Gas detection sensor arrangement and method of assembly

Abstract

A gas detection sensor arrangement includes a housing having a top, a bottom, an electrical connector, and a circuit board, and a gas sensor disposed within the housing. The gas sensor is configured to detect a gas in an environment external to the housing. The bottom, the top, and the electrical connector are joined together to seal the circuit board within the housing. A method for assembling a gas detection sensor arrangement includes joining together a bottom and a top, biasing a gas sensor toward a gas sensor opening formed in a housing, and sealing a circuit board within the housing.

Description

TECHNICAL FIELD

[0001] The present invention relates to the field of gas detection sensors for detecting leaks in air conditioning systems, refrigeration systems, furnaces or other combustion systems, heat pumps, etc. The present invention also relates to the field of gas sensor housings provided to protect the gas detection sensor and associated electronics from harmful external conditions. BACKGROUND

[0002] When HVAC or other refrigeration systems use refrigerants exhibiting lower global warming potential (GWP), flammability hazards or toxicity hazards can occur in the event of refrigerant leaks. This is especially true when flammable refrigerants (A3) such as R290 or R600a are used. Even when less toxic or mildly flammable (A2L) refrigerants (such as R32 or R1234ze / yf) or blends (such as R454B) are used, as such mildly flammable refrigerants have an increased likelihood of combustion as their concentration increases. Therefore, it has become mandatory to incorporate refrigerant leak detection mechanisms into such systems for safety reasons.

[0003] In order for a gas leak detection sensor to function properly, the sensor should be enclosed in a housing unit so that the sensor and its components can be protected from harsh conditions. Current industry solutions for protecting gas leak detection sensors utilize a cover and fasteners to secure the gas leak detection sensor. SUMMARY

[0004] According to a first aspect, a gas detection sensor arrangement includes a housing having a top and a bottom, a circuit board disposed within the housing, and a gas sensor disposed within the housing. The gas sensor is configured to detect a gas in an environment outside of the housing. The bottom and the top are joined together to seal the circuit board within the housing.

[0005] The bottom and the top can be welded together (e.g., via ultrasonic welding or laser welding). Alternatively, the bottom and the top can be bonded together using an adhesive (e.g., via epoxy, or potted together using silicone filler, one- or two-part silicone). Even further, the bottom and the top can be mechanically fastened to each other using, for example, screws or complementary snap-fit features. When the bottom and the top are joined via mechanical means, a seal or sealing element (e.g., an O-ring, a gasket, a UV-cured adhesive, a relatively soft polymer, etc.) can be provided between the bottom and the top.

[0006] The housing can further include an electrical connector opening and an electrical connector with an electrical connector adapter flange. The electrical connector opening and the electrical connector adapter flange have opposing surfaces that are joined together to seal the electrical connector opening.

[0007] The electrical connector opening and the electrical connector adapter flange can be welded together (e.g., via ultrasonic welding or laser welding). Alternatively, the electrical connector opening and the electrical connector adapter flange can be bonded together using an adhesive bond (e.g., via a UV-cured adhesive or an epoxy, or potted together using a silicone filler, one- or two-part silicone). Even further, the electrical connector and the housing can be mechanically fastened to one another using, for example, screws or complementary snap-fit features. When the electrical connector opening and the electrical connector adapter flange are joined via mechanical means, a seal or sealing element (e.g., an O-ring, a gasket, a UV-cured adhesive, a relatively soft polymer, etc.) can be provided between the electrical connector opening and the electrical connector adapter flange.

[0008] The housing can further include a gas sensor opening configured to allow a gas in an environment external to the housing to reach the gas sensor. The gas sensor opening can be configured as a through-hole in the floor of the bottom. According to a preferred embodiment, the gas sensor opening can be configured as a simple through-hole in the flat portion of the floor of the bottom, i.e., without any standoff or spacer portion provided around the through-hole within the housing. The housing is configured to bias the gas sensor towards the gas sensor opening, thereby sealing the gas sensor opening.

[0009] One or more microcontrollers, relays, switches, and / or other electronic components can be provided on the first side of the circuit board and / or on the second side of the circuit board, with the first side of the circuit board facing the top and the second side of the circuit board facing the bottom.

[0010] The gas detection sensor arrangement can further include a seal or sealing member (e.g., an O-ring, a gasket, a relatively soft polymer, etc.) located between the gas sensor and the gas sensor opening. The housing can bias or urge the gas sensor towards the gas sensor opening, thereby compressing the sealing member between the gas sensor and the housing, and sealing the gas sensor opening.

[0011] The gas detection sensor arrangement can further include a light guide that seals a light guide opening formed in the housing. For example, the light guide can emit light (typically red or green light) from a light source, such as an LED mounted on the PCB. Alternatively, the housing can be provided with a transparent or translucent (or any other color that allows light to be transmitted therethrough) wall portion configured to allow light from a light source located within the housing to be visible outside of the housing. For example, the light guide opening or the transparent or translucent wall portion can be provided in the bottom of the housing, thereby allowing light to pass through the bottom.

[0012] According to another aspect, a component for a housing of a gas detection sensor arrangement is provided. The component includes a top portion of the housing and a bottom portion of the housing. At least one of the top portion or the bottom portion is configured to receive a circuit board. At least one of the top portion or the bottom portion is configured to receive a gas sensor configured to detect a gas in an environment outside the housing. At least one of the top portion or the bottom portion includes a gas sensor opening configured to allow the gas in the environment outside the housing to reach the gas sensor. The top portion and the bottom portion are configured to be joined together to seal the circuit board and the gas sensor within the housing.

[0013] According to a preferred embodiment, the opposing surfaces of the top portion and the bottom portion are configured to be ultrasonically welded together at a housing seam. At least one of the top portion or the bottom portion can have an energy director located thereon. The energy director is configured to initially space apart the opposing surfaces of the top portion and the bottom portion at the housing seam and at least partially melt upon application of energy to the housing seam such that the opposing surfaces of the top portion and the bottom portion are brought together and ultrasonically welded together.

[0014] Alternatively, the opposing surfaces of the top portion and the bottom portion can be joined via the use of laser welding. At least one of the top portion or the bottom portion can be provided with a material that transmits energy of a laser beam, thereby facilitating the ability of the laser beam to impinge on and melt the opposing surface of the other of the top portion and the bottom portion. At least one of the top portion or the bottom portion can be provided with a material that absorbs energy of a laser beam, thereby facilitating the ability of the laser beam to melt the absorptive material. Typically, one of the top portion or the bottom portion will be provided with a material that transmits energy of a laser beam and the other of the top portion or the bottom portion will be provided with a material that absorbs energy of a laser beam.

[0015] As another alternative, the top portion and the bottom portion can be joined using mechanical fasteners (e.g., screws, complementary snap-fit features) and / or adhesives (e.g., UV-cured adhesives, epoxies, potting compounds, etc.). When mechanical fasteners are used, a sealing element can additionally be provided between the opposing surfaces. Even as other alternatives, a sealant can be applied on assembled portions of the housing unit, such as the joint or gap between the cover portion and the bottom portion, the electrical connectors and housing unit portions, and / or the gas sensor and any housing unit portions.

[0016] The components can further include an electrical connector having an electrical connector adapter flange. At least one of the top or bottom includes an electrical connector opening. According to a preferred embodiment, opposing surfaces of the electrical connector adapter flange and the electrical connector opening are configured to be ultrasonically welded together to seal the electrical connector opening. At least one of the opposing surfaces of the electrical connector adapter flange and the electrical connector opening can have an energy director located between the opposing surfaces. The energy director is configured to initially space the opposing surfaces of the electrical connector adapter flange and the electrical connector opening apart and further configured to at least partially melt upon application of energy to the opposing surfaces so that the opposing surfaces of the electrical connector adapter flange and the electrical connector opening can subsequently be brought together and ultrasonically welded together.

[0017] Alternatively, the connector and the opposing surfaces of the electrical connector opening can be joined via the use of laser welding. At least one of the electrical connector adapter flange and the electrical connector opening can be provided with a material that transmits laser beam energy, thereby facilitating the ability of a laser beam to impinge on and melt the opposing surface of the other of the electrical connector adapter flange and the electrical connector opening. At least one of the electrical connector adapter flange and the electrical connector opening can be provided with a material that absorbs laser beam energy, thereby facilitating the ability of a laser beam to melt the absorptive material. Typically, one of the electrical connector adapter flange and the electrical connector opening will be provided with a material that transmits laser beam energy and the other of the electrical connector adapter flange and the electrical connector opening will be provided with a material that absorbs laser beam energy.

[0018] As another alternative, the electrical connector adapter flange and the electrical connector opening can be joined using mechanical fasteners (e.g., screws, complementary snap-fit features) and / or adhesives (e.g., UV-cured adhesives, epoxies, potting compounds, etc.). When mechanical fasteners are used, a sealing element can additionally be provided between the opposing surfaces.

[0019] The gas sensor opening can be configured to be at least partially sealed by a gas sensor. The components can further include a sealing member configured to be disposed between the gas sensor and at least one of the top or bottom and configured to at least partially seal the gas sensor opening. Alternatively, a sealant can be provided on the top or bottom (e.g., on an exterior surface around a perimeter of the gas sensor opening) in order to at least partially seal the gas sensor opening. The gas sensor opening can be contoured to facilitate placement and retention of the sealant.

[0020] According to particular aspects, a method for assembling a gas detection sensor arrangement is provided. The method includes providing a first portion of a housing for the gas detection sensor arrangement, providing a second portion of the housing for the gas detection sensor arrangement, and providing an electrical connector having an electrical connector adapter flange. The method also includes joining the electrical connector adapter flange to an electrical connector opening disposed in one of the first portion or the second portion, assembling a circuit board having a gas sensor disposed thereon to the electrical connector, and joining the first portion to the second portion at a housing seam to seal the circuit board inside the housing.

[0021] The joining method can include welding (ultrasonic or laser), mechanical fasteners (e.g., screws, complementary snap-fit features, etc.), and / or adhesive bonding (e.g., UV-cured adhesive, epoxy, potting compound, etc.).

[0022] The method can also include placing a sealing member between the gas sensor and one of the first portion or the second portion during the step of joining (e.g., welding, fastening, bonding, etc.) the first portion to the second portion, and compressing the sealing member between the gas sensor and one of the first portion or the second portion. The step of placing the sealing member between the gas sensor and one of the first portion or the second portion can include placing the sealing member around a gas sensor opening formed in one of the first portion or the second portion, and compressing the sealing member between the gas sensor and one of the first portion or the second portion. The sealing member can seal the gas sensor opening during the step of joining the first portion to the second portion.

[0023] The step of ultrasonically welding the first portion to the second portion can include providing an energy director between opposing surfaces of the first portion and the second portion, at least partially melting the energy director, and joining the opposing surfaces of the first portion and the second portion together at the housing seam when the energy director is melted.

[0024] Similarly, the step of ultrasonically welding the electrical connector adapter flange to the electrical connector opening can include providing an energy director between opposing surfaces of the electrical connector adapter flange and the electrical connector opening, at least partially melting the energy director, and bringing the opposing surfaces of the electrical connector adapter flange and the electrical connector opening together when the energy director is melted.

[0025] The sealed housing can protect the sensors and other components inside the housing from moisture, refrigerant oil, mechanical forces, UV light, corrosion, particulates, and harsh thermal conditions. The housing can be particularly advantageous because the housing protects the gas detection sensor arrangement from frost that occurs during operation, and from the impact of a pressurized water jet that is typically used to clean the gas sensor. BRIEF DESCRIPTION OF DRAWINGS

[0026] Exemplary embodiments of the present application will now be described with reference to the following drawings.

[0027] Figure 1 is a front top perspective view of an embodiment of a gas detection sensor arrangement with a six-pin connector.

[0028] Figure 2 is a front top perspective view of a gas detection sensor arrangement of Figure 1

[0029] Figure 3 is an exploded view of a front top perspective view of a gas detection sensor arrangement of Figure 1

[0030] Figure 4 is a partially exploded bottom perspective view of a gas detection sensor arrangement of Figure 1

[0031] Figure 5 is a bottom perspective view of a gas detection sensor arrangement of Figure 1

[0032] Figure 6 is a bottom perspective view of a gas detection sensor arrangement of Figure 1

[0033] Figure 7 is a schematic side view of an embodiment of a gas detection sensor arrangement showing an energy director.

[0034] Figure 8 is a partially exploded bottom perspective view of a gas detection sensor arrangement according to an alternative embodiment.

[0035] Figure 9 is a bottom perspective view of a gas detection sensor arrangement according to a further embodiment.

[0036] Figure 10 is an exploded bottom perspective view of a gas detection sensor arrangement according to another embodiment with the PCBA and the bottom removed.

[0037] Figure 11A is an enlarged detail according to Figure 7 showing an energy director at an ultrasonic weld seam between the top and bottom of the housing. Figure 11B is an enlarged detail according to Figure 7 showing a laser weld seam between the top and bottom of the housing.

[0038] Figure 12 ​​​​​is a front lower perspective view of a top according to another embodiment, showing ribs on the outside of the top.

[0039] Figure 13 is a flowchart of steps for assembling a gas detection sensor arrangement according to an aspect of the invention.

[0040] Figures 14A-14E Various configurations for sealing a gas sensor opening are schematically shown. In particular, Figure 14A a gas sensor opening is shown provided with a flat profiled edge; Figure 14B a chamfered profiled edge is shown; Figure 14C a chamfered parallel profiled edge is shown; Figure 14D a rounded profiled edge is shown; and Figure 14E a stepped or seat-like profiled edge is shown.

[0041] Figure 15A A low pressure molded electronic assembly is schematically shown, comprising a PCBA and an electrical connector. Figure 15B A low pressure molded electronic assembly is schematically shown, comprising a PCBA and a cable. Figure 15C A low pressure molded electronic assembly is schematically shown, comprising a PCBA and a cable, into a housing.

[0042] Figure 16 A connector variant and a top are shown, which can be overmolded to provide a unitary assembly.

[0043] Figure 17A is a schematic side view of an embodiment of a gas detection sensor arrangement according to a further embodiment (with the PCBA and bottom removed), showing connector pins insert molded into the top. Figure 17B is a bottom perspective view of an embodiment of a gas detection sensor arrangement according to the invention. Figure 17A

[0044] Figure 18A is a schematic side view of an embodiment of a gas detection sensor arrangement according to the invention.

[0045] Figure 18B is a close-up view of a portion of an embodiment of Figure 18A

[0046] Figure 19A is a top perspective view of a top according to an embodiment of Figure 18A

[0047] Figure 19B is a top perspective view of a top according to an embodiment of Figure 18A ​​​The following is a bottom perspective view and an exploded view of a gas detection sensor arrangement in an embodiment, which is at another stage of the assembly method of the arrangement.

[0048] Figure 19C It is based on Figure 18A A schematic side view of a gas detection sensor arrangement according to an embodiment, which is at another stage of the assembly method of the arrangement.

[0049] Figure 19D It is based on Figure 18A A schematic side view of a gas detection sensor arrangement according to an embodiment, which is at another stage of the assembly method of the arrangement.

[0050] Figure 20 It is based on Figure 21 A perspective view of an ultrasonic welding apparatus having a gas detection sensor arrangement according to an embodiment, the ultrasonic welding apparatus being arranged in... Figure 21 In the embodiments described above.

[0051] Figure 21 It is based on Figure 21 The illustration shows the effect of ultrasonic welding on the energy guide of the gas detection sensor arrangement in the embodiment.

[0052] The scope of this invention is not limited to the above schematic diagrams, the number of constituent parts, their relative arrangement, etc. These drawings are disclosed only as examples of embodiments. Detailed Implementation

[0053] With the advent of medium to low GWP refrigerants (such as A2L), the use of refrigerant gas detection sensors to detect refrigerant gas leaks in indoor units of heating, ventilation, and air conditioning (HVAC) systems has become mandatory for safety reasons. Furthermore, specific safety requirements or regulations must be met when using medium to low GWP refrigerants. This is especially true when using flammable refrigerants (A3) (such as R290 or R600a). This is also true when using less toxic or mildly flammable (A2L) refrigerants (such as R32 or R1234ze / yf) or blends (such as R454B), as the flammability of such mildly flammable refrigerants increases with their concentration.

[0054] Preferably, such refrigerant gas detection sensors are installed within the air handling units of HVAC systems, such as in the indoor unit of a residential HVAC system. Such units typically include a heat exchanger and a fan, and are the most likely locations for refrigerant leaks, and leaks within these units are the most critical. Alternatively, refrigerant gas detection sensors can also be disposed outside of the HVAC unit housing, such as in the air duct of an HVAC system proximate to the unit outlet.

[0055] The gas detection sensor arrangement can include one or more relays and / or switches in communication with one or more microcontrollers to control one or more auxiliary units, including (for example, but not limited to) a fan, an indicator light, an electrically energized valve solenoid.

[0056] Reference is made to Figures 1-6 A gas detection sensor arrangement 100, including a housing 10, is shown. The housing 10 includes a first portion 14 (e.g., a top), a second portion 16 (e.g., a bottom), and a connector 20. A sensor 54 is disposed at least partially within the housing 10 (see Figures 5-6 The sensor 54 is configured to detect a gas leak. Further, a circuit board 32 (e.g., a printed circuit board assembly (PCBA)) is disposed within the housing 10.

[0057] The materials used to form the various components of the housing 10 (i.e., the top 14, the bottom 16, and / or the connector housing) can contain an anti-UV polymer. Further, any of the various components (i.e., the top, the bottom, and the electrical connector housing) can be provided with a flame retardant material. In a preferred embodiment, the flame retardant material has a minimum UL94 flammability of V0 rating.

[0058] As best shown in Figures 2-4 An electrical connector opening 56 is formed in the housing 10. In Figures 1-6 embodiments, the electrical connector opening 56 is formed in the top 14. The electrical connector opening 56 is configured to receive the electrical connector 20 and includes an electrical connector opening edge 72. The connector 20 includes an adapter flange 24 having an adapter flange edge 70. The electrical connector opening edge 72 is configured to mate with the adapter flange 24.

[0059] According to this embodiment, as best shown in Figure 1 and Figures 4-6 The top 14 includes a top sidewall 64 extending around a perimeter of the top 14 and a skirted lower portion 22 extending from the top sidewall 64. The top sidewall 64 is provided with a surface 65 (see Figure 4 and Figure 5 The surface 65 can be configured as an edge extending circumferentially along an inner surface of the skirted lower portion 22.

[0060] The top 14 (or alternatively, the bottom 16) may include a post 76 configured to interact with the circuit board opening 78 (see example...). Figure 3 and Figure 5 ) Join and secure the circuit board 32 to the top 14 (or bottom 16).

[0061] like Figure 3 and Figure 6 As best shown, the bottom 16 includes a gas sensor opening 46. The gas sensor opening 46 is configured to allow the sensed gas to reach the gas sensor 54. According to a particular embodiment, the gas sensor opening 46 may be further configured to receive at least a portion of the sensor 54. When the gas sensor 54 is mounted within the housing 10, the periphery of the gas sensor opening 46 is sealed by the gas sensor 54. Thus, for example, the gas sensor 54 may be pressed against the gas sensor opening 46, thereby providing a seal between the bottom 16 and the gas sensor 54. Alternatively, the gas sensor 54 may be pressure-fitted into the gas sensor opening 46a to form a seal.

[0062] In a preferred embodiment, the gas sensor opening 46 can be configured as a through-hole in the base plate 18 of the bottom 16. For example, the gas sensor opening 46 can be configured as a simple through-hole in a flat portion of the base plate 18 of the bottom 16. Therefore, the gas sensor 54 can rest against the flat portion of the base plate 18 without any intermediate supports or spacers within the housing 10 surrounding the through-hole. Furthermore, an optional sealing element 52 can be provided without providing any grooves or chamfers in the base plate 18 of the bottom 16. In this embodiment, the sealing element 52 can be placed flat against only the base plate 18 of the bottom 16 and held in place by the gas sensor 54.

[0063] Optionally, according to a particular embodiment, a groove, chamfer, or rounded corner extending around the gas sensor opening 46 and facing the interior of the housing 10 may be provided on the base plate 18 of the bottom 16. This groove, chamfer, or rounded corner may be configured to receive a sealing element 52, such as an O-ring, gasket, or other relatively soft sealing material (e.g., UV-cured adhesive or other adhesive), such that a strong seal is formed between the bottom 16 and the gas sensor 54 when the gas sensor 54 is mounted within the housing 10 and biased toward the gas sensor opening 46.

[0064] According to a preferred embodiment, the top portion 14 and the bottom portion 16 are configured such that when the top portion 14 and the bottom portion 16 are joined together to form the sealed enclosure joint 62, the gas sensor 54, the sealing element 52, and the chamfer extending around the gas sensor opening 46 are aligned and compressed against one another and form a seal between the gas sensor opening 46 and the gas sensor 54.

[0065] In Figures 1-6 embodiments, the top portion 14 includes mounting legs 30 for attaching the gas detection sensor arrangement 100 to a mounting surface MS (see Figure 7 ). The mounting legs 30 can include, for example, mounting through holes 38. Fasteners (not shown) can be inserted into the mounting through holes 38 to secure the mounting legs 30 to a mounting surface. The mounting legs 30 can space the outer surface of the bottom plate 18 (see Figure 7 ) of the bottom portion 16 from the mounting surface MS (see Figure 7 ). There can be any number of mounting legs 30, typically one to three. As depicted in Figures 1-6 , the two mounting through holes 38 are positioned 180° relative to one another, but they can also be oriented at different angles (e.g., 90°), or both placed adjacent to one another. The mounting legs 30 can be included as part of the top portion 14, or they can be part of the bottom portion 16 (as shown in Figure 9 ).

[0066] The skirted lower portion 22 can extend fully or at least partially along the circumference of the top portion sidewall 64 (as shown in Figures 1-6 ). The skirted lower portion 22 can be provided with a plurality of apertures 28. The apertures 28 can be arranged circumferentially around the perimeter of the top portion 14. These apertures 28 are provided to facilitate the flow of the sensed gas to the gas sensor 54 while limiting the exposure of the gas sensor 54 to damaging environmental factors. Thus, the apertures 28 in the top portion 14 enable gas to flow to the gas sensor opening 46 (which faces the opposing mounting surface MS) so that the gas is sensed by the gas sensor 54. The skirted lower portion 22 around the vent apertures also serves to protect the gas sensor 54 when liquid, such as water or oil, splashes against the enclosure 10.

[0067] As best shown in Figures 2-4 , a bottom portion perimeter 66 is formed around the outer edge of the bottom portion 16. A surface 68 is formed on the edge of the bottom portion perimeter 66. The surface 68 on the bottom portion 16 faces the sidewall 64 provided on the top portion 14, and more particularly, the surface 65 of the top portion sidewall 64. The top portion sidewall 64 and the bottom portion perimeter 66 are configured to attach to one another at the surfaces 65, 68 to form the enclosure joint 62 (see Figure 7). More specifically, the surface 65 of the top rim 64 and the surface 68 of the bottom peripheral rim 66 are configured to be joined so as to form the housing seam 62.

[0068] According to a preferred embodiment and with reference to Figure 7 and Figure 11A and Figure 11B , the surface 65 of the top rim 64 and the opposite surface 68 of the bottom side wall 66 are joined by welding, in particular ultrasonic welding or laser welding, to thereby form the housing seam 62. The welding of the housing seam 62 seals the housing 10 so as to create a mechanically robust connection that is advantageously resistant to environmental conditions, such as frost and pressurized water jets used to clean the housing 10.

[0069] In another embodiment, as best shown in Figure 8 and Figure 10 , the surface 65 of the top rim 64 and the opposite surface 68 of the bottom side wall 66 can be joined to thereby form the housing seam 62 using fasteners 17 (see Figure 8 ). Any number of fasteners 17 can be used. Further, as best shown in Figure 10 , a sealing element 75 can extend around the perimeter of the surface 65 between the opposite surfaces of the top 14 and the bottom 16. The sealing element 75 can ensure that the top 14 and the bottom 16 are sealed when the fasteners 17 (e.g., screws) are tightened. The sealing element 25 can be provided as a separate element (such as an O-ring, a gasket), or as a relatively soft polymer that is co-molded to at least one of the opposite surfaces, or as other sealing material that contains a UV-cured adhesive or an epoxy, or potted using a silicone filler (such as a one- or two-component silicone).

[0070] As shown in alternative embodiments of Figure 9 , the bottom 16 of the housing 10 can include a bottom plate 18 surrounded by a bottom side wall 66, gas sensor openings 46 each having a mounting through-hole 38, and a light guide through-hole 42. The bottom side wall 66 extends from the bottom plate 18 and protrudes in a direction toward the side wall 64 of the top 14. The bottom side wall 66 further includes a surface 68 that faces / confronts the surface 65 of the top 14. As discussed below, and as shown in Figure 7 , Figure 11A , Figure 18A and Figure 18B , an energy director 86 can be provided on the surface 68 of the bottom side wall 66 (or on the surface 65 of the top side wall 64) to facilitate ultrasonic welding of the bottom 16 to the top 14.

[0071] According to other embodiments, the top portion 14 and the bottom portion 14 can be joined and sealed by snap-fit features (see Figure 10 and the associated disclosure below), which are similar to the snap-fit features 77, 79 used to join the connector 20 to the housing 10. Even according to other embodiments, the opposing surfaces 65, 68 can be joined and sealed by adhesive bonding (e.g., via UV-cured adhesive or epoxy, or potting using silicone fillers (such as one- or two-part silicone)).

[0072] As is known in the art, one or more electronic components (which can include microcontrollers, relays, switches, etc.) are disposed on one or both sides of the circuit board 32. In particular embodiments, the electronic components can include one or more relays and / or switches to control one or more auxiliary units associated with operation of the HVAC system, including (for example and without limitation) fans, indicator lights, electrically-energized valve solenoids, and / or other components that can mitigate the effects of a detected gas leak and enhance the safety of the system.

[0073] In preferred embodiments, the electronic components 29 (other than the gas sensor 54 and optionally the gas sensor PCBA) are disposed on the upper side of the circuit board 32. The gas sensor 54 (see Figures 5-7 ) and optionally the gas sensor PCBA can be disposed on the lower surface of the circuit board 32 (i.e., the surface facing the gas sensor opening 46 and the surface of the mounting surface MS). The circuit board 32, with components on one or both sides, can be soldered to the integrated pins of the various connectors 20, or otherwise mounted to the housing 10 (e.g., using surface mount sockets or press-fit pins).

[0074] Referring to Figures 1-6 , the housing 10 seals and protects the circuit board 32, the electronic components mounted on the board 32 (including, for example, the sensor PCBA), and the gas sensor 54 from potentially damaging environments outside of the housing 10. In Figures 1-6 embodiments, the top portion 14 is configured to house the electronic components located on the upper side of the circuit board 32. The bottom portion 16 is configured to house the gas sensor 54 and / or the sensor PCBA located on the lower side of the circuit board 32. Thus, for example, the bottom side wall 66 can be configured to provide sufficient space to dispose the gas sensor 54 between the lower side of the circuit board 32 and the gas sensor opening 46. In the assembled state, the circuit board 32 with the gas sensor 54 located on the lower side of the circuit board 32 can be disposed on the post 76 within the top portion 14 (see Figure 4 ).

[0075] When the housing seam 62 is formed, the gas sensor 54 is pressed against the peripheral surface of the gas sensor opening 46 and / or against the sealing element 52, which in turn is pressed against the peripheral surface of the gas sensor opening 46 in the floor 18 of the base 16. Thus, the gas sensor 54 and / or the sealing element 52 secure the gas sensor 54 in place across the gas sensor opening 46, allowing the sensor 54 to perform its operational purpose. In this secured position, the gas sensor 54 is configured to detect gases from the aperture 28 through the housing 10. As discussed above, according to some embodiments, the gas sensor opening 46 and / or the sealing element 52 are configured to accommodate the outer periphery of the gas sensor 54.

[0076] Still referring to Figures 1-6 , in preferred embodiments, the opposing edges of the sidewall of the top 14 and the bottom peripheral wall 66 of the base 16 are connected at the housing seam 62. Preferably, the housing seam 62 is ultrasonically welded.

[0077] In Figures 1-6 , the connector 20 is shown as a six-pin connector. Generally, the assembled housing 10 can utilize any of a variety of different connectors. For example, the connector 20 can be any connector suitable for providing input / output capability to a circuit board (e.g., a five-pin connector, a six-pin connector, an eight-pin connector, etc.).

[0078] Still referring to Figures 1-6 , the adapter flange 24 is formed around the connector 20. The adapter flange edge 70 (see Figures 2-5 ) is formed around the periphery of the adapter flange 24. The adapter flange edge 70 and the electrical connector opening edge 72 are configured to connect, forming a connector adapter flange seam 74 (see Figure 1 and Figure 5 ). These various connector 20 adapter flanges 24 and adapter flange edges 70 can have a standard configuration or a common configuration, such that all of the connectors 20 can be engaged with electrical connector opening edges 72 having the standard configuration or the common configuration. The ability to readily use different connectors 20 increases the versatility of the housing 10 in enabling different power sources to be connected to the pins 26 of the device 100.

[0079] As Figures 1-6 shown, the adapter flange edge 70 and the electrical connector opening edge 72 can be connected at the connector adapter flange seam 74 by a fastener 27. As Figure 4As best shown, the sealing element 25 can extend around the perimeter of the adapter flange 24 between the opposing surfaces of the adapter flange edge 70 and the electrical connector opening edge 72. When the fastener 27 (e.g., a screw) is tightened, the sealing element 25 can ensure that the adapter flange seam 74 is sealed.

[0080] The sealing element 25 can be provided as an O-ring, a gasket, or a relatively soft polymer, or other sealing material containing a UV-cured adhesive. For example, the relatively soft polymer can be co-molded on the connector opening edge 72 or co-molded on the adapter flange edge 70. To secure the connector 20 tightly to the housing 10, one or more fastening elements, such as a screw 27 as shown in Figures 1-6 ,

[0081] Referring back to Figure 3 and also referring to Figure 6 , Figure 8 and Figure 9 , the light guide 44 can extend through a light guide through-hole 42 provided in the base 16. In a preferred embodiment, the light guide through-hole 42 is located on the floor 18. The light guide 44 is a device for guiding light from a light source (e.g., an LED) to a location where the light can be visible. According to a preferred embodiment, light from the light guide 44 can be projected onto a surface on which the gas detector sensor arrangement 100 is mounted, where the light is in turn reflected out through the aperture 28. The light source and light guide 44 can assist in positioning the gas detection sensor arrangement when the housing 10 is not otherwise clearly visible. Optionally, the light source and light guide 44 can be used to indicate the operating status of the gas detection sensor arrangement, for example with a flashing or color-coded light.

[0082] The light guide 44 can be added to the base 16 as a separate component using a press-fit mounting mechanism, fasteners, a snap-fit, or welding. Optionally, the light guide 44 can be replaced by the base 16 having at least a section made of a transparent or translucent polymer that can transmit light from a light source.

[0083] In an alternative embodiment, as shown in Figure 9 , the mounting leg 30 can be attached to the base 16. In this alternative embodiment, the skirted lower portion 22 of the top portion 14 can include holes, openings, or gaps 82 in the skirted lower portion 22 that are configured to receive the mounting leg 30. These holes, openings, or gaps 82 allow the mounting leg 30 to extend beyond the circumferential, thin-walled skirted lower portion 22 of the top portion 14.

[0084] Also as shown in Figure 9 , the mounting leg 30 can be attached to the base 16 by welding (e.g., ultrasonic welding (see Figure 7or laser welding, etc.) at the connector adapter flange joint 74. Ultrasonic welding of the flange 24 to the remainder of the housing 10 can provide a cost effective assembly as the same ultrasonic horn can be used to ultrasonically weld a variety of different connectors 20 to the electrical connector opening 56 when the various connectors 20 are provided with a standard or common configuration for the adapter flange 24. According to other embodiments, the opposing surfaces 70, 72 can be joined and sealed by adhesive bonding (e.g., via epoxy or potting using a silicone filler such as a one or two part silicone).

[0085] In other embodiments, as shown in Figure 10 the adapter flange edge 70 and the electrical connector opening edge 72 can be joined at the connector adapter flange joint 74 by engagement of one or more connector snap fittings 77 and one or more top snap fittings 79 associated with the top 14 (as shown in Figure 10 for example. For example, to join the connector 20 to the housing 10, the hooks of the snap lock fittings 77 provided on the connector 20 can elastically flex upon initial contact with the flanges of the snap fit towers 79 provided with the top 16. The hooks of the snap locks 77 can then slide past the flanges of the towers 79 and subsequently elastically snap back to their unflexed position, thereby allowing the hooks of the snap locks 77 to engage the flanges of the towers 79 when the opposing surfaces 70, 72 (with any optional sealing elements 25 therebetween) are engaged. Additionally, such snap fit features can be used to secure and hold the connector 20 to the housing 10 prior to welding (ultrasonic or laser) or during bonding of the surfaces 70, 72 together.

[0086] Referring now to Figure 6 and Figure 7 and to Figure 11A the bottom 16 is shown ultrasonically welded to the top 14. An energy director 86 can be used to facilitate the joining of the two parts. In Figure 11AIn particular, the energy director 86 is disposed on the sealing surface 68 of the sidewall 66 of the bottom portion 16. The sealing surface 68 is opposite the sealing surface 65 disposed on the sidewall 64 of the top portion 14. Alternatively, the energy director 86 can be disposed on the top portion 14. In particular, the energy director 86 can be disposed on the sealing surface 65 of the sidewall 64 of the top portion 14. As a further alternative, the energy director 86 can be disposed on the sealing surface 65 of the top portion 14 and the energy director 86 can be disposed on the sealing surface 68 of the bottom portion 16. During the ultrasonic welding of the surface 65 to the surface 68, the energy director 86 acts as a high stress point that softens and melts with the application of energy. By focusing and directing the ultrasonic energy at the energy director 86, this facilitates the welding of the surface 65 to the surface 68.

[0087] Figure 11A The enclosure joint 62 is shown formed after the ultrasonic welding of the surface 65 to the surface 68. The energy director 86 has at least partially melted and the surfaces 65 and 68 have been brought together to form the enclosure joint 62. In a preferred embodiment, the energy director 86 is formed of the same material as the sidewall 64 (or 66) in which the energy director is located. Alternatively, the energy director and the sidewall 64 or 66 are formed of different materials. The energy director 86 is a protrusion extending above the surfaces 65, 68 that can be integrally formed with the sidewall 64, 66 or can be subsequently located on the surfaces 65, 68 after the initial formation of the sidewall 64, 66. In one embodiment, the energy director 86 can be formed as a ridge that continuously extends around the entire perimeter formed by the sidewall 64, 66. In another embodiment, the energy director 86 can be formed as a series of ridges with gaps formed between the series of ridges or even as a series of beads as it extends around the perimeter formed by the sidewall 64, 66. Further, while the energy director 86 need not be formed to have a triangular cross-section, it can be formed to have a pyramidal cross-section or even a raised or rounded cross-section or any other form that allows for the focusing of energy and thereby facilitates melting.

[0088] Similarly, referring now to Figure 7 , the energy director 86 can be disposed on the electrical connector 20 to facilitate the ultrasonic welding of the connector 20 to the enclosure 10. In particular, in Figure 7 , the energy director 86 is disposed on the adapter flange edge surface 70 of the adapter flange 24 of the electrical connector 20. Referring now equally to Figure 1The adapter flange edge surface 70 faces the electrical connector opening edge surface 72, which is disposed at the electrical connector opening 56 formed in the top 14. The opposing surfaces of the adapter flange edge surface 70 and the electrical connector opening edge surface 72 can be configured to be joined by ultrasonic welding to form a connector adapter flange joint 74. Alternatively (not shown), an energy guide 86 can be disposed on the housing 10, for example, on the electrical connector opening edge surface 72 of the top 14. As a further alternative, the energy guide 86 can be disposed on the electrical connector opening edge surface 72 of the top 14, and the energy guide 86 can be disposed on the adapter flange edge surface 70 of the electrical connector 20. During ultrasonic welding of surface 70 to surface 72, the energy guide 86 acts as a high-stress point, which softens and / or melts first upon application of ultrasonic energy. By focusing and guiding the ultrasonic energy at the location of the energy guide 86, it is advantageous to weld surface 70 to surface 72.

[0089] Now for reference Figure 11B In the illustrated embodiment, the bottom 16 is shown as laser-welded to the top 14. For laser welding, a shear joint formed by two opposing complementary surfaces can be used. Figure 11B In the diagram, surface 68 of bottom 16 and surface 65 of top 14 are shown as two flat, opposing surfaces. A welding laser beam is directed to the interface of surfaces 65, 68, such that energy from the laser beam is absorbed by one or more of surfaces 65, 68. The energy causes one or more of surfaces 65, 68 to melt, thereby joining surfaces 65, 68 when the energy is subsequently removed. In a preferred embodiment, the material of one of the bottom 16 or top 14 can transmit the wavelength of the welding laser beam, thereby allowing energy from the laser beam to be transmitted to the first portion and absorbed by the surfaces of the other portions. For example, the material of bottom 16 can transmit the wavelength of the welding laser beam directed to the interface of surfaces 65, 68, such that energy from the laser beam is absorbed by surface 65 of top 14. When energy is absorbed (by surface 65), surface 65 melts, and a housing seam 62 is formed when the mating surfaces cool.

[0090] Similar to the use of laser welding to form the housing seam 62, the connector seam 74 can be formed by laser welding the connector 20 to the housing 10. For example, the adapter flange edge surface 70 and the electrical connector opening edge surface 72 can be disposed as two complementary opposing surfaces, such as two flat opposing surfaces. A welding laser beam is directed at the interface of the surfaces 70, 72 such that energy from the laser beam is absorbed by one or more of the surfaces 70, 72. The energy causes one or more of the surfaces 70, 72 to melt, thereby subsequently joining the surfaces 70, 72 when the energy is removed. In a preferred embodiment, the material of one of the connector adapter flange 24 or the electrical connector opening 56 can transmit the wavelength of the welding laser beam, thereby allowing energy from the laser beam to be transmitted by the flange 24 (or opening 56) and absorbed by the other portion of the surface. For example, the material of the connector adapter flange 24 can transmit the wavelength of the welding laser beam directed at the interface of the surfaces 70, 72 such that energy from the laser beam is absorbed by the surface 72 of the electrical connector opening 56. When the energy is absorbed by the surface 72, the surface 72 melts, and the connector seam 74 is formed as the mating surfaces cool.

[0091] As disclosed herein, according to particular aspects, the gas detection sensor arrangement 100 can include a housing 10 having a first portion 14 and a second portion 16 (e.g., a top and a bottom), a circuit board 32 disposed within the housing 10, and a gas sensor 54 for detecting a gas present in an environment external to the housing 10. The gas sensor 54 is at least partially disposed within the housing 10. The first portion 14 and the second portion 16 are brought together to seal the circuit board 32 within the housing 10.

[0092] The housing 10 can include an electrical connector opening 56 and an electrical connector 20. The electrical connector 20 has an electrical connector adapter flange. The electrical connector opening 56 and the electrical connector adapter flange 24 have opposing surfaces (e.g., surfaces 70 and 72) that are configured to be brought together to seal the electrical connector opening 56.

[0093] The housing 10 includes a gas sensor opening 46 that is configured to allow a gas in an environment external to the housing 10 to reach the gas sensor 54. The gas sensor 54 seals the gas sensor opening 46 when the first portion 14 and the second portion 16 are brought together. In a preferred embodiment, the housing 10 can act as a clamp that biases the gas sensor 54 toward the gas sensor opening 46, thereby sealing the gas sensor opening 46.

[0094] According to a particular embodiment, one or more microcontrollers, relays, switches, or other electronic components can be disposed on a first side of the circuit board 32. The first side of the circuit board 32 can be housed within the first portion 14 of the housing 10 and can face away from the gas sensor opening 46. The gas sensor opening 46 can be disposed in the second portion 16 of the housing 10. Thus, if a leak occurs at the gas sensor opening 46, the electronic components located on the first side of the circuit board 32, which face away from the gas sensor opening 46, are further protected.

[0095] Additionally, a sealing member 52 (such as an O-ring, gasket, or relatively soft polymer) can be provided adjacent the gas sensor opening 46. The sealing member 52 can be compressed between the gas sensors 54 when the first portion 14 and the second portion 16 are joined (e.g., by welding, mechanical fastening, adhesive bonding, snap fit, etc.). Thus, the sealing member 52 can assist in the sealing of the gas sensor opening 46.

[0096] According to another embodiment, a light guide opening 42 can be disposed in the housing 10, preferably in the second portion 16. A light guide 44 can be inserted into the light guide opening 42, thereby sealing the light guide opening 42. Optionally, at least a portion of the second portion 16 (or at least a portion of the first portion 14) can be transparent or translucent, such that light from a light source (e.g., an LED) within the housing 10 can be externally visible.

[0097] According to other aspects, components for a housing 10 of a gas detection sensor arrangement 100 can be provided. These components include a first component 14 and a second component 16 of the housing 10. At least one of the first component 14 or the second component 16 is configured to house a circuit board 32. At least one of the first component 14 or the second component 16 is configured to house a gas sensor 54 for detecting a gas in an environment external to the housing 10. The first component 14 and the second component 16 are configured to be joined together to form the housing 10 around the circuit board 32. In a preferred embodiment, the first component 14 and the second component 16 are configured to be joined together to form a sealed housing 10. In a further preferred embodiment, the first component 14 and the second component 16 are configured to be joined together via welding (e.g., ultrasonic welding or laser welding).

[0098] According to even other aspects, the first and second components 14, 16 can optionally be configured to be joined together via mechanical fasteners, snap-fit features, or adhesive bonding. Thus, for example, joining the first and second components 14, 16 into the housing 10 can be performed via a plurality of complementary snap-fit features, similar to the snap-fit features 77, 79 associated with joining the connector 20 to the housing 10. For example, complementary cantilevered or ring-shaped snap-fit elements can be molded around the peripheral edges of the first and second components 14, 16. Elastic deformation of the snap-fit elements allows them to slide past one another and engage one another, thereby locking the components 14, 16 together. It is contemplated that the size and curvature of the snap-fit features associated with the first and second components 14, 16 will differ from the snap-fit features 77, 79 associated with the connector 20, e.g., ring-shaped or cantilevered snap-fits.

[0099] When mechanical fasteners or snap-fit features are used to join the first and second components 14, 16, a sealing element 75 can additionally be provided between the surfaces 65, 68 to facilitate sealing of the housing 10. The sealing element 75 can be provided as an O-ring, gasket, or relatively soft polymer or other sealing material. For example, the softer polymer can be installed as a separate component during assembly, or can be co-molded on the surface 65 or co-molded on the surface 68. Optionally, the snap-fit features can be used to secure and hold the first and second components in place during a subsequent welding (ultrasonic or laser) operation or during a subsequent adhesive bonding operation.

[0100] According to particular embodiments, the components can further include the electrical connector 20 having an electrical connector adapter flange 24. At least one of the first or second components 14, 16 includes an electrical connector opening 56 configured to receive the electrical connector 20. Opposing surfaces of the electrical connector adapter flange 24 and the electrical connector opening 56 are configured to be joined together to seal the electrical connector opening 56. In preferred embodiments, the electrical connector adapter flange 24 and the electrical connector opening 56 are configured to be joined by welding, preferably ultrasonic or laser welding, to seal the electrical connector opening 56.

[0101] According to other embodiments, at least one of the opposing surfaces of the electrical connector adapter flange 24 and the electrical connector opening 56 has an energy director 86 located thereon. When the electrical connector adapter flange 24 and the electrical connector opening 56 are joined together, the energy director 86 will be positioned between the opposing surfaces. The energy director 86 is configured to initially space the opposing surfaces of the electrical connector adapter flange 24 and the electrical connector opening 56 apart. In the event that ultrasonic energy is applied to the opposing surfaces, the energy director 86 is further configured to be softened and at least partially melted such that the opposing surfaces of the electrical connector adapter flange 24 and the electrical connector opening 56 are subsequently brought together and ultrasonically welded together during the joining process, thereby sealing the electrical connector opening 56.

[0102] According to another embodiment, at least one of the first component 14 or the second component 16 includes a gas sensor opening 46 configured to allow a gas present in an environment external to the enclosure 10 to reach the gas sensor 54. The gas sensor opening 56 is configured to be sealed by the gas sensor 54. Optionally, a sealing member 52, such as an O-ring, gasket, relatively soft polymer, adhesive bond, or the like, is disposed between the gas sensor 54 and the at least one of the first component 14 or the second component 16 in which the gas sensor opening 46 is formed. The sealing member 52 can further assist in sealing the gas sensor opening 46.

[0103] According to another embodiment, the opposing surfaces 65, 68 of the first component 14 and the second component 16 are configured to be joined together at the enclosure seam 62, preferably welded (e.g., laser welded), and more preferably ultrasonically welded. The opposing surfaces need not be flat, but can include steps, channels, protrusions, or generally any complementary surface geometry. At least one of the opposing surfaces of the first component 14 or the second component 16 can have an energy director 86 located thereon. During formation of the enclosure seam 62, the energy director 86 is configured to initially space the opposing surfaces of the first component 14 and the second component 16 apart. The energy director 86 is further configured to concentrate heat generation at the interface of the opposing surfaces. Thus, in the event that energy is applied to the enclosure seam 62, the energy director 86 can soften and / or melt faster than the opposing surfaces. As the energy director 86 softens / melts, the opposing surfaces of the first component 14 and the second component 16 are brought together and ultrasonically welded together, thereby forming the enclosure seam 62 and sealing the enclosure 10.

[0104] According to a further embodiment, a gas sensor opening 46 is provided in one of the first part 14 or the second part 16, the gas sensor opening 46 being configured to allow a gas present in an environment external to the housing 10 to reach the gas sensor 54. The gas sensor opening is configured to house the gas sensor 54 or at least a portion thereof.

[0105] Reference is now made to Figure 12 The top 14 can comprise a plurality of ribs 90, which are preferably oriented in a vertical direction and are spaced apart around at least a portion of the outer or inner surface. The ribs 90 make the top 14 stiffer, which can be advantageous during assembly. In addition, the ribs 90 increase the strength and impact resistance of the top 14 (which can be advantageous), if the housing can fall (e.g., drop to the floor), the ribs 90 thus preventing the top from breaking or cracking. The bottom 16 can also comprise ribs.

[0106] Reference is now made to Figure 13 A method 1500 for assembling the gas detection sensor arrangement 100 is provided. At step 1502, the opposing surfaces of the electrical connector 20 and the top 14 of the housing 10 are brought together and joined to form a sealed joint. More specifically, the opposing surfaces of the electrical connector adapter flange 24 and the electrical connector opening 56 can be joined together (preferably by ultrasonic welding). At step 1504, the circuit board 32, electronic components 36, sensor PCBA 34 and sensor 54 are placed inside the top 14. For example, the circuit board 32 can be mounted to the post 76 associated with the top 14 by inserting the post 76 into the circuit board opening 78. At step 1506, the circuit board 32 is connected to the pins or terminals 26 of the electrical connector 20. In some embodiments, during step 1504 and / or during step 1506, the circuit board 32, electronic components 36 and / or PCBA 34 are pressed or biased towards the surface(s) of the top 14 to ensure that the circuit board 32 is in firm contact with the top 14 of the housing 10 after connecting the circuit board 32 to the pins or terminals 26 of the electrical connector 20, the importance of which is discussed later herein in connection with Figures 18A-18BThe discussion. At step 1508, the light guide 44 can be inserted into the light guide through-hole 42 and the sealing member 52 can be sub-assembled to the gas detector sensor opening 46 or the gas sensor 54 itself. Note that step 1508 can occur before or after any of steps 1502, 1504, 1504, or 1506. At step 1510, the bottom portion 16 is placed on the top portion 14 with the circuit board 32, the sensor PCBA 34, the sensor 54, and the optional sealing member 52 disposed therein. At step 1512, the opposing surfaces of the bottom portion 16 and the top portion 14 are joined together, preferably by ultrasonic welding, to form a seal. In the process of joining the bottom portion 16 to the top portion 14, the sealing member 52 can be compressed between the gas sensor 54 and the housing 10 at the gas detector sensor opening 46.

[0107] According to an embodiment, the opposing surface of the bottom portion 16 can be placed on the opposing surface of the top portion 14 with the circuit board 32, the gas sensor 54, and the sealing member 52 located within the volume between the bottom portion 16 and the top portion 14. Notably, the energy director 86 (e.g., the energy director 86 that can be located on the opposing surface of the bottom portion 16) spaces the opposing surface of the bottom portion 16 apart from the opposing surface of the top portion 14 by a predetermined distance. The predetermined distance is (at least nominally) the height that the energy director 86 protrudes from the opposing surface. In this stage of the process (after step 1510 and before step 1512), the sealing member 52 (which is located between the gas sensor 54 and the interior surface of the bottom portion 16 at the gas sensor opening 46) is not compressed (or is only slightly compressed so as to maintain its alignment).

[0108] After step 1512, the energy director 86 located on the opposing surface of the bottom portion 16 has melted and now forms part of the housing seam 62 between the bottom portion 16 and the top portion 14. Specifically, when the ultrasonic energy is applied to join the bottom portion 16 and the top portion 14, the energy director 86 melts. As the energy director 86 melts, the opposing surfaces are brought together until they eventually contact each other to form the sealed seam 62. In the process, the sealing member 52 (which is located between the gas sensor 54 and the interior surface of the bottom portion 16 at the gas detector sensor opening 46) is further compressed, thereby providing a secure seal between the housing 10 and the gas sensor 54. In the gas detector sensor arrangement 100, the housing 10 essentially acts as a clamp that secures and compresses the sealing member 52 between the gas detector sensor opening 46 and the gas sensor 54.

[0109] Thus, as presented above, according to additional aspects, a method for assembling a gas detection sensor arrangement 100 is provided. The method includes providing a first portion 14 of a housing 10 for the gas detection sensor arrangement 100, and providing a second portion 16 of the housing 10 for the gas detection sensor arrangement 100. An electrical connector 20 having an electrical connector adapter flange 24 is provided. The electrical connector adapter flange 24 is joined (using, for example, welding (e.g., ultrasonic welding or laser welding), mechanical fasteners, snap-fit features, or adhesive bonding) to an electrical connector opening 56 provided in one of the first portion 14 or the second portion 16. A circuit board 32 having a gas sensor 54 (the gas sensor 54 being provided on the circuit board 32) is operatively assembled to the pins 26 of the electrical connector 20. The first portion 14 is joined (using, for example, welding (e.g., ultrasonic welding or laser welding), mechanical fasteners, snap-fit features, or adhesive bonding) to the second portion 16 at a housing seam 62 to seal the circuit board 32 and all other electronic components inside the housing 10.

[0110] Thus, according to one embodiment, the method for assembling a gas detection sensor arrangement 100 can further include placing a sealing member 52 between the gas sensor 54 and one of the first portion 14 or the second portion 16, and compressing the sealing member 52 between the gas sensor 54 and one of the first portion 14 or the second portion 16 during the step of joining the first portion 14 to the second portion 16 (see, for example, FIG. 6). Figure 7 ].

[0111] According to a particular embodiment, the step of ultrasonically welding the electrical connector adapter flange 24 to the electrical connector opening 56 preferably includes providing an energy director 86 between the opposing surfaces 70, 72 of the electrical connector adapter flange 24 and the electrical connector opening 56; softening and then at least partially melting the energy director 86; and then bringing the opposing surfaces 70, 72 of the electrical connector adapter flange 24 and the electrical connector opening 56 together while the energy director 86 is melted.

[0112] Similarly, according to a particular embodiment, the step of ultrasonically welding the first portion 14 to the second portion 16 includes providing an energy director 86 between the opposing surfaces 65, 68 of the first portion 14 and the second portion 16; softening and then at least partially melting the energy director 86; and then bringing the opposing surfaces 65, 68 of the first portion 14 and the second portion 16 together at the housing seam 62 while the energy director 86 is melted.

[0113] In alternative embodiments, reference is made to Figures 14A-14ETo simplify the assembly process and seal the gap between the gas sensor opening 46 (or second portion 16) and the gas sensor 54 of the sealed enclosure 10, a sealing member 52 can be located on the outer surface of the enclosure 10. In particular, the sealing member 52 can be provided at a location where the circumferential edge of the gas sensor 54 extends adjacent to the gas sensor opening 46. In this case, in a preferred embodiment, the sealing member 52 can be provided as a sealant 45 (e.g., a UV-cured adhesive).

[0114] According to other embodiments, therefore, Figures 14A-14E Various configurations for sealing the gas sensor opening 46 are shown schematically. As Figures 14A-14E Various options for contouring or profiling the circumferential edge of the gas sensor opening 46 facing the circumference of the gas sensor 54 can be provided, as shown. In particular, Figure 14A A bottom portion 16 is shown provided with a flat edge profile 40 at the gas sensor opening 46 and sealed with a sealant 45. Figure 14B A bottom portion 16 is shown provided with a chamfered edge profile 41 at the gas sensor opening 46 and sealed with a sealant 45. Figure 14C A bottom portion 16 is shown provided with a chamfered parallel edge profile 43 (i.e., a chamfered profile edge that is parallel to the sidewall of the gas sensor 54) at the gas sensor opening 46 and sealed with a sealant 45. Figure 14D A bottom portion 16 is shown provided with a rounded edge profile 47 at the gas sensor opening 46 and sealed with a sealant 45. Figure 14E A bottom portion 16 is shown provided with a stepped or seat-like edge profile 49 at the gas sensor opening 46 and sealed with a sealant 45. In all of these embodiments, the sealing member 52 extends around the gas sensor opening 46 formed in one of the first portion 14 or the second portion 16 and contacts the gas sensor 54, thereby sealing the opening.

[0115] According to even other embodiments, the gas sensor opening 46 can be provided as a pressure fit configured to receive the circumference of the gas sensor 54 and seal the enclosure 10. Optionally, in addition to the pressure fit of the gas sensor 54 within the gas sensor opening 46, a sealing member 52 (such as a sealant 45) can also be provided.

[0116] The electronic components (including the PCB assembly 32) are disposed within the housing. In a preferred embodiment, the electronic components 29 (except for the gas sensor 54 and optionally the gas sensor PCBA) can be disposed on the upper side of the circuit board 32. The gas sensor 54 (see Figures 5-7 ) and optionally the gas sensor PCBA can be disposed on the lower surface of the circuit board 32 (i.e., the surface facing the gas sensor opening 46 and the surface of the mounting surface MS). The circuit board 32, with components on one or both sides, can be soldered to the integrated pins of the various connectors 20, or otherwise mounted to the housing 10 (e.g., using surface mount sockets or press-fit pins).

[0117] According to a particular aspect, as shown in Figure 15A and Figure 15B , low pressure injection molding can be used to encapsulate the electronic components 29. This method provides partial (and preferably complete) encapsulation of the electronic components 29 (including the PCB assembly 32), as well as at least partial encapsulation of the electrical connectors 20 and cable assemblies 21 (i.e., those portions positioned within the housing 10). The surface 54a of the gas sensor 54 is excluded from the molding process. The low pressure molded encapsulation 33 of the electronic assembly 29 can serve as the final housing, and can include mounting features formed by the molding. Alternatively, as shown in Figure 15C , the low pressure molded encapsulation 33 of the electronic assembly 29 can be mounted into a conventional injection molded component (e.g., the top 14 or the bottom 16) to add features. Even further, the electronic assembly 29 and a conventional injection molded component (e.g., the top 14 or the bottom 16 or the electrical connectors 20) can be put into a mold and then overmolded using a low pressure injection molding process.

[0118] Common polymers for the encapsulation process include, for example, polyurethane, silicone, epoxy. Generally, the polymeric material used for the process includes, for example, polyamide, polyolefin, polyurethane, silicone, epoxy thermoset. The hot melt adhesive or epoxy thermoset low viscosity resin has excellent adhesion to metal, PCB and electrical components, creating a waterproof and dustproof encapsulation.

[0119] As will be clear to one of ordinary skill in the art in view of the benefits of the present application, the electrical connector openings 56 of the housing 10 are designed to accommodate different types of connectors 20. The connectors 20 are provided with an adapter flange 24 that is preferably integrally molded around the perimeter of the connector housing. The adapter flanges 24 for the various different connectors 20 have a common configuration that is designed to mate with the electrical connector openings 56 of the housing 10, and thus, such robust design can easily accommodate a variety of different connector types (such as a Mate N Lok connector having different pin configurations, or a MCON connector having different pin configurations).

[0120] Alternatively, Figure 16 A variant 20a of the electrical connector 20 is shown that can be overmolded to the top portion 14, thereby integrating the connector variant with the top portion. The connector variant 20a can be a standard connector or a custom injection molded connector. The connector adapter flange seam 74 and the housing seam 62 advantageously seal the inside of the housing 10 from the deleterious outside environment.

[0121] According to a further embodiment, Figure 17A is a schematic side view of an embodiment of a gas detection sensor arrangement (with the PCBA and bottom portion removed) showing the connector pins 26 insert molded (14a) into the top portion 14. Figure 17B is a bottom perspective view of a gas detection sensor arrangement according to an embodiment of Figure 17A This embodiment further simplifies the assembly process and robustly protects the PCBA inside the housing from dust, water, or other contaminants.

[0122] According to a further embodiment, Figure 18A is a schematic side view of an embodiment of a gas detection sensor arrangement 100, and Figure 18B is an enlarged view of a portion of the device 100. The device 100 includes a sealing member 52 disposed at the gas sensor opening 46 adjacent the bottom cover 16, which is in the form of an O-ring, gasket, or relatively soft polymer. In some embodiments, the sealing member 52 is integrally formed with the cover 16. According to embodiments of the present application, the sealing member 52 can have a hardness of 40 Shore A, ~40 Shore A, in the range of 40 to 50 Shore A, in the range of 60 to 70 Shore A, in the range of 60 to 80 Shore A, in the range of 70 to 80 Shore A, or less than 80 Shore A. For purposes of the present application, the phrase “in the range of” includes the indicated low end value and high end value. The relatively lower hardness of the sealing member 52 advantageously withstands more stress that can be introduced to the device 100 during a joining process, such as an ultrasonic welding process.

[0123] Referring to Figures 19A-19D , according to embodiments of the present application, different stages of an exemplary method of assembling the device 100 of Figure 18A are shown. In Figure 19AIn FIG. 2, an exploded view of the device 100 is shown at an early stage of assembly, before the circuit board 32 or gas sensor 54 is arranged. From this view, the seating surfaces 14c, 14d of the top portion 14 are visible. There is one or more seating surfaces 14c in the vicinity of the boss 14b, and one or more seating surfaces 14d in the vicinity of the connector pins 26. The seating surfaces 14c are on the opposite side of the interior of the top portion 14 from the seating surfaces 14d. While four discrete seating surfaces 14c are shown in the vicinity of the boss 14b, there can instead be, for example, one continuous, circumferential seating surface in the vicinity of the boss 14b. The seating surfaces 14c, 14d are configured to support the circuit board 32 thereon. In cases where only a few seating surfaces 14c, 14d are provided for supporting the circuit board 32, the circuit board 32 (or PCBA) can be less rigid and more flexible to withstand more stress during the joining process of the housing portions, such as an ultrasonic welding process.

[0124] In Figure 19B In FIG. 3, an exploded view of the device 100 is shown at a later stage of assembly, after the circuit board 32 has been arranged within the top portion 14. In Figure 19C In FIG. 3, an exploded view of the device 100 is shown at a later stage of assembly, after the circuit board 32 has been arranged within the top portion 14. In

[0125] In Figure 19D In FIG. 3, an exploded view of the device 100 is shown at a later stage of assembly, after the circuit board 32 has been arranged within the top portion 14. In

[0126] With reference to Figure 20FIG. 1 shows an example device 100 according to embodiments. The device 100 includes a top portion 14 and a bottom portion 16. The top portion 14 and the bottom portion 16 are configured to be ultrasonically welded together to form a leak-proof enclosure. The device 100 also includes an electrical connector 20 and a circuit board 32. The electrical connector 20 is configured to be ultrasonically welded to the circuit board 32. The device 100 also includes one or more seating surfaces 14c, 14d. The one or more seating surfaces 14c, 14d are configured to support the circuit board 32 during the ultrasonic welding of the electrical connector 20 to the circuit board 32.

[0127] Referring to FIG. 2, an example ultrasonic welding apparatus 1000 for ultrasonically welding the bottom portion 16 to the top portion 14 is shown, according to embodiments. The apparatus 1000 includes a horn 1002 and an anvil 1004. During ultrasonic welding, the device 100 is disposed between the horn 1002 and the anvil 1004, and clamping pressure can be applied to the device 100 during ultrasonic welding. The horn 1002 generates ultrasonic high frequency vibrations (e.g., ~20 kHz) for welding the bottom portion 16 to the top portion 14. Figure 21 Referring to FIG. 3, an example energy director 86 in the shape of a triangle is shown melting during an ultrasonic welding process (other energy directors 86 are within the scope of the invention in shape). At time to, the energy director 86 is shown before receiving ultrasonic vibrations from the horn 1002. At time ti, the energy director 86 has received ultrasonic vibrations and is partially melted. At time t2, additional ultrasonic vibrations have been received, and the energy director 86 is further melted (completely or partially). Due to the melting of the energy director 86 and the pressure applied to the enclosure portions, the bottom portion 16 and the top portion 14 are brought closer together, forming an enclosure seam.

[0128] If the circuit board 32 is not pressed prior to and / or during welding of the pins or terminals 26 of the electrical connector 20, a gap can have existed between one or more of the seating surfaces 14c, 14d and the circuit board 32. If such a gap exists during the ultrasonic welding process, the welded connection between the pins or terminals 26 and the circuit board 32 can fail, and can result in a complete failure of the device 100 at manufacturing, or premature failure of the device 100 when in operation with a customer. Thus, forcing the circuit board 32 prior to and / or during welding of the pins or terminals 26 to avoid / eliminate the gap existing between the circuit board 32 and the one or more seating surfaces 14c advantageously improves manufacturing efficiency and product quality. Such a manner of a gap between the circuit board 32 and the seating surface(s) 14c, 14d can also advantageously allow for higher clamping pressure (or other types of applied pressure) during the ultrasonic welding process, and / or allow for greater amplitude / frequency of the ultrasonic vibrations used for the ultrasonic welding process. A leak-proof enclosure seam can be formed between the enclosure portions 14, 16, and the risk of damage to the electronics of the device 100 is zero, or less than the risk of forcing the circuit board 32 toward the seating surface(s) 14c, 14d.

[0129] As described above in connection with other embodiments, when the top portion (first portion) 14 and the bottom cover (second portion) 16 are joined together (e.g., by welding, mechanical fastening, adhesive bonding, snap fit, etc.), the sealing member 52 can be compressed between the gas sensors 54. Thus, the sealing member 52 can assist in sealing the gas sensor openings 46.

[0130] The relatively soft nature of the sealing member 52 is unique. Sealing members with lower durometers, such as O-rings, typically suffer from compression set issues that affect sealing performance. The sealing member 52 has a special material blend to balance lower durometer with compression set sufficient for sensor applications. For example, but not by way of limitation, the sealing member 52 can contain an ethylene propylene diene monomer (EPDM) material, although other materials are within the scope of the present disclosure.

[0131] The housing 10 can be designed to meet an ingress protection (IP) rating. Ingress protection (IP) testing evaluates how well a product's housing can withstand dust, water, and other external elements. More specifically, the first number indicates the level of protection against solid objects (e.g., dust), and is rated on a scale of 0 to 6. The second number indicates the level of protection from fluids or water provided by the housing, and uses a scale of 0 to 9.

[0132] Depending on the desired IP rating, the seams 62 and 74 can be joined with the screws 27, 17 or the snap fit elements 77, 79, and can optionally include sealing members 25, 75 mounted or disposed between opposing surfaces of the seams 62, 74, and are compressed when the screws 27, 17 are tightened or the snap fit elements 77, 79 are engaged. The seams 62 and 74 can optionally be joined by adhesive bonding (e.g., UV cured adhesive). By utilizing ultrasonic or laser welding in place of mechanical fasteners, the IP rating is increased, for example, from IP54 to IP66 / 67. Overmolding can even further increase the IP rating, for example, above IP69. Thus, the housing 10 can be sealed to protect the internal electronics from dust, and can even be dust-tight. The housing 10 can also be sealed to protect the internal electronics from dripping, spraying, or splashing water, or even from water jets, including high pressure water jets.

[0133] This increased sealing effect further makes the housing 10 mechanically robust, as the housing 10 provides protection against frost build-up on the gas sensors 54 and against the effects of a pressurized water jet when the housing 10 is cleaned. Such increased sealing effect also eliminates the need for expensive, conformal coatings on the circuit board 32 and sensor PCBA 34, resulting in reduced costs to produce the gas detection sensor arrangement 100.

[0134] Another advantage of ultrasonic or laser welding is that the assembly of the housing 10 can be automated, making the assembly process more accessible and enabling more scalable production, which results in a reduced overall cost of manufacturing the gas detection sensor arrangement 100. The simplified design of the housing 10 advantageously reduces the amount of time spent manufacturing each unit.

[0135] It should be noted that terms such as “comprising”, “containing”, “including”, “having” or “having” should be interpreted as not excluding other elements, elements or steps, and the word “a” or “one” should be interpreted as not excluding a plurality of elements, elements or steps.

[0136] While the application has been illustrated and described with reference to one or more particular embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application.

[0137] Cross Reference to Related Applications

[0138] This application claims priority to U.S. Patent Application No. 18 / 907,924, filed October 7, 2024, and U.S. Patent Application No. 19 / 262,689, filed July 8, 2025, the entire contents of which are incorporated herein by reference.

Claims

1. A gas detection sensor arrangement, comprising: It has a shell with a top and a bottom; Circuit board disposed within the housing; and A gas sensor is disposed within the housing and configured to detect gases in the environment outside the housing; The bottom and the top are connected together to seal the circuit board inside the housing.

2. The gas detection sensor arrangement according to claim 1, wherein the bottom and the top are joined together by means of ultrasonic welding or laser welding.

3. The gas detection sensor arrangement of claim 1, wherein the bottom and the top are connected together by means of mechanical fasteners, and wherein a sealing element is located between the bottom and the top.

4. The gas detection sensor arrangement according to claim 3, wherein the bottom and the top are connected by means of complementary snap-fit ​​elements.

5. The gas detection sensor arrangement of claim 1, wherein the bottom and the top are joined together by means of an adhesive.

6. The gas detection sensor arrangement of claim 1, wherein the housing includes an electrical connector opening and an electrical connector having an electrical connector adapter flange, wherein the electrical connector opening and the electrical connector adapter flange have opposing surfaces that are joined together to seal the electrical connector opening.

7. The gas detection sensor arrangement according to claim 6, wherein the electrical connector opening and the electrical connector adapter flange are connected together by means of ultrasonic welding or laser welding.

8. The gas detection sensor arrangement of claim 6, wherein the electrical connector opening and the electrical connector adapter flange are connected together by means of mechanical fasteners, and wherein a sealing element is located between the electrical connector opening and the electrical connector adapter flange.

9. The gas detection sensor arrangement according to claim 8, wherein the mechanical fastener comprises complementary snap-fit ​​elements.

10. The gas detection sensor arrangement of claim 6, wherein the electrical connector opening and the electrical connector adapter flange are joined together by means of an adhesive.

11. The gas detection sensor arrangement of claim 1, wherein the housing includes a gas sensor opening configured to allow gas from the environment outside the housing to reach the gas sensor, and wherein the housing biases the gas sensor toward the gas sensor opening to seal the gas sensor opening.

12. The gas detection sensor arrangement according to claim 1, wherein, One or more microcontrollers, relays, and / or switches are disposed on a first side of the circuit board, wherein the first side of the circuit board faces the top, wherein a gas sensor opening is provided in the bottom of the housing, the gas sensor opening being configured to allow gas from the environment outside the housing to reach the gas sensor, and wherein the gas sensor seals the gas sensor opening.

13. The gas detection sensor arrangement of claim 1 further includes a sealing member, wherein the housing includes a gas sensor opening configured to allow gas from the environment outside the housing to reach the gas sensor, and wherein the housing biases the gas sensor toward the gas sensor opening, thereby compressing the sealing member between the gas sensor and the housing to seal the gas sensor opening.

14. The gas detection sensor arrangement of claim 1, comprising a light guide for emitting a visible light signal, wherein the light guide seals the light guide opening in the housing.

15. The gas detection sensor arrangement of claim 1, wherein at least a portion of the wall of the housing is translucent or transparent, such that light emitted by a light source within the housing is visible from the outside of the housing.

16. The gas detection sensor arrangement of claim 1, wherein the bottom includes an opening with an edge profile, wherein the gas sensor protrudes through the opening, and wherein, The opening is sealed using a sealant between the edge contour and the gas sensor.

17. The gas detection sensor arrangement of claim 1, wherein the circuit board and connectors and / or cables are low-voltage encapsulated.

18. The gas detection sensor arrangement according to claim 6, The electrical connector opening and the electrical connector adapter flange are connected by laser welding using a laser beam, wherein one of the top or bottom components is provided with a material that allows the energy of the laser beam to be transmitted, and the other of the top or bottom component is provided with a material that allows the energy of the laser beam to be absorbed, and / or The electrical connector opening and the electrical connector adapter flange are connected together by laser welding using a laser beam, wherein one of the electrical connector opening and the electrical connector adapter flange is provided with a material that allows the energy of the laser beam to be transmitted, and wherein the other of the electrical connector opening and the electrical connector adapter flange is provided with a material that allows the energy of the laser beam to be absorbed.

19. The gas detection sensor arrangement according to claim 1, wherein at least one of the top and the bottom is provided with ribs.

20. The gas detection sensor arrangement of claim 1, wherein at least one of the top, the bottom, and the electrical connector housing contains a UV-resistant polymer.

21. The gas detection sensor arrangement of claim 1, wherein at least one of the top, the bottom, and the electrical connector housing contains a flame-retardant material having a minimum UL94 flammability rating of V0.

22. A method for assembling a gas detection sensor arrangement, the method comprising: The first part provides a housing for the arrangement of the gas detection sensor; The second part of the housing is provided for the arrangement of the gas detection sensor; Provide electrical connectors with electrical connector adapter flanges; The electrical connector adapter flange is connected to the electrical connector opening, which is located in one of the first portion or the second portion; A circuit board with a gas sensor is assembled onto the electrical connector, the gas sensor being disposed on the circuit board; as well as The first portion is connected to the second portion at the housing seam to seal the circuit board inside the housing.

23. The method of claim 22, wherein linking the first portion to the second portion comprises: Use ultrasonic welding or laser welding.

24. The method of claim 22, wherein linking the first portion to the second portion comprises: The method uses mechanical fasteners and further includes: providing a sealing element between the first part and the second part, wherein the sealing element is manually provided during assembly, or the sealing element is provided integrally with at least one of the first part and the second part.

25. The method of claim 24, wherein complementary snap-fit ​​elements are used to connect the first portion to the second portion.

26. The method of claim 22, wherein linking the first portion to the second portion comprises: The ultrasonic welding is used and an energy director is provided on one of the first or second portions to facilitate the ultrasonic welding, or the connection of the first portion to the second portion includes: using laser welding and providing a shear joint.

27. The method according to claim 22, further comprising: The sealing member is placed between the gas sensor and one of the first or second parts; and During the step of connecting the first part to the second part, the sealing member between the gas sensor and either the first part or the second part is compressed.

28. The method of claim 27, wherein the step of placing the sealing member between the gas sensor and one of the first or second portions comprises: The sealing member is placed around the gas sensor opening formed in one of the first portion or the second portion, and the gas sensor opening is sealed by the step of compressing the sealing member between the gas sensor and the first portion or the second portion during the step of connecting the first portion to the second portion.

29. The method of claim 22, wherein the step of connecting the electrical connector adapter flange to the electrical connector opening comprises: Use ultrasonic welding or laser welding.

30. The method of claim 22, wherein the step of connecting the electrical connector adapter flange to the electrical connector opening comprises: The method uses mechanical fasteners and also includes positioning and compressing a sealing element between the first portion and the bottom.

31. The method of claim 30, wherein complementary snap-fit ​​elements are used to connect the electrical connector adapter flange to the electrical connector opening.

32. The method according to claim 22, The step of linking the first part to the second part includes: The method employs ultrasonic welding and further includes: providing an energy conductor between the opposing surfaces of the first and second portions, causing the energy conductor to at least partially melt, and, as the energy conductor melts, bringing the opposing surfaces of the first and second portions together at the housing seam, and / or The step of connecting the electrical connector adapter flange to the electrical connector opening includes: using ultrasonic welding, and further includes: providing an energy conductor between the opposing surfaces of the electrical connector adapter flange and the electrical connector opening, such that the energy conductor is at least partially melted, and when the energy conductor melts, bringing the opposing surfaces of the electrical connector adapter flange and the electrical connector opening together.

33. The method according to claim 22, The step of linking the first part to the second part includes: Laser welding is performed using a laser beam, providing one of the top or bottom surfaces with a material that allows the energy of the laser beam to be transmitted, and providing the other of the top or bottom surfaces with a material that allows the energy of the laser beam to be absorbed, and / or The step of connecting the electrical connector opening and the electrical connector adapter flange includes: performing laser welding using a laser beam, providing one of the electrical connector opening and the electrical connector adapter flange with a material that allows the transmission of the energy of the laser beam, and providing the other of the electrical connector opening and the electrical connector adapter flange with a material that allows the absorption of the energy of the laser beam.

34. The gas detection sensor arrangement according to claim 1, wherein the circuit board and connector and / or cable are low-voltage encapsulated within a housing.

35. A method for assembling a gas detection sensor arrangement, the method comprising: Provide the first part of the casing; Provide a second part of the housing; A circuit board is arranged on one or more mounting surfaces of the first portion, the circuit board including a gas sensor; The circuit board is subjected to force toward the one or more mounting surfaces, thereby eliminating any gaps between the circuit board and the one or more mounting surfaces; as well as Solder the pins or terminals of the electrical connector to the circuit board; The stress on the circuit board occurs before and / or during the soldering process.

36. The method of claim 35, wherein applying force to the circuit board occurs during the soldering process.

37. The method of claim 35, further comprising: The first part and the second part are ultrasonically welded together.

38. The method of claim 37, wherein during the ultrasonic welding, the energy director of the first or second portion melts at least partially after receiving ultrasonic vibration.

39. The method of claim 35, further comprising: A sealing member is arranged between the gas sensor and the second part.

40. The method of claim 39, wherein the sealing member is an O-ring.

41. The method of claim 39, wherein the sealing member has a Shore A hardness of less than 80.

42. The method of claim 41, wherein the sealing member has a Shore A hardness of less than 60.

43. The method of claim 35, wherein after the soldering, the circuit board or one or more electronic components disposed on the circuit board are programmed.

44. A gas detection sensor arrangement, comprising: It has a shell with a top and a bottom; Circuit board disposed within the housing; A gas sensor is disposed within the housing and configured to detect gases in the environment outside the housing; and A sealing member having a Shore A hardness equal to or less than 80; The bottom defines a gas sensor opening, which is configured to allow gases from the environment outside the housing to reach the gas sensor. The sealing member is sealed between the gas sensor and the bottom to prevent water and / or dust from entering the housing from the environment.

45. The gas detection sensor arrangement according to claim 44, wherein the sealing member has a Shore A hardness in the range of 70 to 80.

46. ​​The gas detection sensor arrangement of claim 44, wherein the sealing member has a Shore A hardness in the range of 60 to 70.

47. The gas detection sensor arrangement according to claim 44, wherein the sealing member has a Shore A hardness in the range of 50 to 60.

48. The gas detection sensor arrangement according to claim 44, wherein the sealing member has a Shore A hardness in the range of 40 to 50.

49. The gas detection sensor arrangement according to claim 44, wherein the sealing member has a Shore A hardness of 40.

50. The gas detection sensor arrangement of claim 44, wherein the top and the bottom are connected to each other by ultrasonic welding.

Images