Hard disk heat dissipation structure and system

Abstract

The invention relates to a hard disk heat dissipation structure and system.The hard disk heat dissipation structure is installed in a case and conducts heat dissipation on a hard disk arranged in a disk box, and the hard disk is arranged in the disk box in an inserted connection mode; the hard disk heat dissipation structure comprises a heat conduction plate, a cold plate and a medium pipeline, the disc boxes are stacked and arranged between the heat conducting plates in a drawing and inserting manner, and heat pipes are arranged on the heat conducting plates; the cold plate is arranged between the heat conducting plates and is inserted into at least one part of the heat conducting plates; the medium pipeline is connected to the cold plate and is used for introducing a heat dissipation medium into / out of the pipeline in the cold plate; and the heat conduction pad is arranged in the lamination gap and / or the insertion gap. According to the heat dissipation structure and the heat dissipation system of the hard disk, the composition of the heat dissipation structure can be simplified, pulling and inserting installation of the disk box single bodies in the heat dissipation structure can be achieved, and then the use requirement and the high maintainability requirement of the server hard disk can be met.

Description

Technical Field

[0001] This application relates to the field of server hardware heat dissipation technology, and more specifically, to a hard disk heat dissipation structure and system. Background Technology

[0002] Servers are a crucial infrastructure in the digital age. The normal operation of servers depends on the collaborative work of various hardware and software systems. Hard drives are an important component of server hardware, and their pluggable and high maintainability requirements pose certain challenges to their heat dissipation solutions.

[0003] Traditional hard drive cooling solutions are mostly air cooling, while some fully liquid-cooled models use liquid cooling solutions for the hard drives. Air cooling solutions have limitations such as noise, dust accumulation, and limited heat dissipation, while existing liquid cooling solutions usually involve attaching a cold plate to the hard drive through a thermal interface material. The general approach is to pre-install a single cold plate in the hard drive bay of the chassis, covering the entire hard drive. This approach generally suffers from problems such as taking up more space, being heavier, having more complex assembly, and being more cumbersome to maintain. Summary of the Invention

[0004] The purpose of this application is to provide a heat dissipation structure and system suitable for server hard drives, so as to solve the problems existing in the traditional cold plate heat dissipation method.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a hard disk heat dissipation structure, which is installed in a computer case and dissipates heat from the hard disk disposed in a disk enclosure, wherein the hard disk is plugged into and disposed in the disk enclosure; The hard drive heat dissipation structure includes a heat-conducting plate, a cold plate, and media pipelines; The trays are removably stacked between the heat-conducting plates, and heat pipes are provided on the heat-conducting plates. The cold plate is disposed between the heat-conducting plates and is inserted into at least a portion of the heat-conducting plates. The medium pipeline is connected to the cold plate and the heat dissipation medium is introduced / exported into the pipeline inside the cold plate. And, thermal pads disposed in the stacking gaps and / or plug gaps.

[0006] In an optional embodiment, a groove is provided on the top and / or bottom wall of the heat-conducting plate, and the heat pipe is embedded in the groove; The heat pipe includes a closed-structure hollow copper tube with a capillary structure inside and filled with a working fluid capable of phase change. The hollow copper tube has a flat tube structure, and its circumferential tube walls are respectively attached to the surface of the settling tank.

[0007] In an optional embodiment, the heat-conducting plate and the tray are alternately stacked, the heat-conducting pad includes a first heat-conducting pad disposed between the tray and the heat-conducting plate, and the tray is removably installed between the heat-conducting plates; The first thermal pad includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is attached to the surface of the thermal plate, and the wear-resistant and scratch-resistant surface faces the wall of the tray.

[0008] In an optional embodiment, the heat-conducting plate is provided with a slot, which allows the heat-conducting plate to be inserted into the cold plate; The slot and the cold plate are respectively provided with positioning parts, and the positioning parts include positioning grooves and positioning protrusions that can be correspondingly matched.

[0009] In an optional embodiment, the slot includes a closed slot disposed in the center of the heat-conducting plate, the length of which is less than or equal to the length of the cold plate.

[0010] In an optional embodiment, the positioning protrusion is disposed on the heat-conducting plate, and the two sides of the slot are constructed as centered protruding protrusion structures; The positioning groove includes multiple pairs spaced apart on the cold plate, each pair including a recessed groove structure, and multiple heat-conducting plates stacked at intervals are correspondingly installed on the same cold plate. The thermal pad includes a second thermal pad disposed between the positioning groove and the positioning protrusion. The second thermal pad includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is fitted to the groove surface of the positioning groove, and the wear-resistant and scratch-resistant surface faces the positioning protrusion.

[0011] In an optional embodiment, the thermal pad further includes a third thermal pad disposed between the disk enclosure and the hard drive. The third thermal pad includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is attached to the inner wall of the disk enclosure, and the wear-resistant and scratch-resistant surface faces the hard drive.

[0012] In an optional embodiment, the cold plate includes a medium inlet at the bottom and a medium outlet at the top, and the medium pipeline includes a liquid inlet pipeline and a liquid outlet pipeline. The liquid inlet pipeline and the medium inlet pipeline and the liquid outlet pipeline and the medium outlet pipeline are respectively sealed and connected by connectors.

[0013] In a second aspect, the present invention provides a hard disk heat dissipation system, including a control unit and a hard disk heat dissipation structure as described in any of the foregoing embodiments; A liquid inlet solenoid valve is installed on the medium pipeline, and a temperature sensor is installed on the heat-conducting plate. The liquid inlet solenoid valve and the temperature sensor are electrically connected to the control unit.

[0014] In an optional embodiment, the heat-conducting plate is provided with a position sensor for detecting whether the tray is plugged in properly, and the position sensor is electrically connected to the control unit.

[0015] The heat dissipation structure and system of the hard drive in this application can simplify the composition of the heat dissipation structure and enable the individual disk enclosures to be installed in the heat dissipation structure, thereby meeting the usage requirements and high maintainability requirements of server hard drives.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the hard disk heat dissipation structure in this application; Figure 2 This is a schematic diagram of the split structure of the hard disk heat dissipation structure in this application; Figure 3 This is a schematic diagram of the assembly of the hard disk and the disk enclosure in this application; Figure 4 This is an assembly diagram of the heat pipe, heat-conducting plate, and first heat-conducting pad in this application; Figure 5 This is a schematic diagram of the assembly of the cold plate and the second thermal pad in this application; Figure 6 This is a schematic diagram of the installation of the liquid inlet solenoid valve in this application.

[0019] icon: 1-Chassis; 11-Liquid inlet; 12-Liquid outlet; 13-Liquid inlet pipe; 14-Liquid outlet pipe; 2-Hard disk; 3-Disc box; 4-Heat conduction plate; 41-Recessed groove; 42-Slot; 43-Positioning protrusion; 5 - Cold plate; 51 - Positioning groove; 6-Heat pipe; 7- Thermal pad; 71- First thermal pad; 72- Second thermal pad; 73- Third thermal pad; 8-Inlet solenoid valve. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] In view of the heat dissipation structure of traditional hard drives, especially the cold plate heat dissipation method, this application provides a hard drive heat dissipation structure to solve the problems existing in the traditional liquid cooling heat dissipation method of hard drives.

[0024] See Figures 1-2 and combined Figures 3-6 The hard drive heat dissipation structure is installed in the chassis 1, mainly including the heat conduction plate 4, the cold plate 5 and the media pipeline. The hard drive 2 is set in the disk enclosure 3 to form a hard drive assembly. The hard drive 2 is specifically plugged into the disk enclosure 3.

[0025] Heat pipes 6 are provided on the heat-conducting plate 4. The heat-conducting plate 4 and the heat pipes 6 together form a welded body. Meanwhile, cold plates 5 are arranged between the heat-conducting plates 4, and at least a portion of the heat-conducting plate 4 is inserted into the cold plates 5. This allows the cold plates 5 to be installed on the chassis 1, and the welded body to be installed on the welded body. The disk tray 3 is stacked between the heat-conducting plates 4 in a removable manner, further allowing the hard disk assembly to be installed in the welded body.

[0026] The installation of the cold plate 5 on the chassis 1 and the installation of the hard drive 2 inside the disk enclosure 3 are two indispensable elements in the heat dissipation structure of this application. The hard drive 2 is installed inside the disk enclosure 3, specifically a welded body that replaces part of the original cold plate 5, and uses aluminum, a metal with a lower specific gravity than copper. Compared with the existing traditional integral cold plate 5 structure, it can effectively reduce weight while providing more heat dissipation space.

[0027] Compared to the traditional cold plate 5 structure, the cold plate 5 in this application has a reduced size, reducing the number of welding points and thus reducing the risk of leakage.

[0028] The medium pipeline is connected to the cold plate 5 and is used to introduce / export the heat dissipation medium into the pipeline inside the cold plate 5, so that the heat received by the cold plate 5 can be discharged to the outside through the circulating medium.

[0029] By placing thermal pads 7 in the stacking gap between the heat-conducting plate 4 and the disk box 3, the insertion gap between the hard disk 2 and the disk box 3, and the insertion gap between the cold plate 5 and the heat-conducting plate 4, effective heat conduction can be achieved. Combined with the heat dissipation medium that is introduced and discharged, heat can be dissipated to the maximum extent.

[0030] The assembly of the welded body and the cold plate 5 is in the form of a groove guide similar to a slide rail. Friction is generated by the compression of the heat-conducting pad 7, and it can be fixed without other positioning structures and screw connections.

[0031] During maintenance, the welded parts need to be removed. After opening the top cover of the chassis 1, the top welded part is taken out. The internal stress of the thermal pad 7 is released and it rebounds, so the lower welded parts can be pulled out. This simplifies the assembly process and reduces the cumbersome maintenance issues.

[0032] The hard drive assembly is installed in the welded body. There are no flow channels inside the welded body, so there is no need to consider sealing tests such as airtightness and pressure holding. The welding method between the heat conduction plate 4 and the heat pipe 6 is simple, low-cost, and efficient in production, which simplifies the process and effectively reduces costs.

[0033] A groove 41 is provided on the top wall or bottom wall of the heat-conducting plate 4, or both the top wall and the bottom wall. The heat pipe 6 is embedded in the groove 41. Specifically, the heat pipe 6 includes a hollow copper tube with a closed structure, with a capillary structure inside and filled with a working fluid capable of phase change. Through this arrangement, heat can be effectively conducted. The heat received by the heat-conducting plate 4 is transferred to the cold plate 5 through the phase change of the working fluid inside the heat pipe 6, and finally discharged to the outside through the heat dissipation medium.

[0034] The hollow copper tube has a flat tube structure, and its circumferential tube walls are respectively attached to the surface of the sink 41. Specifically, at the part where the heat-conducting pad 7 is attached, three walls of the hollow copper tube are respectively attached to the bottom surface and side surface of the sink 41, and the other wall is attached to the surface of the heat-conducting pad 7.

[0035] The heat pipe 6 can absorb heat through the phase change of its working fluid, and transfer the heat of the tray 3 corresponding to the opening part of the sink 41 to the heat-conducting pad 7. The heat is then transferred to the heat-conducting plate 4 through the heat-conducting pad 7, and finally to the cold plate 5 through the heat-conducting plate 4 of the welded body, thus completing the heat conduction of the tray 3 corresponding to the opening part of the sink 41.

[0036] The heat-conducting plate 4 and the disk box 3 are stacked alternately, which can conduct the heat from the hard drive 2 to the disk box 3 through the stacked heat-conducting plate 4, so that the heat is transferred from the disk box 3 to the heat-conducting plate 4.

[0037] Based on the thermal pads 7 described above, which are arranged in different stacking gaps and / or insertion gaps, the thermal pads 7 include a first thermal pad 71 disposed between the tray 3 and the heat-conducting plate 4. The first thermal pad 71 is capable of conducting heat between the tray 3 and the welded body heat-conducting plate 4.

[0038] The disk enclosure 3 is removably installed between the heat conduction plates 4. As the main core heat dissipation object, the removable installation form of the disk enclosure 3 can facilitate the daily maintenance of the hard drive 2. On the other hand, after the disk enclosure 3 is inserted into the stacking gap of the heat conduction plate 4, the disk enclosure 3 can make contact with the heat conduction pad 7 attached to the welded body, restoring a reliable heat conduction path.

[0039] Specifically, the first thermal pad 71 includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is attached to the surface of the thermal plate 4, and the wear-resistant and scratch-resistant surface faces the wall of the tray 3.

[0040] This configuration ensures that the first thermal pad 71 is properly attached and fixed to the thermal plate 4, while also preventing damage to the first thermal pad 71 during frequent insertion and removal of the tray 3.

[0041] From the perspective of the cooperation between the heat-conducting plate 4 and the cold plate 5, the heat-conducting plate 4 is provided with a slot 42, through which the heat-conducting plate 4 can be inserted into the cold plate 5. Specifically, the heat-conducting plate 4 in this application includes multiple pieces arranged in a spaced-out layer, which together with the heat pipe 6 form multiple welded bodies arranged at intervals. The cold plate 5 is assembled and inserted between the multiple heat-conducting plates 4, so that the cold plate 5 and the multiple welded bodies form a whole heat dissipation structure.

[0042] In order to maintain the stability and reliability of the fit between the heat-conducting plate 4 and the cold plate 5, the slot 42 on the heat-conducting plate 4 and the cold plate 5 are respectively provided with positioning parts, including positioning grooves 51 and positioning protrusions that can be matched accordingly.

[0043] The positioning part can effectively realize the positioning and insertion of the heat-conducting plate 4 on the cold plate 5, while maintaining a tight fit between the cold plate 5 and the heat-conducting plate 4, forming an effective and smooth heat conduction channel.

[0044] From the perspective of maintaining the contact area between the cold plate 5 and the welded body, to prevent the cold plate 5 from being exposed due to excessive insertion on the slot 42, the slot 42 includes a closed slot 42 located in the center of the heat-conducting plate 4, and the length of the slot 42 is less than or equal to the length of the cold plate 5.

[0045] The closed slot 42 design allows the end of the cold plate 5 to fit tightly with the closed end of the slot 42, so that the slot 42 of the heat-conducting plate 4 forms an outer wrap around the cold plate 5, which fully guarantees the contact area between the cold plate 5 and the welded body, and at the same time facilitates the absorption of heat from the welded part by the cold plate 5.

[0046] Positioning protrusions 43 are set on the heat-conducting plate 4, and the two sides of the slot 42 are constructed as centered protruding protrusions. Based on the simultaneous cooperation between the cold plate 5 and multiple welded bodies, the positioning grooves 51 include multiple pairs of grooves spaced apart on the cold plate 5. Each pair includes a centered concave groove structure. Multiple heat-conducting plates 4 stacked at intervals are correspondingly installed on the same cold plate 5. By setting the positioning grooves 51 on the cold plate 5, the cooperation area of ​​the cold plate 5 can be increased, thereby improving the heat exchange.

[0047] Based on the insertion relationship between the cold plate 5 and the slot 42, in order to avoid the influence of the insertion gap on heat conduction, the heat-conducting pad 7 includes a second heat-conducting pad 72 disposed between the positioning groove and the positioning protrusion 43, which can fully enable the cold plate 5 and the heat-conducting plate 4 to make close and sufficient contact, which is conducive to the direct conduction of heat between the heat-conducting plate 4 and the cold plate 5 of the welded body.

[0048] The second thermal pad 72 includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is fitted to the groove surface of the positioning groove 51, and the wear-resistant and scratch-resistant surface faces the positioning protrusion 43.

[0049] On the one hand, it can ensure that the second thermal pad 72 is adhered and fixed on the cold plate 5, and on the other hand, it can prevent the cold plate 5 from damaging the second thermal pad 72 during the insertion and removal process.

[0050] From the perspective of ensuring that the heat on the hard drive 2 is effectively transferred to the disk enclosure 3, the thermal pad 7 also includes a third thermal pad 73 disposed between the disk enclosure 3 and the hard drive 2. The third thermal pad 73 can fully occupy the insertion gap between the hard drive 2 and the disk enclosure 3, forming a conduction path through the slot between the hard drive 2 and the disk enclosure 3.

[0051] The third thermal pad 73 includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is attached to the inner wall of the disk tray 3 to keep the third thermal pad 73 firmly bonded to the inside of the disk tray 3. The wear-resistant and scratch-resistant surface faces the hard disk 2 to prevent the hard disk 2 from damaging the third thermal pad 73 during frequent insertion and removal.

[0052] The cold plate 5 includes a medium inlet at the bottom and a medium outlet at the top. The medium pipeline includes an inlet pipeline 13 and an outlet pipeline 14. The inlet pipeline 13 and the medium inlet and the outlet pipeline 14 and the medium outlet are respectively sealed and connected by connectors, thereby forming a flow state of heat dissipation medium entering from the bottom and exiting from the top, ensuring sufficient heat exchange of heat dissipation medium within the cold plate 5.

[0053] During operation, the cryogenic liquid working fluid flows into the inlet pipe 13 from the liquid inlet 11 at the rear window of the chassis 1. The liquid inlet pipe 13 connects to the cold plate 5 inside the chassis 1, and the connectors include pagoda nozzles, threaded joints, quick couplings, etc. The cryogenic liquid working fluid flows into the interior of the cold plate 5 through the inlet. The interior of the cold plate 5 is machined with special flow channels. The hard drive 2 generates heat during operation, and the detailed heat transfer path is: hard drive 2 → third thermal pad 73 → disk enclosure 3 → first thermal pad 71 → welded body → second thermal pad 72 → cold plate 5.

[0054] Heat is transferred to the low-temperature liquid working medium in the flow channel of the cold plate 5 through conduction. The high-temperature liquid working medium that has absorbed heat flows out from the medium outlet and out of the chassis 1 through the liquid outlet 12 of the rear window of the chassis 1.

[0055] During assembly, the cold plate 5 is installed on the bottom surface of the chassis 1, and the second thermal pad 72 is adhered to the positioning groove 51 of the cold plate 5. This prevents the second thermal pad 72 from being damaged during the insertion and removal of the cold plate 5, thus extending its service life. It should be noted that the thermal pad 7 in this application refers to thermal interface materials in general, including silicone thermal adhesive, thermal gel, graphite foam, etc., and does not specifically refer to the thermal pad 7 that combines common thermal fillers and silicone adhesive.

[0056] The heat-conducting plate 4 and the heat pipe 6 are pre-welded into a single welded body. The adhesive bonding surface of the first heat-conducting pad 71 is bonded to the upper and lower surfaces of the welded body, and the wear-resistant and scratch-resistant surface is de-adhesive and treated for wear resistance and scratch resistance.

[0057] The disk enclosure 3 has a hollow structure. The third thermal pad 73 is glued to the inner top and bottom walls. The hard disk 2 is installed in the disk enclosure 3. The adhesive surface of the third thermal pad 73 is attached to the upper and lower inner sides of the disk enclosure 3. The wear-resistant and scratch-resistant surface is treated to be wear-resistant and scratch-resistant. The disk enclosure 3 with the hard disk 2 installed constitutes the hard disk assembly.

[0058] The welded components are inserted laterally into the cold plate 5 from the front panel of the chassis 1, and are guided by the positioning groove 51 on the cold plate 5 and the positioning protrusion 43 on the heat-conducting plate 4. The hard drive assembly is inserted laterally into the gap between the welded components from the front panel of the chassis 1.

[0059] It should be added that the above-described horizontal plug-in installation method is only one possible solution. The specific implementation method can be adjusted according to the actual installation direction of the hard drive 2, including horizontal or vertical plug-in. The number of hard drive assemblies, welded components, cold plates, etc. in the attached diagram is only one possible solution, and the specific implementation method can be adjusted according to the actual number of hard drives 2.

[0060] Chassis 1 is specifically a server chassis 1, which serves as the supporting structure for various hardware and heat dissipation structures. The media pipeline is used to transport cooling media. Inside chassis 1, the media inlet and media outlet are connected to the cold plate 5. The lower part is the liquid inlet pipeline 13, and the upper part is the liquid outlet pipeline 14, which maintains the bottom inlet and top outlet of the heat dissipation media. The materials of the media pipeline include rubber, silicone, stainless steel, copper, aluminum, etc.

[0061] The thermal pad 7 is specifically a thermal interface material used to fill the gap between two independent heat transfer devices to enhance heat transfer efficiency. It can be made by mixing solid thermally conductive fillers with silicone-based fillers, and has a certain degree of flexibility, toughness, and elasticity. The heat pipe 6 in the welded body has an internal capillary structure and is filled with a working fluid, transferring heat through phase change to greatly ensure heat transfer efficiency.

[0062] The heat-conducting plate 4 in the welded body can conduct heat from the disk tray 3 of the hard disk 2 to the cold plate 5, and has several embedded heat pipes 6 to enhance heat transfer efficiency. The heat-conducting plate 4 is preferably made of aluminum and is in close contact with the cold plate 5 through the second heat-conducting pad 72. The weight of the aluminum plate structure heat-conducting plate 4 is significantly reduced compared to the weight of the copper cold plate 5 of the same volume, with a weight reduction of more than 65%.

[0063] The heat-conducting plate 4, combined with the heat pipe 6, forms an integrated structure. With a large heat transfer surface and close contact between the top and bottom surfaces and the disk enclosure 3, the heat of the hard drive 2 can be effectively dissipated, reducing the number of local hot spots and the maximum temperature of the hot spots.

[0064] Hard drive 2 is specifically either a mechanical hard drive (HDD) or a solid-state drive (SSD), serving as the storage hardware structure. The enclosure 3, made of metal, acts as a fixing and heat transfer structure for hard drive 2. The enclosure 3 contacts hard drive 2 via a third thermal pad 73 and contacts heat-conducting plate 4 via a first thermal pad 71, ensuring unobstructed heat exchange channels. The enclosure 3 has an internal cavity into which hard drive 2 is assembled, with the gaps filled by the third thermal pad 73. Hard drive 2 can be removed from enclosure 3, and in use, hard drive 2, along with enclosure 3, is inserted into the server and installed on the backplate of hard drive 2.

[0065] The cold plate 5 is made of copper or aluminum and has a complex internal flow channel structure. It is used as a place for heat transfer devices or radiators to exchange heat with liquid working fluid and is fixed at the bottom or top of the chassis 1.

[0066] The positioning groove 51 and the positioning protrusion 43 have the same structural shape, and the cross-sectional shape is not limited to triangle, rectangle, trapezoid, etc.

[0067] This application also provides a heat dissipation system for a hard disk 2, including a control unit and the hard disk heat dissipation structure described above. An inlet solenoid valve 8 is provided on the media pipeline, and a temperature sensor is provided on the heat conduction plate 4. The temperature sensor can indirectly reflect the temperature of the hard disk 2 during operation.

[0068] By electrically connecting the liquid inlet solenoid valve 8 and the temperature sensor to the control unit respectively, the control unit can receive the temperature signal fed back to the control unit by the temperature sensor, thereby adjusting the valve opening of the liquid inlet solenoid valve 8.

[0069] Based on the working characteristics of hard disk 2, during periods of frequent data reading, hard disk 2 generates more heat, so the opening of the inlet solenoid valve 8 is increased, and the flow rate of coolant into the cold plate 5 is increased; during periods of less data reading, hard disk 2 generates less heat, so the opening of the inlet solenoid valve 8 is decreased, and the flow rate of coolant into the cold plate 5 is reduced.

[0070] By setting the maximum flow rate, the maximum flow rate of the coolant supplied to the two ends of the hard drive can be adjusted, and the maximum flow rate can be controlled to not exceed the rated flow rate of the thermal control design, thus preventing the flow rate of other hardware cold plates 5 from decreasing, thereby achieving temperature control within a single heat dissipation structure node.

[0071] In this application, a position sensor is provided on the heat-conducting plate 4 to detect whether the tray 3 is properly inserted. The position sensor is electrically connected to the control unit. Specifically, the position sensor is located at the position where the tray 3 is inserted on the heat-conducting plate 4, and provides audible and visual indications through its electrical connection with the control unit to indicate that the installation is in place. Specifically, when the tray 3 is unoccupied, the position sensor can be a normally closed circuit; when the tray 3 is installed in place, it forms a normally open circuit, and the green indicator light illuminates. This dual protection of structure and indication ensures that the overall installation is correct.

[0072] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0073] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A hard drive heat dissipation structure, installed in a computer chassis, for dissipating heat from the hard drive housed in a disk enclosure, characterized in that... The hard drive connector is located in the disk enclosure; The hard drive heat dissipation structure includes a heat-conducting plate, a cold plate, and media pipelines; The trays are removably stacked between the heat-conducting plates, and heat pipes are provided on the heat-conducting plates. The cold plate is disposed between the heat-conducting plates and is inserted into at least a portion of the heat-conducting plates. The medium pipeline is connected to the cold plate and the heat dissipation medium is introduced / exported into the pipeline inside the cold plate. And, thermal pads disposed in the stacking gaps and / or plug gaps.

2. The hard disk heat dissipation structure according to claim 1, characterized in that, The heat-conducting plate has a groove on its top and / or bottom wall, and the heat pipe is embedded in the groove. The heat pipe includes a closed-structure hollow copper tube with a capillary structure inside and filled with a working fluid capable of phase change. The hollow copper tube has a flat tube structure, and its circumferential tube walls are respectively attached to the surface of the settling tank.

3. The hard disk heat dissipation structure according to claim 1, characterized in that, The heat-conducting plates and the tray are stacked alternately, and the heat-conducting pad includes a first heat-conducting pad disposed between the tray and the heat-conducting plates. The tray is removably installed between the heat-conducting plates. The first thermal pad includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is attached to the surface of the thermal plate, and the wear-resistant and scratch-resistant surface faces the wall of the tray.

4. The hard disk heat dissipation structure according to claim 1, characterized in that, The heat-conducting plate is provided with a slot, which allows the heat-conducting plate to be inserted into the cold plate; The slot and the cold plate are respectively provided with positioning parts, and the positioning parts include positioning grooves and positioning protrusions that can be correspondingly matched.

5. The hard disk heat dissipation structure according to claim 4, characterized in that, The slot includes a closed slot located in the center of the heat-conducting plate, and the length of the slot is less than or equal to the length of the cold plate.

6. The hard disk heat dissipation structure according to claim 4, characterized in that, The positioning protrusion is disposed on the heat-conducting plate, and the two sides of the slot are constructed as centered protruding protrusion structures; The positioning groove includes multiple pairs spaced apart on the cold plate, each pair including a recessed groove structure, and multiple heat-conducting plates stacked at intervals are correspondingly installed on the same cold plate. The thermal pad includes a second thermal pad disposed between the positioning groove and the positioning protrusion. The second thermal pad includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is fitted to the groove surface of the positioning groove, and the wear-resistant and scratch-resistant surface faces the positioning protrusion.

7. The hard disk heat dissipation structure according to claim 1, characterized in that, The thermal pad also includes a third thermal pad disposed between the disk enclosure and the hard drive. The third thermal pad includes an adhesive surface and a wear-resistant and scratch-resistant surface. The adhesive surface is attached to the inner wall of the disk enclosure, and the wear-resistant and scratch-resistant surface faces the hard drive.

8. The hard disk heat dissipation structure according to claim 1, characterized in that, The cold plate includes a medium inlet at the bottom and a medium outlet at the top. The medium pipeline includes an inlet pipeline and an outlet pipeline. The inlet pipeline and the medium inlet, as well as the outlet pipeline and the medium outlet, are respectively sealed and connected by connectors.

9. A hard drive cooling system, characterized in that, Includes a control unit and a hard disk heat dissipation structure as described in any one of claims 1-8; A liquid inlet solenoid valve is installed on the medium pipeline, and a temperature sensor is installed on the heat-conducting plate. The liquid inlet solenoid valve and the temperature sensor are electrically connected to the control unit.

10. The hard disk cooling system according to claim 9, characterized in that, The heat-conducting plate is equipped with a position sensor for detecting whether the tray is plugged in properly, and the position sensor is electrically connected to the control unit.

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