Liquid cooling heat dissipation chip structure and packaging method thereof

Abstract

This invention discloses a liquid-cooled heat dissipation chip structure and its packaging method, relating to the field of chip technology. The liquid-cooled heat dissipation chip structure includes: a chip with accommodating channels formed therein, and coolant filled into the accommodating channels; a substrate, on which the chip is packaged; and a cooling fan mounted on the side of the chip away from the substrate. This invention solves the problem of chip overheating leading to decreased chip computing performance and slowed data processing speed.

Description

Technical Field

[0001] This invention relates to the field of chip technology, and specifically to a liquid-cooled heat dissipation chip structure and its packaging method. Background Technology

[0002] As chip computing performance continues to advance, the heat and power consumption of individual chips continue to increase. While chip heating is an unavoidable and normal phenomenon, excessive heat will affect chip lifespan, reliability, and stability. The most direct impacts of chip heating are: increased temperature leading to decreased chip computing performance, slower data processing speed, reduced lifespan due to high temperatures, and chip failure caused by overheating. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, a liquid-cooled heat dissipation chip structure and its packaging method are provided to solve the problem of chip heat causing a decrease in chip computing performance and a slowdown in data processing speed.

[0004] To achieve the above objectives, a liquid-cooled heat dissipation chip structure is provided, comprising: A chip, wherein a receiving channel is formed within the chip and a coolant is filled into the receiving channel; A substrate, wherein the chip is packaged on the substrate; A cooling fan is installed on the side of the chip away from the substrate.

[0005] Furthermore, the accommodating channel is disposed along the thickness direction of the chip.

[0006] Furthermore, the number of accommodating channels is multiple.

[0007] Furthermore, the accommodating channel extends through the chip, and heat-conducting plates for sealing the accommodating channel are provided at both ends of the accommodating channel.

[0008] Furthermore, the cooling fan is bonded to one side of the chip using thermally conductive adhesive.

[0009] This invention provides a packaging method for a liquid-cooled heat dissipation chip structure, comprising the following steps: Forming accommodating channels within the chip; Coolant is injected into the accommodating channel; The chip is packaged on a substrate; The cooling fan is installed on the side of the chip away from the substrate.

[0010] The beneficial effects of this invention lie in the fact that the liquid-cooled heat dissipation chip structure of this invention reserves microchannels as receiving channels during wafer manufacturing to inject coolant into the receiving channels to form liquid-cooled columns. These liquid-cooled columns are distributed within the heat-generating chip, and the coolant can remove heat from the chip. The heat exchange efficiency of the coolant is much higher than that of the gaseous state; therefore, it can efficiently conduct heat energy to the coolant and then circulate it to the external cooling fan. The convection generated by the cooling fan removes the heat. This invention's liquid-cooled heat dissipation chip structure shortens the heat transfer path, bringing the coolant closer to the bare die, reducing the thermal interface layer, and improving heat dissipation efficiency. This invention's liquid-cooled heat dissipation chip structure can significantly improve chip computing performance and increase data processing speed. Attached Figure Description

[0011] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the liquid-cooled heat dissipation chip structure according to an embodiment of the present invention.

[0012] Figure 2 This is a schematic diagram of the chip structure according to an embodiment of the present invention.

[0013] Figure label: Chip 1, Accommodation Channel 10; Substrate 2, solder ball 21; Cooling fan 3. Detailed Implementation

[0014] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0015] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0016] Reference Figure 1 and Figure 2 As shown, the present invention provides a liquid-cooled heat dissipation chip structure, including: chip 1, substrate 2, and heat dissipation fan 3.

[0017] In this embodiment, a receiving channel 10 is formed within the chip 1. Coolant is filled into the receiving channel 10. The chip 1 is packaged on a substrate 2.

[0018] The substrate is a copper-clad laminate, specifically including paper-based copper-clad laminate, glass fiber cloth-based copper-clad laminate, composite-based (CEM series) copper-clad laminate, multilayer board-based copper-clad laminate, and special material-based (ceramic, metal core-based copper-clad laminate, etc.) copper-clad laminate.

[0019] The cooling fan 3 is installed on the side of the chip 1 away from the substrate 2.

[0020] In a preferred embodiment, the accommodating channel 10 is disposed along the thickness direction of the chip 1.

[0021] In this embodiment, refer to Figure 2 As shown, there are multiple receiving channels 10.

[0022] The receiving channel 10 penetrates the chip 1. Heat-conducting plates for sealing the receiving channel 10 are provided at both ends of the receiving channel 10.

[0023] The chip manufacturing process includes the creation of tiny channels (i.e., accommodating holes). Coolant is injected into these accommodating holes to form liquid-cooled columns. These liquid-cooled columns are then distributed throughout the heat-generating chip.

[0024] In this embodiment, the coolant is water, ethanol, or a mixture of pure water and ethylene glycol.

[0025] The cooling fan 3 is attached to one side of the chip 1 with thermally conductive adhesive.

[0026] This invention provides a packaging method for a liquid-cooled heat dissipation chip structure, characterized by comprising the following steps: S1. An accommodating channel 10 is formed within chip 1.

[0027] In this embodiment, a concealed dicing technique is used to form a accommodating channel within the chip. Both ends of the accommodating channel are sealed with liquid resin. After the liquid resin cures, the accommodating channel is tightly sealed.

[0028] S2. Fill the receiving channel 10 with coolant.

[0029] S3. Package chip 1 onto substrate 2.

[0030] The chip can be packaged or flip-chip mounted on the substrate. The chip is electrically connected to the substrate via solder pads. Solder balls 21 are provided on the other side of the substrate.

[0031] S4. Install the cooling fan 3 on the side of the chip 1 away from the substrate 2.

[0032] The liquid-cooled heat dissipation chip structure of this invention reserves microchannels as receiving channels during wafer manufacturing to inject coolant into the receiving channels to form liquid-cooled columns. These liquid-cooled columns are distributed within the heat-generating chip, and the coolant can remove heat from the chip. The heat exchange efficiency of the coolant is much higher than that of the gaseous state, thus efficiently conducting heat energy to the coolant, which is then circulated to an external cooling fan. The convection generated by the cooling fan further removes the heat. This liquid-cooled heat dissipation chip structure of the present invention improves heat dissipation efficiency by shortening the heat transfer path, bringing the coolant closer to the bare die, reducing the thermal interface layer.

[0033] The liquid-cooled heat dissipation chip structure of this invention can cope with high power consumption and large heat generation of AI chips, while the efficiency of traditional air cooling has reached the physical limit.

[0034] The liquid-cooled heat dissipation chip structure of this invention allows more servers to be accommodated in the same space, supports AI computing needs, and improves computing power density.

[0035] The liquid-cooled heat dissipation chip structure of the present invention can reduce fan energy consumption, improve power usage efficiency (PUE), and save energy and reduce carbon emissions.

[0036] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A liquid-cooled heat dissipation chip structure, characterized in that, include: A chip, wherein a receiving channel is formed within the chip and a coolant is filled into the receiving channel; A substrate, on which the chip is packaged; A cooling fan is installed on the side of the chip away from the substrate.

2. The liquid-cooled heat dissipation chip structure according to claim 1, characterized in that, The accommodating channel is disposed along the thickness direction of the chip.

3. The liquid-cooled heat dissipation chip structure according to claim 2, characterized in that, The number of accommodating channels is multiple.

4. The liquid-cooled heat dissipation chip structure according to claim 3, characterized in that, The accommodating channel penetrates the chip, and heat-conducting plates for sealing the accommodating channel are provided at both ends of the accommodating channel.

5. The liquid-cooled heat dissipation chip structure according to claim 4, characterized in that, The cooling fan is attached to one side of the chip using thermally conductive adhesive.

6. A packaging method for a liquid-cooled heat dissipation chip structure as described in any one of claims 1 to 5, characterized in that, Includes the following steps: Forming accommodating channels within the chip; Coolant is injected into the accommodating channel; The chip is packaged on a substrate; The cooling fan is installed on the side of the chip away from the substrate.

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