Substrate thickness measuring apparatus, substrate bonding system, and substrate thickness measuring method

Abstract

In the pre-alignment unit (PU), an offset correction actuator (1300) corrects a positional offset of the substrate (W) with respect to the stage (100). The thickness calculation unit (1912) calculates the thickness of the substrate (W) in the circumferential direction on the basis of a measurement result obtained by measuring the distance up to the upper surface (Wa) of the substrate (W) by the first light source (1710) and a measurement result obtained by measuring the distance up to the lower surface (Wb) of the substrate (W) by the second light source (1720) during rotation of the substrate (W). While the substrate (W) is being transported in the transport direction (A), the thickness calculation unit (1912) calculates the thickness of the substrate (W) along the transport direction on the basis of a measurement result obtained by measuring the distance up to the upper surface (Wa) of the substrate (W) by the first light source (1710) and a measurement result obtained by measuring the distance up to the lower surface (Wb) of the substrate (W) by the second light source (1720).

Description

Technical Field

[0001] This invention relates to a substrate thickness measuring device, a substrate bonding system, and a substrate thickness measuring method. Background Technology

[0002] Conventionally, a bonding apparatus is known for bonding a first substrate and a second substrate disposed opposite to the first substrate. As such a bonding apparatus, for example, a substrate bonding apparatus (see, for example, Patent Document 1) is known, comprising: a first member for holding the first substrate; a second member for holding the second substrate; and a movement actuator for moving the second member.

[0003] Patent Document 1 describes a bonding apparatus comprising: an upper clamp for holding an upper wafer; a lower clamp for holding a lower wafer; and a lower clamp moving part for moving the lower clamp. In the bonding apparatus described in Patent Document 1, a lower imaging unit captures an alignment mark on the upper wafer, and an upper imaging unit captures an alignment mark on the lower wafer. Then, based on the two image data, the horizontal position of the lower clamp is adjusted, thereby aligning the alignment marks of the upper and lower wafers. This aligns the upper and lower wafers. Afterward, the lower clamp is moved upward, thereby bonding the upper and lower wafers.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2020-53685. Summary of the Invention

[0005] The problem the invention aims to solve However, in substrate bonding apparatuses, since the tiny electrodes formed on the surfaces of two substrates are electrically connected to each other, high-precision alignment of the two substrates is required. In recent years, with the miniaturization of wiring patterns, the required alignment accuracy is around several hundred nm to tens of nm.

[0006] Here, when bonding two substrates, after aligning them horizontally, the two substrates are bonded by moving one substrate relative to the other in the vertical direction. However, due to this vertical movement, the horizontal positioning accuracy of the two substrates decreases. As a way to improve this problem, it is possible to shorten the vertical movement distance after aligning the two substrates. In this case, the vertical movement distance after aligning the two substrates needs to be set to, for example, several μm to tens of μm. That is, the distance between the two substrates when aligning them needs to be set to, for example, several μm to tens of μm.

[0007] Typically, when two substrates are brought close together, for example, the second member is brought close to the first member in such a way that the distance between a first member holding one substrate and a second member holding the other substrate becomes equal to the sum of the target distance between the two substrates and the thickness of the two substrates. However, the thickness of the substrates varies between substrates and also varies within a single substrate. Therefore, when two substrates are brought close together such that the distance between them is several μm to tens of μm, the two substrates may come into contact with each other due to variations in their thickness. To avoid such a problem, it is necessary to measure the substrate thickness with high precision.

[0008] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate thickness measuring device, a substrate bonding system and a substrate thickness measuring method capable of measuring the thickness of a substrate with high precision.

[0009] means for solving problems A first aspect of the present invention is a substrate thickness measuring apparatus, comprising a stage, a detection sensor, a deviation calculation unit, a deviation correction actuator, a rotation actuator, a first distance measuring sensor, a second distance measuring sensor, and a thickness calculation unit. The stage horizontally holds a substrate. The detection sensor detects the position of the substrate held by the stage. The deviation calculation unit calculates the positional deviation of the substrate relative to the stage based on the detection result of the detection sensor. The deviation correction actuator corrects the positional deviation of the substrate relative to the stage. The rotation actuator rotates the stage holding the substrate. The first distance measuring sensor is disposed above the substrate held by the stage and measures the distance up to the upper surface of the substrate. The second distance measuring sensor is disposed below the substrate held by the stage and measures the distance up to the lower surface of the substrate. The thickness calculation unit calculates the thickness of the substrate based on the measurement results of the first and second distance measuring sensors. The deviation correction actuator moves one of the substrate and the stage in the horizontal direction relative to the other of the substrate and the stage based on the calculation results of the deviation calculation unit, thereby correcting the positional deviation of the substrate relative to the stage. During the rotation of the stage containing the substrate whose positional deviation has been corrected by the rotation actuator, the thickness calculation unit calculates the thickness of the substrate circumferentially based on the measurement results obtained by the first distance measuring sensor (measured up to the upper surface of the substrate) and the second distance measuring sensor (measured up to the lower surface of the substrate). During the transport actuator transporting the substrate whose positional deviation has been corrected relative to the stage in a transport direction that is horizontal, the thickness calculation unit calculates the thickness of the substrate along the transport direction based on the measurement results obtained by the first distance measuring sensor (measured up to the upper surface of the substrate) and the second distance measuring sensor (measured up to the lower surface of the substrate).

[0010] In one embodiment, the transport actuator transports the substrate in the transport direction by measuring the distance along a straight line passing through the center of the substrate using both the first distance measuring sensor and the second distance measuring sensor. During the transport actuator's transport of the substrate in the transport direction, the thickness calculation unit calculates the thickness of the substrate along the transport direction based on the measurement results obtained by the first distance measuring sensor measuring the distance along a straight line passing through the center of the substrate to the upper surface of the substrate, and the measurement results obtained by the second distance measuring sensor measuring the distance along a straight line passing through the center of the substrate to the lower surface of the substrate.

[0011] In one embodiment, the deviation correction actuator includes a holder, a holder movement actuator, and a horizontal movement actuator. The holder transfers the substrate between the holder and the stage by moving it vertically relative to the stage. The holder movement actuator moves the holder vertically relative to the stage. The horizontal movement actuator moves one of the holder and the stage horizontally relative to the other of the holder and the stage. The holder movement actuator corrects the positional deviation of the substrate relative to the stage by moving the holder upward relative to the stage, while the holder holds the substrate, and by moving one of the holder and the stage horizontally relative to the other of the holder and the stage based on the calculation results of the deviation calculation unit.

[0012] In one embodiment, the substrate thickness measuring device further includes a housing that houses the first distance measuring sensor and the second distance measuring sensor, thereby fixing the first distance measuring sensor and the second distance measuring sensor.

[0013] In one embodiment, the conveying actuator is disposed outside the housing. The housing has a window through which the conveying arm of the conveying actuator passes.

[0014] In one embodiment, the first distance measuring sensor includes a first optical head that emits a first emitted light toward the upper surface of the substrate. The second distance measuring sensor includes a second optical head that emits a second emitted light toward the lower surface of the substrate.

[0015] In one embodiment, the optical axis of the second emitted light emitted from the second optical head is located on the same axis as the optical axis of the first emitted light emitted from the first optical head.

[0016] In one embodiment, the first optical head includes: a first light-emitting element that emits the first emitted light; and a first light-receiving element that receives light reflected from the upper surface of the substrate in the first emitted light emitted from the first light-emitting element. The second optical head includes: a second light-emitting element that emits the second emitted light; and a second light-receiving element that receives light reflected from the lower surface of the substrate in the second emitted light emitted from the second light-emitting element.

[0017] A second aspect of the present invention is a substrate bonding system comprising: the substrate thickness measuring device; and a substrate bonding device for bonding a first substrate and a second substrate whose thickness has been measured by the substrate thickness measuring device.

[0018] In one embodiment, the substrate bonding apparatus includes a first substrate holder, a second substrate holder, a substrate holder actuator, and a acquiring unit. The first substrate holder horizontally holds the first substrate. The second substrate holder horizontally holds the second substrate. The substrate holder actuator moves one of the first and second substrate holders relative to the other in a vertical direction. The acquiring unit acquires the calculation result from the thickness calculation unit of the substrate thickness measuring apparatus. Based on the calculation result from the thickness calculation unit, the substrate holder actuator moves one of the first and second substrate holders relative to the other in a manner such that the distance between the first and second substrates is within a predetermined range.

[0019] A third aspect of the present invention is a method for measuring substrate thickness, comprising the steps of: detecting the position of a substrate held horizontally by a stage; calculating a positional deviation of the substrate relative to the stage based on a detection result obtained from detecting the position of the substrate; moving one of the substrate and the stage relative to the other of the substrate and the stage in a horizontal direction based on the calculation result obtained from calculating the positional deviation, thereby correcting the positional deviation of the substrate relative to the stage; calculating the thickness of the substrate along the circumferential direction based on a measurement result obtained from a distance measured by a first distance measuring sensor up to the upper surface of the substrate and a measurement result obtained from a distance measured by a second distance measuring sensor up to the lower surface of the substrate during rotation of the stage holding the substrate with the corrected positional deviation; and calculating the thickness of the substrate along the transport direction based on a measurement result obtained from a distance measured by the first distance measuring sensor up to the upper surface of the substrate and a measurement result obtained from a distance measured by the second distance measuring sensor up to the lower surface of the substrate during transport of the substrate with the corrected positional deviation relative to the stage in a transport direction that is a horizontal direction.

[0020] The effects of the invention According to the present invention, a substrate thickness measuring device, a substrate bonding system, and a substrate thickness measuring method capable of measuring the thickness of a substrate with high precision can be provided. Attached Figure Description

[0021] Figure 1 A top view illustrating the schematic structure of a substrate bonding system according to an embodiment of the present invention.

[0022] Figure 2A block diagram illustrating the structure of the substrate bonding system.

[0023] Figure 3 The cross-sectional view is shown in a schematic manner for the conveying unit, conveying robot, prealignment unit, and joining unit.

[0024] Figure 4 A three-dimensional view showing the structure of the pre-alignment unit.

[0025] Figure 5 A perspective view showing the structure of the retainer movement actuator.

[0026] Figure 6 A block diagram illustrating the structure of the pre-alignment unit.

[0027] Figure 7 This is a schematic diagram illustrating a position detection method for a substrate based on a detection sensor.

[0028] Figure 8 A top view showing the structure of the substrate.

[0029] Figure 9 This is a schematic diagram illustrating a method for measuring the thickness of a substrate using a distance measuring device.

[0030] Figure 10 This is a schematic diagram illustrating a method for measuring the distance up to the substrate in the circumferential direction using a distance measuring device.

[0031] Figure 11 This is a schematic diagram illustrating a method for measuring the distance up to the substrate along the transport direction using a distance measuring device.

[0032] Figure 12 A flowchart illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0033] Figure 13 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0034] Figure 14 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0035] Figure 15 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0036] Figure 16 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0037] Figure 17This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0038] Figure 18 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0039] Figure 19 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0040] Figure 20 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0041] Figure 21 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0042] Figure 22 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0043] Figure 23 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit and the transport unit.

[0044] Figure 24 A perspective view is provided to schematically illustrate the structure of the joining unit.

[0045] Figure 25 This is a schematic diagram showing the structure of the periphery of the second substrate holder of the bonding unit from the X direction.

[0046] Figure 26 This is a schematic diagram showing the structure of the periphery of the second substrate holder of the bonding unit from the Y direction.

[0047] Figure 27 This is a schematic diagram showing the structure around the support platform from below.

[0048] Figure 28 A perspective view showing the structure of the joining unit in a schematic manner from below.

[0049] Figure 29 A flowchart illustrating the bonding method of the bonding unit.

[0050] Figure 30 A side view is shown schematically of the state in which the first substrate and the second substrate are arranged facing each other. Detailed Implementation

[0051] Hereinafter, embodiments of a substrate bonding system having the substrate thickness measuring apparatus of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings, the same or equivalent parts are labeled with the same reference numerals and will not be described repeatedly. Additionally, for ease of understanding of the present invention, the X-axis, Y-axis, and Z-axis will be described as being orthogonal to each other. In this embodiment, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0052] Reference Figures 1 to 30 The substrate bonding system 1 of this embodiment will be described. First, refer to... Figure 1 Describe the overall structure of substrate bonding system 1. Figure 1 A top view showing the schematic structure of a substrate bonding system 1 according to an embodiment of the present invention.

[0053] like Figure 1 As shown, the substrate bonding system 1 stacks and bonds a first substrate W1 and a second substrate W2. In this embodiment, the substrate bonding system 1 performs, for example, activation treatment, cleaning treatment, and bonding treatment on the first substrate W1 and the second substrate W2.

[0054] The first substrate W1 and the second substrate W2 include, for example, semiconductor substrates. The first substrate W1 and the second substrate W2 include, for example, semiconductor wafers. The first substrate W1 and the second substrate W2 are, for example, generally circular plates.

[0055] The first substrate W1 has a plurality of (e.g., dozens to hundreds) first semiconductor chips (not shown). Each first semiconductor chip constitutes an integrated circuit such as a CPU (Central Processing Unit) and / or DRAM (Dynamic Random Access Memory). Each first semiconductor chip has, for example, a semiconductor element layer (not shown) and a plurality of electrodes (not shown), and the semiconductor element layer is formed with a plurality of semiconductor elements such as transistors. The electrodes are formed of a metal material such as copper, gold, or aluminum. In this embodiment, the electrodes are formed of copper, for example.

[0056] The second substrate W2 has a plurality of (e.g., dozens to hundreds) second semiconductor chips (not shown). Each second semiconductor chip constitutes an integrated circuit such as a CPU and / or DRAM. Each second semiconductor chip has, for example, a semiconductor element layer (not shown) and a plurality of electrodes (not shown), and the semiconductor element layer is formed with a plurality of semiconductor elements such as transistors. The electrodes are formed of a metal material such as copper, gold or aluminum. In this embodiment, the electrodes are formed of copper, for example.

[0057] The electrodes of the first substrate W1 and the second substrate W2 are joined together to form an electrical connection. Specifically, the number of electrodes on the first substrate W1 and the number of electrodes on the second substrate W2 are the same. The electrodes of the second substrate W2 are disposed at positions corresponding to the electrodes on the first substrate W1.

[0058] The electrodes of the first substrate W1 and the second substrate W2 are formed, for example, as bumps and / or electrode pads. From the viewpoint of ease of bonding, it is preferable that at least one of the electrodes of the first substrate W1 and the second substrate W2 is formed as a bump. In this embodiment, both the electrodes of the first substrate W1 and the second substrate W2 are formed as bumps.

[0059] The substrate bonding system 1 includes a transport path CP, a first load port LP1, a second load port LP2, a third load port LP3, an activation unit AU, a cleaning unit CU, a pre-alignment unit PU, a transport unit TU, a bonding unit JU, a center robot CR, a transport robot TR, and a control device 90. Furthermore, the pre-alignment unit PU is an example of the "substrate thickness measuring device" of the present invention. The bonding unit JU is an example of the "substrate bonding apparatus" of the present invention. The transport unit TR is an example of the "transport actuator" of the present invention.

[0060] The transport path CP transports the first substrate W1 and the second substrate W2. The transport path CP has, for example, a straight shape. The central robot CR, the first loading port LP1, the second loading port LP2, the third loading port LP3, the activation unit AU, the cleaning unit CU, the pre-alignment unit PU, the transport unit TU, and the joining unit JU are configured to face the transport path CP.

[0061] The central robot CR holds and transports the first substrate W1 and the second substrate W2. The central robot CR moves within the transport path CP. The central robot CR transports the first substrate W1 and the second substrate W2 between the first loading port LP1, the second loading port LP2, the third loading port LP3, the activation unit AU, the cleaning unit CU, and the transport unit TU.

[0062] The first loading port LP1 accommodates multiple (e.g., 25) first substrates W1. Specifically, the multiple first substrates W1 are accommodated in a stacked state in a front-opening unified pod (FOUP) (i.e., a carrier) not shown. The front-opening unified pod accommodating the first substrates W1 is accommodated in the first loading port LP1.

[0063] The second loading port LP2 accommodates multiple (e.g., 25) second substrates W2. Specifically, the multiple second substrates W2 are accommodated in a stacked state in a front-opening wafer transfer box (not shown). The front-opening wafer transfer box accommodating the second substrates W2 is accommodated in the second loading port LP2.

[0064] The third loading port LP3 accommodates multiple (e.g., 25) stacked substrates WL. Specifically, the multiple stacked substrates WL are accommodated in a front-opening wafer transfer box (not shown) in a stacked state. The front-opening wafer transfer box accommodating the stacked substrates WL is accommodated in the third loading port LP3.

[0065] The laminated substrate WL is a substrate obtained by stacking and bonding a first substrate W1 and a second substrate W2. In this embodiment, the laminated substrate WL is constructed by stacking and bonding the first substrate W1 and the second substrate W2.

[0066] The activation unit AU activates the surfaces of the first substrate W1 and the second substrate W2. Specifically, the activation unit AU activates the surfaces of at least the electrodes in the first substrate W1 and the second substrate W2. The type of gas used in the plasma treatment is not particularly limited, for example, it may be oxygen or nitrogen.

[0067] The activation unit AU, for example, has a high-frequency power supply and a pair of electrodes to which a high-frequency voltage is applied. Applying a high-frequency voltage between the electrodes ionizes the process gas. For example, when oxygen is used as the process gas, the oxygen is plasmaized into oxygen ions. When these oxygen ions are irradiated onto the surface of the first substrate W1 or the second substrate W2, dangling bonds (unbonded bonds) are formed on the surface of the electrodes. That is, the surface of the electrodes is activated.

[0068] The cleaning unit CU cleans the first substrate W1 and the second substrate W2. The cleaning unit CU supplies cleaning fluid to the first substrate W1 and the second substrate W2. Specifically, the cleaning unit CU has cleaning nozzles (not shown) that spray the cleaning fluid. Examples of cleaning fluids include deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., approximately 10 ppm to 100 ppm), or reduced water (hydrogen water). In this embodiment, the cleaning fluid is pure water such as DIW.

[0069] The electrodes of the first substrate W1 and the second substrate W2 are cleaned by cleaning unit CU. At this time, hydroxyl groups are formed on the surface of the electrodes.

[0070] The transport unit TU is configured to face the transport path CP, the pre-alignment unit PU, and the engagement unit JU. The transport robot TR is housed within the transport unit TU.

[0071] The transport robot TR holds and transports the first substrate W1 and the second substrate W2. The transport robot TR transfers the first substrate W1 and the second substrate W2 between the central robot CR, the pre-alignment unit PU, and the joining unit JU. The transport robot TR is fixed to the bottom of the transport unit TU and does not move within the transport unit TU. Therefore, the transport accuracy of the transport robot TR is higher than that of the central robot CR, which moves within the transport path CP.

[0072] The pre-alignment unit PU aligns the first substrate W1 and the second substrate W2 one by one. In this embodiment, the pre-alignment unit PU aligns the first substrate W1 and the second substrate W2 one by one before the alignment in the bonding unit JU. In addition, the alignment performed by the pre-alignment unit PU is sometimes referred to as pre-alignment.

[0073] Furthermore, in this embodiment, the pre-alignment unit PU functions as a thickness measuring device, which measures the thickness of the first substrate W1 and the second substrate W2. The detailed structure of the pre-alignment unit PU will be described later.

[0074] The bonding unit JU bonds the first substrate W1 and the second substrate W2. Specifically, the bonding unit JU performs a higher-precision alignment on the pre-aligned first substrate W1 and second substrate W2, which are transported from the pre-alignment unit PU. Then, the bonding unit JU bonds the electrodes of the first substrate W1 and the electrodes of the second substrate W2. The detailed structure of the bonding unit JU will be described later.

[0075] Figure 2 This is a block diagram illustrating the structure of the substrate bonding system 1. Figure 2 As shown, the control device 90 controls various operations of the substrate bonding system 1. The control device 90 includes a control unit 91 and a storage unit 93. The control unit 91 has a processor. The control unit 91 has a central processing unit. In addition, the control unit 91 may also have a general-purpose arithmetic logic unit (ALU).

[0076] Storage unit 93 stores data and computer programs. The data, for example, specifies the processing content and order for bonding.

[0077] Storage unit 93 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 93 may also include removable media. Control unit 91 executes the computer program stored in storage unit 93 and performs a bonding action.

[0078] The control unit 91 controls the central robot CR, activation unit AU, cleaning unit CU, transport robot TR, pre-alignment unit PU, and joining unit JU. Specifically, the control unit 91 sends control signals to the central robot CR, activation unit AU, cleaning unit CU, transport robot TR, pre-alignment unit PU, and joining unit JU, thereby controlling the central robot CR, activation unit AU, cleaning unit CU, transport robot TR, pre-alignment unit PU, and joining unit JU.

[0079] More specifically, the control unit 91 controls the central robot CR, which transfers the substrate W. The substrate W includes a first substrate W1 and a second substrate W2. Furthermore, in the following description, when it is not necessary to distinguish between the first substrate W1 and the second substrate W2, either the first substrate W1 or the second substrate W2 may be referred to as substrate W. The central robot CR, for example, picks up the untreated substrate W and moves it into the activation unit AU. Furthermore, the central robot CR picks up the activated substrate W from the activation unit AU and moves it to the cleaning unit CU. Furthermore, the central robot CR picks up the cleaned substrate W from the cleaning unit CU and moves it to the bonding unit JU.

[0080] The control unit 91 controls the activation unit AU, thereby controlling the plasma treatment of the substrate W. For example, the control unit 91 controls the output voltage and processing time of the activation unit AU.

[0081] The control unit 91 controls the cleaning unit CU, thereby controlling the cleaning process on the substrate W. For example, the control unit 91 sets the valve (not shown) of the cleaning unit CU to an open or closed state, thereby supplying or stopping the supply of cleaning fluid to the substrate W.

[0082] The control unit 91 controls the transport robot TR and transfers the substrate W through the transport robot TR. For example, the transport robot TR picks up the substrate W from the central robot CR and delivers the substrate W to the pre-alignment unit PU. Furthermore, the transport robot TR picks up the substrate W from the pre-alignment unit PU and delivers the substrate W to the bonding unit JU. Additionally, the transport robot TR picks up the laminated substrate WL from the bonding unit JU and delivers the laminated substrate WL to the central robot CR.

[0083] The control unit 91 controls the pre-alignment unit PU. Specifically, the control unit 91 controls the pre-alignment unit PU to pre-align the substrate W. In addition, the control unit 91 controls the pre-alignment unit PU and measures the thickness of the pre-aligned substrate W.

[0084] The control unit 91 controls the bonding unit JU. Specifically, the control unit 91 controls the bonding unit JU to bond the first substrate W1 and the second substrate W2.

[0085] Next, refer to Figure 3 This section describes the transport unit TU, the transport robot TR, the pre-alignment unit PU, and the engagement unit JU. Figure 3 The cross-sectional view is shown in a schematic manner for the conveying unit TU, the conveying robot TR, the pre-alignment unit PU, and the engagement unit JU.

[0086] like Figure 3 As shown, the transport unit TU has a transport housing 3010 and an air supply unit 3020. The transport housing 3010 is composed of multiple (four in this case) side walls 3011, a bottom 3012, and a top 3013. The transport housing 3010 separates the interior and exterior of the transport unit TU.

[0087] Sidewall 3011 includes: sidewall 3011a, disposed adjacent to pre-alignment unit PU; and sidewall 3011b, disposed adjacent to bonding unit JU. An opening window 3011c is formed in sidewall 3011a, extending through sidewall 3011a in the thickness direction. An opening window 3011d is formed in sidewall 3011b, extending through sidewall 3011b in the thickness direction. The opening windows 3011c and 3011d are sized to allow substrate W to pass through.

[0088] An air supply unit 3020 is disposed on the upper part or above the transport housing 3010. For example, the air supply unit 3020 is disposed on the top 3013 of the transport housing 3010. The air supply unit 3020 delivers air into the transport housing 3010. The air supply unit 3020 includes, for example, a fan filter unit (FFU). A downflow is formed within the transport housing 3010 through the air supply unit 3020 and an exhaust device (not shown).

[0089] A transport robot TR is disposed within a transport housing 3010. The transport robot TR is fixed to the bottom 3012 of the transport housing 3010. The transport robot TR has a transport arm 3510 and a transport drive unit 3520. The transport arm 3510 has an upper surface 3510a that supports the lower surface of the substrate W. The transport arm 3510 supports the substrate W and transports the substrate W in the horizontal direction.

[0090] The transport drive unit 3520 moves the transport arm 3510 horizontally. The transport drive unit 3520 also moves the transport arm 3510 linearly in the horizontal direction. In this embodiment, the transport drive unit 3520 rotates the transport arm 3510 about a central axis (not shown) extending in the vertical direction. The transport drive unit 3520 includes, for example, a stepping motor and a rack and pinion, converting the rotary drive of the stepping motor into linear drive in the horizontal direction.

[0091] The transport arm 3510 is configured to be able to pass through openings 3011c and 3011d. The transport arm 3510 transfers the substrate W between the transport arm 3510 and the pre-alignment unit PU via the opening 3011c. Furthermore, the transport arm 3510 transfers the substrate W between the transport arm 3510 and the bonding unit JU via the opening 3011d.

[0092] In addition, although not shown, an opening window is also formed on the side wall 3011 facing the transport path CP, through which the substrate W can pass. The transport arm 3510 transfers the substrate W between the transport arm 3510 and the central robot CR via the opening window (not shown).

[0093] The pre-alignment unit PU has an alignment housing 1010 and an air supply unit 1020. Furthermore, the alignment housing 1010 corresponds to an example of the "housing" of the present invention. The alignment housing 1010 has a bottom 1012, a top 1013, and a plurality of (four in this case) sidewalls 1011. The alignment housing 1010 separates the interior and exterior of the pre-alignment unit PU.

[0094] Sidewall 1011 has sidewall 1011a, which is disposed adjacent to the transport unit TU. An opening window 1011c is formed in sidewall 1011a, extending through sidewall 1011a in the thickness direction. Furthermore, the opening window 1011c is an example of a "window" according to the present invention. The opening window 1011c is sized to allow the substrate W to pass through.

[0095] Furthermore, sidewall 1011a and sidewall 3011a can be provided independently or they can be a single sidewall. That is, the pre-alignment unit PU and the transport unit TU can also share a single sidewall. In the following description, for the sake of simplicity, an example will be given where the sidewall 1011a of the pre-alignment unit PU is shared with the sidewall 3011a of the transport unit TU.

[0096] An air supply unit 1020 is disposed on the upper part or above the alignment housing 1010. For example, the air supply unit 1020 is disposed on the top 1013 of the alignment housing 1010. The air supply unit 1020 delivers air into the alignment housing 1010. The air supply unit 1020 includes, for example, a fan filter unit. A downflow is formed within the alignment housing 1010 through the air supply unit 1020 and an exhaust device (not shown).

[0097] An alignment device 1001 is disposed within the alignment housing 1010. The alignment device 1001 is fixed to the bottom 1012 of the alignment housing 1010. The alignment device 1001 transfers the substrate W between the alignment device 1001 and the transport robot TR.

[0098] The joining unit JU has a joining housing 4010 and an air supply unit 4020. The joining housing 4010 has a bottom 4012, a top 4013, and multiple (four in this case) side walls 4011. The joining housing 4010 separates the interior and exterior of the joining unit JU.

[0099] Sidewall 4011 has sidewall 4011a, which is disposed adjacent to the transport unit TU. An opening window 4011c is formed in sidewall 4011a, which extends through sidewall 4011a in the thickness direction. The opening window 4011c is sized to allow the substrate W to pass through.

[0100] Furthermore, sidewall 4011a and sidewall 3011a can be provided independently or they can be a single sidewall. That is, the joining unit JU and the transport unit TU can also share a single sidewall. In the following description, for the sake of simplicity, an example will be given where the sidewall 4011a of the joining unit JU is shared with the sidewall 3011a of the transport unit TU.

[0101] An air supply unit 4020 is disposed on the upper part or above the connecting housing 4010. For example, the air supply unit 4020 is disposed on the top 4013 of the connecting housing 4010. The air supply unit 4020 delivers air into the connecting housing 4010. The air supply unit 4020 includes, for example, a fan filter unit. A downflow is formed within the connecting housing 4010 through the air supply unit 4020 and an exhaust device (not shown).

[0102] Next, refer to Figure 4 This section describes the detailed structure of the pre-alignment unit PU. Figure 4 A perspective view showing the structure of the pre-alignment unit PU.

[0103] like Figure 4As shown, the pre-alignment unit PU includes an alignment device 1001 and an alignment housing 1010. The alignment device 1001 includes a stage 1100, a rotary actuator 1200, a deviation correction actuator 1300, a detection sensor 1600, a distance measuring device 1700, and a control device 1900 (see reference). Figure 6 The alignment housing 1010 houses the stage 1100, rotary actuator 1200, offset correction actuator 1300, detection sensor 1600, distance measuring device 1700, and control device 1900. Furthermore, the detection sensor 1600 is an example of the "detection sensor" of this invention.

[0104] The alignment housing 1010 further comprises a plurality of (four in this case) housing frames 1030. The housing frames 1030 are, for example, metal frames with an L-shaped cross-section. The housing frames 1030 are, for example, arranged at the four corners of the pre-alignment unit PU in a vertically extending manner. Specifically, the housing frames 1030 are arranged at the junctions of adjacent sidewalls 1011 and fix the sidewalls 1011. A housing frame (not shown) may also be further provided, extending horizontally to connect the vertically extending housing frames 1030 to each other. Furthermore, for ease of understanding, in Figure 4 The top 1013 and a portion of the sidewall 1011 of the housing 1010 are shown in the middle with double-dotted lines.

[0105] The platform 1100 holds the substrate W horizontally. In this embodiment, the platform 1100 has a support plate 1110 and a plurality of support pins 1120. The support plate 1110 is made of, for example, a metal plate. The support plate 1110 is arranged horizontally. Furthermore, the shape of the support plate 1110 is not particularly limited, for example, it is rectangular.

[0106] Multiple (four in this case) support pins 1120 are mounted at the four corners of the support plate 1110. The support pins 1120 are fixed to the support plate 1110 in a manner that protrudes upward from the support plate 1110. The front end (upper end) of the support pin 1120 supports the lower surface of the substrate W. In addition, the support pin 1120 may also adhere to the lower surface of the substrate W, but in this embodiment it does not adhere to the lower surface of the substrate W.

[0107] Furthermore, the stage 1100 has a smaller overall size than the substrate W. Specifically, with the substrate W held in place, when viewed from above, the stage 1100 is positioned radially inward from the periphery of the substrate W. Moreover, in this embodiment, the stage 1100 does not move vertically. That is, the height of the stage 1100 is fixed.

[0108] The rotary actuator 1200 supports the stage 1100 in a rotatable manner. Specifically, the rotary actuator 1200 has a rotating shaft 1210, a main body 1220, and a motor 1230. The rotating shaft 1210 is configured such that the rotation axis L1210 extends in the vertical direction. Furthermore, the rotation axis L1210 of the rotary actuator 1200 is aligned with the central axis (not shown) of the stage 1100.

[0109] The upper end of the rotating shaft 1210 is fixed to the lower surface of the platform 1100. The lower end of the rotating shaft 1210 is inserted into the interior of the main body 1220.

[0110] The main body 1220 has, for example, a generally rectangular parallelepiped shape. A motor 1230 is mounted on the side of the main body 1220 in the Y direction.

[0111] Motor 1230 is not particularly limited, and may include, for example, a stepper motor. Motor 1230 is configured such that the axis of rotation (not shown) extends in, for example, a horizontal direction (Y direction in this case).

[0112] A transmission member (not shown) is provided inside the main body 1220, which transmits the driving force of the motor 1230 to the rotating shaft 1210. In this embodiment, the transmission member converts the rotational driving force of the motor 1230 about a rotational axis extending in the horizontal direction into a rotational driving force about a rotational axis L1210 extending in the vertical direction. The transmission member may be, for example, a helical gear or a bevel gear.

[0113] When the motor 1230 of the rotary actuator 1200 is driven (rotated), the rotational driving force of the motor 1230 is transmitted to the rotation shaft 1210 via a transmission member (not shown). Therefore, since the rotation shaft 1210 rotates around the rotation axis L1210 extending in the vertical direction, the stage 1100 rotates around the rotation axis L1210. Consequently, the substrate W held by the stage 1100 also rotates around the rotation axis L1210.

[0114] The offset correction actuator 1300 offsets the position of the correction substrate W relative to the stage 1100. In this embodiment, the center of the offset correction actuator 1300 offsets the position of the correction substrate W relative to the center of the stage 1100 in the horizontal direction.

[0115] Specifically, the deviation correction actuator 1300 includes a retainer 1310, a retainer movement actuator 1330, a first horizontal movement actuator 1400, and a second horizontal movement actuator 1500. Furthermore, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 are examples of the "horizontal movement actuator" of the present invention.

[0116] The holder 1310 holds the substrate W horizontally. The holder 1310 is capable of transferring the substrate W between the holder 1310 and the stage 1100. The holder 1310 has a support ring 1311 and a plurality of support pins 1312. The support ring 1311 is made, for example, of a metal plate. The support ring 1311 is horizontally arranged. The shape of the support ring 1311 is not particularly limited, for example, it is annular.

[0117] Multiple (eight in this case) support pins 1312 are mounted on the support ring 1311 at approximately 90-degree angles, centered on the central axis (not shown). Two support pins are mounted on each ring 1311. The support pins 1312 are fixed to the support ring 1311 in a manner that they protrude upwards from the support ring 1311. The front end (upper end) of the support pin 1312 supports the lower surface of the substrate W. Alternatively, the support pins 1312 can adhere to the lower surface of the substrate W, but in this embodiment, they do not adhere to the lower surface of the substrate W.

[0118] The support ring 1311 has an outer periphery 1311a and an inner periphery 1311b. The outer periphery 1311a forms the shape of the support ring 1311. The inner periphery 1311b forms a through hole 1311c in the support ring 1311.

[0119] The through hole 1311c of the support ring 1311 is formed to allow the support plate 1110 to pass through. Specifically, when viewed from above, the support plate 1110 is positioned radially inward than the inner periphery 1311b of the support ring 1311.

[0120] Furthermore, the retainer 1310 has a smaller overall size than the substrate W. Specifically, when the retainer 1310 holds the substrate W, in a top view, the retainer 1310 is positioned radially inward from the periphery of the substrate W. In other words, when the retainer 1310 holds the substrate W, in a top view, the outer periphery 1311a of the support ring 1311 is positioned radially inward from the periphery of the substrate W.

[0121] The retainer movement actuator 1330 supports the retainer 1310 and causes the retainer 1310 to move vertically relative to the stage 1100. Furthermore, for ease of understanding, in Figure 4 Only a portion of the retainer movement actuator 1330 is depicted here. The structure of the retainer movement actuator 1330 will be described later.

[0122] The first horizontal movement actuator 1400 moves the retainer 1310 in, for example, the Y direction. In this embodiment, the first horizontal movement actuator 1400 moves the rotary actuator 1200 in the Y direction, thereby moving the retainer 1310 in the Y direction. Specifically, the first horizontal movement actuator 1400 has a body 1410, a motor 1420, and a moving stage 1430.

[0123] The main body 1410 has, for example, a generally rectangular parallelepiped shape. The main body 1410 has an elongated shape extending in the Y direction. A motor 1420 is mounted on the Y-direction end face of the main body 1410. The motor 1420 is not particularly limited, and may include, for example, a stepper motor. The motor 1420 is configured such that its rotation axis (not shown) extends in the Y direction.

[0124] A recess 1411 is formed on the X-direction side of the main body 1410, into which a portion of the moving stage 1430 is inserted. The recess 1411 extends in the Y-direction. Furthermore, a transmission member (not shown) is provided inside the main body 1410, which transmits the driving force of the motor 1420 to the moving stage 1430. In this embodiment, the transmission member converts the rotational driving force of the motor 1420 about a rotation axis extending in the Y-direction into a driving force along the Y-direction. For example, the transmission member has a worm gear, and the moving stage 1430 has a rack gear that engages with the worm gear.

[0125] The movable stage 1430 is made of metal, for example. The movable stage 1430 has, for example, a U-shaped form when viewed from above. The lower part of the movable stage 1430 is inserted into the recess 1411. The movable stage 1430 extends upward from the recess 1411 and protrudes above the upper surface of the main body 1410. A rotary actuator 1200 is mounted and fixed at the upper end of the movable stage 1430.

[0126] When the motor 1420 is driven (rotated), the rotational driving force of the motor 1420 is transmitted to the moving stage 1430 via a transmission member (not shown). As a result, since the moving stage 1430 moves in the Y direction along the recess 1411, the rotary actuator 1200 fixed to the moving stage 1430 moves in the Y direction. Consequently, the stage 1100 fixed to the rotary actuator 1200 moves in the Y direction.

[0127] The second horizontal movement actuator 1500 is fixed to the bottom 1012. The second horizontal movement actuator 1500 causes the retainer 1310 to move, for example, in the X direction. In this embodiment, the second horizontal movement actuator 1500 causes the first horizontal movement actuator 1400 and the rotary actuator 1200 to move in the X direction, thereby moving the retainer 1310 in the X direction. Specifically, the second horizontal movement actuator 1500 has a body 1510, a motor 1520, and a moving stage 1530.

[0128] The main body 1510 has, for example, a generally rectangular parallelepiped shape. The main body 1510 has an elongated shape extending in the X direction. A motor 1520 is mounted on the X-direction end face of the main body 1510. The motor 1520 is not particularly limited, and may include, for example, a stepper motor. The motor 1520 is configured such that its rotation axis (not shown) extends in the X direction.

[0129] A recess 1511 is formed on the side of the main body 1510 in the Y direction, into which a portion of the moving stage 1530 is inserted. The recess 1511 extends in the X direction. Furthermore, a transmission member (not shown) is provided inside the main body 1510, which transmits the driving force of the motor 1520 to the moving stage 1530. In this embodiment, the transmission member converts the rotational driving force of the motor 1520 about a rotation axis extending in the X direction into a driving force along the X direction. For example, the transmission member has a worm gear, and the moving stage 1530 has a rack and pinion gear that engages with the worm gear.

[0130] The movable stage 1530 is made of metal, for example. The movable stage 1530 has, for example, a U-shaped form when viewed from above. The lower part of the movable stage 1530 is inserted into the recess 1511. The movable stage 1530 extends upward from the recess 1511 and protrudes above the upper surface of the main body 1510. The main body 1410 of the first horizontal movement actuator 1400 is mounted and fixed at the upper end of the movable stage 1530.

[0131] When the motor 1520 is driven (rotated), the rotational driving force of the motor 1520 is transmitted to the moving stage 1530 via a transmission member (not shown). As a result, since the moving stage 1530 moves along the recess 1511 in the X direction, the first horizontal movement actuator 1400 fixed to the moving stage 1530 moves in the X direction. Therefore, since the rotary actuator 1200 fixed to the first horizontal movement actuator 1400 moves in the X direction, the stage 1100 fixed to the rotary actuator 1200 moves in the X direction.

[0132] Furthermore, the method for correcting the positional deviation of the substrate W relative to the stage 1100 by means of the deviation correction actuator 1300 will be described later.

[0133] The detection sensor 1600 detects the position of the substrate W held by the stage 1100. Specifically, the detection sensor 1600 has a light emitting head 1610, a light receiving head 1620, and a support frame 1630.

[0134] The support frame 1630 is, for example, a metal frame with an L-shaped cross-section. The support frame 1630 is disposed radially outward relative to the support ring 1311. The support frame 1630 is fixed to the bottom 1012 in a vertically extending manner.

[0135] A light emitting head 1610 is fixed to the upper part of the support frame 1630, and a light receiving head 1620 is fixed to the lower part of the support frame 1630. The light emitting head 1610 is located above the edge of the substrate W, and the light receiving head 1620 is located below the edge of the substrate W.

[0136] The light emitting head 1610 emits a strip of light with a specified width (e.g., a width of more than 5 mm and less than 20 mm) downwards. The light emitting head 1610 is positioned such that a portion of the strip of light irradiates the upper surface of the substrate W, while the remaining strip of light passes through the side of the substrate W.

[0137] The light receiver 1620 receives light emitted from the light emitter 1610 and passing through the side of the substrate W.

[0138] Furthermore, the position detection method for the substrate W using the detection sensor 1600 will be described later.

[0139] The distance measuring device 1700 measures the distance up to the substrate W held by the stage 1100. Specifically, the distance measuring device 1700 has a first optical head 1710, a second optical head 1720, and a fixing member 1730. Furthermore, the first optical head 1710 is an example of the "first distance measuring sensor" of the present invention. The second optical head 1720 is an example of the "second distance measuring sensor" of the present invention.

[0140] The fixing member 1730 is made of, for example, a metal plate. The fixing member 1730 holds the first optical head 1710 in a predetermined position, for example. In addition, the distance measuring device 1700 may further have a fixing member that holds the second optical head 1720 in a predetermined position.

[0141] In this embodiment, the fixing member 1730 has a first plate 1731 and a second plate 1732. The first plate 1731 extends in the Y direction and is fixed across two housing frames 1030 adjacent to the transport unit TU. The second plate 1732 is fixed to the first plate 1731 such that it extends from the center of the first plate 1731 in the Y direction toward the center aligned with the housing 1010. A first optical head 1710 is fixed to the lower surface of the front end of the second plate 1732.

[0142] The first optical head 1710 is positioned above the substrate W held by the stage 1100. The first optical head 1710 emits a first emitted light toward the upper surface of the substrate W. Furthermore, the first optical head 1710 receives light reflected from the upper surface of the substrate W in the emitted first emitted light, thereby measuring the distance up to the upper surface of the substrate W held by the stage 1100.

[0143] The second optical head 1720 is located below the substrate W held by the stage 1100. The second optical head 1720 emits a second emitted light toward the lower surface of the substrate W. In addition, the second optical head 1720 receives the light reflected from the lower surface of the substrate W in the emitted second emitted light, thereby measuring the distance up to the lower surface of the substrate W held by the stage 1100.

[0144] Furthermore, the method for measuring the thickness of the substrate W using the distance measuring device 1700 will be described later.

[0145] Furthermore, in this embodiment, all movable or actuating structural members (here, the stage 1100, the rotary actuator 1200, and the offset correction actuator 1300) are located below the substrate W. Therefore, it is possible to suppress the adhesion of particles generated by the movement or actuation of the structural members to the substrate W.

[0146] Next, refer to Figure 5 Description of retainer movement actuator 1330. Figure 5 A perspective view showing the structure of the retainer movement actuator 1330. (See attached image.) Figure 5 As shown, the retainer movement actuator 1330 has a support frame 1331, a fixing plate 1332, and a drive unit 1333.

[0147] The support frame 1331 is, for example, a metal frame with an L-shaped cross-section. The support frame 1331 has, for example, two frames 1331a and frame 1331b, and is formed into a U-shape when viewed from above. The two frames 1331a and frame 1331b are configured to extend, for example, in the horizontal direction. The two frames 1331a extend in the Y direction and are arranged parallel to each other in the X direction. Frame 1331b extends in the X direction and connects the ends of the two frames 1331a to each other.

[0148] The support frame 1331 is fixed to the lower surface of the support ring 1311 and supports the support ring 1311 from below. This prevents the support ring 1311 from warping due to its own weight and / or the weight of the substrate W.

[0149] The fixing plate 1332 is, for example, a metal plate extending in the vertical direction. The upper end of the fixing plate 1332 is fixed to the frame 1331b. The lower end of the fixing plate 1332 is inserted into the drive unit 1333.

[0150] The drive unit 1333 includes, for example, a stepper motor, a rack, and a pinion. The drive unit 1333 moves the fixed plate 1332 in the vertical direction. Because the fixed plate 1332 is moved vertically by the drive unit 1333, the support frame 1331 fixed to the fixed plate 1332 also moves vertically. Consequently, the retainer 1310 fixed to the support frame 1331 moves vertically.

[0151] Next, refer to Figure 6 Further explanation of the pre-alignment unit PU. Figure 6 A block diagram illustrating the structure of the pre-alignment unit PU.

[0152] like Figure 6 As shown, the first optical head 1710 of the distance measuring device 1700 includes: a first light-emitting element 1711 that emits first emitted light; and a first light-receiving element 1712 that receives light reflected from the upper surface of the substrate W in the first emitted light emitted from the first light-emitting element 1711. The first light-emitting element 1711 is not particularly limited, and can be, for example, a semiconductor element. In this embodiment, the first light-emitting element 1711 is, for example, a semiconductor laser. The first light-receiving element 1712 is not particularly limited, and can be, for example, a semiconductor element. In this embodiment, the first light-receiving element 1712 is, for example, a photodiode. Thus, the first optical head 1710 has a first light-emitting element 1711 for emitting the first emitted light and a first light-receiving element 1712 for receiving light reflected from the upper surface of the substrate W in the first emitted light emitted from the first light-emitting element 1711, thereby enabling easy measurement of the distance up to the upper surface of the substrate W held by the stage 1100.

[0153] The second optical head 1720 of the distance measuring device 1700 includes: a second light-emitting element 1721 that emits second emitted light; and a second light-receiving element 1722 that receives light reflected from the lower surface of the substrate W in the second emitted light emitted from the second light-emitting element 1721. The second light-emitting element 1721 is not particularly limited, and may be, for example, a semiconductor element. In this embodiment, the second light-emitting element 1721 is, for example, a semiconductor laser. The second light-receiving element 1722 is not particularly limited, and may be, for example, a semiconductor element. In this embodiment, the second light-receiving element 1722 is, for example, a photodiode. Thus, the second optical head 1720 has a second light-emitting element 1721 for emitting the second emitted light and a second light-receiving element 1722 for receiving light reflected from the lower surface of the substrate W in the second emitted light emitted from the second light-emitting element 1721, thereby enabling easy measurement of the distance up to the lower surface of the substrate W held by the stage 1100.

[0154] The control device 1900 controls various operations of the pre-alignment unit PU. Through the control device 1900, the pre-alignment unit PU corrects the positional deviation of the substrate W relative to the stage 1100. Furthermore, through the control device 1900, the pre-alignment unit PU measures the thickness of the substrate W.

[0155] The control device 1900 includes a control unit 1910 and a storage unit 1920. The control unit 1910 has a processor. The control unit 1910 may have, for example, a central processing unit. Alternatively, the control unit 1910 may also have a general-purpose arithmetic logic unit (ALU).

[0156] In this embodiment, the control unit 1910 includes a deviation calculation unit 1911 and a thickness calculation unit 1912. The deviation calculation unit 1911 calculates the positional deviation of the substrate W relative to the stage 1100 based on the detection results of the detection sensor 1600. Based on the calculated positional deviation, the control unit 1910 corrects the position of the substrate W relative to the stage 1100 using the deviation correction actuator 1300.

[0157] The thickness calculation unit 1912 calculates the thickness of the substrate W based on the measurement results of the first optical head 1710 and the second optical head 1720. Specifically, since the distance between the first optical head 1710 and the second optical head 1720 is a fixed distance, the thickness calculation unit 1912 subtracts the measurement results of the first optical head 1710 (the distance from the first optical head 1710 to the upper surface of the substrate W) and the measurement results of the second optical head 1720 (the distance from the second optical head 1720 to the lower surface of the substrate W) from the distance between the first optical head 1710 and the second optical head 1720, thereby calculating the thickness of the substrate W.

[0158] The storage unit 1920 stores data and computer programs. The data, for example, specifies the processing content and sequence for correcting positional deviations. Furthermore, the data, for example, specifies the processing content and sequence for measuring the thickness of the substrate W.

[0159] The storage unit 1920 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 1920 may also include a removable medium. The control unit 1910 executes the computer program stored in the storage unit 1920, thereby performing position deviation correction operations and substrate W thickness measurement operations.

[0160] Next, refer to Figure 7 as well as Figure 8 This paper describes a position detection method for substrate W based on sensor 1600. Figure 7 This is a schematic diagram illustrating a position detection method for a substrate W based on a detection sensor 1600. Figure 8 A top view showing the structure of substrate W. Furthermore, for ease of understanding, in Figure 7 The following Figure 17 as well as Figure 21 The strip of light emitted from the light emitter 1610 is shaded.

[0161] like Figure 7 As shown, the light emitting head 1610 is positioned above the edge of the substrate W such that the strip of light extends radially along the substrate W. Thus, as described above, a portion of the strip of light illuminates the upper surface of the substrate W, while the remaining strip of light passes through the sides of the substrate W.

[0162] Here, when the substrate W is offset from the stage 1100, since the central axis (not shown) of the stage 1100 coincides with the rotation axis L1210 of the rotary actuator 1200, the central axis LW of the substrate W is not aligned with the rotation axis L1210 of the rotary actuator 1200. Therefore, when the stage 1100 is rotated around the rotation axis L1210 of the rotary actuator 1200, the central axis LW of the substrate W rotates around the rotation axis L1210. That is, the substrate W rotates eccentrically. At this time, the amount of light (strip light) emitted from the light emitting head 1610 that is blocked by the substrate W changes synchronously with the rotation period of the substrate W. In other words, the amount of light received by the light receiving head 1620 changes synchronously with the rotation period of the substrate W. As a result, the offset calculation unit 1911 can calculate the positional offset of the substrate W relative to the stage 1100 based on the change in the amount of light received by the light receiving head 1620.

[0163] In addition, such as Figure 8As shown, a notch WN is formed at the periphery of the substrate W. The notch WN is a V-shaped cut. When the substrate W rotates around the rotation axis L1210, the amount of light blocked by the substrate W changes drastically as the notch WN passes between the light emitting head 1610 and the light receiving head 1620. Specifically, the amount of light blocked by the substrate W decreases sharply and then increases sharply as the notch WN passes between the light emitting head 1610 and the light receiving head 1620. Therefore, the offset calculation unit 1911 can detect the timing of the notch WN passing between the light emitting head 1610 and the light receiving head 1620. Therefore, the offset calculation unit 1911 can calculate the rotation angle position of the substrate W.

[0164] Next, refer to Figures 9 to 11 This describes a method for measuring the thickness of substrate W using a distance measuring device 1700. Figure 9 This is a schematic diagram illustrating a method for measuring the thickness of a substrate W using a distance measuring device 1700. Figure 10 This is a schematic diagram illustrating a method for measuring the distance up to the substrate W in the circumferential direction using a distance measuring device 1700. Figure 11 This is a schematic diagram illustrating a method for measuring the distance up to the substrate W along the transport direction A using a distance measuring device 1700.

[0165] like Figure 9 As shown, the first optical head 1710 is located above the substrate W held by the stage 1100. In other words, the first optical head 1710 is arranged facing the upper surface Wa of the substrate W held by the stage 1100. Furthermore, the first optical head 1710 is arranged such that the optical axis L1710 of the first emitted light emitted from the first optical head 1710 is located radially inward from the periphery of the upper surface Wa of the substrate W at a predetermined distance (for example, more than 1 mm and less than 10 mm). Hereinafter, the optical axis L1710 of the first emitted light emitted from the first optical head 1710 will sometimes be referred to as the optical axis L1710 of the first optical head 1710.

[0166] The second optical head 1720 is located below the substrate W held by the stage 1100. In other words, the second optical head 1720 is arranged facing the lower surface Wb of the substrate W held by the stage 1100. Furthermore, the second optical head 1720 is arranged such that the optical axis L1720 of the second emitted light emitted from the second optical head 1720 is located radially inward from the periphery of the lower surface Wb of the substrate W at a predetermined distance (for example, more than 1 mm and less than 10 mm). Hereinafter, the optical axis L1720 of the second emitted light emitted from the second optical head 1720 will sometimes be referred to as the optical axis L1720 of the second optical head 1720.

[0167] In this embodiment, the optical axis L1720 of the second emitted light emitted from the second optical head 1720 is located on the same axis as the optical axis L1710 of the first emitted light emitted from the first optical head 1710. Therefore, by using the first optical head 1710 and the second optical head 1720, it is possible to simultaneously measure the distance up to the upper surface Wa at the same position on the substrate W and the distance up to the lower surface Wb at the same position on the substrate W.

[0168] In this embodiment, when the distance to the substrate W is measured by the distance measuring device 1700, the distance to the substrate W is measured after the positional deviation of the substrate W relative to the stage 1100 has been corrected. That is, the distance to the substrate W is measured by the distance measuring device 1700 with the central axis LW of the substrate W aligned with the rotation axis L1210 of the rotary actuator 1200.

[0169] like Figure 10 As shown, with the positional deviation of the substrate W relative to the stage 1100 already corrected, the first emitted light from the first optical head 1710 illuminates a position radially inward from the periphery of the upper surface Wa of the substrate W at a predetermined distance (e.g., more than 1 mm and less than 10 mm). For ease of understanding, in Figure 10 The illumination position P1710 of the first optical head 1710 is shown in a small circle.

[0170] In this embodiment, when the distance to the substrate W is measured circumferentially by the distance measuring device 1700, the stage 1100 is rotated around the rotation axis L1210 of the rotary actuator 1200. As a result, the substrate W rotates around the rotation axis L1210 of the rotary actuator 1200. Since the central axis LW of the substrate W coincides with the rotation axis L1210, the illumination position P1710 of the first optical head 1710 moves circumferentially at a position radially inward from the periphery of the upper surface Wa of the substrate W at a predetermined distance. Figure 10 The trajectory P1710a of the irradiation position P1710 is shown in bold lines. Furthermore, similarly to the first optical head 1710, the irradiation position of the second optical head 1720 moves in a circular motion at a position radially inward from the periphery of the lower surface Wb of the substrate W at a predetermined distance.

[0171] Furthermore, in this embodiment, during the period when the rotary actuator 1200 rotates the stage 1100 holding the substrate W, the first optical head 1710 measures the distance up to the upper surface Wa of the substrate W, and the second optical head 1720 measures the distance up to the lower surface Wb of the substrate W.

[0172] Furthermore, during the period when the rotary actuator 1200 rotates the stage 1100 holding the substrate W, the thickness calculation unit 1912 calculates the thickness of the substrate W along the circumferential direction based on the measurement results obtained by the first optical head 1710 measuring the distance up to the upper surface Wa of the substrate W and the measurement results obtained by the second optical head 1720 measuring the distance up to the lower surface Wb of the substrate W.

[0173] In addition, such as Figure 11 As shown, in this embodiment, while the transport robot TR is transporting the substrate W relative to the stage 1100 in the transport direction A, which is the horizontal direction, the distance measuring device 1700 measures the distance up to the substrate W. Specifically, as described later, after the distance measuring device 1700 measures the distance up to the substrate W in the circumferential direction, in order to transport the substrate W to the bonding unit JU, the transport arm 3510 of the transport robot TR holds the substrate W and transports the substrate W relative to the stage 1100 in the transport direction A. As a result, the illumination position P1710 of the first optical head 1710 moves linearly through the center of the upper surface Wa of the substrate W (here, the center). That is, the illumination position P1710 moves along the centerline of the substrate W. Figure 11 The trajectory P1710b of the irradiation position P1710 is shown in thick lines. Furthermore, similarly to the first optical head 1710, the irradiation position of the second optical head 1720 moves in a straight line through the center of the lower surface Wb of the substrate W (here, the center).

[0174] During the process of the transport robot TR transporting the substrate W relative to the stage 1100 in the transport direction A, the first optical head 1710 measures the distance up to the upper surface Wa of the substrate W, and the second optical head 1720 measures the distance up to the lower surface Wb of the substrate W.

[0175] Furthermore, during the period when the transport robot TR is transporting the stage 1100 holding the substrate W relative to the stage 1100 in the transport direction A, the thickness calculation unit 1912 calculates the thickness of the substrate W along the transport direction A based on the measurement results obtained by the first optical head 1710 measuring the distance up to the upper surface Wa of the substrate W and the measurement results obtained by the second optical head 1720 measuring the distance up to the lower surface Wb of the substrate W.

[0176] The above, if used Figures 1 to 11As explained above, in this embodiment, the deviation correction actuator 1300 corrects the positional deviation of the substrate W relative to the stage 1100 based on the calculation results of the deviation calculation unit 1911. During the rotation of the stage 1100, which holds the substrate W with the corrected positional deviation, by the rotation actuator 1200, the thickness calculation unit 1912 calculates the thickness of the substrate W along the circumferential direction based on the measurement results obtained by the first optical head 1710 measuring the distance up to the upper surface Wa of the substrate W and the second optical head 1720 measuring the distance up to the lower surface Wb of the substrate W. Furthermore, during the transport robot TR transporting the corrected positional deviation substrate W relative to the stage 1100 in the horizontal direction, i.e., the transport direction A, the thickness calculation unit 1912 calculates the thickness of the substrate W along the transport direction A based on the measurement results obtained by the first optical head 1710 measuring the distance up to the upper surface Wa of the substrate W and the second optical head 1720 measuring the distance up to the lower surface Wb of the substrate W. Therefore, with the positional deviation of the substrate W relative to the stage 1100 already corrected, the thickness of the substrate W is calculated based on the measurement results obtained by measuring the distance up to the substrate W using the first optical head 1710 and the second optical head 1720, thus enabling high-precision measurement of the thickness of the substrate W.

[0177] Furthermore, the distance is measured from above and below the substrate W using the first optical head 1710 and the second optical head 1720, thereby enabling the high-precision measurement of the thickness of the substrate W even when the substrate W is warped.

[0178] Furthermore, during the rotation of the substrate W by the rotary actuator 1200, the first optical head 1710 and the second optical head 1720 measure the distance up to the substrate W. Therefore, unlike cases where the first optical head 1710 and the second optical head 1720 are moved circumferentially to measure the distance up to the substrate W, or cases where the substrate W is moved horizontally, the space for movement of the first optical head 1710 and the second optical head 1720, or the space for movement of the substrate W, may not be guaranteed. Therefore, it is possible to suppress the enlargement of the pre-alignment unit PU.

[0179] Furthermore, the thickness calculation unit 1912 calculates the thickness of the substrate W along the circumferential direction and along the transport direction A. Therefore, compared with the case where the thickness of the substrate W is calculated only along the circumferential direction or only along the transport direction A, the thickness of the substrate W can be measured with high accuracy.

[0180] Furthermore, as described above, during the transport robot TR's transport of substrate W in transport direction A, the thickness calculation unit 1912 calculates the thickness of substrate W along transport direction A based on the measurement results obtained by the first optical head 1710 measuring the distance along a straight line passing through the center of substrate W to the upper surface Wa of substrate W, and the measurement results obtained by the second optical head 1720 measuring the distance along a straight line passing through the center of substrate W to the lower surface Wb of substrate W. Therefore, the thickness of substrate W can be calculated along a straight line passing through the center of substrate W, thus enabling high-precision measurement of substrate W thickness.

[0181] Furthermore, as described above, with the substrate W held by the holder 1310, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 move the holder 1310 in the horizontal direction relative to the stage 1100 based on the calculation results of the deviation calculation unit 1911, thereby correcting the positional deviation of the substrate W relative to the stage 1100. Therefore, the positional deviation of the substrate W relative to the stage 1100 can be easily corrected.

[0182] Furthermore, as described above, the pre-alignment unit PU has an alignment housing 1010, on which a first optical head 1710 and a second optical head 1720 are fixed. Therefore, unlike the case where a moving mechanism is provided for moving the first optical head 1710 and the second optical head 1720, it is possible to prevent the generation of particles due to the driving of the moving mechanism.

[0183] Furthermore, as described above, the transport robot TR is configured outside the alignment housing 1010. Therefore, compared to the case where the transport robot TR is configured inside the alignment housing 1010, it is possible to suppress particulate contamination of the interior of the alignment housing 1010 caused by the driving of the transport robot TR.

[0184] Furthermore, as described above, the first optical head 1710 emits a first emitted light toward the upper surface Wa of the substrate W, and the second optical head 1720 emits a second emitted light toward the lower surface Wb of the substrate W. Therefore, the distance up to the upper surface Wa of the substrate W can be easily measured by the first optical head 1710, and the distance up to the lower surface Wb of the substrate W can be easily measured by the second optical head 1720.

[0185] Next, refer to Figures 12 to 23 Here is an example illustrating the operation flow of the pre-alignment unit PU and the transport unit TU in this embodiment. Figure 12 A flowchart illustrating an example of the operation of the pre-alignment unit PU and the transport unit TU. Figures 13 to 23 This is a schematic diagram illustrating an example of the operation of the pre-alignment unit PU and the transport unit TU. Furthermore, in Figures 13 to 23In order to simplify the accompanying drawings, the number of support pins 1120 of platform 1100 and support pins 1312 of retainer 1310 is depicted as less.

[0186] In this embodiment, the operation of the pre-alignment unit PU and the transport unit TU includes steps S1 to S19. Steps S1, S3, S16, and S18 are executed by the control unit (not shown) of the transport unit TU. Steps S2, S4 to S15, S17, and S19 are executed by the control unit 1910 of the pre-alignment unit PU. Furthermore, step S5 is an example of the "process for detecting the position of the substrate" according to the present invention. Step S6 is an example of the "process for calculating the positional deviation of the substrate" according to the present invention. Steps S7 to S11 are examples of the "process for correcting the positional deviation of the substrate" according to the present invention. Step S13 is an example of the "process for calculating the thickness of the substrate along the circumferential direction" according to the present invention. Step S19 is an example of the "process for calculating the thickness of the substrate along the transport direction" according to the present invention.

[0187] like Figure 12 As shown, in step S1, the substrate W is moved into the pre-alignment unit PU. Specifically, after the transport robot TR receives the substrate W from the central robot CR, it moves the substrate W into the pre-alignment unit PU. At this time, as... Figure 13 As shown, the transport robot TR inserts the transport arm 3510, which holds the substrate W, into the pre-alignment unit PU through the opening window 1011c of the side wall 1011a. Thus, the substrate W held by the transport arm 3510 is positioned above the stage 1100 and the holder 1310.

[0188] Next, in step S2, the holder 1310 rises to the raised position. Specifically, as follows... Figure 14 As shown, the retainer movement actuator 1330 causes the retainer 1310 to rise from the lowered position to the raised position. The lowered position is... Figure 13 The height position of the retainer 1310 is shown, and it is the height position where the support pin 1312 of the retainer 1310 is lower than the support pin 1120 of the platform 1100. The rising position is... Figure 14 The height position shown is the height position where the support pin 1312 of the retainer 1310 becomes higher than the support pin 1120 of the stage 1100. In addition, the rising position is the height position where the support pin 1312 of the retainer 1310 protrudes above the upper surface 3510a of the transport arm 3510.

[0189] In step S2, the holder 1310 rises to the raised position, whereby the support pin 1312 of the holder 1310 protrudes above the upper surface 3510a of the transport arm 3510. Thus, the substrate W is supported by the holder 1310 and separated from the transport arm 3510. That is, the substrate W is delivered from the transport arm 3510 to the holder 1310.

[0190] Next, in step S3, the transport arm 3510 retracts. Specifically, the transport drive unit 3520 of the transport robot TR retracts the transport arm 3510 into the transport unit TU through the opening window 1011c of the side wall 1011a (see reference). Figure 15 ).

[0191] Next, in step S4, the holder 1310 descends to the lowered position. Specifically, as... Figure 16 As shown, the retainer movement actuator 1330 lowers the retainer 1310 from the raised position to the lowered position. As a result, the substrate W descends from above the stage 1100. In step S4, as the retainer 1310 descends to the lowered position, the support pin 1312 of the retainer 1310 moves below the support pin 1120 of the stage 1100, and the lower surface Wb of the substrate W contacts the support pin 1120 of the stage 1100. Thus, the substrate W is supported by the support pin 1120, and the lower surface Wb of the substrate W is separated from the support pin 1312 of the retainer 1310. That is, the substrate W is delivered from the retainer 1310 to the stage 1100.

[0192] Furthermore, in step S4, when the substrate W is delivered from the holder 1310 to the stage 1100, the central axis LW of the substrate W is not aligned with the rotation axis L1210 of the rotary actuator 1200 and the central axis (not shown) of the stage 1100. That is, the center of the substrate W is offset relative to the center of the stage 1100.

[0193] Next, in step S5, the detection sensor 1600 detects the position of the substrate W held by the stage 1100. Specifically, as... Figure 17As shown, the rotary actuator 1200 rotates the stage 1100 around the rotation axis L1210. Consequently, the substrate W rotates around the rotation axis L1210. Furthermore, in step S5, the stage 1100 rotates while positioned in a reference position. Hereinafter, the axis coinciding with the central axis (not shown) of the stage 1100 and the rotation axis L1210 of the rotary actuator 1200 when the stage 1100 is positioned in the reference position will be referred to as the reference axis LB. The reference position and the position of the reference axis LB coincide with, for example, the center position of the alignment housing 1010 when viewed from above and do not move. The rotation speed of the stage 1100 and the substrate W is not particularly limited, but to ensure the detection accuracy of the detection sensor 1600, it is, for example, 60 rpm (rotations per minute) or less.

[0194] Furthermore, during the rotation of the substrate W, the detection sensor 1600 detects the position of the substrate W. Specifically, as described above, the light emitting head 1610 emits a strip of light toward the periphery of the substrate W, and the light receiving head 1620 receives the light (strip of light) emitted from the light emitting head 1610 that passes through the side of the substrate W. The detection sensor 1600 sends a signal indicating the amount of light received to the control unit 1910.

[0195] Next, in step S6, the deviation calculation unit 1911 of the control unit 1910 calculates the positional deviation of the substrate W relative to the stage 1100 based on the detection result of the detection sensor 1600. In this embodiment, the positional deviation of the substrate W relative to the central axis (not shown) of the stage 1100 and the rotation axis L1210 of the rotary actuator 1200 is calculated.

[0196] Furthermore, in this embodiment, the deviation calculation unit 1911 detects the time point between the light emitting head 1610 and the light receiving head 1620 for the notch WN of the substrate W based on the detection result of the detection sensor 1600. Then, the deviation calculation unit 1911 calculates the rotation angle position of the substrate W relative to the stage 1100. The rotation angle position is the position of the substrate W relative to the rotation direction of the stage 1100.

[0197] Next, in step S7, stage 1100 moves in the horizontal direction. Specifically, as follows: Figure 18 As shown, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 move the stage 1100 and the substrate W in the horizontal direction based on the position deviation calculated by the deviation calculation unit 1911, so that the central axis LW of the substrate W is aligned with the reference axis LB. Furthermore, in step S7, when the central axis LW of the substrate W is aligned with the reference axis LB, the rotation axis L1210 of the rotary actuator 1200 is located at a position deviated from the reference axis LB.

[0198] Next, in step S8, the holder 1310 rises to the raised position. Specifically, as... Figure 19 As shown, the retainer movement actuator 1330 raises the retainer 1310 from a lowered position to a raised position. When the retainer 1310 rises to the raised position, the support pin 1312 of the retainer 1310 protrudes above the support pin 1120 of the stage 1100. Thus, the substrate W is supported by the retainer 1310 and separated from the support pin 1120 of the stage 1100. That is, the substrate W is delivered from the stage 1100 to the retainer 1310.

[0199] Next, in step S9, stage 1100 moves in the horizontal direction. Specifically, as follows: Figure 20 As shown, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 move the stage 1100 by the same distance in the horizontal direction opposite to that of step S7. As a result, the central axis of the stage 1100 (not shown) and the rotation axis L1210 of the rotary actuator 1200 are aligned with the central axis LW of the substrate W and the reference axis LB.

[0200] Next, in step S10, the stage 1100 is rotated. Specifically, the rotation actuator 1200 rotates the stage 1100 based on the rotation angle position of the substrate W relative to the stage 1100 calculated by the offset calculation unit 1911. As a result, the substrate W is positioned at a predetermined rotation angle relative to the stage 1100. That is, the notch WN of the substrate W is located directly above a specific position on the stage 1100.

[0201] Next, in step S11, the holder 1310 descends to the lowered position. Specifically, as... Figure 16 As shown, similar to step S4, the holder movement actuator 1330 lowers the holder 1310 from the raised position to the lowered position. Thus, the substrate W is delivered from the holder 1310 to the stage 1100.

[0202] Furthermore, in step S11, when the substrate W is delivered from the holder 1310 to the stage 1100, unlike in step S4, the central axis LW of the substrate W is substantially aligned with the rotation axis L1210 of the rotary actuator 1200, the central axis of the stage 1100 (not shown), and the reference axis LB. The positional deviation of the central axis LW of the substrate W relative to the rotation axis L1210 of the rotary actuator 1200, the central axis of the stage 1100 (not shown), and the reference axis LB is, for example, less than 0.1 mm.

[0203] Next, in step S12, the distance from the distance measuring device 1700 to the substrate W is measured in the circumferential direction. Specifically, as follows... Figure 21As shown, the rotary actuator 1200 causes the stage 1100 to rotate about the rotation axis L1210 and the reference axis LB. As a result, the substrate W rotates about the central axis LW, the rotation axis L1210 and the reference axis LB.

[0204] Furthermore, during the rotation of the substrate W, the distance measuring device 1700 measures the distance up to the substrate W in the circumferential direction. Specifically, the first optical head 1710 emits a first emitted light toward the upper surface Wa of the substrate W, and receives the light reflected from the upper surface Wa of the substrate W in the first emitted light through the first light receiving element 1712. Thus, the first optical head 1710 measures the distance up to the upper surface Wa of the substrate W held by the stage 1100. The second optical head 1720 emits a second emitted light toward the lower surface Wb of the substrate W, and receives the light reflected from the lower surface Wb of the substrate W in the second emitted light through the second light receiving element 1722. Thus, the second optical head 1720 measures the distance up to the lower surface Wb of the substrate W held by the stage 1100. The distance measuring device 1700 sends a signal showing the measured distance to the control unit 1910. Furthermore, for ease of understanding, in Figure 21 The first and second emitted beams are shaded.

[0205] Furthermore, in this embodiment, similarly to step S5, during the rotation of the substrate W, the detection sensor 1600 detects the position of the substrate W. The detection sensor 1600 sends a signal indicating the amount of light received to the control unit 1910.

[0206] Next, in step S13, the thickness calculation unit 1912 of the control unit 1910 calculates the thickness of the substrate W along the circumferential direction based on the measurement results of the distance measuring device 1700. Furthermore, in this embodiment, simultaneously with the measurement by the distance measuring device 1700, the detection sensor 1600 detects the position of the notch WN in the substrate W. Therefore, the thickness calculation unit 1912 calculates the thickness of the substrate W based on the detection results of the detection sensor 1600, while already associating the thickness of the substrate W with its circumferential position.

[0207] Next, in step S14, the position of the notch WN on the substrate W is adjusted. Specifically, the rotary actuator 1200 rotates the stage 1100 and the substrate W by a predetermined angle based on the detection result of the detection sensor 1600. At this time, the rotary actuator 1200 rotates the stage 1100 and the substrate W such that the notch WN on the substrate W is located at a predetermined position. In this embodiment, the rotary actuator 1200 rotates the stage 1100 such that the notch WN is located on a straight line parallel to the X direction and passing through the reference axis LB. Here, the rotary actuator 1200 rotates the stage 1100 and the substrate W such that the notch WN is located on a straight line parallel to the X direction and passing through the reference axis LB and close to the transport unit TU.

[0208] Next, in step S15, the holder 1310 rises to the raised position. Specifically, as... Figure 19 As shown, the retainer movement actuator 1330 raises the retainer 1310 from a lowered position to a raised position. When the retainer 1310 rises to the raised position, the support pin 1312 of the retainer 1310 protrudes above the support pin 1120 of the stage 1100. Thus, the substrate W is supported by the retainer 1310 and separated from the support pin 1120 of the stage 1100. That is, the substrate W is delivered from the stage 1100 to the retainer 1310.

[0209] Next, in step S16, the handling arm 3510 of the handling robot TR is inserted into the pre-alignment unit PU. Specifically, as... Figure 22 As shown, the handling robot TR inserts the handling arm 3510 into the pre-alignment unit PU through the opening window 1011c of the side wall 1011a. Thus, the handling arm 3510 is positioned between the holder 1310 and the substrate W.

[0210] Next, in step S17, the holder 1310 descends to the lowered position. Specifically, as... Figure 23 As shown, the holder movement actuator 1330 lowers the holder 1310 from the raised position to the lowered position. This causes the substrate W to descend from above the transport arm 3510. As the holder 1310 descends to the lowered position, the support pin 1312 of the holder 1310 moves to below the upper surface 3510a of the transport arm 3510. Consequently, the lower surface Wb of the substrate W contacts the upper surface 3510a of the transport arm 3510, thus the substrate W is supported by the transport arm 3510. Then, the lower surface Wb of the substrate W is separated from the support pin 1312 of the holder 1310. That is, the substrate W is delivered from the holder 1310 to the transport arm 3510.

[0211] Next, in step S18, the substrate W is removed from the pre-alignment unit PU, and the distance from the distance measuring device 1700 to the substrate W is measured along the transport direction A. Specifically, the transport drive unit 3520 of the transport robot TR receives the transport arm 3510 holding the substrate W into the transport unit TU through the opening window 1011c of the side wall 1011a. That is, the transport robot TR moves the substrate W in the transport direction A (refer to...). Figure 11 The substrate W is then transported and housed within the transport unit TU. Thus, the substrate W is moved from the pre-alignment unit PU to the transport unit TU. At this time, if using... Figure 11 As explained, during the process of the transport robot TR transporting the substrate W relative to the stage 1100 in the transport direction A, the distance measuring device 1700 measures the distance up to the substrate W. Thus, the distance measuring device 1700 measures the distance up to the substrate W along a straight line (center line) passing through the center of the substrate W.

[0212] Next, in step S19, the thickness calculation unit 1912 of the control unit 1910 calculates the thickness of the substrate W along the transport direction A based on the measurement results of the distance measuring device 1700. Then, the control unit 1910 sends the calculation results from step S13 and the calculation results from step S19 to the control unit 91.

[0213] As described above, the pre-alignment operation of the substrate W using the pre-alignment unit PU and the thickness measurement operation of the substrate W are completed.

[0214] Next, refer to Figures 24 to 30 The joining unit JU of this embodiment is described. Figure 24 A perspective view is provided to schematically illustrate the structure of the joining unit JU. (See figure.) Figure 24 As shown, the bonding unit JU includes a base 2, a first substrate holder 10, a second substrate holder 20, a first motion actuator 100, and a second motion actuator 200. Furthermore, the first motion actuator 100 is an example of the "substrate holder actuator" of the present invention.

[0215] The base 2 supports the first substrate holder 10, the second substrate holder 20, the first motion actuator 100, and the second motion actuator 200, etc. The base 2 is formed of a material that is difficult to deform due to the weight and heat of the first motion actuator 100 and the second motion actuator 200, etc. For example, the base 2 is formed of stone. This improves the straightness and flatness of the base 2. Furthermore, a vibration isolation table (not shown) is disposed below the base 2. This suppresses vibrations from the bottom 4012 (see reference 4012). Figure 3The vibration is transmitted to the first substrate holder 10, the second substrate holder 20, the first motion actuator 100, and the second motion actuator 200, etc. The vibration isolation stage is not particularly limited; for example, it can also be an active vibration removal stand. An active vibration isolation stand, for example, has a sensor for detecting vibration and an actuator for suppressing the transmission of vibration.

[0216] In this embodiment, the first substrate holder 10 holds the back side of the first substrate W1 (the side opposite to the side that is attached to the second substrate W2). In this embodiment, as described later, the first substrate holder 10 causes the first substrate W1 to flip up and down or move the first substrate W1 up and down.

[0217] The first substrate holder 10 has a first unit 11 and a first holding portion 12 fixed to the first unit 11. The first unit 11 has a first surface 11a on which the first holding portion 12 is mounted. The first unit 11 is, for example, a plate with a cuboid shape. The first unit 11 is, for example, formed of ceramic or metal with a small coefficient of linear expansion.

[0218] The first holding portion 12 holds the back side of the first substrate W1. The holding method of the first holding portion 12 is not particularly limited, and for example, it can be a vacuum type. That is, the first holding portion 12 adsorbs the back side of the first substrate W1. Alternatively, the holding method of the first holding portion 12 can be a clamping type that holds the end of the first substrate W1. However, to avoid the first holding portion 12 contacting the second substrate holder 20 and / or the second substrate W2 when the first substrate W1 and the second substrate W2 are bonded, the holding method of the first holding portion 12 is preferably a vacuum type. The first holding portion 12 is, for example, a plate having a cylindrical or circular shape. The first holding portion 12 is, for example, formed of ceramic or metal with a low coefficient of linear expansion.

[0219] In this embodiment, the second substrate holder 20 holds the back side of the second substrate W2 (the side opposite to the side that is attached to the first substrate W1). In this embodiment, as described later, the second substrate holder 20 moves the second substrate W2 horizontally along the upper surface of the base 2. Furthermore, as described later, the second substrate holder 20 rotates the second substrate W2 circumferentially.

[0220] The second substrate holder 20 has a second base 21 and a second holding portion 22 fixed to the second base 21. The second base 21 holds the second holding portion 22. The second base 21 is, for example, a plate with a cuboid shape. The second base 21 is, for example, formed of ceramic or metal with a small coefficient of linear expansion.

[0221] The second holding portion 22 holds the back side of the second substrate W2. The holding method of the second holding portion 22 is not particularly limited, and for example, it can be a vacuum type. That is, the second holding portion 22 adsorbs the back side of the second substrate W2. Alternatively, the holding method of the second holding portion 22 can be a clamping type that holds the end of the second substrate W2. However, to avoid contact between the second holding portion 22 and the first substrate holder 10 and / or the first substrate W1 when the second substrate W2 is attached, the holding method of the second holding portion 22 is preferably a vacuum type. The second holding portion 22 is, for example, a plate having a cylindrical or circular shape. The second holding portion 22 is, for example, formed of ceramic or metal with a low coefficient of linear expansion.

[0222] Furthermore, the second holding portion 22 is configured to rotate in the circumferential direction. Specifically, the second holding portion 22 is configured to rotate about its center. In other words, the second holding portion 22 causes the second substrate W2 to rotate in the circumferential direction. Additionally, the second holding portion 22 causes the second substrate W2 to rotate in the horizontal plane.

[0223] The first motion actuator 100 moves the first substrate holder 10. In this embodiment, the first motion actuator 100 flips the first substrate holder 10 up and down or moves the first substrate holder 10 up and down. As a result, the first substrate W1 flips up and down or moves up and down.

[0224] Specifically, the first moving actuator 100 includes a tilting actuator 110, a lifting actuator 120, and a first gantry 130. Figure 24 The first gantry 130 is depicted with a double-dotted line.

[0225] The flip actuator 110 flips the first substrate holder 10 up and down. The flip actuator 110 includes: a rotation shaft 111 fixed to the first substrate holder 10; and a first rotation drive unit (not shown) that rotates the rotation shaft 111. The rotation shaft 111 can be a single shaft passing through the first substrate holder 10, or it can be a pair of shafts disposed apart from the first substrate holder 10. The first rotation drive unit may be, for example, a stepper motor. The first rotation drive unit rotates the rotation shaft 111 180 degrees. Thus, the first substrate holder 10 flips up and down.

[0226] In this embodiment, the bonding unit JU includes an angle detection sensor 150. The angle detection sensor 150 detects the angle between the first substrate holder 10 and the second substrate holder 20. The angle detection sensor 150 includes, for example, three or more distance measuring sensors 151. The distance measuring sensors 151 are mounted, for example, on one side 11a of the first substrate holder 10 and measure the distance up to the second substrate holder 20. Based on the detection results of the distance measuring sensors 151, the rotation shaft 111 is rotated, thereby enabling the first substrate holder 10 to be arranged parallel to the second substrate holder 20. Thus, the first substrate W1 can be arranged parallel to the second substrate W2. Alternatively, the distance measuring sensors 151 can also be mounted on the second substrate holder 20 and measure the distance up to the first substrate holder 10. As long as the angle detection sensor 150 can detect the angle between the first substrate holder 10 and the second substrate holder 20, sensors or devices other than the distance measuring sensor 151 may also be included.

[0227] The lifting actuator 120 moves the first substrate holder 10 up and down. The lifting actuator 120 has a pair of support members 121 and a pair of lifting mechanisms 122. The support members 121 support the flip actuator 110. The support members 121 rotatably support the rotation axis 111 of the flip actuator 110. Furthermore, the lifting actuator 120 moves the first substrate holder 10 in the vertical direction based on the detection result of the distance measuring sensor 151, thereby setting the distance between the first substrate W1 and the second substrate W2 within a predetermined range.

[0228] The lifting mechanism 122 has multiple movable elements 122a and multiple tracks (not shown). The movable elements 122a are fixed to a support member 121. Two movable elements 122a are fixed to one support member 121. The movable elements 122a move along the tracks. The movable elements 122a may have coils, for example. Furthermore, the movable elements 122a may have an encoder to detect the distance traveled along the tracks (not shown). Alternatively, all movable elements 122a may not have coils or encoders, or more than one movable element 122a may have coils and encoders.

[0229] A track (not shown) is fixed to the first gantry 130 in a vertically extending manner. The track has multiple magnets. The multiple magnets are arranged with their N and S poles alternating along the vertical direction. A current is passed through the coil of the movable member 122a, thereby moving the movable member 122a along the track. The movable member 122a moves up and down along the track, thereby moving the first substrate holder 10 up and down.

[0230] The second motion actuator 200 moves the second substrate holder 20. In this embodiment, the second motion actuator 200 moves the second substrate holder 20 horizontally along the upper surface of the base 2. Furthermore, in this embodiment, the second motion actuator 200 rotates the second holding portion 22 of the second substrate holder 20 in the circumferential direction. In other words, the second motion actuator 200 rotates the second holding portion 22 of the second substrate holder 20 in the horizontal plane.

[0231] Specifically, the second motion actuator 200 has a parallel movement section 210 and a second rotation drive section 230 (see reference). Figure 25 The parallel movement section 210 moves the second substrate holder 20 parallel to the upper surface of the base 2. The parallel movement section 210 includes: a movement section 211 for moving the second substrate holder 20 in the X direction; a movement section 212 for moving the second substrate holder 20 in the Y direction; and a support stage 213 disposed between the movement section 211 and the movement section 212.

[0232] Figure 25 This is a schematic diagram showing the structure of the periphery of the second substrate holder 20 of the bonding unit JU from the X direction. Figure 24 as well as Figure 25 As shown, the moving part 211 is disposed on the support platform 213. The moving part 211 has a linear motor 2111 and a linear guide 2112. In this embodiment, the moving part 211 has a pair of linear motors 2111 and a pair of linear guides 2112.

[0233] A pair of linear motors 2111 are disposed outside the second motor 21 of the second substrate holder 20 in the Y direction. The pair of linear motors 2111 are disposed at a predetermined distance from each other in the Y direction.

[0234] Each linear motor 2111 has a movable element 2111a and a track 2111b. The movable element 2111a is fixed to the side of the second motor 21. The movable element 2111a moves along the track 2111b. The movable element 2111a has, for example, a coil. Furthermore, the movable element 2111a has an encoder for detecting the distance traveled along the track 2111b. Alternatively, neither of the two movable elements 2111a may have a coil or an encoder, or one of the two movable elements 2111a may have a coil and an encoder.

[0235] Track 2111b is fixed to support platform 213 in an X-direction extending direction. Track 2111b has multiple magnets. The multiple magnets are arranged with N poles and S poles alternating along the X-direction. Current is passed through the coil of movable member 2111a, thereby moving movable member 2111a along track 2111b. The movement of movable member 2111a along track 2111b causes the second substrate holder 20 to move in the X-direction.

[0236] A pair of linear guides 2112 are disposed between the second stage 21 of the second substrate holder 20 and the support stage 213. The pair of linear guides 2112 are disposed at a predetermined distance in the Y direction. The pair of linear guides 2112 are respectively disposed along a pair of linear motors 2111.

[0237] Each linear guide 2112 has a movable element 2112a and a track 2112b. The movable element 2112a is fixed to the lower surface of the second base 21 (the surface facing the support platform 213). The movable element 2112a moves along the track 2111b. The movable element 2112a has, for example, a U-shaped cross-section and clamps the track 2112b from both sides in the Y direction. The track 2112b is fixed to the support platform 213 in a manner that extends in the X direction. The linear guide 2112 enables the second substrate holder 20 to move linearly with high precision.

[0238] Figure 26 This is a schematic diagram showing the structure of the periphery of the second substrate holder 20 of the bonding unit JU from the Y direction. Figure 24 as well as Figure 26 As shown, the moving part 212 is disposed on the base 2. The moving part 212 has a linear motor 2121 and a linear guide 2122. In this embodiment, the moving part 212 has a pair of linear motors 2121 and a pair of linear guides 2122.

[0239] A pair of linear motors 2121 are disposed between the support platform 213 and the base 2. The pair of linear motors 2121 are disposed at a predetermined distance from each other in the X direction.

[0240] Each linear motor 2121 has a movable element 2121a and a track 2121b. The movable element 2121a is fixed to the lower surface of the support platform 213 (the surface facing the base 2). The movable element 2121a moves along the track 2121b. The movable element 2121a has, for example, a coil. Furthermore, the movable element 2121a has an encoder for detecting the distance traveled along the track 2121b. Alternatively, neither of the two movable elements 2121a may have a coil or encoder, or one of the movable elements 2121a may have a coil and encoder.

[0241] Track 2121b is fixed to base 2 in a manner extending in the Y direction. Track 2121b has multiple magnets. The multiple magnets are arranged in a manner where the N pole and S pole are alternately arranged along the Y direction. Current is passed through the coil of movable member 2121a, thereby moving movable member 2121a along track 2121b. As movable member 2121a moves along track 2121b, support stage 213 and second substrate holder 20 move in the Y direction.

[0242] A pair of linear guides 2122 are disposed between the support platform 213 and the base 2. The pair of linear guides 2122 are disposed at a predetermined distance in the X direction. The pair of linear guides 2122 are respectively disposed along a pair of linear motors 2121.

[0243] Each linear guide 2122 has a movable element 2122a and a track 2122b. The movable element 2122a is fixed to the lower surface of the support platform 213 (the surface facing the base 2). The movable element 2122a moves along the track 2122b. The movable element 2122a has, for example, a U-shaped cross-section and clamps the track 2122b from both sides in the X direction. The track 2122b is fixed to the base 2 in a manner extending in the Y direction. The linear guide 2122 enables the support platform 213 and the second substrate holder 20 to move linearly with high precision.

[0244] The second rotation drive unit 230 is mounted on the lower part of the second holding part 22 of the second substrate holder 20. The second rotation drive unit 230 rotates the second holding part 22 in the circumferential direction. That is, the second rotation drive unit 230 rotates the second substrate W2 in the circumferential direction in the horizontal plane. The second rotation drive unit 230 includes, for example, a motor. In this embodiment, the second rotation drive unit 230 includes a direct drive motor. As a result, the rotation angle of the second substrate W2 can be controlled with high precision.

[0245] Figure 27 This is a schematic diagram showing the structure surrounding the support platform 213 from below. Figure 25 as well as Figure 27 As shown, the bonding unit JU has a detection actuator 300. The detection actuator 300 detects the movement of one of the first substrate holder 10 and the second substrate holder 20 in the XY plane. In this embodiment, the detection actuator 300 detects the movement of the second substrate holder 20 in the XY plane.

[0246] Specifically, the detection actuator 300 includes, for example, a two-dimensional scale 301 (hereinafter referred to as 2D scale 301) and a detection sensor 302. The 2D scale 301 is mounted on the lower surface of the second unit 21 of the second substrate holder 20. The 2D scale 301 has a rectangular shape that extends in the X and Y directions. The 2D scale 301 is, for example, a reflection-type diffraction grating scale. The 2D scale 301 is configured such that the grating spacing varies along the X and Y directions.

[0247] An opening 213a is provided on the support platform 213. The opening 213a is located below the 2D scale 301. Furthermore, the opening 213a has a larger opening than the 2D scale 301.

[0248] A detection sensor 302 is mounted on the upper surface of the base 2. The detection sensor 302 protrudes upward from the opening 213a of the support 213. Alternatively, the detection sensor 302 may be located below the support 213. The detection sensor 302 emits a laser beam toward the 2D scale 301 and receives the light reflected by the 2D scale 301. As the second substrate holder 20 moves, the light-receiving signal of the detection sensor 302 changes. Thus, the amount of movement of the second substrate holder 20 in the X and Y directions is detected.

[0249] Return to Figure 24 Further explanation of the joining unit JU. For example... Figure 24 As shown, the bonding unit JU includes a first substrate detection sensor 310 and a first reference mask 410. The first substrate detection sensor 310 detects a first substrate W1. Specifically, the first substrate W1 has one or more alignment marks. The first substrate detection sensor 310 detects the alignment marks of the first substrate W1.

[0250] The first substrate detection sensor 310 is fixed to the second unit 21. The first substrate detection sensor 310 includes, for example, a camera. The first substrate detection sensor 310 includes an imaging element. For example, the imaging element is a CCD (Charge Coupled Device) imaging sensor or a CMOS (Complementary Metal-Oxide Semiconductor) imaging sensor. The first substrate detection sensor 310 transmits the captured image data to the control device 90. The captured image data includes image data. In this embodiment, the first substrate detection sensor 310 has a camera 311. Furthermore, the first substrate detection sensor 310 may also have multiple cameras with different magnifications, similar to the second substrate detection actuator 320 described later.

[0251] Furthermore, the first substrate detection sensor 310 detects the first reference mask 410. Specifically, the first reference mask 410 has alignment marks. The first substrate detection sensor 310 detects the alignment marks of the first reference mask 410. Furthermore, the first substrate detection sensor 310 detects the first reference mask 410 with one side 11a of the first unit 11 facing downwards.

[0252] The first reference mask 410 is fixed to the first stage 11. The first reference mask 410 has: a marking member 411 with alignment marks formed thereon; and a pair of pillars 412 supporting the marking member 411.

[0253] The marking member 411 has alignment marks formed with high precision. For example, the marking member 411 is etched or otherwise formed to form the alignment marks. The marking member 411 is formed, for example, from a member with a small coefficient of linear expansion. Furthermore, the marking member 411 may also be formed, for example, from a member that is transparent to light. In this embodiment, the marking member 411 is formed, for example, from glass that allows visible light to pass through.

[0254] Here, the alignment mark of the first substrate W1 and the alignment mark of the first reference mask 410 are detected by the first substrate detection sensor 310, thereby enabling the detection of the relative position of the alignment mark of the first substrate W1 relative to the alignment mark of the first reference mask 410. Specifically, the first substrate detection sensor 310 is moved horizontally with one side 11a of the first unit 11 facing downwards, thereby detecting the alignment mark of the first substrate W1 and the alignment mark of the first reference mask 410. At this time, after the alignment mark of the first substrate W1 is detected by the first substrate detection sensor 310, the direction and distance of movement of the first substrate detection sensor 310 and the second substrate holder 20 are detected by the detection actuator 300 until the alignment mark of the first reference mask 410 is detected. Thus, the relative position of the alignment mark of the first substrate W1 relative to the alignment mark of the first reference mask 410 can be detected.

[0255] The bonding unit JU includes a second substrate detection actuator 320 and a second reference mask 420. The second substrate detection actuator 320 detects a second substrate W2. Specifically, the second substrate W2 has one or more alignment marks. The second substrate detection actuator 320 detects the alignment marks of the second substrate W2.

[0256] The bonding unit JU has a second gantry 350, and a second substrate detection actuator 320 is fixed to the second gantry 350. Furthermore, in Figure 24A portion of the second gantry 350 is depicted using a double-dotted line. The second substrate detection actuator 320 includes, for example, a camera. The second substrate detection actuator 320 includes an imaging element. For example, the imaging element is a CCD imaging sensor or a CMOS imaging sensor. The second substrate detection actuator 320 transmits the captured imaging data to the control device 90. The captured data includes image data.

[0257] In this embodiment, the second substrate detection actuator 320 includes a camera 321 and a camera 322 with different magnifications. Camera 321 is a lower magnification camera, and camera 322 is a higher magnification camera. The magnification of camera 322 is greater than that of camera 321. Because camera 321 has a larger viewing angle, it is easier to detect the alignment marks on the second substrate W2. On the other hand, because camera 322 has a smaller viewing angle and a higher magnification, the detection accuracy of the alignment marks is high.

[0258] Furthermore, when the alignment mark of the second substrate W2 is detected by the second substrate detection actuator 320, the alignment mark is detected by the camera 321 and then by the camera 322. Therefore, between the detection performed by the camera 321 and the detection performed by the camera 322, it is necessary to move the second substrate detection actuator 320 (both cameras 321 and 322). However, for the sake of simplicity, both the detection performed by the camera 321 and the detection performed by the camera 322 will be referred to as the detection performed by the second substrate detection actuator 320. Furthermore, the action of moving the second substrate detection actuator 320 between the detection performed by the camera 321 and the detection performed by the camera 322 will be omitted.

[0259] Furthermore, the second substrate detection actuator 320 detects the second reference mask 420. Specifically, the second reference mask 420 has alignment marks. The second substrate detection actuator 320 detects the alignment marks of the second reference mask 420.

[0260] The second reference mask 420 is fixed to the second stage 21. The second reference mask 420 has: a marking member 421 with alignment marks formed thereon; and a support 422 supporting the marking member 421.

[0261] The marking member 421 has alignment marks formed with high precision. For example, the marking member 421 is etched or otherwise formed to form the alignment marks. The marking member 421 is formed, for example, from a member with a small coefficient of linear expansion. Furthermore, the marking member 421 may also be formed, for example, from a member that is translucent. In this embodiment, the marking member 421 is formed, for example, from glass that allows visible light to pass through. Alternatively, the marking member 421 may also be formed from a member that does not allow visible light to pass through.

[0262] Here, the alignment marks of the second substrate W2 and the alignment marks of the second reference mask 420 are detected by the second substrate detection actuator 320, thereby enabling the detection of the relative position of the alignment marks of the second substrate W2 with respect to the alignment marks of the second reference mask 420. Specifically, the second substrate holder 20 and the second substrate W2 are moved in the horizontal direction, thereby detecting the alignment marks of the second substrate W2 and the alignment marks of the second reference mask 420. At this time, after the second substrate detection actuator 320 detects the alignment marks of the second substrate W2, the detection actuator 300 detects the direction and distance of movement of the second substrate holder 20 and the second substrate W2 until the alignment marks of the second reference mask 420 are detected. Thus, the relative position of the alignment marks of the second substrate W2 with respect to the alignment marks of the second reference mask 420 can be detected.

[0263] Figure 28 A perspective view showing the structure of the joining unit JU in a schematic manner from below. Figure 28 As shown, the joining unit JU has a shooting unit 50. Furthermore, in this embodiment, the shooting unit 50 sends the captured shooting data to the control device 90.

[0264] In this embodiment, the imaging unit 50 is fixed to the first substrate holder 10. Furthermore, in this embodiment, the imaging unit 50 images the first reference mask 410 and the second reference mask 420. Specifically, the imaging unit 50 images the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420. In this embodiment, the imaging unit 50 simultaneously images the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420. That is, the imaging unit 50 images the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 within a single frame.

[0265] In this embodiment, the camera unit 50 is mounted on the first unit 11. For example, the camera unit 50 is mounted on one side 11a of the first unit 11 (see reference). Figure 24 Furthermore, the imaging unit 50 may be mounted on the first unit 11, for example, by passing through it. In this embodiment, the imaging unit 50 is mounted on the first unit 11 by passing through it in the thickness direction.

[0266] When the first substrate W1, held by the first substrate holder 10, and the second substrate W2, held by the second substrate holder 20, are bonded together, the first reference mask 410 and the second reference mask 420 are arranged facing each other in the vertical direction. At this time, the alignment marks of the first reference mask 410 and the second reference mask 420 are arranged facing each other in the vertical direction. However, in the XY plane, the positions of the alignment marks of the first reference mask 410 and the second reference mask 420 may or may not be exactly the same. The alignment marks of the first reference mask 410 and the second reference mask 420 only need to be positioned where they are simultaneously captured by the imaging unit 50.

[0267] Control Unit 91 (Reference) Figure 1 The control unit 91 controls the first motion actuator 100 and the second motion actuator 200.

[0268] For example, the control unit 91 controls the first motion actuator 100 to flip the first substrate W1, which is delivered from the transport robot TR to the first substrate holder 10 and held by the first substrate holder 10, vertically. For example, the control unit 91 controls the first motion actuator 100 to move the flipped first substrate W1 downward and fit it against the first substrate W1 and the second substrate W2.

[0269] The control unit 91 calculates, for example, the relative position of the alignment mark of the first substrate W1 relative to the alignment mark of the first reference mask 410 based on the detection results of the detection actuator 300 and the first substrate detection sensor 310. Furthermore, the control unit 91 calculates, for example, the relative position of the alignment mark of the second substrate W2 relative to the alignment mark of the second reference mask 420 based on the detection results of the detection actuator 300 and the second substrate detection actuator 320. Additionally, the control unit 91 calculates, for example, the relative positional relationship between the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 based on the detection results of the imaging unit 50. Therefore, the control unit 91 can, for example, calculate the relative positional relationship between the alignment marks of the first substrate W1 and the alignment marks of the second substrate W2 based on the detection results of the detection actuator 300, the first substrate detection sensor 310, the second substrate detection actuator 320, and the imaging unit 50.

[0270] Furthermore, for example, calculating the relative positions of the first reference mask 410 and the second reference mask 420, calculating the relative positions of the first substrate holder 10 and the second substrate holder 20, and calculating the relative positions of the first substrate W1 and the second substrate W2 are substantially the same as calculating the relative position of the second reference mask 420 relative to the imaging unit 50.

[0271] The control unit 91 acquires the calculation results of the thickness calculation unit 1912 of the pre-alignment unit PU. Furthermore, the control unit 91 is an example of the "acquisition unit" of the present invention.

[0272] The control unit 91 generates mapping data for the first substrate W1 and the second substrate W2 based on the thicknesses of the first substrate W1 and the second substrate W2 calculated by the pre-alignment unit PU. The mapping data shows the thickness information of the substrate W in each region when the substrate W is divided into multiple regions in a grid shape. In this embodiment, the control unit 91 predicts the thickness of a portion (uncalculated region) of the substrate W based on the thickness calculation results of the substrate W along the circumferential direction and the thickness calculation results of the substrate W along the transport direction A, thereby generating mapping data for the entire region of the substrate W.

[0273] In this embodiment, the control unit 91 controls the lifting actuator 120 to move the first substrate holder 10 relative to the second substrate holder 20 based on the calculation results of the thickness calculation unit 1912, such that the distance between the first substrate W1 and the second substrate W2 is within a predetermined range. Therefore, since the first substrate holder 10 can be moved relative to the second substrate holder 20 based on the thickness of the substrate W measured with high precision, the distance between the first substrate W1 and the second substrate W2 can be easily set within a predetermined range.

[0274] Next, refer to Figure 29 as well as Figure 30 The bonding method of the bonding unit JU in this embodiment is explained. Figure 29 A flowchart illustrating the bonding method of the bonding unit JU. Figure 30 A side view is shown schematically, illustrating the state in which the first substrate W1 and the second substrate W2 are arranged facing each other. Furthermore, for ease of understanding, in... Figure 30 The thickness variation of the substrate W is shown in the extreme values. In this embodiment, the bonding method of the bonding unit JU includes steps S101 to S111.

[0275] like Figure 29 As shown, in step S101, the control unit 91 moves the first substrate W1, delivered from the pre-alignment unit PU to the transport robot TR, into the bonding unit JU. Specifically, the control unit 91 controls the transport robot TR to move the substrate W1 through the opening window 4011c (see reference 1011c). Figure 3The first substrate W1 is moved into the bonding unit JU. At this time, with the surface of the first substrate W1 that is attached to the second substrate W2 (hereinafter sometimes referred to as the bonding surface) facing upwards, the transport robot TR transports the first substrate W1. Next, the transport robot TR delivers the first substrate W1 to the first substrate holder 10. At this time, the transport robot TR can deliver the first substrate W1 directly to the first substrate holder 10, or it can deliver the first substrate W1 to the first substrate holder 10 via other means such as suction clamp pins. Furthermore, the first substrate W1 is held by the first substrate holder 10 with the bonding surface facing upwards.

[0276] Next, in step S102, the control unit 91 moves the second substrate W2, delivered from the pre-alignment unit PU to the transport robot TR, into the bonding unit JU. Specifically, the control unit 91 controls the transport robot TR to move the substrate W2 through the opening window 4011c (see reference). Figure 3 The second substrate W2 is moved into the bonding unit JU. At this time, with the surface of the second substrate W2 that adheres to the first substrate W1 (hereinafter sometimes referred to as the bonding surface) facing upwards, the transport robot TR transports the second substrate W2. Next, the transport robot TR delivers the second substrate W2 to the second substrate holder 20. At this time, the transport robot TR can deliver the second substrate W2 directly to the second substrate holder 20, or it can deliver the second substrate W2 to the second substrate holder 20 via other means such as suction clamp pins. Furthermore, the second substrate W2 is held by the second substrate holder 20 with the bonding surface facing upwards.

[0277] Next, in step S103, the control unit 91 flips the first substrate W1 vertically. Specifically, the control unit 91 controls the first motion actuator 100 to flip the first substrate holder 10 vertically. As a result, the bonding surface of the first substrate W1 faces downward.

[0278] Next, in step S104, the control unit 91 moves the second substrate holder 20 to a reference position. Specifically, the control unit 91 controls the second motion actuator 200 to move the second substrate holder 20 to the reference position. The reference position is, for example, the position of the second substrate holder 20 when the center of the second holding portion 22 of the second substrate holder 20 is directly below the center of the first holding portion 12 of the first substrate holder 10. Furthermore, in this state, the distance between the first substrate W1 and the second substrate W2 is, for example, several millimeters to tens of millimeters or more.

[0279] Next, in step S105, the control unit 91 determines the descent amount of the first substrate W1 based on the mapping data of the first substrate W1 and the mapping data of the second substrate W2. Specifically, the control unit 91 determines the region RW (refer to) where the distance between the first substrate W1 and the second substrate W2 is minimized based on the mapping data of the first substrate W1 and the mapping data of the second substrate W2. Figure 30 ).

[0280] Next, as Figure 30 As shown, the control unit 91 calculates the descent amount of the first substrate W1 and the first substrate holder 10 such that the distance Lmin between the first substrate W1 and the second substrate W2 in region RW is within a specified range. The specified range is, for example, from several μm or more to tens of μm or less.

[0281] Next, in step S106, the control unit 91 lowers the first substrate W1. Specifically, the control unit 91 controls the lifting actuator 120 to lower the first substrate holder 10 only by the amount calculated in step S105. As a result, the distance between the first substrate W1 and the second substrate W2 is within a predetermined range.

[0282] Next, in step S107, the control unit 91 acquires the imaging data. Specifically, the control unit 91 acquires the image data captured by the imaging unit 50. The image data includes information showing the relative positional relationship between the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420.

[0283] Next, in step S108, the control unit 91 detects the relative position between the alignment mark of the first reference mask 410 and the alignment mark of the second reference mask 420 based on the acquired imaging data. Here, since both the imaging unit 50 and the first reference mask 410 are fixed to the first substrate holder 10, the relative positional relationship between the imaging unit 50 and the first reference mask 410 does not change. Therefore, detecting the relative position between the alignment mark of the first reference mask 410 and the alignment mark of the second reference mask 420 is substantially the same as detecting the relative position used to indicate the relative position of the alignment mark of the second reference mask 420 relative to the imaging unit 50. That is, in step S108, the control unit 91 detects the relative position of the alignment mark of the second reference mask 420 relative to the imaging unit 50 based on the acquired imaging data. Then, the control unit 91 calculates the relative position of the second substrate holder 20 relative to the first substrate holder 10 and the relative position of the second substrate W2 relative to the first substrate W1 based on the relative position of the second reference mask 420 relative to the imaging unit 50.

[0284] Next, in step S109, the control unit 91 calculates a correction amount to move the second substrate holder 20 in the horizontal direction so that the central axis of the second substrate W2 is aligned with the central axis of the first substrate W1, based on the relative position of the second substrate W2 relative to the first substrate W1 calculated in step S108.

[0285] Next, in step S110, the control unit 91 aligns the first substrate holder 10 and the second substrate holder 20. Specifically, the control unit 91 drives the second motion actuator 200 based on the correction amount calculated in step S109. As a result, the first substrate holder 10 and the second substrate holder 20 are aligned. As a result, the positional deviation between the first substrate W1 and the second substrate W2 becomes, for example, less than tens of nm.

[0286] Next, in step S111, the control unit 91 attaches the first substrate W1 and the second substrate W2. Specifically, the control unit 91 controls the first motion actuator 100 to move the first substrate holder 10 and the first substrate W1 downward. As a result, the first substrate W1 and the second substrate W2 are attached and thus joined.

[0287] This completes the bonding of the first substrate W1 and the second substrate W2 performed by the bonding unit JU.

[0288] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described above, and can be implemented in various ways without departing from its spirit. Furthermore, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the above embodiments. For example, some constituent elements of all the constituent elements shown in the embodiments may be deleted. Furthermore, constituent elements in different embodiments may be appropriately combined. To facilitate understanding of the present invention, the accompanying drawings show the main constituent elements schematically, and the thickness, length, number, spacing, etc. of the illustrated constituent elements may differ from the actual figures due to the nature of the drawings. In addition, the material, shape, size, etc. of the constituent elements shown in the above embodiments are examples and are not particularly limited; various modifications can be made without substantially departing from the effects of the present invention.

[0289] For example, in the above embodiment, although an example of bonding two substrates W whose thickness has been measured by the pre-alignment unit PU (substrate thickness measuring device) by the bonding unit JU is described, the present invention is not limited thereto. The substrates W whose thickness has been measured by the substrate thickness measuring device may also be used for purposes other than bonding.

[0290] Furthermore, while the above embodiments show an example of arranging the pre-alignment unit PU, the transport unit TU, and the joining unit JU, the present invention is not limited thereto. For example, the pre-alignment unit PU may be arranged adjacent to the joining unit JU, or the pre-alignment unit PU may be arranged away from the joining unit JU. Additionally, the pre-alignment unit PU may be arranged directly above the joining unit JU, for example.

[0291] Furthermore, while the above embodiment illustrates an example of a transport robot TR that transfers the substrate W relative to the pre-alignment unit PU, the present invention is not limited thereto. For example, a central robot CR may also transfer the substrate W relative to the pre-alignment unit PU.

[0292] Furthermore, although the above embodiment shows an example of providing a transport unit TU that houses the transport robot TR between the pre-alignment unit PU and the engagement unit JU, the present invention is not limited thereto. For example, the pre-alignment unit PU and the engagement unit JU may be arranged adjacent to each other, and either the pre-alignment unit PU or the engagement unit JU may have the transport robot TR.

[0293] Furthermore, although the above embodiment shows an example of a detection sensor 1600 having a light emitting head 1610 and a light receiving head 1620, the present invention is not limited thereto. For example, the detection sensor 1600 may also have a CCD imaging sensor or a CMOS imaging sensor. Moreover, the position of the substrate W held by the stage 1100 may also be detected based on the image captured by the CCD imaging sensor or the CMOS imaging sensor.

[0294] Furthermore, while the above embodiment shows an example where the pre-alignment unit PU has a control unit 1910, the present invention is not limited thereto. For example, the control unit 91 of the substrate bonding system 1 may also include the control unit 1910. That is, the control unit 91 may also include, for example, a deviation calculation unit and a thickness calculation unit.

[0295] Furthermore, in the above embodiments, as an example of the operation flow of the pre-alignment unit PU and the transport unit TU, it is shown that after the substrate W is moved into the pre-alignment unit PU ( Figure 12 Step S1) then raise the retainer 1310 ( Figure 12 This is an example of step S2), but the invention is not limited thereto. For example, the substrate W can be moved into the pre-alignment unit PU after the holder 1310 has risen. If configured in this way, the tact time can be shortened.

[0296] Industrial availability This invention is suitable for use in substrate thickness measuring devices, substrate bonding systems, and substrate thickness measuring methods.

[0297] Explanation of reference numerals in the attached figures 1: Substrate bonding system 10: First substrate holder 20: Second substrate holder 91: Control Department (Acquisition Department) 100: First moving actuator (substrate holder actuator) 1010: Align with the housing (shell) 1011c: Open window (window) 1100: Taiwan 1200: Rotary actuator 1300: Deviation correction actuator 1310: Holder 1330: Holder movement actuator 1400: First horizontal translation actuator (horizontal translation actuator) 1500: Second horizontal translation actuator (horizontal translation actuator) 1600: Detection sensor, 1710: First optical head (first distance measuring sensor) 1711: First light-emitting element 1712: First optical receiving element 1720: Second optical head (second distance measuring sensor) 1721: Second light-emitting element 1722: Second optical receiving element 1911: Deviation from the Calculation Department 1912: Thickness Calculation Department 3510: Handling arm, JU: Bonding unit (substrate bonding device) L1710: Optical axis L1720: Optical axis PU: Pre-alignment unit (substrate thickness measuring device) S5: Step (process for detecting the position of the substrate) S6: Step (process for calculating the positional deviation of the substrate) S7 to S11: Steps (processes for correcting the positional deviation of the substrate) S13: Step (process of calculating the thickness of the substrate along the circumference) S19: Step (process for calculating the thickness of the substrate along the transport direction) TR: Transport Robot (Transport Actuator) W: substrate, W1: First substrate W2: Second substrate Wa: upper surface, Wb: Lower surface.

Claims

1. A substrate thickness measuring device, wherein, have: The platform holds the substrate horizontally. A detection sensor detects the position of the substrate held by the stage. The deviation calculation unit calculates the positional deviation of the substrate relative to the stage based on the detection results of the detection sensor. A deviation correction actuator corrects the positional deviation of the substrate relative to the stage. A rotary actuator rotates the stage that holds the substrate in its current state. A first distance measuring sensor is disposed above the substrate held by the stage, and measures the distance up to the upper surface of the substrate. A second distance measuring sensor is disposed below the substrate held by the stage, and measures the distance up to the lower surface of the substrate. The thickness calculation unit calculates the thickness of the substrate based on the measurement results of the first distance measuring sensor and the measurement results of the second distance measuring sensor; The deviation correction actuator moves one of the substrate and the stage in the horizontal direction relative to the other of the substrate and the stage based on the calculation results of the deviation calculation unit, thereby correcting the positional deviation of the substrate relative to the stage. The thickness calculation unit calculates the thickness of the substrate circumferentially during the rotation of the stage, where the rotary actuator rotates the stage to deviate the calibrated position of the substrate. This is based on a measurement result obtained by the first distance measuring sensor measuring the distance up to the upper surface of the substrate and a measurement result obtained by the second distance measuring sensor measuring the distance up to the lower surface of the substrate. During the transport actuator's transport of the substrate with its position deviated from the corrected transport direction relative to the stage direction as a horizontal transport direction, the thickness calculation unit calculates the thickness of the substrate along the transport direction based on the measurement results obtained by the first distance measuring sensor measuring the distance up to the upper surface of the substrate and the measurement results obtained by the second distance measuring sensor measuring the distance up to the lower surface of the substrate.

2. The substrate thickness measuring device according to claim 1, wherein, The transport actuator transports the substrate in the transport direction by measuring the distance along a straight line passing through the center of the substrate using the first distance measuring sensor and the second distance measuring sensor. The thickness calculation unit calculates the thickness of the substrate along the transport direction based on the measurement results obtained by the first distance measuring sensor along a straight line passing through the center of the substrate to the upper surface of the substrate and the measurement results obtained by the second distance measuring sensor along a straight line passing through the center of the substrate to the lower surface of the substrate.

3. The substrate thickness measuring device according to claim 1 or 2, wherein, The deviation correction actuator has: The holder, by moving vertically relative to the stage, transfers the substrate between the holder and the stage. The retainer movement actuator moves the retainer relative to the stage in the vertical direction, and A horizontal movement actuator causes one of the holders and the stage to move horizontally relative to the other of the holders and the stage. The holder movement actuator moves the holder upward relative to the stage, thereby correcting the positional deviation of the substrate relative to the stage by moving the holder upward relative to the stage, while the holder holds the substrate. The horizontal movement actuator moves one of the holder and the stage in the horizontal direction relative to the other of the holder and the stage based on the calculation results of the deviation calculation unit.

4. The substrate thickness measuring apparatus according to any one of claims 1 to 3, wherein, It also has a housing that houses the first distance measuring sensor and the second distance measuring sensor, thereby fixing the first distance measuring sensor and the second distance measuring sensor.

5. The substrate thickness measuring device according to claim 4, wherein, The conveying actuator is disposed outside the housing. The housing has a window through which the transport arm of the transport actuator passes.

6. The substrate thickness measuring apparatus according to any one of claims 1 to 5, wherein, The first distance measuring sensor includes a first optical head, which emits a first emitted light toward the upper surface of the substrate. The second distance measuring sensor includes a second optical head that emits a second emitted light toward the lower surface of the substrate.

7. The substrate thickness measuring device according to claim 6, wherein, The optical axis of the second emitted light from the second optical head is on the same axis as the optical axis of the first emitted light from the first optical head.

8. The substrate thickness measuring apparatus according to claim 6 or 7, wherein, The first optical head has: The first light-emitting element emits the first emitted light, and A first light receiving element receives light reflected from the upper surface of the substrate in the first emitted light emitted from the first light-emitting element. The second optical head has: The second light-emitting element emits the second emitted light, and The second light receiving element receives light reflected from the lower surface of the substrate in the second emitted light emitted from the second light-emitting element.

9. A substrate bonding system, wherein, have: The substrate thickness measuring apparatus according to any one of claims 1 to 8; and A substrate bonding apparatus bonds a first substrate and a second substrate whose thickness has been measured by the substrate thickness measuring device.

10. The substrate bonding system according to claim 9, wherein, The substrate bonding device includes: A first substrate holder holds the first substrate horizontally. The second substrate holder holds the second substrate horizontally. A substrate holder actuator moves one of the first substrate holder and the second substrate holder in a vertical direction relative to the other of the first substrate holder and the second substrate holder. The acquisition unit acquires the calculation results of the thickness calculation unit of the substrate thickness measuring device; Based on the calculation results of the thickness calculation unit, the substrate holder actuator moves one of the first substrate holder and the second substrate holder relative to the other of the first substrate holder and the second substrate holder in such a way that the distance between the first substrate and the second substrate is within a specified range.

11. A method for measuring substrate thickness, wherein, Includes the following processes: Detect the position of the substrate held horizontally by the platform; Based on the detection results obtained from detecting the position of the substrate, the positional deviation of the substrate relative to the stage is calculated; Based on the calculation result obtained by calculating the positional deviation, one of the substrate and the stage is moved in the horizontal direction relative to the other of the substrate and the stage, thereby correcting the positional deviation of the substrate relative to the stage. During the rotation of the stage while maintaining a position offset from the calibrated substrate, the thickness of the substrate is calculated along the circumferential direction based on the measurement results obtained by the first distance measuring sensor measuring the distance up to the upper surface of the substrate and the measurement results obtained by the second distance measuring sensor measuring the distance up to the lower surface of the substrate. as well as During the period when the substrate is transported in a horizontal transport direction relative to the stage with its position deviated from the corrected position, the thickness of the substrate is calculated along the transport direction based on the measurement results obtained by the first distance measuring sensor measuring the distance up to the upper surface of the substrate and the measurement results obtained by the second distance measuring sensor measuring the distance up to the lower surface of the substrate.

Images