Laminated inductor component and electronic equipment

Abstract

The invention discloses a laminated inductor component. The laminated inductor component comprises a base body, two outer electrodes, multiple layers of inner electrodes and an air gap layer. The base body comprises two cover plates which are oppositely arranged in the first direction and a plurality of insulating layers. The multiple layers of inner electrodes are arranged in the base body, and the multiple layers of insulating layers and the multiple layers of inner electrodes are alternately arranged in the first direction. The air gap layer is arranged between the insulating layer adjacent to the air gap layer and the inner electrode, and is located in the preset area. The preset area refers to an area in continuous K layers of inner electrodes which are close to any cover plate in the multiple layers of inner electrodes and are counted from the inner electrode closest to the cover plate in the first direction, N is the total layer number of the inner electrodes, and the condition that 3K is smaller than or equal to N (K and N are positive integers) is met. The distribution state is beneficial for reducing the leakage magnetic flux phenomenon and maintaining the stability of the inductance value. In addition, the invention further discloses electronic equipment with the laminated inductor component.

Description

Technical Field

[0001] This application relates to the field of electronic components technology, and in particular to a multilayer inductor component and an electronic device. Background Technology

[0002] Multilayer inductors are key components used for filtering and energy storage. In related technologies, multilayer inductors mostly incorporate an air gap layer within the multilayer structure. This air gap layer is typically made of non-magnetic or low-permeability materials, serving to block the magnetic circuit and increase magnetic reluctance, thereby preventing magnetic saturation when a large current flows through the magnet. In actual manufacturing processes, to simplify the process and reduce design complexity, related technologies often configure the air gap layer based on a multilayer loop pattern. For example, when the multilayer loop pattern is an ABCD loop, or if there are multiple ABCD loops, an air gap layer is often mechanically placed at each specific loop layer (e.g., all A layers).

[0003] However, this design approach, based on ease of manufacturing, results in significant limitations and randomness in the spatial distribution of the air gap layer within the component body. The air gap layer is often randomly distributed in non-critical magnetic circuit areas of the inductor coil. This distribution may not only fail to improve the saturation current characteristics of the inductor but may also easily lead to problems such as increased leakage flux and excessive inductance attenuation. Summary of the Invention

[0004] This application discloses a multilayer inductor component and an electronic device that can improve the saturation current characteristics of the multilayer inductor component while also ensuring the stability of the inductance and maintaining the miniaturization of the overall structure.

[0005] To achieve the above objectives, in a first aspect, this application discloses a multilayer inductor component, comprising: The substrate includes two cover plates disposed opposite each other along a first direction, and multiple insulating layers stacked between the two cover plates along the first direction; Two external electrodes are disposed opposite to each other on the substrate; The multilayer internal electrode is disposed within the substrate, and the multilayer insulating layer and the multilayer internal electrode are alternately disposed along the first direction. The multilayer internal electrode includes an internal electrode that is electrically connected to the external electrode. An air gap layer is disposed between the insulating layer and the inner electrode adjacent to the air gap layer, and the air gap layer is located in a predetermined region; The preset region refers to the region within K consecutive layers of the inner electrodes that are close to any of the cover plates and are counted along the first direction starting from the inner electrode closest to the cover plate, where N is the total number of inner electrode layers, satisfying: 3K≤N; Where K and N are both positive integers.

[0006] As an optional implementation, the number of air gap layers located within the preset area is X, satisfying: X≤K.

[0007] Limiting the number of air gap layers X to no more than the reference number of inner electrode layers K in the region avoids excessive air gap layer placement in the area near the cover plate (e.g., the number of air gap layers is greater than the number of inner electrode layers in the preset region), thus preventing excessive attenuation of the inductance of the multilayer inductor component. This helps to maintain a balance between the anti-saturation capability and the stability of the inductance value of the multilayer inductor component.

[0008] As an optional implementation, the two cover plates include a first cover plate and a second cover plate, and the preset area includes a first sub-region near the first cover plate and a second sub-region near the second cover plate, and both the first sub-region and the second sub-region are provided with the air gap layer.

[0009] By introducing air gap layers at both ends of the substrate, the magnetic reluctance of the multilayer inductor is increased simultaneously in the high flux density regions at both ends of the magnetic circuit. This structure, with air gap layers in both the first and second sub-regions, can more uniformly disperse the magnetic field, thereby improving the saturation current characteristics of the multilayer inductor. Simultaneously, this structure with air gap layers at both ends also helps to balance the stress within the substrate, reducing the risk of delamination or cracking caused by differences in materials.

[0010] As an optional implementation, the multilayer inductor component further includes an intermediate region in which the air gap layer is not disposed; The intermediate region is configured as, in the first direction, the region defined by the first cover plate and the second cover plate, excluding the first sub-region and the second sub-region.

[0011] In the intermediate region, only an insulating layer and an inner electrode are alternately arranged, without an air gap layer made of non-magnetic or low-magnetic material. This distribution structure ensures the continuity of the insulating layer in the central region of the substrate. Since the central region of an inductor coil is usually where the magnetic flux is most concentrated, omitting an air gap layer in this intermediate region helps avoid magnetic leakage caused by interrupting the central magnetic circuit, thus helping to maintain the stability of the inductance in the central region of the substrate.

[0012] As an optional implementation, the number of air gap layers located in the preset area is X, and the total number of inner electrode layers is N, satisfying: X≤2 / 3N.

[0013] This quantitative relationship limits that the total number of air gap layers shall not exceed 2 / 3 of the total number of inner electrodes. By controlling the number of layers X of the air gap layer within this range, the ratio of the air gap layer to the magnetic insulation layer inside the substrate is maintained at a reasonable balance, neither causing too much decrease in the magnetic permeability of the entire stacked inductor component due to introducing too many air gap layers, nor sacrificing too much inductance while effectively increasing the magnetic reluctance of the magnetic circuit through a sufficient number of air gap layers, thus being beneficial to improving the saturation current characteristics of the stacked inductor component.

[0014] As an optional implementation manner, the thickness of the air gap layer along the first direction is T1, and the thickness of the inner electrode along the first direction is T2, satisfying: T1 < T2.

[0015] The thickness T1 of the air gap layer along the first direction is less than the thickness T2 of the inner electrode along the first direction.

[0016] Since the stacked inductor component has requirements for the overall height, if the thickness of the air gap layer is too large, it will cause the overall size of the device to exceed the design standard or occupy the space of the insulation layer and the inner electrode. And the setting of T1 < T2 is beneficial to achieving better saturation current characteristics without significantly increasing the total thickness of the substrate, thus being beneficial to maintaining the miniaturization of the stacked inductor component. In addition, the thinner air gap layer is also beneficial to reducing the risk of insufficient interlayer bonding force, and thus is beneficial to improving the structural stability of the stacked inductor component.

[0017] As an optional implementation manner, via holes are provided on multiple layers of the insulation layer, and multiple layers of the inner electrodes are sequentially connected head to tail through connection conductors passing through the via holes to form an inductance coil arranged in a spiral manner.

[0018] Between two adjacent layers of inner electrodes, the tail end of one layer of inner electrode is connected to the head end of another layer of inner electrode through a connection conductor, and so on, so that multiple layers of inner electrodes are sequentially connected head to tail in the first direction perpendicular to the plane of the insulation layer. This structure enables multiple layers of inner electrodes to jointly form an inductance coil spirally extending in the first direction, which is beneficial to increasing the effective number of turns of the coil within a limited package volume.

[0019] As an optional implementation manner, in the projection plane along the first direction, the outer peripheral contour of the air gap layer is larger than the inner edge contour of the inner electrode.

[0020] Since multiple layers of inner electrodes form an inductance coil by spiral winding, a central hollowed-out area is formed by enclosing in the center of this inductance coil, and the inner edge contour of the inner electrode is the boundary of this central hollowed-out area. And the air gap layer is a continuous solid layer, and its outer peripheral contour in the first direction is larger than the inner edge contour of the inner electrode. This can enable the air gap layer to completely cover the main magnetic flux path inside the inductance coil, thus being beneficial to preventing the magnetic lines of force from leaking from the edge of the air gap layer.

[0021] Secondly, this application discloses a multilayer inductor component, comprising: The substrate includes two cover plates disposed opposite each other along a first direction, and multiple insulating layers stacked between the two cover plates along the first direction; Two external electrodes are disposed opposite to each other on the substrate; The multilayer internal electrode is disposed within the substrate, and the multilayer insulating layer and the multilayer internal electrode are alternately disposed along the first direction. The multilayer internal electrode includes an internal electrode that is electrically connected to the external electrode. An air gap layer is disposed between the insulating layer adjacent to the air gap layer and the inner electrode, and the air gap layer is disposed on part or all of the insulating layer in a predetermined area near any of the cover plates; The number of insulating layers covered by the preset area in the first direction is M, which does not exceed one-third of the total number of insulating layers N; The total number of insulating layers is the same as the total number of inner electrode layers, and M and N are both positive integers.

[0022] The distribution of this air gap layer allows non-magnetic or low-magnetic inductive blocking at both ends of the multilayer inductor, thereby increasing magnetic resistance without causing excessive inductance decay, delaying the occurrence of magnetic saturation, and thus helping to improve the saturation current characteristics of the multilayer inductor.

[0023] Thirdly, this application also discloses an electronic device comprising a multilayer inductor component as described in the first or second aspect.

[0024] Compared with the prior art, the beneficial effects of this application are: This application provides a multilayer inductor component. By placing the air gap layer in a predetermined region near the cover plate (within a continuous inner electrode layer satisfying 3K≤N), the magnetic reluctance of the substrate end along a first direction is increased, which helps to delay the magnetic saturation phenomenon of the magnetic material. Simultaneously, this distribution method, which avoids the central region, prevents the interruption of the central magnetic circuit, thereby helping to reduce leakage flux and maintain the stability of the inductance value. Therefore, this application can improve the saturation current characteristics of the multilayer inductor component while also ensuring the stability of the inductance, thus contributing to the improvement of the overall performance of electronic devices. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 These are front view structural diagrams of multilayer inductor components using different schemes in related technologies; Figure 2 This is an isometric view of the multilayer inductor component disclosed in the embodiments of this application; Figure 3 These are front view structural schematic diagrams of multilayer inductor components in various scenarios disclosed in the embodiments of this application; Figure 4 This is an exploded view of the structure of the multilayer inductor component disclosed in the embodiments of this application; Figure 5 This is a front view schematic diagram of another multilayer inductor component disclosed in the embodiments of this application; Figure 6 This is an exploded view of another multilayer inductor component disclosed in the embodiments of this application; Figure 7 This is a top view of the multilayer inductor component disclosed in the embodiments of this application; Figure 8 This is a front view structural schematic diagram of a multilayer inductor component according to different embodiments of this application; Figure 9 This is a schematic diagram of the electronic device disclosed in the embodiments of this application.

[0027] Explanation of reference numerals in the attached figures: Multilayer inductor component - 100; First side surface - 101; Second side surface - 102; First end face - 103; Second end face - 104; Bottom surface - 105; Top surface - 106; Electronic device - 200; Substrate - 10; Cover plate - 11; First cover plate - 11a; Second cover plate - 11b; Insulating layer - 13; Through hole - 131; First insulating layer - 13a; Second insulating layer - 13b; Third insulating layer - 13c; Fourth insulating layer - 13d; Fifth insulating layer - 13e; Sixth insulating layer - 13f; External electrode - 20; Inner electrode - 30; First inner electrode - 30a; Second inner electrode - 30b; Third inner electrode - 30c; Fourth inner electrode - 30d; Fifth inner electrode - 30e; Sixth inner electrode - 30f; Inductor coil - 33; Connecting conductor - 331; Inner edge contour of inner electrode - 30p; Air gap layer - 40; First air gap layer - 40a; Second air gap layer - 40b; Outer periphery contour of air gap layer - 40p; Preset region - Z; First sub-region - Z1; Second sub-region - Z2; Middle region - Z3; First direction - F1; Second direction - F2; Third direction - F3; Thickness of air gap layer along the first direction - T1; Thickness of inner electrode along the first direction - T2. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] In this application, the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0030] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "installation," "setting," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0032] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0033] As described in the background section of this application, in order to improve the saturation current characteristics of multilayer inductors, an air gap layer made of non-magnetic or low-permeability material is usually added to its internal structure. However, the inventors have found through experiments that the specific distribution of the air gap layer in the multilayer structure has a significant impact on the performance of the product, and existing conventional arrangements often fail to achieve the expected anti-saturation effect.

[0034] For example, such as Figure 1 As shown, Figure 1 This is a front view structural diagram of a multilayer inductor component using different solutions in related technologies. Specifically, Figure 1 (a) illustrates a mechanical distribution scheme based on existing process cycle patterns (such as the ABCD cycle), in which an air gap layer is provided for each of the A, B, C, and D layers of the cycle. However, the inventors found that although this method introduces magnetic resistance overall, its effect on increasing the saturation current is not significant, and leakage flux is easily generated due to structural dispersion.

[0035] For example Figure 1 As shown in (b), Figure 1 (b) is a design limitation of the air gap layer due to the process cycle, where the air gap layer is concentrated in the middle region of the stacked structure. (That is, the air gap layer is only set in the electrode layer near the middle of the stacked structure in the stacking direction). Since the geometric center of the inductor coil is usually the central magnetic circuit region where the magnetic flux is most concentrated, introducing a non-magnetic or low-magnetic air gap layer at this location can easily lead to a decrease in magnetic circuit efficiency.

[0036] Based on this, this application discloses a multilayer inductor component and an electronic device. By setting the air gap layer 40 in a specific preset area near the cover plate (i.e., the end area of ​​the multilayer inductor component, and not in the middle area), the magnetic resistance is effectively increased in the critical region with high magnetic flux density while avoiding the central magnetic circuit to maintain the stability of the inductance, thereby improving the saturation current characteristics of the device.

[0037] The multilayer inductor and electronic device of this application will be described in detail below with reference to the accompanying drawings.

[0038] Please see Figures 2 to 4 , Figure 2 This is an isometric view of the multilayer inductor component 100 disclosed in the embodiments of this application. Figure 3 This is a front view schematic diagram of the multilayer inductor component 100 in various scenarios disclosed in the embodiments of this application. Figure 4 This is an exploded view of the structure of the multilayer inductor 100 disclosed in an embodiment of this application. The multilayer inductor 100 includes a substrate 10.

[0039] The multilayer inductor component 100 is generally rectangular parallelepiped in shape. The multilayer inductor component 100 includes: a first side surface 101 and a second side surface 102 facing each other; a first end surface 103 and a second end surface 104 facing each other; a bottom surface 105 connecting the first side surface 101 and the second side surface 102, and the first end surface 103 and the second end surface 104; and a top surface 106 facing the bottom surface 105. That is, the outer surface of the multilayer inductor component 100 is formed by the first side surface 101, the second side surface 102, the first end surface 103, the second end surface 104, the bottom surface 105, and the top surface 106. In addition, such as Figure 2 As shown, the first direction F1 is orthogonal to the bottom surface 105 and the top surface 106, and extends from the bottom surface 105 toward the top surface 106. The second direction F2 is orthogonal to the first end surface 103 and the second end surface 104, and extends from the first end surface 103 toward the second end surface 104. The third direction F3 is orthogonal to the first side surface 101 and the second side surface 102, and extends from the second side surface 102 toward the first side surface 101. The first direction F1 is also called the height direction of the multilayer inductor component 100, the second direction F2 is also called the length direction of the multilayer inductor component 100, and the third direction F3 is also called the width direction of the multilayer inductor component 100. The first direction F1, the second direction F2, and the third direction F3 are mutually orthogonal.

[0040] The substrate 10 includes two cover plates 11 disposed opposite each other along a first direction F1, and a multilayer insulating layer 13 stacked between the two cover plates 11 along the first direction F1. The multilayer inductor 100 is a cuboid. In this embodiment, the first direction F1 is taken as the height direction (i.e., the stacking direction) of the substrate 10 for illustration.

[0041] In some embodiments, the multilayer inductor 100 includes two external electrodes 20 disposed opposite to each other on the substrate 10 along the second direction F2, and the two external electrodes are respectively disposed on the first end face and the second end face of the substrate 10.

[0042] It is understood that, of the two external electrodes, one electrode may be an L-shaped terminal extending from the first end face to the bottom face, and the other may be an L-shaped terminal extending from the second end face to the bottom face. Alternatively, one of the external electrodes may be a C-shaped terminal extending from the top face along the first end face to the bottom face, and the other external electrode may be a C-shaped terminal extending from the top face along the second end face 104 to the bottom face.

[0043] In some embodiments, the multilayer inductor 100 further includes multiple inner electrodes 30 disposed within the substrate 10, and multiple insulating layers 13 and multiple inner electrodes 30 are alternately disposed along a first direction F1. The multiple inner electrodes 30 include an inner electrode 30 electrically connected to the outer electrode 20.

[0044] like Figure 4 As shown, in some embodiments, the multilayer insulating layer 13 is provided with a through hole 131, and the multilayer inner electrodes 30 are connected end to end through the connecting conductor 331 passing through the through hole 131 to form a spirally arranged inductor coil 33.

[0045] Specifically, between two adjacent inner electrode layers 30, the tail end of one inner electrode layer 30 is connected to the head end of another inner electrode layer 30 via a connecting conductor 331, and so on, so that the multiple inner electrode layers 30 are connected end to end in the first direction F1 perpendicular to the plane of the insulating layer 13. This structure allows the multiple inner electrode layers 30 to collectively form an inductor coil 33 that spirals along the first direction F1, which is beneficial for increasing the effective number of turns of the coil within a limited package volume.

[0046] It is understandable that the via 131 usually refers to a microhole formed by drilling on the unsintered insulating layer 13.

[0047] It is understandable that the connecting conductor 331 usually refers to the conductive paste (such as silver paste) filling the through hole 131, which fuses with the inner electrode 30 material during the co-firing process to form an integrated conductive channel.

[0048] It is understandable that sequential connection means that the current flows from the inner electrode 30 of the upper layer, enters the inner electrode 30 of the lower layer through the connecting conductor 331, and maintains the same direction of current, such as both being counterclockwise or both being clockwise.

[0049] Understandably, the inductor coil 33 has two leads, which are typically formed by the uppermost and lowermost inner electrodes 30 extending to opposite end faces of the substrate 10. Two outer electrodes 20 cover these two end faces to cover and contact the leads, thereby achieving electrical connection. This connection structure allows the outer electrodes 20 to connect the internally packaged inductor coil 33 into the circuitry of an external circuit board.

[0050] Please refer to the following: Figures 2 to 4 In some embodiments, the multilayer inductor 100 further includes an air gap layer 40, which is disposed between the insulating layer 13 adjacent to the air gap layer 40 and the inner electrode 30, and the air gap layer 40 is located in a preset region Z.

[0051] The preset region Z refers to the region within K consecutive layers of inner electrodes 30 that are closest to any cover plate 11 and are counted along the first direction F1, starting from the inner electrode 30 closest to the cover plate 11. In other words, if the two cover plates 11 are a first cover plate 11a (upper cover plate) and a second cover plate 11b (lower cover plate) that are opposite each other along the first direction F1, the preset region can be the region defined between the K consecutive layers of inner electrodes 30 counted along the first direction F1, starting from the inner electrode 30 closest to the first cover plate 11a, and the first cover plate 11a. Alternatively, it can also be the region defined between the K consecutive layers of inner electrodes 30 counted along the first direction F1, starting from the inner electrode 30 closest to the second cover plate 11b, and the second cover plate 11b.

[0052] If the total number of layers of the inner electrode 30 is N, then 3K≤N is satisfied, where K and N are both positive integers.

[0053] By limiting the distribution of the air gap layer 40 to a predetermined region Z satisfying 3K≤N, that is, the air gap layer 40 is located in the region close to the electrode layer of the cover plate 11, this distribution of the air gap layer 40 allows non-magnetic or low-magnetic inductive blocking at both ends of the multilayer inductor component 100. This increases the magnetic reluctance without causing excessive attenuation of the inductance, delays the occurrence of magnetic saturation, and thus helps to improve the saturation current characteristics of the multilayer inductor component 100.

[0054] It is understood that the preset region Z refers to the region in the multilayer inner electrode 30 that is close to any of the cover plates 11, which can specifically include three cases: In some embodiments, such as Figure 3 In (a), the air gap layer 40 is only disposed within a preset region Z located near the first cover plate 11a along the first direction F1. For example, when the total number of inner electrode layers N is 3 (satisfying 3K≤3), the value of K is 1, and the preset region Z is limited to the first inner electrode layer 30 closest to the first cover plate 11a. When N is 5 (satisfying 3K≤5), the value of K is 1, and the preset region Z is limited to the first inner electrode layer 30 closest to the first cover plate 11a. When N is 7 (satisfying 3K≤7), the value of K can be 1 or 2, and the preset region Z can cover up to the first to second inner electrode layers 30 counted from the first cover plate 11a.

[0055] In other embodiments, such as Figure 3In (b), the air gap layer 40 is only disposed within a preset region Z located near the second cover plate 11b along the first direction F1. For example, when the total number of inner electrode layers N is 3 (satisfying 3K≤3), the value of K is 1, and the preset region Z is limited to the first inner electrode 30 closest to the second cover plate 11b. When the total number of inner electrode layers N is 5 (satisfying 3K≤5), the value of K is 1, and the preset region Z is limited to the first inner electrode 30 closest to the second cover plate 11b. When N is 7 (satisfying 3K≤7), the value of K can be 1 or 2, and the preset region Z can cover up to the first to second inner electrode layers 30 counted from the second cover plate 11b.

[0056] In some other embodiments, such as Figure 3 In (c), the air gap layer 40 is simultaneously disposed in a preset region Z near the first cover plate 11a along the first direction F1 and in a preset region Z near the second cover plate 11b along the first direction F1. For example, when the total number of inner electrode layers N is 3 (satisfying 3K≤3), the value of K is 1, and the preset region Z is respectively defined as the first inner electrode 30 closest to the first cover plate 11a and the first inner electrode 30 closest to the second cover plate 11b. When the total number of inner electrode layers N is 5 (satisfying 3K≤5), the value of K is 1, and the preset region Z is respectively defined as the first inner electrode 30 closest to the first cover plate 11a and the first inner electrode 30 closest to the second cover plate 11b. When N is 7 (satisfying 3K≤7), the value of K can be 1 or 2. At this time, the preset area Z can cover the inner electrodes 30 of the first to second layers from the first cover plate 11a and the inner electrodes 30 of the first to second layers from the second cover plate 11b.

[0057] It is understood that in the layer structure including the air gap layer 40, the air gap layer 40 is located between the adjacent insulating layer 13 and the inner electrode 30, that is, the air gap layer 40 is directly attached to the surface of the insulating layer 13, while the inner electrode 30 is disposed on the side of the air gap layer 40 away from the insulating layer 13. In the first direction F1, the insulating layer 13, the air gap layer 40 and the inner electrode 30 are arranged alternately in sequence, so that the inner electrode 30 does not directly contact the insulating layer 13 below.

[0058] It is understood that the preset region Z only defines the maximum area where the air gap layer 40 is allowed to exist (i.e., the range of the first K layers), and does not limit the air gap layer 40 to exist on every insulating layer 13 within the preset region Z. The specific layer location and quantity distribution of the air gap layer 40 within the preset region Z can be set according to actual needs. For example, when the total number of inner electrode layers N is 9, and according to the formula 3K≤9, then K is 3, the preset region Z covers the first 3 inner electrode layers 30 (i.e., the 1st, 2nd, and 3rd layers) counting from the cover plate 11. Within this preset region Z, the air gap layer 40 can be set only at the 1st layer, or only at the 2nd layer, or only at the 3rd layer; or, the air gap layer 40 can be set simultaneously at the 1st and 2nd layers, or simultaneously at the 1st, 2nd, and 3rd layers. In other words, as long as the air gap layer 40 is located within the preset region Z from the first layer to the Kth layer, whether it is a single layer or a combination of multiple layers, it falls within the preset region Z.

[0059] It is understood that the numerical relationship 3K≤N includes various proportions of the distribution range of the air gap layer 40. The range covered by the preset region Z may include, but is not limited to: each 1 / 3 electrode layer near the cover plate 11 (i.e., 3K≤N), each 1 / 4 electrode layer near the cover plate 11 (i.e., 4K≤N), each 1 / 5 electrode layer near the cover plate 11 (i.e., 3K≤N), and each 1 / 6 electrode layer near the cover plate 11 (i.e., 6K≤N), etc. This embodiment does not make specific limitations on this.

[0060] Understandably, the air gap layer 40 is typically made of non-magnetic ceramic materials (such as glass glaze or non-magnetic ferrite), while the inner electrode 30 is typically made of silver (Ag) or a silver-palladium alloy.

[0061] In some embodiments, such as Figure 4 As shown, the two cover plates 11 include a first cover plate 11a and a second cover plate 11b. The first cover plate 11a and the second cover plate 11b can be a single-layer structure or a multi-layer structure, and the specific number of layers is not limited. For example... Figure 4 In the case where both the first cover plate 11a and the second cover plate 11b are multi-layered (two-layered), the preset area Z includes a first sub-area Z1 near the first cover plate 11a and a second sub-area Z2 near the second cover plate 11b. Both the first sub-area Z1 and the second sub-area Z2 are provided with an air gap layer 40.

[0062] Specifically, along the first direction F1, the first cover plate 11a and the second cover plate 11b are located on opposite sides of the substrate 10, and the air gap layer 40 is disposed within several electrode layer gaps in the first sub-region Z1 and within several electrode layer gaps adjacent to the second sub-region Z2. The first sub-region Z1 generally corresponds to the range of the inner electrodes 30 from the first layer to the Kth layer, counting inward from the first cover plate 11a, and the second sub-region Z2 generally corresponds to the range of the inner electrodes 30 from the first layer to the Kth layer, counting inward from the second cover plate 11b.

[0063] By introducing air gap layers 40 at both ends of the substrate 10, the magnetic reluctance of the multilayer inductor 100 is increased simultaneously in the high magnetic flux density regions at both ends of the magnetic circuit. This structure, where air gap layers 40 are present in both the first sub-region Z1 and the second sub-region Z2, can more uniformly disperse the magnetic field, thereby improving the saturation current characteristics of the multilayer inductor 100. Simultaneously, this structure, with air gap layers 40 distributed at both ends, also helps to balance the stress within the substrate 10, reducing the risk of delamination or cracking due to differences in materials.

[0064] It is understandable that the number of air gap layers 40 in the first sub-region Z1 can be the same as or different from the number of air gap layers 40 in the second sub-region Z2. For example, to achieve structural symmetry, the number of air gap layers 40 in the first sub-region Z1 and the second sub-region Z2 can be configured to be equal. When adapting to a specific magnetic circuit design, the number of air gap layers 40 in the first sub-region Z1 can also be more or less than the number of air gap layers 40 in the second sub-region Z2.

[0065] It is understandable that the presence of an air gap layer 40 in both the first sub-region Z1 and the second sub-region Z2 means that at least one air gap layer 40 is located within the first sub-region Z1, and simultaneously, at least one air gap layer 40 is located within the second sub-region Z2. For example, when the total number of inner electrode layers N is 7, according to the constraint 3K≤N, the maximum integer value of K is 2. In this case, the first sub-region Z1 covers the first and second layers of inner electrodes 30 counting from the first cover plate 11a, and the second sub-region Z2 covers the first and second layers of inner electrodes 30 counting from the second cover plate 11b. In this case, the provision of an air gap layer 40 in both the first sub-region Z1 and the second sub-region Z2 can be manifested as follows: an air gap layer 40 is provided at the first layer near the first cover plate 11a, and an air gap layer 40 is also provided at the first layer near the second cover plate 11b; or, an air gap layer 40 is provided at both the first and second layers near the first cover plate 11a, and an air gap layer 40 is also provided at the second layer near the second cover plate 11b.

[0066] In some embodiments, such as Figure 5 As shown, Figure 5This is a front view schematic diagram of another multilayer inductor component 100 disclosed in an embodiment of this application. The multilayer inductor component 100 also includes an intermediate region Z3, in which no air gap layer 40 is disposed. The intermediate region Z3 is configured as the region other than the first sub-region Z1 and the second sub-region Z2 within the area defined by the first cover plate 11a and the second cover plate 11b in the first direction F1.

[0067] Specifically, within the intermediate region Z3, only the insulating layer 13 and the inner electrode 30 are alternately arranged, without the air gap layer 40 made of non-magnetic or low-magnetic material. This distribution structure ensures the continuity of the insulating layer 13 in the central region of the substrate 10. Since the central region of the inductor coil 33 is typically the area with the highest magnetic flux, omitting the air gap layer 40 in this intermediate region Z3 helps avoid magnetic leakage caused by interrupting the central magnetic circuit, thereby helping to maintain the stability of the inductance in the central region of the substrate 10.

[0068] For the case where both the first sub-region Z1 and the second sub-region Z2 of the multilayer inductor component 100 have air gap layers 40, but the intermediate region Z3 does not have an air gap layer 40, the following is a specific embodiment with a structure of six insulating layers 13: Please refer to Figure 6 , Figure 6 This is a three-dimensional exploded view of another multilayer inductor component 100 disclosed in this application embodiment. When N is 6, the substrate 10 of the multilayer inductor component 100 includes a second cover plate 11b as a base and a first cover plate 11a as a top cover. Between the second cover plate 11b and the first cover plate 11a, six insulating layers 13 are sequentially stacked along the first direction F1, namely the first insulating layer 13a, the second insulating layer 13b, the third insulating layer 13c, the fourth insulating layer 13d, the fifth insulating layer 13e, and the sixth insulating layer 13f.

[0069] In this stacked structure, the second sub-region Z2 near the second cover plate 11b is mainly composed of the layers containing the first insulating layer 13a and the second insulating layer 13b. A first air gap layer 40a and a first inner electrode 30a are disposed on the first insulating layer 13a, with the first air gap layer 40a located between the first insulating layer 13a and the first inner electrode 30a. The third insulating layer 13c and the fourth insulating layer 13d constitute the intermediate region Z3. A second inner electrode 30b is disposed on the second insulating layer 13b, a third inner electrode 30c is disposed on the third insulating layer 13c, a fourth inner electrode 30d is disposed on the fourth insulating layer 13d, and a fifth inner electrode 30e is disposed on the fifth insulating layer 13e.

[0070] No air gap layer 40 is provided between the second insulating layer 13b, the third insulating layer 13c, the fourth insulating layer 13d, and the fifth insulating layer 13e and their respective corresponding inner electrodes 30, thus ensuring the continuity of the magnetic circuit in the middle region. The first sub-region Z1 near the first cover plate 11a is mainly composed of the layers where the fifth insulating layer 13e and the sixth insulating layer 13f are located. A second air gap layer 40b and a sixth inner electrode 30f are provided on the sixth insulating layer 13f, and the second air gap layer 40b is located between the sixth insulating layer 13f and the sixth inner electrode 30f. This structural state is conducive to maintaining a high inductance in the coil region while effectively controlling the leakage magnetic field effect, thereby being conducive to improving the saturation current characteristics.

[0071] It can be understood that not providing the air gap layer 40 means that at the interface of any two adjacent layer structures (such as between the insulating layer 13 and the inner electrode 30) in the middle region Z3, it is filled with a magnetic material or in direct contact, and there is no non-magnetic printing layer or low magnetic permeability blocking layer.

[0072] In some embodiments, such as Figure 5 As shown, the thickness of the air gap layer 40 along the first direction F1 is T1, and the thickness of the inner electrode 30 along the first direction F1 is T2, satisfying: T1 < T2.

[0073] Specifically, the thickness T1 of the air gap layer 40 along the first direction F1 is less than the thickness T2 of the inner electrode 30 along the first direction F1.

[0074] Since the stacked inductor component 100 has requirements for the overall height, if the thickness of the air gap layer 40 is too large, it will cause the overall size of the device to exceed the design standard or squeeze the space of the insulating layer 13 and the electrode. The setting of T1 < T2 is conducive to achieving good saturation current characteristics without significantly increasing the total thickness of the substrate 10, thereby being conducive to maintaining the miniaturization of the stacked inductor component 100. In addition, the thinner air gap layer 40 is also conducive to reducing the risk of insufficient interlayer bonding force and improving the structural stability of the stacked inductor component 100.

[0075] It can be understood that although T1 < T2, the specific value of T1 cannot be infinitely small, that is, 0 < T1 < T2, and it needs to maintain the minimum effective thickness to form a continuous physical blocking layer.

[0076] In some embodiments, such as Figure 7 As shown, in the projection plane along the first direction F1, the outer peripheral contour 40p of the air gap layer 40 is larger than the inner edge contour 30p of the inner electrode 30.

[0077] Specifically, the multilayer inner electrodes 30 are spirally wound to form an inductor coil 33, with a centrally hollowed-out region enclosed in the center of the inductor coil 33. The inner edge contour 30p of the inner electrodes 30 forms the boundary of this centrally hollowed-out region. The air gap layer 40 is configured as a continuous solid layer, with its outer peripheral contour 40p in the first direction F1 being larger than the inner edge contour 30p of the inner electrodes 30. This allows the air gap layer 40 to completely cover the main magnetic flux path inside the inductor coil 33, which helps prevent magnetic lines of force from leaking from the edges of the air gap layer 40.

[0078] It is understood that the shape of the air gap layer 40 can be a rectangle that matches the cross-section of the substrate 10, or it can be a circle or an ellipse, as long as it can cover the inner edge contour 30p of the inner electrode 30. This embodiment does not make specific limitations on this.

[0079] In some embodiments, the number of air gap layers 40 located in the preset region Z is X, satisfying: X≤K.

[0080] Specifically, the number of air gap layers 40 within the preset region Z is defined as X, and the number of inner electrode layers 30 covered by the preset region Z is defined as K. Both X and K are positive integers, and they satisfy the numerical relationship: X ≤ K. Limiting the number of air gap layers 40 X to no more than the reference number of inner electrode layers K within this region avoids excessive placement of air gap layers 40 in the area near the cover plate 11, thereby preventing excessive attenuation of the inductance of the multilayer inductor component 100. This helps maintain a balance between the anti-saturation capability and the stability of the inductance value of the multilayer inductor component 100.

[0081] Understandably, the specific cases satisfying X≤K are as follows: For example, when the number of layers K in the preset region Z is 3, the number of layers X of the air gap layer 40 within the preset region Z can be designed as 1, 2, or 3 layers. When the number of layers K in the preset region Z is 5, the number of layers X of the air gap layer 40 within the preset region Z can be designed as 1, 2, 3, 4, or 5 layers.

[0082] It is understandable that when X equals K (i.e., X=K), it means that an air gap layer 40 is provided between each insulating layer 13 and the inner electrode 30 in the preset area Z. This high-density arrangement is beneficial to improving the saturation current characteristics and is suitable for scenarios with high requirements for high current resistance.

[0083] In some embodiments, the number of air gap layers 40 located in the preset region Z is X, and the total number of inner electrode layers 30 is N, satisfying: X≤2 / 3N.

[0084] Specifically, this quantitative relationship limits the total number of air gap layers 40 to no more than 2 / 3 of the total number of internal electrodes 30. By controlling the number X of air gap layers 40 within this range, the ratio of air gap layers 40 to magnetic insulating layers 13 inside the substrate 10 is maintained in a reasonable balance. This prevents the permeability of the entire multilayer inductor 100 from decreasing too much due to the introduction of too many air gap layers 40. At the same time, without sacrificing too much inductance, a sufficient number of air gap layers 40 can effectively increase the magnetic reluctance of the magnetic circuit, thereby improving the saturation current characteristics of the multilayer inductor 100.

[0085] The following section will compare and explain the influence parameters of the location of the air gap layer 40 and the range of the preset region Z in the multilayer inductor component 100 on the product's saturation current. Please refer to... Figure 1 and Figure 8 , Figure 8 This is a front view structural schematic diagram of the multilayer inductor component 100 of different embodiments of this application.

[0086] A multilayer inductor component 100 of the same model with the same number of internal electrode turns was selected as the test sample. While maintaining a consistent thickness for each individual air gap layer 40, the distribution position of the air gap layers 40 was varied, and the number of air gap layers 40 was adjusted accordingly to obtain a test product with a consistent inductance value. Figure 1 (a) in the middle is a conventional design of the air gap layer 40 in the inner electrode 30 based on the process cycle mode (e.g., priority single mode) in the prior art. This design makes the air gap layer present an irregularly interspersed distribution between the inner electrode layers (serial number 1). Figure 1 Scheme (b) is the one where the air gap layer 40 is concentrated in the middle of the inner electrode layer 30 (serial number 2). Figure 8 (a) shows a scheme in which the air gap layer 40 is concentrated in the region (number 3) near the first cover plate 11a and the second cover plate 11b. Figure 8 (b) shows a scheme where the air gap layer 40 is concentrated in the region near the first cover plate 11a or the second cover plate 11b (serial number 4). Under the same test environment, the saturation current change rate of the tested products is shown in Table 1 below: Table 1

[0087] In the above position influence test (as shown in Table 1), it can be clearly seen that the design of this application (serial number 3) has a greater advantage in saturation current characteristics compared with the uniformly distributed design (serial number 1) and the intermediate concentrated design (serial number 2).

[0088] In particular, as shown in Table 1 above, when the air gap layer 40 is placed near the middle of the electrode layer, the saturation current is reduced by 42% compared to the design with an irregular distribution. This is because the geometric center of the inductor coil 33 is usually the region with the highest magnetic flux density. While placing the air gap layer 40 in this region increases magnetic reluctance, it may also lead to a decrease in magnetic circuit efficiency, resulting in a decrease in the inductance of the device. Conversely, when the structure of this application is adopted, and the air gap layer 40 is placed near the two ends of the first cover plate 11a and the second cover plate 11b, the saturation current is increased by 15% compared to the uniformly distributed design. This indicates that this distribution method of placing the air gap layer 40 at both ends of the magnetic circuit is beneficial to more effectively delaying magnetic saturation behavior without disrupting the continuity of the magnetic circuit, thereby improving the current carrying capacity of the device. In addition, as can be seen from Serial No. 4, relying on only one side of the cover plate 11 also helps to increase the saturation current (+3%).

[0089] Furthermore, in order to verify the rationality of the preset region Z range (i.e., 3K≤N) in this application, while keeping the thickness of each individual air gap layer 40 consistent and the number of inner electrode turns consistent, a more detailed test was conducted on the specific distribution range of the air gap layer 40 in the region near the cover plate 11.

[0090] The specific experimental steps are as follows: First, the air gap layer 40 is concentrated in the 1 / 6, 1 / 5, 1 / 3, and 2 / 5 electrode layers near the first cover plate 11a and the second cover plate 11b, respectively. By adjusting the number of air gaps, four experimental product groups (denoted as A1, B1, C1, and D1) with inductance values ​​of a, b, c, and d are prepared. Second, for each experimental product group, corresponding control group products (denoted as A2, B2, C2, and D2) are prepared. The control group products adopt the conventional design based on the process cycle mode (e.g., priority single mode) in the existing technology. This design makes the air gap layer present an irregularly interspersed distribution between the inner electrode layers. Based on this, by changing the number of air gap layers in the control group, its inductance value is adjusted to a, b, c, and d respectively to ensure consistency with the inductance value of the experimental group.

[0091] Finally, the saturation current change rate of each experimental group product relative to its control group product with the same sensitivity value was calculated, namely A1 compared to A2 (serial number 1), B1 compared to B2 (serial number 2), C1 compared to C2 (serial number 3), and D1 compared to D2 (serial number 4). The test results are shown in Table 2 below: Table 2

[0092] As shown in Table 2, under the condition of maintaining the same inductance value, the improvement in saturation current is most significant when the air gap layer 40 is concentrated in the region near the cover plate (such as 1 / 6 electrode layer and 1 / 5 electrode layer), reaching 20% ​​and 16% respectively. This indicates that the closer the air gap layer 40 is to both ends of the substrate 10, the more beneficial it is to improving the rate of change of saturation current. When the distribution range of the air gap layer 40 expands to 1 / 3 of the electrode layer, the saturation current increases by 5%, indicating that this range is still within the effective optimization range. Therefore, limiting the preset region Z to 3K≤N in this application is a critical condition supported by data. However, when the distribution range of the air gap layer 40 expands to 2 / 5 of the electrode layer (exceeding the 1 / 3 limit), the rate of change of saturation current turns to -1%. This is because as the distribution range expands excessively, the air gap layer 40 gradually approaches the middle region Z3 of the electrode layer, thus exhibiting a trend similar to that shown in Table 1, which is closer to the middle electrode layer. Therefore, the preset region Z (3K≤N) defined in this application is an important condition for achieving an effective improvement in saturation current.

[0093] The manufacturing process of the multilayer inductor component 100 of this application is briefly described below. The manufacturing process includes the following steps: Step 1: Ingredient Preparation. Prepare the casting paste and printing paste. The casting paste is used to form the ferrite film; the printing paste includes a conductive ink paste (such as silver paste) for forming the inner coil and a non-magnetic ink paste for forming the air gap layer 40.

[0094] Step Two: Casting and Hole Opening. The cast slurry is used to form a ceramic thin film of a certain thickness through a casting process. Subsequently, mechanical or laser-drilled holes are made in the cast ceramic thin film at designed locations to create through-holes for connecting the layers. This step facilitates the construction of the basic channels for interlayer interconnection.

[0095] Step 3: Printing. Using a pre-designed screen printing stencil, the required inner electrode 30 pattern and air gap layer 40 pattern are printed on the ceramic film. In particular, the air gap layer 40 is formed by printing a non-magnetic paste on the insulating layer 13 near the cover plate 11, which helps to precisely control the spatial distribution of the air gap layer 40 within the substrate 10.

[0096] Step 4: Lamination and Isostatic Pressing. The printed ceramic films are stacked layer by layer according to the design sequence and initially pressed together under pressure. Then, isostatic pressing is performed to further tighten the layers together. This isostatic pressing process helps eliminate interlayer voids, forming a dense green body.

[0097] Step 5: Cutting and Debinding. The pressed green block is cut into individual green product particles. Then, the cut green particles are placed in a debinding furnace for debinding to remove some of the colloids (mainly low-boiling and medium-boiling organic solvents) from the green body, reducing the colloid content.

[0098] Step Six: Sintering and Chamfering. The debinded green body is subjected to high-temperature heat treatment (sintering), causing the powders within the green body to react and form a solid, monolithic ceramic body. After sintering, the product is ground and chamfered using grinding media and small balls, slowly smoothing its edges and corners. Chamfering helps prevent chipping during subsequent processing or assembly.

[0099] Step Seven: End Sealing (Silver Dipping, Silver Burning, and Electroplating). First, conductive paste is applied to both ends of the product (silver dipping), connecting the leads of the internal coil to the external circuit. Next, high-temperature heat treatment (silver burning) forms a dense end electrode from the silver paste applied to both ends. Finally, the end electrodes undergo surface treatment, sequentially electroplating a nickel protective layer and a solder layer. The electroplating layer improves the solderability and oxidation resistance of the outer electrode 20.

[0100] Step 8: Inspection and Packaging. Visually screen the finished products, separating those that meet specifications from those that do not; further sort the products to ensure their electrical properties meet the required range.

[0101] Step Nine: Braiding. Pack the products that have passed the inspection for appearance, size, electrical properties, and reliability into standard-sized paper or plastic braided tape to complete the braided packaging for shipment.

[0102] Secondly, this application also discloses a multilayer inductor component 100, please refer to... Figures 2 to 4 The multilayer inductor component 100 includes a substrate 10, two external electrodes 20, and an air gap layer 40. The substrate 10 includes two cover plates 11 disposed opposite each other along a first direction F1, and multiple insulating layers 13 stacked between the two cover plates 11 along the first direction F1. The two external electrodes 20 are disposed opposite each other on the substrate 10. Multiple internal electrodes 30 are disposed within the substrate 10, and the multiple insulating layers 13 and multiple internal electrodes 30 are alternately disposed along the first direction F1. Each multiple internal electrode 30 includes an internal electrode 30 electrically connected to the external electrodes 20.

[0103] An air gap layer 40 is disposed between the insulating layer 13 adjacent to the air gap layer 40 and the inner electrode 30, and the air gap layer 40 is disposed on part or all of the insulating layer 13 within a preset region Z near any cover plate 11. The preset region Z covers M layers of insulating layer 13 in the first direction F1, which does not exceed one-third of the total number of insulating layer 13 layers N. The total number of insulating layer 13 layers is the same as the total number of inner electrode 30 layers, and M and N are both positive integers.

[0104] Specifically, the total number of insulating layers 13 is the same as the total number of inner electrode layers 30. An air gap layer 40 is disposed between the insulating layer 13 adjacent to the inner electrode 30, and the air gap layer 40 is located in a predetermined region Z. The predetermined region Z covers M insulating layers 13 in the first direction F1, which does not exceed one-third of the total number of insulating layers N. This arrangement ensures that the air gap layer 40 is stably located in the region near the electrode layer of the cover plate 11. This distribution of the air gap layer 40 provides non-magnetic or low-magnetic inductive blocking at both ends of the multilayer inductor component 100, thereby increasing magnetic resistance without causing excessive inductance decay, delaying magnetic saturation, and thus improving the saturation current characteristics of the multilayer inductor component 100.

[0105] The descriptions of the substrate 10, outer electrode 20, inner electrode 30, cover plate 11, air gap layer 40, insulating layer 13, and preset area are all based on the descriptions in the foregoing embodiments and will not be repeated here.

[0106] Thirdly, such as Figure 9 As shown, this application also discloses an electronic device 200, which includes a multilayer inductor component 100 as described in the first aspect.

[0107] Specifically, the electronic device 200 has the aforementioned multilayer inductor 100 from the first aspect, thus achieving the corresponding beneficial effects of the multilayer inductor 100. By utilizing the air gap layer 40 distributed within a predetermined region Z (satisfying 3K≤N) near the cover plate 11, the saturation current characteristics of the multilayer inductor 100 can be improved. When the multilayer inductor 100 is applied to the electronic device 200, it helps maintain stable inductance under high-load conditions. Simultaneously, since the multilayer inductor 100 optimizes the internal magnetic circuit structure, improves performance, and maintains device miniaturization, the electronic device 200 using the multilayer inductor 100 can be designed to be thinner and more compact. Therefore, the electronic device 200 of this application, while ensuring the stability of the internal current, also improves the utilization efficiency of the internal space, which is beneficial to improving the overall operational stability of the electronic device 200.

[0108] It is understood that electronic device 200 refers to a device that includes a circuit board and electronic components mounted on the circuit board, such as smartphones, tablets, laptops, smartwatches, Bluetooth headsets, drone control terminals, or in-vehicle electronic devices.

[0109] It is understandable that the multilayer inductor component 100 is typically soldered onto the circuit board of the electronic device 200 using surface mount technology, and the external electrode 20 of the multilayer inductor component 100 is connected to the pads on the circuit board through solder to form a connection and electrical conduction.

[0110] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A multilayer inductor component, characterized in that, include: The substrate includes two cover plates disposed opposite each other along a first direction, and multiple insulating layers stacked between the two cover plates along the first direction; Two external electrodes are disposed opposite to each other on the substrate; The multilayer internal electrode is disposed within the substrate, and the multilayer insulating layer and the multilayer internal electrode are alternately disposed along the first direction. The multilayer internal electrode includes an internal electrode that is electrically connected to the external electrode. An air gap layer is disposed between the insulating layer and the inner electrode adjacent to the air gap layer, and the air gap layer is located in a predetermined region; The preset region refers to the region within K consecutive layers of the inner electrodes that are close to any of the cover plates and are counted along the first direction starting from the inner electrode closest to the cover plate, where N is the total number of inner electrode layers, satisfying: 3K≤N; Where K and N are both positive integers.

2. The multilayer inductor component as described in claim 1, characterized in that, The number of air gap layers located within the preset area is X, satisfying: X≤K.

3. The multilayer inductor component as described in claim 1, characterized in that, The two cover plates include a first cover plate and a second cover plate. The preset area includes a first sub-region near the first cover plate and a second sub-region near the second cover plate. Both the first sub-region and the second sub-region are provided with the air gap layer.

4. The multilayer inductor component as described in claim 3, characterized in that, The multilayer inductor component also includes an intermediate region, in which the air gap layer is not disposed; The intermediate region is configured as, in the first direction, the region defined by the first cover plate and the second cover plate, excluding the first sub-region and the second sub-region.

5. The multilayer inductor component as described in claim 3, characterized in that, The number of air gap layers located within the preset area is X, and the total number of inner electrode layers is N, satisfying: X≤2 / 3N.

6. The multilayer inductor component as claimed in claim 1, characterized in that, The thickness of the air gap layer along the first direction is T1, and the thickness of the inner electrode along the first direction is T2, satisfying: T1 <T2。 7. The multilayer inductor component as claimed in claim 1, characterized in that, The multilayer insulating layer is provided with through holes, and the multilayer inner electrodes are connected end to end through connecting conductors passing through the through holes to form a spirally arranged inductor coil.

8. The multilayer inductor component as claimed in claim 1, characterized in that, In the projection plane along the first direction, the outer periphery of the air gap layer is larger than the inner edge profile of the inner electrode.

9. A multilayer inductor component, characterized in that, include: The substrate includes two cover plates disposed opposite each other along a first direction, and multiple insulating layers stacked between the two cover plates along the first direction; Two external electrodes are disposed opposite to each other on the substrate; The multilayer internal electrode is disposed within the substrate, and the multilayer insulating layer and the multilayer internal electrode are alternately disposed along the first direction. The multilayer internal electrode includes an internal electrode that is electrically connected to the external electrode. An air gap layer is disposed between the insulating layer adjacent to the air gap layer and the inner electrode, and the air gap layer is disposed on part or all of the insulating layer in a predetermined area near any of the cover plates; The number of insulating layers covered by the preset area in the first direction is M, which does not exceed one-third of the total number of insulating layers N; The total number of insulating layers is the same as the total number of inner electrode layers, and M and N are both positive integers.

10. An electronic device, characterized in that, The electronic device includes a multilayer inductor as described in any one of claims 1-9.

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