Substrate holding device, bonding device, substrate holding method and bonding method

Abstract

A substrate holding device (100) is provided with a holding mechanism (110) and a deformation mechanism (170). The holding mechanism (110) sucks and holds the substrate (W). The deformation mechanism (170) deforms the holding mechanism (110). The holding mechanism (110) has a jig (130) and a base (120) to which the jig (130) is attached. The jig (130) has a holding surface (130a), and the holding surface (130a) holds the back surface (Wb) of the substrate (W). The deformation mechanism (170) deforms the jig (130) so that the holding surface (130a) can achieve both a convex shape in which the center of the holding surface (130a) protrudes toward the substrate (W) side and a concave shape in which the center of the holding surface (130a) is concave toward the susceptor (120) side.

Description

Technical Field

[0001] This invention relates to a substrate holding device, a bonding device, a substrate holding method, and a bonding method. Background Technology

[0002] Conventionally, a substrate holding device for holding a substrate is known. Furthermore, a bonding device (see, for example, Patent Document 1) is known, comprising: an upper substrate holding device for holding the substrate; and a lower substrate holding device for holding the substrate. Patent Document 1 describes a bonding system for bonding an upper wafer and a lower wafer. The bonding system comprises: a first holding portion for holding the upper wafer; and a second holding portion for holding the lower wafer. The first holding portion has an upper clamp for holding the upper wafer. The second holding portion has a lower clamp for holding the lower wafer.

[0003] In the bonding system of Patent Document 1, the upper wafer and the lower wafer are bonded with the upper clamp deformed downwards and the lower clamp deformed upwards. That is, the upper wafer and the lower wafer are bonded with the device forming surface of the upper wafer deformed downwards and the device forming surface of the lower wafer deformed downwards.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2020-53685 Summary of the Invention The problem the invention aims to solve However, this can cause warping in the wafer. Specifically, the device formation surface of the wafer typically becomes either a convex shape or a concave shape. However, when the device formation surface of the wafer becomes, for example, a concave shape, if the device formation surface is deformed into a convex shape as described in Patent Document 1, the wafer deforms from a concave shape to a convex shape to a large extent. In this case, there is a problem of increased stress applied to the wafer. Therefore, this may adversely affect the characteristics of the devices formed on the wafer.

[0005] Furthermore, not in the bonding system of Patent Document 1, but in a typical bonding system, the holding surface located below the upper clamp and the holding surface located above the lower clamp are generally flat. However, there is a situation where, as the wafer is held by the upper and lower clamps, stress is applied to the wafer as it deforms from a warped state to a flat state, thereby adversely affecting the characteristics of the components formed on the wafer.

[0006] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that can suppress stress applied to a substrate.

[0007] means for solving problems A first aspect of the present invention is a substrate holding device comprising a holding mechanism and a deformation mechanism. The holding mechanism adsorbs and holds a substrate. The deformation mechanism deforms the holding mechanism. The holding mechanism has a clamp and a base, the clamp being mounted on the base. The clamp has a holding surface that holds one side of the substrate. The base is disposed on the opposite side of the holding surface of the clamp. The deformation mechanism deforms the clamp in such a way that the holding surface can achieve both a convex shape and a concave shape; the convex shape is a shape in which the center of the holding surface protrudes towards the substrate side, and the concave shape is a shape in which the center of the holding surface is recessed towards the base side.

[0008] In one embodiment, a control unit is provided to control the deformation mechanism. The control unit acquires warpage information indicating at least a warpage direction of the substrate. Based on the warpage information, the control unit deforms the clamp via the deformation mechanism in a manner that causes the holding surface to become the convex shape or the concave shape, and holds the substrate via the holding mechanism.

[0009] In one embodiment, the substrate has a front side and a back side, the back side being the front side. The front side is a device forming surface. The back side is a non-device forming surface and is located opposite the front side. When the warpage information indicates that the substrate has a substrate recessed shape, the control unit deforms the clamp via the deformation mechanism in a manner that causes the holding surface to become the recessed shape, and holds the back side of the substrate via the holding mechanism. The substrate recessed shape indicates a shape in which the front side is recessed towards the back side and the back side protrudes towards the opposite side of the front side.

[0010] In one embodiment, after the control unit makes the center of the holding surface contact the center point of the back side of the substrate, the deformation mechanism forms the holding surface into the recessed shape and makes the curvature of the holding surface greater than the curvature of the substrate.

[0011] In one embodiment, the deformation mechanism has a movable body fixed to the center of the clamp. The movable body moves relative to the base along an opposing direction between the clamp and the base.

[0012] In one embodiment, the movable body includes a tube having a through hole connected to the retaining surface. The through hole is an attraction hole for attracting the side of the substrate.

[0013] In one embodiment, a partition wall is provided that divides the space between the clamp and the base into a plurality of spaces. The partition wall extends from the clamp toward the base. The base has an insertion hole into which a portion of the partition wall is inserted. With the retaining surface planar, a portion of the partition wall is inserted into the insertion hole. The insertion hole has a region into which the partition wall can be further inserted into the interior of the insertion hole. The region is defined by the front end face of the partition wall and the inner surface of the insertion hole.

[0014] A second aspect of the present invention is a bonding apparatus for bonding a first substrate and a second substrate. The bonding apparatus includes a first substrate holding device and a second substrate holding device. The first substrate holding device holds the first substrate. The second substrate holding device is disposed opposite to the first substrate holding device and holds the second substrate. The first substrate holding device includes: a first holding mechanism for adsorbing and holding the first substrate; and a first deformation mechanism for deforming the first holding mechanism. The first holding mechanism includes: a first clamp having a first holding surface that holds one side of the first substrate; and a first base disposed on the opposite side of the first holding surface of the first clamp and on which the first clamp is mounted. The first deformation mechanism deforms the first clamp in such a way that the first holding surface can achieve both a convex shape and a concave shape, wherein the convex shape is a shape in which the center of the first holding surface protrudes towards the first substrate side, and the concave shape is a shape in which the center of the first holding surface is recessed towards the first base side.

[0015] In one embodiment, the second substrate holding device includes: a second holding mechanism for adsorbing and holding the second substrate; and a second deformation mechanism for deforming the second holding mechanism. The second holding mechanism includes: a second clamp having a second holding surface that holds one side of the second substrate; and a second base disposed on the opposite side of the second holding surface of the second clamp, and on which the second clamp is mounted. The second deformation mechanism deforms the second clamp in such a way that the second holding surface can achieve both a convex shape and a concave shape. The convex shape is a shape in which the center of the second holding surface protrudes towards the second substrate side, and the concave shape is a shape in which the center of the second holding surface is recessed towards the second base side.

[0016] In one embodiment, the first substrate holding device and the second substrate holding device attach the first substrate and the second substrate with one of the first holding surface and the second holding surface being formed in the convex shape and the other of the first holding surface and the second holding surface being formed in the concave shape.

[0017] In one embodiment, the maximum curvature of the convex shape of the first retaining surface is greater than the maximum curvature of the concave shape of the first retaining surface.

[0018] A third aspect of the present invention is a substrate holding method, comprising: a step of preparing a substrate; and a step of deforming a clamp having the holding surface in such a way that a holding surface that adsorbs and holds one side of the substrate becomes concave, and holding the substrate by the clamp. The concave shape refers to a shape in which the center of the holding surface is concave towards the opposite side of the substrate.

[0019] The fourth aspect of the present invention is a bonding method, comprising the following steps: preparing a first substrate; deforming a first clamp having the first holding surface in such a way that a first holding surface adsorbing and holding one side of the first substrate becomes concave, and holding the first substrate by the first clamp; adsorbing and holding one side of a second substrate by a second holding surface of a second clamp; and bonding the first substrate and the second substrate with the first holding surface formed into the concave shape and the second holding surface facing the first holding surface formed into a convex shape. The concave shape of the first holding surface refers to a shape in which the center of the first holding surface is concave towards the opposite side of the first substrate. The convex shape of the second holding surface refers to a shape in which the center of the second holding surface protrudes towards the second substrate.

[0020] Invention Effects According to the present invention, a substrate holding device, a bonding device, a substrate holding method, and a bonding method capable of suppressing stress applied to a substrate can be provided. Attached Figure Description

[0021] Figure 1 A side view is shown to schematically illustrate the overall structure of the substrate holding device of the first embodiment.

[0022] Figure 2 A cross-sectional view of the substrate holding device according to the first embodiment is shown schematically.

[0023] Figure 3 A top view schematically showing the clamp of the substrate holding device according to the first embodiment.

[0024] Figure 4 For along Figure 3 A schematic cross-sectional view of line IV-IV, showing the support pin in its protruding position.

[0025] Figure 5 For along Figure 3 A schematic cross-sectional view of line IV-IV, showing the support pin in a non-protruding position.

[0026] Figure 6 A cross-sectional view schematically showing the state in which the holding surface of the clamp of the substrate holding device of the first embodiment becomes a convex shape.

[0027] Figure 7 A cross-sectional view schematically showing the state in which the holding surface of the clamp of the substrate holding device of the first embodiment becomes concave.

[0028] Figure 8 This is a block diagram illustrating the configuration of the substrate holding device according to the first embodiment.

[0029] Figure 9 A flowchart illustrating the substrate holding method of the substrate holding apparatus according to the first embodiment.

[0030] Figure 10 This is a schematic cross-sectional view illustrating a method for holding a substrate whose front side has become convex in shape using a substrate holding device.

[0031] Figure 11 This is a schematic cross-sectional view illustrating a method for holding a substrate whose front surface has become concave using a substrate holding device.

[0032] Figure 12 A side view of the bonding device according to the second embodiment is shown schematically.

[0033] Figure 13 A cross-sectional view is shown schematically of the first substrate holding device and the second substrate holding device of the bonding apparatus of the second embodiment.

[0034] Figure 14 A cross-sectional view of the second substrate holding device is shown schematically, and a diagram showing the support pin in the protruding position is also shown.

[0035] Figure 15 A block diagram illustrating the configuration of the bonding device according to the second embodiment.

[0036] Figure 16 A flowchart illustrating the bonding method of the bonding device according to the second embodiment.

[0037] Figure 17 This is a flowchart illustrating the bonding process (step S24) in the bonding method of the bonding apparatus according to the second embodiment.

[0038] Figure 18 This is a schematic diagram illustrating the bonding method in the first combination mode.

[0039] Figure 19 This is a schematic diagram illustrating the bonding method in the second combination mode.

[0040] Figure 20 This is a schematic diagram illustrating the bonding method in the third combination mode.

[0041] Figure 21 This is a schematic diagram illustrating the bonding method in the fourth combination mode.

[0042] Figure 22 This is a schematic diagram illustrating the bonding method in the fifth combination mode.

[0043] Figure 23 This is a schematic diagram illustrating the bonding method in the sixth combination mode. Detailed Implementation

[0044] Hereinafter, embodiments of the substrate holding device and bonding device of the present invention will be described with reference to the accompanying drawings. Furthermore, the same reference numerals are used to denote the same or equivalent parts in the drawings, and descriptions will not be repeated. Additionally, for ease of understanding of the present invention, the X-axis, Y-axis, and Z-axis, which are orthogonal to each other, are sometimes referred to in the specification. In this embodiment, the X-axis and Y-axis are substantially parallel to the horizontal direction, and the Z-axis is substantially parallel to the vertical direction. Furthermore, for convenience, one side of the Z-axis direction, Z1, represents the upward direction, and the other side of the Z-axis direction, Z2, represents the downward direction. However, the upward and downward directions are defined for ease of explanation and do not need to be consistent with the vertical direction.

[0045] [First Implementation Method] Reference Figures 1 to 11 The substrate holding device 100 of the first embodiment of the present invention will be described. Figure 1 A side view is shown to schematically illustrate the overall structure of the substrate holding device 100 according to the first embodiment. However, to prevent the drawing from becoming complicated, Figure 1 In, with Figure 4 Correspondingly, only two of the multiple support pins 400 are depicted.

[0046] First, refer to Figure 1 The schematic structure of the substrate holding device 100 is described below. For example... Figure 1 As shown, the substrate holding device 100 includes a support stage SB, a holding mechanism 110, a deformation mechanism 170, a suction mechanism 300, a pin actuator 450, and a plurality of support pins 400.

[0047] The support platform SB is configured not to move in the vertical or horizontal directions. Specifically, the support platform SB is fixed to the floor FL provided by the substrate holding device 100. In addition, the substrate holding device 100 has a floor member (not shown), and the support platform SB can also be fixed to the floor member.

[0048] The support platform SB is made of a material that is difficult to deform due to the weight and heat of the retaining mechanism 110. The support platform SB is, for example, formed of stone or a metal frame. The shape of the support platform SB is, for example, a generally rectangular parallelepiped shape. A through hole SBa, in a generally rectangular parallelepiped shape, is formed in the support platform SB, extending vertically. That is, the support platform SB is formed as a rectangular ring extending vertically.

[0049] In this embodiment, the support platform SB supports the multiple support pins 400 of the retaining mechanism 110. The support platform SB supports the retaining mechanism 110 from below. The outer periphery of the retaining mechanism 110 is fixed to the support platform SB by fasteners such as bolts (not shown).

[0050] The holding mechanism 110 adsorbs and holds the substrate W. The holding mechanism 110 holds the substrate W in a substantially horizontal position.

[0051] The substrate W can be, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disc, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the substrate W is a semiconductor wafer.

[0052] From a top-down view, the substrate W is, for example, circular or rectangular. In this embodiment, from a top-down view, the substrate W is approximately circular.

[0053] Furthermore, in this embodiment, the substrate W has a front side Wa and a back side Wb, with the back side Wb located opposite to the front side Wa. The front side Wa is a device forming surface where components are formed. The back side Wb is a non-device forming surface where no components are formed. Moreover, the back side Wb is an example of a "side" of the present invention.

[0054] In this embodiment, the holding mechanism 110 holds the substrate W from below. Furthermore, the holding mechanism 110 adsorbs and holds the back surface Wb of the substrate W. Therefore, when the substrate W is held by the holding mechanism 110, the back surface Wb of the substrate W becomes the lower surface, and the front surface Wa of the substrate W becomes the upper surface. While it is possible to flip the substrate W vertically when it is not held by the holding mechanism 110, for ease of understanding, in this embodiment, unless specifically stated otherwise, the substrate W is not flipped vertically. That is, in this embodiment, regardless of whether the substrate W is held by the holding mechanism 110, the front surface Wa of the substrate W is always the upper surface, and the back surface Wb of the substrate W is always the lower surface.

[0055] A portion of the deformation mechanism 170 is mounted to the lower part of the retaining mechanism 110 using fasteners such as bolts (not shown). Specifically, as described later, the deformation mechanism 170 has a movable body 171 and a drive mechanism 173. The drive mechanism 173 is mounted to the lower part of the retaining mechanism 110 using fasteners such as bolts (not shown). The deformation mechanism 170 has the function of deforming a portion of the retaining mechanism 110. Furthermore, the drive mechanism 173 can also be mounted on a support platform SB. The structure of the deformation mechanism 170 will be described later.

[0056] A portion of the suction mechanism 300 is mounted to the floor FL of the substrate holding device 100 using fasteners such as bolts (not shown). The suction mechanism 300 is a device for adsorbing the substrate W by the holding mechanism 110 and also draws air. Furthermore, a portion of the suction mechanism 300 can be mounted to the support platform SB. The structure of the suction mechanism 300 and the suction method of the suction mechanism 300 will be described later.

[0057] Multiple support pins 400 are configured to pass through the holding mechanism 110 in the vertical direction and are movable relative to the holding mechanism 110 in the vertical direction. The multiple support pins 400 support the substrate W before it is held by the holding mechanism 110. The multiple support pins 400 attract and support the back surface Wb of the substrate W. The multiple support pins 400 support the substrate W from below. The multiple support pins 400 pick up the substrate W from the transport arm TA of the transport device TR. The transport device TR is, for example, a device other than the substrate holding device 100, or a device that transports the substrate W from a substrate cassette (not shown) to the substrate holding device 100.

[0058] Furthermore, multiple support pins 400 deliver the substrate W received from the transport device TR to the holding mechanism 110. The structure of the multiple support pins 400 will be described later.

[0059] The pin actuator 450 is mounted on the lower part of the holding mechanism 110 using fasteners such as bolts (not shown). The pin actuator 450 drives a plurality of support pins 400. The pin actuator 450 drives the plurality of support pins 400, thereby enabling the plurality of support pins 400 to pick up the substrate W from the transport device TR, or to deliver the substrate W to the holding mechanism 110. Alternatively, the pin actuator 450 can also be mounted on the support table SB. The structure of the pin actuator 450 will be described later.

[0060] Then, refer to Figure 2 Further explanation of the substrate holding device 100. Figure 2 A cross-sectional view of the substrate holding device 100 of the first embodiment is shown schematically.

[0061] like Figure 2 As shown, the retaining mechanism 110 has a base 120, a clamp 130, a support wall 140, a retaining ring 150, and a partition wall 160.

[0062] The base 120 is generally circular in shape when viewed from above. The base 120 is, for example, a plate. The base 120 has an upper surface 120a and a lower surface 120b. The upper surface 120a and the lower surface 120b are configured to be generally horizontal.

[0063] The base 120 has a first member 121 and a second member 122. The first member 121 is generally circular in shape when viewed from above. The second member 122 is annular in shape when viewed from above and surrounds the outer periphery of the first member 121. That is, the first member 121 constitutes the central portion of the base 120, and the second member 122 constitutes the outer peripheral portion of the base 120. Furthermore, although this embodiment describes an example of the base 120 having a first member 121 and a second member 122, the base 120 may also be formed without separating the first member 121 and the second member 122, and may have the first member 121, the second member 122, and other members not shown.

[0064] The first component 121 is formed, for example, of ceramic or metal. The first component 121 has a generally circular plate shape or a generally cylindrical shape. Furthermore, a through hole 121a is formed in the first component 121 for insertion of the movable body 171 of the deformation mechanism 170 (described later). The through hole 121a extends through the first component 121 in the thickness direction (here, the vertical direction). The through hole 121a is formed at the center of the first component 121. Additionally, a through hole 121b is formed in the first component 121 for air passage. The through hole 121b extends through the first component 121 in the thickness direction. For example, multiple through holes 121b are provided. Furthermore, the through holes 121b are formed radially outward relative to the through hole 121a.

[0065] Furthermore, the first component 121 has a sealing groove 121c and a sealing groove 121d. The sealing groove 121c is formed in a generally annular shape along the inner peripheral surface of the insertion hole 121a. The sealing groove 121c is a groove formed on the inner peripheral surface of the insertion hole 121a with the central axis of the first component 121 as its center. The sealing groove 121d is formed in an annular shape along the outer peripheral surface of the first component 121. The sealing groove 121d is a groove formed on the outer peripheral surface of the first component 121 with the central axis of the first component 121 as its center. The sealing grooves 121c and 121d are formed, for example, by a cutting process.

[0066] Furthermore, the first member 121 has a flange portion 121e. The flange portion 121e is formed in the lower part of the first member 121. The flange portion 121e protrudes radially outward compared to the other parts of the first member 121. The upper surface of the flange portion 121e contacts the lower surface of the second member 122, and the flange portion 121e has the function of positioning the second member 122 in the vertical direction.

[0067] The second component 122 is formed, for example, of ceramic or metal. The second component 122 is formed in a ring shape surrounding the first component 121. In this embodiment, the second component 122 is generally annular or generally cylindrical. Furthermore, a stepped portion 122a is formed on the second component 122. The stepped portion 122a is formed on the inner peripheral surface of the second component 122. Moreover, an insertion groove 120c is formed by the stepped portion 122a of the second component 122 and the outer peripheral surface of the first component 121. The insertion groove 120c is formed on the upper surface 120a of the base 120. In other words, the insertion groove 120c is formed in the base 120 at a position facing the clamp 130. Furthermore, the insertion groove 120c extends in the vertical direction. Additionally, the insertion groove 120c may also penetrate the base 120 in the vertical direction.

[0068] Furthermore, a through hole 122b for air passage is formed in the second member 122. The through hole 122b penetrates the second member 122 in the thickness direction (here, the vertical direction). For example, multiple through holes 122b are provided. The through holes 122b are located radially outward from the insertion groove 120c.

[0069] Furthermore, the second member 122 has a sealing groove 122c. The sealing groove 122c is formed in a generally annular shape along the outer periphery of the second member 122 on the upper surface of the second member 122. The sealing groove 122c is formed, for example, by a cutting process.

[0070] The clamp 130 is generally circular in shape when viewed from above. The clamp 130 is, for example, a plate. The clamp 130 is positioned above the base 120. The clamp 130 is smaller than the base 120, and the lower surface of the clamp 130 faces the upper surface 120a of the base 120. Furthermore, the clamp 130 is positioned approximately parallel to the base 120, spaced apart from it by a predetermined interval (e.g., 5 mm or more). The clamp 130 is made of, for example, ceramic, resin, metal, or synthetic rubber, and is capable of warping from a few millimeters to about 10 mm.

[0071] The clamp 130 has a holding surface 130a and a back surface 130c located on the opposite side of the holding surface 130a. The holding surface 130a holds the back surface Wb (here, the lower surface) of the substrate W. In this embodiment, the holding surface 130a is the upper surface of the clamp 130, and the back surface 130c is the lower surface of the clamp 130. The back surface Wb (here, the lower surface) of the substrate W is the surface that contacts the holding surface 130a (here, the upper surface) of the clamp 130.

[0072] like Figure 2As shown, a through hole 130b for air passage is formed in the clamp 130. The through hole 130b extends through the thickness direction (here, the vertical direction) of the clamp 130. For example, multiple through holes 130b are provided. The through holes 130b are formed in approximately the entire area of ​​the region in the clamp 130 where the substrate W is placed. As will be described later, the through hole 130b is a hole for attracting air to hold the substrate W.

[0073] The support wall 140 supports the clamp 130. In this embodiment, the support wall 140 and the clamp 130 are formed from a single component. Alternatively, the support wall 140 may be provided with a different component than the clamp 130.

[0074] The support wall 140 extends from the outer peripheral end of the clamp 130 toward the base 120. In this embodiment, the support wall 140 extends downward from the outer peripheral end of the clamp 130. The lower end of the support wall 140 is fixed to the upper surface 120a of the base 120, and the upper end of the support wall 140 is connected to the clamp 130. Therefore, the clamp 130 is disposed above the base 120 at a predetermined distance.

[0075] The support wall 140 is formed in a generally annular shape along the outer periphery of the clamp 130. That is, the support wall 140 is a generally annular wall. Moreover, the space S is formed by the base 120, the clamp 130 and the support wall 140.

[0076] Furthermore, the support wall 140 has a flange 141. The flange 141 is formed on the lower part of the support wall 140. The flange 141 protrudes radially outward compared to the other parts of the support wall 140.

[0077] The retaining ring 150 is, for example, generally annular in shape and is disposed along the outer peripheral surface of the support wall 140. The retaining ring 150 secures the flange portion 141 to the upper surface 120a of the base 120. Specifically, the retaining ring 150 is generally L-shaped in cross-sectional view and engages with the flange portion 141. In other words, a step is formed on the inner peripheral surface of the retaining ring 150 to engage with the flange portion 141. The retaining ring 150 is secured to the base 120, for example, by screws. That is, the retaining ring 150 is fixed to the base 120, thereby fixing the flange portion 141 to the base 120.

[0078] The partition wall 160 extends from the clamp 130 toward the base 120. Specifically, the partition wall 160 extends from the lower surface, i.e., the back surface 130c, of the clamp 130 toward the base 120. The partition wall 160 is formed in a generally annular shape. Furthermore, the partition wall 160 is formed at a position corresponding to the insertion groove 120c of the base 120, and the vertical length of the partition wall 160 is longer than the vertical length of the support wall 140. Therefore, the front end of the partition wall 160 is inserted into the insertion groove 120c.

[0079] Here, in this embodiment, the holding surface 130a of the clamp 130 is planar ( Figure 2 In the state of (the partition wall 160 is in a planar state), a portion of the partition wall 160 is inserted into the insertion slot 120c, and the insertion slot 120c has a region S120 that allows the partition wall 160 to be further inserted into the insertion slot 120c. The region S120 is defined by the front end face 160a of the partition wall 160 and the inner surface 120d of the insertion slot 120c. That is, with the holding surface 130a in a planar state, inside the insertion slot 120c (in the planar state), a portion of the partition wall 160 is inserted into the insertion slot 120c. Figure 2 The lower surface of the middle section) and the front end surface 160a of the partition wall 160 (in Figure 2 A gap is formed between the lower surface and the partition wall 160. Therefore, the partition wall 160 can be further inserted into the interior of the insertion groove 120c. By further inserting the partition wall 160 into the interior of the insertion groove 120c, the retaining surface 130a can be easily formed into a recessed shape, as described later.

[0080] Furthermore, in this embodiment, the partition wall 160 and the clamp 130 are formed from a single component. Additionally, in this embodiment, the partition wall 160, the clamp 130, and the support wall 140 are formed from a single component. Furthermore, the partition wall 160 may be provided with a different component than the clamp 130.

[0081] The deformation mechanism 170 deforms the holding mechanism 110. Furthermore, the deformation mechanism 170 deforms the clamp 130 in a convex shape, with the center of the holding surface 130a protruding towards the substrate W (in this case, upward). Additionally, the deformation mechanism 170 deforms the clamp 130 in a concave shape, with the center of the holding surface 130a recessed away from the substrate W (in this case, downward). That is, the deformation mechanism 170 deforms the clamp 130 in either a convex or concave shape, making the holding surface 130a convex. Hereinafter, the case where the holding surface 130a is bent so that its center protrudes towards the substrate W (in this case, upward) is sometimes described as the holding surface 130a becoming convex. Furthermore, the case where the holding surface 130a is bent so that its center is recessed away from the substrate W (in this case, downward) is sometimes described as the holding surface 130a becoming concave.

[0082] Specifically, the deformation mechanism 170 includes a movable body 171, a fixed member 172, and a drive mechanism 173. The movable body 171 is formed, for example, of resin or metal. The movable body 171 is formed, for example, in the shape of a rod, column, or shaft. In this embodiment, the movable body 171 is cylindrical and is configured to extend in the vertical direction. The movable body 171 is inserted into the insertion hole 121a of the first member 121. That is, the lower end of the movable body 171 protrudes downward from the insertion hole 121a of the first member 121. The upper end of the movable body 171 protrudes upward from the insertion hole 121a of the first member 121.

[0083] The upper end of the movable body 171 can be directly fixed to the back 130c of the clamp 130 (in Figure 2 The upper end of the movable body 171 can also be fixed via a fixing member or the like at the center of the lower surface of the clamp 130. In this embodiment, the upper end of the movable body 171 is fixed to the center of the back surface 130c of the clamp 130 via a fixing member 172. Specifically, the fixing member 172 is disposed between the movable body 171 and the clamp 130. The fixing member 172 is fixed to the back surface 130c of the clamp 130 by adhesive material or screws. In addition, the fixing member 172 is fixed to the upper end of the movable body 171 by adhesive material or screws. The fixing member 172 is, for example, made of metal. Furthermore, in this embodiment, the fixing member 172 functions as a sealing member for sealing between the movable body 171 and the clamp 130.

[0084] The movable body 171 is capable of moving relative to the base 120 in the direction of opposition (here, the up and down direction) between the clamp 130 and the base 120.

[0085] The drive mechanism 173 moves the movable body 171 relative to the base 120 in the vertical direction. The drive mechanism 173 has an actuator. Although not specifically limited, the drive mechanism 173 has a drive source such as a pump or motor, and a transmission member such as a gear and / or cam, transmitting the driving force of the drive source to the movable body 171. The drive mechanism 173 is, for example, fixed to the lower surface 120b of the base 120. The drive mechanism 173 is driven, thereby moving the movable body 171 relative to the base 120 in the vertical direction. This causes the clamp 130 to deform. The deformation of the clamp 130 will be described later. Furthermore, to prevent the drawings from becoming complex, except where specifically necessary, Figure 3 The drive mechanism 173 is sometimes omitted.

[0086] Furthermore, in this embodiment, the movable body 171 includes a tube having a through hole 171a connected to the holding surface 130a. The through hole 171a extends through the interior of the movable body 171 in its extending direction. Air passes through the through hole 171a. The through hole 171a is a suction hole for attracting the substrate W. In this embodiment, a through hole 172a for air passage is formed in the fixing member 172. The through hole 172a is connected to the through hole 171a of the movable body 171. Furthermore, in this embodiment, a through hole 130b of the clamp 130 is connected to the through hole 171a of the movable body 171 via the through hole 172a of the fixing member 172. The through hole 130b connected to the through hole 171a is formed at the center of the clamp 130.

[0087] Continue to refer to Figure 2 The retaining mechanism 110 is described. The retaining mechanism 110 has sealing members 123a, 123b, and 123c. Sealing members 123a, 123b, and 123c are, for example, formed of elastic members such as rubber. Furthermore, sealing members 123a, 123b, and 123c are, for example, O-rings.

[0088] Sealing member 123a is disposed within sealing groove 121c. When disposed within sealing groove 121c, sealing member 123a contacts the outer peripheral surface of movable body 171. Sealing member 123a seals the space between movable body 171 and first member 121. Sealing member 123b is disposed within sealing groove 121d. When disposed within sealing groove 121d, sealing member 123b contacts the inner peripheral surface of partition wall 160. Sealing member 123b seals the space between first member 121 and partition wall 160. Sealing member 123c is disposed within sealing groove 122c. When disposed within sealing groove 122c, sealing member 123c contacts the lower surface of support wall 140. Sealing member 123c seals the space between support wall 140 and second member 122. When the pressure in space S is reduced by the suction mechanism 300, it can prevent air from flowing into space S from between the moving body 171 and the first component 121, between the first component 121 and the partition wall 160, and between the support wall 140 and the second component 122.

[0089] The suction mechanism 300 is connected to through holes 171a, 121b, and 122b, and draws in air. Specifically, the suction mechanism 300 includes a pipe 301a, a suction device 302, and a valve 310a. The pipe 301a is connected to the through holes 171a, 121b, and 122b. The suction device 302 is mounted to the floor FL on which the substrate holding device 100 is located using fasteners such as bolts (not shown). The suction device 302 may include, for example, a suction pump or an exhaust fan. Alternatively, the substrate holding device 100 may not have a suction device 302. For example, the pipe 301a may be connected to an external suction device 302 on the substrate holding device 100. The valve 310a is provided on the pipe 301a to switch the pipe 301a to an open or closed state.

[0090] When the suction device 302 is activated and the valve 310a is open, air in space S is drawn in through holes 121b and 122b, creating a negative pressure in space S. Therefore, air flows into space S through the through hole 130b in the clamp 130 connected to space S. Furthermore, when the suction device 302 is activated and the valve 310a is open, air in through hole 171a is drawn in, creating a negative pressure in through hole 171a. Therefore, air flows into through hole 171a through the through hole 130b in the clamp 130 connected to through hole 171a. Therefore, if the substrate W is brought close to the holding surface 130a of the clamp 130 when the suction device 302 is activated and the valve 310a is open, the back surface Wb of the substrate W is attracted to the holding surface 130a of the clamp 130.

[0091] Then, refer to Figure 3 The fixture 130 and the partition wall 160 are further described. Figure 3 A top view of the clamp 130 of the substrate holding device 100 according to the first embodiment is shown schematically. Figure 2 as well as Figure 3 As shown, partition wall 160 divides space S into multiple spaces. In this embodiment, partition wall 160 divides space S into two spaces, S1 and S2. Space S1 is a central circular space in space S. Space S2 is an outer annular space in space S. Furthermore, although this embodiment describes an example of space S being divided into two spaces, S1 and S2, by one partition wall 160, space S can also be divided into three or more spaces by one or more partition walls 160.

[0092] Furthermore, one or more through holes 130b are formed in the clamp 130 at a position radially inward from the partition wall 160. In other words, one or more through holes 130b connect space S1 to the external space. In this embodiment, multiple through holes 130b are formed in the clamp 130 at a position radially inward from the partition wall 160.

[0093] Furthermore, one or more through holes 130b are formed in the clamp 130 at a position radially outward from the partition wall 160. In other words, one or more through holes 130b connect space S2 to the external space. In this embodiment, multiple through holes 130b are formed in the clamp 130 at a position radially outward from the partition wall 160.

[0094] Furthermore, in this embodiment, the through hole 130b includes: a through hole 130d; a plurality of through holes 130e for the support pin 400 to pass through; and a plurality of through holes 130f for not allowing the support pin 400 to pass through. In this embodiment, the through hole 130d is formed at the center of the clamp 130. The plurality of through holes 130e are formed at the periphery of the clamp 130. The plurality of through holes 130f are formed throughout the entire area of ​​the clamp 130.

[0095] Then, refer to Figure 4 as well as Figure 5 This indicates that there are multiple support pins of 400. Figure 4 For along Figure 3 A schematic cross-sectional view along line IV-IV, and a diagram showing the support pin 400 configured in the protruding position P1. Figure 5 For along Figure 3 A schematic cross-sectional view along line IV-IV, showing the support pin 400 in the non-protruding position P2. (See diagram.) Figure 4 As shown, a plurality of support pins 400 support the substrate W before it is held by the holding mechanism 110. In this embodiment, the plurality of support pins 400 support the back surface Wb (here, the lower surface) of the substrate W. The plurality of support pins 400 support the substrate W and deliver the substrate W to the holding mechanism 110. Specifically, for example, the substrate W can be delivered from the transport device TR to the plurality of support pins 400. Alternatively, the substrate holding device 100 may not have the plurality of support pins 400.

[0096] In this embodiment, the plurality of support pins 400 includes multiple (four in this case) support pins 400 extending in the vertical direction. The support pins 400 are arranged at equal angular intervals in a top view. The support pins 400 support the back surface Wb (lower surface in this case) of the substrate W. Furthermore, the support pins 400 have through holes (not shown) for air passage, and the plurality of support pins 400 can attract the substrate W. In this embodiment, the support pins 400 do not have through holes (not shown).

[0097] In this embodiment, one or more (four in this case) through holes 130e are located above the through hole 122b. A support pin 400 is inserted into the through holes 122b and 130e.

[0098] Support pin 400, for example, can be positioned at the protruding location P1 (see reference). Figure 4 ) and non-protruding position P2 (refer to Figure 5 The support pins 400 move between the support surfaces 130a and 130a respectively. The protruding position P1 is the position that protrudes upwards from the retaining surface 130a, and the non-protruding position P2 is the position that does not protrude upwards from the retaining surface 130a. In this embodiment, multiple (four in this case) support pins 400 are linked together by connecting members (not shown). Therefore, the multiple (four in this case) support pins 400 move integrally in the vertical direction.

[0099] Specifically, as described above, the substrate holding device 100 includes a pin actuator 450 that moves the support pin 400 in the vertical direction. The pin actuator 450 is, for example, fixed to the lower surface 120b of the base 120. While not particularly limited, the pin actuator 450 includes a drive source such as a pump or motor, and a transmission member such as a gear and / or cam, transmitting the driving force of the drive source to the lower part of the support pin 400. The pin actuator 450 is driven, thereby moving the support pin 400 in the vertical direction relative to the base 120. For example, the pin actuator 450 moves the support pin 400 to a protruding position P1, whereby the support pin 400 protrudes from the holding surface 130a, allowing the substrate W to be picked up from the transport device TR. That is, the support pin 400 picks up the substrate W at the protruding position P1. When the support pin 400 picks up the substrate W from the transport device TR, the substrate W is picked up when it protrudes from the holding surface 130a by, for example, 10 mm or more. At this point, the height positions of the front ends of all the support pins 400 are approximately the same. Furthermore, for example, the pin actuator 450 moves the support pins 400 from the protruding position P1 to the non-protruding position P2, thereby preventing the support pins 400 from protruding from the holding surface 130a. As a result, since the substrate W moves downwards from its position above the holding surface 130a, the substrate W is delivered from the support pins 400 to the holding surface 130a.

[0100] Next, refer to Figure 6 as well as Figure 7 Explain the deformation of the retaining surface 130a of the fixture 130. Figure 6 This is a cross-sectional view schematically showing the state in which the holding surface 130a of the clamp 130 of the substrate holding device 100 of the first embodiment is in a convex shape. Figure 7 This is a cross-sectional view schematically showing the state in which the holding surface 130a of the clamp 130 of the substrate holding device 100 of the first embodiment is concave.

[0101] like Figure 6 as well as Figure 7 As shown, in this embodiment, the clamp 130 can be deformed to make the retaining surface 130a convex, and can also be deformed to make the retaining surface 130a concave. Making the retaining surface 130a convex means, as... Figure 6 As shown, the retaining surface 130a is curved such that its center protrudes toward the substrate W (in this case, upwards). That is, the convex shape of the retaining surface 130a refers to the shape in which the center of the retaining surface 130a protrudes toward the substrate W. The retaining surface 130a becoming a concave shape means that, as... Figure 7 As shown, the retaining surface 130a is curved in such a way that the center of the retaining surface 130a is recessed in a direction away from the substrate W (in this case, the downward direction). That is, the recessed shape of the retaining surface 130a represents the shape in which the center of the retaining surface 130a is recessed in a direction away from the substrate W.

[0102] For example, when the drive mechanism 173 moves the movable body 171 upward relative to the base 120, since the upper end of the movable body 171 is fixed to the center of the clamp 130 by the fixing member 172, the central portion of the clamp 130 is pushed upward relative to the base 120 as the movable body 171 moves upward relative to the base 120. Therefore, with the outer periphery of the clamp 130 fixed by the fixing ring 150, the central portion of the clamp 130 is pushed upward. Therefore, since the clamp 130 can warp, the clamp 130 deforms into an upwardly convex shape. Therefore, the holding surface 130a becomes a convex shape (see reference). Figure 6 ).

[0103] Furthermore, for example, when the drive mechanism 173 moves the movable body 171 downward relative to the base 120, since the upper end of the movable body 171 is fixed to the center of the clamp 130 by the fixing member 172, the central portion of the clamp 130 is pulled downward relative to the base 120 as the movable body 171 moves downward relative to the base 120. Therefore, with the outer periphery of the clamp 130 fixed by the fixing ring 150, the central portion of the clamp 130 is pulled downward. Therefore, since the clamp 130 can warp, the clamp 130 deforms into a downwardly concave shape. Therefore, the retaining surface 130a becomes a concave shape (see reference). Figure 7 ).

[0104] Then, refer to Figure 8 The substrate holding device 100 will be further explained. Figure 8 A block diagram illustrating the configuration of the substrate holding device 100 according to the first embodiment.

[0105] In this embodiment, the substrate holding device 100 includes a control device 190. The control device 190 controls the substrate holding device 100. The control device 190 controls the deformation mechanism 170. In this embodiment, the control device 190 controls the deformation mechanism 170, the suction mechanism 300, the pin actuator 450, and the warpage detection device 500, which will be described later.

[0106] The control device 190 includes a control unit 191 and a storage unit 193. The control unit 191 has a processor. The control unit 191 may have a CPU (Central Processing Unit). Alternatively, the control unit 191 may have a general-purpose arithmetic logic unit (ALU).

[0107] Storage unit 193 stores data and computer programs. The data, for example, specifies the processing content and processing order used to maintain the substrate W.

[0108] Storage unit 193 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 193 may include removable media. Control unit 191 executes the computer program stored in storage unit 193 and performs board holding operations.

[0109] The control unit 191 acquires warpage information of the substrate W. The warpage information indicates at least one warpage direction of the substrate W. The warpage information indicates that the substrate W has a recessed shape, a convex shape, or a planar shape. Specifically, a recessed shape indicates a shape where the front surface Wa of the substrate W is recessed towards the back surface Wb (in this case, downward direction), and the back surface Wb protrudes towards the opposite side of the front surface Wa (in this case, downward direction). That is, in this embodiment, a recessed shape indicates a shape where the center of the front surface Wa (in this case, the upper surface) of the substrate W is recessed downward. Furthermore, a convex shape indicates a shape where the front surface Wa of the substrate W protrudes towards the opposite side of the back surface Wb (in this case, upward direction), and the back surface Wb is recessed towards the front surface Wa (in this case, upward direction). That is, in this embodiment, a convex shape indicates a shape where the center of the front surface Wa of the substrate W protrudes upward. A planar shape indicates a shape where both the front surface Wa and the back surface Wb of the substrate W are planar. Furthermore, in this embodiment, the warpage information indicates the warpage direction of the substrate W and the amount of warpage of the substrate W.

[0110] Warpage information of substrate W can be transmitted from a warpage detection device to a control device 190, which detects the warpage of substrate W. Furthermore, a storage unit 193 can store the warpage information, and the control unit 191 retrieves the warpage information from the storage unit 193. The substrate holding device 100 may include a warpage detection device. Furthermore, the warpage detection device may be separately installed from the substrate holding device 100. In this embodiment, the substrate holding device 100 includes a warpage detection device 500. The warpage detection device 500 may be a contact detection device that contacts the substrate W, or a non-contact detection device that does not contact the substrate W. In this embodiment, the warpage detection device 500 may be, for example, a non-contact detection device having a laser emission section and a light receiving section.

[0111] The warpage detection device 500 can detect warpage of the substrate W supported by the support pin 400, and it can also detect warpage of the substrate W supported by the transport device TR. In this embodiment, the warpage detection device 500 detects warpage of the substrate W supported by the support pin 400. The warpage detection device 500 sends warpage information related to the detected warpage to the control device 190, and the control device 190 stores the warpage information in the storage unit 193.

[0112] Furthermore, based on warpage information, the control unit 191 deforms the clamp 130 via the deformation mechanism 170 to make the holding surface 130a, for example, become a convex or concave shape, and holds the substrate W via the holding mechanism 110.

[0113] Specifically, when the warpage information indicates that the substrate W is in a recessed shape (the front surface Wa is recessed), the control unit 191 deforms the clamp 130 by means of the deformation mechanism 170 to make the holding surface 130a into a recessed shape. Furthermore, with the holding surface 130a already formed into a recessed shape, the control unit 191 holds the back surface Wb (here, the lower surface) of the substrate W by means of the holding mechanism 110. In addition, the control unit 191 can control the deformation mechanism 170 based on detection results from a detection unit (not shown), which detects the force of the deformation mechanism 170 or the amount of movement of the moving body 171.

[0114] Furthermore, the control unit 191 brings the center of the upper surface of the clamp 130, i.e., the holding surface 130a, into contact with the center point of the back surface Wb (here, the lower surface) of the substrate W. Specifically, the control unit 191 brings the holding surface 130a into contact with the back surface Wb of the substrate W when the holding surface 130a has been formed into a convex shape or a flat shape. Alternatively, the control unit 191 brings the holding surface 130a into contact with the back surface Wb of the substrate W when the holding surface 130a has been formed into a concave shape and the curvature of the holding surface 130a is smaller than the curvature of the substrate W.

[0115] Subsequently, the control unit 191 deforms the clamp 130 via the deformation mechanism 170 such that the holding surface 130a is pressed tightly against the back surface Wb of the substrate W. As a result, the entire back surface Wb of the substrate W is pressed tightly against the holding surface 130a. Therefore, the back surface Wb of the substrate W is held by the holding surface 130a. Furthermore, the curvature is a value representing the degree of bending of the surface. If the curvature increases, the radius of curvature decreases.

[0116] Then, refer to Figures 9 to 11 This embodiment describes the substrate holding method of the substrate holding device 100. Figure 9 A flowchart illustrating the substrate holding method of the substrate holding apparatus 100 according to the first embodiment. Figure 10 This is a schematic cross-sectional view illustrating a method for holding a substrate W with its front surface Wa in a convex shape by means of a substrate holding device 100. Figure 11 This is a schematic cross-sectional view illustrating the method of holding a substrate W with its front surface Wa becoming a recessed shape by the substrate holding device 100. Furthermore, to simplify the drawings, [the following text is missing]. Figure 10 as well as Figure 11 The support pin 400 is omitted. In this embodiment, the substrate holding method of the substrate holding device 100 includes steps S11 to S14. Furthermore, step S11 is an example of the "substrate preparation process" of the present invention. Step S14 is an example of the "substrate holding process" of the present invention.

[0117] like Figure 9 As shown, in step S11, substrate W is prepared. Specifically, substrate W can be prepared for control of the transport device TR by the control unit 191, or substrate W can be prepared for transport devices other than substrate holding device 100 (not shown).

[0118] Next, in step S12, the control unit 191 detects the warping of the substrate W using the warping detection device 500. Specifically, with the substrate W positioned above the holding surface 130a by the transport device TR, the control unit 191 uses the pin actuator 450 to cause multiple support pins 400 to protrude upwards from the holding surface 130a. This causes the multiple support pins 400 to contact the back surface Wb (here, the lower surface) of the substrate W and lift the substrate W, thereby moving the substrate W from the transport device TR to the support pins 400. Furthermore, the control unit 191 detects the warping of the substrate W supported by the support pins 400 using the warping detection device 500. The warping information, as a result of the detection by the warping detection device 500, is stored in the storage unit 193.

[0119] Next, in step S13, the control unit 191 obtains warping information. Specifically, the control unit 191 obtains warping information from the storage unit 193.

[0120] Next, in step S14, the control unit 191 deforms the clamp 130 via the deformation mechanism 170. Specifically, the control unit 191 deforms the clamp 130 via the deformation mechanism 170 based on warp information, causing the holding surface 130a to become a convex or concave shape. More specifically, the control unit 191 drives the deformation mechanism 170, thereby moving the moving body 171 relative to the base 120 in the vertical direction, thus deforming the clamp 130. Furthermore, the control unit 191 can also deform the clamp 130 via the deformation mechanism 170 based on warp information, causing the holding surface 130a to become planar. Additionally, in step S14, the control unit 191 drives the suction mechanism 300.

[0121] For example, such as Figure 10 As shown, in the case where the warpage information indicates that the substrate W has a convex shape (the front side Wa of the substrate W has a convex shape) (refer to... Figure 10 The upper part of the control unit 191 deforms the clamp 130 by means of the deformation mechanism 170 in such a way that the holding surface 130a becomes a convex shape. That is, the control unit 191 moves the moving body 171 relative to the base 120 in the upward direction. At this time, the control unit 191 deforms the clamp 130 in such a way that the curvature of the holding surface 130a is greater than the curvature of the substrate W.

[0122] Then, the control unit 191 moves the support pin 400 downward relative to the base 120 via the pin actuator 450, thereby bringing the substrate W into contact with the holding surface 130a (see reference). Figure 10 (The middle part). Thus, the center of the upper surface of the clamp 130, i.e. the center of the holding surface 130a, contacts the center point of the back surface Wb (in this case, the lower surface) of the substrate W. Therefore, the center of the substrate W is adsorbed through the through hole 130b located in the center of the clamp 130. At this time, since the curvature of the holding surface 130a is greater than the curvature of the substrate W, the support pin 400 is in the protruding position P1.

[0123] Subsequently, the control unit 191 makes the curvature of the holding surface 130a less than the curvature of the substrate W, or the same as the curvature of the substrate W (see reference). Figure 10(The lower part). Specifically, the control unit 191 moves the moving body 171 downward relative to the base 120 via the drive mechanism 173, and moves the support pin 400 downward relative to the base 120 via the pin actuator 450, thereby positioning it in a non-protruding position P2. Thus, if the curvature of the holding surface 130a becomes the same as the curvature of the substrate W, the entire back surface Wb of the substrate W is adsorbed onto the holding surface 130a. At this time, the back surface Wb (here, the lower surface) of the substrate W gradually contacts the holding surface 130a from the center of the substrate W toward the radially outward side. Specifically, after the substrate W is adsorbed through the through hole 130d in the center of the clamp 130, the through holes 130e and 130f, which are radially outward from the through hole 130d, adsorb the substrate W, and then the through holes 130f on the outer periphery of the clamp 130 adsorb the substrate W. Therefore, air can be prevented from entering between the back surface Wb of the substrate W and the holding surface 130a.

[0124] Then, the control unit 191 stops the moving body 171 and the support pin 400 from moving downward. In this way, the substrate W is held by the substrate holding device 100.

[0125] In addition, for example Figure 11 As shown, in the case where the warpage information indicates that the substrate W has a recessed shape (the front side Wa of the substrate W has a recessed shape) (refer to... Figure 11 The control unit 191 deforms the clamp 130 by means of the deformation mechanism 170, making the holding surface 130a convex. That is, the control unit 191 moves the moving body 171 relative to the base 120 in the upward direction by means of the drive mechanism 173. In addition, when the warpage information indicates that the substrate W is in a concave shape, the control unit 191 can deform the clamp 130 by means of the deformation mechanism 170, making the holding surface 130a planar. In addition, when the warpage information indicates that the substrate W is in a concave shape, the control unit 191 can deform the clamp 130 by means of the deformation mechanism 170, making the holding surface 130a concave. Among them, when the clamp 130 is deformed by means of making the holding surface 130a concave, the control unit 191 can deform the clamp 130 by means of making the curvature of the holding surface 130a smaller than the curvature of the substrate W.

[0126] Then, the control unit 191 moves the support pin 400 downward relative to the base 120 via the pin actuator 450, thereby bringing the substrate W into contact with the holding surface 130a (see reference). Figure 11 (The middle part). Thus, the center of the upper surface of the clamp 130, i.e., the holding surface 130a, contacts the center point of the back surface Wb (in this case, the lower surface) of the substrate W. Therefore, the center of the substrate W is adsorbed through the through hole 130b located in the center of the clamp 130. At this time, the support pin 400 is in the protruding position P1.

[0127] Subsequently, the control unit 191 forms the holding surface 130a into a recessed shape, and makes the curvature of the holding surface 130a greater than or the same as the curvature of the substrate W (see reference). Figure 11 (The lower part). Specifically, the control unit 191 moves the moving body 171 relative to the base 120 in a downward direction via the drive mechanism 173, and moves the support pin 400 relative to the base 120 in a downward direction relative to it via the pin actuator 450, placing it in a non-protruding position P2. Thus, when the curvature of the holding surface 130a is the same as the curvature of the substrate W, the entire back surface Wb of the substrate W is adsorbed onto the holding surface 130a. At this time, the back surface Wb (here, the lower surface) of the substrate W gradually contacts the holding surface 130a from the center of the substrate W toward the radially outward direction. Specifically, after the substrate W is adsorbed through the through hole 130d in the center of the clamp 130, the through holes 130e and 130f, which are radially outward from the through hole 130d, adsorb the substrate W, and then the through holes 130f on the outer periphery of the clamp 130 adsorb the substrate W. Therefore, air can be prevented from entering between the back surface Wb of the substrate W and the holding surface 130a.

[0128] Then, the control unit 191 stops the moving body 171 and the support pin 400 from moving downward. In this way, the substrate W is held by the substrate holding device 100.

[0129] Furthermore, when the warpage information indicates that the substrate W is a planar substrate shape (the front surface Wa of the substrate W is planar), the control unit 191 and the warpage information indicate that the substrate W is a convex substrate shape (the front surface Wa of the substrate W is convex) (see reference). Figure 10 The same process is performed.

[0130] The above is for reference only. Figures 1 to 11 As described, in this embodiment, the deformation mechanism 170 deforms the clamp 130 in a manner that makes the holding surface 130a convex or concave. Therefore, the clamp 130 can be deformed according to the warping of the substrate W, making the holding surface 130a convex or concave. Thus, the increase in stress applied to the substrate W can be suppressed. Furthermore, as in this embodiment, when using a substrate W with components formed on it, the increase in stress applied to the substrate W is suppressed, thereby suppressing adverse effects on the characteristics of the components. Therefore, the present invention is particularly effective when using a substrate W with components formed on it.

[0131] Furthermore, as described above, the control unit 191 deforms the clamp 130 via the deformation mechanism 170 to make the holding surface 130a into a convex or concave shape based on warping information that at least indicates the warping direction, and holds the substrate W via the holding mechanism 110. Therefore, it is easy to suppress the increase of stress applied to the substrate W.

[0132] Furthermore, as described above, when the warpage information indicates that the substrate W is in a recessed shape (the front surface Wa is recessed), the control unit 191 deforms the clamp 130 by means of the deformation mechanism 170 to make the holding surface 130a into a recessed shape, and holds the substrate W by means of the holding mechanism 110. Therefore, when the substrate W becomes in a recessed shape, it is easy to suppress the increase of stress applied to the substrate W.

[0133] Furthermore, as described above, when the warpage information indicates that the substrate W has a recessed shape (the front surface Wa is recessed), the control unit 191 contacts the center of the upper surface of the clamp 130, i.e., the holding surface 130a, with the center point of the back surface Wb (here, the lower surface) of the substrate W. Then, the deformation mechanism 170 makes the curvature of the holding surface 130a greater than the curvature of the substrate W. Therefore, the back surface Wb of the substrate W gradually contacts the holding surface 130a from the center of the substrate W towards the radially outward direction. This prevents air from entering between the back surface Wb of the substrate W and the holding surface 130a. Therefore, it is easy to make the entire back surface Wb of the substrate W adhere tightly to the holding surface 130a. In other words, it prevents voids from forming between the back surface Wb of the substrate W and the holding surface 130a.

[0134] Furthermore, as described above, the deformation mechanism 170 has a movable body 171 fixed to the center of the clamp 130, which moves relative to the base 120 along an opposing direction in which the clamp 130 and the base 120 face each other. Thus, the clamp 130 can be easily deformed in such a way that the holding surface 130a can be made into a convex or concave shape.

[0135] Furthermore, as described above, the movable body 171 includes a tube having a through hole 171a connected to the holding surface 130a. The through hole 171a is an attraction hole for attracting the back surface Wb (in this case, the lower surface) of the substrate W. Therefore, the center of the substrate W can be easily attracted while the movable body 171 is fixed to the center of the clamp 130.

[0136] Furthermore, as described above, with the retaining surface 130a formed as a plane, a portion of the partition wall 160 is inserted into the insertion groove 120c, which has a region S120 allowing the partition wall 160 to be further inserted into the interior of the insertion groove 120c. Therefore, by further inserting the partition wall 160 into the interior of the insertion groove 120c, the retaining surface 130a can be easily formed into a recessed shape.

[0137] [Second Implementation] Reference Figures 12 to 23 The bonding device 1 of the second embodiment of the present invention will be described. Figure 12 A side view of the bonding device 1 according to the second embodiment is shown schematically. However, to avoid complicating the drawings, in... Figure 12 The first embodiment described above is in accordance with Figure 1 Similarly, only the support pins 400 of the two substrate holding devices 100 are depicted, and together with Figure 14 Correspondingly, only the second support pins 410 of the two second substrate holding devices 200 are depicted.

[0138] like Figure 12 As shown, the bonding apparatus 1 of the second embodiment includes a substrate holding device 100 (hereinafter referred to as the first substrate holding device 100) and a second substrate holding device 200, which are arranged facing each other. In addition, in the second embodiment, for ease of understanding, the substrate holding device 100 of the first embodiment will be described as the first substrate holding device 100.

[0139] Furthermore, in the following description, for ease of understanding, the substrate W, holding mechanism 110, base 120, clamp 130, holding surface 130a, deformation mechanism 170, moving body 171, and support pin 400 of the first embodiment will be referred to as the first substrate W1, the first holding mechanism 110, the first base 120, the first clamp 130, the first holding surface 130a, the first deformation mechanism 170, the first moving body 171, and the first support pin 400, respectively.

[0140] In this embodiment, the first substrate holding device 100 does not include the suction mechanism 300 and the control device 190, while the bonding device 1 includes the suction mechanism 300 and the control device 190. Furthermore, the other structures of the first substrate holding device 100 are the same as those of the substrate holding device 100 in the first embodiment.

[0141] The bonding apparatus 1 bonds the first substrate W1 held by the first substrate holding device 100 and the second substrate W2 held by the second substrate holding device 200. The bonding apparatus 1 includes a support frame SF, the first substrate holding device 100, the second substrate holding device 200, a first moving mechanism 610, and a second moving mechanism 620.

[0142] The support frame SF is fixed to the floor FL provided by the bonding device 1. The support frame SF is made of metal, for example. The support frame SF has, for example, a plurality of first frames SF1 extending in the vertical direction and a plurality of second frames SF2 extending in the horizontal direction. In this embodiment, four first frames SF1 and four second frames SF2 are provided. The four first frames SF1 have two sets of first frame SF1 assemblies (not shown), each set consisting of two first frames SF1 arranged at a predetermined interval from each other in the X direction. These two sets of first frame SF1 assemblies overlap each other in the X direction and are arranged at a predetermined interval from each other in the Y direction. That is, in a top view, the four first frames SF1 are positioned at the four corners of a rectangle. The lower end of each first frame SF1 is fixed to the floor FL. The four second frames SF2 have two second frames SF2 that connect the upper ends of adjacent first frames SF1 in the X direction and two second frames SF2 that connect the upper ends of adjacent first frames SF1 in the Y direction. That is, from a top-down view, the four second frames SF2 are positioned at the four sides of a rectangle. Furthermore, the support frames SF can be fixed to the interior wall or ceiling where the fitting device 1 is installed.

[0143] Furthermore, the support frame SF supports the second substrate holding device 200. In this embodiment, the support frame SF has: a horizontal track SF3 that guides the second substrate holding device 200 in the horizontal direction; and a vertical track SF4 that guides the second substrate holding device 200 in the vertical direction. For example, two horizontal tracks SF3 and two vertical tracks SF4 are provided. The horizontal tracks SF3 extend, for example, in the X direction. The two horizontal tracks SF3 are respectively fixed to two second frames SF2 extending in the X direction. The two vertical tracks SF4 are respectively mounted on the two horizontal tracks SF3. The vertical tracks SF4 are configured to be movable in the X direction along the horizontal tracks SF3.

[0144] In this embodiment, the second substrate holding device 200 is configured to be movable relative to the first substrate holding device 100. Specifically, the second substrate holding device 200 includes a second support platform SB2. The second support platform SB2 is supported by a vertical track SF4 and moves horizontally along a horizontal track SF3 together with the vertical track SF4. Furthermore, the second support platform SB2 moves vertically along the vertical track SF4.

[0145] In this embodiment, the second substrate holding device 200 is disposed above the first substrate holding device 100. The second substrate holding device 200 is configured such that the first substrate holding device 100 can be flipped in the vertical direction. Furthermore, the first substrate holding device 100 and the second substrate holding device 200 can be configured to flip in the vertical direction. The structure of the second substrate holding device 200 will be described later.

[0146] The first moving mechanism 610 is fixed to the horizontal track SF3, for example. Alternatively, the first moving mechanism 610 may be fixed to the second frame SF2. The first moving mechanism 610 moves the second substrate holding device 200 in the horizontal direction. In this embodiment, the first moving mechanism 610 moves the second substrate holding device 200 together with the vertical track SF4 in the horizontal direction. The first moving mechanism 610 has an actuator. Although not particularly limited, the first moving mechanism 610 has: a drive source such as a pump or motor; and a transmission member such as a gear, which transmits the driving force of the drive source to the vertical track SF4 or the second support platform SB2. Furthermore, the first moving mechanism 610 can move the first substrate holding device 100, or both the first substrate holding device 100 and the second substrate holding device 200.

[0147] The second moving mechanism 620 is fixed, for example, to the vertical track SF4. Furthermore, the second moving mechanism 620 moves the second substrate holding device 200 in the vertical direction. The second moving mechanism 620 has an actuator. Although not particularly limited, the second moving mechanism 620 has: a drive source such as a pump or motor; and a transmission member such as a gear to transmit the driving force of the drive source to the second support platform SB2. Furthermore, the second moving mechanism 620 can move the first substrate holding device 100, or both the first substrate holding device 100 and the second substrate holding device 200.

[0148] Continue to refer to Figure 12 The second substrate holding device 200 is described. The second substrate holding device 200 includes a second support stage SB2, a second holding mechanism 210, a second deformation mechanism 270, a second pin actuator 460, and a plurality of second support pins 410.

[0149] As described above, the second support platform SB2 is configured to move in both the vertical and horizontal directions. Furthermore, the second support platform SB2 is formed of a material that is resistant to deformation due to the weight and heat of the second holding mechanism 210. The second support platform SB2 is, for example, formed of stone or a metal frame. The shape of the second support platform SB2 is, for example, a generally cuboid shape. A through hole SBa, in a generally cuboid shape, is formed in the second support platform SB2, extending vertically. That is, the second support platform SB2 is formed as a rectangular ring extending vertically.

[0150] In this embodiment, the second support platform SB2 supports a plurality of second support pins 410 of the second holding mechanism 210. The second support platform SB2 supports the second holding mechanism 210 from above. The outer periphery of the second holding mechanism 210 is fixed to the second support platform SB2 by fasteners such as bolts (not shown).

[0151] The second holding mechanism 210 adsorbs and holds the second substrate W2. The second holding mechanism 210 holds the second substrate W2 in a substantially horizontal position.

[0152] In this embodiment, the second holding mechanism 210 holds the second substrate W2 from above. Furthermore, the second holding mechanism 210 attracts and holds the back surface Wb of the second substrate W2. Therefore, when the second substrate W2 is held by the second holding mechanism 210, the back surface Wb of the second substrate W2 becomes the upper surface, and the front surface Wa of the second substrate W2 becomes the lower surface. While the second substrate W2 can be flipped vertically when it is not held by the second holding mechanism 210, for ease of understanding, in this embodiment, unless specifically stated otherwise, the second substrate W2 is not flipped vertically. That is, in this embodiment, regardless of whether the second substrate W2 is held by the second holding mechanism 210, the front surface Wa of the second substrate W2 is always the lower surface, and the back surface Wb of the second substrate W2 is always the upper surface.

[0153] A portion of the second deformation mechanism 270 is mounted to the upper part of the second holding mechanism 210 using fasteners such as bolts (not shown). Specifically, as described later, the second deformation mechanism 270 has a second moving body 271 and a drive mechanism 273. The drive mechanism 273 is mounted to the upper part of the second holding mechanism 210 using fasteners such as bolts (not shown). The second deformation mechanism 270 has the function of deforming a portion of the second holding mechanism 210. Furthermore, the drive mechanism 273 can be mounted on the second support platform SB2. The structure of the second deformation mechanism 270 will be described later.

[0154] A portion of the suction mechanism 300 is mounted to the first frame SF1 of the support frame SF using fasteners such as bolts (not shown). The suction mechanism 300 is a device for adsorbing the first substrate W1 and the second substrate W2 by the first holding mechanism 110 and the second holding mechanism 210, respectively, and also for suctioning air. Furthermore, a portion of the suction mechanism 300 can be mounted on the first support platform SB1 or the second support platform SB2, a portion of the suction mechanism 300 can also be mounted on the second frame SF2 of the support frame SF, and a portion of the suction mechanism 300 can also be placed on the floor FL provided by the bonding device 1. The structure of the suction mechanism 300 and the suction method of the suction mechanism 300 will be described later.

[0155] A plurality of second support pins 410 are configured to pass through the second holding mechanism 210 in the vertical direction and are configured to be movable relative to the second holding mechanism 210 in the vertical direction. The plurality of second support pins 410 support the second substrate W2 before it is held by the second holding mechanism 210. The plurality of second support pins 410 attract and support the back surface Wb of the second substrate W2. The plurality of second support pins 410 support the second substrate W2 from above. The plurality of second support pins 410 pick up the second substrate W2 from the transport arm TA of the transport device TR.

[0156] Furthermore, a plurality of second support pins 410 deliver the second substrate W2 received from the transport device TR to the second holding mechanism 210. The structure of the plurality of second support pins 410 will be described later.

[0157] The second pin actuator 460 is mounted on the upper part of the second holding mechanism 210 using fasteners such as bolts (not shown). Driving the second pin actuator 460 causes the plurality of second support pins 410 to move up and down. Driving the second pin actuator 460 causes the plurality of second support pins 410 to move up and down, thereby enabling the plurality of second support pins 410 to pick up the second substrate W2 from the transport device TR, or to deliver the second substrate W2 to the second holding mechanism 210. Furthermore, the second pin actuator 460 can be mounted on the second support stage SB2. The structure of the second pin actuator 460 will be described later.

[0158] Next, refer to Figure 13 The first substrate holding device 100 and the second substrate holding device 200 will be further described. Figure 13 A cross-sectional view is shown schematically of the first substrate holding device 100 and the second substrate holding device 200 of the bonding apparatus 1 according to the second embodiment. (See attached image.) Figure 13 As shown, the second substrate holding device 200 is configured identically to the first substrate holding device 100. Furthermore, the second substrate holding device 200 is arranged such that the first substrate holding device 100 can be flipped in the vertical direction. This will be described in detail below.

[0159] The second holding mechanism 210 adsorbs and holds the second substrate W2. The second holding mechanism 210 holds the second substrate W2 in a substantially horizontal position. The second substrate W2 is configured the same as the first substrate W1. However, the second substrate W2 is held by the second substrate holding device 200 with its front side Wa facing downward and its back side Wb facing upward.

[0160] The second holding mechanism 210 includes a second base 220, a second clamp 230, a support wall 140, a retaining ring 150, and a partition wall 160. The second base 220 is generally circular in a top view. The second base 220 is, for example, a plate. The second base 220 has a lower surface 220a and an upper surface 220b. Furthermore, similar to the first base 120, the second base 220 has a first member 121 and a second member 122. The lower surface 220a and the upper surface 220b are configured to be generally horizontal.

[0161] The second clamp 230 is generally circular in a top view. The second clamp 230 is, for example, a plate. The second clamp 230 is disposed below the second base 220. The second clamp 230 is smaller than the second base 220, and the upper surface of the second clamp 230 faces the lower surface 220a of the second base 220. Furthermore, the second clamp 230 is configured to be substantially parallel to the second base 220 at a predetermined interval (e.g., 5 mm or more). The second clamp 230 is, for example, formed of ceramic, resin, metal, or synthetic rubber, and is capable of warping from a few millimeters to about 10 mm.

[0162] The second clamp 230 has a second holding surface 230a and a back surface 230c located on the opposite side of the second holding surface 230a. The second holding surface 230a holds the back surface Wb (here, the upper surface) of the second substrate W2. In this embodiment, the second holding surface 230a is the lower surface of the second clamp 230, and the back surface 230c is the upper surface of the second clamp 230. The back surface Wb (here, the upper surface) of the second substrate W2 is the surface that contacts the second clamp 230.

[0163] The second deformation mechanism 270 deforms the second holding mechanism 210. Furthermore, in this embodiment, the second deformation mechanism 270 deforms the second clamp 230 in a convex shape, protruding from the center of the second holding surface 230a toward the second substrate W2 (in this case, the downward direction). Additionally, the second deformation mechanism 270 deforms the second clamp 230 in a concave shape, recessed from the center of the second holding surface 230a toward the direction away from the second substrate W2 (in this case, the upward direction). That is, the second deformation mechanism 270 deforms the second clamp 230 in either a convex or concave shape, with the second holding surface 230a becoming either a convex shape or a concave shape. Hereinafter, the bending of the second holding surface 230a in a manner protruding from its center toward the second substrate W2 (in this case, the downward direction) is sometimes described as the second holding surface 230a becoming a convex shape. Furthermore, it is sometimes described that the second holding surface 230a is bent in a way that the center of the second holding surface 230a is recessed in a direction away from the second substrate W2 (in this case, the upward direction), and the second holding surface 230a becomes a recessed shape. In this embodiment, the second deformation mechanism 270 has a second moving body 271 fixed to the center of the second clamp 230. The second moving body 271 includes a tube having a through hole 171a.

[0164] In this embodiment, the second deformation mechanism 270 has a drive mechanism 273, which causes the second moving body 271 to move relative to the second base 220 in the vertical direction. Furthermore, to prevent the drawing from becoming complex, except where particularly necessary, Figure 14 The drive mechanism 273 is sometimes omitted hereafter. The drive mechanism 273 has an actuator. Although not specifically limited, the drive mechanism 273 has: a drive source such as a pump or motor; and a transmission member such as a gear or cam to transmit the driving force of the drive source to the second moving body 271. The drive mechanism 273 is, for example, fixed to the upper surface 220b of the second base 220. The drive mechanism 273 is driven, thereby causing the second moving body 271 to move relative to the second base 220 in the vertical direction. As a result, the second clamp 230 deforms.

[0165] The drive mechanism 273 of the second deformation mechanism 270 is configured to be the same as the drive mechanism 173 of the first deformation mechanism 170. Specifically, for example, if the drive mechanism 273 causes the second moving body 271 to move downward relative to the second base 220, since the lower end of the second moving body 271 is fixed to the center of the second clamp 230 by the fixing member 172, the central portion of the second clamp 230 is pushed downward relative to the second base 220 as the second moving body 271 moves downward relative to the second base 220. Therefore, with the outer periphery of the second clamp 230 fixed by the fixing ring 150, the central portion of the second clamp 230 is pushed downward. Therefore, since the second clamp 230 can warp, the second clamp 230 deforms into a convex shape in the downward direction. Therefore, the second holding surface 230a becomes a convex shape.

[0166] Furthermore, for example, if the drive mechanism 273 moves the second movable body 271 upward relative to the second base 220, since the lower end of the second movable body 271 is fixed to the center of the second clamp 230 by the fixing member 172, the central portion of the second clamp 230 is pulled upward relative to the second base 220 as the second movable body 271 moves upward relative to the second base 220. Therefore, with the outer periphery of the second clamp 230 fixed by the fixing ring 150, the central portion of the second clamp 230 is pulled upward. Therefore, since the second clamp 230 can warp, it deforms into an upwardly concave shape. Therefore, the second holding surface 230a becomes concave.

[0167] In this embodiment, the maximum curvature of the convex shape of the first holding surface 130a of the first substrate holding device 100 is greater than the maximum curvature of the concave shape of the first holding surface 130a. In other words, the maximum curvature that the first holding surface 130a can achieve when it is formed as a convex shape is greater than the maximum curvature that the first holding surface 130a can achieve when it is formed as a concave shape. Furthermore, the maximum curvature of the convex shape of the first holding surface 130a can be smaller than the maximum curvature of the concave shape of the first holding surface 130a, or it can be the same as the maximum curvature of the concave shape of the first holding surface 130a.

[0168] Similarly, the maximum curvature of the protruding shape of the second holding surface 230a of the second substrate holding device 200 is greater than the maximum curvature of the recessed shape of the second holding surface 230a. In other words, the maximum curvature that the second holding surface 230a can achieve when it is formed as a protruding shape is greater than the maximum curvature that the second holding surface 230a can achieve when it is formed as a recessed shape. Furthermore, the maximum curvature of the protruding shape of the second holding surface 230a can be smaller than the maximum curvature of the recessed shape of the second holding surface 230a, or it can be the same as the maximum curvature of the recessed shape of the second holding surface 230a.

[0169] Furthermore, in this embodiment, the maximum curvature of the convex shape of the first retaining surface 130a is approximately the same as the maximum curvature of the convex shape of the second retaining surface 230a. Additionally, the maximum curvature of the concave shape of the first retaining surface 130a is approximately the same as the maximum curvature of the concave shape of the second retaining surface 230a.

[0170] In this embodiment, the suction mechanism 300 of the bonding device 1 (refer to...) Figure 12 The suction mechanism 300 is connected to the through holes 171a, 121b, and 122b of the first substrate holding device 100 and the second substrate holding device 200, and draws in air. Specifically, the suction mechanism 300 includes: a pipe 301a connected to the through holes 171a, 121b, and 122b of the first substrate holding device 100; a pipe 301c connected to the through holes 171a, 121b, and 122b of the second substrate holding device 200; and a suction device 302 (see reference 302). Figure 12 The suction device 302 uses fasteners such as bolts (not shown) to be installed, for example, on the first frame SF1 of the support frame SF (see reference). Figure 12 ).

[0171] In this embodiment, the suction mechanism 300 includes adjustment sections 303a, 303b, and 303c. Adjustment sections 303a, 303b, and 303c respectively adjust the attraction force on the through holes 171a, 121b, and 122b. Adjustment sections 303a, 303b, and 303c may include actuators, for example. Although not particularly limited, adjustment sections 303a, 303b, and 303c may include, for example, adjustment valves provided on pipes 301a and 301c. Furthermore, to adjust the attraction force on the through holes 171a, 121b, and 122b, the suction mechanism 300 may, for example, have multiple suction pumps or multiple exhaust fans to adjust the attraction force on the through holes 171a, 121b, and 122b respectively. Additionally, the bonding device 1 may not have a suction device 302. For example, pipes 301a and 301c can also be connected to an external suction device 302.

[0172] Figure 14 A cross-sectional view of the second substrate holding device 200 is shown schematically, illustrating the state in which the second support pin 410 is positioned at the protruding position P1. (See diagram below.) Figure 14 As shown, in this embodiment, the second substrate holding device 200 has a plurality of second support pins 410. The plurality of second support pins 410 support the second substrate W2 before it is held by the second holding mechanism 210. Alternatively, the second substrate holding device 200 may not have a plurality of second support pins 410.

[0173] In this embodiment, a plurality of second support pins 410 attract and hold the back surface Wb (here, the upper surface) of the second substrate W2. The second support pins 410 have through holes for air passage. The suction mechanism 300 includes: a conduit 301d connected to the through hole of the second support pin 410; and a valve 310a that switches the conduit 301d to an open or closed state. The conduit 301d is, for example, a rubber tube. The upper end (not shown) of the second support pin 410 is inserted into the rubber tube, thereby connecting the second support pin 410 to the conduit 301d. When the suction mechanism 300 is activated and the valve 310a is opened, air in the through hole of the second support pin 410 is drawn in, creating a negative pressure within the through hole of the second support pin 410. Therefore, if the second substrate W2 is brought close to the front end (here, the lower end) of the second support pin 410 while the suction device 302 is driven and the valve 301a is open, the back surface Wb of the second substrate W2 will be attracted by the second support pin 410. Furthermore, a suction device different from the suction device 300 can be connected to the through hole of the second support pin 410. Additionally, although not shown, the second substrate holding device 200 can be configured such that after the second substrate W2 is delivered from the second support pin 410 to the second holding surface 230a with the second holding surface 230a facing upwards, the second holding mechanism 210 flips up and down. In this case, the second support pin 410 may not attract the second substrate W2.

[0174] The other components of the second support pin 410 are the same as those of the support pin 400. For example, the second support pin 410 can be positioned at the protruding position P1 (refer to...). Figure 14 The position moves between the protruding position P1 and the non-protruding position P2. The protruding position P1 is the position that protrudes downward from the second holding surface 230a, and the non-protruding position P2 is the position that does not protrude downward from the second holding surface 230a.

[0175] As described above, the second substrate holding device 200 includes a pin actuator 460 that moves the second support pin 410 in the vertical direction. The pin actuator 460 is, for example, fixed to the upper surface 220b of the second base 220. While not specifically limited, the pin actuator 460 includes a drive source, such as a pump or motor, and a transmission member, such as a gear and / or a cam, to transmit the driving force of the drive source to the upper part of the second support pin 410. The pin actuator 460 is driven, thereby causing the second support pin 410 to move relative to the second base 220 and the second clamp 230 in the vertical direction. For example, the pin actuator 460 moves the second support pin 410 to a protruding position P1, whereby the second support pin 410 protrudes from the second holding surface 230a, enabling the second substrate W2 to be picked up from the transport device TR. That is, the second support pin 410 holds the second substrate W2 at the protruding position P1. When the second substrate W2 is picked up from the transport device TR by the second support pin 410, the second substrate W2 is picked up while protruding from the second holding surface 230a by, for example, more than 10 mm. At this time, the height positions of the tips of all the second support pins 410 are approximately the same. Although the second substrate W2 may warp by a maximum of about a few mm, the air suction caused by the second support pins 410 pulls the second substrate W2 closer and attracts it. Furthermore, for example, the pin actuator 460 moves the second support pin 410 from the protruding position P1 to the non-protruding position P2, thereby preventing the second support pin 410 from protruding from the second holding surface 230a. As a result, since the second substrate W2 moves upward from the position below the second holding surface 230a, the second substrate W2 is delivered from the second support pin 410 to the second holding surface 230a.

[0176] Furthermore, in this embodiment, the second substrate holding device 200 includes a warpage detection device 500 for detecting warpage of the second substrate W2. Alternatively, the second substrate holding device 200 may not include the warpage detection device 500.

[0177] The other structures of the second substrate holding device 200 are the same as those of the first substrate holding device 100.

[0178] Next, refer to Figure 15 Further explanation of bonding device 1. Figure 15 A block diagram illustrating the configuration of the bonding device 1 according to the second embodiment.

[0179] In this embodiment, the bonding apparatus 1 includes a control device 190. In this embodiment, the control device 190 controls the bonding apparatus 1. The control device 190 also controls the first substrate holding device 100, the second substrate holding device 200, and the suction mechanism 300, etc.

[0180] The control device 190 includes a control unit 191 and a storage unit 193. The storage unit 193 stores data and computer programs. The data, for example, specifies the processing content and sequence for holding the first substrate W1 and the second substrate W2. Furthermore, the data specifies the processing content and sequence for bonding the first substrate W1 and the second substrate W2. The control unit 191 executes the computer program stored in the storage unit 193 and performs substrate holding and substrate bonding operations.

[0181] The control unit 191 controls the first moving mechanism 610. The control unit 191 aligns the first substrate holding device 100 and the second substrate holding device 200 via the first moving mechanism 610. Specifically, the control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the horizontal direction via the first moving mechanism 610. In this embodiment, the control unit 191 moves the second substrate holding device 200 in the horizontal direction via the first moving mechanism 610.

[0182] The control unit 191 controls the second moving mechanism 620. The control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the vertical direction via the second moving mechanism 620. In this embodiment, the control unit 191 moves the second substrate holding device 200 relative to the first substrate holding device 100 in the vertical direction via the second moving mechanism 620.

[0183] The control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200. The control unit 191 acquires warpage information of the first substrate W1 and the second substrate W2. Similar to the first embodiment, the control unit 191 controls the first substrate holding device 100 to hold the first substrate W1 based on the warpage information of the first substrate W1. Furthermore, similar to the first embodiment, the control unit 191 controls the second substrate holding device 200 to hold the second substrate W2 based on the warpage information of the second substrate W2.

[0184] The warpage information of the second substrate W2 indicates that the second substrate W2 has a recessed shape, a convex shape, or a planar shape. Specifically, the recessed shape of the second substrate W2 indicates that the front surface Wa (here, the lower surface) of the second substrate W2 is recessed towards the back surface Wb (here, the upward direction), and the back surface Wb (here, the upper surface) protrudes towards the opposite side of the front surface Wa (here, the upward direction). That is, in this embodiment, the recessed shape of the second substrate W2 indicates that the center of the front surface Wa (here, the lower surface) of the second substrate W2 is recessed upward. Furthermore, the convex shape of the second substrate W2 indicates that the front surface Wa of the second substrate W2 protrudes towards the opposite side of the back surface Wb (here, the downward direction), and the back surface Wb is recessed towards the front surface Wa (here, the downward direction). That is, in this embodiment, the convex shape of the second substrate W2 indicates that the center of the front surface Wa of the substrate W2 protrudes downward. The planar shape of the substrate is a shape in which both the front surface Wa and the back surface Wb of the second substrate W2 are planar. Furthermore, in the following description, the state in which the substrate W (first substrate W1 and second substrate W2) is a recessed substrate shape is sometimes referred to as a recessed front side Wa. Furthermore, the state in which the substrate W (first substrate W1 and second substrate W2) is a convex substrate shape is sometimes referred to as a convex front side Wa. Furthermore, the state in which the substrate W (first substrate W1 and second substrate W2) is a planar substrate shape is sometimes referred to as a planar front side Wa. In this embodiment, the warp information of the second substrate W2 indicates the warp direction and the amount of warp of the second substrate W2.

[0185] Furthermore, based on the warping information of the first substrate W1 and the second substrate W2, the control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200 to bond the first substrate W1 and the second substrate W2 together.

[0186] The other structures of the second embodiment are the same as those of the first embodiment.

[0187] Next, refer to Figure 16 The bonding method of the bonding device 1 in this embodiment will be explained. Figure 16 This is a flowchart illustrating the bonding method of the bonding apparatus 1 according to the second embodiment. In this embodiment, the bonding method of the bonding apparatus 1 includes steps S21 to S24. Step S21 is an example of the "process of holding the first substrate" of the present invention. Step S22 is an example of the "process of holding the second substrate" of the present invention. Step S24 is an example of the "bonding process" of the present invention.

[0188] like Figure 16 As shown, in step S21, the control unit 191 holds the first substrate W1 via the first substrate holding device 100. Specifically, compared with using Figure 9Similarly, in the substrate holding method described, the control unit 191 causes the first substrate holding device 100 to hold the first substrate W1. At this time, the front side Wa of the first substrate W1 faces upward and the back side Wb of the first substrate W1 faces downward.

[0189] Next, in step S22, the control unit 191 holds the second substrate W2 via the second substrate holding device 200. Specifically, compared with using Figure 9 Similarly, in the described substrate holding method, the control unit 191 causes the second substrate holding device 200 to hold the second substrate W2. At this time, the second support pin 410 of the second substrate holding device 200 attracts the second substrate W2 and supports the back surface Wb of the second substrate W2. Furthermore, at this time, the front surface Wa of the second substrate W2 faces downward, and the back surface Wb of the second substrate W2 faces upward. In addition, after holding the second substrate W2 with the second holding surface 230a facing upward, the second substrate holding device 200 can be flipped up and down by a flipping mechanism (not shown).

[0190] Furthermore, the processing order of steps S21 and S22 can be reversed or performed in parallel.

[0191] Next, in step S23, the control unit 191 aligns the first substrate W1 and the second substrate W2 via the first moving mechanism 610. Specifically, the control unit 191 obtains relative position information (not shown) via a position detection sensor, which indicates the relative position of the first substrate W1 and the second substrate W2. For example, the position detection sensor detects alignment marks provided on the first substrate W1 and the second substrate W2. Furthermore, based on the relative position information, the control unit 191 moves the second substrate holding device 200 horizontally via the first moving mechanism 610. This aligns the first substrate W1 and the second substrate W2. Additionally, when detecting the alignment marks via the position detection sensor, the front surfaces Wa of the first substrate W1 and the second substrate W2 can be formed into a planar shape via the first deformation mechanism 170 and the second deformation mechanism 270. This configuration improves the detection accuracy of the position detection sensor.

[0192] Next, in step S24, the control unit 191 uses the second moving mechanism 620 to bring the first substrate W1 and the second substrate W2 together. Specifically, the control unit 191 moves at least one of the first substrate W1 and the second substrate W2 in the vertical direction to bring the first substrate W1 and the second substrate W2 together. In this embodiment, the control unit 191 uses the second moving mechanism 620 to move the second substrate holding device 200 in the downward direction to bring the first substrate W1 and the second substrate W2 together.

[0193] At this time, based on the warping information of the first substrate W1 and the warping information of the second substrate W2, the control unit 191 deforms at least one of the first clamp 130 of the first substrate holding device 100 and the second clamp 230 of the second substrate holding device 200, so that the first substrate W1 and the second substrate W2 are attached together.

[0194] The bonding process is now complete, as described above.

[0195] Next, refer to Figure 17 Step S24 of the bonding method of the second embodiment will be described in detail. Figure 17 This is a flowchart illustrating the bonding process (step S24) in the bonding method of the bonding device 1 according to the second embodiment. In this embodiment, the bonding process (step S24) includes steps S241 to S244.

[0196] like Figure 17 As shown, in step S241, the control unit 191 determines the warping shape of the first clamp 130 and the second clamp 230 during bonding based on the warping information. Specifically, the control unit 191 determines the combination mode of the warping directions of the first substrate W1 and the second substrate W2 based on the warping information of the first substrate W1 and the second substrate W2.

[0197] Specifically, there are six possible combinations of warpage directions for the first substrate W1 and the second substrate W2. For example, the first combination is as follows: both the front surfaces Wa of the first substrate W1 and the second substrate W2 are planar (substrate planar shape). The second combination is as follows: one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is planar (substrate planar shape), and the other is convex (substrate convex shape). The third combination is as follows: one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is planar (substrate planar shape), and the other is concave (substrate concave shape). The fourth combination is as follows: both the front surfaces Wa of the first substrate W1 and the second substrate W2 are convex (substrate convex shape). The fifth combination mode is as follows: one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is a convex shape (substrate convex shape), and the other of the front surfaces Wa of the first substrate W1 and the second substrate W2 is a recessed shape (substrate recessed shape). The sixth combination mode is as follows: both the front surfaces Wa of the first substrate W1 and the second substrate W2 are recessed shapes (substrate recessed shape).

[0198] Then, the control unit 191 determines the warping shape of the first clamp 130 and the second clamp 230 during bonding based on the first to sixth combination modes. That is, the control unit 191 determines the warping shape of the first holding surface 130a and the second holding surface 230a during bonding.

[0199] In this embodiment, the control unit 191 can determine the warpage of the first clamp 130 and the second clamp 230 during bonding based on the warpage of the first substrate W1 and the second substrate W2. That is, the control unit 191 can determine the warpage of the first holding surface 130a and the second holding surface 230a during bonding.

[0200] Next, in step S242, the control unit 191 deforms the first clamp 130 and the second clamp 230 to a warped shape determined in step S241. Specifically, the control unit 191 deforms the first clamp 130 via the first deformation mechanism 170 and the second clamp 230 via the second deformation mechanism 270 to a warped shape determined in step S241. At this time, for example, the control unit 191 drives the first deformation mechanism 170 while the first base 120 is fixed, thereby causing the first moving body 171 to move relative to the first base 120 in the vertical direction, thus deforming the first clamp 130. Furthermore, at this time, for example, the control unit 191 drives the second deformation mechanism 270 while the second base 220 is fixed, thereby causing the second moving body 271 to move relative to the second base 220 in the vertical direction, thus deforming the second clamp 230.

[0201] Next, in step S243, the control unit 191 makes point contact between the first substrate W1 and the second substrate W2. Specifically, the control unit 191 makes the center of the first substrate W1 and the center point of the second substrate W2 make contact via the second moving mechanism 620.

[0202] Next, in step S244, the control unit 191 brings the first substrate W1 into full-surface contact with the second substrate W2. That is, the control unit 191 makes the first substrate W1 and the second substrate W2 adhere together.

[0203] The following is for reference Figures 18 to 23 The bonding methods for the first to sixth combination patterns are further explained.

[0204] [First Combination Pattern] Figure 18 This is a schematic diagram illustrating the bonding method of the first combination pattern. (Refer to...) Figure 18 This describes the case where both the front surfaces Wa of the first substrate W1 and the second substrate W2 are planar. In other words, it describes the case where both the first substrate W1 and the second substrate W2 are planar substrates.

[0205] like Figure 18 As shown, when both the front surfaces Wa of the first substrate W1 and the second substrate W2 are planar ( Figure 18 (As shown in the upper part), the control unit 191 maintains either the first holding surface 130a of the first clamp 130 or the second holding surface 230a of the second clamp 230 in a planar shape, and forms the other of the first holding surface 130a and the second holding surface 230a into a convex shape. In this embodiment, the control unit 191 may, for example, maintain the first holding surface 130a in a planar shape and form the second holding surface 230a into a convex shape ( Figure 18 (The state shown in the middle part). At this time, for example, the control unit 191 drives the second deformation mechanism 270 while the second base 220 is fixed, thereby causing the second moving body 271 to move relative to the second base 220 in the downward direction, thereby forming the second holding surface 230a into a convex shape. In addition, the control unit 191 may, for example, form both the first holding surface 130a and the second holding surface 230a into convex shapes.

[0206] Subsequently, the control unit 191 moves the second substrate holding device 200 downward via the second moving mechanism 620. At this time, the second support platform SB2, the second base 220, and the second support pin 410 move downward by the same amount. As a result, the front surface Wa (upper surface in this case) of the first substrate W1 makes point contact with the front surface Wa (lower surface in this case) of the second substrate W2.

[0207] Then, the control unit 191 gradually reduces the attractive force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second clamp 230 by the restoring force of the second substrate W2, and while deforming the front surface Wa (the lower surface in this case) of the second substrate W2 in a near-planar manner, the entire front surface Wa of the second substrate W2 is pressed tightly against the entire front surface Wa (the upper surface in this case) of the first substrate W1. Figure 18 (The state shown in the lower part). Specifically, starting from the point where the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2 are in contact at the center, the contact area gradually expands radially outward, and the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2 are in contact across their entire surfaces. Therefore, the generation of gaps between the first substrate W1 and the second substrate W2 is suppressed.

[0208] Furthermore, in this embodiment, the control unit 191 gradually reduces the attractive force on the second substrate W2 from the center outwards. Specifically, the control unit 191 switches the adjustment unit 303a from the open state to the closed state, then switches the adjustment unit 303b from the open state to the closed state, and then switches the adjustment unit 303c from the open state to the closed state. This sequentially reduces the attractive force on the through holes 171a, 121b, and 122b. Therefore, starting from the point of contact between the first substrate W1 and the second substrate W2 at a central point, the contact area between the first substrate W1 and the second substrate W2 easily expands outwards. Thus, it is easier to suppress the formation of gaps between the first substrate W1 and the second substrate W2.

[0209] Furthermore, although not shown, the control unit 191 can deform the second clamp 230 from a point-contact state between the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2, without reducing the attraction force on the second substrate W2, and instead making the second holding surface 230a planar. In this case, the control unit 191 moves the second base 220 downwards without moving the second moving body 271 in the vertical direction. Specifically, the control unit 191 moves the second base 220 downwards via the second deformation mechanism 270, while simultaneously moving the second moving body 271 upwards relative to the second base 220 at the same speed via the drive mechanism 273. At this time, the control unit 191 moves the second support pin 410 of the second substrate holding device 200 upwards relative to the second base 220 via the pin actuator 460, ensuring that the second support pin 410 does not protrude downwards from the second holding surface 230a. Thus, the first substrate W1 and the second substrate W2 are in full-surface contact.

[0210] [Second Combination Mode] Figure 19 This is a schematic diagram illustrating the bonding method of the second combination mode. (Refer to...) Figure 19 This describes the case where one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is planar and the other is convex. In other words, it describes the following situation: one of the first substrate W1 and the second substrate W2 is planar, and the other is convex.

[0211] like Figure 19 As shown, in the case where one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is planar and the other of the front surfaces Wa of the first substrate W1 and the second substrate W2 is convex ( Figure 19(As shown in the upper part), the control unit 191, for example, maintains one of the first holding surface 130a of the first clamp 130 and the second holding surface 230a of the second clamp 230 in a planar shape, and forms the other of the first holding surface 130a and the second holding surface 230a in a convex shape. Here, the following example is given: the front surface Wa of the first substrate W1 is convex, and the front surface Wa of the second substrate W2 is planar. The control unit 191, for example, maintains the first holding surface 130a in a convex shape and maintains the second holding surface 230a in a planar shape. Figure 19 (The state shown in the middle part). In addition, the control unit 191 can form both the first holding surface 130a and the second holding surface 230a into a convex shape.

[0212] Subsequently, the control unit 191 moves the second substrate holding device 200 downward via the second moving mechanism 620. As a result, the front surface Wa (upper surface) of the first substrate W1 makes point contact with the front surface Wa (lower surface) of the second substrate W2.

[0213] Then, the control unit 191 deforms the first clamp 130 via the first deformation mechanism 170 to make the first holding surface 130a planar, while simultaneously bringing the front surface Wa (lower surface in this case) of the second substrate W2 into contact with the front surface Wa (upper surface in this case) of the first substrate W1. In this case, the control unit 191 moves the first moving body 171 downward relative to the first base 120 via the drive mechanism 173, while simultaneously moving the second substrate holding device 200 downward at the same speed via the second moving mechanism 620. Thus, the first substrate W1 and the second substrate W2 are in full-surface contact ( Figure 19 (The state shown in the lower part). Alternatively, although not shown, the control unit 191 may, for example, deform the second clamp 230 in such a way that the second holding surface 230a becomes a concave shape while bringing the front surface Wa (lower surface in this case) of the second substrate W2 into contact with the front surface Wa (upper surface in this case) of the first substrate W1.

[0214] [Third Combination Mode] Figure 20 This is a schematic diagram illustrating the bonding method of the third combination mode. (Refer to...) Figure 20 This describes the case where one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is planar and the other is recessed. In other words, it describes the following situation: one of the first substrate W1 and the second substrate W2 is planar, and the other is recessed.

[0215] like Figure 20As shown, in the case where one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is planar and the other of the front surfaces Wa of the first substrate W1 and the second substrate W2 is recessed ( Figure 20 (As shown in the upper part), the control unit 191, for example, forms one of the first holding surface 130a of the first clamp 130 and the second holding surface 230a of the second clamp 230 into a convex shape, and the other of the first holding surface 130a and the second holding surface 230a into a concave shape. Here, the following example is given: the front surface Wa of the first substrate W1 is concave, and the front surface Wa of the second substrate W2 is convex. The control unit 191, for example, maintains the first holding surface 130a in a concave shape, and forms the second holding surface 230a into a convex shape by means of the second deformation mechanism 271. Figure 20 (The state shown in the middle part). At this time, for example, the control unit 191 drives the second deformation mechanism 270 while the second base 220 is fixed, thereby moving the second moving body 271 relative to the second base 220 in the downward direction, thereby forming the second holding surface 230a into a convex shape. In addition, the control unit 191 can form both the first holding surface 130a and the second holding surface 230a into convex shapes. However, for example, if the substrate W (here, the first substrate W1) that makes the front surface Wa into a concave shape is deformed in a way that makes the front surface Wa into a convex shape, the stress applied to the substrate W is likely to increase. Therefore, it is preferable not to deform the substrate W in a way that reverses the warping direction of the substrate W.

[0216] When one of the first retaining surface 130a and the second retaining surface 230a is formed into a convex shape and the other of the first retaining surface 130a and the second retaining surface 230a is formed into a concave shape, the control unit 191 makes the curvature of one of the first retaining surface 130a and the second retaining surface 230a greater than the curvature of the other of the first retaining surface 130a. In this embodiment, the control unit 191 makes the curvature of the second retaining surface 230a greater than the curvature of the first retaining surface 130a.

[0217] Subsequently, the control unit 191 moves the second substrate holding device 200 downward via the second moving mechanism 620. As a result, the front surface Wa (upper surface) of the first substrate W1 makes point contact with the front surface Wa (lower surface) of the second substrate W2.

[0218] Then, the control unit 191 gradually reduces the attractive force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second clamp 230, and while deforming the front surface Wa (here, the lower surface) of the second substrate W2 in a near-planar manner, the entire surface Wa of the second substrate W2 is pressed tightly against the entire surface Wa (here, the upper surface) of the first substrate W1. Figure 20 (The state shown in the lower part). Furthermore, the method for reducing the attractive force and the method for expanding the contact area between the first substrate W1 and the second substrate W2 are the same as those for bonding in the first combination mode described above.

[0219] Furthermore, although not shown, it is also possible that: from the point of contact between the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2, the control unit 191 does not reduce the attractive force on the second substrate W2, but deforms the second clamp 230 so that the second holding surface 230a is nearly planar. In this case, the control unit 191 moves the second base 220 downward in such a way that the second moving body 271 does not move in the vertical direction. The method of moving the second base 220 downward in such a way that the second moving body 271 does not move in the vertical direction is the same as the bonding method of the first combination mode described above. As a result, the first substrate W1 and the second substrate W2 are in full-surface contact.

[0220] [Fourth Combination Pattern] Figure 21 This is a schematic diagram illustrating the bonding method of the fourth combination mode. (Refer to...) Figure 21 This describes the case where both the front surfaces Wa of the first substrate W1 and the second substrate W2 are convex. In other words, it describes the case where both the first substrate W1 and the second substrate W2 are convex.

[0221] like Figure 21 As shown, when both the front surfaces Wa of the first substrate W1 and the second substrate W2 are convex ( Figure 21 (as shown in the upper part), for example, the control unit 191 maintains both the first holding surface 130a of the first clamp 130 and the second holding surface 230a of the second clamp 230 in a convex shape. Figure 21 (The state shown in the middle part). In addition, for example, the control unit 191 can form one of the first holding surface 130a and the second holding surface 230a as a plane.

[0222] Subsequently, the control unit 191 moves the second substrate holding device 200 downward via the second moving mechanism 620. As a result, the front surface Wa (upper surface) of the first substrate W1 makes point contact with the front surface Wa (lower surface) of the second substrate W2.

[0223] Then, the control unit 191 deforms the first clamp 130, for example, by making the first holding surface 130a planar, and deforms the second clamp 230 by making the second holding surface 230a planar. In this case, the control unit 191 moves the first moving body 171 downward relative to the first base 120 via the drive mechanism 173, and moves the second moving body 271 downward at the same speed via the drive mechanism 273. At this time, the control unit 191 moves the second base 220 downward at a speed greater than that of the second moving body 271. That is, the control unit 191 moves the second moving body 271 upward relative to the second base 220 via the drive mechanism 273. Furthermore, at this time, the control unit 191 moves the second support pin 410 upward relative to the second base 220 via the drive mechanism 173 such that the second support pin 410 does not protrude downward from the second holding surface 230a. As a result, the first substrate W1 and the second substrate W2 are in full-surface contact ( Figure 21 (The state shown in the lower part). Alternatively, although not shown, it could also be that the control unit 191 deforms either the first holding surface 130a or the second holding surface 230a by making either of them concave. As a result, the first substrate W1 and the second substrate W2 are in full-surface contact.

[0224] [Fifth Combination Mode] Figure 22 This is a schematic diagram illustrating the bonding method of the fifth combination mode. (Refer to...) Figure 22 This describes a situation where one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is convex and the other is concave. In other words, it describes the following situation: one of the first substrate W1 and the second substrate W2 is convex, and the other is concave.

[0225] like Figure 22 As shown, in the case where one of the front surfaces Wa of the first substrate W1 and the second substrate W2 is convex and the other of the front surfaces Wa of the first substrate W1 and the second substrate W2 is concave ( Figure 22(As shown in the upper part), the control unit 191, for example, maintains one of the first holding surface 130a of the first clamp 130 and the second holding surface 230a of the second clamp 230 in a convex shape, and maintains the other of the first holding surface 130a and the second holding surface 230a in a concave shape. Here, the following example is given: the front surface Wa of the first substrate W1 is concave, and the front surface Wa of the second substrate W2 is convex. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a in a concave shape and the second holding surface 230a in a convex shape. Figure 22 (The state shown in the middle part). In addition, the control unit 191 may, for example, form the first holding surface 130a as a plane.

[0226] When one of the first retaining surface 130a and the second retaining surface 230a is formed into a convex shape and the other of the first retaining surface 130a and the second retaining surface 230a is formed into a concave shape, the control unit 191 makes the curvature of one of the first retaining surface 130a and the second retaining surface 230a greater than the curvature of the other of the first retaining surface 130a. In this embodiment, the control unit 191 makes the curvature of the second retaining surface 230a greater than the curvature of the first retaining surface 130a.

[0227] Subsequently, the control unit 191 moves the second substrate holding device 200 downward via the second moving mechanism 620. As a result, the front surface Wa (upper surface) of the first substrate W1 makes point contact with the front surface Wa (lower surface) of the second substrate W2.

[0228] Then, instead of reducing the attractive force on the second substrate W2, the control unit 191 deforms the second clamp 230 by means of the first deformation mechanism 170, making the second holding surface 230a nearly planar. In this case, the control unit 191 moves the second base 220 downwards without moving the second moving body 271 in the vertical direction. The method of moving the second base 220 downwards without moving the second moving body 271 is the same as the method used in the first combination mode described above. As a result, the first substrate W1 and the second substrate W2 are in full-surface contact. Alternatively, although not shown, it is also possible that the control unit 191 deforms the first clamp 130 such that the curvature of the first holding surface 130a is the same as the curvature of the second holding surface 230a. As a result, the first substrate W1 and the second substrate W2 are in full-surface contact.

[0229] [Sixth Combination Pattern] Figure 23 This is a schematic diagram illustrating the bonding method of the sixth combination pattern. (Refer to...) Figure 23This describes the case where both the front surfaces Wa of the first substrate W1 and the second substrate W2 are recessed. In other words, it describes the case where both the first substrate W1 and the second substrate W2 are recessed.

[0230] like Figure 23 As shown, when both the front surfaces Wa of the first substrate W1 and the second substrate W2 are recessed ( Figure 23 (As shown in the upper part), the control unit 191, for example, forms one of the first holding surface 130a of the first clamp 130 and the second holding surface 230a of the second clamp 230 into a convex shape, and maintains the other of the first holding surface 130a and the second holding surface 230a into a concave shape. It appropriately determines which of the first holding surface 130a and the second holding surface 230a should be formed into a convex shape. For example, the control unit 191 may form the holding surface for holding the substrate with less warping in the first substrate W1 and the second substrate W2 into a convex shape. Alternatively, the control unit 191 may form the holding surface for holding the substrate with less adverse effects caused by stress into a convex shape. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a in a concave shape and forms the second holding surface 230a into a convex shape ( Figure 23 (The state shown in the middle part). At this time, for example, the control unit 191 drives the second deformation mechanism 270 while the second base 220 is fixed, thereby causing the second moving body 271 to move relative to the second base 220 in the downward direction, thereby forming the second holding surface 230a into a convex shape. In addition, the control unit 191 may, for example, form the other of the first holding surface 130a and the second holding surface 230a into a planar shape or a convex shape.

[0231] When one of the first retaining surface 130a and the second retaining surface 230a is formed into a convex shape and the other of the first retaining surface 130a and the second retaining surface 230a is formed into a concave shape, the control unit 191 makes the curvature of one of the first retaining surface 130a and the second retaining surface 230a greater than the curvature of the other of the first retaining surface 130a. In this embodiment, the control unit 191 makes the curvature of the second retaining surface 230a greater than the curvature of the first retaining surface 130a.

[0232] Subsequently, the control unit 191 moves the second substrate holding device 200 downward via the second moving mechanism 620. As a result, the front surface Wa (upper surface) of the first substrate W1 makes point contact with the front surface Wa (lower surface) of the second substrate W2.

[0233] Then, the control unit 191 gradually reduces the attractive force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second clamp 230, and while deforming the front surface Wa (in this case, the lower surface) of the second substrate W2 to near-planar shape, the entire front surface Wa of the second substrate W2 is pressed tightly against the entire front surface Wa (in this case, the upper surface) of the first substrate W1. Figure 23 (The state shown in the lower part). Furthermore, the method for reducing the attractive force and the method for expanding the contact area between the first substrate W1 and the second substrate W2 are the same as those for the bonding of the first combination mode described above.

[0234] In this embodiment, as described above, the first deformation mechanism 170 deforms the first clamp 130 in a manner that makes the first holding surface 130a convex and concave. Furthermore, the second deformation mechanism 270 deforms the second clamp 230 in a manner that makes the second holding surface 230a convex and concave. Therefore, during bonding, the warped shapes of the first clamp 130 and the second clamp 230 can be combined in various ways. Thus, the increase in stress applied to the first substrate W1 and the second substrate W2 can be suppressed.

[0235] Furthermore, as described above, the first substrate W1 and the second substrate W2 are bonded together with one of the first holding surface 130a and the second holding surface 230a being formed as a convex shape and the other of the first holding surface 130a and the second holding surface 230a being formed as a concave shape. Therefore, when, for example, the first substrate W1 with a concave shape on its front surface Wa is bonded together with the second substrate W2 with a convex shape on its front surface Wa, the first substrate W1 and the second substrate W2 can be bonded together while maintaining the warp direction of the first substrate W1 and the warp direction of the second substrate W2. Therefore, it is easy to suppress the increase of stress applied to the first substrate W1 and the second substrate W2.

[0236] Furthermore, as described above, the maximum curvature of the convex shapes of the first retaining surface 130a and the second retaining surface 230a is greater than the maximum curvature of the concave shapes of the first retaining surface 130a and the second retaining surface 230a. Therefore, in cases where, for example, the first retaining surface 130a is formed as a concave shape and the second retaining surface 230a is formed as a convex shape (see, for example, refer to...) Figure 20 (the middle part), which can easily make the curvature of the second retaining surface 230a greater than the curvature of the first retaining surface 130a.

[0237] The other structures and other effects of the second embodiment are the same as those of the first embodiment.

[0238] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described above, and can be implemented in various ways without departing from the spirit of the present invention. Furthermore, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the embodiments described above. For example, some of the constituent elements shown in all the embodiments can be deleted. Moreover, constituent elements in different embodiments can be appropriately combined. In order to facilitate understanding of the present invention, the accompanying drawings show the main components schematically, and the thickness, length, number, spacing, etc. of the constituent elements shown in the drawings may sometimes differ from the actual figures due to the nature of the drawings. In addition, the material, shape, size, etc. of the constituent elements shown in the embodiments described above are examples and are not particularly limited, and various changes can be made without substantially departing from the effects of the present invention.

[0239] For example, although an example of a semiconductor wafer being used as substrate W has been described in this embodiment, the present invention is not limited thereto. The present invention can use various substrates other than semiconductor wafers as substrate W.

[0240] Furthermore, although an example has been described in the second embodiment where both the first holding surface 130a of the first substrate holding device 100 and the second holding surface 230a of the second substrate holding device 200 are deformed into convex and concave shapes, the present invention is not limited thereto. For example, the first holding surface 130a of the first substrate holding device 100 may be deformed into both convex and concave shapes, while the second holding surface 230a of the second substrate holding device 200 may not be deformed into a concave shape. That is, the bonding device may be constituted by the first substrate holding device 100 and the second substrate holding device 200 having a different structure from the first substrate holding device 100. However, when the bonding device is constituted by the first substrate holding device 100 and the second substrate holding device having a different structure from the first substrate holding device 100, it is preferable that the first substrate holding device 100 without the second support pin 410 is disposed below the second substrate holding device. In other words, the first substrate holding device 100 preferably holds the lower substrate of the two substrates.

[0241] Furthermore, although examples have been described above of deforming the clamp by moving a movable body fixed to the clamp in the vertical direction, the present invention is not limited thereto. For example, a sealed space may be provided between the clamp and the base, and compressed air may be injected into the sealed space or the pressure in the sealed space may be reduced, thereby deforming the clamp. In this case, the deformation mechanism may include, for example, a pump or a fan.

[0242] Industrial applicability This invention is applicable to substrate holding devices, bonding devices, substrate holding methods, and bonding methods.

[0243] Explanation of reference numerals in the attached figures 1: Adhesion device 100: Substrate holding device, first substrate holding device 110: Maintaining organization, First Maintaining Organization 120: Base, First Base 120c: Insertion slot (insertion hole) 120d: Inner surface 130: Fixture, First Fixture 130a: Holding surface, first holding surface 160: Next door 160a: Front end face 170: Deformation mechanism, first deformation mechanism 171: Moving body 171a: Through hole 191: Control Department 200: Second substrate holding device 210: Second Maintaining Agency 220: Second Plinth 230: Second clamp 230a: Second retaining surface 270: Second Deformation Mechanism 400: Support pin, first support pin 410: Second support pin S, S1, S2: Space S120: Area S11: Step (Process for preparing the substrate) S14: Step (Process of holding the substrate) S21: Step (Process of holding the first substrate) S22: Step (Process of holding the second substrate) S24: Step (Lamination Process) W: substrate W1: First substrate W2: Second substrate Wa: front Wb: Back side (one side).

Claims

1. A substrate holding device, wherein, have: The holding mechanism adsorbs and holds the substrate; and A deformation mechanism is used to deform the retaining mechanism. The retaining mechanism has: A clamp having a holding surface that holds one side of the substrate; and A base is disposed on the opposite side of the retaining surface of the clamp, and the clamp is mounted thereon. The deformation mechanism deforms the fixture in such a way that the retaining surface can achieve both a convex shape and a concave shape. The convex shape is a shape in which the center of the retaining surface protrudes towards the substrate side, and the concave shape is a shape in which the center of the retaining surface is recessed towards the base side.

2. The substrate holding device according to claim 1, wherein, The substrate holding device includes a control unit for controlling the deformation mechanism. The control unit acquires warpage information indicating at least one warpage direction of the substrate. The control unit deforms the clamp via the deformation mechanism based on the warping information to make the holding surface into the convex shape or the concave shape, and holds the substrate via the holding mechanism.

3. The substrate holding device according to claim 2, wherein, The substrate has: The front side is the surface where the device is formed; and The back side, which is the stated side and is not the device forming surface, is located on the opposite side of the stated front side. When the warpage information indicates that the substrate has a recessed shape, the control unit deforms the clamp via the deformation mechanism to make the holding surface into the recessed shape, and holds the back side of the substrate via the holding mechanism. The substrate recess shape represents a shape in which the front side is recessed towards the back side and the back side protrudes towards the opposite side of the front side.

4. The substrate holding device according to claim 3, wherein, After the control unit makes the center of the holding surface contact the center point of the back side of the substrate, it uses the deformation mechanism to form the holding surface into the concave shape and make the curvature of the holding surface greater than the curvature of the substrate.

5. The substrate holding device according to any one of claims 1 to 4, wherein, The deformation mechanism has a movable body fixed to the center of the clamp. The movable body moves relative to the base along the opposing direction of the clamp and the base.

6. The substrate holding device according to claim 5, wherein, The movable body includes a tube having a through hole connected to the retaining surface. The through hole is an attraction hole that attracts one side of the substrate.

7. The substrate holding device according to any one of claims 1 to 6, wherein, The substrate holding device includes partition walls that divide the space between the clamp and the base into multiple spaces. The partition wall extends from the clamp toward the base. The base has an insertion hole for inserting a portion of the partition wall. With the retaining surface in a planar state, a portion of the partition wall is inserted into the insertion hole. The insertion hole has a region where the partition wall allows for further insertion into the interior of the insertion hole. The area is defined by the front end face of the partition wall and the inner surface of the insertion hole.

8. A bonding apparatus for bonding a first substrate and a second substrate, comprising: A first substrate holding device holds the first substrate; and The second substrate holding device is disposed opposite to the first substrate holding device and holds the second substrate. The first substrate holding device has: A first holding mechanism adsorbs and holds the first substrate; and The first deformation mechanism deforms the first holding mechanism. The first holding mechanism has: A first clamp has a first holding surface that holds one side of the first substrate; and A first base is disposed on the opposite side of the first holding surface of the first clamp, and the first clamp is mounted thereon. The first deformation mechanism deforms the first clamp in such a way that the first holding surface can achieve both a protruding shape and a concave shape. The protruding shape is the shape in which the center of the first holding surface protrudes towards the first substrate side, and the concave shape is the shape in which the center of the first holding surface is recessed towards the first base side.

9. The bonding device according to claim 8, wherein, The second substrate holding device includes: A second holding mechanism adsorbs and holds the second substrate; and The second deformation mechanism deforms the second holding mechanism. The second holding mechanism has: The second clamp has a second holding surface that holds one side of the second substrate; and A second base is disposed on the opposite side of the second retaining surface of the second clamp, and the second clamp is mounted thereon. The second deformation mechanism deforms the second clamp in such a way that the second holding surface can achieve both a protruding shape and a concave shape. The protruding shape is a shape in which the center of the second holding surface protrudes towards the second substrate side, and the concave shape is a shape in which the center of the second holding surface is recessed towards the second base side.

10. The bonding device according to claim 9, wherein, The first substrate holding device and the second substrate holding device attach the first substrate and the second substrate together with one of the first holding surface and the second holding surface being formed into the convex shape and the other of the first holding surface and the second holding surface being formed into the concave shape.

11. The bonding device according to any one of claims 8 to 10, wherein, The maximum curvature of the convex shape of the first retaining surface is greater than the maximum curvature of the concave shape of the first retaining surface.

12. A substrate holding method, wherein, include: The process of preparing the substrate; as well as The process of deforming a clamp having a retaining surface such that the retaining surface of one side of the substrate that is adsorbed and held becomes concave, and holding the substrate by the clamp. The recessed shape refers to the shape in which the center of the retaining surface is recessed towards the opposite side of the substrate.

13. A bonding method, comprising the following steps: The first clamp having the first holding surface is deformed in such a way that the first holding surface of the side that adsorbs and holds the first substrate becomes concave, and the first substrate is held by the first clamp. One side of the second substrate is adsorbed and held by the second holding surface of the second clamp; and With the first holding surface formed into a recessed shape and the second holding surface facing the first holding surface formed into a convex shape, the first substrate and the second substrate are bonded together. The recessed shape of the first retaining surface refers to the shape in which the center of the first retaining surface is recessed towards the opposite side of the first substrate. The protruding shape of the second retaining surface refers to the shape in which the center of the second retaining surface protrudes toward the second substrate side.

Images