Diode pickling device for integrated circuit board

Abstract

The invention relates to the technical field of diode pickling, in particular to a diode pickling device for an integrated circuit board, which comprises a base fixedly connected with a control panel, a pickling tank mounted on the base, and a liquid changing structure connected with the base, the device comprises a base and a turnover immersion structure connected with the base, the turnover immersion structure comprises a turnover lifting mechanism connected with the base, the turnover lifting mechanism is connected with a plurality of groups of double-sided material carrying mechanisms, the plurality of groups of double-sided material carrying mechanisms are jointly connected with a group of loosening and clamping regulation and control assemblies, and the plurality of groups of double-sided material carrying mechanisms are jointly connected with a rotation regulation and control assembly. According to the invention, through a mode of mutual cooperation of the liquid changing structure and the overturning immersion structure, multiple groups of diodes are laid in one layer, mutual stacking of the diodes is avoided, and through a mode of overturning the diodes and supporting the diodes, all surfaces of the diodes are subjected to acid pickling processing, so that stable and comprehensive acid pickling processing of the diodes is facilitated.

Description

Technical Field

[0001] This invention relates to the field of diode pickling technology, specifically a diode pickling device for integrated circuit boards. Background Technology

[0002] Integrated circuit boards are manufactured using semiconductor processes, creating numerous transistors, resistors, capacitors, and other components on a small single-crystal silicon wafer. Diodes are electronic devices made from semiconductor materials, exhibiting unidirectional conductivity. Diodes are also commonly mounted on integrated circuit boards, and their manufacturing process requires acid etching.

[0003] In existing diode manufacturing processes, pickling equipment typically includes a pickling basket and a pickling tank. The pickling basket contains diodes placed in the pickling tank, and the diodes are immersed in a pickling solution. However, the pickling solution can only pickle the diode surfaces that are in direct contact. This results in many diode surfaces not being able to fully contact the pickling solution due to stacking as diodes are stacked in multiple layers. Furthermore, some diodes are not fully pickled because they are in direct contact with the pickling basket. Even if the diodes are moved by agitation, it cannot be guaranteed that the surfaces of the diodes that were not in contact with the pickling solution will be fully in contact with the pickling solution. This leads to unstable pickling results and makes it impossible to pickle the diodes comprehensively. Summary of the Invention

[0004] The purpose of this invention is to provide a diode pickling device for integrated circuit boards to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A diode pickling device for integrated circuit boards includes a base, a control panel fixedly connected to the base, a pickling tank mounted on the base, a liquid level sensor installed inside the pickling tank, and further includes: A liquid exchange structure connected to a base, the liquid exchange structure being located below the pickling tank and connected to the pickling tank; A tilting immersion structure connected to a base, the tilting immersion structure including a tilting lifting mechanism connected to the base, the tilting lifting mechanism being connected to multiple sets of double-sided material loading mechanisms, the multiple sets of double-sided material loading mechanisms being connected to a set of clamping control components, the clamping control components being installed on the tilting lifting mechanism, and the multiple sets of double-sided material loading mechanisms being connected to a rotation control component installed on the tilting lifting mechanism.

[0006] As a further improvement of the present invention: a pH value detection probe is fixedly installed inside the pickling tank, and the pH value detection probe is communicatively connected to the control panel.

[0007] As a further improvement of the present invention: the liquid replacement structure includes a liquid storage tank fixedly installed in the base, a liquid pump fixedly connected to the liquid storage tank, a bent pipe fixedly connected to the liquid pump and the pickling tank, a replenishment pipe fixedly connected to the liquid storage tank, a cover threadedly connected to the replenishment pipe, a waste liquid tank fixedly connected to the base, a control valve fixedly installed on the top of the waste liquid tank, the control valve fixedly connected to the pickling tank, and the upper end of the control valve being located inside the pickling tank.

[0008] As a further improvement of the present invention: the tilting and lifting mechanism includes a rotating frame hinged to the base, the rotating frame is fixedly connected to two sets of protruding shafts, each set of protruding shafts is movably connected to a set of snap-fit ​​frames, the snap-fit ​​frames are movably connected to the base, the rotating frame is fixedly connected to multiple sets of first active telescopic rods, the multiple sets of first active telescopic rods are jointly fixedly connected to a lifting frame slidably connected to the rotating frame, the lifting frame is connected to a clamping and loosening control component, and the lifting frame is connected to multiple sets of double-sided material loading mechanisms.

[0009] As a further improvement of the present invention: the double-sided material loading mechanism includes a hanger fixedly connected to the lifting frame, a gearbox fixedly connected to the hanger, a linkage shaft frame fixedly installed at the input end of the gearbox, the linkage shaft frame being slidably connected to the rotation control component, a drive shaft fixedly connected to the output end of the gearbox, a rotating frame rotatably connected to the hanger fixedly connected to the drive shaft, two symmetrically arranged mesh frames slidably connected to the rotating frame, mesh plates fixedly connected to the mesh frames, each mesh frame being connected to a thickness-limiting frame by multiple sets of bolts, the thickness-limiting frame being slidably connected to the mesh frame, two sets of driven telescopic frames fixedly connected to one set of mesh frames, four sets of driven telescopic frames being jointly fixedly connected to a fixed frame fixedly connected to the drive shaft, two sets of hinge plates hinged to each set of mesh frames, four sets of hinge plates being jointly hinged to one set of hinge frames, the hinge frames being rotatably connected to the clamping control component, the hinge frames being slidably connected to the drive shaft, multiple sets of guide bars fixedly installed on the drive shaft, the guide bars being slidably connected to the hinge frames, and the hinge frames being rotatably connected to the rotation control component.

[0010] As a further improvement of the present invention: the clamping control assembly includes multiple sets of second active telescopic rods fixedly connected to the lifting frame, the moving end of the second active telescopic rods is fixedly connected to a pressure sensor, the multiple sets of pressure sensors are jointly fixedly connected to a crossbeam slidably connected to the lifting frame, the crossbeam is fixedly connected to multiple sets of outer ring sleeves, and the outer ring sleeves are rotatably connected to the hinge frame.

[0011] As a further improvement of the present invention: the rotation control component includes a first guide frame fixedly connected to the lifting frame, a second guide frame fixedly connected to the lifting frame, a multi-head frame slidably connected to the first guide frame and the second guide frame, a multi-head frame fixedly connected to a plurality of rectangular frames, the rectangular frames slidably connected to the linkage shaft frame, a third active telescopic rod fixedly installed on the second guide frame, and the moving end of the third active telescopic rod fixedly connected to the multi-head frame.

[0012] Compared with the prior art, the beneficial effects of the present invention are: In use, each group of diodes is placed into its respective double-sided loading mechanism, so that the diodes are laid flat in the mechanism, forming a single diode layer with gaps between them. The double-sided loading mechanism then supports and limits the diodes. Next, the liquid exchange structure replenishes the pickling tank with pickling solution. A level sensor measures the level in real time and transmits the data to the control panel, which calculates the level. When the level reaches a predetermined height, the control panel stops the liquid exchange structure from replenishing the pickling tank. Then, a tilting and lifting mechanism lowers the double-sided loading mechanism into the pickling tank, ensuring the diodes are completely immersed in the pickling solution for pickling. The side of the diode supported by the double-sided loading mechanism cannot be pickled. The tilting and lifting mechanism then... The mechanism lifts the double-sided material carrier, and the clamping control component adjusts the double-sided material carrier to clamp and limit the diode, preventing the diode from moving freely within the double-sided material carrier and thus avoiding collisions between the diodes. Driven by the rotation control component, the double-sided material carrier flips the diode 180 degrees. Then, the double-sided material carrier releases the diode, allowing the flipped diode to be supported and limited by the double-sided material carrier. Subsequently, the flipping and lifting mechanism lowers the double-sided material carrier into the pickling tank, allowing the diode to be completely immersed in the pickling solution. At this point, the side that was not pickled due to contact with the double-sided material carrier is fully in contact with the pickling solution, thus completing the comprehensive pickling process of the diode. As the pickling solution is consumed, the solution replacement structure replenishes the pickling tank to maintain pickling efficiency. This invention uses a combination of a liquid exchange structure and a flip-immersion structure to allow multiple diodes to be laid out in a single layer, avoiding the stacking of diodes. Furthermore, by flipping and supporting the diodes, all sides of the diodes are acid-washed, thus facilitating stable and comprehensive acid washing of the diodes. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a three-dimensional structural schematic diagram from another perspective of the present invention.

[0015] Figure 3 For the present invention Figure 2 A magnified view of a portion of point A in the middle.

[0016] Figure 4 This is a three-dimensional structural diagram of the double-sided material loading mechanism of the present invention.

[0017] Figure 5 This is a three-dimensional structural schematic diagram of the double-sided material loading mechanism of the present invention from another perspective.

[0018] Figure 6 This is a schematic diagram of the internal three-dimensional structure of the double-sided material loading mechanism of the present invention.

[0019] Figure 7 This is a partial three-dimensional structural diagram of the double-sided material loading mechanism of the present invention.

[0020] Figure 8 This is a partial three-dimensional structural schematic diagram of the double-sided material loading mechanism of the present invention from another perspective.

[0021] Figure 9 This is a three-dimensional structural diagram of the clamp release control component of the present invention.

[0022] Figure 10 This is a three-dimensional structural diagram of the card holder of the present invention.

[0023] Figure 11 This is a three-dimensional structural diagram of the mesh frame, mesh plate, and thickness limiting frame of the present invention working together.

[0024] Figure 12 This is a three-dimensional structural diagram of the pickling tank, liquid level sensor, control valve, and pH value detection probe of the present invention working together.

[0025] Figure 13 This is a schematic diagram of the three-dimensional structure of the multi-head frame and rectangular frame of the present invention.

[0026] In the diagram: 1. Base; 2. Control panel; 3. Pickling tank; 4. Liquid level sensor; 5. Liquid exchange structure; 6. Tilting immersion structure; 7. Tilting lifting mechanism; 8. Double-sided loading mechanism; 9. Clamping control assembly; 10. Rotation control assembly; 11. Storage tank; 12. Liquid pump; 13. Bend; 14. Replenishment pipe; 15. Cover; 16. Waste tank; 17. Control valve; 18. pH value detection probe; 19. Rotating frame; 20. Protruding shaft; 21. Snap-fit ​​frame; 22. First active telescopic rod; 3. Lifting frame; 24. Hanger; 25. Gearbox; 26. Linkage shaft frame; 27. Drive shaft; 28. Rotating frame; 29. ​​Mesh frame; 30. Mesh plate; 31. Driven telescopic frame; 32. Fixed frame; 33. Hinge plate; 34. Hinge frame; 35. Guide bar; 36. Second active telescopic rod; 37. Cross frame; 38. Outer ring sleeve; 39. First guide frame; 40. Second guide frame; 41. Multi-head frame; 42. Rectangular frame; 43. Third active telescopic rod; 44. Pressure sensor; 45. Thickness limiting frame. Detailed Implementation

[0027] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0028] Example 1, see Figures 1 to 13 As shown, a diode pickling device for integrated circuit boards includes a base 1, a control panel 2 fixedly connected to the base 1, a pickling tank 3 mounted on the base 1, a liquid level sensor 4 installed in the pickling tank 3, and the liquid level sensor 4 communicatively connected to the control panel 2. The device also includes: A liquid exchange structure 5 is connected to the base 1. The liquid exchange structure 5 is located below the pickling tank 3 and is connected to the pickling tank 3. The tilting immersion structure 6 is connected to the base 1. The tilting immersion structure 6 includes a tilting lifting mechanism 7 connected to the base 1. The tilting lifting mechanism 7 is connected to multiple sets of double-sided material loading mechanisms 8. The multiple sets of double-sided material loading mechanisms 8 are connected to a set of clamping control components 9. The clamping control components 9 are installed on the tilting lifting mechanism 7. The multiple sets of double-sided material loading mechanisms 8 are connected to a rotation control component 10 installed on the tilting lifting mechanism 7.

[0029] In use, each group of diodes is placed into its respective double-sided loading mechanism 8, so that the diodes are laid flat in the double-sided loading mechanism 8, forming a diode layer with gaps between the diodes. Then, the double-sided loading mechanism 8 supports and limits the diodes. Afterwards, the liquid exchange structure 5 replenishes the pickling solution into the pickling tank 3. The liquid level sensor 4 measures the level in real time and transmits the measurement data to the control panel 2, which calculates the liquid level. When the liquid level reaches the predetermined height, the control panel 2 stops the liquid exchange structure 5 from replenishing the pickling tank 3. Then, the tilting and lifting mechanism 7 lowers the double-sided loading mechanism 8 into the pickling tank 3, so that the diodes are completely immersed in the pickling solution for pickling. At this time, the surface of the diode supported by the double-sided loading mechanism 8 cannot fully contact the pickling solution, causing the diode to be supported by the double-sided loading mechanism 8. The supporting surface cannot be acid-washed. Then, the flipping and lifting mechanism 7 lifts the double-sided material-carrying mechanism 8, and the clamping and adjusting component 9 adjusts the double-sided material-carrying mechanism 8 so that the double-sided material-carrying mechanism 8 clamps and limits the diode, preventing the diode from moving freely in the double-sided material-carrying mechanism 8, thereby preventing the diodes from colliding with each other. Driven by the rotation adjusting component 10, the double-sided material-carrying mechanism 8 flips the diode 180 degrees. Then, the double-sided material-carrying mechanism 8 releases the diode, so that the diode after flipping 180 degrees is supported and limited by the double-sided material-carrying mechanism 8. Then, the flipping and lifting mechanism 7 lowers the double-sided material-carrying mechanism 8 into the acid washing tank 3, so that the diode is completely immersed in the acid washing solution. At this time, the surface that was not acid-washed due to contact with the double-sided material-carrying mechanism 8 is fully in contact with the acid washing solution, thereby completing the comprehensive acid washing process of the diode. As the acid washing solution is consumed, the solution replacement structure 5 replenishes the acid washing tank 3 to maintain the acid washing efficiency. The present invention uses the combination of the liquid exchange structure 5 and the flipping immersion structure 6 to arrange multiple groups of diodes in a single layer, avoiding the stacking of diodes. Furthermore, by flipping and supporting the diodes, all sides of the diodes are acid-washed, thus facilitating the stable and comprehensive acid washing process of the diodes.

[0030] In one embodiment, a pH value detection probe 18 is fixedly installed inside the pickling tank 3, and the pH value detection probe 18 is communicatively connected to the control panel 2. The pH value detection probe 18 is used to monitor the pH value of the pickling solution in the pickling tank 3 in real time, so that the control panel 2 can obtain the changes in the pH value of the pickling solution in the pickling tank 3 in real time.

[0031] In one embodiment, the liquid replacement structure 5 includes a liquid storage tank 11 fixedly installed in the base 1. The liquid storage tank 11 is fixedly connected to a liquid pump 12. The liquid pump 12 is fixedly connected to a bent pipe 13 fixedly connected to the pickling tank 3. The liquid storage tank 11 is fixedly connected to a replenishment pipe 14. The replenishment pipe 14 is threadedly connected to a cover 15. The base 1 is fixedly connected to a waste liquid tank 16. A control valve 17 is fixedly installed on the top of the waste liquid tank 16. The control valve 17 is fixedly connected to the pickling tank 3, and the upper end of the control valve 17 is located inside the pickling tank 3. When the acidity of the pickling solution in the pickling tank 3 decreases to below the threshold, the control panel 2 controls the control valve 17 to open, so as to discharge the pickling solution in the pickling tank 3 into the waste liquid tank 16. Then the control valve 17 closes, the liquid pump 12 starts and draws the pickling solution in the storage tank 11, and then the pickling solution is replenished into the pickling tank 3 along the bend pipe 13, so that the liquid replacement structure 5 can complete the replacement and replenishment of the pickling solution in the pickling tank 3. By removing the cover 15, it is convenient to replenish the pickling solution in the storage tank 11 through the replenishment pipe 14.

[0032] In one embodiment, the tilting and lifting mechanism 7 includes a rotating frame 19 hinged to the base 1. The rotating frame 19 is fixedly connected to two sets of protruding shafts 20. Each set of protruding shafts 20 is movably connected to a set of snap-fit ​​frames 21. The snap-fit ​​frames 21 are movably connected to the base 1. The rotating frame 19 is fixedly connected to multiple sets of first active telescopic rods 22. The multiple sets of first active telescopic rods 22 are jointly fixedly connected to a lifting frame 23 that is slidably connected to the rotating frame 19. The lifting frame 23 is connected to the clamping and releasing control assembly 9. The lifting frame 23 is connected to multiple sets of double-sided material loading mechanisms 8. During normal pickling, the snap-fit ​​bracket 21 snaps into the protruding shaft 20 and is inserted into the base 1 to restrict the movement of the protruding shaft 20, thereby restricting the rotation of the rotating frame 19. When it is necessary to adjust the height of the lifting frame 23, the first active telescopic rod 22 actively extends and retracts to drive the lifting frame 23 and the rotating frame 19 to slide relative to each other, thereby driving the double-sided material loading mechanism 8, the clamping control component 9, and the rotation control component 10 to move. When it is necessary to clean the pickling tank 3, the restriction on the protruding shaft 20 is released by disassembling the snap-fit ​​bracket 21, and then the rotating frame 19 is flipped. The rotating frame 19 drives the lifting frame 23 to rotate, and the lifting frame 23 drives the double-sided material loading mechanism 8 to rotate and move away from the pickling tank 3, so as to prevent the double-sided material loading mechanism 8 from blocking the opening at the top of the pickling tank 3, thereby facilitating the cleaning of the pickling tank 3.

[0033] In one embodiment, the double-sided material-carrying mechanism 8 includes a hanger 24 fixedly connected to the lifting frame 23. A gearbox 25 is fixedly connected to the hanger 24. The gearbox 25 is a conventional structure in the art and will not be described in detail here. A linkage shaft bracket 26 is fixedly installed at the input end of the gearbox 25. The linkage shaft bracket 26 is slidably connected to the rotation adjustment component 10. A drive shaft 27 is fixedly connected to the output end of the gearbox 25. A rotating frame 28, rotatably connected to the hanger 24, is fixedly connected to the drive shaft 27. Two symmetrically arranged mesh frames 29 are slidably connected to the rotating frame 28. A mesh plate 30 is fixedly connected to each mesh frame 29. Each mesh frame 29 is connected to a thickness-limiting frame 45 by multiple sets of bolts. The thickness-limiting frame 45 is slidably connected to the mesh frame 29. By adding the thickness-limiting frame 45, the adjustment... The overall thickness of the mesh frame 29 and the thickness limiting frame 45 is used to limit the minimum distance between the two sets of mesh plates 30, so as to avoid damage to the diode due to excessive proximity of the two sets of mesh plates 30. When the two sets of thickness limiting frames 45 abut against each other, the distance between the two sets of mesh plates 30 reaches the minimum value. One set of mesh frame 29 is fixedly connected to two sets of driven telescopic frames 31. The four sets of driven telescopic frames 31 are jointly fixedly connected to a fixed frame 32 that is fixedly connected to the drive shaft 27. Each set of mesh frame 29 is hinged to two sets of hinge plates 33. The four sets of hinge plates 33 are jointly hinged to a set of hinge frame 34. The hinge frame 34 is rotatably connected to the clamping adjustment component 9. The hinge frame 34 is slidably connected to the drive shaft 27. Multiple sets of guide bars 35 are fixedly installed on the drive shaft 27. The guide bars 35 are slidably connected to the hinge frame 34. The hinge frame 34 is rotatably connected to the rotation adjustment component 10. As the clamping adjustment component 9 moves the hinge frame 34, the hinge frame 34 moves the mesh frame 29 via the hinge plate 33. The driven telescopic frame 31 provides guidance and limitation for the moving mesh frame 29. The mesh frame 29 slides relative to the rotating frame 28. The mesh frame 29 moves the thickness limiting frame 45 via bolts, and the mesh frame 29 moves the mesh plate 30. After the mesh frame 29 and the thickness limiting frame 45 are both disengaged from the rotating frame 28, the diode is placed on the mesh plate 30 arranged below. Then, the clamping adjustment component 9 moves the hinge frame 34, and the hinge frame 34 moves the mesh frame 29 via the hinge plate 33. To fix the diode, the two sets of mesh plates 30 approach each other and abut against the diode. If only the diode is fixed... When the diodes are supported, only one set of mesh plates 30 supports the diodes from below. When the mesh frame 29 needs to be rotated, the rotation control component 10 drives the linkage shaft 26 to rotate. The linkage shaft 26 applies driving force to the gearbox 25. The gearbox 25 drives the transmission shaft 27 to rotate. Then the transmission shaft 27 drives the rotating frame 28 to rotate. The rotating frame 28 and the hanger 24 rotate. The rotating frame 28 drives the mesh frame 29 to rotate. Since the guide bar 35 rotates with the mesh frame 29, the guide bar 35 drives the hinge frame 34 to rotate. The transmission shaft 27 drives the fixed frame 32 to rotate. The fixed frame 32 drives the driven telescopic frame 31 to rotate. The driven telescopic frame 31 drives the mesh frame 29 to rotate, thereby causing the double-sided loading mechanism 8 to flip the diodes.

[0034] In one embodiment, the clamping control assembly 9 includes multiple sets of second active telescopic rods 36 fixedly connected to the lifting frame 23. The moving end of the second active telescopic rod 36 is fixedly connected to a pressure sensor 44. The pressure sensor 44 is communicatively connected to the control panel 2. The pressure sensor 44 is used to detect the clamping force and feed the signal back to the control panel 2 to realize controllable clamping force and avoid damaging the diode. Multiple sets of pressure sensors 44 are fixedly connected to a crossbeam 37 slidably connected to the lifting frame 23. Multiple sets of outer ring sleeves 38 are fixedly connected to the crossbeam 37. The outer ring sleeves 38 are rotatably connected to the hinge frame 34. The inner ring of the outer ring sleeve 38 is provided with an annular groove rotatably connected to the hinge frame 34. The second active telescopic rod 36 drives the pressure sensor 44 to move by actively telescopically extending and retracting. The pressure sensor 44 drives the crossbeam 37 to move, the crossbeam 37 drives each set of outer ring sleeves 38 to move, and the outer ring sleeves 38 drive the hinge frame 34 to move. This allows the clamping adjustment component 9 to adjust the position of the hinge frame 34, thereby adjusting the interval between the two sets of mesh plates 30. When the hinge frame 34 rotates, the outer ring sleeves 38 and the hinge frame 34 rotate relative to each other.

[0035] Example 2, based on Example 1, see [link / reference] Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 13 The rotation control component 10 includes a first guide frame 39 fixedly connected to the lifting frame 23, a second guide frame 40 fixedly connected to the lifting frame 23, and a multi-head frame 41 slidably connected to the first guide frame 39 and the second guide frame 40. Multiple rectangular frames 42 are fixedly connected to the multi-head frame 41, and the rectangular frames 42 are slidably connected to the linkage shaft frame 26. A third active telescopic rod 43 is fixedly installed on the second guide frame 40, and the moving end of the third active telescopic rod 43 is fixedly connected to the multi-head frame 41. The third active telescopic rod 43 drives the multi-head frame 41 to move, which in turn drives each set of rectangular frames 42 to move synchronously. The synchronously moving rectangular frames 42 drive each set of linkage shaft frames 26 to rotate, thereby driving each set of gearboxes 25. This allows the rotation control component 10 to provide driving force to the flip diodes of the double-sided material loading mechanism 8, while simultaneously achieving synchronous control of each set of double-sided material loading mechanisms 8.

[0036] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention.

Claims

1. A diode pickling device for integrated circuit boards, comprising a base, a control panel fixedly connected to the base, an pickling tank mounted on the base, and a liquid level sensor installed inside the pickling tank, characterized in that... Also includes: A liquid exchange structure connected to a base, the liquid exchange structure being located below the pickling tank and connected to the pickling tank; A tilting immersion structure connected to a base, the tilting immersion structure including a tilting lifting mechanism connected to the base, the tilting lifting mechanism being connected to multiple sets of double-sided material loading mechanisms, the multiple sets of double-sided material loading mechanisms being connected to a set of clamping control components, the clamping control components being installed on the tilting lifting mechanism, and the multiple sets of double-sided material loading mechanisms being connected to a rotation control component installed on the tilting lifting mechanism.

2. The diode pickling device for integrated circuit boards according to claim 1, characterized in that, A pH value detection probe is fixedly installed inside the pickling tank, and the pH value detection probe is communicatively connected to the control panel.

3. The diode pickling device for integrated circuit boards according to claim 1, characterized in that, The liquid replacement structure includes a liquid storage tank fixedly installed in the base, a liquid pump fixedly connected to the liquid storage tank, a bent pipe fixedly connected to the liquid pump and fixedly connected to the pickling tank, a replenishment pipe fixedly connected to the liquid storage tank, a cover threadedly connected to the replenishment pipe, a waste liquid tank fixedly connected to the base, a control valve fixedly installed on the top of the waste liquid tank, the control valve fixedly connected to the pickling tank, and the upper end of the control valve located inside the pickling tank.

4. The diode pickling device for integrated circuit boards according to claim 1, characterized in that, The tilting and lifting mechanism includes a rotating frame hinged to the base. The rotating frame is fixedly connected to two sets of protruding shafts. Each set of protruding shafts is movably connected to a set of snap-fit ​​frames. The snap-fit ​​frames are movably connected to the base. The rotating frame is fixedly connected to multiple sets of first active telescopic rods. The multiple sets of first active telescopic rods are jointly fixedly connected to a lifting frame that is slidably connected to the rotating frame. The lifting frame is connected to a clamping and releasing control component and to multiple sets of double-sided material loading mechanisms.

5. The diode pickling device for integrated circuit boards according to claim 4, characterized in that, The double-sided material-carrying mechanism includes a hanger fixedly connected to a lifting frame, a gearbox fixedly connected to the hanger, a linkage shaft bracket fixedly installed at the input end of the gearbox, the linkage shaft bracket being slidably connected to a rotation control component, a drive shaft fixedly connected to the output end of the gearbox, a rotating frame fixedly connected to the drive shaft and rotatably connected to the hanger, two symmetrically arranged mesh frames slidably connected to the rotating frame, mesh plates fixedly connected to the mesh frames, each mesh frame being connected to a thickness-limiting frame by multiple sets of bolts, the thickness-limiting frame being slidably connected to the mesh frame, two sets of driven telescopic frames fixedly connected to one set of mesh frames, four sets of driven telescopic frames being jointly fixedly connected to a fixed frame fixedly connected to the drive shaft, two sets of hinge plates hinged to each set of mesh frames, four sets of hinge plates being jointly hinged to one set of hinge frames, the hinge frames being rotatably connected to a clamping control component, the hinge frames being slidably connected to the drive shaft, multiple sets of guide bars fixedly installed on the drive shaft, the guide bars being slidably connected to the hinge frames, and the hinge frames being rotatably connected to the rotation control component.

6. The diode pickling apparatus for integrated circuit boards according to claim 5, characterized in that, The clamping control assembly includes multiple sets of second active telescopic rods fixedly connected to the lifting frame. The moving end of the second active telescopic rod is fixedly connected to a pressure sensor. The multiple sets of pressure sensors are fixedly connected to a crossbeam slidably connected to the lifting frame. The crossbeam is fixedly connected to multiple sets of outer ring sleeves, and the outer ring sleeves are rotatably connected to the hinge frame.

7. The diode pickling apparatus for integrated circuit boards according to claim 5, characterized in that, The rotation control assembly includes a first guide frame fixedly connected to the lifting frame, a second guide frame fixedly connected to the lifting frame, a multi-head frame slidably connected to the first and second guide frames, a multi-head frame fixedly connected to a plurality of rectangular frames, the rectangular frames slidably connected to the linkage shaft frame, a third active telescopic rod fixedly installed on the second guide frame, and the moving end of the third active telescopic rod fixedly connected to the multi-head frame.

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