Manufacturing method of bendable plate

By forming blind slot structures, setting peelable films, and laminating thickened layers during the circuit board manufacturing process, the problem of insufficient bendability of circuit boards has been solved, and space utilization has been improved.

CN121815554APending Publication Date: 2026-04-07TRIPOD WUXI ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-31
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

Existing circuit board manufacturing methods produce circuit boards with insufficient flexibility, resulting in low space utilization.

Method used

A bendable plate is formed by forming first and second blind groove structures during the manufacturing process of the circuit board, and placing a peelable film therebetween, then pressing a thickening layer, and finally forming a bendable plate by a windowing step, including a bendable portion and a connecting portion.

Benefits of technology

It improves the flexibility of the circuit board and enhances space utilization.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a manufacturing method of a bendable plate, which comprises the following steps: a preposition step: providing a first stacking structure and a second stacking structure; a first blind groove structure forming step: forming a first blind groove structure on one surface of the second stacking structure; a peelable film arrangement step: arranging a peelable film between the two first blind grooves of the first blind groove structure; a first pressing step, wherein the first stacking structure and the second stacking structure are pressed; a second blind groove structure forming step: forming a second blind groove structure communicated with the first blind groove structure; and a windowing step: removing a part of the first stacking structure, a part of the second stacking structure and the peelable film along the first blind groove structure and the second blind groove structure so as to form a bendable plate. According to the manufacturing method of the bendable board, the problem that the space utilization rate of an existing circuit board is not high enough can be solved.
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Description

TECHNICAL FIELD

[0001] The present application relates to a manufacturing method of a bendable structure, in particular, a manufacturing method of a bendable board. BACKGROUND

[0002] The bendability of the circuit board manufactured by the existing manufacturing method of a circuit board is not good enough, and thus the space utilization is not high enough in use. SUMMARY

[0003] The present application discloses a manufacturing method of a bendable board, which is mainly used to improve the bendability of the circuit board manufactured by the existing manufacturing method of a circuit board, and thus the space utilization is not high enough in use.

[0004] One embodiment of the present application discloses a manufacturing method of a bendable board, which comprises: a pre-step of providing a first stack structure and a second stack structure; a first blind groove structure forming step of forming a first blind groove structure on the surface of the second stack structure; wherein the first blind groove structure comprises two first blind grooves; a peelable film setting step of setting a peelable film between the two first blind grooves; a first pressing step of pressing the first stack structure and the second stack structure; a second pressing step of pressing a thickening layer on the second stack structure; a second blind groove structure forming step of forming a second blind groove structure with an opening direction opposite to that of the first blind groove structure; wherein the second blind groove structure comprises two second blind grooves connected to the two first blind grooves; a windowing step of removing part of the first stack structure, part of the second stack structure and the peelable film along the two first blind grooves and the two second blind grooves to form a window, thereby forming a bendable board.

[0005] Optionally, the bendable board comprises a body part, a bendable part and a connecting part; wherein the body part is defined by part of the first stack structure and part of the second stack structure on one side of the window, the bendable part is defined by part of the first stack structure and part of the second stack structure on the other side of the window, and the connecting part comprising the thickening layer is connected to the body part and the bendable part; wherein the connecting part can be bent so that the bendable part can be bent towards the body part.

[0006] Optionally, after the second pressing step and before the second blind groove structure forming step, the manufacturing method of the bendable board further comprises an ink layer forming step of forming an ink layer on the thickening layer corresponding to the position of the peelable film.

[0007] Optionally, the depth of each first blind groove is 0.05-0.5 mm.

[0008] Optionally, the thickness of the connecting part is 0.1-0.5 mm.

[0009] Optionally, the distance between the body and the bendable part is 5 mm to 40 mm.

[0010] Optionally, the connecting part can be bent at a bendable angle, and the maximum bendable angle is greater than 90 degrees.

[0011] Optionally, the first blind groove structure forming step, the peelable membrane setting step, the second blind groove structure forming step, and the window opening step are performed multiple times to form a bendable plate with multiple bendable portions.

[0012] Optionally, there are two second stacked structures. The first blind groove structure forming step and the peelable film setting step are performed twice to form a first blind groove structure and a peelable film on each second stacked structure. In the first pressing step, the two second stacked structures are pressed onto both sides of the first stacked structure, and in the second pressing step, the two thickened layers are pressed onto the two second stacked structures. The second blind groove structure forming step and the windowing step are performed twice to form a bendable plate with two bendable portions and two connecting portions.

[0013] Optionally, one of the connecting parts is connected to one side of the main body and one of the bendable parts, and the other connecting part is connected to the other side of the main body and another bendable part.

[0014] In summary, the manufacturing method of the bendable board of the present invention can effectively improve the problem of insufficient bendability of the circuit boards produced by the existing circuit board manufacturing methods through the technical solutions of "the second pressing step, pressing the thickened layer onto the second stacked structure" and "the windowing step, removing a portion of the first stacked structure, a portion of the second stacked structure and the peelable film along the two first blind slots and the two second blind slots to form the window, thereby forming the bendable board".

[0015] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating a method for manufacturing a bendable plate according to an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the preliminary steps in the manufacturing method of the bendable plate according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the first blind groove structure formation step in the manufacturing method of the bendable plate according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the peelable film setting step in the manufacturing method of the bendable plate according to an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the first pressing step in the manufacturing method of the bendable plate according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the second pressing step in the manufacturing method of the bendable plate according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the ink layer formation step in the manufacturing method of a bendable plate according to an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram of the second blind groove structure formation step in the manufacturing method of the bendable plate according to an embodiment of the present invention.

[0024] Figure 9 This is a schematic diagram of a bendable plate according to an embodiment of the present invention.

[0025] Figure 10 This is a schematic diagram of the bendable plate in a bent state according to an embodiment of the present invention.

[0026] Figure 11 This is a schematic diagram of a bendable plate according to another embodiment of the present invention. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of the "manufacturing method of a bendable plate" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0028] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0029] Please seeFigure 1 As shown, Figure 1 This is a flowchart illustrating a method for manufacturing a bendable plate according to an embodiment of the present invention. The present invention provides a method for manufacturing a bendable plate. The method includes a pre-processing step S110, a first blind groove structure forming step S120, a peelable film setting step S130, a first pressing step S140, a second pressing step S150, a second blind groove structure forming step S170, and a windowing step S180.

[0030] Please see Figure 2 As shown, Figure 2 This is a schematic diagram of the preliminary steps in the manufacturing method of the bendable plate according to an embodiment of the present invention. In the preliminary step S110, a first stacked structure 1 and at least one second stacked structure 2 are provided. The first stacked structure 1 and the second stacked structure 2 can be formed, for example, by stacking a copper foil layer and an insulating layer. The aforementioned insulating layer can be, for example, paper impregnated with phenolic resin or glass fiber cloth impregnated with epoxy resin, but the present invention does not limit the material of the insulating layer. Furthermore, although Figure 2 The number of the second stacking structures 2 shown is two, but in other embodiments, the number of the second stacking structures 2 may be one or more.

[0031] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the first blind groove structure forming step in the manufacturing method of a bendable plate according to an embodiment of the present invention. In the first blind groove structure forming step S120, a first blind groove structure 3 is formed on the surface of the second stacked structure 2. The first blind groove structure 3 is defined as including two first blind grooves 31. In one embodiment, the first blind groove structure forming step S120 may be formed by laser. In other words, each first blind groove 31 may be a laser blind groove. Furthermore, the depth d1 of each first blind groove 31 may be 0.05 mm to 0.5 mm, but the present invention is not limited thereto. The depth d1 of each first blind groove 31 may be 0.1 mm to 0.21 mm.

[0032] Please see Figure 4 As shown, Figure 4 This is a schematic diagram of the peelable film setting step in the manufacturing method of a bendable plate according to an embodiment of the present invention. In the peelable film setting step S130, a peelable film 4 is set between the two first blind slots 31. Specifically, the peelable film 4 is set at the position between the two first blind slots 31 on the second stacked structure 2. The peelable film 4 may be, for example, a peelable ink layer formed of a high-temperature resistant resin.

[0033] Please seeFigure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram of the first pressing step in the manufacturing method of the bendable plate according to an embodiment of the present invention, and... Figure 6 This is a schematic diagram of the second pressing step in the manufacturing method of the bendable plate according to an embodiment of the present invention. In the first pressing step S140, the first stacked structure 1 and the second stacked structure 2 are pressed together. In the second pressing step S150, a thickening layer 5 is pressed onto the second stacked structure 2. In one embodiment, in the first pressing step S140, the second stacked structure 2 may be pressed between an auxiliary layer 6 and the first stacked structure 1, and in the second pressing step, the thickening layer 5 may be pressed onto the auxiliary layer 6. In this way, the peelable film 4 can be covered by the auxiliary layer 6. Through the auxiliary layer 6, the connecting portion C (such as...) Figure 9 The thickness t (as shown) can be more easily controlled.

[0034] Please see Figure 7 As shown, Figure 7 This is a schematic diagram of the ink layer formation step in the manufacturing method of a bendable plate according to an embodiment of the present invention. After the second pressing step S150 and before the second blind groove structure formation step S170, the manufacturing method of the bendable plate may further include an ink layer formation step S160, in which the ink layer 7 is formed at the position of the thickened layer 5 corresponding to the peelable film 4.

[0035] Please see Figure 8 As shown, Figure 8 This is a schematic diagram of the second blind groove structure forming step in the manufacturing method of a bendable plate according to an embodiment of the present invention. In the second blind groove structure forming step S170, a second blind groove structure 8 is formed with an opening direction opposite to that of the first blind groove structure 3. Figure 8 As shown, the opening of the first blind slot structure 3 on the right side faces... Figure 8 The opening of the second blind slot structure 8, located above and on the right side, faces... Figure 8 Below the first blind slot 31. The second blind slot structure 8 includes two second blind slots 81 that communicate with the two first blind slots 31. In other words, each second blind slot 81 is connected to the first blind slot 31 by the bottom of one of the corresponding first blind slots 31.

[0036] In one embodiment, the second blind groove structure forming step S170 can be performed by blind scooping. It is worth mentioning that since the first blind groove structure 3 is formed in the first blind groove structure forming step S120, the accuracy requirement in the second blind groove structure forming step S170 can be reduced, thus reducing the likelihood of the second blind groove structure 8 being too deep or too shallow.

[0037] Please see Figure 9 As shown, Figure 9 This is a schematic diagram of a bendable plate according to an embodiment of the present invention. Figure 9 This can also be seen as a schematic diagram of the windowing step in the manufacturing method of the bendable plate according to an embodiment of the present invention. In the windowing step S180, a portion of the first stacked structure 1, a portion of the second stacked structure 2, and the peelable film 4 are removed along the two first blind grooves 31 and the two second blind grooves 81 to form a window 9, thereby forming a bendable plate 100. In other words, in the windowing step S180, the portion of the first stacked structure 1 and the portion of the second stacked structure 2 located on the peelable film 4 opposite to the ink layer 7 are removed.

[0038] Please see Figure 10 As shown, Figure 10 This is a schematic diagram of a bendable plate in a bent state according to an embodiment of the present invention. The bendable plate 100 includes a body portion A, a bendable portion B, and a connecting portion C. The opening 9 is spaced between the body portion A and the bendable portion B. The body portion is defined by a portion of the first stacking structure 1 and a portion of the second stacking structure 2 located on one side of the opening 9, and the bendable portion B is defined by a portion of the first stacking structure 1 and a portion of the second stacking structure 2 located on the other side of the opening 9.

[0039] The connecting portion C connects the main body portion A and the bendable portion B. The connecting portion C can be bent so that the bendable portion B can bend towards the main body portion A. The connecting portion C can be bent at a bendable angle α, which can be from 0 degrees to 180 degrees, and the maximum value of the bendable angle α can be greater than 90 degrees, greater than 120 degrees, or greater than 150 degrees.

[0040] The interval d2 between the main body A and the bendable part B can be from 5 mm to 40 mm. The interval d2 can be considered as the distance between two first blind slots 31 or two second blind slots 81. The interval d2 can be no less than 2.5 times the thickness t of the bendable plate 100 to make the connecting part C easier to bend, but the invention is not limited thereto. Furthermore, the thickness t of the connecting part C can be from 0.1 mm to 0.5 mm to give the connecting part C excellent bending resistance.

[0041] In one embodiment, the ink layer 7 may be formed on the connecting portion C at a position opposite to the window 9, thereby improving the bending resistance of the connecting portion C and providing an anti-breakage effect.

[0042] The connecting portion C includes the thickening layer 5 and may also include the auxiliary layer 6. The connecting portion C and the auxiliary layer 6 may be formed by stacking a copper foil layer and an insulating layer, and the insulating layer may be, for example, glass fiber cloth impregnated with epoxy resin.

[0043] Please see Figure 11 As shown, Figure 11 This is a schematic diagram of a bendable plate according to another embodiment of the present invention. It is worth noting that the first blind groove structure forming step S120, the peelable film setting step S130, the second blind groove structure forming step S170, and the window opening step S180 can be performed multiple times to form the bendable plate 100 having a plurality of the bendable portions B. For example, the number of bendable portions B is one to four.

[0044] In one embodiment, there are two second stacked structures 2. The first blind groove structure forming step S120 and the peelable film setting step S130 are performed twice to form the first blind groove structure 3 and the peelable film 4 on each of the second stacked structures 2. In the first pressing step S140, the two second stacked structures 2 are pressed onto both sides of the first stacked structure 1, and in the second pressing step S150, the two thickening layers 5 are pressed onto the two second stacked structures 2. The second blind groove structure forming step S170, the ink layer forming step S160, and the windowing step S180 are performed twice to form the bendable plate 100 having two bendable portions B and two connecting portions C. That is, there are two connecting portions C and two bendable portions B.

[0045] In the foregoing embodiments, one of the connecting portions C is connected to one side of the body portion A and one of the bendable portions B, and the other connecting portion C is connected to the other side of the body portion A and the other bendable portion B. In the foregoing embodiments, the bendable portion B is defined by a portion of the first stacked structure 1, a portion of the second stacked structure 2, a portion of the auxiliary layer 6, and a portion of the thickening layer 5.

[0046] [Beneficial Effects of the Embodiments of the Invention]

[0047] In summary, the manufacturing method of the bendable board of the present invention can effectively improve the problem of insufficient bendability of the circuit boards produced by the existing circuit board manufacturing methods through the technical solutions of "the second pressing step, pressing the thickened layer onto the second stacked structure" and "the windowing step, removing a portion of the first stacked structure, a portion of the second stacked structure and the peelable film along the two first blind slots and the two second blind slots to form the window, thereby forming the bendable board".

[0048] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention.

Claims

1. A method for manufacturing a bendable plate, characterized in that, The method for manufacturing the bendable plate includes: A preliminary step includes providing a first stacking structure and a second stacking structure; A first blind slot structure forming step involves forming a first blind slot structure on the surface of the second stacked structure; wherein the first blind slot structure comprises two first blind slots; A peelable membrane setting step involves setting a peelable membrane between the two first blind grooves; A first pressing step is to press the first stacked structure and the second stacked structure together; A second lamination step involves laminating a thickened layer onto the second stacked structure; A second blind slot structure forming step involves forming a second blind slot structure with an opening direction opposite to that of the first blind slot structure; wherein the second blind slot structure includes two second blind slots communicating with the two first blind slots; and In the first windowing step, a portion of the first stacked structure, a portion of the second stacked structure, and the peelable membrane are removed along the two first blind grooves and the two second blind grooves to form a window, thereby forming a bendable plate.

2. The method for manufacturing a bendable plate according to claim 1, characterized in that, The bendable panel includes a body portion, a bendable portion, and a connecting portion; wherein the body portion is defined by a portion of a first stacked structure and a portion of a second stacked structure located on one side of the window, the bendable portion is defined by a portion of the first stacked structure and a portion of the second stacked structure located on the other side of the window, and the connecting portion including the thickened layer is connected to the body portion and the bendable portion; wherein the connecting portion can be bent so that the bendable portion can be bent toward the body portion.

3. The method for manufacturing a bendable plate according to claim 1, characterized in that, After the second pressing step and before the second blind groove structure forming step, the method for manufacturing the bendable plate further includes an ink layer forming step, in which an ink layer is formed at the position of the thickened layer corresponding to the peelable film.

4. The method for manufacturing a bendable plate according to claim 1, characterized in that, The depth of each of the first blind slots is 0.05 mm to 0.5 mm.

5. The method for manufacturing a bendable plate according to claim 2, characterized in that, The thickness of the connecting part is 0.1 mm to 0.5 mm.

6. The method for manufacturing a bendable plate according to claim 2, characterized in that, The distance between the main body and the bendable part is 5 mm to 40 mm.

7. The method for manufacturing a bendable plate according to claim 2, characterized in that, The connecting part can be bent at a bendable angle, and the maximum value of the bendable angle is greater than 90 degrees.

8. The method for manufacturing a bendable plate according to claim 2, characterized in that, The first blind groove structure forming step, the peelable film setting step, the second blind groove structure forming step, and the window opening step are performed multiple times to form the bendable plate having multiple bendable portions.

9. The method for manufacturing a bendable plate according to claim 8, characterized in that, The number of the second stacked structures is two. The first blind groove structure forming step and the peelable film setting step are performed twice to form the first blind groove structure and the peelable film on each of the second stacked structures. In the first pressing step, the two second stacked structures are pressed onto both sides of the first stacked structure, and in the second pressing step, the two thickened layers are pressed onto the two second stacked structures. The second blind groove structure forming step and the windowing step are performed twice to form a bendable plate having two bendable portions and two connecting portions.

10. The method for manufacturing a bendable plate according to claim 9, characterized in that, One of the connecting portions is connected to one side of the body portion and one of the bendable portions, and the other connecting portion is connected to the other side of the body portion and the other bendable portion.