < H2 and T ≤ T1, stop draining and start injecting water into the box body 3, and the injection flow rate is not greater than the drainage flow rate.

[0072] Keep draining the box body 3, the water level continues to drop, and at the same time start injecting water into the box body 3 and then cool the water in the box body 3. When H = H2 and T ≤ T1, the water level and water temperature are both reasonable, so stop draining; when H < H2 and T ≤ T1, the water level is low and the water temperature is reasonable, so stop draining and start injecting water into the box body 3, and the injection flow rate is not greater than the drainage flow rate.

[0073] Preferably, the air conditioner includes a driving component 6. When H ≥ H3, the water level is appropriate and the driving component 6 is turned on. When H < H3, the water level is too low and the driving component 6 is turned off to avoid the water pump from idling. H3 < H2.

[0074] The working process of this air conditioner: After the air conditioner is installed, the control module of the air conditioner continuously obtains the water level and water temperature in the box body. Open the water injection valve 3031, and the filtered tap water and the condensate generated by the air conditioner flow into the box body 3 at the same time. Initially, the water level is too low, lower than H3, and the water pump does not work. When the water level reaches H3, the water pump starts to work; when the water level gradually rises to H2, the water level is reasonable and the water injection stops. At this time, the air conditioner has been turned on for a short time, and the water temperature in the box body 3 is relatively low, and the water temperature must be less than T1. In this case, the air conditioner operates normally. As the condensate flows in and the air conditioner works, the water temperature in the box body 3 gradually rises, and the water level also gradually rises. At this time, there are two working conditions: The first scenario involves water temperature rising to a certain level and then stabilizing. The water dissipates heat through the cooling components and absorbs heat from the motherboard, maintaining a relatively balanced heat dissipation and absorption. However, condensation will inevitably increase gradually. When the water level inside the enclosure is high, above or equal to H1, drainage is necessary to prevent overflow. At this point, the outlet valve 3021 is opened to begin drainage. Drainage is stopped when the water level drops to H2. During drainage, the amount of water absorbing heat from the motherboard decreases, causing the water temperature to rise. It's crucial to consider whether the water temperature is suitable. If the water temperature is not higher than T1, the temperature is reasonable, and drainage is stopped. If the water temperature is higher than T1, drainage continues until the water level is below H2. When the water level is below H2, the inlet valve 3031 is opened to begin filling with water. Since the inlet flow rate is greater than the drainage flow rate, water will not overflow from enclosure 3. When the water temperature drops to T1, the outlet valve 3021 is closed, but water filling continues until H=H2, then water filling is stopped.

[0075] The second scenario involves a water level that hasn't yet reached H1, but the water temperature has already risen significantly. When the water temperature reaches T2, it must be cooled down. T2 > T1 (if T2 is greater than T1 but less than T2, the water temperature isn't very high, and the mainboard can still function normally; in this case, if the water temperature is greater than T1 but less than T2, and the water level isn't very high, drainage or filling isn't necessary). First, open the outlet valve 3021 to lower the water level below H2 to prevent splashing during filling. After the water level drops below H2, open the filling valve 3031 to begin filling the tank 3 with water, ensuring the filling flow rate doesn't exceed the outlet flow rate. When the water temperature is not higher than T1, stop drainage. Since the water level is still below H2, continue filling until the water level reaches H2, then stop filling. During air conditioner operation, the control module continuously monitors the water temperature and level inside the tank, controlling drainage and filling based on these changes.

[0076] Three water level sensors (such as) are installed inside the tank 3. Figure 1 and Figure 2 As shown, multi-level water level monitoring is implemented: Water level sensor A801 ​​is located at the top right side of the housing 3 to monitor the first water level, which is used to detect whether the water level has reached the upper limit, to prevent cooling water overflow and avoid short circuits or equipment damage; Water level sensor B802 is located in the middle right side of the housing 3 to monitor the second water level, which is used to determine whether the cooling water volume is sufficient. If the water level is too low, a water replenishment mechanism is triggered to ensure the normal operation of the system; Water level sensor C803 is set 10mm directly above the water pump inlet 301 to monitor the third water level, which is used to prevent the water pump from starting when there is no water or the water level is too low, to avoid overheating and damage to the motor caused by idling, and to extend the service life of the water pump.

[0077] The bottom of the box 3 is placed on the tray 702 on the middle partition 7 (as shown in the figure). Figure 3 , Figure 9 and Figure 10As shown), it is used to support the overall weight of the housing 3, ensuring that it does not sink or shift during equipment operation; the upper part of the housing 3 is vertically locked to the middle partition 7 by three screws (as shown). Figure 3 (As shown). The bottom of the enclosure 3 is provided with a mounting groove 307 that matches the shape of the motherboard 2. After the motherboard 2 is inserted into the groove 307, it is locked by the motherboard 2 fixing device to ensure that the motherboard 2 and the enclosure 3 are tightly fitted.

[0078] like Figure 11 As shown, ( Figure 11 In the diagram, letter C indicates the third water level monitored by water level sensor C803. Letter B indicates the second water level monitored by water level sensor A801, and letter A indicates the first water level monitored by water level sensor A801. After the air conditioner is turned on, the condensate produced immediately begins to flow into housing 3 until the air conditioner is turned off.

[0079] In this application, the cooling medium for the motherboard 2 is condensate and tap water. This avoids the problem of insufficient cooling for the motherboard 2 when the external air temperature is high, improving the cooling efficiency of the motherboard 2 and ensuring that the motherboard 2 operates within a reasonable temperature range. Since water has a much higher specific heat capacity than air, cooling of the motherboard 2 can be achieved without additional large heat sinks or high-power fans, reducing equipment manufacturing costs. Simultaneously, the water cooling system effectively prevents the cooling water (water inside the casing 3) from overheating and overflowing through an automatic water temperature and level regulation mechanism, reducing the frequency of manual maintenance and extending the system's lifespan. By converting condensate, a byproduct of air conditioning refrigeration, into an effective cooling resource, this approach avoids water waste, balances environmental protection and economy, and provides reliable technical support for the stable operation of household air conditioners in extreme climates.

[0080] It will be readily understood by those skilled in the art that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0081] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the protection scope of the present invention.

Claims

1. An air conditioner mainboard assembly, comprising a mainboard (2) and a cooling device (1), the cooling device (1) comprising a housing (3) capable of storing condensate produced by the air conditioner, characterized in that, The surface of the housing is provided with a groove (307), the wall panel of the groove (307) includes a heat-conducting part (306), the main board (2) includes a first plate surface and a second plate surface provided with components, the first plate surface is thermally bonded to the heat-conducting part (306).

2. The motherboard assembly according to claim 1, characterized in that, The groove (307) is provided on the bottom plate of the box (3).

3. The motherboard assembly according to claim 1, characterized in that, The heat-conducting part (306) is provided with fins (4) facing the inner wall of the box (3).

4. The motherboard assembly according to claim 1, characterized in that, The wall panels of the groove (307) are all heat-conducting.

5. The motherboard assembly according to claim 2, characterized in that, The cooling device (1) also includes a heat dissipation component (5) and a drive component (6) disposed outside the housing (3); the drive component (6) is capable of circulating water between the housing (3) and the heat dissipation component (5).

6. The motherboard assembly according to claim 5, characterized in that, The housing (3) includes a circulation inlet (304) and a circulation outlet (305). The circulation inlet (304) and the circulation outlet (305) are located on the same side of the housing (3). The circulation inlet (304) and the circulation outlet (305) are both connected to the housing (3). A preset area (309) is provided inside the housing (3). The preset area (309) and the circulation outlet (305) are respectively located on both sides of the groove (307). The operation of the driving component (6) enables the water in the preset area (309) to flow to the circulation outlet (305). The water flowing into the housing (3) from the heat dissipation component (5) can flow to the preset area (309).

7. The motherboard assembly according to claim 6, characterized in that, The housing (3) is equipped with a guide plate (308), which enables the water flowing in from the circulation inlet (304) to flow to the preset area (309).

8. An air conditioner, characterized in that, Includes the mainboard assembly according to any one of claims 1-7, wherein the mainboard (2) is the mainboard (2) of the outdoor unit of the air conditioner, the outdoor unit is provided with a partition (7), a fan is provided on one side of the partition (7), and a ventilation hole (701) is provided on the partition (7). The fan can make air pass through the ventilation hole (701) when it is working. When a heat dissipation component (5) is provided, the heat dissipation component (5) is provided on the air flow path.

9. The air conditioner according to claim 8, characterized in that, The heat dissipation component (5) includes a coil, at least a portion of which is disposed within the ventilation hole (701). The extension direction of the pipe of the coil disposed within the ventilation hole (701) is consistent with the extension direction of the plate surface of the partition plate (7).

10. The air conditioner according to claim 8, characterized in that, The heat dissipation component (5) includes a heat dissipation pipe arranged around the ventilation hole (701).

11. A control method for controlling an air conditioner according to any one of claims 8-10, characterized in that, The control method includes: obtaining the water level H and water temperature T inside the tank (3), and controlling the tank (3) to drain water when H≥H1 and / or when T>T2, where H1 is the first preset water level and T2 is the second preset temperature.

12. The control method according to claim 11, characterized in that, The control method further includes: during the drainage process of the box (3), when H=H2 and T≤T1, drainage is stopped; when HT1, drainage of the box (3) is maintained and water is started to be injected into the box (3), the water injection flow rate is not greater than the drainage flow rate, H2 is the second preset water level, H2<H1, T1 is the first preset temperature, and T2>T1.

13. The control method according to claim 12, characterized in that, After draining the tank (3) and starting to fill the tank (3) with water, stop draining when H = H2 and T ≤ T1; stop draining and start filling the tank (3) with water when H < H2 and T ≤ T1, and the water filling flow rate is not greater than the draining flow rate.

14. The control method according to claim 11, characterized in that, The air conditioner includes a drive component (6). When H≥H3, the drive component (6) is turned on, and when H<H3, the drive component (6) is turned off, and H3<H2.

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