Side pump laser

Abstract

The invention relates to a side pump laser, which comprises a crystal assembly, a plurality of bar assemblies, a plurality of heat dissipation assemblies and a first mounting seat, the first mounting seat comprises a base, a first end cover and a second end cover; the first end cover and the second end cover are oppositely installed on the base in a spaced mode, a first containing cavity is formed in the first end cover, a second containing cavity is formed in the second end cover, and the first containing cavity and the second containing cavity communicate with an external circulating water system; one end of the crystal assembly is connected to the first end cover and the other end is connected to the second end cover; the bar assemblies are circumferentially arranged around the crystal assembly at intervals, one end of each bar assembly is mounted on the first end cover, and the other end is mounted on the second end cover; the heat dissipation assemblies and the bar assemblies are arranged in a one-to-one correspondence mode, and each heat dissipation assembly comprises a header pipe and a plurality of first heat pipes; the other end of the main pipe is communicated with the second accommodating cavity; one end of each first heat pipe is located in the header pipe and is in sealing connection with the header pipe, and the other end is attached to the heating part of the bar assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of lasers, and particularly relates to a side-pumped laser. BACKGROUND

[0002] In the working process of a laser, a side-pumping module as an important energy input part will generate a large amount of heat. For example, in a high-power fiber laser commonly used in the industrial processing field, the electrical-to-optical conversion efficiency of the side-pumping module is usually only 30%-50%, which means that a considerable proportion of electrical energy is converted into heat energy. If this heat cannot be effectively dissipated in time, the temperature of the side-pumping module will rise, thereby affecting the performance of the laser. On the one hand, the temperature rise will change the pump light bandwidth of the pump source semiconductor array, produce a temperature drift effect, reduce the absorption efficiency, and make the laser output power unstable. On the other hand, the excessively high temperature will affect the optical performance of the laser medium, produce a thermal lens effect, and even damage the key components of the laser and shorten the service life of the laser. At present, the common heat dissipation methods for the side-pumping module of a laser mainly include air cooling and water cooling. The air cooling method usually uses a fan to forcibly cool the heat dissipation fins, and this method has simple structure and low cost, but the heat dissipation efficiency is limited, and the space occupation is large, which is not suitable for the inside of a small volume sealed box. Meanwhile, in a high-power laser, the heat generated by the side-pumping module is large, and the air cooling cannot meet the demand for rapid heat dissipation, which is easy to cause heat dissipation not in time and excessively high temperature. The water cooling method is to circulate the cooling liquid in the cooling channel to take away the heat, and the heat dissipation efficiency is relatively high, but there are some disadvantages. The water cooling system is added to the inside of the heat generating component, which will cause the structure to be complex, the volume to be large, and the space occupation to be more, and the water flow in the heat generating components at different heights is uneven under the action of gravity and pressure. Moreover, the leakage risk of the cooling liquid is high, and once the leakage occurs, it may cause damage to the laser and the surrounding equipment. The above problems need to be solved urgently. SUMMARY

[0003] The present application discloses a side-pumped laser, which aims to solve the technical problems existing in the prior art.

[0004] The present application adopts the following technical scheme: The application provides a side-pumped laser, which comprises a crystal assembly, a plurality of bar strip assemblies, a plurality of heat dissipation assemblies and a first mounting base; the first mounting base comprises a base, a first end cover and a second end cover; the first end cover and the second end cover are oppositely and spacedly mounted on the base, the first end cover is internally provided with a first accommodating cavity, the second end cover is internally provided with a second accommodating cavity, and the first accommodating cavity and the second accommodating cavity are communicated with an external circulating water system; one end of the crystal assembly is connected to the first end cover, and the other end is connected to the second end cover; the bar strip assemblies are circumferentially and spacedly arranged around the crystal assembly, and one end of each bar strip assembly is mounted on the first end cover, and the other end is mounted on the second end cover; the heat dissipation assemblies are correspondingly arranged with the bar strip assemblies, and each heat dissipation assembly comprises a main pipe and a plurality of first heat pipes; one end of the main pipe is communicated with the first accommodating cavity, and the other end is communicated with the second accommodating cavity; one end of each first heat pipe is located in the main pipe and is sealingly connected with the main pipe, and the other end is attached to a heat generating part of the bar strip assembly.

[0005] In the side-pumped laser, a flow distribution assembly is further included; the flow distribution assembly comprises a heat transfer member and a deformation member; the heat transfer member is in heat transfer connection with the crystal assembly; the deformation member is arranged in the main pipe and is connected with the heat transfer member and can change the projection area along the axial direction of the main pipe when the temperature of the heat transfer member rises.

[0006] In the side-pumped laser, the heat transfer member comprises a heat conduction ring and a heat conduction heat pipe; the heat conduction ring is annularly arranged and attached to the surface of the crystal assembly; one end of the heat conduction heat pipe is connected to the heat conduction ring, and the other end is located in the main pipe; the deformation member is arranged at the end of the heat conduction heat pipe located in the main pipe.

[0007] In the side-pumped laser, the deformation member is a memory metal, and in a non-deformation state, the deformation member extends along the axial direction of the main pipe, and in a deformation state, the free end of the deformation member is bent towards the inner wall of the main pipe.

[0008] In the side-pumped laser, the deformation member comprises a plurality of deformation petals; the plurality of deformation petals are uniformly arranged around the axial line of the main pipe.

[0009] In the side-pumped laser, the heat dissipation assembly further comprises a plurality of uniform temperature elements; the uniform temperature elements are correspondingly arranged with the first heat pipes, and one side of each uniform temperature element is attached to a heat generating part of the bar strip assembly, and the other side is attached to the heat pipe.

[0010] In the side-pumped laser, the uniform temperature element is a VC plate.

[0011] In a side-pumped laser according to the present application, the bar assembly includes a second mounting base and a plurality of bar rods; the plurality of bar rods are mounted on the surface of the second mounting base facing the crystal assembly at intervals along the extending direction of the crystal assembly; the second mounting base is arranged adjacent to the crystal assembly, and is mounted at both ends on the first end cover and the second end cover, and the side of the second mounting base facing away from the bar rods has the mounting positions of the uniform temperature elements.

[0012] In a side-pumped laser according to the present application, the surface of the side of the second mounting base facing away from the bar rods has a plurality of protrusions; the plurality of protrusions are arranged at intervals along the extending direction of the crystal assembly, and the mounting positions are formed between adjacent protrusions, and the protrusions are in contact with the uniform temperature elements.

[0013] In a side-pumped laser according to the present application, the heat dissipation assembly further includes a first heat dissipation layer and / or a second heat dissipation layer; the first heat dissipation layer is filled between the uniform temperature elements and the heat generating parts; and the second heat dissipation layer is filled between the first heat pipes and the uniform temperature elements.

[0014] In a side-pumped laser according to the present application, the heat dissipation assembly further includes a third mounting base and a heat insulation plate; the third mounting base has a recess accommodating the main pipe, and the third mounting base is arranged on the side of the main pipe opposite to the first heat pipes and connected with the bar assembly, so that the first heat pipes are in contact with the surface of the heat generating parts; and the heat insulation plate covers the surface of the heat dissipation assembly between the third mounting base and the bar assembly.

[0015] In a side-pumped laser according to the present application, the first mounting base further includes a shell; the shell is a “∩”-shaped folded plate structure, and surrounds the base, the first end cover and the second end cover to form a space accommodating the crystal assembly, the bar assembly and the heat dissipation assembly.

[0016] In a side-pumped laser according to the present application, the crystal assembly includes a glass tube and a crystal; the crystal is arranged in the glass tube, and the two ends of the crystal extend out of the glass tube, pass through the first accommodating cavity and the second accommodating cavity, and are sealingly connected with the first end cover and the second end cover; the glass tube is in clearance fit with the crystal, and is sealingly connected with the opposite sides of the first end cover and the second end cover.

[0017] In a side-pumped laser according to the present application, further including a temperature measuring element and a water machine device; the temperature measuring element is used for measuring the temperature of the bar assembly and the heat dissipation assembly; and the water inlet end of the water machine device is communicated with one of the first accommodating cavity and the second accommodating cavity, and the water outlet end is communicated with the other.

[0018] In a side-pumped laser of the present application, a second heat pipe is further included; the second heat pipe is arranged in the main pipe and is in communication with the cold end of each first heat pipe.

[0019] The technical scheme adopted by the present application can achieve the following beneficial effects: The present application mainly provides a side-pumped laser, which is based on the cooperation of a main pipe and a plurality of first heat pipes to cool the heat generating parts of bar strip assemblies. Firstly, when water cooling is adopted, the uneven flow distribution of a plurality of water cooling channels due to gravity and position can affect heat exchange, thereby improving the temperature consistency among the bar strip assemblies and the stability of the laser operation. Secondly, the first heat pipes are attached to the heat generating parts of the bar strip assemblies to improve the heat exchange efficiency. Thirdly, the heat dissipation assembly has a simple structure, few connections, and small space occupation, thereby avoiding the problem of increased crystal length caused by direct water cooling. The first heat pipes are used as heat transfer elements, the phase change heat transfer process of the working medium inside the first heat pipes is stable and reliable, and there is no problem of cooling liquid leakage inside the bar strip assemblies, thereby improving the reliability and service life of the heat dissipation assembly. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows, which form a part of the present application. The schematic embodiments of the present application and their description and explanation do not constitute an improper limitation on the present application. In the drawings: Figure 1 It is a structure schematic diagram of a side-pumped laser of the present application; Figure 2 It is a sectional structure schematic diagram of a side-pumped laser of the present application Figure 3 It is one of internal structure schematic diagrams of a side-pumped laser of the present application; Figure 4 It is another of internal structure schematic diagrams of a side-pumped laser of the present application; Figure 5 It is a third of internal structure schematic diagrams of a side-pumped laser of the present application; Figure 6 It is a structure schematic diagram of a side-pumped laser of the present application in a state of being connected with a first heat pipe and a main pipe; Figure 7 It is one of structure schematic diagrams of a flow distribution assembly of the present application; Figure 8 It is another of structure schematic diagrams of a flow distribution assembly of the present application; Figure 9 It is a structure schematic diagram of a heat conduction ring of the present application; Figure 10Structure diagram of heat dissipation assembly provided with second heat pipe; Figure 11 Structure diagram of first heat pipe and second heat pipe of the present application.

[0021] Figure 12 Structure diagram of bar assembly and heat dissipation assembly of the present application in mounted state; Figure 13 Structure diagram of heat dissipation assembly of the present application in exploded view; Figure 14 Structure diagram of second mounting base provided with protrusion of the present application.

[0022] Explanation of reference numerals: 1. Crystal assembly; 11. Glass tube; 12. Crystal; 2. Bar assembly; 21. Second mounting base; 22. Bar; 23. Protrusion; 3. Heat dissipation assembly; 31. Main pipe; 32. First heat pipe; 33. Uniform temperature element; 34. First heat dissipation layer; 35. Second heat dissipation layer; 36. Third mounting base; 361. Groove; 37. Heat insulation plate; 38. Second heat pipe; 4. First mounting base; 41. Base; 42. First end cover; 421. First inner end cover; 422. First middle end cover; 423. First outer end cover; 424. First accommodating cavity; 43. Second end cover; 431. Second inner end cover; 432. Second middle end cover; 433. Second outer end cover; 434. Second accommodating cavity; 44. Outer shell; 7. Pull rod; 8. Flow distribution assembly; 81. Heat transfer piece; 811. Heat conduction ring; 8111. Rubber section; 8112. Metal section; 812. Heat conduction heat pipe; 82. Deformation piece. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described clearly and completely below in combination with specific embodiments of the present application and corresponding drawings. In the description of the present application, it should be noted that the term “or” is generally used in the meaning of including “and / or”, unless the content is explicitly indicated otherwise.

[0024] In the description of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or magnetic connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, the terms "first", "second" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present application, the meaning of "multiple" is at least two, for example, two, three or more, etc., unless otherwise specifically limited.

[0025] Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0026] To solve the problems in the prior art, the embodiments of the present application provide a side-pumped laser.

[0027] As shown in Figures 1-6 A side-pumped laser includes a crystal assembly 1, a plurality of bar strip assemblies 2, a plurality of heat dissipation assemblies 3 and a first mounting base 4; the first mounting base 4 includes a base 41, a first end cover 42 and a second end cover 43; the first end cover 42 and the second end cover 43 are oppositely and spacedly mounted on the base 41, and the first end cover 42 has a first containing cavity 424 therein, and the second end cover 43 has a second containing cavity 434 therein, the first containing cavity 424 and the second containing cavity 434 are communicated with an external circulating water system; the crystal assembly 1 is connected at one end to the first end cover 42 and at the other end to the second end cover 43; the bar strip assemblies 2 are circumferentially and spacedly arranged around the crystal assembly 1, and one end of each bar strip assembly 2 is mounted on the first end cover 42 and the other end is mounted on the second end cover 43; the heat dissipation assemblies 3 are correspondingly arranged with the bar strip assemblies 2, and each heat dissipation assembly 3 includes a main pipe 31 and a plurality of first heat pipes 32; one end of the main pipe 31 is communicated with the first containing cavity 424 and the other end is communicated with the second containing cavity 434; one end of each first heat pipe 32 is located in the main pipe 31 and is sealingly connected with the main pipe 31, and the other end of each first heat pipe 32 is attached to a heat generating part of the bar strip assembly 2, i.e. the cold end is located in the main pipe 31 and the hot end is attached to the heat generating part of the bar strip assembly 2.

[0028] The side-pumped laser of the present application can reduce the temperature of the heat generating parts of the bar strip assembly 2 based on the cooperation of the manifold 31 and the plurality of first heat pipes 32. In the first aspect, the problem of uneven flow distribution caused by gravity and position of the plurality of water cooling channels when water cooling is adopted can be avoided, the temperature consistency between the bar strip assemblies 2 is improved, and the stability of the laser operation is further improved. In the second aspect, the heat exchange efficiency can be improved based on the cooperation of the first heat pipe 32 and the heat generating parts of the bar strip assembly 2 for heat exchange, and the response to temperature control is more timely. In the third aspect, the heat dissipation assembly 3 of the present application has a simple structure, few connections, and occupies a small space, and the problem of increased crystal length caused by direct water cooling scheme can be avoided. The phase change heat transfer process of the working medium in the first heat pipe 32 is stable and reliable, and there is no problem such as leakage of cooling liquid in the internal channel of the bar strip assembly 2 when water cooling is adopted, the reliability and service life of the heat dissipation assembly 3 are improved. In addition, the plurality of first heat pipes 32 are arranged in a spaced manner, which can avoid the thermal deformation of the manifold 31, improve the stability of installation, and further improve the stability of heat dissipation.

[0029] In some preferred embodiments, as shown in Figure 3 and Figure 5 , a flow distribution assembly 8 is further included; the flow distribution assembly 8 includes a heat transfer member 81 and a deformation member 82; the heat transfer member 81 is in heat transfer connection with the crystal assembly 1; the deformation member 82 is arranged in the manifold 31 and connected with the heat transfer member 81, and can change the projection area along the axial direction of the manifold 31 when the temperature of the heat transfer member 81 rises. Based on the arrangement of the flow distribution assembly 8, the heat generated by the crystal assembly 1 is transferred to the deformation member 82 by the heat transfer member 81. When the temperature of the crystal assembly 1 rises to the deformation temperature of the deformation member 82, the deformation member 82 deforms to shield the flow area of the manifold 31, reduces the flow area, and makes more cooling medium flow into the crystal assembly 1 for cooling, thereby ensuring the stable operation of the crystal assembly 1.

[0030] Preferably, the heat transfer member 81 is provided with a heat insulation layer except the surface in contact with the crystal assembly 1 for heat transfer; based on this, the temperature rising speed of the deformation member 82 is improved.

[0031] Preferably, the deformation member 82 is arranged at the inlet end of the manifold 31.

[0032] In some preferred embodiments, as shown in Figure 7 and Figure 8 , the heat transfer member 81 includes a heat conduction ring 811 and a heat conduction heat pipe 812; the heat conduction ring 811 is annularly arranged and attached to the surface of the crystal assembly 1, specifically, the surface of the crystal 12; the heat conduction heat pipe 812 is connected to the heat conduction ring 811 at one end and located in the manifold 31 at the other end; the deformation member 82 is arranged at the end of the heat conduction heat pipe 812 located in the manifold 31.

[0033] Preferably, the heat-conducting ring 811 is made of high-thermal-conductivity material, such as copper or silver.

[0034] Preferably, a flexible composite material is added between the heat-conducting ring 811 and the crystal assembly 1 to fill the gap and improve the heat-conducting system. Optionally, the flexible composite material comprises a base layer and a composite layer combined on the base layer, wherein the base layer can be a flexible metal foil / mesh (such as copper foil, aluminum foil, thickness 0.01-0.1mm; or metal woven mesh, such as copper mesh, stainless steel mesh); and the composite layer can be a polymer (such as PI, PET) or elastomer (such as silicone) composite to improve flexibility and insulation.

[0035] Preferably, as shown in Figure 9 , the heat-conducting ring 811 comprises a rubber segment 8111 and a metal segment 8112, and the rubber segment 8111 and the metal segment 8112 are connected to form a ring structure, for example, through a clamping connection (one of which is provided with a clamping groove and the other is provided with a clamping part), or a plug-in connection, or other existing connection methods, and the heat-conducting heat pipe 812 is connected to the metal segment 8112, and the rubber segment 8111 is made of heat-shrinkable rubber; based on this, when the crystal assembly 1 is heated, the rubber segment 8111 shrinks, so that the metal segment 8112 tightly adheres to the crystal assembly 1 to improve the heat transfer efficiency, and when the crystal assembly 1 is cooled, the elastic deformation of the rubber segment 8111 facilitates the installation of the heat-conducting ring 811.

[0036] In some preferred embodiments, as shown in Figure 7 and Figure 8 , the deformation member 82 is a memory metal, and in the non-deformed state, it extends along the total pipe 31 in the axial direction, and in the deformed state, the free end of the deformation member 82 is bent towards the inner wall of the total pipe 31; specifically, the deformation member 82 can be selected from existing products on the market, which can be bent at a specific temperature, and the specific deformation temperature is determined according to the working condition requirements.

[0037] In some preferred embodiments, as shown in Figure 7 and Figure 8 , the deformation member 82 comprises a plurality of deformation petals 821; the plurality of deformation petals 821 are uniformly arranged around the axis of the total pipe 31; based on this, in the non-deformed state, the plurality of deformation petals 821 are gathered together to reduce the flow resistance to the cooling medium, and in the deformed state, the plurality of deformation petals 821 are unfolded into petal shape, and the cooling medium flows out from the gap between the deformation petals 821, thereby improving the uniform dispersion of the cooling medium and the degree of turbulent flow of the cooling medium, and further improving the heat dissipation effect of the heat dissipation assembly 3.

[0038] In some preferred embodiments, the first heat pipes 32 are in communication with each other at their hot ends. In this way, when the heat dissipation of the first heat pipes 32 is different, the evaporated liquid in the first heat pipe 32 with less heat dissipation flows to the first heat pipe 32 with more heat dissipation, so as to improve the heat dissipation of the first heat pipe 32 with less heat dissipation, and make the heat dissipation of the bar assembly 2 more uniform.

[0039] In some preferred embodiments, as shown in Figure 10 and Figure 11 , the heat dissipation assembly 3 further comprises a second heat pipe 38. The second heat pipe 38 is arranged in the manifold 31 and is in communication with the cold end of each first heat pipe 32. In this way, the temperature consistency of the cold end of the first heat pipe 32 is improved, and the uniformity of the heat dissipation of the bar assembly 2 is further improved.

[0040] In some preferred embodiments, the manifold 31 is a spliced structure, i.e. two halves divided along the axial direction, one of which is provided with a mounting port for the first heat pipe 32 to pass through.

[0041] Preferably, the first heat pipe 32 and the mounting port are connected by an elastic sealing ring with low thermal conductivity, so as to avoid heat transfer to the manifold 31, thereby reducing the heat exchange between the manifold 31 and the cooling medium, and improving the consistency of the heat dissipation of the cooling medium to each first heat pipe 32.

[0042] In some preferred embodiments, as shown in Figure 12 and 13 , the heat dissipation assembly 3 further comprises a plurality of uniform temperature elements 33. The uniform temperature elements 33 are arranged one by one corresponding to the first heat pipes 32, and are attached to the heat generating parts of the bar assembly 2 on one side and to the first heat pipes 32 on the other side. Based on the arrangement of the uniform temperature elements 33, the heat receiving consistency of the heat receiving surface of the first heat pipe 32 can be improved, and the efficient heat exchange of the first heat pipe 32 can be ensured.

[0043] Preferably, the end surface of the first heat pipe 32 attached to the uniform temperature element 33 is a flat surface, thereby increasing the heat exchange area.

[0044] Preferably, the cross section of the first heat pipe 32 comprises two parallel straight line segments and two arc segments, the straight line segments and the arc segments are arranged alternately and connected end to end to form a ring structure. The first heat pipe 32 with such structure has simple structure and small space occupation, and can transfer and dissipate heat according to the designed route.

[0045] Preferably, the uniform temperature element 33 is a VC plate.

[0046] In some preferred embodiments, as shown in Figure 12As shown, the bar assembly 2 includes a second mounting base 21 and a plurality of bar bars 22; the plurality of bar bars 22 are spaced apart on the surface of the second mounting base 21 facing the crystal assembly 1 along the extending direction of the crystal assembly 1; the second mounting base 21 is disposed adjacent to the crystal assembly 1, and its two ends are mounted on the first end cap 42 and the second end cap 43, and the side of the second mounting base 21 facing away from the bar bars 22 has a mounting position for a temperature equalization element 33.

[0047] Specifically, the heating element is located on the surface of the second mounting base 21 that is away from the bar strip 22 and opposite to the bar strip 22.

[0048] Preferably, such as Figure 14 As shown, the surface of the second mounting base 21 opposite to the bar strip 22 has a plurality of protrusions 23; the plurality of protrusions 23 are spaced apart along the extension direction of the crystal assembly 1, and mounting positions are formed between adjacent protrusions 23, and the protrusions 23 are in contact with the temperature equalization element 33.

[0049] More preferably, the protrusion 23 is cuboid in shape, and the heat dissipation element 33 is a square plate structure. As a result, the contact area with the second mounting base 21 is larger, the heat transfer area is increased, and thus the heat dissipation efficiency is improved.

[0050] More preferably, the coefficient of thermal expansion of the protrusion 23 is greater than that of the second mounting base 21, and it is made of a thermally conductive material. Thus, when the temperature of the bar 22 is high, the protrusion 23 expands due to heat and fits more tightly with the temperature equalization element 33, which can improve the heat dissipation effect. That is, the protrusion 23 can also play a heat dissipation role. For example, if a material with a high thermal conductivity, such as copper, is selected, the protrusion 23 will fit with the temperature equalization element 33 at low temperatures, which facilitates the installation of the temperature equalization element 33.

[0051] In some preferred embodiments, such as Figure 12 As shown, the heat dissipation assembly 3 further includes a first heat dissipation layer 34 and / or a second heat dissipation layer 35; the first heat dissipation layer 34 is filled between the heat spreader 33 and the heat-generating part; the second heat dissipation layer 35 is filled between the first heat pipe 32 and the heat spreader 33. Based on the arrangement of the first heat dissipation layer 34 and the second heat dissipation layer 35, the contact area between the first heat pipe 32 and the heat spreader 33, as well as between the heat spreader 33 and the heat-generating part, can be increased, thereby improving heat transfer efficiency.

[0052] Preferably, the first heat dissipation layer 34 and the second heat dissipation layer 35 are silicone or silicone grease layers.

[0053] In some preferred embodiments, such as Figure 12As shown, the heat dissipation assembly 3 further comprises a third mounting base 36 and a heat insulation plate 37; the third mounting base 36 has a groove 361 accommodating the main pipe 31, and the third mounting base 36 is arranged on the side of the main pipe 31 relative to the first heat pipe 32 and connected with the bar strip assembly 2 so that the first heat pipe 32 abuts against the surface of the heat generating part; the heat insulation plate 37 covers the surface of the heat dissipation assembly 3 between the third mounting base 36 and the bar strip assembly 2. Based on this, it can be ensured that the heat to be dissipated cannot be dissipated in the laser cavity, ensuring stable operation, and the temperature around the first heat pipe 32 can be reduced, ensuring efficient heat dissipation of the heat generating part, i.e. avoiding evaporation of the side surface by contacting with the high-temperature medium, affecting the normal return of the cold medium.

[0054] Preferably, the third mounting base 36 and the second mounting base 21 are welded to reduce the length of the module, and further reduce the length of the crystal 12 of the crystal assembly 1.

[0055] In some preferred embodiments, as shown in Figure 1 As shown, the first mounting base 4 further comprises a shell 44; the shell 44 is a “∩” type folded plate structure in cross section, and surrounds the space accommodating the crystal assembly 1, the bar strip assembly 2 and the heat dissipation assembly 3 with the base 41, the first end cover 42 and the second end cover 43.

[0056] Preferably, the surface of the shell 44 has a heat insulation layer, which can be selected from high-temperature resistant ceramic or other heat insulation materials, and can be determined according to the working condition requirements.

[0057] In some preferred embodiments, as shown in Figure 4 As shown, the crystal assembly 1 comprises a glass tube 11 and a crystal 12; the crystal 12 is arranged in the glass tube 11, and the two ends pass through the first accommodating cavity 424 and the second accommodating cavity 434 after extending out of the two ends of the glass tube 11 and are sealingly connected with the first end cover 42 and the second end cover 43; the glass tube 11 is in clearance fit with the crystal 12 and is sealingly connected with the opposite sides of the first end cover 42 and the second end cover 43. That is, the glass tube 11 and the crystal 12 form an annular channel communicating the first accommodating cavity 424 and the second accommodating cavity 434.

[0058] In some preferred embodiments, a temperature measuring element (not shown) and a water machine device (not shown) (such as a water chiller) are further included; the temperature measuring element is used to measure the temperature of the bar strip assembly 2 and the heat dissipation assembly 3; the water inlet end of the water machine device communicates with one of the first accommodating cavity and the second accommodating cavity, and the water return end communicates with the other; based on the efficient heat dissipation of the first heat pipe 32, the heat dissipation efficiency of the bar strip assembly 2 and the heat dissipation assembly can be improved, and the temperature adjustment is more rapid and timely, i.e. by adjusting the water flow of the water machine device to adjust the temperature of the bar strip assembly 2 and the heat dissipation assembly 3.

[0059] In some preferred embodiments, as shown in Figure 2As shown, the first end cover 42 comprises a first inner end cover 421, a first middle end cover 422 and a first outer end cover 423; the first inner end cover 421 is mounted on the base 41 and is in sealing connection, such as through sealing gasket connection, with the first middle end cover 422, the first outer end cover 423 and the crystal assembly 1, and encloses a first containing cavity 424; and / or, the second end cover 43 comprises a second inner end cover 431, a second middle end cover 432 and a second outer end cover 433; the second inner end cover 431 is mounted on the base 41 and is in sealing connection, such as through sealing gasket connection, with the second middle end cover 432, the second outer end cover 433 and the crystal assembly 1, and encloses a second containing cavity 434.

[0060] In some preferred embodiments, as Figure 3 As shown, the first end cover 42 and the second end cover 43 are connected with a pull rod 7, which is used to pull inwardly between the first end cover 42 and the second end cover 43, so that the sealing gasket abuts and seals the glass tube 11 and the first inner end cover 421 and the glass tube 11 and the second inner end cover 431.

[0061] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, which are only illustrative but not restrictive, and those of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which all belong to the protection of the present application.

Claims

1. A lateral-pumping laser characterized by, Includes a crystal assembly, multiple bar assemblies, multiple heat dissipation assemblies, and a first mounting base; The first mounting base includes a base, a first end cap, and a second end cap; The first end cap and the second end cap are mounted on the base at a distance from each other, and the first end cap has a first receiving cavity and the second end cap has a second receiving cavity. The first receiving cavity and the second receiving cavity are connected to an external circulating water system. One end of the crystal assembly is connected to the first end cap, and the other end is connected to the second end cap; The bar components are arranged circumferentially around the crystal component, with one end installed on the first end cap and the other end installed on the second end cap; The heat dissipation components are configured in a one-to-one correspondence with the bar components, and each heat dissipation component includes a main pipe and multiple first heat pipes; One end of the main pipe is connected to the first receiving cavity, and the other end is connected to the second receiving cavity; One end of each of the first heat pipes is located inside the main pipe and is sealed to the main pipe, while the other end is attached to the heating part of the bar assembly.

2. A lateral pump laser as claimed in claim 1, characterized in that It also includes traffic distribution components; The flow distribution component includes a heat transfer element and a deformation element; The heat transfer element is heat-transfer connected to the crystal assembly; The deformation element is disposed inside the main pipe and connected to the heat transfer element, and can change the projected area along the axial direction of the main pipe when the temperature of the heat transfer element rises.

3. A lateral pump laser as claimed in claim 2, characterized in that The heat transfer component includes a heat-conducting ring and a heat-conducting heat pipe; The thermally conductive ring is arranged around and attached to the surface of the crystal assembly; One end of the heat pipe is connected to the heat-conducting ring, and the other end is located inside the main pipe; The deformable element is disposed at the end of the heat-conducting heat pipe located inside the main pipe.

4. A lateral pump laser as claimed in claim 2 or 3, characterized in that The deformable element is a shape memory metal and extends approximately along the axial direction of the main pipe in the non-deformed state. In the deformed state, the free end of the deformable element bends toward the inner wall of the main pipe.

5. A lateral pump laser as claimed in claim 2 or 3, characterized in that The deformable component includes multiple deformable lobes; The multiple deformation lobes are evenly arranged around the axis of the main pipe.

6. A lateral pump laser as claimed in claim 1, wherein The heat dissipation assembly also includes multiple temperature equalization elements; The temperature equalization element is configured in a one-to-one correspondence with the first heat pipe, with one side attached to the heating part of the bar assembly and the other side attached to the heat pipe.

7. A lateral pump laser as claimed in claim 6, characterized in that The temperature distribution element is a VC plate.

8. A lateral pump laser as claimed in claim 6, characterized in that The bar assembly includes a second mounting base and multiple bar strips; A plurality of the bars are spaced apart on the surface of the second mounting base facing the crystal assembly along the extension direction of the crystal assembly; The second mounting base is disposed adjacent to the crystal assembly, with both ends mounted on the first end cap and the second end cap, and the side of the second mounting base opposite to the bar strip has the mounting position of the temperature equalization element.

9. A lateral pump laser as claimed in claim 6, characterized in that The surface of the second mounting base opposite to the bar has multiple protrusions; The plurality of protrusions are spaced apart along the extension direction of the crystal assembly, and the mounting positions are formed between adjacent protrusions, and the protrusions are in contact with the temperature equalization element.

10. A lateral pump laser as claimed in claim 6, characterized in that The heat dissipation component further includes a first heat dissipation layer and / or a second heat dissipation layer; The first heat dissipation layer is filled between the temperature equalization element and the heat-generating part; The second heat dissipation layer is filled between the first heat pipe and the heat spreader.

11. A side-pumped laser according to any one of claims 1-10, characterized in that, The heat dissipation assembly also includes a third mounting base and a heat insulation plate; The third mounting base has a groove for accommodating the main pipe, and the third mounting base is disposed on the side of the main pipe opposite to the first heat pipe and connected to the bar assembly so that the first heat pipe abuts against the surface of the heating part. The heat insulation plate covers the surface of the heat dissipation assembly between the third mounting base and the bar assembly.

12. A side-pumped laser according to any one of claims 1-10, characterized in that, The first mounting base also includes a housing; The outer shell is a folded plate structure with a "∩" shaped cross-section, which, together with the base, the first end cap, and the second end cap, forms a space to accommodate the crystal assembly, the bar assembly, and the heat dissipation assembly.

13. A side-pumped laser according to any one of claims 1-10, characterized in that, The crystal assembly includes a glass tube and a crystal; The crystal is disposed inside the glass tube, with its two ends extending through the two ends of the glass tube and passing through the first receiving cavity and the second receiving cavity, and is sealed and connected to the first end cap and the second end cap. The glass tube is gap-fitted with the crystal and is sealed to the opposite sides of the first end cap and the second end cap.

14. A side-pumped laser according to any one of claims 1-10, characterized in that, It also includes temperature measuring elements and water treatment equipment; The temperature measuring element is used to measure the temperature of the bar assembly and the heat dissipation assembly; The water inlet of the water machine is connected to one of the first and second accommodating chambers, and the return water outlet is connected to the other.

15. A side-pumped laser according to any one of claims 1-10, characterized in that, It also includes a second heat pipe; The second heat pipe is disposed inside the main pipe and is connected to the cold end of each of the first heat pipes.

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