Server cooling system and server

Abstract

The invention discloses a server cooling system and a server, the server cooling system comprises a cooling circulation loop, a phase change liquid cooling module, a medium separation module, a medium cooling module and a pressure relief module, the phase change liquid cooling module comprises a first inlet pipeline, a phase change liquid cooling unit and a first outlet pipeline which are communicated in sequence, the first inlet pipeline and the first outlet pipeline are respectively communicated with the cooling circulation loop; the medium separation module is communicated with the first outlet pipeline; the medium cooling module communicates with the cooling circulation loop and further communicates with the medium separation module. And the pressure relief module comprises a second inlet pipeline, a pressure relief unit and a second outlet pipeline, the second inlet pipeline is connected with the first outlet pipeline, and the second outlet pipeline is used for conveying the liquid medium to the medium cooling module. The single-phase cold plate solves the problem that a single-phase cold plate in the prior art is insufficient in heat dissipation effect.

Description

Technical Field

[0001] This invention belongs to the field of liquid cooling technology, specifically relating to a server cooling system and a server. Background Technology

[0002] With the rapid development of the digital industry, data centers using new cooling technologies are also developing rapidly. Single-phase cold plate liquid cooling technology, as a new heat dissipation technology, is being widely used in new data centers, which can reduce the power efficiency of data centers to around 1.1.

[0003] However, as the power consumption of GPU and CPU chips gradually increases, and the power consumption of GPUs may even increase to over 1500W in the future, the heat generated by high-power chips is also higher. However, the current single-phase cold plate liquid cooling technology has poor heat dissipation effect and cannot meet the higher heat dissipation requirements. Summary of the Invention

[0004] The present invention aims to provide a server cooling system and a server, which solves the problem of poor heat dissipation effect of the existing single-phase cold plate liquid cooling technology.

[0005] To solve the above-mentioned technical problems, the present invention is implemented as follows: In a first aspect, embodiments of the present invention provide a server cooling system, comprising: a cooling circulation loop, wherein the cooling circulation loop is used to drive the circulation of a cooling medium; The phase change liquid cooling module includes a first inlet pipe, a phase change liquid cooling unit, and a first outlet pipe connected in sequence. The first inlet pipe and the first outlet pipe are respectively connected to the cooling circulation loop. The phase change liquid cooling unit is used to cool the server, causing the cooling medium to absorb the heat of the server, boil, and generate a gas-liquid two-phase fluid. A media separation module is connected to the first outlet pipeline, and the media separation module is used to separate the gas medium and the liquid medium in the gas-liquid two-phase fluid. A medium cooling module, connected to the cooling circulation loop, and also connected to the medium separation module, is used to receive and cool the liquid medium; and... The pressure relief module includes a second inlet pipe, a pressure relief unit, and a second outlet pipe. The second inlet pipe is connected to the first outlet pipe and is used to receive the gas medium in the gas-liquid two-phase fluid. The pressure relief unit is used to cool the gas medium and convert it into a liquid medium. The second outlet pipe is used to transmit the liquid medium to the medium separation module.

[0006] Optionally, the pressure relief module further includes: The detection unit is used to detect the pressure of the cooling circulation loop so that the pressure relief unit is activated when the pressure of the cooling circulation loop increases to a preset pressure value.

[0007] Optionally, the pressure relief unit includes: A liquid recovery device includes a gas cooling structure and a liquid recovery structure. The gas cooling structure is used to increase the contact area with the gas medium and cool it into the liquid medium. The liquid recovery structure contains the liquid medium and is connected to a second outlet pipeline.

[0008] Optionally, the media separation module includes: A gas-liquid separator, connected to the first outlet pipeline, is used to separate the gaseous medium and the liquid medium in the gas-liquid two-phase fluid; and... A liquid level stabilizer is connected to the gas-liquid separator, and the liquid level stabilizer is used to maintain the liquid level of the liquid medium in the gas-liquid separator within a preset range.

[0009] Optionally, the level stabilizer includes: Level holder; The high-level pipeline is equipped with a first one-way valve. One end of the high-level pipeline is connected to the high liquid level line in the gas-liquid separator, and the other end is connected to the liquid level holder. The flow direction of the liquid medium is configured to flow from the gas-liquid separator to the liquid level holder. The low-level pipeline is equipped with a second one-way valve. One end of the low-level pipeline is connected to the low liquid level line in the gas-liquid separator, and the other end is connected to the liquid level holder. The flow direction of the liquid medium is configured to flow from the liquid level holder to the gas-liquid separator.

[0010] Optionally, the medium cooling module includes: A first cooling unit is located within the pressure relief unit and is used to cool the gaseous medium within the pressure relief unit and liquefy it into the liquid medium. A second cooling unit, located within the medium separation module, is used to cool the gaseous medium in the gas-liquid two-phase fluid received by the medium separation module, and to liquefy the gaseous medium into the liquid medium; and... The third cooling unit receives the liquid medium from the medium separation module and cools the liquid medium.

[0011] Optionally, the cooling circulation loop includes a circulation pump connected between the third cooling unit and the first inlet pipe, the circulation pump being used to drive the flow of the cooling medium.

[0012] Optionally, it also includes a heat recovery module, which is connected to the medium cooling module and is used to recover heat from the medium cooling module.

[0013] Optionally, the pressure resistance rating of the first outlet pipeline and the second inlet pipeline is higher than that of the first inlet pipeline.

[0014] Secondly, embodiments of the present invention provide a server including the server cooling system described above.

[0015] In embodiments of the present invention, the server cooling system includes a cooling circulation loop, a phase change liquid cooling module, a media separation module, a media cooling module, and a pressure relief module. The cooling circulation loop drives the continuous flow of the cooling medium, ensuring the continuity and stability of the server's heat dissipation process. The phase change liquid cooling module utilizes the cooling medium to absorb heat from inside the server and boil, generating a gas-liquid two-phase fluid. The large amount of heat absorbed during the vaporization process significantly improves heat dissipation efficiency, solving the problem of insufficient heat dissipation capacity of single-phase cold plates. Simultaneously, the media separation module and the media cooling module separate the gaseous and liquid media of the gas-liquid two-phase fluid and cool them, ensuring that the cooling medium can continuously and efficiently absorb heat during circulation, maintaining the thermal balance of the server cooling system. The pressure relief module addresses the problem of increased internal pipeline pressure caused by phase change, reducing the internal pressure of the server cooling system. Furthermore, by recovering the vaporized cooling medium, it reduces cooling medium loss and environmental pollution, improving the environmental friendliness and economy of the server cooling system.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of a server cooling system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the server cooling system according to another embodiment of the present invention.

[0018] Figure label: 100. Server cooling system; 1. Cooling circulation loop; 11. Circulation pump; 2. Phase change liquid cooling module; 21. First inlet pipe; 22. Phase change liquid cooling unit; 23. First outlet pipe; 24. Distributor; 3. Medium separation module; 31. Gas-liquid separator; 32. Liquid level stabilizer; 321. Liquid level holder; 322. High-level pipeline; 3221. First check valve; 323. Low-level pipeline; 3231. Second check valve; 4. Medium cooling module; 41. First cooling unit; 42. Second cooling unit; 43. Third cooling unit; 5. Pressure relief module; 51. Second inlet pipe; 52. Pressure relief unit; 521. Liquid recovery device; 5211. Gas cooling structure; 5212. Liquid recovery structure; 53. Second outlet pipe; 54. Detection unit; 6. Heat recovery module. Detailed Implementation

[0019] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] The terms "first," "second," etc., used in the specification and claims of this invention are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] With the rapid development of the digital industry, data centers using new cooling technologies are also developing rapidly. Single-phase cold plate liquid cooling technology, as a new heat dissipation technology, is being widely used in new data centers, which can reduce the power efficiency of data centers to around 1.1.

[0022] However, as the power consumption of GPU and CPU chips gradually increases, and the power consumption of GPUs may even increase to over 1500W in the future, the heat generated by high-power chips is also higher. However, the current single-phase cold plate liquid cooling technology has poor heat dissipation effect and cannot meet the higher heat dissipation requirements.

[0023] Therefore, one of the core concepts of this invention is that by maintaining the state of the cooling medium as a two-phase gas-liquid fluid during the heat dissipation process, the heat absorption capacity of the limited cooling medium is improved. Furthermore, by maintaining the pressure inside the cooling circulation loop within a safe limit through the pressure relief module, the cooling medium can be recycled and reused, ensuring a significant improvement in heat absorption efficiency. This also better protects the environment and reduces the loss of the cooling medium.

[0024] This invention provides a server cooling system 100 and a server, which can solve the problem of poor heat dissipation effect of single-phase cold plate liquid cooling technology in the prior art.

[0025] Figure 1 This is a schematic diagram of the structure of a server cooling system 100 according to an embodiment of the present invention, as shown below. Figure 1 As shown, the server cooling system 100 includes: a cooling circulation loop 1, a phase change liquid cooling module 2, a media separation module 3, a media cooling module 4, and a pressure relief module 5. The cooling circulation loop 1 drives the flow of the cooling medium; the phase change liquid cooling module 2 includes a first inlet pipe 21, a phase change liquid cooling unit 22, and a first outlet pipe 23 connected in sequence. The first inlet pipe 21 and the first outlet pipe 23 are respectively connected to the cooling circulation loop 1. The phase change liquid cooling unit 22 cools the server, causing the cooling medium to absorb the server's heat, boil, and generate a gas-liquid two-phase fluid; the media separation module 3 is connected to the first outlet pipe 23 and is used to separate the gaseous medium from the gas-liquid two-phase fluid. The medium cooling module 4 is connected to the cooling circulation loop 1 and is also connected to the medium separation module 3, for receiving and cooling the liquid medium; the pressure relief module 5 includes a second inlet pipe 51, a pressure relief unit 52 and a second outlet pipe 53, the second inlet pipe 51 is connected to the first outlet pipe 23, for receiving the gas medium in the gas-liquid two-phase fluid, the pressure relief unit 52 is used to cool the gas medium and convert it into a liquid medium, and the second outlet pipe 53 is used to transmit the liquid medium to the medium separation module 3.

[0026] It should be noted that, in this embodiment, the cooling circulation loop 1 ensures the continuity and stability of the server's heat dissipation process by driving the continuous flow of the cooling medium, avoiding localized overheating or decreased heat dissipation efficiency caused by stagnation of the cooling medium, and improving the reliability of the server's heat dissipation system. It is understood that, because the cooling medium needs to flow continuously and maintain good heat absorption capacity, the cooling medium in this embodiment is a liquid medium. However, in other embodiments, depending on the specific requirements, the cooling medium can be a solid or a gas.

[0027] Correspondingly, the phase change liquid cooling module 2 includes a first inlet pipe 21, a phase change liquid cooling unit 22, and a first outlet pipe 23. The cooling medium flows into the phase change liquid cooling unit 22 through the first inlet pipe 21 and flows out through the first outlet pipe 23 after passing through the phase change liquid cooling unit 22. In some embodiments, there are multiple phase change liquid cooling units 22, each of which is used for the corresponding position of the chip in the server, thereby achieving cooling and heat dissipation of the chip at the corresponding position. Furthermore, the cooling medium absorbs the heat of the chip in the server in the phase change liquid cooling unit 22 and boils to generate a gas-liquid two-phase fluid. The gas-liquid two-phase fluid refers to the cooling medium continuously vaporizing during the boiling process, so that the cooling medium can maintain both liquid and gas states. It can be understood that a large amount of heat can be absorbed during the vaporization process, thus significantly enhancing the heat dissipation efficiency through the latent heat of vaporization. Compared with the single-phase heat transfer of liquid media, the phase change heat transfer of the cooling medium in the embodiments of the present invention can cope with the huge heat generated by high-power chips, solving the technical problem of insufficient heat dissipation capacity of single-phase cold plates in the background art.

[0028] In some embodiments, the phase change liquid cooling module 2 further includes a distributor connected between the first inlet pipe 21 and the plurality of phase change liquid cooling units 22, for distributing the cooling medium of the first inlet pipe 21 evenly to the plurality of phase change liquid cooling units 22, thereby further improving the effect of uniform heat dissipation of chips at various locations of the server and avoiding local overheating of the server.

[0029] The media separation module 3 is connected to the first outlet pipe 23 and is used to separate the gas medium and liquid medium in the gas-liquid two-phase fluid. It can effectively prevent the gas medium from accumulating in the cooling circulation loop 1, reduce the risk of pressure fluctuations or increased flow resistance caused by the accumulation of gas medium, thereby improving the stability and safety of the server cooling system 100 and reducing potential failure risks.

[0030] Correspondingly, the medium cooling module 4 connects the cooling circulation loop 1 and the medium separation module 3, and is responsible for receiving and cooling the separated liquid medium. By reducing the temperature of the liquid medium to a certain range (at least below the boiling point), it ensures that the cooling medium can continuously and efficiently absorb heat in the circulation, maintain the thermal balance of the server cooling system 100, and ensure that the cooling medium can circulate repeatedly and dissipate heat continuously.

[0031] The pressure relief module 5 receives the gaseous medium from the first outlet pipe 23 through the second inlet pipe 51, and uses the pressure relief unit 52 to cool the gaseous medium and convert it into a liquid medium, which is then transmitted to the medium separation module 3 through the second outlet pipe 53. On the one hand, the pressure relief module 5 can solve the problem of pressure increase in the cooling loop 1 after the cooling medium changes from a liquid medium to a gaseous medium, reducing the risk of overpressure in the server cooling system 100; on the other hand, it also avoids the direct discharge of the cooling medium into the environment by recovering the vaporized cooling medium, reducing the loss of cooling medium and environmental pollution, and improving the environmental friendliness and economy of the server cooling system 100.

[0032] In general, in the embodiments of the present invention, the server cooling system 100 includes a cooling circulation loop 1, a phase change liquid cooling module 2, a media separation module 3, a media cooling module 4, and a pressure relief module 5. The cooling circulation loop 1 drives the continuous flow of the cooling medium, ensuring the continuity and stability of the server's heat dissipation process. The phase change liquid cooling module 2 utilizes the cooling medium to absorb heat from inside the server and boil to generate a gas-liquid two-phase fluid. By absorbing a large amount of heat during the vaporization process of the cooling medium, the heat dissipation efficiency is significantly improved, solving the problem of insufficient heat dissipation capacity of single-phase cold plates. At the same time, the medium separation module 3 and the medium cooling module 4 are used to separate the gas medium and liquid medium of the gas-liquid two-phase fluid and cool them down, ensuring that the cooling medium can continuously and efficiently absorb heat in the circulation, maintaining the thermal balance of the server cooling system 100. The pressure relief module 5 is used to solve the problem of increased internal pipeline pressure caused by phase change, reducing the internal pressure of the server cooling system 100. It also reduces the loss of cooling medium and environmental pollution by recovering the vaporized cooling medium, improving the environmental protection and economy of the server cooling system 100.

[0033] In some embodiments, please refer to Figure 1 and Figure 2 The pressure relief module 5 further includes a detection unit 54 for detecting the pressure of the cooling circulation loop 1, so that the pressure relief unit 52 is activated when the pressure of the cooling circulation loop 1 increases to a preset pressure value. In this embodiment, the detection unit 54 can monitor the pressure of the cooling circulation loop 1 in real time. When the internal pressure of the loop increases to a preset value, it automatically activates to recover excess gas medium until the pressure in the cooling circulation loop 1 returns to normal. By monitoring the internal pressure of the loop in real time through the detection module, precise and automated pressure control is achieved without manual intervention. This further reduces the risk of failure of the server cooling system 100 due to abnormal pressure, while improving the efficiency and reliability of cooling medium recovery.

[0034] In addition, the pressure relief unit 52 includes a liquid recovery device 521, which includes a gas cooling structure 5211 and a liquid recovery structure 5212. The gas cooling structure 5211 is used to increase the contact area with the gas medium and cool it into the liquid medium. The liquid recovery structure 5212 contains the liquid medium and is connected to the second outlet pipe 53.

[0035] The gas cooling structure 5211 significantly improves heat exchange efficiency by increasing the contact area with the gas medium, ensuring that the temperature of the high-temperature gas medium entering the pressure relief unit 52 can be rapidly and fully cooled to below the boiling point, and then transformed back into a liquid medium. This effectively avoids incomplete recovery of the gas medium or fluctuations in the pressure of the server cooling system 100 caused by insufficient cooling, and enhances the stability and controllability of the pressure relief process.

[0036] In some embodiments, the gas cooling structure 5211 includes flow baffles, and there can be multiple flow baffles. The flow baffles are disposed inside the liquid recovery structure 5212. On the one hand, they buffer the high-pressure gas medium, preventing it from being damaged by excessively fast flow. On the other hand, the flow baffles are used to fully contact and exchange heat with the gas medium, thereby rapidly reducing the heat of the gas medium and accelerating its liquefaction. Specifically, the buffering and cooling effect can be improved by increasing the surface area of ​​the flow baffles. In other embodiments, the surface of the flow baffles can be made into an uneven surface. This invention is not limited here, as long as it can achieve the buffering and cooling effect.

[0037] In addition, the liquid recovery structure 5212 is used to contain the liquid medium after cooling and liquefaction, and through the connection with the second outlet pipe 53, the recovered liquid medium is reintroduced into the cooling circulation loop 1, thereby realizing the closed-loop utilization of the cooling medium. On the one hand, it eliminates the pollution caused by the direct discharge of harmful or volatile cooling media into the environment, which meets the requirements of green design; on the other hand, it reduces the maintenance needs of the server cooling system 100 due to the loss of cooling medium and the frequent replenishment of liquid, thus reducing long-term operating costs.

[0038] Therefore, the gas cooling structure 5211 and the liquid recovery structure 5212 enable the pressure relief module 5 to not only provide safety protection when the server cooling system 100 experiences abnormal pressure, but also to achieve the recycling of the cooling medium.

[0039] In some embodiments, please continue to refer to Figure 1 and Figure 2The medium separation module 3 includes a gas-liquid separator 31 and a liquid level stabilizer 32. The gas-liquid separator 31 is connected to the first outlet pipe 23 and is used to separate the gas medium and the liquid medium in the gas-liquid two-phase fluid. The liquid level stabilizer 32 is connected to the gas-liquid separator 31 and is used to maintain the liquid level of the liquid medium in the gas-liquid separator 31 within a preset range. The gas-liquid separator 31, connected to the first outlet pipe 23, separates the gas medium and the liquid medium in the gas-liquid two-phase fluid, ensuring that the gas-liquid two-phase fluid flowing out of the phase change liquid cooling module 2 can be effectively separated, facilitating different processing of the gas medium and the liquid medium. Specifically, the gas-liquid separator 31 is used to prevent flow instability problems that may be caused by the gas medium entering the cooling circulation loop 1. The liquid level stabilizer 32 is connected to the gas-liquid separator 31. The liquid level stabilizer 32 is used to maintain the liquid level change of the liquid medium in the gas-liquid separator 31 within a preset range, ensuring that the liquid level of the liquid medium is not too high or too low. By maintaining the liquid level stability, it effectively prevents the risk of gas medium entrainment that may be caused by excessive liquid level or the risk of pumping cavitation that may be caused by excessive liquid level, thereby improving the stability and safety of the cooling circulation loop 1 during operation.

[0040] Therefore, the gas-liquid separator 31 and the liquid level stabilizer 32 work together to form an adaptively adjustable separation system. The cooperation between the gas-liquid separator 31 and the liquid level stabilizer 32 can not only complete the separation of gaseous and liquid media, but also enable the server cooling system 100 to cope with the dynamically changing heat dissipation load of the server by controlling the liquid level of the gas-liquid separator 31. This reduces the dependence on manual intervention, lowers the probability of system shutdown or performance degradation due to abnormal liquid level, and provides continuous, reliable and efficient heat dissipation for the server.

[0041] Further, the liquid level stabilizer 32 includes: a liquid level holder 321, a high-level pipeline 322, and a low-level pipeline 323. The high-level pipeline 322 is provided with a first one-way valve 3221. One end of the high-level pipeline 322 is connected to the high liquid level line in the gas-liquid separator 31, and the other end is connected to the liquid level holder 321. The flow direction of the liquid medium is configured to flow from the gas-liquid separator 31 to the liquid level holder 321. The low-level pipeline 323 is provided with a second one-way valve 3231. One end of the low-level pipeline 323 is connected to the low liquid level line in the gas-liquid separator 31, and the other end is connected to the liquid level holder 321. The flow direction of the liquid medium is configured to flow from the liquid level holder 321 to the gas-liquid separator 31.

[0042] It should be noted that the liquid level holder 321 includes a container with a cavity, and the liquid level holder 321 can be used to hold liquid media.

[0043] The high-level pipeline 322 is equipped with a first one-way valve 3221, and the high-level pipeline 322 is connected between the high liquid level line of the gas-liquid separator 31 and the liquid level holder 321. It limits the liquid medium to flow only from the gas-liquid separator 31 to the liquid level holder 321. Therefore, when the liquid level in the liquid level separator rises to the high liquid level due to the instantaneous increase in liquid volume, the excess liquid medium can be automatically discharged to the liquid level holder 321. This effectively prevents the effective separation space from being compressed due to the excessively high liquid level in the liquid level separator, and avoids the risk of the gas medium being carried into the downstream circuit by the liquid medium. On the other hand, it can also avoid the risk of backflow of liquid medium caused by the excessively high liquid level in the liquid level separator.

[0044] Correspondingly, the low-level pipeline 323 is equipped with a second check valve 3231, which is connected between the low liquid level line of the gas-liquid separator 31 and the liquid level holder 321. It limits the liquid medium to flow only from the liquid level holder 321 to the liquid separator. When the liquid level in the gas-liquid separator 31 drops to a low level due to evaporation or flow fluctuations, liquid can be automatically replenished from the liquid level holder 321. This effectively prevents the liquid level in the gas-liquid separator 31 from being too low, which would cause gas to be trapped at the pump inlet. In some embodiments, the circulating pump 11 drives the liquid medium to circulate. By setting the low-level pipeline 323 with the second check valve 3231, the risk of cavitation damage to the circulating pump 11 can be effectively reduced, thereby ensuring the safe operation and service life of the core power components of the circulating pump 11.

[0045] In this embodiment of the invention, the liquid level maintainer 321 can serve as a temporary storage and buffer container for the liquid medium. It works in conjunction with the high-level pipeline 322 and the low-level pipeline 323 to automatically maintain the liquid level in the gas-liquid separator 31 within the corresponding range. Furthermore, the liquid level stabilizer 32 does not require external power or electronic control. It achieves dynamic balance of the liquid level within a preset range only by setting the flow channel position and cooperating with the one-way valve. It has a simple structure and reliable operation, which can effectively reduce the control complexity of the server cooling system 100 and reduce the failure rate during operation. It ensures that the server cooling system 100 can still maintain long-term and stable operation under the condition of variable server load.

[0046] In addition, please refer to Figure 1 and Figure 2The medium cooling module 4 includes a first cooling unit 41, a second cooling unit 42, and a third cooling unit 43. The first cooling unit 41 is located within the pressure relief unit 52 and is used to cool the gaseous medium within the pressure relief unit 52 and liquefy it into the liquid medium. The second cooling unit 42 is located within the medium separation module 3 and is used to cool the gaseous medium in the gas-liquid two-phase fluid received by the medium separation module 3 and liquefy the gaseous medium into the liquid medium. The third cooling unit 43 receives the liquid medium within the medium separation module 3 and cools the liquid medium.

[0047] The first cooling unit 41 is located within the pressure relief unit 52 and is used to cool and liquefy the gaseous medium discharged during the pressure relief process, thereby achieving synchronization of the pressure relief function and the liquid medium recovery function. In some embodiments of the present invention, the first cooling unit 41 and the gas cooling structure 5211 work together to accelerate the cooling effect, enabling the pressure relief unit 52 to both receive and buffer the gaseous medium, and to cool the gaseous medium into a liquid medium, achieving the effect of recycling. It can be understood that by instantly liquefying and recycling the gaseous medium, not only are the environmental problems caused by direct emissions and the loss of cooling medium reduced, but also the accumulation or diffusion of high-temperature gaseous medium in the pressure relief module 5 can be prevented, ensuring the smooth and efficient operation of the pressure relief module 5 and improving the response speed and reliability of the pressure relief module 5.

[0048] The second cooling unit 42 is located inside the medium separation module 3. It is used to cool and liquefy the gas medium in the gas-liquid two-phase fluid received by the medium separation module 3. When the gas-liquid two-phase flow enters the medium separation module 3, the second cooling unit 42 can absorb the heat of the gas medium and the liquid medium, thereby accelerating the phase change process of the gas medium to the liquid medium. This effectively reduces the gas pressure load in the gas-liquid separator 31, avoids excessive gas pressure in the gas-liquid separator 31, improves the efficiency and effect of gas-liquid separation, reduces the amount of gas in the gas-liquid separator 31, indirectly maintains the stability of the liquid level in the gas-liquid separator 31, and can also perform preliminary cooling of the liquid medium.

[0049] The third cooling unit 43 receives the liquid medium from the medium separation module 3 and further cools it down. In the embodiment of the present invention, the third cooling unit 43 is used to achieve supercooling of the liquid medium, that is, to reduce the temperature of the liquid medium to the current corresponding saturation temperature, that is, below the boiling point of the liquid medium, to ensure that the temperature of the liquid medium flowing back to the phase change liquid cooling module 2 is lower, so that the low temperature liquid medium can absorb more heat in the phase change liquid cooling module 2, and also provides it with a larger temperature rise space and heat absorption capacity, thereby improving the heat dissipation capacity of each cycle.

[0050] The first cooling unit 41, the second cooling unit 42, and the third cooling unit 43 work together to achieve thermal management of the gas medium in the pressure relief module 5, the gas medium and liquid medium in the medium separator, and the returning liquid medium within the server cooling system 100. This distributed, multi-stage cooling strategy, compared to a single cooling method, can more efficiently and specifically handle the heat generated in each stage of the server cooling system 100. This allows the entire server cooling system 100 to achieve stronger adaptability and better overall energy efficiency when facing dynamically changing heat dissipation loads, ensuring continuous high efficiency and safety in the heat dissipation process of high-power server chips.

[0051] In some embodiments, the first cooling unit 41, the second cooling unit 42, and the third cooling unit 43 are all configured as tubular heat exchangers. The inside of the tubular heat exchanger is low-temperature water, and the outside of the tube is a cooling medium. The low-temperature water cools the cooling medium. Specifically, the tubular heat exchanger liquefies the gaseous medium into a liquid medium and also cools the temperature of the liquid medium to below its boiling point.

[0052] In some embodiments of the present invention, the cooling circulation loop 1 includes a circulation pump 11, which is connected between the third cooling unit 43 and the first inlet pipe 21, and the circulation pump 11 is used to drive the flow of the cooling medium.

[0053] In this invention, the circulating pump 11 is positioned between the third cooling unit 43 and the first inlet pipe 21, allowing the circulating pump 11 to directly receive the fully subcooled liquid cooling medium from the third cooling unit 43. This ensures that the cooling medium entering the circulating pump 11 is in a liquid state, and that the temperature of the cooling medium is lower than the saturation temperature of the current server cooling system 100, i.e., lower than the boiling point. This reduces the possibility of local boiling of the cooling medium in the circulating pump 11 or the possibility of the circulating pump 11 ingesting air bubbles, and avoids cavitation in the circulating pump 11. This not only protects the impeller and housing of the circulating pump 11 from cavitation impact damage and extends its service life, but also maintains the stable head and operating efficiency of the circulating pump 11, ensuring the stability of flow and pressure within the entire cooling circulation loop 1.

[0054] Furthermore, the circulation pump 11 is positioned between the third cooling unit 43 and the first inlet pipe 21, so that the circulation pump 11 serves as the starting point of the server cooling system 100 at the cold end. The circulation pump 11 can push the low-temperature cooling medium to the heat-absorbing phase change liquid cooling module 2. On the one hand, this keeps the operating environment temperature of the circulation pump 11 low, which helps to reduce the operating temperature of the pump body and its motor, reducing the risk of performance degradation or failure due to self-heating, and further improving the reliability of the core power components. On the other hand, since the phase change liquid cooling unit 22 usually includes various microchannels, valves and pipes, the flow resistance in the phase change liquid cooling module 2 is relatively large. The circulation pump 11 is positioned corresponding to the phase change liquid cooling module 2, so that the outlet pressure of the circulation pump 11 can act more directly and effectively on the phase change liquid cooling module 2 with the largest flow resistance in the server cooling system 100, thereby effectively overcoming the flow resistance of the server cooling system 100 and ensuring that the cooling medium can still flow through the server chip at a sufficient speed and flow rate under high heat flux density, achieving efficient heat exchange.

[0055] In summary, the circulation pump 11, with its aforementioned layout, and its connection with the third cooling unit 43 and the phase change liquid cooling module 2, not only effectively protects the internal components of the circulation pump 11, but also provides a stable, reliable, and durable fluid drive capability for the entire server cooling system 100 by optimizing the pressure distribution of the cooling medium delivered by the phase change liquid cooling module 2, thereby ensuring the long-term continuous operation of the server cooling system 100 under high load.

[0056] Please refer to Figure 1 and Figure 2 The server cooling system 100 also includes a heat recovery module 6, which is connected to the medium cooling module 4 and is used to recover the heat from the medium cooling module 4.

[0057] In this application, by adding a heat recovery module 6 connected to the medium cooling module 4, the waste heat generated during the operation of the server cooling system 100 is effectively collected and reused.

[0058] Specifically, the heat recovery module 6 is connected to the medium cooling module 4 to recover the heat absorbed by the medium cooling module 4 from the cooling cycle, thereby converting the waste heat that would otherwise be discharged into the environment through a cooling tower or air-cooled radiator into usable energy, achieving efficient energy utilization. This not only directly reduces the additional energy costs paid for heat dissipation itself, but also helps to reduce the overall energy efficiency index.

[0059] In addition, the heat recovery module 6 can also optimize the workload of the medium cooling module 4. Since some of the heat of the medium cooling module 4 is effectively transferred and utilized, the heat load of the medium cooling module 4 for final dissipation is reduced accordingly. This helps to reduce its dependence on external cooling resources. On the other hand, it can also reduce the size of its own heat sink, thereby saving certain operating costs.

[0060] In some embodiments, the server cooling system 100 of the present invention is applied in a data center, and the recovered heat has a variety of practical applications, such as heating the office area of ​​the data center, providing domestic hot water, or driving an adsorption refrigeration system to provide cooling for other non-core areas, thereby integrating energy at the system level. This allows the server cooling system 100 to not only be an operating system that requires payment, but also a potential energy recovery point, thereby improving the overall energy efficiency of the data center and reducing certain operating costs.

[0061] In summary, the heat recovery module 6 captures and reuses the dispersed heat energy inside the server cooling system 100, thereby ensuring the core function of server cooling while improving the energy efficiency and environmental friendliness of the entire server cooling system 100.

[0062] In some embodiments, the pressure rating of the first outlet pipe 23 and the second inlet pipe 51 is higher than that of the first inlet pipe 21.

[0063] In this application, the pressure resistance level of the first outlet pipe 23 and the second inlet pipe 51 is set to be higher than that of the first inlet pipe 21, and the structural settings are differentiated based on the state and pressure characteristics of the cooling medium between different modules in the server cooling system 100.

[0064] It should be noted that in the phase change liquid cooling unit 22, the liquid cooling medium absorbs heat and boils, transforming into a gas-liquid two-phase fluid. This phase change process is accompanied by a significant expansion of the cooling medium volume and a change in flow momentum, resulting in a significantly higher internal pressure in the piping system (i.e., the first outlet pipe 23) starting from the outlet of the phase change liquid cooling unit 22 and the inlet pipe of the pressure relief module 5 that receives the gas medium (i.e., the second inlet pipe 51) than in the first inlet pipe 21 that only transports a single liquid cooling medium.

[0065] By increasing the pressure resistance of the first outlet pipe 23 and the second inlet pipe 51, the structural integrity and sealing reliability of the high-pressure section within the server cooling system 100 are ensured during operation. This effectively prevents deformation, rupture, or interface leakage of the first outlet pipe 23 and the second inlet pipe 51 due to excessive internal pressure, thereby eliminating the risk of system performance degradation, cooling medium loss, or even damage to server equipment caused by cooling medium leakage. This enhances the operational safety and long-term stability of the server cooling system 100.

[0066] Furthermore, this differentiated pressure resistance design reflects a reasonable balance between structural strength and economic benefits, avoiding unnecessary increases in material costs caused by uniformly adopting the highest pressure resistance standard for the entire cooling loop 1, and optimizing the overall manufacturing cost of the server cooling system 100 while ensuring the safety of critical high-pressure areas.

[0067] Furthermore, the high-pressure resistant first outlet pipe 23 and second inlet pipe 51 complement and connect with the pressure relief module 5 installed in the server cooling system 100. The pressure-resistant first outlet pipe 23 and second inlet pipe 51 provide the ability to withstand normal fluctuations in gas pressure, while the pressure relief module 5 serves as the most effective safety guarantee for dealing with abnormal pressure peaks. The combination of the two constructs a well-structured and reliable pressure containment and protection system.

[0068] In summary, the aforementioned differentiated design for pressure resistance levels is not a simple upgrade in specifications, but rather a targeted measure based on the accurate identification of the internal pressure distribution of the server cooling system 100. By strengthening the critical path, it ensures that the server cooling system 100 can safely and reliably accommodate and handle the internal pressure generated by the phase change, providing a fundamental guarantee for the entire phase change liquid cooling solution to achieve the goal of high-power heat dissipation.

[0069] This invention also discloses a server, including the server cooling system 100 described above.

[0070] In an embodiment of the present invention, the server cooling system 100 includes a cooling circulation loop 1, a phase change liquid cooling module 2, a media separation module 3, a media cooling module 4, and a pressure relief module 5. The cooling circulation loop 1 drives the continuous flow of the cooling medium, thereby ensuring the continuity and stability of the server's heat dissipation process. The phase change liquid cooling module 2 utilizes the cooling medium to absorb heat from inside the server in the phase change liquid cooling unit 22 and boils to generate a gas-liquid two-phase fluid. The large amount of heat absorbed by the cooling medium during vaporization significantly improves heat dissipation efficiency, solving the problem of insufficient heat dissipation capacity of single-phase cold plates. Simultaneously, the media separation module 3 and the media cooling module 4 separate the gaseous and liquid media of the gas-liquid two-phase fluid and cool them, ensuring that the cooling medium can continuously and efficiently absorb heat during circulation, maintaining the thermal balance of the server cooling system 100. The pressure relief module 5 addresses the problem of increased internal pipeline pressure caused by phase change, reducing the internal pressure of the server cooling system 100. It also reduces cooling medium loss and environmental pollution by recovering the vaporized cooling medium, improving the environmental friendliness and economy of the server cooling system 100.

[0071] The specific structure of the server cooling system 100 is as described in the above embodiments. Since the server adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0072] The terms "first" and "second" in the specification and claims of this invention may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0073] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0074] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A server cooling system, characterized in that, include: Cooling circulation loop is used to drive the flow of cooling medium; The phase change liquid cooling module includes a first inlet pipe, a phase change liquid cooling unit, and a first outlet pipe connected in sequence. The first inlet pipe and the first outlet pipe are respectively connected to the cooling circulation loop. The phase change liquid cooling unit is used to cool the server, causing the cooling medium to absorb the heat of the server, boil, and generate a gas-liquid two-phase fluid. A media separation module is connected to the first outlet pipeline, and the media separation module is used to separate the gas medium and the liquid medium in the gas-liquid two-phase fluid. A medium cooling module, connected to the cooling circulation loop, and also connected to the medium separation module, is used to receive and cool the liquid medium; and... The pressure relief module includes a second inlet pipe, a pressure relief unit, and a second outlet pipe. The second inlet pipe is connected to the first outlet pipe and is used to receive the gas medium in the gas-liquid two-phase fluid. The pressure relief unit is used to cool the gas medium and convert it into a liquid medium. The second outlet pipe is used to transmit the liquid medium to the medium separation module.

2. The server cooling system according to claim 1, characterized in that, The pressure relief module also includes: The detection unit is used to detect the pressure of the cooling circulation loop so that the pressure relief unit is activated when the pressure of the cooling circulation loop increases to a preset pressure value.

3. The server cooling system according to claim 1, characterized in that, The pressure relief unit includes: A liquid recovery device includes a gas cooling structure and a liquid recovery structure. The gas cooling structure is used to increase the contact area with the gas medium and cool it into the liquid medium. The liquid recovery structure contains the liquid medium and is connected to a second outlet pipeline.

4. The server cooling system according to claim 1, characterized in that, The media separation module includes: A gas-liquid separator, connected to the first outlet pipeline, is used to separate the gaseous medium and the liquid medium in the gas-liquid two-phase fluid; and... A liquid level stabilizer is connected to the gas-liquid separator, and the liquid level stabilizer is used to maintain the liquid level of the liquid medium in the gas-liquid separator within a preset range.

5. The server cooling system according to claim 4, characterized in that, The liquid level stabilizer includes: Level holder; The high-level pipeline is equipped with a first one-way valve. One end of the high-level pipeline is connected to the high liquid level line in the gas-liquid separator, and the other end is connected to the liquid level holder. The flow direction of the liquid medium is configured to flow from the gas-liquid separator to the liquid level holder. The low-level pipeline is equipped with a second one-way valve. One end of the low-level pipeline is connected to the low liquid level line in the gas-liquid separator, and the other end is connected to the liquid level holder. The flow direction of the liquid medium is configured to flow from the liquid level holder to the gas-liquid separator.

6. The server cooling system according to claim 1, characterized in that, The medium cooling module includes: A first cooling unit is located within the pressure relief unit and is used to cool the gaseous medium within the pressure relief unit and liquefy it into the liquid medium. A second cooling unit, located within the medium separation module, is used to cool the gaseous medium in the gas-liquid two-phase fluid received by the medium separation module, and to liquefy the gaseous medium into the liquid medium; and... The third cooling unit receives the liquid medium from the medium separation module and cools the liquid medium.

7. The server cooling system according to claim 6, characterized in that, The cooling circulation loop includes a circulation pump connected between the third cooling unit and the first inlet pipe, and the circulation pump is used to drive the flow of the cooling medium.

8. The server cooling system according to claim 1, characterized in that, It also includes a heat recovery module, which is connected to the medium cooling module and is used to recover heat from the medium cooling module.

9. The server cooling system according to claim 1, characterized in that, The pressure resistance rating of the first outlet pipeline and the second inlet pipeline is higher than that of the first inlet pipeline.

10. A server, characterized in that, include: The server cooling system is the server cooling system according to any one of claims 1-9.

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