Substrate loading and temporary storage without lifting pins
By combining intermittent air-float substrate support components and lifting components, the problems of uneven heat distribution and low loading and unloading efficiency caused by lifting pins are solved, realizing frictionless movement and efficient handling of the substrate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-20
- Publication Date
- 2026-04-03
AI Technical Summary
In the prior art, the uneven heat caused by the contact between the lifting pin and the substrate, as well as the wasted time during the loading and unloading of the substrate, affect production efficiency and product quality.
Intermittent air-float substrate support and lifting components are adopted. The substrate is supported by the air-float component and the leading edge of the substrate is lifted during movement to avoid collision with the air-float component and achieve frictionless movement.
It improves production efficiency, avoids product defects caused by thermal inhomogeneity, reduces the risk of collision between the substrate and the air-float component, and enhances the stability and throughput of the substrate processing process.
Smart Images
Figure CN121795142A_ABST
Abstract
Description
Background Technology
[0001] In various solid-state electronic device industries, lifting pins are commonly used for loading, unloading, and temporarily storing solid planar substrates. Semiconductor manufacturing and display manufacturing fall into this category. In some cases, thermal effects during processing can lead to problems with the final product, and thermal inhomogeneity caused by the contact between the substrate and the lifting pin can adversely affect the finished product. For example, in display manufacturing processes using inkjet printing, liquid materials are deposited on a substrate, typically forming a thin film less than 100 micrometers thick. In this case, the substrate can be a glass material, fabricated into a large sheet with a thickness of less than 500 micrometers. The liquid is typically cured into a solid layer on the substrate through curing, drying, etc., but thermal inhomogeneity during the curing process can cause pattern defects visible on the display device within the solid layer. In some cases, contact between the lifting pin and the back of the substrate can lead to thermal inhomogeneity that causes such defects. Furthermore, the extension and retraction of the lifting pin is time-consuming, reducing production throughput. Therefore, there is a need for a method and apparatus for loading, unloading, and temporarily storing substrates without the use of lifting pins. Summary of the Invention
[0002] The specific embodiments described herein provide a substrate processing system, including: a temporary storage area having an intermittent air-floating substrate support; a processing area coupled to the temporary storage area, the processing area having the air-floating substrate support; a transfer member for transferring a substrate between the temporary storage area and the processing area; and a lifting member for lifting the leading edge of the substrate as it moves between the temporary storage area and the processing area.
[0003] Other specific embodiments described herein provide a substrate processing method, comprising: supporting a substrate on an intermittent air-float support in a temporary storage area of a processing apparatus; transferring the substrate from the temporary storage area to a processing area; processing the substrate in the processing area; moving the substrate from the processing area to the intermittent air-float support in the temporary storage area; and raising the leading edge of the substrate during the process of moving the substrate from the processing area to the intermittent air-float support to avoid collision between the leading edge of the substrate and the air-float component of the air-float support.
[0004] Other specific embodiments described herein provide a substrate processing system, including: a temporary storage area having an intermittent air-floating substrate support; a processing area coupled to the temporary storage area, the processing area having the air-floating substrate support; a transfer member for transferring a substrate between the temporary storage area and the processing area; and a roller assembly for lifting the leading edge of the substrate as it moves between the temporary storage area and the processing area. Attached Figure Description
[0005] Figure 1A This is a plan view of a substrate processing system according to one specific embodiment.
[0006] Figure 1B for Figure 1A An elevation view of the substrate processing system in the image.
[0007] Figure 1C for Figure 1A A detailed view of a part of the substrate processing system.
[0008] Figure 1D This is a plan view of a substrate processing system according to another specific embodiment.
[0009] Figure 2A This is a plan view of a substrate processing system according to another specific embodiment.
[0010] Figure 2B for Figure 2A An elevation view of the substrate processing system shown.
[0011] Figure 2C This is a plan view of a substrate processing system according to another specific embodiment.
[0012] Figure 3A This is a plan view of a substrate processing apparatus according to another specific embodiment.
[0013] Figure 3B for Figure 3A The image shows an elevation view of the substrate processing system. Detailed Implementation
[0014] This document describes a method and apparatus for loading, unloading, and temporarily storing substrates to be processed without the use of lifting pins. The substrate is placed in an air-floating storage area of a processing system for substrate input and output. The storage area typically uses intermittent air-floating supports with gaps between the air-floating members to engage with an end effector for placing and retrieving the substrate from the support. The end effector typically extends to contact the storage area, moves through the gaps between the air-floating members to place and retrieve the substrate on the air-float, and then withdraws from the storage area. The air-float provides frictionless movement of the substrate along the storage area to the processing chamber of the processing system; however, as the substrate moves on the air-float, the inherent flexibility of the substrate can cause its leading edge to sag at the gaps between the air-floating members, where there is no air cushion supporting the substrate. The degree of sag may be sufficient to cause the leading edge of the substrate to collide with the air-floating members during the substrate's movement toward the air-float.
[0015] Therefore, the lifting component is configured to apply a lifting force to the leading edge of the substrate during the movement of the substrate between the temporary storage area and the processing chamber of the processing system. Figure 1A This is a plan view of a substrate processing system 100 according to one specific embodiment. Figure 1B This is an elevation view of the processing system 100. The processing system 100 has a temporary storage area 102 for substrate input and output, and a processing area 104 coupled and adjacent to the temporary storage area 102. The temporary storage area 102 uses intermittent air-floating substrate supports 106 to support substrates 108 on an air cushion, enabling placement and retrieval of substrates within the temporary storage area 102. The processing area 104 also typically uses air-floating substrate supports 110, allowing substrates 108 to move continuously and frictionlessly between the interiors of the temporary storage area 102 and the processing area 104. The air-floating substrate supports 106 and 110 are typically disposed on, within, or combined with a base structure 111, shown herein as a table-like structure, but any suitable base structure may be used. The base structure 111 is typically located on the ground or floor and provides stable support for the air-floating supports 106 and 110, the lifting member 130, and any support devices.
[0016] A housing 112 encloses the temporary storage area 102 and the processing area 104. The housing 112 can be supported on the base structure 111 or placed independently on the ground or floor. The processing area 104 can perform various processes, such as deposition, heat treatment, radiation treatment, cooling, buffering, or other types of processing. In one type, the processing area 104 is a radiation treatment area where electromagnetic radiation is emitted toward the substrate to modify the substrate material. The processing area 104 of the processing system 100 has an ultraviolet radiation source 115 for exposing the substrate 108 to ultraviolet radiation to solidify the liquid material on the substrate. The substrate 108 is supported on an air cushion in the processing area 104, while the ultraviolet radiation source located above the air-floating substrate support 110 irradiates the substrate.
[0017] The processing system 100 employs a substrate holder 114 as a transfer component, which contacts the substrate 108 at its edge and transfers the substrate 108 between the temporary storage area 102 and the processing area 104, as indicated by arrow 116. The substrate holder 114 may be a vacuum device such as a vacuum chuck, having a flat surface on which a vacuum is applied to firmly adhere the back side of the substrate 108. The substrate holder 114 moves along a guide rail 118 extending in the transport direction of the processing system 100. This transport direction is typically the direction in which the substrate 108 moves between the temporary storage area 102 and the processing area 104 during processing. The substrate holder 114 thus adheres to the substrate 108, and because the substrate is frictionlessly supported by the intermittent air-floating substrate support 106, the holder 114 moves from the temporary storage area 102 to the processing area 104, thereby transferring the substrate from the temporary storage area 102 to the processing area 104. When the substrate 108 traverses the connection between the air-floating substrate support 106 and the air-floating substrate support 110, the air cushions in the temporary storage area 102 and the processing area 104 continuously support the substrate 108 during its movement. The substrate holder 114 can be supported on the guide rail 118 and moved along the guide rail 118 by any convenient method (such as air bearing support and linear magnetic drive).
[0018] The intermittent air-float substrate support 106 has a plurality of air-float members 120 extending in a lateral direction perpendicular to the transport direction, and a plurality of gaps 122 are formed between the air-float members 120. The lateral direction is the direction of substrate movement when substrates are input and output in the temporary storage area 102. The air-float members 120 and gaps 122 are configured to accommodate an end effector 124 of a substrate processor (not shown), which can place and retrieve substrates in the temporary storage area 102. The end effector 124 extends into the processing system 100 in a direction perpendicular to the transport direction, optionally through a door or closure (not shown), and moves through the gaps 122 in a direction perpendicular to both the transport and lateral directions. Thus, the end effector 124 moves between two positions: one position is above the intermittent air-float substrate support 106 (above the support surface 133 of each air-float member 120, see...). Figure 1C Another location is below the support position of the air cushion of the intermittent air-float substrate support 106, where the substrate is placed on the air cushion; however, depending on the volume of the air cushion and the location of the support position, this support position may be below the support surface 133 of each air-float component 120, at the support surface 133 of each air-float component 120, or slightly above the support surface 133 of each air-float component 120. When the end effector 124 moves through the gap 122, the end effector 124 can contact and disengage from the substrate, allowing for substrate placement and retraction without the aid of a lifting pin.
[0019] Substrate 108 is processed in processing zone 104. During processing, substrate holder 114 typically remains in contact with the substrate. However, in some cases, substrate holder 114 may detach from substrate 108 during processing. In such cases, other limiting devices, such as edge limiting devices and / or corner limiting devices (not shown), can be used to maintain the position of substrate 108 during processing. When processing in processing zone 104 is complete, substrate holder 114 moves substrate 108 back to temporary storage zone 102 to be removed from processing system 100. To remove substrate 108 from processing system 100, end effector 124 extends into temporary storage zone 102 located below substrate 108 and moves upward through gap 122 to lift substrate 108 from the air cushion. End effector 124 removes the substrate being processed by withdrawing from processing system 100 while holding the substrate with grippers.
[0020] In many cases, the substrate 108 is relatively thin to provide a degree of flexibility. As the substrate 108 moves from the processing area 104 to the temporary storage area 102, the leading edge of the substrate 108 moves over one of the gaps 122 in the intermittent air-float substrate support 106. This gap 122 may be too large, causing the substrate 108 to bend, which could result in the traveling edge of the substrate 108 colliding with the facing edge of one of the air-float members 120.
[0021] When the substrate moves from the processing area 104 into the temporary storage area 102, the processing system 100 uses a lifting member 130 to lift the edge of the substrate 108. In this case, the lifting device consists of multiple rollers 129 that contact the leading edge of the substrate 108 as it is transferred to the temporary storage area 102, thereby lifting the leading edge of the substrate 108 above the edge of the air-bearing member 120 to avoid collision. Each roller 129 is oriented to rotate about an axis parallel to the lateral direction, so when the substrate 108 contacts the roller, the friction between the substrate edge and back surface and the roller surface causes the roller to rotate in the transport direction, thereby allowing the substrate 108 to slide past the roller and lifting the edge of the substrate above the edge of the air-bearing member 120.
[0022] In the processing system 100, each air-floating member 120 uses three lifting components 130 (shown as rollers 129). However, depending on the size and flexibility of the substrate 108, any convenient and suitable number of lifting components 130 can be used. Furthermore, four air-floating members 120 are visible in the temporary storage area 102 of the processing system 100, but any number of such air-floating members 120 can be used depending on the substrate processor used for placing and retrieving substrates in the temporary storage area 102 of the processing system 100. Specifically, the temporary storage area 102 can be configured to have air-floating members 120, wherein the number of gaps 122 provided by the air-floating members 120 is greater than the number of grippers on the end effector of a particular substrate processor. This configuration enables the processing of substrates of different sizes in the processing system 100. For example, a substrate processor with two grippers can be used to process smaller substrates, but the buffer area 102 of system 100 may have four gaps, so the substrate processor can use two of these gaps to place and retrieve the small substrate in the buffer area 102. Another substrate processor with a four-gripper end effector can also utilize all four gaps to place and retrieve larger substrates in the buffer area 102. In this way, the buffer area 102 of processing system 100 can process substrates of different sizes.
[0023] Rollers 129, serving as lifting members 130 in system 100, are disposed at the trailing edge of the air-float member 120 having the lifting members 130. When the substrate is transferred to the temporary storage area 102 and approaches the air-float member 120, the substrate first passes over a first edge of the air-float member 120. This first edge of the air-float member 120 can be referred to as the leading edge. When the substrate 108 is further transferred to the temporary storage area 102, the substrate passes over a second edge of the air-float member 120. This second edge can be referred to as the trailing edge. The lifting member 130 is located at the trailing edge of the air-float member 120 to lift the leading edge of the substrate 108 when the substrate is transferred over the gap 122.
[0024] Figure 1C A detailed diagram of a portion of the processing system 100. Figure 1C The image shows substrate 108 moving from processing area 104 to temporary storage area 102, as indicated by arrow 131. Substrate 108 is shown extending above gap 122, where there is no air cushion support. As shown, the leading edge 132 of substrate 108 bends downwards without support, while the main body of substrate 108 is still supported by lifting members 130 at the edge of processing area 104 and the air buoyancy of processing area 104 (shown as a cloud-like pattern). Figure 1CIn the illustrated scenario, if the substrate 108 does not receive additional support from the lifting member 130 at the edge of the processing area 104 when it enters the temporary storage area 102, the leading edge 132 of the substrate 108 risks colliding with the first edge 140 of the air levitation member 120 of the temporary storage area 102. Therefore, the function of the lifting member 130 is to maintain the height of the substrate 108 so that the leading edge 132 of the substrate 108 extends above the air levitation member 120 without colliding with the first edge 140 of the air levitation member 120. When the substrate 108 extends above the air levitation member 120, the air cushion of the temporary storage area 102 supports the portion of the substrate 108 extending above the air levitation member 120, thus at least partially alleviating the bending of the substrate 108. As the substrate 108 moves across the air levitation member 120, the leading edge 132 is lifted to contact the lifting member 130 coupled to the air levitation member 120 at the second edge 145 opposite the first edge 140 of the air levitation member 120. Then, when the substrate 108 extends out of the lifting member 130 of the air levitation member 120 at the second edge 145 and the leading edge 132 of the substrate 108 extends over the gap (not shown) of the air levitation member 120, the lifting member of the air levitation member 120 will provide support for the substrate 108 to avoid any possibility of the substrate 108 subsequently colliding with the air levitation member.
[0025] The lifting member 130 is shown protruding above the support surface 133 of the air flotation member 120 to support the substrate 108 at a specified height, preventing the leading edge 132 of the substrate 108 from contacting the first edge 140 of the air flotation member 120. In this case, the lifting member 130 is a roller protruding above the support surface 133 and entering the gap 122. This roller rotates about an axis 134, which is shown in dashed lines, because the roller is located in a groove 136 formed within the edge of the air flotation member. Figure 1A The shaft 134 can be embedded in the wall of the groove 136, so that the roller can be passively rotated when it contacts the back of the substrate 108.
[0026] like Figure 1CAs shown, the roller (heightening member 130 in this example) protrudes above the support surface 133 of the air levitation member 120 by a first distance 138. The air cushion of the temporary storage area 102 supports the substrate at the support position 142 by a second distance 143 above the support surface 133, where the second distance 143 is greater than the first distance 138. When the substrate 108 is fully supported by the air cushion of the temporary storage area 102, the substrate 108 may not contact the lifting member 130 because the support distance between the substrate and the support surface 133 may be greater than the first distance 138. When the substrate 108 moves from the processing area 104 to the temporary storage area 102, the leading edge 132 of the substrate 108 extends above the gap 122 and, due to the flexibility of the substrate 108, may bend downwards toward the gap 122. Without the additional support of the lifting member 130, the leading edge 132 of the substrate 108 may be at risk of colliding with the first edge 140 of the air levitation member 120. The lifting member 130 provides additional support for the substrate 108 to ensure that the leading edge 132 of the substrate 108 does not collide with the first edge 140 of the air buoyancy member 120. Each air buoyancy member 120 has a lifting member 130, thereby providing support for the substrate 108 at the edge of the air buoyancy member 120 when the leading edge 132 of the substrate 108 extends over the gap 122 adjacent to the lifting member 130.
[0027] The lifting component 130 can be driven to start ( Figure 1B Actuator 144 can be connected to all lifting components 130 of the processing system 100 to adjust the position of the lifting components 130 so that they can approach the substrate 108 and be approached by the end effector, thereby avoiding conflict between the end effector and the lifting components 130. Actuator 144 can retract the lifting components 130 vertically or horizontally, or both, to maximize the space for the end effector to access the clearance 122, and can extend the lifting components 130 vertically or horizontally, or both, during the movement of the substrate 108 to prevent the substrate 108 from colliding with the air flotation member 120.
[0028] The actuator 144 is enclosed in a housing 146 to minimize any particulate matter diffusion that may occur due to the operation of the actuator 144. The housing 146 may be coupled to a gas delivery device 148 (e.g., a blower or vacuum device) to allow gas to move through the housing 146, thereby removing particulate matter that may have accumulated within the housing 146 due to the operation of the actuator 144.
[0029] The processing system 100 has a lifting member 130 that protects only one edge of the air flotation member 120, because the risk of collision only occurs when the substrate 108 moves in a single direction. Figure 1DThis is a plan view of a processing system 150 according to another specific embodiment. The processing system 150 has two processing zones 104A and 104B respectively disposed on either side of a temporary storage area 102. A substrate can be moved to processing zone 104A, processing zone 104B, or both processing zones; therefore, in the processing system 150, as indicated by arrow 154, the substrate moves in two opposite directions within the temporary storage area 102. In the processing system 150, the potential for collision between the substrate and the air flotation member 120 exists at the two opposite edges of the air flotation member 120. Therefore, the processing system 150 provides lifting members 130 at the two opposite edges of each air flotation member 120. The lifting members 130 of the processing system 150 can be driven, like the lifting members 130 of the processing system 100, to achieve vertical retraction, horizontal retraction, or both, thereby allowing the end effector to enter the gap 122.
[0030] Figures 1A-1D The roller-type lifting components shown are presented in sets of three. That is, each edge of the air levitation member 120, which may collide with the travel edge of the substrate, has three rollers 129. In other cases, any suitable number of such rollers can be used depending on the system size and substrate characteristics. If the substrate is quite flexible, more rollers 129 can be used as the lifting component. Furthermore, the rollers 129 here are narrow and wheel-shaped, but in some cases, thicker rollers resembling slender cylinders can also be used. If the substrate is highly thermally sensitive, it is preferable to minimize the contact area between the rollers 129 and the back of the substrate. If the substrate is less thermally sensitive, the substrate can be adapted to thicker, more cylindrical rollers.
[0031] The lifting component 130 need not be a roller, and it does not need to contact the substrate at all. Figure 2A This is a plan view of a processing system 200 according to another specific embodiment employing different lifting components. The processing system 200 and... Figure 1A The processing system 100 is generally similar, but has a different lifting member 130. In this case, the lifting member 130 is a plurality of air flotation assemblies located below the air flotation member 120, used to guide airflow into the gap 122, thereby providing support for the portion of the substrate 108 extending above the gap 122. In this case, the air flotation member constituting the lifting member 130 is an elongated air flotation member stretched in a direction perpendicular to the substrate transfer direction, and may be in the form of an air rod parallel to the air flotation member 120 and substantially aligned with the gap 122.
[0032] Figure 2BThis is an elevation view of the processing system 200. The lifting member 130 of the processing system 200 is an air-bearing member extending parallel to and aligned with the gap 122, as shown. It is located below the air-bearing member 120, thus providing an end effector with a passage to enter and pass through the gap 122 for placing and retrieving a substrate, such as substrate 108. As shown, substrate 108 is partially located in the processing area 104 and partially in the temporary storage area 102. Actuator 202 is coupled to a pneumatic rod that acts as the lifting member 130 of the processing system 200 to lift the pneumatic rod above the gap 122 when the substrate 108 is moved from the processing area 104 to the temporary storage area 102, thereby supporting the leading edge of substrate 108 as it traverses each gap 122, preventing the leading edge of substrate 108 from falling and colliding with the air-bearing member 120. When the substrate 108 is positioned for removal from the storage area 102 by the end effector, the lifting member 130 can be lowered to clear the gaps 122, allowing the end effector to enter and pass through these gaps 122, thereby lifting the substrate 108 away from the air cushion support of the air flotation member 120. The lifting member 130 of the vertical drive processing system 200 provides gas support during the movement of the substrate 108 and can retract to clear the gaps 122 for use by the end effector.
[0033] Similar to the configuration of processing system 100, the actuator 202 of processing system 200 can be enclosed in housing 204 to control particulate matter that may be formed due to the movement of lifting member 130 driven by actuator 202. Housing 204, shown here, has an extension structure extending into gap 122 to provide a passage for lifting member 130 to extend into gap 122. An air delivery device 206 can also be coupled to housing 204 to exhaust air through housing 204, thereby discharging particulate matter formed due to the operation of actuator 202.
[0034] Figure 2C This is a plan view of a processing system 250 according to another specific embodiment. Similar to processing system 200, processing system 250 uses an air flotation member 251 as a lifting member 130; however, in processing system 250, the air flotation member 251 is an elongated member that extends along the conveying direction and is perpendicular to the air flotation member 120 of the temporary storage area 102. In this example, the air flotation member 251 of the lifting member 130 extends along almost the entire length of the temporary storage area 102 below the air flotation member 120 of the temporary storage area 102, and at least below all gaps 122 of the temporary storage area 102.
[0035] In another specific embodiment, the lifting component may come into contact with the front side (or working surface) of the substrate as it moves toward the air flotation member to lift its leading edge. Figure 3AThis is a plan view of a processing system 300 according to another specific embodiment. The processing system 300 has a lifting member 130 disposed above a temporary storage area 102, which is movable from a position near the processing area 104 to a position near the other end of the temporary storage area 102 opposite to the processing area 104. The lifting member 130 is a vacuum device that contacts the leading edge of a substrate 108 on a working surface in a non-working area of the substrate 108 and applies a vacuum to this non-working area, thereby firmly attaching the substrate 108 to the leading edge of the working surface of the substrate 108.
[0036] There is a support structure 302 on each side of the substrate support 106, which supports the adsorption member 304 with adsorption device 306; the adsorption device 306 is shown in dashed lines here because it is located on the lower surface of the adsorption member 304. The adsorption device 306 contacts the leading edge of the substrate 108 and adsorbs it by applying a vacuum. An actuator (not shown) coupled to the adsorption member 304 moves the vacuum device 306 up and down to raise the leading edge of the substrate 108 as it travels in the transport direction. The adsorption member 304 is driven to move along the support structure 302 in the transport direction so that the adsorption member 304 is positioned so that the adsorption device 306 can contact and adhere to the leading edge of the substrate 108. The support structure 302 may include two guide rails 308, which are arranged laterally on both sides of the substrate support 106, each extending in the transport direction. An upright plate (not shown) connects the two ends of the adsorption member 304 to the corresponding guide rail 308. These uprights are configured to move along guide rail 308 (by using suitable bearings) to position the adsorption member 304 in a position that facilitates contact with the leading edge of the substrate 108 before the substrate travels significantly into the temporary storage area 102.
[0037] The upright plate is driven to move along guide rail 308 to an initial position at the junction of temporary storage area 102 and processing area 104. When it is necessary to transfer substrate 108 from processing area 104 to temporary storage area 102, adsorption device 306 is driven to extend downward and contact the leading edge of substrate 108 using vacuum, thereby adsorbing the leading edge. Vacuum can be transmitted to adsorption device through suitable conduits (not shown), such conduits being arranged along substrate support 106. Once in contact with the leading edge of substrate 108, adsorption device 306 is driven to rise and lift the leading edge of substrate 108. Subsequently, substrate 108 can be transferred to temporary storage area 102.
[0038] The substrate 108 can be transferred using a substrate holder 114, which vacuum-adsorbs the bottom surface of the substrate 108. In this case, the adsorption member 304 can be passively supported above the guide rail 308 by a vertical plate, so that the adsorption member 304 is pulled along the guide rail 308 as the substrate 108 moves. Alternatively, while the adsorption member 304 adsorbs the substrate 108, the vertical plate is driven to transfer the adsorption member 304 from the processing area to the temporary storage area 102. In this case, the substrate holder 114 can move along with the substrate 108 while adsorbing it, or the substrate holder 114 can separate from the substrate 108 as the adsorption member 304 moves along the guide rail 308. In some cases, the substrate holder 114 and the guide rail 118 can be omitted from the device 300, and thus the transfer of the substrate between the temporary storage area 102 and the processing area 104 can be completed using the adsorption member 304. In such cases, the adsorption member 304 needs to be positioned near the location where the leading edge of the substrate 108 will be placed when the end effector 124 places the substrate 108 in the temporary storage area 102. Once the substrate 108 is in place, the adsorption device 306 can extend downwards to adsorb the leading edge of the substrate 108 via vacuum. Since the adsorption device 306 contacts the front surface (i.e., the working surface) of the substrate 108 and is located outside the working area near the edge of the substrate 108, the adsorption device 306 can contact the substrate 108 when it contacts the end effector 124, or after the end effector 124 places the substrate on the air cushion of the air flotation member 120. If the adsorption device 306 contacts the substrate 108 before it disengages from the end effector 124, the positioning device for placing the substrate 108 on the air cushion after the end effector 124 disengages from the substrate 108 can be simplified. Once in contact with the substrate 108, the adsorption member 304 can move to the position where the temporary storage area 102 intersects with the processing area 104, thereby transferring the substrate 108 into the processing area 104.
[0039] When the substrate is transferred from the temporary storage area 102 to the processing area 104, the leading edge of the substrate 108 can be lifted without retracting the adsorption device 306. This is because, when the end effector 124 places the substrate on the air cushion, the position of the substrate 108 ensures that any edge of the substrate 108 will not collide with the air flotation component when it is moved to the processing area 104. To move the substrate 108 back to the temporary storage area 102, the adsorption device 306 can be retracted to lift the leading edge of the substrate 108. The adsorption device 306 can be held in contact with the substrate 108 by vacuum until the substrate 108 contacts the end effector 124. At this point, the adsorption device 306 can be separated from the substrate 108, and the substrate can be removed from the device 300 by retracting the end effector 124 from the housing 112.
[0040] Figure 3BThis is an end elevation view of the processing system 300. Consistent with other embodiments described herein, the processing system 300 includes a housing 310 enclosing the temporary storage area 102 and the processing area 104. Here, the radiation source 115 is supported within the processing area 104 by a vertical plate 314 extending from the base structure 111, while the housing 310 is separately mounted on the floor. The vertical plate 314 can be fixed to the base structure 111, or the radiation source 115 can be moved by driving the vertical plate 314, for example by moving the vertical plate 314 along a guide rail (not shown) coupled to the base structure 111.
[0041] An adsorption device 306 extends from an adsorption member 304, which is supported by a crossbeam 312 coupled to a vertical plate 314. The vertical plate 314 is coupled by a vertical plate actuator 316 to a guide rail (not shown) disposed on the base structure 111, wherein the vertical plate actuator 316 can be any suitable linear actuator, for moving the vertical plate 314 along the base structure 111 in the conveying direction. In this case, a first vertical plate 314A is located on a first side of the temporary storage area 102 in the lateral direction and coupled to a first guide rail (not shown) disposed on the base structure 111, while a second vertical plate 314B is located on a second side of the temporary storage area 102 in the lateral direction and coupled to a second guide rail (not shown) on the base structure 111. Here, the first and second guide rails are shielded by the vertical plate actuator 316. The first vertical plate 314A can be a first set of vertical plates 314, and the second vertical plate 314B can be a second set of vertical plates 314. The first upright plate 314A is located near the edge of the base structure 111 and between the edge of the base structure 111 and the substrate holder 114. Therefore, in this case, the base structure 111 provides or is coupled to two guide structures, namely the guide rail 118 for the substrate holder 114 and the guide rail for the upright plate 314.
[0042] The adsorption member 304 is supported on the crossbeam 312 by one or more lifting actuators 318. Operating the lifting actuators moves the adsorption member 304 closer to or further away from the substrate 108, allowing the adsorption device 306 to contact and separate from the substrate 108. When the lifting actuator 318 moves the adsorption member 304 closer to the substrate, the end suction cup 320 of the adsorption device 306 contacts the substrate 108. A vacuum can be applied to the end suction cup 320 using fluid conduits disposed in the adsorption device 306, the adsorption member 304, and / or the crossbeam 312, or a separate fluid conduit (such as a hose) can be used to apply a vacuum to the end suction cup 320. Once in contact with the substrate 108, the vacuum applied to the end suction cup 320 causes the end suction cup 320 to adhere to the substrate 108. The lifting actuator 318 can then be operated to lift a portion of the substrate 108 (here, the leading edge in the transport direction).
[0043] The lifting component 130 of the processing system 300 can be substantially encapsulated by the housing 322. The housing 322 can be configured to control any particulate matter or other impurities that may be generated during the operation of the adsorption device (including the vertical plate actuator 316, vertical plate 314, crossbeam 312, lifting actuator 318, adsorption member 304, and adsorption device 306) of the lifting component 130 in the processing system 300. An opening 324 can be provided on the facing surface 326 of the housing 322 towards the air flotation support 106, allowing the end suction cup 320 of the adsorption device 306 to extend from the housing 322 and contact the substrate 108. When the adsorption device 306 is not in contact with the substrate 108, it can be completely retracted into the housing 322. The housing 322 can be emptied by using a suitable blowing device to push gas through its interior or by using a vacuum device to extract gas from its interior. The flow path for gas to enter housing 322 may include opening 324 and any other suitable openings, inlets and outlets (not shown).
[0044] Consistent with other embodiments described herein, the number of adsorption devices 306 used to adsorb and lift the edges of the substrate can be adjusted as needed. Any number of such adsorption devices 306 can be used depending on the size and hardness of the substrate 108. Furthermore, as described above, in some embodiments, the lifting member 130 (here referring to an adsorption device including the adsorption devices 306, adsorption member 304, crossbeam 312, lifting actuator 318, and upright actuator 316, optionally including a housing 322) can be used to position the substrate 108 for processing, thereby eliminating the need for the substrate holder 114 and guide rail 118. In such cases, the upright actuator 316, along with the rest of the adsorption device, can be a transfer member for the processing system 300, or a transfer member other than the lifting member.
[0045] The processing system described herein reduces the risk of substrate collision when using intermittent air flotation supports to support substrates in a processing system. When a substrate moves along the intermittent air flotation support and its edge approaches the edge of the air flotation member within the support, a lifting member can temporarily lift the leading edge of the substrate as it approaches the edge of the air flotation member, thereby preventing collision between the leading edge of the substrate and the edge of the air flotation member. Lifting can be achieved by applying a force above or below the substrate, or on the back side of the substrate (e.g., in roller 129 or air flotation member 201), or on the front side of the substrate (e.g., in adsorption device 306). Using the lifting member in this manner eliminates the processing risks associated with the movement of sheet-like substrates along the intermittent air flotation support.
[0046] The foregoing describes one or more specific embodiments of the present invention. Other specific embodiments of the invention not specifically described in this disclosure may be devised without departing from the basic scope of protection of the invention as defined by the appended claims.
Claims
1. A substrate processing system, comprising: A temporary storage area with intermittent air-float substrate support; A processing area coupled to the temporary storage area, the processing area having an air-float substrate support; A transfer component for transferring a substrate between the temporary storage area and the processing area; as well as A lifting member for lifting the leading edge of the substrate during the movement of the substrate between the temporary storage area and the processing area.
2. The substrate processing system according to claim 1, wherein: The intermittent air flotation substrate support includes a plurality of generally parallel and elongated air flotation members, each air flotation member having an air flotation surface with an opening for gas flow to form an air cushion at the air flotation surface, and the plurality of air flotation members defining a plurality of gaps between adjacent air flotation components.
3. The substrate processing system according to claim 2, wherein: The processing system has a conveying direction along which the substrate moves during processing, and a transverse direction perpendicular to the conveying direction of the substrate, along which the substrate moves during input and output of the substrate, and the air flotation assembly extends along the transverse direction.
4. The substrate processing system according to claim 3, wherein: The transfer component is a vacuum clamp, which contacts the edge of the substrate and is adsorbed onto the substrate by vacuum.
5. The substrate processing system according to claim 3, wherein: The lifting component consists of multiple passive rollers, which are attached to the air flotation member and protrude beyond the air flotation surface.
6. The substrate processing system according to claim 3, wherein: The lifting component is configured to apply a lifting force to the back side of the substrate.
7. The substrate processing system according to claim 3, wherein: The lifting component is configured to apply a lifting force to the front side of the substrate.
8. The substrate processing system according to claim 3, wherein: The lifting component includes a plurality of adsorption devices for contacting the front side of the substrate.
9. The substrate processing system according to claim 1, wherein: The lifting component is an adsorption device for applying a lifting force to the front side of the substrate. The adsorption device includes multiple adsorption units, which are supported by a vertical plate coupled to a vertical plate actuator. The vertical plate actuator is a transfer component for transferring the substrate.
10. The substrate processing system according to claim 3, wherein: The plurality of air flotation components constitute a first group of air flotation components, while the lifting component constitutes a second group of air flotation components, the direction of which is perpendicular to the first group of air flotation components.
11. A method for processing a substrate, comprising: In the temporary storage area of the processing equipment, the substrate is supported on an intermittent air flotation support. The substrate is transferred from the temporary storage area to the processing area; The substrate is processed within the processing area; The intermittent air-float support member for transferring the substrate from the processing area to the temporary storage area; as well as During the process of transferring the substrate from the processing area to the temporary storage area, the leading edge of the substrate is raised to avoid collision between the leading edge of the substrate and the air-bearing component of the air-bearing support.
12. The method according to claim 11, wherein: Lifting the leading edge of the substrate involves applying a lifting force to the back or front side of the substrate.
13. The method according to claim 12, wherein: Lifting the leading edge of the substrate involves applying a lifting force to the back side of the substrate by using rollers to contact the substrate.
14. The method of claim 11, wherein: Transferring the substrate from the temporary storage area to the processing area, and transferring the substrate from the processing area to the temporary storage area, includes attaching a substrate holder to the substrate using a vacuum.
15. The method according to claim 11, wherein: Lifting the leading edge of the substrate involves applying a lifting force to the front side of the substrate.
16. The method of claim 11, wherein: Supporting the substrate on an air-float support includes: supporting the substrate on an air-float support in the temporary storage area, and supporting the substrate on different air-float supports in the processing area.
17. The method of claim 13, wherein: The rollers are driven to extend and retract.
18. The method of claim 17, wherein: The intermittent air-bearing support of the temporary storage area defines a plurality of gaps and further includes allowing the gripper of the end effector to pass through the gaps in order to place or retrieve a substrate in the temporary storage area.
19. A substrate processing system, comprising: A temporary storage area with intermittent air-float substrate support; A processing area coupled to the temporary storage area, the processing area having an air-float substrate support; A transfer component for transferring a substrate between the temporary storage area and the processing area; as well as A roller assembly for lifting the leading edge of the substrate as it moves between the temporary storage area and the processing area.
20. The substrate processing system according to claim 19, wherein: The intermittent air-float substrate support defines multiple gaps, allowing the grippers of the substrate processor to pass through the gaps for placing and retrieving the substrate in the temporary storage area, and the roller assembly includes multiple rollers that are driven to extend into and retract from the gaps.