Hybrid water cooling equipment

Abstract

The invention relates to the technical field of water cooling equipment, and provides mixed type water cooling equipment which comprises a steam compression refrigeration cycle system which comprises a first evaporator and a second evaporator and further comprises a grinding fluid open type circulation water path system and a spindle water closed type circulation water path system. The open type grinding fluid circulating waterway system is used for open type circulation of grinding fluid and heat exchange with the vapor compression refrigeration circulating system, and comprises a water tank I, a liquid pump I and a water outlet pipe I; and the main shaft water closed type circulating waterway system is used for closed type circulation of main shaft cooling liquid and heat exchange with the steam compression refrigeration circulating system, and the main shaft water closed type circulating waterway system comprises a second water tank, a second liquid pump and a second water outlet pipe. By means of the technical scheme, the technical problem that in the prior art, in the silicon wafer or wafer grinding process, high-precision temperature control is inconvenient to conduct on grinding liquid and main shaft cooling liquid separately is solved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of water cooling equipment technology, and more specifically, to a hybrid water cooling equipment. Background Technology

[0002] In the silicon wafer grinding and polishing process and the subsequent wafer thinning process in wafer processing, silicon wafers or wafers need to be ground to make their thickness meet the requirements of subsequent processing steps. During the process, deionized water is used as the grinding fluid to cool the silicon wafers or wafers during the grinding process. The spindle that drives the grinding machine also needs to be cooled. Because the silicon powder particles generated during the grinding process are small, they are difficult to filter. The liquid after grinding is difficult to process and reuse. The filtration cost is higher than that of using pure water. The grinding fluid needs to be continuously supplied with pure water, which is difficult to recycle. However, the cooling water on the spindle side can be recycled.

[0003] In silicon wafer grinding and polishing processes and subsequent wafer thinning processes, high processing precision is required, with some requirements reaching the μm level. Temperature fluctuations in the grinding slurry and spindle coolant directly affect process stability and processing yield. Current water-cooling equipment generally uses the same system to cool both processes simultaneously, which is not convenient for separately controlling the temperature of the grinding slurry and spindle coolant. Alternatively, two different systems may be required to control the temperature of the grinding slurry and spindle coolant separately, resulting in a large space requirement for the equipment. Summary of the Invention

[0004] To overcome the above-mentioned defects, the present invention provides a hybrid water-cooling device to solve the technical problem in the prior art that it is inconvenient to separately and precisely control the temperature of the polishing fluid and the spindle coolant during the silicon wafer or wafer polishing process.

[0005] According to one aspect, at least one embodiment of the present invention provides a hybrid water-cooling device, including a vapor compression refrigeration cycle system, the vapor compression refrigeration cycle system including an evaporator one and an evaporator two, and further comprising: An open-loop circulation system for grinding slurry, wherein the open-loop circulation system for grinding slurry is used for open circulation and heat exchange with the vapor compression refrigeration cycle system, the open-loop circulation system for grinding slurry includes: Water tank one, the water tank one is connected to a grinding side water inlet, the grinding side water inlet is connected to an external water source, and the grinding side water inlet is equipped with a solenoid valve one; A liquid pump is connected to a water tank and is used to send water from the water tank to the heat exchange tube of the evaporator for heat exchange. Water outlet pipe 1, the heat exchange pipe 1 is connected to a grinding side water outlet for supplying water to the grinding position through the water outlet pipe 1, the water outlet pipe 1 is equipped with a heater 1 and a water temperature probe 1 for monitoring the water temperature of the grinding fluid, the water temperature probe 1 and the heater 1 are electrically connected. A closed-loop spindle water circulation system, wherein the closed-loop spindle water circulation system is used for the closed-loop circulation of spindle coolant and for heat exchange with the vapor compression refrigeration cycle system, the closed-loop spindle water circulation system comprising: Water tank two, which is connected to the grinding side water inlet through a water inlet pipe, the water inlet pipe is equipped with a solenoid valve two, and the water tank two is connected to a spindle side water inlet for receiving spindle return water; Liquid pump two, which is connected to water tank two, is used to send water in water tank two to heat exchange tube two of evaporator two for heat exchange; The second water outlet pipe is connected to a spindle-side water outlet for supplying water to the spindle of the grinding machine. The second water outlet pipe is equipped with a second heater and a second water temperature probe for monitoring the water temperature of the spindle coolant. The second water temperature probe and the first heater are electrically connected.

[0006] To ensure the purity of the grinding fluid, a filter is connected between the water outlet pipe and the grinding side water outlet for filtering the grinding fluid.

[0007] To ensure the purity of the spindle coolant, a filter is connected between the second water outlet pipe and the spindle-side water outlet for filtering the spindle coolant.

[0008] To further reduce impurities in the closed-loop water circulation system of the spindle, a water exchange pipe is also included. The spindle-side outlet is connected to the outlet pipe through the water exchange pipe and is used to deliver spindle coolant into the filter. The water exchange pipe is equipped with a solenoid valve.

[0009] Preferably, the first filter and the second filter have the same structure, and the first filter includes: The main cylinder has a detachable cover on its top, an inlet on the cover, and an outlet on the main cylinder. A filter cartridge is disposed inside the main cylinder, with the inlet located inside the filter cartridge and the outlet located outside the filter cartridge.

[0010] To promptly remove impurities from the filter and reduce impurity residue in the open-loop grinding fluid circulation system and the closed-loop spindle water circulation system, the filter also includes a slag discharge assembly. The bottom of the filter cartridge has a slag discharge port for discharging impurities. The slag discharge assembly is mounted on the main cylinder and is used to discharge impurities blocked by the filter cartridge into the main cylinder. The slag discharge assembly includes: The slag discharge ball is rotatably disposed at the bottom of the main cylinder. A slag storage trough is provided on the slag discharge ball. When the slag storage trough is rotated to the top, it can communicate with the filter cylinder through the slag discharge port. When the slag storage trough is rotated to the bottom, the impurities inside it can be poured out.

[0011] To prevent the liquid level in water tank one from becoming too high, a float valve is installed inside water tank one.

[0012] To prevent the liquid level in the second water tank from becoming too high, the second water tank is equipped with an overflow port.

[0013] To control the opening and closing of liquid pump one and liquid pump two, multiple liquid level switches are installed inside both water tank one and water tank two.

[0014] The beneficial effects of the embodiments of the present invention are as follows: 1. In this invention, the polishing slurry is in an open-loop circulation system. Deionized water enters the grinding side inlet and passes through a solenoid valve and a float valve into the liquid tank. The float valve controls the liquid level to ensure it is at the normal position. The deionized water flows through a liquid pump and enters an evaporator to exchange heat with a vapor compression refrigeration system. It then flows out of the system through a heater. A water temperature probe monitors the temperature of the polishing slurry and controls the heater to fine-tune the temperature of the polishing slurry after heat exchange and cooling. This is used to compensate for minor temperature losses during heat exchange or pipeline transportation, accurately calibrating the polishing slurry temperature to the required process value. This, combined with the refrigeration system, achieves ±0.1℃ temperature control, preventing temperature fluctuations from affecting the processing accuracy of silicon wafers or crystals.

[0015] 2. In the spindle water closed-loop circulation system of this invention, the water tank 2 is initially empty, and the solenoid valve 2 is open. Deionized water enters the interior of the water tank 2 through the grinding side inlet. When the liquid level in the water tank 2 meets the usage requirements, the solenoid valve 2 closes, and the system operates normally. That is, the liquid enters the evaporator 2 through the liquid pump 2 to exchange heat with the vapor compression refrigeration system, and flows out of the system through the heater 2. The temperature of the spindle coolant is monitored by the water temperature probe 2, and the heater 2 is controlled to fine-tune the temperature of the spindle coolant after heat exchange and cooling. This is used to compensate for the slight temperature loss of the spindle coolant during heat exchange or pipeline transportation, and to accurately calibrate the spindle coolant temperature to the process requirement value. Together with the refrigeration system, it achieves ±0.1℃ temperature control, avoiding temperature fluctuations from affecting the processing accuracy of silicon wafers or crystals.

[0016] 3. This invention integrates the pipeline system of the open circulation of grinding fluid (external water source access), the closed circulation water system of the spindle (internal sealed circuit), and the vapor compression refrigeration cycle system into a single equipment chassis, which greatly reduces the footprint compared to the traditional split system.

[0017] 4. The grinding fluid and spindle coolant are filtered by filter one and filter two respectively, and impurities in the deionized water transportation process are blocked inside the filter screen. The impurities stored in the slag storage tank are poured out by the rotation of the slag discharge ball, and the impurities in the water system are discharged in time, reducing the accumulation of scale in the pipes and equipment, ensuring the normal operation of the water system. At the same time, the slag discharge port can be automatically sealed during the rotation of the slag discharge ball to prevent liquid leakage.

[0018] 5. In this invention, by opening the solenoid valve four, water in the spindle water closed-loop circulation system can be sent into the interior of filter two through the water exchange pipe to serve as grinding fluid. At the same time, by opening the solenoid valve two, external water source can be sent into the interior of water tank two through the grinding side inlet, which means replenishing water to the spindle water closed-loop circulation system. This prevents the spindle coolant from being in the sealed pipeline for a long time and causing impurities to accumulate. Impurities are discharged in time, further ensuring the purity of deionized water in the spindle water closed-loop circulation system. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of the present invention and these drawings without any creative effort.

[0020] Figure 1 This is a system diagram according to one embodiment of the present invention; Figure 2 for Figure 1 A first-view structural schematic diagram of the overall embodiment; Figure 3 for Figure 1 A schematic diagram of the overall structure from a second perspective in the embodiment; Figure 4 for Figure 1 The embodiment shows a schematic diagram of the structure of water outlet pipe 1, grinding side water outlet, spindle side water outlet and water replacement pipe; Figure 5 for Figure 1 The embodiment is shown in the structural diagram of the main cylinder, filter cylinder, cylinder cover and slag discharge ball.

[0021] In the diagram: 1. Vapor compression refrigeration cycle system; 2. Evaporator 1; 3. Evaporator 2; 4. Open-loop circulation water system for grinding fluid; 5. Water tank 1; 6. Liquid pump 1; 7. Water outlet pipe 1; 8. Grinding side water inlet; 9. Solenoid valve 1; 10. Grinding side water outlet; 11. Heater 1; 12. Water temperature probe 1; 13. Closed-loop circulation water system for spindle water; 14. Water tank 2; 15. Liquid pump 2; 16. Water outlet pipe 2; 17. Water inlet pipe; 18. Solenoid valve 2; 19. Spindle side water outlet; 20. Spindle side water inlet; 21. Heater 2; 22. Water temperature probe 2; 23. Filter 1; 24. Filter 2; 25. Main cylinder; 26. Filter cartridge; 27. Cylinder cover; 28. Slag discharge ball; 29. ​​Motor; 30. Water exchange pipe; 31. Solenoid valve 4. Detailed Implementation The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it.

[0022] To keep the drawings concise, each drawing only schematically shows the parts relevant to the invention; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0023] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0026] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] like Figures 1 to 5 As shown, this invention illustrates a hybrid water-cooling device according to an embodiment of the present invention, including a vapor compression refrigeration cycle system 1. The vapor compression refrigeration cycle system 1 includes an evaporator 2 and an evaporator 3. The vapor compression refrigeration cycle system 1 includes two systems, which respectively cool the grinding fluid and the spindle coolant. The vapor compression refrigeration cycle system 1 is prior art known to those skilled in the art, and mainly includes a compressor, a condenser, an electronic expansion valve, and an evaporator. The refrigerant enters the compressor in the form of low-pressure vapor, and after compression, it becomes high-pressure vapor. The high-pressure vapor flows into the condenser, releasing heat in the process and condensing into high-pressure liquid. The high-pressure liquid passes through the expansion valve, where the pressure drops sharply, and part of the liquid vaporizes, and the temperature decreases to form a mixture of low-pressure liquid and gas. The low-pressure liquid enters the evaporator, absorbing heat from the surrounding medium, that is, cooling the grinding fluid and the spindle coolant. The low-pressure liquid evaporates into low-pressure vapor, which is then drawn back into the compressor to start a new cycle. It also includes an open-loop water circulation system 4 for the grinding fluid and a closed-loop water circulation system 13 for the spindle.

[0028] like Figures 1 to 3As shown, the open-loop circulation system 4 for grinding slurry is used for open circulation and heat exchange with the vapor compression refrigeration cycle system 1. The open-loop circulation system 4 includes a water tank 5, a pump 6, and an outlet pipe 7. The water tank 5 is connected to a grinding-side inlet 8, which is connected to an external water source. A float valve is installed inside the water tank 5, and a solenoid valve 9 is installed at the grinding-side inlet 8. The pump 6 is connected to the water tank 5 and is used to pump the slurry from the water tank 5. Water is sent to the heat exchange tube of evaporator 2 for heat exchange. The heat exchange tube is connected to a grinding-side outlet 10 via a water outlet pipe 7 for supplying water to the grinding position. The water outlet pipe 7 is equipped with a heater 11 and a water temperature probe 12 for monitoring the water temperature of the grinding fluid. The water temperature probe 12 and the heater 11 are electrically connected. A water tank 5 is used to temporarily store the grinding fluid and is connected to a grinding-side inlet 8 via a pipe. The grinding-side inlet 8 uses an external deionized water source. A solenoid valve 9 is used... To control the supply of external water, the float valve operates based on the Archimedes principle of buoyancy. When the water level in water tank 5 rises, the float rises and pushes the valve to close via a connecting rod, preventing fluid from continuing to flow in. When the water level drops, the float falls, and the connecting rod drives the valve to open, allowing fluid to flow in. This ensures that water tank 5 maintains a suitable amount of deionized water. The liquid pump 6 pumps the grinding fluid in water tank 5 into the evaporator 2 for heat exchange and cooling. The grinding fluid flowing out of the evaporator 2 enters the outlet pipe 7. The water temperature probe 12 monitors the temperature of the grinding fluid in the outlet pipe 7 in real time. The temperature controller or PLC is electrically connected to the heater 11. Based on the deviation between the detected temperature and the set value, the grinding fluid is precisely heated and compensated to correct the slight heat loss during the heat exchange process, achieving precise control of the final outlet water temperature. The temperature-controlled grinding fluid is then transported to the grinding position of the grinding machine through the grinding side outlet 10 for grinding and cooling of silicon wafers or wafers.

[0029] like Figures 1 to 3As shown, the spindle water closed-loop circulation system 13 is used for the closed-loop circulation of spindle coolant and for heat exchange with the vapor compression refrigeration cycle system 1. The spindle water closed-loop circulation system 13 includes a second water tank 14, a second pump 15, and a second outlet pipe 16. The second water tank 14 is connected to the grinding side inlet 8 through the inlet pipe 17. The second water tank 14 has an overflow port. The inlet pipe 17 is equipped with a second solenoid valve 18. The second pump 15 is connected to the second water tank 14 and is used to send the water in the second water tank 14 to the second heat exchange tube of the second evaporator 3 for heat exchange. The second heat exchange tube is connected to the outlet pipe. Water tank 16 is connected to a spindle-side outlet 19 for supplying water to the spindle of the grinding machine. Water tank 14 is connected to a spindle-side inlet 20 for receiving the spindle coolant returned from the spindle. Water outlet 16 is equipped with a heater 21 and a water temperature probe 22 for monitoring the spindle coolant temperature. The water temperature probe 22 is electrically connected to heater 11. To control the opening and closing of pumps 6 and 15, multiple level switches are installed inside both water tanks 5 and 14. During initial operation, water tank 14 is empty. The level is controlled by a level gauge. When the water level in water tank 14 is low, the control solenoid valve 18 opens, allowing water from the grinding side inlet 8 to enter water tank 14 through the solenoid valve. When the level gauge detects that the water level in water tank 14 has reached the set value, meeting the minimum circulating water volume requirement for spindle cooling, the control solenoid valve 18 automatically closes. Afterward, the spindle water-closed circulating water system 13 remains sealed, preventing further external water intake. The spindle coolant is stored inside water tank 14, providing a stable water source for circulation. The spindle coolant in water tank 14 is pumped by pump 15. The coolant is sent to the evaporator 23 for heat exchange and cooling, and then transported to the spindle side outlet 19 through the outlet pipe 26. The spindle coolant in the outlet pipe 26 is monitored in real time by the water temperature probe 22. The temperature is electrically connected to the heater 21 through the temperature controller or PLC. Based on the deviation between the detected temperature and the set value, the spindle coolant is precisely heated and compensated to correct the slight heat loss in the heat exchange process, so as to achieve precise control of the final outlet water temperature. The temperature-controlled spindle coolant is then transported to the spindle through the spindle side outlet 19 for cooling.

[0030] like Figures 1 to 5As shown, to ensure the purity of the grinding slurry, a filter 23 for filtering the grinding slurry is connected between the outlet pipe 7 and the grinding side outlet 10. To ensure the purity of the spindle coolant, a filter 24 for filtering the spindle coolant is connected between the outlet pipe 16 and the spindle side outlet 19. Filters 23 and 24 have the same structure. Filter 23 includes a main cylinder 25 and a filter cartridge 26. A cover 27 is detachably installed on the top of the main cylinder 25, with an inlet on the cover 27. An outlet is installed on the main cylinder 25. The filter cartridge 26 is located inside the main cylinder 25, with the inlet inside and the outlet outside. Water pipe 7 or outlet pipe 16 delivers the cooled grinding fluid or spindle coolant through the inlet into the filter screen. The filter screen traps impurities in the grinding fluid or spindle coolant, trapping them inside. The filtered water passes through the filter screen into the main cylinder 25 and flows through the outlet into the grinding side outlet 10 or the spindle side outlet 19 for grinding and spindle cooling. To promptly remove impurities from the filter and reduce residue in the open-loop grinding fluid system 4 and the closed-loop spindle water system 13, filter 23 also includes a slag discharge assembly. The bottom of the filter cylinder 26 has a slag discharge port for removing impurities. The slag discharge assembly is located on the main cylinder 25 and is used to remove impurities from the filter. Impurities blocked by the filter cartridge 26 are discharged from the main cylinder 25. The slag discharge assembly includes a slag discharge ball 28, which is rotatably mounted at the bottom of the main cylinder 25. A motor 29 is installed on the main cylinder 25, and the slag discharge ball 28 is fixedly connected to the output end of the motor 29. A slag storage tank is provided on the slag discharge ball 28. When the slag storage tank rotates to the top, it can communicate with the filter cartridge 26 through the slag discharge port. When the slag storage tank rotates to the bottom, the impurities inside can be poured out. The slag discharge ball 28 and the slag discharge port are in close contact, and the slag discharge port can be sealed by the slag discharge ball 28. Impurities in the grinding fluid or spindle coolant are retained inside the filter screen and sink and accumulate inside the slag storage tank. The motor 29 is periodically turned on to drive the slag discharge ball 28 to rotate. Rotate the upward-facing slag collection tank to a downward-facing position by 80 degrees, emptying the impurities inside. During this process, a small amount of grinding fluid or spindle coolant will be discharged. A bucket can be placed below the slag discharge ball 28 to collect the wastewater and impurities. Water tank 1 5 is connected to an external water source, so the discharge of a small amount of grinding fluid will not cause any impact. A small amount of spindle coolant in filter 24 will be lost as the slag discharge ball 28 rotates. When the liquid level in water tank 2 14 drops below a certain level, the solenoid valve 2 18 will be opened to allow deionized water to enter the interior of water tank 2 14, replenishing the spindle coolant and ensuring the normal circulation of the spindle coolant in the closed-loop spindle water system 13.

[0031] like Figures 1 to 5As shown, to further reduce impurities in the spindle water closed-loop circulation system 13, a water exchange pipe 30 is also included. The spindle-side outlet 19 is connected to the outlet pipe 7 through the water exchange pipe 30, which is used to deliver spindle coolant to the interior of the filter 23. The water exchange pipe 30 is equipped with a solenoid valve 31. The solenoid valve 31 is opened periodically to deliver the spindle coolant filtered by the filter 24 to the interior of the filter 23. That is, the coolant mixed with grinding fluid is filtered by the filter 23 and delivered to the grinding position for grinding and cooling. When the liquid level in the water tank 14 drops, the solenoid valve 18 is opened to replenish deionized water to the interior of the water tank 14. This prevents the spindle coolant from circulating in the sealed pipe for a long time and accumulating a lot of impurities, thus realizing the periodic replacement of the circulating liquid in the spindle water closed-loop circulation system 13.

[0032] The working principle or usage process of this hybrid water-cooling equipment is as follows: The grinding side water inlet 8 is connected to an external water source. Deionized water enters the grinding side water inlet 8 and passes through the solenoid valve and float valve into the liquid tank. The liquid level is controlled by the float valve to ensure that the liquid level is in the normal position. The deionized water flows through the liquid pump and enters the evaporator to exchange heat with the vapor compression refrigeration system. It flows out of the system through the heater. The temperature of the grinding fluid is monitored by the water temperature probe 12 and the heater 11 is controlled to fine-tune the temperature of the grinding fluid after heat exchange and cooling. This is used to compensate for the small temperature loss of the grinding fluid during heat exchange or pipeline transportation and to accurately calibrate the temperature of the grinding fluid to the required value. The grinding fluid is transported to the grinding position for cooling through the grinding side water outlet 10. Initially, water tank 14 is empty, and solenoid valve 18 is open. Deionized water enters water tank 14 through grinding side inlet 8. When the liquid level in water tank 14 meets the usage requirements, solenoid valve 18 closes, and the system operates normally. The liquid enters evaporator 3 through pump 15 to exchange heat with the vapor compression refrigeration system, and flows out of the system through heater 2. The temperature of the spindle coolant is monitored by water temperature probe 22, and heater 21 is controlled to fine-tune the temperature of the spindle coolant after heat exchange and cooling. This is used to compensate for the slight temperature loss of the spindle coolant during heat exchange or pipeline transportation, and to accurately calibrate the spindle coolant temperature to the process requirement value. The spindle coolant is transported to the spindle through spindle side outlet 19 to cool the spindle. Then, the spindle coolant inside the spindle is transported back to water tank 14 through spindle side inlet 20 to achieve circulation. The grinding fluid or spindle coolant in the water outlet pipe 7 and water outlet pipe 16 enters the interior of the filter screen, blocking impurities in the deionized water transportation process inside the filter screen. By rotating the slag discharge ball, the impurities stored in the slag storage tank are poured out, and the impurities in the water system are discharged in time, reducing the accumulation of scale in the pipes and equipment. At regular intervals, the opening of solenoid valve 31 allows water from the spindle water closed-loop circulation system 13 to be sent through water exchange pipe 30 into the filter 24 to act as grinding fluid. At the same time, the opening of solenoid valve 18 allows external water to be supplied to the water tank 14 through the grinding side inlet 8. This replenishes the spindle water closed-loop circulation system 13, preventing the spindle coolant from accumulating impurities in the sealed pipes for extended periods. The impurities are promptly discharged, further ensuring the purity of the deionized water in the spindle water closed-loop circulation system 13.

[0033] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A hybrid water-cooled device, comprising a vapor compression refrigeration cycle system (1), characterized in that, The vapor compression refrigeration cycle system (1) includes evaporator one (2) and evaporator two (3), and also includes: An open-loop circulation system (4) for grinding fluid is used for open circulation of the grinding fluid and for heat exchange with the vapor compression refrigeration cycle system (1). The open-loop circulation system (4) for grinding fluid includes: Water tank 1 (5), the water tank 1 (5) is connected to a grinding side water inlet (8), the grinding side water inlet (8) is connected to an external water source, and the grinding side water inlet (8) is equipped with a solenoid valve 1 (9). Liquid pump 1 (6) is connected to water tank 1 (5) and is used to send water in water tank 1 (5) to heat exchange tube 1 of evaporator 1 (2) for heat exchange. Water outlet pipe 1 (7), the heat exchange pipe 1 is connected to a grinding side water outlet (10) for supplying water to the grinding position through the water outlet pipe 1 (7), the water outlet pipe 1 (7) is equipped with a heater 1 (11) and a water temperature probe 1 (12) for monitoring the water temperature of the grinding fluid, the water temperature probe 1 (12) and the heater 1 (11) are electrically connected. A closed-loop water circulation system (13) for the spindle coolant to circulate in a closed manner and exchange heat with the vapor compression refrigeration cycle system (1). The closed-loop water circulation system (13) includes: Water tank two (14) is connected to the grinding side water inlet (8) through water inlet pipe (17). The water inlet pipe (17) is equipped with solenoid valve two (18). The water tank two (14) is connected to the spindle side water inlet (20) for receiving spindle return water. Liquid pump two (15) is connected to water tank two (14) and is used to send water in water tank two (14) to heat exchange tube two of evaporator two (3) for heat exchange; The second water outlet pipe (16) is connected to the spindle-side water outlet (19) for supplying water to the spindle of the grinding machine. The second water outlet pipe (16) is equipped with a second heater (21) and a second water temperature probe (22) for monitoring the water temperature of the spindle coolant. The second water temperature probe (22) and the first heater (11) are electrically connected.

2. The hybrid water-cooling device according to claim 1, characterized in that, A filter (23) for filtering the grinding fluid is connected between the water outlet pipe (7) and the grinding side water outlet (10).

3. The hybrid water-cooling device according to claim 2, characterized in that, A filter 2 (24) for filtering the spindle coolant is connected between the water outlet pipe 2 (16) and the spindle side water outlet (19).

4. A hybrid water-cooling device according to claim 3, characterized in that, It also includes a water exchange pipe (30), the spindle-side outlet (19) is connected to the outlet pipe (7) through the water exchange pipe (30) and is used to deliver spindle coolant to the interior of the filter (23). The water exchange pipe (30) is equipped with a solenoid valve (31).

5. A hybrid water-cooling device according to claim 4, characterized in that, The first filter (23) and the second filter (24) have the same structure. The first filter (23) includes: The main cylinder (25) is provided with a detachable cover (27) on its top. The cover (27) is provided with a water inlet, and the main cylinder (25) is provided with a water outlet. The filter cartridge (26) is located inside the main cylinder (25), the water inlet is located inside the filter cartridge (26), and the water outlet is located outside the filter cartridge (26).

6. A hybrid water-cooling device according to claim 5, characterized in that, The filter (23) further includes a slag discharge assembly. The bottom of the filter cylinder (26) is provided with a slag discharge port for discharging impurities. The slag discharge assembly is disposed on the main cylinder (25) and is used to discharge the impurities blocked by the filter cylinder (26) into the main cylinder (25).

7. A hybrid water-cooling device according to claim 6, characterized in that, The slag discharge assembly includes: Slag discharge ball (28), the slag discharge ball (28) is rotatably disposed at the bottom of the main cylinder (25), the slag discharge ball (28) is provided with a slag storage tank, the slag storage tank is connected to the filter cylinder (26) through the slag discharge port when rotated to the top, and the impurities inside the slag storage tank can be poured out when rotated to the bottom.

8. A hybrid water-cooling device according to claim 7, characterized in that, The water tank (5) is equipped with a float valve.

9. A hybrid water-cooling device according to claim 8, characterized in that, The second water tank (14) is equipped with an overflow port.

10. A hybrid water-cooling device according to claim 9, characterized in that, Both the first water tank (5) and the second water tank (14) are equipped with multiple liquid level switches.

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