A heat dissipating device for a semiconductor power device

Abstract

The application belongs to the technical field of processor heat dissipation, and discloses a heat dissipation device for a semiconductor power device, which comprises two processor heat fin assemblies and a central processor, the processor heat fin assemblies are arranged on a heat dissipation support arm assembly, the heat dissipation support arm assembly is linearly slidably arranged on a heat dissipation support frame assembly, the two processor heat fin assemblies timely lead out the heat of the central processor from both sides, and the heat is transmitted to the third and second heat dissipation fins through the first heat dissipation fin, so that the heat of the central processor is timely led out during heat dissipation, air is sent into the heat dissipation air chamber through the heat dissipation air inlet pipe, the air is guided and discharged through the heat dissipation air groove on the heat dissipation air chamber, the heat on the second heat dissipation fin is timely blown away, and the central processor is suspended and supported through the second heat dissipation fin and the third heat dissipation fin, so that the smooth discharge of the air flow is ensured when the heat dissipation air groove aerodynamically dissipates the heat of the second heat dissipation fin.

Description

Technical Field

[0001] This invention belongs to the field of processor heat dissipation technology, and specifically relates to a heat dissipation device for semiconductor power devices. Background Technology

[0002] Currently, most mainstream processor cooling solutions on the market are single-sided air-cooled or liquid-cooled heatsinks. These heatsinks typically only contact a single surface of the processor, usually the top, transferring heat from the processor to the heatsink body with its numerous fins via thermally conductive materials, and then using a fan to force convection and dissipate the heat into the air. However, this traditional solution has the following significant drawbacks: Heat dissipation bottleneck: Modern high-performance processors consume enormous amounts of power, and their heat sources are not concentrated solely on the top surface. Traditional single-sided cooling methods cannot effectively dissipate heat from both the top and bottom surfaces of the processor simultaneously. A large amount of heat accumulates on the uncooled side, causing heat buildup and resulting in persistently high chip junction temperatures, which becomes a limiting factor for improving processor performance.

[0003] Installation structure limitations: In most application scenarios, such as motherboard packaging, the bottom surface of the processor is directly soldered or mounted on the PCB board. This makes it impossible for traditional heat sinks to contact the bottom surface of the processor, completely abandoning the heat dissipation potential of the bottom surface and resulting in the overall heat dissipation efficiency not being maximized.

[0004] Contact pressure and uniformity issues: Existing heatsinks typically apply pressure using rigid fasteners or screws to ensure tight contact with the top surface of the processor. Uneven or excessive pressure can easily cause mechanical damage to the processor package itself, such as crushing. At the same time, the lack of elasticity in rigid contacts may create gaps during thermal expansion and contraction, affecting the continuous stability of heat conduction. Summary of the Invention

[0005] To address the problems mentioned in the background section, this invention provides a heat dissipation device for semiconductor power devices, which is convenient for heat dissipation and installation.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation device for semiconductor power devices, comprising two sets of processor heat sink assemblies and a central processing unit (CPU). The processor heat sink assemblies are mounted on a heat dissipation support arm assembly, which is linearly slidably mounted on a heat dissipation support frame assembly. The heat dissipation support frame assembly is provided with a bidirectional traction arm assembly that synchronously pulls the two sets of processor heat sink assemblies. The heat dissipation support frame assembly also contains a heat dissipation resistance drive assembly that provides driving force for the pulling of the bidirectional traction arm assembly. Through the pulling action of the bidirectional traction arm assembly, the two sets of processor heat sink assemblies form a self-clamping double-sided heat dissipation structure on both sides of the CPU. Through the overhead support of the two sets of processor heat sink assemblies on both sides of the CPU, an overhead heat dissipation structure is formed on both sides of the CPU.

[0007] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the processor heat sink assembly includes a thermally conductive heat sink base and a heat dissipation chamber. The thermally conductive heat sink base is provided with a heat dissipation air inlet pipe at one end, and a plurality of first heat dissipation fins are provided in the middle of the thermally conductive heat sink base. A third heat dissipation fin is provided on the top of the first heat dissipation fins, and second heat dissipation fins are provided on both sides of the third heat dissipation fins. The heat dissipation chamber has a hollow internal structure, and an air inlet is provided at one end of the heat dissipation chamber. A plurality of heat dissipation slots are provided on the top of the heat dissipation chamber, and a seat slot is provided in the center of the heat dissipation chamber.

[0008] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the heat dissipation support arm assembly includes a heat dissipation support cross arm, a cross arm end platform is fixedly provided at one end of the heat dissipation support cross arm, a cross arm vertical plate is fixedly provided at the bottom of the cross arm end platform, a cross arm guide plate is fixedly provided at the bottom of the cross arm vertical plate, and a plurality of cross arm vertical slots are provided on the heat dissipation support cross arm. The heat dissipation support frame assembly includes a heat dissipation support main frame. The top and bottom of one end of the heat dissipation support main frame are provided with grooved vertical arms, and a bearing is provided at the center of the other end of the heat dissipation support main frame. A guide rail square groove is opened on one side of the heat dissipation support main frame.

[0009] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the bidirectional traction arm assembly includes a traction arm shaft, a traction arm gear is provided in the middle of the traction arm shaft, and a traction convex arm is fixedly provided at the far end of the traction arm shaft. Both ends of the traction convex arm are rotatably provided with traction arm pull rods through bearings.

[0010] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the heat dissipation contact drive assembly includes a contact drive toothed arm, one end of which is fixedly provided with a contact drive end arm, the middle of which is fixedly provided with a contact drive square rod, and contact drive springs are fixedly provided at the top and bottom of the contact drive end arm.

[0011] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the second heat dissipation fins and the thermally conductive heat dissipation base are suspended. The heat dissipation air chamber is fixed on the top surface of the thermally conductive heat dissipation base. The first heat dissipation fins are disposed in the seat groove. The heat dissipation air inlet pipe is fixedly disposed at the air inlet position. Multiple heat dissipation air channels form a row and column arrangement on the heat dissipation air chamber. The second heat dissipation fins are cooled by wind-assisted cooling through the multiple heat dissipation air channels. The first heat dissipation fins pass through the heat dissipation support horizontal arm through the horizontal arm vertical slot. The heat dissipation support horizontal arm is located in the seat groove.

[0012] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the thermally conductive heat dissipation base plate abuts against the heat-generating surface of the central processing unit (CPU), and the heat from the CPU's heat-generating surface is transferred to the first heat dissipation fins through the thermally conductive heat dissipation base plate. The third heat dissipation fins and the two second heat dissipation fins on both sides form a complete heat dissipation fin structure, and the first heat dissipation fins transfer the heat conducted out by the thermally conductive heat dissipation base plate to the third heat dissipation fins and the second heat dissipation fins.

[0013] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the end of the traction arm shaft away from the traction convex arm is rotatably mounted on the heat dissipation support main frame via a bearing. Both the traction arm gear and the traction convex arm are mounted within the heat dissipation support main frame. The end of the traction arm pull rod away from the traction convex arm is rotatably mounted at the end of the horizontal arm end platform. The horizontal arm guide plate slides up and down within the grooved vertical arm. Through the sliding between the horizontal arm guide plate and the grooved vertical arm, the heat dissipation support arm assembly forms a linear sliding structure on the heat dissipation support frame assembly.

[0014] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the heat dissipation contact drive assembly is disposed inside the heat dissipation support main frame. The contact drive square rod slides through the heat dissipation support main frame via a guide rail square groove. One end of the contact drive spring is fixed to the contact drive end arm, and the other end of the contact drive spring is fixed to the inner wall of the heat dissipation support main frame near the guide rail square groove. The contact drive tooth arm and the traction arm gear are on the same longitudinal plane, and the contact drive tooth arm meshes with the traction arm gear.

[0015] In a preferred embodiment of a heat dissipation device for semiconductor power devices, the push of the abutment drive spring against the abutment drive end arm, in conjunction with the meshing and shifting of the abutment drive gear arm against the traction arm gear, causes the traction arm shaft to drive the traction cam arm to be in a clockwise rotation structure. The two sets of processor heat sink assemblies form a synchronous abutment clamping heat dissipation structure on both sides of the central processor. The heat dissipation air inlet pipe is connected to an external air supply device through a pipe.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. The present invention provides two sets of processor heat sink assemblies on both sides of the central processing unit. The heat from both sides of the central processing unit is dissipated in a timely manner through the two sets of processor heat sink assemblies, and the heat is transferred to the third and second heat sink fins through the first heat sink fins, so as to realize the timely dissipation of heat from the central processing unit. At the same time, air is sent into the heat dissipation chamber through the heat dissipation air slots on the heat dissipation chamber, and the air is guided and discharged through the heat dissipation air slots on the heat dissipation chamber, so as to blow away the heat on the second heat sink fins in a timely manner. Meanwhile, the central processing unit is suspended and supported by the second and third heat sink fins, so as to ensure the smooth discharge of airflow when the heat dissipation air slots aerodynamically dissipate heat from the second heat sink fins.

[0017] 2. The heat dissipation support frame assembly of the present invention is provided with a bidirectional traction arm assembly that synchronously pulls the two sets of processor heat sink assemblies. Through the pulling of the bidirectional traction arm assembly, the two sets of processor heat sink assemblies form a double-sided self-clamping heat dissipation structure on both sides of the central processing unit.

[0018] 3. The heat dissipation support frame assembly of the present invention is provided with a heat dissipation abutment drive assembly that provides driving force for the pulling of the bidirectional traction arm assembly. The traction arm provides continuous abutment pull force to the two sets of processor heat sink assemblies through the traction arm pull rod. At the same time, this driving force is converted by the elastic force of the abutment drive spring. Since the abutment drive spring has elastic buffering performance, the two sets of processor heat sink assemblies form a flexible abutment heat dissipation structure at both ends of the central processing unit. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 This is a perspective view of the processor heatsink assembly of the present invention; Figure 4 This is an exploded view of the processor heatsink assembly of the present invention; Figure 5 This is a perspective view of the heat dissipation support arm assembly and the heat dissipation support frame assembly of the present invention; Figure 6 This is a perspective view of the bidirectional traction arm assembly of the present invention; Figure 7 This is a perspective view of the heat dissipation and resistance drive component of the present invention.

[0020] In the diagram: 100, Processor heatsink assembly; 101, Thermal conductive heat dissipation base plate; 102, First heat dissipation fin; 103, Second heat dissipation fin; 104, Third heat dissipation fin; 105, Heat dissipation air inlet duct; 106, Seat slot; 107, Air inlet; 108, Heat dissipation air chamber; 109, Heat dissipation air duct; 200, Heat dissipation support arm assembly; 201, Heat dissipation support horizontal arm; 202, Horizontal arm vertical slot; 203, Horizontal arm end plate; 204, Horizontal arm vertical plate; 205, Horizontal arm guide plate; 3 00. Heat dissipation support frame assembly; 301. Heat dissipation support main frame; 302. Grooved vertical arm; 303. Bearing; 304. Guide rail square groove; 400. Bidirectional traction arm assembly; 401. Traction arm shaft; 402. Traction arm gear; 403. Traction convex arm; 404. Traction arm tie rod; 500. Heat dissipation contact drive assembly; 501. Contact drive gear arm; 502. Contact drive end arm; 503. Contact drive square rod; 504. Contact drive spring; 600. Central processing unit. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-7 As shown, the present invention provides a heat dissipation device for semiconductor power devices, including two sets of processor heat sink assemblies 100 and a central processing unit 600. The processor heat sink assemblies 100 are disposed on a heat dissipation support arm assembly 200, which is linearly slidably disposed on a heat dissipation support frame assembly 300. The heat dissipation support frame assembly 300 is provided with a bidirectional traction arm assembly 400 for synchronously pulling the two sets of processor heat sink assemblies 100, and the heat dissipation support frame assembly 300 is provided with a heat dissipation abutment drive assembly 500 that provides driving force for the pulling of the bidirectional traction arm assembly 400. Through the pulling of the bidirectional traction arm assembly 400, the two sets of processor heat sink assemblies 100 form a double-sided self-clamping heat dissipation structure on both sides of the central processing unit 600. Through the double-sided overhead support of the central processing unit 600 by the two sets of processor heat sink assemblies 100, the central processing unit 600 forms an overhead heat dissipation structure on both sides.

[0023] In a preferred embodiment, please refer to Figure 3 and Figure 4The processor heatsink assembly 100 includes a heat-conducting heat sink 101 and a heat dissipation chamber 108. The heat-conducting heat sink 101 has a heat dissipation air inlet pipe 105 at one end, and multiple first heat dissipation fins 102 are provided in the middle of the heat-conducting heat sink 101. A third heat dissipation fin 104 is provided on the top of the first heat dissipation fins 102. Second heat dissipation fins 103 are provided on both sides of the third heat dissipation fin 104. The heat dissipation chamber 108 has a hollow structure inside, and an air inlet 107 is provided at one end of the heat dissipation chamber 108. Multiple heat dissipation slots 109 are provided on the top of the heat dissipation chamber 108, and a seat slot 106 is provided in the center of the heat dissipation chamber 108.

[0024] In this embodiment, the second heat dissipation fin 103 and the heat-conducting heat dissipation base plate 101 are suspended structures.

[0025] In this embodiment, the heat dissipation chamber 108 is fixed to the top surface of the heat-conducting heat dissipation base plate 101, and the first heat dissipation fin 102 is disposed in the seat groove 106.

[0026] In this embodiment, the heat dissipation air inlet pipe 105 is fixedly installed at the air inlet 107.

[0027] In this embodiment, multiple heat dissipation slots 109 are arranged in a row and column structure on the heat dissipation chamber 108. The second heat dissipation fins 103 are cooled by wind-assisted heat dissipation through the multiple heat dissipation slots 109. The heat dissipation air inlet pipe 105 is connected to an external air supply device through a pipe.

[0028] In this embodiment, the first heat dissipation fin 102 passes through the heat dissipation support horizontal arm 201 via the horizontal arm vertical groove 202.

[0029] In this embodiment, the heat-conducting heat dissipation base 101 abuts against the heating surface of the central processing unit 600, and the heat of the heating surface of the central processing unit 600 is transferred to the first heat dissipation fin 102 through the heat-conducting heat dissipation base 101. The third heat dissipation fin 104 and the two second heat dissipation fins 103 on both sides form a complete heat dissipation fin structure. The first heat dissipation fin 102 transfers the heat conducted out by the heat-conducting heat dissipation base 101 to the third heat dissipation fin 104 and the second heat dissipation fins 103.

[0030] In a preferred embodiment, please refer to Figure 5 The heat dissipation support arm assembly 200 includes a heat dissipation support cross arm 201. A cross arm end platform 203 is fixedly provided at one end of the heat dissipation support cross arm 201. A cross arm vertical plate 204 is fixedly provided at the bottom of the cross arm end platform 203. A cross arm guide plate 205 is fixedly provided at the bottom of the cross arm vertical plate 204. A plurality of cross arm vertical slots 202 are provided on the heat dissipation support cross arm 201.

[0031] In this embodiment, the heat dissipation support cross arm 201 is located within the seat groove 106.

[0032] In this embodiment, two sets of processor heat sink assemblies 100 form a heat dissipation structure that synchronously abuts and clamps on both sides of the central processing unit 600.

[0033] In a preferred embodiment, please refer to Figure 5 The heat dissipation support frame assembly 300 includes a heat dissipation support main frame 301. The top and bottom of one end of the heat dissipation support main frame 301 are provided with grooved vertical arms 302, and the center of the other end of the heat dissipation support main frame 301 is provided with a bearing 303. A guide rail square groove 304 is opened on one side of the heat dissipation support main frame 301.

[0034] In a preferred embodiment, please refer to Figure 6 The bidirectional traction arm assembly 400 includes a traction arm shaft 401, a traction arm gear 402 is provided in the middle of the traction arm shaft 401, and a traction cam 403 is fixedly provided at the far end of the traction arm shaft 401. Both ends of the traction cam 403 are rotatably provided with traction arm tie rods 404 through bearings.

[0035] In this embodiment, the end of the traction arm shaft 401 away from the traction boom 403 is rotatably mounted on the heat dissipation support main frame 301 via a bearing 303.

[0036] In this embodiment, both the traction arm gear 402 and the traction cam 403 are disposed within the heat dissipation support main frame 301.

[0037] In this embodiment, the end of the traction arm lever 404 away from the traction arm 403 is rotatably disposed at the end of the cross arm end plate 203.

[0038] In this embodiment, the horizontal arm guide plate 205 slides up and down within the grooved vertical arm 302.

[0039] In this embodiment, the heat dissipation support arm assembly 200 forms a linear sliding structure on the heat dissipation support frame assembly 300 by sliding between the horizontal arm guide plate 205 and the slotted vertical arm 302.

[0040] In a preferred embodiment, please refer to Figure 7 The heat dissipation contact drive assembly 500 includes a contact drive toothed arm 501, a contact drive end arm 502 fixedly disposed at one end of the contact drive toothed arm 501, a contact drive square rod 503 fixedly disposed in the middle of the contact drive end arm 502, and contact drive springs 504 fixedly disposed at the top and bottom of the contact drive end arm 502.

[0041] In this embodiment, the heat dissipation abutment drive assembly 500 is disposed inside the heat dissipation support main frame 301.

[0042] In this embodiment, the abutting drive rod 503 slides through the guide rail groove 304 and the heat dissipation support main frame 301.

[0043] In this embodiment, one end of the abutment drive spring 504 is fixed to the abutment drive end arm 502, and the other end of the abutment drive spring 504 is fixed to the inner wall of the heat dissipation support main frame 301 near the guide rail square groove 304.

[0044] In this embodiment, the abutting drive gear 501 and the traction arm gear 402 are on the same longitudinal plane, and the abutting drive gear 501 and the traction arm gear 402 mesh.

[0045] In this embodiment, the push of the abutment drive spring 504 against the abutment drive end arm 502, combined with the meshing and actuation of the abutment drive gear arm 501 against the traction arm gear 402, causes the traction arm shaft 401 to drive the traction cam arm 403 to be in a clockwise rotation structure.

[0046] The working principle of this invention is as follows: When the existing central processing unit (CPU) 600 is used under high power conditions on both sides, if heat is not dissipated in time, heat will concentrate on one side. If this heat is not dissipated in time, the chip temperature will rise sharply, leading to performance degradation or frequency reduction, system instability, crashes, or even permanent damage. Furthermore, when the existing CPU 600 is installed and used, its bottom surface is in contact with the external electronic board, which further limits the heat dissipation efficiency. To overcome these problems, this invention provides two sets of processor heat sink assemblies 100 on both sides of the CPU 600, enabling heat dissipation through these two sets of heat sinks. The heat sink assembly 100 promptly dissipates heat generated on both sides of the central processing unit 600. Specifically, the processor heat sink assembly 100 is in close contact with the top or bottom surface of the central processing unit 600. At this time, the heat-conducting heat dissipation base 101 is tightly attached to the central processing unit 600. The heat-conducting heat dissipation base 101 transfers heat from the heat-generating surface of the central processing unit 600 to the first heat dissipation fin 102. The third heat dissipation fin 104 and the two second heat dissipation fins 103 on both sides form a complete heat dissipation fin structure. The first heat dissipation fin 102 transfers the heat dissipated by the heat-conducting heat dissipation base 101 to the third heat dissipation fin 104 and the second heat dissipation fins 103. The second heat dissipation fins 103 and the heat-conducting heat dissipation base 101... The structure between the two is suspended. The heat dissipation chamber 108 is fixed to the top surface of the heat-conducting heat dissipation base 101. The heat dissipation air inlet pipe 105 is fixed at the air inlet 107. Multiple heat dissipation air channels 109 are arranged in a row and column on the heat dissipation chamber 108. The multiple heat dissipation air channels 109 provide wind-assisted heat dissipation for the second heat dissipation fins 103. The heat dissipation air inlet pipe 105 is connected to an external air supply device through a pipe. In actual use, the heat of the central processing unit 600 is transferred to the first heat dissipation fin 102 through the heat-conducting heat dissipation base 101. The first heat dissipation fin 102 transfers the heat to the third heat dissipation fin 104 and the second heat dissipation fin 103. In this way, the central processing unit achieves heat dissipation. The heat from the CPU 600 is promptly dissipated during heat dissipation. Simultaneously, air is supplied to the heat dissipation chamber 108 through the heat dissipation inlet duct 105. The air is then guided and exhausted through the heat dissipation duct 109 on the heat dissipation chamber 108. In this way, the heat on the second heat dissipation fin 103 is promptly blown away. This method achieves timely heat dissipation and exhaust of the CPU 600. At the same time, the CPU 600 is suspended and supported by the second heat dissipation fin 103 and the third heat dissipation fin 104. This method avoids the heat from the CPU 600 surface from converging and concentrating. This suspended structure also ensures smooth airflow when the heat dissipation duct 109 aerodynamically cools the second heat dissipation fin 103.

[0047] Based on the above, in order to solve the problem of rapid contact and contact between the two sets of processor heat sink assemblies 100 on both sides of the central processing unit 600, the heat dissipation support frame assembly 300 of the present invention is provided with a bidirectional traction arm assembly 400 for synchronously pulling the two sets of processor heat sink assemblies 100. Through the pulling of the bidirectional traction arm assembly 400, the two sets of processor heat sink assemblies 100 form a double-sided self-clamping heat dissipation structure on both sides of the central processing unit 600. Specifically, the end of the traction arm shaft 401 away from the traction protruding arm 403 is rotatably mounted on the heat dissipation support main frame 301 through the bearing 303. The traction arm gear 402 and the traction protruding arm 403 are both mounted in the heat dissipation support main frame 301. The end of the traction arm pull rod 404 away from the traction protruding arm 403 is rotatably mounted at the end of the horizontal arm end platform 203. The horizontal arm guide plate 205 slides up and down in the grooved vertical arm 302. Through the sliding between the horizontal arm guide plate 205 and the grooved vertical arm 302, the heat dissipation support arm assembly 200 is mounted on the heat dissipation support frame assembly. A linear sliding structure is formed on the 300. In actual use, the clockwise rotation of the traction arm shaft 401 drives the traction convex arm 403 to rotate clockwise. At this time, the two arms of the traction convex arm 403 pull the processor heat sink assemblies 100 on the two sets of heat dissipation support arm assemblies 200 through the traction arm pull rod 404. At this time, the two sets of processor heat sink assemblies 100 are in a contacting and close structure. In this way, it is convenient for the two sets of processor heat sink assemblies 100 to quickly contact and fit together when dissipating heat at both ends of the central processing unit 600, and to fix the heat dissipation of the two sets of processor heat sink assemblies 100. At the same time, when the traction arm pull rod 404 pulls the heat dissipation support arm assembly 200, the horizontal arm guide plate 205 slides longitudinally in the grooved vertical arm 302. Through the linear insertion and sliding between the horizontal arm guide plate 205 and the grooved vertical arm 302, it is ensured that the two sets of processor heat sink assemblies 100 do not deviate when they are in contact and close together at both ends of the central processing unit 600.

[0048] Based on the above, in order to solve the driving force problem of the bidirectional traction arm assembly 400, the heat dissipation support frame assembly 300 of the present invention is provided with a heat dissipation abutment drive assembly 500 to provide driving force for the traction of the bidirectional traction arm assembly 400. Specifically, the heat dissipation abutment drive assembly 500 is disposed inside the heat dissipation support main frame 301. The abutment drive square rod 503 slides through the guide rail square groove 304 and the heat dissipation support main frame 301. One end of the abutment drive spring 504 is fixed to the abutment drive end arm 502, and the other end of the abutment drive spring 504 is fixed to the inner wall of the heat dissipation support main frame 301 near the guide rail square groove 304. The abutment drive gear arm 501 and the traction arm gear 402 are on the same longitudinal plane and mesh with each other. The abutment drive gear arm 501 and the traction arm gear 402 are engaged by the abutment drive spring 504 pushing the abutment drive end arm 502, which in turn engages the abutment drive gear arm 501 with the traction arm gear 402. When 02 engages, the traction arm shaft 401 drives the traction cam 403 to rotate clockwise. The two sets of processor heat sink assemblies 100 form a synchronously contacting and clamping heat dissipation structure on both sides of the central processing unit 600. Specifically, the elastic force of the contact drive spring 504 is converted into a pushing force on the contact drive gear 501. At this time, the contact drive gear 501 drives the traction arm gear 402 to mesh, so that the bidirectional traction arm assembly 400 is always in a clockwise rotation state. In this way, the traction cam 403 provides a continuous contact pulling force to the two sets of processor heat sink assemblies 100 through the traction arm pull rod 404. At the same time, this driving force is converted through the elastic force of the contact drive spring 504. Since the contact drive spring 504 has elastic buffering performance, the two sets of processor heat sink assemblies 100 form a flexible contact heat dissipation structure on both ends of the central processing unit 600.

[0049] It should be noted that this invention is used for heat dissipation of power devices with pins, but it is also applicable to heat dissipation of other power devices with pins.

[0050] In another embodiment of the present invention, when other pinned power devices or pinned central processing units have contact contacts at their bottom, the present invention can configure a set of processor heat sink assemblies 100 at the bottom as a U-shaped plate structure. At this time, the top processor heat sink assembly 100 and the bottom U-shaped plate are in an automatic clamping structure on the heat dissipation support frame assembly 300 through the action of the bidirectional traction arm assembly 400 and the heat dissipation contact drive assembly 500. At this time, the top processor heat sink assembly 100 elastically contacts the heating surface at the top of the central processing unit 600, and the bottom U-shaped plate contacts the lower end surface of the pins of the central processing unit 600. In this way, on the one hand, the contacts on the bottom end surface of the central processing unit 600 are exposed, and on the other hand, the elastic contact heat dissipation of the top processor heat sink assembly 100 is not affected, realizing the rapid heat dissipation assembly of the top processor heat sink assembly 100 on the power device. It should also be noted that the U-shaped plate structure is made of insulating material to avoid electrical connection of multiple pins on the central processing unit 600.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for semiconductor power devices, comprising two sets of processor heat sink assemblies (100) and a central processing unit (600), characterized in that: The processor heat sink assembly (100) is mounted on the heat dissipation support arm assembly (200). The heat dissipation support arm assembly (200) is linearly slidably mounted on the heat dissipation support frame assembly (300). The heat dissipation support frame assembly (300) is provided with a bidirectional traction arm assembly (400) that synchronously pulls the two sets of processor heat sink assemblies (100). The heat dissipation support frame assembly (300) is provided with a heat dissipation resistance drive assembly (500) that provides driving force for the pulling of the bidirectional traction arm assembly (400). Through the pulling of the bidirectional traction arm assembly (400), the two sets of processor heat sink assemblies (100) form a double-sided self-clamping heat dissipation structure on both sides of the central processor (600). Through the double-sided overhead support of the central processor (600) by the two sets of processor heat sink assemblies (100), the two sides of the central processor (600) form an overhead heat dissipation structure. The processor heat sink assembly (100) includes a thermally conductive heat sink base (101) and a heat dissipation chamber (108). The thermally conductive heat sink base (101) is provided with a heat dissipation air inlet pipe (105) at one end, and a plurality of first heat dissipation fins (102) are provided in the middle of the thermally conductive heat sink base (101). A third heat dissipation fin (104) is provided on the top of the first heat dissipation fins (102). A second heat dissipation fin (103) is provided on both sides of the third heat dissipation fin (104). The heat dissipation chamber (108) has a hollow structure inside, and an air inlet (107) is provided at one end of the heat dissipation chamber (108). A plurality of heat dissipation slots (109) are provided on the top of the heat dissipation chamber (108). A seat slot (106) is provided in the center of the heat dissipation chamber (108). The heat dissipation support arm assembly (200) includes a heat dissipation support cross arm (201), one end of which is fixedly provided with a cross arm end platform (203), the bottom of which is fixedly provided with a cross arm vertical plate (204), the bottom of which is fixedly provided with a cross arm guide plate (205), and a plurality of cross arm vertical slots (202) are provided on the heat dissipation support cross arm (201). The heat dissipation support frame assembly (300) includes a heat dissipation support main frame (301). The top and bottom of one end of the heat dissipation support main frame (301) are provided with grooved vertical arms (302), and the center of the other end of the heat dissipation support main frame (301) is provided with a bearing (303). A guide rail square groove (304) is opened on one side of the heat dissipation support main frame (301).

2. A heat sink for a semiconductor power device according to claim 1, wherein: The bidirectional traction arm assembly (400) includes a traction arm shaft (401), a traction arm gear (402) is provided in the middle of the traction arm shaft (401), and a traction arm (403) is fixedly provided at the far end of the traction arm shaft (401). Both ends of the traction arm (403) are rotatably provided with traction arm pull rods (404) through bearings.

3. A heat sink for a semiconductor power device according to claim 2, wherein: The heat dissipation contact drive assembly (500) includes a contact drive toothed arm (501), one end of which is fixedly provided with a contact drive end arm (502), a contact drive square rod (503) is fixedly provided in the middle of the contact drive end arm (502), and contact drive springs (504) are fixedly provided at the top and bottom of the contact drive end arm (502).

4. A heat dissipation device for semiconductor power devices according to claim 3, characterized in that: The second heat dissipation fin (103) and the heat-conducting heat dissipation base plate (101) are suspended structures. The heat dissipation air chamber (108) is fixed on the top surface of the heat-conducting heat dissipation base plate (101). The first heat dissipation fin (102) is set in the seat groove (106). The heat dissipation air inlet pipe (105) is fixed at the air inlet (107). Multiple heat dissipation air grooves (109) form a row and column arrangement on the heat dissipation air chamber (108). The second heat dissipation fin (103) is cooled by wind through multiple heat dissipation air grooves (109). The first heat dissipation fin (102) passes through the heat dissipation support horizontal arm (201) through the horizontal arm vertical groove (202). The heat dissipation support horizontal arm (201) is located in the seat groove (106).

5. A heat sink for a semiconductor power device according to claim 4, wherein: The heat-conducting heat dissipation plate (101) abuts against the heating surface of the central processing unit (600). The heat from the heating surface of the central processing unit (600) is transferred to the first heat dissipation fin (102) through the heat-conducting heat dissipation plate (101). The third heat dissipation fin (104) forms a complete heat dissipation fin structure with the two second heat dissipation fins (103) on both sides. The first heat dissipation fin (102) transfers the heat conducted out by the heat-conducting heat dissipation plate (101) to the third heat dissipation fin (104) and the second heat dissipation fins (103).

6. A heat sink for a semiconductor power device according to claim 5, wherein: The end of the traction arm shaft (401) away from the traction protrusion (403) is rotatably mounted on the heat dissipation support main frame (301) via a bearing (303). The traction arm gear (402) and the traction protrusion (403) are both located inside the heat dissipation support main frame (301). The end of the traction arm tie rod (404) away from the traction protrusion (403) is rotatably mounted at the end of the horizontal arm end platform (203). The horizontal arm guide plate (205) slides up and down inside the grooved vertical arm (302). Through the sliding between the horizontal arm guide plate (205) and the grooved vertical arm (302), the heat dissipation support arm assembly (200) forms a linear sliding structure on the heat dissipation support frame assembly (300).

7. A heat dissipation device for semiconductor power devices according to claim 6, characterized in that: The heat dissipation contact drive assembly (500) is disposed inside the heat dissipation support main frame (301). The contact drive square rod (503) slides through the heat dissipation support main frame (301) via the guide rail square groove (304). One end of the contact drive spring (504) is fixed on the contact drive end arm (502), and the other end of the contact drive spring (504) is fixed on the inner wall of the heat dissipation support main frame (301) near the guide rail square groove (304). The contact drive toothed arm (501) and the traction arm gear (402) are on the same longitudinal plane, and the contact drive toothed arm (501) and the traction arm gear (402) mesh.

8. A heat dissipation device for semiconductor power devices according to claim 7, characterized in that: The push of the abutment drive spring (504) against the abutment drive end arm (502), combined with the meshing and actuation of the abutment drive gear arm (501) against the traction arm gear (402), causes the traction arm shaft (401) to drive the traction cam arm (403) to be in a clockwise rotation structure. The two sets of processor heat sink assemblies (100) form a synchronous abutment clamping heat dissipation structure on both sides of the central processor (600). The heat dissipation air inlet pipe (105) is connected to the external air supply device through the pipe.

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