Method and system for monitoring temperature field of laser in-situ assisted single point diamond turning region

Abstract

This invention relates to the field of advanced laser manufacturing and optical inspection, specifically to a method and system for monitoring the temperature field of a single-point diamond cutting region using laser in situ assistance. The method includes the following steps: S1, inducing plasma generation in the processing area using a pulsed laser and acquiring a spatiotemporal resolved image of the plasma luminescence region; S2, extracting morphological feature parameters and corresponding spectral intensity data from the spatiotemporal resolved image of the plasma luminescence region in S1; S3, inputting the morphological feature parameters from S2 into a pre-calibrated temperature mapping model to calculate the two-dimensional temperature distribution of the processing area; S4, confirming the location and temperature rise rate of abnormal temperature distribution areas based on the two-dimensional temperature distribution in S3, and generating real-time optimization commands for laser power and scanning path to achieve monitoring of the temperature field in the diamond cutting region.

Description

Technical Field

[0001] This invention relates to the field of advanced laser manufacturing and optical inspection, specifically to a method and system for monitoring the temperature field of a single-point diamond cutting region assisted by laser in situ. Background Technology

[0002] In laser-assisted in-situ single-point diamond cutting, the temperature distribution in the cutting area has a decisive impact on machining quality, tool life, and material removal mechanisms. However, due to the tiny size of the machining area, typically on the micrometer scale, rapid temperature changes on the microsecond to millisecond scale, and complex spatial distribution, traditional contact temperature measurement methods, such as thermocouples, are difficult to achieve real-time and accurate monitoring and suffer from intrusive interference. Non-contact temperature measurement methods, such as infrared thermal imagers, can perform area measurements, but their spatial resolution is limited by the diffraction limit, resulting in insufficient accuracy at the micrometer scale, and they struggle to capture transient temperature changes. Furthermore, the lack of effective temperature field visualization methods severely restricts the optimization of laser processing parameters and the active suppression of thermal damage.

[0003] The spectral and morphological characteristics of laser-induced plasma are strongly correlated with the local temperature of the substrate from which it originates, offering a potential new approach for temperature measurement. However, current research on plasma-based temperature measurement focuses primarily on spectral analysis, lacking in-depth exploration and utilization of the coupling relationship between the spatiotemporal evolution of plasma and the temperature field. Furthermore, the extremely short lifetime of plasma, with its initial expansion phase containing the richest temperature information, places extremely high demands on the temporal resolution of detection equipment. Ordinary CCD or CMOS cameras struggle to achieve effective imaging within such a short timeframe.

[0004] Existing technology discloses a "laser-induced breakdown spectroscopy ICCD time-resolved measurement method and system," the core of which lies in the independently developed ICCD camera system. Precise timing control is achieved through FPGA and ARM processors to observe the spatiotemporal evolution of laser-induced plasma. The system's design aims to solve the problem of domestic ICCD camera production and observe plasma morphology changes, focusing on the size and location of plasma regions rather than the temperature field distribution of the processing area. It lacks in-depth exploration of the correlation between plasma morphology and temperature, and cannot achieve quantitative inversion of the temperature field. Its image processing only uses edge detection algorithms and does not construct a multi-parameter fusion temperature mapping model. Its technical effectiveness is limited to plasma evolution observation and cannot provide thermal management basis for optimizing processing parameters.

[0005] Existing technology discloses a "system and method for synchronizing photoelectric signals with ultrafast lasers and ICCD cameras." This method compensates for the emission time jitter of ultrafast lasers through optical path beam splitting and delay adjustment, ensuring that the ICCD camera can accurately capture the transient process of laser-material interaction. This method focuses on solving the synchronization accuracy problem, lacking in-depth analysis and application of the acquired image content; its technical solution only involves the synchronization triggering stage, without specifying subsequent processing methods for image and spectral data; it does not construct a temperature mapping model or process feedback mechanism; its application value lies in improving synchronization accuracy itself, and it cannot independently achieve temperature monitoring and optimization of the processing process. Summary of the Invention

[0006] This invention addresses the shortcomings of existing technologies by providing a laser-induced plasma-based in-situ assisted single-point diamond cutting region temperature field mapping and monitoring system and method. This system and method utilize a high-temporal-resolution ICCD camera to capture transient images of pulsed laser-induced plasma, and combine this with its spectral information. Through a constructed temperature mapping model, the real-time two-dimensional temperature field of the processing region is retrieved, thereby achieving dynamic monitoring and feedback of processing thermal effects.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a laser in-situ assisted single-point diamond cutting region temperature field monitoring method, comprising the following steps: S1 induces plasma in the cutting area where the diamond tool contacts the workpiece by using a pulsed laser. A delay circuit is used to control the timing matching between the laser pulse and the exposure time of the ICCD camera, and the ICCD camera is synchronously triggered to acquire a spatiotemporal resolution image of the plasma luminescence area within a specific delay time after the laser pulse ends. S2 extracts the morphological feature parameters and corresponding spectral intensity data of the spatiotemporal resolved image of the plasma luminescence region in S1. S3 inputs the morphological feature parameters from S2 into a pre-calibrated temperature mapping model to calculate the two-dimensional temperature distribution of the processing area; Based on the two-dimensional temperature distribution in S3, S4 identifies the location and temperature rise rate of the abnormal temperature distribution area, and generates real-time optimization instructions for laser power and scanning path to achieve monitoring of the temperature field in the diamond cutting area.

[0008] Preferably, step S1 specifically involves heating the sample to a series of known temperature points T using a temperature-controlled heating stage. truth The system uses standard thermocouples to record the actual surface temperature in real time. At each temperature point, a single-pulse laser is emitted, and at a fixed delay time Δt, the spatiotemporal resolution image and emission spectrum of the plasma emission region are simultaneously acquired. Multiple sets of data are repeatedly acquired to eliminate random errors.

[0009] Preferably, the morphological feature parameters in S2 are the axial length L of the plasma plume and the pixel area A, and the spatiotemporal resolution image of the plasma luminescent region in S1 is extracted by an image processing algorithm.

[0010] Preferably, the image processing algorithm in S2 can be implemented using existing technologies such as binarization, edge detection, and morphological analysis. For details, please refer to "Digital Image Processing" (by González).

[0011] Preferably, the spectral intensity data in S2 is acquired by a plasma spectral acquisition module, which includes a tunable grating spectrometer and a high-speed photomultiplier tube array, and the sampling frequency is synchronized with the laser pulse repetition frequency.

[0012] Preferably, the construction of the S3 temperature mapping model includes the following steps: (1) establishing the relationship between plasma expansion velocity and processing area temperature; (2) establishing a linear mapping relationship between plasma characteristic spectral line intensity and substrate temperature for different processing materials (such as metals, semiconductors, ceramics, etc.); (3) extracting plasma plume area and axial expansion length as temperature-sensitive parameters based on the spatiotemporal resolution image of the plasma luminescence region, constructing a neural network model (such as multilayer perceptron, backpropagation network, etc.), and fusing multiple parameters to realize temperature field reconstruction.

[0013] Preferably, during the calibration of the temperature mapping model, the laser parameters are kept consistent with the laser parameters used in the actual processing.

[0014] Preferably, the step of reconstructing the temperature field by fusing multiple parameters using a neural network algorithm specifically includes the following steps: (1) Construct a backpropagation neural network model, such as a 3-layer fully connected network: The input layer of this model is the feature vector X = [L, A, I]. spectral The output layer is the predicted temperature T, where L is the axial length of the plasma plume, A is the pixel area, and I... spectral The relative peak intensity of the characteristic spectral line; (2) Using S1 and S2 to obtain [X, T truth The dataset is used to train the network until the mean squared error converges to a preset range, such as mean squared error <1%; (3) Save the trained model parameters.

[0015] Preferably, the real-time optimization instruction in S4 specifically compares the real-time temperature field distribution with a preset process threshold and dynamically adjusts the laser power, scanning speed, or defocusing amount to suppress thermal damage defects.

[0016] A laser-assisted in-situ single-point diamond cutting area temperature field monitoring system includes a pulsed laser module for generating a pulsed laser beam for processing, inducing plasma generation in the processing area; an ICCD camera imaging module for acquiring spatiotemporally resolved images of the plasma luminescence area; a synchronous trigger control module for precisely controlling the timing matching of the laser pulse and the ICCD camera exposure time through a delay circuit to ensure that the ICCD camera acquires images within a specific delay time after the laser pulse; a plasma spectrum acquisition module equipped with a spectrometer and a photodetector for obtaining the intensity distribution of the plasma emission spectrum; and a temperature field analysis module with a built-in temperature mapping model for retrieving the real-time temperature field distribution of the processing area based on the spatiotemporal evolution characteristics of the plasma morphology and spectral intensity data in the spatiotemporally resolved images of the plasma luminescence area.

[0017] By adopting the above scheme, this invention has the following advantages and beneficial effects: This invention utilizes the extremely short gating capability of an ICCD camera to non-contactly "freeze" and capture the transient spatiotemporal evolution of plasma, combined with its high spatial resolution, to achieve high-precision measurement of the temperature field in the microscale processing area. High precision through multi-information fusion: This invention creatively fuses the morphological characteristics (spatiotemporal information) and spectral characteristics (intensity information) of plasma, constructing a temperature mapping model through machine learning algorithms. Compared with methods relying solely on spectrum or morphology, this significantly improves the accuracy and robustness of temperature inversion. Fast system response: This system enables real-time online monitoring of the temperature field during processing and, based on the monitoring results, forms closed-loop feedback control of process parameters, actively suppressing thermal damage and improving processing quality and consistency. This system and method are not only applicable to laser-assisted single-point diamond processing but can also be extended to other precision laser processing fields sensitive to thermal effects, such as laser welding, laser additive manufacturing, and laser micro / nano processing for process monitoring. Attached Figure Description

[0018] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the specific embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some specific embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram showing the structural composition and signal flow of the system described in an embodiment of the present invention; Figure 2 This is a schematic diagram showing the detailed components of some devices in the system described in the embodiments of the present invention; Figure 3 This is a schematic diagram illustrating the construction and calibration process of the temperature mapping model in an embodiment of the present invention; Figure 4 This is a flowchart illustrating the steps of the laser processing temperature monitoring method according to an embodiment of the present invention.

[0020] In the figure: 1-Laser-induced plasma experimental platform, 101-Z-axis displacement platform, 102-Focusing lens, 103-Frame, 104-Y-axis displacement platform, 105-X-axis displacement platform, 106-Workpiece, 107-Diamond tool, 2-Reflector, 3-Laser beam, 4-Laser, 5-Digital delay generator, 6-Computer, 601-Process parameter optimization module, 602-Synchronous triggering module, 603-Temperature field analysis visualization interface, 7-Processing area, 8-Plasma field of view optical path, 9-Beam splitter, 10-Plasma spectrum acquisition module, 1001-Photodetector, 1002-Spectrometer, 11-ICCD camera, 1101-Narrow band filter, 1102-Microscope objective. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0026] This invention proposes a laser-assisted in-situ method and system for monitoring the temperature field in a single-point diamond cutting region, specifically including the following steps: S1 induces plasma generation in the processing area through a pulsed laser. A delay circuit is used to control the timing matching between the laser pulse and the exposure time of the ICCD camera, and the ICCD camera is synchronously triggered to acquire a spatiotemporal resolution image of the plasma luminescent area within a specific delay time after the laser pulse ends. S2 extracts the morphological feature parameters and corresponding spectral intensity data of the spatiotemporal resolved image of the plasma luminescence region in S1. S3 inputs the morphological feature parameters from S2 into a pre-calibrated temperature mapping model to calculate the two-dimensional temperature distribution of the processing area; Based on the two-dimensional temperature distribution in S3, S4 identifies the location and temperature rise rate of the abnormal temperature distribution area, and generates real-time optimization instructions for laser power and scanning path to achieve monitoring of the temperature field in the diamond cutting area.

[0027] Reference Figure 1-2The system structure diagram shown illustrates the construction of a complete experimental and monitoring platform. The core of this system lies in utilizing pulsed lasers to induce plasma and, through high-precision synchronous trigger control, enabling an ICCD camera to capture transient images of the plasma at specific moments. Specifically, the system comprises: plasma generation in the sample processing area 7 within the laser-induced plasma experimental platform 1, where the workpiece 6 induces plasma. This platform specifically includes an X-axis displacement platform 105, a Y-axis displacement platform 104, a Z-axis displacement platform 101, and a frame 103 controlling the movement of each axial displacement platform (see the attached manual). Figure 2 Each axial displacement platform specifically controls the specific position of the processing area 7. The pulsed laser (laser beam 3) generated by the laser 4 passes through the reflecting mirror 2, the focusing lens 102, and the diamond tool 107 to reach the processing area of ​​the workpiece 6. The laser is connected to a digital delay generator 5, which controls the timing matching of the laser pulse with the exposure time of the ICCD camera 11. A plasma field-of-view optical path 8 and a beam splitter 9 are set at the processing area 7, and the plasma spectrum is acquired by the plasma spectrum acquisition module 10. The plasma spectrum acquisition module 10, the digital delay generator 5, and the ICCD camera 11 are controlled and analyzed by the process parameter optimization module 601, the synchronization trigger module 602, and the temperature field analysis visualization interface 603 of the computer 6. (See attached instruction manual) Figure 2 The plasma spectral acquisition module includes a photodetector 1001 and a spectrometer 1002, and the ICCD camera 11 includes a narrowband filter 1101 and a microscope objective 1102.

[0028] The laser 4 is specifically a pulsed laser module: a nanosecond pulsed fiber laser with a wavelength of 1064 nm and a pulse width of ~100 ns is selected. After passing through a beam expander, collimator, and focusing lens group, the laser beam is focused at a specific incident angle onto the cutting point in front of the tool, with a spot diameter of approximately 50 μm.

[0029] Laser-induced plasma experimental platform 1: A stainless steel workpiece is clamped in the tool holder of the laser-induced plasma experimental platform, and a single-point diamond tool is mounted on the workpiece holder. The pulsed laser passes through the diamond tool and reaches the machining area through a focusing lens, ensuring that the laser focus coincides with the tool tip-workpiece contact point, thus achieving synchronization between the laser and the simulated turning motion.

[0030] ICCD Camera 11: Employs an Andor iStar series ICCD camera equipped with a 5× long-focal-length microscope objective, aligned with the laser's point of action. The gate width is set to 10 ns. The key is to "freeze" the imaging during the rapid expansion phase of the plasma after its generation by fixing the delay time Δt, at which point the plasma's state is most sensitive to the substrate temperature.

[0031] The digital delay generator 5 is the core component for achieving time-resolved measurements. It employs a DG535 digital delay generator, using the laser's Q-Switch synchronization signal as the master clock. The delay generator outputs two signals: one triggers the laser to emit light; the other, after a precisely set delay time Δt, triggers the ICCD camera and spectrometer for data acquisition.

[0032] Plasma spectral acquisition module 10: The spectrometer probe and ICCD share the same optical path, used to acquire characteristic spectral lines of iron atoms (Fe I).

[0033] The temperature field analysis module and process parameter optimization module are implemented by a high-performance computer. The computer has a built-in data acquisition card to receive spatiotemporal resolved images and spectral data of the plasma luminescence region, and runs dedicated analysis software developed based on Python, which is responsible for feature extraction, temperature calculation, and generation of closed-loop control commands.

[0034] Construction and calibration of the temperature mapping model: Before conducting actual cutting monitoring, a mapping model of "plasma characteristics - substrate temperature" needs to be established. This process solves the problem that traditional thermocouples cannot measure temperature during rotating cutting. Refer to the attached instruction manual for the procedure. Figure 3 .

[0035] Step a: Construct a calibration dataset. In a static state, use a temperature-controlled heating stage to heat the sample to a series of known temperature points T. truth For example, temperatures of 200℃, 300℃, ..., 800℃ are recorded in real time using standard thermocouples. At each temperature point, a single-pulse laser is emitted, and spatiotemporally resolved images and emission spectra of the plasma luminescence region are simultaneously acquired at a fixed delay time Δt. Multiple sets of data are repeatedly acquired to eliminate random errors.

[0036] Step b: Feature parameter extraction. The axial length L and pixel area A of the plasma plume are extracted using image processing algorithms. The relative peak intensity I of the 538.3 nm characteristic spectral line of FeI is extracted. spectral The image processing methods here include image preprocessing: denoising, binarization (such as Otsu thresholding); morphological analysis: calculating the area of ​​connected regions (pixel area A), fitting the principal axis direction and calculating the axial length L.

[0037] Step c: Neural network training, constructing a backpropagation neural network model: Input layer: Feature vector X = [L, A, I] spectral Output layer: Predicted temperature T.

[0038] Training: Using the [X, T] obtained from steps a and btruth The dataset is used to train the network until the mean squared error converges to a preset range. The trained model parameters are then saved to the temperature field analysis module.

[0039] The real-time monitoring and feedback control implementation process, after calibration, involves simulating a laser-assisted cutting process. Refer to the attached instruction manual for the process details. Figure 4 .

[0040] S1. Induced Plasma and Synchronous Acquisition: During the cutting process, the laser emits high-frequency pulses to soften the material. The synchronous trigger control module locks each laser pulse, and after a fixed delay Δt after the pulse ends, it triggers the ICCD camera to open its shutter for 10 ns, capturing transient images and simultaneously recording the spectrum.

[0041] S2. Feature Parameter Extraction: Receive raw data and run image algorithms in real time. Calculate the morphological parameters of the plasma in the current frame: axial length L and pixel area A. Calculate the current spectral intensity I. spectral .

[0042] S3. Temperature Field Calculation and Visualization: Real-time features [L, A, I] spectral The system takes a pre-trained neural network model as input and outputs the temperature value T of the current machining point in milliseconds. Combining this with machine tool coordinate information, the system plots a thermal map of the temperature field in the machining area on the software interface.

[0043] S4. Process Feedback and Optimization: The process parameter optimization module has a built-in safe process temperature threshold T. limit For example, to prevent severe graphitization wear of diamond tools, a T value is set. limit = 700℃, if the monitored T>T limit The system immediately generates control commands to reduce the single-pulse energy of the laser through the analog interface, or to reduce heat accumulation by reducing the pulse repetition frequency, until the temperature drops back to a safe range.

[0044] Through the above embodiments, the present invention utilizes the temperature sensitivity of plasma to solve the problems of insufficient spatial resolution of traditional infrared thermal imagers and the inability of thermocouples to measure rotating workpieces, and realizes accurate and dynamic monitoring of the temperature field of the micron-level cutting area.

[0045] The present invention provides the preferred embodiments described above. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A method for monitoring the temperature field of a single-point diamond cutting region using laser in situ assistance, characterized in that, Includes the following steps: S1 induces plasma in the cutting area where the diamond tool contacts the workpiece by using a pulsed laser. A delay circuit is used to control the timing matching between the laser pulse and the exposure time of the ICCD camera, and the ICCD camera is synchronously triggered to acquire a spatiotemporal resolution image of the plasma luminescence area within a specific delay time after the laser pulse ends. S2 extracts the morphological feature parameters and corresponding spectral intensity data of the spatiotemporal resolved image of the plasma luminescence region in S1. S3 inputs the morphological feature parameters from S2 into a pre-calibrated temperature mapping model to calculate the two-dimensional temperature distribution of the processing area; S4 determines the location and temperature rise rate of abnormal temperature distribution areas based on the two-dimensional temperature distribution in S3, and generates real-time optimization instructions for laser power and scanning path to achieve monitoring of the temperature field in the diamond cutting area.

2. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 1, characterized in that, Specifically, S1 involves heating the sample to a series of known temperature points T using a temperature-controlled heating stage. truth The system uses standard thermocouples to record the actual surface temperature in real time. At each temperature point, a single-pulse laser is emitted, and at a fixed delay time Δt, the spatiotemporal resolution image and emission spectrum of the plasma emission region are acquired simultaneously. Multiple sets of data are repeatedly acquired to eliminate random errors.

3. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 2, characterized in that, The morphological parameters in S2 are the axial length L and pixel area A of the plasma plume. The spatiotemporal resolution image of the plasma luminescent region in S1 is extracted by an image processing algorithm.

4. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 3, characterized in that, The spectral intensity data in S2 is acquired by a plasma spectral acquisition module, which includes a tunable grating spectrometer and a high-speed photomultiplier tube array, and the sampling frequency is synchronized with the laser pulse repetition frequency.

5. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 4, characterized in that, The construction of the S3 temperature mapping model includes the following steps: (1) Establishing the relationship between plasma expansion rate and processing area temperature; (2) For different processing materials, calibrating the linear mapping relationship between plasma characteristic spectral intensity and substrate temperature; (3) Extracting plasma plume area and axial expansion length as temperature-sensitive parameters based on the spatiotemporal resolution image of the plasma luminescence region, and reconstructing the temperature field by fusing multiple parameters through a neural network algorithm.

6. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 5, characterized in that, During the calibration of the temperature mapping model, the laser parameters are kept consistent with the laser parameters used in the actual processing.

7. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 6, characterized in that, The method of fusing multiple parameters using a neural network algorithm to reconstruct the temperature field specifically includes the following steps: (1) Construct a neural network model: The input layer of this model is the feature vector X = [L, A, I] spectral The output layer is the predicted temperature T, where L is the axial length of the plasma plume, A is the pixel area, and I... spectral The relative peak intensity of the characteristic spectral line; (2) Using S1 and S2 to obtain [X, T truth The dataset is used to train the network until the loss function converges to a set threshold range; (3) Save the trained model parameters.

8. The laser-assisted in-situ single-point diamond cutting region temperature field monitoring method according to claim 1, characterized in that, The real-time optimization instruction in S4 specifically compares the real-time temperature field distribution with a preset process threshold and dynamically adjusts the laser power, scanning speed, or defocusing amount to suppress thermal damage defects.

9. A laser-assisted in-situ single-point diamond cutting region temperature field monitoring system, characterized in that, It includes a pulsed laser module for generating a pulsed laser beam for processing, which induces plasma generation in the processing area; and an ICCD camera imaging module for acquiring spatiotemporal resolved images of the plasma luminescent area. The synchronous trigger control module precisely controls the timing matching of the laser pulse and the exposure time of the ICCD camera through a delay circuit, ensuring that the ICCD camera acquires images within a specific delay time after the laser pulse is applied. The plasma spectral acquisition module is equipped with a spectrometer and a photodetector to acquire the intensity distribution of plasma emission spectra; the temperature field analysis module has a built-in temperature mapping model to invert the real-time temperature field distribution of the processing area based on the spatiotemporal evolution characteristics of plasma morphology and spectral intensity data in the spatiotemporal resolution image of the plasma luminescence area.

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