Server heat dissipation system and electronic equipment
By integrating temperature detection and signal processing modules into components that do not support SMBus, the problem of BMC's ineffective heat dissipation is solved, enabling precise data acquisition and closed-loop control of these components, thereby reducing overall power consumption and overheating risk.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-08
- Publication Date
- 2026-04-07
AI Technical Summary
In existing technologies, BMC cannot effectively dissipate heat from components that do not support SMBus, leading to system overheating and shutdown or increased overall power consumption.
By integrating temperature detection and signal processing modules onto components that do not support SMBus, temperature data is transmitted to the substrate management controller, dynamically adjusting the operating power of the heat dissipation module, thereby achieving precise acquisition and closed-loop control of these components.
It achieves effective heat dissipation for components that do not support SMBus, reduces the power consumption of the heat dissipation module, improves the overall energy efficiency, and avoids system overheating and shutdown.
Smart Images
Figure CN121807129A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of server technology, and more specifically, to a server heat dissipation system and electronic device. Background Technology
[0002] In server cooling systems, the BMC (Baseboard Management Controller) collects the temperature of key components in real time via SMBus (System Management Bus) and dynamically adjusts the fan speed based on the temperature data, thereby ensuring the continuous and stable operation of the system and preventing downtime caused by overheating.
[0003] However, under the existing speed control mechanism, the BMC can only implement closed-loop control for components that support temperature reporting via SMBus. If a high-power device cannot transmit temperature data via SMBus, it will be excluded from the speed control strategy. If this device operates at full load for an extended period, heat will accumulate rapidly, easily causing system crashes.
[0004] For components whose temperature cannot be read via SMBus, BMC typically adopts a "conservative" strategy, locking the fan at a high, constant speed. While this approach can prevent localized overheating to some extent, it leads to a significant increase in overall fan power consumption, resulting in both higher overall system energy consumption and operating costs.
[0005] In summary, how to effectively dissipate heat from components in servers that do not support SMBus is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0006] The purpose of this application is to provide a server heat dissipation system and electronic device to effectively dissipate heat from components in a server that do not support SMBus.
[0007] To achieve the above objectives, the technical solution adopted in this application is as follows: On the one hand, this application provides a server heat dissipation system, including: a server motherboard, a baseboard management controller, a heat dissipation module, a signal processing module, a temperature detection module, and a first type of component that does not support SMBus; The baseboard management controller, the heat dissipation module, and the signal processing module are all integrated on the server motherboard. The baseboard management controller is connected to the heat dissipation module and the signal processing module respectively. The signal processing module is also connected to the temperature detection module. The temperature detection module is disposed on the first type of component, and the first type of component is pluggable to the server motherboard. The signal processing module is used to process the signal detected by the temperature detection module to obtain the temperature data of the first type of component, and send it to the substrate management controller. The substrate management controller is used to adjust the operating power of the heat dissipation module according to the temperature data of the first type of components, so as to dissipate heat from the first type of components.
[0008] Furthermore, the server cooling system also includes a second type of component that supports SMBus; The second type of component is integrated into the server motherboard, and the second type of component is connected to the baseboard management controller via SMBus; The substrate management controller is used to read the temperature of the second type of component via SMBus and adjust the operating power of the heat dissipation module according to the temperature data of the second type of component to dissipate heat from the second type of component.
[0009] Furthermore, the heat dissipation module includes multiple fans; each fan is integrated into the server motherboard, and each fan is connected to the baseboard management controller; The substrate management controller is used to output a PWM signal to the first fan based on the temperature data of the first type of component, so as to adjust the speed of the first fan; wherein, the first fan is the fan closest to the location of the first type of component among a plurality of fans; The substrate management controller is further configured to output a PWM signal to the second fan based on the temperature data of the second type of component, so as to adjust the speed of the second fan; wherein the second fan is the fan closest to the location of the second type of component among a plurality of fans.
[0010] Furthermore, the first type of component is a network card or a GPU, and the second type of component is a CPU.
[0011] Furthermore, the temperature detection module is a thermocouple sensor, and the server motherboard also integrates a temperature sampling connector; The measuring end of the thermocouple sensor is located on the first type of component, and the reference end of the thermocouple sensor is connected to the signal processing module through the temperature sampling connector.
[0012] Furthermore, the signal processing module includes an amplifier circuit and an ADC circuit; Both the amplifier circuit and the ADC circuit are integrated on the server motherboard. The input terminal of the amplifier circuit is connected to the reference terminal of the thermocouple sensor, the output terminal of the amplifier circuit is connected to the input terminal of the ADC circuit, and the output terminal of the ADC circuit is connected to the baseboard management controller. The amplifier circuit is used to amplify the voltage signal generated by the thermocouple sensor and send it to the ADC circuit; The ADC circuit is used to convert the amplified analog voltage signal into a digital signal and send it to the substrate management controller; The substrate management controller is used to look up a resolution table based on the digital signal to convert the digital signal into a temperature value for the first type of component.
[0013] Furthermore, the server cooling system also includes a current sampling module; One end of the current sampling module is connected to the power supply of the first type of component, and the other end of the current sampling module is connected to the substrate management controller. The substrate management controller is used to read the current value of the power supply through the current sampling module, and adjust the operating power of the heat dissipation module according to the change of the current value.
[0014] Furthermore, the current sampling module is an electronic fuse or a sampling resistor.
[0015] Furthermore, the server cooling system also includes a noise detection module; The noise detection module is integrated into the server motherboard, is close to the heat dissipation module, and is connected to the baseboard management controller. The noise detection module is used to detect the actual noise of the heat dissipation module in real time and send it to the substrate management controller. The substrate management controller is used to reduce the operating power of the heat dissipation module when the actual noise exceeds a preset noise threshold, until the actual noise is lower than the preset noise threshold.
[0016] On the other hand, this application also provides an electronic device, which includes a server cooling system as described in any of the foregoing embodiments.
[0017] Compared with the prior art, this application has the following advantages: This application provides a server heat dissipation system and electronic device. The system includes: a server motherboard, a baseboard management controller, a heat dissipation module, a signal processing module, a temperature detection module, and a first type of component that does not support SMBus. The baseboard management controller, heat dissipation module, and signal processing module are all integrated into the server motherboard. The baseboard management controller is connected to both the heat dissipation module and the signal processing module. The signal processing module is also connected to the temperature detection module, which is mounted on the first type of component and is pluggably connected to the server motherboard. The signal processing module processes the signal detected by the temperature detection module to obtain temperature data of the first type of component and sends it to the baseboard management controller. The baseboard management controller adjusts the operating power of the heat dissipation module based on the temperature data of the first type of component to dissipate heat from the first type of component. By introducing the signal processing module and the temperature detection module, this application effectively incorporates the temperature information of the first type of component that does not support SMBus into the management system of the baseboard management controller. This design enables the baseboard management controller to dynamically adjust the operating power of the heat dissipation module based on the real-time temperature data of the first type of components. It achieves accurate acquisition and closed-loop control of the temperature of components without SMBus reporting capability, thereby reducing the power consumption of the heat dissipation module and improving the overall energy efficiency while ensuring the heat dissipation safety of the server system.
[0018] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0020] Figure 1 This is one of the structural schematic diagrams of a server heat dissipation system provided in an embodiment of this application; Figure 2 A circuit diagram of a signal processing module provided in an embodiment of this application; Figure 3 This is a second schematic diagram of a server heat dissipation system provided in an embodiment of this application; Figure 4 This is the third schematic diagram of a server heat dissipation system provided in an embodiment of this application.
[0021] Icons: 10 - Server cooling system; 100 - Server motherboard; 110 - Temperature sampling connector; 200 - Baseboard management controller; 300 - Cooling module; 400 - Signal processing module; 410 - Amplifier circuit; 420 - ADC circuit; 500 - Temperature detection module; 510 - Thermocouple sensor; 600 - Category I components; 700 - Category II components; 800 - Current sampling module; 900 - Noise detection module. Detailed Implementation
[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0023] In the description of this application, it should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The term "connection" should be interpreted broadly; for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0025] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0026] As described in the background section, under existing speed control mechanisms, the BMC can only implement closed-loop control for components that support temperature reporting via SMBus. If a high-power device cannot transmit temperature data via SMBus, it will be excluded from the speed control strategy. If this device operates at full load for an extended period, heat will accumulate rapidly, easily causing system crashes.
[0027] For components whose temperature cannot be read via SMBus, BMC typically adopts a "conservative" strategy, locking the fan at a high, constant speed. While this approach can prevent localized overheating to some extent, it leads to a significant increase in overall fan power consumption, resulting in both higher overall energy consumption and operating costs. Therefore, how to effectively dissipate heat from components in servers that do not support SMBus is a technical problem that urgently needs to be solved by those skilled in the art.
[0028] To resolve the above technical issues, please refer to Figure 1 This application provides a server heat dissipation system 10, including: a server motherboard 100, a baseboard management controller 200, a heat dissipation module 300, a signal processing module 400, a temperature detection module 500, and a first type of component 600 that does not support SMBus.
[0029] Optionally, the first type of component 600 is an external insertion device such as a network card or a GPU (Graphics Processing Unit).
[0030] The baseboard management controller 200, heat dissipation module 300, and signal processing module 400 are all integrated on the server motherboard 100. The baseboard management controller 200 is connected to the heat dissipation module 300 and the signal processing module 400, respectively. The signal processing module 400 is also connected to the temperature detection module 500, which is mounted on the first type of component 600 and is pluggably connected to the server motherboard 100.
[0031] The signal processing module 400 processes the signal detected by the temperature detection module 500 to obtain the temperature data of the first type of component 600, and sends it to the substrate management controller 200.
[0032] The substrate management controller 200 is used to adjust the operating power of the heat dissipation module 300 according to the temperature data of the first type of component 600, so as to dissipate heat from the first type of component 600.
[0033] Based on the above design, this application introduces a signal processing module 400 and a temperature detection module 500 to effectively incorporate the temperature information of the first type of component 600 that does not support SMBus into the unified management system of the substrate management controller 200. This design enables the substrate management controller 200 to dynamically adjust the operating power of the heat dissipation module 300 according to the real-time temperature data of the first type of component 600, realizing accurate acquisition and closed-loop control of the temperature of components without SMBus reporting capability. This significantly reduces the power consumption of the heat dissipation module 300 and improves the overall energy efficiency while ensuring the heat dissipation safety of the server system.
[0034] Furthermore, the server cooling system 10 also includes a second type of component 700 that supports SMBus. Optionally, the second type of component 700 may be on-board components such as a CPU (Central Processing Unit).
[0035] The second type of component 700 is integrated into the server motherboard 100, and the second type of component 700 is connected to the baseboard management controller 200 via SMBus.
[0036] The substrate management controller 200 is used to read the temperature of the second type of component 700 via SMBus and adjust the operating power of the heat dissipation module 300 according to the temperature data of the second type of component 700 in order to dissipate heat from the second type of component 700.
[0037] Therefore, it can be seen that for the second type of component 700 (such as CPU, memory, etc.) that supports SMBus, a temperature sensor is integrated inside, which can sense the real-time temperature of the second type of component 700. The board management controller 200 can directly read the digital temperature value of the second type of component 700 through the SMBus bus, and dynamically adjust the operating power of the heat dissipation module 300 according to the temperature value, thereby effectively dissipating heat from the second type of component 700.
[0038] For first-class components 600 that do not support SMBus (such as network cards, GPUs, etc.), a temperature detection module 500 is mounted on the first-class component 600 and connected sequentially to the signal processing module 400 and the baseboard management controller 200 on the server motherboard 100. This allows the temperature of the first-class component 600 to be collected, converted, and transmitted to the baseboard management controller 200. The baseboard management controller 200 dynamically adjusts the operating power of the heat dissipation module 300 according to the temperature of the first-class component 600, thereby achieving closed-loop heat dissipation control of "load changes, temperature is known, heat dissipation follows". That is, this application incorporates the first-class component 600 that does not support SMBus into the dynamic heat dissipation strategy, achieving the same closed-loop heat dissipation control as the second-class component 700 that supports SMBus, thus filling the gap in temperature sensing for components without SMBus temperature interfaces. This application breaks the absolute dependence of the baseboard management controller 200 on the SMBus protocol. Through the dual-mode temperature acquisition scheme of the first type of component 600 and the second type of component 700, the coverage of heat dissipation management is extended to all key heat-generating components of the server.
[0039] For the Type 1 component 600 that does not support SMBus, please refer to [link to relevant documentation] for a better understanding of its heat dissipation control method. Figure 2 and Figure 3 In one alternative implementation, the temperature detection module 500 is a thermocouple sensor 510, and the server motherboard 100 also integrates a temperature sampling connector 110.
[0040] The measuring end of the thermocouple sensor 510 is located on the first type of component 600, and the reference end of the thermocouple sensor 510 is connected to the signal processing module 400 through the temperature sampling connector 110.
[0041] Understandably, in this application, the measuring end (i.e., the hot end) of the surface-insulated thermocouple sensor 510 is attached to the surface of the housing of the first type of component 600 or near its main control chip on a single board, and the reference end (i.e., the cold end) of the thermocouple sensor 510 is connected to the signal processing module 400 through the temperature sampling connector 110 on the server motherboard 100. Because the thermocouple sensor 510 has surface insulation characteristics, it does not affect electrical performance and can sense the housing temperature in real time as the load increases, generating a microvolt-level voltage signal and sending it to the signal processing module 400.
[0042] Furthermore, in another alternative embodiment, the signal processing module 400 includes an amplifier circuit 410 and an ADC circuit 420.
[0043] The amplifier circuit 410 and the ADC circuit 420 are both integrated on the server motherboard 100. The input terminal of the amplifier circuit 410 is connected to the reference terminal of the thermocouple sensor 510, the output terminal of the amplifier circuit 410 is connected to the input terminal of the ADC circuit 420, and the output terminal of the ADC circuit 420 is connected to the baseboard management controller 200.
[0044] The amplifier circuit 410 is used to amplify the voltage signal generated by the thermocouple sensor 510 and send it to the ADC circuit 420.
[0045] The ADC circuit 420 is used to convert the amplified analog voltage signal into a digital signal and send it to the board management controller 200.
[0046] The substrate management controller 200 is used to look up a resolution table based on the digital signal to convert the digital signal into a temperature value for the first type of component 600.
[0047] Understandably, the entire temperature acquisition process for the first type of component 600 is as follows: When the housing temperature of the first type of component 600 changes, a voltage difference is generated across the thermocouple sensor 510. The amplifier circuit 410 amplifies the microvolt-level voltage signal, and the ADC circuit 420 converts the amplified analog voltage signal into a digital signal and sends it to the substrate management controller 200. The substrate management controller 200 converts the digital signal into a temperature value according to the calibration table (i.e., the voltage-temperature lookup table), and dynamically adjusts the operating power of the heat dissipation module 300 according to the temperature value, thereby effectively dissipating heat from the first type of component 600 in the server that does not support SMBus.
[0048] Further, please refer to Figure 3 In another alternative implementation, the heat dissipation module 300 includes multiple fans. Each fan is integrated onto the server motherboard 100 and is connected to the baseboard management controller 200.
[0049] The baseboard management controller 200 outputs a PWM signal to the first fan based on the temperature data of the first type of component 600 to adjust the speed of the first fan. At this time, the first fan is the fan closest to the first type of component 600 among multiple fans.
[0050] For example, assuming the heat dissipation module 300 includes five fans (i.e., fans 0-4) and the number of first-type components 600 is two (i.e., the network card and the GPU), each first-type component 600 is equipped with a thermocouple sensor 510, and each thermocouple sensor 510 is connected to the temperature sampling connector 110 on the server motherboard 100. When the baseboard management controller 200 detects that the network card temperature is too high through the "ADC circuit + amplifier circuit + thermocouple sensor" temperature measurement link, the baseboard management controller 200 outputs a PWM signal to fan 0 to increase the speed of fan 0, thereby providing precise heat dissipation for the network card. Here, fan 0 is the first fan among the multiple fans that is closest to the network card.
[0051] Similarly, when the baseboard management controller 200 detects that the GPU temperature is too high through the temperature measurement link of "ADC circuit + amplifier circuit + thermocouple sensor", the baseboard management controller 200 outputs a PWM signal to fan 4 to precisely cool the GPU. At this time, fan 4 is the first fan among multiple fans that is closest to the GPU.
[0052] The baseboard management controller 200 is also used to output a PWM signal to the second fan based on the temperature data of the second type of component 700, so as to adjust the speed of the second fan. The second fan is the fan closest to the second type of component 700 among multiple fans.
[0053] For example, assume that there are two second-type components 700 (i.e., CPU0 and CPU1). When the baseboard management controller 200 detects that the CPU0 temperature is too high via SMBus, the baseboard management controller 200 outputs a PWM signal to fan 1 to increase the speed of fan 1, thereby providing precise heat dissipation for CPU0. At this time, fan 1 is the second fan among the multiple fans that is closest to the CPU0.
[0054] Similarly, when the baseboard management controller 200 detects that the CPU1 temperature is too high via SMBus, the baseboard management controller 200 outputs a PWM signal to the fan 3 to precisely cool the CPU1. At this time, the fan 3 is the second fan closest to the CPU1 among the multiple fans.
[0055] Based on the above design, by integrating multiple fans on the server motherboard 100 to form a heat dissipation module 300, and connecting all fans to the baseboard management controller 200, the speed of the corresponding fan is increased when the temperature of a critical component in the server system is abnormal, so as to accurately dissipate heat from the component, thereby improving local heat dissipation efficiency and effectively reducing the overall energy consumption of the system.
[0056] Furthermore, due to the temperature response delay of components after a sudden increase in current, existing solutions can only adjust the speed "after the fact" and cannot suppress thermal spikes in advance, which leads to the risk of instantaneous overheating of the system. This not only affects the reliability of the hardware, but also limits the energy efficiency optimization of the heat dissipation system.
[0057] In view of this, please refer to Figure 4 In one optional implementation, the server cooling system 10 further includes a current sampling module 800. Optionally, the current sampling module 800 is an electronic fuse or a sampling resistor.
[0058] One end of the current sampling module 800 is connected to the power supply of the first type of component 600, and the other end of the current sampling module 800 is connected to the substrate management controller 200.
[0059] The baseboard management controller 200 is used to read the current value of the power supply through the current sampling module 800 and adjust the operating power of the heat dissipation module 300 according to the change of the current value.
[0060] Understandably, the baseboard management controller 200 can monitor the power supply current of the first type of component 600 in real time through the current sampling module 800, thereby enabling advanced prediction of the component's temperature rise trend. Based on this prediction, the baseboard management controller 200 can adjust the heat dissipation strategy in advance before the temperature rises significantly. This not only ensures the stable operation of the components under high load, enabling them to perform at a higher performance, but also prevents the heat dissipation module 300 (such as a fan) from suddenly accelerating in response to a rapid temperature rise, thereby effectively reducing server operating noise.
[0061] Based on the above design, the entire workflow of the server cooling system 10 provided in this application embodiment is as follows: After the server is powered on, the baseboard management controller 200 reads the transient current of the current sampling module 800 in real time. When a sudden increase in current is detected, the baseboard management controller 200 slowly increases the speed of the corresponding fan in advance, so that the components start cooling in advance. When the current decreases, the baseboard management controller 200 slowly decreases the speed of the corresponding fan. This current detection mechanism runs in parallel with the dual-mode temperature control detection throughout the process, together forming a dual-loop coordinated speed regulation strategy of "power consumption feedforward + temperature feedback", which can reduce the noise of the whole machine while suppressing the heat generated by the components in advance.
[0062] In addition, to further reduce server operating noise, in another optional implementation, the server cooling system 10 also includes a noise detection module 900.
[0063] The noise detection module 900 is integrated on the server motherboard 100, close to the heat dissipation module 300, and connected to the baseboard management controller 200.
[0064] The noise detection module 900 is used to detect the actual noise of the heat dissipation module 300 in real time and send it to the baseboard management controller 200.
[0065] The baseboard management controller 200 is used to reduce the operating power of the heat dissipation module 300 when the actual noise exceeds a preset noise threshold, until the actual noise is lower than the preset noise threshold.
[0066] Optionally, the heat dissipation module 300 includes multiple fans integrated on the server motherboard 100, and the noise detection module 900 includes multiple noise sensors integrated on the server motherboard 100.
[0067] The number of noise sensors is the same as the number of fans. Each noise sensor is located near its corresponding fan, and all noise sensors are connected to the baseboard management controller 200. Through this one-to-one configuration, the baseboard management controller 200 can accurately acquire the operating noise of each fan and independently adjust its speed. This allows for the construction of a precise closed-loop noise reduction mechanism for each fan while meeting heat dissipation requirements, achieving a dynamic balance between heat dissipation performance and quiet operation.
[0068] Furthermore, this application also provides an electronic device that includes a server cooling system 10 as described in any of the foregoing embodiments.
[0069] In summary, this application provides a server cooling system and electronic device. By constructing a temperature measurement link of "ADC circuit + amplifier circuit + thermocouple sensor," the management blind spot of not being able to participate in fan speed control due to the lack of an SMBus temperature interface is effectively filled. This allows the temperature of the first type of components that do not support SMBus to be injected into the fan speed control strategy of the board management controller in real time, avoiding the decrease in overall power consumption caused by constant fan speed. In addition, by adding a current sampling module, advanced monitoring of component power consumption can be achieved, giving the system a "pre-intervention" pre-cooling capability. By adding a noise detection module, a direct correlation between fan speed and noise level can be established, ultimately achieving a dynamic balance between effective heat dissipation and quiet operation.
[0070] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0071] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A server cooling system, characterized in that, include: Server motherboard, baseboard management controller, heat dissipation module, signal processing module, temperature detection module, and Class 1 components that do not support SMBus; The baseboard management controller, the heat dissipation module, and the signal processing module are all integrated on the server motherboard. The baseboard management controller is connected to the heat dissipation module and the signal processing module respectively. The signal processing module is also connected to the temperature detection module. The temperature detection module is disposed on the first type of component, and the first type of component is pluggable to the server motherboard. The signal processing module is used to process the signal detected by the temperature detection module to obtain the temperature data of the first type of component, and send it to the substrate management controller. The substrate management controller is used to adjust the operating power of the heat dissipation module according to the temperature data of the first type of components, so as to dissipate heat from the first type of components.
2. The server cooling system according to claim 1, characterized in that, The server cooling system also includes a second type of component that supports SMBus; The second type of component is integrated into the server motherboard, and the second type of component is connected to the baseboard management controller via SMBus; The substrate management controller is used to read the temperature of the second type of component via SMBus and adjust the operating power of the heat dissipation module according to the temperature data of the second type of component to dissipate heat from the second type of component.
3. The server heat dissipation system according to claim 2, characterized in that, The heat dissipation module includes multiple fans; each fan is integrated into the server motherboard and each fan is connected to the baseboard management controller; The substrate management controller is used to output a PWM signal to the first fan based on the temperature data of the first type of component, so as to adjust the speed of the first fan; wherein, the first fan is the fan closest to the location of the first type of component among a plurality of fans; The substrate management controller is further configured to output a PWM signal to the second fan based on the temperature data of the second type of component, so as to adjust the speed of the second fan; wherein the second fan is the fan closest to the location of the second type of component among a plurality of fans.
4. The server cooling system according to claim 2, characterized in that, The first type of component is a network card or a GPU, and the second type of component is a CPU.
5. The server cooling system according to claim 1, characterized in that, The temperature detection module is a thermocouple sensor, and the server motherboard also integrates a temperature sampling connector. The measuring end of the thermocouple sensor is located on the first type of component, and the reference end of the thermocouple sensor is connected to the signal processing module through the temperature sampling connector.
6. The server cooling system according to claim 5, characterized in that, The signal processing module includes an amplifier circuit and an ADC circuit; Both the amplifier circuit and the ADC circuit are integrated on the server motherboard. The input terminal of the amplifier circuit is connected to the reference terminal of the thermocouple sensor, the output terminal of the amplifier circuit is connected to the input terminal of the ADC circuit, and the output terminal of the ADC circuit is connected to the baseboard management controller. The amplifier circuit is used to amplify the voltage signal generated by the thermocouple sensor and send it to the ADC circuit; The ADC circuit is used to convert the amplified analog voltage signal into a digital signal and send it to the substrate management controller; The substrate management controller is used to look up a resolution table based on the digital signal to convert the digital signal into a temperature value for the first type of component.
7. The server cooling system according to claim 1, characterized in that, The server cooling system also includes a current sampling module; One end of the current sampling module is connected to the power supply of the first type of component, and the other end of the current sampling module is connected to the substrate management controller. The substrate management controller is used to read the current value of the power supply through the current sampling module, and adjust the operating power of the heat dissipation module according to the change of the current value.
8. The server cooling system according to claim 7, characterized in that, The current sampling module is an electronic fuse or a sampling resistor.
9. The server cooling system according to claim 1, characterized in that, The server cooling system also includes a noise detection module; The noise detection module is integrated into the server motherboard, is close to the heat dissipation module, and is connected to the baseboard management controller. The noise detection module is used to detect the actual noise of the heat dissipation module in real time and send it to the substrate management controller. The substrate management controller is used to reduce the operating power of the heat dissipation module when the actual noise exceeds a preset noise threshold, until the actual noise is lower than the preset noise threshold.
10. An electronic device, characterized in that, The electronic device includes the server cooling system as described in any one of claims 1-9.