PCB local thick copper mask dissolving device

Abstract

The application provides a PCB local thick copper mask dissolving device, which is used to solve the problems of insufficient spraying precision, lack of deformation adjustment ability, missing chemical liquid recycling and backwashing function in traditional mask dissolving technology, and affect the processing quality and precision of local thick copper. The PCB local thick copper mask dissolving device comprises an upper groove, a transmission transition groove is fixed on the front wall of the upper groove, a lower groove is installed on the lower part of the upper groove, a deformation spraying mechanism is installed between the upper groove and the transmission transition groove, a backwashing liquid flow system is installed between the lower groove and the deformation spraying mechanism, the deformation spraying mechanism realizes selective and accurate dissolution of the PCB local thick copper mask, effectively avoids excessive corrosion of the non-target copper layer, has high circuit processing precision, can perfectly adapt to various special-shaped patterns, eliminates the spraying blind area, has high special-shaped area coverage, and can realize differential flow adjustment of the uneven thick and thin area, and improves the production efficiency.

Description

Technical Field

[0001] This invention relates to the field of PCB mask processing technology, and in particular to a mask dissolution device for localized thick copper on a PCB. Background Technology

[0002] In the PCB local thick copper manufacturing process, mask dissolution is one of the core steps that determines product precision, yield, and production efficiency. With the continuous improvement of requirements for PCB circuit density and current carrying capacity in fields such as 5G and automotive electronics, the precision requirements of local thick copper processes have moved towards higher standards, which poses stringent challenges to the accuracy, selectivity, and automation level of the mask dissolution process.

[0003] Existing mask dissolution technologies are mainly divided into two categories:

[0004] One type is like the "immersion device for PCB boards" published in CN121078636A, which adopts the traditional immersion dissolution process. Although the equipment structure is simple, it has obvious technical defects: First, it adopts the whole immersion method, which cannot achieve selective dissolution and is prone to excessive corrosion of non-target copper layers, resulting in a decrease in circuit accuracy; Second, the dissolution efficiency depends entirely on the immersion time, and it is difficult to balance efficiency and thorough dissolution in mass production, and residues are prone to appear in thick mask areas; Third, the dissolution solution is for single use and cannot be recycled, resulting in high waste liquid discharge, which does not meet the requirements of modern green manufacturing.

[0005] Another type is the "PCB board processing etching spray device" disclosed in CN120321885A, which uses a fixed nozzle array to spray and dissolve the PCB surface. Although it improves the dissolution efficiency to some extent, it has obvious technical limitations: First, the spray path is fixed and cannot be adapted to the local thick copper mask pattern differences of different PCB boards. For complex irregular mask areas, spray blind spots are likely to occur, resulting in mask residue. Second, the spray water volume cannot be adjusted. For mask operation areas with varying thicknesses, the spray volume cannot be adjusted specifically, which can easily slow down the overall mask processing speed or cause local over-dissolution. Third, the nozzles are prone to clogging after long-term use, requiring manual cleaning after machine shutdown, which seriously affects the continuity of production.

[0006] In addition, these two types of devices often lack a targeted backwashing system, have low solvent recycling rates, and are prone to clogging of filter elements and pipelines, resulting in short service life. Summary of the Invention

[0007] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a mask dissolution device for local thick copper on PCBs, which solves the problems of insufficient spraying precision, lack of deformation adjustment capability, lack of chemical liquid recycling and backwashing function in traditional mask dissolution technology, thus affecting the processing quality and precision of local thick copper.

[0008] To achieve the above and other related objectives, the present invention provides a mask dissolution device for local thick copper on a PCB, comprising: an upper tank, a transmission transition groove fixed to the front wall of the upper tank, a lower tank installed at the lower part of the upper tank, a deformation spraying mechanism installed between the upper tank and the transmission transition groove, and a backwashing liquid flow system installed between the lower tank and the deformation spraying mechanism;

[0009] The upper groove is used for mask dissolution processing to selectively remove the protective film and expose the circuit pattern that needs to be thickened for copper plating.

[0010] The transmission transition groove is used to accommodate the transmission system of the deformable spraying mechanism and provide it with transmission space;

[0011] The lower tank is used to store the solution;

[0012] The deformable spraying mechanism is used to precisely dissolve the mask according to the requirements of the mask pattern and along the spraying path.

[0013] The backwashing liquid flow system is used to deliver mask dissolving liquid to the deformation spray mechanism and to backwash the pipeline and filter element at regular intervals.

[0014] The deformable spraying mechanism includes a nozzle support plate, nozzles, a mask solution delivery pipe, a stepped transmission mounting plate, a main transmission gear set, a linkage roller, a secondary synchronous pulley connecting rod, a butterfly valve, and a synchronous belt. Two nozzle support plates are fixed to the front of the upper trough via brackets. Each nozzle support plate is equipped with 256 nozzles arranged in a matrix, evenly distributed in a 16x16 array on the mounting surface of the nozzle support plate. The rear end of each nozzle is fixedly connected to a mask solution delivery pipe. Stepped transmission mounting plates are installed on the inner left and right walls of the transmission transition trough. A main transmission gear set is located in the upper middle of the outer side of the stepped transmission mounting plate. The main transmission gear set consists of a pair of meshing transmission gears. The two transmission shafts of the main transmission gear set are connected at their front ends. All outer walls are fixedly fitted with linkage rollers, and a synchronous belt is driven between the outer walls of two linkage rollers. The rear linkage roller is an unwinding roller, and the front linkage roller is a take-up roller. Limit locks are installed on both the unwinding and take-up rollers. The limit locks intermittently lock the synchronous belt. Two hundred and fifty-six auxiliary synchronous pulleys are installed in a matrix on the outer side of the stepped transmission mounting plate. The auxiliary synchronous pulleys are evenly distributed on the outer side of the stepped transmission mounting plate in a sixteen by sixteen array. The synchronous belt has toothed grooves at equal intervals, and the synchronous belt is driven by meshing with the auxiliary synchronous pulleys through the toothed grooves. A connecting rod is fixedly installed on the inner side of the drive shaft of each auxiliary synchronous pulley. A butterfly valve is fixedly installed on the inner end of each connecting rod, and the two hundred and fifty-six butterfly valves are respectively rotatably installed in the pipeline of the mask solution delivery pipe.

[0015] Optionally, the stepped transmission mounting plate is formed by fixing a large plate and a small plate. The small plate is fixed to the middle of the outer side of the large plate. The main transmission gear set is installed in the middle of the upper part of the large plate, and the tooth width of the main transmission gear set is the same as the width of the small plate. The width of the roller of the linkage belt roller is greater than the width of the auxiliary synchronous belt pulley.

[0016] Optionally, the two nozzle support plates are distributed on the same horizontal line, and the rear ends of the mask solution delivery pipes are all bent at right angles. The mask solution delivery pipes on the same nozzle support plate have the same bending direction, while the mask solution delivery pipes on the two nozzle support plates have opposite bending directions. The mask solution delivery pipes on the two nozzle support plates are symmetrically connected one-to-one. The 256 mask solution delivery pipes on the same nozzle support plate are of the same length, but their bending points are different. The points formed by the bends are located on the same 45-degree inclined plane, and the 45-degree plane is an inclined plane with a 45-degree angle between the inner side of the stepped transmission mounting plate and the rear wall of the nozzle support plate. The 256 connecting rods on each stepped transmission mounting plate have different lengths and are distributed from front to back in a manner from long to short. Each connecting rod corresponds to a mask solution delivery pipe. The inner end of the connecting rod is rotatably connected to the front section of the mask solution delivery pipe at the bend point. All 256 butterfly valves are rotatably installed in the front section of the mask solution delivery pipe at the bend point.

[0017] Optionally, the deformable spraying mechanism further includes a horizontal slide rail, a horizontal slider, a vertical slide rail, a vertical slider, a lifting slide, a transmission base, a turntable, clamping guide rails, and clamping blocks. A horizontal slide rail is fixed to the lower outer side of the stepped transmission mounting plate. A horizontal slider is slidably installed inside the horizontal slide rail. A vertical slide rail is fixed to the outer side of the horizontal slider. A vertical slider is slidably installed inside the vertical slide rail. A lifting slide is slidably installed inside the front wall of the vertical slider. A transmission base is fixedly installed on the lifting slide. A turntable is rotatably installed inside the transmission base. Two clamping guide rails are installed on the lower wall of the turntable. Clamping blocks are slidably installed inside both clamping guide rails, and the clamping blocks intermittently clamp the synchronous belt.

[0018] Optionally, the backwashing fluid system includes a filter, a first bidirectional circulation pipe, a circulation pump, a second bidirectional circulation pipe, a reducing right-angle tee, an upper tank drain outlet, a reducing liquid delivery pipe, a right-angle tee, a backwashing fluid input pipe, and a diversion input pipe. A filter is installed at the rear of the lower tank. The first bidirectional circulation pipe is installed at the upper front of the filter. A circulation pump is installed at the lower end of the first bidirectional circulation pipe. A second bidirectional circulation pipe is installed at the front end of the circulation pump. A reducing right-angle tee is installed at the upper end of the second bidirectional circulation pipe. The upper interface of the reducing right-angle tee is connected to the upper tank drain outlet, which is located inside the lower wall of the upper tank. The front interface of the reducing right-angle tee is connected to the reducing liquid delivery pipe. Both top outlets of the reducing liquid delivery pipe are equipped with right-angle tees. The front interface of the right-angle tee is connected to the backwashing fluid input pipe. The rear interface of the right-angle tee is connected to the diversion input pipe, which is connected to the mask solution delivery pipe.

[0019] Optionally, the backwashing fluid system further includes a drain pipe and a waste pipe, with the drain pipe installed at the lower part of the filter and the waste pipe connected to the lower end of the drain pipe.

[0020] Optionally, the backwashing fluid system includes two fluid paths: a mask solution input path and a backwashing fluid path. The mask solution input path enters from the lower tank through the filter into the first bidirectional circulation pipe. Driven by a circulation pump, the solution flows through the second bidirectional circulation pipe into the lower and front ports of the reducing right-angle tee. The solution then enters the lower and rear ports of the right-angle tee through the reducing delivery pipe, and then enters the mask solution delivery pipe through the diversion input pipe. It is then sprayed into the upper tank through the nozzle, and then flows from the upper tank drain outlet into the upper and lower ports of the reducing right-angle tee. The solution then enters the lower tank through the second bidirectional circulation pipe, driven by the circulation pump, through the first bidirectional circulation pipe into the filter.

[0021] Optionally, the backwash liquid path of the backwash liquid flow system enters the diversion input pipe through the front and rear ports of the right-angle tee, then through the mask solution delivery pipe and sprays into the upper tank through the nozzle. Through the upper and lower ports of the reducing right-angle tee, it enters the second bidirectional circulation pipe from the upper tank drain outlet. The solution is driven by the circulation pump to flow into the filter through the first bidirectional circulation pipe, and finally discharged through the sewage pipe and waste pipe.

[0022] As described above, the mask dissolution device for locally thick copper on PCBs of the present invention has at least the following beneficial effects:

[0023] 1. The main transmission gear set of the deformable spraying mechanism drives the synchronous belt to move. The synchronous belt precisely meshes with the target pair synchronous belt pulley, which drives the connecting rod to control the butterfly valve to rotate to the preset opening degree. This enables independent and precise control of the nozzle, solving the problem that existing soaking devices cannot selectively dissolve copper. It can spray only the target thick copper area to achieve selective dissolution of the local thick copper mask, while the non-target copper layer is completely uncorroded, thus improving the accuracy of the circuit.

[0024] 2. By precisely adjusting the opening of the butterfly valve, differentiated flow control can be implemented for mask areas of varying thickness. Thick film areas use high flow for rapid dissolution, while thin film areas use low flow for precise operation. This solves the problem that the water volume of existing fixed spray devices cannot be adjusted, improves the quality of mask processing and dissolution, and prevents dissolution residue in thick mask areas.

[0025] 3. Through a three-dimensional adjustment system consisting of horizontal slide rails, vertical slide rails, lifting slides and turntables, and with the precise positioning of the synchronous belt by the clamping block, it achieves blind-spot-free full-coverage spraying of complex irregular shapes, with high coverage of irregular areas, and solves the limitations of fixed spraying paths.

[0026] 4. The backwashing liquid path of the backwashing liquid flow system can automatically clean and maintain the pipelines, nozzles and filter elements that are contaminated and blocked by the mask solution during the processing, which extends the service life of the liquid flow system, shortens the downtime for maintenance, helps to improve the efficiency of mask dissolution processing, and completely avoids the problem of nozzle blockage requiring manual cleaning after shutdown.

[0027] 5. By using the mask solution input path of the backwashing liquid flow system, the efficient recycling of the solution is achieved, reducing the amount of waste liquid discharged, thus lowering the operating cost of mask dissolution processing and solving the environmental problems of single-use solution and high waste liquid discharge in the existing technology. Attached Figure Description

[0028] Figure 1 The image shown is a front perspective view of the overall structure of the present invention.

[0029] Figure 2 The image shown is a rear perspective view of the groove fitting structure of the present invention.

[0030] Figure 3 The image shown is a rear-view perspective view of the deformable spraying mechanism of the present invention.

[0031] Figure 4 The diagram shown is a rear-view perspective view of the transmission structure of the butterfly valve of the present invention.

[0032] Figure 5 The diagram shown is a left-side view of the deformable spraying mechanism of the present invention.

[0033] Figure 6The diagram shown is a right-side view of the lifting slide structure of the present invention.

[0034] Figure 7 The diagram shown is a left-side view of the flow direction of the mask solution input channel of the present invention.

[0035] Figure 8 The diagram shown is a left-side view of the backwash fluid path of this invention.

[0036] Figure 9 The diagram shown is a left-side view of the overall structure of the present invention.

[0037] Figure 10 The image shown is a top view of the structure in which the deformable spray mechanism and the diversion input pipeline of the present invention are combined.

[0038] Component designation explanation

[0039] 1. Upper groove;

[0040] 2. Transmission transition groove;

[0041] 3. Lowering the trough;

[0042] 4. Deformation spray mechanism; 401. Spray nozzle support plate; 402. Nozzle; 403. Mask solution delivery pipe; 404. Stepped transmission mounting plate; 405. Main transmission gear set; 406. Linkage belt roller; 407. Secondary synchronous belt pulley; 408. Connecting rod; 409. Butterfly valve; 410. Horizontal slide rail; 411. Horizontal slider; 412. Vertical slide rail; 413. Vertical slider; 414. Lifting slide table; 415. Transmission seat; 416. Turntable; 417. Clamping guide rail; 418. Clamping block; 419. Synchronous belt.

[0043] 5. Backwash fluid flow system; 501. Filter; 502. First bidirectional circulation pipe; 503. Circulation pump; 504. Second bidirectional circulation pipe; 505. Reducing right-angle tee; 506. Upper tank drain outlet; 507. Reducing liquid delivery pipe; 508. Right-angle tee; 509. Backwash fluid input pipe; 510. Diversion input pipe; 511. Sewage pipe; 512. Waste discharge pipe. Detailed Implementation

[0044] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0045] Example 1

[0046] Please see Figures 1-10To address the shortcomings of existing immersion processes, such as the inability to achieve selective dissolution and the tendency to cause excessive corrosion to non-target copper layers, and the limitations of fixed nozzle array spraying processes in adapting to irregularly shaped patterns and adjusting the spray volume for PCB areas of varying thickness, this invention provides a mask dissolution device for locally thick copper on PCBs. The device includes an upper tank 1, a transmission transition groove 2 fixed to the front wall of the upper tank 1, a lower tank 3 installed at the lower part of the upper tank 1, and a deformable spraying mechanism 4 installed between the upper tank 1 and the transmission transition groove 2.

[0047] The deformable spraying mechanism 4 includes a nozzle support plate 401, nozzles 402, a mask solution delivery pipe 403, a stepped transmission mounting plate 404, a main transmission gear set 405, a linkage roller 406, a secondary synchronous pulley 407, and a synchronous belt 419. Two nozzle support plates 401 are fixed to the front of the upper trough 1 via brackets. Each nozzle support plate 401 is equipped with 256 nozzles 402 arranged in a matrix, and the nozzles 402 are evenly distributed in a 16x16 array. The nozzles 402 are arranged in a matrix on the mounting surface of the nozzle support plate 401, providing a stable base for spray installation. The rear end of the nozzles 402 is fixedly connected to the mask solution delivery pipe 403. Stepped transmission mounting plates 404 are installed on the inner sides of the left and right walls of the transmission transition groove 2. A main transmission gear set 405 is set in the upper middle of the outer side of the stepped transmission mounting plate 404. The main transmission gear set 405 consists of a pair of meshing transmission gears. Both front ends of the two drive shafts of the main drive gear set 405 are fixedly fitted with linkage belt rollers 406. A synchronous belt 419 is installed between the outer walls of the two linkage belt rollers 406. A pair of meshing gears in the main drive gear set 405 provides power for the synchronous belt 419. The rear linkage belt roller 406 is a unwinding roller, and the front linkage belt roller 406 is a take-up roller. Both the unwinding roller and the take-up roller are equipped with limit locks. The limit locks intermittently lock the synchronous belt 419. As unwinding and winding rollers, the output length and transmission of the synchronous belt 419 can be precisely controlled by the limit lock. Two hundred and fifty-six auxiliary synchronous pulleys 407 are mounted on the outer side of the stepped transmission mounting plate 404 in a matrix arrangement. The auxiliary synchronous pulleys 407 are evenly distributed on the outer side of the stepped transmission mounting plate 404 in a sixteen-by-sixteen array. The synchronous belt 419 has toothed grooves at equal intervals, and the synchronous belt 419 engages with the auxiliary synchronous pulleys 407 through the toothed grooves for belt transmission.

[0048] More comprehensively, such as Figure 3As shown, the stepped transmission mounting plate 404 is composed of a large plate and a small plate. The small plate is fixed to the middle of the outer side of the large plate. The main transmission gear set 405 is installed in the middle of the upper part of the large plate, and the tooth width of the main transmission gear set 405 is the same as the width of the small plate. The roller width of the linkage roller 406 is greater than the wheel width of the auxiliary synchronous pulley 407. The width difference design between the large plate and the small plate provides transmission space for the main transmission gear set 405, while ensuring that the linkage roller 406 and the auxiliary synchronous pulley 407 are on the same transmission plane. The roller width of the linkage roller 406 provides a larger wrap angle contact area, resulting in strong transmission reliability.

[0049] Among them, such as Figures 3-4 As shown, the deformable spraying mechanism 4 also includes a connecting rod 408 and a butterfly valve 409. The connecting rod 408 is fixedly installed on the inner side of the drive shaft of the auxiliary synchronous pulley 407, and the butterfly valve 409 is fixedly installed on the inner end of the connecting rod 408. All 256 butterfly valves 409 are rotatably installed in the front section of the mask solution delivery pipe 403 at the bend point. The auxiliary synchronous pulley 407 meshes with the tooth groove of the synchronous belt 419, which can control the rotation of the auxiliary synchronous pulley 407 to drive the connecting rod 408 and the butterfly valve 409 to control the passage size and opening and closing of the mask solution delivery pipe 403.

[0050] More comprehensively, such as Figures 3-4 , Figures 7-8 and Figure 10 As shown, the two nozzle support plates 401 are distributed on the same horizontal line, providing a wide radiation area and preventing the formation of blind spots in the spray. The rear ends of the mask solution delivery pipes 403 are all bent at right angles, which facilitates the installation of the butterfly valve 409 while minimizing fluid resistance at the bends. Furthermore, the bends of the mask solution delivery pipes 403 on the same nozzle support plate 401 are in the same direction, while the bends of the mask solution delivery pipes 403 on the two nozzle support plates 401 are in opposite directions. The mask solution delivery pipes 403 on the two nozzle support plates 401 are symmetrically connected one-to-one. All 256 mask solution delivery pipes 403 on the same nozzle support plate 401 are of the same length, and the bends are positioned... Unlike other systems, the points formed by the bends of the 256 mask solution delivery pipes 403 are located on the same 45-degree inclined plane. The 45-degree plane is an inclined plane that forms a 45-degree angle with the inner side of the stepped transmission mounting plate 404 and the rear wall of the nozzle support plate 401. The 256 connecting rods 408 on each stepped transmission mounting plate 404 have different lengths and are distributed from front to back in a manner from long to short. Each connecting rod 408 corresponds to a mask solution delivery pipe 403. The inner end of the connecting rod 408 is rotatably connected to the front section of the bend of the mask solution delivery pipe 403, so that the delivery length of the 256 mask solution delivery pipes 403 is the same and the flow rate of each nozzle 402 is uniform.

[0051] Among them, such as Figure 3 , Figures 5-6As shown in the figure, the deformable spraying mechanism 4 also includes a horizontal slide rail 410, a horizontal slider 411, a vertical slide rail 412, a vertical slider 413, a lifting slide 414, a transmission base 415, a turntable 416, clamping guide rails 417, and clamping blocks 418. A horizontal slide rail 410 is fixed to the lower part of the outer side of the stepped transmission mounting plate 404. A horizontal slider 411 is slidably installed inside the horizontal slide rail 410. A vertical slide rail 412 is fixedly installed on the outer side of the horizontal slider 411. A vertical slider 413 is slidably installed inside the vertical slide rail 412. A lifting slide 414 is slidably installed inside the front wall of the vertical slider 413. A transmission base 415 is fixedly installed on the lifting slide 414. A turntable 416 is rotatably installed inside the transmission base 415. Two clamping guide rails 417 are installed on the lower wall of the turntable 416. Clamping blocks 418 are slidably installed inside both clamping guide rails 417, and the clamping blocks 418 intermittently clamp the synchronous belt 419. Block 418 can pull the synchronous belt 419 out a certain length between the unwinding and rewinding rollers of the linkage roller 406. Under the three-dimensional adjustment of the horizontal slide rail 410, vertical slide rail 412, lifting slide 414 and turntable 416, the synchronous belt 419 is fitted onto the target auxiliary synchronous pulley 407 corresponding to the spray path. Then, the two limit locks are controlled to lock the released synchronous belt 419, leaving only the movable belt length for one rotation of the unwinding roller, that is, one circumference of the auxiliary synchronous pulley 407. Then, the main transmission gear set 405 is driven to mesh, which can drive the linkage roller 406 to rotate. Under the action of belt drive, the synchronous belt 419 drives the auxiliary synchronous pulley 407 on the spray target path to move together, thereby controlling the opening size and opening and closing of the butterfly valve 409 at the corresponding position, thereby accurately controlling the opening and closing and flow rate of the mask solution delivery pipe 403 of the spray path. The mask dissolving solution is accurately sprayed onto the target area through the opened nozzle 402.

[0052] The working principle of the above scheme is as follows: First, the staff inputs the graphic data of the thick copper area of ​​the PCB that needs to be melted into the control system according to the processing of the PCB board. The system automatically generates a spraying scheme based on the graphic data. For example, the thin copper area is sprayed once with a small flow rate. After the thick copper area participates in the small flow rate spray, it is then included in the secondary spraying path for a large flow rate spray. After the PCB board is sent into the upper slot 1 by the conveyor system, the clamping block 418 pulls the synchronous belt 419 out of the unwinding and rewinding rollers of the linkage roller 406 to a specific length. Through three-dimensional adjustment by the horizontal slide rail 410, vertical slide rail 412, lifting slide 414 and turntable 416, the synchronous belt 419 is precisely fitted onto the target secondary synchronous belt. On pulley 407, the limit locker locks the synchronous belt 419, leaving only the length of the belt for one revolution of the unwinding roller. Then, the main drive gear set 405 is activated, which drives the linkage roller 406 to rotate. The synchronous belt 419 precisely drives the target auxiliary synchronous belt pulley 407 to rotate through the tooth groove. The auxiliary synchronous belt pulley 407 drives the connecting rod 408 to control the butterfly valve 409 to rotate to the preset opening. Each time the main drive gear set 405 engages and rotates forward or backward, it drives the butterfly valve 409 to rotate forward or backward by one revolution. All 256 butterfly valves 409 can be controlled in this way, thereby achieving precise flow regulation in different areas. The dissolving liquid is precisely sprayed onto the target area through the opened nozzle 402. After the mask dissolves, All butterfly valves 409 are closed, clamping block 418 releases synchronous belt 419, and horizontal slide rail 410, vertical slide rail 412, lifting slide 414, and turntable 416 return to their initial positions, ready for the next PCB board to be processed. Thus, the synchronous belt 419 is driven by the main transmission gear set 405 of the deformable spray mechanism 4. The synchronous belt 419 precisely meshes with the target auxiliary synchronous belt pulley 407, driving the connecting rod 408 to control the butterfly valve 409 to rotate to a preset opening. This allows for independent and precise control of the nozzle 402, solving the problem of selective dissolution in existing immersion devices. It enables spraying only the target thick copper area, achieving selective dissolution of the local thick copper mask, while non-target copper layers remain completely unaffected by corrosion. Erosion is reduced, improving line accuracy; through precise adjustment of the butterfly valve 409 opening, differentiated flow control can be implemented for mask areas of varying thickness. Thick film areas use high flow for rapid dissolution, while thin film areas use low flow for fine operation, solving the problem of the inability to adjust the water volume of existing fixed spray devices, improving the quality of mask processing dissolution, and preventing dissolution residue in thick mask areas; through a three-dimensional adjustment system composed of horizontal slide rail 410, vertical slide rail 412, lifting slide 414 and turntable 416, combined with the clamping block 418 for precise positioning of synchronous belt 419, blind-spot-free full-coverage spraying of complex irregular shapes is achieved, with high coverage of irregular areas, overcoming the limitations of fixed spray paths.

[0053] Example 2

[0054] Please see Figures 1-2 and Figures 8-9To address the problem of nozzle clogging in existing devices, requiring manual cleaning and shutdown, this invention provides a mask dissolution device for locally thick copper areas on PCBs. The device further includes a backwashing liquid flow system 5 with a backwashing liquid path. The backwashing liquid flow system 5 is installed between the lower tank 3 and the deformation spray mechanism 4. The backwashing liquid flow system 5 is used to deliver mask dissolution liquid to the deformation spray mechanism 4 and periodically backwash the pipeline and filter element. The backwashing liquid flow system 5 includes a filter 501 and a first bidirectional... The system includes a circulation pipe 502, a circulation pump 503, a second bidirectional circulation pipe 504, a reducing right-angle tee 505, an upper tank drain outlet 506, a reducing liquid delivery pipe 507, a right-angle tee 508, a backwash liquid inlet pipe 509, and a diversion inlet pipe 510. A filter 501 is installed at the rear of the lower tank 3. A first bidirectional circulation pipe 502 is installed on the upper front side of the filter 501. A circulation pump 503 is installed at the lower end of the first bidirectional circulation pipe 502. A second bidirectional circulation pipe is installed at the front end of the circulation pump 503. Pipe 504, the upper end of the second bidirectional circulation pipe 504 is provided with a reducing right-angle tee 505, the upper interface of the reducing right-angle tee 505 is connected to the upper tank drain port 506. The reducing diameter design of the reducing right-angle tee 505 can ensure the flow matching of the reducing liquid delivery pipe 507 and the second bidirectional circulation pipe 504, avoiding eddies and pressure loss. The upper tank drain port 506 is located inside the lower wall of the upper tank 1. The front interface of the reducing right-angle tee 505 is connected to the reducing liquid delivery pipe 507. The two sides of the reducing liquid delivery pipe 507... Each top output port is equipped with a right-angle tee 508. The front end of the right-angle tee 508 is connected to the backwash fluid inlet pipe 509, and the rear end of the right-angle tee 508 is connected to the diversion inlet pipe 510. The diversion inlet pipe 510 is connected to the mask solution delivery pipe 403. Both the variable diameter right-angle tee 505 and the right-angle tee 508 can be switched by internal valve cores to realize automatic conversion of forward and reverse flow. The right-angle tee 508 can switch the flow path to allow the backwash fluid inlet pipe 509 to be filled with special flushing fluid.

[0055] Among them, such as Figure 8 As shown, the backwashing fluid system 5 also includes a drain pipe 511 and a waste pipe 512. The drain pipe 511 is installed at the lower part of the filter 501, and the lower end of the drain pipe 511 is connected to the waste pipe 512, so that the flushing fluid carrying impurities is discharged through the drain pipe 511 and the waste pipe 512.

[0056] Among them, such as Figure 8As shown, the backwash liquid path of the backwash liquid flow system 5 starts from the backwash liquid inlet pipe 509, passes through the front and rear ports of the right-angle tee 508, enters the diversion inlet pipe 510, then passes through the mask solution delivery pipe 403 and is sprayed into the upper tank 1 through the nozzle 402. After passing through the upper and lower ports of the reducing right-angle tee 505, it enters the second bidirectional circulation pipe 504 from the upper tank drain outlet 506. The circulation pump 503 drives the solution to flow into the filter 501 through the first bidirectional circulation pipe 502, and finally discharges it through the drain pipe 511 and the waste pipe 512.

[0057] The working principle of the above scheme is as follows: Open the front and rear ports of the right-angle tee 508, then input the flushing fluid from the backwash fluid inlet pipe 509 into the diversion inlet pipe 510. The flushing fluid enters the upper tank 1 through the mask solution delivery pipe 403 and nozzle 402. Open the upper and lower ports of the reducing right-angle tee 505 to connect the backwash fluid path with the upper tank 1. The flushing fluid enters the second bidirectional circulation pipe 504 from the upper tank drain outlet 506, then enters the first bidirectional circulation pipe 502 through the circulation pump 503, inputs into the filter 501, and finally exits through the drain pipe 511. The solution is discharged through the waste pipe 512. During this process, the rinsing fluid sequentially rinses the diversion input pipe 510, the mask solution delivery pipe 403, the nozzle 402, the upper tank 1, the second bidirectional circulation pipe 504, the first bidirectional circulation pipe 502, and the filter element 501. The system automatically cleans and maintains the pipes, nozzles 402, and filter elements that are contaminated or blocked by the mask solution during the processing, thereby extending the service life of the liquid flow system, shortening downtime for maintenance, improving the efficiency of mask dissolution processing, and completely avoiding the problem of manual cleaning of nozzles 402 that need to be stopped due to blockage.

[0058] Example 3

[0059] Please see Figure 7 To address the problems of existing technologies where the dissolving solution cannot be recycled and waste liquid discharge is high, this invention provides a mask dissolution device for localized thick copper on PCBs. The device further includes a mask solution input path in a backwashing system 5. The mask solution input path enters from the lower tank 3 via a filter 501 into a first bidirectional circulation pipe 502. A circulation pump 503 drives the solution through a second bidirectional circulation pipe 504 into the lower and front ports of a reducing right-angle tee 505. The solution then enters the lower and rear ports of a right-angle tee 508 via a reducing delivery pipe 507, and then enters the mask solution delivery pipe 403 through a diversion input pipe 510. It is then sprayed into the upper tank 1 through a nozzle 402, and flows from the upper tank drain 506 into the upper and lower ports of the reducing right-angle tee 505. Finally, the solution, driven by the circulation pump 503, enters the lower tank 3 through the first bidirectional circulation pipe 502 via the second bidirectional circulation pipe 504 and the first bidirectional circulation pipe 502.

[0060] The working principle of the above scheme is as follows: Open the lower and front ports of the reducing right-angle tee 505. First, the mask dissolving solution is filtered through the filter 501 from the lower tank 3. Then, the clean mask dissolving solution is fed into the circulation pump 503 through the first bidirectional circulation pipe 502. The circulation pump 503 outputs the solution to the second bidirectional circulation pipe 504, and then it is fed into the reducing liquid delivery pipe 507, connecting the lower and rear ports of the right-angle tee 508. The solution is fed into the mask solution delivery pipe 403 through the diversion input pipe 510, and then sprayed onto the PCB board through the nozzle 402 for mask dissolution processing. The solution then flows into the upper tank 1, completing the processing. Then, the upper and lower ports of the variable-diameter right-angle tee 505 are connected. The mask processing waste liquid is input from the upper tank drain 506 into the second bidirectional circulation pipe 504, then enters the first bidirectional circulation pipe 502 through the circulation pump 503, is filtered by the filter 501, and then input into the lower tank 3. In this way, through the circulation system composed of the first bidirectional circulation pipe 502, the second bidirectional circulation pipe 504, and the filter 501, the efficient recycling of the solution is realized, the amount of waste liquid is reduced, the operating cost of mask dissolution processing is reduced, and the environmental protection problems of single use of solution and high amount of waste liquid discharge in the existing technology are solved.

[0061] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0062] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A mask dissolution device for locally thick copper on a PCB, characterized in that, include: Upper tank (1), the front wall of the upper tank (1) is fixed with a transmission transition groove (2), the lower part of the upper tank (1) is installed with a lower tank (3), a deformable spraying mechanism (4) is installed between the upper tank (1) and the transmission transition groove (2), and a backwashing liquid flow system (5) is installed between the lower tank (3) and the deformable spraying mechanism (4). The upper groove (1) is used for mask dissolution processing to selectively remove the protective film and expose the circuit pattern that needs to be thickened for copper plating. The transmission transition groove (2) is used to accommodate the transmission system of the deformable spraying mechanism (4) and provide it with transmission space; The lower tank (3) is used to store the solution; The deformable spraying mechanism (4) is used to precisely dissolve the mask according to the requirements of the mask pattern and the spraying path. The backwashing liquid flow system (5) is used to deliver mask dissolving liquid to the deformation spray mechanism (4) and to backwash the pipeline and filter element at regular intervals. The deformable spraying mechanism (4) includes a nozzle support plate (401), nozzles (402), a mask solution delivery pipe (403), a stepped transmission mounting plate (404), a main transmission gear set (405), a linkage roller (406), a secondary synchronous pulley (407), a connecting rod (408), a butterfly valve (409), and a synchronous belt (419). The front of the upper trough (1) is fixed with two nozzle support plates (401) by a bracket. Each nozzle support plate (401) is equipped with two hundred and fifty-six nozzles (402) arranged in a matrix. The nozzles (402) are evenly distributed in a 16x16 array on the mounting surface of the nozzle support plate (401). The rear end of the nozzles (402) is fixedly connected to the mask solution delivery pipe (403). The inner left and right walls of the transmission transition groove (2) are both equipped with stepped transmission mounting plates (404). The upper middle part of the outer side of the stepped transmission mounting plate (404) is provided with a main transmission gear set (405). The main transmission gear set (405) consists of a pair of meshing transmission gears. Both drive shafts of 405 have a linkage roller (406) fixedly sleeved on their front outer walls. A synchronous belt (419) is installed between the outer walls of the two linkage rollers (406). The rear linkage roller (406) is an unwinding roller, and the front linkage roller (406) is a take-up roller. Limit locks are installed on both the unwinding roller and the take-up roller. The limit locks intermittently lock the synchronous belt (419). Two hundred and fifty-six auxiliary synchronous pulleys (407) are installed in a matrix on the outer side of the stepped drive mounting plate (404). The synchronous belt (419) is evenly distributed on the outer side of the stepped transmission mounting plate (404) in a sixteen by sixteen array. The synchronous belt (419) is provided with toothed grooves at equal intervals, and the synchronous belt (419) is driven by meshing with the auxiliary synchronous pulley (407) through the toothed grooves. The inner side of the transmission shaft of the auxiliary synchronous pulley (407) is fixedly installed with connecting rods (408), and the inner end of the connecting rods (408) is fixedly installed with butterfly valves (409). All 256 butterfly valves (409) are respectively rotatably installed in the pipeline of the mask solution delivery pipe (403).

2. The mask dissolution device for locally thick copper on a PCB according to claim 1, characterized in that: The stepped transmission mounting plate (404) is formed by fixing a large plate and a small plate. The small plate is fixed in the middle of the outer side of the large plate. The main transmission gear set (405) is installed in the middle of the upper part of the large plate, and the tooth width of the main transmission gear set (405) is the same as the width of the small plate. The roller width of the linkage belt roller (406) is greater than the wheel width of the auxiliary synchronous belt pulley (407).

3. The mask dissolution device for locally thick copper on a PCB according to claim 2, characterized in that: The two nozzle support plates (401) are distributed on the same horizontal line. The rear ends of the mask solution delivery pipes (403) are all bent at right angles. The bending directions of the mask solution delivery pipes (403) on the same nozzle support plate (401) are consistent. The bending directions of the mask solution delivery pipes (403) on the two nozzle support plates (401) are opposite. The mask solution delivery pipes (403) on the two nozzle support plates (401) are symmetrically connected one-to-one. The two hundred and fifty-six mask solution delivery pipes (403) on the same nozzle support plate (401) are of the same length but have different bending positions. The points formed by the bends are located on the same 45-degree inclined plane, and the 45-degree plane is an inclined plane with a 45-degree angle between the inner side of the stepped transmission mounting plate (404) and the rear wall of the nozzle support plate (401). The 256 connecting rods (408) on each stepped transmission mounting plate (404) have different lengths and are distributed from front to back in a manner from long to short. The connecting rods (408) correspond one-to-one with the mask solution delivery pipe (403). The inner end of the connecting rod (408) is rotatably connected to the front section of the bend point of the mask solution delivery pipe (403). The 256 butterfly valves (409) are respectively rotatably installed in the front section of the pipe at the bend point of the mask solution delivery pipe (403).

4. The mask dissolution device for locally thick copper on a PCB according to claim 3, characterized in that: The deformable spraying mechanism (4) further includes a horizontal slide rail (410), a horizontal slider (411), a vertical slide rail (412), a vertical slider (413), a lifting slide (414), a transmission base (415), a turntable (416), a clamping guide rail (417), and a clamping block (418). The lower part of the outer side of the stepped transmission mounting plate (404) is fixed with a horizontal slide rail (410). A horizontal slider (411) is slidably installed inside the horizontal slide rail (410). A vertical slide rail (412) is fixedly installed on the outer side of the horizontal slider (413). 2) A vertical slider (413) is slidably installed inside the vertical slide rail (412). A lifting slide (414) is slidably installed inside the front wall of the vertical slider (413). A transmission seat (415) is fixedly installed on the lifting slide (414). A turntable (416) is rotatably installed inside the transmission seat (415). Two clamping guide rails (417) are installed on the lower wall of the turntable (416). A clamping block (418) is slidably installed inside each of the two clamping guide rails (417), and the clamping block (418) intermittently clamps the synchronous belt (419).

5. The mask dissolution device for locally thick copper on a PCB according to claim 4, characterized in that: The backwash liquid flow system (5) includes a filter (501), a first bidirectional circulation pipe (502), a circulation pump (503), a second bidirectional circulation pipe (504), a reducing right-angle tee (505), an upper tank drain outlet (506), a reducing liquid delivery pipe (507), a right-angle tee (508), a backwash liquid inlet pipe (509), and a diversion inlet pipe (510). A filter (501) is installed on the rear of the lower tank (3). A first bidirectional circulation pipe (502) is installed on the upper front side of the filter (501). A circulation pump (503) is installed at the lower end of the first bidirectional circulation pipe (502). A second bidirectional circulation pipe (504) is provided at the front end of the circulation pump (503). The upper end of the bidirectional circulation pipe (504) is provided with a reducing right-angle tee (505). The upper interface of the reducing right-angle tee (505) is connected to the upper tank drain outlet (506), and the upper tank drain outlet (506) is located inside the lower wall of the upper tank (1). The front interface of the reducing right-angle tee (505) is connected to a reducing liquid delivery pipe (507). Both top outlets of the reducing liquid delivery pipe (507) are equipped with right-angle tees (508). The front end interface of the right-angle tee (508) is connected to a backwash liquid input pipe (509). The rear end interface of the right-angle tee (508) is connected to a diversion input pipe (510). The diversion input pipe (510) is connected to the mask solution delivery pipe (403).

6. The mask dissolution device for locally thick copper on a PCB according to claim 5, characterized in that: The backwashing fluid system (5) also includes a drain pipe (511) and a waste pipe (512). The drain pipe (511) is installed at the lower part of the filter (501), and the waste pipe (512) is connected to the lower end of the drain pipe (511).

7. The mask dissolution device for locally thick copper on a PCB according to claim 6, characterized in that: The backwashing liquid flow system (5) includes two liquid paths, namely the mask solution input liquid path and the backwashing liquid path. The mask solution input liquid path enters the first bidirectional circulation pipe (502) from the lower tank (3) through the filter (501). The solution is driven by the circulation pump (503) to flow into the lower port and front port passage of the variable diameter right angle tee (505) through the second bidirectional circulation pipe (504). The solution enters the lower port and rear port passage of the right angle tee (508) through the variable diameter delivery pipe (507). Then, it enters the mask solution delivery pipe (403) through the diversion input pipe (510). It is sprayed into the upper tank (1) through the nozzle (402). Then, it flows into the upper port and lower port passage of the variable diameter right angle tee (505) from the upper tank drain (506). The solution enters the lower tank (3) through the second bidirectional circulation pipe (504) and is driven by the circulation pump (503) through the first bidirectional circulation pipe (502) to the filter (501).

8. The mask dissolution device for locally thick copper on a PCB according to claim 7, characterized in that: The backwash liquid path of the backwash liquid flow system (5) enters the diversion input pipe (510) through the front and rear ports of the right-angle tee (508) from the backwash liquid input pipe (509), and then is sprayed into the upper tank (1) through the nozzle (402) via the mask solution delivery pipe (403). It enters the second bidirectional circulation pipe (504) through the upper and lower ports of the variable diameter right-angle tee (505), and is driven by the circulation pump (503) to flow into the filter (501) through the first bidirectional circulation pipe (502). Finally, it is discharged through the sewage pipe (511) and the waste pipe (512).

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