Wafer trimming device and method

Abstract

The embodiment of the invention discloses a wafer trimming device and method. The wafer trimming device comprises a frame body, and a first carrying mechanism, a centering transmission mechanism, a trimming mechanism, a second carrying mechanism and a cleaning mechanism which are respectively mounted on the frame body, the first carrying mechanism is configured to carry a wafer to be trimmed to the centering transmission mechanism; the centering transmission mechanism is configured to calibrate the direction and position of the wafer and then transmit the wafer to the processing platform; the trimming mechanism is configured to trim the wafer on the processing platform; the second carrying mechanism is configured to pick up the trimmed wafer on the processing platform and carry the wafer to the cleaning mechanism in the Y direction; the cleaning mechanism is configured to clean the wafer; and the first carrying mechanism is also configured to pick up the cleaned wafer on the cleaning mechanism and carry the wafer to the next process. Through the embodiment of the invention, the technical problem that the layout of each module of the existing trimming equipment is unreasonable is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, in particular to a wafer trimming device and method. BACKGROUND

[0002] In three-dimensional integration technology, the ultra-thinning of the bonded wafer is a key step. However, the outer edge of the bonded wafer is often unable to withstand mechanical pressure uniformly due to its inherent bevel shape during the thinning process, and is prone to edge collapse or breakage, resulting in direct loss of yield. Therefore, it has become an essential key process in 3D IC manufacturing to precisely trim the outer edge of the wafer to form a strong vertical profile, thereby ensuring the integrity of the wafer during the thinning process.

[0003] However, the existing trimming equipment still has obvious shortcomings in overall design and module cooperation. The core problem is that the layout of each functional module is unreasonable, resulting in a long transmission path and complicated handover of the wafer between modules. This unreasonable layout not only directly increases the overall floor area of the equipment, but also makes it difficult to achieve precise and efficient transmission of the wafer due to the need for the robot to handle the wafer between modules that are far apart or have poor angles, thereby restricting the production efficiency (UPH). At the same time, it also brings great difficulties to daily maintenance, troubleshooting, and even consumable replacement, further affecting the overall availability and output stability of the equipment. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a wafer trimming device and method to solve the technical problem of unreasonable layout of each module of the existing trimming equipment.

[0005] In a first aspect, the present application provides a wafer trimming device, comprising a frame body and a first handling mechanism, a centering transmission mechanism, a trimming mechanism, a second handling mechanism and a cleaning mechanism mounted on the frame body respectively; The first handling mechanism is configured to handle the wafer to be trimmed to the centering transmission mechanism; The centering transmission mechanism and the trimming mechanism are arranged in sequence along the X direction; the trimming mechanism has a processing platform; the centering transmission mechanism is configured to transmit the wafer after calibrating its direction and position to the processing platform; the trimming mechanism is configured to trim the wafer on the processing platform; The second handling mechanism is configured to pick up the trimmed wafer on the processing platform and handle the wafer to the cleaning mechanism in the Y direction; the cleaning mechanism is configured to clean the wafer; The first handling mechanism is also configured to pick up the cleaned wafer on the cleaning mechanism and handle the wafer to the next process.

[0006] In at least some embodiments of the present application, The centering transmission mechanism comprises an edge searching mechanism and a third carrying mechanism; The edge searching mechanism is provided with an alignment station; the edge searching mechanism is configured to align the wafer carried by the first carrying mechanism to the alignment station so as to make the notch direction of the wafer consistent; The third carrying mechanism comprises a first driving assembly and a first clamping assembly; the first driving assembly is located at one side of the edge searching mechanism and is installed on the frame body; The first clamping assembly is configured to clamp the wafer at the alignment station and adjust the center position of the wafer; the first clamping assembly is installed at the driving end of the first driving assembly; The first driving assembly is configured to drive the first clamping assembly to move along the X direction and / or the Z direction, so as to drive the wafer on the first clamping assembly to move to the processing platform.

[0007] In at least some embodiments of the present application, The edge trimming mechanism comprises a first conveying assembly, a mounting frame, a second driving assembly and a cutter; The first conveying assembly is provided with a discharging station and a processing station; the processing platform is installed on the first conveying assembly; the first conveying assembly is configured to convey the processing platform to move along the X direction, so as to make the processing platform send the wafer received from the discharging station to the processing station or send the wafer trimmed in the processing station to the discharging station; The mounting frame is installed on the first conveying assembly, and the second driving assembly is installed on the mounting frame; the cutter is installed at the driving end of the second driving assembly; The second driving assembly is configured to drive the cutter to move, so as to trim the wafer on the processing platform in the processing station; The second carrying mechanism is configured to pick up the wafer trimmed on the processing platform in the discharging station and carry it to the cleaning mechanism.

[0008] In at least some embodiments of the present application, The number of cutters is at least two; the second driving assembly is further configured to drive at least two cutters to move along the Y direction and / or the Z direction respectively, so as to trim the wafer on the processing platform together; The trimming mechanism further comprises at least two detection assemblies, each of which is installed on one of the cutters; at least one of the detection assemblies is configured to detect the position of the wafer on the processing platform before trimming; and at least another of the detection assemblies is configured to detect the topography of the wafer on the processing platform. The centering and conveying mechanism is further configured to pick up the wafer with inaccurate position detected by the detection assembly on the processing platform and send it back to the processing platform after adjusting it to the correct position.

[0009] In at least some embodiments of the present application, The second conveying mechanism comprises a third driving assembly and a second clamping assembly. The second clamping assembly is installed on the driving end of the third driving assembly; and the second clamping assembly is configured to clamp the trimmed wafer on the processing platform. The third driving assembly is installed on the frame body; and the third driving assembly is configured to drive the second clamping assembly to move in the Y direction and / or the Z direction, so as to drive the wafer on the second clamping assembly to the cleaning mechanism.

[0010] In at least some embodiments of the present application, The second clamping assembly comprises a base plate, a fourth driving assembly and at least three clamping jaws. The base plate is installed on the driving end of the third driving assembly. The fourth driving assembly is installed on the base plate; and the at least three clamping jaws are evenly distributed around the center of the base plate in the circumferential direction and are installed on the driving end of the fourth driving assembly. The fourth driving assembly is configured to drive the at least three clamping jaws to move synchronously towards or away from the center of the base plate, so as to clamp or release the wafer.

[0011] In at least some embodiments of the present application, The cleaning mechanism comprises a first cleaning mechanism and a second cleaning mechanism; the first cleaning mechanism and the second cleaning mechanism are arranged in sequence in the X direction; the first cleaning mechanism is located on one side of the trimming mechanism; and the second cleaning mechanism is located on one side of the centering and conveying mechanism. The wafer trimming device further comprises a fourth conveying mechanism. The first cleaning mechanism is configured to receive the wafer conveyed by the second conveying mechanism and clean the back surface of the wafer. The fourth conveying mechanism is configured to pick up the wafer cleaned on the first cleaning mechanism and convey the wafer to the second cleaning mechanism. The second cleaning mechanism is configured to receive the wafer carried by the fourth carrying mechanism and perform front side cleaning and spin-drying on the wafer. The first carrying mechanism is further configured to pick up the wafer after spin-drying on the second cleaning mechanism and carry the wafer to a next process.

[0012] In at least some embodiments of the present application, The fourth carrying mechanism comprises a fifth driving assembly and a third clamping assembly. The third clamping assembly is installed on a driving end of the fifth driving assembly, and the third clamping assembly is configured to clamp the cleaned wafer of the first cleaning mechanism. The fifth driving assembly is installed on the frame body, and the fifth driving assembly is configured to drive the third clamping assembly to move in the X direction and / or the Z direction, so as to drive the wafer on the third clamping assembly to the second cleaning mechanism.

[0013] In at least some embodiments of the present application, The third clamping assembly comprises a substrate, a sixth driving assembly and at least three clamping claws. The substrate is installed on the driving end of the fifth driving assembly. The sixth driving assembly is installed on the substrate, and the at least three clamping claws are uniformly distributed around the center of the substrate in a circumferential direction and are installed on the driving end of the sixth driving assembly. The sixth driving assembly is configured to drive the at least three clamping claws to move synchronously towards or away from the center of the substrate, so as to clamp or release the wafer.

[0014] In at least some embodiments of the present application, The wafer trimming device further comprises a detection mechanism, and the detection mechanism is located on one side of the first carrying mechanism. The first carrying mechanism is further configured to pick up the cleaned wafer on the cleaning mechanism and carry the wafer to the detection mechanism. The detection mechanism is configured to receive the trimmed and cleaned wafer carried by the first carrying mechanism and detect the edge of the wafer. The first carrying mechanism is further configured to pick up the detected wafer on the detection mechanism and carry the wafer to a corresponding next process according to the detection result.

[0015] In a second aspect, the present application provides a wafer trimming method based on the wafer trimming device of any one of the first aspect, the method comprising: Controlling the first carrying mechanism to carry the wafer to be trimmed to the centering and conveying mechanism. controlling the centering transmission mechanism to transmit the wafer carried by the first carrying mechanism to the processing platform after calibrating the direction and position of the wafer; controlling the trimming mechanism to trim the wafer on the processing platform; controlling the second carrying mechanism to pick up the trimmed wafer on the processing platform and carry the wafer to the cleaning mechanism in the Y direction; controlling the cleaning mechanism to clean the wafer; controlling the first carrying mechanism to pick up the cleaned wafer on the cleaning mechanism and carry the wafer to the next process.

[0016] The one or more embodiments of the present application have at least one or more of the following beneficial effects: In the implementation of the technical solutions of the present application, by integrating the first carrying mechanism, the centering transmission mechanism, the trimming mechanism, the second carrying mechanism and the cleaning mechanism, the full-process automatic processing of the wafer from positioning transmission to trimming and cleaning is realized, and the trimming process integrity of the wafer is effectively ensured. The reasonable layout of each mechanism and the cooperation with the carrying mechanism make the transmission path of the wafer between processes simple and the handover more direct, thereby significantly improving the accuracy and efficiency of transmission. In addition, the compact overall layout reduces the equipment floor area, facilitates daily maintenance, and ultimately improves the overall availability and output stability of the equipment.

[0017] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0018] The disclosure of the present application will become more apparent with reference to the drawings. It will be readily understood by those skilled in the art that the drawings are only for the purpose of illustration and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the figures are used to represent similar components, wherein: Figure 1 is a schematic top view of the layout structure of a wafer trimming device according to one embodiment of the present application; Figure 2 is a schematic three-dimensional structure of a trimming mechanism according to one embodiment of the present application; Figure 3 is a schematic three-dimensional structure of a third carrying mechanism according to one embodiment of the present application; Figure 4 is a schematic three-dimensional structure of a trimming mechanism according to one embodiment of the present application; Figure 5 is a schematic three-dimensional structure of a second carrying mechanism according to one embodiment of the present application; Figure 6is a schematic view of a second clamping assembly according to an embodiment of the present application; Figure 7 is a schematic view of a first cleaning mechanism according to an embodiment of the present application; Figure 8 is a schematic view of a fourth conveying mechanism according to an embodiment of the present application; Figure 9 is a schematic view of a second cleaning mechanism according to an embodiment of the present application; Figure 10 is a schematic view of a wafer trimming device according to an embodiment of the present application; Figure 11 is a schematic view of a wafer trimming method according to an embodiment of the present application.

[0019] Legend of reference signs: 1, frame body; 2, first conveying mechanism; 3, centering and conveying mechanism; 31, edge finding mechanism; 311, mounting plate; 312, rotating platform; 313, rotating driving mechanism; 314, sensor; 32, third conveying mechanism; 321, first driving assembly; 3211, first driving member; 3212, second driving member; 322, first clamping assembly; 4, trimming mechanism; 41, processing platform; 42, first conveying assembly; 43, mounting frame; 44, second driving assembly; 441, third driving member; 442, fourth driving member; 45, cutter; 46, detecting assembly; 5, second conveying mechanism; 51, third driving assembly; 511, fifth driving member; 512, sixth driving member; 52, second clamping assembly; 521, base plate; 522, fourth driving assembly; 523, clamping jaw; 6, cleaning mechanism; 61, first cleaning mechanism; 611, fourth clamping assembly; 612, cleaning assembly; 62, second cleaning mechanism; 621, cleaning station; 7, fourth conveying mechanism; 71, fifth driving assembly; 711, seventh driving member; 712, eighth driving member; 72, third clamping assembly; 721, base plate; 722, sixth driving assembly; 723, clamping jaw; 8, detecting mechanism. DETAILED DESCRIPTION

[0020] Some embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the protection scope of the present application.

[0021] Reference will be made to the accompanying drawings Figure 1In one or more embodiments, a wafer trimming device of the present application comprises a frame body 1, a first conveying mechanism 2, a centering transmission mechanism 3, a trimming mechanism 4, a second conveying mechanism 5 and a cleaning mechanism 6 mounted on the frame body 1 respectively; The first conveying mechanism 2 is configured to convey the wafer to be trimmed to the centering transmission mechanism 3; The centering transmission mechanism 3 and the trimming mechanism 4 are arranged in sequence along the X direction; the trimming mechanism 4 has a processing platform 41; the centering transmission mechanism 3 is configured to transmit the wafer to the processing platform 41 after calibrating the direction and position of the wafer; the trimming mechanism 4 is configured to trim the wafer on the processing platform 41; The second conveying mechanism 5 is configured to pick up the trimmed wafer on the processing platform 41 and convey the wafer to the cleaning mechanism 6 in the Y direction; the cleaning mechanism 6 is configured to clean the wafer; The first conveying mechanism 2 is also configured to pick up the cleaned wafer on the cleaning mechanism 6 and convey the wafer to the next process.

[0022] It can be understood that in the present application, the first conveying mechanism 2 serves as the front-end interface of the entire wafer trimming device, which conveys the wafer to be trimmed from the external transfer station or buffer platform to the centering transmission mechanism 3, and also sends the trimmed and cleaned wafer out of the device to the next process such as thinning; during conveying the wafer to be processed to the centering transmission mechanism 3, the wafer conveyed by the first conveying mechanism 2 may not be consistent in position and direction due to inconsistent docking platforms or inconsistent picking directions, etc., and in order to ensure accurate cutting of the wafer edge and uniformity of trimming, the consistency of the wafer direction and the determination of the center position are required, therefore, before trimming, the centering transmission mechanism 3 is arranged to calibrate the direction and position of the wafer, so that the subsequent trimming is based on the unified direction to plan the cutting path and determine the trimming contour centered on the wafer itself, which can avoid cutting the effective area and ensure the uniformity of edge trimming, and also avoid the need for repositioning features for each wafer during trimming, and provides a unified and known wafer direction for all subsequent stations, so that the entire transmission and processing process can be efficiently and automatically performed without the need for repeated edge searching to improve production efficiency; The centering transmission mechanism 3 and the trimming mechanism 4 are arranged in the frame body 1 in sequence along the X direction, which can be understood as that the centering transmission mechanism 3 and the trimming mechanism 4 are arranged in the same direction, and the two are in the same plane during wafer transmission, and only one direction needs to be considered for docking transfer, that is, only the movement in the X direction needs to be considered during wafer handling, and the wafer transmission can be completed without movement in the Y direction; in this way, the problem of wafer position deviation caused by multi-directional movement can be avoided, so that the wafer aligned in direction and position can be accurately sent to the trimming mechanism 4; at the same time, the handling efficiency can be improved, and the structural design complexity of the handling assembly in the centering transmission mechanism 3 can be simplified, which is convenient for installation and maintenance, thereby facilitating the space optimization and output efficiency of the whole machine. The cleaning mechanism 6 is located in the Y direction, that is, the setting direction of the cleaning mechanism 6 is perpendicular to the transmission direction of the trimming mechanism 4, which avoids the length of the whole machine being too long in the same direction, and at the same time, facilitates the setting and handling of the second handling mechanism 5; during the process of the second handling mechanism 5 handling the wafer on the processing platform 41 to the cleaning mechanism 6, only one direction needs to be considered for movement in the same plane, that is, the Y direction, which reduces the possibility of wafer position deviation and facilitates the subsequent clamping and cleaning of the wafer by the cleaning mechanism 6; the second handling mechanism 5 can only consider being arranged in the Y direction in the XY plane, which simplifies the structural design complexity of the handling mechanism, effectively improves the handling efficiency, and is convenient for installation and maintenance, thereby facilitating the space optimization and output efficiency of the whole machine.

[0023] In the embodiments of the present application, by integrating the first handling mechanism 2, the centering transmission mechanism 3, the trimming mechanism 4, the second handling mechanism 5 and the cleaning mechanism 6, the whole process automation of wafer positioning, transmission, trimming and cleaning is realized, and the integrity of the wafer trimming process is effectively ensured. The reasonable layout of each mechanism and the cooperation of the handling mechanism make the transmission path of the wafer between processes simple and the handover more direct, thereby significantly improving the accuracy and efficiency of transmission. In addition, the compact overall layout reduces the equipment floor area, facilitates daily maintenance, and finally improves the overall availability and output stability of the equipment.

[0024] In one embodiment, referring to Figures 1-3 The centering transmission mechanism 3 includes an edge finding mechanism 31 and a third handling mechanism 32; The edge finding mechanism 31 is provided with an alignment station; the edge finding mechanism 31 is configured to align the wafer handled by the first handling mechanism 2 to the alignment station, so that the cut direction of the wafer is consistent; The third handling mechanism 32 includes a first driving assembly 321 and a first clamping assembly 322; the first driving assembly 321 is located on one side of the edge finding mechanism 31 and is installed on the frame body 1; The first clamping assembly 322 is configured to clamp the wafer at the alignment station and adjust the center position of the wafer; the first clamping assembly 322 is installed on the driving end of the first driving assembly 321; The first driving assembly 321 is configured to drive the first clamping assembly 322 to move along the X direction and / or the Z direction, so as to drive the wafer on the first clamping assembly 322 to move to the processing platform 41.

[0025] That is, the edge finding mechanism 31 receives the wafer to be processed carried by the first carrying mechanism 2, and aligns the wafer so that the notch (or flat) of the wafer always faces the same direction; the third carrying mechanism 32 can carry the wafer between the edge finding mechanism 31 and the processing platform 41, and the first clamping assembly 322 of the third carrying mechanism 32 can adjust the center of the wafer so that the center of the wafer is aligned with the preset reference point, so as to ensure accurate positioning in subsequent processing.

[0026] Specifically, referring to Figure 2 , the edge finding mechanism 31 includes a mounting plate 311, a rotating platform 312, a rotating driving mechanism 313, and a sensor 314; the entire edge finding mechanism 31 is installed on the frame body 1 through the mounting plate 311, the rotating platform 312, the rotating driving mechanism 313, and the sensor 314 are all installed on the mounting plate 311; the rotating platform 312 is installed on the driving end of the rotating driving mechanism 313; the first carrying mechanism 2 carries the wafer to be processed to the rotating platform 312; the sensor 314 is used to identify the notch of the wafer on the rotating platform 312; the rotating driving mechanism 313 drives the rotating platform 312 to rotate according to the identification structure of the sensor 314, so that the notch of the wafer always faces the same direction. The notch on the wafer is the only physical direction reference. The edge finding mechanism 31 identifies this reference and rotates the wafer to a uniform angle (for example, adjusts the notch to the standard 3 o'clock position). In this way, the subsequent edge trimming mechanism 4 can accurately calculate the cutting path based on this uniform coordinate. If it is not aligned, the cutting position will deviate from the design target, which may cause uneven trimming width or directly cut the effective chip area. Further, the edge finding mechanism 31 can also preliminarily check whether the wafer has serious damage, edge collapse, or size abnormalities during the alignment process, so that unqualified products can be found and removed in advance before the trimming process starts, thereby avoiding wasting processing time and resources.

[0027] Specifically, referring to Figure 3 , the first driving assembly 321 includes a first driving member 3211 and a second driving member 3212; the first driving member 3211 is arranged on the frame body 1 along the X direction; the second driving member 3212 is installed on the driving end of the first driving member 3211; the first clamping assembly 322 is installed on the driving end of the second driving member 3212; The first driving member 3211 can drive the second driving member 3212 to move along the X direction to drive the first clamping assembly 322 to move along the X direction; the second driving member 3212 can drive the first clamping assembly 322 to move along the Z direction; In use, wafer picking: the first driving member 3211 drives the second driving member 3212 to move along the X direction to the first clamping assembly 322 above the rotating platform 312, and the second driving member 3212 drives the first clamping assembly 322 to descend to pick up the wafer on the rotating platform 312; after picking up the wafer, the second driving member 3212 drives the first clamping assembly 322 to ascend, the first driving member 3211 drives the second driving member 3212 to drive the first clamping assembly 322 to move above the processing platform 41, and the second driving member 3212 drives the first clamping assembly 322 to descend to place the wafer on the processing platform 41.

[0028] Among them, the first driving member 3211 and the second driving member 3212 can be servo cylinders or linear modules.

[0029] Among them, the first clamping assembly 322 can be a jaw assembly, referring to Figure 3 Among them, the jaw assembly includes three evenly distributed jaws, and each jaw can be correspondingly provided with a driving mechanism, so that each jaw can be driven independently, so that the clamped wafer moves in the direction of the jaw, thereby adjusting the movement distance of the wafer in the direction of each jaw, and adjusting the center of the wafer to reach the preset standard position.

[0030] In one embodiment, referring to Figure 1 and Figure 4 The trimming mechanism 4 includes a first conveying assembly 42, a mounting frame 43, a second driving assembly 44, and a cutter 45; The first conveying assembly 42 is provided with a discharging station and a processing station; the processing platform 41 is installed on the first conveying assembly 42; the first conveying assembly 42 is configured to convey the processing platform 41 to move along the X direction, so that the processing platform 41 sends the wafer received from the discharging station to the processing station or sends the wafer trimmed in the processing station to the discharging station; The mounting frame 43 is installed on the first conveying assembly 42, and the second driving assembly 44 is installed on the mounting frame 43; the cutter 45 is installed on the driving end of the second driving assembly 44; The second driving assembly 44 is configured to drive the cutter 45 to move along the Y direction and / or the Z direction to drive the cutter 45 to trim the wafer on the processing platform 41 in the processing station; The second conveying mechanism 5 is configured to pick up the trimmed wafer on the processing platform 41 in the discharging station and convey it to the cleaning mechanism 6.

[0031] It can be understood that the first conveying assembly 42 is arranged along the X direction, which can drive the processing platform 41 to move in the X direction to realize the movement of the processing platform 41 between the discharging station and the processing station; the discharging station is located at one end close to the edge searching mechanism 31, so that the third carrying mechanism 32 places the wafer on the processing platform 41 located at the discharging station; the processing platform 41 carrying the wafer is sent to the processing station by the first conveying assembly 42, so that the cutter 45 performs the edge trimming treatment on the wafer.

[0032] In a specific embodiment, the number of cutters 45 is at least two; the second driving assembly 44 is further configured to drive the at least two cutters 45 to move along the Y direction and / or the Z direction respectively, so as to collectively trim the wafer on the processing platform 41; the cooperation of the at least two cutters 45 can improve the processing efficiency and the trimming accuracy. Specifically, the mounting frame 43 can be arranged transversely on the first conveying assembly 42, and the processing platform 41 can pass through the mounting frame 43 along the X direction; the second driving assembly 44 includes a third driving member 441 and two fourth driving members 442; the third driving member 441 is arranged on the mounting frame 43 along the Y direction and above the first conveying assembly 42; the two fourth driving members 442 are installed on the driving end of the third driving member 441; each fourth driving member 442 has a cutter 45 installed on the driving end thereof; The lower position of the first conveying assembly 42 corresponding to the third driving member 441 can be defined as the processing station; the third driving member 441 can drive the two fourth driving members 442 to move along the Y direction, so as to correspondingly move to the positions on both sides of the processing station and correspondingly to the edges of the wafer in the Z direction (which can be understood as the vertical direction); the fourth driving member 442 can drive the corresponding cutter 45 to ascend or descend, so as to move the cutter 45 to the position of contacting the edge of the wafer to process it. The processed wafer is sent to the discharging station by the first conveying assembly 42 to drive the processing platform 41, so as to be taken away by the second carrying mechanism 5.

[0033] Among them, the third driving member 441 and the fourth driving member 442 can be a servo cylinder or a linear module.

[0034] In a possible embodiment, the edge trimming mechanism 4 further includes at least two detection assemblies 46, each detection assembly 46 being correspondingly installed on a cutter 45; at least one detection assembly 46 of the at least two detection assemblies 46 is configured to detect the position of the wafer on the processing platform 41 before trimming, which is mainly the distance between the cutter 45 and the wafer, and accurate positioning can ensure the accuracy of the cutting of the cutter 45; at least another detection assembly 46 of the at least two detection assemblies 46 is configured to detect the topography of the wafer on the processing platform 41, i.e. the cutting condition of the wafer surface, to observe whether the cutting work is completed or normally performed; The centering transmission mechanism 3 is further configured to pick up the wafer whose position is inaccurately detected by the detection assembly 46 on the processing platform 41 and adjust the wafer to the correct position, and then send the wafer back to the processing platform 41. That is, before the wafer is processed by the trimming mechanism 4, the trimming mechanism 4 detects the position of the wafer by the detection assembly 46, and determines whether the distance between the wafer and the cutter 45 meets the positioning requirement. If the position of the wafer is largely deviated, the wafer can be sent back to the centering transmission mechanism 3 to be adjusted to the correct position, and then be sent to the processing platform 41 to be processed in the processing station, so as to improve the processing precision.

[0035] In one embodiment, the detection assembly 46 can be a vision system, which can identify the position of the wafer by image recognition to determine whether the position of the wafer is accurate or not.

[0036] In one embodiment, the detection assembly 46 can be a vision system, which can identify the position of the wafer by image recognition to determine whether the position of the wafer is accurate or not. Figure 1 Figure 5 The second conveying mechanism 5 includes a third driving assembly 51 and a second clamping assembly 52. The second clamping assembly 52 is installed on the driving end of the third driving assembly 51, and is configured to clamp the wafer after trimming on the processing platform 41. The third driving assembly 51 is installed on the frame body 1, and is configured to drive the second clamping assembly 52 to move along the Y direction and / or the Z direction, so as to drive the wafer on the second clamping assembly 52 to the cleaning mechanism 6.

[0037] Specifically, the third driving assembly 51 includes a fifth driving member 511 and a sixth driving member 512. The fifth driving member 511 is arranged on the frame body 1 along the Y direction. The sixth driving member 512 is installed on the driving end of the fifth driving member 511 along the Z direction. The second clamping assembly 52 is installed on the driving end of the sixth driving member 512. In use, the fifth driving member 511 can drive the sixth driving member 512 to move, so as to drive the second clamping assembly 52 to correspond to the position of the wafer on the processing platform 41 in the processing station along the Y direction. The sixth driving member 512 drives the second clamping assembly 52 to descend to the processing platform 41 to pick up the wafer. After picking up the wafer, the sixth driving member 512 drives the second clamping assembly 52 to ascend, and the fifth driving member 511 drives the sixth driving member 512 to move along the Y direction, so as to move the second clamping assembly 52 above the cleaning mechanism 6. The sixth driving member 512 continues to drive the second clamping assembly 52 to descend, so as to place the wafer on the clamping assembly or the support in the cleaning mechanism 6 to be cleaned.

[0038] In one embodiment, the detection assembly 46 can be a vision system, which can identify the position of the wafer by image recognition to determine whether the position of the wafer is accurate or not. Figure 5 Figure 6 The second clamping assembly 52 includes a substrate 521, a fourth driving assembly 522, and at least three clamping claws 523. The substrate 521 is installed on the driving end of the third driving assembly 51.​​ The fourth driving assembly 522 is installed on the base plate 521; and the at least three clamping jaws 523 are evenly distributed around the center of the base plate 521 and are installed on the driving end of the fourth driving assembly 522. The fourth driving assembly 522 is configured to drive the at least three clamping jaws 523 to move synchronously towards or away from the center of the base plate 521 to clamp or release the wafer.

[0039] That is, the three clamping jaws 523 driven by the fourth driving assembly 522 can realize simultaneous opening and closing, realize simultaneous clamping and releasing of the wafer, keep the wafer center position fixed, effectively ensure the positioning accuracy of the wafer, make the wafer not deviate during the conveying process, and further improve the transmission accuracy.

[0040] In one embodiment, referring to Figure 1 The cleaning mechanism 6 includes a first cleaning mechanism 61 and a second cleaning mechanism 62; the first cleaning mechanism 61 and the second cleaning mechanism 62 are arranged in sequence along the X direction; the first cleaning mechanism 61 is located on one side of the trimming mechanism 4; and the second cleaning mechanism 62 is located on one side of the centering and conveying mechanism 3. The wafer trimming device further includes a fourth conveying mechanism 7. The first cleaning mechanism 61 is configured to receive the wafer conveyed by the second conveying mechanism 5 and clean the back surface of the wafer. The fourth conveying mechanism 7 is configured to pick up the cleaned wafer on the first cleaning mechanism 61 and convey the wafer to the second cleaning mechanism 62. The second cleaning mechanism 62 is configured to receive the wafer conveyed by the fourth conveying mechanism 7 and clean the front surface of the wafer and spin dry. The first conveying mechanism 2 is further configured to pick up the spun-dried wafer on the second cleaning mechanism 62 and convey the wafer to the next process.

[0041] It can be understood that, in the present application, the first cleaning mechanism 61 is located on one side of the trimming mechanism 4 in the Y direction, which facilitates the second conveying mechanism 5 to directly send the wafer to the first cleaning mechanism 61 after picking up the wafer from the trimming mechanism 4; the first cleaning mechanism 61 and the second cleaning mechanism 62 are arranged side by side in the X direction, which facilitates the fourth conveying mechanism 7 to directly send the wafer in the first cleaning mechanism 61 to the second cleaning mechanism 62 in the X direction; and the second cleaning mechanism 62 is located on one side of the centering and conveying mechanism 3 in the Y direction, which facilitates the centering and conveying mechanism 3 to interface with the first conveying mechanism 2 and send the cleaned and spun-dried wafer out of the wafer trimming device or to the next process.

[0042] In one possible implementation, referring to Figure 7The first cleaning mechanism 61 may include a fourth clamping component 611 and a cleaning component 612; the fourth clamping component 611 is used to clamp the wafer transported by the second transport mechanism 5; the cleaning component 612 can clean the back side of the wafer.

[0043] In one possible implementation, refer to Figure 8 The fourth conveying mechanism 7 includes a fifth drive assembly 71 and a third clamping assembly 72; The third clamping assembly 72 is mounted on the drive end of the fifth drive assembly 71; the third clamping assembly 72 is configured to clamp the cleaned wafer of the first cleaning mechanism 61. The fifth drive assembly 71 is mounted on the frame 1 and is configured to drive the third clamping assembly 72 to move along the X and / or Z directions to move the wafer on the third clamping assembly 72 to the second cleaning mechanism 62.

[0044] Specifically, the fifth drive assembly 71 includes a seventh drive member 711 and an eighth drive member 712; the seventh drive member 711 is disposed on the frame 1 along the X direction; the eighth drive member 712 is mounted on the drive end of the seventh drive member 711; the third clamping assembly 72 is mounted on the drive end of the eighth drive member 712; during use, the seventh drive member 711 can drive the eighth drive member 712 to move, causing the third clamping assembly 72 to align with the fourth clamping assembly 611 of the first cleaning mechanism 61 in the X direction; the eighth drive member 712... The actuator 712 drives the third clamping assembly 72 to descend to the fourth clamping assembly 611 to pick up the wafer on the fourth clamping assembly 611; after picking up the wafer, the eighth actuator 712 drives the third clamping assembly 72 to rise, and the seventh actuator 711 drives the eighth actuator 712 to move along the X direction, so that the third clamping assembly 72 is moved above the cleaning station of the second cleaning mechanism 62. The eighth actuator 712 continues to drive the third clamping assembly 72 to descend, so as to place the wafer on the cleaning station of the second cleaning mechanism 62 for front cleaning.

[0045] The seventh drive unit 711 and the eighth drive unit 712 can be servo electric cylinders or linear modules.

[0046] Among them, such as Figure 6As shown, the third clamping assembly 72 can be arranged in the same manner as the second clamping assembly 52. That is, the third clamping assembly 72 can be arranged in the same manner as the second clamping assembly 52 or in a different manner. If arranged in the same manner, the third clamping assembly 72 specifically includes a substrate 721, a sixth driving assembly 722, and at least three clamping jaws 723; the substrate 721 is mounted on the driving end of the fifth driving assembly 71; the sixth driving assembly 722 is mounted on the substrate 721; the at least three clamping jaws 723 are evenly distributed around the center of the substrate 721 and mounted on the driving end of the sixth driving assembly 722; and the sixth driving assembly 722 is configured to drive the at least three clamping jaws 723 to move synchronously towards or away from the center of the substrate 721 to clamp or release the wafer. Similarly, the three clamping jaws are simultaneously actuated to open or close, thereby achieving simultaneous clamping and releasing of the wafer, keeping the wafer center fixed, effectively ensuring the positioning accuracy of the wafer, preventing the wafer from shifting during the transfer between the first cleaning mechanism 61 and the second cleaning mechanism 62, and further improving the accuracy of the transfer.

[0047] In one possible implementation, referring to Figure 9 The second cleaning mechanism 62 has a cleaning station 621, and the fourth transfer mechanism 7 transfers the wafer cleaned by the first cleaning mechanism 61 to the cleaning station 621 for cleaning, and the first transfer mechanism 2 takes out the wafer cleaned and dried by the cleaning station 621 and transfers it to the next process. In this application, the second cleaning mechanism 62 can clean the front side of the wafer through chemical cleaning and megasonic cleaning.

[0048] It should be understood that the specific structure of the first cleaning mechanism 61 and the second cleaning mechanism 62 is not limited in this application, and any cleaning mechanism that meets the use requirements can be arranged in the scheme of this application, and if the arrangement is consistent, it should be within the protection scope of this application.

[0049] In one embodiment, referring to Figure 1 The wafer trimming device further includes a detection mechanism 8; the detection mechanism 8 is located on one side of the first transfer mechanism 2; The first transfer mechanism 2 is further configured to pick up the wafer cleaned by the cleaning mechanism 6 and transfer the wafer to the detection mechanism 8; The detection mechanism 8 is configured to receive the wafer trimmed and cleaned by the first transfer mechanism 2 and detect the edge of the wafer; The first transfer mechanism 2 is further configured to pick up the wafer detected by the detection mechanism 8 and transfer the wafer to the corresponding next process according to the detection result.

[0050] The detection mechanism 8 can detect whether the width and depth of the outer edge of the processed wafer meet the processing process requirements, and if so, subsequent thinning process can be performed; if not, unqualified products can be removed in time to ensure production quality. In the present application, the detection mechanism 8 can be a laser sensor assembly and a vision system, which detects the cutting depth of the wafer through the laser sensor assembly and monitors the cutting width through the vision system.

[0051] In one embodiment, referring to Figure 10 The frame body 1 can be made of aluminum alloy profile frame, and the first conveying mechanism 2, the centering transmission mechanism 3, the trimming mechanism 4, the second conveying mechanism 5 and the cleaning mechanism 6 are arranged in the frame body 1, so that the overall structure is compact, the floor area is small, and the production efficiency is high.

[0052] Based on the above embodiment, referring to Figures 1-10 An optional working process of the wafer trimming device in the present embodiment is as follows: The first conveying mechanism 2 conveys the wafer to be trimmed to the rotating platform 312 of the edge finding mechanism 31; the edge finding mechanism 31 aligns the wafer on the rotating platform 312 so that the cutting direction of the wafer is consistent; The third conveying mechanism 32 conveys the aligned wafer on the rotating platform 312 to the processing platform 41 of the trimming mechanism 4 in the discharge station along the X direction and / or the Z direction; The first conveying assembly 42 moves the processing platform 41 from the discharge station to the processing station; The second driving assembly 44 drives the cutter 45 to move, so as to drive the cutter 45 to trim the wafer on the processing platform 41 in the processing station; After trimming, the first conveying assembly 42 moves the processing platform 41 from the processing station to the discharge station; The second conveying mechanism 5 picks up the trimmed wafer on the processing platform 41 in the discharge station and conveys it to the fourth clamping assembly 611 of the first cleaning mechanism 61 along the Y direction and / or the Z direction; The cleaning assembly 612 cleans the back of the wafer clamped on the fourth clamping assembly 611; After cleaning, the fourth conveying mechanism 7 conveys the cleaned wafer to the cleaning station 621 of the second cleaning mechanism 62 along the X direction and / or the Z direction for front cleaning; After cleaning and drying, the first conveying mechanism 2 conveys the wafer on the cleaning station 621 to the detection mechanism 8 for outer edge qualification detection and sends the wafer meeting the requirements after detection to the next process.

[0053] Further, the present application provides a wafer trimming method based on the wafer trimming device as described above, which comprises the following steps: Controlling the first conveying mechanism 2 to convey the wafer to be trimmed to the centering transmission mechanism 3; The centering transmission mechanism 3 transmits the wafer carried by the first carrying mechanism 2 to the processing platform 41 after the direction and position of the wafer are calibrated; The trimming mechanism 4 trims the wafer on the processing platform 41; The second carrying mechanism 5 picks up the trimmed wafer on the processing platform 41 and carries the wafer to the cleaning mechanism 6 in the Y direction; The cleaning mechanism 6 cleans the wafer; The first carrying mechanism 2 picks up the cleaned wafer on the cleaning mechanism 6 and carries the wafer to the next process.

[0054] In one embodiment, the wafer trimming method described above can be executed by a control system, which can include a vision system or various detection systems with detection components such as laser sensors. The vision system can capture wafer images to obtain the position of the wafer, and the laser sensor can detect the direction of the wafer and whether it reaches the specified position. For specific implementations of each component, please refer to the above-described embodiments of the wafer trimming device, and the repeated parts will not be described again.

[0055] Based on the above embodiments, with reference to Figure 11 , an optional flow of the wafer trimming method of the present embodiment is as follows: The first carrying mechanism 2 carries the wafer to be trimmed to the edge finding mechanism 31 (the wafer on the rotating platform 312 is placed at a specified position), the edge finding mechanism 31 finds the notch of the wafer through the sensor 314, and the rotating platform 312 is driven by the rotating drive mechanism 313 to make the notch direction of the wafer consistent; The third carrying mechanism 32 carries the wafer with consistent notch on the rotating platform 312 to the processing platform 41 at the docking position (which can be understood as the discharge station of the trimming mechanism 4); The processing platform 41 moves to the specified detection position on the trimming mechanism 4 for visual detection. If the wafer center is not offset, the second drive assembly 44 drives the cutter 45 to process the wafer. If the wafer center is offset, the processing platform 41 is controlled to transport the wafer back to the docking position, and the third carrying mechanism 32 is controlled to pick up the wafer for center adjustment and positioning. After adjustment, the wafer is placed on the processing platform 41 at the docking position again, and the processing platform 41 is transported back to the detection position for repeated visual detection until the wafer center is not offset. The processing platform 41 continues to transport the wafer to the trimming station for trimming processing; After processing is completed, the processing platform 41 transports the wafer back to the docking position, and the second carrying mechanism 5 transports the wafer from the docking position to the first cleaning mechanism 61 for back washing; After back washing, the fourth carrying mechanism 7 carries the wafer from the first cleaning mechanism 61 to the second cleaning mechanism 62 for front cleaning and spin-drying; Optionally, the first conveying mechanism 2 conveys the cleaned and dried wafer from the second cleaning mechanism 62 to the detection mechanism 8 for outer edge detection, and finally conveys the wafer that passes the detection to the wafer cassette.

[0056] It should be understood that, during the conveying of the wafer, each conveying mechanism can control other conveying mechanisms to avoid collision.

[0057] It should be understood that various portions of the application can be implemented with hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented with software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any of the following technologies, or a combination thereof, can be used: discrete logic circuitry having logic gates for implementing logic functions upon data signals, application specific integrated circuits having appropriate combinational logic gates, programmable gate arrays (PGA), field programmable gate arrays (FPGA), and the like.

[0058] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0059] In addition, the terms "first", "second", etc. are used only for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0060] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A wafer trimming device, characterized in that, It includes a frame (1) and a first transport mechanism (2), a centering and transmission mechanism (3), a trimming mechanism (4), a second transport mechanism (5), and a cleaning mechanism (6) respectively installed on the frame (1); The first transport mechanism (2) is configured to transport the wafer to be trimmed to the centering and transfer mechanism (3); The centering and transmission mechanism (3) and the trimming mechanism (4) are arranged sequentially along the X direction; the trimming mechanism (4) has a processing platform (41); the centering and transmission mechanism (3) is configured to calibrate the direction and position of the wafer and then transmit it to the processing platform (41); the trimming mechanism (4) is configured to trim the wafer on the processing platform (41); The second transport mechanism (5) is configured to pick up the trimmed wafer located on the processing platform (41) and transport the wafer to the cleaning mechanism (6) located in the Y direction; the cleaning mechanism (6) is configured to clean the wafer; The first transport mechanism (2) is also configured to pick up the cleaned wafer from the cleaning mechanism (6) and transport the wafer to the next process.

2. The wafer trimming apparatus according to claim 1, characterized in that, The centering transmission mechanism (3) includes an edge-finding mechanism (31) and a third transport mechanism (32). The edge-finding mechanism (31) is provided with an alignment station; the edge-finding mechanism (31) is configured to align the wafers transported by the first transport mechanism (2) to the alignment station so that the cut directions of the wafers are consistent; The third transport mechanism (32) includes a first drive assembly (321) and a first clamping assembly (322); the first drive assembly (321) is located on one side of the edge-finding mechanism (31) and is mounted on the frame (1); The first clamping assembly (322) is configured to clamp the wafer located at the alignment station and adjust the center position of the wafer; the first clamping assembly (322) is mounted on the drive end of the first drive assembly (321); The first drive component (321) is configured to drive the first clamping component (322) to move along the X direction and / or Z direction to move the wafer on the first clamping component (322) to the processing platform (41).

3. The wafer trimming apparatus according to claim 1, characterized in that, The trimming mechanism (4) includes a first conveying assembly (42), a mounting bracket (43), a second drive assembly (44), and a cutting tool (45). The first conveying assembly (42) is provided with a discharge station and a processing station; the processing platform (41) is mounted on the first conveying assembly (42); the first conveying assembly (42) is configured to convey the processing platform (41) to move along the X direction, so that the processing platform (41) delivers the wafer received from the discharge station to the processing station or delivers the wafer trimmed at the processing station to the discharge station; The mounting bracket (43) is mounted on the first conveying assembly (42), and the second drive assembly (44) is mounted on the mounting bracket (43); the cutting tool (45) is mounted on the drive end of the second drive assembly (44); The second drive component (44) is configured to drive the tool (45) to move along the Y direction and / or Z direction, so as to drive the tool (45) to trim the wafer on the processing platform (41) at the processing station; The second transport mechanism (5) is configured to pick up the trimmed wafers located on the processing platform (41) at the discharge station and transport them to the cleaning mechanism (6).

4. The wafer trimming apparatus according to claim 3, characterized in that, The number of the cutting tools (45) is at least two; the second drive assembly (44) is also configured to drive at least two of the cutting tools (45) to move along the Y direction and / or the Z direction respectively, so as to jointly trim the wafer on the processing platform (41); The trimming mechanism (4) further includes at least two detection components (46), each of which is mounted on one of the cutting tools (45); at least one of the at least two detection components (46) is configured to perform position detection on the wafer on the processing platform (41) before trimming; at least another of the at least two detection components (46) is configured to detect the morphology of the wafer on the processing platform (41); The centering and transmission mechanism (3) is also configured to pick up wafers that are not in the correct position detected by the detection component (46) on the processing platform (41), adjust them to the correct position, and then send them back to the processing platform (41).

5. The wafer trimming apparatus according to claim 1, characterized in that, The second conveying mechanism (5) includes a third drive assembly (51) and a second clamping assembly (52); The second clamping assembly (52) is mounted on the drive end of the third drive assembly (51); the second clamping assembly (52) is configured to clamp the trimmed wafer located on the processing platform (41); The third drive assembly (51) is mounted on the frame (1) and is configured to drive the second clamping assembly (52) to move along the Y direction and / or the Z direction to move the wafer on the second clamping assembly (52) to the cleaning mechanism (6).

6. The wafer trimming apparatus according to claim 5, characterized in that, The second clamping assembly (52) includes a substrate (521), a fourth drive assembly (522), and at least three grippers (523). The substrate (521) is mounted on the driving end of the third driving assembly (51); The fourth drive assembly (522) is mounted on the substrate (521); the at least three grippers (523) are evenly distributed around the center of the substrate (521) and mounted on the drive end of the fourth drive assembly (522); The fourth driving component (522) is configured to drive the at least three grippers (523) to move toward or away from the center of the substrate (521) in a synchronous manner to grip or release the wafer.

7. The wafer trimming apparatus according to claim 1, characterized in that, The cleaning mechanism (6) includes a first cleaning mechanism (61) and a second cleaning mechanism (62); the first cleaning mechanism (61) and the second cleaning mechanism (62) are arranged sequentially along the X direction; the first cleaning mechanism (61) is located on one side of the trimming mechanism (4); the second cleaning mechanism (62) is located on one side of the centering transmission mechanism (3); The wafer trimming device also includes a fourth transport mechanism (7). The first cleaning mechanism (61) is configured to receive the wafer transported by the second transport mechanism (5) and perform back-side cleaning on the wafer; The fourth transport mechanism (7) is configured to pick up the cleaned wafer located on the first cleaning mechanism (61) and transport the wafer to the second cleaning mechanism (62). The second cleaning mechanism (62) is configured to receive the wafers transported by the fourth transport mechanism (7) and perform front-side cleaning and spin-drying on the wafers; The first transport mechanism (2) is also configured to pick up the spun-dry wafer from the second cleaning mechanism (62) and transport the wafer to the next process.

8. The wafer trimming apparatus according to claim 7, characterized in that, The fourth transport mechanism (7) includes a fifth drive assembly (71) and a third clamping assembly (72). The third clamping assembly (72) is mounted on the drive end of the fifth drive assembly (71); the third clamping assembly (72) is configured to clamp the cleaned wafer of the first cleaning mechanism (61); The fifth drive assembly (71) is mounted on the frame (1) and is configured to drive the third clamping assembly (72) to move along the X and / or Z directions to move the wafer on the third clamping assembly (72) to the second cleaning mechanism (62).

9. The wafer trimming apparatus according to claim 8, characterized in that, The third clamping assembly (72) includes a base plate (721), a sixth drive assembly (722), and at least three grippers (723). The substrate (721) is mounted on the driving end of the fifth driving assembly (71); The sixth drive assembly (722) is mounted on the substrate (721); the at least three grippers (723) are evenly distributed around the center of the substrate (721) and mounted on the drive end of the sixth drive assembly (722); The sixth driving component (722) is configured to drive the at least three grippers (723) to move synchronously toward or away from the center of the substrate (721) to grip or release the wafer.

10. The wafer trimming apparatus according to claim 1, characterized in that, The wafer trimming device also includes an inspection mechanism (8); the inspection mechanism (8) is located on one side of the first transport mechanism (2); The first transport mechanism (2) is also configured to pick up the cleaned wafer from the cleaning mechanism (6) and transport the wafer to the inspection mechanism (8); The detection mechanism (8) is configured to receive the trimmed and cleaned wafers transported by the first transport mechanism (2) and to detect the edges of the wafers. The first transport mechanism (2) is also configured to pick up the inspected wafer from the inspection mechanism (8) and transport the wafer to the corresponding next process according to the inspection result.

11. A wafer trimming method, characterized in that, Based on the wafer trimming apparatus as described in any one of claims 1-10, the method comprises: Control the first transport mechanism (2) to transport the wafer to be trimmed to the centering and transfer mechanism (3); The centering and transfer mechanism (3) calibrates the direction and position of the wafer transported from the first transport mechanism (2) and then transfers it to the processing platform (41). The trimming mechanism (4) is controlled to trim the wafers on the processing platform (41); Control the second transport mechanism (5) to pick up the trimmed wafer located on the processing platform (41) and transport the wafer to the cleaning mechanism (6) located in the Y direction; The cleaning mechanism (6) is controlled to clean the wafer; Control the first transport mechanism (2) to pick up the cleaned wafer from the cleaning mechanism (6) and transport the wafer to the next process.

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