Micro-nano flexible structure transfer printing equipment and preparation method thereof

Abstract

The invention provides a micro-nano flexible structure transfer printing device and a preparation method thereof.A photoetching table, a developing box and a collecting table are arranged on a base at intervals, a photoetching unit comprises a laser head connected with a photoetching driving mechanism, and a carrying unit comprises a suction cup connected with a carrying driving mechanism; the transfer printing control unit is in control connection with the photoetching unit and the carrying unit, and is configured to drive a laser head to act through a photoetching driving mechanism so as to carry out photoetching treatment on photoresist placed on the photoetching table, and drive a suction cup to act through a carrying driving mechanism so as to carry out transfer printing on the photoresist on the photoetching table; and conveying the photoresist subjected to photoetching treatment to a developing box from the photoetching table for developing treatment, and then conveying the photoresist subjected to developing treatment to a collecting table from the developing box. According to the device and the method, the limitation of curved surface manufacturing and three-dimensional structure manufacturing of an optical photoetching process is solved, preparation of high-precision two-dimensional and three-dimensional multi-layer flexible structures on a curved surface or a flexible substrate is achieved, and the device and the method are suitable for batch production and have wide application prospects.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of micro-nano manufacturing technology, in particular to a micro-nano flexible structure transfer printing equipment and a preparation method thereof. BACKGROUND

[0002] Lithography technology is an extremely important micro-nano processing technology, which can realize the precise manufacturing of micron-level structures. This technology is widely used in integrated circuits, optical devices, display manufacturing, photovoltaic power generation, biochips and other fields, and plays a key role in promoting electronic technology progress and promoting the development of related industries.

[0003] The basic principle of lithography technology is to use the characteristics of light, through the steps of light source, mask, photosensitive material and development, to transfer the required pattern to the substrate to be processed. Light shines on the photosensitive material through the transparent area of the mask, causing chemical or physical changes, and then removing the unexposed photosensitive material through the development process to form the required pattern. However, lithography technology is mainly suitable for planar processing, and it is difficult to directly realize precise manufacturing of lithography patterns on curved surfaces or flexible substrates, so the applicability of lithography technology is limited in applications that require the manufacturing of micro-nano structures on curved surfaces or flexible substrates.

[0004] Transfer printing technology is an advanced process widely used in micro-nano device manufacturing. It uses a flexible stamp as an intermediary to orderly transfer the functional structures pre-prepared on the donor substrate to the receiver substrate, realizing the assembly of micro-nano devices. Transfer printing technology has excellent compatibility and can be combined with various processing technologies. Whether it is a simple nanowire, two-dimensional structure, or a complex three-dimensional multi-layer structure, transfer printing technology can achieve highly precise structure transfer and assembly. This makes transfer printing technology a flexible and powerful tool, providing strong support for the functional expansion of micro-nano devices and the expansion of application fields.

[0005] However, the current transfer printing technology is still in the experimental stage when applied to nanowires, two-dimensional, three-dimensional structures and other fields. At the same time, although optical lithography technology can achieve micron-level precision on a plane, for example, China's photolithography machine has relatively mature, which can be applied to 28 nanometer or 22 nanometer precision or even smaller size process. Conventional lithography technology can relatively easily achieve sub-micron precision, but when performing lithography on curved surfaces or flexible substrates, due to changes in light source focal points, uneven glue uniformity and a series of problems, it is impossible to achieve precise two-dimensional or three-dimensional structure manufacturing on curved surfaces or flexible substrates. SUMMARY

[0006] Therefore, the present application provides a micro-nano flexible structure transfer printing equipment and a preparation method thereof, which realizes the preparation of high-precision two-dimensional and three-dimensional multi-layer flexible structures on curved surfaces or flexible substrates, and solves the limitations of optical lithography process in curved surface manufacturing and three-dimensional structure manufacturing.

[0007] To achieve the above objectives, in a first aspect, the present invention provides a micro / nano flexible structure transfer device. A base is provided with a lithography stage, a developing chamber, and a collecting stage spaced apart. The lithography stage holds photoresist during the lithography process, the developing chamber contains developing solution, and the collecting stage holds the developed photoresist. The lithography unit includes a laser head connected to a lithography driving mechanism; the transport unit includes a suction cup connected to a transport driving mechanism; and a transfer control unit is controlled and connected to the lithography unit and the transport unit, configured to drive the laser head via the lithography driving mechanism to perform lithography on the photoresist placed on the lithography stage, and drive the suction cup via the transport driving mechanism to transport the lithographically processed photoresist from the lithography stage to the developing chamber for developing, and then transport the developed photoresist from the developing chamber to the collecting stage.

[0008] Furthermore, the photolithography driving mechanism includes a y-axis moving mechanism and an x-axis moving mechanism. The y-axis moving mechanism is mounted on the base and its output end is adjusted along the y-axis. The x-axis moving mechanism is mounted on the output end of the y-axis moving mechanism and its movable end is adjusted along the x-axis. The laser head is located at the output end of the x-axis moving base. The laser head is configured to selectively irradiate the photoresist on the photolithography stage by being driven by the y-axis moving mechanism and the x-axis moving mechanism.

[0009] Furthermore, the transport drive mechanism includes a rotary table and a lifting mechanism. The rotary table is mounted on a base and is rotatably adjustable about a vertical rotation axis. The lifting mechanism is mounted on the rotary table and arranged away from the vertical rotation axis of the rotary table. The movable end of the lifting mechanism extends downward and is connected to a suction cup. The suction cup is configured to move above the lithography stage, the developing cassette, and the collecting stage by being driven by the rotary table, and to move closer to and away from the lithography stage, the developing cassette, and the collecting stage by being driven by the lifting mechanism, so as to transport photoresist between the lithography stage, the developing cassette, and the collecting stage by the suction cup.

[0010] Furthermore, the photolithography stage is mounted on the base and driven by a rotation mechanism, rotating around a vertical central axis. The photolithography stage has two photoresist placement sections.

[0011] Furthermore, the laser head is equipped with an adjustable laser, a beam corrector, a beam shape setter, a light shield, a mask, and an objective lens. The adjustable laser emits laser light of a specific wavelength, the corrector keeps the laser beam parallel by adjusting the incident direction of the beam, the beam shape setter sets the beam to a circular, ring, or other shape, the light shield prevents the beam from illuminating areas outside the photoresist setting range, the mask forms a light source image, and the objective lens compensates for optical errors and proportionally reduces the circuit diagram.

[0012] Furthermore, the tunable laser is configured to emit laser light with a wavelength of -nm.

[0013] Furthermore, the laser head is also equipped with an energy controller and an energy detector. The energy controller controls the energy that is finally irradiated onto the photoresist to avoid underexposure or overexposure that would affect the imaging quality. The energy detector detects whether the final incident energy of the beam meets the exposure requirements and feeds it back to the energy controller for adjustment.

[0014] To achieve the above objectives, in a second aspect, the present invention provides a method for fabricating micro / nano flexible structures by transfer printing, comprising: S100. The photoresist is moved to the photolithography stage. The y-axis and x-axis moving mechanisms of the photolithography drive mechanism drive the laser head to selectively irradiate the photoresist on the photolithography stage. The photosensitive agent in the irradiated part of the photoresist will undergo a photochemical reaction. S200. The rotary table of the transport drive mechanism moves the suction cup above the photolithography stage. The lifting mechanism drives the suction cup to move vertically and pick up the photoresist to be photolithographically processed. The rotary table of the transport drive mechanism moves the suction cup above the developing tank. The lifting mechanism drives the suction cup to move the photoresist vertically into the developing tank for developing. The areas in the photoresist where the photosensitizer will undergo photochemical reaction react with the developing solution, and the pattern in the photoresist layer appears. S300. The rotary table of the transport drive mechanism moves the suction cup to above the collection platform, and the lifting mechanism drives the suction cup to move the photoresist vertically to the collection platform for collection. S400. Cycle through S100-S300 to perform photolithography, development and collection of photoresist in batches.

[0015] Furthermore, the lithography stage is configured to rotate after completing one lithography operation, the transport drive mechanism drives the chuck to pick up the photoresist, the lithography stage continues to rotate, and the laser head continues to perform a new lithography operation.

[0016] Furthermore, a mask of a circular hole model is placed in the laser head to increase the precision of the laser. The laser head is driven by a photolithography drive mechanism to selectively irradiate the photoresist on the photolithography stage according to the set model. The photosensitizer in the laser-irradiated part will undergo a photochemical reaction. The photosensitizer that has undergone a photochemical reaction dissolves in the developer, and the pattern in the photoresist is revealed.

[0017] The technical advantages of the micro / nano flexible structure transfer device and its preparation method provided by this invention are as follows: 1. The photolithography unit controls the photolithography process of the photoresist on the photolithography stage through the transfer control unit. The photoresist after photolithography is transported to the developing cassette for developing through the transport unit. After developing, it is transported to the collection stage for collection. The photoresist is picked up and released by a suction cup during the transport process. It is suitable for high-precision two-dimensional and three-dimensional multilayer flexible structures on curved or flexible substrates. The whole process is automated and suitable for mass production. 2. The photolithography stage is mounted on the base and driven by the rotation mechanism, rotating around the vertical central axis. The photolithography stage has two photoresist placement parts. During the transfer process, the photolithography stage is configured to rotate 90 degrees after completing one photolithography operation. The transport drive mechanism drives the chuck to pick up the photoresist. The photolithography stage continues to rotate 90 degrees, and the laser head continues to perform a new photolithography operation. This allows the photolithography process of one photoresist to be carried out simultaneously with the transport process of another photoresist, effectively improving the efficiency of the production process. 3. The mask is a photolithography mask, which is a relatively mature technology. It is easy to achieve submicron or even nanometer level precision, which can be suitable for products of different sizes. Moreover, the manufactured products are of high precision and easy to realize, effectively reducing product costs. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a three-dimensional structural diagram of the micro-nano flexible structure transfer device provided according to an embodiment of the present invention; Figure 2 This is a front view of the micro-nano flexible structure transfer device provided according to an embodiment of the present invention; Figure 3 This is a schematic diagram illustrating the composition and working principle of a laser head according to an embodiment of the present invention; Figure 4 This is a flowchart of a method for fabricating micro / nano flexible structures by transfer printing according to an embodiment of the present invention.

[0019] Explanation of reference numerals in the attached diagram: 1-Suction cup, 2-Laser head, 3-Moving block, 4-Lead screw, 5-Y-axis motor, 6-X-axis guide rail, 7-Y-axis guide rail, 8-Support base, 9-Collection stage, 10-Developing box, 11-Lithography stage, 12-Base, 13-Lead screw, 14-Lead screw motor, 15-Rotating stage, 16-Rotating axis, 17-Stepper motor, 18-Bevel gear, 19-Bearing, 20-Support plate, 21-Flange, 22-Bearing, 23-Stepper motor.

[0020] It should be understood that the dimensions of the various parts shown in the accompanying drawings are not drawn to actual scale. Furthermore, the same or similar reference numerals denote the same or similar components. Detailed Implementation

[0021] To enable the application of precise two-dimensional or three-dimensional structures on curved or flexible substrates, this invention develops a micro-nano flexible structure transfer device and its preparation method. Based on flexible photoresist materials, it combines micro-nano processing technology to fabricate high-density, high-resolution flexible micro-nano structures, overcoming the limitations of optical lithography in curved surface and three-dimensional structure manufacturing, and realizing the preparation of high-precision two-dimensional and three-dimensional multilayer flexible structures on curved or flexible substrates.

[0022] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are in no way intended to limit the present disclosure or its application or use. The present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps and the composition of materials set forth in these embodiments are merely exemplary and not intended to be limiting.

[0023] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are in no way intended to limit the invention or its application or use. The invention can be implemented in many different forms and is not limited to the embodiments described herein. The terms "first," "second," etc., used in the invention are for convenience of description and to distinguish different components with the same name, and do not indicate a sequential or primary / secondary relationship. In the present invention, when a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device. Example

[0024] like Figure 1 and Figure 2 As shown, this invention provides a micro / nano flexible structure transfer device. A base 12 is spaced apart by a lithography stage 11, a developing tank 10, and a collecting stage 9. The lithography stage 11 holds the photoresist used in the lithography process, the developing tank 10 contains the developing solution, and the collecting stage 9 holds the developed photoresist. The lithography unit includes a laser head 2 connected to a lithography driving mechanism. The transport unit includes a suction cup 1 connected to a transport driving mechanism. The transfer control unit is connected to the lithography unit and the transport unit and is configured to drive the laser head 2 via the lithography driving mechanism to perform lithography on the photoresist placed on the lithography stage 11, and drive the suction cup 1 via the transport driving mechanism to transport the lithographically processed photoresist from the lithography stage 11 to the developing tank 10 for development, and then transport the developed photoresist from the developing tank 10 to the collecting stage 9.

[0025] The photolithography driving mechanism includes a y-axis moving mechanism and an x-axis moving mechanism. The y-axis moving mechanism is mounted on the base and its output end is adjusted along the y-axis. The x-axis moving mechanism is mounted on the output end of the y-axis moving mechanism and its movable end is adjusted along the x-axis. The laser head is located at the output end of the x-axis moving base. The laser head 2 is configured to selectively irradiate the photoresist on the photolithography stage 11 by being driven by the y-axis moving mechanism and the x-axis moving mechanism.

[0026] The transport drive mechanism includes a rotary table 15 and a lifting mechanism. The rotary table 15 is mounted on the base 12 and is rotatably adjustable around a vertical rotation axis. The lifting mechanism is mounted on the rotary table 15 and arranged away from the vertical rotation axis of the rotary table. The movable end of the lifting mechanism extends downward and is connected to a suction cup 5. The suction cup 5 is configured to move above the photolithography stage 11, the developing cassette 10, and the collecting stage 9 via the rotary table drive, and to move closer to and away from the photolithography stage 11, the developing cassette 10, and the collecting stage 9 via the lifting mechanism drive, so as to transport photoresist between the photolithography stage 11, the developing cassette 10, and the collecting stage 9 via the suction cup 5.

[0027] The laser head 2 is equipped with an adjustable laser, a beam corrector, a beam shape setter, a light shield, a mask, and an objective lens. The adjustable laser emits laser light of a specific wavelength. The corrector keeps the laser beam parallel by adjusting the incident direction of the beam. The beam shape setter sets the beam to a circular, ring, or other shape. The light shield prevents the beam from illuminating areas outside the photoresist setting range. The mask forms a light source image, and the objective lens compensates for optical errors and scales down the circuit diagram proportionally.

[0028] Preferably, the tunable laser is configured to emit laser light with a wavelength of 300-500 nm.

[0029] like Figure 4 As shown, this invention provides a method for fabricating micro / nano flexible structures by transfer printing, using the provided micro / nano flexible structure transfer printing equipment, and the steps include: S100. The photoresist is moved to the photolithography stage 11. The y-axis moving mechanism and x-axis moving mechanism of the photolithography drive mechanism drive the laser head 2 to selectively irradiate the photoresist on the photolithography stage 11. The photosensitive agent of the irradiated part of the photoresist will undergo a photochemical reaction. S200. The rotary table 15 of the transport drive mechanism moves the suction cup 5 above the photolithography stage 11. The lifting mechanism drives the suction cup 5 to move vertically and pick up the photoresist to be photolithographically etched. The rotary table of the transport drive mechanism moves the suction cup 5 above the developing tank 10. The lifting mechanism drives the suction cup 5 to move the photoresist vertically into the developing tank 10 for developing. The areas in the photoresist where the photosensitive agent will undergo a photochemical reaction react with the developing solution, and the pattern in the photoresist layer appears. S300. The rotary table 15 of the transport drive mechanism drives the suction cup 5 to move above the collection platform 9, and the lifting mechanism drives the suction cup 5 to move the photoresist vertically to the collection platform 9 for collection. S400. Cycle through S100-S300 to perform photolithography, development and collection of photoresist in batches.

[0030] Based on this embodiment, the micro-nano flexible structure transfer equipment and its preparation method provided by the present invention control the photolithography unit to perform photolithography on the photolithography stage through the transfer control unit, transport the photolithography-treated photoresist to the developing cassette through the transport unit, and transport the developed photoresist to the collecting stage for development through the transport unit. The photoresist is then picked up and released using a suction cup. This method is suitable for high-precision two-dimensional and three-dimensional multilayer flexible structures on curved or flexible substrates. The entire process is automated, effectively improving product quality. Example

[0031] Based on Embodiment 1, the structure of the equipment is optimized. Specifically, the lithography stage 11 is rotatably mounted on the base around a vertical central axis and driven by a rotation mechanism. The lithography stage 11 has two photoresist placement sections. Specifically, the lithography stage is rotatably mounted on the base around a vertical central axis and driven by a rotation mechanism. The flange 21 is fixedly connected to the bottom of the lithography stage 11, and the bearing 22 of the flange 21 is fixed in the base 12. The motor shaft of the stepper motor 23 is connected to the flange 21. The transfer control mechanism controls the rotation of the lithography stage 11 by controlling the stepper motor 23.

[0032] During the transfer process, the photolithography stage 11 is configured to rotate 90 degrees after completing one photolithography operation. The transport drive mechanism drives the chuck 5 to pick up the photoresist, and the photolithography stage 11 continues to rotate 90 degrees, while the laser head 2 continues to perform a new photolithography operation.

[0033] Based on this embodiment, the photolithography stage is mounted on the base and driven by the rotation mechanism, rotating around the vertical central axis. Photoresist placement parts are respectively provided at both ends of the photolithography stage. During the transfer process, the photolithography process of one photoresist and the handling process of the other photoresist are carried out simultaneously, effectively improving the efficiency of the production process. Example

[0034] The laser head composition and working principle diagram are as follows: Figure 3 As shown, the main functions of each part are as follows: Table 1. Composition and Working Principle of the Laser Head Name Function Adjustable laser Light source, emitting laser at specific wavelength, around 405nm. Beam corrector Correct the direction of the light beam, making it as parallel as possible. Energy controller Control the energy of the final exposure on the wafer, under or over exposure will severely affect the quality of the image. Beam shape setter Set the shape of the beam, round, ring, etc. Different beam shape has different optical properties. Beam blocker Block the beam from exposing the photoresist when not needed. Energy detector Detect the final energy of the beam and feedback to the energy controller for adjustment. Reticle A glass plate with a pattern of round holes, forming the image of the very thin light source. Objective lens The objective lens is used to compensate for optical errors and scale down the circuit pattern. The photomask is a photolithography photomask. Domestic photomasks can achieve sub-micron precision, while imported photomasks can achieve nanometer precision. The digital micromirror device (DMD) chip currently has a precision of 5.4µm, achieved by foreign companies. Due to the low resolution and high cost of DMD chips, this technology uses photomask imaging to replace the DMD chip imaging currently proposed by researchers, further improving printing precision and enabling large-area and multi-scale printing from micro-nano to decimeter level scanning. Since DMD pixels are mostly 14μm×14μm or 16μm×16μm, further reducing their size using a scaling mirror to improve printing precision results in a smaller printing area. Therefore, printing large parts cannot meet the precision and size requirements. Photomask technology is relatively mature, and precision can easily reach sub-micron or even nanometer levels, effectively overcoming this limitation.

[0035] The laser head 2 is also equipped with an energy controller and an energy detector. The energy controller controls the energy that is finally irradiated onto the photoresist to avoid underexposure or overexposure that would affect the imaging quality. The energy detector detects whether the final incident energy of the beam meets the exposure requirements and feeds it back to the energy controller for adjustment.

[0036] A mask of a circular hole model is placed in the laser head 2 to increase the accuracy of the laser. The laser head is driven by the photolithography drive mechanism to selectively irradiate the photoresist on the photolithography stage 11 according to the set model. The photosensitive agent in the laser-irradiated part will undergo a photochemical reaction. The photosensitive agent that has undergone a photochemical reaction dissolves in the developer, and the pattern in the photoresist is revealed.

[0037] Based on Embodiment 3, the mask is a photolithography mask with a precision of submicron or nanometer level. The technology is relatively mature, and the precision can be easily achieved at the submicron or even nanometer level. It can be suitable for products of different sizes, and the manufactured products have high precision and are easy to realize, making them suitable for mass industrial production. Example

[0038] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, based on Embodiment 1, Embodiment 2, and Embodiment 3, this embodiment provides the following specific implementation method: This embodiment provides a micro-nano flexible curved surface structure transfer device. The support base 8 of the photolithography driving mechanism is fixedly connected to one side of the base 12. The y-axis guide rail 7 is fixedly connected to the support base 8. The y-axis motor 5 is driven by the y-axis lead screw 4. The x-axis guide rail 6 is meshed with the y-axis lead screw 4. The bottom groove of the x-axis guide rail 6 is slidably engaged with the y-axis guide rail 7. The x-axis motor is driven by the x-axis lead screw. The moving block 3 is meshed with the x-axis lead screw. The moving block 3 is slidably engaged with the x-axis guide rail 6. The laser head 2 is fixedly connected to the moving block 3.

[0039] The laser head 2 is driven by x-axis and y-axis lead screw motors. The y-axis motor 5 drives the lead screw 4 to move the x-axis guide rail 6 along the y-axis direction. The x-axis motor drives the lead screw to move the moving block 3 along the x-axis direction. By controlling the working state of the x-axis and y-axis lead screw motors, the laser head 2 can move in the x-axis and y-axis directions of the plane. The laser head 2 selectively irradiates the photoresist on the photolithography stage 11. The photosensitizer in the photoresist undergoes a photochemical reaction, which changes the chemical composition of the irradiated area of ​​the photoresist. These areas with changed chemical composition can be dissolved in a specific developing solution in the next step.

[0040] The support plate 20 of the transport drive mechanism is fixedly connected to the base 12. The bearing 19 is fixed to the upper end of the support plate 20. One end of the rotating shaft 16 is supported by the bearing 19, and the other end is fixedly connected to the rotating table 15. The driven bevel gear 18 is fixed to the rotating shaft 16. The stepper motor 17 is driven and connected to the driving bevel gear, and the driving bevel gear meshes with the driven bevel gear 18. The lead screw motor 14 is fixed to the upper end of the rotating table 15 and driven and connected to the Z-axis lead screw 13. The suction cup 1 is connected to the lower end of the lead screw 13. The lead screw motor 14 drives the Z-axis lead screw 13 to move up and down, thereby driving the suction cup 1 to move up and down. The suction cup 5 uses vacuum to achieve suction and release during the transport and migration process. The rotation of the rotating table 15 is achieved by controlling the working state of the stepper motor 17. The suction cup 5 controls the vacuum to achieve "picking up" and "putting down" during the transport and migration process. The lead screw motor 14 drives the lead screw 13 to move up and down, thereby achieving the up and down movement of the suction cup 1, and thus achieving the "picking up" and "putting down" of the photoresist.

[0041] The developer is contained within the developing tank 10, which is fixed to both sides of the lithography stage 11. After the laser head 2 completes one lithography operation on the lithography stage 11, the stage 11 rotates 90 degrees, and the transport device picks up the photoresist. The stage 11 then rotates another 90 degrees, and the laser head 2 continues to perform a new lithography operation. Simultaneously, the transport device lifts and lowers the photoresist into the developing tank 10. After the developer treats the photoresist, the pattern in the photoresist layer becomes visible. After development, the transport device transfers the photoresist to the collecting stage 9. This cycle repeats continuously. By rotating the lithography stage, lithography, development, and deposition are performed simultaneously, greatly increasing the lithography efficiency of the equipment. The collecting stage 9 is fixed to one side of the support plate 20.

[0042] The specific printing process is as follows: A mask of a circular hole model is placed in the laser head 2 of the device to increase the accuracy of the laser. By driving the x and y axis lead screw motors, the laser head selectively applies photoresist on the photolithography stage 11 according to the set model. In the photoresist, the photosensitizer in the laser-irradiated area undergoes a photochemical reaction, causing a change in the chemical composition of the irradiated area. Then, the stepper motor 23 drives the lithography stage 11 to rotate 90 degrees, and the lead screw motor 14 drives the chuck 5 to move up and down, "lifting" the laser-irradiated photoresist. The lithography stage 11 continues to rotate 90 degrees in the same direction. After rotation, the other end of the lithography platform rotates to directly below the laser head 2, continuing the new lithography process. Simultaneously, the lead screw motor drives the photoresist to be "placed" into the developing tank 10. The developing solution reacts with the irradiated area of ​​the photoresist; the area with the changed chemical composition dissolves in the specific developing solution, and the pattern in the photoresist layer becomes visible. The developed photoresist is then "removed" by the lead screw motor, and then the stepper motor 17 drives the bevel gear 18 to rotate the rotary table 15, thus "placing" the developed photoresist onto the collecting stage 9. This cycle of laser irradiation, lithography stage rotation, developing, and deposition repeats continuously, achieving the deposition and shaping of laser-printed micro / nano parts.

[0043] Import the pre-designed and sliced ​​3D model into the machine, select the desired model, and install the prepared photoresist on the lithography platform. Press start, and the laser head rotates back to the reference coordinate origin along the X and Y axes and the chuck's Z axis. The processor in the machine processes the model according to the settings. First, exposure occurs. The laser head emits light, selectively irradiating the photoresist. The photosensitizer in the photoresist undergoes a photochemical reaction, causing changes in the chemical composition of the irradiated area. Next, development occurs. The lithography stage rotates 90 degrees, and the chuck of the transport device "lifts" the photoresist from the lithography stage. The lithography stage continues to rotate 90 degrees, and the laser head performs new lithography work on the other side of the lithography stage. Simultaneously, the transport device lifts and lowers the photoresist into the developing solution. Areas with changed chemical composition dissolve in the developing solution, thus forming the lithographic pattern on the photoresist. By rotating the lithography stage and simultaneously developing and collecting, the lithography efficiency is greatly increased. Finally, after development, the transport device moves the photoresist to the collection stage. The machine's reference coordinate origin is the coordinated X, Y, and Z axes, which positions the laser head directly above the center of the lithography platform and the suction cup directly above the center of the developing plate.

[0044] Based on the above embodiments, a micro-nano flexible structure transfer device and its preparation method are provided, which realizes the preparation of high-precision two-dimensional and three-dimensional multilayer flexible structures on curved or flexible substrates, solves the limitations of optical lithography in curved surface manufacturing and three-dimensional structure manufacturing, and has broad application prospects.

[0045] The invention is intended to describe technical solutions, not to limit them. Although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. However, such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the invention.

Claims

1. A micro / nano flexible structure transfer device, characterized in that, include: The base (12) is provided with a photolithography stage (11), a developing box (10) and a collecting platform (9) at intervals. The photolithography stage (11) holds the photoresist during the photolithography process, the developing box (10) holds the developing solution, and the collecting platform (9) holds the photoresist after the developing process. The lithography unit includes a laser head (2) connected to the lithography driving mechanism. The conveying unit includes a suction cup (1) connected to the conveying drive mechanism; and The transfer control unit is connected to the lithography unit and the transport unit and is configured to drive the laser head (2) to perform lithography on the photoresist placed on the lithography stage (11) through the lithography drive mechanism, and drive the chuck (1) to transport the photoresist after lithography from the lithography stage (11) to the developing cassette (10) for developing, and then transport the photoresist after developing from the developing cassette (10) to the collecting stage (9).

2. The micro-nano flexible structure transfer equipment according to claim 1, characterized in that, The photolithography driving mechanism includes a y-axis moving mechanism and an x-axis moving mechanism. The y-axis moving mechanism is mounted on the base and its output end is adjusted along the y-axis. The x-axis moving mechanism is mounted on the output end of the y-axis moving mechanism and its movable end is adjusted along the x-axis. The laser head is located at the output end of the x-axis moving base. The laser head (2) is configured to selectively irradiate the photoresist on the photolithography stage (11) by being driven by the y-axis moving mechanism and the x-axis moving mechanism.

3. The micro-nano flexible structure transfer equipment according to claim 1, characterized in that, The transport drive mechanism includes a rotary table (15) and a lifting mechanism. The rotary table (15) is mounted on a base (12) and is rotatably adjusted about a vertical rotation axis. The lifting mechanism is mounted on the rotary table (15) and arranged away from the vertical rotation axis of the rotary table. The movable end of the lifting mechanism extends downward and is connected to a suction cup (5). The suction cup (5) is configured to move above the lithography stage (11), the developing cassette (10), and the collecting stage (9) driven by the rotary table, and to move closer to and away from the lithography stage (11), the developing cassette (10), and the collecting stage (9) driven by the lifting mechanism, so as to transport photoresist between the lithography stage (11), the developing cassette (10), and the collecting stage (9) by the suction cup (5).

4. The micro-nano flexible structure transfer equipment according to claim 1, characterized in that, The photolithography stage (11) is mounted on the base and driven by the rotation mechanism, rotating around the vertical central axis. The photolithography stage (11) has two photoresist placement parts.

5. The micro-nano flexible structure transfer equipment according to claim 1, characterized in that, The laser head (2) is equipped with an adjustable laser, a beam corrector, a beam shape setter, a light shield, a mask, and an objective lens. The adjustable laser emits laser light of a specific wavelength. The corrector keeps the laser beam parallel by adjusting the incident direction of the beam. The beam shape setter sets the beam to a circular, ring, or other shape. The light shield prevents the beam from irradiating areas outside the photoresist setting range. The mask is a photolithographic mask and forms a light source image. The objective lens compensates for optical errors and scales down the circuit diagram proportionally.

6. The micro-nano flexible structure transfer equipment according to claim 5, characterized in that, The tunable laser is configured to emit laser light with a wavelength of 300-500 nm.

7. The micro-nano flexible structure transfer device according to claim 5 or 6, characterized in that, The laser head (2) is also equipped with an energy controller and an energy detector. The energy controller controls the energy that is finally irradiated onto the photoresist to avoid underexposure or overexposure that would affect the imaging quality. The energy detector detects whether the final incident energy of the beam meets the exposure requirements and feeds it back to the energy controller for adjustment.

8. A method for fabricating micro / nano flexible structures by transfer printing, using the equipment described in any one of claims 1 to 7, characterized in that, include: S100. Move the photoresist to the photolithography stage (11). The y-axis moving mechanism and x-axis moving mechanism of the photolithography drive mechanism drive the laser head (2) to selectively irradiate the photoresist on the photolithography stage (11). The photosensitive agent of the irradiated part of the photoresist will undergo a photochemical reaction. S200. The rotary table (15) of the transport drive mechanism drives the suction cup (5) to move above the photolithography stage (11). The lifting mechanism drives the suction cup (5) to move vertically and pick up the photoresist to be photolithographically etched. The rotary table of the transport drive mechanism drives the suction cup (5) to move above the developing tank (10). The lifting mechanism drives the suction cup (5) to move the photoresist vertically into the developing tank (10) for developing. The photosensitive area in the photoresist will react with the developing solution, and the pattern in the photoresist layer will appear. S300. The rotary table (15) of the transport drive mechanism drives the suction cup (5) to move above the collection platform (9), and the lifting mechanism drives the suction cup (5) to move the photoresist vertically to the collection platform (9) for collection; S400. Cycle through S100-S300 to perform photolithography, development and collection of photoresist in batches.

9. The method for fabricating micro / nano flexible structures by transfer printing according to claim 8, characterized in that, The lithography stage (11) is configured to rotate 90 degrees after completing one lithography operation, and the transport drive mechanism drives the chuck (5) to pick up the photoresist. The lithography stage (11) continues to rotate 90 degrees, and the laser head (2) continues to perform a new lithography operation.

10. The method for fabricating micro / nano flexible structures by transfer printing according to claim 8, characterized in that, A mask of a circular hole model is placed in the laser head (2) to increase the accuracy of the laser. The laser head is driven by the photolithography drive mechanism to selectively irradiate the photoresist on the photolithography stage (11) according to the set model. The photosensitive part irradiated by the laser will undergo a photochemical reaction. The photosensitive part that has undergone a photochemical reaction dissolves in the developer, and the pattern in the photoresist is revealed.

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