Rubber tube centrifugal device and method for high-viscosity integrated circuit packaging adhesive

Abstract

The invention discloses a rubber tube centrifugal device and method for high-viscosity integrated circuit packaging glue, and relates to the field of centrifugal equipment. The cup cover is detachably arranged at the top of the rubber cup, and an air hole is formed in the top of the cup cover; the framework is arranged in the rubber cup, and a plurality of insertion holes are formed in the top of the framework; the pipe fitting is inserted into the insertion hole; the bottom supports are arranged in the glue cup and correspond to the insertion holes one to one, the centrifuged pipe fittings can be directly used, and glue waste is reduced; the pipe fitting can be centrifuged without replacing accessories, so that the cost is reduced, and the operation convenience is improved; due to the design, the pipe fitting is simpler and more convenient to operate, and the single-component glue can be directly centrifuged after being filled, so that the process reliability is improved; by adopting pipe fitting centrifugation, the problem that bubbles are brought in when glue flows into a pipe body during glue pouring in conventional operation can be avoided.

Description

Technical Field

[0001] This invention relates to the technical field of centrifugation equipment, and specifically to a tube centrifugation device and method for high-viscosity integrated circuit encapsulation adhesive. Background Technology

[0002] Integrated circuit packaging is mainly divided into three types: plastic packaging, metal packaging, and ceramic packaging. Among them, plastic packaging usually uses injection molding with a specific mold. The existing technology uses a process that combines a prefabricated bracket and a cup. First, the integrated circuit chip is fixed on the prefabricated bracket to form a stable electrical connection. Then, epoxy resin is applied inside the cup to protect the chip.

[0003] To improve the convenience of production operations and the reliability of encapsulation, epoxy encapsulants need to undergo vacuum centrifugation to ensure that the effective components inside are mixed evenly and distributed consistently, to eliminate air bubbles, and to ensure that the colloid has good flowability at a suitable temperature.

[0004] Currently, LED dispensing often employs a dispensing device that combines a cavity and a dispensing tube: after the adhesive is injected into the tube, a pressure piston forces the adhesive into the cavity, and then it is injected into a cup through a needle. Because LED adhesive has a relatively low viscosity, the glue cup (e.g., [missing information]) can be used directly. Figure 8 (As shown) The adhesive is centrifuged, and then transferred into the dispensing tube.

[0005] However, the viscosity of integrated circuit packaging adhesive is high, and its fluidity is still poor at 50°C after vacuum centrifugation. If the adhesive cup is used for centrifugation, not only will the adhesive easily stick to the cup wall, resulting in material waste, but air bubbles will also be easily introduced during the transfer to the adhesive tube.

[0006] Based on this, the present invention provides a tube centrifugation device and method for high-viscosity integrated circuit encapsulation adhesive. Summary of the Invention

[0007] To address the problems mentioned in the background section, this invention provides a centrifugation device and method for high-viscosity integrated circuit encapsulation adhesive tubes. The centrifuged tubes can be used directly, reducing adhesive waste. Centrifugation of the tubes can be achieved without replacing parts, reducing costs and improving operational convenience. This design simplifies tube operation, allowing for direct centrifugation after single-component adhesive filling, thus enhancing process reliability. Using tube centrifugation avoids the air bubbles introduced when adhesive flows into the tube during conventional pouring operations.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A centrifuge device for a high-viscosity integrated circuit encapsulating adhesive includes a glue cup; a cup lid, detachably disposed on the top of the glue cup, and the top of the cup lid having a vent hole; at least one frame disposed inside the glue cup, and the top of the frame having multiple insertion holes; a tube inserted into the insertion holes; and a base disposed inside the glue cup, and the base corresponding to each insertion hole.

[0010] By adopting the above technical solution, the centrifuged tubes can be used directly, reducing glue waste; centrifugation of tubes can be achieved without replacing parts, reducing costs and improving operational convenience; this design makes tube operation simpler, and single-component glue can be centrifuged directly after filling, improving process reliability; using tube centrifugation can avoid the problem of air bubbles brought in by glue flowing into the tube body when pouring glue in conventional operations.

[0011] Furthermore, the fitting includes a hose; a cap, detachably disposed at the top of the hose, and the cap having a vent hole at its top; and a dispensing head, disposed at the bottom of the hose.

[0012] Furthermore, the insertion port at the top of the base is tapered.

[0013] Furthermore, the bottom of the cup lid is provided with multiple inserts, and the top of the plastic cup is provided with multiple notches, with each insert corresponding to one of the notches.

[0014] Furthermore, it also includes a fixing mechanism disposed within the cup lid for fixing the tubular component.

[0015] Furthermore, the fixing mechanism includes multiple sliding rods slidably inserted into the top of the cup lid; a disc connected between the bottom ends of each sliding rod and arranged at the bottom of the cup lid, the bottom of the disc having multiple tapered through holes corresponding one-to-one with the insertion holes; and an adjusting rod threaded onto the top of the cup lid, the bottom end of the adjusting rod being rotatably connected to the top of the disc.

[0016] By adopting the above technical solution, the tapered through hole and the base work together to form a reliable clamping and fixing of the pipe fitting, effectively preventing it from rotating during centrifugation. In addition, since both the tapered through hole and the insertion port of the base are tapered, the structure has a certain degree of adaptability and can meet the clamping and fixing requirements of different types of pipe fittings.

[0017] Furthermore, the fixing mechanism also includes at least one upright strip disposed at the bottom of the cup lid; a plug rod slidably inserted into the side of the upright strip, and the plug rod is distributed through the side of the upright strip; a wedge-shaped pad disposed at one end of the plug rod, a spring passing through the middle of the plug rod located between the wedge-shaped pad and the upright strip, and the side of the disc can contact the side of the wedge-shaped pad; a slot is opened inside the plastic cup, and the other end of the plug rod can be inserted into the slot.

[0018] By adopting the above technical solution, axial movement, circumferential rotation, or jumping of the fittings during centrifugation is effectively prevented. It also has good dimensional adaptability and can be compatible with fittings of different specifications, ensuring the stability of the centrifugation process and the consistency of degassing effect. All fittings can be tightened and the cup cap and glue cup can be automatically locked simultaneously by rotating the adjusting rod, forming a forced safety interlock, simplifying the operation process, effectively preventing safety risks caused by cup cap loosening, and ensuring that the glue is centrifuged in a fixed state, reducing fitting wear and usage costs.

[0019] A method for a centrifuge apparatus for a tube containing high-viscosity integrated circuit encapsulating adhesive, applicable to a centrifuge apparatus for a tube containing high-viscosity integrated circuit encapsulating adhesive, comprising the following steps:

[0020] Insert the glue-filled pipes into the corresponding holes one by one, ensuring that the bottom end of the pipe is inserted into the corresponding base.

[0021] Next, attach the lid to the plastic cup;

[0022] Finally, the glue cup containing the fittings is placed in a centrifuge for centrifugation of the glue.

[0023] Compared with existing technologies, the present invention provides a centrifugation device and method for high-viscosity integrated circuit encapsulation adhesive. The integrated circuit encapsulation adhesive to be centrifuged is poured into a tube, which is then sequentially inserted into the corresponding holes of the skeleton, ensuring the bottom of the tube is inserted into the corresponding base. Afterwards, the cup is covered, and the entire adhesive cup is placed in a centrifuge for centrifugation. This structural design has several advantages over conventional LED adhesive centrifugation methods—that is, firstly, all the adhesive is poured into a container for centrifugation, then poured into a tube, and finally the tube is installed in a dispensing machine—firstly, the centrifuged tube can be used directly, reducing adhesive waste; secondly, tube centrifugation can be achieved without replacing parts, reducing costs and improving operational convenience; furthermore, this design makes tube operation simpler, and single-component adhesive can be centrifuged directly after filling, improving process reliability; finally, using tube centrifugation avoids the problem of air bubbles introduced when adhesive flows into the tube during conventional operation.

[0024] By applying constraints simultaneously from the top and bottom of the fitting, and utilizing the fit between the tapered through hole and the tapered socket of the base, not only is rapid alignment and reliable fixation of the fitting achieved, effectively preventing axial movement, circumferential rotation or jumping of the fitting during centrifugation, but it also has good dimensional adaptability, is compatible with fittings of different specifications, and ensures the stability of the centrifugation process and the consistency of the degassing effect.

[0025] By simply rotating the adjusting rod, all fittings can be tightened simultaneously and the cup cap and glue cup can be automatically locked, forming a mandatory safety interlock. This simplifies the operation process, effectively prevents safety risks caused by the cup cap coming loose, and ensures that the glue is centrifuged in a fixed state, reducing fitting wear and operating costs. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1 This is a schematic diagram of the structure of the tube centrifuge device for high-viscosity integrated circuit encapsulation adhesive in an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the unfolded structure of the centrifugal device for high-viscosity integrated circuit encapsulation adhesive in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the internal structure of the centrifuge device for high-viscosity integrated circuit encapsulation adhesive in an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the fixing mechanism in an embodiment of the present invention;

[0031] Figure 5 yes Figure 4 Enlarged structural diagram at point A;

[0032] Figure 6 This is a cross-sectional structural schematic diagram of the cup lid in an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of the hose in an embodiment of the present invention;

[0034] Figure 8 This is a schematic diagram of the container structure used for centrifuging LED adhesive in existing technology.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Glue cup; 2. Cup lid; 3. Frame; 4. Insertion hole; 5. Fittings; 500. Glue tube; 501. Tube cap; 502. Glue dispensing head; 6. Base; 7. Insert pad; 8. Notch; 9. Fixing mechanism; 900. Slide rod; 901. Disc; 902. Conical through hole; 903. Adjusting rod; 904. Vertical bar; 905. Insertion rod; 906. Wedge pad; 907. Spring; 908. Slot. Detailed Implementation

[0037] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0038] As attached Figure 1 To be continued Figure 7 As shown:

[0039] Example 1:

[0040] This invention provides a centrifuge device for a tube of high-viscosity integrated circuit encapsulating adhesive, comprising an adhesive cup 1, a cup lid 2, at least one frame 3, a tube 5, and a base 6;

[0041] The cup lid 2 is detachably mounted on the top of the plastic cup 1, and the top of the cup lid 2 has a vent hole; the frame 3 is mounted inside the plastic cup 1, and the top of the frame 3 has multiple insertion holes 4; the tube 5 is inserted into the insertion holes 4; the base 6 is mounted inside the plastic cup 1, and the base 6 corresponds one-to-one with the insertion holes 4.

[0042] Specifically, currently, LED dispensing mostly uses a dispensing device that combines a cavity and a tube: after the glue is injected into the tube, the glue is forced into the cavity by a pressure piston and then injected into the cup through a needle. Since the viscosity of LED glue is relatively low, the glue cup 1 can be used directly to hold the glue for centrifugation. After centrifugation, the glue is then transferred into the dispensing tube.

[0043] However, the viscosity of the integrated circuit packaging adhesive is high, and its flowability remains poor even after vacuum centrifugation at 50°C. If the same adhesive cup 1 (e.g.) is used... Figure 8 Centrifugation (as shown) not only causes the colloid to easily adhere to the cup wall, leading to material waste, but also easily introduces air bubbles during the transfer to the tube.

[0044] In view of this, the present invention first fills the integrated circuit encapsulation adhesive to be centrifuged into the tube 5, then inserts the tube 5 into the corresponding insertion hole 4 of the skeleton 3 in sequence, and ensures that the bottom end of the tube 5 is inserted into the corresponding base 6, then covers the cup lid 2, and places the entire glue cup 1 in the centrifuge for centrifugation.

[0045] Compared to the conventional method of centrifuging LED adhesive—which involves first centrifuging all the adhesive in a container, then pouring it into a tube, and finally installing the tube into the dispensing machine—this structural design offers several advantages: First, the centrifuged tube 5 can be used directly, reducing adhesive waste; second, centrifuging the tube 5 can be performed without replacing parts, reducing costs and improving operational convenience; furthermore, this design simplifies the operation of the tube 5, allowing for direct centrifugation of single-component adhesive after filling, thus improving process reliability; finally, centrifuging the tube 5 avoids the air bubbles introduced when adhesive flows into the tube during conventional operations.

[0046] like Figure 7 As shown, fitting 5 includes a hose 500, a cap 501, and a dispensing head 502;

[0047] The tube cap 501 is detachably installed at the top of the tube 500, and the top of the tube cap 501 has an exhaust hole; the glue dispensing head 502 is installed at the bottom of the tube 500, and the tube cap 501 and the tube 500 are connected by threads.

[0048] Specifically, the socket at the top of the base 6 has a conical structure.

[0049] Specifically, the glue dispensing head 502 is inserted into the socket of the base 6 to seal the bottom of the fitting 5, preventing the internal glue from flowing out during centrifugation.

[0050] It is worth noting that the adhesive inside fitting 5 will not be discharged under normal circumstances; it needs to be dispensed using the air pump on the dispensing machine.

[0051] like Figure 2 As shown, the bottom of the cup lid 2 is provided with multiple inserts 7, and the top of the cup 1 is provided with multiple notches 8, with the inserts 7 and notches 8 corresponding one to one.

[0052] Specifically, the cup lid 2 and the plastic cup 1 are connected by inserting the pad 7 into the corresponding notch 8. This design can prevent the cup lid 2 from rotating during centrifugation.

[0053] like Figure 4 As shown, it also includes a fixing mechanism 9 disposed inside the cup lid 2 for fixing the tube 5.

[0054] like Figure 4 and Figure 6 As shown, the fixing mechanism 9 includes multiple slide rods 900, a disc 901, and an adjusting rod 903;

[0055] Multiple sliding rods 900 are slidably inserted into the top of the cup lid 2; a disc 901 is connected between the bottom ends of each sliding rod 900 and is arranged at the bottom of the cup lid 2. The bottom of the disc 901 has multiple tapered through holes 902, and the tapered through holes 902 correspond one-to-one with the insertion holes 4; an adjusting rod 903 is threaded onto the top of the cup lid 2, and the bottom end of the adjusting rod 903 is rotatably connected to the top of the disc 901.

[0056] Specifically, after the cup lid 2 is closed, rotating the adjusting rod 903 can move the disc 901 downwards, thereby pressing and fixing the top of the tube 5 with the tapered through hole 902 at the bottom of the disc 901. The tapered through hole 902 and the base 6 work together to form a reliable clamping and fixing of the tube 5, effectively preventing it from rotating during centrifugation. In addition, since both the tapered through hole 902 and the insertion port of the base 6 adopt a tapered design, this structure has a certain degree of adaptability and can meet the clamping and fixing requirements of different models of tubes 5.

[0057] Example 2:

[0058] This embodiment is a further optimization based on the first embodiment described above. The parts that are the same as those in the aforementioned technical solution will not be repeated here. Figure 5 As shown, in order to better realize the present invention, the following arrangement is adopted. In this embodiment, the fixing mechanism 9 further includes at least one upright bar 904, a plug rod 905 and a wedge-shaped pad 906.

[0059] The stand bar 904 is located at the bottom of the cup lid 2; the plug rod 905 is slidably inserted into the side of the stand bar 904, and the plug rod 905 is distributed through the side of the stand bar 904; the wedge-shaped pad 906 is located at one end of the plug rod 905, and a spring 907 is inserted through the middle of the plug rod 905 between the wedge-shaped pad 906 and the stand bar 904, and the side of the disc 901 can contact the side of the wedge-shaped pad 906; a slot 908 is opened inside the cup 1, and the other end of the plug rod 905 can be inserted into the slot 908.

[0060] Specifically, when the disc 901 moves downward, its side contacts and pushes the wedge-shaped pad 906 outward, thereby inserting the other end of the plug-in rod 905 into the corresponding slot 908 inside the cup 1, thus locking and fixing the cup lid 2 and the cup 1. This locking mechanism ensures the overall stability of the connection between the two and prevents the cup lid 2 from loosening during centrifugation. At the same time, the wedge-shaped pad 906 compresses the spring 907 when it moves. When the disc 901 moves upward, the wedge-shaped pad 906 returns to its original position under the elastic force of the spring 907, causing the plug-in rod 905 to exit from the slot 908, thereby releasing the lock.

[0061] By simultaneously applying constraints from the top and bottom of the tube 5, and utilizing the fit between the tapered through hole 902 and the tapered socket of the base 6, not only is rapid centering and reliable fixing of the tube 5 achieved, effectively preventing axial movement, circumferential rotation or jumping of the tube 5 during centrifugation, but it also has good dimensional adaptability, is compatible with tubes 5 of different specifications, and ensures the stability of the centrifugation process and the consistency of the degassing effect.

[0062] By simply rotating the adjusting rod 903, all fittings 5 ​​can be pressed together and the cup cap 2 and the glue cup 1 can be automatically locked together, forming a forced safety interlock. This simplifies the operation process, effectively prevents safety risks caused by the cup cap 2 coming loose, and ensures that the glue is centrifuged in a fixed state, reducing the wear and tear and cost of fittings 5.

[0063] Example 3:

[0064] A method for a centrifuge apparatus for a tube containing high-viscosity integrated circuit encapsulating adhesive, applicable to a centrifuge apparatus for a tube containing high-viscosity integrated circuit encapsulating adhesive, comprising the following steps:

[0065] Insert the pipe fittings 5 ​​filled with glue into the corresponding sockets 4 in sequence, and ensure that the bottom end of the pipe fittings 5 ​​is inserted into the corresponding base 6.

[0066] Next, attach the cup lid 2 to the plastic cup 1;

[0067] Finally, the glue cup 1 containing the fitting 5 is placed in a centrifuge for centrifugation of the glue.

[0068] This method offers several advantages over conventional LED adhesive centrifugation methods—which involve first centrifuging all the adhesive in a container, then pouring it into a tube, and finally installing the tube into a dispensing machine. Firstly, the centrifuged tube 5 can be used directly, reducing adhesive waste. Secondly, centrifuging the tube 5 can be performed without replacing parts, lowering costs and improving operational convenience. Furthermore, this design simplifies the operation of the tube 5, allowing for direct centrifugation of single-component adhesive after filling, thus enhancing process reliability. Finally, centrifuging the tube 5 avoids the air bubbles introduced during conventional dispensing processes.

[0069] Working principle and usage process of this invention:

[0070] First, pour the encapsulating adhesive of the integrated circuit to be centrifuged into the tube 5. Then, insert the tube 5 into the corresponding insertion hole 4 of the skeleton 3 in sequence, and ensure that the bottom end of the tube 5 is inserted into the corresponding base 6. Then, cover the cup lid 2.

[0071] Next, rotating the adjusting rod 903 will move the disc 901 downward, thereby pressing and fixing the top of the pipe 5 with the tapered through hole 902 at the bottom of the disc 901. The tapered through hole 902 and the base 6 work together to form a reliable clamping and fixing of the pipe 5, effectively preventing it from rotating during centrifugation. In addition, since both the tapered through hole 902 and the insertion port of the base 6 adopt a tapered design, this structure has a certain degree of adaptability and can meet the clamping and fixing requirements of different types of pipe 5.

[0072] When the disc 901 moves downward, its side contacts and pushes the wedge-shaped pad 906 outward, thereby inserting the other end of the plug-in rod 905 into the corresponding slot 908 inside the cup 1, thus locking and fixing the cup lid 2 and the cup 1. This locking mechanism ensures the overall stability of the connection between the two and prevents the cup lid 2 from loosening during centrifugation. At the same time, the wedge-shaped pad 906 compresses the spring 907 when it moves. When the disc 901 moves upward, the wedge-shaped pad 906 returns to its original position under the elastic force of the spring 907, causing the plug-in rod 905 to exit from the slot 908, thereby releasing the lock.

[0073] Finally, the entire glue cup 1 is placed in a centrifuge for centrifugation. This structural design has several advantages over the conventional LED glue centrifugation method—that is, first filling all the glue into a container for centrifugation, then pouring it into the tube, and finally installing the tube into the dispensing machine—firstly, the centrifuged tube 5 can be used directly, reducing glue waste; secondly, centrifuging the tube 5 can be achieved without replacing parts, reducing costs and improving operational convenience; in addition, this design makes the operation of the tube 5 simpler, and single-component glue can be centrifuged directly after filling, improving process reliability; finally, using the tube 5 for centrifugation can avoid the problem of air bubbles introduced by glue flowing into the tube during conventional operation.

[0074] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually.

[0075] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, which will not be described in detail here.

[0076] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A centrifuge device for a tube used in high-viscosity integrated circuit encapsulation adhesive, characterized in that, include: Glue cup (1); The cup lid (2) is detachably mounted on the top of the plastic cup (1), and the top of the cup lid (2) is provided with a vent hole; At least one skeleton (3) is disposed inside the glue cup (1), and the top of the skeleton (3) is provided with a plurality of insertion holes (4). The fitting (5) is inserted into the socket (4); The base (6) is set inside the plastic cup (1), and the base (6) corresponds one-to-one with the insertion hole (4).

2. The centrifuge device for a tube used in high-viscosity integrated circuit encapsulation adhesive according to claim 1, characterized in that, The pipe fitting (5) includes: Rubber hose (500); The tube cap (501) is detachably installed at the top of the hose (500), and the top of the tube cap (501) is provided with an exhaust hole; A dispensing head (502) is located at the bottom end of the dispensing tube (500).

3. The centrifuge device for a tube used in high-viscosity integrated circuit encapsulation adhesive according to claim 1, characterized in that, The insertion port at the top of the base (6) is tapered.

4. The centrifuge device for a tube used in high-viscosity integrated circuit encapsulation adhesive according to claim 1, characterized in that, The bottom of the cup lid (2) is provided with multiple inserts (7), and the top of the cup (1) is provided with multiple notches (8), with each insert (7) corresponding to a notch (8).

5. A centrifuge device for a tube used in high-viscosity integrated circuit encapsulation adhesive according to claim 1, characterized in that, It also includes a fixing mechanism (9) disposed within the cup lid (2) for fixing the tube (5).

6. A centrifuge device for a tube used in high-viscosity integrated circuit encapsulation adhesive according to claim 5, characterized in that, The fixing mechanism (9) includes: Multiple slide rods (900) are slidably inserted into the top of the cup lid (2); A disc (901) is connected between the bottom ends of each of the slide rods (900), and the disc (901) is arranged at the bottom of the cup lid (2). The bottom of the disc (901) is provided with a plurality of conical through holes (902), and the conical through holes (902) correspond one-to-one with the insertion holes (4). An adjusting rod (903) is threaded onto the top of the cup lid (2), and the bottom end of the adjusting rod (903) is rotatably connected to the top of the disc (901).

7. A centrifuge device for a tube containing high-viscosity integrated circuit encapsulating adhesive according to claim 6, characterized in that, The fixing mechanism (9) also includes: At least one vertical strip (904) is provided at the bottom of the cup lid (2); The plug rod (905) is slidably inserted into the side of the vertical bar (904), and the plug rod (905) is distributed through the side of the vertical bar (904); A wedge-shaped pad (906) is disposed at one end of the plug rod (905). A spring (907) is inserted through the middle of the plug rod (905) between the wedge-shaped pad (906) and the vertical bar (904). The side of the disc (901) can contact the side of the wedge-shaped pad (906). The inside of the cup (1) is provided with a slot (908), and the other end of the plug rod (905) can be inserted into the slot (908).

8. A method for a centrifuge apparatus for a high-viscosity integrated circuit encapsulating adhesive, applicable to the centrifuge apparatus for a high-viscosity integrated circuit encapsulating adhesive as described in any one of claims 1-7, characterized in that, Includes the following steps: Insert the pipe fittings (5) filled with glue into the corresponding sockets (4) in sequence, and ensure that the bottom end of the pipe fittings (5) is inserted into the corresponding base (6); Next, attach the cup lid (2) to the plastic cup (1); Finally, the glue cup (1) containing the fitting (5) is placed in a centrifuge for centrifugation of the glue.

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