Board stringing and column separating equipment for PCB gold immersion treatment and process thereof

Abstract

The invention, which relates to the technical field of PCBs, discloses a board stringing and column separating device for PCB gold immersion processing and a process thereof, the board stringing and column separating device comprises a bottom plate, a base is welded on the upper surface of the bottom plate, and a limiting plate is welded on the side of the upper surface of the base; the lifting mechanism is used for lifting the PCBs, and through the arrangement of the lifting mechanism, after the PCBs needing to be stringed are placed on the surface of the lifting mechanism, the PCBs can be accurately driven, so that the PCBs can be moved to the designated positions, and the PCBs are placed; the lifting mechanism is used for driving the PCBs to move up and down, the PCBs after board stringing can be driven to move downwards by arranging the lifting mechanism, then the lifting mechanism only needs to repeatedly position the PCBs to the designated positions, meanwhile, the partition columns are conveniently placed, and the effect that the partition columns are accurately connected with the PCBs together is achieved.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, specifically to a PCB board immersion gold treatment equipment and its process. Background Technology

[0002] A PCB, or Printed Circuit Board, is an indispensable and crucial basic component in the electronics industry. It uses electronic printing technology to form conductive patterns on an insulating substrate to achieve electrical connections and mechanical support between electronic components. A standard PCB typically consists of a substrate, copper foil, solder mask, and silkscreen layer. The substrate, as the main insulating material, is commonly made of FR-4 epoxy fiberglass cloth; it is covered with precision copper foil lines formed by etching; the solder mask (usually green) covers the copper lines, providing insulation and anti-oxidation; the silkscreen layer is used to mark component reference numbers and other information. Based on the number of conductive layers, PCBs can be divided into single-sided boards, double-sided boards, and multilayer boards. Modern complex electronic devices (such as computers and communication equipment) commonly use high-density interconnect (HDI) multilayer boards, with dozens of layers, achieving interlayer electrical interconnection through metallized vias. The design and manufacturing quality of the PCB directly affects the performance, reliability, and lifespan of electronic products.

[0003] The effects of inaccurate placement of the partition post are cascading and severe, directly damaging product quality and production efficiency. The most direct consequence is the scrapping of the PCB board. If the partition post is crooked, its main body or clips will not be firmly held on the edge of the board, but will instead press on the surface area of ​​the PCB. In this case, the pressed area will be isolated from the chemical solution during the gold plating process and will not be able to undergo a chemical reaction, ultimately resulting in a fatal defect where gold plating cannot be performed in certain areas. Summary of the Invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: a PCB board immersion gold treatment board stringing partition device, including a base plate, a base welded to the upper surface of the base plate, a limit plate welded to the side of the upper surface of the base plate, and a device box sleeved on the outer surface of the base plate. The lifting mechanism is used to lift the PCB board. By setting up the lifting mechanism, after the PCB board to be strung is placed on its surface, the PCB board can be precisely driven to move to the designated position and be placed. The lifting mechanism is used to move the PCB board up and down. By setting the lifting mechanism, the PCB board after it has been strung together can be moved downward, so that the lifting mechanism only needs to repeatedly position the PCB board to the designated position, and it is also convenient to place the partition column. A spacer placement device is used to place spacers in holes on the surface of a PCB board. By setting up the spacer placement device, spacers that need to be placed can be stored, and after the PCB board is positioned in the designated position, the spacers are positioned and slid down to the position of the holes on the surface of the PCB board. The partition post placement device includes a top plate, which is movably connected between the opposing surfaces of the two limiting plates. A discharge mechanism is provided on the outer side of the top plate to stably position a single partition post at a hole on the upper surface of the PCB board. The discharge mechanism includes a limiting cylinder, with a pressing cylinder slidably connected to its inner cavity. An arc-shaped hole is formed on the outer surface of the pressing cylinder, and a blocking mechanism is provided at the arc-shaped hole. By setting the discharge mechanism, it can be aligned with the hole on the PCB board surface, thus allowing the partition post to be placed in the hole on the PCB board surface. The limiting cylinder can limit the movement of the pressing cylinder on its outer surface.

[0005] Preferably, the lifting mechanism includes a fixed frame welded to the upper surface of the base plate. A horizontal moving device is fixedly connected to the inner wall of the fixed frame. A moving plate is fixedly connected to the movable end of the horizontal moving device. A vertical moving device is fixedly connected to the upper surface of the moving plate. A placement frame is fixedly connected to the movable end of the vertical moving device.

[0006] Preferably, the lifting mechanism includes a connecting frame and a partition. The connecting frame is riveted to the upper surface of the base. A stepper motor is fixedly connected to the inner wall of the connecting frame. A reciprocating lead screw is installed at the output end of the stepper motor through a coupling. A limit sleeve is rotatably connected to the top end of the reciprocating lead screw. The partition is riveted to the outer surface of the limit plate, and the limit sleeve is welded to the lower surface of the partition.

[0007] Preferably, the lifting mechanism further includes a first sliding sleeve, which is slidably connected to the outer surface of the limiting plate. The first sliding sleeve is located below the partition plate. A placement plate is riveted to the lower surface of the first sliding sleeve. Several holes are opened on the side of the placement plate. A coaxial friction wheel set is fixedly connected to the holes on the side of the placement plate. The coaxial friction wheel set has three sets of planetary-arranged micro friction wheels inside, which are evenly distributed in a circular cavity. The coaxial friction wheel set is driven by an outer ring drive ring through gears to drive all planetary friction wheels to rotate synchronously in the same direction.

[0008] Preferably, a connecting frame is riveted to the outer side of the placement plate, and a fixing ring is welded to the side of the connecting frame away from the placement plate. A threaded ring is welded to the inner ring of the fixing ring, and the threaded ring is threadedly connected to the outer surface of the reciprocating lead screw.

[0009] Preferably, a second sliding sleeve is riveted to the outer side of the top plate, the second sliding sleeve is slidably connected to the outer surface of the limiting plate, the second sliding sleeve is located above the partition, an extrusion frame is riveted to the upper surface of the top plate, a hydraulic cylinder is fixedly connected to the inner wall of the partition, and the top end of the movable end of the hydraulic cylinder is welded to the lower surface of the extrusion frame.

[0010] Preferably, a storage box is welded to the top of the limiting cylinder, the storage box is welded to the inner surface of the top plate, a guide frame is welded to the inner wall of the storage box, a track ring passes through the outer side of the limiting cylinder, a sliding block is riveted to the outer surface of the extrusion cylinder, the sliding block is slidably connected to the inner cavity of the track ring, and a washer is fixedly connected to the lower surface of the extrusion cylinder.

[0011] Preferably, the blocking mechanism includes a support frame riveted to the outer surface of the extrusion cylinder. A limit post is welded to the top of the support frame, and a rotating cylinder is rotatably connected to the outer surface of the limit post. A first support rod is riveted to the outer surface of the rotating cylinder, and an extrusion plate is riveted to the end of the first support rod. A spring is welded to the lower surface of the extrusion plate, and the end of the spring is welded to the outer surface of the support frame. An extrusion rod is riveted to the outer surface of the limit cylinder, and an extrusion head is welded to the bottom end of the extrusion rod. The extrusion head is adapted to the extrusion plate for extrusion.

[0012] Preferably, a second support rod is welded to the upper surface of the rotating cylinder, a baffle plate is welded to the top of the second support rod, a limit frame is welded to the outer surface of the baffle plate, and a roller is rotatably connected to the inner cavity of the limit frame.

[0013] A process for using spacer columns in PCB immersion gold treatment includes the following steps: Step 1: Place the PCB board to be immersion gold treated on the lifting mechanism, then start the lifting mechanism to drive the PCB board for precise positioning, so that the hole area of ​​the PCB board where the partition column needs to be placed is accurately moved to the bottom of the partition column placement device. Step 2: Pour a large number of partitions into the partition placement device. In the initial state, the blocking mechanism extends into the inner cavity of the limiting cylinder to prevent the partitions above from falling, thus achieving temporary storage and queuing of the partitions. Step 3: Control the equipment to lower the top plate of the partition column placement equipment until the lower end of the discharge mechanism gently touches the PCB board surface. At this time, the outlet of the lower end of the extrusion cylinder is aligned with the target hole on the PCB board, and the part of the blocking mechanism that extends into the inner cavity of the limiting cylinder is rotated out, thereby causing the partition column to slide down to the target hole on the PCB board. Step 4: After the partition column is in place, drive the lifting mechanism again and place the new PCB board on the upper surface of the partition column. Repeat the above steps to complete the stringing of several PCB boards.

[0014] This invention provides a board-sequencing separator device and process for PCB board immersion gold treatment. It has the following beneficial effects: I. The PCB board immersion gold treatment equipment and its process, by setting up a lifting mechanism, can precisely drive the PCB board after placing it on its surface, so that the PCB board can be moved to the designated position and placed.

[0015] II. The PCB board immersion gold treatment equipment and its process, by setting up a lifting mechanism, can drive the PCB board after it has been strung to move downward, so that the lifting mechanism only needs to repeatedly position the PCB board to the designated position, and at the same time facilitates the placement of the partition column.

[0016] III. The PCB board immersion gold treatment equipment and its process: By setting up a partition placement device, the partitions that need to be placed can be stored, and after the PCB board is positioned to the designated position, the partitions are positioned and slid down to the position of the holes on the PCB board surface.

[0017] IV. The PCB board immersion gold treatment equipment and its process, by setting up a material discharge mechanism, can be aligned with the holes on the PCB board surface, so that the spacers to be placed can be placed in the holes on the PCB board surface. By setting up a limiting cylinder, the extrusion cylinder can be limited, so that the extrusion cylinder can move on the outer surface of the limiting cylinder.

[0018] V. The PCB board immersion gold treatment equipment and its process, using a PCB board spacer assembly, utilizes limiting posts to limit the rotation of the rotating cylinder, ensuring stable rotation on the outer surface of the limiting posts. An extrusion plate allows the extrusion head to press against the extrusion plate when the limiting cylinder and the extrusion cylinder are close together, thus rotating the rotating cylinder. A barrier plate, when the extrusion plate is horizontal, partially positions itself within the extrusion cylinder's inner cavity, effectively blocking the spacers. A roller, when the barrier plate rotates and disengages from the extrusion cylinder's inner cavity, contacts the spacers above the barrier plate, preventing jamming between the spacers and the barrier plate during rotation. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the external structure of a PCB board immersion gold treatment equipment according to the present invention. Figure 2 This is a schematic diagram of the internal structure of a PCB board immersion gold treatment partition column according to the present invention. Figure 3 This is a schematic diagram of the lifting mechanism structure of the present invention; Figure 4 This is a schematic diagram of the lifting mechanism structure of the present invention; Figure 5 This is a partial structural diagram of the lifting mechanism of the present invention; Figure 6 This is a schematic diagram of the partition column placement device of the present invention; Figure 7 This is a partial structural diagram of the partition column placement device of the present invention; Figure 8 This is a schematic diagram of the extrusion state structure of the discharge mechanism of the present invention; Figure 9 This is a schematic diagram of the material discharge mechanism of the present invention in its natural state. Figure 10 This is a schematic diagram of the barrier mechanism of the present invention.

[0020] In the diagram: 1. Base plate; 2. Lifting mechanism; 3. Base; 4. Limiting plate; 5. Lifting mechanism; 6. Partition placement device; 7. Equipment box; 21. Fixed frame; 22. Lateral movement device; 23. Moving plate; 24. Longitudinal movement device; 25. Placement rack; 51. Connecting frame; 52. Stepper motor; 53. Reciprocating lead screw; 54. Limiting sleeve; 55. Partition plate; 56. First sliding sleeve; 57. Placement plate; 58. Coaxial friction wheel assembly; 59. Connecting frame; 510. Fixed ring; 511. Threaded ring; 61. Second sliding sleeve; 62. Top plate; 63. 64. Extrusion frame; 65. Hydraulic cylinder; 66. Discharge mechanism; 67. Storage box; 68. Guide frame; 69. Limiting cylinder; 60. Track ring; 61. Extrusion cylinder; 62. Washer; 63. Sliding block; 64. Barrier mechanism; 655. Extrusion rod; 66. Extrusion head; 67. Support frame; 68. Limiting post; 69. Rotating cylinder; 60. First support rod; 61. Extrusion plate; 62. Spring; 63. Second support rod; 64. Barrier plate; 65. Limiting frame; 65. Roller. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

[0022] like Figures 1-10 As shown, the present invention provides a technical solution: a PCB board immersion gold treatment board stringing column device, including a base plate 1, a base 3 welded to the upper surface of the base plate 1, and a limit plate 4 welded to the side of the upper surface of the base 3. Lifting mechanism 2 is used to lift the PCB board. By setting up lifting mechanism 2, after the PCB board to be strung is placed on its surface, the PCB board can be precisely driven so that the PCB board can be moved to the designated position and placed. Lifting mechanism 5 is used to move the PCB board up and down. By setting the lifting mechanism 5, the PCB board after being strung together can move downward, so that the lifting mechanism 2 only needs to repeatedly position the PCB board to the designated position, and at the same time, it is convenient to place the partition column. The spacer placement device 6 is used to place spacers in the holes on the surface of the PCB board. By setting the spacer placement device 6, the spacers to be placed can be stored, and after the PCB board is positioned in the designated position, the spacers are positioned and slid down to the position of the holes on the surface of the PCB board. The spacer placement device 6 includes a top plate 62, which is movably connected between the opposing surfaces of two limiting plates 4. A discharge mechanism 65 is provided on the outer side of the top plate 62. The discharge mechanism 65 is used to stably position a single spacer at a hole on the upper surface of the PCB board. The discharge mechanism 65 includes a limiting cylinder 653. An extrusion cylinder 655 is slidably connected to the inner cavity of the limiting cylinder 653. An arc-shaped hole is opened on the outer surface of the extrusion cylinder 655. A blocking mechanism 658 is provided at the arc-shaped hole on the outer surface of the extrusion cylinder 655. By setting the discharge mechanism 65, it can be aligned with the hole on the surface of the PCB board, so that the spacer to be placed can be placed in the hole on the surface of the PCB board. By setting the limiting cylinder 653, the extrusion cylinder 655 can be limited, so that the extrusion cylinder 655 can move on the outer surface of the limiting cylinder 653.

[0023] The lifting mechanism 2 includes a fixed frame 21, which is welded to the upper surface of the base plate 1. A horizontal moving device 22 is fixedly connected to the inner wall of the fixed frame 21. A moving plate 23 is fixedly connected to the movable end of the horizontal moving device 22. A vertical moving device 24 is fixedly connected to the upper surface of the moving plate 23. A placement frame 25 is fixedly connected to the movable end of the vertical moving device 24. By setting the horizontal moving device 22, the moving plate 23 and the vertical moving device 24 can be driven to move closer to or further away from the lifting mechanism 5. By setting the vertical moving device 24, the placement frame 25 can be driven to move vertically up and down, thereby adjusting the vertical height of the PCB board placed on the surface of the placement frame 25.

[0024] The lifting mechanism 5 includes a connecting frame 51 and a partition plate 55. The connecting frame 51 is riveted to the upper surface of the base 3. A stepper motor 52 is fixedly connected to the inner wall of the connecting frame 51. A reciprocating screw 53 is mounted on the output end of the stepper motor 52 via a coupling. A limit sleeve 54 is rotatably connected to the top end of the reciprocating screw 53. The partition plate 55 is riveted to the outer surface of the limit plate 4, and the limit sleeve 54 is welded to the lower surface of the partition plate 55. By setting the stepper motor 52, after the power is connected and the switch is turned on, the reciprocating screw 53 at the output end can be rotated, and under control, the reciprocating screw 53 can rotate clockwise or counterclockwise. The clockwise rotation effect, achieved by setting a limiting sleeve 54, can limit the top end of the reciprocating lead screw 53, making the reciprocating lead screw 53 rotate more stably. The lifting mechanism 5 also includes a first sliding sleeve 56, which is slidably connected to the outer surface of the limiting plate 4. The first sliding sleeve 56 is located below the partition plate 55. A placement plate 57 is riveted to the lower surface of the first sliding sleeve 56. Several holes are opened on the side of the placement plate 57. A coaxial friction wheel set 58 is fixedly connected to the holes opened on the side of the placement plate 57. The coaxial friction wheel set 58 has three sets arranged in a row inside. The coaxial friction wheel assembly 58 consists of star-shaped micro-friction wheels evenly distributed within a circular cavity. An outer drive ring drives all planetary friction wheels to rotate synchronously in the same direction via gears. A limiting plate 4 limits the movement of the first sliding sleeve 56, allowing it to move vertically up and down on the outer surface of the limiting plate 4. A placement plate 57 allows the PCB board to be placed on the plate, and it also moves up and down along with the first sliding sleeve 56. The coaxial friction wheel assembly 58, during operation, drives the PCB board and... The lifting beams required for the column series are moved, allowing the lifting beams to pass through the PCB board and the partition column. A connecting frame 59 is riveted to the outer side of the placement plate 57. A fixing ring 510 is welded to the side of the connecting frame 59 away from the placement plate 57. A threaded ring 511 is welded to the inner ring of the fixing ring 510. The threaded ring 511 is threaded to the outer surface of the reciprocating screw 53. By setting the fixing ring 510, the threaded ring 511 can be connected to the connecting frame 59. When the threaded ring 511 moves vertically as the reciprocating screw 53 rotates, it drives the placement plate 57 to move together.

[0025] A second sliding sleeve 61 is riveted to the outer side of the top plate 62. The second sliding sleeve 61 is slidably connected to the outer surface of the limiting plate 4. The second sliding sleeve 61 is located above the partition plate 55. An extrusion frame 63 is riveted to the upper surface of the top plate 62. A hydraulic cylinder 64 is fixedly connected to the inner wall of the partition plate 55. The top end of the movable end of the hydraulic cylinder 64 is welded to the lower surface of the extrusion frame 63. By setting the second sliding sleeve 61 and positioning it above the partition plate 55, the top plate 62 can move vertically up and down between the opposite surfaces of the limiting plate 4, while ensuring that the top plate 62 only moves within a designated area. By setting the hydraulic cylinder 64, the output end of the hydraulic cylinder 64 can move vertically up and down under the operation of the operator, thereby causing the extrusion frame 63 to move vertically up and down. The top plate 62 moves up and down. A storage box 651 is welded to the top of the limiting cylinder 653 and is welded to the inner surface of the top plate 62. A guide frame 652 is welded to the inner wall of the storage box 651. A track ring 654 passes through the outer side of the limiting cylinder 653. A sliding block 657 is riveted to the outer surface of the extrusion cylinder 655 and slidably connected to the inner cavity of the track ring 654. A washer 656 is fixedly connected to the lower surface of the extrusion cylinder 655. By setting the storage box 651, partitions that need to be placed can be stored. By setting the guide frame 652, the partitions can slide into the inner cavity of the storage box 651 while preventing the partitions from leaking out when the storage box 651 shakes up and down. By setting the track ring 654 and... The sliding block 657 allows the extrusion cylinder 655 to move vertically up and down within the inner cavity of the limiting cylinder 653 without relative rotation. The blocking mechanism 658 includes a support frame 6581, which is riveted to the outer surface of the extrusion cylinder 655. A limiting post 6582 is welded to the top of the support frame 6581. A rotating cylinder 6583 is rotatably connected to the outer surface of the limiting post 6582. A first support rod 6584 is riveted to the outer surface of the rotating cylinder 6583. An extrusion plate 6585 is riveted to the end of the first support rod 6584. A spring 6586 is welded to the lower surface of the extrusion plate 6585, and the end of the spring 6586 is welded to the outer surface of the support frame 6581. An extrusion rod 659 is riveted to the outer surface of the limiting cylinder 653. A pressing head 6510 is welded to the bottom of cylinder 59. The pressing head 6510 is adapted to press the pressing plate 6585. By setting a limiting post 6582, the rotating cylinder 6583 can be limited, allowing the rotating cylinder 6583 to rotate stably on the outer surface of the limiting post 6582. By setting the pressing plate 6585, when the limiting cylinder 653 and the pressing cylinder 655 are relatively close, the pressing head 6510 presses the pressing plate 6585, thereby causing the rotating cylinder 6583 to rotate. By setting a spring 6586, the rotating cylinder 6583 can rotate when the pressing head 6510 is not pressing the pressing plate 6585, ultimately keeping the pressing plate 6585 in a horizontal state. A second support rod 6587 is welded to the upper surface of the rotating cylinder 6583.A baffle plate 6588 is welded to the top of the second support rod 6587. A limit frame 6589 is welded to the outer surface of the baffle plate 6588. A roller 6580 is rotatably connected to the inner cavity of the limit frame 6589. By setting the baffle plate 6588, when the extrusion plate 6585 is in a horizontal position, a portion of the baffle plate 6588 is located within the inner cavity of the extrusion cylinder 655, thereby blocking the partition column. By setting the roller 6580, when the baffle plate 6588 rotates and disengages from the inner cavity of the extrusion cylinder 655, the roller 6580 contacts the partition column above the baffle plate 6588, thus preventing the partition column from jamming with the baffle plate 6588 during rotation.

[0026] A process for using spacer columns in PCB immersion gold treatment includes the following steps: Step 1: Place the PCB board to be immersion gold treated on the placement frame 25 of the lifting mechanism 2, start the horizontal moving device 22 and the vertical moving device 24, drive the moving plate 23 and the placement frame 25 to perform precise positioning, so that the hole area of ​​the PCB board where the partition column needs to be placed is accurately moved to the underside of the partition column placement device 6. Step 2: A large number of partitions, usually small cylindrical parts, are poured into the storage box 651 of the partition placement device 6. The partitions enter the limiting cylinder 653 through the guide frame 652. In the initial state, the blocking mechanism 658's blocking plate 6588, under the tension of the spring 6586, partially extends into the inner cavity of the limiting cylinder 653, blocking the partitions above from falling, thus realizing the temporary storage and queuing of the partitions. Step 3: Control the equipment to lower the top plate 62 of the partition column placement device 6 until the lower end of the discharge mechanism 65 gently contacts the PCB board surface. At this time, the outlet of the lower end of the extrusion cylinder 655 is aligned with the target hole on the PCB board. During the descent of the top plate 62, the extrusion cylinder 655 will not move, while the limiting cylinder 653 moves downward on the outer surface of the extrusion cylinder 655. During the process, the extrusion head 6510 extrudes the upper surface of the extrusion plate 6585. During the extrusion, the rotating cylinder 6583 rotates on the outer surface of the limiting column 6582, and finally the part of the barrier plate 6588 located in the inner cavity of the limiting cylinder 653 is separated from the limiting cylinder 653. Without the barrier plate 6588 blocking, the partition column slides down and, under the action of gravity, slides down to the target hole on the PCB board. Step 4: After the partition column is in place, drive the lifting mechanism 2 again and place the new PCB board on the upper surface of the partition column. Repeat the above steps to complete the stringing of several PCB boards.

[0027] Working principle: During use, the PCB board to be immersion gold treated is placed on the placement frame 25 of the lifting mechanism 2. The horizontal moving device 22 and the vertical moving device 24 are started to drive the moving plate 23 and the placement frame 25 to perform precise positioning, so that the hole area of ​​the PCB board where the partitions need to be placed is accurately moved to the underside of the partition placement device 6. A large number of partitions, usually small cylindrical parts, are poured into the storage box 651 of the partition placement device 6. The partitions enter the limiting cylinder 653 through the guide frame 652. In the initial state, the blocking mechanism 658's blocking plate 6588, under the tension of the spring 6586, partially extends into the inner cavity of the limiting cylinder 653, blocking the partitions above from falling, realizing the temporary storage and queuing of the partitions. The stepper motor 52 of the lifting mechanism 5 is started to drive the reciprocating screw 53 to rotate. The threaded ring 511, which is threaded to the reciprocating screw 53, drives the placement plate 57 to descend smoothly through the connecting frame 59. Then, the support is controlled to... The lifting mechanism 2 places the PCB board on the upper surface of the placement plate 57; then the hydraulic cylinder 64 is activated, causing the top plate 62 of the partition placement device 6 to descend until the washer 656 at the lower end of the discharge mechanism 65 gently contacts the surface of the PCB board. At this time, the outlet at the lower end of the extrusion cylinder 655 is aligned with the target hole on the PCB board. As the top plate 62 continues to descend, the limiting cylinder 653 drives the extrusion head 6510 to move downward, thereby causing the extrusion head 6510 to extrude the extrusion plate 6585. When the extrusion plate 6585 is subjected to downward extrusion force, the rotating cylinder 6583 rotates, eventually causing the part of the barrier plate 6588 located in the inner cavity of the extrusion cylinder 655 to detach from the inner cavity of the extrusion cylinder 655. Then the partition slides from the extrusion cylinder 655 and falls to the designated position. Then the coaxial friction wheel group 58 is activated, allowing the lifting beam line to pass through the PCB board and the partition. The steps are repeated to complete the stringing of several PCB boards and partitions.

[0028] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A board-sequencing separator device for PCB immersion gold treatment, characterized in that, include: The base plate (1) has a base (3) welded to its upper surface, a limit plate (4) welded to the side of the upper surface of the base (3), and an equipment box (7) fitted on the outer surface of the base plate (1). Lifting mechanism (2), which is used to lift the PCB board; Lifting mechanism (5), which is used to drive the PCB board to move up and down; A spacer placement device (6) is used to place spacers in holes on the surface of a PCB board; The partition placement device (6) includes a top plate (62), which is movably connected between the opposite surfaces of the two limiting plates (4). The outer side of the top plate (62) is provided with a discharge mechanism (65), which is used to stably position a single partition at a hole on the upper surface of the PCB board. The discharge mechanism (65) includes a limiting cylinder (653), and an extrusion cylinder (655) is slidably connected to the inner cavity of the limiting cylinder (653). An arc-shaped hole is opened on the outer surface of the extrusion cylinder (655), and a blocking mechanism (658) is provided at the arc-shaped hole opened on the outer surface of the extrusion cylinder (655).

2. The PCB board immersion gold treatment equipment according to claim 1, characterized in that: The lifting mechanism (2) includes a fixed frame (21) which is welded to the upper surface of the base plate (1). A horizontal moving device (22) is fixedly connected to the inner wall of the fixed frame (21). A moving plate (23) is fixedly connected to the movable end of the horizontal moving device (22). A vertical moving device (24) is fixedly connected to the upper surface of the moving plate (23). A placement rack (25) is fixedly connected to the movable end of the vertical moving device (24).

3. The PCB board immersion gold treatment equipment according to claim 1, characterized in that: The lifting mechanism (5) includes a connecting frame (51) and a partition (55). The connecting frame (51) is riveted to the upper surface of the base (3). A stepper motor (52) is fixedly connected to the inner wall of the connecting frame (51). A reciprocating screw (53) is installed at the output end of the stepper motor (52) through a coupling. A limit sleeve (54) is rotatably connected to the top end of the reciprocating screw (53). The partition (55) is riveted to the outer surface of the limit plate (4). The limit sleeve (54) is welded to the lower surface of the partition (55).

4. The PCB board immersion gold treatment equipment according to claim 3, characterized in that: The lifting mechanism (5) also includes a first sliding sleeve (56), which is slidably connected to the outer surface of the limiting plate (4). The first sliding sleeve (56) is located below the partition plate (55). A placement plate (57) is riveted to the lower surface of the first sliding sleeve (56). Several holes are opened on the side of the placement plate (57). A coaxial friction wheel set (58) is fixedly connected to the holes on the side of the placement plate (57). The coaxial friction wheel set (58) has three sets of micro friction wheels arranged in a planetary pattern and evenly distributed in a circular cavity. The coaxial friction wheel set (58) is driven by an outer ring drive ring through gears to drive all planetary friction wheels to rotate synchronously in the same direction.

5. The PCB board immersion gold treatment equipment according to claim 4, characterized in that: A connecting frame (59) is riveted to the outer side of the placement plate (57). A fixing ring (510) is welded to the side of the connecting frame (59) away from the placement plate (57). A threaded ring (511) is welded to the inner ring of the fixing ring (510). The threaded ring (511) is threadedly connected to the outer surface of the reciprocating screw (53).

6. The PCB board immersion gold treatment equipment according to claim 4, characterized in that: The outer side of the top plate (62) is riveted with a second sliding sleeve (61), which is slidably connected to the outer surface of the limiting plate (4). The second sliding sleeve (61) is located above the partition (55). The upper surface of the top plate (62) is riveted with an extrusion frame (63). The inner wall of the partition (55) is fixedly connected with a hydraulic cylinder (64), and the top end of the movable end of the hydraulic cylinder (64) is welded to the lower surface of the extrusion frame (63).

7. The PCB board immersion gold treatment equipment according to claim 1, characterized in that: A storage box (651) is welded to the top of the limiting cylinder (653). The storage box (651) is welded to the inner surface of the top plate (62). A guide frame (652) is welded to the inner wall of the storage box (651). A track ring (654) passes through the outer side of the limiting cylinder (653). A sliding block (657) is riveted to the outer surface of the extrusion cylinder (655). The sliding block (657) is slidably connected to the inner cavity of the track ring (654). A washer (656) is fixedly connected to the lower surface of the extrusion cylinder (655).

8. The PCB board immersion gold treatment equipment according to claim 7, characterized in that: The blocking mechanism (658) includes a support frame (6581) riveted to the outer surface of the extrusion cylinder (655). A limit post (6582) is welded to the top of the support frame (6581). A rotating cylinder (6583) is rotatably connected to the outer surface of the limit post (6582). A first support rod (6584) is riveted to the outer surface of the rotating cylinder (6583). An extrusion plate (6585) is riveted to the end of the first support rod (6584). A spring (6586) is welded to the lower surface of the extrusion plate (6585). The end of the spring (6586) is welded to the outer surface of the support frame (6581). An extrusion rod (659) is riveted to the outer surface of the limit cylinder (653). An extrusion head (6510) is welded to the bottom end of the extrusion rod (659). The extrusion head (6510) is extruded and adapted to the extrusion plate (6585).

9. The PCB board immersion gold treatment equipment according to claim 8, characterized in that: The upper surface of the rotating cylinder (6583) is welded with a second support rod (6587), the top end of the second support rod (6587) is welded with a baffle plate (6588), the outer surface of the baffle plate (6588) is welded with a limit frame (6589), and the inner cavity of the limit frame (6589) is rotatably connected with a roller (6580).

10. A PCB board immersion gold treatment board separator device according to any one of claims 1-9 provides a PCB board immersion gold treatment board separator process, characterized in that, Includes the following steps: Step 1: Place the PCB board to be gold-plated on the lifting mechanism (2), then start the lifting mechanism (2) to drive the PCB board to be precisely positioned so that the hole area of ​​the PCB board where the partition column needs to be placed is accurately moved to the underside of the partition column placement device (6). Step 2: Pour a large number of partitions into the partition placement device (6). In the initial state, the blocking mechanism (658) partially extends into the inner cavity of the limiting cylinder (653) to block the partitions above from falling, thereby realizing the temporary storage and queuing of the partitions. Step 3: Control the equipment to lower the top plate (62) of the partition placement device (6) until the lower end of the discharge mechanism (65) gently touches the PCB board surface. At this time, the outlet of the lower end of the extrusion cylinder (655) is aligned with the target hole on the PCB board, and the part of the blocking mechanism (658) that extends into the inner cavity of the limiting cylinder (653) is rotated out, so that the partition slides down to the target hole on the PCB board. Step 4: After the partition column is placed, drive the lifting mechanism (2) again and place the new PCB board on the upper surface of the partition column. Repeat the above work to complete the stringing of several PCB boards.

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