HPC-DPCC composite structure with sound stealth performance and impact resistance as well as preparation method and application of HPC-DPCC composite structure

Abstract

The invention discloses an HPC-DPCC composite structure with sound stealth performance and impact resistance and a preparation method and application thereof, and relates to the technical field of materials. The HPC-DPCC composite structure comprises a plurality of single-layer plates, and a heating network structure is arranged between every two adjacent single-layer plates. The single-layer plate is prepared from an HPC-DPCC composite material, and the HPC-DPCC composite material comprises a temperature acoustic impedance matching material and a multi-layer phase change energy absorption microcapsule layer; the multi-layer phase change microcapsule layer comprises an inner-layer microcapsule, an outer-layer microcapsule coated on the surface of the inner-layer microcapsule and a heat insulation layer coated on the surface of the outer-layer microcapsule. The HPC-DPCC composite structure disclosed by the invention has excellent mechanical property, heat-conducting property and electric conductivity, can remarkably improve the efficiency of noise isolation and impact energy absorption, and is applied to the submarine, so that the submarine has excellent sound stealth performance and impact resistance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of materials, in particular to a HPC-DPCC composite structure with acoustic stealth performance and impact resistance performance and a preparation method and application thereof. BACKGROUND

[0002] Currently, submarines have become an essential part of modern naval forces, playing a core role in maintaining national security and military deterrence. On the one hand, the acoustic stealth technology of submarines is one of the core technologies to ensure their concealment in enemy detection systems. In modern naval warfare, the stealth of submarines directly affects their survivability and strike effectiveness. Since submarines rely on underwater operations, the only exposure point is the noise transmitted through sound waves. Therefore, the application of acoustic stealth technology enables submarines to significantly reduce their acoustic signals, thereby avoiding being discovered by enemy sonar systems and improving the combat advantage and survival probability of submarines. On the other hand, the impact resistance performance of submarines is crucial for their survivability, especially when encountering underwater explosions, torpedo attacks, or mine impacts. Good impact resistance can effectively reduce the damage of shock waves to the hull and internal equipment, ensuring the safety of the crew and maintaining the basic combat capability of the submarine. In a high-intensity underwater battlefield environment, a submarine with excellent impact resistance can significantly improve its survivability and enhance the reliability of continuous combat during wartime.

[0003] The current acoustic stealth structure and impact resistance structure of submarines are usually designed independently. Although this design approach can meet the performance requirements of each structure to some extent, it also has some problems, especially in terms of overall combat capability and system integration of submarines. Acoustic stealth technology and impact resistance design focus on different needs of submarines in underwater environments, and the balance and coordination between the two are not always ideal, which may constrain the overall performance of submarines.

[0004] Firstly, the main goal of acoustic stealth design for submarines is to evade enemy sonar detection by reducing the noise radiation of submarines, which usually includes reducing mechanical noise of submarines, avoiding sound wave reflection, and optimizing the streamline design of the hull, etc. In this process, the external and internal structures of submarines need to use materials with strong sound absorption capacity, while reducing the vibration of noise sources. This requires submarines to be extremely meticulous in material selection and structural layout, especially the use of lightweight, high-performance composite materials with strong sound absorption. However, acoustic stealth materials usually do not have excellent impact resistance, which may affect the impact resistance of submarines when optimizing acoustic stealth.

[0005] Secondly, the anti-shock design of the submarine focuses on enhancing the tolerance of the submarine when it encounters a shock underwater, ensuring that the submarine will not be destroyed when it is subjected to an explosion shock, a collision or a mine attack. The anti-shock design usually requires the use of a thick pressure-resistant shell, a honeycomb structure and separate cabin sections, etc. Although these designs can effectively improve the anti-shock capability of the submarine, they often increase the overall weight and stiffness of the submarine. Reinforcing structures, increasing separate cabin sections and using high-strength composite materials may conflict with the acoustic stealth design, because these reinforcing measures often increase the noise radiation of the submarine body, affecting the acoustic stealth performance.

[0006] Since the acoustic stealth and anti-shock designs are usually carried out independently, a trade-off between the two aspects is often needed. In order to improve the anti-shock performance, the thickness of the submarine body or the use of more robust materials is often increased, which may impair the acoustic stealth performance of the submarine to some extent. Conversely, if the acoustic stealth performance is excessively pursued, the anti-shock performance may be weakened. Therefore, the current design of the submarine has a certain contradiction between the two. SUMMARY

[0007] The purpose of the present application is to overcome the shortcomings of the prior art and provide an HPC-DPCC composite structure with acoustic stealth performance and anti-shock performance, as well as a preparation method and application thereof. The HPC-DPCC composite structure has excellent mechanical properties, thermal conductivity and electrical conductivity, can significantly improve the efficiency of noise isolation and shock energy absorption, and when applied to a submarine, the submarine has excellent acoustic stealth performance and anti-shock performance.

[0008] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows: In a first aspect, the present application provides an HPC-DPCC composite structure with acoustic stealth performance and anti-shock performance, which comprises a plurality of single-layer plates, and a heating network structure is arranged between adjacent single-layer plates. The single-layer plate is prepared from an HPC-DPCC composite material, and the HPC-DPCC composite material comprises a temperature-acoustic impedance matching material and a plurality of layers of phase change energy-absorbing microcapsules. The temperature-acoustic impedance matching material comprises a thermal phase change material and reinforcing fibers. The multi-layer phase change microcapsules comprise inner layer microcapsules, outer layer microcapsules coated on the surface of the inner layer microcapsules, and a heat insulation layer coated on the surface of the outer layer microcapsules.

[0009] The HPC-DPCC composite structure of the present application is a multifunctional composite structure coupled by the temperature-acoustic impedance matching material and the multi-layer phase change energy-absorbing microcapsules.

[0010] Preferably, the thickness of the single-layer plate is 3-5 mm.

[0011] Preferably, the thickness of the outer layer microcapsule is 100-1000 μm, for example, it can be 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 800 μm, 900 μm, 1000 μm, or a range consisting of any two of the above values.

[0012] Preferably, the thickness of the inner layer microcapsule is 50-100 μm, for example, it can be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, or a range consisting of any two of the above values.

[0013] Preferably, the thickness of the thermal insulation layer is 500-1000 μm, for example, it can be 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, or a range consisting of any two of the above values.

[0014] The multilayer phase change energy absorption microcapsule has good adjustability, and by controlling the thickness of each layer, the phase change rate and energy absorption efficiency can be further improved to meet different engineering application requirements.

[0015] The thickness of the outer layer microcapsule, the inner layer microcapsule, and the thermal insulation layer is tested by a scanning electron microscope (SEM) or an optical microscope.

[0016] Preferably, the thermal phase change material includes at least one of paraffin, stearic acid, cetyl alcohol, and polyethylene glycol.

[0017] Preferably, the reinforcing fiber includes at least one of carbon fiber, glass fiber, Kevlar fiber, and metal fiber.

[0018] More preferably, the metal fiber includes at least one of stainless steel fiber, copper fiber, and aluminum fiber.

[0019] Preferably, the aspect ratio of the reinforcing fiber is 100-500.

[0020] Preferably, the material of the heating network structure includes at least one of copper nanowire, carbon nanotube, graphene, aluminum nanowire, and nickel nanowire.

[0021] Preferably, the diameter of the material of the heating network structure is 5-10 nm, for example, it can be 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm, or a range consisting of any two of the above values.

[0022] Preferably, the shape of the heating network structure includes, but is not limited to, a spiral line, a snake tube, and a spider web.

[0023] Preferably, the HPC-DPCC composite structure includes but is not limited to 2-5 single-layer plates. Preferably, the outer layer microcapsule contains at least one of n-octadecane, hexadecane, methylhexadecane.

[0024] The outer layer microcapsule described above has moderate phase transition temperature and low trigger pressure, and is suitable for relieving lower intensity impact energy.

[0025] Preferably, the inner layer microcapsule contains at least one of erythritol, triglyceride, linseed oil, ammonium nitrate.

[0026] The inner layer microcapsule described above has higher phase transition enthalpy and higher trigger pressure, and is suitable for bearing higher intensity impact load.

[0027] Preferably, the raw material of the thermal insulation layer includes at least one of polytetrafluoroethylene dispersion, polytetrafluoroethylene, polyimide, and polydimethylsilane.

[0028] Preferably, the mass concentration of the polytetrafluoroethylene dispersion is 1-5%.

[0029] Preferably, the mass ratio of the thermal phase change material to the reinforcing fiber in the temperature-acoustic impedance matching material is (70-90):(10-30), for example, it can be 70:30, 80:20, 90:10, or a range composed of any two of the above values.

[0030] Preferably, the mass ratio of the temperature-acoustic impedance matching material to the multi-layer phase change energy-absorbing microcapsule in the HPC-DPCC composite material is 100:(5-20), for example, it can be or 100:5, 100:8, 100:10, 100:12, 100:15, 100:18, 100:20, or a range composed of any two of the above values.

[0031] In a second aspect, the present application also provides a preparation method of an HPC-DPCC composite structure with acoustic stealth performance and impact resistance, comprising the following steps: (1) Dissolve the preparation raw material of the outer layer microcapsule in solvent A to obtain solution A; dissolve the preparation raw material of the inner layer microcapsule in solvent B to obtain solution B; (2) Add solution A to the surfactant solution to obtain the outer layer microcapsule; (3) Add the outer layer microcapsule to solution B to obtain the double-layer microcapsule; (4) Dip the double-layer microcapsule into the raw material of the thermal insulation layer, and dry and solidify to obtain the multi-layer phase change energy-absorbing microcapsule; (5) mixing the thermal phase change material and the reinforcing fiber uniformly to obtain a suspension; then mixing the multi-layer phase change energy absorption microcapsules and the suspension uniformly to obtain the HPC-DPCC composite material; (6) pouring the HPC-DPCC composite material into a mold, taking out after solidification to obtain a single-layer plate; (7) embedding a heating network structure between adjacent single-layer plates to obtain the HPC-DPCC composite structure.

[0032] Preferably, the reaction temperature in the step (2) is 40-60℃, and the reaction time is 2-6h.

[0033] Preferably, the reaction temperature in the step (3) is 60-80℃, and the reaction time is 1-4h.

[0034] In the present application, the raw materials of the outer layer microcapsule are dissolved in the solvent A, then the surfactant is added to form a stable emulsion, and then the gelation reaction is initiated by heating. In this process, the solvent gradually volatilizes to form a stable outer layer microcapsule. The raw materials of the inner layer microcapsule are dissolved in the solvent to obtain a uniform solution B, then the outer layer microcapsule is added, and the inner layer microcapsule is combined with the outer layer microcapsule firmly by heating to form a double-layer microcapsule with an inner and outer double-layer structure. Then the double-layer microcapsule is immersed in the raw materials of the heat insulation layer to make the surface of the double-layer microcapsule coated with a layer of heat insulation layer, and the solvent is removed by drying to obtain a multi-layer phase change energy absorption microcapsule after solidification. Then the multi-layer phase change energy absorption microcapsule is added to the suspension of the thermal phase change material and the reinforcing fiber and mixed uniformly to obtain the HPC-DPCC composite material. Subsequently, the HPC-DPCC composite material is poured into a mold, and the single-layer plate is obtained after cooling and solidification. Finally, the heating network structure is embedded between adjacent single-layer plates to obtain the HPC-DPCC composite structure.

[0035] Preferably, the mass concentration of the solution A in the step (1) is 10-30%.

[0036] Preferably, the solvent A comprises at least one of dichloromethane, chloroform, cyclohexane, hexane, and benzene.

[0037] The above solvent is used in the present application to ensure that the outer layer microcapsule is uniformly dispersed in the solution without causing premature crystallization of the outer layer microcapsule.

[0038] Preferably, the mass concentration of the solution B in the step (1) is 5-20%.

[0039] Preferably, the solvent B comprises water or ethanol.

[0040] Preferably, the surfactant in the step (2) comprises at least one of cetyltrimethylammonium bromide, sodium dodecylbenzenesulfonate, polyvinyl alcohol, and polyoxyethylene ether.

[0041] Preferably, the mass concentration of the surfactant solution is 0.5-5%.

[0042] Preferably, the temperature of the impregnation in step (4) is 40-60℃, and the impregnation time is 0.5-2h.

[0043] Preferably, the mass of the multilayer phase change energy-absorbing microcapsules in step (5) accounts for 5-20% of the total mass of the suspension.

[0044] Preferably, the reinforcing fibers are subjected to oxidation treatment in step (5) by the following method: the reinforcing fibers are soaked in an oxidation solution for 0.5-2h, and then washed and dried.

[0045] When the reinforcing fibers are subjected to oxidation treatment, oxidation reaction occurs on the surface of the reinforcing fibers, forming polar groups such as carboxyl and hydroxyl groups, which helps to improve the interfacial bonding between the reinforcing fibers and the thermal phase change material.

[0046] Preferably, the oxidation solution includes at least one of concentrated nitric acid, concentrated sulfuric acid, and hydrogen peroxide solution.

[0047] Preferably, the reinforcing fibers are subjected to chemical modification in step (5) by the following method: the reinforcing fibers are mixed with a chemical modifier solution, and then reacted at room temperature-80℃ for 1-2h, and then washed and dried.

[0048] Preferably, the chemical modifier includes organosilane and / or epoxy groups; these reagents can form chemical bonds on the surface of the reinforcing fibers, which is conducive to the adhesion to the thermal phase change material.

[0049] The preparation of the outer microcapsules, the inner microcapsules, and the thermal insulation layer is not limited in the present application, as long as the purpose of the present application can be achieved.

[0050] In a third aspect, the present application also provides a use of the HPC-DPCC composite structure with acoustic stealth performance and impact resistance in a submarine, which can be used in the inter-bank sandwich, cover layer, internal shell, and other components of the submarine.

[0051] The HPC-DPCC composite structure can not only effectively provide good sound absorption effect, reduce the noise radiation of the submarine, and achieve good acoustic stealth performance, but also effectively absorb and disperse the energy brought by the explosion shock wave when encountering the explosion shock wave, and improve the anti-explosion performance of the submarine, thereby better protecting the survivability of the submarine in underwater combat. The core technology of the HPC-DPCC composite structure is the combination of the phase change microcapsule and the temperature acoustic impedance matching technology. The temperature acoustic impedance matching technology optimizes the acoustic performance of the structural material. The thermal phase change material changes phase (melts) when the temperature rises, thereby changing the acoustic impedance characteristics and optimizing the sound insulation effect. At the same time, the precise temperature control technology is adopted to achieve the best sound absorption performance in different environments.

[0052] In terms of anti-explosion performance, the HPC-DPCC composite structure can absorb part of the shock wave energy when encountering the explosion shock wave underwater by using the characteristics of the pressure-induced phase change microcapsule, thereby reducing the direct impact of the shock wave on the submarine structure. At the same time, the deformation and phase change process of the inner and outer microcapsules help to disperse the energy of the shock wave, so that the anti-explosion performance of the submarine is greatly improved. The design of this structure not only improves the survivability of the submarine, but also reduces the damage to the interior of the submarine when facing high-intensity attacks, ensuring the safety of personnel and equipment in the cabin of the submarine. At the same time, by combining the acoustic stealth and anti-explosion functions, this innovative structure effectively solves the performance contradiction of the submarine in these two aspects, and is expected to provide stronger protection for the combat performance of future submarines, making them more competitive and survivable in complex underwater environments.

[0053] Compared with the prior art, the HPC-DPCC composite structure has the following advantages: (1) The present application combines temperature acoustic impedance matching materials and inner-outer double-layer microcapsule materials to form a heat-induced phase change sound absorption and double-layer phase change microcapsule impact resistance coupled multifunctional composite material (HPC-DPCC). The structure of this composite material can significantly improve the efficiency of noise isolation and impact energy absorption. The core of the HPC-DPCC composite structure described in the present application is to achieve multifunctional comprehensive performance in the material through the synergistic effect of heat-induced phase change sound absorption and double-layer microcapsule impact resistance. First, the heat-induced response characteristics of the phase change material can significantly change its physical properties when the temperature changes, thereby effectively absorbing and attenuating sound wave energy. At the same time, through the design of the optimized temperature acoustic impedance matching material, the reflection of sound waves can be reduced, the absorption efficiency of sound can be improved, and the noise isolation effect can be further enhanced. Second, the introduction of the inner-outer double-layer microcapsule technology makes the material significantly enhanced in impact resistance. The inner microcapsule is filled with phase change material, and the outer microcapsule is wrapped with a low thermal conductivity material thermal insulation layer with excellent thermal insulation performance. Such design effectively prevents the material in the microcapsule from failing due to thermal phase change during the heating process. The inner-outer double-layer microcapsule can effectively absorb and disperse impact energy under the action of impact force, so that the composite material shows excellent impact resistance when facing external impact.

[0054] (2) The temperature acoustic impedance matching material described in the present application improves the performance of the material in different working environments by precisely adjusting the matching between temperature and acoustic impedance, thereby realizing the response to temperature change and the adjustment of acoustic impedance, and further optimizing the sound insulation effect and thermal management performance of the material. Specifically, the thermal phase change material has the characteristic of phase change within a certain temperature range: when the temperature rises, it changes from solid to liquid, causing a significant change in its physical properties, especially its acoustic impedance. This phase change process can effectively adjust the acoustic performance of the material, so that the material can adaptively adjust the sound propagation characteristics at different environmental temperatures, achieving good sound insulation effect. In order to enhance the thermal conductivity of the thermal phase change material, it is compounded with reinforcing fibers: reinforcing fibers have extremely high strength and good thermal conductivity, and have good mechanical properties, which can significantly improve the mechanical properties and thermal conductivity of the composite material. During the compounding of reinforcing fibers and thermal phase change material, reinforcing fibers not only provide the required mechanical support for the material and enhance its structural stability, but also effectively improve the thermal conductivity. This feature ensures that the thermal phase change material can respond quickly and stably to temperature changes, thereby making temperature control more accurate.

[0055] (3) The multi-layer phase change energy absorption microcapsule encapsulates phase change materials with different physical properties in layers, and realizes graded absorption and intelligent response to impact energy of different intensities through the synergistic effect of the outer microcapsule and the inner microcapsule. The core advantage lies in that different levels of phase change processes can be triggered according to different impact intensities, so that an efficient, controllable and continuous energy buffering effect can be achieved. Specifically, the outer microcapsule can undergo solid-liquid phase change under lower pressure conditions to absorb external impact energy. At the initial stage of impact, the outer microcapsule responds first, converts part of kinetic energy into latent heat, and effectively alleviates the risk of energy concentration and structural damage caused by the initial impact. Because its phase change temperature is moderate and the response is sensitive, it is very suitable for use as the first energy barrier to play a role in rapid response and energy absorption buffering in high-frequency low-amplitude shock waves. When the impact intensity exceeds the energy absorption capacity of the outer capsule, the inner microcapsule of the material will be activated. The inner capsule has stronger energy absorption capacity, and its phase change trigger pressure threshold is higher, so it is used to cope with higher intensity impact load.

[0056] Moreover, the multi-layer phase change energy absorption microcapsule has a double-layer microcapsule nesting structure, which realizes a graded response mechanism to impact loads of different intensities: only the outer microcapsule participates in the reaction when the impact is light, maintaining the integrity of the overall structure; when the impact intensity increases to a certain extent, the inner microcapsule is activated and starts deep energy absorption and buffering. This graded starting method not only improves the total energy absorption capacity of the material, but also avoids the problem of structural overload that may be caused by the concentrated release of energy in a short time.

[0057] Meanwhile, the present application can prevent failure caused by thermal phase change of the material in the microcapsule by coating a heat insulation layer on the surface of the outer microcapsule.

[0058] (4) The present application embeds a heating network structure between different single-layer plates, and heats the thermal phase change material by accurately controlling the flow of current. The heating network has good electrical conductivity and thermal conductivity, and can form a uniform heating network inside the material. During the heating process, the temperature can be accurately adjusted by controlling the flow of current, so that the phase change occurs within the preset temperature range. This heating method can quickly respond to changes in environmental temperature, ensuring that the material can maintain its phase change characteristics under different environmental conditions, thereby realizing dynamic adjustment of the sound insulation effect. BRIEF DESCRIPTION OF DRAWINGS

[0059] Figure 1 is a structural schematic diagram of the HPC-DPCC composite structure in Example 1 of the present application.

[0060] Figure 2 is a three-dimensional schematic diagram of the HPC-DPCC composite structure in Example 1 of the present application.

[0061] Figure 3 is a structural diagram of a multilayer phase change energy-absorbing microcapsule according to the present application.

[0062] Figure 4 is a shape diagram of a heating network structure according to an embodiment 1 of the present application.

[0063] Figure 5 is a shape diagram of a heating network structure according to an embodiment 2 of the present application.

[0064] Figure 6 is a shape diagram of a heating network structure according to an embodiment 3 of the present application. DETAILED DESCRIPTION

[0065] To better illustrate the purpose, technical scheme and advantages of the present application, the present application will be further described below in conjunction with specific embodiments, but the scope of protection and implementation mode of the present application are not limited thereto.

[0066] The materials, reagents and the like used in the following embodiments are commercially available reagents and materials unless otherwise specified.

[0067] Embodiment 1 The present embodiment discloses an HPC-DPCC composite structure with acoustic stealth performance and impact resistance, comprising two single-layer plates, a heating network structure being arranged between the two single-layer plates, as shown in Figures 1-2 The thickness of the single-layer plate is 3 mm.

[0068] The single-layer plate is prepared from an HPC-DPCC composite material, the HPC-DPCC composite material comprising a temperature acoustic impedance matching material and a multilayer phase change energy-absorbing microcapsule, the structure of the multilayer phase change energy-absorbing microcapsule being as shown in Figure 3

[0069] The temperature acoustic impedance matching material comprises a thermal phase change material and a reinforcing fiber; the thermal phase change material is paraffin, and the reinforcing fiber is carbon fiber.

[0070] The multilayer phase change microcapsule comprises an inner layer microcapsule, an outer layer microcapsule coated on the surface of the inner layer microcapsule, and a heat insulation layer coated on the surface of the outer layer microcapsule.

[0071] The thickness of the inner layer microcapsule is 80 μm; the raw material of the inner layer microcapsule is erythritol.

[0072] The thickness of the outer layer microcapsule is 500 μm; the raw material of the outer layer microcapsule is n-octadecane.

[0073] The thickness of the heat insulation layer is 600 μm; the raw material of the heat insulation layer is a polytetrafluoroethylene dispersion liquid, and the present application does not have a particular limitation on the source of the polytetrafluoroethylene dispersion liquid, as long as the purpose of the present application can be achieved. ​

[0074] The material of the heating network structure is copper nanowire, the diameter of the copper nanowire is 10 nm, and the shape is a snake-shaped tube, as shown in Figure 4 .

[0075] The embodiment also discloses a preparation method of the HPC-DPCC composite structure with the sound stealth performance and the impact resistance, and comprises the following steps: (1) dissolve n-octadecane in dichloromethane to obtain solution A, and the mass concentration of the solution A is 20%; dissolve erythritol in an ethanol solution to obtain solution B, and the mass concentration of the solution B is 10%; The carbon fiber is subjected to oxidation treatment in the following manner: the carbon fiber is soaked in concentrated nitric acid for 1 h, then the surface of the carbon fiber is washed clean with deionized water, and then the carbon fiber is dried in an oven at 80 DEG C for 2 h to ensure that no water remains on the surface of the carbon fiber.

[0076] (2) add the solution A into a hexadecyl trimethyl ammonium bromide solution with a mass concentration of 2%, and react at 50 DEG C for 4 h to obtain an outer layer microcapsule.

[0077] (3) add the outer layer microcapsule into the solution B, and react at 70 DEG C for 2 h to obtain a double-layer microcapsule.

[0078] (4) add the double-layer microcapsule into a polytetrafluoroethylene dispersion liquid with a mass concentration of 2%, and immerse at 50 DEG C for 1 h, dry to remove the solvent, and then perform light curing to obtain a multilayer phase change energy absorption microcapsule.

[0079] (5) melt the paraffin into a liquid state at 55 DEG C, then add the pretreated carbon fiber to mix uniformly through mechanical stirring, to obtain a suspension; the mass ratio of the paraffin to the carbon fiber is 80:20; then mix the multilayer phase change energy absorption microcapsule with a mass ratio of 10:100 and the suspension uniformly through mechanical stirring to obtain an HPC-DPCC composite material.

[0080] (6) pour the HPC-DPCC composite structure into a mold, cool to room temperature, and then solidify to obtain a single-layer plate.

[0081] (7) dry the single-layer plate to remove excess solvent, then lay copper nanowire on the surface of the single-layer plate, then place another single-layer plate on the surface of the copper nanowire, and then heat press and solidify to obtain the HPC-DPCC composite structure.

[0082] Embodiment 2 The embodiment discloses an HPC-DPCC composite structure with sound stealth performance and impact resistance, which comprises three single-layer plates, and a heating network structure is arranged between adjacent single-layer plates. The thickness of the single-layer plate is 3 mm.

[0083] The single-layer plate is prepared from an HPC-DPCC composite material, the HPC-DPCC composite material comprises a temperature acoustic impedance matching material and a multi-layer phase change energy absorption microcapsule, and a structure of the multi-layer phase change energy absorption microcapsule is as shown in Figure 3 .

[0084] The temperature acoustic impedance matching material comprises a thermal phase change material and reinforcing fibers; the thermal phase change material is stearic acid, and the reinforcing fibers are glass fibers.

[0085] The multi-layer phase change microcapsule comprises an inner layer microcapsule, an outer layer microcapsule coated on the surface of the inner layer microcapsule, and a heat insulation layer coated on the surface of the outer layer microcapsule.

[0086] The thickness of the inner layer microcapsule is 50 μm; and a raw material of the inner layer microcapsule is triglyceride.

[0087] The thickness of the outer layer microcapsule is 100 μm; and a raw material of the outer layer microcapsule is hexadecane.

[0088] The thickness of the heat insulation layer is 500 μm; and a raw material of the heat insulation layer is a polytetrafluoroethylene dispersion liquid.

[0089] The material of the heating network structure is a carbon nanotube, the diameter of the carbon nanotube is 5 nm, and the shape of the carbon nanotube is a spiral line, as shown in Figure 5 .

[0090] The embodiment also discloses a preparation method of the HPC-DPCC composite structure with the acoustic stealth performance and the impact resistance, and the preparation method comprises the following steps: (1) hexadecane is dissolved in chloroform to obtain solution A, and the mass concentration of the solution A is 10%; triglyceride is dissolved in an ethanol solution to obtain solution B, and the mass concentration of the solution B is 5%; glass fibers are subjected to oxidation treatment in the following manner: the glass fibers are soaked in concentrated sulfuric acid for 1 h, then the surface of the glass fibers is washed clean with deionized water, and then the glass fibers are dried in an oven at 80 ℃ for 2 h to ensure that no water remains on the surface of the glass fibers.

[0091] (2) solution A is added into a 1% sodium dodecylbenzenesulfonate solution, and reacted at 50 ℃ for 4 h to obtain an outer layer microcapsule.

[0092] (3) the outer layer microcapsule is added into solution B, and reacted at 70 ℃ for 2 h to obtain a double-layer microcapsule.

[0093] (4) the double-layer microcapsule is added into a 1% polytetrafluoroethylene dispersion liquid, and immersed at 50 ℃ for 1 h, and then dried to remove the solvent, and then subjected to photocuring to obtain a multi-layer phase change energy absorption microcapsule.

[0094] (5) stearic acid solution is added to the pretreated glass fiber, and mixed uniformly by mechanical stirring to obtain a suspension; the mass ratio of stearic acid to glass fiber is 90:10.

[0095] Then, the multi-layer phase change energy absorption microcapsules with a mass ratio of 20:100 are mixed uniformly with the suspension by mechanical stirring to obtain the HPC-DPCC composite material.

[0096] (6) The HPC-DPCC composite material is poured into a mold, and after cooling to room temperature, a single-layer plate is obtained after solidification.

[0097] (7) The single-layer plate is dried to remove excess solvent, then a first carbon nanotube is laid on the surface of the first single-layer plate, then a second single-layer plate is placed on the surface of the first carbon nanotube, then a second carbon nanotube is laid on the surface of the second single-layer plate, and finally a third single-layer plate is placed on the surface of the second carbon nanotube, and after hot pressing and solidification, an HPC-DPCC composite structure is obtained.

[0098] Example 3 The embodiment discloses an HPC-DPCC composite structure with acoustic stealth performance and impact resistance, comprising two single-layer plates, and a heating network structure is arranged between the two single-layer plates. The thickness of the single-layer plate is 3mm.

[0099] The single-layer plate is prepared from an HPC-DPCC composite material, and the HPC-DPCC composite material comprises a temperature acoustic impedance matching material and multi-layer phase change energy absorption microcapsules. Figure 3 The multi-layer phase change energy absorption microcapsules have a structure as shown in the figure.

[0100] The temperature acoustic impedance matching material comprises a thermal phase change material and a reinforcing fiber; the thermal phase change material is cetyl alcohol, and the reinforcing fiber is Kevlar fiber.

[0101] The multi-layer phase change microcapsules comprise an inner layer microcapsule, an outer layer microcapsule coated on the surface of the inner layer microcapsule, and a heat insulation layer coated on the surface of the outer layer microcapsule.

[0102] The thickness of the inner layer microcapsule is 100μm; the raw material of the inner layer microcapsule is linseed oil.

[0103] The thickness of the outer layer microcapsule is 1000μm; the raw material of the outer layer microcapsule is methylhexadecane.

[0104] The thickness of the heat insulation layer is 1000μm; the raw material of the heat insulation layer is polytetrafluoroethylene dispersion liquid.

[0105] The material of the heating network structure is aluminum nanowire, the diameter of the aluminum nanowire is 5nm, and the shape of the aluminum nanowire is spider web shape, as shown in the figure. Figure 6 ​

[0106] The embodiment also discloses a preparation method of the HPC-DPCC composite structure with the sound stealth performance and the impact resistance, comprising the following steps: (1) methylhexadecane is dissolved in cyclohexane to obtain solution A, and the mass concentration of the solution A is 30%; linseed oil is dissolved in an ethanol solution to obtain solution B, and the mass concentration of the solution B is 20%; The Kevlar fiber is subjected to oxidation treatment in the following manner: the Kevlar fiber is soaked in a hydrogen peroxide solution for 1 h, then the surface of the Kevlar fiber is washed clean with deionized water, and then the Kevlar fiber is dried in an oven at 80 DEG C for 2 h, so as to ensure that the surface of the Kevlar fiber is free of residual water.

[0107] (2) solution A is added to a polyoxyethylene ether solution with a mass concentration of 3%, and is reacted at 50 DEG C for 4 h to obtain an outer layer microcapsule.

[0108] (3) the outer layer microcapsule is added to solution B, and is reacted at 70 DEG C for 2 h to obtain a double-layer microcapsule.

[0109] (4) the double-layer microcapsule is added to a polytetrafluoroethylene dispersion liquid with a mass concentration of 5%, and is immersed at 50 DEG C for 1 h, and then is dried to remove the solvent, and is subjected to photocuring to obtain a multilayer phase change energy absorption microcapsule.

[0110] (5) cetyl alcohol is added to the pretreated Kevlar fiber, and is uniformly mixed by mechanical stirring to obtain a suspension; the mass ratio of the cetyl alcohol to the Kevlar fiber is 70:30; Then, the multilayer phase change energy absorption microcapsule with a mass ratio of 5:100 is uniformly mixed with the suspension by mechanical stirring to obtain an HPC-DPCC composite material.

[0111] (6) the HPC-DPCC composite structure is poured into a mold, and is cooled to room temperature, and then is solidified to obtain a single-layer plate.

[0112] (7) the single-layer plate is dried to remove the excess solvent, and then aluminum nanowires are laid on the surface of the single-layer plate, and then another single-layer plate is placed on the surface of the aluminum nanowires, and then the HPC-DPCC composite structure is obtained after heat pressing and solidification.

[0113] Example 4 The difference from the example 1 is that the shape of the heating network structure is a square, and the uniform heating network cannot be formed in the material, and then the HPC-DPCC composite structure cannot quickly respond to the change of the ambient temperature, and the sound stealth performance of the HPC-DPCC composite structure is reduced.

[0114] Example 5 The difference from Example 1 is that the mass ratio of the thermal phase change material and the reinforcing fiber in the temperature-acoustic impedance matching material is 95:5.

[0115] The content of the reinforcing fiber in Example 5 is lower than that in Example 1. In the process of compounding the reinforcing fiber and the thermal phase change material, the content of the reinforcing fiber is too low to provide sufficient mechanical support for the material, so that the mechanical properties and heat conduction capacity of the composite material are reduced, thereby reducing the mechanical properties of the HPC-DPCC composite structure.

[0116] Example 6 The difference from Example 1 is that the mass ratio of the thermal phase change material and the reinforcing fiber in the temperature-acoustic impedance matching material is 60:40.

[0117] The content of the thermal phase change material in Example 6 is lower than that in Example 1. When the temperature changes, the thermal phase change material cannot well absorb and attenuate acoustic wave energy, so that the noise isolation effect of the HPC-DPCC composite structure is affected.

[0118] Example 7 The difference from Example 1 is that the mass ratio of the temperature-acoustic impedance matching material (suspension) and the multilayer phase change energy absorption microcapsule in the HPC-DPCC composite material is 100:3.

[0119] The content of the multilayer phase change energy absorption microcapsule in Example 7 is lower than that in Example 1. Under the action of impact force, the multilayer phase change energy absorption microcapsule cannot effectively absorb and disperse impact energy, so that the impact resistance of the HPC-DPCC composite structure is reduced.

[0120] Example 8 The difference from Example 1 is that the mass ratio of the temperature-acoustic impedance matching material (suspension) and the multilayer phase change energy absorption microcapsule in the HPC-DPCC composite material is 100:25.

[0121] The content of the multilayer phase change energy absorption microcapsule in Example 8 is higher than that in Example 1. Due to the van der Waals force and hydrogen bond action between the microcapsules exceeding the dispersion effect of paraffin and the barrier effect of the fiber, the microcapsules are adsorbed and aggregated to form large-size agglomerates, which cannot be well dispersed and uniform with paraffin and carbon fiber, so that the performance of the HPC-DPCC composite structure is affected.

[0122] Comparative Example 1 The difference from Example 1 is that no carbon fiber is added in the temperature-acoustic impedance matching material, the structural stability of the HPC-DPCC composite structure is reduced, and the heat conduction efficiency of paraffin is also affected.

[0123] Comparative Example 2 Different from example 1, no thermal insulation layer is arranged in the multilayer phase change microcapsule, and the thermal induced phase change of the material in the multilayer phase change energy absorption microcapsule is invalid.

[0124] Comparative example 3 Different from example 1, no copper nanowire is arranged between the two single-layer plates, which cannot quickly respond to the change of the ambient temperature, so that the material cannot maintain its phase change characteristics under different environmental conditions, and further causes the HPC-DPCC composite structure to fail to dynamically adjust the sound insulation effect.

[0125] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, but not to limit the protection scope of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the essence and scope of the technical solutions of the present application.

Claims

1. An HPC-DPCC composite structure with acoustic stealth and impact resistance, characterized in that, The HPC-DPCC composite structure includes several single-layer plates, and a heating network structure is provided between adjacent single-layer plates. The single-layer plate is made of HPC-DPCC composite material, which includes temperature acoustic impedance matching material and multilayer phase change energy-absorbing microcapsules. The temperature acoustic impedance matching material includes thermal phase change material and reinforcing fiber; The multilayer phase change microcapsule includes an inner microcapsule, an outer microcapsule covering the surface of the inner microcapsule, and a heat insulation layer covering the surface of the outer microcapsule.

2. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 1, characterized in that, The thickness of the outer microcapsule is 100~1000 μm; And / or, the thickness of the inner microcapsule is 50~100 μm; And / or, the thickness of the insulation layer is 500~1000 μm; And / or, the thickness of the single-layer plate is 3~5 mm.

3. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 1, characterized in that, The shape of the heating network structure includes at least one of the following: spiral, serpentine, and spider web. And / or, the material of the heating network structure includes at least one of copper nanowires, carbon nanotubes, graphene, aluminum nanowires, and nickel nanowires.

4. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 3, characterized in that, The diameter of the material in the heating network structure is 5~10 nm.

5. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 1, characterized in that, The HPC-DPCC composite structure comprises 2 to 5 single-layer plates.

6. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 1, characterized in that, The thermal phase change material includes at least one of paraffin, stearic acid, cetyl alcohol, and polyethylene glycol; And / or, the reinforcing fiber includes at least one of carbon fiber, glass fiber, Kevlar fiber, and metal fiber.

7. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 1, characterized in that, The outer microcapsule contains at least one of n-octadecane, hexadecane, and methylhexadecane; And / or, the inner microcapsules contain at least one of erythritol, triglycerides, linseed oil, and ammonium nitrate; And / or, the raw material of the insulation layer includes at least one of polytetrafluoroethylene dispersion, perfluoroethylene, polyimide, and polydimethylsilane.

8. The HPC-DPCC composite structure with acoustic stealth and impact resistance as described in claim 1, characterized in that, The mass ratio of thermal phase change material to reinforcing fiber in the temperature acoustic impedance matching material is (70~90):(10~30). And / or, the mass ratio of temperature acoustic impedance matching material and multilayer phase change energy-absorbing microcapsules in the HPC-DPCC composite material is 100:(5~20).

9. A method for preparing an HPC-DPCC composite structure with acoustic stealth and impact resistance as described in any one of claims 1-8, characterized in that, Includes the following steps: (1) Dissolve the raw materials for the preparation of the outer microcapsule in solvent A to obtain solution A; dissolve the raw materials for the preparation of the inner microcapsule in solvent B to obtain solution B; (2) Solution A is added to the surfactant solution to react and obtain the outer microcapsules; (3) The outer microcapsule is added to solution B to react and obtain a double-layer microcapsule; (4) The double-layer microcapsules were impregnated in the raw material of the heat insulation layer, and after drying and curing, multilayer phase change energy-absorbing microcapsules were obtained; (5) Mix the thermal phase change material and reinforcing fiber evenly to obtain a suspension; then mix the multilayer phase change energy-absorbing microcapsules with the suspension evenly to obtain the HPC-DPCC composite material. (6) Pour the HPC-DPCC composite material into a mold, and remove it after curing to obtain a single-layer board; (7) A heating network structure is embedded between adjacent single-layer plates to obtain the HPC-DPCC composite structure.

10. The application of an HPC-DPCC composite structure with acoustic stealth and shock resistance as described in any one of claims 1-8 in a submarine.

Images