Wafer rotary plectrum mechanism and wafer cleaning device

Abstract

The invention relates to the technical field of wafer cleaning, in particular to a wafer rotary shifting mechanism and a wafer cleaning device. The wafer rotating and shifting mechanism comprises a driving device, a transmission device and a bearing and positioning device; the driving device is arranged above the bearing and positioning device, and the two ends of the transmission device are connected with the driving device and the bearing and positioning device respectively; the bearing and positioning device comprises a bearing frame, and two roller shafts which are parallel to each other and are used for bearing wafers are arranged in the bearing frame; a rotating motor is arranged in the driving device; a transmission wheel train is arranged in the transmission device; the output end of the rotating motor is connected with the input end of the transmission wheel train through a gear connecting shaft; and the output end of the transmission wheel train is connected with the two roller shafts respectively, so that the two roller shafts can synchronously rotate in the same direction. When the cleaning device is used, the driving device drives the roller shaft to rotate through the transmission device and drives a wafer to rotate, so that a solvent is uniformly distributed on the surface of the wafer, chemical cleaning liquid is fully contacted and reacted with pollutants, and the cleaning efficiency and quality are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cleaning, in particular to a wafer rotating chuck mechanism and a wafer cleaning device. BACKGROUND

[0002] With the development of semiconductor technology, the integration of chip manufacturing is getting higher and higher, and the requirement for wafer surface cleanliness has reached an extremely high level. In the cleaning process, the early simple soaking and flushing method cannot meet the cleaning needs of small particles and impurities. The rotating mechanism can make the cleaning liquid take away the impurities from the wafer surface by rotating the wafer, and at the same time, it can ensure that the cleaning liquid uniformly covers and is timely removed at a suitable rotating speed. In addition, through a reasonable rotating method, the cleaning liquid can be recycled to the greatest extent after cleaning, reducing the waste of chemical reagents and the pollution to the environment.

[0003] In the prior art, there are also some mechanisms that can drive the wafer to rotate, but there is a problem of uneven coating of the solvent on the wafer surface. SUMMARY

[0004] The present application provides a wafer rotating chuck mechanism and a wafer cleaning device, which can solve the problems of poor cleaning effect, uneven cleaning and low cleaning efficiency to a certain extent in the wafer cleaning process.

[0005] In a first aspect, the present application provides a wafer rotating chuck mechanism, comprising a driving device, a transmission device and a bearing positioning device; the driving device is arranged above the bearing positioning device, and the two ends of the transmission device are connected with the driving device and the bearing positioning device respectively; The bearing positioning device comprises a bearing frame, and two parallel roller shafts for bearing the wafer are arranged in the bearing frame; A rotating motor is arranged in the driving device, and a transmission gear train is arranged in the transmission device; the output end of the rotating motor is connected with the input end of the transmission gear train through a gear connecting shaft; the output end of the transmission gear train is connected with the two roller shafts respectively, so that the two roller shafts can rotate synchronously and in the same direction.

[0006] In a preferred embodiment, the transmission gear train comprises a first helical gear arranged in the vertical direction and a second helical gear arranged in the horizontal direction, and the first helical gear is engaged with the second helical gear; the helical gear shaft of the first helical gear is used for connecting with the gear connecting shaft, and the helical gear shaft of the second helical gear is coaxially connected with a driving spur gear; First and second driven spur gears are arranged on the two sides of the driving spur gear respectively and are engaged with the driving spur gear respectively; The gear shafts of the first and second driven spur gears are connected with a roller shaft respectively.

[0007] In a preferred embodiment, the outer side of the driving spur gear is provided with a gear limiting sleeve for preventing the gear from falling off.

[0008] In a preferred embodiment, the roller shaft is provided with a plurality of grooves along the length direction.

[0009] In a preferred embodiment, the driving device is provided with a rotating table support, and the rotating motor is mounted on the rotating table support.

[0010] In a preferred embodiment, each wall of the housing of the driving device is respectively clamped with a sealing gasket.

[0011] In a preferred embodiment, the bearing frame comprises two oppositely arranged side connecting plates, a front connecting plate at the front end and a lower connecting plate at the lower side; the front end of the roller shaft is rotationally connected with the front connecting plate.

[0012] In a preferred embodiment, the inner side of the side connecting plate is provided with a first positioning block abutting against the side connecting plate and a second positioning block extending towards the roller shaft.

[0013] In a preferred embodiment, the wafer cleaning device further comprises a wafer cassette arranged on the bearing frame, and the wafer cassette contains a plurality of wafers.

[0014] In a second aspect, the application further provides a wafer cleaning device comprising the wafer rotating and wafer pushing mechanism according to any one of the preceding aspects.

[0015] The application has the following beneficial effects: During the wafer cleaning process, the driving device can drive the roller shaft to rotate synchronously in the same direction through the transmission device, thereby driving the wafer to rotate, making the solvent uniformly distributed on the wafer surface, ensuring that each area is uniformly cleaned, allowing the chemical cleaning liquid to fully contact and react with the contaminants, and effectively improving the cleaning efficiency and quality. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0017] Fig. 1 The shaft measurement schematic diagram of the wafer rotating and wafer pushing mechanism provided by the embodiments of the application; Fig. 2 The shaft measurement schematic diagram of the driving device provided by the embodiments of the application; Fig. 3This is an isometric schematic diagram of the transmission device provided in the embodiments of this application; Fig. 4 This is an isometric schematic diagram of the load-bearing positioning device provided in the embodiments of this application; Numbering on the map: 1-Drive device; 2-Transmission device; 3-Bearing positioning device; 4-Rotary motor; 5-Turntable connecting plate; 6-Gear connecting shaft; 7-Turntable bracket; 8-Sealing gasket; 9-First reinforcing plate; 10-Second reinforcing plate; 11-Motor sealing box; 12-Helical gear shaft; 13-Gear limiting sleeve; 14-First helical gear; 15-First driven spur gear; 16-Second helical gear; 17-Second driven spur gear; 18-Driving spur gear; 19-First positioning block; 20-Second positioning block; 21-Roller shaft; 22-Lower connecting plate; 23-Front connecting plate; 24-First side connecting plate; 25-Second side connecting plate; 26-Wafer box; 27-Wafer. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and labeled in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0025] like Figs. 1-4 As shown, the wafer rotation lever mechanism provided in this application embodiment includes a driving device 1, a transmission device 2, and a bearing positioning device 3; the driving device 1 is disposed above the bearing positioning device 3, and the two ends of the transmission device 2 are respectively connected to the driving device 1 and the bearing positioning device 3.

[0026] The drive unit 1 includes a rotary motor 4, a turntable connecting plate 5, a gear connecting shaft 6, a turntable support 7, a motor connecting base plate, a first reinforcing plate 9, a second reinforcing plate 10, a motor sealing box 11, and a protective cover. The protective cover constitutes the housing of the drive unit 1. The first reinforcing plate 9 is provided on the front side surface of the protective cover for connection with other equipment, and the second reinforcing plate 10 is provided on the lower surface of the protective cover for connection with the transmission device 2. The protective cover is used to seal and protect the internal mechanism from damage by external acid gases.

[0027] A motor connection base plate is provided on the second reinforcing plate 10, a rotary table bracket 7 is provided on the motor connection base plate, a rotary motor 4 is fixed on the rotary table bracket 7, and a turntable connecting plate 5 is provided above the rotary motor 4. The upper end of the gear connecting shaft 6 passes through the second reinforcing plate 10 and is connected to the output shaft of the rotary motor 4. The turntable connecting plate 5 is used to provide rotation limit for the gear connecting shaft 6.

[0028] The motor sealing box 11 is located inside the protective cover and is used to protect the circuit part of the rotating motor 4.

[0029] A sealing gasket 8 is installed between the second reinforcing plate 10 and the protective cover. Sealing gaskets can also be installed on other walls of the protective cover as needed.

[0030] The transmission device 2 is equipped with a transmission gear system; the transmission gear system includes a first helical gear 14 arranged vertically and a second helical gear 16 arranged horizontally, the first helical gear 14 meshes with the second helical gear 16; the helical gear shaft 12 of the first helical gear 14 is used to connect with the gear connecting shaft 6, and the helical gear shaft of the second helical gear 16 is coaxially connected with the driving spur gear 18; the first driven spur gear 15 and the second driven spur gear 17 are respectively arranged on both sides of the driving spur gear 18 and mesh with the driving spur gear 18 respectively.

[0031] The bearing positioning device 3 includes a bearing frame, and two parallel roller shafts 21 for bearing the wafer 27 are arranged in the bearing frame; the gear shafts of the first driven spur gear 15 and the second driven spur gear 17 are respectively connected to one roller shaft 21.

[0032] The output end of the rotary motor 4 is connected to the helical gear shaft 12 of the first helical gear 14 via the gear connecting shaft 6. Power is transmitted through the first helical gear 14 and the second helical gear 16, changing the direction of rotation and thus driving the first driven spur gear 15 and the second driven spur gear 17 to rotate synchronously in the same direction. This, in turn, drives the two roller shafts 21 to rotate synchronously in the same direction. The transmission of motion and power through the first driven spur gear 15 and the second driven spur gear 17 effectively changes the direction of shaft rotation, achieving power transmission and speed variation. Using three spur gears allows for precise transmission of motion and power between parallel shafts, while simultaneously achieving the conversion between speed and torque.

[0033] A gear limiting sleeve 13 is provided on the outer side of the drive spur gear 18 to prevent the gear from falling off.

[0034] The roller shaft 21 has several grooves along its length, which can effectively reduce the relative sliding between the wafer 27 and the roller shaft 21, ensuring that the roller shaft 21 can effectively drive the wafer 27 to rotate during the rotation process.

[0035] Preferably, flange bearings are also provided on the end sides of the helical gear shaft 12 and the roller shaft 21 to provide support force and reduce friction, so that the helical gear shaft 12 and the roller shaft 21 can rotate smoothly.

[0036] Preferably, the outer diameter of the driving spur gear 18 is smaller than the outer diameter of the first driven spur gear 15 and the second driven spur gear 17, thereby reducing the rotational speed.

[0037] The bearing frame of the bearing positioning device 3 includes a first side connecting plate 24 and a second side connecting plate 25 arranged opposite to each other, a front connecting plate 23 located at the front end and a lower connecting plate 22 located below; the front end of the roller shaft 21 is rotatably connected to the front connecting plate 23.

[0038] The inner sides of the first side connecting plate 24 and the second side connecting plate 25 are provided with a first positioning block 19 that fits the side connecting plate and a second positioning block 20 that extends toward the roller shaft 21 for positioning the cassette 26.

[0039] The wafer cassette 26 can be mounted on the carrier frame via the first positioning block 19 and the second positioning block 20. The wafer cassette 26 can hold a number of wafers 27. After the wafer cassette 26 is mounted on the carrier frame, the wafers 27 can be inserted into the grooves of the roller shaft 21.

[0040] When the wafer rotation and picking mechanism is working, the wafer cassette 26 (a 12-inch wafer cassette in this embodiment) must first be placed manually or automatically by a robotic arm onto the support frame of the support positioning device 3. At this time, the bottom of the wafer 27 will be lifted by two roller shafts 21. Then, the rotary motor 4 drives the gear connecting shaft 6 to rotate. The gear connecting shaft 6 drives the second helical gear 16 to rotate through the first helical gear 14, thereby changing the direction of shaft rotation. The second helical gear 16 drives the driving spur gear 18 to rotate through shaft transmission, and drives the first driven spur gear 15 and the second driven spur gear 17 to rotate, thereby driving the two roller shafts 21 to rotate, so that the wafer 27 rotates inside the wafer cassette 26.

[0041] The operating temperature range of the aforementioned rotary paddle mechanism needs to be within a relatively constant temperature environment of 20~25℃ to avoid deformation of components due to thermal expansion and contraction, which would affect positioning accuracy. The humidity needs to be within the range of 30%~60% of the indoor environment to avoid excessive humidity causing metal parts to rust or electronic components to be damaged by moisture.

[0042] The rotary motor 4 of the aforementioned rotary lever mechanism uses 220V AC power, has a maximum axial load of 400N, and a maximum permissible torque of 100N.m, ensuring that the roller shaft 21 has sufficient torque to drive the wafer 27 to rotate. In other embodiments, the rotary motor can be selected from other models according to the load conditions.

[0043] In other embodiments, the normal and end face parameters of the helical gear, such as normal module, normal pressure angle, helix angle, etc., can be selected and designed as needed.

[0044] In other embodiments, the dimensions of the roller shaft 21 and the groove can be selected and designed as needed.

[0045] During the wafer cleaning process, the drive unit of the rotary paddle mechanism can drive the roller shaft to rotate synchronously in the same direction through the transmission device, thereby driving the wafer to rotate. This ensures that the solvent is evenly distributed on the wafer surface, guaranteeing that each area is cleaned uniformly. This allows the chemical cleaning solution to fully contact and react with the contaminants, effectively improving cleaning efficiency and quality.

[0046] This embodiment also provides a wafer cleaning apparatus, including the aforementioned wafer rotation lever mechanism. This wafer cleaning apparatus possesses all the features of the wafer rotation lever mechanism, and therefore also possesses all its technical effects, which will not be elaborated further here.

[0047] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer rotation lever mechanism, characterized in that, It includes a drive device, a transmission device, and a load-bearing positioning device; the drive device is disposed above the load-bearing positioning device, and both ends of the transmission device are respectively connected to the drive device and the load-bearing positioning device; The bearing and positioning device includes a bearing frame, within which two parallel roller shafts for bearing wafers are arranged. The drive device is equipped with a rotary motor, and the transmission device is equipped with a transmission gear system; the output end of the rotary motor is connected to the input end of the transmission gear system through a gear connecting shaft; the output end of the transmission gear system is connected to two roller shafts respectively, enabling the two roller shafts to rotate synchronously in the same direction.

2. The wafer rotation lever mechanism according to claim 1, characterized in that, The transmission gear train includes a first helical gear arranged vertically and a second helical gear arranged horizontally, the first helical gear meshing with the second helical gear; the helical gear shaft of the first helical gear is used to connect with the gear connecting shaft, and the helical gear shaft of the second helical gear is coaxially connected with the driving spur gear; The first driven spur gear and the second driven spur gear are respectively disposed on both sides of the driving spur gear and mesh with the driving spur gear respectively; The gear shafts of the first driven spur gear and the second driven spur gear are respectively connected to one of the roller shafts.

3. The wafer rotation lever mechanism according to claim 2, characterized in that, A gear limiting sleeve is provided on the outer side of the driving spur gear to prevent the gear from falling off.

4. The wafer rotation lever mechanism according to claim 1, characterized in that, The roller shaft has several grooves along its length.

5. The wafer rotation lever mechanism according to claim 1, characterized in that, The drive device is equipped with a rotary table support, and the rotary motor is mounted on the rotary table support.

6. The wafer rotation lever mechanism according to claim 5, characterized in that, Each wall surface of the drive unit's housing is fitted with a sealing gasket.

7. The wafer rotation lever mechanism according to claim 1, characterized in that, The support frame includes two side connecting plates arranged opposite each other, a front connecting plate at the front end and a lower connecting plate at the bottom; the front end of the roller shaft is rotatably connected to the front connecting plate.

8. The wafer rotation lever mechanism according to claim 7, characterized in that, The inner side of the side connecting plate is provided with a first positioning block that fits against the side connecting plate and a second positioning block that extends toward the roller shaft.

9. The wafer rotation lever mechanism according to claim 7, characterized in that, It also includes a wafer cassette disposed on the carrier frame, the wafer cassette containing a plurality of wafers.

10. A wafer cleaning apparatus, characterized in that, Includes the wafer rotation lever mechanism as described in any one of claims 1 to 9.

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