High-flatness fixing device for blue film wafer

Abstract

The invention discloses a blue film wafer high-flatness fixing device which comprises a base plate, a notch is formed in the base plate, and a through hole is formed in the notch. The shell is arranged at the top of the chassis, and a first step part is arranged on the inner wall of the shell; the light source is arranged at the top of the first step part and is used for illuminating the blue film wafer; the vacuum ring is arranged at the top of the shell, an adsorption groove is formed in the top of the vacuum ring and used for adsorbing the outer edge of the blue film, a second step part is arranged on the inner wall of the vacuum ring, and air holes are formed in the outer wall of the vacuum ring. The beneficial effects are that the vacuum ring is arranged, the light-transmitting platform is arranged in the vacuum ring, the plane where the top surface of the light-transmitting platform is located is higher than the plane where the top of the vacuum ring is located, the central area of the blue film wafer is placed on the light-transmitting platform, the top of the vacuum ring is provided with the adsorption groove, and when the adsorption groove adsorbs the outer edge of the blue film, the blue film is tensioned; and the central area of the blue film wafer is supported by the light-transmitting platform, so that the overall flatness is improved, and the detection accuracy and the detection efficiency are improved.

Description

Technical Field

[0001] This invention belongs to the field of blue film wafer vacuum adsorption technology, and particularly relates to a blue film wafer high flatness fixing device. Background Technology

[0002] Blue film wafers consist of a blue film and multiple chips adhered to the blue film. The blue film is usually fixed in a plastic circular frame. When inspecting blue film wafers, the wafers are placed on an inspection platform and then photographed by an optical system above. Since the blue film is a flexible material with multiple chips attached to it, the blue film wafers need to be tensioned before the camera takes pictures to improve the overall flatness.

[0003] In existing testing equipment, the blue film is often tensioned by pressing down on its edge. This method can easily result in unevenness in certain areas of the blue film wafer, leading to deviations in the chip testing results in those areas. It may be necessary to adjust the pressing position of the blue film edge multiple times to complete the testing of all chips, which is a cumbersome process with low testing efficiency. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high flatness fixing device for blue film wafers, which can improve the overall flatness of blue film wafers.

[0005] To achieve the above objectives, the present invention employs the following technical solution: a high-flatness fixing device for blue film wafers, comprising: a chassis with a slot and a through hole; a housing disposed on top of the chassis, the inner wall of which has a first step; a light source disposed on top of the first step, the light source being used to illuminate the blue film wafer; a vacuum ring disposed on top of the housing, the top of which has an adsorption groove for adsorbing the outer edge of the blue film, the inner wall of which has a second step, the outer wall of which has vents, one end of which is connected to the bottom of the adsorption groove, and the other end of which is connected to a connector for connecting an external venting device; and a light-transmitting platform disposed on top of the second step, the top plane of which is higher than the top plane of the vacuum ring, the top of which has multiple venting grooves.

[0006] Optionally, the outer wall of the housing is provided with a pipe hole, and a flow divider is provided in the slot. The flow divider is located directly above the through hole. The flow divider includes multiple airflow interfaces. The airflow interfaces are connected to the connector through a connecting pipe, and the connecting pipe is located inside the pipe hole.

[0007] Optionally, a connector is connected to the bottom of the chassis, and a first airflow connection port is provided at the top of the connector. The first airflow connection port passes through a through hole and is connected to a distributor. A second airflow connection port is provided at the bottom of the connector and is connected to an external air extraction device.

[0008] Optionally, there are multiple adsorption tanks, all of which are arc-shaped, and the center of each adsorption tank coincides with the center of the vacuum ring.

[0009] Optionally, multiple adsorption tanks are spaced apart, with a notch between each pair of adjacent adsorption tanks. A top wire hole is provided below the notch, and an adjusting top wire is provided in the top wire hole. The end of the adjusting top wire is in contact with the outer wall of the light-transmitting platform.

[0010] Optionally, the bottom of the adsorption tank is provided with a small hole in the vertical direction, and the small hole is connected to the air hole.

[0011] Optionally, the venting groove includes a plurality of horizontal grooves arranged in parallel and a plurality of vertical grooves arranged in parallel and at intervals, wherein the horizontal grooves and vertical grooves are perpendicular to each other.

[0012] Optionally, a rotary motor is connected to the bottom of the chassis to drive the chassis to rotate. The rotary motor has a communicating cavity in the vertical direction, and the connector is located in the communicating cavity. The bottom of the rotary motor is fixedly connected to an external support platform.

[0013] Optionally, a sensing plate is provided at the bottom edge of the chassis, and a sensor that cooperates with the sensing plate is provided on one side of the sensing plate. When the sensing plate is located inside the sensor, the chassis is in the initial position, and one side of the sensor is fixedly connected to the external support platform.

[0014] Optionally, the connector may include an electrical slip ring for wrapping the wiring.

[0015] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: by setting a vacuum ring, a light-transmitting platform is set inside the vacuum ring, and the plane on which the top surface of the light-transmitting platform is located is higher than the plane on which the top of the vacuum ring is located, the central area of ​​the blue film wafer is placed on the light-transmitting platform, and an adsorption groove is opened at the top of the vacuum ring. When the adsorption groove adsorbs the outer edge of the blue film, the blue film is stretched, and the light-transmitting platform supports the central area of ​​the blue film wafer, improving the overall flatness, thereby improving the detection accuracy and detection efficiency. Attached Figure Description

[0016] Figure 1 The diagram shown is a schematic representation of the overall structure of the present invention. Figure 2 The figure shown is a three-dimensional schematic diagram of the fixing device of the present invention; Figure 3The diagram shown is a disassembly schematic of the fixing device of the present invention; Figure 4 The diagram shown is a schematic representation of the structure of the vacuum ring of the present invention. Figure 5 The diagram shown is a structural schematic of the chassis and outer shell of the present invention; Figure 6 The diagram shown is a schematic representation of the shunt device of the present invention.

[0017] In the diagram: 1. Chassis; 2. Housing; 3. Light source; 4. Vacuum ring; 5. Light-transmitting platform; 6. Diverter; 7. Connector; 8. Rotary motor; 9. Induction plate; 10. Sensor; 101. Groove; 102. Through hole; 201. First step; 202. Pipe hole; 401. Adsorption tank; 402. Second step; 403. Air hole; 404. Connector; 501. Vent groove; 601. Airflow interface. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] Example Reference Figures 1 to 6 This embodiment provides a blue film wafer high flatness fixing device, specifically including: a chassis 1, the chassis 1 having a slot 101, and a through hole 102 inside the slot 101; a housing 2, located on top of the chassis 1, the inner wall of the housing 2 having a first step portion 201; a light source 3, located on top of the first step portion 201, the light source 3 being used to illuminate the blue film wafer; a vacuum ring 4, located on top of the housing 2, the vacuum ring 4 having an adsorption groove 401 on its top, the adsorption groove 401 being used to adsorb the outer edge of the blue film, the inner wall of the vacuum ring 4 having a second step portion 402, the outer wall of the vacuum ring 4 having an air hole 403, one end of the air hole 403 being connected to the bottom of the adsorption groove 401, the other end of the air hole 403 being connected to a connector 404, the connector 404 being used to connect to an external air extraction device; a light-transmitting platform 5, located on top of the second step portion 402, the plane where the top of the light-transmitting platform 5 is located is higher than the plane where the top of the vacuum ring 4 is located, the top of the light-transmitting platform 5 having multiple venting grooves 501.

[0022] The light-transmitting platform 5 is made of highly flat glass, with its upper surface flatness controlled within the micrometer level. When the blue film edge is adsorbed by the adsorption groove 401, the central area of ​​the blue film wafer is stretched open upon contact with the light-transmitting platform 5. Since the top surface of the light-transmitting platform 5 is higher than the top surface of the vacuum ring 4, the blue film can be freed from an unstable state, and the overall flatness error is controlled within a preset range. Simultaneously, a venting groove 501 is opened on the upper surface of the light-transmitting platform 5 to prevent air bubbles from forming between the blue film and the light-transmitting platform 5 during the adsorption and tensioning process, which could lead to insufficient flatness of the blue film. The light-transmitting platform 5 uses glass, which has high light transmittance. The light source 3 is positioned below the light-transmitting platform 5, illuminating vertically upwards to meet the lighting requirements for camera photography. The external evacuation device is an air pump.

[0023] like Figure 1 As shown, an optical inspection system is installed above the light-transmitting platform 5. The optical inspection system includes a camera, which is used to take pictures and inspect the blue film wafer on the top of the light-transmitting platform 5.

[0024] A vacuum ring 4 is set on the top of the outer shell 2, and an adsorption groove 401 is set on the top of the vacuum ring 4. A second step 402 is set on the inner wall of the vacuum ring 4. A light-transmitting platform 5 is attached to the second step 402 and then fixed by adjusting the set screw. The plane where the top surface of the light-transmitting platform 5 is located is higher than the plane where the top surface of the vacuum ring 4 is located. When the entire blue film wafer is placed on the vacuum ring 4 and the light-transmitting platform 5, the central area of ​​the blue film wafer is located on the top of the light-transmitting platform 5, and the edge area of ​​the blue film wafer is located on the top of the adsorption groove 401. A height difference is formed between the central area and the edge area of ​​the blue film wafer. When the adsorption groove 401 adsorbs the outer edge of the blue film, the blue film is stretched. The light-transmitting platform 5 supports the central area of ​​the blue film wafer, improving the overall flatness of the blue film wafer, thereby improving the accuracy and efficiency of the optical inspection system for detecting surface defects of the blue film wafer.

[0025] By utilizing the height difference between the top surface of the light-transmitting platform 5 and the top surface of the vacuum ring 4, and combined with the adsorption tension effect of the adsorption groove 401 on the top of the vacuum ring 4 on the edge of the blue film, the light-transmitting platform 5 stably supports the central area of ​​the blue film wafer, freeing the blue film from an unstable state, improving the overall flatness, and providing a guarantee for high-precision detection.

[0026] The outer wall of the outer casing 2 has a pipe hole 202. A diverter 6 is provided in the slot 101. The diverter 6 is located directly above the through hole 102. The diverter 6 includes multiple airflow interfaces 601. The airflow interfaces 601 are connected to the connector 404 through a connecting pipe. The connecting pipe is located in the pipe hole 202.

[0027] The slot 101 is circular, and the through hole 102 is square. The bottom of the distributor 6 is in contact with the bottom of the slot 101, and the top plane of the distributor 6 is higher than the top plane of the chassis 1. The two ends of the distributor 6 are fixedly connected to the chassis 1 by bolts, and a through hole is opened in the middle of the distributor 6. Four airflow ports 601 are provided on both sides of the distributor 6, and the four airflow ports 601 are evenly spaced.

[0028] The bottom of the chassis 1 is connected to a connector 7. The top of the connector 7 is provided with a first airflow connection port. The first airflow connection port passes through the through hole 102 and is connected to the splitter 6. The bottom of the connector 7 is provided with a second airflow connection port, which is connected to an external air extraction device.

[0029] There are multiple adsorption tanks 401, all of which are arc-shaped, with the center of each arc coinciding with the center of the vacuum ring 4. The adsorption tanks 401 are spaced apart, with a notch between each pair of adjacent tanks. Below the notch is a set screw hole containing an adjusting set screw, the end of which contacts the outer wall of the light-transmitting platform 5. A small hole is vertically oriented at the bottom of each adsorption tank 401, connecting to an air vent 403.

[0030] The vacuum ring 4 includes a bottom ring and a top ring, which are integrally formed. The diameter of the bottom ring is larger than that of the top ring. The adsorption groove 401 is located on the top of the top ring. The set screw holes are opened on the top ring, and the set screw holes are opened from the outer wall of the top ring towards the center of the top ring. Multiple set screw holes are evenly distributed on the outer wall of the top ring. The air holes 403 are provided on the bottom ring, and the number of air holes 403 is the same as that of the airflow interface 601.

[0031] The light-transmitting platform 5 is attached to the top of the second step 402. Multiple adjusting screws simultaneously press against the outer wall of the light-transmitting platform 5 to achieve fixation. By slightly changing the tightness of each adjusting screw, the angle between the top surface of the light-transmitting platform 5 and the plane where the bottom of the camera lens is located can be finely adjusted, improving the parallelism between the two. This allows the entire wafer chip on the blue film to be captured within the camera's depth of field, further improving detection clarity and accuracy.

[0032] The venting groove 501 includes multiple horizontal grooves arranged in parallel intervals and multiple vertical grooves arranged in parallel intervals, with the horizontal grooves and vertical grooves being perpendicular to each other.

[0033] The light-transmitting platform 5 is made of high-flatness glass material, which meets the high light transmittance lighting requirements of optical inspection. The light-transmitting platform 5 has high light transmittance, and the light source 3 below the light-transmitting platform 5 shines vertically upward, which can improve the uniformity and clarity of the lighting on the blue film wafer, and provide sufficient and stable light conditions for camera photography and inspection.

[0034] The surface of the light-transmitting platform 5 has crisscrossing air vents 501, which effectively eliminates air bubble interference between the blue film and the light-transmitting platform 5. During the process of the blue film being adsorbed and stretched, the air between the blue film and the light-transmitting platform 5 can be discharged, avoiding the problem of insufficient local flatness caused by air bubbles and ensuring the stability of the detection reference surface.

[0035] A rotary motor 8 is connected to the bottom of the chassis 1. The rotary motor 8 is used to drive the chassis 1 to rotate. The rotary motor 8 has a communicating cavity in the vertical direction. The connector 7 is located in the communicating cavity. The bottom of the rotary motor 8 is fixedly connected to the external support platform.

[0036] A sensing plate 9 is provided at the bottom edge of the chassis 1. A sensor 10 that cooperates with the sensing plate 9 is provided on one side of the sensing plate 9. When the sensing plate 9 is located inside the sensor 10, the chassis 1 is in the initial position. One side of the sensor 10 is fixedly connected to the external support platform. An electrical slip ring is provided inside the connector 7. The electrical slip ring is used to wrap the circuit.

[0037] A rotary motor 8 drives the chassis 1, vacuum ring 4, and light-transmitting platform 5 to rotate synchronously, correcting deviations during product loading. The external support platform is either a fixed base or a linear motion mechanism. An electrical slip ring is a precision device that enables the transmission of electrical signals and current between rotating and stationary components. When the rotary motor 8 drives the chassis 1 to rotate, the electrical slip ring wraps around the relevant wiring to prevent tangling.

[0038] By adjusting the set screw on the vacuum ring 4, the parallelism between the detection reference surface and the camera lens can be finely adjusted. By slightly changing the tightness of the set screw, the angle between the top surface of the light-transmitting platform 5 and the bottom plane of the camera lens can be adjusted, reducing the parallel error between the two. This allows the camera to clearly capture the entire blue film wafer surface within the depth of field, improving detection clarity and accuracy.

[0039] The rotary motor 8 drives the chassis 1, vacuum ring 4 and light-transmitting platform 5 to rotate synchronously. In conjunction with the initial positioning of the induction plate 9 and sensor 10, it can correct the positional deviation when loading the blue film wafer.

[0040] When using the equipment, first adjust the top screw on the vacuum ring 4, fine-tune the top surface angle of the light-transmitting platform 5 so that it is parallel to the bottom plane of the camera lens in the optical detection system, start the light source 3, the light source 3 shines vertically upward on the top of the first step 201 of the outer shell 2, and the light shines evenly through the glass light-transmitting platform 5, and the sensor 9 and the sensor 10 cooperate to perform initial position positioning of the chassis 1.

[0041] The robotic arm places the blue film wafer on top of the vacuum ring 4, so that the central area of ​​the blue film wafer adheres to the top surface of the light-transmitting platform 5, and the edge area of ​​the blue film covers the top of the adsorption groove 401 of the vacuum ring 4. The adsorption groove 401 generates an adsorption force on the outer edge of the blue film, causing the blue film wafer to be tensioned. Because of the height difference between the top surface of the vacuum ring 4 and the top surface of the light-transmitting platform 5, the central area of ​​the blue film wafer is supported by the light-transmitting platform 5 and completely adheres to the surface of the light-transmitting platform 5. At the same time, the air between the blue film and the light-transmitting platform 5 is discharged through the venting groove 501 to achieve the flatness requirement. At this time, the optical inspection system moves above the light-transmitting platform 5 to take pictures and inspect the blue film wafer.

[0042] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A high-flatness fixing device for blue film wafers, characterized in that, include: The chassis (1) has a slot (101) and a through hole (102) inside the slot (101). The outer shell (2) is located on the top of the chassis (1), and the inner wall of the outer shell (2) is provided with a first step (201). A light source (3) is located at the top of the first step (201), and the light source (3) is used to illuminate the blue film wafer; A vacuum ring (4) is located on the top of the outer shell (2). An adsorption groove (401) is provided on the top of the vacuum ring (4). The adsorption groove (401) is used to adsorb the outer edge of the blue film. A second step (402) is provided on the inner wall of the vacuum ring (4). An air hole (403) is provided on the outer wall of the vacuum ring (4). One end of the air hole (403) is connected to the bottom of the adsorption groove (401). The other end of the air hole (403) is connected to a connector (404). The connector (404) is used to connect to an external air extraction device. A light-transmitting platform (5) is located at the top of the second step (402). The plane at the top of the light-transmitting platform (5) is higher than the plane at the top of the vacuum ring (4). Multiple venting grooves (501) are provided at the top of the light-transmitting platform (5).

2. The blue film wafer high flatness fixing device according to claim 1, characterized in that, The outer wall of the outer shell (2) is provided with a pipe hole (202), and a diverter (6) is provided in the slot (101). The diverter (6) is located directly above the through hole (102). The diverter (6) includes multiple airflow interfaces (601). The airflow interfaces (601) are connected to the connector (404) through a connecting pipe. The connecting pipe is located in the pipe hole (202).

3. The blue film wafer high flatness fixing device according to claim 2, characterized in that, The bottom of the chassis (1) is connected to a connector (7), the top of the connector (7) is provided with a first airflow connection port, the first airflow connection port passes through the through hole (102) and is connected to the splitter (6), the bottom of the connector (7) is provided with a second airflow connection port, the second airflow connection port is connected to an external air extraction device.

4. The blue film wafer high flatness fixing device according to claim 1, characterized in that, There are multiple adsorption tanks (401), and the shape of each adsorption tank (401) is arc-shaped. The center of each adsorption tank (401) coincides with the center of the vacuum ring (4).

5. The blue film wafer high flatness fixing device according to claim 4, characterized in that, Multiple adsorption tanks (401) are spaced apart, and a notch is provided between every two adjacent adsorption tanks (401). A top wire hole is provided below the notch, and an adjusting top wire is provided in the top wire hole. The end of the adjusting top wire is in contact with the outer wall of the light-transmitting platform (5).

6. The blue film wafer high flatness fixing device according to claim 1, characterized in that, The bottom of the adsorption tank (401) has a small hole in the vertical direction, and the small hole is connected to the air hole (403).

7. The blue film wafer high flatness fixing device according to claim 1, characterized in that, The venting groove (501) includes a plurality of horizontal grooves arranged in parallel intervals and a plurality of vertical grooves arranged in parallel intervals, wherein the horizontal grooves and vertical grooves are perpendicular to each other.

8. The blue film wafer high flatness fixing device according to claim 3, characterized in that, The bottom of the chassis (1) is connected to a rotary motor (8), which is used to drive the chassis (1) to rotate. The rotary motor (8) has a communicating cavity in the vertical direction. The connector (7) is located in the communicating cavity. The bottom of the rotary motor (8) is fixedly connected to the external support platform.

9. The blue film wafer high flatness fixing device according to claim 8, characterized in that, A sensor plate (9) is provided at the bottom edge of the chassis (1). A sensor (10) is provided on one side of the sensor plate (9) to cooperate with the sensor plate (9). When the sensor plate (9) is located inside the sensor (10), the chassis (1) is in the initial position. One side of the sensor (10) is fixedly connected to the external support platform.

10. The blue film wafer high flatness fixing device according to claim 3, characterized in that, An electrical slip ring is provided inside the connector (7), which is used to wrap the circuit.

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