Laser drilling visual inspection equipment and method for semiconductor wafer

Abstract

The invention discloses a laser drilling visual inspection device and method for a semiconductor wafer, the laser drilling visual inspection device comprises a base and two symmetrical detection mechanisms on the upper end face of the base, a carrying mechanism is arranged between the two detection mechanisms, the carrying mechanism comprises a fixed seat arranged on the upper end face of the base, and the fixed seat is rotatably connected with a rotary table; a gear ring is fixedly arranged on the inner wall of the fixing base, the bottom end of the rotating shaft is sleeved with a driving gear, and the driving gear is meshed with the gear ring. When the bearing table is located below one detection module, the first to-be-detected area is over against the detection module for detection, and in the process that the bearing table revolves by 180 degrees along with the rotary table, the bearing table synchronously rotates by 180 degrees to enable the second to-be-detected area to be over against the other detection module, so that two wafer half areas which are far away from each other are synchronously detected by the two detection modules in parallel; and after the detection is completed, the next period of detection and loading and unloading can be carried out by repeatedly rotating a preset angle, so that assembly line type continuous operation is realized, and the detection period of a single wafer is greatly shortened.

Description

Technical Field

[0001] This invention relates to the field of semiconductor inspection technology, and more specifically, to a laser drilling visual inspection device and method for semiconductor wafers. Background Technology

[0002] Against the backdrop of the rapid development of the semiconductor industry, the feature size of integrated circuits is constantly shrinking, the functional density of chips is continuously increasing, and advanced packaging technologies such as 3D IC stacking, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) are widely used. Laser drilling technology has become a key process for achieving high-density interconnects. Laser drilling is mainly used to form through-holes (TSVs), blind vias, or microvias on silicon wafers or packaging substrates to meet the vertical interconnect requirements of high-performance chips. To ensure the reliability and consistency of the laser drilling process, high-precision visual inspection of the wafer surface after drilling is essential. This inspection focuses on identifying defects such as hole diameter, hole wall roughness, hole position deviation, residue adhesion, and cracks, thereby effectively controlling process parameters, improving product yield, and reducing the risk of subsequent packaging failures. This visual inspection step has become an indispensable quality assurance process in modern semiconductor production lines, playing a crucial role in improving overall manufacturing efficiency and product competitiveness.

[0003] In existing technologies, visual inspection of wafers after laser drilling typically employs a single inspection module to perform a full-surface spiral scan of the entire wafer. This involves rotating the wafer and radially moving the optical head to scan and cover the entire surface point by point or line by line. However, since the entire wafer area needs to be scanned sequentially, the inspection time is long, and it is easily affected by mechanical vibration and scanning noise, resulting in blurred images or a decrease in signal-to-noise ratio. Especially under high-resolution imaging conditions, even longer inspection times are required, which in turn limits the overall production throughput and equipment efficiency.

[0004] Therefore, there is a need to provide a laser drilling visual inspection device and method for semiconductor wafers to solve the problem that the low inspection efficiency of existing wafer laser drilling visual inspection devices limits the overall production throughput. Summary of the Invention

[0005] The main objective of this invention is to provide a laser drilling visual inspection device and method for semiconductor wafers, aiming to solve the technical problems mentioned in the background section.

[0006] The present invention adopts the following technical solution: A laser drilling visual inspection device for semiconductor wafers includes a base and two symmetrical inspection mechanisms on the upper surface of the base, with a transport mechanism between the two inspection mechanisms, and each inspection mechanism includes an inspection module. The carrier mechanism includes a fixed base disposed on the upper end face of the base, a turntable rotatably connected to the fixed base, a toothed ring fixedly disposed on the inner wall of the fixed base, six rotating shafts passing through the turntable in a circumferential array, a drive gear sleeved at the bottom end of the rotating shaft, the drive gear meshing with the toothed ring, and a support platform for supporting the wafer rotatably connected above the rotating shaft. The wafer includes a first inspection area and a second inspection area. The first inspection area is located below the first inspection module. When the turntable rotates 180°, the carrier platform rotates 180° synchronously, causing the second inspection area to be located below another inspection module, so that the first inspection area and the second inspection area, which are far apart from each other on the two wafers, can be inspected synchronously.

[0007] Furthermore, it also includes a loading and unloading mechanism, which includes a loading suction cup and a unloading suction cup with the same structure. The loading suction cup is located on one side of the first detection module, and the unloading suction cup is located on one side of the other detection module. The loading suction cup and the unloading suction cup are respectively located above two adjacent support platforms. When two testing institutions respectively test the first and second inspection areas that are far apart from each other on the two wafers, the loading and unloading suction cups simultaneously load and unload materials onto the two adjacent support platforms.

[0008] Furthermore, a rotating groove is formed on the upper end face of the fixed seat along the outer periphery, and a thrust bearing is installed in the rotating groove. The upper end face of the thrust bearing is higher than the upper end face of the gear ring and the upper end face of the fixed seat, and the upper end of the thrust bearing is fixedly connected to the turntable. A stepper motor is installed below the turntable. The stepper motor is fixedly connected to the base. The drive shaft of the stepper motor is coaxial with the turntable and is fixedly connected to the turntable.

[0009] Furthermore, the rotating shaft is rotatably connected to the turntable, a first gear is sleeved on the upper end face of the rotating shaft, and a second gear is coaxially arranged below the turntable. The second gear is spaced apart from the turntable, and the second gear meshes with the first gear. A rotating rod is inserted through the second gear. The lower end face of the rotating rod is rotatably connected to the upper end face of the turntable. The upper end face of the rotating rod is fixedly connected to the support platform so that when the turntable revolves, the support platform rotates synchronously and at the same angle.

[0010] Furthermore, the detection mechanism also includes a column perpendicular to the upper surface of the base. A dovetail-shaped sliding track is provided on the side of the column facing the transport mechanism, extending from the bottom end of the column to the top end. A first slider and a second slider are slidably connected to the sliding track in sequence. The first slider extends a lighting frame towards the side of the transport mechanism. The bottom end of the lighting frame is provided with an annular lighting component. The lighting frame has a detection hole coaxial with the lighting component. The detection module is located above the detection hole. One side of the detection module is connected to the second slider through an L-shaped detection frame.

[0011] Furthermore, a fine-tuning slide rail is provided below the column. The fine-tuning slide rail is fixedly mounted on the upper surface of the base and is perpendicular to the column. A fine-tuning slider is slidably connected to the fine-tuning slide rail. A support base extending to one side of the column is fixedly connected to one side of the fine-tuning slider. A scanning linear motor is connected to the side of the support base near the column. The drive end of the scanning linear motor is fixedly connected to the column. The scanning linear motor is perpendicular to both the column and the fine-tuning slide rail, and is parallel to the diameter extension direction of the first and second inspection areas to perform translational scanning of the wafer.

[0012] Furthermore, the loading and unloading mechanism includes a loading component and an unloading component arranged symmetrically, and the loading component and the unloading component have the same structure; The feeding assembly includes a horizontal linear motor parallel to the base, and a lifting linear motor is fixedly connected to the drive end of the horizontal linear motor. The feeding suction cup is connected to the drive end of the lifting linear motor.

[0013] Furthermore, a transport base is provided on one side of the transverse linear motor, and the transport base extends in an L-shape to the upper end face of the base. The extension direction of the transverse linear motor is tangent to the movement trajectory of the transport mechanism. The driving end of the lifting linear motor is provided with a connecting arm. One end of the connecting arm is connected to the driving end of the lifting linear motor through a reinforcing rib, and the other end of the connecting arm is fixedly connected to the feeding suction cup.

[0014] The bottom of both the loading and unloading suction cups is provided with a vacuum adsorption structure. The vacuum adsorption structure includes several uniformly distributed adsorption holes. The adsorption holes are connected to an external vacuum pump through a flexible tube to adsorb and release the wafer.

[0015] A method for visual inspection of laser drilling on semiconductor wafers, applied to a laser drilling visual inspection device for semiconductor wafers as described in any of the preceding claims, characterized in that it includes: S1: Provide testing equipment, the testing equipment includes a loading and unloading mechanism, a conveying mechanism and a testing module, the conveying mechanism includes a turntable and several bearing platforms, the bearing platforms are arranged in a circumferential array on the upper surface of the turntable, and two testing modules are symmetrically distributed on opposite sides of the conveying mechanism; S2: The loading and unloading mechanism synchronously executes loading and unloading actions on the transport mechanism; S3: Drive the turntable to rotate by a preset angle and drive the support platform to rotate synchronously by a preset angle; S4: The loading and unloading mechanism synchronously performs loading and unloading actions on the carrier platform, and synchronously detects whether there is a wafer on the carrier platform based on the detection module. When there is a wafer, the laser holes on the wafer surface are visually inspected. S5: After the detection is completed, repeat steps S3 to S4.

[0016] Furthermore, the number of the support platforms is six, and the preset angle is 60°.

[0017] Beneficial effects: In this invention, two symmetrical detection mechanisms are set on the upper surface of the base, and a transport mechanism is arranged between them. The detection mechanism includes a detection module, and the transport mechanism includes a fixed base, a turntable, and six carrier platforms arranged in a circular array. The turntable is rotatably connected to the fixed base, and a toothed ring is fixed on the inner wall of the fixed base. The bottom drive gear of each rotating shaft meshes with the toothed ring, so that the carrier platforms rotate synchronously when the turntable rotates. The wafer is divided into a first inspection area and a second inspection area. When the carrier platform is located under a detection module, the first inspection area is inspecting the detection module. During the 180° revolution of the carrier platform with the turntable, the carrier platform rotates synchronously by 180° so that the second inspection area faces the other detection module. This allows two far apart wafer halves to be inspected in parallel and synchronously by two detection modules. At the same time, other non-detection workstation carrier platforms can perform loading and unloading operations synchronously. After the detection is completed, the next cycle of detection and loading / unloading can be entered by repeatedly rotating the preset angle, realizing continuous production line operation, thereby significantly shortening the detection cycle of a single wafer, increasing the overall production throughput of the equipment, and optimizing the overall capacity of the semiconductor production line. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the laser drilling visual inspection equipment for semiconductor wafers according to the present invention. Figure 2 This is a partial structural schematic diagram of an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the transport mechanism of the present invention; Figure 4 This is a partial structural schematic diagram of the transport mechanism of the present invention; Figure 5 This is a schematic diagram of the detection mechanism of the present invention; Figure 6 This is a schematic diagram of the feeding assembly of the present invention; Figure 7 This is a flowchart illustrating the laser drilling visual inspection method for semiconductor wafers according to the present invention. in: 1. Base; 2. Detection Mechanism; 21. Detection Module; 22. Column; 221. Sliding Rail; 23. First Slider; 24. Second Slider; 25. Lighting Frame; 251. Detection Hole; 26. Lighting Component; 27. Detection Frame; 28. Fine-tuning Rail; 29. ​​Fine-tuning Slider; 2a. Support Base; 2b. Scanning Linear Motor; 3. Carrying Mechanism; 31. Fixed Base; 311. Rotating Slot; 32. Turntable; 33. Gear Ring; 34. Rotating Shaft; 35. Drive Gear; 36. Bearing Platform; 37. Thrust Bearing; 38. Stepper Motor; 39. First Gear; 3a. Second Gear; 3b. Rotating Rod; 4. Loading / Unloading Mechanism; 41. Loading Component; 411. Loading Suction Cup; 42. Unloading Component; 421. Unloading Suction Cup; 43. Horizontal Linear Motor; 44. Lifting Linear Motor; 45. Carrying Base; 46. Connecting Arm.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0024] Reference Figures 1 to 6 The present invention proposes a laser drilling visual inspection device for semiconductor wafers, including a base 1 and two symmetrical inspection mechanisms 2 on the upper surface of the base 1, and a transport mechanism 3 is provided between the two inspection mechanisms 2. The inspection mechanism 2 includes an inspection module 21. The carrier mechanism 3 includes a fixed base 31 disposed on the upper end face of the base 1. The fixed base 31 is rotatably connected to a turntable 32. A toothed ring 33 is fixedly disposed on the inner wall of the fixed base 31. Six rotating shafts 34 are arranged in a circumferential array on the turntable 32. A drive gear 35 is sleeved on the bottom end of the rotating shaft 34. The drive gear 35 meshes with the toothed ring 33. A support platform 36 for supporting wafers is rotatably connected above the rotating shaft 34. The wafer includes a first inspection area and a second inspection area. The first inspection area is located below the first detection module 21. When the turntable 32 rotates 180°, the support platform 36 rotates 180° synchronously, causing the second inspection area to be located below the other detection module 21, so that the first inspection area and the second inspection area, which are far apart from each other on the two wafers, are detected synchronously.

[0025] In the above embodiment, a base 1 and two detection mechanisms 2 symmetrically arranged on the upper surface of the base 1 are included. A transport mechanism 3 is arranged between the two detection mechanisms 2. Each detection mechanism 2 is equipped with a detection module 21 for visual inspection of laser drilling on the wafer surface. The transport mechanism 3 mainly consists of a fixed base 31 and a turntable 32 rotatably connected to the fixed base 31. The fixed base 31 is fixed to the upper surface of the base 1, and a toothed ring 33 is fixedly provided on its inner wall. Six rotating shafts 34 are arranged in a circumferential array on the turntable 32. A drive gear 35 is fixedly sleeved at the bottom of each rotating shaft 34. The drive gear 35 is engaged with the toothed ring 33 on the inner wall of the fixed base 31. A support platform 36 is rotatably connected to the upper part of the rotating shaft 34 for stably supporting the semiconductor wafer to be inspected. When the turntable 32 revolves around the center of the fixed base 31 under the drive of external force, due to the meshing relationship between the drive gear 35 and the fixed gear ring 33, each bearing platform 36 will generate a rotation motion simultaneously while revolving, and the rotation angle is in a fixed proportional relationship with the revolution angle, thereby realizing the directional rotation of the wafer on the bearing platform 36.

[0026] In the actual inspection process, the wafer is divided into a first inspection area and a second inspection area that are far apart from each other. When a certain carrier stage 36 moves directly under a detection module 21, the wafer on it is positioned so that the first inspection area faces the detection module 21. At this time, the detection module 21 performs high-precision visual inspection on the laser holes in the first inspection area to identify defects such as hole diameter, hole wall roughness, hole position deviation, residue adhesion, and cracks. At the same time, another detection module 21, which is symmetrically arranged, performs synchronous inspection on the second inspection area of ​​the wafer on the other carrier stage 36 on the opposite side. After the turntable 32 rotates 180°, due to the gear meshing transmission, each carrier stage 36 rotates 180° synchronously, causing the original first inspection area to flip to the side away from the detection module 21, while the second inspection area is precisely rotated to the position facing the other detection module 21. This allows the two halves of the same wafer to be inspected in parallel by two detection modules 21 at different workstations. During this process, the other four non-inspection stations' carrier platforms 36 can simultaneously perform wafer loading and unloading operations. After inspection, the turntable 32 continues to revolve at preset angle intervals, driving each carrier platform 36 to enter the inspection station or loading / unloading station in sequence, forming a continuous assembly line operation mode. The equipment achieves a high degree of parallelism between inspection and loading / unloading. The complete inspection of a single wafer no longer relies on the sequential scanning of a single module, but significantly shortens the inspection cycle by using a dual-module synchronous inspection half-area method. At the same time, the loading / unloading operation and the inspection process do not interfere with each other, further improving the overall operating efficiency and production throughput of the equipment, effectively meeting the semiconductor manufacturing demand for high-precision, high-throughput visual inspection of wafers after laser drilling.

[0027] In one embodiment, the system further includes a loading and unloading mechanism 4, which includes a loading suction cup 411 and a unloading suction cup 421 with identical structures. The loading suction cup 411 is disposed on one side of the first detection module 21, and the unloading suction cup 421 is disposed on one side of the other detection module 21. The loading suction cup 411 and the unloading suction cup 421 are respectively disposed above two adjacent support platforms 36. When the two testing institutions 2 respectively test the first and second inspection areas that are far apart from each other on the two wafers, the loading suction cup 411 and the unloading suction cup 421 simultaneously load and unload materials onto the two adjacent carrier platforms 36.

[0028] In the above embodiment, the loading and unloading mechanism 4 includes a loading suction cup 411 and an unloading suction cup 421 with identical structures. The loading suction cup 411 is fixedly arranged on one side of the first detection module 21, and the unloading suction cup 421 is fixedly arranged on one side of the other detection module 21. This arrangement ensures that the loading suction cup 411 and the unloading suction cup 421 are respectively positioned above the two adjacent support platforms 36 on the turntable 32. This symmetrical and staggered arrangement allows the loading and unloading stations and the two detection stations to form a reasonable spacing distribution on the circumference of the turntable 32, ensuring that the equipment can achieve parallel operation of detection and loading / unloading during operation. When the turntable 32 is positioned such that the two opposing support platforms 36 are directly below the two detection modules 21, the two detection mechanisms 2 simultaneously perform visual inspection on the first and second inspection areas of the two wafers that are far apart from each other. At the same time, the loading suction cup 411 and the unloading suction cup 421 perform loading and unloading operations on the other two adjacent support platforms 36, respectively. Specifically, the loading suction cup 411 picks up the wafer to be inspected from the external feeding device through vacuum adsorption and accurately places it onto the unloaded carrier stage 36, while the unloading suction cup 421 adsorbs the wafer that has completed full-surface inspection and transfers it to the external collection device. Since the six carrier stages 36 are evenly distributed, the turntable 32 can cycle and switch between each station every 60°. When the inspection station completes the inspection of the current batch, the turntable 32 continues to revolve, and the next carrier stage 36 enters the inspection position. At the same time, the original inspection station turns into the unloading station, and the original unloading station turns into the loading station. This achieves seamless connection between the three main processes of loading, inspection, and unloading. The inspection process and the loading and unloading process are carried out in parallel without interference, effectively eliminating the bottleneck of long loading and unloading waiting time in traditional single-station inspection equipment, and further shortening the overall processing cycle of a single wafer.

[0029] In one example, the upper end face of the fixed base 31 is provided with a rotating groove 311 along the outer periphery, and a thrust bearing 37 is installed in the rotating groove 311. The upper end face of the thrust bearing 37 is higher than the upper end face of the toothed ring 33 and the upper end face of the fixed base 31. The upper end of the thrust bearing 37 is fixedly connected to the turntable 32. A stepper motor 38 is provided below the turntable 32. The stepper motor 38 is fixedly connected to the base 1. The drive shaft of the stepper motor 38 is coaxially arranged with the turntable 32, and the drive shaft of the stepper motor 38 is fixedly connected to the turntable 32.

[0030] In the above embodiment, to ensure the smooth, high-load revolution of the turntable 32 when carrying multiple wafers, an annular rotating groove 311 is provided on the upper end face of the fixed base 31 along the outer periphery. A high-load-bearing thrust bearing 37 is installed in the rotating groove 311. The upper end face of the thrust bearing 37 is higher than the upper end face of the toothed ring 33 on the inner wall of the fixed base 31 and the upper end face of the fixed base 31 itself. This allows the lower end face of the turntable 32 to directly contact and be fixedly connected to the upper end face of the thrust bearing 37, avoiding direct frictional contact between the turntable 32 and the fixed base 31 or the toothed ring 33. This effectively allows the thrust bearing 37 to bear the vertical load and radial force of the turntable 32.

[0031] A stepper motor 38 is coaxially mounted below the turntable 32. The stepper motor 38 is fixedly installed on the base 1, and its drive shaft is strictly coaxial with and fixedly connected to the center of the turntable 32. The stepper motor 38 directly drives the turntable 32 to achieve precise angle control and positioning. The stepper motor 38 features high-precision indexing, rapid start / stop, and strong anti-interference capabilities. It can achieve intermittent rotation according to a preset program, with each revolution a fixed angle, such as 60° or 180°, ensuring that each support platform 36 accurately stops at the inspection or loading / unloading station. The combination of the thrust bearing 37 and the stepper motor 38 not only ensures that the turntable 32 can achieve low-noise and stable rotational movement under heavy load conditions, but also provides a stable foundation platform for the self-rotation transmission of the support platforms 36, avoiding unstable gear meshing caused by turntable 32 wobbling or eccentricity.

[0032] In one example, the rotating shaft 34 is rotatably connected to the turntable 32, a first gear 39 is sleeved on the upper end face of the rotating shaft 34, and a second gear 3a is coaxially arranged below the turntable 32. The second gear 3a is spaced apart from the turntable 32, and the second gear 3a meshes with the first gear 39. A rotating rod 3b is inserted through the second gear 3a. The lower end face of the rotating rod 3b is rotatably connected to the upper end face of the turntable 32. The upper end face of the rotating rod 3b is fixedly connected to the support platform 36 so that when the turntable 32 revolves, the support platform 36 rotates synchronously and at the same angle.

[0033] In the above embodiment, a planetary gear transmission structure is adopted. Specifically, the lower part of each rotating shaft 34 corresponding to the support platform 36 is rotatably connected to the turntable 32. A first gear 39 is fixedly sleeved on the upper end face of the rotating shaft 34. A second gear 3a is coaxially fixedly arranged below the turntable 32, integral with or fixedly connected to the turntable 32. There is no relative rotation between the second gear 3a and the turntable 32, and the second gear 3a maintains a meshing relationship with the first gear 39. A rotating rod 3b is inserted through the center of the second gear 3a. The lower end face of the rotating rod 3b is rotatably connected to the upper end face of the turntable 32 to provide support, while the upper end face of the rotating rod 3b is fixedly connected to the support platform 36, thereby directly transmitting the rotation of the rotating rod 3b to the support platform 36.

[0034] When the turntable 32 revolves around the center under the action of external driving force, the second gear 3a is fixed to the turntable 32 and revolves with it. The first gear 39, as a planetary gear, rolls along the outer circumference of the second gear 3a, driving the rotating shaft 34 and the rotating rod 3b to generate a rotational motion opposite to the direction of revolution. The rotation angle and the revolution angle maintain a precise ratio of 1:1, thereby enabling the first and second inspection areas on the wafer to achieve accurate directional rotation, always keeping the inspection area facing the corresponding detection module 21. The synchronous rotation control of multiple bearing stages 36 can be achieved solely by the rotation of the turntable 32 itself, reducing the overall mechanical complexity and failure rate of the equipment, and effectively supporting the parallel synchronous detection requirements of the dual detection modules 21 for the two halves of the wafer.

[0035] In one example, the detection mechanism 2 further includes a column 22 perpendicular to the upper surface of the base 1. A dovetail-shaped sliding track 221 is provided on the side of the column 22 facing the transport mechanism 3. The sliding track 221 is slidably connected to a first slider 23 and a second slider 24 along the bottom end of the column 22 toward the top end. The first slider 23 extends a lighting frame 25 toward the side of the carrier mechanism 3. The bottom end of the lighting frame 25 is provided with an annular lighting component 26. The lighting frame 25 has a detection hole 251 coaxial with the lighting component 26. The detection module 21 is located above the detection hole 251. One side of the detection module 21 is connected to the second slider 24 through an L-shaped detection frame 27.

[0036] In the above embodiment, the structure of the column 22 and the double slider in the detection mechanism 2 allows for independent height adjustment and coaxial alignment of the detection module 21 and the lighting component 26. The column 22 is vertically fixed to the upper surface of the base 1, and a dovetail-shaped sliding track 221 is machined on its side facing the carrier mechanism 3. This track extends along the height direction of the column 22 to ensure the stability and accuracy of the slider movement. The first slider 23 and the second slider 24 are slidably connected to the track from top to bottom. The first slider 23 extends into a lighting frame 25 towards the carrier mechanism 3. The bottom end of the lighting frame 25 is fixed with an annular lighting component 26. The lighting component 26 uses a multi-angle LED light source to uniformly illuminate the wafer surface to eliminate shadows and improve the imaging contrast of holes. A detection hole 251 coaxial with the lighting component 26 is opened in the center of the lighting frame 25, so that the optical axis of the detection module 21 passes directly through the hole and is vertically aligned with the wafer to be inspected, avoiding detection errors caused by offset. The detection module 21 is rigidly connected to the second slider 24 via the L-shaped detection frame 27. When it is necessary to adjust the detection distance or focus, the first slider 23 and the second slider 24 can be driven to move up and down along the sliding track 221 respectively, so as to independently adjust the illumination distance between the illumination component 26 and the wafer and the imaging distance between the detection module 21 and the wafer, thereby achieving rapid matching of optimal illumination and imaging conditions.

[0037] In one example, a fine-tuning slide rail 28 is provided below the column 22. The fine-tuning slide rail 28 is fixedly disposed on the upper end surface of the base 1 and is perpendicular to the column 22. A fine-tuning slider 29 is slidably connected to the fine-tuning slide rail 28. A support seat 2a extending to one side of the column 22 is fixedly connected to one side of the fine-tuning slider 29. A scanning linear motor 2b is connected to the side of the support seat 2a near the column 22. The drive end of the scanning linear motor 2b is fixedly connected to the column 22. The scanning linear motor 2b is perpendicular to both the column 22 and the fine-tuning slide rail 28, and is parallel to the diameter extension direction of the first and second inspection areas to perform translational scanning of the wafer.

[0038] In the above embodiment, a fine-tuning slide rail 28 and a scanning linear motor 2b are combined below the column 22 to realize the translational scanning motion of the wafer, so as to cover the entire wafer surface for comprehensive inspection. The fine-tuning slide rail 28 is fixed to the upper end face of the base 1 and is set perpendicular to the column 22. A fine-tuning slider 29 is slidably connected to it, and one side of the fine-tuning slider 29 extends to the support base 2a below the column 22. The scanning linear motor 2b is connected to the side of the support base 2a near the column 22. The drive end of the scanning linear motor 2b is rigidly fixed to the bottom of the column 22, so that the entire column 22 can move precisely along the direction of the fine-tuning slide rail 28. The movement direction of the scanning linear motor 2b is perpendicular to the height of the column 22 and the extension direction of the fine-tuning slide rail 28, and parallel to the diameter extension direction of the first and second inspection areas of the wafer. During the inspection process, after the carrier mechanism 3 rotates the wafer to a specific angle, the scanning linear motor 2b can drive the column 22 and the entire inspection mechanism 2 to move linearly along the wafer diameter direction, so that the optical axis of the inspection module 21 scans the wafer surface line by line along the diameter. Combined with the rotational movement of the carrier mechanism 3, the first inspection area and the second inspection area are inspected step by step to achieve full surface grating scanning coverage of the wafer.

[0039] In one embodiment, the loading and unloading mechanism 4 includes a loading component 41 and an unloading component 42 arranged symmetrically, and the loading component 41 and the unloading component 42 have the same structure; The feeding assembly 41 includes a horizontal linear motor 43 parallel to the base 1, and a lifting linear motor 44 is fixedly connected to the drive end of the horizontal linear motor 43. The feeding suction cup 411 is connected to the drive end of the lifting linear motor 44.

[0040] In the above embodiments, the symmetrically arranged loading assembly 41 and unloading assembly 42 achieve automated loading and unloading, significantly improving the continuous operation capability of the equipment. The loading assembly 41 and unloading assembly 42 have the same structure, both including a horizontal linear motor 43 arranged parallel to the base 1, whose drive end is fixedly connected to a lifting linear motor 44. The drive end of the lifting linear motor 44 is directly connected to the loading suction cup 411 or the unloading suction cup 421. During the loading process, the horizontal linear motor 43 drives the lifting linear motor 44 and the suction cup to move horizontally to above the wafer stack position. The lifting linear motor 44 then descends to make the suction cup adhere to the top wafer. After the wafer is firmly adsorbed by the vacuum adsorption structure, it rises and is then horizontally transported by the horizontal linear motor 43 to above the transport mechanism 3. The lifting linear motor 44 descends to accurately place the wafer in the designated position of the transport mechanism 3 and releases the vacuum. The unloading process is the opposite. The unloading assembly 42 adsorbs the inspected wafer from the transport mechanism 3, moves it horizontally to the unloading stack position, and then lowers it for placement. This allows loading and unloading to be performed in parallel. When one component is being loaded, another component can simultaneously unload another 36-station support, greatly reducing cycle time.

[0041] In one embodiment, a transport base 45 is provided on one side of the transverse linear motor 43. The transport base 45 extends in an L-shape to the upper end face of the base 1, and the extending direction of the transverse linear motor 43 is tangent to the movement trajectory of the transport mechanism 3. The driving end of the lifting linear motor 44 is provided with a connecting arm 46. One end of the connecting arm 46 is connected to the driving end of the lifting linear motor 44 through a reinforcing rib, and the other end of the connecting arm 46 is fixedly connected to the feeding suction cup 411.

[0042] The bottom of both the loading suction cup 411 and the unloading suction cup 421 is provided with a vacuum adsorption structure. The vacuum adsorption structure includes a number of uniformly distributed adsorption holes. The adsorption holes are connected to an external vacuum pump through a flexible tube to adsorb and release the wafer.

[0043] In the above embodiment, an L-shaped carrier base 45 is provided on one side of the transverse linear motor 43. One end of the base is fixed to the motor, and the other end extends to the upper surface of the base 1 to provide additional support, thereby enhancing the overall cantilever rigidity of the transverse linear motor 43. Its extension direction is tangent to the circumferential motion trajectory of the carrier mechanism 3, so that the suction cup is directly aligned with the center of the carrier plate at the end of the horizontal movement, achieving seamless docking. The drive end of the lifting linear motor 44 is connected to the suction cup through a connecting arm 46. One end of the connecting arm 46 is rigidly connected to the drive end with a reinforcing rib, which significantly improves the bending resistance. The other end is directly fixed to the suction cup to ensure stability during vertical movement. The bottom of the loading suction cup 411 and the unloading suction cup 421 both integrate a vacuum adsorption structure, which consists of several evenly distributed adsorption holes. Each adsorption hole is connected in parallel to an external vacuum pump through a flexible hose. During wafer adsorption, a vacuum pump creates a negative pressure in the adsorption holes. The evenly distributed holes ensure balanced force on the back of the wafer, preventing warping or breakage caused by localized stress concentration. During release, the vacuum is disconnected or a slight positive pressure is introduced for rapid detachment, fully ensuring the reliability and efficiency of the automated loading and unloading process.

[0044] refer to Figure 7 A method for visual inspection of laser drilling on semiconductor wafers, applied to a laser drilling visual inspection device for semiconductor wafers as described in any of the preceding claims, characterized in that it includes: S1: Provide testing equipment, the testing equipment includes a loading and unloading mechanism, a conveying mechanism and a testing module, the conveying mechanism includes a turntable and several bearing platforms, the bearing platforms are arranged in a circumferential array on the upper surface of the turntable, and two testing modules are symmetrically distributed on opposite sides of the conveying mechanism; S2: The loading and unloading mechanism synchronously executes loading and unloading actions on the transport mechanism; S3: Drive the turntable to rotate by a preset angle and drive the support platform to rotate synchronously by a preset angle; S4: The loading and unloading mechanism synchronously performs loading and unloading actions on the carrier platform, and synchronously detects whether there is a wafer on the carrier platform based on the detection module. When there is a wafer, the laser holes on the wafer surface are visually inspected. S5: After the detection is completed, repeat steps S3 to S4.

[0045] In the above embodiments, during the unloaded stage of the carrier platform, the loading and unloading mechanism first performs loading and unloading actions on the carrier platform of the transport mechanism. The loading action places the wafer to be inspected on the carrier platform. Then, the turntable is driven to rotate by a preset angle, and each carrier platform rotates synchronously by a preset angle to adjust the wafer orientation, avoid blind spots in the inspection, and ensure all-round exposure of the laser aperture. Next, the loading and unloading mechanism continues to perform unloading and unloading actions to replenish the empty carrier platform positions and trigger the detection module to synchronously determine whether there is a wafer on the carrier platform. If there is, the vision inspection program is activated. The camera captures images of the wafer surface, and the light source illumination highlights the contour, depth, and defect features of the laser aperture. The image algorithm is used to analyze parameters such as aperture uniformity, positional accuracy, and potential cracks to achieve efficient non-contact quality assessment. After the inspection is completed, the turntable rotation and carrier platform rotation steps are repeated to cycle the loading, unloading, and inspection actions, so that each carrier platform on the turntable is in a state of abundant material, forming a continuous production line operation.

[0046] In summary, by combining the rotation of the turntable with the rotation of the carrier stage, and the parallel operation of the dual-sided detection modules, the detection throughput and accuracy are significantly improved, making it suitable for mass production control of high-density laser-drilled wafers.

[0047] In one embodiment, the number of the support platforms is six, and the preset angle is 60°.

[0048] In the above embodiment, the turntable of the transport mechanism is equipped with six carrier platforms, which are evenly distributed in a circular array along the upper surface of the turntable to form a six-station layout. Each carrier platform independently carries a semiconductor wafer to be inspected, thereby realizing parallel processing of multiple wafers and improving the overall inspection efficiency of the equipment. The preset angle of each rotation of the turntable is set to 60°, which corresponds exactly to the circumferentially divided angle of the six carrier platforms. This allows each carrier platform to accurately switch to the loading / unloading position or the inspection position in sequence with each rotation of the turntable. At the same time, each carrier platform synchronously rotates 60° on its own axis during the revolution of the turntable, so that the wafer itself completes a complete orientation adjustment. This ensures that the laser holes in all areas of the wafer surface are evenly exposed within the field of view of the inspection module, avoiding blind spots in the inspection of some holes caused by the fixed posture of the wafer.

[0049] After the turntable rotates 60°, the carrier platform originally at the loading station moves to one of the inspection stations, while the carrier platform that has completed inspection moves to the unloading station or other inspection stations, forming a continuous station cycle. The loading and unloading mechanisms synchronously perform loading or unloading actions on the corresponding carrier platforms at fixed positions. Meanwhile, the symmetrically distributed inspection modules on both sides immediately align with the wafers on the two carrier platforms currently at the inspection station after the turntable stops, performing synchronous visual inspection. High-resolution cameras capture images of the laser holes, and image processing algorithms analyze the morphology and quality of the holes in real time. The matching of six carrier platforms with a 60° rotation angle enables multiple operations such as loading, inspection, and unloading to be completed simultaneously in each cycle, significantly shortening the average processing time per wafer and achieving high-speed, streamlined inspection operations. This allows the equipment to maintain inspection accuracy while possessing higher production throughput, making it particularly suitable for quality control scenarios after laser drilling of large batches of semiconductor wafers.

[0050] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A laser drilling visual inspection device for semiconductor wafers, characterized in that, It includes a base (1) and two symmetrical detection mechanisms (2) on the upper surface of the base (1), and a transport mechanism (3) is provided between the two detection mechanisms (2). The detection mechanism (2) includes a detection module (21). The carrier mechanism (3) includes a fixed seat (31) disposed on the upper end face of the base (1), a turntable (32) is rotatably connected to the fixed seat (31), a toothed ring (33) is fixedly disposed on the inner wall of the fixed seat (31), six rotating shafts (34) are arranged in a circumferential array on the turntable (32), a drive gear (35) is sleeved on the bottom end of the rotating shaft (34), the drive gear (35) meshes with the toothed ring (33), and a support platform (36) for supporting the wafer is rotatably connected above the rotating shaft (34). The wafer includes a first inspection area and a second inspection area. The first inspection area is located below the first detection module (21). When the turntable (32) rotates 180°, the carrier stage (36) rotates 180° synchronously, causing the second inspection area to be located below another detection module (21), so that the first inspection area and the second inspection area, which are far apart from each other on the two wafers, can be detected synchronously.

2. The laser drilling visual inspection equipment for semiconductor wafers according to claim 1, characterized in that, It also includes a loading and unloading mechanism (4), which includes a loading suction cup (411) and a unloading suction cup (421) with the same structure. The loading suction cup (411) is located on one side of the first detection module (21), and the unloading suction cup (421) is located on one side of another detection module (21). The loading suction cup (411) and the unloading suction cup (421) are respectively located above two adjacent support platforms (36). When the two testing institutions (2) respectively test the first and second test areas that are far apart from each other on the two wafers, the loading chuck (411) and unloading chuck (421) simultaneously load and unload the two adjacent carrier platforms (36).

3. The laser drilling visual inspection equipment for semiconductor wafers according to claim 1, characterized in that, The upper end face of the fixed seat (31) is provided with a rotating groove (311) along the outer periphery. A thrust bearing (37) is installed in the rotating groove (311). The upper end face of the thrust bearing (37) is higher than the upper end face of the toothed ring (33) and the upper end face of the fixed seat (31). The upper end of the thrust bearing (37) is fixedly connected to the turntable (32). A stepper motor (38) is provided below the turntable (32). The stepper motor (38) is fixedly connected to the base (1). The drive shaft of the stepper motor (38) is coaxially arranged with the turntable (32), and the drive shaft of the stepper motor (38) is fixedly connected to the turntable (32).

4. The laser drilling visual inspection equipment for semiconductor wafers according to claim 1, characterized in that, The rotating shaft (34) is rotatably connected to the turntable (32). A first gear (39) is sleeved on the upper end face of the rotating shaft (34). A second gear (3a) is coaxially arranged below the turntable (32). The second gear (3a) is spaced apart from the turntable (32). The second gear (3a) meshes with the first gear (39). A rotating rod (3b) is inserted through the second gear (3a). The lower end face of the rotating rod (3b) is rotatably connected to the upper end face of the turntable (32). The upper end face of the rotating rod (3b) is fixedly connected to the support platform (36) so that when the turntable (32) revolves, the support platform (36) rotates synchronously and at the same angle.

5. The laser drilling visual inspection equipment for semiconductor wafers according to claim 1, characterized in that, The detection mechanism (2) also includes a column (22) perpendicular to the upper surface of the base (1). A dovetail-shaped sliding track (221) is provided on one side of the column (22) facing the transport mechanism (3). The sliding track (221) is connected to the first slider (23) and the second slider (24) in sequence from the bottom end of the column (22) to the top end. The first slider (23) has a lighting frame (25) extending toward the side of the carrier mechanism (3). The bottom end of the lighting frame (25) is provided with an annular lighting component (26). The lighting frame (25) has a detection hole (251) coaxial with the lighting component (26). The detection module (21) is located above the detection hole (251). One side of the detection module (21) is connected to the second slider (24) through an L-shaped detection frame (27).

6. The laser drilling visual inspection equipment for semiconductor wafers according to claim 5, characterized in that, A fine-tuning slide rail (28) is provided below the column (22). The fine-tuning slide rail (28) is fixedly disposed on the upper end surface of the base (1) and is perpendicular to the column (22). The fine-tuning slide rail (28) is slidably connected to a fine-tuning slider (29). A support seat (2a) extending to one side of the fine-tuning slider (29) is fixedly connected to one side of the column (22). A scanning linear motor (2b) is connected to the side of the support seat (2a) near the column (22). The driving end of the scanning linear motor (2b) is fixedly connected to the column (22). The scanning linear motor (2b) is perpendicular to the column (22) and the fine-tuning slide rail (28) respectively. The scanning linear motor (2b) is parallel to the diameter extension direction of the first inspection area and the second inspection area to perform translational scanning of the wafer.

7. The laser drilling visual inspection equipment for semiconductor wafers according to claim 1, characterized in that, The loading and unloading mechanism (4) includes a loading component (41) and an unloading component (42) arranged symmetrically, and the loading component (41) and the unloading component (42) have the same structure; The feeding assembly (41) includes a horizontal linear motor (43) parallel to the base (1), and a lifting linear motor (44) is fixedly connected to the drive end of the horizontal linear motor (43). The feeding suction cup (411) is connected to the drive end of the lifting linear motor (44).

8. The laser drilling visual inspection equipment for semiconductor wafers according to claim 7, characterized in that, A carrier base (45) is provided on one side of the transverse linear motor (43). The carrier base (45) extends in an L-shape to the upper end face of the base (1). The extension direction of the transverse linear motor (43) is tangent to the motion trajectory of the carrier mechanism (3). The driving end of the lifting linear motor (44) is provided with a connecting arm (46). One end of the connecting arm (46) is connected to the driving end of the lifting linear motor (44) through a reinforcing rib, and the other end of the connecting arm (46) is fixedly connected to the feeding suction cup (411). The bottom of both the loading suction cup (411) and the unloading suction cup (421) is provided with a vacuum adsorption structure. The vacuum adsorption structure includes several uniformly distributed adsorption holes. The adsorption holes are connected to an external vacuum pump through a flexible tube to adsorb and release the wafer.

9. A method for visual inspection of laser drilling on semiconductor wafers, applied to a visual inspection device for laser drilling on semiconductor wafers as described in any one of claims 1-8, characterized in that, include: S1: Provide testing equipment, the testing equipment includes a loading and unloading mechanism, a conveying mechanism and a testing module, the conveying mechanism includes a turntable and several bearing platforms, the bearing platforms are arranged in a circumferential array on the upper surface of the turntable, and two testing modules are symmetrically distributed on opposite sides of the conveying mechanism; S2: The loading and unloading mechanism synchronously executes loading and unloading actions on the transport mechanism; S3: Drive the turntable to rotate by a preset angle and drive the support platform to rotate synchronously by a preset angle; S4: The loading and unloading mechanism synchronously performs loading and unloading actions on the carrier platform, and synchronously detects whether there is a wafer on the carrier platform based on the detection module. When there is a wafer, the laser holes on the wafer surface are visually inspected. S5: After the detection is completed, repeat steps S3 to S4.

10. The laser drilling visual inspection method for semiconductor wafers according to claim 9, characterized in that, The number of the support platforms is six, and the preset angle is 60°.

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