Single crystal silicon rod slicing device

Abstract

The invention discloses a single crystal silicon rod slicing device, and relates to the technical field of single crystal silicon processing, the single crystal silicon rod slicing device comprises a processing base, a supporting table, a silicon rod placing rack and a linkage cutting assembly, the supporting table is installed on the processing base through a first supporting stand column, and the silicon rod placing rack is arranged on the top of the supporting table through a second supporting stand column; the linkage cutting assembly and the U-shaped support are installed on the table top of the supporting table. The core of the device is that when the linkage cutting assembly drives the single crystal silicon rod to move quantitatively, the diamond cutting line completes slicing synchronously, and the cut silicon wafer falls off through the discharging channel and falls into the discharging water tank after being buffered by the rubber rod on the driving disc. According to the device, cyclic operation is achieved through precise transmission of the bevel gear, the belt pulley, the gear and the rack in cooperation with the elastic reset mechanism, the structure is simplified, the slicing efficiency and continuity are improved, the thickness uniformity and edge integrity of the silicon wafer are guaranteed, the breakage rate is reduced, machining parameters can be adjusted by replacing the corresponding gear, environment friendliness and adaptability are both considered, and practicability is high.

Description

Technical Field

[0001] This invention relates to the field of single-crystal silicon processing technology, specifically to a single-crystal silicon rod slicing device. Background Technology

[0002] Monocrystalline silicon is a core material in semiconductor chips, photovoltaic modules, and other fields, and the precision and efficiency of its slicing process directly affect the performance and production cost of end products. Currently, the mainstream monocrystalline silicon rod slicing technology in the industry is diamond wire cutting, which is widely used due to its advantages such as high cutting efficiency and low kerf loss. However, existing slicing equipment still has many problems that need to be solved.

[0003] In existing diamond wire slicing equipment, most adopt independent feeding and cutting mechanisms, which are coordinated through an electrical control system. However, due to signal delay and differences in mechanical response, the feeding and cutting actions are easily out of sync, resulting in defects such as uneven silicon wafer thickness and edge cracking, which seriously affects product yield.

[0004] Therefore, the present invention provides a single-crystal silicon rod slicing apparatus to solve one or more of the above-mentioned problems. Summary of the Invention

[0005] (a) Technical problems to be solved In view of the shortcomings of the prior art, the present invention provides a single crystal silicon rod slicing device to solve the problems mentioned in the background art.

[0006] (II) Technical Solution To achieve the above objectives, the present invention is implemented through the following technical solution: a single crystal silicon rod slicing device, comprising a processing base, a support platform, a silicon rod placement rack, and a linkage cutting assembly. The support platform is installed on the top of the processing base by several sets of support columns, and the silicon rod placement rack is installed on the top of the support platform by support columns. The linkage cutting assembly and the U-shaped bracket are both installed on the support platform. While the single crystal silicon rod is moved by the linkage cutting assembly, the diamond cutting wire can simultaneously slice the single crystal silicon rod.

[0007] Preferably, a discharge water tank is installed on the processing base, the vertical section of the L-shaped mounting bracket is fixedly connected to the processing base, the horizontal section of the L-shaped mounting bracket is fixedly equipped with a fixed box, the drive plate is rotatably connected to the fixed box, and several sets of rubber rods are fixedly installed on the outer wall of the drive plate, and a torsion spring is installed on the rotating shaft between the drive plate and the fixed box.

[0008] Preferably, the unloading channel is fixedly connected to the front end of the support platform, and the outer wall of the unloading channel is provided with a first clearance groove for the rotation of the rubber rod, and the rear end of the unloading channel is provided with a second clearance groove.

[0009] Preferably, the U-shaped cutting bracket is installed inside the U-shaped bracket, the guide limiting component is fixedly connected to the U-shaped bracket, the vertical section of the U-shaped cutting bracket is slidably connected to the guide limiting component, and a driving rack is fixedly provided at the bottom of the vertical section of the U-shaped cutting bracket. A connecting spring is sleeved on the vertical section of the U-shaped cutting bracket, and one end of the connecting spring is fixedly connected to the guide limiting component, and the other end of the connecting spring is fixedly connected to the horizontal section of the U-shaped cutting bracket.

[0010] Preferably, a mounting plate is fixedly provided on the front side of the vertical section of the U-shaped cutting bracket, and a drive motor is fixedly provided on the front side of the horizontal section of the U-shaped cutting bracket. Drive wheels are installed on both the output shaft of the drive motor and the mounting plate, and the diamond cutting wire is wound around the drive wheel.

[0011] Preferably, the silicon rod placement rack has a silicon rod placement slot, the top plate is slidably connected to the silicon rod placement rack, the guide limiting member two is fixedly connected to the top of the silicon rod placement rack, the drive rack two is slidably connected to the guide limiting member two, and the end of the drive rack two near the top plate is fixedly connected to the top plate.

[0012] Preferably, the linkage cutting assembly includes a second drive motor, which is fixedly mounted on the support platform. A pulley is fixedly sleeved on the output shaft of the second drive motor. Mounting column one and mounting column two are fixedly mounted on the support platform. A third drive link is rotatably connected to mounting column one, and a second drive link is rotatably connected to mounting column two.

[0013] Preferably, a guide limiting component three is fixedly provided on the outer wall of the silicon rod placement rack, and a drive connecting rod one is rotatably connected to the guide limiting component three. A single toothed gear is fixedly provided on the top of the drive connecting rod one, and a bevel gear one is fixedly provided on the bottom of the drive connecting rod one. The single toothed gear meshes with the drive rack two.

[0014] Preferably, bevel gear 2, pulley 3 and pulley 2 are fixedly sleeved on the outer wall of drive linkage 3, bevel gear 2 meshes with bevel gear 1, pulley 3 is connected to pulley 4 through connecting belt 2, and pulley 2 is connected to pulley 1 through connecting belt 1.

[0015] Preferably, the sector gear and the pulley are fixedly sleeved on the outer wall of the drive connecting rod, the sector gear meshes with the drive rack, and the support platform is provided with a clearance hole for moving the drive rack.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention realizes the synchronous and coordinated operation of quantitative feeding of monocrystalline silicon rods and diamond wire cutting slicing through a linkage cutting component. With the help of a layered support structure, elastic buffer reset mechanism and precise transmission design, it simplifies the overall structure of the device, improves the continuity of slicing and processing efficiency, effectively ensures the uniformity of silicon wafer thickness and edge integrity, reduces the silicon wafer breakage rate, and realizes the recycling of cutting wastewater and the orderly collection of silicon wafers. It takes into account processing accuracy, operational stability and environmental protection. Moreover, the slicing thickness and cutting speed can be flexibly adjusted by changing the corresponding gears to adapt to different processing needs, making it highly practical. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 This is a side view of the structure of the present invention; Figure 3 This is a schematic diagram of the cross-sectional structure of the unloading channel of the present invention; Figure 4 This is a top view of the silicon rod placement rack of the present invention; Figure 5 This is a top view of the support platform structure of the present invention; Figure 6 This is a schematic diagram of the linkage cutting component structure of the present invention.

[0018] In the diagram: 1. Processing base; 2. Support platform; 3. Silicon rod placement rack; 4. Support column one; 5. Support column two; 6. Unloading channel; 7. Clearance groove one; 8. U-shaped bracket; 9. U-shaped cutting bracket; 10. L-shaped mounting bracket; 11. Unloading water tank; 12. Linked cutting assembly; 13. Monocrystalline silicon rod; 14. Drive disk; 15. Drive rack one; 16. Guide limit component one; 17. Drive rack two; 18. Guide limit component two; 19. Mounting plate; 20. Drive wheel; 21. Connecting spring; 22. Drive motor one; 23. Diamond cutting. 24. Line; Top plate; 25. Silicon rod placement slot; 26. Fixing box; 27. Rubber rod; 28. Clearance groove two; 29. ​​Drive motor two; 30. Pulley one; 31. Mounting column one; 32. Mounting column two; 33. Single tooth gear; 34. Drive connecting rod one; 35. Guide limiter three; 36. Bevel gear one; 37. Drive connecting rod two; 38. Sector gear; 39. Drive connecting rod three; 40. Bevel gear two; 41. Connecting belt one; 42. Connecting belt two; 43. Pulley two; 44. Pulley three; 45. Pulley four; 46. Clearance hole. Detailed Implementation

[0019] In this invention, the terms "first," "second," etc., are used for descriptive purposes only and do not specifically refer to any order or sequence, nor are they intended to limit the invention. They are merely used to distinguish protective components or operations described using the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0020] Please see Figures 1-6 The present invention provides a technical means including a processing base 1, a support platform 2, a silicon rod placement rack 3, and a linkage cutting assembly 12. The support platform 2 is installed on the top of the processing base 1 by several sets of support columns 4. The silicon rod placement rack 3 is installed on the top of the support platform 2 by support columns 5. The linkage cutting assembly 12 and the U-shaped bracket 8 are both installed on the table surface of the support platform 2. While the single crystal silicon rod 13 is moved by the linkage cutting assembly 12, the diamond cutting wire 23 can simultaneously slice the single crystal silicon rod 13. The monocrystalline silicon rod 13 is placed in the silicon rod placement slot 25 of the silicon rod placement rack 3. The support platform 2 is installed on the top of the processing base 1 by several sets of support columns 1 4, and the silicon rod placement rack 3 is installed on the top of the support platform 2 by support columns 2 5, providing stable support for the entire device. The U-shaped bracket 8 is fixed to the table surface of the support platform 2. After the linkage cutting component 12 is started, it drives the monocrystalline silicon rod 13 to move along the set direction on the one hand, and drives the diamond cutting wire 23 to keep running on the other hand, completing the slicing action synchronously with the movement of the monocrystalline silicon rod 13, realizing the coordinated operation of "feeding-cutting". Through the layered support design of support columns 1 4 and support columns 2 5, the installation stability of the support platform 2 and the silicon rod placement rack 3 is ensured, and vibration during the cutting process is avoided from affecting the slicing accuracy. The linkage cutting component 12 realizes the synchronous movement of the monocrystalline silicon rod 13 and the slicing of the diamond cutting wire 23, without the need for an additional independent feeding drive mechanism, simplifying the overall structure of the device, reducing the process connection time, and improving the continuity and processing efficiency of monocrystalline silicon rod slicing.

[0021] Furthermore, a discharge water tank 11 is installed on the processing base 1, the vertical section of the L-shaped mounting bracket 10 is fixedly connected to the processing base 1, the horizontal section of the L-shaped mounting bracket 10 is fixedly provided with a fixing box 26, the drive plate 14 is rotatably connected to the fixing box 26, and several sets of rubber rods 27 are fixedly provided on the outer wall of the drive plate 14, and a torsion spring is installed on the rotating shaft between the drive plate 14 and the fixing box 26. The unloading water tank 11 is installed on the processing base 1 to receive the cut silicon wafers and collect the cutting wastewater. The vertical section of the L-shaped mounting bracket 10 is fixed to the processing base 1, and the fixed box 26, which is fixed to the horizontal section, provides a rotating mounting base for the drive plate 14. Several sets of rubber rods 27 on the outer wall of the drive plate 14 rotate synchronously with the drive plate 14, and the torsion spring on the rotating shaft between the drive plate 14 and the fixed box 26 can provide reset power after the drive plate 14 rotates. When the silicon wafer falls from the unloading channel 6, it will contact the rubber rods 27 and push the drive plate 14 to rotate. The torsion spring is twisted and accumulates elastic potential energy. The silicon wafer drives the drive plate 14 and the rubber rods 27 to reset through the rear torsion spring. The L-shaped mounting bracket 10's structural design achieves a stable connection between the fixed box 26 and the processing base 1, ensuring the stability of the drive plate 14 during operation. The rubber rod 27 has an elastic buffering effect, which can prevent edge damage caused by impact when the silicon wafer falls, thus improving the silicon wafer yield. The torsion spring's reset function allows the rubber rod 27 to continuously support the subsequently falling silicon wafers, working in conjunction with the unloading water tank 11 to achieve orderly collection of silicon wafers and wastewater recycling, taking into account both environmental protection and operational continuity.

[0022] Furthermore, the unloading channel 6 is fixedly connected to the front end of the support platform 2. The outer wall of the unloading channel 6 is provided with a first clearance groove 7 for the rotation of the rubber rod 27, and the rear end of the unloading channel 6 is provided with a second clearance groove 28. The unloading channel 6 is fixedly connected to the front end of the support platform 2, forming a conveying channel for silicon wafers from the support platform 2 to the unloading water tank 11. The first clearance groove 7 on the outer wall of the unloading channel 6 provides rotation space for the rubber rod 27 on the drive disk 14, avoiding interference between the rubber rod 27 and the outer wall of the unloading channel 6, and ensuring that the rubber rod 27 can properly play its buffering role. The second clearance groove 28 at the rear end of the unloading channel 6 reserves space for the movement and cutting of the monocrystalline silicon rod 13, avoiding collisions between the unloading channel 6 and other moving parts of the device. The setting of the first clearance groove 7 solves the interference problem between the rubber rod 27 and the unloading channel 6, ensuring the normal operation of the buffer mechanism; the second clearance groove 28 provides reasonable space for the moving parts of the device, ensuring that the feeding and cutting process of the single crystal silicon rod 13 is not obstructed; the fixed connection method of the unloading channel 6 ensures the stability of the silicon wafer conveying path, reduces the offset and damage of the silicon wafer during the conveying process, and improves the regularity of silicon wafer collection.

[0023] Furthermore, the U-shaped cutting bracket 9 is installed inside the U-shaped bracket 8, the guide limiting member 16 is fixedly connected to the U-shaped bracket 8, the vertical section of the U-shaped cutting bracket 9 is slidably connected to the guide limiting member 16, and a driving rack 15 is fixedly provided at the bottom of the vertical section of the U-shaped cutting bracket 9. A connecting spring 21 is sleeved on the vertical section of the U-shaped cutting bracket 9, and one end of the connecting spring 21 is fixedly connected to the guide limiting member 16, and the other end of the connecting spring 21 is fixedly connected to the horizontal section of the U-shaped cutting bracket 9. The U-shaped cutting bracket 9 is installed inside the U-shaped bracket 8. The guide limiting component 16 is fixedly connected to the U-shaped bracket 8, which guides and limits the vertical section of the U-shaped cutting bracket 9, so that the U-shaped cutting bracket 9 can only slide up and down in the vertical direction. The drive rack 15 at the bottom of the vertical section of the U-shaped cutting bracket 9 can receive the driving force of the linkage cutting component 12, which drives the U-shaped cutting bracket 9 to move downward. One end of the connecting spring 21 sleeved on the vertical section of the U-shaped cutting bracket 9 is fixed to the guide limiting component 16, and the other end is fixed to the horizontal section of the U-shaped cutting bracket 9. When the U-shaped cutting bracket 9 moves downward, the connecting spring 21 is compressed and accumulates dynamic potential energy. When the driving force disappears, the connecting spring 21 releases the potential energy and drives the U-shaped cutting bracket 9 to return to its original position. The guide limiter 16 ensures the precise movement direction of the U-shaped cutting bracket 9, preventing the diamond cutting line 23 from shifting during the cutting process and causing uneven slice thickness, thus improving the slicing accuracy. The connecting spring 21 enables the automatic reset of the U-shaped cutting bracket 9, eliminating the need for an additional reset drive mechanism, simplifying the device structure and reducing energy consumption. The drive rack 15, in cooperation with the linkage cutting component 12, achieves stable driving of the U-shaped cutting bracket 9, ensuring the reliability and consistency of the cutting action.

[0024] Furthermore, a mounting plate 19 is fixedly installed on the front side of the vertical section of the U-shaped cutting bracket 9, and a drive motor 22 is fixedly installed on the front side of the horizontal section of the U-shaped cutting bracket 9. Drive wheels 20 are installed on both the output shaft of the drive motor 22 and the mounting plate 19, and the diamond cutting wire 23 is wound around the drive wheel 20. The mounting plate 19 on the front side of the vertical section of the U-shaped cutting bracket 9 is used to install the drive wheel 20, and the drive motor 22 on the front side of the horizontal section provides power to the drive wheel 20. The drive wheel 20 on the output shaft of the drive motor 22 rotates under the drive of the motor, and the drive wheel 20 on the mounting plate 19 rotates synchronously with the transmission of the diamond cutting wire 23. The diamond cutting wire 23 is wound around the two sets of drive wheels 20, and under the drive of the drive wheels 20, a high-speed rotating cutting surface is formed to cut the single crystal silicon rod 13. The drive motor 22 provides stable operating power for the diamond cutting wire 23, ensuring the cutting efficiency and cutting capability of the wire; the cooperation of the two sets of drive wheels 20 keeps the tension of the diamond cutting wire 23 stable, preventing the wire from loosening or breaking and extending the service life of the wire; the mounting plate 19 provides a stable mounting base for the driven drive wheel 20, ensuring the coaxiality of the drive wheel 20 during operation, thereby ensuring the cutting accuracy of the diamond cutting wire 23 and improving the uniformity of silicon wafer thickness.

[0025] Furthermore, the silicon rod placement rack 3 has a silicon rod placement groove 25, the top plate 24 is slidably connected to the silicon rod placement rack 3, the second guide limit member 18 is fixedly connected to the top of the silicon rod placement rack 3, the second drive rack 17 is slidably connected to the second guide limit member 18, and the end of the second drive rack 17 near the top plate 24 is fixedly connected to the top plate 24. The silicon rod placement groove 25 on the silicon rod placement rack 3 is used to position and place the monocrystalline silicon rod 13, restricting the lateral displacement of the monocrystalline silicon rod 13; the top plate 24 is slidably connected to the silicon rod placement rack 3 in the horizontal direction, and the guide limiter 18 is fixed to the top of the silicon rod placement rack 3, which guides the drive rack 17, so that the drive rack 17 can only slide in the horizontal direction; the end of the drive rack 17 near the top plate 24 is fixedly connected to the top plate 24. When the drive rack 17 moves forward under the drive of the linkage cutting assembly 12, it drives the top plate 24 to push the monocrystalline silicon rod 13 forward synchronously, realizing the quantitative feeding of the monocrystalline silicon rod 13. The silicon rod placement groove 25 positions the monocrystalline silicon rod 13, preventing it from shifting during the cutting process and ensuring slicing accuracy. The guide limiter 18 ensures the precise movement direction of the drive rack 17, making the pushing force of the top plate 24 on the monocrystalline silicon rod 13 uniform and preventing damage caused by uneven force on the monocrystalline silicon rod 13. The fixed connection between the top plate 24 and the drive rack 17 enables quantitative feeding of the monocrystalline silicon rod 13, providing a structural basis for precise control of the slicing thickness and improving the consistency of product quality.

[0026] Furthermore, the linkage cutting assembly 12 includes a second drive motor 29, which is fixedly mounted on the support platform 2. A first pulley 30 is fixedly sleeved on the output shaft of the second drive motor 29. Mounting columns 31 and 32 are fixedly mounted on the support platform 2. A third drive rod 39 is rotatably connected to the first drive rod 31, and a second drive rod 37 is rotatably connected to the second drive rod 32. The second drive motor 29 of the linkage cutting assembly 12 is fixed to the support platform 2, providing power to the entire linkage mechanism. The first pulley 30 on the output shaft of the second drive motor 29 rotates synchronously with the motor output shaft, transmitting power to the second pulley 43 via a first connecting belt 41. The first and second mounting columns 31 and 32 are fixed to the support platform 2, providing a rotating mounting base for the third drive rod 39 and the second drive rod 37, respectively. The third drive rod 39 rotates under the drive of the second pulley 43, and the second drive rod 37 rotates under the drive of the fourth pulley 45, thereby transmitting power to subsequent transmission components. The second drive motor 29 serves as the core power source, providing synchronous power for the feeding of the monocrystalline silicon rod 13 and the cutting action of the diamond cutting wire 23, ensuring the coordination of the "feeding-cutting" collaborative operation; the first mounting column 31 and the second mounting column 32 provide stable support for the third drive link 39 and the second drive link 37, avoiding unstable power transmission caused by link swaying during transmission; the belt drive has the characteristics of buffering and vibration absorption, which can reduce the impact of vibration during motor operation on transmission accuracy and improve the overall operational stability of the device.

[0027] Furthermore, a guide limiting component 35 is fixedly provided on the outer wall of the silicon rod placement rack 3. The drive connecting rod 34 is rotatably connected to the guide limiting component 35. A single-tooth gear 33 is fixedly provided on the top of the drive connecting rod 34, and a bevel gear 36 is fixedly provided on the bottom of the drive connecting rod 34. The single-tooth gear 33 meshes with the drive rack 17. The guide limiting component 35 on the outer wall of the silicon rod placement rack 3 provides a rotating mounting base for the drive connecting rod 34, ensuring the coaxiality of the drive connecting rod 34 during operation. The single-tooth gear 33 at the top of the drive connecting rod 34 meshes with the drive rack 17, and the bevel gear 36 at the bottom meshes with the bevel gear 40. When the bevel gear 40 rotates under the drive of the drive connecting rod 39, it drives the drive connecting rod 34 to rotate through the bevel gear meshing transmission, thereby driving the single-tooth gear 33 to rotate synchronously. Each rotation of the single-tooth gear 33 pushes the drive rack 17 forward by one unit displacement, realizing the quantitative feeding of the monocrystalline silicon rod 13. The guide limiter 35 ensures the rotational accuracy of the drive linkage 34, avoids misalignment during bevel gear meshing, and ensures the stability of power transmission. The meshing of bevel gear 36 and bevel gear 40 realizes the vertical conversion of power direction, enabling the horizontal output power of drive motor 29 to be converted into the vertical rotational power of drive linkage 34, thus optimizing the spatial layout of the device. The meshing transmission of single-tooth gear 33 and drive rack 17 realizes the quantitative feeding of monocrystalline silicon rod 13. By controlling the number of teeth of single-tooth gear 33, the feeding displacement can be precisely adjusted, thereby controlling the silicon wafer thickness and improving the controllability of the product.

[0028] Furthermore, bevel gear 2 40, pulley 3 44 and pulley 2 43 are fixedly sleeved on the outer wall of drive connecting rod 3 39. Bevel gear 2 40 meshes with bevel gear 1 36. Pulley 3 44 is connected to pulley 45 via connecting belt 2 42. Pulley 2 43 is connected to pulley 1 30 via connecting belt 1 41. The outer wall of the drive link 39 is fixedly sleeved with bevel gear 40, pulley 44, and pulley 43. When the drive link 39 rotates under the drive of pulley 43, it synchronously drives bevel gear 40 and pulley 44 to rotate. Bevel gear 40 meshes with bevel gear 36 and transmits power to drive link 34. Pulley 44 transmits power to pulley 45 through belt 42, thereby driving drive link 37 to rotate. Pulley 43 is connected to pulley 30 through belt 41, receives power from drive motor 29 and transmits it to drive link 39. Multiple transmission components are integrated on the drive linkage 39, realizing the split transmission of power and providing power for the feeding of the single crystal silicon rod 13 and the cutting action of the diamond cutting wire 23, simplifying the complexity of the transmission mechanism. The combination of bevel gear transmission and belt transmission not only realizes the conversion of power direction, but also ensures the smoothness and reliability of power transmission. The cooperation of multiple pulleys and connecting belts allows the transmission ratio to be flexibly adjusted, which is convenient to adjust the feeding speed and cutting speed according to actual processing needs, thus improving the versatility of the device.

[0029] Furthermore, the sector gear 38 and the pulley 45 are fixedly sleeved on the outer wall of the drive linkage 37. The sector gear 38 meshes with the drive rack 15. The support platform 2 has a clearance hole 46 for the movement of the drive rack 15. The sector gear 38 and the pulley 45 are fixedly sleeved on the outer wall of the drive linkage 37. The pulley 45 receives the power transmitted by the pulley 44 and drives the drive linkage 37 to rotate, thereby driving the sector gear 38 to rotate synchronously. The sector gear 38 meshes with the drive rack 15. When the sector gear 38 rotates half a turn, it drives the drive rack 15 to move downward, thereby driving the U-shaped cutting bracket 9 to move downward to achieve the cutting action. When the sector gear 38 rotates more than half a turn, it disengages from the drive rack 15, and the U-shaped cutting bracket 9 returns to its original position under the action of the connecting spring 21. The clearance hole 46 on the support platform 2 provides space for the up and down movement of the drive rack 15, avoiding interference between the drive rack 15 and the support platform 2. The design of the sector gear 38 allows the drive rack 15 to move downwards only within the meshing range of the sector gear 38, enabling intermittent cutting action. This precisely coordinates with the quantitative feeding action of the monocrystalline silicon rod 13, ensuring a cyclical operation of "feeding-cutting-resetting". The clearance hole 46 avoids interference between the drive rack 15 and the support table 2, ensuring smooth cutting action. By replacing the sector gear 38 with different numbers of teeth, the downward movement distance of the drive rack 15 can be adjusted, thereby adjusting the cutting depth of the diamond cutting wire 23, adapting to the cutting requirements of monocrystalline silicon rods 13 with different diameters, and improving the adaptability of the device.

[0030] Preferably, the unloading channel 6 is provided with a protective liner for protecting the edges of the silicon wafers.

[0031] Preferably, a spray pipe for spray cooling is installed on the U-shaped bracket 8, with one end of the spray pipe connected to the cooling water tank and the other end of the spray pipe aligned with the cutting position of the monocrystalline silicon rod 13.

[0032] The working principle and beneficial effects of the above scheme are as follows: In use, the monocrystalline silicon rod 13 is placed in the silicon rod placement slot 25, with one end of the monocrystalline silicon rod 13 abutting against the top plate 24. Then, the drive motor 29 is started to drive the pulley 30 to rotate. The pulley 30 drives the pulley 43 to rotate through the connecting belt 41. The pulley 43 drives the drive linkage 39 to rotate. At the same time, the drive linkage 39 rotates and simultaneously drives the bevel gear 40 and the pulley 44 to rotate. Since the bevel gear 40 meshes with the bevel gear 36, the bevel gear 36 drives the single-tooth gear 33 to rotate synchronously through the drive linkage 34. The single-tooth gear 33 rotates once, which in turn drives the drive rack 17 to move forward by one unit displacement along the guide limit member 18 (one unit displacement refers to the thickness of the slice required for the monocrystalline silicon rod 13). This causes the top plate 24 to push the monocrystalline silicon rod 13 forward by one unit displacement.

[0033] At the same time, pulley three 44 can drive pulley four 45 to rotate through belt two 42. Belt four 45 drives sector gear 38 to rotate through drive linkage two 37. When sector gear 38 rotates half a turn, it can drive drive rack one 15 to move downward, thereby driving U-shaped cutting bracket 9 to move downward along guide limit member one 16. At the same time, the connecting spring 21 compresses and accumulates kinetic energy. During this process, drive motor one 22 starts and drives drive wheel 20 to rotate, thereby enabling diamond cutting wire 23 to rotate around the other drive wheels 20 while cutting the part extending from single crystal silicon rod 13.

[0034] After cutting, the silicon wafer will automatically fall into the unloading channel 6 and move downward until it comes into contact with the rubber rod 27 for cushioning. The weight of the silicon wafer itself will drive the drive disk 14 to rotate, so that the silicon wafer can slowly fall along the unloading channel 6 and fall smoothly into the unloading water tank 11 (the unloading water tank 11 can not only collect wastewater, but the solution accumulated in it can further protect the silicon wafer).

[0035] When the sector gear 38 rotates half a turn and is no longer engaged with the drive rack 15, the connecting spring 21 can drive the U-shaped cutting bracket 9 to reset. During this process, the silicon wafer in the unloading channel 6 falls into the unloading water tank 11. The rubber rod 27 is no longer under pressure, and the torsion spring on the connecting shaft between the drive disc 14 and the fixed box 26 can drive the rubber rod 27 to reset and wait to receive the next silicon wafer.

[0036] The motor 29 is driven in the above manner to enable the single-tooth gear 33 to rotate one revolution and drive the monocrystalline silicon rod 13 to move forward one unit displacement. Then, the U-shaped cutting bracket 9 drives the diamond cutting wire 23 to cut the monocrystalline silicon rod 13 and then resets, waiting for the next cutting action, which greatly increases the cutting efficiency.

[0037] The thickness of the silicon wafer and the cutting speed of the diamond cutting line 23 can both be achieved by replacing the corresponding single-tooth gear 33 and sector gear 38.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A single-crystal silicon rod slicing device, characterized in that, The system includes a processing base (1), a support platform (2), a silicon rod placement rack (3), and a linkage cutting assembly (12). The support platform (2) is installed on the top of the processing base (1) by several sets of support columns (4). The silicon rod placement rack (3) is installed on the top of the support platform (2) by support columns (5). The linkage cutting assembly (12) and the U-shaped bracket (8) are both installed on the table surface of the support platform (2). While the single crystal silicon rod (13) is moved by the linkage cutting assembly (12), the diamond cutting wire (23) can simultaneously slice it.

2. The single-crystal silicon rod slicing device according to claim 1, characterized in that, A discharge water tank (11) is installed on the processing base (1). The vertical section of the L-shaped mounting bracket (10) is fixedly connected to the processing base (1). A fixed box (26) is fixedly installed on the horizontal section of the L-shaped mounting bracket (10). The drive plate (14) is rotatably connected to the fixed box (26). Several sets of rubber rods (27) are fixedly installed on the outer wall of the drive plate (14). A torsion spring is installed on the rotating shaft between the drive plate (14) and the fixed box (26).

3. The single-crystal silicon rod slicing device according to claim 2, characterized in that, The unloading channel (6) is fixedly connected to the front end of the support platform (2). The outer wall of the unloading channel (6) is provided with a relief groove 1 (7) for the rotation of the rubber rod (27). The rear end of the unloading channel (6) is provided with a relief groove 2 (28).

4. The single-crystal silicon rod slicing apparatus according to claim 1, characterized in that, The U-shaped cutting bracket (9) is installed inside the U-shaped bracket (8). The guide limiter (16) is fixedly connected to the U-shaped bracket (8). The vertical section of the U-shaped cutting bracket (9) is slidably connected to the guide limiter (16) and the bottom of the vertical section of the U-shaped cutting bracket (9) is fixedly provided with a drive rack (15). A connecting spring (21) is sleeved on the vertical section of the U-shaped cutting bracket (9). One end of the connecting spring (21) is fixedly connected to the guide limiter (16) and the other end of the connecting spring (21) is fixedly connected to the horizontal section of the U-shaped cutting bracket (9).

5. A single-crystal silicon rod slicing apparatus according to claim 4, characterized in that, A mounting plate (19) is fixedly installed on the front side of the vertical section of the U-shaped cutting bracket (9), and a drive motor (22) is fixedly installed on the front side of the horizontal section of the U-shaped cutting bracket (9). A drive wheel (20) is fixedly installed on the output shaft of the drive motor (22), and another set of drive wheels (20) is rotatably installed on the mounting plate (19). The diamond cutting wire (23) is wound around the drive wheel (20).

6. The single-crystal silicon rod slicing apparatus according to claim 1, characterized in that, The silicon rod placement rack (3) has a silicon rod placement slot (25). The top plate (24) is slidably connected to the silicon rod placement rack (3). The second guide limiter (18) is fixedly connected to the top of the silicon rod placement rack (3). The second drive rack (17) is slidably connected to the second guide limiter (18), and the end of the second drive rack (17) near the top plate (24) is fixedly connected to the top plate (24).

7. A single-crystal silicon rod slicing apparatus according to claim 6, characterized in that, The linkage cutting assembly (12) includes a second drive motor (29), which is fixedly mounted on the support platform (2). A pulley (30) is fixedly sleeved on the output shaft of the second drive motor (29). Mounting column one (31) and mounting column two (32) are fixedly mounted on the support platform (2). A drive linkage three (39) is rotatably mounted on mounting column one (31), and a drive linkage two (37) is rotatably mounted on mounting column two (32).

8. A single-crystal silicon rod slicing apparatus according to claim 7, characterized in that, The outer wall of the silicon rod placement rack (3) is fixed with a guide limiting component three (35). The drive link one (34) is rotatably connected to the guide limiting component three (35). The top of the drive link one (34) is fixed with a single tooth gear (33), and the bottom of the drive link one (34) is fixed with a bevel gear one (36). The single tooth gear (33) meshes with the drive rack two (17).

9. A single-crystal silicon rod slicing apparatus according to claim 8, characterized in that, Bevel gear 2 (40), pulley 3 (44) and pulley 2 (43) are fixedly sleeved on the outer wall of drive link 3 (39). Bevel gear 2 (40) meshes with bevel gear 1 (36). Pulley 3 (44) is connected to pulley 4 (45) via connecting belt 2 (42). Pulley 2 (43) is connected to pulley 1 (30) via connecting belt 1 (41).

10. A single-crystal silicon rod slicing apparatus according to claim 1, characterized in that, The sector gear (38) and the pulley four (45) are fixedly sleeved on the outer wall of the drive connecting rod two (37). The sector gear (38) meshes with the drive rack one (15). The support platform (2) is provided with a clearance hole (46) for the drive rack one (15) to move.

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