Semiconductor heating equipment

Abstract

The invention discloses semiconductor heating equipment which comprises a supporting rack, a supporting top frame is fixedly connected to the top of the supporting rack, and a rotating stand column is rotationally connected to the top of the supporting top frame. When the output end of a first motor drives a reciprocating lead screw to rotate, the reciprocating lead screw drives a first sliding block on the outer side to move in a reciprocating mode for adjustment, the first sliding block drives a sliding rack to move, the sliding rack drives a meshed gear to rotate, and when the gear rotates, the gear drives a rotating rod on the inner side to rotate; the rotating rod drives the rotating stand column, the first air cylinder, the supporting frame and the second air cylinder to rotate and adjust, the positions of the fixed supporting disc and the vacuum suction cup are exchanged and adjusted, automatic feeding and discharging treatment can be conveniently conducted on wafers, manual contact with the wafers is not needed, and safety and cleanliness are improved.

Description

Technical Field

[0001] This invention relates to the field of heating equipment technology, specifically to a semiconductor heating device. Background Technology

[0002] Semiconductors are a class of materials whose conductivity lies between that of conductors (such as metals) and insulators (such as rubber and glass). Their core characteristic is that their conductivity can be significantly modulated by external conditions (such as temperature, light, electric field, or doping). This characteristic makes them the cornerstone of modern electronic technology. In the field of semiconductor manufacturing, wafers serve as the core carrier of integrated circuits (ICs). The precision and stability of their processing technology directly determine the performance and yield of the chips. Semiconductor heating equipment is widely used in semiconductor manufacturing, packaging and testing, and scientific research. Its core function is to provide a stable and uniform heating environment for wafers, chips or other semiconductor materials to meet the process requirements of thin film deposition, annealing, photoresist curing and other processes. As semiconductor technology develops towards smaller process nodes (such as 7nm, 5nm and below), the requirements for temperature control, cleanliness and process environment in wafer processing are becoming increasingly stringent. However, as a high-value precision component, wafers are easily scratched, contaminated or even broken by manual handling due to static electricity, collision or positioning deviation, which directly causes yield loss. In addition, manual operation may introduce additional particulate matter or organic pollutants, which will damage the ultra-clean environment and increase the burden of subsequent cleaning processes. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor heating device to solve the problems mentioned in the background art, which are that as high-value precision components, wafers are easily scratched, contaminated or even broken due to static electricity, collision or positioning deviation during manual handling, resulting in direct yield loss. In addition, manual operation may introduce additional particulate matter or organic pollutants, which will damage the ultra-clean environment and increase the burden on subsequent cleaning processes.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor heating device, comprising a support frame, a support top frame fixedly connected to the top of the support frame, a rotating column rotatably connected to the top of the support top frame, a first cylinder installed inside the rotating column, a support frame fixedly connected to the output end of the first cylinder, a second cylinder symmetrically installed at the bottom of the support frame, a fixed support plate fixedly connected to the output end of the second cylinder, vacuum suction cups symmetrically installed at the bottom of the fixed support plate, a vacuum generator installed at the top of the vacuum suction cups, and a conveyor installed at the top of the support top frame. The conveyor frame has guide plates symmetrically arranged on its top. A reaction chamber is fixedly connected to the top of the supporting frame. A sliding support plate is slidably arranged inside the reaction chamber. A heating plate is installed on the top of the sliding support plate. A No. 3 cylinder is installed on the top of the reaction chamber. A fixed support is fixedly connected to the output end of the No. 3 cylinder. An array of infrared lamps is installed at the bottom of the fixed support. A hot plate reflector is fixedly connected to the bottom of the fixed support. A sealing side plate is fixedly connected to one side of the sliding support plate. An air inlet head is symmetrically fixedly connected inside the supporting frame. An air inlet pipe is fixedly connected to one side of the air inlet head.

[0005] As a preferred embodiment of the present invention: an inner fixed support box is fixedly connected to the top of the support frame, the top of the inner fixed support box is fixedly connected to the support top frame, a rotating rod is rotatably connected inside the inner fixed support box, the rotating rod is rotatably connected to the support top frame, a gear is fixedly connected to the outside of the rotating rod, and a sliding rack is slidably connected inside the inner fixed support box, the sliding rack meshing with the gear.

[0006] As a preferred embodiment of the present invention: a reciprocating screw is rotatably arranged inside the internal fixed support box, a first slider is installed on the outer side of the reciprocating screw, the first slider is slidably connected to the internal fixed support box, one side of the first slider is fixedly connected to a sliding rack, a first motor is installed on one side of the internal fixed support box, the output end of the first motor is fixedly connected to the reciprocating screw, a first limiting rod is slidably connected inside the first slider, and the first limiting rod is fixedly connected to the internal fixed support box.

[0007] As a preferred embodiment of the present invention: a side fixing frame is fixedly connected to one side of the reaction box, an adjusting screw is rotatably connected inside the side fixing frame, one end of the adjusting screw is rotatably connected to the reaction box, a second slider is installed on the outside of the adjusting screw, the second slider is slidably connected to the side fixing frame, a fixing support plate is fixedly connected to one side of the second slider, the fixing support plate is slidably connected to the reaction box, and one side of the fixing support plate is fixedly connected to a guide block.

[0008] As a preferred embodiment of the present invention: a second motor is installed on one side of the side fixing frame, the output end of the second motor is fixedly connected to the adjusting screw, and multiple guide rods are slidably connected inside the support frame, the bottom end of the guide rods being fixedly connected to the rotating column.

[0009] As a preferred embodiment of the present invention: a fixed frame is symmetrically fixedly connected to the outer side of the conveyor frame, a No. 4 cylinder is installed on the outer side of the fixed frame, the output end of the No. 4 cylinder is fixedly connected to the guide plate, and a No. 3 limiting rod is symmetrically fixedly connected to the outer side of the guide plate, and the No. 3 limiting rod is slidably connected to the fixed frame.

[0010] As a preferred embodiment of the present invention: a limiting support ring is fixedly connected to the top of the heating plate, and a heating resistance wire is installed inside the heating plate.

[0011] As a preferred embodiment of the present invention: a mounting base block is fixedly connected to the bottom of the heating plate, a mounting groove that mates with the mounting base block is opened on the top of the sliding support plate, a side limiting groove is opened on one side of the mounting base block, a spring clip is slidably connected inside the sliding support plate, a pull rod is fixedly connected to one side of the spring clip, and the pull rod is slidably connected to the sliding support plate.

[0012] As a preferred embodiment of the present invention: a guide rod is slidably connected inside the guide block, and the guide rod is fixedly connected to the reaction chamber.

[0013] As a preferred embodiment of the present invention: a plurality of second limiting rods are symmetrically fixedly connected to the top of the fixed support, and the second limiting rods are slidably connected to the reaction chamber.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: By setting up a reciprocating lead screw, a first slider, a sliding rack, a gear, and a rotating rod, the present invention achieves the following: when the output end of the first motor drives the reciprocating lead screw to rotate, the reciprocating lead screw drives the outer first slider to reciprocate for adjustment. The first slider drives the sliding rack to move, and the sliding rack drives the meshing gear to rotate. When the gear rotates, it drives the inner rotating rod to rotate. The rotating rod drives the rotating column, the first cylinder, the support frame, and the second cylinder to rotate for adjustment. This allows for the interchange of the positions of the fixed support plate and the vacuum chuck, facilitating automatic wafer loading and unloading without the need for… Manual contact with the wafer improves safety and cleanliness. By incorporating a heating plate, heating resistance wire, array of infrared lamps, and a hot plate reflector, the bottom of the wafer is directly heated via heat conduction through the resistance wire built into the heating plate. This is suitable for processes such as low-temperature baking and photoresist pre-curing, offering a fast temperature response. Infrared radiation penetrates the wafer surface to directly heat the material inside, making it suitable for rapid thermal annealing and oxide layer repair processes requiring millisecond-level heating / cooling. The hot plate reflector optimizes heat utilization by directionally reflecting the radiation energy from the heating plate and infrared lamps to the wafer surface, reducing heat loss and lowering the equipment surface temperature, thus improving operational safety. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle; Figure 3 This is a schematic diagram of the internal structure of the reaction chamber of the present invention; Figure 4 This is a top view of the internal structure of the internal fixed support box of the present invention; Figure 5 This is a schematic diagram of the internal structure of the sliding support plate of the present invention; Figure 6 This is a schematic diagram of the heating resistance wire structure of the present invention; Figure 7 This is a top view of the limiting support ring of the present invention.

[0016] In the diagram: 1. Support frame; 2. Support top frame; 3. Internal fixed support box; 4. Rotating rod; 5. Gear; 6. Sliding rack; 7. Sliding block No. 1; 8. Reciprocating lead screw; 9. Limiting rod No. 1; 10. Motor No. 1; 11. Rotating column; 12. Cylinder No. 1; 13. Support frame; 14. Guide rod; 15. Cylinder No. 2; 16. Fixed support plate; 17. Vacuum suction cup; 18. Reaction chamber; 19. Sliding support plate; 20. Guide block; 21. Heating plate; 22. Limiting ring; 23. Heating element. 24. Resistance wire; 25. Conveyor frame; 26. Guide rod; 27. Fixed support plate; 28. Side fixed frame; 29. ​​No. 2 slider; 30. Adjusting screw; 31. No. 2 motor; 32. No. 3 cylinder; 33. Fixed support platform; 34. Array infrared lamp; 35. Hot plate reflector; 36. No. 2 limit rod; 37. Air inlet head; 38. Sealing side plate; 39. Fixed frame; 40. No. 4 cylinder; 41. Guide plate; 42. No. 3 limit rod; 43. Mounting base block; 44. Side limit groove; 45. Spring clip. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figures 1 to 7This invention provides a technical solution: a semiconductor heating device, including a support frame 1, a support top frame 2 fixedly connected to the top of the support frame 1, a rotating column 11 rotatably connected to the top of the support top frame 2, a first cylinder 12 installed inside the rotating column 11, a support frame 13 fixedly connected to the output end of the first cylinder 12, a second cylinder 15 symmetrically installed at the bottom of the support frame 13, a fixed support plate 16 fixedly connected to the output end of the second cylinder 15, vacuum suction cups 17 symmetrically installed at the bottom of the fixed support plate 16, a vacuum generator installed at the top of the vacuum suction cups 17, a conveyor frame 24 installed on the top of the support top frame 2, guide plates 40 symmetrically arranged on the top of the conveyor frame 24, and a fixed connection between the top of the support top frame 2 and a... The reaction chamber 18 has a sliding support plate 19 inside, a heating plate 21 on top of the sliding support plate 19, a third cylinder 31 on top of the reaction chamber 18, a fixed support 32 fixedly connected to the output end of the third cylinder 31, an array of infrared lamps 33 installed at the bottom of the fixed support 32, a hot plate reflector 34 fixedly connected to the bottom of the fixed support 32, a sealing side plate 37 fixedly connected to one side of the sliding support plate 1, and an air inlet head 36 symmetrically fixedly connected inside the support frame 1. An air inlet pipe is fixedly connected to one side of the air inlet head 36. An inert gas supply device is connected to the air inlet head 36 to fill the chamber with a specific gas, such as nitrogen or argon, to prevent the wafer from oxidizing or being contaminated during the heating process.

[0019] The support frame 1 is fixedly connected to an inner fixed support box 3 at its top. The top of the inner fixed support box 3 is fixedly connected to the support top frame 2. A rotating rod 4 is rotatably connected inside the inner fixed support box 3. The rotating rod 4 is rotatably connected to the support top frame 2. A gear 5 is fixedly connected to the outside of the rotating rod 4. A sliding rack 6 is slidably connected inside the inner fixed support box 3. The sliding rack 6 is meshed with the gear 5. When the sliding rack 6 moves inside the inner fixed support box 3, it drives the meshed gear 5 to rotate. When the gear 5 rotates, it drives the inner rotating rod 4 to rotate. When the rotating rod 4 rotates, it rotates the angle of the rotating column 11, the first cylinder 12, and the support frame 13, thereby exchanging the positions of the two sets of fixed support plates 16 and vacuum suction cups 17 to facilitate the loading and unloading of wafers.

[0020] The internal fixed support box 3 is equipped with a reciprocating screw 8, and a first slider 7 is installed on the outside of the reciprocating screw 8. The first slider 7 is slidably connected to the internal fixed support box 3. One side of the first slider 7 is fixedly connected to the sliding rack 6. A first motor 10 is installed on one side of the internal fixed support box 3. The output end of the first motor 10 is fixedly connected to the reciprocating screw 8. A first limit rod 9 is slidably connected inside the first slider 7. The first limit rod 9 is fixedly connected to the internal fixed support box 3. The output end of the first motor 10 drives the reciprocating screw 8 to rotate. When the reciprocating screw 8 rotates, it drives the first slider 7 on the outside to move. When the first slider 7 moves, it drives the sliding rack 6 on one side to slide inside the internal fixed support box 3. The sliding rack 6 drives the meshing gear 5 to rotate. The gear 5 drives the inner rotating rod 4 to perform reciprocating rotation adjustment.

[0021] The reaction chamber 18 is fixedly connected to a side fixing frame 27. An adjusting screw 29 is rotatably connected inside the side fixing frame 27. One end of the adjusting screw 29 is rotatably connected to the reaction chamber 18. A second slider 28 is installed on the outside of the adjusting screw 29. The second slider 28 is slidably connected to the side fixing frame 27. A fixed support plate 26 is fixedly connected to one side of the second slider 28. The fixed support plate 26 is slidably connected to the reaction chamber 18. One side of the fixed support plate 26 is fixedly connected to the guide block 20. When the adjusting screw 29 is rotated, the adjusting screw 29 drives the second slider 28 on the outside to move and adjust. When the second slider 28 moves, it drives the fixed support plate 26, the guide block 20 and the sliding support plate 19 to move and adjust, thereby adjusting the position of the sliding support plate 19 and the heating plate 21.

[0022] Among them, a second motor 30 is installed on one side of the side fixing frame 27. The output end of the second motor 30 is fixedly connected to the adjusting screw 29. Multiple guide rods 14 are slidably connected inside the support frame 13. The bottom end of the guide rod 14 is fixedly connected to the rotating column 11. The output end of the second motor 30 drives the adjusting screw 29 to rotate, and the adjusting screw 29 drives the second slider 28 on the outside to move.

[0023] The conveyor frame 24 is symmetrically fixedly connected to a fixed frame 38. A fourth cylinder 39 is installed on the outside of the fixed frame 38. The output end of the fourth cylinder 39 is fixedly connected to a guide plate 40. A third limit rod 41 is symmetrically fixedly connected to the outside of the guide plate 40. The third limit rod 41 is slidably connected to the fixed frame 38. The output end of the fourth cylinder 39 drives the guide plate 40 to adjust its position. The guide plate 40 guides and limits the wafers conveyed on the conveyor frame 24 to prevent excessive wafer displacement.

[0024] The heating plate 21 has a limiting support ring 22 fixedly connected to the top, and a heating resistance wire 23 is installed inside the heating plate 21. The wafer placed on the heating plate 21 is heated by the heating resistance wire 23.

[0025] The heating plate 21 is fixedly connected to the bottom of the mounting base 42. The top of the sliding support plate 19 is provided with a mounting groove that mates with the mounting base 42. The mounting base 42 is provided with a side limiting groove 43 on one side. A spring clip 44 is slidably connected inside the sliding support plate 19. A pull rod is fixedly connected to one side of the spring clip 44. The pull rod is slidably connected to the sliding support plate 19. The spring clip 44 and the side limiting groove 43 are fixedly positioned. The mounting base 42 is installed inside the sliding support plate 19, which facilitates the overall disassembly, replacement and maintenance of the heating plate 21.

[0026] The guide block 20 has a guide rod 25 slidably connected inside, and the guide rod 25 is fixedly connected to the reaction chamber 18. The guide block 20 slides on the outside of the guide rod 25 to limit the movement stability of the guide block 20 and the sliding support plate 19.

[0027] The top of the fixed support 32 is symmetrically fixedly connected with multiple second limit rods 35. The second limit rods 35 are slidably connected to the reaction box 18. The output end of the third cylinder 31 drives the fixed support 32 to adjust its vertical position. The array infrared lamp 33 drives the second limit rods 35 to slide and limit the reaction box 18, thereby improving the stability of the fixed support 32.

[0028] Specifically, in use, the wafers are transported via the conveyor frame 24. The output of the second motor 30 drives the adjusting screw 29 to rotate. When the adjusting screw 29 rotates, it moves the outer second slider 28. The movement of the second slider 28 moves the fixed support plate 26 and the guide block 20. The guide block 20 then moves the sliding support plate 19 and the heating plate 21 outwards, facilitating wafer receiving. The output of the first cylinder 12 moves the support frame 13, the second cylinder 15, the fixed support plate 16, and the vacuum suction cup 17 downwards as a whole. The output of the second cylinder 15 moves the fixed support plate 16 and the vacuum suction cup 17 downwards. One set of vacuum suction cups 17 picks up the wafers transported on the conveyor frame 24. Additionally... A set of vacuum chucks 17 fixes the heated wafer on the heating plate 21. Then, the output end of cylinder 15 drives the fixed support plate 16 and vacuum chucks 17 to move upward, raising the wafer's height. Simultaneously, the output end of cylinder 12 drives the support frame 13 and cylinder 15 to lift upward. Then, the output end of motor 10 drives the reciprocating screw 8 to rotate. When the reciprocating screw 8 rotates, it drives the outer slider 7 to move. When the slider 7 moves, it drives the sliding rack 6 to move and adjust. When the sliding rack 6 moves, it drives the meshing gear 5 to rotate. When the gear 5 rotates, it drives the rotating rod 4 to rotate. The sliding rack 6 drives the gear 5 and the rotating rod 4 to rotate 180 degrees, which in turn drives the rotating column 11 to rotate. The first cylinder 12 and support frame 13 are rotated at different angles to swap the positions of the two wafers. Then, the output of the first cylinder 12 moves the support frame 13 downwards, and the output of the second cylinder 15 moves the fixed support plate 16 and vacuum suction cup 17 downwards, placing the new wafer on the heating plate 21. The heated wafer is then placed on the conveyor frame 24, which transports the wafers. The wafer requiring further heating is moved back below the fixed support plate 16 and vacuum suction cup 17. After the heating plate 21 is filled with wafers, the output of the second motor 30 drives the adjusting screw 29 to rotate in the opposite direction. The adjusting screw 29 moves the outer second slider 28, which in turn moves the fixed support plate 26. The guide block 20 and sliding support plate 19 move into the reaction chamber 18, and the sealing side plate 37 seals against one side of the reaction chamber 18. The wafer on the heating plate 21 is positioned inside the limiting support ring 22. The bottom of the wafer is directly heated by heat conduction through the heating resistance wire 23 in the heating plate 21. This is suitable for processes such as low-temperature baking and photoresist pre-curing, with a fast temperature response. Infrared radiation penetrates the wafer surface and directly heats the material inside, making it suitable for rapid thermal annealing and oxide layer repair processes that require millisecond-level heating / cooling. The hot plate reflector 34 optimizes heat energy utilization by directionally reflecting the radiation energy of the heating plate and infrared lamp to the wafer surface, reducing heat loss and lowering the surface temperature of the equipment, thus improving operational safety. Inert gas is supplied to the equipment through the air inlet 36.Specific gases, such as nitrogen or argon, are introduced to prevent the wafer from oxidizing or becoming contaminated during heating.

[0029] In the description of this invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," "both ends," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0030] Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of those features.

[0031] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor heating device, comprising a support frame (1), characterized in that, The top of the support frame (1) is fixedly connected to a support top frame (2), and the top of the support top frame (2) is rotatably connected to a rotating column (11). A first cylinder (12) is installed inside the rotating column (11). The output end of the first cylinder (12) is fixedly connected to a support frame (13). A second cylinder (15) is symmetrically installed at the bottom of the support frame (13). The output end of the second cylinder (15) is fixedly connected to a fixed support plate (16). Vacuum suction cups (17) are symmetrically installed at the bottom of the fixed support plate (16). A vacuum generator is installed at the top of the vacuum suction cups (17). A conveyor frame (24) is installed at the top of the support top frame (2), and guide plates (40) are symmetrically arranged at the top of the conveyor frame (24). The top of the support frame (2) is fixedly connected to the reaction chamber (18). The inside of the reaction chamber (18) is slidably provided with a sliding support plate (19). The top of the sliding support plate (19) is equipped with a heating plate (21). The top of the reaction chamber (18) is equipped with a No. 3 cylinder (31). The output end of the No. 3 cylinder (31) is fixedly connected to a fixed support platform (32). The bottom of the fixed support platform (32) is equipped with an array of infrared lamps (33). The bottom of the fixed support platform (32) is fixedly connected with a hot plate reflector (34). A sealing side plate (37) is fixedly connected to one side of the sliding support plate (19). An air inlet head (36) is symmetrically fixedly connected inside the support frame (1). An air inlet pipe is fixedly connected to one side of the air inlet head (36).

2. The semiconductor heating device according to claim 1, characterized in that: The top of the support frame (1) is fixedly connected to an inner fixed support box (3), the top of the inner fixed support box (3) is fixedly connected to the support top frame (2), the inner fixed support box (3) is rotatably connected to a rotating rod (4), the rotating rod (4) is rotatably connected to the support top frame (2), the outer side of the rotating rod (4) is fixedly connected to a gear (5), the inner fixed support box (3) is slidably connected to a sliding rack (6), and the sliding rack (6) is meshed with the gear (5).

3. A semiconductor heating device according to claim 2, characterized in that: The internal fixed support box (3) is equipped with a reciprocating screw (8) for rotation. A first slider (7) is installed on the outside of the reciprocating screw (8). The first slider (7) is slidably connected to the internal fixed support box (3). One side of the first slider (7) is fixedly connected to the sliding rack (6). A first motor (10) is installed on one side of the internal fixed support box (3). The output end of the first motor (10) is fixedly connected to the reciprocating screw (8). A first limiting rod (9) is slidably connected inside the first slider (7). The first limiting rod (9) is fixedly connected to the internal fixed support box (3).

4. A semiconductor heating device according to claim 3, characterized in that: A side fixing frame (27) is fixedly connected to one side of the reaction chamber (18). An adjusting screw (29) is rotatably connected inside the side fixing frame (27). One end of the adjusting screw (29) is rotatably connected to the reaction chamber (18). A second slider (28) is installed on the outside of the adjusting screw (29). The second slider (28) is slidably connected to the side fixing frame (27). A fixed support plate (26) is fixedly connected to one side of the second slider (28). The fixed support plate (26) is slidably connected to the reaction chamber (18). One side of the fixed support plate (26) is fixedly connected to the guide block (20).

5. A semiconductor heating device according to claim 4, characterized in that: A second motor (30) is installed on one side of the side fixing frame (27). The output end of the second motor (30) is fixedly connected to the adjusting screw (29). Multiple guide rods (14) are slidably connected inside the support frame (13). The bottom end of the guide rod (14) is fixedly connected to the rotating column (11).

6. A semiconductor heating device according to claim 5, characterized in that: A fixed frame (38) is symmetrically fixedly connected to the outside of the conveyor frame (24). A fourth cylinder (39) is installed on the outside of the fixed frame (38). The output end of the fourth cylinder (39) is fixedly connected to the guide plate (40). A third limiting rod (41) is symmetrically fixedly connected to the outside of the guide plate (40). The third limiting rod (41) is slidably connected to the fixed frame (38).

7. A semiconductor heating device according to claim 6, characterized in that: The top of the heating plate (21) is fixedly connected to a limiting support ring (22), and a heating resistance wire (23) is installed inside the heating plate (21).

8. A semiconductor heating device according to claim 7, characterized in that: The bottom of the heating plate (21) is fixedly connected to a mounting base block (42). The top of the sliding support plate (19) is provided with a mounting groove that cooperates with the mounting base block (42). A side limiting groove (43) is provided on one side of the mounting base block (42). A spring clip (44) is slidably connected inside the sliding support plate (19). A pull rod is fixedly connected to one side of the spring clip (44). The pull rod is slidably connected to the sliding support plate (19).

9. A semiconductor heating device according to claim 8, characterized in that: The guide block (20) has a guide rod (25) slidably connected inside, and the guide rod (25) is fixedly connected to the reaction chamber (18).

10. A semiconductor heating device according to claim 9, characterized in that: The top of the fixed support (32) is symmetrically fixedly connected with multiple second-position limit rods (35), and the second-position limit rods (35) are slidably connected to the reaction box (18).

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