Wafer processing platform

Abstract

The embodiment of the invention discloses a wafer processing platform. The wafer processing platform comprises a base; the driving assembly is mounted on the base; the connecting plate is mounted at the driving end of the driving assembly; the working table comprises a base and a lifting table; the base is adsorbed and mounted on the connecting plate; the lifting table is movably installed on the base in the vertical direction. The base is provided with adsorption pieces in the circumferential direction of the periphery of the lifting table. The lifting table is configured to bear the wafer and drive the wafer to move up and down so as to jack up the wafer or enable the wafer to be in contact with the adsorption piece; the adsorption piece is configured to adsorb and fix the contacted wafer; and the driving assembly is configured to drive the connecting plate to rotate so as to drive the wafer adsorbed on the adsorption piece to rotate. According to the embodiment of the invention, the technical problem of how to consider the stability of the wafer during processing, the reliability of taking and placing the wafer and the convenience of maintenance at the same time is solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer fabrication technology, and more particularly to a wafer fabrication platform. Background Technology

[0002] In wafer fabrication, the processing platform, as the core component that supports and fixes the wafer, directly affects the processing accuracy and process stability. Currently, most common processing platforms employ adsorption fixation, that is, using methods such as vacuum adsorption or electrostatic adsorption to stably adsorb the wafer onto the surface of the worktable, preventing displacement or vibration during processing, thereby ensuring processing consistency and reliability.

[0003] However, existing adsorption-based processing platforms still have several significant drawbacks in practical applications. Their design often struggles to simultaneously ensure wafer stability during processing, reliability of wafer handling, and ease of maintenance, frequently requiring trade-offs between different performance characteristics. Specifically, while adsorption fixation provides strong holding force, residual adsorption force or insufficient alignment accuracy can lead to difficulties in wafer handling, impacting operational efficiency and wafer safety. Furthermore, the worktable modules of existing platforms typically have complex connection structures, making cleaning, replacement, or maintenance cumbersome and time-consuming, reducing the overall availability and maintenance efficiency of the equipment. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a wafer processing platform to solve the technical problem of how to simultaneously ensure wafer stability during processing, wafer handling reliability, and ease of maintenance.

[0005] This application provides a wafer fabrication platform, including: Base; The drive assembly is mounted on the base; A connecting plate is mounted on the drive end of the drive assembly; The workbench includes a base and a lifting platform; the base is attached to the connecting plate; the lifting platform is movably mounted on the base in a vertical direction; the base is provided with suction elements around the periphery of the lifting platform. The lifting platform is configured to carry the wafer and move the wafer up and down to lift the wafer or bring the wafer into contact with the adsorption element; the adsorption element is configured to adsorb and fix the wafer in contact. The driving component is configured to drive the connecting plate to rotate, thereby causing the wafer adsorbed on the adsorption element to rotate.

[0006] In at least some embodiments of this application, The base has a first airflow channel that connects an external air source to the lower surface of the lifting platform; The first airflow channel is configured to introduce or extract gas to create a positive or negative pressure that drives the lifting platform to rise or fall.

[0007] In at least some embodiments of this application, The first airflow channel is a through hole penetrating the base, and the through hole is located at the center of the lifting platform; The lifting platform is provided with several vent holes around its center.

[0008] In at least some embodiments of this application, A limiting guide mechanism is provided between the lifting platform and the base; the limiting guide mechanism includes a first sleeve and a limiting pin, and the first sleeve is installed on the base. The limiting pin includes a movable shaft and a limiting block; one end of the movable shaft is mounted on the lifting platform and movably mounted in the first sleeve; the limiting block is disposed at the other end of the movable shaft and located below the base; the first sleeve is configured to limit the upward movement of the limiting block.

[0009] In at least some embodiments of this application, An elastic element is provided between the movable shaft and the first sleeve.

[0010] In at least some embodiments of this application, The connecting plate has a second airflow channel and a third airflow channel that are respectively connected to an external air source; the second airflow channel is connected to the first airflow channel; the third airflow channel is connected to the upper surface of the connecting plate to form a negative pressure that adsorbs the lifting platform.

[0011] In at least some embodiments of this application, The adsorption element is provided with adsorption holes; The base has a fourth airflow channel that connects to the adsorption holes; The connecting plate has a fifth airflow channel that connects an external air source to the fourth airflow channel, so as to form a negative pressure on the adsorption hole to adsorb the wafer.

[0012] In at least some embodiments of this application, The drive assembly has a hollow channel, and the ends of the second, third, and fifth airflow channels connected to the external air source are set corresponding to the hollow channel.

[0013] In at least some embodiments of this application, The drive assembly includes a mounting base; the mounting base is mounted on the base; the mounting base and the base have a plurality of mounting points; at least one mounting point is provided with a leveling mechanism. The leveling mechanism includes a fastening screw, a second sleeve, and an adjusting bolt; the two ends of the fastening screw are respectively mounted on the mounting base and the base; the second sleeve is sleeved on the fastening screw and passes through the mounting base; the adjusting bolt is sleeved on the second sleeve and abuts against the base; the outer surface of the adjusting bolt is threaded to the mounting base. The adjusting bolt is configured to adjust the height of the mounting base at the corresponding mounting point by rotation, thereby leveling the mounting base.

[0014] In at least some embodiments of this application, A waterproof cover is installed on the connecting plate; the wafer processing platform also includes a zero-return mechanism. The zero-return mechanism includes a mounting plate, a guide rail, a slider, a brush, a first sensor, a second sensor, an elastic component, and a lever. The mounting plate is mounted on the waterproof cover; the guide rail is mounted on the mounting plate; the slider is slidably mounted on the guide rail; the brush is mounted on the slider and is symmetrical about the slider; the first sensor and the second sensor are respectively mounted on the mounting plates at both ends of the guide rail; The elastic component is mounted on the mounting plate and elastically connected to the slider. The elastic component is configured to hold the slider at the midpoint between the first sensor and the second sensor without external force. The paddle is disposed at the outer edge of the base; the paddle is configured to contact the slider as the base rotates, thereby causing the slider to move along the guide rail toward the first sensor or the second sensor so that the brush triggers the first sensor or the second sensor.

[0015] The above-described one or more embodiments of this application have at least one or more of the following beneficial effects: In implementing the technical solution of this application, a height-adjustable lifting platform is designed. When loading and unloading wafers, the platform is raised, lifting the wafer so that its edges are suspended in the air, facilitating reliable loading and unloading by the clamping mechanism. When the wafer needs to be processed, the lifting platform lowers and resets. At this time, the adsorption components located around the lifting platform adsorb and fix the wafer, thereby ensuring its positional stability during processing. Furthermore, the worktable is mounted on the connecting plate via a base adsorption method. This structure not only makes the entire worktable module easy to disassemble and replace, facilitating maintenance, but also allows for the replacement of worktables to accommodate different wafer sizes, thus supporting the processing needs of various wafer specifications. This application thus simultaneously achieves stable wafer placement during processing, reliable operation during loading and unloading, and convenient overall maintenance.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein: Figure 1 This is a three-dimensional structural schematic diagram of a wafer fabrication platform according to one embodiment of this application; Figure 2 This is a side cross-sectional view of a wafer fabrication platform according to one embodiment of this application; Figure 3 This is a top view of a wafer fabrication platform according to one embodiment of this application; Figure 4 yes Figure 2 Enlarged structural diagram of section A; Figure 5 This is a partial side cross-sectional view of the mounting base and the base according to one embodiment of this application; Figure 6 yes Figure 5 Enlarged structural diagram of section B; Figure 7 This is a schematic diagram of the overall three-dimensional structure of a wafer fabrication platform according to another embodiment of this application; Figure 8 This is a three-dimensional structural diagram of the zero-return mechanism according to one embodiment of this application.

[0018] Explanation of reference numerals in the attached figures: 1. Base; 2. Drive assembly; 21. Hollow channel; 22. Mounting base; 23. Drive component; 24. Insulation board; 3. Connecting plate; 31. Second airflow channel; 32. Third airflow channel; 33. Fifth airflow channel; 4. Workbench; 41. Base; 411. Adsorption component; 4111. Adsorption hole; 4112. Flow channel; 412. First airflow channel; 413. Fourth airflow channel; 414. Groove; 415. Drain hole; 42. Lifting platform; 421. Vent hole; 422. Insert plate; 5. Limiting and guiding mechanism; 51. First sleeve; 52. Limiting pin; 521. Movable shaft; 522. Limiting block; 53. Elastic element; 6. Leveling mechanism; 61. Fastening screw; 62. Second sleeve; 63. Adjusting bolt; 64. Washer; 65. Spring washer; 7. Waterproof cover; 8. Zeroing mechanism; 81. Mounting plate; 82. Guide rail; 83. Slider; 84. Brush; 85. First sensor; 86. Second sensor; 87. Elastic component; 88. Paddle. Detailed Implementation

[0019] Some embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0020] See appendix Figure 1 In one or more embodiments, a wafer fabrication platform of this application includes: Base 1; Drive component 2 is mounted on base 1; Connector plate 3 is installed on the drive end of drive component 2; The workbench 4 includes a base 41 and a lifting platform 42; the base 41 is attached to the connecting plate 3; the lifting platform 42 is movably mounted on the base 41 in the vertical direction; the base 41 is provided with an adsorption element 411 around the periphery of the lifting platform 42. The lifting platform 42 is configured to carry the wafer and move the wafer up and down to lift the wafer or bring the wafer into contact with the adsorption member 411; the adsorption member 411 is configured to adsorb and fix the wafer in contact. The drive assembly 2 is configured to drive the connecting plate 3 to rotate, thereby causing the wafer adsorbed on the adsorption component 411 to rotate.

[0021] Based on the above embodiments, an optional working process of the wafer processing platform in this embodiment is as follows: the lifting platform 42 is raised to receive the wafer placed by the clamping device; the lifting platform 42 is lowered and reset until the edge of the wafer contacts the surface of the adsorption member 411, and the adsorption member 411 adsorbs and fixes the wafer; the driving component 2 drives the connecting plate 3 to rotate, thereby driving the wafer fixed by the adsorption member 411 on the worktable 4 to rotate for corresponding processing; after processing is completed, the driving component 2 stops driving, and the adsorption member 411 stops adsorbing the wafer; the lifting platform 42 is raised to lift the wafer, so that the edge of the wafer leaves the adsorption member 411 and is suspended in the air, and the clamping device can remove the wafer from the lifting platform 42.

[0022] The lifting platform 42 is configured as a liftable support platform. In this embodiment, the lifting drive method of the lifting platform 42 is not specifically limited. The lifting platform 42 may include a drive component, such as controlling the overall lifting of the lifting platform 42 by setting a motor or cylinder related structural components. Alternatively, the lifting platform 42 may be lifted up or adsorbed and lowered by forming a negative pressure or positive pressure in the area between the lifting platform 42 and the base 41.

[0023] In the embodiments of this application, a height-adjustable lifting platform is designed. When loading and unloading wafers, the platform rises, lifting the wafer so that its edges are suspended in the air, facilitating reliable loading and unloading by the clamping mechanism. When the wafer needs processing, the lifting platform descends and resets. At this time, adsorption components located around the lifting platform adsorb and fix the wafer, ensuring its positional stability during processing. Furthermore, the worktable is mounted on the connecting plate via a base adsorption method. This structure not only makes the entire worktable module easy to disassemble and replace, facilitating maintenance, but also allows for the replacement of worktables to accommodate different wafer sizes, thus supporting the processing needs of various wafer specifications. This application thus simultaneously achieves stable wafer placement during processing, reliable operation during loading and unloading, and convenient overall maintenance.

[0024] In one embodiment, reference Figure 1 and Figure 2 The base 41 has a first airflow channel 412 that connects an external air source to the lower surface of the lifting platform 42. The first airflow channel 412 is configured to introduce or extract gas to create a positive or negative pressure that drives the lifting platform 42 to rise or fall. That is, an external air source can introduce gas through the first airflow channel 412, which can create a positive pressure in the area between the lower surface of the lifting platform 42 and the base 41 to lift the lifting platform 42 upward; an external air source can also extract gas through the first airflow channel 412, which can create a negative pressure in the area between the lower surface of the lifting platform 42 and the base 41 to adsorb the lifting platform 42 downward.

[0025] In one possible implementation, refer to Figure 2 and Figure 3 The first airflow channel 412 is a through hole that penetrates the base 41. The through hole is set at the center of the lifting platform 42. When the air is ventilated or evacuated at the center, the force formed on the lifting platform 42 can be kept uniform, ensuring that the lifting platform 42 rises or falls stably. Several vent holes 421 are arranged around the center of the lifting platform 42 for venting, preventing excessive pneumatic movement, excessive speed of the lifting platform 42 and excessive force.

[0026] In one possible implementation, refer to Figure 4 , Figure 4 yes Figure 2 The enlarged view of part A shows that a limit guide mechanism 5 is provided between the lifting platform 42 and the base 41; the limit guide mechanism 5 includes a first sleeve 51 and a limit pin 52, and the first sleeve 51 is installed on the base 41. The limiting pin 52 includes a movable shaft 521 and a limiting block 522; one end of the movable shaft 521 is mounted on the lifting platform 42 and movably mounted inside the first sleeve 51; the limiting block 522 is located at the other end of the movable shaft 521 and below the base 41; the first sleeve 51 is configured to limit the upward movement of the limiting block 522.

[0027] This can be understood as follows: one end of the limiting pin 52 is fixed to the lifting platform 42, and the movable shaft 521 passes through the first sleeve 51 and extends to the bottom of the base 41. The movable shaft 521 can slide up and down inside the first sleeve 51. Since a limiting block 522 is provided on the end of the movable shaft 521 below the base 41, it can prevent the movable shaft 521 from coming off the first sleeve 51 during the up and down sliding process, thereby limiting the range of the movable shaft 521's up and down movement. Since the entire limiting pin 52 moves up and down with the lifting platform 42, the up and down movement limitation of the limiting pin 52 forms the range of the lifting platform 42's up and down movement, which can prevent the lifting platform 42 from completely coming off the base 41, and at the same time can provide guidance for the movement of the lifting platform 42, ensuring the verticality of the lifting platform 42's lifting.

[0028] The movable shaft 521 can be fixed to the lifting platform 42 by fasteners such as screws.

[0029] In one possible implementation, an elastic element 53 is provided between the movable shaft 521 and the first sleeve 51, which has a buffering effect and can also prevent over-fitting. The elastic element 53 can be a spring.

[0030] In one possible implementation, refer to Figure 3 and Figure 4 Multiple limiting and guiding mechanisms 5 can be evenly distributed around the center of the lifting platform 42 near the edge of the lifting platform 42 to further ensure the verticality and stability of the lifting platform 42.

[0031] In one possible implementation, refer to Figure 4 The base 41 is also provided with a groove 414, and the lifting platform 42 is provided with an insert plate 422 that can be inserted into the groove 414. The matching arrangement of the groove 414 and the insert plate 422 can make the lifting platform 42 as close as possible to the base 41 to maintain stability after it is fully lowered. It can also make the support surface of the lifting platform 42 after it is lowered to the same height as or lower than the upper surface of the adsorption component 411, so that the edge of the wafer is in contact with the upper surface of the adsorption component 411. At the same time, the matching arrangement of the groove 414 and the insert plate 422 also has a certain guiding function to ensure the stability and verticality of the lifting platform 42 during lifting.

[0032] In one embodiment, reference Figure 2The connecting plate 3 has a second airflow channel 31 and a third airflow channel 32 that are respectively connected to an external air source. The second airflow channel 31 is connected to the first airflow channel 412. The third airflow channel 32 is connected to the upper surface of the connecting plate 3 to form a negative pressure that adsorbs the lifting platform 42. In the aforementioned embodiment, the base 41 can be directly connected to an external air source through channel design to generate negative or positive pressure on the lifting platform 42. In this embodiment, the external air source can be connected through a second airflow channel 31 connected to the first airflow channel 412 in the connecting plate 3, which can also generate negative or positive pressure on the lifting platform 42. Since the base 41 is part of the workbench 4 and has limited space, the channel design of the connecting plate 3 makes it easier to connect to an external air source without affecting the normal operation of the workbench 4. The function of the third airflow channel 32 is to form positive or negative pressure on the upper surface of the connecting plate 3 by connecting to an external air source. When the pressure is negative, the base 41 is stably fixed on the connecting plate 3, thereby allowing it to rotate with the connecting plate 3. When the pressure is positive, the connecting plate 3 releases the base 41, thereby enabling the replacement or maintenance of the entire workbench 4.

[0033] In one possible implementation, refer to Figure 2 and Figure 3 The adsorption component 411 is provided with adsorption holes 4111; the base 41 has a fourth airflow channel 413 communicating with the adsorption holes 4111; the connecting plate 3 has a fifth airflow channel 33 communicating with an external air source to the fourth airflow channel 413, so as to form a negative pressure for wafer adsorption on the adsorption holes 4111. The design of the fifth airflow channel 33 on the connecting plate 3 to connect with an external air source also facilitates the access of the external air source without affecting the normal operation of the workbench 4.

[0034] In one possible implementation, refer to Figure 3 A drain hole 415 is also provided on the base 41 between the lifting platform 42 and the adsorption component 411 to drain the liquid during processing. Furthermore, multiple drain holes 415 are evenly distributed around the center of the lifting platform 42 to improve the drainage performance.

[0035] In one possible implementation, the adsorption element 411 and the lifting platform 42 are made of ceramic or high-performance plastic, which have thermal stability and high hardness. Used for contacting the wafer, they are not easily deformed by stress or heat during the process, ensuring high stability and guaranteeing processing accuracy. Furthermore, the base 41 is made of metal, providing high-strength support and preventing deformation of the adsorption element 411 and the lifting platform 42.

[0036] In one possible implementation, refer to Figure 3Meanwhile, the adsorption component 411 is provided with a flow channel 4112, which forms a circle around the central axis of the lifting platform 42. Multiple adsorption holes 4111 are evenly distributed at the bottom of the flow channel 4112. A negative pressure ring is formed on the flow channel 4112 through the adsorption holes 4111 (a negative pressure ring can be formed in the flow channel 4112 when air is drawn through the adsorption holes 4111), which further improves the reliability of adsorbing wafers.

[0037] In one possible implementation, refer to Figure 2 The drive assembly 2 has a hollow channel 21. The second airflow channel 31, the third airflow channel 32, and the fifth airflow channel 33 are connected to an external air source at one end corresponding to the hollow channel 21. While not affecting the function of the drive assembly 2 in driving the worktable 4 to rotate, and considering the airtightness and stability of the entire device, each airflow channel can be connected to a corresponding air pipe through the hollow channel 21, thereby connecting to an external air source to achieve air supply or extraction for the corresponding channel.

[0038] Furthermore, the drive assembly 2 includes a drive member 23 and an insulating plate 24. The insulating plate 24 is mounted on the drive member 23, and the connecting plate 3 is fixedly mounted on the insulating plate 24 by fasteners. The drive member 23 is used to drive the insulating plate 24 to rotate, thereby driving the connecting plate 3 to rotate. The setting of the insulating plate 24 improves the safety between the drive member 23 and the connecting plate 3 and prevents the connecting plate 3 from conducting electricity.

[0039] Among them, the driving component 23 can be a hollow motor. The hollow motor has a certain volume, which can ensure the support stability of the entire workbench 4 and the connecting plate 3, and can provide a stable driving force. At the same time, the hollow motor has a channel in the middle, through which air pipes can pass to connect the various airflow channels on the connecting plate 3, so as to realize air extraction or air supply to form positive or negative pressure in the corresponding area.

[0040] In one embodiment, reference Figure 2 , Figure 5 and Figure 6 The drive assembly 2 also includes a mounting base 22; the mounting base 22 is mounted on the base 1; there are several mounting points between the mounting base 22 and the base 1; at least one mounting point is provided with a leveling mechanism 6; The leveling mechanism 6 includes a fastening screw 61, a second sleeve 62, and an adjusting bolt 63. The two ends of the fastening screw 61 are respectively mounted on the mounting base 22 and the base 1. The second sleeve 62 is sleeved on the fastening screw 61 and passes through the mounting base 22. The adjusting bolt 63 is sleeved on the second sleeve 62 and abuts against the base 1. The outer surface of the adjusting bolt 63 is threadedly connected to the mounting base 22. The adjusting bolt 63 is configured to adjust the height of the mounting base 22 at the corresponding mounting point by rotation, so as to level the mounting base 22.

[0041] The fastening screws 61 are fastened to the mounting base 22 and the base 1 respectively, ensuring that they are not interfered with by the adjusting bolts 63. The adjusting bolts 63 can be tightened by wrench to adjust the height of the mounting base 22, thereby achieving leveling.

[0042] Among them, a washer 64 and a spring washer 65 are installed between the fastening screw 61 and the upper surface of the mounting base 22 to loosen it, ensuring that the fastening screw 61 is locked and the mounting base 22 will not loosen after being leveled.

[0043] In one possible implementation, the mounting base 22 and the base 1 are supported and fixed by three mounting points arranged in a triangular shape. One mounting point is locked with screws or other fasteners, while the other two mounting points are connected by a leveling mechanism 6. The three-point support forms a stable support structure, and the two mounting points can be adjusted to facilitate the overall leveling of the mounting base 22, i.e., the leveling of the entire wafer processing platform.

[0044] In one embodiment, reference Figure 1 , Figure 7 and Figure 8 A waterproof cover 7 is installed on the connecting plate 3; the wafer processing platform also includes a zero-return mechanism 8; the zero-return mechanism 8 includes a mounting plate 81, a guide rail 82, a slider 83, a brush 84, a first sensor 85, a second sensor 86, an elastic component 87, and a lever 88; Mounting plate 81 is mounted on waterproof cover 7; guide rail 82 is mounted on mounting plate 81; slider 83 is slidably mounted on guide rail 82; brush plate 84 is mounted on slider 83 and is symmetrical about slider 83; first sensor 85 and second sensor 86 are respectively mounted on mounting plates 81 at both ends of guide rail 82; The elastic component 87 is mounted on the mounting plate 81 and elastically connected to the slider 83. The elastic component 87 is configured to keep the slider 83 at the midpoint between the first sensor 85 and the second sensor 86 without external force. The paddle 88 is disposed at the outer edge of the base 41; the paddle 88 is configured to contact the slider 83 as the base 41 rotates, so as to drive the slider 83 to move along the guide rail 82 toward the first sensor 85 or the second sensor 86 so that the brush 84 triggers the first sensor 85 or the second sensor 86.

[0045] It is understood that the mounting plate 81 is detachably mounted on the waterproof cover 7 and set on one side of the workbench 4, and can be removed from the outside for easy debugging; the elastic component 87 is installed on both sides of the mounting plate 81 and connected to the slider 83. Under the action of elastic force, the slider 83 can automatically return to the middle position between the first sensor 85 and the second sensor 86; it can be configured that when the workbench 4 is at the zero position, the paddle 88 mounted on the base 41 is in the middle position of the guide rail 82. At this time, the slider 83 is pushed to one side by the paddle 88, and the brush 84 just triggers the first sensor 85, which is identified as the zero position; as the process proceeds, the paddle 88 leaves the slider 83, the slider 83 moves to the other side, and the brush 84 disengages from the first sensor 85; after the paddle 88 rotates 360°, it returns to the middle position, and the slider 83 just moves to the other side, causing the brush 84 to trigger the second sensor 86 on the other side, which is identified as the end of the process; the workbench 4 rotates 360° in the opposite direction to return to the zero position, and the first sensor 85 on the first side is triggered again, which is identified as the return to the zero position.

[0046] Among them, the elastic component 87 can be two springs installed on both sides of the mounting plate 81, with the two springs having the same elastic coefficient and jointly connecting to the slider 83; the elastic component 87 can also be other structures with elastic reset function.

[0047] Among them, the first sensor 85 and the second sensor 86 are both photoelectric sensors, which are triggered by the brush plate 84 to give a positioning signal.

[0048] A sealing gasket is also provided between the mounting plate 81 and the waterproof cover 7 to prevent water leakage.

[0049] A sealing element, such as a V-ring, is provided between the waterproof cover 7 and the connecting plate 3 to further ensure the sealing between the connecting plate 3 and the waterproof cover 7.

[0050] Based on the above implementation methods, refer to Figures 1-8 Another optional operating process of the wafer fabrication platform in this embodiment is as follows: The overall structure can be leveled by adjusting the mounting base 22 at the bottom of the hollow motor and the leveling mechanism 6 on the base 1. Each airflow channel of the connecting plate 3 is connected to the corresponding air pipe from the bottom and connected to an external air source. The negative pressure is transmitted to the surface of the connecting plate 3 through the third airflow channel 32 to adsorb the base 41. When the negative pressure is disconnected, the entire workbench 4 can be easily removed for maintenance. The through hole in the middle of the base 41, through the corresponding airflow channel on the connecting plate 3, can provide positive or negative pressure to the lifting platform 42; first, positive pressure is introduced, and the air pressure lifts the lifting platform 42, with the outer edge of the wafer suspended to receive the wafer; then, negative pressure is introduced, and the lifting platform 42 returns to its original position under the guidance of the limiting guide mechanism 5 and the dual action of negative pressure. At this time, the outer edge of the wafer is in contact with the adsorption hole 4111, and negative pressure is introduced into the adsorption hole 4111, and the wafer is adsorbed. The entire worktable 4 is driven to rotate by a hollow motor at the bottom, which in turn rotates the wafer to perform the corresponding processing. After processing, the negative pressure is stopped from being supplied to the adsorption hole 4111; positive pressure is supplied to the through hole in the middle of the base 41, and the air pressure lifts the lifting platform 42, suspending the outer edge of the wafer so that the robot arm can grip and pick it up.

[0051] Furthermore, a zero-return mechanism 8 is provided on the waterproof cover 7. The slider 83 of the zero-return mechanism 8 is kept in the middle position by springs on both sides. When the lever 88 fixed to the base 41 is moved, the slider 83 drives the brush 84 to trigger the photoelectric sensors on both sides. At this time, the zero position of the worktable 4 is recorded. In this way, the turntable can accurately return to the zero position after the machine is powered off, and then accurately position itself to the position before the power failure.

[0052] The wafer processing platform of this application solves the problems of wafer displacement during processing due to unstable fixing on the table, difficulty in picking up and placing wafers using adsorption methods, difficulty in processing and maintaining the platform, planar deformation caused by the process, and loss of position of the turntable after power failure.

[0053] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0056] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A wafer processing platform, characterized in that, include: Base (1); The drive assembly (2) is mounted on the base (1); A connecting plate (3) is installed on the drive end of the drive assembly (2); The workbench (4) includes a base (41) and a lifting platform (42); the base (41) is attached to the connecting plate (3); the lifting platform (42) is movably mounted on the base (41) in the vertical direction; the base (41) is provided with an adsorption element (411) around the periphery of the lifting platform (42). The lifting platform (42) is configured to carry the wafer and move the wafer up and down to lift the wafer or make the wafer contact the adsorption member (411); the adsorption member (411) is configured to adsorb and fix the contacted wafer. The driving component (2) is configured to drive the connecting plate (3) to rotate, thereby causing the wafer adsorbed on the adsorption member (411) to rotate.

2. The wafer processing platform according to claim 1, characterized in that, The base (41) has a first airflow channel (412) that connects an external air source to the lower surface of the lifting platform (42). The first airflow channel (412) is configured to introduce or extract gas to form a positive or negative pressure that drives the lifting platform (42) to rise or fall.

3. The wafer processing platform according to claim 2, characterized in that, The first airflow channel (412) is a through hole that penetrates the base (41), and the through hole is located at the center of the lifting platform (42); The lifting platform (42) has several vent holes (421) arranged around its center.

4. The wafer processing platform according to claim 2, characterized in that, A limiting guide mechanism (5) is provided between the lifting platform (42) and the base (41); the limiting guide mechanism (5) includes a first sleeve (51) and a limiting pin (52), and the first sleeve (51) is installed on the base (41); The limiting pin (52) includes a movable shaft (521) and a limiting block (522); one end of the movable shaft (521) is mounted on the lifting platform (42) and movably mounted inside the first sleeve (51); the limiting block (522) is disposed at the other end of the movable shaft (521) and located below the base (41); the first sleeve (51) is configured to limit the upward movement of the limiting block (522).

5. The wafer processing platform according to claim 4, characterized in that, An elastic element (53) is provided between the movable shaft (521) and the first sleeve (51).

6. The wafer processing platform according to claim 2, characterized in that, The connecting plate (3) has a second airflow channel (31) and a third airflow channel (32) that are respectively connected to an external air source; the second airflow channel (31) is connected to the first airflow channel (412); the third airflow channel (32) is connected to the upper surface of the connecting plate (3) to form a negative pressure adsorbed on the lifting platform (42).

7. The wafer processing platform according to claim 6, characterized in that, The adsorption element (411) is provided with adsorption holes (4111). The base (41) has a fourth airflow channel (413) that connects to the adsorption hole (4111). The connecting plate (3) has a fifth airflow channel (33) that connects an external air source to the fourth airflow channel (413) to form a negative pressure on the adsorption hole (4111) to adsorb the wafer.

8. The wafer processing platform according to claim 7, characterized in that, The drive assembly (2) has a hollow channel (21), and the second airflow channel (31), the third airflow channel (32) and the fifth airflow channel (33) are connected to an external air source at one end corresponding to the hollow channel (21).

9. The wafer processing platform according to claim 2, characterized in that, The drive assembly (2) includes a mounting base (22); the mounting base (22) is mounted on the base (1); there are a plurality of mounting points between the mounting base (22) and the base (1); at least one mounting point is provided with a leveling mechanism (6). The leveling mechanism (6) includes a fastening screw (61), a second sleeve (62), and an adjusting bolt (63); the two ends of the fastening screw (61) are respectively mounted on the mounting base (22) and the base (1); the second sleeve (62) is sleeved on the fastening screw (61) and passes through the mounting base (22); the adjusting bolt (63) is sleeved on the second sleeve (62) and abuts against the base (1); the outer surface of the adjusting bolt (63) is threaded to the mounting base (22); The adjusting bolt (63) is configured to adjust the height of the mounting base (22) at the corresponding mounting point by rotating it to level the mounting base (22).

10. The wafer processing platform according to claim 1, characterized in that, A waterproof cover (7) is installed on the connecting plate (3); the wafer processing platform also includes a zero-return mechanism (8). The zeroing mechanism (8) includes a mounting plate (81), a guide rail (82), a slider (83), a brush (84), a first sensor (85), a second sensor (86), an elastic component (87), and a paddle (88). The mounting plate (81) is mounted on the waterproof cover (7); the guide rail (82) is mounted on the mounting plate (81); the slider (83) is slidably mounted on the guide rail (82); the brush (84) is mounted on the slider (83) and is symmetrical about the slider (83); the first sensor (85) and the second sensor (86) are respectively mounted on the mounting plate (81) at both ends of the guide rail (82); The elastic component (87) is mounted on the mounting plate (81) and elastically connected to the slider (83). The elastic component (87) is configured to hold the slider (83) at the midpoint between the first sensor (85) and the second sensor (86) without external force. The paddle (88) is disposed at the outer edge of the base (41); the paddle (88) is configured to rotate with the base (41) to contact the slider (83) to drive the slider (83) to move along the guide rail (82) toward the first sensor (85) or the second sensor (86) so that the brush (84) triggers the first sensor (85) or the second sensor (86).

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