Packaging adhesive composition, packaging layer and display device

Abstract

The invention discloses a packaging adhesive composition, a packaging layer and a display device, and belongs to the technical field of display. The packaging adhesive composition comprises a resin system and a curing system, wherein the resin system comprises hydroxy acrylic resin, modified epoxy resin and organic silicon resin, and the curing system comprises an aliphatic isocyanate curing agent. Through the synergistic effect of the hydroxy acrylic resin, the modified epoxy resin and the organic silicon resin in the resin system and the reaction of the aliphatic isocyanate curing agent and the hydroxy acrylic resin, a polyurethane network structure is formed, and comprehensive improvement of adhesive force, weather resistance, flexibility and waterproofness is achieved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to an encapsulating adhesive composition, an encapsulation layer, and a display device. Background Technology

[0002] With the rapid development of light-emitting diode (LED) lighting technology, LED lamps are widely used in indoor and outdoor lighting, landscape lighting, and commercial displays due to their advantages such as high efficiency, energy saving, and long lifespan. Common LED light panels can be protected by using masks, potting compounds, and surface coatings to improve their long-term reliability.

[0003] However, the above-mentioned protective methods still have many drawbacks in application, and cannot meet the display and protection requirements such as optical performance, adhesion, weather resistance, flexibility and waterproofness. Summary of the Invention

[0004] This application provides an encapsulating adhesive composition, an encapsulation layer, and a display device that can meet display and protection requirements such as optical performance, adhesion, weather resistance, flexibility, and water resistance.

[0005] On one hand, this application provides an encapsulating adhesive composition comprising a resin system and a curing system; wherein the resin system comprises hydroxyl acrylic resin, modified epoxy resin and silicone resin, and the curing system comprises an aliphatic isocyanate curing agent.

[0006] In some embodiments of this application, the mass ratio of the hydroxyl acrylic resin, the modified epoxy resin, and the silicone resin in the resin system ranges from (45-60):(10-20):(5-15).

[0007] In some embodiments of this application, the resin system further includes at least one of a matting agent, an adhesion promoter, an ultraviolet absorber, a leveling agent, an antifoaming agent, and a first solvent.

[0008] In some embodiments of this application, the matting agent is selected from fumed silica and matting powder; in the encapsulant composition, the resin system comprises the following components in parts by weight: The hydroxyl acrylic resin, 40 to 60 parts; The modified epoxy resin, 10 to 20 parts; The silicone resin, 5 to 15 parts; The fumed silica, 1 to 3 parts; The matting agent, 2 to 5 parts; The adhesion promoter, 0.5 to 2 parts; The ultraviolet absorber, 0.2 parts to 1 part; The leveling agent, 0.1 to 0.5 parts; The defoamer, 0.1 to 0.5 parts; and The first solvent, 15 to 25 parts.

[0009] In some embodiments of this application, the material of the matting powder is selected from at least one of organic waxes and silica.

[0010] In some embodiments of this application, the adhesion promoter is selected from at least one of silane coupling agents, titanate coupling agents, aluminate coupling agents, and phosphate compounds.

[0011] In some embodiments of this application, the ultraviolet absorber is selected from at least one of benzotriazole derivatives, triazine derivatives, and cyanoacrylate derivatives.

[0012] In some embodiments of this application, the leveling agent is selected from at least one of polyether-modified polydimethylsiloxane derivatives and acrylate derivatives.

[0013] In some embodiments of this application, the defoamer is selected from defoaming polymers.

[0014] In some embodiments of this application, the first solvent is selected from at least one of butyl acetate, ethyl acetate, propylene glycol methyl ether acetate, isobutyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and ethylene glycol butyl ether acetate.

[0015] In some embodiments of this application, the curing system further includes a second solvent; In the encapsulating adhesive composition, the curing system comprises the following components in parts by weight: The aliphatic isocyanate curing agent, 10 to 20 parts; and The second solvent, 5 to 10 parts.

[0016] In some embodiments of this application, the aliphatic isocyanate curing agent is selected from at least one of hexamethylene diisocyanate trimer and isophorone diisocyanate trimer; In some embodiments of this application, the second solvent is selected from at least one of butyl acetate, ethyl acetate, propylene glycol methyl ether acetate, isobutyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and ethylene glycol butyl ether acetate.

[0017] In some embodiments of this application, the mass ratio of the curing system to the resin system ranges from 3:20 to 1:4.

[0018] On the other hand, this application also provides an encapsulation layer, which is made using the encapsulating adhesive composition described in any one of the foregoing claims.

[0019] On the other hand, this application also provides a display device, the display device including a lamp panel and an encapsulation layer disposed at least on the surface of the lamp panel, the encapsulation layer including the aforementioned encapsulation layer.

[0020] In the encapsulating adhesive composition, encapsulation layer, and display device provided in this application, during the process of fabricating the encapsulation layer using the encapsulating adhesive composition, the isocyanate groups in the curing agent system undergo an addition reaction with the hydroxyl acrylic resin in the resin system to form a polyurethane cross-linked network as the main structure. This is beneficial for improving the weather resistance, UV resistance, transparency, and initial hardness of the encapsulation layer. The modified epoxy resin is integrated into the polyurethane cross-linked network through physical blending and interpenetration, which is beneficial for improving the adhesion, chemical corrosion resistance, and cross-linking density (i.e., increasing rigidity) of the encapsulation layer. The silicone resin is integrated into the network through physical migration or other means, thereby introducing the flexible and hydrophobic properties of silicone into the encapsulation system, providing excellent flexibility, hydrophobicity, resistance to high and low temperature impacts, and permanent elasticity, which is beneficial for buffering internal stress. Therefore, the three resins in the resin system of this application, through the synergistic effect of physical and chemical methods, ultimately form a unified, complementary interpenetrating network structure, achieving a comprehensive improvement in optical performance, adhesion, weather resistance, flexibility, and water resistance. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of an encapsulation layer provided in an embodiment of this application; Figure 2 This application provides a method for fabricating an encapsulation layer. Figure 3 This is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0023] Figure label: 10. Display device; 100. Encapsulation layer; 200. Lamp board; 210. Circuit board; 220. Lamp bead. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Common LED light boards can be protected by using face shields, potting compounds, and surface coatings to improve their long-term reliability.

[0026] However, the above-mentioned protective methods still have many drawbacks in application. For example, face shields have seams, making it difficult to guarantee waterproof sealing and easily causing glare, affecting visual comfort. To achieve anti-glare effects, the surface of the shield usually needs to be frosted, leading to a loss of light efficiency. Potting compounds are mostly high-gloss products, producing severe glare under direct light, and their high fluidity makes them unsuitable for vertical or ceiling spraying, prone to sagging, and difficult to form a matte coating. Surface coatings are prone to aging, yellowing, and peeling, exhibiting poor durability and cumbersome application.

[0027] Therefore, there is an urgent need for an encapsulation material that can be directly coated onto the surface of LED light panels, simultaneously meeting the performance requirements of ease of application, good optical performance, strong protection, high reliability, and durability. Ease of application refers to applicability to various processes such as spraying and brushing, with no dripping and rapid curing. Good optical performance means forming a permanent matte coating, effectively eliminating glare while maintaining high light transmittance and preventing severe luminous efficacy degradation. Protection refers to excellent waterproof, moisture-proof, and corrosion-resistant properties, protecting LED chips, printed circuit board (PCB) circuitry, and solder joints from environmental corrosion. Reliability refers to strong adhesion to the PCB substrate, epoxy resin encapsulation, and LED chips, and the ability to pass rigorous environmental aging tests (such as double 85 testing, thermal shock, and salt spray testing) to ensure long-term stability. Durability refers to resistance to yellowing and UV aging, maintaining stable performance over the long term.

[0028] This application provides an encapsulating adhesive composition, an encapsulation layer, and a display device. These are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments. Furthermore, in the description of this application, the term "comprising" means "including but not limited to". The terms first, second, third, etc., are used merely as illustrative and do not impose numerical requirements or establish an order. Various embodiments of this application may exist in a range format; it should be understood that the description in a range format is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of this application; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single numerical values ​​within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. Additionally, whenever a numerical range is indicated herein, it means including any referenced number (number or integer) within the indicated range.

[0029] This application provides an encapsulating adhesive composition comprising a resin system and a curing system; wherein the resin system comprises hydroxyl acrylic resin, modified epoxy resin and silicone resin, and the curing system comprises an aliphatic isocyanate curing agent.

[0030] Understandably, during the process of fabricating the encapsulation layer using the encapsulating adhesive composition, the isocyanate groups in the curing agent system undergo an addition reaction with the hydroxyl acrylic resin in the resin system, forming a polyurethane cross-linked network as the main structure. This is beneficial for improving the weather resistance, UV resistance, transparency, and initial hardness of the encapsulation layer. The modified epoxy resin integrates into this polyurethane cross-linked network through physical blending and interpenetration, which is beneficial for improving the adhesion, chemical corrosion resistance, and cross-linking density (i.e., increasing rigidity) of the encapsulation layer. The silicone resin integrates into the network through physical migration or other means, thereby introducing the flexible and hydrophobic properties of silicone into the encapsulation system, providing excellent flexibility, hydrophobicity, resistance to high and low temperature impacts, and permanent elasticity, which is beneficial for buffering internal stress. Therefore, the three resins in the resin system of this application, through the synergistic effect of physical and chemical methods, ultimately form a unified, complementary interpenetrating network structure, achieving a comprehensive improvement in optical performance, adhesion, weather resistance, flexibility, and water resistance.

[0031] In some examples, the hydroxyl acrylic resin may be selected from at least one of the following: Setalux1157XX-51 from Zhanxin Company, DesmophenA 365 from Covestro, or SY-421b from Jiangsu Sanmu and PL-3018 from Shenzhen Jiashengda, but is not limited thereto.

[0032] In some examples, the modified epoxy resin is a liquid bisphenol A type epoxy resin, which may be selected from at least one of Momentive's EPIKOTE 828, Dow Chemical's DER331, or domestically from Yueyang Baling Petrochemical's CYD-128 (E-51), Nanya Epoxy's NPEL-128 and Jiangsu Sanmu's YD-128, but is not limited thereto.

[0033] In some examples, the silicone resin may be selected from at least one of Dow Chemical's DC249, Evonik's TEGO® Resin B1480, or domestic products such as Chenguang Kemei's GSR-301 and Jinan Jiuri's JH-S-801, but is not limited thereto.

[0034] In some embodiments of this application, the mass ratio of hydroxyl acrylic resin, modified epoxy resin and organosilicon resin in the resin system ranges from (45-60):(10-20):(5-15).

[0035] Understandably, the range of mass ratios of hydroxyl acrylic resin, modified epoxy resin, and silicone resin ensures a synergistic effect among the three, guaranteeing both the hardness and adhesion of the encapsulation layer, while also taking into account its flexibility and weather resistance.

[0036] In some embodiments of this application, the resin system further includes at least one of a matting agent, an adhesion promoter, an ultraviolet absorber, a leveling agent, an antifoaming agent, and a first solvent.

[0037] It is understandable that by adding a variety of functional additives, the matte finish, adhesion, aging resistance, smoothness of application, and anti-bubble properties of the encapsulation layer can be further improved.

[0038] In some embodiments, the matting agent is selected from at least one of fumed silica and matting powder.

[0039] In a preferred embodiment, the matting agent is selected from fumed silica and matting powder.

[0040] Understandably, a uniform matte surface can be formed through the dual matting mechanism of fumed silica and matting powder, with a gloss level of less than 10 GU at 60°, effectively resisting glare without affecting light transmittance.

[0041] In some embodiments, the resin system in the encapsulating adhesive composition comprises the following components in parts by weight: Hydroxy acrylic resin, 40 to 60 parts; Modified epoxy resin, 10 to 20 parts; Organosilicon resin, 5 to 15 parts; Fumed silica, 1 to 3 parts; Matte powder, 2 to 5 parts; Adhesion promoter, 0.5 to 2 parts; Ultraviolet absorber, 0.2 to 1 part; Leveling agent, 0.1 to 0.5 parts; Defoamer, 0.1 to 0.5 parts; and First solvent, 15 to 25 parts.

[0042] Understandably, by optimizing the content of each component, balanced performance and good workability are ensured.

[0043] In some embodiments, the matting agent is selected from at least one of organic waxes and silica.

[0044] In some examples, the fumed silica is selected from at least one of Evonik's AEROSIL R 202 and Cabot's CAB-O-SIL TS-720, but is not limited thereto.

[0045] In some examples, organic wax matting agents can be selected from Evonik's OK-607, Clariant's Ceridust8090, or domestic products such as Dongguan Tianfu's TF-1830 and Qingdao Bonnie's GR-280, but are not limited to these.

[0046] In some embodiments, the adhesion promoter is selected from at least one of silane coupling agents, titanate coupling agents, aluminate coupling agents, and phosphate compounds, but is not limited thereto.

[0047] In some examples, the silane coupling agent is selected from at least one of γ-glycidoxypropyltrimethoxysilane (KH-560) or γ-aminopropyltriethoxysilane (KH-550).

[0048] In some embodiments, the ultraviolet absorber is selected from at least one of benzotriazole derivatives, triazine derivatives, and cyanoacrylate derivatives, but is not limited thereto.

[0049] In some examples, the benzotriazole derivative is selected from at least one of BASF Tinuvin® P, BASF Uvinul® 3030, and Beijing Chiguard® 5830, but is not limited thereto.

[0050] It is understandable that the -N=N- and ortho-OH groups in the molecular structure of benzotriazole derivatives can absorb high-energy ultraviolet light (290nm to 400nm) and convert the light energy into harmless heat energy through instantaneous intramolecular hydrogen bond breaking and reconstruction, thereby protecting the polymer resin chain from ultraviolet attack.

[0051] In some examples, the triazine derivative is selected from at least one of BASF Tinuvin® 1577 and Beijing Chiguard 1159, but is not limited thereto.

[0052] Understandably, triazine derivatives contain triazine heterocycles in their molecular structure. Their UV absorption capacity is stronger than that of benzotriazoles, making them particularly suitable for thin encapsulation layers or harsh environments requiring extremely high weather resistance. Similar to benzotriazole derivatives, they can absorb and convert UV light.

[0053] In some examples, the cyanoacrylate derivatives are selected from BASF Uvinul® 3030, but are not limited to this.

[0054] It is understandable that cyanoacrylate derivatives contain -C(CN)=C(C=O)- in their molecular structure. These products are usually light in color, have excellent compatibility, and are not prone to causing the encapsulation layer to yellow. They are very suitable for transparent encapsulation layers with extremely high color requirements.

[0055] In some embodiments, the leveling agent is selected from at least one of polyether-modified polydimethylsiloxane derivatives and acrylate derivatives, but is not limited thereto.

[0056] In some examples, the polyether-modified polydimethylsiloxane derivative is selected from at least one of BYK®-333 and BYK®-306 from BYK Chemicals.

[0057] It is understandable that polyether-modified polydimethylsiloxane derivatives include polydimethylsiloxane segments and polyether segments. The polydimethylsiloxane segments provide extremely low surface tension, enabling them to migrate rapidly to the surface of the encapsulation layer, spread evenly, eliminate pinholes, and avoid uneven surfaces. The polyether segments can act as anchoring groups, exhibiting good compatibility with resin systems (such as hydroxyl acrylic resins), preventing excessive migration that could lead to pinholes or interlayer adhesion problems.

[0058] In some examples, the leveling agent is selected from fluorocarbon modified leveling agents. The fluorocarbon modified leveling agent is selected from at least one of the DuPont Capstone® series and the Daikin Unidyne® series, but is not limited thereto.

[0059] Understandably, the introduction of fluorocarbon chains into the leveling agent gives the encapsulating adhesive composition extremely low surface tension, providing excellent substrate wetting properties, especially for low surface energy plastics, where it exhibits good leveling and anti-sticking effects.

[0060] In some embodiments, the defoamer is selected from at least one of defoaming polymers, silicone defoamers, and mineral oil-based defoamers, but is not limited thereto.

[0061] In some examples, the defoaming polymer is selected from at least one of BYK-055 from BYK Chemicals and TEGOFoamex 810 from Evonik.

[0062] Understandably, defoaming polymers are typically modified polyether siloxane copolymers. Specifically, this refers to defoamers based on modified polyether siloxane copolymers. These defoamers achieve selective incompatibility within the system through a balance of hydrophilic and hydrophobic segments in their molecular structure, thereby efficiently penetrating and destroying the foam film. Their mechanism of action is primarily defoaming rather than foam suppression. Their molecules are designed to exhibit partial compatibility: they can selectively wet and penetrate the foam wall, but their unique molecular structure (such as branching) locally reduces surface elasticity, disrupting the Marangoni effect and causing the foam wall to thin and rupture. Simultaneously, hydrophobic particles (such as fumed silica) can act as defoaming nuclei, puncturing the bubble film.

[0063] In some examples, the silicone defoamer is selected from at least one of BYK-065 from BYK Chemicals and TEGOAirex910 from Evonik, but is not limited thereto.

[0064] Understandably, silicone defoamers are mainly composed of modified polysiloxanes or polydimethylsiloxane derivatives, have a wide range of compatibility, and strong defoaming and foam-suppressing abilities, making them the most efficient and universal type of defoamer.

[0065] In some examples, the mineral oil-based defoamer is selected from Nopco® 8034, but it is not limited to this.

[0066] Understandably, mineral oil-based defoamers use mineral oil as a carrier and are compounded with hydrophobic particles (such as wax and silica). They mainly work by spreading on the foam surface and carrying hydrophobic particles to puncture the bubbles.

[0067] In some embodiments, the first solvent is selected from at least one of ethyl acetate, butyl acetate, ethyl acetate, propylene glycol methyl ether acetate, isobutyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and ethylene glycol butyl ether acetate, but is not limited thereto.

[0068] It is understood that the first solvent can be a mixture of butyl acetate and propylene glycol methyl ether acetate, or a mixture of ethyl acetate and divalent ester (DBE). For example, the first solvent is a mixture of butyl acetate and propylene glycol methyl ether acetate in a mass ratio of 1:(0.5~3), preferably 1:(1~2). This mixing ratio gives the solvent system a balanced volatility gradient, ensuring both excellent solubility for the resin components and good leveling properties of the coating after application, thus avoiding surface defects.

[0069] In a preferred embodiment, the mixing ratio of butyl acetate to propylene glycol methyl ether acetate is selected from any value of 1:1, 1:2, or any range of both.

[0070] Specifically, a mixed solvent of butyl acetate and propylene glycol methyl ether acetate is used as the first solvent. Since both butyl acetate and propylene glycol methyl ether acetate are ester solvents, the ester bonds in their molecules have moderate polarity and good solubility, exhibiting excellent solubility for acrylic resins, epoxy resins, and the like. Furthermore, this solvent has a moderate boiling point, forming a balanced volatility gradient, ensuring good leveling of the encapsulation layer and minimizing defects such as blistering and bubbles.

[0071] Specifically, methyl ethyl ketone and methyl isobutyl ketone are ketone solvents. The carbonyl group in the molecule provides stronger polarity, and their solubility is generally better than that of esters. Cyclohexanone has extremely strong solubility for epoxy resins.

[0072] Specifically, propylene glycol methyl ether acetate and ethylene glycol butyl ether acetate belong to the ether ester solvent class, which combines the flexibility of ether bonds with the strong dissolving power of ester bonds, and are commonly used solvents in high-performance coatings.

[0073] Understandably, the primary purpose of the first solvent is to adjust the viscosity of the resin system. For the spray coating process (the preferred application method), the recommended viscosity range is as follows: At a measurement temperature of 25°C, using a Ford cup (also known as Ford Cup No. 4), the viscosity of the adjusted resin system should be controlled between 20-40 seconds. A more preferred viscosity range is 25-35 seconds (Ford cup, 25°C). This range ensures that the encapsulating adhesive has: good atomization, allowing it to be fully atomized into uniform, fine droplets through the spray gun; excellent leveling properties, enabling it to quickly level and form a uniform film after being applied to the lamp panel surface, avoiding orange peel or brush marks; and effective anti-sagging properties, preventing sagging, dripping, or thick edges on vertical or inclined lamp panel surfaces due to gravity.

[0074] In some embodiments, the curing system further includes a second solvent; in the encapsulating adhesive composition, the curing system comprises the following components in parts by weight: Aliphatic isocyanate curing agent, 10 to 20 parts; and Second solvent, 5 to 10 parts.

[0075] Understandably, the curing agent and solvent are mixed in a reasonable ratio, making it easy to prepare for application. The viscosity is also moderate, making it suitable for processes such as spraying and brushing.

[0076] In some embodiments, the aliphatic isocyanate curing agent is selected from at least one of hexamethylene diisocyanate trimer and isophorone diisocyanate trimer, but is not limited thereto.

[0077] Understandably, aliphatic isocyanates selected from at least one of hexamethylene diisocyanate trimer (HDI trimer) and isophorone diisocyanate trimer (IPDI trimer) have high yellowing resistance and are suitable for high-requirement outdoor scenarios.

[0078] In some embodiments, the second solvent is selected from at least one of butyl acetate, ethyl acetate, propylene glycol methyl ether acetate, isobutyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and ethylene glycol butyl ether acetate, but is not limited thereto.

[0079] Understandably, the second solvent in the curing system can be selected to have good solubility in aliphatic isocyanate curing agents, a moderate evaporation rate, and must not contain active hydrogen that reacts with -NCO groups (such as water, alcohols, primary and secondary amines, etc.).

[0080] Understandably, the second solvent is chosen appropriately, exhibiting good compatibility with the resin system and not affecting the curing reaction. The primary purpose of the second solvent is to adjust the viscosity of the cured system. Specifically for spray coating (the preferred application method), the recommended viscosity range is as follows: At a measurement temperature of 25°C, using a Ford cup (also known as Ford Cup No. 4), the viscosity of the resin system after adjustment should be controlled between 20-40 seconds. A more preferred viscosity range is 25-35 seconds (Ford cup, 25°C). This range ensures that the encapsulating adhesive possesses: good atomization effect, with a sufficiently low viscosity to allow it to be fully atomized into uniform, fine droplets through the spray gun; excellent leveling properties, enabling it to quickly level and form a uniform film layer after landing on the LED light panel surface, avoiding orange peel or brush marks; and effective anti-sagging properties, with a sufficiently high viscosity to prevent sagging, dripping, or thick edges on vertical or inclined light panel surfaces due to gravity.

[0081] In some embodiments, the mass ratio of the curing system to the resin system ranges from 3:20 to 1:4.

[0082] It is understood that the mass ratio of the curing system to the resin system within the scope of this application ensures a reasonable NCO:OH stoichiometric ratio (approximately (1.05-1.1):1), resulting in sufficient cross-linking and advantages such as a dense encapsulation layer, high strength, and good durability. The mass ratio of the curing system to the resin system includes any value or a range of any two values ​​from 3:20, 17:100, 9:50, 11:50, and 1:4.

[0083] like Figure 1 As shown, this application embodiment also provides an encapsulation layer 100, which is made using the encapsulation adhesive composition described in the foregoing embodiments.

[0084] It should be noted that the NCO:OH stoichiometric ratio in the encapsulating adhesive composition used to make the encapsulation layer is reasonable, approximately (1.05-1.1):1, which allows for sufficient cross-linking during the curing process, resulting in a dense, high-strength, and durable encapsulation layer.

[0085] Understandably, this encapsulation layer combines waterproof, anti-glare, matte finish, high adhesion, and aging resistance, making it suitable for demanding applications such as LED light panels.

[0086] like Figure 2 As shown in the figure, this application embodiment also provides a method for manufacturing an encapsulation layer, including the following steps: S100: A resin system containing hydroxyl acrylic resin, modified epoxy resin and organosilicon resin; S200: A curing system containing an aliphatic isocyanate curing agent; S300: Mix the resin system and the curing system evenly according to the preset ratio to obtain the encapsulating coating. S400: The encapsulating coating is formed into an encapsulation layer through a coating and curing process.

[0087] In some examples, step S100 includes: S110: In a light-proof and dry reaction vessel, add the specified amounts of hydroxyl acrylic resin, modified epoxy resin and organosilicon resin, and stir at a speed of 300 rpm to 500 rpm for 10 min to 30 min to mix them evenly to obtain the first mixture. S120: While stirring, slowly add fumed silica, matting agent, and UV absorber sequentially to the first mixture. After addition, increase the rotation speed to 800 rpm to 1000 rpm and disperse for 30 min to 60 min until the system is uniform and free of particles to obtain the second mixture; S130: Reduce the rotation speed of the second mixture to 300 rpm to 400 rpm, add the adhesion promoter, leveling agent, defoamer and solvent, and continue stirring for 20 min to 40 min until completely homogeneous to obtain the third mixture; S140: Filter the third mixture through a 60-120 mesh filter bag to obtain a resin system.

[0088] In some examples, in step S200, the stirring conditions include: a stirring speed ranging from 300 rpm to 400 rpm and a stirring time ranging from 10 minutes to 30 minutes.

[0089] In step S200, the cured system is obtained by filtering through a 60-mesh to 120-mesh filter bag.

[0090] In step S300, the resin system and the curing system are mixed to obtain the encapsulating coating. The mixing conditions include a rotation speed of 300 rpm to 500 rpm and a stirring time of 10 min to 15 min.

[0091] In step S400, after allowing the encapsulating adhesive coating to stand for 5 to 10 minutes, it can be applied by spraying or brushing. The corresponding surface drying time is approximately 15 to 30 minutes, the actual drying time at 25°C is approximately 4 to 8 hours, and complete curing requires 2 days; alternatively, it can be accelerated by baking at 80°C for 1 to 2 hours.

[0092] like Figure 3 As shown, this application embodiment also provides a display device 10, which includes a lamp panel 200 and an encapsulation layer 100 disposed on at least the surface of the lamp panel, the encapsulation layer including the aforementioned encapsulation layer.

[0093] In some embodiments, the lamp board 200 includes a circuit board 210 and lamp beads 220 disposed on the circuit board. The lamp beads 220 are electrically connected to the circuit board 210.

[0094] In some embodiments, the circuit board is selected from PCB, but is not limited thereto.

[0095] In some embodiments, the encapsulation layer is further disposed on the underfill of the LED board. Underfill here refers to the process or state in which the encapsulating adhesive composition is applied to the surface of the LED board, not only covering the top of the LED chips and circuit board, but also further filling the sides of the LED chips, around the solder joints, and in the small depressions or gaps on the surface of the LED board.

[0096] Understandably, the display device has excellent waterproof and anti-glare performance, making it suitable for harsh environments such as vehicle displays and outdoor advertising screens, thus improving product reliability and visual comfort.

[0097] In some embodiments, the thickness of the encapsulation layer ranges from 90 μm to 110 μm.

[0098] Understandably, this thickness range matches the curing shrinkage rate and coefficient of thermal expansion of the resin system, which can buffer internal stress and prevent the encapsulation layer from cracking or peeling off from the substrate due to thermal expansion and contraction.

[0099] In some examples, the display device may be a lighting device, a direct display device, or a liquid crystal display device, and the lamp panel may be the backlight source in the backlight module of the liquid crystal display device.

[0100] Understandably, when the display device is a direct display device, different LEDs can emit different colors of light (e.g., RGB) to achieve full-color display.

[0101] Example 1 The resin system and curing agent system, as well as the encapsulation layer, are prepared according to the following steps: Step 1: In a light-proof and dry reaction vessel, add the specified amounts of hydroxyl acrylic resin (Zhanxin Setalux 1157 XX-51), modified epoxy resin (Momentive EPIKOTE 828), and silicone resin (Dow DC 249), and stir at 400 rpm for 15 minutes to mix them evenly to obtain the first mixture. Step 2: While stirring, slowly add fumed silica (Evonik AEROSILR 202), matting agent (Evonik OK-607), and UV absorber (BASF Tinuvin 1130) sequentially to the first mixture. After addition, increase the rotation speed to 1000 rpm and disperse for 30 minutes until the system is homogeneous and free of particles, thus obtaining the second mixture. Step 3: Reduce the rotation speed of the second mixture to 350 rpm, add the adhesion promoter silane coupling agent (Hubei Xinlantian KH-560), leveling agent (BYK-333), defoamer (BYK-055), and first solvent (a mixed solvent of propylene glycol methyl ether acetate / butyl acetate in a mass ratio of 1:1), and continue stirring for 20 minutes until completely homogeneous to obtain the third mixture.

[0102] Step 4: Filter the third mixture through an 80-mesh filter bag to obtain the resin system; Step 5: In a dry container, add the aliphatic isocyanate curing agent (Covestro Desmodur N 75) and the second solvent butyl acetate, and stir at 350 rpm for 15 minutes until well mixed to obtain the fourth mixture; Step 6: Filter the fourth mixture through an 80-mesh filter bag to obtain the solidified system; Step 7: Mix the curing system and the resin system at a mass ratio of 1:4 to obtain the encapsulating coating. The mixing conditions include: a rotation speed of 300 rpm and a stirring time of 15 minutes.

[0103] Step 8: After allowing the encapsulating adhesive coating to stand for 5 minutes to defoam, spray it to obtain the encapsulation layer. The dry film thickness of the encapsulation layer is 100μm. Application viscosity: 32 seconds (Ford cup 4, 25°C); Curing conditions: surface dry in 20 minutes, hard dry in 6 hours (25°C); or bake at 80°C for 1.5 hours.

[0104] Example 2 The resin system and curing agent system, as well as the encapsulation layer, are prepared according to the following steps: Step 1: In a light-proof and dry reaction vessel, add the specified amounts of hydroxyl acrylic resin (Sanmu Group) SY-421b), modified epoxy resin (Yueyang Baling Petrochemical CYD-128), and organosilicon resin (Jinan Jiuri JH-S-801), and stir at 300 rpm for 15 minutes to mix them evenly to obtain the first mixture. Step 2: While stirring, slowly add fumed silica (Evonik AEROSILR 202), matting agent (Grace SY-7000), and UV absorber (Beijing Chiguard 5830) sequentially to the first mixture. After addition, increase the rotation speed to 800 rpm and disperse for 40 minutes until the system is uniform and free of particles, thus obtaining the second mixture. Step 3: Reduce the rotation speed of the second mixture to 400 rpm, add the adhesion promoter silane coupling agent (Hubei Xinlantian KH-550), leveling agent (Evonik TEGO Glide 410), defoamer (Evonik TEGO Airex 902W) and the first solvent butyl acetate, and continue stirring for 30 minutes until completely homogeneous to obtain the third mixture.

[0105] Step 4: Filter the third mixture through an 80-mesh filter bag to obtain the resin system; Step 5: In a dry container, add the aliphatic isocyanate curing agent (Covestro Desmodur N 75) and the second solvent butyl acetate, and stir at 400 rpm for 20 minutes until well mixed to obtain the fourth mixture; Step 6: Filter the fourth mixture through an 80-mesh filter bag to obtain the solidified system; Step 7: Mix the curing system and the resin system at a mass ratio of 11:50 to obtain the encapsulating coating. The mixing conditions include: a rotation speed of 500 rpm and a stirring time of 15 minutes.

[0106] Step 8: After allowing the encapsulating adhesive coating to stand for 5 minutes to defoam, spray it to obtain the encapsulation layer. The dry film thickness of the encapsulation layer is 100μm. Application viscosity: 33 seconds (Ford cup 4, 25°C); Curing conditions: surface dry in 25 minutes, hard dry in 6 hours (25°C); or bake at 80°C for 1.2 hours.

[0107] Example 3 The resin system and curing agent system, as well as the encapsulation layer, are prepared according to the following steps: Step 1: In a light-proof and dry reaction vessel, add the specified amounts of hydroxyl acrylic resin (Covestro Desmophen A 365), modified epoxy resin (Momentive EPIKOTE 828), and silicone resin (Evonik TEGO Resin B1480), and stir at 380 rpm for 18 minutes to mix them evenly to obtain the first mixture. Step 2: While stirring, slowly add fumed silica (Cabot CAB-O-SIL TS-720), matting agent (Evonik OK-607), and UV absorber (BASF Tinuvin 1130) sequentially to the first mixture. After addition, increase the rotation speed to 900 rpm and disperse for 35 minutes until the system is homogeneous and free of particles, thus obtaining the second mixture. Step 3: Reduce the rotation speed of the second mixture to 320 rpm, add the adhesion promoter silane coupling agent (Hubei Xinlantian KH-560), leveling agent (BYK-333), defoamer (BYK-055), and the first solvent propylene glycol methyl ether acetate, and continue stirring for 18 minutes until completely homogeneous to obtain the third mixture.

[0108] Step 4: Filter the third mixture through a 100-mesh filter bag to obtain the resin system; Step 5: In a dry container, add the aliphatic isocyanate curing agent (Evonik, IPDI trimer Vestanet T1890 / 100), stir at 400 rpm for 20 minutes until well mixed, and obtain the fourth mixture; Step 6: Filter the fourth mixture through a 100-mesh filter bag to obtain the solidified system; Step 7: Mix the curing system and the resin system at a mass ratio of 9:50 to obtain the encapsulating coating. The mixing conditions include: a rotation speed of 500 rpm and a stirring time of 15 minutes.

[0109] Step 8: After allowing the encapsulating adhesive coating to stand for 5 minutes to defoam, spray it to obtain the encapsulation layer. The dry film thickness of the encapsulation layer is 100μm. Application viscosity: 35 seconds (Ford cup 4, 25°C); Curing conditions: surface dry in 25 minutes, hard dry in 7 hours (25°C); or bake at 80°C for 1.8 hours.

[0110] Example 4 The resin system and curing agent system, as well as the encapsulation layer, are prepared according to the following steps: Step 1: In a light-proof and dry reaction vessel, add the specified amounts of hydroxyl acrylic resin (Shenzhen Jiashengda PL-3018), modified epoxy resin (Nanya Epoxy NPEL-128), and silicone resin (Chenguang Kemei GSR-301), and stir at 500 rpm for 10 minutes to mix them evenly to obtain the first mixture. Step 2: While stirring, slowly add fumed silica (Evonik AEROSILR 202), matting agent (Dongguan Tianfu TF-1830), and UV absorber (BASF Tinuvin 1130) sequentially to the first mixture. After addition, increase the rotation speed to 850 rpm and disperse for 20 minutes until the system is uniform and free of particles, thus obtaining the second mixture. Step 3: Reduce the rotation speed of the second mixture to 400 rpm, add the adhesion promoter silane coupling agent (Hubei Xinlantian KH-560), leveling agent (BYK-358), defoamer (BYK-055), and first solvent (a mixed solvent with a mass ratio of propylene glycol methyl ether acetate / butyl acetate of 2:1), and continue stirring for 15 minutes until completely homogeneous to obtain the third mixture.

[0111] Step 4: Filter the third mixture through an 80-mesh filter bag to obtain the resin system; Step 5: In a dry container, add aliphatic isocyanate curing agent (Covestro Desmodur N 3390, solid content 90%) and second solvent butyl acetate, stir at 400 rpm for 15 minutes, mix evenly, and obtain the fourth mixture. Step 6: Filter the fourth mixture through an 80-mesh filter bag to obtain the solidified system; Step 7: Mix the curing system and the resin system at a mass ratio of 17:100 to obtain the encapsulating coating. The mixing conditions include: a rotation speed of 500 pm and a stirring time of 15 minutes.

[0112] Step 8: After allowing the encapsulating adhesive coating to stand for 5 minutes to defoam, spray it to obtain the encapsulation layer. The dry film thickness of the encapsulation layer is 100μm. Application viscosity: 26 seconds (Ford cup 4, 25°C); Curing conditions: surface dry in 15 minutes, hard dry in 4.5 hours (25°C); or bake at 80°C for 1 hour.

[0113] Example 5 The resin system and curing agent system, as well as the encapsulation layer, are prepared according to the following steps: Step 1: In a light-proof and dry reaction vessel, add the specified amounts of hydroxyl acrylic resin (Sanmu Group SY-421b), modified epoxy resin (Jiangsu Sanmu YD-128), and organosilicon resin (Jinan Jiuri JH-S-801), and stir at 350 rpm for 20 minutes to mix them evenly to obtain the first mixture. Step 2: While stirring, slowly add fumed silica (Evonik AEROSIL 202), matting agent (Qingdao Bonnie GR-280), and UV absorber (Beijing Chiguard 5830) sequentially to the first mixture. After addition, increase the rotation speed to 850 rpm and disperse for 40 minutes until the system is uniform and free of particles, thus obtaining the second mixture. Step 3: Reduce the rotation speed of the second mixture to 300 rpm, add the adhesion promoter silane coupling agent (Hubei Xinlantian KH-560), leveling agent (BYK-333), defoamer (BYK-055), and the first solvent butyl acetate, and continue stirring for 25 minutes until completely homogeneous to obtain the third mixture.

[0114] Step 4: Filter the third mixture through a 60-mesh filter bag to obtain the resin system; Step 5: In a dry container, add the aliphatic isocyanate curing agent (Covestro Desmodur N 75) and the second solvent butyl acetate, and stir at 400 rpm for 20 minutes until well mixed to obtain the fourth mixture; Step 6: Filter the fourth mixture through a 60-mesh filter bag to obtain the solidified system; Step 7: Mix the curing system and the resin system at a mass ratio of 17:100 to obtain the encapsulating adhesive coating. Mixing conditions include: a rotation speed of 450 rpm and a stirring time of 13 minutes. Step 8: After allowing the encapsulating adhesive coating to stand for 8 minutes to defoam, apply it by spraying or brushing to obtain the encapsulation layer. The dry film thickness of the encapsulation layer is 100μm. Application viscosity: 38 seconds (Ford cup 4, 25°C); Curing conditions: surface dry in 30 minutes, fully dry in 8 hours (25°C); or bake at 80°C for 2 hours.

[0115] Comparative Example 1 used Dow Chemical's SILASTIC™ JCR6185 LED potting compound, and applied and cured according to the instructions in its product data sheet.

[0116] The specific differences in the proportions of each component of the encapsulating adhesive composition in the corresponding systems of Examples 2 to 5 and Comparative Example 2 are detailed in Table 1.

[0117] Table 1. Differences in components between Examples 1 to 5 and Comparative Example 2

[0118] The following tests were performed on the encapsulating adhesive compositions of the examples and comparative examples: Performance testing was conducted according to national standard testing methods, specifically including: Adhesion: The cross-cut test was conducted according to GB / T9286-2021 standard; Method: A grid pattern was drawn using a multi-blade cutting tool with a cutting interval of 1 mm or 2 mm. After peeling off the adhesive tape, the area of ​​paint film peeling off was rated (0-5, with 5B being the best grade required in this application).

[0119] 60° Gloss: Determined according to GB / T9754-2007 standard; using a calibrated gloss meter, the coating after complete curing and conditioning on a standard glass plate was measured at a temperature of (23±2)°C and a relative humidity of (50±5)%. The ratio of specular reflected light flux of the paint film at an incident angle of 60° to the reflected light flux of the standard plate was measured, and the arithmetic mean of the measurements at at least three different locations was taken. The unit is GU.

[0120] Water resistance: IPX7 rating test according to GB / T4208-2017 standard; Method: Immerse the coated and cured LED light panel in water to a depth of 1 meter for 30 minutes. After the test, remove and inspect; if there is no water or moisture inside, it passes the test.

[0121] Moisture and heat resistance: The constant damp heat test at 85°C / 85%RH for 1000 hours was conducted according to GB / T2423.3-2016 standard. Method: The sample was placed in an environment with a constant temperature of 85°C and relative humidity of 85% for a specified time (e.g., 1000 hours). After the test, the appearance and adhesion of the encapsulation layer were checked for deterioration.

[0122] Thermal shock resistance: 200 cycles of temperature shock test from -40℃ to 85℃ were conducted according to GB / T2423.22-2012 standard; Method: The sample was rapidly switched between two extreme temperatures, high temperature (85℃) and low temperature (-40℃), and each extreme temperature was held for 30 minutes, for 200 cycles, to test the internal stress resistance and crack resistance of the encapsulation layer.

[0123] High temperature and high humidity thermal cycling: Refer to GB / T2423.34-2012 "Environmental Testing Part 2: Test Methods Test Z / AD: Temperature / Humidity Combined Cyclic Test". Method: This is a combined stress test that simulates a more stringent real-world operating environment (high temperature and high humidity + low temperature drying + room temperature recovery), placing extremely high demands on the overall reliability of the encapsulation layer. A complete cycle typically lasts 8 hours and is divided into three stages: (1) High temperature and high humidity stage (85°C / 85%RH, maintain for 4 hours); (2) Low-temperature drying stage (-40°C, maintain for 2 hours); (3) Room temperature recovery stage (25°C, maintain for 2 hours); Number of cycles: Typically 50 cycles (approximately 400 hours in total).

[0124] Salt spray corrosion resistance: Neutral salt spray test for 500 hours according to GB / T1771-2007 standard; Method: The sample is continuously or intermittently sprayed with 5% sodium chloride solution in a closed chamber at 35℃ to form a salt spray environment. After 500 hours, check the blistering, rusting, corrosion and other conditions of the encapsulation layer.

[0125] Transmittance retention: After UV aging, the transmittance change of the sample was determined according to GB / T2410-2008 standard. Method: Accelerated aging was carried out using a UV aging test chamber (e.g., according to GB / T16422.3-2014 Plastics Laboratory Light Source Exposure Test Method Part 3: Fluorescent UV Lamp). Before and after aging, the transmittance of the encapsulation layer coated on the transparent substrate was measured using a haze meter or spectrophotometer, and the transmittance retention was calculated.

[0126] The corresponding test results are detailed in Table 2.

[0127] Table 2 Performance test results of the examples and comparative examples

[0128] From the adhesion test results, Examples 1 to 4 all achieved a cross-cut adhesion score of 5B (best grade), indicating extremely strong adhesion between the encapsulation layer and the substrate (LED light board, PCB, epoxy resin encapsulation, etc.) with no peeling. Example 5 achieved an adhesion score of 4B, still considered excellent, but slightly lower than the previous four examples. This may be related to the lower content of silicone resin and modified epoxy resin in its resin formulation, which reduces their contribution to adhesion. Comparative Example 1 only achieved an adhesion score of 3B, indicating insufficient adhesion of conventional potting compounds to complex substrates, easily leading to peeling and flaking of the encapsulation layer, affecting long-term protective reliability. This demonstrates that the synergistic effect of hydroxyl acrylic resin, modified epoxy resin, and silicone resin in the resin system of this application, along with the addition of a silane coupling agent, significantly improves the interfacial adhesion of the encapsulation layer to different substrates. The initial adhesion in Comparative Example 2 remained good.

[0129] From the perspectives of both matte finish and anti-glare optical properties, Examples 1 to 4 exhibit a 60° gloss level between 6 and 9 GU, achieving an excellent permanent matte effect that effectively eliminates direct LED glare and improves visual comfort. Example 5 has a gloss level of 12 GU, still within the matte range, but with a slightly higher gloss, possibly due to its lower total amount of matting agent. Comparative Example 1 has a gloss level as high as 95 GU, a high-gloss surface that would produce severe specular reflection and glare, making it unsuitable for applications requiring a softer visual appearance. This application utilizes a dual matting mechanism of fumed silica and matting powder to construct a uniform micro-rough structure on the surface of the encapsulation layer, achieving a highly efficient and stable matte effect without significantly sacrificing light transmittance; the light transmittance retention rate is consistently greater than 92%. Comparative Example 2 has a light transmittance retention rate below 90%.

[0130] In terms of waterproof sealing, all embodiments and comparative examples passed the waterproof test, indicating that the encapsulation layer provided in this application can form a dense protective film, effectively blocking moisture penetration. The potting compound used in Comparative Example 1 also has a certain degree of waterproofness, so this basic waterproof requirement can be met. The main difference lies in long-term reliability.

[0131] Based on the results of the damp heat aging test (double 85 test), Examples 1 to 4 showed no warping of the encapsulation layer after 500 hours, demonstrating extremely strong resistance to high temperature and humidity. Example 5 showed slight edge warping, possibly related to the relatively low crosslinking density of the resin system and the slightly weaker resistance to deformation under damp heat due to its flexible formulation (high hydroxyl acrylic resin, low-modified epoxy resin). Comparative Example 1 showed severe yellowing and cracking, indicating poor hydrolysis and heat oxidation resistance of its resin system, making it unsuitable for use in harsh environments. The encapsulation layer of Comparative Example 2 cracked severely, with adhesion dropping to 0 GB.

[0132] In terms of thermal shock resistance, the encapsulation layers of all embodiments showed no abnormalities after 200 cycles. However, Comparative Example 1 showed film peeling, indicating that its encapsulation layer and substrate had mismatched coefficients of thermal expansion, resulting in high internal stress, insufficient flexibility, and inability to withstand rapid temperature changes. Furthermore, the encapsulation layer of Comparative Example 2 experienced large-area peeling after 200 cycles.

[0133] In terms of high-temperature and high-humidity thermal cycling, Examples 1 to 5 showed no abnormalities in the encapsulation layer after 50 cycles. However, Comparative Example 1 failed, further demonstrating the superior reliability of the encapsulation layer provided in this application under complex alternating stress. Comparative Example 2 showed network cracks in the encapsulation layer after 20 cycles and completely detached after 50 cycles, indicating that the network structure formed by the corresponding proportions in the resin system of the encapsulation adhesive composition of this application has better stability.

[0134] Regarding salt spray corrosion resistance, Examples 1 to 4 showed no corrosion after 500 hours of neutral salt spray. Example 5 exhibited slight edge corrosion, possibly due to a thinner edge film and a lower content of corrosion-resistant components (such as modified epoxy resin) in its formulation. The corrosion of the PCB copper foil in Comparative Example 1 indicates insufficient protection of its encapsulation layer, failing to effectively block chloride ion penetration and leading to corrosion of the underlying metal circuitry. Comparative Example 2 showed severe corrosion propagation and blistering at the edges of the encapsulation layer.

[0135] Tests such as resistance to damp heat aging, thermal shock, high temperature and high humidity thermal cycling, and salt spray corrosion can be used to compare the environmental adaptability of the embodiments and comparative examples. The embodiments of this application, through the weather resistance of the hydroxyl acrylic resin in the resin system, the strong adhesion and chemical resistance of the modified epoxy resin, and the flexibility and hydrophobicity of the silicone resin, along with the optimized curing network, endow the encapsulation layer with excellent environmental adaptability, resisting various aging factors such as damp heat, high and low temperatures, and salt spray.

[0136] In terms of UV aging resistance and light transmittance, all examples maintained a light transmittance of more than 92% after 1000 hours of UV aging, with the highest reaching more than 96%. In contrast, Comparative Example 1 had a light transmittance retention of less than 70%, indicating severe yellowing and chalking, which led to a significant decrease in light transmittance.

[0137] The above provides a detailed description of an encapsulating adhesive composition, encapsulation layer, and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An encapsulating adhesive composition, characterized in that, The encapsulating adhesive composition includes a resin system and a curing system; The resin system includes hydroxyl acrylic resin, modified epoxy resin and organosilicon resin, and the curing system includes aliphatic isocyanate curing agent.

2. The encapsulating adhesive composition according to claim 1, characterized in that, In the resin system, the mass ratio of the hydroxyl acrylic resin, the modified epoxy resin and the silicone resin is in the range of (45-60):(10-20):(5-15).

3. The encapsulating adhesive composition according to claim 1, characterized in that, The resin system further includes at least one of a matting agent, an adhesion promoter, an ultraviolet absorber, a leveling agent, an antifoaming agent, and a first solvent.

4. The encapsulating adhesive composition according to claim 3, characterized in that, The matting agent is selected from fumed silica and matting powder; In the encapsulating adhesive composition, the resin system comprises the following components in parts by weight: The hydroxyl acrylic resin, 40 to 60 parts; The modified epoxy resin, 10 to 20 parts; The silicone resin, 5 to 15 parts; The fumed silica, 1 to 3 parts; The matting agent, 2 to 5 parts; The adhesion promoter, 0.5 to 2 parts; The ultraviolet absorber, 0.2 parts to 1 part; The leveling agent, 0.1 to 0.5 parts; The defoamer, 0.1 to 0.5 parts; and The first solvent, 15 to 25 parts.

5. The encapsulating adhesive composition according to claim 4, characterized in that, The matting agent is selected from at least one of organic waxes and silica. The adhesion promoter is selected from at least one of silane coupling agents, titanate coupling agents, aluminate coupling agents, and phosphate compounds; The ultraviolet absorber is selected from at least one of benzotriazole derivatives, triazine derivatives, and cyanoacrylate derivatives; The leveling agent is selected from at least one of polyether-modified polydimethylsiloxane derivatives and acrylate derivatives; The defoamer is selected from defoaming polymers; The first solvent is selected from at least one of butyl acetate, ethyl acetate, propylene glycol methyl ether acetate, isobutyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and ethylene glycol butyl ether acetate.

6. The encapsulating adhesive composition according to claim 1, characterized in that, The curing system also includes a second solvent; In the encapsulating adhesive composition, the curing system comprises the following components in parts by weight: The aliphatic isocyanate curing agent, 10 to 20 parts; and The second solvent, 5 to 10 parts.

7. The encapsulating adhesive composition according to claim 6, characterized in that, The aliphatic isocyanate curing agent is selected from at least one of hexamethylene diisocyanate trimer and isophorone diisocyanate trimer; The second solvent is selected from at least one of butyl acetate, ethyl acetate, propylene glycol methyl ether acetate, isobutyl acetate, methyl ethyl ketone, methyl isobutyl ketone, and ethylene glycol butyl ether acetate.

8. The encapsulating adhesive composition according to any one of claims 1 to 7, characterized in that, The mass ratio of the curing system to the resin system ranges from 3:20 to 1:

4.

9. An encapsulation layer, characterized in that, The encapsulation layer is made using the encapsulating adhesive composition according to any one of claims 1 to 8.

10. A display device, characterized in that, The display device includes a lamp panel and an encapsulation layer disposed at least on the surface of the lamp panel, the encapsulation layer including the encapsulation layer of claim 9.

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