Multi-segment diamond saw blade

Abstract

The application discloses a multi-fragment diamond saw blade, which comprises a saw blade base body, a diamond cutting layer with a certain width is arranged radially towards the center at the outer end of the surface of the saw blade base body, and the overlapping part of the saw blade base body and the diamond cutting layer is circumferentially divided into a plurality of single cutting pieces, and a notch is formed between adjacent single cutting pieces. The overlapping part of the saw blade base body and the diamond cutting layer is circumferentially divided into a plurality of single cutting pieces, and a notch is formed between adjacent single cutting pieces, so that heat dissipation is realized during sawing, the influence of the thermal deformation of the saw blade base body caused by the accumulation of high temperature under high-speed rotation sawing is effectively solved, the sawing precision of a workpiece is ensured, and the service life of the diamond saw blade is prolonged. The problems of the thermal deformation of the saw blade base body can be further reduced through the expansion hole and the reinforcing hole.

Description

Technical Field

[0001] This application relates to the field of diamond saw blade technology, and more particularly to a multi-segment diamond saw blade. Background Technology

[0002] Diamond saw blades are high-efficiency machining tools for hard and brittle materials, using diamond particles as the cutting edge and fixed and driven by a metal matrix. Due to their high hardness, high wear resistance, and sharpness, they are widely used in stone, ceramics, concrete, and composite materials industries. The core structure of a diamond saw blade consists of a cutting head (cutting part) and a matrix (supporting part). The cutting head contains diamond particles, fixed by sintering or welding with metal powder (such as cobalt, nickel, etc.), and undertakes the cutting task. The matrix is ​​usually made of steel, providing rigidity and stability to ensure the cutting head maintains accuracy during high-speed rotation. Figure 1 As shown, currently, a diamond cutting layer of a certain width is usually bonded onto a metal substrate, and sawing is achieved by using the diamond cutting layer to contact the workpiece.

[0003] Because of its high hardness, diamond allows for high rotary sawing speeds in sawing operations, enabling rapid sawing and significantly improving work efficiency in continuous sawing. However, high-speed rotation generates even higher temperatures in contact with the workpiece. These temperatures, when transferred to the saw blade substrate, can cause deformation of the saw blade itself, affecting the strength of the diamond saw blade, leading to deformation of the diamond cutting layer, impacting sawing accuracy, and shortening the blade's lifespan. Conversely, reducing the sawing speed prevents the effective utilization of diamond's hardness, thus diminishing its value. Summary of the Invention

[0004] To address the aforementioned problems, this application aims to provide a multi-segment diamond saw blade. Through the grooves formed between the multiple blades, the heat generated during high-speed sawing can be dissipated quickly, thereby solving the problem of heat accumulation and deformation of the saw blade substrate caused by high-temperature sawing under high-rotation sawing, ensuring the sawing accuracy of the workpiece, and extending the service life of the diamond saw blade.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: a multi-segment diamond saw blade, comprising a saw blade substrate, wherein a diamond cutting layer of a certain width is provided radially toward the center at the outer end of the saw blade substrate surface, wherein the overlapping part of the saw blade substrate and the diamond cutting layer is divided into multiple single cutting blades along the circumferential direction, and a groove is formed between adjacent single cutting blades.

[0006] Preferably, an enlarged hole is formed on the saw blade substrate that communicates with each of the slots.

[0007] Preferably, reinforcing holes are also evenly distributed on the saw blade substrate between adjacent enlarged holes.

[0008] Preferably, the thickness of each of the single cutting blades gradually decreases in the opposite direction of the rotation of the saw blade matrix.

[0009] Preferably, the center of the saw blade substrate is provided with a reinforcing substrate higher than the surface of the saw blade substrate in the direction of the reinforcing hole, and the surface of the reinforcing substrate is lower than the surface of the diamond cutting layer.

[0010] The beneficial effects of this application are as follows: This application divides the overlapping portion of the saw blade substrate and the diamond cutting layer into multiple single cutting blades along the circumference. Grooves are formed between adjacent single cutting blades to achieve heat dissipation during sawing, effectively solving the problem of thermal deformation of the saw blade substrate caused by high temperature accumulation under high-rotation sawing, ensuring the sawing accuracy of the workpiece, and extending the service life of the diamond saw blade. Furthermore, the problem of thermal deformation of the saw blade substrate can be further reduced by enlarging and reinforcing the holes. Attached Figure Description

[0011] Figure 1 This is an illustration of a diamond saw blade currently in use.

[0012] Figure 2 This is a diagram of the multi-segment diamond saw blade used in this application.

[0013] Figure 3 For this application Figure 2 Enlarged view of the structure at point B in the middle.

[0014] Figure 4 For this application Figure 2 Sectional view along line A.

[0015] Figure 5 For this application Figure 4 Enlarged view of the structure at point C.

[0016] Figure 6 The diagram shows that the single cutting blade of the planar structure of this application is in contact with the saw cut sidewall of the workpiece.

[0017] Figure 7 This diagram illustrates the contact between the single cutting blade with reduced thickness as described in this application and the saw cut sidewall of the workpiece.

[0018] In the diagram: 3 - workpiece. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions of this application will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] See attached document Figures 2-7The multi-segment diamond saw blade shown includes a saw blade base 1. A diamond cutting layer 2 of a certain width is provided radially toward the center at the outer end of the saw blade base 1. A clamping hole (not shown in the figure) is provided at the center of the saw blade base. After the saw blade is clamped through the clamping hole, the diamond cutting layer 2 contacts the workpiece to realize the sawing operation.

[0021] To address the issue of heat deformation of the saw blade substrate 1 caused by the heat generated during high-speed rotation of diamond saw blades, such as... Figure 2 As shown, this application divides the overlapping portion of the saw blade substrate 1 and the diamond cutting layer 2 into multiple single cutting blades 21 along the circumferential direction. A slot 2a is formed between adjacent single cutting blades 21. That is, during saw blade manufacturing, slots 2a can be preferentially opened on the saw blade substrate 1 to form multiple single-blade structures. Diamond particles are then fixed on each single blade through sintering, ultimately forming multiple single cutting blades 21. During sawing, the multiple single cutting blades 21 sequentially contact the workpiece while rotating. The single cutting blade 21 in direct contact with the workpiece dissipates heat through the slots 2a on both sides after being heated during sawing, preventing heat transfer to adjacent single cutting blades 21. This ensures that the next single cutting blade 21 will not be at a high temperature when it contacts the workpiece for cutting, and that there is no high temperature accumulation after contact. This achieves continuous heating and heat dissipation during cutting, effectively solving the problem of high temperature accumulation causing thermal deformation of the saw blade substrate 1 under high-rotation sawing, ensuring the sawing accuracy of the workpiece, and extending the service life of the diamond saw blade.

[0022] To improve the heat dissipation effect of slot 2a, such as Figure 2-3 As shown, an enlarged hole 1a is provided on the saw blade base 1, which communicates with each of the slots 2a. The outer end of the slot 2a can dissipate the heat of the single cutting blade 21 in the external environment of the saw blade, while the heat dissipated on the inner side enters into the enlarged hole 1a and is dissipated, thus preventing the heat from the inner end of the slot 2a from being transferred to the saw blade base 1 and heated.

[0023] When the saw blade rotates at high speed, the heat it generates is transferred to the rear of the rotating saw blade. Therefore, the heat lost into the enlarged hole 1a is also transferred towards the saw blade base 1 at the rear of the rotating blade. To prevent heat from being transferred back to the saw blade base 1, as follows... Figure 2 As shown, reinforcing holes 1b are also evenly distributed on the saw blade substrate 1 between adjacent enlarged holes 1a. Figure 2 In the direction indicated by the middle arrow a, the heat lost from the inner end of the slot 2a to the enlarged hole 1a is transferred towards the rear of the rotating saw blade when the saw blade rotates. During the transfer process, the heat enters the reinforcing hole 1b for further dissipation, thereby completely and effectively dissipating the heat generated by sawing and further reducing the problem of heat deformation of the saw blade substrate 1.

[0024] like Figure 6 As shown, during the sawing operation on the workpiece, each single cutting blade 21 first contacts the workpiece at one end to achieve sawing and grooving. After the front end grooves the workpiece, the rear part continues to contact the side wall of the saw cut, resulting in continuous accumulation of heat from contact friction. This causes an increase in heat in each single cutting blade 21 even after completing the sawing and grooving. Therefore, to solve this problem, as... Figure 7 As shown, the thickness of each single cutting blade 21 gradually decreases in the opposite direction of the rotation of the saw blade base 1. After the end of the single cutting blade 21 contacts the workpiece to make a groove, its rear side disengages from the inner wall of the saw kerf of the workpiece, thereby solving the problem of heat accumulation caused by friction and further reducing the thermal deformation transferred to the metal base 1.

[0025] During high-speed sawing with a diamond saw blade, although effective heat dissipation can be achieved through the aforementioned multiple heat dissipation structures, a certain amount of heat still exists on the blade itself. Therefore, to avoid heat accumulation during prolonged sawing operations leading to thermal deformation of the saw blade substrate 1, such as... Figure 2 , 4 As shown in Figure 5, the saw blade substrate 1 has a reinforcing substrate 11 above the surface of the saw blade substrate 1, facing the reinforcing hole 1b. This reinforcing substrate 11 increases the substrate thickness in the area not covered by the diamond cutting layer 2 to resist thermal deformation caused by heat accumulation during continuous sawing. The surface of the reinforcing substrate 11 is lower than the surface of the diamond cutting layer 2 to avoid contact obstruction between the reinforcing substrate 11 and the side of the saw kerf as the sawing depth increases. The reinforcing substrate 11, being smaller than the diamond cutting layer 2, can enter the saw kerf, allowing the diamond cutting layer 2 to further increase the cutting depth on the workpiece.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Various changes and modifications may be made to this utility model without departing from its spirit and scope of protection, and all such changes and modifications fall within the scope of protection claimed by this utility model.

Claims

1. A multi-segment diamond saw blade, comprising a saw blade substrate (1), wherein a diamond cutting layer (2) of a certain width is provided radially toward the center at the outer end of the saw blade substrate (1), characterized in that: The overlapping portion of the saw blade substrate (1) and the diamond cutting layer (2) is divided into multiple single cutting blades (21) along the circumferential direction, and a groove (2a) is formed between adjacent single cutting blades (21).

2. The multi-segment diamond saw blade according to claim 1, characterized in that: An enlarged hole (1a) is provided on the saw blade base (1) to communicate with each of the slots (2a).

3. The multi-segment diamond saw blade according to claim 2, characterized in that: Reinforcing holes (1b) are also evenly distributed on the saw blade substrate (1) between adjacent enlarged holes (1a).

4. The multi-segment diamond saw blade according to claim 3, characterized in that: The thickness of each of the single cutting blades (21) gradually decreases in the opposite direction of the rotation of the saw blade base (1).

5. The multi-segment diamond saw blade according to claim 4, characterized in that: The saw blade substrate (1) has a reinforcing substrate (11) at its center facing the reinforcing hole (1b) and is higher than the surface of the saw blade substrate (1), and the surface of the reinforcing substrate (11) is lower than the surface of the diamond cutting layer (2).

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