Manufacturing process of 5.5 G high-frequency high-speed circuit board
By designing an automated flipping device and a stable transmission system, the problems of human damage and high flipping rate during the high-frequency circuit board flipping process were solved, achieving an efficient and reliable circuit board manufacturing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-31
- Publication Date
- 2026-04-07
AI Technical Summary
In existing technologies, the flipping process of high-frequency circuit boards relies on manual labor, which can easily lead to substrate damage. Furthermore, traditional exposure machines can only expose one side, making it impossible to avoid the flipping step and increasing the probability of defective products.
A 5.5G high-frequency and high-speed circuit board manufacturing device was designed, which includes flipping, moving, clamping, lifting and shock absorption devices. The device achieves automated flipping and exposure through linkage mechanism, reduces manual operation, ensures the safety of the board, and improves transmission stability and clamping effect through tensioning, shock absorption and clamping devices.
It enables automated flipping of high-frequency circuit boards, reduces human damage, improves production efficiency and product yield, reduces defect rate, and ensures the stability of the transmission system and the reliability of clamping.
Smart Images
Figure CN121815549A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of pcb board production and processing, and particularly relates to a manufacturing process of a 5.5G high-frequency high-speed circuit board. BACKGROUND
[0002] The high-frequency circuit board is a special circuit board with high electromagnetic frequency, and generally, high frequency can be defined as a frequency above 1GHz. The high-frequency circuit board has very high requirements on physical performance, precision and technical parameters, and is commonly used in the fields of automobile anti-collision systems, satellite systems and radio systems.
[0003] In the prior art, the exposure of the double-sided circuit board is still manually flipped. If the pcb board is dropped from a high place due to slight carelessness, the substrate will be impacted, and the probability of defective production will be increased. For the processing of the double-sided pcb board, the step of flipping the double-sided pcb board cannot be avoided because the traditional exposure machine can only expose one side. SUMMARY
[0004] In view of the deficiencies of the prior art, the technical scheme adopted by the present application to solve the technical problems is: a manufacturing device of a 5.5G high-frequency high-speed circuit board, comprising a machine base, a flipping device is arranged in the machine base, a moving device is arranged below the flipping device, a lifting device is arranged between the moving devices, the flipping device comprises a rotating wheel, a first transmission belt is rotatably connected to the outer surface of the rotating wheel, a rotating table is rotatably connected to the inner surface of the first transmission belt, a tensioning device is arranged on both sides of the rotating table, an extension rod is arranged between the tensioning devices, triangular blocks are arranged above the extension rod, a clamping device is arranged between the triangular blocks, a second transmission belt is arranged around the clamping device, a transmission wheel is slidably connected to the outer surface of the second transmission belt, a supporting table is arranged above the transmission wheel, the tensioning device comprises a sliding block, a positioning moving block is slidably connected to the inner surface of the sliding block, a first spring is fixedly connected to one side of the positioning moving block, a large hydraulic rod is fixedly connected to the other side of the positioning moving block, a damping device is arranged between the large hydraulic rods, when the second transmission belt moves, the tensioning device is subjected to a counterforce, due to the motion characteristics of the tensioning device, the force applied to the tensioning device is fluctuating, for the fluctuating force, the large hydraulic rod may be vibrated, and the vibration may hit the sliding block inside to cause damage to the sliding block.
[0005] Preferably, the both ends of the telescopic rod are slidably connected with a first transmission belt, the outer surface of the telescopic rod is fixedly connected with the inner surface of the base, the outer surface of the base is fixedly connected with the outer surface of the triangular block, the outer surface of the rotating table is slidably connected with a second transmission belt, the outer surface of the tensioning device is rotatably connected with a transmission wheel, the outer surface of the transmission wheel is rotatably connected with the outer surface of the supporting table, and the both sides are provided with turnover devices at the same time, and synchronous turnover is realized through the linkage mechanism.
[0006] Preferably, the damping device comprises a small hydraulic rod, the outer surface of the small hydraulic rod is fixedly connected with a supporting ring, the supporting rings are provided with a sliding ring, the outer surface of the sliding ring is fixedly connected with a second spring, the outer surface of the supporting ring is slidably connected with a large hydraulic rod, the inner surface of the sliding ring is slidably connected with the outer surface of the small hydraulic rod, and the outer surface of the second spring is fixedly connected with a sliding block. The supporting rings at the both ends of the damping device can provide supporting effect for the large hydraulic rod with large vibration amplitude, and the small hydraulic rod can weaken the vibration effect. Meanwhile, gaps are left between the supporting rings and the large hydraulic rod, the whole damping device is connected in the sliding block through the second spring, and the effect of a damper is achieved when the vibration is small, so that the damping effect is achieved.
[0007] Preferably, the clamping device comprises a track plate, the inner surface of the track plate is slidably connected with a clamping plate, the outer surface of the clamping plate is fixedly connected with a sliding plate, the outer surface of the sliding plate is fixedly connected with a supporting plate, the outer surface of the supporting plate is rotatably connected with a roller, the outer surface of the supporting plate is fixedly connected with a third spring, the outer surface of the third spring is fixedly connected with a rotating table, the outer surface of the rotating table is fixedly connected with the outer surface of the track plate, the outer surface of the supporting plate is slidably connected with the inner surface of the rotating table, and the inner surface of the rotating table is slidably connected with the outer surface of the sliding plate. When the rotating table is rotated to the highest points of the both ends, the clamping device is prepared for turnover, the included angle formed by the rollers is opened by the triangular block at one of the both ends, the supporting plate is opened at this time, the protrusions fixed on the supporting plate move in the groove of the sliding plate, the sliding plate is expanded outwardly due to the force, and the clamping plate fixed on the sliding plate is moved at this time, so that the clamping plate is in an opened state when the turnover is prepared.
[0008] Preferably, the moving device includes a support displacement block, a cam rotatably connected to the outer surface of the support displacement block, a first rotating rod rotatably connected to the outer surface of the cam, a second rotating rod disposed below the first rotating rod, a connecting block rotatably connected to the outer surface of the second rotating rod, a wheel rotatably connected to the outer surface of the connecting block, the inner surface of the second rotating rod rotatably connected to the outer surface of the support displacement block, the outer surface of the first rotating rod rotatably connected to the inner surface of the connecting block, and the outer surface of the first rotating rod rotatably connected to the inner surface of the second rotating rod. For ordinary moving devices, although they have a moving effect, because they are flipping mechanisms, debris on the PCB board may fall during the flipping process, obstructing the movement, making ordinary moving devices unsuitable for this situation. By setting the first and second rotating rods, when the wheel encounters debris, the upward force is converted to the cam and the support displacement block through the rotational connection.
[0009] Preferably, the lifting device includes a lifting platform, a base is provided below the lifting platform, a slide rod is slidably connected to the inner surface of the base, a push block is slidably connected to the outer surface of the slide rod, fixed seats are provided on both sides of the push block, a limit groove is fixedly connected to the upper surface of the fixed seat, a passive block is slidably connected to the inner surface of the limit groove, a pull rod is rotatably connected to the inner surface of the passive block, a foot pedal is rotatably connected to the outer surface of the pull rod, a return spring is provided above the foot pedal, the outer surface of the return spring is fixedly connected to the outer surface of the push block, the upper surface of the push block is fixedly connected to the outer surface of the passive block, a base is fixedly connected to the lower surface of the fixed seat, the outer surface of the slide rod is rotatably connected to the inner surface of the lifting platform, the lifting platform and the support platform form a plane, which can be used as a normal pushing plane. When the flipping device is needed, the foot pedal is released, and under the action of the return spring, the push and pull plates on both sides are pushed outward. Under the action of gravity, the lifting platform descends, making room for the flipping mechanism to flip.
[0010] A manufacturing process for a 5.5G high-frequency, high-speed circuit board includes the following steps: Step 1: Material preparation. The raw copper-clad laminate is cut into boards that can be manufactured on the production line.
[0011] Step 2 involves drilling holes to create through-holes between the PCB layers, thereby connecting the layers.
[0012] Step 3: Copper Plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank, forming a copper layer that metallizes the holes. This deposits copper onto the surface of the originally insulating substrate, achieving interlayer electrical connectivity.
[0013] Step four involves lamination. After lamination, a layer of blue dry film is pressed onto the PCB board. The dry film serves as a carrier and is crucial in the circuit manufacturing process. Compared to wet film, dry film offers higher stability and better quality, and can be directly used to create non-metallic vias.
[0014] Step 5: Exposure. Align the film and the substrate with the pressed dry film. Place the aligned substrate on the flipping device and push it into the exposure machine. Use ultraviolet light to transfer the film pattern onto the photosensitive dry film. Pull out the exposed substrate and rotate the rotating wheel to make the turntable rotate to the left. Push the substrate into the track plate. The rotating wheel drives the turntable to rotate to the right to complete the flipping. Align the film and dry film again. Rotate the turntable to be perpendicular to the ground. Step on the pedal to raise the lifting platform and push the substrate into the exposure machine to complete the double-sided exposure.
[0015] Step 6: Development. Use the weak alkalinity of the developer to dissolve and wash away the unexposed dry or wet film, leaving the exposed parts intact.
[0016] Step 7: Electroplating. Place the PCB board into the electroplating equipment. The copper parts will be electroplated, while the parts blocked by the film will not react.
[0017] Step 8: Soldering – This is a preparatory step to remove the copper portion protected by the film.
[0018] Step 9: Remove the exposed dry film protecting the copper surface using a sodium hydroxide solution to expose the circuit pattern.
[0019] Step 10: After etching, the unexposed dry or wet film is removed by the developer, exposing the copper surface. This exposed copper surface is then dissolved and etched away with acidic copper chloride to obtain the desired circuitry.
[0020] Step 11: Remove the solder. Use solder remover to remove the solder from the circuit, restoring the circuit to its original copper color. Step 12: Optical Inspection (AOI) works by first taking a quick picture with a high-definition camera, and then comparing the picture with the original file. This fundamentally solves the problems of open circuits, short circuits, and micro-openings or micro-short circuits.
[0021] Step 13: Print solder resist. Apply a layer of solder resist to the board surface by screen printing or coating with solder resist ink. After exposure and development, expose the disks and holes to be soldered. Cover other areas with solder resist to prevent short circuits during soldering.
[0022] Step Fourteen: Solder Mask Exposure. First, place the solder mask film on a board completely covered with green solder mask. The areas where windows need to be opened are black, and the areas where windows don't need to be opened are transparent. Then, place the film on an exposure machine for exposure. The areas where windows need to be opened are not exposed because the film is black, and the black color blocks the light. The exposure changes as the state of the green solder mask changes.
[0023] Step 15: Print the required text, trademarks, parts and other symbols onto the PCB board using screen printing, and then expose the board surface to ultraviolet light.
[0024] Step Sixteen: Surface treatment to ensure good solderability or electrical properties. Common surface treatments include: tin plating, immersion gold, OSP, immersion tin, immersion silver, nickel-palladium-gold, electroplated hard gold, electroplated gold fingers, etc.
[0025] Step 17: Shaping and cutting the PCB into the required dimensions.
[0026] Step 18: Perform electrical tests and simulate the state of the circuit board. Power on the circuit board to check for open circuits or short circuits.
[0027] Step nineteen involves random sampling and inspection of the circuit board's appearance, dimensions, hole diameter, board thickness, markings, etc., to ensure it meets customer requirements. Qualified products are then packaged for easy storage and transportation.
[0028] The beneficial effects of this invention are as follows: 1. This invention, by setting a tensioning device, ensures that during the flipping process, most of the force is transmitted through the pulley. The first transmission belt only needs to be driven at two points, and since its position is fixed, it does not require a tensioning device. For the second transmission belt, whose transmission position moves, if a certain force is not applied to tension it, the second transmission belt that drives the mechanism may detach due to loosening after multiple movements. To prevent detachment, the tensioning device is slidably connected to the machine base, and the groove is opened on the inner surface of the machine base. The transmission wheel is rotatably connected to the tensioning device. The first spring pushes the positioning moving block forward, and the large hydraulic rod fixedly connected to the outer surface of the positioning moving block adds thrust to the tensioning device, so that the tensioning device pushes the transmission wheel to always apply thrust to the second transmission belt.
[0029] 2. This invention incorporates a shock-absorbing device. When the second transmission belt moves, it applies a reaction force to the thrust of the tensioning device. Due to its own motion characteristics, the force applied to the tensioning device fluctuates. Under this fluctuating force, the large hydraulic rod may be vibrated, and the vibration may strike the interior of the sliding block, causing damage. The support rings at both ends of the shock-absorbing device provide support for the large hydraulic rod with large vibration amplitude, while the small hydraulic rods weaken the vibration effect. At the same time, there is a gap between the support rings and the large hydraulic rod. The entire shock-absorbing device is connected to the interior of the sliding block through a second spring, acting as a damper when the vibration is small, thus achieving a shock-absorbing effect.
[0030] 3. This invention, by setting up a clamping device, when the rotating table rotates to the highest point at both ends, prepares for flipping. The included angle formed by the rollers in the clamping device is opened by the triangular block at one of the ends, which drives the support plate to be opened. The protrusion fixed on the support plate moves in the groove of the sliding plate. Due to the force, the sliding plate expands outward, which drives the clamping plate fixed on the sliding plate to move. Therefore, when preparing for flipping, the clamping plate is in an open state. During the flipping process, the support of the triangular block is lost. Due to the force of the third spring, the recovery process makes the movement process reversed, thus achieving the function of clamping the PCB board during the flipping process.
[0031] 4. This invention, by setting up a moving device, addresses the issue that when pushing or flipping a PCB board, the support platform makes it difficult to clamp smaller PCB boards. In such cases, it is necessary to move one side of the base to achieve an effect suitable for most PCB boards. While ordinary moving devices can achieve movement, they are flipping mechanisms, and debris on the PCB board may fall during the flipping process, obstructing the movement. This makes ordinary moving devices unsuitable for such situations. By setting up a first rotating rod and a second rotating rod, when the wheel encounters debris, the upward force is converted through a rotating connection to the cam and the support displacement block, making it a suspension for the wheel, thus dealing with situations where debris falls and jams the base.
[0032] 5. This invention, by setting up a lifting device, allows for the following scenarios: when double-sided PCB boards are not being processed or a flipping device is not being used, pressing the pedal drives the pull rod, causing the passive block to move towards the center. The push block fixed on the passive block pushes the slide rod, causing the slide rod to move inward, thereby raising the lifting platform. The lifting platform and the support platform become a plane, which can be used as a normal pushing plane. When the flipping device is needed, releasing the pedal causes the push-pull plates on both sides to move outward under the action of the return spring. Under the action of gravity, the lifting platform descends, making room for the flipping mechanism to flip. Attached Figure Description
[0033] Figure 1 This is a process flow diagram of the present invention.
[0034] Figure 2 This is a front view of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0035] Figure 3 This is a cross-sectional view of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0036] Figure 4 This is a schematic diagram of the flipping device structure of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0037] Figure 5This is a schematic diagram of the tensioning device structure of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0038] Figure 6 This is a schematic diagram of the shock absorption device structure of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0039] Figure 7 This is a schematic diagram of the clamping device structure of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0040] Figure 8 This is a schematic diagram of the moving device structure of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0041] Figure 9 This is a schematic diagram of the lifting device structure of the manufacturing apparatus for the 5.5G high-frequency and high-speed circuit board of the present invention.
[0042] In the diagram: 1. Base; 2. Tilting device; 3. Moving device; 4. Lifting device; 20. Rotating wheel; 21. First transmission belt; 22. Rotary table; 23. Tensioning device; 24. Telescopic rod; 25. Triangular block; 26. Clamping device; 27. Second transmission belt; 28. Transmission wheel; 29. Support platform; 231. Sliding block; 232. Positioning moving block; 233. First spring; 234. Large hydraulic rod; 235. Shock absorption device; 2351. Small hydraulic rod; 2352. Support ring; 2353. Sliding... Moving ring; 2354, second spring; 261, track plate; 262, clamping plate; 263, sliding plate; 264, support plate; 265, roller; 266, third spring; 31, support displacement block; 32, cam; 33, first rotating rod; 34, second rotating rod; 35, connecting block; 36, wheel; 40, lifting platform; 41, base; 42, slide rod; 43, push block; 44, fixed seat; 45, limit groove; 46, passive block; 47, pull rod; 48, pedal; 49, return spring. Detailed Implementation
[0043] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.
[0044] Example: Please refer to Figure 1 - Figure 9This invention provides a technical solution: a manufacturing apparatus for a 5.5G high-frequency high-speed circuit board, comprising a base 1, a flipping device 2 disposed inside the base 1, a moving device 3 disposed below the flipping device 2, and a lifting device 4 disposed between the moving devices 3. The flipping device 2 includes a rotating wheel 20, a first transmission belt 21 rotatably connected to the outer surface of the rotating wheel 20, a rotating table 22 rotatably connected to the inner surface of the first transmission belt 21, tensioning devices 23 disposed on both sides of the rotating table 22, a telescopic rod 24 disposed between the tensioning devices 23, a triangular block 25 disposed above the telescopic rod 24, a clamping device 26 disposed between the triangular blocks 25, a second transmission belt 27 disposed around the clamping device 26, a transmission wheel 28 slidably connected to the outer surface of the second transmission belt 27, a support platform 29 disposed above the transmission wheel 28, and a sliding block 23. 31. A positioning moving block 232 is slidably connected to the inner surface of the sliding block 231. A first spring 233 is fixedly connected to one side of the positioning moving block 232, and a large hydraulic rod 234 is fixedly connected to the other side of the positioning moving block 232. A shock-absorbing device 235 is provided between the large hydraulic rods 234. When the rotating table 22 is in a state perpendicular to the ground, the support platform 29 set above and the lifting platform 40 of the lifting device 4 cooperate to form a plane, so that the PCB board can be pushed into the exposure machine along the plane. When single-sided exposure is completed, the track plate 261 is rotated to be parallel to the ground and the entrance is facing the PCB board by rotating the rotating wheel 20. The PCB board is pushed in along the track plate 261 until the bottom. At this time, in order to cooperate with the rotation of the rotating table 22, the lifting device 4 is lowered, and the middle position is left empty to make room for flipping. The rotating wheel 20 is moved to drive the rotating table 22 to rotate.
[0045] The telescopic rod 24 is slidably connected to the two ends of the first transmission belt 21. The outer surface of the telescopic rod 24 is fixedly connected to the inner surface of the base 1. The outer surface of the base 1 is fixedly connected to the outer surface of the triangular block 25. The outer surface of the rotating table 22 is slidably connected to the second transmission belt 27. The outer surface of the tensioning device 23 is rotatably connected to the transmission wheel 28. The outer surface of the transmission wheel 28 is rotatably connected to the outer surface of the support platform 29. The two sides are simultaneously controlled to flip through linkage.
[0046] The shock absorber 235 includes a small hydraulic rod 2351, a support ring 2352 fixedly connected to the outer surface of the small hydraulic rod 2351, a sliding ring 2353 between the support rings 2352, a second spring 2354 fixedly connected to the outer surface of the sliding ring 2353, a large hydraulic rod 234 slidably connected to the outer surface of the support rings 2352, and the inner surface of the sliding ring 2353 slidably connected to the outer surface of the small hydraulic rod 2351. A sliding block 231 is fixedly connected to the outer surface of the second spring 2354. The support rings 2352 at both ends of the shock absorber 235 provide support for the large hydraulic rod 234 with large vibration amplitude, and the small hydraulic rod 2351 weakens the vibration. At the same time, there is a gap between the support rings 2352 and the large hydraulic rod 234. The entire shock absorber 235 is connected to the inside of the sliding block 231 through the second spring 2354, and acts as a damper when the vibration is small to achieve the shock absorption effect.
[0047] The clamping device 26 includes a track plate 261, a clamping plate 262 slidably connected to the inner surface of the track plate 261, a sliding plate 263 fixedly connected to the outer surface of the clamping plate 262, a support plate 264 fixedly connected to the outer surface of the sliding plate 263, a roller 265 rotatably connected to the outer surface of the support plate 264, a third spring 266 fixedly connected to the outer surface of the support plate 264, a rotating platform 22 fixedly connected to the outer surface of the third spring 266, the outer surface of the rotating platform 22 being fixedly connected to the outer surface of the track plate 261, and the outer surface of the support plate 264 being slidably connected to the inner surface of the rotating platform 22. The inner surface of the rotary table 22 is slidably connected to the outer surface of the sliding plate 263. The included angle formed by the rollers 265 in the clamping device 26 is opened by the triangular block 25 at one end. At this time, the support plate 264 is opened, and the protrusion fixed on the support plate 264 moves in the groove of the sliding plate 263. Due to the force, the sliding plate 263 is expanded outward. At this time, the clamping plate 262 fixed on the sliding plate 263 is moved. So when it is ready to flip, the clamping plate 262 is in an open state and loses the support of the triangular block 25. The recovery process makes the movement process the opposite of the above process, and the clamping is completed.
[0048] The mobile device 3 includes a support displacement block 31. A cam 32 is rotatably connected to the outer surface of the support displacement block 31. A first rotating rod 33 is rotatably connected to the outer surface of the cam 32. A second rotating rod 34 is disposed below the first rotating rod 33. A connecting block 35 is rotatably connected to the outer surface of the second rotating rod 34. A wheel 36 is rotatably connected to the outer surface of the connecting block 35. The inner surface of the second rotating rod 34 is rotatably connected to the outer surface of the support displacement block 31. The outer surface of the first rotating rod 33 is rotatably connected to the inner surface of the connecting block 35. The outer surface of the first rotating rod 33 is rotatably connected to the inner surface of the second rotating rod 34. With the first rotating rod 33 and the second rotating rod 34 configured, when the wheel 36 encounters debris, the upward force is converted to the cam 32 and the support displacement block 31 through the rotating connection, making it a suspension for the wheel 36, in order to deal with the situation where debris falls and jams the movement of the base 1.
[0049] The lifting device 4 includes a lifting platform 40, a base 41 below the lifting platform 40, a slide rod 42 slidably connected to the inner surface of the base 41, a push block 43 slidably connected to the outer surface of the slide rod 42, fixed seats 44 on both sides of the push block 43, a limit groove 45 fixedly connected to the upper surface of the fixed seat 44, a passive block 46 slidably connected to the inner surface of the limit groove 45, a pull rod 47 rotatably connected to the inner surface of the passive block 46, a foot pedal 48 rotatably connected to the outer surface of the pull rod 47, and a return spring 49 above the foot pedal 48. The outer surface is fixedly connected to the outer surface of the push block 43, the upper surface of the push block 43 is fixedly connected to the outer surface of the passive block 46, the lower surface of the fixed seat 44 is fixedly connected to the base 1, the outer surface of the slide rod 42 is rotatably connected to the inner surface of the lifting platform 40, the lifting platform 40 and the support platform 29 form a plane, which can be used as a normal pushing plane. When the flipping device 2 needs to be used, the foot pedal 48 is released, and under the action of the return spring 49, the push and pull plates on both sides are pushed outward. Under the action of gravity, the lifting platform 40 descends, making room for the flipping mechanism to flip.
[0050] A manufacturing process for a 5.5G high-frequency, high-speed circuit board, characterized by comprising the following steps: Step 1: Material preparation. The raw copper-clad laminate is cut into boards that can be manufactured on the production line.
[0051] Step 2 involves drilling holes to create through-holes between the PCB layers, thereby connecting the layers.
[0052] Step 3: Copper Plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank, forming a copper layer that metallizes the holes. This deposits copper onto the surface of the originally insulating substrate, achieving interlayer electrical connectivity.
[0053] Step four involves lamination. After lamination, a layer of blue dry film is pressed onto the PCB board. The dry film serves as a carrier and is crucial in the circuit manufacturing process. Compared to wet film, dry film offers higher stability and better quality, and can be directly used to create non-metallic vias.
[0054] Step 5: Exposure. Align the film and the substrate with the pressed dry film. Place the aligned substrate on the flipping device 2 and push it into the exposure machine. Use ultraviolet light to transfer the film pattern onto the photosensitive dry film. Pull out the exposed substrate and rotate the rotating wheel 20 to rotate the rotating stage 20 to the left. Push the substrate into the track plate 261. The rotating wheel 20 drives the rotating stage 22 to rotate to the right to complete the flipping. Align the film and dry film again. Rotate the rotating stage 22 to be perpendicular to the ground. Step on the foot pedal 48 to raise the lifting platform 40 and push the substrate into the exposure machine to complete double-sided exposure.
[0055] Step 6: Development. Use the weak alkalinity of the developer to dissolve and wash away the unexposed dry or wet film, leaving the exposed parts intact.
[0056] Step 7: Electroplating. Place the PCB board into the electroplating equipment. The copper parts will be electroplated, while the parts blocked by the film will not react.
[0057] Step 8: Soldering – This is a preparatory step to remove the copper portion protected by the film.
[0058] Step 9: Remove the exposed dry film protecting the copper surface using a sodium hydroxide solution to expose the circuit pattern.
[0059] Step 10: After etching, the unexposed dry or wet film is removed by the developer, exposing the copper surface. This exposed copper surface is then dissolved and etched away with acidic copper chloride to obtain the desired circuitry.
[0060] Step 11: Remove the solder. Use solder remover to remove the solder from the circuit, restoring the circuit to its original copper color. Step 12: Optical Inspection (AOI) works by first taking a quick picture with a high-definition camera, and then comparing the picture with the original file. This fundamentally solves the problems of open circuits, short circuits, and micro-openings or micro-short circuits.
[0061] Step 13: Print solder resist. Apply a layer of solder resist to the board surface by screen printing or coating with solder resist ink. After exposure and development, expose the disks and holes to be soldered. Cover other areas with solder resist to prevent short circuits during soldering.
[0062] Step Fourteen: Solder Mask Exposure. First, place the solder mask film on a board completely covered with green solder mask. The areas where windows need to be opened are black, and the areas where windows don't need to be opened are transparent. Then, place the film on an exposure machine for exposure. The areas where windows need to be opened are not exposed because the film is black, and the black color blocks the light. The exposure changes as the state of the green solder mask changes.
[0063] Step 15: Print the required text, trademarks, parts and other symbols onto the PCB board using screen printing, and then expose the board surface to ultraviolet light.
[0064] Step Sixteen: Surface treatment to ensure good solderability or electrical properties. Common surface treatments include: tin plating, immersion gold, OSP, immersion tin, immersion silver, nickel-palladium-gold, electroplated hard gold, electroplated gold fingers, etc.
[0065] Step 17: Shaping and cutting the PCB into the required dimensions.
[0066] Step 18: Perform electrical tests and simulate the state of the circuit board. Power on the circuit board to check for open circuits or short circuits.
[0067] Step nineteen involves random sampling and inspection of the circuit board's appearance, dimensions, hole diameter, board thickness, markings, etc., to ensure it meets customer requirements. Qualified products are then packaged for easy storage and transportation.
[0068] Working principle: During use, the circuit board is pushed forward into the exposure machine during the exposure process. For double-sided PCB processing, after one side is exposed, it needs to be manually flipped to the other side for further exposure. By setting up the flipping device 2, when the rotary table 22 is perpendicular to the ground, the support platform 29 above and the lifting platform 40 of the lifting device 4 cooperate to form a plane, allowing the PCB board to be pushed into the exposure machine along the plane. When single-sided exposure is completed, the rotating wheel 20 is rotated to make the track plate 261 parallel to the ground with the entrance facing the PCB board. The PCB board is then pushed in along the track plate 261 until it reaches the bottom. At this time, in order to cooperate with the rotation of the rotary table 22, the lifting device 4 descends, leaving space in the middle for flipping. The rotating wheel 20 is moved to drive the rotary table 22 to rotate. During the descent, the clamping device 26 clamps the PCB board, reducing the possibility of the PCB board falling off during rotation. At this time, the rotary table completes the flipping, achieving the effect of saving manpower and quick flipping.
[0069] In use, by setting the tensioning device 23, most of the force is transmitted through the pulley during the flipping process. The first transmission belt 21 only needs to be driven in two places, and its position is fixed, so the tensioning device 23 is not required. If the second transmission belt 27, whose transmission position is movable, is not tensioned by applying a certain force, the second transmission belt 27 that drives the mechanism to move may fall off due to loosening after multiple movements. To prevent it from falling off, the tensioning device 23 is slidably connected to the base 1, and the groove is opened on the inner surface of the base 1. The transmission wheel 28 is rotatably connected to the tensioning device 23. The first spring 233 pushes the positioning moving block 232 forward. The large hydraulic rod 234, which is fixedly connected to the outer surface of the positioning moving block 232, adds thrust to the tensioning device 23, so that the tensioning device 23 pushes the transmission wheel 28 to always apply thrust to the second transmission belt 27.
[0070] In use, by setting up a shock-absorbing device 235, when the second transmission belt 27 moves, it applies a reaction force to the thrust of the tensioning device 23. Due to its own motion characteristics, the force applied to the tensioning device 23 is fluctuating. For the fluctuating force, the large hydraulic rod 234 may be vibrated, and the vibration hits the inside of the sliding block 231, causing damage to it. The support rings 2352 at both ends of the shock-absorbing device 235 will provide support for the large hydraulic rod 234 with large vibration amplitude, and the small hydraulic rod 2351 will weaken the vibration effect. At the same time, there is a gap between the support rings 2352 and the large hydraulic rod 234. The entire shock-absorbing device 235 is connected to the inside of the sliding block 231 through the second spring 2354, which acts as a damper when the vibration is small to achieve the shock absorption effect.
[0071] In use, by setting up the clamping device 26, when the rotating table rotates to the highest point at both ends, it is ready to flip. The included angle formed by the rollers 265 in the clamping device 26 is opened by the triangular block 25 at one end. At this time, the support plate 264 is opened, and the protrusion fixed on the support plate 264 moves in the groove of the sliding plate 263. Due to the force, the sliding plate 263 is expanded outward. At this time, the clamping plate 262 fixed on the sliding plate 263 is moved. So when preparing to flip, the clamping plate 262 is in an open state. During the flipping process, the support of the triangular block 25 is lost. Due to the force of the third spring 266, the recovery process makes the movement process reversed, thus achieving the function of clamping the PCB board during the flipping process.
[0072] In use, by setting the moving device 3, when pushing or flipping the PCB board, due to the setting of the support platform 29, it will be difficult to clamp smaller PCB boards. At this time, it is necessary to move one side of the base 1 to achieve the effect of being suitable for most PCB boards. For ordinary moving device 3, although it has a moving effect, since it is a flipping mechanism, debris on the PCB board may fall during the flipping process, blocking the movement. This makes ordinary moving device 3 difficult to handle this situation. The first rotating rod 33 and the second rotating rod 34 are set up. When the wheel 36 encounters debris, the upward force is converted to the cam 32 and the support displacement block 31 through the rotating connection, making it a suspension for the wheel 36, in order to deal with the situation where debris falls and jams the movement of the base 1.
[0073] In use, by setting up the lifting device 4, when not processing double-sided PCB boards or not using the flipping device 2, stepping on the pedal 48 drives the pull rod 47, causing the passive block 46 to move towards the center. The push block 43 fixed on the passive block 46 pushes the slide rod 42, causing the slide rod 42 to move inward, thereby raising the lifting platform 40. The lifting platform 40 and the support platform 29 become a plane, which can be used as a normal pushing plane. When the flipping device 2 needs to be used, the pedal 48 is released, and under the action of the return spring 49, the push-pull plates on both sides are pushed outward. Under the action of gravity, the lifting platform 40 descends, making room for the flipping mechanism to flip.
[0074] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.
Claims
1. A manufacturing apparatus for a 5.5G high-frequency high-speed circuit board, comprising a base (1), characterized in that: The base (1) is provided with a flipping device (2) inside, a moving device (3) is provided below the flipping device (2), and a lifting device (4) is provided between the moving devices (3). The flipping device (2) includes a rotating wheel (20). The outer surface of the rotating wheel (20) is rotatably connected to a first transmission belt (21). The inner surface of the first transmission belt (21) is rotatably connected to a rotating table (22). Tensioning devices (23) are provided on both sides of the rotating table (22). Telescopic rods (24) are provided between the tensioning devices (23). Triangular blocks (25) are provided above the telescopic rods (24). Clamping devices (26) are provided between the triangular blocks (25). A second transmission belt (27) is provided around the clamping device (26). A transmission wheel (28) is slidably connected to the outer surface of the second transmission belt (27). A support platform (29) is provided above the transmission wheel (28). The tensioning device (23) includes a sliding block (231), a positioning moving block (232) is slidably connected to the inner surface of the sliding block (231), a first spring (233) is fixedly connected to one side of the positioning moving block (232), a large hydraulic rod (234) is fixedly connected to the other side of the positioning moving block (232), and a shock-absorbing device (235) is provided between the large hydraulic rods (234).
2. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 1, characterized in that: The telescopic rod (24) is slidably connected to the two ends of the first transmission belt (21). The outer surface of the telescopic rod (24) is fixedly connected to the inner surface of the base (1). The outer surface of the base (1) is fixedly connected to the outer surface of the triangular block (25). The outer surface of the rotating table (22) is slidably connected to the second transmission belt (27). The outer surface of the tensioning device (23) is rotatably connected to the transmission wheel (28). The outer surface of the transmission wheel (28) is rotatably connected to the outer surface of the support table (29).
3. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 1, characterized in that: The shock absorption device (235) includes a small hydraulic rod (2351), a support ring (2352) is fixedly connected to the outer surface of the small hydraulic rod (2351), a sliding ring (2353) is provided between the support rings (2352), and a second spring (2354) is fixedly connected to the outer surface of the sliding ring (2353).
4. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 3, characterized in that: The outer surface of the support ring (2352) is slidably connected to a large hydraulic rod (234), the inner surface of the sliding ring (2353) is slidably connected to the outer surface of the small hydraulic rod (2351), and the outer surface of the second spring (2354) is fixedly connected to a sliding block (231).
5. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 1, characterized in that: The clamping device (26) includes a track plate (261), a clamping plate (262) is slidably connected to the inner surface of the track plate (261), a sliding plate (263) is fixedly connected to the outer surface of the clamping plate (262), a support plate (264) is fixedly connected to the outer surface of the sliding plate (263), a roller (265) is rotatably connected to the outer surface of the support plate (264), a third spring (266) is fixedly connected to the outer surface of the support plate (264), a rotating platform (22) is fixedly connected to the outer surface of the third spring (266), the outer surface of the rotating platform (22) is fixedly connected to the outer surface of the track plate (261), the outer surface of the support plate (264) is slidably connected to the inner surface of the rotating platform (22), and the inner surface of the rotating platform (22) is slidably connected to the outer surface of the sliding plate (263).
6. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 1, characterized in that: The moving device (3) includes a support displacement block (31), a cam (32) is rotatably connected to the outer surface of the support displacement block (31), a first rotating rod (33) is rotatably connected to the outer surface of the cam (32), a second rotating rod (34) is provided below the first rotating rod (33), a connecting block (35) is rotatably connected to the outer surface of the second rotating rod (34), and a wheel (36) is rotatably connected to the outer surface of the connecting block (35).
7. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 6, characterized in that: The inner surface of the second rotating rod (34) is rotatably connected to the outer surface of the support displacement block (31), the outer surface of the first rotating rod (33) is rotatably connected to the inner surface of the connecting block (35), and the outer surface of the first rotating rod (33) is rotatably connected to the inner surface of the second rotating rod (34).
8. The manufacturing apparatus for a 5.5G high-frequency, high-speed circuit board according to claim 1, characterized in that: The lifting device (4) includes a lifting platform (40), a base (41) is provided below the lifting platform (40), a slide rod (42) is slidably connected to the inner surface of the base (41), a push block (43) is slidably connected to the outer surface of the slide rod (42), a fixed seat (44) is provided on both sides of the push block (43), a limit groove (45) is fixedly connected to the upper surface of the fixed seat (44), a passive block (46) is slidably connected to the inner surface of the limit groove (45), a pull rod (47) is rotatably connected to the inner surface of the passive block (46), a foot pedal (48) is rotatably connected to the outer surface of the pull rod (47), and a return spring (49) is provided above the foot pedal (48).
9. The manufacturing apparatus for a 5.5G high-frequency high-speed circuit board according to claim 8, characterized in that: The outer surface of the reset spring (49) is fixedly connected to the outer surface of the push block (43), the upper surface of the push block (43) is fixedly connected to the outer surface of the passive block (46), the lower surface of the fixed seat (44) is fixedly connected to the base (1), and the outer surface of the slide rod (42) is rotatably connected to the inner surface of the lifting platform (40).
10. A manufacturing process for a 5.5G high-frequency, high-speed circuit board, characterized in that, Includes the following steps: Step 1: Material preparation. The raw copper-clad laminate is cut into boards that can be manufactured on the production line. Step 2: Drill holes to create through-holes between PCB layers, thereby connecting the layers. Step 3: Copper plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank to form a copper layer that metallizes the holes, depositing copper on the surface of the originally insulating substrate to achieve interlayer electrical connectivity. Step 4: Lamination. A layer of blue dry film is pressed onto the PCB board after lamination. The dry film is a carrier and is very important in the circuit process. Compared to wet films, dry films have higher stability and better quality, and can be used directly for non-metallic vias. Step 5: Exposure, align the film and the substrate with the pressed dry film, place the aligned substrate on the flipping device (2), push it into the inside of the exposure machine, use ultraviolet light to transfer the film pattern onto the photosensitive dry film, pull out the exposed substrate, rotate the rotating wheel (20) to rotate the rotating table (20) to the left, push the substrate into the track plate (261), the rotating wheel (20) drives the rotating table (22) to rotate to the right to complete the flipping, align the film and dry film again, rotate the rotating table (22) to be perpendicular to the ground, step on the foot pedal (48), raise the lifting platform (40), push the substrate into the exposure machine, and complete the double-sided exposure; Step 6: Development. Use the weak alkalinity of the developer to dissolve and wash away the unexposed dry or wet film, leaving the exposed parts intact. Step 7: Electroplating. Place the PCB board into the electroplating equipment. The copper parts will be electroplated, while the parts blocked by the film will not react. Step 8: Soldering – This is a preparatory step to remove the copper protected by the film. Step 9: Remove the exposed dry film protecting the copper surface using a sodium hydroxide solution to expose the circuit pattern. Step 10: After etching, the unexposed dry or wet film is removed by the developer, exposing the copper surface. Acidic copper chloride is used to dissolve and etch away this exposed copper surface to obtain the desired circuit. Step 11: Remove the solder. Use solder remover to remove the solder from the circuit, restoring the circuit to its original copper color. Step 12 Optical Inspection (AOI) works by first taking a quick picture with a high-definition image camera, and then comparing the picture with the original file. This fundamentally solves the problems of open and short circuits, as well as micro-open and micro-short circuits. Step 13: Print solder resist. Apply a layer of solder resist to the board surface by screen printing or coating with solder resist ink. Expose and develop the surface to expose the disks and holes to be soldered. Cover other areas with solder resist to prevent short circuits during soldering. Step Fourteen: Solder Mask Exposure. First, place the solder mask film on a board completely covered with green solder mask. The areas where windows need to be opened are black, and the areas where windows don't need to be opened are transparent. Then, place the film on an exposure machine for exposure. The areas where windows need to be opened are not exposed because the film is black, and the black color blocks the light. The exposure changes as the state of the green solder mask changes. Step 15: Print the required text, trademarks, parts and other symbols onto the PCB board using screen printing, and then expose the board surface to ultraviolet light. Step Sixteen: Surface treatment to ensure good solderability or electrical properties; Common surface treatments include: tin plating, immersion gold, OSP, immersion tin, immersion silver, nickel-palladium-gold, electroplated hard gold, and electroplated gold fingers. Step 17: Shaping and cutting the PCB into the required dimensions; Step 18: Perform electrical tests and simulate the state of the circuit board. Power on the circuit board to check for open circuits or short circuits. Step 19: Sampling and inspection of the circuit board's appearance, dimensions, hole diameter, board thickness, markings, etc., to ensure it meets customer requirements; Pack qualified products for easy storage and transportation.