PCB welding equipment

Abstract

The invention relates to the technical field of PCB welding, in particular to PCB welding equipment which comprises a preheating system, a vacuum heating furnace, a cooling system, a platform assembly and a transfer assembly, a feeding port and a discharging port are formed in the two sides of the vacuum heating furnace respectively, the feeding port is communicated with the preheating system, the discharging port is communicated with the cooling system, and the vacuum heating furnace is communicated with the platform assembly. The platform assembly is arranged in the vacuum heating furnace, a plurality of bearing seats are arranged in the vacuum heating furnace, the bearing seats are connected with the platform assembly, the transfer assembly is arranged in the vacuum heating furnace, and the transfer assembly transports a plurality of PCBs from the preheating system to the bearing seats. And the plurality of PCBs are transported to a cooling system from the bearing seat. According to the invention, the plurality of PCBs are transported to the bearing seat, and then the plurality of PCBs are subjected to vacuum reflow soldering at the same time, so that the situation that the soldering speed is slowed down due to one-board one-soldering is avoided, and the processing efficiency of the PCBs is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB welding technology, specifically to a PCB welding device. Background Technology

[0002] A PCB, also known as a printed circuit board, is an important electronic component. It consists of an insulating base plate, connecting wires, and pads for mounting and soldering electronic components. It serves the dual purpose of conducting conductive lines and acting as an insulating base plate. It can replace complex wiring and realize the electrical connection between various components in a circuit. Soldering is an indispensable step in the PCB manufacturing process. PCB soldering is a welding process that uses heated solder to melt and fix different components in position and make electrical connections, ensuring the circuit can conduct electricity or transmit signals. There are various soldering methods, including manual soldering, dip soldering, wave soldering, selective soldering, reflow soldering, and soldering robots. Different soldering methods require different soldering equipment. During the process, it is necessary to minimize the influence of air on the solder. If there is a large amount of air inside the soldering equipment, the solder reacts with the oxygen in the air to easily form oxides, which will reduce the strength of the solder joint and increase the risk of soldering defects, such as cold solder joints and open circuits. Therefore, using a vacuum reflow oven can effectively avoid the influence of air on the soldering process: place an appropriate amount and shape of solder layer on the PCB board where it needs to be soldered, then place the lead of the component, solder ball or other position to be soldered on the solder layer, and finally transport the PCB board into the vacuum chamber and use an external heat source to heat the solder to the melting point so that it flows again to cover the surface components to achieve the purpose of vacuum soldering. However, in the current technology, vacuum reflow ovens are generally one board at a time, which has low production efficiency.

[0003] To avoid the low soldering efficiency and slow production speed caused by using a vacuum reflow oven for PCB soldering, invention patent application number CN202011467736.1 provides a vacuum reflow soldering machine. This invention features a transmission unit mounted on a frame, conveying components from one end to the other. A soldering module, a vacuuming module, and a cooling module are sequentially arranged on the frame along the conveying direction. Workpieces are soldered in the soldering module, then conveyed to the vacuuming module via the transmission unit. The transmission unit then moves out of the vacuuming module and stops conveying, closing the vacuuming module and forming a sealed structure inside. After the vacuuming module finishes its operation, it opens, and the workpiece is sent out after passing through the cooling module. The closed sealed structure of the vacuuming module is small in volume and only matches a single workpiece internally, ensuring rapid vacuuming. Vacuuming within a small, sealed space improves the production efficiency of the assembly line, allowing for vacuuming of one workpiece in approximately 2-3 minutes. Compared to the previous assembly line operation of individual soldering and simultaneous vacuuming, this effectively improves the overall processing efficiency of the assembly line. However, each vacuuming operation can only solder one PCB board, so the processing efficiency remains low.

[0004] Therefore, in order to avoid the low efficiency of vacuum reflow oven soldering during the PCB soldering process, which leads to a slowdown in vacuum soldering speed and affects the overall processing efficiency of the production line, a PCB soldering equipment is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a PCB board soldering device. To avoid the situation where PCB boards can only be soldered one board at a time during the soldering process using a vacuum reflow oven, resulting in a slow vacuum soldering speed and affecting the overall processing efficiency of the production line, a platform component is set in the vacuum heating furnace to transport multiple PCB boards to the carrier seat, and then perform vacuum reflow soldering on multiple PCB boards simultaneously. This prevents the soldering process from being limited by the capacity of the vacuum reflow oven, which would prevent multiple PCB boards from being vacuum reflow soldered at the same time, thereby improving the processing efficiency of PCB boards.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A PCB board soldering device includes a preheating system, a vacuum heating furnace, a cooling system, a platform assembly, and a transfer assembly. The vacuum heating furnace is shaped as a vertical cuboid, with an inlet and an outlet on each side. The inlet is connected to the preheating system, and the outlet is connected to the cooling system. The platform assembly is disposed inside the vacuum heating furnace, and multiple support seats are disposed inside the vacuum heating furnace. The multiple support seats are connected to the platform assembly, and the platform assembly drives the multiple support seats to move up and down. The transfer assembly is disposed inside the vacuum heating furnace, and when the platform assembly moves, the transfer assembly moves the PCB board to or away from the support seats.

[0008] A vacuum welding device for PCB boards is formed by combining a preheating system, a vacuum heating furnace, and a cooling system. A conveyor belt and a preheating zone are provided in the preheating system. After the PCB board with components placed is placed on the conveyor belt of the preheating system, solder paste left by screen printing adheres to the pads of the PCB board, and corresponding electronic components are placed on the solder paste. The PCB board passes through the entire preheating zone on the conveyor belt to preheat all the components on the PCB board, making the temperatures of all components tend to be consistent and quickly volatilizing the moisture in the solder paste to prevent the water vapor from affecting the soldering process. The PCB board reaches the feed port after passing through the preheating system. The transfer component transports the PCB board coming out of the preheating system into the vacuum heating furnace respectively, making multiple PCB boards located on multiple bearing seats. After the loading is completed, both the transfer component and the platform component stop moving. The vacuum heating furnace closes the feed port and the discharge port, and then fills the cavity of the vacuum heating furnace with nitrogen and evacuates it to replace the internal atmosphere of the cavity. When the PCB board is in a vacuum state, the temperature in the cavity of the vacuum heating furnace rises to make the solder paste reach the melting point and be in a molten liquid state, thus achieving the purpose of vacuum soldering. After the soldering is completed, the feed port and the discharge port are opened, and the transfer component transports the PCB board on the bearing seat into the cooling system. A conveyor belt and a cooling zone are provided in the cooling system. The PCB board passes through the entire cooling zone on the conveyor belt, and the PCB board and the solder paste are quickly cooled. The solder paste forms solder joints on the PCB board to complete the entire soldering process. The setting of multiple bearing seats in the vacuum heating furnace enables multiple PCB boards to perform vacuum reflow soldering, avoiding the slow soldering speed caused by soldering one board at a time and improving the processing efficiency of the PCB board.

[0009] Preferably, the platform component includes a first drive chain, a second drive chain, a drive motor, a sprocket, and a connecting chain. Two drive motors are fixedly installed on the inner sidewall of the vacuum heating furnace. Sprockets are respectively fixedly connected to the rotating shafts of the two drive motors. A first drive chain and a second drive chain are respectively provided on both sides inside the vacuum heating furnace. The two drive motors respectively drive the first drive chain and the second drive chain to rotate. The height difference between the top of the second drive chain and the top of the first drive chain is equal to the length of one chain link. The rotation axes of the first drive chain and the second drive chain are both located in the same vertical plane. The connecting chain is fixedly installed on a single chain link of the first drive chain and the second drive chain. The bearing seat is set in a "冂" shape. The connecting chains on the first drive chain and the second drive chain are respectively rotationally connected to the two sidewalls of the bearing seat, and the height difference between the rotation axes of the two connecting chains is equal to one chain link. The bearing seat is located between the first drive chain and the second drive chain.

[0010] By arranging two transmission chains with a height difference in a vacuum heating furnace, the transmission chains are vertically arranged in a vacuum heating furnace in the shape of a vertical cuboid. Two sprockets are respectively rotatably installed at the upper and lower ends of the transmission chains. The rotation speeds of two drive motors are set to be the same, and the rotation speeds of transmission chain one and transmission chain two are also the same. Two connecting chains are respectively rotatably installed on both side walls of the "冂"-shaped carrier. The rotation axis on one side is higher than that on the other side. Since the connecting chain is fixedly installed on the chain links, when transmission chain one and transmission chain two rotate, the connecting chain moves along the trajectory of the transmission chain, and the carrier moves along with transmission chain one and transmission chain two. During the movement of the carrier, relative rotation occurs at the connection between the connecting chain and the carrier. However, due to the height difference at the rotation points of the two connecting chains, when the carrier moves along the trajectory of the transmission chain, the upper end surface is always in a horizontal state, and the orientation of the carrier always remains unchanged, preventing the carrier from tilting or rotating during the movement of loading the PCB board, ensuring the horizontal stability of the PCB board, improving the soldering quality. The vertical design of the transmission chain and the vacuum heating furnace can ensure vacuum reflow soldering of multiple PCB boards while reducing the floor area of the equipment and saving production space.

[0011] Preferably, the transfer component includes a crank slider one, a crank slider two, an intermediate wheel, a transfer plate and a pushing plate. The intermediate wheel is rotatably installed on the inner side wall of the vacuum heating furnace and is rotationally engaged with transmission chain one. The crank slider one and the crank slider two are eccentrically rotatably installed on the intermediate wheel. The crank slider one is located on one side of the feeding port, and a transfer plate is fixedly installed at the end of the crank slider one. The crank slider two is located on one side of the discharging port, and a pushing plate is arranged at the end of the crank slider two. A connecting component is arranged inside the vacuum heating furnace, and the connecting component connects the crank slider two and the pushing plate.

[0012] By arranging an intermediate wheel on transmission chain one, when the sprocket drives the transmission chain to rotate, the intermediate wheel also rotates along with the transmission chain. The rotation of the intermediate wheel drives the crank slider one and the crank slider two to perform reciprocating motions in the horizontal direction. When the crank slider one extends out of the feeding port, the PCB board in the preheating system is transferred from the conveyor belt to the transfer plate. The PCB board is located above the transfer plate. As the intermediate wheel continues to rotate, the crank slider one moves horizontally into the feeding port, and the transfer plate brings the PCB board into the feeding port and places the PCB board on the carrier. When multiple carriers move along the trajectory of the transmission chain, the reciprocating motion of the crank slider one places multiple PCB boards on multiple carriers. After the PCB board completes vacuum reflow soldering, the reciprocating motion of the crank slider two pushes each PCB board out of the discharging port from the carrier, enabling the PCB board to enter the conveyor belt in the cooling system for cooling. The power linkage setting of the transfer component and the platform component enables the transfer component to save production costs without setting additional power.

[0013] Preferably, the conveyor plate is configured in an "F" shape, the width of the end of the conveyor plate is smaller than the width of the PCB board, the horizontal position of the conveyor plate is lower than the top of the conveyor belt in the preheating system, the support seat has a rectangular groove that passes through the upper end of the support seat, and the conveyor plate slides in conjunction with the rectangular groove.

[0014] By setting the conveyor plate in an "F" shape, the end of the conveyor plate is used to receive the PCB board moving from the preheating system. The conveyor plate and the crank slider move horizontally back and forth to ensure the horizontal stability of the PCB board. When the transmission chain continues to rotate, the intermediate wheel drives the crank slider to move, and the connecting chain drives the carrier to move. After the conveyor plate carries the PCB board into the feed port, the carrier moves vertically upward from below the conveyor plate. The conveyor plate slides relative to the rectangular groove. When the conveyor plate leaves the rectangular groove, the PCB board is placed flat on the carrier. The carrier moves with the PCB board. The carrier horizontally picks up the PCB board from bottom to top, avoiding the PCB board from tilting or slipping, ensuring the stability of the PCB board and ensuring the soldering quality.

[0015] Preferably, the width of the upper end of the support is greater than the width of the PCB board, and a blocking plate is fixedly installed at both ends of the support. The blocking plate is provided with an inclined slope, and the PCB board can slide at the upper limit of the inclined slope.

[0016] By setting a baffle plate on the support, when the support lifts the PCB board from bottom to top, the side wall of the PCB board slides relative to the inclined slope. After the PCB board contacts the inclined side plate, it slowly descends to the upper surface of the support, so that the PCB board is located in the middle of the support, preventing the PCB board from tilting and further improving the horizontal stability of the PCB board.

[0017] Preferably, the vacuum heating furnace has a feeding door and a discharging door on both side walls. The feeding door and the discharging door control the opening and closing of the feeding port and the discharging port, respectively. The connecting assembly includes a discharging plate, a horizontal spring, and a slot. The discharging plate is slidably installed inside the vacuum heating furnace. One end of the discharging plate is fixedly connected to the upper end of the discharging door. One end of the horizontal spring is fixedly installed on the side wall of the discharging plate, and the other end is fixedly connected to the side wall of the ejector plate. A slot is provided on one side of the ejector plate. Protruding blocks are provided at both ends of the crank slider. The slot and the protruding blocks slide together. The vertical movement of the discharging door can realize the engagement and disengagement of the slot and the protruding blocks.

[0018] By sliding the discharge plate inside the vacuum heating furnace, the discharge plate is positioned above the discharge gate. When the crank slider one operates, it drives the PCB board into the inlet, and the discharge gate closes the discharge port. At this time, the crank slider two reciprocates inside the vacuum heating furnace without contacting the support seat. After the PCB board completes vacuum reflow soldering, the discharge gate moves vertically downward to open the discharge port. The discharge gate drives the discharge plate downward, and the ejector plate moves downward with it. The slot on the ejector plate engages with the protruding block on the crank slider. The ejector plate is located on one side of the discharge port. When the drive motor starts and the sprocket rotates, the ejector plate reciprocates horizontally. The horizontal spring extends and retracts horizontally with the movement of the ejector plate. The ejector plate pushes each PCB board from the support seat into the cooling system. The ejector plate does not operate when the discharge gate is closed; it only ejects the PCB board when the discharge gate is open. By using the same power as the crank slider one, the crank slider two avoids mechanical interference and ensures the structural stability of the welding equipment.

[0019] Preferably, a cylindrical rod is fixedly installed on the connecting chain of the second transmission chain, and a key-shaped sliding groove is provided on the inner side wall of the vacuum heating furnace. The end of the cylindrical rod is in contact with the inner side wall of the vacuum heating furnace, and the cylindrical rod slides in cooperation with the key-shaped sliding groove.

[0020] By setting a key-shaped groove and a cylindrical rod in the vacuum heating furnace, the chain link is prevented from shaking due to the gap between the sprocket and the transmission chain. When the bearing seat moves along the transmission chain trajectory, the cylindrical rod is always in the key-shaped groove, ensuring the smoothness of the bearing seat's movement.

[0021] Preferably, both the conveyor plate and the ejector plate have rounded corners at their ends, and the rounded corners slide relative to the rectangular groove when the intermediate wheel rotates.

[0022] By setting rounded corners at the ends of the conveyor plate and the ejector plate, when the conveyor plate transports the PCB board to the carrier or the ejector plate pushes the PCB board out of the carrier from the discharge port, the ends of the conveyor plate and the ejector plate will slide relative to each other with the rectangular groove. The rounded corners can reduce the friction between the ends of the conveyor plate and the ejector plate and the rectangular groove, reduce the influence of external forces during the transfer of the PCB board, and ensure that the PCB board is placed stably.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. By setting multiple support seats and connecting them to the platform components in the vacuum heating furnace, multiple PCB boards can be vacuum reflow soldered simultaneously, avoiding the situation of soldering one board at a time, which would slow down the soldering speed and improve the processing efficiency of PCB boards.

[0025] 2. By setting the carrier seat and the connecting chain to rotate, when the carrier seat moves along the transmission chain track, the upper surface is always in a horizontal state and the orientation of the carrier seat remains unchanged, which avoids the carrier seat tilting or rotating when loading PCB boards, ensuring the horizontal stability of the PCB boards and improving the soldering quality. The vertical design of the transmission chain and the vacuum heating furnace can not only ensure that multiple PCB boards can be vacuum reflow soldered, but also reduce the footprint of the equipment and save production space.

[0026] 3. By setting up crank slider one to transport the PCB board to the carrier, and then crank slider two to send the PCB board out of the discharge port, the intermediate wheel drives the reciprocating motion of crank slider one and crank slider two at the same time, without the need for additional power, thus saving production costs. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the external structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0029] Figure 3 This is a schematic diagram of the transmission component structure of the present invention;

[0030] Figure 4 This is a schematic diagram of the conveyor plate in operation according to the present invention;

[0031] Figure 5 This is a schematic diagram of the slot and protruding block engaging in the present invention;

[0032] Figure 6 This is a schematic diagram of the PCB board supported by the support base of the present invention;

[0033] Figure 7 This is a schematic diagram of the PCB board operation of the present invention;

[0034] Figure 8 This is a schematic diagram of the PCB board entering the feed inlet of the present invention.

[0035] In the diagram: 1. Preheating system; 2. Vacuum heating furnace; 21. Feed inlet; 22. Discharge outlet; 23. Feed gate; 24. Discharge gate; 25. Discharge plate; 26. Horizontal spring; 27. Key-type slide; 3. Cooling system; 4. Platform assembly; 41. Transmission chain one; 42. Transmission chain two; 43. Drive motor; 44. Sprocket; 45. Connecting chain; 5. Transmission assembly; 51. Crank slider one; 52. Crank slider two; 521. Protruding block; 53. Intermediate wheel; 54. Conveyor plate; 55. Push-out plate; 551. Slot; 6. Bearing seat; 61. Rectangular slot; 62. Baffle plate; 7. Cylindrical rod; 8. Rounded corner; 9. PCB board. Detailed Implementation

[0036] Please see Figures 1 to 8 This invention provides a PCB board welding device, the technical solution of which is as follows:

[0037] A PCB board welding device includes a preheating system 1, a vacuum furnace 2, a cooling system 3, a platform assembly 4, and a transfer assembly 5. The preheating system 1, the vacuum furnace 2, and the cooling system 3 are combined to form a vacuum welding device for a PCB board 9. The vacuum furnace 2 is shaped as a vertical cuboid, with an inlet 21 and an outlet 22 on both sides. The inlet 21 is connected to the preheating system 1, and the outlet 22 is connected to the cooling system 3. The platform assembly 4 is disposed inside the vacuum furnace 2, and multiple support seats 6 are disposed inside the vacuum furnace 2 and connected to the platform assembly 4. The transfer assembly 5... Set inside the vacuum heating furnace 2, the transfer assembly 5 transports multiple PCB boards 9 from the preheating system 1 to multiple carrier seats 6, and then from the carrier seats 6 to the cooling system 3. The preheating system 1 is equipped with a conveyor belt and a preheating zone. The surface-mounted PCB boards 9 are placed on the conveyor belt of the preheating system 1. At this time, the pads of the PCB board 9 are covered with solder paste left by screen printing, and the corresponding electronic components are placed on the solder paste. The PCB board 9 passes through the entire preheating zone on the conveyor belt, preheating all the components on the PCB board 9, so that the temperature of all the components tends to be uniform, and so that... The moisture in the solder paste evaporates as quickly as possible to prevent moisture from affecting the soldering process. PCB boards 9 reach the inlet 21 after passing through the preheating system 1. The transfer assembly 5 transports the PCB boards 9 from the preheating system 1 into the vacuum furnace 2, placing multiple PCB boards 9 on multiple carrier seats 6. After loading, both the transfer assembly 5 and the platform assembly 4 stop moving. The vacuum furnace 2 closes the inlet 21 and outlet 22, then fills the cavity with nitrogen and evacuates to replace the internal atmosphere. When the PCB boards 9 are under vacuum, the temperature inside the vacuum furnace 2 rises, causing the solder paste to reach its melting point. In a molten liquid state, the PCB board 9 achieves the purpose of vacuum welding. After welding is completed, the feed port 21 and the discharge port 22 are opened. The transfer component 5 transports the PCB board 9 on the carrier 6 to the cooling system 3. The cooling system 3 is equipped with a conveyor belt and a cooling zone. The PCB board 9 passes through the entire cooling zone on the conveyor belt. The PCB board 9 and the solder paste are cooled rapidly. The solder paste forms solder joints on the PCB board 9 to complete the entire welding process. The setting of multiple carriers 6 in the vacuum heating furnace 2 enables multiple PCB boards 9 to be vacuum reflow soldered, avoiding the situation of one board one solder, which slows down the welding speed and improves the processing efficiency of the PCB board 9.The platform component 4 includes a first transmission chain 41, a second transmission chain 42, a drive motor 43, a sprocket 44 and a connecting chain 45. Two drive motors 43 are fixedly installed on the inner sidewall of the vacuum heating furnace 2. Sprockets 44 are fixedly connected to the rotating shafts of the two drive motors 43 respectively. The first transmission chain 41 and the second transmission chain 42 are respectively rotatably installed on the two sprockets 44. The horizontal position of the top of the second transmission chain 42 is higher than that of the first transmission chain 41. Each transmission chain is equipped with two sprockets 44. The axes of the four sprockets 44 are located on the same horizontal plane. The connecting chain 45 is set in an "丄" shape. The connecting chain 45 is fixedly installed on a single link of the first transmission chain 41 and the second transmission chain 42. The sidewall of the connecting chain 45 is parallel to the inner sidewall of the vacuum heating furnace 2. The bearing seat 6 is set in a "冂" shape. The connecting chain 45 on the first transmission chain 41 and the connecting chain 45 on the second transmission chain 42 are respectively rotatably connected to the two sidewalls of the bearing seat 6. The bearing seat 6 is located between the first transmission chain 41 and the second transmission chain 42. The transmission chains are vertically arranged in the vacuum heating furnace 2 in the shape of a vertical cuboid. There is a height difference between the two transmission chains. The two sprockets 44 are respectively rotatably installed at the upper and lower ends of the transmission chains. The rotational speeds of the two drive motors 43 are set to be the same, and the rotational speeds of the first transmission chain 41 and the second transmission chain 42 are also the same. Two connecting chains 45 are respectively rotatably installed on the two sidewalls of the "冂"-shaped bearing seat 6. The rotational axis on one side is higher than that on the other side. Since the connecting chain 45 is fixedly installed on the link, when the first transmission chain 41 and the second transmission chain 42 rotate, the connecting chain 45 moves along the trajectory of the transmission chain, and the bearing seat 6 moves along with the first transmission chain 41 and the second transmission chain 42. During the movement of the bearing seat 6, relative rotation occurs at the connection between the connecting chain 45 and the bearing seat 6. However, due to the height difference at the rotational parts of the two connecting chains 45, when the bearing seat 6 moves along the trajectory of the transmission chain, the upper end face is always in a horizontal state, and the orientation of the bearing seat 6 remains unchanged, avoiding tilting or rotation of the bearing seat 6 during the movement of loading the PCB board 9, ensuring the horizontal stability of the PCB board 9, improving the soldering quality. The vertical design of the transmission chain and the vacuum heating furnace 2 can ensure vacuum reflow soldering of multiple PCB boards 9 while reducing the floor area of the equipment and saving production space;The transmission assembly 5 includes a crank-slider one 51, a crank-slider two 52, an intermediate wheel 53, a conveyor plate 54, and an ejector plate 55. The intermediate wheel 53 is rotatably mounted on the inner wall of the vacuum heating furnace 2 and rotates in conjunction with the transmission chain one 41. The intermediate wheel 53 is located between two sprockets 44. The crank-slider one 51 and the crank-slider two 52 are coaxially rotatably mounted on the intermediate wheel 53. The crank-slider one 51 is located on one side of the feed inlet 21, and the conveyor plate 54 is fixedly mounted on the end of the crank-slider one 51. The crank-slider two 52 is located on one side of the discharge outlet 22, and the ejector plate 55 is provided at the end of the crank-slider two 52. A connecting assembly is provided inside the vacuum assembly to connect the crank-slider two 52 and the ejector plate 55. When the sprocket 44 drives the transmission chain to rotate, the intermediate wheel 53 also rotates with the transmission chain. The rotation of the intermediate wheel 53 drives the crank-slider one 51 and the crank-slider two 52 to reciprocate in the horizontal direction. When crank slider 51 extends out of the feed inlet 21, the PCB board 9 in the preheating system 1 is transferred from the conveyor belt to the conveyor plate 54. The PCB board 9 is positioned above the conveyor plate 54. As the intermediate wheel 53 continues to rotate, crank slider 51 moves horizontally into the feed inlet 21. The conveyor plate 54 carries the PCB board 9 into the feed inlet 21 and places it on the support seat 6. As multiple support seats 6 move along the transmission chain track, the reciprocating motion of crank slider 51 places multiple PCB boards 9 on multiple support seats 6. After the PCB board 9 completes vacuum reflow soldering, the reciprocating motion of crank slider 52 pushes each PCB board 9 out of the support seat 6 and out of the discharge port 22, allowing the PCB board 9 to enter the conveyor belt in the cooling system 3 for cooling. The power linkage between the transfer component 5 and the platform component 4 eliminates the need for additional power to the transfer component 5, saving production costs.

[0038] As one embodiment of the present invention, refer to Figures 2 to 8The conveyor plate 54 is shaped like an "F". The width of the end of the conveyor plate 54 is smaller than the width of the PCB board 9. The horizontal position of the conveyor plate 54 is lower than the top of the conveyor belt in the preheating system 1. A rectangular groove 61 is provided on the support seat 6, which passes through the upper end of the support seat 6. The conveyor plate 54 slides in conjunction with the rectangular groove 61. The end of the conveyor plate 54 is used to receive the PCB board 9 moving from the preheating system 1. The conveyor plate 54 and the crank slider 51 reciprocate horizontally to ensure the horizontal stability of the PCB board 9. When the transmission chain rotates continuously, the intermediate wheel 53 drives the crank slider 51 to move, and the connecting chain 45 drives the support seat 6 to move. After the conveyor plate 54 carries the PCB board 9 into the feed port 21, the support seat 6 moves vertically upward from below the conveyor plate 54. The conveyor plate 54 slides relative to the rectangular groove 61. After board 54 leaves rectangular groove 61, PCB board 9 is placed flat on support seat 6. Support seat 6 moves with PCB board 9. Support seat 6 horizontally picks up PCB board 9 from bottom to top to prevent PCB board 9 from tilting or slipping, ensuring the stability of PCB board 9 and ensuring solder quality. The width of the upper end of support seat 6 is greater than the width of PCB board 9. Baffle plates 62 are fixedly installed at both ends of support seat 6. Baffle plates 62 are provided with an inclined slope. PCB board 9 can slide at the upper limit of the inclined slope. When support seat 6 lifts PCB board 9 from bottom to top, the side wall of PCB board 9 slides relative to the inclined slope. After PCB board 9 contacts the inclined side plate, it slowly descends to the upper end of support seat 6, so that the position of PCB board 9 is in the middle of support seat 6, preventing PCB board 9 from tilting and further improving the horizontal stability of PCB board 9.The vacuum heating furnace 2 has a feed door 23 and a discharge door 24 on both side walls. The feed door 23 and the discharge door 24 control the opening and closing of the feed port 21 and the discharge port 22, respectively. The connecting assembly includes a discharge plate 25, a horizontal spring 26, and a slot 551. The discharge plate 25 is slidably installed inside the vacuum heating furnace 2. One end of the discharge plate 25 is fixedly connected to the upper end of the discharge door 24. A horizontal spring 26 is fixedly installed on the side wall of the discharge plate 25. The other end of the horizontal spring 26 is fixedly connected to the side wall of the push-out plate 55. A slot 551 is opened on one side of the push-out plate 55. A protruding block 521 is provided at the end of the crank slider 52. The slot 551 and the protruding block 521 slide together. The vertical movement of the discharge door 24 can realize the engagement and disengagement of the slot 551 and the protruding block. The discharge plate 25 is located above the discharge gate 24. When the crank slider 1 51 operates and drives the PCB board 9 into the inlet 21, the discharge gate 24 closes the discharge port 22. At this time, the crank slider 2 52 reciprocates in the vacuum heating furnace 2 and does not contact the support seat 6. After the PCB board 9 completes vacuum reflow soldering, the discharge gate 24 moves vertically downward to open the discharge port 22. The discharge gate 24 drives the discharge plate 25 to move downward. At this time, the ejector plate 55 moves downward with the discharge plate 25. The slot 551 on the ejector plate 55 engages with the protruding square block 521 on the crank slider. The ejector plate 55 is located on one side of the discharge port 22. When the drive motor 43 starts and the sprocket 44 rotates, the ejector plate 55 reciprocates in the horizontal direction. The horizontal spring 26... The ejector plate 55 extends and retracts horizontally with the movement of the ejector plate 55, pushing each PCB board 9 from the support 6 into the cooling system 3. The ejector plate 55 does not work when the discharge gate 24 is closed, and only when the discharge gate 24 is open does the ejector plate 55 transport the PCB board 9 out. The crank slider 2 52 avoids mechanical interference while using the same power as the crank slider 1 51, ensuring the structural stability of the welding equipment. The connecting chain 45 on the transmission chain 2 42 is fixedly mounted with a cylindrical rod 7. The inner wall of the vacuum heating furnace 2 is provided with a key-shaped slide groove 27. The end of the cylindrical rod 7 fits against the inner wall of the vacuum heating furnace 2. The cylindrical rod 7 slides with the key-shaped slide groove 27, avoiding the chain link from driving the connecting chain due to the fit gap between the sprocket 44 and the transmission chain. The chain 45 wobbles, and as the carrier 6 moves along the transmission chain track, the cylindrical rod 7 remains within the key-shaped groove 27, ensuring the stability of the carrier 6's movement. Both the conveyor plate 54 and the ejector plate 55 have rounded corners 8 at their ends. When the intermediate wheel 53 rotates, the rounded corners 8 slide relative to the rectangular groove 61. When the conveyor plate 54 transports the PCB board 9 onto the carrier 6, or the ejector plate 55 ejects the PCB board 9 from the carrier 6 through the discharge port 22, the ends of the conveyor plate 54 and the ejector plate 55 will slide relative to the rectangular groove 61. The rounded corners 8 reduce the friction between the ends of the conveyor plate 54 and the ejector plate 55 and the rectangular groove 61, reducing the influence of external forces during the PCB board 9's transport and ensuring the PCB board 9 is placed stably.

[0039] Working principle: After the solder paste printing PCB board 9 is completed, it passes through the preheating system 1 and reaches the inlet 21. At this time, the inlet 21 is open, and the outlet 22 is closed by the outlet gate 24. The drive motor 43 drives the sprocket 44 to rotate. The sprocket 44 drives the transmission chain 1 41 and the transmission chain 2 42 to move synchronously. The carrier 6 moves along the transmission chain track with its orientation unchanged. The transmission chain 1 41 drives the intermediate wheel 53 to rotate. The rotation of the intermediate wheel 53 causes the crank slider 1 51 and the crank slider 2 52 to reciprocate simultaneously. At this time, the crank slider 2 52 is not in contact with the carrier 6 in the vacuum heating furnace 2. The crank slider 1 51 causes the conveyor plate 54 to extend out of the inlet 21 to receive the PCB board 9 from the conveyor belt of the preheating system 1. When the conveyor plate 54 moves back into the inlet 21, the carrier 6 moves vertically upward from below the conveyor plate 54. The end of the conveyor plate 54 slides relative to the rectangular groove 61. When multiple PCB boards 9 are placed flat on multiple carriers 6, the feed gate 23 closes the feed port 21, the drive motor 43 stops working, and the vacuum heating furnace 2 performs vacuum reflow soldering. After the soldering is completed, the discharge gate 24 opens the discharge port 22, and the discharge gate 24 drives the discharge plate 25 to move downward. At this time, the ejector plate 55 moves downward with the discharge plate 25. The slot 551 on the ejector plate 55 engages with the protruding square block 521 on the crank slider. The ejector plate 55 is located on one side of the discharge port 22. When the drive motor 43 starts and the sprocket 44 rotates, the ejector plate 55 reciprocates in the horizontal direction. The horizontal spring 26 extends and retracts in the horizontal direction with the movement of the ejector plate 55. The ejector plate 55 pushes each PCB board 9 from the carrier 6 into the cooling system 3. The PCB board 9 is cooled in the cooling system 3 and then the processing is completed.

[0040] The specific embodiment of the present invention has been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the embodiments described above. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and ideas of the present invention should still fall within the protection scope of the present invention.

Claims

1. A PCB board soldering apparatus characterized by, The application relates to a PCB vacuum heating and transferring device, which comprises a preheating system (1), a vacuum heating furnace (2), a cooling system (3), a platform assembly (4) and a transferring assembly (5), the vacuum heating furnace (2) is shaped as a vertical cuboid, feeding ports (21) and discharging ports (22) are arranged on the two sides of the vacuum heating furnace (2) respectively, the feeding ports (21) are communicated with the preheating system (1), the discharging ports (22) are communicated with the cooling system (3), the platform assembly (4) is arranged in the vacuum heating furnace (2), a plurality of bearing seats (6) are arranged in the vacuum heating furnace (2), the bearing seats (6) are connected with the platform assembly (4), the platform assembly (4) drives the bearing seats (6) to move up and down, the transferring assembly (5) is arranged in the vacuum heating furnace (2), and the transferring assembly (5) drives a PCB (9) to move to or leave the bearing seats (6) when the platform assembly (4) moves.

2. The PCB soldering apparatus of claim 1, wherein, The platform assembly (4) comprises a transmission chain one (41), a transmission chain two (42), drive motors (43), chain wheels (44) and connecting chains (45), two drive motors (43) are fixedly installed on the inner side walls of the vacuum heating furnace (2), chain wheels (44) are fixedly connected to the rotating shafts of the two drive motors (43) respectively, transmission chain ones (41) and transmission chain twos (42) are arranged on the two sides in the vacuum heating furnace (2), the two drive motors (43) drive the transmission chain one (41) and the transmission chain two (42) to rotate respectively, the difference between the top height of the transmission chain two (42) and the top height of the transmission chain one (41) is equal to the length of a chain link, the rotating axes of the transmission chain one (41) and the transmission chain two (42) are located in the same vertical plane, the connecting chains (45) are fixedly installed on single chain links of the transmission chain one (41) and the transmission chain two (42), the bearing seats (6) are shaped as a "H" character, the connecting chains (45) on the transmission chain one (41) and the transmission chain two (42) are rotatably connected with the two side walls of the bearing seats (6) respectively, and the height difference between the rotating axes of the two connecting chains (45) is equal to a chain link, and the bearing seats (6) are located between the transmission chain one (41) and the transmission chain two (42).

3. The PCB soldering apparatus of claim 2, wherein, The transferring assembly (5) comprises a crank slider one (51), a crank slider two (52), an intermediate wheel (53), a conveying plate (54) and a pushing plate (55), the intermediate wheel (53) is rotatably installed on the inner side wall of the vacuum heating furnace (2) and is rotatably matched with the transmission chain one (41), the crank slider one (51) and the crank slider two (52) are eccentrically rotatably installed on the intermediate wheel (53), the crank slider one (51) is located on one side of the feeding port (21), the conveying plate (54) is fixedly installed on the end of the crank slider one (51), the crank slider two (52) is located on one side of the discharging port (22), the pushing plate (55) is arranged on the end of the crank slider two (52), and a connecting assembly is arranged in the vacuum heating furnace (2), the connecting assembly connects the crank slider two (52) and the pushing plate (55).

4. The PCB soldering apparatus of claim 3, wherein, The conveyor plate (54) is set in an "F" shape. The width of the end of the conveyor plate (54) is smaller than the width of the PCB board (9). The horizontal position of the conveyor plate (54) is lower than the top of the conveyor belt in the preheating system (1). A rectangular groove (61) is provided on the support seat (6). The rectangular groove (61) passes through the upper end of the support seat (6). The conveyor plate (54) and the rectangular groove (61) are slidably engaged.

5. The PCB board welding apparatus according to claim 4, wherein, The upper end of the support base (6) is wider than the width of the PCB board (9). A baffle plate (62) is fixedly installed at both ends of the support base (6). The baffle plate (62) is provided with an inclined slope. The PCB board (9) can slide at the upper limit of the inclined slope.

6. The PCB board welding apparatus according to claim 3, wherein, The vacuum heating furnace (2) has a feed door (23) and a discharge door (24) on both sides. The feed door (23) and the discharge door (24) control the opening and closing of the feed port (21) and the discharge port (22) respectively. The connecting assembly includes a discharge plate (25), a horizontal spring (26) and a slot (551). The discharge plate (25) is slidably installed inside the vacuum heating furnace (2). One end of the discharge plate (25) is fixedly connected to the upper end of the discharge door (24). Next, one end of the horizontal spring (26) is fixedly installed on the side wall of the discharge plate (25), and the other end is fixedly connected to the side wall of the push plate (55). A slot (551) is provided on one side of the push plate (55), and a protruding block (521) is provided at the end of the crank slider (52). The slot (551) and the protruding block (521) slide in cooperation. The vertical movement of the discharge gate (24) can realize the engagement and disengagement of the slot (551) and the protruding block.

7. The PCB board welding apparatus of claim 3, wherein, A cylindrical rod (7) is fixedly installed on the connecting chain (45) on the second transmission chain (42). A key-shaped sliding groove (27) is provided on the inner wall of the vacuum heating furnace (2). The end of the cylindrical rod (7) is in contact with the inner wall of the vacuum heating furnace (2). The cylindrical rod (7) and the key-shaped sliding groove (27) are in sliding cooperation.

8. The PCB board welding apparatus of claim 6, wherein, Both the conveyor plate (54) and the ejector plate (55) are provided with rounded corners (8) at their ends. When the intermediate wheel (53) rotates, the rounded corners (8) slide relative to the rectangular groove (61).

Images