Printed circuit board

Abstract

The invention provides a printed circuit board. The printed circuit board includes a glass layer having a first surface and a second surface facing each other in a thickness direction, and a side surface connecting the first surface and the second surface. A metal layer is disposed on the side surface of the glass layer, and a first insulating layer is disposed on the first surface and the side surface such that the first insulating layer covers the metal layer on the side surface of the glass layer. This construction enhances electromagnetic shielding and mitigates crack propagation in the glass layer, thereby improving the reliability of the printed circuit board.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0137711, filed on October 10, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The disclosure relates to a printed circuit board. BACKGROUND

[0003] Recently, in order to improve the performance of a printed circuit board, large area, multi-layer, and miniaturization can be necessary. A copper clad laminate (CCL) can be used as a core layer included in a printed circuit board, but can be easily warped due to the low modulus and high coefficient of thermal expansion of the CCL, and can have limitations in implementing a microcircuit. Accordingly, there is an increasing demand for a new material, such as a glass substrate, which can prevent warping and can easily implement a microcircuit. However, in the case of a glass substrate, the outer edge of the panel can be damaged due to handling or equipment operation during a process of manufacturing the substrate, and thus a crack can be formed in a unit area, thereby possibly reducing the yield. SUMMARY

[0004] An aspect of the disclosure is to provide a printed circuit board that can reduce a crack in a glass layer.

[0005] According to an example embodiment, a printed circuit board includes a glass layer having a first surface and a second surface opposite each other in a thickness direction and a side surface connected to the first surface and the second surface, a metal layer disposed on the side surface of the glass layer, and a first insulating layer disposed on the first surface and the side surface of the glass layer, wherein the first insulating layer covers the metal layer located on the side surface of the glass layer.

[0006] The metal layer can be disposed on a portion of the first surface and / or the second surface of the glass layer.

[0007] The first insulating layer can also be disposed in a region of the side surface of the glass layer in which the metal layer is not disposed.

[0008] An area of the side surface of the glass layer covered by the metal layer can be greater than an area of the side surface of the glass layer covered by the first insulating layer and not covered by the metal layer.

[0009] A region of the side surface of the glass layer in which the metal layer is not disposed can be inclined with respect to the thickness direction.

[0010] The region of the side surface of the glass layer, in which the metal layer is not disposed, can include a plurality of regions having different inclination angles with respect to the thickness direction.

[0011] The region of the side surface of the glass layer, in which the metal layer is not disposed, can have a shape in which a width of the glass layer increases and then decreases in a direction from the first surface to the second surface.

[0012] The region of the side surface of the glass layer, in which the metal layer is not disposed, can be more inclined with respect to the thickness direction than a region of the side surface of the glass layer, in which the metal layer is disposed.

[0013] The printed circuit board can further include a second insulating layer disposed on both the second surface and the side surface of the glass layer.

[0014] An area of the side surface of the glass layer covered by the metal layer can be greater than an area of the side surface of the glass layer covered by the second insulating layer and not covered by the metal layer.

[0015] The metal layer on the side surface of the glass layer can be disconnected by the second insulating layer.

[0016] A region of the side surface of the glass layer, in which the second insulating layer is disposed, can include a plurality of regions separated from each other.

[0017] Side surfaces of the first insulating layer and the second insulating layer can be coplanar with each other.

[0018] The first insulating layer and the second insulating layer can include the same material and can be in contact with each other, thereby forming an interface surface.

[0019] The glass layer can include a protrusion formed on the side surface.

[0020] According to an example embodiment, a printed circuit board includes a glass layer having a first surface and a second surface opposite to each other in a thickness direction and a side surface connected to the first surface and the second surface, a metal layer disposed in a first region of the side surface of the glass layer, and an insulating layer including a material different from a material of the glass layer and disposed in a second region of the side surface of the glass layer.

[0021] An area of the first region can be greater than an area of the second region.

[0022] According to an example embodiment, a printed circuit board includes a glass layer having a first surface and a second surface opposite each other in a thickness direction and a side surface connected to the first surface and the second surface; a metal layer disposed on the side surface of the glass layer; a via conductor formed by filling a conductive material in a first via hole of the glass layer, the via conductor being electrically connected to a conductor layer disposed on the first surface and / or the second surface; and a first insulating layer disposed on the first surface and the side surface of the glass layer, wherein the first insulating layer covers the metal layer located on the side surface of the glass layer. BRIEF DESCRIPTION OF DRAWINGS

[0023] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 is a block diagram illustrating an example of an electronic device system; Figure 2 is a perspective view illustrating an example of an electronic device; Figure 3 is a cross-sectional view illustrating an example of a printed circuit board; Figures 4 to 12 is a diagram illustrating an example of a process for manufacturing a printed circuit board according to an example embodiment; Figure 13 and Figure 14 is a diagram illustrating another example of a process for manufacturing a printed circuit board according to an example embodiment; Figure 15 is a cross-sectional view illustrating another example of a printed circuit board according to an example embodiment; and Figure 16 is a cross-sectional view illustrating another example of a printed circuit board according to an example embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0025] The present disclosure is not limited to the example embodiments, and it should be understood that various modifications can be made without departing from the spirit and scope of the present disclosure. The embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. Some elements can be exaggerated in the drawings, and the same elements will be denoted by the same reference numerals.

[0026] Electronic device Figure 1 is a block diagram illustrating an example of an electronic device system.

[0027] Referring to Figure 1The electronic device 1000 can accommodate the main board 1010 therein. The main board 1010 can be physically or electrically connected to the chip-related components 1020, the network-related components 1030, the other components 1040, and the like. These components can be connected to other electronic components to be described below through various signal lines 1090.

[0028] The chip-related components 1020 can include a memory chip such as a volatile memory (e.g., a dynamic random access memory (DRAM)), a non-volatile memory (e.g., a read only memory (ROM) or a flash memory), and the like, an application processor chip such as a central processing unit (e.g., a central processing unit (CPU)), a graphics processing unit (e.g., a graphics processing unit (GPU)), a digital signal processor, a cryptographic processor, a microprocessor, a microcontroller, and the like, and a logic chip such as an analog-digital converter (ADC), an application specific integrated circuit (ASIC), and the like. However, the chip-related components 1020 are not limited thereto, and can further include other types of chip-related components. Also, the chip-related components 1020 can be combined with each other.

[0029] The network-related components 1030 can include components compatible with or operating according to protocols such as wireless fidelity (Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11 series, etc.), worldwide interoperability for microwave access (WiMAX) (IEEE 802.16 series, etc.), IEEE 802.20, long term evolution (LTE), evolution-data optimized (Ev-DO), high speed packet access+ (HSPA+), high speed downlink packet access+ (HSDPA+), high speed uplink packet access+ (HSUPA+), global system for mobile communications (GSM), enhanced data rates for GSM evolution (EDGE), global positioning system (GPS), general packet radio service (GPRS), code division multiple access (CDMA), time division multiple access (TDMA), digital enhanced cordless telecommunications (DECT), Bluetooth, third generation mobile communication technology (3G) protocol, fourth generation mobile communication technology (4G) protocol, and fifth generation mobile communication technology (5G) protocol, and any other wireless protocol and wired protocol designated after the above protocols. However, the network-related components 1030 are not limited thereto, and can further include components compatible with or operating according to various other wireless standards or protocols or wired standards or protocols. Also, the network-related components 1030 can be combined with the above-described chip-related components 1020, together with each other.

[0030] The other components 1040 can include high frequency inductors, ferrite inductors, power inductors, ferrite beads, low temperature co-fired ceramic (LTCC) components, electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCCs), etc. However, the other components 1040 are not limited thereto, and can further include passive components for various other purposes, etc. Also, the other components 1040 can be combined with each other together with the above-described chip-related components 1020 and / or the above-described network-related components 1030.

[0031] The electronic device 1000 can include other electronic components that are physically or electrically connected to the main board 1010 or are not physically or electrically connected to the main board 1010, according to the type of the electronic device 1000. These other electronic components can include, for example, a camera 1050, an antenna 1060, a display 1070, and a battery 1080. However, these other electronic components are not limited thereto, and can further include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a large-capacity storage unit (e.g., a hard drive), a compact disc (CD) drive, a digital versatile disc (DVD) drive, etc. The electronic device 1000 can also include other electronic components for various purposes, according to the type of the electronic device 1000.

[0032] The electronic device 1000 can be a smart phone, a personal digital assistant (PDA), a digital camera, a camcorder, a web system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, a car component, etc. However, the electronic device 1000 is not limited thereto, and can be any other electronic device that processes data.

[0033] Figure 2 is a perspective view showing an example of an electronic device.

[0034] Referring to Figure 2 , the electronic device can be a smart phone 1100. A main board 1110 can be housed in the smart phone 1100, and various components 1120 can be physically or electrically connected to the main board 1110. Also, other electronic components (such as a camera module 1130 and / or a speaker 1140) that are physically or electrically connected to the main board 1110 or are not physically or electrically connected to the main board 1110 can be housed in the smart phone 1100. Part of the components 1120 can be chip-related components, such as a component package 1121, but example embodiments thereof are not limited thereto. The component package 1121 can be a printed circuit board on which electronic components (including active components and / or passive components) are surface-mounted. Alternatively, the component package 1121 can be a printed circuit board in which active components and / or passive components are embedded. The electronic device is not necessarily limited to the smart phone 1100, and can be other electronic devices as described above.

[0035] Printed circuit board Figure 3 is a cross-sectional view showing an example of a printed circuit board. Referring to Figure 3 According to an embodiment, the printed circuit board 100 can include a glass layer 111, a metal layer 112, and a first insulating layer 113. Here, the metal layer 112 can be disposed on a side surface of the glass layer 111, the first insulating layer 113 can be disposed on a first surface S1 and the side surface of the glass layer 111, and can cover the metal layer 112 located on the side surface of the glass layer 111. In addition, the printed circuit board 100 can further include a second insulating layer 114, a via conductor 120, conductor layers 121, 122, 123, and 124, connection vias 131 and 132, passivation layers 141 and 142, etc. The above-described structure can reduce the propagation of cracks in the outer side area of the panel to the glass layer 111 of the unit substrate area (unit area) during the process of manufacturing the printed circuit board 100, and in addition, since the metal layer 112 is disposed on the side surface of the glass layer 111, the electromagnetic shielding effect can be improved. Hereinafter, the main elements of the printed circuit board 100 can be described in more detail.

[0036] The glass layer 111 can include glass (amorphous solid). The glass can include, for example, pure silica (about 100% of SiO2), soda-lime glass, borosilicate glass, alumino-silicate glass, etc. However, embodiments are not limited thereto, and alternative glass materials (such as fluorine-based glass, phosphate glass, or sulfur-based glass) can also be used. In addition, other additives can be included to form glass having specific physical properties. Such additives can include magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, and carbonates and / or oxides of these elements and carbonates and / or oxides of other elements, such as calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda). The glass layer 111 can be distinguished from an insulating material (such as a copper-clad laminate (CCL) or a prepreg (PPG)) including glass fibers (such as glass fabric, for example, glass cloth). For example, the glass layer 111 can include a glass plate (GC).

[0037] The glass layer 111 can have a first surface S1 and a second surface S2 opposite each other in a thickness direction (vertical direction based on the drawing) and a side surface connected to the first surface S1 and the second surface S2. The metal layer 112 can be disposed on the side surface of the glass layer 111 and can also be disposed on a portion of the first surface S1 and / or the second surface S2; in one embodiment, the metal layer 112 is disposed on a portion of the first surface S1 and a portion of the second surface S2. Further, the metal layer 112 can be disposed on a portion of the side surface of the glass layer 111 and not disposed on the remaining portion of the side surface of the glass layer 111, and at least one of the first insulating layer 113 and the second insulating layer 114 can be disposed on the remaining portion of the side surface of the glass layer 111. In this case, the area of a first region on the side surface of the glass layer 111 on which the metal layer 112 is disposed can be greater than the area of a second region on the side surface of the glass layer 111 on which at least one of the first insulating layer 113 and the second insulating layer 114 is disposed and on which the metal layer 112 is not disposed. This is because the first insulating layer 113 and the second insulating layer 114, which include a material different from that of the glass layer 111, can be formed on the bridge region B required in the manufacturing process of the glass layer 111, whereas the metal layer 112 is formed on the other regions of the side surface of the glass layer 111 except for the bridge region B. By forming the metal layer 112 on a sufficiently large region, the electromagnetic shielding effect can be improved. Here, the first region and the second region can be arranged along the side surface of the glass layer 111.

[0038] The metal layer 112 can be formed on the surface of the glass layer 111 through a plating process and can be implemented in a multi-layer structure including a seed layer and a plated layer. As an example of a material, the metal layer 112 can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal layer 112 can include copper (Cu), but embodiments thereof are not limited thereto. In an embodiment, the metal layer 112 can be formed on the regions of the side surface of the glass layer 111 except for the bridge region (an outer side region connected to an adjacent unit or panel) in the manufacturing process described below. By covering the side surface of the glass layer 111, the metal layer 112 can have an electromagnetic shielding function and thus can improve the reliability of the printed circuit board 100.

[0039] A first insulating layer 113 may be disposed on a first surface S1 and a side surface of the glass layer 111, and may cover the metal layer 112 located on the side surface of the glass layer 111. Furthermore, the first insulating layer 113 may also be disposed in the area of ​​the side surface of the glass layer 111 where the metal layer 112 is not disposed. In this case, the area of ​​the side surface of the glass layer 111 covered by the metal layer 112 may be larger than the area of ​​the side surface of the glass layer 111 covered by the first insulating layer 113 but not covered by the metal layer 112. The area of ​​the side surface of the glass layer 111 where the metal layer 112 is not disposed may have a shape inclined relative to the thickness direction (i.e., such as...). Figure 3 As shown, the area on the side surface of glass layer 111 without the metal layer 112 may include a tilted region I1, and a first insulating layer 113 may be disposed in the tilted region I1. As a more specific example, the area on the side surface of glass layer 111 without the metal layer 112 may include multiple regions I1 and I2 with different tilt angles relative to the thickness direction. Furthermore, the area on the side surface of glass layer 111 without the metal layer 112 may have a shape in which the width of glass layer 111 increases and then decreases in the direction from the first surface S1 to the second surface S2. Moreover, compared to the area on the side surface of glass layer 111 with the metal layer 112, the area on the side surface of glass layer 111 without the metal layer 112 may be more tilted relative to the thickness direction. The tilted structure can be obtained by adjusting the shape of the through-hole in the bridging region B during the process of forming through-holes in the outer region of the cell region, as described later.

[0040] However, as in Figure 15 In a variant example, the area on the side surface of the glass layer 111 where the metal layer 112 is not disposed can be formed substantially parallel to the thickness direction, rather than inclined relative to the thickness direction, and this can be achieved by adjusting the shape of the through-hole. Furthermore, as in... Figure 16 In a variant example, the area on the side surface of the glass layer 111 where the metal layer 112 is disposed can be formed to be inclined relative to the thickness direction, rather than substantially parallel to the thickness direction. Therefore, the metal layer 112 on the side surface of the glass layer 111 can be formed to be inclined relative to the thickness direction.

[0041] See you again Figure 3The second insulating layer 114 may be disposed on the second surface S2 and the side surface of the glass layer 111. In this case, the area of ​​the side surface of the glass layer 111 covered by the metal layer 112 may be larger than the area of ​​the side surface of the glass layer 111 covered by the second insulating layer 114 but not covered by the metal layer 112. Here, the second insulating layer 114 may cover a portion of the side surface of the glass layer 111, and the first insulating layer 113 may cover another portion of the side surface of the glass layer 111. Furthermore, the metal layer 112 on the side surface of the glass layer 111 may be disconnected by the second insulating layer 114. As a more specific example, the area on the side surface of the glass layer 111 where the second insulating layer 114 is disposed may include multiple areas separated from each other, so the metal layer 112 on the side surface of the glass layer 111 may be divided into multiple areas. As described in the process later, the second insulating layer 114 may be formed by removing the bridging area connected to the outer area of ​​the panel of the glass layer 111 or adjacent other units. Figure 6 (B in the middle), and fill with insulating material.

[0042] like Figure 3 As shown, the side surfaces of the first insulating layer 113 and the second insulating layer 114 may be coplanar. As described later, such a coplanar structure can be achieved during the formation of the first insulating layer 113 and the second insulating layer 114 by cutting the layers into units. The first insulating layer 113 and the second insulating layer 114 may comprise the same material and be in contact with each other to form an interface surface.

[0043] The first insulating layer 113 and the second insulating layer 114 may comprise materials different from those of the glass layer 111, such as organic insulating materials. Organic insulating materials may comprise thermosetting resins (such as epoxy resins) or thermoplastic resins (such as polyimide), or may comprise materials including inorganic fillers, organic fillers, and / or glass fibers (such as glass fabrics, for example, glass cloth), as well as thermosetting and / or thermoplastic resins. For example, organic insulating materials may be prepreg (PPG), Ajinomoto laminate (ABF), photosensitive dielectric (PID), solder resist (SR), etc., but embodiments are not limited thereto. Each of the first insulating layer 113 and the second insulating layer 114 may be constructed using multiple layers when necessary.

[0044] Each of the first conductor layer 121, the second conductor layer 122, the third conductor layer 123, and the fourth conductor layer 124 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, copper (Cu) may be included, but embodiments thereof are not limited thereto. Each of the first conductor layer 121, the second conductor layer 122, the third conductor layer 123, and the fourth conductor layer 124 may perform various functions according to design, such as serving as a signal pattern, a power pattern, a ground pattern, etc. Each of these patterns may have various shapes such as lines, planes, and pads. Each of the first conductor layer 121, the second conductor layer 122, the third conductor layer 123, and the fourth conductor layer 124 may include a seed layer and a plating layer. The seed layer may be formed by an electroless plating process (e.g., a chemical copper plating process), and when required, the seed layer may be formed by a sputtering process. Optionally, both processes may be used. The plating layer can be formed by an electrolytic plating process (e.g., an electrolytic copper plating process). When the first insulating layer 113 and the second insulating layer 114 are formed as multiple layers, the first conductor layer 121, the second conductor layer 122, the third conductor layer 123, and the fourth conductor layer 124 can be formed as multiple layers corresponding to the first insulating layer 113 and the second insulating layer 114. The first conductor layer 121, the second conductor layer 122, the third conductor layer 123, and the fourth conductor layer 124 can protrude from the first insulating layer 113 and the second insulating layer 114, respectively, or they can be embedded in the first insulating layer 113 and the third insulating layer 114, respectively.

[0045] The via conductor 120 may comprise a metal. The metal may comprise copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, the via conductor 120 may comprise copper (Cu), but embodiments thereof are not limited thereto. The via conductor 120 may be accessible through a first through-hole (… Figure 5 The via conductor 120 is formed by filling the H1 layer with conductive material. The via conductor 120 can perform various functions depending on the design. For example, the via conductor 120 may include signal vias, power vias, ground vias, etc. The via conductor 120 may be connected to each of the first conductor layer 121 and the second conductor layer 122. The via conductor 120 may include a seed layer and a plating layer. The seed layer may be formed by an electroless plating process (e.g., chemical copper plating process), or, if desired, by a sputtering process. Optionally, both processes may be used. The plating layer may be formed by an electrolytic plating process (e.g., electrolytic copper plating process).

[0046] Each of the first connection via 131 and the second connection via 132 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, the via may include copper (Cu), but embodiments thereof are not limited thereto. Each of the first connection via 131 and the second connection via 132 may perform various functions depending on the design. For example, the via may include a signal via, a power via, a ground via, etc. Each of the first connection via 131 and the second connection via 132 may include a filled via (filled VIA) formed by filling the via with metal, but if desired, the via may also include a conformal via (conformal VIA) formed by distributing metal along the wall surface of the via. Each of the first connection via 131 and the second connection via 132 may have a tapered cross-section. For example, the first connecting via 131 may have a wider width at its upper end than at its lower end in cross-section, and the second connecting via 132 may have a wider width at its lower end than at its upper end in cross-section. Each of the first connecting via 131 and the second connecting via 132 may include a seed layer and a plating layer respectively included in the third conductor layer 123 and the fourth conductor layer 124. There may be multiple instances of each of the first connecting via 131 and the second connecting via 132.

[0047] The first resist layer 141 and the second resist layer 142 may have openings that expose the conductor layer and may include an organic insulating material. Here, the organic insulating material may include thermosetting resins (such as epoxy resins) or thermoplastic resins (such as polyimide), or may be a material comprising inorganic fillers, organic fillers, and / or glass fibers (such as glass fabrics, for example, glass cloth) and thermosetting and / or thermoplastic resins. For example, the organic insulating material may be prepreg (PPG), Ajinomoto laminate (ABF), photosensitive dielectric (PID), solder resist (SR), etc., but embodiments are not limited thereto.

[0048] In the following text, reference will be made to Figures 4 to 12 An example describing the process used to manufacture printed circuit boards. First, refer to... Figures 4 to 6 The process for forming through-holes in glass layer 111 is described. Figure 6 In the diagram, glass layer 111 is shown in plan view, while Figure 5 It is along Figure 6 A cross-sectional view taken from line I-I'. Preparation of glass layer 111 ( Figure 4 ), and as Figure 5 and Figure 6As shown, a first through-hole H1 and a second through-hole H2 are formed in the glass layer 111. Through-holes H1 and H2 can be formed by processes such as etching, sandblasting, laser processing, or plasma treatment. The first through-hole H1 is the region where the via conductor 120 will be formed, and the second through-hole H2 corresponds to the dicing region used to divide the unit region U. A bridging region B is formed to support the unit region U; the bridging region B corresponds to the region of the glass layer 111 that is not completely penetrated in the thickness direction and remains intact. In the bridging region B, the side surface of the glass layer 111 is formed as an inclined surface.

[0049] For reference Figure 7 and Figure 8 The process for forming the metal layer 112 and the via conductor 120 is described. Figure 8 This is a plan view of glass layer 111 as seen from above. Figure 7 It is along Figure 8 The image shows a cross-sectional view taken along line I-I'. A via conductor 120 can be formed by filling the first through-hole H1 of the glass layer 111, and a first conductor layer 121 and a second conductor layer 122 can be formed on the upper and lower surfaces of the glass layer 111 (corresponding to the first and second surfaces described above, respectively). Furthermore, a metal layer 112 can be formed to cover the side, upper, and lower surfaces of the glass layer 111. In this case, the metal layer 112 can be formed after a mask layer is formed on the upper surface of the glass layer 111, so that the metal layer 112 is not formed in the bridging region B. Therefore, the metal layer 112 on the side surface of the glass layer 111 can be disconnected through the bridging region B. As described later, the bridging region B can be removed in a subsequent process, and a second insulating layer 114 can be filled in the corresponding region, thus obtaining a structure in which the metal layer 112 is disconnected through the second insulating layer 114.

[0050] Subsequently, refer to Figure 9 A first insulating layer 113 is formed on the upper surface of the glass layer 111, and the first insulating layer 113 completely fills the second through-hole H2, which includes the bridging region B. Then, referring to... Figure 10 This forms a third through-hole H3, causing at least a portion of the bridging region B to be removed, thereby separating the glass layer 111 into individual units. Although in Figure 10 The cross-sectional view is not shown, but since each unit region U has multiple bridging regions B (two bridging regions in this embodiment), multiple third through-holes H3 can also be formed. Subsequently, a second insulating layer 114 can be formed on the lower surface of the glass layer 111 and in the third through-holes H3. Figure 11 Conductor layers 123 and 124, via conductors 131 and 132, and passivation layers 141 and 142 can be formed. Figure 12Subsequently, a cutting process can be performed along the cutting line D to separate the components by unit. In this case, the cutting line D may extend beyond the glass layer 111, so that the first insulating layer 113 and the second insulating layer 114 can be cut.

[0051] The above process yielded... Figure 3 The printed circuit board 100 shown can also be realized by appropriate modifications to the manufacturing method described above, and a printed circuit board according to the modified example can also be realized.

[0052] Unlike the manufacturing process described above, the bridging region B may not be completely removed but may be partially retained, as can be referred to... Figure 13 and Figure 14 Describe it. Figure 13 The following example is shown: In Figure 9 After the process in the middle, while retaining the bridging region B, conductor layers 123 and 124, via conductors 131 and 132, and passivation layers 141 and 142 are formed. Subsequently, a dicing process can be performed along the dicing line D to separate the components by unit, and as... Figure 13 As shown, the cutting line D can be identified as passing through the bridging region B. Figure 14 A printed circuit board in an individualized state is shown, and a protrusion P (i.e., the remaining area of ​​the bridging region B) may be formed on the side surface of the glass layer 111. By including the protrusion P in the glass layer 111, the area of ​​the glass layer 111 can be increased, thereby improving warpage characteristics, and in this case, cracks may be difficult to propagate through the protrusion P due to its relatively small size.

[0053] According to the above example embodiments, the occurrence of cracks in the glass layer of the printed circuit board can be reduced, thereby improving the reliability of the printed circuit board.

[0054] In embodiments, the expressions "cover" or "coverable" can include complete coverage and at least partial coverage, and may also include direct coverage and indirect coverage. Furthermore, the expressions "fill" or "coverable" can include complete filling and at least partial filling, and may also include substantial filling (e.g., including cases where pores or voids exist). Furthermore, the expression "surround" can include complete surrounding, partial surrounding, and substantial surrounding. Furthermore, the expression "exposed" can include complete exposure and partial exposure, and the expression "exposed" can mean that one element is exposed from another element (the one element being embedded in the other element). For example, a configuration that exposes a pad through an opening can mean that the pad is exposed from a resist layer, and a surface treatment layer may also be disposed on the exposed pad.

[0055] In embodiments, in a cross-section, a configuration in which an object is disposed within a through portion or through hole may include a configuration in which the object is completely disposed within the through portion or through hole, and a configuration in which the object protrudes upward or downward beyond the through portion or through hole. For example, in a plane, this configuration can be understood in a broader sense when the object is disposed within a through portion or through hole.

[0056] In embodiments, process errors, positional deviations, and measurement errors occurring during the manufacturing process may be included. For example, a substantially vertical structure may include a completely vertical structure and a nearly vertical structure. Furthermore, a substantially coplanar structure may include a structure in which the elements are entirely on the same plane and a structure in which the elements are nearly on the same plane.

[0057] In the embodiments, "the same insulating material" can refer to examples where the insulating material is exactly the same, or examples where the material includes the same type of insulating material. Therefore, the composition of the insulating material can be substantially the same, and its specific composition ratios can differ slightly.

[0058] In embodiments, the term "section" may refer to the cross-sectional shape observed when an object is cut in a vertical direction or when the object is viewed from the side. Similarly, the term "plane" may refer to the cross-sectional shape when an object is cut in a horizontal direction or the planar shape observed when the object is viewed from the top or bottom.

[0059] In the embodiments, for ease of description, the terms "lower side," "lower part," and "lower surface" may be used to indicate the downward direction of the cross-section based on the drawings, and the terms "upper side," "upper part," and "upper surface" may be used to indicate the opposite direction. However, the above directions are defined for ease of description, and the scope of the claims is not specifically limited by these directional descriptions, and the concept of "upper / lower" may vary.

[0060] In embodiments, the connection may be constructed as both direct and indirect connections (e.g., via an adhesive layer). Additionally, the electrical connection may be constructed as either physically connected or not connected. Furthermore, terms such as "first" and "second" are used only to distinguish one element from another and do not indicate any particular order or importance. In some cases, without departing from the scope of the claims, a first element may be referred to as a second element, and vice versa.

[0061] In embodiments, thickness, width, length, depth, linewidth, spacing, pitch, interval distance, surface roughness, etc., can be measured using a scanning microscope or optical microscope based on a cross-section obtained by polishing or cutting the printed circuit board. The cross-section can be a vertical or horizontal cross-section, and each value can be measured based on the desired cross-section. For example, the width of the upper and / or lower ends of a via can be measured on a cross-section taken along the central axis of the via. In this case, when the measured values ​​of one of the thickness, width, length, depth, linewidth, spacing, pitch, interval distance, surface roughness, etc., are not constant, the value of one of them can be determined as the average of the values ​​measured at any five points.

[0062] The term "example" used in the embodiments does not refer to the same embodiment, but is provided to describe and emphasize the unique features of each example. However, an example can be implemented by combining features with those of other examples. For example, unless otherwise stated, a feature described in a particular example may be understood to be relevant to another example even if it is not described in another example.

[0063] For ease of description, terms may be defined as described above, and the scope of the exemplary embodiments is not particularly limited to the terms described above. Unless a term used in the singular has a clearly different meaning in the context, a term used in the singular encompasses a plural term.

[0064] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A printed circuit board, comprising: A glass layer having a first surface and a second surface opposite to each other in the thickness direction, and a side surface connected to the first surface and the second surface; A metal layer is disposed on the side surface of the glass layer; as well as A first insulating layer is disposed on the first surface and the side surface of the glass layer. The first insulating layer covers the metal layer located on the side surface of the glass layer.

2. The printed circuit board as claimed in claim 1, wherein, The metal layer is disposed on a portion of the first surface and / or the second surface of the glass layer.

3. The printed circuit board as claimed in claim 1, wherein, The first insulating layer is also disposed in the area on the side surface of the glass layer where the metal layer is not disposed.

4. The printed circuit board as claimed in claim 3, wherein, The area of ​​the side surface of the glass layer covered by the metal layer is greater than the area of ​​the side surface of the glass layer that is covered by the first insulating layer but not by the metal layer.

5. The printed circuit board as claimed in claim 1, wherein, The area on the side surface of the glass layer where the metal layer is not disposed is inclined relative to the thickness direction.

6. The printed circuit board as claimed in claim 5, wherein, The area on the side surface of the glass layer where the metal layer is not disposed includes multiple areas with different tilt angles relative to the thickness direction.

7. The printed circuit board as claimed in claim 6, wherein, The area of ​​the side surface of the glass layer where the metal layer is not disposed has a shape in which the width of the glass layer increases and then decreases in the direction from the first surface to the second surface.

8. The printed circuit board as claimed in claim 5, wherein, Compared to the area on the side surface of the glass layer where the metal layer is provided, the area on the side surface of the glass layer where the metal layer is not provided is more inclined relative to the thickness direction.

9. The printed circuit board of claim 1, further comprising: A second insulating layer is disposed on both the second surface and the side surface of the glass layer.

10. The printed circuit board of claim 9, wherein, The area of ​​the side surface of the glass layer covered by the metal layer is greater than the area of ​​the side surface of the glass layer that is covered by the second insulating layer but not by the metal layer.

11. The printed circuit board of claim 9, wherein, The metal layer on the side surface of the glass layer is disconnected by the second insulating layer.

12. The printed circuit board of claim 11, wherein, The area on the side surface of the glass layer where the second insulating layer is disposed includes multiple areas that are separated from each other.

13. The printed circuit board as claimed in claim 9, wherein, The side surfaces of the first insulating layer and the second insulating layer are coplanar.

14. The printed circuit board of claim 9, wherein, The first insulating layer and the second insulating layer are formed using the same material and are in contact with each other, thereby forming an interface surface.

15. The printed circuit board as claimed in claim 1, wherein, The glass layer includes protrusions formed on the side surface.

16. A printed circuit board, comprising: A glass layer having a first surface and a second surface opposite to each other in the thickness direction, and a side surface connected to the first surface and the second surface; A metal layer is disposed in a first region of the side surface of the glass layer; as well as An insulating layer, comprising a material different from that of the glass layer, is disposed in a second region of the side surface of the glass layer.

17. The printed circuit board of claim 16, wherein, The area of ​​the first region is larger than the area of ​​the second region.

18. The printed circuit board of claim 16, wherein, The metal layer is not disposed in the second region, and the insulating layer is also disposed in the first region to cover the metal layer.

19. A printed circuit board, comprising: A glass layer having a first surface and a second surface opposite to each other in the thickness direction, and a side surface connected to the first surface and the second surface; A metal layer is disposed on the side surface of the glass layer; A via conductor is formed by filling a first via in the glass layer with conductive material, and the via conductor is electrically connected to a conductor layer disposed on the first surface and / or the second surface. as well as A first insulating layer is disposed on the first surface and the side surface of the glass layer, wherein the first insulating layer covers the metal layer located on the side surface of the glass layer.

20. The printed circuit board of claim 19, wherein, The via conductor includes a seed layer.

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