PCB (Printed Circuit Board) vertical type solder mask developing device

Abstract

The invention provides a PCB vertical solder resist developing device. The PCB vertical solder resist developing device comprises a cabinet body; the pump body is fixedly mounted on the side surface of the cabinet body; the washing assembly is arranged on the inner side face of the cabinet body, the washing assembly comprises a flow dividing frame, a plurality of flow dividing plates and a plurality of first spray heads, and the flow dividing plates are fixedly installed on the front face of the flow dividing frame. According to the PCB vertical type solder resist developing device provided by the invention, through mutual cooperation of the cabinet body, the pump body, the flushing assembly, the moving assembly, the clamping assembly, the filtering assembly and other structures, when the device is used, the moving assembly drives the flushing assembly to move up and down, so that a flow dividing frame, a flow dividing plate and a first spray head of the flushing assembly comprehensively spray a developing solution; the developing solution uniformly covers the surface of the PCB, no spraying blind area exists, and photosensitive layer residues are reduced, so that the problem of photosensitive layer residues caused by fixed position of a flushing assembly and non-uniform spraying of the developing solution of an existing device is solved.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a vertical solder resist developing device for PCB boards. Background Technology

[0002] Solder resist development is a key process in PCB manufacturing. The developing solution removes the photosensitive layer not covered by the solder resist ink, forming a pre-set circuit pattern. The uniformity and thoroughness of the development directly affect the circuit accuracy and reliability of the PCB. Vertical solder resist development equipment is widely used in the industry because it can reduce developer residue and improve waste liquid discharge efficiency.

[0003] Existing vertical solder resist developing devices for PCBs have significant technical defects: the rinsing components are mostly fixed structures, the position of the developing solution nozzles cannot be flexibly adjusted, making it difficult to spray the PCB surface comprehensively and evenly, resulting in residual photosensitive layer in some areas, affecting the clarity of circuit patterns.

[0004] Therefore, it is necessary to provide a vertical solder resist developing device for PCB boards to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a vertical solder resist developing device for PCB boards, which solves the problem of fixed position of the rinsing components and uneven spraying of developing solution in existing devices, resulting in residual photosensitive layer on the surface of the PCB board.

[0006] To solve the above-mentioned technical problems, the present invention provides a vertical solder resist developing device for PCB boards, comprising: Cabinet; Pump body, the pump body being fixedly installed on the side of the cabinet; A flushing assembly is disposed on the inner side of the cabinet. The flushing assembly includes a diversion frame, multiple diversion plates, and multiple first nozzles. The multiple diversion plates are fixedly installed on the front of the diversion frame, and the multiple first nozzles are respectively fixedly installed on both sides of the multiple diversion plates. One end of the diversion frame is fixedly installed to the output end of the pump body through a hose. A movable component is disposed on the back of the rinsing component and is used to drive the rinsing component to move up and down; A clamping assembly is disposed at the bottom of the rinsing assembly and is used to clamp the PCB board; A filter assembly is disposed at the bottom of the clamping assembly.

[0007] Preferably, the moving component includes a drive motor, a threaded rod, and a moving block. The drive motor is fixedly installed on the top of the cabinet, the threaded rod is fixedly installed on the output end of the drive motor, and the moving block is threadedly connected to the outer side of the threaded rod and fixedly installed on the back of the diversion frame.

[0008] Preferably, the clamping assembly includes a fixed plate, a mounting groove, multiple placement frames, multiple clamping plates, multiple sliders, multiple sliding grooves, multiple moving plates, multiple connecting rods, two sliding rods, and an electric telescopic rod. The fixed plate is fixedly installed on the inner side of the cabinet. The mounting groove is opened inside the fixed plate. The multiple placement frames are all fixedly installed on the inner side of the mounting groove. The multiple clamping plates are slidably connected to the inner sides of the multiple placement frames. The multiple sliders are fixedly installed at the bottom of the multiple clamping plates. The multiple sliding grooves are fixedly installed at the bottom of the multiple placement frames. The multiple sliders are slidably connected to the inner sides of the multiple sliding grooves. The multiple moving plates are fixedly installed on one side of the multiple sliders. The multiple connecting rods are fixedly installed in the middle of the multiple moving plates. The two sliding rods are slidably connected to the two ends of the multiple moving plates. The electric telescopic rod is fixedly installed on one side of one of the moving plates.

[0009] Preferably, the two ends of the two sliding rods are respectively fixedly installed at both ends of the bottom of the mounting plate, and the electric telescopic rod is fixedly installed at one end of the bottom of the mounting plate.

[0010] Preferably, doors are provided on both sides of the front of the cabinet, a through groove is provided on the front of the cabinet, and slide rails are fixedly installed on both sides of the inner side of the cabinet.

[0011] Preferably, the filter assembly includes a filter frame, filter cotton, a handle, and a filter screen. The handle is fixedly installed on the front of the filter frame, the filter screen is fixedly installed on the bottom of the inner side of the filter frame, and the filter cotton is disposed on the top of the filter screen.

[0012] Preferably, the filter frame is slidably connected to the inner sides of the through groove and the two slide rails respectively.

[0013] Preferably, the PCB vertical solder resist developing device further includes a drying component, which is disposed on the inner side of the cabinet.

[0014] Preferably, the drying assembly includes a fan, an air pipe, a fixed frame, multiple diverter pipes, and multiple second nozzles. The fan is fixedly installed on the top of the cabinet, the air pipe is fixedly installed at the output end of the fan, the fixed frame is fixedly installed at the output end of the air pipe, the multiple diverter pipes are all fixedly installed on the front of the fixed frame, and the multiple second nozzles are respectively fixedly installed at the bottom of the multiple diverter pipes.

[0015] Preferably, the fixing frame is fixedly installed at the bottom of the diversion frame, and the plurality of second nozzles are respectively disposed at the bottom of the plurality of diversion plates.

[0016] Compared with related technologies, the PCB vertical solder resist developing device provided by the present invention has the following advantages: This invention provides a vertical solder resist developing device for PCB boards. Through the cooperation of structures such as cabinet, pump, rinsing component, moving component, clamping component and filtering component, during use, the moving component drives the rinsing component to move up and down, so that the diversion frame, diversion plate and first nozzle of the rinsing component are fully sprayed with developing solution, so that the developing solution uniformly covers the surface of the PCB board, with no spray blind spots, reducing the residue of photosensitive layer, thereby solving the problem of fixed position of rinsing component and uneven spraying of developing solution in existing devices, which leads to the residue of photosensitive layer. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of a first embodiment of a vertical solder resist developing device for PCB boards provided by the present invention; Figure 2 for Figure 1 The diagram shows the internal structure of the cabinet. Figure 3 for Figure 2 The diagram shows the structure of the moving component and the rinsing component; Figure 4 for Figure 2 The diagram shows the structure of the clamping assembly. Figure 5 for Figure 4 The diagram shows another perspective of the structure; Figure 6 This is a schematic diagram of a second embodiment of a vertical solder resist developing apparatus for PCB boards provided by the present invention. Figure 7 for Figure 6 The diagram shows another perspective of the structure; Figure 8 This is a schematic diagram of the third embodiment of a vertical solder resist developing device for PCB boards provided by the present invention.

[0018] Numbered in the diagram: 1. Cabinet, 11. Door, 12. Through groove, 13. Slide rail, 2. Pump body, 3. Moving assembly, 31. Drive motor, 32. Threaded rod, 33. Moving block, 4. Flushing assembly, 41. Diverter frame, 42. Diverter plate, 43. First nozzle, 5. Clamping assembly, 51. Fixing plate, 52. Mounting groove, 53. Placement frame, 54. Clamping plate, 55. Slider, 56. Slide groove, 57. Moving plate, 58. Connecting rod, 59. Slide rod, 50. Electric telescopic rod, 6. Filter assembly, 61. Filter frame, 62. Filter cotton, 63. Handle, 64. Filter screen, 7. Drying assembly, 71. Fan, 72. Air pipe, 73. Fixing frame, 74. Diverter pipe, 75. Second nozzle. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] First embodiment: Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic diagram of the structure of a first embodiment of a vertical solder resist developing device for PCB boards provided by the present invention; Figure 2 for Figure 1 The diagram shows the internal structure of the cabinet. Figure 3 for Figure 2 The diagram shows the structure of the moving component and the rinsing component; Figure 4 for Figure 2 The diagram shows the structure of the clamping assembly. Figure 5 for Figure 4 The diagram shows another perspective of the structure.

[0021] A vertical solder resist developing device for PCB boards includes: a cabinet 1; Pump body 2, which is fixedly installed on the side of the cabinet 1; A flushing assembly 4 is disposed on the inner side of the cabinet 1. The flushing assembly 4 includes a diversion frame 41, multiple diversion plates 42 and multiple first nozzles 43. The multiple diversion plates 42 are fixedly installed on the front of the diversion frame 41, and the multiple first nozzles 43 are respectively fixedly installed on both sides of the multiple diversion plates 42. One end of the diversion frame 41 is fixedly installed to the output end of the pump body 2 through a hose. The moving component 3 is disposed on the back of the rinsing component 4 and is used to drive the rinsing component 4 to move up and down. Clamping component 5, which is disposed at the bottom of the rinsing component 4, is used to clamp the PCB board; The filter assembly 6 is disposed at the bottom of the clamping assembly 5.

[0022] The moving component 3 includes a drive motor 31, a threaded rod 32, and a moving block 33. The drive motor 31 is fixedly installed on the top of the cabinet 1, the threaded rod 32 is fixedly installed on the output end of the drive motor 31, and the moving block 33 is threadedly connected to the outer side of the threaded rod 32 and fixedly installed on the back of the diversion frame 41.

[0023] The drive motor 31 is a forward and reverse motor, which can drive the threaded rod 32 to rotate in both directions, thereby driving the moving block 33 to move smoothly up and down along the threaded rod 32. The moving block 33 drives the diversion frame 41 and the diversion plate 42 to rise and fall synchronously, so that the first nozzle 43 can spray the PCB board surface comprehensively and avoid spray blind spots. The back of the moving block 33 is attached to the back of the inner side of the cabinet 1.

[0024] The clamping assembly 5 includes a fixed plate 51, a mounting groove 52, multiple placement frames 53, multiple clamping plates 54, multiple sliders 55, multiple sliding grooves 56, multiple moving plates 57, multiple connecting rods 58, two sliding rods 59, and an electric telescopic rod 50. The fixed plate 51 is fixedly installed on the inner side of the cabinet 1. The mounting groove 52 is formed inside the fixed plate 51. The multiple placement frames 53 are all fixedly installed on the inner side of the mounting groove 52. The multiple clamping plates 54 are slidably connected to the inner sides of the multiple placement frames 53. The multiple sliders 55... 5 are respectively fixedly installed on the bottom of the multiple clamping plates 54, the multiple sliding grooves 56 are respectively fixedly installed on the bottom of the multiple placement frames 53, the multiple sliders 55 are slidably connected to the inner side of the multiple sliding grooves 56, the multiple moving plates 57 are respectively fixedly installed on one side of the multiple sliders 55, the multiple connecting rods 58 are respectively fixedly installed in the middle of the multiple moving plates 57, the two sliding rods 59 are respectively slidably connected to the two ends of the multiple moving plates 57, and the electric telescopic rod 50 is fixedly installed on one side of one of the moving plates 57.

[0025] The placement frame 53 is used to place the PCB board to be developed. When the electric telescopic rod 50 extends, it pushes the corresponding moving plate 57 to move along the slide rod 59. Through the connecting rod 58, all moving plates 57 move synchronously. The moving plate 57 drives the clamping plate 54 to move along the slide groove 56 towards the center of the placement frame 53 through the slider 55, clamping the PCB board from both sides to ensure the PCB board is vertically stable and avoids shaking during the development process.

[0026] The two ends of the two sliding rods 59 are respectively fixedly installed at both ends of the bottom of the mounting plate 51, and the electric telescopic rod 50 is fixedly installed at one end of the bottom of the mounting plate 51.

[0027] The slide bar 59 provides precise sliding guidance for the moving plate 57, ensuring that multiple clamping plates 54 move synchronously and the clamping force is uniform, avoiding damage caused by uneven force on the PCB board; the electric telescopic rod 50 is firmly fixed and runs stably, and can precisely control the clamping force of the clamping plate 54.

[0028] The cabinet 1 has doors 11 on both sides of the front, a through groove 12 on the front, and slide rails 13 fixedly installed on both sides of the inner side of the cabinet 1.

[0029] The door 11 is made of transparent material, which makes it easy to observe the internal development process; the through groove 12 cooperates with the slide rail 13 to provide an installation and sliding channel for the filter assembly 6, which facilitates the disassembly and cleaning of the filter assembly 6.

[0030] The working principle of the vertical solder resist developing device for PCB boards provided by this invention is as follows: In use, open the door 11 and place multiple PCBs to be developed into multiple placement frames 53; start the electric telescopic rod 50, driving the moving plate 57 to move along the slide bar 59, and drive multiple clamping plates 54 to clamp the PCBs synchronously through the connecting rod 58; close the door 11, start the pump 2 and drive motor 31, the pump 2 delivers the developer solution through the hose to the diversion frame 41, and then after being diverted by the diversion plate 42, it is sprayed out from the first nozzle 43; the drive motor 31 drives the threaded rod 32 to rotate, driving the moving block 33 and the rinsing assembly 4 to move up and down, and the first nozzle 43 sprays the surface of multiple PCBs comprehensively and evenly to remove the photosensitive layer not covered by solder resist ink; the waste liquid after spraying falls into the filter assembly 6 for filtration to remove impurities; after development is completed, turn off the pump 2 and drive motor 31, finally open the door 11, control the electric telescopic rod 50 to retract, the clamping plates 54 to release, and take out the PCBs to complete the development operation.

[0031] Compared with related technologies, the PCB vertical solder resist developing device provided by the present invention has the following advantages: Through the coordinated structure of cabinet 1, pump body 2, rinsing assembly 4, moving assembly 3, clamping assembly 5 and filtering assembly 6, during use, the moving assembly 3 drives the rinsing assembly 4 to move up and down, so that the diversion frame 41, diversion plate 42 and first nozzle 43 of the rinsing assembly 4 are fully sprayed with developing solution, so that the developing solution evenly covers the PCB board surface, with no spray blind spots, reducing the residue of photosensitive layer, thereby solving the problem of fixed position of rinsing assembly and uneven spraying of developing solution in existing devices, which leads to the residue of photosensitive layer.

[0032] Second embodiment: Please refer to the following: Figure 6 and Figure 7Based on the first embodiment of this application which provides a vertical solder resist developing apparatus for PCB boards, the second embodiment of this application proposes another vertical solder resist developing apparatus for PCB boards. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0033] Specifically, the difference in the PCB vertical solder resist developing device provided in the second embodiment of this application is that the filter assembly 6 of the PCB vertical solder resist developing device includes a filter frame 61, filter cotton 62, handle 63 and filter screen 64. The handle 63 is fixedly installed on the front of the filter frame 61, the filter screen 64 is fixedly installed on the bottom of the inner side of the filter frame 61, and the filter cotton 62 is disposed on the top of the filter screen 64.

[0034] The filter frame 61 is slidably connected to the inner sides of the through groove 12 and the two slide rails 13.

[0035] The filter cotton 62 is made of a highly absorbent material, which can filter out impurities such as photosensitive layer residue in the developing waste liquid. The filter screen 64 further filters out larger particulate impurities. The dual filtration can effectively protect the pump body 2 and the first nozzle 43 and prevent clogging. The filter frame 61 can be pulled out along the slide rail 13 by the handle 63, which makes it convenient to replace the filter cotton 62 and clean the filter screen 64, making maintenance convenient.

[0036] The working principle of the vertical solder resist developing device for PCB boards provided by this invention is as follows: During the development process, the waste liquid after spraying drips from the clamping component 5 into the filter frame 61. After the filter cotton 62 adsorbs fine impurities and the filter screen 64 filters large particles of impurities, the waste liquid is discharged from the bottom of the filter frame 61 or recycled. When the filter cotton 62 and the filter screen 64 accumulate a lot of impurities, the filter frame 61 is pulled out from the through groove 12 along the slide rail 13 by the handle 63, a new filter cotton 62 is replaced and the filter screen 64 is cleaned, and then the filter frame 61 is pushed back to its original position for continued use.

[0037] Compared with related technologies, the PCB vertical solder resist developing device provided by the present invention has the following advantages: The filter frame 61, filter cotton 62, handle 63 and filter screen 64 work together to filter the photosensitive layer residue and impurities in the developing waste liquid through dual filtration by the filter cotton 62 and filter screen 64, so that the developing liquid can be reused, thereby reducing the cost of use.

[0038] Third embodiment: Please refer to the following: Figure 8Based on the first embodiment of this application, which provides a vertical solder resist developing apparatus for PCB boards, the third embodiment of this application proposes another vertical solder resist developing apparatus for PCB boards. The third embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the separate implementation of the first embodiment.

[0039] Specifically, the difference between the PCB vertical solder resist developing device provided in the third embodiment of this application is that the PCB vertical solder resist developing device further includes a drying component 7, which is disposed on the inner side of the cabinet 1.

[0040] The drying assembly 7 includes a fan 71, an air pipe 72, a fixing frame 73, multiple diversion pipes 74, and multiple second nozzles 75. The fan 71 is fixedly installed on the top of the cabinet 1, the air pipe 72 is fixedly installed at the output end of the fan 71, the fixing frame 73 is fixedly installed at the output end of the air pipe 72, the multiple diversion pipes 74 are all fixedly installed on the front of the fixing frame 73, and the multiple second nozzles 75 are respectively fixedly installed at the bottom of the multiple diversion pipes 74.

[0041] The fixed frame 73 is fixedly installed at the bottom of the diversion frame 41, and the plurality of second nozzles 75 are respectively disposed at the bottom of the plurality of diversion plates 42.

[0042] The working principle of the vertical solder resist developing device for PCB boards provided by this invention is as follows: After development is complete, turn off pump 2, keep drive motor 31 running, and drive rinsing assembly 4 and drying assembly 7 to move up and down synchronously; start fan 71, and airflow is sprayed out from second nozzle 75 through air pipe 72, fixed frame 73 and diverter pipe 74 to dry the surface of multiple PCB boards; after drying is complete, turn off drive motor 31 and fan 71, open door 11 and take out PCB boards.

[0043] Compared with related technologies, the PCB vertical solder resist developing device provided by the present invention has the following advantages: Through the coordinated structure of fan 71, air pipe 72, fixed frame 73, diverter pipe 74 and second nozzle 75, the drying assembly 7 moves up and down synchronously with the rinsing assembly 4, and the second nozzle 75 sprays air evenly to quickly dry the residual developer on the PCB board surface, thereby increasing the efficiency of PCB board processing.

[0044] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A vertical solder resist developing device for PCB boards, characterized in that, include: Cabinet; Pump body, the pump body being fixedly installed on the side of the cabinet; A flushing assembly is disposed on the inner side of the cabinet. The flushing assembly includes a diversion frame, multiple diversion plates, and multiple first nozzles. The multiple diversion plates are fixedly installed on the front of the diversion frame, and the multiple first nozzles are respectively fixedly installed on both sides of the multiple diversion plates. One end of the diversion frame is fixedly installed to the output end of the pump body through a hose. A movable component is disposed on the back of the rinsing component and is used to drive the rinsing component to move up and down; A clamping assembly is disposed at the bottom of the rinsing assembly and is used to clamp the PCB board; A filter assembly is disposed at the bottom of the clamping assembly.

2. The PCB vertical solder resist developing device according to claim 1, characterized in that, The moving component includes a drive motor, a threaded rod, and a moving block. The drive motor is fixedly installed on the top of the cabinet, the threaded rod is fixedly installed on the output end of the drive motor, and the moving block is threadedly connected to the outer side of the threaded rod and fixedly installed on the back of the diversion frame.

3. The PCB vertical solder resist developing device according to claim 1, characterized in that, The clamping assembly includes a fixed plate, a mounting slot, multiple placement frames, multiple clamping plates, multiple sliders, multiple sliding grooves, multiple movable plates, multiple connecting rods, two sliding rods, and an electric telescopic rod. The fixed plate is fixedly installed on the inner side of the cabinet. The mounting slot is opened inside the fixed plate. The multiple placement frames are all fixedly installed on the inner side of the mounting slot. The multiple clamping plates are slidably connected to the inner sides of the multiple placement frames. The multiple sliders are fixedly installed at the bottom of the multiple clamping plates. The multiple sliding grooves are fixedly installed at the bottom of the multiple placement frames. The multiple sliders are slidably connected to the inner sides of the multiple sliding grooves. The multiple movable plates are fixedly installed on one side of the multiple sliders. The multiple connecting rods are fixedly installed in the middle of the multiple movable plates. The two sliding rods are slidably connected to both ends of the multiple movable plates. The electric telescopic rod is fixedly installed on one side of one of the movable plates.

4. A vertical solder resist developing device for PCB boards according to claim 3, characterized in that, The two ends of the two sliding rods are respectively fixedly installed at both ends of the bottom of the mounting plate, and the electric telescopic rod is fixedly installed at one end of the bottom of the mounting plate.

5. A vertical solder resist developing device for PCB boards according to claim 1, characterized in that, Doors are provided on both sides of the front of the cabinet, a through groove is provided on the front of the cabinet, and slide rails are fixedly installed on both sides of the inner side of the cabinet.

6. A vertical solder resist developing device for PCB boards according to claim 5, characterized in that, The filter assembly includes a filter frame, filter cotton, a handle, and a filter screen. The handle is fixedly installed on the front of the filter frame, the filter screen is fixedly installed on the bottom of the inner side of the filter frame, and the filter cotton is disposed on top of the filter screen.

7. A vertical solder resist developing device for PCB boards according to claim 6, characterized in that, The filter frame is slidably connected to the inner sides of the through groove and the two slide rails.

8. A vertical solder resist developing device for PCB boards according to claim 1, characterized in that, It also includes a drying assembly, which is disposed on the inner side of the cabinet.

9. A vertical solder resist developing device for PCB boards according to claim 8, characterized in that, The drying assembly includes a fan, an air pipe, a fixed frame, multiple diverter pipes, and multiple second nozzles. The fan is fixedly installed on the top of the cabinet, the air pipe is fixedly installed at the output end of the fan, the fixed frame is fixedly installed at the output end of the air pipe, the multiple diverter pipes are fixedly installed on the front of the fixed frame, and the multiple second nozzles are respectively fixedly installed at the bottom of the multiple diverter pipes.

10. A vertical solder resist developing device for PCB boards according to claim 9, characterized in that, The fixed frame is fixedly installed at the bottom of the flow divider frame, and the multiple second nozzles are respectively disposed at the bottom of the multiple flow dividers.

Images