Electrical interconnection component adopting laser selective conductor and preparation method

Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to an electrical interconnection component adopting a laser selective conductor and a preparation method, and solves the problem of complex preparation of the electrical interconnection component in the prior art. The method provided by the invention comprises the following steps: providing a base material, wherein the carbon content in the base material is greater than 70%; a patterned carbonization layer is formed on a substrate by adopting a laser selective conductor, the sum of the content of SP2 hybrid carbon and elemental carbon in the carbonization layer is greater than 80%, the sheet resistance is less than 30 omega / sq, the porosity is less than 60%, and the characteristic aperture is 50-500 nm; and carrying out pattern electroplating, and forming a metal layer on the carbonized layer by taking the carbonized layer as a cathode. The carbonized layer has good conductivity and adhesive force and can be directly used as a seed layer for electroplating, so that a metal layer with a specific thickness is directly grown on the carbonized layer, the preparation process of the electrical interconnection component is simplified, and the production cost and the environmental protection cost can be effectively reduced.

Description

Technical Field

[0001] This invention relates to the technical field of circuit board manufacturing, and more specifically to an electrical interconnect component employing laser selective conductorization and its fabrication method. Background Technology

[0002] As electronic products evolve towards miniaturization, lightweighting, and high integration, higher demands are being placed on circuit boards and interconnect components. Traditional printed circuit board (PCB) manufacturing employs a subtractive manufacturing process, involving complex pattern transfer, chemical etching, and multilayer lamination. This process is lengthy, highly polluting, and difficult to manufacture circuits on complex three-dimensional curved surfaces. Therefore, the industry is exploring various technologies for directly forming circuits.

[0003] One such technology is laser-induced graphene (LAB) technology, which uses lasers to ablate conductive patterns on the surface of a carbon polymer substrate. However, existing LAB technologies primarily focus on generating graphene as porous carbonized layers, which have limited conductivity and adhesion to the substrate, making them unsuitable for direct use as interconnects carrying high currents. Furthermore, the carbonized layer needs to be metallized to achieve good conductivity. During metallization, due to the limited conductivity of the carbonized layer, processes such as electroless copper plating are typically introduced to deposit a copper layer as a "seed pattern" on the surface of the carbonized layer. This "seed pattern" is then used as a cathode for electroplating to thicken the copper layer and form a circuit. However, the electroless plating solution used in electroplating contaminates the entire substrate surface, damaging the insulation properties of non-patterned areas (i.e., non-circuit areas). Moreover, the electroless plating process is complex, the presence of precious metal catalysts in the solution leads to high costs, and the wastewater requires treatment, resulting in high environmental costs.

[0004] Therefore, there is an urgent need for an electrical interconnect component and its fabrication method that employs laser selective conductors to solve the problem of complex processes in current direct molding technologies. Summary of the Invention

[0005] In view of this, embodiments of the present invention aim to provide an electrical interconnect component employing laser selective conductors and a method for its fabrication.

[0006] In a first aspect, the present invention provides a method for fabricating an electrical interconnect component employing laser selective conductor formation, comprising: providing a substrate, the substrate being made of a carbon polymer and having a carbon content greater than 70%; selectively conductor forming the substrate with a laser to form a patterned carbonized layer on the substrate, wherein the carbonized layer is formed by selectively ablating and pyrolyzing the substrate with a laser, the carbonized layer having a content of SP2 hybrid carbon and elemental carbon greater than 80%, a sheet resistance less than 30 Ω / sq, a porosity less than 60%, and a characteristic pore size of 50 nm to 500 nm; and performing patterned electroplating, using the carbonized layer as a cathode to form a metal layer on the carbonized layer.

[0007] In one embodiment, the method further includes: after pattern electroplating, removing or cutting process wires, the process wires being part of the carbide layer on which the metal layer is plated.

[0008] In one embodiment, the method further includes: after removing or cutting the process wire, stacking and assembling the electrical interconnection component with the prefabricated core board, wherein the electrical interconnection component is electrically connected to the core board.

[0009] In one embodiment, the step of stacking and assembling the electrical interconnection component with the prefabricated core board includes: electrically connecting the metal layer of the electrical interconnection component to the circuit on the core board by means of mechanical interconnection, welding or conductive adhesive connection.

[0010] In one embodiment, the provision of the substrate includes: the material of the substrate is any one or more of polyimide, polyetheretherketone, liquid crystal polymer, and polyphenylene sulfide.

[0011] In one embodiment, the laser selective conductor-conducting of the substrate includes: the laser being a pulsed laser emitted from an infrared laser, a green laser, an ultraviolet laser, or a deep ultraviolet laser, the laser having a power of 1W to 1000W, a scanning speed of 0.1mm / s to 1000mm / s, and a pulse frequency of 0.001kHz to 10000kHz.

[0012] In one embodiment, the laser selective conductorization of the substrate includes: laser selective conductorization of the substrate in a closed environment, a halogenated hydrocarbon environment, or a carbon-containing gas environment.

[0013] In one embodiment, providing a substrate includes: the substrate having through holes or blind holes; the laser selective conductor-forming of the substrate includes: selectively scanning a portion of the inner sidewall of the through holes or blind holes and at least one side of the substrate with a laser to form a continuous carbonized layer on the inner sidewall of the through holes and at least one side of the substrate.

[0014] In one embodiment, the pattern electroplating includes: immersing the substrate in an electroplating solution and electrically connecting the cathode to the carbonized layer; wherein the electroplating solution is one of acidic copper sulfate electroplating, copper sulfamate electroplating, or cyanide copper plating.

[0015] In a second aspect, an electrical interconnection component is manufactured using the method described above.

[0016] Compared with the prior art, the present invention has at least the following advantages: The present invention provides a method for fabricating electrical interconnect components using laser selective conductors, comprising: providing a substrate, the substrate being a carbon polymer with a carbon content greater than 70%; using laser selective conductors to form a patterned carbonized layer on the substrate, wherein the carbonized layer is formed by selective ablation and pyrolysis of the substrate by a laser, the carbonized layer having a content of SP2 hybrid carbon and elemental carbon greater than 80%, a sheet resistance less than 30 Ω / sq, a porosity less than 60%, and a characteristic pore size of 50 nm to 500 nm; and performing patterned electroplating, using the carbonized layer as a cathode to form a metal layer on the carbonized layer. The carbonized layer has good conductivity and adhesion, and can be directly used as a seed layer for electroplating, thereby directly growing a metal layer of a specific thickness on the carbonized layer. This simplifies the fabrication process of electrical interconnect components, eliminating multiple complex and polluting processes such as chemical plating, pattern transfer, and etching in traditional processes, effectively reducing production and environmental costs. Attached Figure Description

[0017] Figure 1 The diagram shows a flowchart of a prior art method for fabricating electrical interconnect components using laser-induced graphene.

[0018] Figure 2 The diagram shows a flowchart of the method for fabricating an electrical interconnect component using laser selective conductors provided by the present invention. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0022] For certain elements, terms like "above" or "over" are sometimes used when describing the position of an element in certain directions, while "below" or "under" is used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "over," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, the terms "first," "second," and "third," etc., are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0023] To facilitate a comparative understanding of the overall concept of this invention, the following provides a detailed description of existing methods for preparing electrical interconnect components using laser-induced graphene technology.

[0024] refer to Figure 1 A method for fabricating electrical interconnect components using laser-induced graphene, comprising: S100. Provide a substrate. The substrate material is a carbon polymer, such as polyimide (PI).

[0025] S200 employs laser selective conductor substrate to form a patterned carbonized layer on the substrate.

[0026] The area on the substrate scanned by the laser converts light energy into heat energy, causing the scanned area to heat up rapidly. Elements such as oxygen, nitrogen, and hydrogen in the substrate escape in gaseous forms (e.g., carbon dioxide, nitrogen oxides, and water vapor), leaving behind a carbon-rich framework. The remaining carbon atoms rearrange at high temperature to form an interconnected three-dimensional porous graphene network with an sp2 hybrid structure, thereby creating a patterned carbonized layer within the laser-scanned area and achieving selective conductivity of the substrate. In other words, by controlling the laser scanning path with a computer, any desired patterned carbonized layer can be directly "drawn" without the need for masks or chemical etching.

[0027] S300: A copper layer is deposited on the surface of the carbide layer using electroless copper plating to form a seed layer. It should be noted that the copper layer deposited on the carbide layer surface using electroless copper plating is very thin, ensuring continuity across the carbide layer surface to enhance its conductivity. This serves as the seed layer for subsequent electrochemical copper plating.

[0028] S400: An electrochemical method is used to continue growing a copper layer on the surface of the seed layer. The seed layer is generally connected to the cathode. During the electrochemical copper plating process, the copper layer naturally grows on the surface of the seed layer until the copper layer reaches the required thickness.

[0029] In the fabrication of the aforementioned electrical interconnect components, laser-induced graphene technology primarily focuses on generating porous carbon layers on the thin film surface. The conductive pathways of these three-dimensional porous carbon layers are tortuous, requiring electron transport to overcome the contact resistance between numerous graphene sheets. This results in high bulk resistivity of the porous carbon layers. Simultaneously, the porous structure leads to a smaller effective conductive cross-sectional area, concentrating current on a limited graphene framework. Consequently, the current-carrying capacity of the carbon layer is limited, easily leading to overheating, electromigration, or thermal burn-out. Therefore, it is generally difficult to directly use the carbon layer as a seed layer for electroplating. Thus, electroless copper plating is necessary to form a copper layer with lower resistance and a uniform cross-section as a seed layer. However, during electroless copper plating, the copper layer deposits on the entire substrate surface, contaminating the entire substrate surface and potentially damaging the insulation of non-patterned areas (i.e., areas without a carbon layer). Therefore, an additional stripping step is required, complicating the process and increasing costs. Furthermore, the electroless copper plating process is complex, with the presence of precious metal catalysts in the plating solution leading to high costs, and the need for waste treatment resulting in high environmental costs.

[0030] In addition, the bonding force between the porous carbonized layer and the uncarbonized substrate is limited, and the carbonized layer is easy to peel off from the substrate, resulting in discontinuous open circuits in the conductive pattern.

[0031] In other words, due to the limitations of current laser-induced graphene technology in generating carbonized layers, the only option is to first use chemical copper plating to form a copper layer as a seed layer, followed by electroplating to grow the copper layer and form the final conductive pattern. This process has gradually become the technical consensus in the field.

[0032] Based on this, the applicant of this application has been gradually exploring a scheme for direct electroplating after using laser selectively conductive substrates. In practice, it has been found that in some cases, after using laser selectively conductive substrates, some carbonized layers possess good conductivity and high adsorption strength, thus meeting the basic conditions for direct electroplating. After researching and summarizing this, the applicant obtained the basic concept of this invention.

[0033] refer to Figure 2 This invention provides a method for fabricating an electrical interconnect component using laser selective conductorization, comprising: S110, Provide substrate.

[0034] The substrate is an insulating workpiece with a predetermined structure. The substrate material is a carbon polymer and can be formed using methods such as high-temperature lamination, precision injection molding, compression molding, or 3D printing. The carbon content in the substrate is greater than 70% to ensure a sufficiently high carbon content, providing a foundation for the subsequent formation of a more compact carbonized layer. It should be noted that the substrate does not contain carbon-containing conductive fillers (such as carbon nanotubes or carbon black) to ensure that the substrate has sufficient mechanical strength, dielectric properties, and weather resistance.

[0035] For example, the substrate material is any one or more of polyimide (PI), polyetheretherketone (PEEK), liquid crystal polymer (LCP), and polyphenylene sulfide (PPS). The carbon content in polyimide (PI) is approximately 70% to 76%, the carbon content in polyetheretherketone (PEEK) is approximately 80% to 83%, the carbon content in polyphenylene sulfide (PPS) is approximately 70% to 75%, and the carbon content in liquid crystal polymer (LCP) is approximately 70% to 78%, depending on the degree of polymerization of the materials in the substrate.

[0036] S210: A patterned carbonized layer is formed on a substrate by laser selectively conductiveizing the substrate.

[0037] The laser-scanned area on the substrate converts light energy into heat energy, causing a rapid temperature rise in the scanned area. Elements such as oxygen, nitrogen, and hydrogen in the substrate escape in gaseous form (e.g., carbon dioxide, nitrogen oxides, and water vapor), leaving behind a carbon-rich framework. The remaining carbon atoms rearrange at high temperature to form an interconnected three-dimensional porous graphene network with an SP2 hybrid structure, thereby creating a patterned carbonized layer within the laser-scanned area and achieving selective conductivity of the substrate. Of course, besides the SP2 hybrid structure, other structures exist between carbon atoms, such as SP3 hybrid structures, allotropes, and other structures (e.g., carbonate structures). Among these, carbon atoms arranged in an SP2 hybrid structure and allotropes provide good electrical conductivity, while SP3 hybrid structures and other structures do not effectively provide good conductivity. In this invention, the content of SP2 hybrid carbon and allotropes in the carbonized layer produced by laser selective conductivity of the substrate is greater than 80% to ensure excellent electrical conductivity of the carbonized layer.

[0038] In addition, because the substrate of high carbon content polymers contains less of other elements (such as oxygen, hydrogen, nitrogen, etc.), the volume of gas that escapes during the heating process is smaller, and the pores of the remaining carbonized layer are relatively small.

[0039] On the other hand, during the laser selective conductiveing ​​of the substrate, excessive ablation and insufficient carbonization must be avoided. During laser ablation of the substrate, the reaction temperature must be sufficient to induce the breakage of the polymer main bonds, the escape of non-carbon elements, and simultaneously promote the rearrangement of carbon atoms into an sp2 hybrid structure and elemental carbon, generating a more continuous, denser, and less porous carbonized layer. In actual experiments, the applicant found that many factors are involved in generating this type of carbonized layer, including the type of laser generator, laser scanning rate, laser energy density, laser pulse frequency, and the laser ablation reaction environment. Many combinations of these factors can produce carbonized layers that achieve the above effects, making it difficult to grasp the underlying principles. Therefore, this application limits the final result of using laser selective conductiveing ​​of the substrate from the perspective of the generated carbonized layer. For example, the laser can be a pulsed laser emitted from an infrared, green, ultraviolet, or deep ultraviolet laser, with a power of 1W to 1000W, a scanning speed of 0.1mm / s to 1000mm / s, and a pulse frequency of 0.001kHz to 10000kHz. For example, laser selective conductiveing ​​of substrates can be used in enclosed environments, halogenated hydrocarbon environments, or carbon-containing gas environments. In enclosed environments, the amount of carbon dioxide released from the carbon reaction can be reduced, thus helping to reduce the porosity of the carbonized layer. In halogenated hydrocarbon gaseous or liquid environments (such as fluorinated hydrocarbons, chlorinated hydrocarbons, bromine hydrocarbons, and iodinated hydrocarbons), the formation of the carbonized layer can be promoted. In carbon-containing gas environments (such as methane, acetylene, and ethylene), during the laser selective conductiveing ​​process, not only can the substrate be pyrolyzed at high temperatures to form a carbonized layer, but the high temperature also catalyzes the decomposition of the carbon source gas to form elemental carbon or SP2 hybrid carbon, which is then applied to the substrate (specifically the laser selectively conductive area), increasing the carbon content in the carbonized layer. This helps to increase the sum of the SP2 hybrid carbon and elemental carbon content, thereby improving the conductivity of the carbonized layer.

[0040] The laser spot diameter can be adjusted according to production requirements. For example, the laser spot diameter can be adjusted to the order of 10 micrometers, enabling the production of lines with a width of approximately 10 micrometers. Furthermore, the repeatability of laser precision machining equipment can be calibrated to approximately 0.5 micrometers, and the positional accuracy can also be achieved to approximately 0.5 micrometers. Therefore, this invention can be used to manufacture high-precision electrical interconnect components.

[0041] In a specific example of the present invention, the sum of the contents of SP2 hybrid carbon and elemental carbon in the carbide layer is greater than 80%, the sheet resistance is less than 30 Ω / sq, the porosity is less than 60%, and the characteristic pore size is 50 nm to 500 nm. The sum of the contents of SP2 hybrid carbon and elemental carbon in the carbide layer being greater than 80% is to ensure that the carbide layer has good electrical conductivity, providing the possibility of reducing the sheet resistance of the carbide layer to less than 30 Ω / sq, ensuring that the current can be evenly distributed when the carbide layer is used as a seed layer for subsequent electroplating, and avoiding localized overplating or failure to deposit the metal layer. Pore ​​size and porosity affect the resistance of the carbide layer and the bonding force between the metal coating and the carbide layer. If the porosity is too high or the pore size is too large, the conductive skeleton in the carbide layer will be discontinuous, resulting in a large resistance. It will also be difficult for the initial metal coating to form a continuous film, and the bonding force between the metal coating and the carbide layer will be weak. Appropriate porosity and characteristic pore size are conducive to the penetration of electroplating solution and ion transport, which can realize the mechanical interlock between the metal coating and the carbide layer, greatly enhance the bonding force between the metal coating and the carbide layer, and at the same time help to reduce the resistance of the carbide layer to obtain a better electroplating effect.

[0042] In addition, appropriate porosity and characteristic pore size in the carbide layer can also increase the bonding force between the carbide layer and the substrate, so as to withstand the thermal stress, chemical corrosion and internal stress of the metal layer during the electroplating process, and reduce the possibility of the carbide layer detaching from the substrate.

[0043] In some possible examples, during the laser selective conductorization of the substrate, the laser scanning path exhibits a certain overlap rate (e.g., over 60%). In the repeatedly scanned areas, the heat generated by the secondary laser scan can promote a secondary "annealing" of the carbon layer, resulting in a more continuous, denser, and less porous carbonized layer. Alternatively, repeating the scan after laser selective conductorization can achieve the same effect.

[0044] In some possible examples, the substrate has through-holes or blind holes. During the laser selective conductor formation process, the laser selectively scans a portion of the inner wall of the through-hole or blind hole and at least one side of the substrate, forming a continuous carbide layer on the inner wall of the through-hole or blind hole and at least one side of the substrate. With subsequent electroplating using the carbide layer as a seed layer, electrically interconnected components capable of three-dimensional interconnection can be realized.

[0045] S310. Perform pattern electroplating, using the carbide layer as the cathode, and form a metal layer on the carbide layer.

[0046] Generally, the metal layer electroplated is a copper layer. The substrate is immersed in the electroplating solution, and the cathode is electrically connected to the carbide layer. The electroplating solution is one of acidic copper sulfate electroplating, copper sulfamate electroplating, or cyanide copper plating. In this way, a metal layer of sufficient thickness is directly electroplated and grown on the carbide layer.

[0047] S410. Remove or cut the process conductor. The process conductor is part of a carbide layer with an electroplated metal layer. The process conductor is removed by means of laser etching or physical cutting.

[0048] S510. Assemble the electrical interconnection components with the prefabricated core board.

[0049] Electrical interconnect components are electrically connected to the core board. The metal layer of the electrical interconnect components and the circuitry on the core board can be electrically connected using mechanical interconnection, soldering, or conductive adhesive. The core board can be a pre-fabricated glass chip, ceramic chip, or a traditional printed circuit board.

[0050] In summary, the method for fabricating electrical interconnect components using laser selective conductors provided by this invention has at least the following advantages: (1) By using laser selective conductor to form a carbonized layer with a design pattern in the preset area of ​​the substrate, the carbonized layer can be formed only at the required location. This can completely preserve the original mechanical properties, insulation properties, weather resistance and other excellent properties of the carbon polymer substrate. In addition, the carbonized layer has good conductivity and adhesion, and can be directly used as a seed layer for electroplating. Thus, a metal layer with a specific thickness can be directly grown on the carbonized layer, which simplifies the preparation process of electrical interconnection components and eliminates many complex and polluting processes such as chemical plating, pattern transfer and etching in traditional processes. This can effectively reduce production costs and environmental protection costs.

[0051] (2) Using laser selective conductive substrate, it can be precisely applied to complex curved surfaces and deep hole inner walls to realize true three-dimensional circuit manufacturing, providing an ideal solution for integrated structural and functional devices (such as antennas, sensors, and microfluidic devices); at the same time, using laser selective conductive substrate, laser direct writing supports arbitrary patterns and rapid iteration, which is particularly suitable for the production of customized interconnect components with small batches, multiple varieties, and high complexity.

[0052] (3) The porosity of the formed carbonized layer is less than 60%, and the characteristic pore size is 50nm to 500nm. The appropriate porosity and characteristic pore size are conducive to the penetration of electroplating solution and ion transport, and can realize the mechanical interlock between the metal coating and the carbonized layer, which greatly enhances the bonding force between the metal coating and the carbonized layer.

[0053] (4) Since the laser spot diameter can be adjusted to the order of 10 micrometers, the laser positioning accuracy can be calibrated to about 0.5 micrometers, thus high-precision and high-accuracy conductive patterns can be prepared.

[0054] The present invention provides two specific implementation methods below.

[0055] Example 1 Substrate preparation. Selective Laser Sintering (SLS) 3D printing technology was used to fabricate a 20mm × 20mm × 5mm cubic test piece using pure PEEK powder, in which a vertical through hole with a diameter of 0.5mm was pre-designed.

[0056] A patterned carbonized layer is formed on a substrate by laser selectively conductiveizing the substrate.

[0057] For example, an ultraviolet picosecond laser (355nm wavelength) with a power of 8W, a scanning speed of 500mm / s, and a pulse frequency of 200kHz is used, with two repeated scans. The laser processes a pre-defined pattern with a square spiral wire pattern (100μm linewidth) on the surface, and connects the wire pattern to pre-defined electrode contacts via two process wires, with the pre-defined pattern covering the opening of the through-hole. During the laser selective conductorization of the substrate, the laser focus is guided to the inner wall of the through-hole for spiral scanning, ensuring that the entire inner wall of the through-hole is scanned by the laser. After laser selective conductorization of the substrate, the scanned area becomes a dark gray carbonized layer visible to the naked eye. The sheet resistance of the carbonized layer, measured using a four-probe tester, is approximately 15Ω / sq to 20Ω / sq. The sum of the percentage of carbon atoms in sp2 hybridization and the percentage of elemental carbon is approximately 85% to 89%. The porosity of the carbonized layer, measured using an electron microscope, is 43% to 47%, and the characteristic pore size is 82nm to 155nm.

[0058] A metal layer is grown on the carbide layer using electroplating.

[0059] A standard acidic copper sulfate electroplating solution was used. Conductive silver paste was used to connect the laser-generated electrode contacts to copper wires (i.e., the carbide layer is electrically connected to the cathode via the electrode contacts and copper wires), which then served as the cathode connected to the electroplating power supply. The substrate was immersed in the electroplating solution with an initial current density of 1 ASD (amperes per square decimeter) for 30 minutes. A copper layer was uniformly deposited on the surface spiral pattern and the inner walls of the through-holes, forming a continuous metallic coating. No copper deposition was observed in the non-scanning areas.

[0060] The conductive wires were then removed using laser technology, and the substrate was cleaned with anhydrous ethanol to obtain the electrical interconnect components. Multimeter measurements confirmed that the continuity resistance of the upper and lower surface circuits connected through vertical vias was less than 50mΩ, and no copper layer peeled off after tape peeling tests according to the IPC-TM-650 standard.

[0061] Example 2 Substrate preparation. A liquid crystal polymer (LCP) film with a thickness of 100 μm was used as the substrate.

[0062] A patterned carbonized layer is formed on a substrate by laser selectively conductiveizing it. For example, a carbon dioxide laser (10.6 micrometers wavelength) with a power of 3W, a scanning speed of 200 mm / s, and a pulse frequency of 200 kHz is used in a single scan. The laser processes the substrate according to a preset pattern, which is a microstrip line pattern (80 micrometers linewidth) for radio frequency signals.

[0063] After selectively conductiveizing the substrate with laser, the scanning area becomes a dark gray carbonized layer visible to the naked eye. The sheet resistance of the carbonized layer measured using a four-probe tester is approximately 16 Ω / sq to 22 Ω / sq. The sum of the proportion of carbon atoms in sp2 hybridization and the proportion of all-carbon atoms is approximately 82% to 87%. The porosity of the carbonized layer measured using an electron microscope is 49% to 55%, and the characteristic pore size is 121 nm to 186 nm.

[0064] A metal layer is grown on the carbide layer using electroplating.

[0065] A standard acidic copper sulfate electroplating solution was used. Conductive silver paste was used to connect the laser-generated electrode contacts to copper wires (i.e., the carbide layer is electrically connected to the cathode via the electrode contacts and copper wires), which then served as the cathode for the electroplating power supply. The substrate was immersed in the electroplating solution with an initial current density of 1 ASD (amperes per square decimeter). Electroplating lasted 15 minutes, during which a copper layer was uniformly deposited on the carbide layer, increasing to approximately 10 micrometers, forming a continuous metallic coating. No copper deposition was observed in the non-scanning areas.

[0066] The conductive wires were then removed using laser technology, and the substrate was cleaned with anhydrous ethanol. The electrical interconnect component was then aligned and bonded to the corresponding pads on a prefabricated four-layer FR-4 PCB using anisotropic conductive adhesive (ACP) to achieve system-level electrical connection.

[0067] At least one embodiment of the present invention also provides an electrical interconnection component, which is prepared by the above-described method for preparing an electrical interconnection component using laser selective conductors.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for fabricating an electrical interconnect component using laser selective conductorization, characterized in that, include: A substrate is provided, wherein the material of the substrate is a carbon polymer, and the carbon content of the substrate is greater than 70%; The substrate is selectively conductiveized by laser to form a patterned carbonized layer on the substrate. The carbonized layer is formed by selectively ablating and pyrolyzing the substrate by laser. The content of SP2 hybrid carbon and elemental carbon in the carbonized layer is greater than 80%, the sheet resistance is less than 30 Ω / sq, the porosity is less than 60%, and the characteristic pore size is 50 nm to 500 nm. A pattern electroplating process is performed, using the carbide layer as the cathode, to form a metal layer on the carbide layer.

2. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 1, characterized in that, The method further includes: After the pattern electroplating is performed, the process wires are removed or cut off. The process wires are part of the carbide layer on which the metal layer is electroplated.

3. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 2, characterized in that, The method further includes: After the process wires are removed or cut, the electrical interconnection components are stacked and assembled with the prefabricated core board, wherein the electrical interconnection components are electrically connected to the core board.

4. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 3, characterized in that, The step of stacking and assembling the electrical interconnection components with the prefabricated core board includes: The metal layer of the electrical interconnection component is electrically connected to the circuit on the core board by means of mechanical interconnection, welding, or conductive adhesive connection.

5. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 1, characterized in that, The substrate provided includes materials that are one or more of polyimide, polyetheretherketone, liquid crystal polymer, and polyphenylene sulfide.

6. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 1, characterized in that, The method of selectively conductiveizing the substrate with laser includes: The laser is a pulsed laser emitted by an infrared laser, a green laser, an ultraviolet laser, or a deep ultraviolet laser, with a power of 1W to 1000W, a scanning speed of 0.1mm / s to 1000mm / s, and a pulse frequency of 0.001kHz to 10000kHz.

7. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 1, characterized in that, The method of selectively conductiveizing the substrate with laser includes: selectively conductiveizing the substrate with laser in a closed environment, a halogenated hydrocarbon environment, or a carbon-containing gas environment.

8. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 1, characterized in that, The provided substrate includes: the substrate having through holes or blind holes; The method of selectively conductiveizing the substrate with laser includes: selectively scanning a portion of the inner wall of the through-hole or blind hole and at least one side of the substrate with a laser to form a continuous carbonized layer on the inner wall of the through-hole and at least one side of the substrate.

9. The method for fabricating an electrical interconnect component employing laser selective conductors according to claim 1, characterized in that, The process of performing pattern electroplating includes: immersing the substrate in an electroplating solution and electrically connecting the cathode to the carbonized layer. The electroplating solution is one of acidic copper sulfate electroplating, copper aminosulfonate electroplating, or cyanide copper plating.

10. An electrical interconnection component, characterized in that, It is prepared by the method described in any one of claims 1 to 9.

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