A flat panel phased array antenna

Abstract

The application relates to the technical field of phased array antennas, in particular to a flat plate type phased array antenna which comprises a base, an angle adjusting mechanism arranged on the base, and a phased array antenna body arranged on the angle adjusting mechanism, a rotating seat is rotatably arranged at the middle part of the base, an antenna mounting surface is rotatably arranged above the rotating seat, and the phased array antenna body is arranged above the antenna mounting surface; the angle adjusting mechanism comprises an azimuth angle adjusting assembly and a pitch adjusting assembly; a center wave-transparent area is arranged at the middle part of a heat shield, and a heat flow guiding assembly is arranged on the periphery of the heat shield. Compared with the prior art, the heat flow guiding assembly is arranged, heat is transmitted through contact and convection / radiation coupling into the groove, then is diffused in the circumferential direction, is transmitted to the outer heat conduction plate in a directional manner, and is connected to an external radiator / fins / heat pipes / liquid cooling, etc. through the external connecting hole to realize multi-point heat dissipation and uniform temperature release, reduce local hot spots, thermal stress and maintenance replacement cost.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, and more particularly to a planar phased array antenna. Background Technology

[0002] Planar active phased array antennas typically consist of a beam-controlled power supply, a beamguide module, a frequency converter / RF module, an antenna array, and a housing. The beam-controlled power supply receives beam pointing information and controls the beamguide module to achieve beam scanning and transmit / receive switching, meeting the transmission and reception requirements under multiple modes and beam configurations. To adapt to the external environmental influences (wind, rain, salt spray, water vapor, impact vibration, etc.) of dynamic platforms such as ships, in engineering applications, the antenna main unit is often encapsulated inside a housing. A closed space is formed by assembling and fastening the upper / lower housing shells. At the same time, drying components and other structures can be combined to reduce humidity inside the housing and improve environmental adaptability.

[0003] In the prior art, Chinese patent document CN207098042U discloses a shipborne mobile communication antenna system, outlining the enclosure design and the integration of the internal antenna main unit and drying components. The enclosure consists of an upper and lower housing assembled to form a sealed protective space, emphasizing improved environmental adaptability and reliability in a shipborne environment through enclosure packaging and internal component configuration. Another example is Chinese patent document CN118738852A, which discloses a Ka-band phased array antenna radome and its manufacturing method. The radome consists of a transparent area and a solid area surrounding it. The solid area is made of quartz fiber prepreg resin, while the transparent area uses a laminated structure of coating + inner and outer skin + core layer. The design specifications, including the thickness range and transmittance targets for both the solid and transparent areas, are provided to meet the transmittance performance and structural protection requirements of the phased array radome. In dynamic platform applications, planar phased array antennas need to achieve wide-range pointing of satellites or targets through mechanical azimuth / elevation adjustments, and also rely on wide-beam, sub-narrow-beam, and narrow-beam electronic scanning for rapid acquisition, coarse tracking, and fine tracking. Under encapsulated and sealed conditions, heat from high-power components such as power amplifiers, TR modules, beam control power supplies, and frequency converters accumulates within the enclosed space, creating temperature rises and differences between the radome and the array surface. This leads to risks of thermal stress, thermal deformation, and electrical performance drift. Furthermore, this thermal impact is compounded by the "wide / narrow beam ±60° coverage, narrow beam ±60° dynamic scanning" and the attitude adjustment of the angle mechanism, affecting beam pointing stability and scanning consistency. Simultaneously, existing antenna radome designs often prioritize wave transmission performance and environmental isolation in their structural and material selection (e.g., transparent / solid areas). The structural partitioning and layering of the area (such as the sandwich structure) present challenges. However, under the constraints of not compromising the integrity of the sealing surface and not excessively affecting the electrical performance and structural continuity of the central transparent area, how to form a controllable, verifiable, and scalable heat drainage path inside the radome structure, while simultaneously being compatible with the motion envelope, assembly maintenance, and reliability requirements of the azimuth / elevation angle adjustment mechanism, so as to achieve continuous and stable transmission and reception and long-term thermally reliable operation of "mechanical coarse pointing + electronic fine scanning" in synergy on a dynamic platform, constitutes a systematic technical problem that needs to be addressed in a comprehensive manner. Therefore, this application discloses a planar phased array antenna. Summary of the Invention

[0004] In view of this, the purpose of this invention is to propose a planar phased array antenna to solve the problems of limited heat dissipation, deformation caused by temperature rise and temperature difference and electrical performance drift, which lead to a decrease in pointing and scanning stability when balancing azimuth / elevation pointing and ±60° electronic scanning under dynamic platform enclosure conditions.

[0005] To achieve the above objectives, this invention provides a planar phased array antenna, comprising a base, an angle adjustment mechanism disposed on the base, and a phased array antenna body disposed on the angle adjustment mechanism. The phased array antenna body comprises, from bottom to top, a frequency conversion module, a beam control power module, a TR component, an antenna array, and a heat shield. A rotating seat is rotatably mounted in the middle of the base, and an antenna mounting surface is rotatably mounted above the rotating seat. The phased array antenna body is disposed above the antenna mounting surface. The angle adjustment mechanism includes an azimuth adjustment component and a pitch adjustment component. The azimuth adjustment component drives the rotating seat and the antenna mounting surface to rotate to adjust the azimuth angle of the phased array antenna body. The pitch adjustment component drives the antenna mounting surface to rotate to adjust the pitch position of the phased array antenna body. The beam control power module receives beam pointing information and controls the TR component to achieve... The system includes beam scanning and transmit / receive switching, and provides secondary power to the TR component and the frequency conversion module. A central transparent area is provided in the middle of the heat shield, and a heat diversion component is provided circumferentially around the heat shield. This heat diversion component is used to divert heat generated inside the phased array antenna body outwards. The heat diversion component is located in the circumferential non-transparent area of ​​the heat shield. The heat diversion component includes a heat dissipation groove formed inside the heat shield wall, a surrounding groove on one side of the heat dissipation groove, and several dispersive grooves on the heat dissipation groove. The heat dissipation groove, surrounding groove, and dispersive grooves do not penetrate the inner surface sealing area of ​​the heat shield. At least one heat-conducting block is circumferentially arranged on the other side of the heat dissipation groove. A heat-conducting plate is circumferentially arranged on the outer surface of the heat shield. The heat-conducting block extends outwards from the heat dissipation groove to the outer surface of the heat shield and contacts the heat-conducting plate. The heat-conducting plate has several external heat-conducting holes connected to an external heat dissipation structure.

[0006] Preferably, the azimuth adjustment assembly includes a fixed gear fixedly installed at the bottom center of the base, and an azimuth rotation motor fixedly installed on one side of the rotating seat. The output end of the azimuth rotation motor is fixedly connected to a first meshing gear, which meshes with the fixed gear. When the azimuth rotation motor drives the first meshing gear to rotate, the first meshing gear revolves around the fixed gear, thereby driving the rotating seat to rotate as a whole.

[0007] Preferably, the pitch adjustment assembly includes a half gear fixedly installed below one side of the antenna mounting surface, and a pitch rotary motor fixedly installed on the other side of the rotating base. The output end of the pitch rotary motor is fixedly connected to a second meshing gear, which meshes with the half gear. When the pitch rotary motor drives the second meshing gear to rotate, it drives the half gear to rotate, and the half gear synchronously drives the antenna mounting surface to deflect.

[0008] Preferably, the length and width of the central wave-transparent region are larger than the length and width of the antenna array, and the central wave-transparent region is configured as a solid structure made of quartz fiber reinforced NPI-550-2 polyimide-based composite material.

[0009] Preferably, the heat diversion assembly and the sealing structure on the inner surface of the heat insulation cover are structurally isolated from each other; one side of each of the dispersion grooves is connected to the surrounding groove.

[0010] Preferably, the heat-conducting block does not extend into the inner surface sealing area of ​​the heat insulation cover.

[0011] Preferably, the surrounding trench and the dispersion groove are filled with a thermally conductive filler material, which includes at least one of thermally conductive particles, thermally conductive powder, thermally conductive gel, thermally conductive potting compound, and phase change energy storage material.

[0012] Preferably, the thermally conductive filler material is fixed in the surrounding groove and dispersion groove by means of curing, potting, or porous carrier to prevent migration under vibration or impact conditions.

[0013] Preferably, the plurality of dispersion grooves extend along the circumference of the heat insulation cover to the four sides of the heat insulation cover, with the groove ends located near the outer peripheral edge of the heat insulation cover; the surrounding grooves form a circumferentially connected confluence channel to allow heat to be evenly distributed among the dispersion grooves.

[0014] Preferably, an amplifier module is provided on one side of the base.

[0015] The beneficial effects of this invention are:

[0016] This type of planar phased array antenna features a heat shield with a "functionally partitioned" thermo-electric integrated structure. The central wave-transparent area uses a solid composite material to achieve wave transmission stability and thermal insulation protection, while the circumferential non-wave-transparent area is equipped with heat-draining components and isolated from the inner surface sealing structure. This allows the heat shield to achieve the design logic of "thermal insulation does not mean no heat conduction," that is, prioritizing electrical performance and environmental isolation for the central aperture, and prioritizing the establishment of controllable heat conduction channels for the circumferential area. This partitioning method not only avoids the sealing surface being weakened by penetration and reduces the risk of water vapor, salt spray and other intrusions, but also conducts heat from the internal power amplifier, TR and power supply through circumferential heat conduction and external heat exchange, suppressing the temperature rise and temperature difference of the shield and array surface, and reducing the impact of thermal deformation on beam pointing and scanning consistency.

[0017] Meanwhile, the heat diversion component adopts an expandable thermal path of "internal wall channel network + heat-conducting block + external surface heat-conducting plate". The heat dissipation channel serves as the main heat collection cavity, and the surrounding channel forms a circumferentially connected confluence channel. The dispersion channel extends to four sides to form a multi-branch temperature uniformity network. The channel is filled with thermally conductive / phase change material and fixed to improve the equivalent thermal conductivity and reduce power surges. Heat enters the channel through contact heat transfer and convection / radiation coupling of the bearing structure and then diffuses circumferentially. It is then directionally transferred to the external heat-conducting plate by the heat-conducting block and connected to the external heat sink / fins / heat pipes / liquid cooling through external holes to dissipate heat, realize multi-point heat dissipation and uniform temperature release, reduce local hot spots, thermal stress and maintenance and replacement costs, and improve long-term reliability and engineering adaptability.

[0018] The angle adjustment mechanism is designed in conjunction with the electronic scanning capability of the planar active phased array to form a composite pointing link of "mechanical coarse pointing + electronic fine scanning": the angle mechanism is responsible for low-frequency, long-stroke attitude compensation and pointing maintenance, the wide beam and the second narrow beam are used for rapid acquisition, coarse tracking and rapid compensation for carrier jitter and residual pointing error within ±60°, and the narrow beam is used for fine tracking and high-gain link maintenance within ±60°, thereby reducing the high-frequency large-amplitude servo movement and impact load, and improving tracking robustness, pointing continuity and link stability on dynamic platforms. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall first-view structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall second-view structure of the present invention;

[0022] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0023] Figure 4 This is a schematic diagram of the internal structure at the bottom of the present invention;

[0024] Figure 5 This is a schematic diagram of the phased array antenna body structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the heat insulation cover structure of the present invention;

[0026] Figure 7 This is a schematic diagram of the heat-conducting plate structure of the present invention;

[0027] Figure 8 This is a block diagram of the phased array antenna of the present invention;

[0028] Figure 9 This is a schematic diagram showing the wave transmittance of the heat insulation cover of the present invention.

[0029] The diagram is marked as follows:

[0030] 1. Base; 2. Fixed gear; 3. Rotating seat; 4. Antenna mounting surface; 5. Phased array antenna body; 6. Power amplifier module; 7. Azimuth rotary motor; 8. First meshing gear; 9. Pitch rotary motor; 10. Second meshing gear; 11. Half gear; 12. Frequency conversion module; 13. Waveguide power supply module; 14. TR assembly; 15. Antenna array; 16. Heat shield; 17. Central wave-transparent area; 18. Heat dissipation groove; 19. Surrounding groove; 20. Dispersion groove; 21. Heat-conducting block; 22. Heat-conducting plate; 23. External heat-conducting hole. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments.

[0032] It should be noted that, unless otherwise defined, the technical or scientific terms used in this invention should have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] like Figures 1 to 9As shown, the planar phased array antenna includes a base 1, an angle adjustment mechanism mounted on the base 1, and a phased array antenna body 5 mounted on the angle adjustment mechanism. A power amplifier module 6 is mounted on one side of the base 1, a rotating seat 3 is rotatably mounted in the middle of the base 1, and an antenna mounting surface 4 is rotatably mounted above the rotating seat 3. The phased array antenna body 5 is positioned above the antenna mounting surface 4. The phased array antenna body 5 includes, from bottom to top, a frequency conversion module 12, a beam control power module 13, a TR component 14, an antenna array 15, and a heat shield 16. The angle adjustment mechanism includes an azimuth adjustment component and a pitch adjustment component. The azimuth adjustment component rotates the rotating seat 3 relative to the antenna mounting surface 4 to adjust the azimuth angle of the phased array antenna body 5, and the pitch adjustment component rotates the antenna mounting surface 4 to adjust the pitch position of the phased array antenna body 5. The beam control power module 13 is used for… The phased array antenna 5 receives beam pointing information and controls the TR component 14 to achieve beam scanning and transmit / receive switching, and provides secondary power to the TR component 14 and the frequency conversion module 12. A central transparent area 17 is provided in the middle of the heat shield 16, and a heat diversion component is provided on the outer periphery of the heat shield 16. The heat diversion component is used to divert the heat generated inside the phased array antenna body 5 to the outside. The antenna array 15 consists of 64 antenna elements arranged in an 8×8 rectangular grid. The antenna array 15 is divided into five symmetrical subarrays. Each antenna element corresponds to a pair of transmit / receive RF channels. The transmit / receive RF channels are switched by a switch to achieve time-division multiplexing of transmit and receive. The phased array antenna body 5 has four working modes: high transmit power, low transmit power, receive, and standby. It also supports beam switching of wide beam, second narrow beam, and narrow beam. The wide beam and second narrow beam cover ±60°, and the narrow beam mode achieves ±60° dynamic scanning.

[0034] The aforementioned planar phased array antenna achieves a composite pointing mode of "mechanical coarse pointing + electronic fine scanning" by arranging the phased array antenna body 5 on a two-degree-of-freedom angle adjustment mechanism consisting of a base 1, a rotating seat 3, and an antenna mounting surface 4. The azimuth adjustment component drives the rotating seat 3 and the antenna mounting surface 4 above it to rotate around a vertical axis, quickly obtaining omnidirectional or large-area azimuth coverage and compensating for pointing errors caused by changes in the carrier's heading. The elevation adjustment component drives the antenna mounting surface 4 to rotate around a horizontal axis, compensating for changes in the carrier's pitch / roll or the target's elevation angle, thereby ensuring that the antenna array 15 can still stably align with the target direction under dynamic platform conditions. The phased array antenna body 5 integrates, from bottom to top, a frequency conversion module 12, a beam control power module 13, a TR component 14, an antenna array 15, and a heat shield 16, enabling the RF link and the control power supply link to complete a closed loop within the same assembly. The beam control power module 13 receives beam pointing information and controls the TR component 14, driving a pair of transmit / receive RF channels corresponding to each antenna element to complete amplitude and phase modulation and transmit / receive switching. It also provides secondary power to the TR component 14 and the frequency conversion module 12, enabling the array to perform beam scanning according to a preset beam angle or beam number under a time-division multiplexing working mechanism. The antenna array 15 employs 64 antennas... The linear unit is arranged in an 8×8 rectangular grid and divided into five symmetrical subarrays. On one hand, the regular grid and symmetrical subarray division facilitates channel consistency calibration, subarray-level anti-interference / zeroing processing, and beamforming control. On the other hand, it allows for switchable coverage and gain in multi-beam modes such as wide beam, second-narrow beam, and narrow beam. Wide beam and second-narrow beam coverage of ±60° enables wide-range search, rapid acquisition, and coarse tracking. After the angle adjustment mechanism adjusts the array surface to the approximate azimuth / elevation of the target, the electronic beam is still allowed to quickly compensate for residual pointing errors, carrier attitude jitter, and short-term target maneuvers within a ±60° range, thereby reducing... The mechanical mechanism meets the requirements of transient high bandwidth tracking, reduces frequent large-amplitude servo movements, and improves the system's vibration resistance and tracking robustness. The narrow beam mode enables ±60° dynamic scanning to provide higher array gain and narrower main lobe after target acquisition, achieving precise tracking and high link margin. At this time, the angle adjustment mechanism is responsible for keeping the target near the "optimal working area" of the narrow beam electronic scanning and continuously providing low-frequency large-stroke compensation, while the electronic narrow beam scanning undertakes high-frequency small-amplitude dynamic error correction and rapid beam jitter suppression, so as to maintain continuous beam pointing, link not lost, and improve pointing stability under large-scale maneuvering or strong disturbance conditions.

[0035] The heat shield 16 serves as a protective enclosure for the antenna array 15 and its upper radiating aperture. A central wave-transparent area 17 is provided in its center to ensure wave transmission performance while providing environmental isolation for the array surface. The central wave-transparent area 17 ensures material and structural continuity within the effective aperture range, thereby reducing the risk of phase distortion and scanning performance degradation caused by abrupt structural changes. Simultaneously, a heat-draining component is located on the outer periphery of the heat shield 16. This component effectively draws out heat generated inside the phased array antenna body 5 by the power amplifier module 6, wave-controlled power supply module 13, TR component 14, and frequency converter module 12, and dissipates it to the outside under the heat shield 16 enclosure. The heat-draining component is located in the circumferential non-wave-transparent area of ​​the heat shield 16 and is isolated from the sealing structure on the inner surface of the heat shield 16, allowing heat to pass through smoothly. The heat extraction path does not disrupt the continuity of the inner sealing surface, avoids the formation of water and moisture ingress channels, and reduces the risk of sealing failure. The heat diversion component forms a circumferentially connected uniform temperature and convergence structure inside the heat shield 16 wall, which diffuses and evenly guides the heat generated by local hot spots in the circumferential range to the outer heat exchange parts. Then, the heat is transferred by the heat conduction block 21 to the heat conduction plate 22 on the outer surface of the heat shield 16 or the external heat dissipation structure to achieve convection / radiation heat transfer. This improves the heat dissipation capacity after encapsulation and reduces the temperature rise and thermal gradient without changing the structural stability of the central wave-transparent area 17. In turn, it reduces the thermal stress concentration, array deformation and electrical performance drift of the shield caused by temperature difference, and improves the thermal reliability and long-term stability of the phased array antenna in different working modes such as high power, low power, reception and standby.

[0036] Furthermore, the power amplifier module 6 located on one side of the base 1 separates the high-power devices from the rotation / pitch motion components. This facilitates the direct dissipation of heat generated by the power amplifier through the outer surface of the base 1 or an external heat dissipation structure, reducing the thermal load and temperature rise of the follower components. It also helps control the overall center of gravity and rotational inertia, thereby reducing the driving torque requirements of the angle adjustment mechanism, improving attitude response and control accuracy. Ultimately, this forms a composite pointing and tracking mechanism that works in conjunction with "wide / narrow beam ±60° coverage + narrow beam ±60° dynamic scanning" and "azimuth / pitch angle adjustment." This enables the system to achieve a planar phased array antenna solution with wide-range acquisition, fast tracking, precise pointing, and high-reliability thermal management capabilities on a dynamic platform.

[0037] like Figures 1 to 4As shown, the azimuth adjustment assembly includes a fixed gear 2 fixedly installed at the bottom center of the base 1, and an azimuth rotation motor 7 fixedly installed on one side of the rotating seat 3. The output end of the azimuth rotation motor 7 is fixedly connected to a first meshing gear 8, which meshes with the fixed gear 2. When the azimuth rotation motor 7 drives the first meshing gear 8 to rotate, the first meshing gear 8 revolves around the fixed gear 2, thereby driving the rotating seat 3 to rotate as a whole. The pitch adjustment assembly includes a half gear 11 fixedly installed below one side of the antenna mounting surface 4, and a pitch rotation motor 9 fixedly installed on the other side of the rotating seat 3. The output end of the pitch rotation motor 9 is fixedly connected to a second meshing gear 10, which meshes with the half gear 11. When the pitch rotation motor 9 drives the second meshing gear 10 to rotate, it drives the half gear 11 to rotate, and the half gear 11 synchronously drives the antenna mounting surface 4 to deflect.

[0038] In this embodiment, the azimuth adjustment component adopts a structure of "fixed gear 2 + first meshing gear 8 revolving". The fixed gear 2 is fixed at the bottom of the middle part of the base 1 as a central reference and provides a stable meshing reference. The azimuth rotation motor 7 is installed on the side of the rotating seat 3 so that the motor rotates with the rotating seat 3 as a whole. The first meshing gear 8 at the output end of the motor keeps continuously meshed with the fixed gear 2. When the azimuth rotation motor 7 drives the first meshing gear 8 to rotate, the first meshing gear 8 revolves around the fixed gear 2 under the meshing constraint and drives the rotating seat 3 of its mounting carrier to rotate around the central axis of the fixed gear 2. This enables the phased array antenna body 5 to adjust the azimuth angle with the rotating seat 3. This structure fixes the positioning reference of the azimuth rotation on the base 1, which is beneficial to improve the concentricity and repeatability of the azimuth rotation. Moreover, the meshing transmission can provide a large output torque and resistance to external loads, which is suitable for stable pointing under dynamic carrier vibration, wind load or inertial impact conditions.

[0039] Meanwhile, the pitch adjustment assembly adopts a pitch transmission form of "half gear 11 + second meshing gear 10". The half gear 11 is fixed below one side of the antenna mounting surface 4 and forms a rigid connection with the antenna mounting surface 4. The pitch rotary motor 9 is installed on the other side of the rotating base 3 and meshes with the half gear 11 through the second meshing gear 10. When the pitch rotary motor 9 drives the second meshing gear 10 to rotate, the meshing pair converts the rotational motion of the motor into the rotation of the half gear 11, thereby driving the antenna mounting surface 4 to deflect around its pitch axis, realizing the pitch angle adjustment of the phased array antenna body 5. The advantage of this structure is that the pitch drive and azimuth return are both... The integrated arrangement of the rotating carrier (rotating seat 3) results in a short force transmission path and a compact structure. The half gear 11 limits the effective stroke of the pitch rotation and facilitates the setting of mechanical limits, which can prevent cable / feed harness stretching or mechanism interference caused by excessive pitch rotation. At the same time, the gear meshing transmission has a self-holding tendency and high transmission stiffness, which can reduce pitch jitter caused by platform vibration and improve attitude holding capability. Thus, the whole machine has high load-bearing capacity, good transmission efficiency and control accuracy when achieving two degrees of freedom of azimuth and pitch pointing, which meets the application requirements of phased array antenna for rapid pointing, stable tracking and repeated positioning under moving platform conditions.

[0040] like Figures 6 to 7 As shown, the length and width of the central wave-transparent region 17 are larger than those of the antenna array 15. The central wave-transparent region 17 is set as a solid structure made of quartz fiber reinforced NPI-550-2 polyimide-based composite material.

[0041] The length and width of the central transparent area 17 are set to be larger than those of the antenna array 15, ensuring that the antenna array 15 remains within the effective transparent aperture coverage of the central transparent area 17 under any permissible azimuth / elevation attitude and electronic scanning conditions. This avoids additional attenuation, scattering, and phase distortion introduced by the array edges falling into non-transparent areas, reduces the risks of beam pointing deviation, sidelobe rise, and scan edge gain reduction, and improves the consistency and stability of wide-angle scanning. The central transparent area 17 is made of quartz fiber reinforced NPI polyimide composite material and is designed as a solid structure. On the one hand, this type of composite material can maintain relatively stable performance while meeting the operating temperature and environmental protection requirements of the heat shield 16. With fixed dielectric parameters and mechanical strength, the solid structure avoids changes in the equivalent dielectric constant and thickness unevenness caused by sandwich cavities or local structural abrupt changes, thereby reducing the phase error introduced by the wave-transmitting window and improving the predictability and repeatability of wave-transmitting performance. In addition, in the overall design of the heat shield 16, the effect of "heat insulation is not the same as non-thermal conduction" is achieved through functional zoning. That is, the central wave-transmitting area 17 focuses on heat insulation protection and electrical performance stability, while the circumferential non-wave-transmitting area can combine heat-conducting components and heat-draining structures to achieve heat conduction and heat dissipation. Thus, without sacrificing the stability of the wave-transmitting window, the requirements of encapsulation protection and thermal management are taken into account, improving the reliability and service life of the phased array antenna in high-power operation or high-temperature environment.

[0042] like Figures 5 to 7 As shown, the heat diversion assembly is disposed in the circumferential non-wave-transparent area of ​​the heat insulation cover 16, and the heat diversion assembly is structurally isolated from the sealing structure of the inner surface of the heat insulation cover 16. The heat diversion assembly includes a heat dissipation groove 18 formed inside the wall of the heat insulation cover 16. A surrounding groove 19 is formed on one side of the heat dissipation groove 18, and a plurality of dispersion grooves 20 are formed on the heat dissipation groove 18. One side of the plurality of dispersion grooves 20 is connected to the surrounding groove 19, and at least one heat-conducting block 21 is circumferentially arranged on the other side of the heat dissipation groove 18. The heat dissipation groove 18, the surrounding groove 19, and the dispersion grooves 20 do not penetrate the inner surface sealing area of ​​the heat insulation cover 16, and a heat-conducting plate 2 is circumferentially arranged on the outer surface of the heat insulation cover 16. 2. The heat-conducting block 21 extends outward from the heat dissipation groove 18 to the outer surface of the heat insulation cover 16 and contacts the heat-conducting plate 22. The heat-conducting block 21 does not extend to the inner surface sealing area of ​​the heat insulation cover 16. The heat-conducting plate 22 is provided with a number of heat-conducting external connection holes 23 connected to the external heat dissipation structure. The surrounding groove 19 and the dispersion groove 20 are filled with heat-conducting filler material. The heat-conducting filler material includes at least one of heat-conducting particles, heat-conducting powder, heat-conducting gel, heat-conducting potting compound, and phase change energy storage material. The heat-conducting filler material is fixed in the surrounding groove 19 and the dispersion groove 20 by curing, potting, or porous carrier to prevent migration under vibration or impact conditions.

[0043] In this embodiment, the heat diversion component is located in the circumferential non-transparent area of ​​the heat shield 16 and is structurally isolated from the sealing structure on the inner surface of the heat shield 16. Its purpose is to provide a controllable, verifiable, and non-destructive external heat dissipation path for the internal heat sources of the phased array antenna body 5 (such as the TR component 14, wave-controlled power module 13, frequency converter module 12, and adjacent power amplifier module 6, etc.) while maintaining the continuity and integrity of the inner sealing surface of the heat shield 16. This achieves the functional zoning principle that "heat insulation does not equal non-thermal conduction," meaning that the central transparent area 17 focuses on heat insulation and electrical performance stability, while the circumferential non-transparent area focuses on heat conduction and heat dissipation. (Specific structure...) The heat dissipation groove 18, the surrounding groove 19, and the dispersion groove 20 are all formed inside the wall of the heat insulation cover 16 and do not penetrate the inner surface sealing area. Therefore, they do not create weakening or leakage channels in the sealing and pressing area, and also prevent external water vapor and salt spray from entering the inner cavity along the grooves. At the same time, the internal groove network, as a circumferential temperature uniformity and heat convergence structure, can gather and distribute heat in the circumferential non-transparent area of ​​the heat insulation cover 16: the heat dissipation groove 18 is the main heat collection cavity, the surrounding groove 19 provides a circumferentially connected heat diffusion path, and the dispersion groove 20 introduces heat from local areas into the surrounding groove 19 to achieve uniform heat distribution in the circumferential direction, thereby reducing the temperature rise and thermal gradient of local hot spots and reducing the temperature rise caused by heat. The difference causes thermal stress concentration and local warping of the enclosure, as well as the resulting array deformation and electrical performance drift. To enhance the heat absorption, storage, and conduction capabilities of the channel network, thermally conductive filler material is used to surround the trench 19 and the dispersion trench 20. This thermally conductive filler material can be at least one of thermally conductive particles, thermally conductive powders, thermally conductive gels, thermally conductive potting compounds, or phase change energy storage materials. Thermally conductive particles / powders are used to improve the equivalent thermal conductivity and reduce the thermal diffusion resistance within the channel; thermally conductive gels / potting compounds are used to fill small gaps and reduce interfacial thermal resistance; and phase change energy storage materials are used to absorb latent heat under conditions of sudden changes in heat source power or short-term high heat flux density to suppress transient temperature rises. The thermally conductive filling material is fixed in the groove by curing, potting, or porous carrier to prevent migration, accumulation, or cavitation under vibration or impact conditions, which could lead to failure of the heat conduction path. At the same time, at least one thermally conductive block 21 is arranged circumferentially on the other side of the heat dissipation groove 18. One end of the thermally conductive block 21 is in thermal communication with the heat dissipation groove 18 and its channel network, and the other end extends outward from the heat dissipation groove 18 to the outer surface of the heat insulation cover 16 and makes thermal contact with the thermally conductive plate 22. The thermally conductive block 21 does not extend into the inner surface sealing area, so that heat is directed from the "internal channel network of the wall" to the "outer surface thermally conductive plate 22", preventing heat from entering the sealing area in reverse or damaging the sealing structure.The heat-conducting plate 22 is arranged circumferentially on the outer surface of the heat insulation cover 16. It is provided with heat-conducting external connection holes 23 for connecting with external heat dissipation structures (such as external heat sinks, heat dissipation fins, heat pipes or liquid cooling heat exchange components, etc.), so that heat can be further transferred to the outside through convection and radiation at the heat-conducting plate 22. The external connection holes provide an assemblable, maintainable and expandable thermal interface, thereby significantly improving the external heat dissipation capacity and overall thermal reliability of the heat insulation cover 16 after encapsulation without affecting the electrical performance of the central wave-transparent area 17 or damaging the inner sealing surface.

[0044] Several dispersion grooves 20 extend along the circumference of the heat insulation cover 16 to the four sides of the heat insulation cover 16, with the groove ends located near the outer peripheral edge of the heat insulation cover 16; a circumferentially connected confluence groove is formed around the groove 19 to make the heat evenly distributed among the dispersion grooves 20.

[0045] Several dispersion grooves 20 extend circumferentially towards the four sides of the heat insulation cover 16, with the groove ends located near the outer periphery of the heat insulation cover 16. Together with the surrounding groove 19, they form a circumferentially connected confluence channel, making the heat diversion assembly geometrically form a uniform temperature diversion network of "circumferential main pipe + multiple branches". Its function is to guide heat from different directions to the outer heat exchange position with a shorter heat diffusion path and achieve multi-directional heat distribution: when a local heat flow concentration occurs in a certain side or corner near the heat source area, the dispersion groove 20 first provides a low thermal resistance heat diffusion channel in that local area, allowing the heat to quickly flow into the surrounding groove 19. The surrounding groove 19, as a circumferentially continuous confluence channel, further evenly distributes the heat in the circumferential range and guides it to the area where other dispersion grooves 20 are located, so that the heat can be distributed to the heat exchange positions of multiple heat-conducting blocks 21 and heat-conducting plates 22 and released simultaneously, avoiding heat loss. Concentrating force at a single location can lead to excessively high local temperatures on the outer surface or a heat exchange bottleneck. Meanwhile, the dispersion grooves 20 extend to the four edges, ensuring that the effective heat dissipation range of the circumferential non-transparent area covers the four boundaries of the heat shield 16. This allows for adaptation to attitude changes caused by the angle adjustment mechanism and changes in external wind direction / convection conditions. In other words, it ensures that at least some edge areas are in a more favorable convection heat transfer direction under different attitudes, thereby improving the consistency of heat dissipation under all operating conditions. In addition, the circumferential temperature equalization and diversion can reduce the temperature gradient and thermal deformation unevenness of the heat shield 16 in the circumferential direction, reduce the relative displacement between the shield and the internal structure, assembly stress concentration, and sealing pressure fluctuation caused by thermal deformation, thereby improving sealing stability and long-term service reliability. Furthermore, it reduces phase error changes caused by local thermal warping of the shield at the electromagnetic level, enabling the phased array antenna to maintain stable beam pointing and radiation performance under high-power operation, dynamic scanning, and complex environmental conditions.

[0046] Furthermore, to effectively channel the heat generated inside the phased array antenna body 5 into the heat diversion assembly, this embodiment establishes a thermal coupling path between the circumferential non-transparent area and the supporting structure of the phased array antenna body 5. This thermal coupling path includes: heat generated by the TR component 14, wave-controlled power module 13, frequency converter module 12, and / or power amplifier module 6 is transferred via their mounted metal supports / mounting frames / fasteners to the supporting plate or antenna mounting surface 4 on the back of the antenna array 15, and then through contact heat transfer between the circumferential non-transparent area of ​​the heat shield 16 and the supporting plate / antenna mounting surface 4 into the heat dissipation grooves 18, surrounding grooves 19, and dispersion grooves inside the heat shield 16 wall; at contact... In addition to heat transfer, the hot air convection and thermal radiation inside the heat shield 16 can also serve as auxiliary heat channels to couple heat to the circumferential non-transparent area. The heat entering the channel network is diffused circumferentially along the surrounding groove 19 under the action of the thermally conductive filling material and distributed by the distribution groove 20. Then, the heat is directionally transferred to the heat-conducting plate 22 on the outer surface of the heat shield 16 by the heat-conducting block 21 that is thermally connected to the heat dissipation groove 18. The heat-conducting plate 22 then forms a heat exchange path with the external heat dissipation structure through the thermally conductive external connection hole 23 to dissipate heat to the outside, thereby forming a continuous heat flow path from the internal heat source to the external heat dissipation structure. This heat flow path avoids the sealing area on the inner surface of the heat shield 16 to ensure sealing reliability.

[0047] like Figure 9 As shown, in this embodiment, the central wave-transparent region 17 of the heat shield 16 is a solid structure. The dielectric constant ε of the quartz fiber reinforced polyimide resin used in the central wave-transparent region 17 is 3.4, and the loss tangent tgδ is 5×10^-3. Based on the antenna structure parameters of this embodiment, the transmittance of the central wave-transparent region 17 in the 0° direction under different thickness conditions is calculated, and the results are as follows. Figure 9 As shown, by Figure 9 It can be seen that when the wall thickness of the central wave-transparent area 17 is 4mm, the wave transmittance of the central wave-transparent area 17 in the 0° direction is the highest, reaching more than 85%, thus meeting the protection and heat insulation requirements of the heat insulation cover 16 while taking into account the wave transmittance performance and beam pointing stability.

[0048] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples; within the framework of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in the details for the sake of brevity.

[0049] This invention is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A planar phased array antenna, comprising a base (1), an angle adjustment mechanism disposed on the base (1), and a phased array antenna body (5) disposed on the angle adjustment mechanism, characterized in that: The phased array antenna body (5) includes a frequency conversion module (12), a wave control power module (13), a TR component (14), an antenna array (15), and a heat shield (16) arranged sequentially from bottom to top. A rotating seat (3) is rotatably installed in the middle of the base (1), and an antenna mounting surface (4) is rotatably installed above the rotating seat (3). The phased array antenna body (5) is located above the antenna mounting surface (4). The angle adjustment mechanism includes an azimuth adjustment component and a pitch adjustment component. The azimuth adjustment component is used to drive the rotating seat (3) and the antenna mounting surface (4) to rotate to adjust the azimuth angle of the phased array antenna body (5). The pitch adjustment component is used to drive the antenna mounting surface (4) to rotate to adjust the pitch position of the phased array antenna body (5). The beam control power module (13) is used to receive beam pointing information and control the TR component (14) to realize beam scanning and transmit / receive switching, and to provide secondary power to the TR component (14) and the frequency conversion module (12); The heat shield (16) has a central wave-transmitting area (17) in the middle and a heat diversion assembly is provided on the outer periphery of the heat shield (16). The heat diversion assembly is used to draw out the heat generated inside the phased array antenna body (5). The heat diversion assembly is located in the circumferential non-wave-transparent area of ​​the heat insulation cover (16). The heat diversion assembly includes a heat dissipation groove (18) opened inside the wall of the heat insulation cover (16). A surrounding groove (19) is opened on one side of the heat dissipation groove (18). A plurality of dispersion grooves (20) are opened on the heat dissipation groove (18). The heat dissipation groove (18), the surrounding groove (19) and the dispersion grooves (20) do not penetrate the inner surface sealing area of ​​the heat insulation cover (16). Furthermore, at least one heat-conducting block (21) is arranged circumferentially on the other side of the heat dissipation groove (18), and a heat-conducting plate (22) is arranged circumferentially on the outer surface of the heat insulation cover (16). The heat-conducting block (21) extends outward from the heat dissipation groove (18) to the outer surface of the heat insulation cover (16) and contacts the heat-conducting plate (22). The heat-conducting plate (22) is provided with a plurality of heat-conducting external connection holes (23) that are connected to the external heat dissipation structure. The heat diversion assembly and the inner surface sealing structure of the heat insulation cover (16) are structurally isolated from each other; one side of the plurality of dispersion grooves (20) is connected to the surrounding groove (19), and the surrounding groove (19) and the dispersion groove (20) are filled with thermally conductive filling material.

2. The planar phased array antenna according to claim 1, characterized in that, The azimuth adjustment assembly includes a fixed gear (2) fixedly installed at the bottom center of the base (1) and an azimuth rotation motor (7) fixedly installed on one side of the rotating seat (3). The output end of the azimuth rotation motor (7) is fixedly connected to a first meshing gear (8). The first meshing gear (8) meshes with the fixed gear (2). When the azimuth rotation motor (7) drives the first meshing gear (8) to rotate, the first meshing gear (8) revolves around the fixed gear (2), thereby driving the rotating seat (3) to rotate as a whole.

3. The planar phased array antenna according to claim 2, characterized in that, The pitch adjustment assembly includes a half gear (11) fixedly installed below one side of the antenna mounting surface (4) and a pitch rotary motor (9) fixedly installed on the other side of the rotating seat (3). The output end of the pitch rotary motor (9) is fixedly connected to a second meshing gear (10). The second meshing gear (10) meshes with the half gear (11). When the pitch rotary motor (9) drives the second meshing gear (10) to rotate, it drives the half gear (11) to rotate. The half gear (11) synchronously drives the antenna mounting surface (4) to deflect.

4. The planar phased array antenna according to claim 1, characterized in that, The length and width of the central transparent region (17) are greater than those of the antenna array (15), and the central transparent region (17) is set as a solid structure made of quartz fiber reinforced NPI-550-2 polyimide-based composite material.

5. The planar phased array antenna according to claim 4, characterized in that, The heat-conducting block (21) does not extend into the inner surface sealing area of ​​the heat insulation cover (16).

6. The planar phased array antenna according to claim 1, characterized in that, The thermally conductive filler material includes at least one of thermally conductive particles, thermally conductive powder, thermally conductive gel, thermally conductive potting compound, and phase change energy storage material.

7. The planar phased array antenna according to claim 1, characterized in that, The thermally conductive filler material is fixed in the surrounding groove (19) and the dispersion groove (20) by means of curing, potting, or porous carrier to avoid migration under vibration or impact conditions.

8. The planar phased array antenna according to claim 7, characterized in that, Several of the dispersion grooves (20) extend along the circumference of the heat insulation cover (16) to the four sides of the heat insulation cover (16), with the groove ends located near the outer peripheral edge of the heat insulation cover (16); the surrounding grooves (19) form a circumferentially connected confluence groove so that heat is evenly distributed among the dispersion grooves (20).

9. The planar phased array antenna according to claim 1, characterized in that, A power amplifier module (6) is provided on one side of the base (1).

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